OLEDs

OLEDS ARTICLES



Polarizer film trends: AMOLED growth, and acrylics move in

07/25/2012 

Polarizers used in display manufacturing will form a $9.94 billion market in 2012, up 4% from 2011, according to Displaybank. Sequentially, the polarizer market decreased by 9% in Q1 2012, hitting 2.235 billion. This was down 6% from Q1 2011.

PANL, Plextronics expand OLED partnership to cover hole injection, transport materials

07/20/2012 

Universal Display broadened its work with Plextronics to accelerate the development and commercialization of solution-based OLED material systems. They will combine Plextronics’ hole injection and hole transport materials with Universal Display’s phosphorescent OLED emissive layer materials.

Semiconductor fab tool capex trends gleaned @ SEMICON West

07/12/2012 

After meeting with various semiconductor manufacturing tool suppliers -- Applied Materials, KLA-Tencor, Lam Research, Tokyo Electron, Teradyne and Cymer -- at SEMICON West, Citi analysts share impressions on foundry spending plans and tool choices.

AMOLED manufacturing improvements to enable TV market share grab

07/09/2012 

AMOLED is entrenched in the small- and medium-sized displays market. For the technology to capture significant market share in the large-size, TV-bound display market, manufacturers will need to invest in better, higher throughput processing, shares Displaybank.

Top conference reports from H1 2012

07/06/2012 

We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.

Picosecond laser enables new high-tech devices

07/05/2012 

Industrially proven and robust, picosecond lasers are proving their worth in cutting and patterning of delicate materials for a wide variety of industrial applications.

SEMICON West preview: OLED displays and lighting adopt printing processes, flexible substrates

07/03/2012 

Technology for making circuits with organic materials, non-vacuum processes, and flexible substrates has made striking progress, but it’s been a challenge to find applications where the new technologies offer must-have advantages. Paula Doe, SEMI, reports on flexible and large-area OLED displays and lighting.

Samsung Mobile Display sources OLED materials from Novaled

07/02/2012 

Samsung Mobile Display (SMD) wiill purchase dopant materials used in the transport layers of its AMOLED display modules from Novaled. Novaled will also provide its proprietary PIN OLED technology to SMD for use in the production of SMD’s AMOLED display modules.

OLED thin-film encapsulation technology key to new applications

06/29/2012 

OLED thin film encapsulation technology is the one of technologies emerging as the core technology of flexible OLED, and technology development and patent securing competition between world’s leading OLED companies will increase accordingly, shows Displaybank.

Guide to LED and OLED programs at SEMICON West

06/28/2012 

SEMICON West 2012 will take place July 10-12 at the Moscone Center in San Francisco, CA. Following is a preview of the LED and OLED events taking place during SEMICON West, from contributor Paula Doe, SEMI Emerging Markets.

Sony, Panasonic combine OLED manufacturing expertise to achieve large-panel, low-cost fab

06/25/2012 

Panasonic and Sony will combine their core and printing technology to jointly develop next-generation organic light-emitting diode (OLED) panel and module manufacturing technology.

MIT team models electronic behavior of OLEDs and other organic electronics

06/22/2012 

A multidisciplinary research team at MIT and the Universidad Autónoma de Madrid developed a new mathematical approach to simulating the electronic behavior of noncrystalline materials, with applications in OLEDs, flexible printable organic electronic circuits, and solar cells.

PANL hits white OLED performance record

06/11/2012 

Universal Display Corporation (NASDAQ: PANL) announced record-breaking performance of its white organic light-emitting diode (OLED) lighting technology.

Universal Display intros novel emission layer systems for OLEDs

06/05/2012 

Universal Display Corporation (NASDAQ: PANL) introduced new red, green, and yellow UniversalPHOLED products, combining UniversalPHOLED emitter materials with novel host systems.

Novaled's new OLED materials set could double OLED lifetimes

05/31/2012 

Novaled debuted a class of n-doped electron transport layer (ETL) materials for OLED TV and mobile displays.

CNTs produced with >95% semiconducting content now available from SWeNT

05/31/2012 

SouthWest NanoTechnologies (SWeNT) released SG65i, a single-wall carbon nanotube product with >95% semiconducting concentration, before secondary processing to remove metallic SWCNT content.

Largest flexible OLED display fabbed with mixed-oxide TFT

05/30/2012 

The Flexible Display Center at ASU, in conjunction with Army Research Labs scientists, manufactured what it is reporting as the world's largest flexible, full-color OLED display prototype. FDC used advanced mixed-oxide TFTs to build the 7.4” device.

3M flexible barrier films for displays come to market

05/22/2012 

M’s Optical Systems Division made its flexible, optically clear 3M FTB3-50 and FTB3-125 films available commercially, to protect sensitive electronics displays from water vapor and oxygen. The films previously were sold under limited R&D agreements.

OLED is a technology, not an answer, for TVs: DisplaySearch

05/21/2012 

DisplaySearch's Paul Gray advises that TV makers “think deeply about how consumers are watching long-form video at home” before leaping to conclusions about OLED’s impact. “The industry need not take billion dollar technology bets to provide better products.”




FINANCIALS



TECHNOLOGY PAPERS



UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014