Beyond LEDs: Brighter, new energy-saving flat panel lights based on carbon nanotubes

10/16/2014  Planar light source using a phosphor screen with highly crystalline single-walled carbon nanotubes (SWCNTs) as field emitters demonstrates its potential for energy-efficient lighting device.

Deeper Dive -- Mentor Graphics Looks to the Future

10/14/2014  There has been a great deal of handwringing and naysaying about the industry’s progress to the 14/16-nanometer process node, along with wailing and gnashing of teeth about the slow progress of extreme-ultraviolet lithography, which was supposed to ease the production of 14nm or 16nm chips. Joseph Sawicki, vice president and general manager of Mentor’s Design-to-Silicon Division, is having none of it.

Smartwatches storm wearables market; Flexible displays are critical

10/10/2014  Wearable electronics are going from geek to chic, as new smartwatches from the likes of Apple and Samsung have set a new standard for technological bling.

Pixelligent Technologies announces $1.25M solid-state lighting award from the Department of Energy

09/23/2014  Pixelligent Technologies announced today that it has been selected for a Department of Energy (DOE) solid-state-lighting award to support the continued development of its OLED lighting application.

SPIE Photomask Technology Wrap-up

09/23/2014  Extreme-ultraviolet lithography was a leading topic at the SPIE Photomask Technology conference and exhibition, held September 16-17-18 in Monterey, Calif., yet it wasn’t the only topic discussed and examined. Mask patterning, materials and process, metrology, and simulation, optical proximity correction (OPC), and mask data preparation were extensively covered in conference sessions and poster presentations.

SPIE panel tackles mask complexity issues

09/19/2014  Photomasks that take two-and-a-half days to write. Mask data preparation that enters into Big Data territory. And what happens when extreme-ultraviolet lithography really, truly arrives?

ASML on EUV: Available at 10nm

09/17/2014  Extreme-ultraviolet lithography systems will be available to pattern critical layers of semiconductors at the 10-nanometer process node, and EUV will completely take over from 193nm immersion lithography equipment at 7nm, according to Martin van den Brink, president and chief technology officer of ASML Holding.

Design and Manufacturing Technology Development in Future IC Foundries

09/16/2014  Virtual Roundtable provides perspective on the need for greater integration within the “fabless-foundry” ecosystem.

Monolithic 3D breakthrough at IEEE S3S 2014

09/15/2014  In the upcoming 2014 IEEE S3S conference (October 6-9), MonolithIC 3D will unveil a breakthrough flow that is game-changing for 3D IC. For the first time ever monolithic 3D (“M3DI”) could be built using the existing fab and the existing transistor flow.

Kateeva receives $38 million in financing

09/15/2014  Kateeva announced that it has closed its Series D round with $38 million in financing. The newest participant is Samsung Venture Investment Corporation (SVIC).

Process Watch: Sampling matters

09/15/2014  Determining an optimum sampling strategy comes down to weighing the cost of process control against the benefit of capturing the defect or other excursion in a timely manner.

Foundry, EDA partnership eases move to advanced process nodes

09/15/2014  A leading semiconductor foundry and an EDA vendor with design-for-yield (DFY) solutions have enjoyed a long-term partnership. Recently, they worked together to leverage DFY technologies for process technology development and design flow enhancement.

Research Alert: September 9, 2014

09/09/2014  GLOBALFOUNDRIES and SRC announce new scholarship for undergraduate engineering students; Layered graphene sandwich for next generation electronics; Doped graphene nanoribbons with potential

The Week in Review: September 5, 2014

09/05/2014  New non-volatile memory technology; President and CEO of FSA announced; Samsung to use ProPlus 14nm finFET SPICE modeling platform; MEMS gyroscope from Analog Devices; SEMICON Taiwan held this week

Research Alert: September 3, 2014

09/03/2014  A new, tunable device for spintronics; Copper shines as flexible conductor; Competition for graphene

Intel Announces “New Interconnect” for 14nm

09/02/2014  Intel has just announced that “Embedded Multi-die Interconnect Bridge (EMIB”) packaging technology will be available to 14nm foundry customers.

The Week in Review: August 29, 2014

08/29/2014  Intel releases new packaging technologies; Fairchild Semiconductor to close two facilities; KLA-Tencor introduces new metrology tools; UMC joins Fujitsu's new foundry company; Thinnest-possible semiconductor; SEMI announces keynotes for Vietnam Semiconductor Strategy Summit

Lithography: What are the alternatives to EUV?

08/28/2014  Hopes remain high for EUV, but long delays has caused attention to shift to various alternatives.

Plastic electronics: Opportunity on the edge of commercialization

08/27/2014  The Plastics Electronics Conference and Exposition will co-locate with SEMICON Europa. Plastic Electronics 2014 (PE 2014) is themed “Enabling Applications beyond Limits in Electronics” and will be held at Alpexpo in Grenoble on 7-9 October.

The Week in Review: August 22, 2014

08/22/2014  Collaboration for next-generation smart glasses; Book-to-bill ratio holds steady in July; Intel and Unity to collaborate; MediaTek launches new R&D facility; Amkor appoints new member to board of directors; STATS ChipPAC achieves shipping milestone




Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

More Technology Papers


3D NAND Challenges and Opportunities

December 16, 2015 at 12:00 p.m. ET

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation will discuss this (r)evolution as well as its major scaling limitations.

Sponsored By:
IoT Device Trends and Challenges

January 2016 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015