11/01/2011 — 3D packaging enters the mainstream: Attend the conference
2.5D, 3D and Beyond - Bringing 3D Integration to the Packaging Mainstream will take place November 9 in Santa Clara, CA. The MEPTEC conference follows the trend of 3D and 2.5D packaging moving from roadmap to factory production.
10/31/2011 — ONNN update: Thai floods close Rojana SATS ops indefinitely
ON Semi believes that its SANYO Semiconductor division's Thai operations in the Rojana Industrial Park have been severely damaged by Thailand's flood. Another facility in Bang Pa In, previously unaffected, is now flooded. ONNN says none of its employees in Thailand have been endangered by flood waters on-site.
10/31/2011 — Spansion consolidates test and assembly ops
Spansion Inc. (NYSE:CODE) will consolidate its 2 semiconductor assembly and test services (SATS) operations, closing its facility in Kuala Lumpur, Malaysia, to reduce costs by about $30 million annually.
10/28/2011 — Multitest vertical contact test probe technology eschews barrels
Multitest debuted the Quad Tech concept, next-generation vertical contact technology with a barrel-less architecture.
10/28/2011 — Global Unichip focuses on ASIC biz
Global Unichip Corp. (GUC; TW:3443) refined its business and technology model to become a full-service, flexible ASIC company. President Jim Lai refers to the model as GUC's branded Flexible ASIC Model, covering SoC integration, implementation methodologies, and integrated manufacturing.
10/28/2011 — TSV fab tool combines stress-free CMP with thermal flow etch
ACM Research Shanghai, Ltd., introduced the integrated Ultra iSFP stress-free polishing (SFP) semiconductor manufacturing tool for 65-45nm copper (Cu) interconnects, improving through silicon vias (TSV) with better heat dissipation.
10/27/2011 — OmniVision faces lawsuit over lost Apple image sensor contract
Levi & Korsinsky is bringing a class action lawsuit against OmniVision Technologies Inc. (NASDAQ:OVTI) on behalf of stockholders that allege that OmniVision failed to disclose properly the loss of an exclusive contract with Apple for image sensors, in-house production delays, as well as other counts.
10/27/2011 — EVG launches ZoneBond-capable modules
EV Group (EVG) launched a suite of temporary bonding and debonding equipment modules that support ZoneBOND technology.
10/26/2011 — Lasers package ultrathin semiconductors at low cost, high volume
North Dakota State University, Fargo, researchers have developed a packaging technology using Thermo-Mechanical Selective Laser Assisted Die Transfer (tmSLADT) to reduce the size and cost of microelectronics packages.
10/25/2011 — Xilinx FPGA boasts 6.8B transistors
Xilinx Inc. (Nasdaq:XLNX) began shipping its Virtex-7 2000T field programmable gate array (FPGA), a programmable logic device with 6.8 billion transistors: 2 million logic cells, a die-stack architecture, low power consumption, and a more flexible design than large ASICS and monolithic FPGAs.
10/20/2011 — Brewer Science, EVG commercialize temporary wafer bonding with zoning laws
Brewer Science Inc. and EV Group (EVG) will both commercialize ZoneBOND technology for temporary wafer bonding, thin wafer processing, and debonding applications.
10/19/2011 — TSV electroplating dev team unites SVTC, Amerimade Technology, Shanghai Sinyang Semiconductor Materials
Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will collaborate on electroplating processes for TSV that are production-ready for advanced packages and MEMS.
10/19/2011 — Nantong Fujitsu Microelectronics installs NEXX tool for copper pillar, RDL packaging
NEXX Systems shipped a Stratus electrochemical deposition tool to Nantong Fujitsu Microelectronics Co. Ltd. (NFME), based in Jiangsu province, China. NFME will use the Stratus for copper pillar and RDL advanced packaging applications.
10/18/2011 — SUSS MicroTec wins thin-wafer temporary bonder order
SUSS MicroTec, in partnership with temporary bonding adhesive maker TMAT, will deliver SUSS MicroTec's new-generation high-volume temporary wafer bond tool clusters to a leading IDM.
