OLEDs

OLEDS ARTICLES



Flat panel display area demand growing rapidly

01/29/2015  Increasing sizes of display panels for TVs, smartphones, mobile PCs and automotive displays are driving increases in total flat-panel-display area demand growth.

"The Electrical Arts" and the First Trans-Atlantic Telegraph Cable

01/28/2015  Before there were electrical engineers and standard definitions for the ampere, ohm and volt, entrepreneurs and scientists in the United Kingdom and the United States worked on the issue of improving communications between the Old World and the New World.

Ten lighting and LED trends to watch in 2015

01/20/2015  The recent restructuring by major global lighting companies will allow LED makers to raise capital for investments in 2015.

Shedding light on why blue LEDS are so tricky to make

01/08/2015  Scientists at UCL, in collaboration with groups at the University of Bath and the Daresbury Laboratory, have uncovered the mystery of why blue light-emitting diodes (LEDs) are so difficult to make, by revealing the complex properties of their main component - gallium nitride - using sophisticated computer simulations.

Solid Doping for Bulk FinFETs

01/05/2015  In another example of the old one-liner that “all that is old is new again,” the old technique of solid-source doping is being used by Intel for a critical process step in so-called “14nm node” finFET manufacturing.

IEDM: Thanks for MEMS-ories

12/16/2014  At the 60th annual International Electron Devices Meeting this week in San Francisco, there was much buzz about the 14-nanometer FinFET papers being presented by IBM and Intel. Those papers were the subject of a press release two months in advance.

Pixelligent closes $5.5M in funding

12/11/2014  Pixelligent Technologies, producer of PixClear, nanocrystal dispersions for demanding applications in the Solid State Lighting and Optical Coatings & Films markets, announced today that it closed $5.5 million in new equity funding.

Mentor Graphics Announces New Verification IP for PCIe 4.0

12/08/2014  Mentor Graphics Corp. announced the immediate availability of its new Mentor EZ-VIP PCI Express Verification IP, which reduces testbench assembly time for ASIC and FPGA design verification by a factor of up to 10X.

Research yields material made of single-atom layers that snap together like Legos

11/25/2014  Physicists at the University of Kansas have fabricated an innovative substance from two different atomic sheets that interlock much like Lego toy bricks.

Applied Materials Introduces New Hardmask Process, Saphira

11/24/2014  A new hardmask material, called Saphira, and accompanying processes was introduced Applied Materials. The material, which is transparent and offers high selectivity and good mechanical strength, could reduce manufacturing costs by 35% per module.

NFC IGZO TFT for Game Cards

11/20/2014  Holst Centre, imec, and Cartamundi work on flexible Near Field Communication tags embedded in paper cards.

Experts at the Table: Focus on Semiconductor Materials

11/03/2014  The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde Electronics; Kate Wilson of Edwards Vacuum; David Thompson of Applied Materials; and Ed Shober of Air Products and Chemicals.

Air-gaps in Copper Interconnects for Logic

10/31/2014  Intel’s “14nm-node” process uses air-gaps in dielectrics; direction disclosed four years ago.

Semiconductor “dust” enables low cost solar cells, LEDs

10/17/2014  The U.S. Patent Office has issued US Patent No. 8,859,310 to Versatilis LLC that shows how fine semiconductor particles, powders or fines, often the waste byproduct of dicing semiconductor wafers into ever smaller chips, can be processed into a sea of low cost solar cells or micro-LEDs.

Beyond LEDs: Brighter, new energy-saving flat panel lights based on carbon nanotubes

10/16/2014  Planar light source using a phosphor screen with highly crystalline single-walled carbon nanotubes (SWCNTs) as field emitters demonstrates its potential for energy-efficient lighting device.

Deeper Dive -- Mentor Graphics Looks to the Future

10/14/2014  There has been a great deal of handwringing and naysaying about the industry’s progress to the 14/16-nanometer process node, along with wailing and gnashing of teeth about the slow progress of extreme-ultraviolet lithography, which was supposed to ease the production of 14nm or 16nm chips. Joseph Sawicki, vice president and general manager of Mentor’s Design-to-Silicon Division, is having none of it.

Smartwatches storm wearables market; Flexible displays are critical

10/10/2014  Wearable electronics are going from geek to chic, as new smartwatches from the likes of Apple and Samsung have set a new standard for technological bling.

Pixelligent Technologies announces $1.25M solid-state lighting award from the Department of Energy

09/23/2014  Pixelligent Technologies announced today that it has been selected for a Department of Energy (DOE) solid-state-lighting award to support the continued development of its OLED lighting application.

SPIE Photomask Technology Wrap-up

09/23/2014  Extreme-ultraviolet lithography was a leading topic at the SPIE Photomask Technology conference and exhibition, held September 16-17-18 in Monterey, Calif., yet it wasn’t the only topic discussed and examined. Mask patterning, materials and process, metrology, and simulation, optical proximity correction (OPC), and mask data preparation were extensively covered in conference sessions and poster presentations.

SPIE panel tackles mask complexity issues

09/19/2014  Photomasks that take two-and-a-half days to write. Mask data preparation that enters into Big Data territory. And what happens when extreme-ultraviolet lithography really, truly arrives?




TWITTER


WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

September 27, 2016 at 1 p.m. ET / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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EVENTS



SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017

VIDEOS