10/08/2015 As the push for tinier and faster electronics continues, a new finding by University of British Columbia scientists could help inform the design of the next generation of cheaper, more efficient devices.
10/06/2015 System-on-a-chip designs are complex endeavors, and they are growing more complicated by the day. Mentor Graphics is cognizant of the many challenges in SoC design and is working to ease the troubles of chip designers.
10/06/2015 The company, founded in 1967, has a Silicon Systems Group which last year accounted for 66 percent of Applied's revenue. The SSG includes a number of other wafer fab equipment categories, such as epitaxy, ion implantation, metrology and wafer inspection, rapid thermal processing, and wet cleaning.
10/02/2015 "Money (That’s What I Want)" could have been the theme song for playing off the EUV Mask Readiness panel discussion on Thursday morning (October 1) at the SPIE Photomask Technology conference in Monterey, California.
10/01/2015 DuPont Displays announced the opening of a state-of-the-art, scale-up manufacturing facility designed to deliver production scale quantities of advanced materials that enable large-format, solution-based printed Organic Light Emitting Diode (OLED) displays.
09/30/2015 Intel has been working on photomasks for extreme-ultraviolet lithography for more than a decade, and has recently logged significant progress.
09/30/2015 Harry J. Levinson, senior director of technology research at GlobalFoundries, took “Lithography and Mask Challenges at the Leading Edge” as the theme for his keynote presentation Tuesday morning, opening the SPIE Photomask Technology 2015 conference in Monterey, California.
09/29/2015 A screen-printable functionalized graphene ink supplied by Goodfellow performs better than normal carbon-based ink.
09/28/2015 New devices, materials, and substrates challenge atomic-scale integration.
09/28/2015 Transparency Market Research (TMR) projects the global organic electronics market to grow at a CAGR of 32.6% from 2012 to 2018.
09/25/2015 The overall theme for the conference was “Materials for a Smart and Interconnected World.” It featured sessions on “Material Enabling Silicon Everywhere”, “New Emerging Materials Technology & Opportunities at the Edge,” sustainable manufacturing, and a panel of executives from semiconductor manufacturers providing “A View from the Fabs.”
09/25/2015 Electronic Fluorocarbons LLC and Albemarle Corporation recognized for quality, safety, service and technology performance.
09/24/2015 Gary Patton, chief technology officer of GlobalFoundries and head of the company’s worldwide research and development, called for innovation in chip materials in his keynote address on Tuesday at SEMI’s Strategic Materials Conference in Mountain View, Calif.
09/21/2015 Mentor Graphics had a hand in presenting two of the 30 papers offered Thursday at Taiwan Semiconductor Manufacturing’s Open Innovation Platform Ecosystem Forum in Santa Clara, Calif.
09/21/2015 While Taiwan Semiconductor Manufacturing continues to fine-tune its 16-nanometer FinFET process, the world’s largest silicon foundry will begin making chips with 10nm features later this year and will put 7nm chips into risk production in early 2017.
09/17/2015 Taiwan Semiconductor Manufacturing kicked off its Open Innovation Platform (OIP) Ecosystem Forum with thanks – not for another beautiful day in Silicon Valley, but for the collaborative work it does with its customers, suppliers, and other industry partners.
09/15/2015 With a recent sharp rise in the number of patent applications for flexible display technologies, the market for various types of flexible displays is expected to broaden.
09/14/2015 Until now transparent electrode materials for OLEDs have mainly consisted of indium tin oxide (ITO), which is expected to become economically challenging for the industry due to the shrinking abundance of indium. One promising candidate is graphene.
09/09/2015 Encapsulation layers keep carbon nanotube transistors stable in open air.
09/04/2015 Next directions in organic light-emitting diode (OLED) technology for lighting identified in Journal of Photonics for Energy.
October 26, 2016 at 1 p.m. ET / Sponsored by Air Products
With the change in the traditional IC scaling cadence, the expansive growth of “Big data,” and the pervasive nature of computing, rises a paradigm shift in integrated circuit scaling and microelectronic devices. The pervasive nature of computing drives a need for connecting billions of people and tens of billions of devices/things via cloud computing. Such connectivity effect will generate tremendous amount of data and would require a revolutionary change in the technology infrastructures being used to transmit, store and analyze data. Heterogeneous integration through package with technologies such as system in package (SIP), on package integration (OPI) and fan-out (WLFO and PLFO) are poised to change the packaging industry and play a disruptive role in enabling next generation devices.
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,
XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016Sponsored by XwinSys Technology Development Ltd.