10/18/2011 — MVTS expands in California, Malaysia, and Taiwan
MVTS Technologies opened new offices in San Jose, CA; Penang, Malaysia; and Hsinchu, Taiwan to support growing demand for test, assembly, and other IC production equipment and services among semiconductor manufacturers.
10/17/2011 — Air-cooled wafer probe chuck debuts in modular format
ERS uncrated the ERS AirCool 3 wafer thermal test system with modular options and easy integration into all major wafer prober systems.
10/14/2011 — IMAPS: Markovich takes reins, Jones given Lifetime Achievement Award
At the IMAPS 44th International Symposium on Microelectronics in Long Beach, CA, Voya Markovich, well-known industry PCB and packaging expert, took over the reins as the organization
10/14/2011 — IMAPS semiconductor packaging award bestowed on Nordson Asymtek's Adamson
Steven J. Adamson, marketing specialist with Nordson ASYMTEK, received the Daniel C. Hughes, Jr., Memorial Award, for the greatest contribution to IMAPS and the microelectronics packaging industry.
10/11/2011 — Fraunhofer, EVG develop temporary wafer bonding for thicker die
EV Group (EVG) will work with Fraunhofer IZM's ASSID research center to develop temporary bonding/debonding technologies for thicker die structures, some as large as 600
10/11/2011 — CSCD probe head accurately tests high-frequency devices on small pads
Cascade Microtech Inc. debuted InfinityQuad, a multi-contact probe head capable of automatically probing aluminum (Al), copper (cu), or gold (Au) pads as small as 30 x 50
10/11/2011 — Fraunhofer IZM's packaging center installs Altatech CVD
All Silicon System Integration Dresden (ASSID) installed an Altatech 300mm CVD tool for dielectric film deposition on advanced through silicon vias (TSV), with diameters as small as 10
10/07/2011 — DuPont LTCC material suits 50GHz+ electronics
DuPont Microcircuit Materials, part of DuPont Electronics & Communications, uncrated its DuPont GreenTape 9K5 low temperature co-fired ceramic (LTCC) packaging material, offering good dielectric constant properties for higher speed, frequency, and reliability applications.
10/06/2011 — Multitest wins gravity test handler order for leaded and leadless package test
Test equipment provider Multitest installed a MT9928 XM Gravity Test Handler at a semiconductor production facility after a 1-year+ benchmarking against two major competitors.
10/06/2011 — Thin wafers win majority in electronics by 2016
Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole D
10/05/2011 — ADI unveils digital isolator package to meet 8mm creepage reqs
Analog Devices Inc. (ADI) introduced a packaging technology for digital isolators that achieves a minimum of 8mm creepage distance required by global industry standards to ensure safe operation in high-voltage medical and industrial applications.
10/04/2011 — Tamar Technology debuts TSV metrology tool WaferScan
Tamar Technology shipped its first fully automated WaferScan system to a major semiconductor fab. The system performs TSV etch depth, deep trench depth, wafer thickness, photo-resist thickness, and hole diameter metrology.
10/03/2011 — IMAPS 2011 preview
IMAPS 2011, the 44th International Symposium on Microelectronics, will take place in less than one week at the Long Beach Convention Center. Ahead of the show, here are some of the highlights for attendees.
10/03/2011 — Rudolph wins TSV inspection systems order
Rudolph Technologies Inc. (NASDAQ:RTEC) shipped its Wafer Scanner 3880 3D Inspection System, multiple NSX Macro Defect Inspection Systems and its Discover Yield Management Software Suite to a leading semiconductor manufacturer for use in developing through silicon via (TSV) structures.
09/30/2011 — Toshiba selling Amkor its Malaysian SATS ops
Amkor will acquire Toshiba Electronics Malaysia Sdn. Bhd., Toshiba
09/29/2011 — Samsung embedded memory fits 8 die in 1.4mm stack
Samsung Electronics Co. Ltd. developed a high-performance 64GB embedded memory with 64Gb NAND. The package contains an 8 die stack in a low profile for smartphones, tablets and other mobile devices.
09/27/2011 — Epson inkjet semiconductor marking system prevents die damage
Seiko Epson Corporation introduced the IP-2000 inkjet semiconductor marking system to print identification data on the surface of a semiconductor package without the danger of damage from laser cutting
09/27/2011 — CSCD completes test socket biz sale, authorizes stock repurchase
Cascade Microtech (NASDAQ:CSCD) completed the sale of its test socket manufacturing business for $550,000 to R&D Interconnect Solutions. Cascade's board of directors also authorized a stock repurchase program under which up to $2,000,000 of its common stock may be repurchased.
09/27/2011 — Ziptronix low-temp direct oxide bonding scales pixels to 0.7
In a podcast interview with ElectroIQ.com, Ziptronix president & CEO, Daniel Donabedian, and company CTO, Paul Enquist, discussed both the Ziptronix wafer bonding technology and their partnership with Sony.
08/24/2011 — Package-on-package (PoP) track at SMTAI
The SMTA will host conference events with Amkor, Research in Motion, and TechLead Corporation on package-on-package (PoP) 3D stacking at SMTA International (SMTAI), October 16-20 in Fort Worth, TX.
08/18/2011 — Multitest test contactor wins out in IDM yield comparison
An IDM recently performed side-by-side comparisons of a Multitest Mercury test contactor and an "established contactor of an incumbent Asian competitor" during high-volume production package testing.
08/17/2011 — Inside the Known Good Die conference
The annual Known Good Die (KGD) conference, taking place Nov. 10 in Santa Clara, CA, will address semiconductor die testing, assembly, manufacturing, and business challenges, with the tagline "KGD in an Era of Multi-Die Packaging and 3D Integration."
08/16/2011 — MEMS, 3D packaging major factors in iNEMI roadmap
The 2011 iNEMI Roadmap, published by the International Electronics Manufacturing Initiative (iNEMI), includes a new chapter on MEMS and sensors, and an expanded chapter on packaging to include substrates discussions.
08/15/2011 — Tessera adds DARPA former director to board
Tessera Technologies appointed Anthony J. Tether, Ph.D., to its board of directors. Tether is CEO of The Sequoia Group, and has held executive positions at DARPA and Ford Aerospace Corp., among others.
08/12/2011 — SEMI convenes system-in-package summit alongside SEMICON Taiwan
SEMI will hold the first-ever SiP Global Summit, September 7-9, co-located with SEMICON Taiwan. Three forums cover system in package (SiP) test, the "3D IC era," and the requirements of mobile electronics.
02/24/2011 — Nanometrics WLP bonding metrology tool launches with logic order
The Unifire 7900IR provides 3D inspection of wafer-scale packaging features as well as registration for wafer-to-wafer bonding applications for use in advanced wafer scale packaging process control.
02/16/2011 — Agilent oscilloscope series debut for tight budgets
Agilent Technologies Inc. (NYSE:A) expanded its mixed-signal and digital-storage oscilloscope portfolio with 26 new models that comprise its next-generation InfiniiVision 2000 and 3000 X-Series. Entry-level mixed-signal oscilloscopes and an integrated function generator are part of the 2 new product groups.
01/20/2012 — Semiconductor industry veteran takes helm at Minco Technology Labs
Minco Technology Labs, hi-rel semiconductor die processing, packaging and test provider, appointed board member Bill Bradford as president and CEO.
01/19/2012 — Samsung Electronics ramps embedded multi-chip packaging with memory products
Samsung Electronics began producing embedded multi-chip package (eMCP) memory for use in entry- to mid-level smartphones. The products use low power double-data-rate 2 (LPDDR2) 30nm DRAM and 20nm NAND flash memory.
01/19/2012 — Hitachi Chemical claims die bonding film patent violation
Hitachi Chemical filed a lawsuit against INNOX in Taiwan, alleging infringement on Hitachi Chemical's Taiwanese patent related to die bonding film used in semiconductor packaging processes.
01/19/2012 — Optomec expands aerosol jet lab for 3D semiconductor packaging, PV, other device formation
Optomec opened its new and expanded Advanced Applications Lab and Product Development Facility in St. Paul, MN. The facility will help Optomec grow its Aerosol Jet additive manufacturing technology for advanced printed electronics applications.
01/18/2012 — Anti-counterfeiting program uses DNA to uniquely code computer chips
The College of Nanoscale Science and Engineering (CNSE) and Applied DNA Sciences (APDN) are partnering to prevent the counterfeiting of computer chips.
01/18/2012 — Hesse & Knipps discusses wedge bonding for RF and microwave devices at workshop
Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Wedge Bonding for RF and Microwave Devices" at the Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging
01/16/2012 — MHI room-temp wafer bonder line grows with 300mm tool
Mitsubishi Heavy Industries launched a fully automated 12" (300mm) wafer bonding tool, Bond Meister MWB-12-ST, capable of producing 3D LSI circuits at room temperature. The 300mm bonder targets production of memory chips and MPUs.
01/11/2012 — Zymet PoP underfill offers lower viscosity, CTE for finer pitches
Zymet introduced the CN-1736 reworkable underfill encapsulant for 0.4mm-pitch package-on-package (PoP) assemblies.
01/11/2012 — Semiconductor packaging houses gain from more device complexity
Increased I/O density, power/performance reqs, and other factors are increasing use of flip chip, 2.5D and 3D technologies, a boon to packaging subcontractors. But they face a challenge from foundries, and must navigate under-utilization of wire bonding capacity.
01/10/2012 — Upcoming SMTA events: IWLPC keynote named, SMTAI seeks presenters
The SMTA released its call for presenters for SMTA International (SMTAI) 2012, October 14-18 in Orlando, FL. The association, along with Chip Scale Review magazine, also announced the keynote for the International Wafer-level Packaging Conference (IWLPC), held November 5-8, San Jose, CA.
01/10/2012 — Teledyne Microelectronics to package Zephyr Photonics VCSELs
Teledyne Microelectronic Technologies will expand its optical packaging portfolio in a partnership with Zephyr Photonics, which makes a proprietary high-temp vertical-cavity surface-emitting laser (VCSEL).
01/10/2012 — Inari proposes acquisition of Amertron
Packaging house Inari Berhad signed an MOU to acquire Amertron Global, which operates in the Philippines and China providing microelectronics and optoelectronics manufacturing services.
01/09/2012 — UltraFlat wafer-level semiconductor test process creates permanent PCB flatness
Multitest qualified its UltraFlat process for high parallel vertical probe card tests. UltraFlat provides permanent overall PCB flatness for better wafer-level test.
01/06/2012 — Hesse & Knipps heavy wire bonder handles power semis
Hesse & Knipps Inc. introduced its next-generation BONDJET BJ93X heavy wire bonder for back-end semiconductor assembly, targeting manufacturers of power semiconductors and automotive electronics.
01/05/2012 — JEDEC publishes wide-I/O mobile DRAM standard
JEDEC Solid State Technology Association released a new standard for wide I/O mobile DRAM: JESD229 Wide I/O Single Data Rate. Wide I/O mobile DRAM increases die integration -- stacking chips with TSV interconnects with a SoC -- and improves bandwidth, latency, power, weight, and form factor.
01/05/2012 — Advantest to expand beyond semiconductor test
Haruo Matsuno, president and CEO of Advantest Corporation (TSE:6857, NYSE:ATE) shares the company's major goals, including expansion into new measurement applications, utilization of cloud computing, and more.
01/05/2012 — STATS ChipPAC expands WLP capacity with new Singapore facility
STATS ChipPAC held the groundbreaking ceremony for a new factory in Singapore, which will enable STATS ChipPAC to expand its manufacturing capabilities for advanced wafer level technologies.
01/04/2012 — TSRA faces stockholder challenge to Board of Directors
Tessera Technologies (TSRA) received a letter from Starboard Value and Opportunity Master Fund Ltd, intending to nominate 3 candidates for the TSRA Board of Directors. Tessera issued a response, saying that it has the right Board and management team in place.
01/03/2012 — PTI buys NEXX deposition tool for RDL and Cu pillar fab
NEXX Systems sold a 300mm Stratus electrochemical deposition (ECD) system to Powertech Technology for copper pillar bumps and re-distribution layers (RDL) fab, and possibly to make TSVs.
01/02/2012 — 3D integration key to 22nm semiconductor devices
The benefits of 3D IC integration can be combined with aggressively scaled 22nm semiconductor devices, with More Moore (scaling) and More than Moore (package advances) developing in parallel but relatively independently, says Paul Lindner, EV Group (EVG).
06/07/2012 — FormFactor probe card tests SoCs
FormFactor Inc. (NASDAQ: FORM) introduced TrueScale Matrix probe cards for 200mm and 300mm Full Wafer Contact system-on-chip (SoC) test applications.
06/06/2012 — ConFab interview: Amkor's Ron Huemoeller on 3D packaging readiness
Ron Huemoeller of Amkor presented in the Advanced Packaging session of Solid State Technology
06/06/2012 — 3D and 2.5D semiconductor packaging technologies @ The ConFab
As packaging has played a larger and larger role in chip performance, form factor, and capabilities, The ConFab has increased its focus on back-end processes. Cue
06/05/2012 — Flash memory maker orders additional Aehr full-wafer test tool
Aehr Test Systems (Nasdaq:AEHR) will install an additional FOX-1 full-wafer test system at a leading flash memory manufacturer.
06/04/2012 — LED package sales to increase but revenues will stay flat until 2014
Displaybank published a 2009-2014 analysis of LED packages, the finished LED components used in various applications. While LED package units will grow steadily through the forecast period, revenues will remain mostly flat from 2010 to 2013.
06/04/2012 — APDN extends DNA products to microelectronics counterfeit prevention with S3IP
The New York State Center of Excellence in Small Scale Systems Integration and Packaging at Binghamton University (S3IP), and Applied DNA Sciences will develop new ways to embed and authenticate DNA on various substrates. This may involve marking semiconductor packaging, and exploring rapid-reading technologies to screen chips.
05/31/2012 — Xilinx relies on stacked silicon interconnect for 28Gbps FPGA
Xilinx Inc. (NASDAQ:XLNX) began shipping a 3D heterogeneous all-programmable FPGA, the Virtex-7 H580T FPGA, using its stacked silicon interconnect (SSI) technology to reach up to 16 28Gbps and 72 13.1Gbps transceiver bandwidth.
05/31/2012 — AT&S cuts embedded package design time by 40% with Mentor Graphics
Mentor Graphics collaborated with Austria Technologie & Systemtechnik (AT&S) to implement AT&S Embedded Component Package (ECP) process in Mentor Graphics
05/30/2012 — Ziptronix wafer stacking tech expands to 3D memory devices
Ziptronix Inc. is helping a 3D memory device maker replace standard die stacking with its DBI wafer-stacking technology, which has been proven in image sensor packaging.
05/30/2012 — New Japan Radio implements Cu wire bonding for power semiconductors
New Japan Radio Co. Ltd. adopted Tanaka Denshi Kogyo KK
05/29/2012 — IC package revenues outgrow unit shipments through 2016
Increased demand for product functionality is driving up IC packaging revenue faster -- a 9.8% compound annual growth rate (CAGR) -- than IC unit growth -- 7.3% CAGR 2010-2016, says New Venture Research (NVR).
05/29/2012 — Semiconductor packaging house orders 14 Rudolph Technologies inspection tools
Rudolph Technologies Inc. will deliver 14 NSX Series 320 inspection systems to a large outsourced semiconductor assembly and test (OSAT) provider.
05/29/2012 — ASE opens Phase 3 semiconductor packaging and test facility in Weihai
Advanced Semiconductor Engineering Incorporated (ASE) opened its Phase 3 manufacturing facility in Weihai, Shangdong province, China, boosting discrete packaging and test capacity.
05/25/2012 — Top suppliers of semiconductor assembly and test equipment: VLSIresearch survey
THE BEST rankings from VLSIresearch identify the highest-rated suppliers of wafer processing, assembly, and test equipment. The top 2 test equipment suppliers were just fractions apart in the rankings.
05/23/2012 — Direct chip bonding, all-SiC design increase power density in Mitsubishi Electric inverter
Mitsubishi Electric Corporation developed a prototype forced-air-cooled three-phase 400V output inverter with all-silicon carbide (SiC) power modules and direct lead bonding that has a power density of 50kVA per liter.
05/23/2012 — APNT's new thermal interface materials meet power semiconductors' reqs
Applied Nanotech Holdings Inc. uncrated the THERCOBOND family of highly thermally conductive bonding and printed materials for power electronics and photonics packaging.
05/23/2012 — Indium expands electronics materials manufacturing with new facility in NY
Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.
05/22/2012 — Invensas debuts high-I/O PoP semiconductor packaging design
Invensas Corporation, Tessera subsidiary, debuted bond via array (BVA) technology, an ultra-high-I/O PoP semiconductor packaging alternative to wide-I/O TSV packaging.
05/21/2012 — Dow Electronic Materials promotes Muni to direct advanced packaging products
Bhavesh Muni took the helm as global business director for the Advanced Packaging Technologies business of Dow Electronic Materials, covering Dow's semiconductor packaging materials product portfolio and its manufacturing capabilities.
05/19/2012 — Amkor plans semiconductor packaging and test facility in Korea
Amkor Technology Inc. (NASDAQ:AMKR) plans to build a state-of-the-art factory and global research and development center in the Incheon Free Economic Zone, which is located in the greater metropolitan area of Seoul, Korea.
05/18/2012 — IC packaging substrates heading for $8.67B in 2012
In 2012, the global IC substrate market will reach a value of USD8.67 billion, according to Research in China
05/16/2012 — Silicon Labs offers bare die from 1 wafer and up
Mixed-signal IC maker Silicon Laboratories Inc. (NASDAQ: SLAB) introduced a microcontroller (MCU) die sales program with a minimum order quantity of 1 wafer.
05/16/2012 — Wire bonder debuts with Cu wire optimization, automatic rethreading from ASM Pacific Technology
The ASM iHawk Xpress Opto Wire Bonder from backend semiconductor assembly equipment supplier ASM Pacific Technology offers new innovations in transport, copper-wire bonding, and automatic rethreading.
05/16/2012 — Kulicke & Soffa expands Singapore HQ, bolsters bonder tool R&D and manufacturing
Kulicke & Soffa broke ground on its Singapore global headquarters expansion, near the current leased headquarters location. A state-of-the-art facility in Serangoon will bolster the company
05/15/2012 — DRIE expands from MEMS to advanced packaging and more applications
05/15/2012 — "3.5D interposer technology could someday replace PCBs" -- TSMC's Doug Yu
05/14/2012 — Heraeus Al-clad Cu bonding wire avoids metallization changes in power semiconductors
Heraeus introduced its high-reliability composite aluminum/copper (CucorAl) semiconductor bonding wire, which offers strong mechanical and electrical bonds to semiconductor pads, with good thermal properties.
02/14/2011 — Keithley Avoid wafer test probe set up cabling errors
Dave Rose, Keithley Instruments, addresses specific cabling techniques for DC, multi-frequency capacitance, and ultra-fast I-V and pulse testing, as well as the importance of proper grounding and shielding, choosing the proper interconnect for a specific measurement, and troubleshooting common interconnect problems.
02/02/2011 — Agilent Infiniium oscilloscopes gain deeper standard memory
Agilent Technologies Inc. (NYSE: A) enhanced the memory depth of its Infiniium oscilloscope lineup. All 30 models now ship with the industry's deepest standard memory and offer the deepest memory options, according to the company.
01/18/2011 — Advanced packaging collab Rudolph Technologies process tool supplier IC device manufacturer for defect inspection wafer debonding
The development effort involves the integration of defect inspection with a debonding tool. Manufacturing efficiencies, along with the ability to handle ultra-thin wafers, necessitates the integration of inspection in de-bonding applications. Rudolph is bringing its inspection technologies to this three-way collaboration to provide this integrated process control solution.
01/07/2011 — Aries 0.30mm pitch test sockets suit BGA CSP MLF packages
Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers machined high-frequency center probe test sockets to accommodate IC devices with a lead pitch of 0.30mm.
03/01/2011 — Wafer probe parameters for current carrying capability in semiconductor test Microprobe
The trend toward complex semiconductor devices is fueling demand for more advanced wafer probe cards capable of accurately and cost-effectively testing these ICs, says January Kister, Microprobe. Kister examines the variables that impact current carrying capability (CCC) during semiconductor wafer test, and describe an optimal probe design with a composite metal structure.
03/15/2011 — KLAC packaged IC inspector ICOS CI T620
KLA-Tencor Corporation (Nasdaq: KLAC) introduced the ICOS CI-T620, a high-performance component inspector system for tape and reel. The CI-T620 system has dual tapers working sequentially with minimal operator intervention to increase units per hour.
03/15/2011 — TeraView partners with HELIOS on THz semiconductor package failure analysis
TeraView and HELIOS are partnering to improve semiconductor package failure analysis using terahertz technology. The technology was originally developed with Intel and isolates faults in advanced 3D semiconductor packages.
03/01/2012 — Thermal modeling software aids 3D IC, SoC, SiP designs
Docea Power, power and thermal analysis software supplier, released AceThermalModeler for generating compact thermal models of SoCs, 3D ICs, SiP devices, and complete boards.
03/01/2012 — Package and test provider orders new Verigy Smart Scale technology
March 1, 2012 - Marketwire -- Semiconductor test equipment supplier Verigy, an Advantest Group company (TSE: 6857, NYSE:ATE), installed multiple V93000 Smart Scale and Pin Scale Generation testers with Pin Scale digital channel cards at ISE Labs' test and packaging facilities in CA and TX. ISE Labs has a long[...]
02/28/2012 — Two-element wafer-level camera from Nemotek boasts low distortion
Nemotek Technologie uncrated a two-element wafer-level camera, Exiguus H12-A2. The two-element lense gives Exiguus H12-A2 high resolution and low (<0.5%) distortion.
02/24/2012 — LED packaging report reveals costs, reliability impact of package
With thermal issues accounting for half of all lighting failures, and costs prohibitive to widespread adoption, assembly and packaging are keys to improving LEDs. TechSearch International tracks LED packaging materials and methods, as well as reliability and package efficiency.
02/23/2012 — NEXX Systems bolsters employee skills with new grant
February 23, 2012 -- Wafer-level packaging tool maker NEXX Systems was awarded a $42,765 Workforce Training Fund grant from the state of Massachusetts, where NEXX Systems is headquartered. The grant will help provide training and professional development for more than 100 employees there, improving lean manufacturing techniques and adding[...]
02/21/2012 — Present at ESTC 2012 in Amsterdam
Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.
02/21/2012 — Amkor plans IMAPS Device Packaging keynote
The 2012 IMAPS Device Packaging Conference will take place March 6-8 in Fountain Hills, AZ, with Amkor's Dr. Robert Darveaux presenting "Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect Technologies."
02/17/2012 — Join iNEMI's electronics manufacturing supply chain workshop at IPC APEX
iNEMI will hold the industry kick-off for its 2013 Roadmap in an open workshop immediately following IPC APEX EXPO in San Diego, CA, March 1-2.
02/16/2012 — Georgia Tech produces 130um 3D organic semiconductor package
02/15/2012 — Universities: Enter to win a Finetech die bonder
Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges.
02/15/2012 — Hesse & Knipps opens wedge bonder demo lab on West Coast
Backend packaging equipment supplier Hesse & Knipps Inc. opened a West Coast Demo and Applications Laboratory at its manufacturer rep Chalman Technologies.
02/15/2012 — LEDs, power semiconductors packaged with high-thermal-conductivity die attach adhesives
Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for LEDs and small power semiconductor die packaging.
02/10/2012 — Amkor continues cost reductions with voluntary retirement in Japan
Amkor (NASDAQ:AMKR) shared that it cut costs through workforce reductions in Q4 2012, and announced a voluntary retirement program in Japan to continue this initiative.
02/09/2012 — Synova Laser MicroJet wafer dicing tools to be made by Makino
Synova SA formed an OEM agreement with its partner Makino Milling Machine Co. Ltd., wherein Makino will manufacture Laser MicroJet (LMJ) tools based on Synova technology.
02/08/2012 — SATS providers order BTU reflow ovens in Asia
BTU International Inc. won multiple orders for PYRAMAX solder reflow ovens from semiconductor assembly and test subcontractors (SATS) in Asia.
02/07/2012 — Kyocera doubles flip-chip assembly with new cleanroom in US
Kyocera America, Inc. doubled its flip chip assembly capacity for microelectronic devices with a $3.5 million Class-10,000 cleanroom, offering lead-free processes in San Diego.
02/06/2012 — Rudolph sells metrology tool for back-end wafer packaging processes
Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.
02/06/2012 — SUSS wafer bonder/debonder features up to 6 modules in new generation
SUSS MicroTec launched the XBC300 Gen2 high-volume 3D wafer processing tool for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers.
02/03/2012 — X-FAB Silicon Foundries adopts SFT software
X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18
02/02/2012 — 3M debuts high-capacitance ECM for IC packaging, RF, other apps
3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI).
02/01/2012 — Multitest launches MT9510 x16 test tool with Asian sale
Multitest launched its tri-temp 16-site pick-and-place platform, MT9510 x16, with an installation at a high-volume chip test site in Asia.
02/01/2012 — STATS ChipPAC shutters Thailand semiconductor packaging plant after floods
STATS ChipPAC decided not to resume semiconductor assembly operations in its Thailand plant, owing to extensive equipment and facility damages sustained during the disastrous floods in 2011.
01/31/2012 — CEA-Leti launches 3D semiconductor packaging platform
CEA-Leti launched a major new platform, Open 3D, that provides industrial and academic partners with a global offer of mature 3D packaging technologies for their advanced semiconductor products and research projects.
01/31/2012 — Tanaka establishes copper bonding wire production in Taiwan
Tanaka Denshi Kogyo K.K., of Tanaka Precious Metals, will establish a production subsidiary for manufacturing copper bonding wire in Taiwan, with manufacturing ramp on February 1.
01/26/2012 — Keithley Instruments upgrades semiconductor test software suite
Keithley Instruments Inc. upgraded the capabilities of its Automated Characterization Suite Test Environment to ACS Version 4.4. The software is used with several Keithley instrument and system configurations for automated device characterization and reliability analysis.
01/25/2012 — 3D MID sensor fabricated with Ticona laser-activated LCP circuits
2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic circuits. The Vectra E840i forms circuits on 3D injection moldings produced with an LDS process.
01/24/2012 — Presto Engineering semiconductor service hub opens in Israel
Presto Engineering, integrated semiconductor test and product engineering services provider, opened its newest Hub to serve the semiconductor design community, in Israel.
01/24/2012 — USPTO seeks nominees for National Medal of Technology and Innovation
The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."
01/23/2012 — Sony stacks CMOS image sensor pixel structures and chips
Sony has developed a backside-illuminated CMOS image sensor that layers the pixel section with back-illuminated structures over the chips containing signal processing circuits, instead of using supporting substrates.
11/20/2012 — Will the $2 interposer be silicon or glass?
Dr. Phil Garrou reports from the 2nd annual Georgia Tech 2.5D Interposer Conference: what's the market projection for silicon and glass interposers, what's preventing high-volume manufacturing, and is there a crossover with flat-panel display glass manufacturing?
11/13/2012 — Alchimer pursuing partners with new CEO, CTO
Alchimer SA says it is seeking partnerships with various semiconductor equipment and materials companies as it welcomes two top execs: Bruno Morel is the company's CEO since May of this year, and product development director Fr
11/07/2012 — Deca tips new M-Series chip-scale packaging offering
Deca Technologies has introduced a new chip-scale packaging (CSP) product line for applications where its existing wafer-level CSP option isn't a good fit. Details and analysis to come.
03/22/2012 — Texas Instruments (TI) embedded die package teardown report released
Texas Instruments' MicroSiP module is the first embedded die package in high volume production. Yole D
03/21/2012 — Altera taps Amkor for molded flip chip packaging of FPGA family
Altera Corporation will use an exposed-die molded flip chip technology from Amkor on its 28nm Arria V FPGA. Amkor
03/20/2012 — Imec's via-middle TSV fab 'reveals' contacts by wafer thinning/etch
Imec developed a via-middle approach to through-silicon via (TSV) manufacturing for 3D packaging, using wafer thinning and a silicon etch process to reveal TSV contacts on the wafer.
03/20/2012 — Teradyne tester boasts high throughput of consumer digital chips
Teradyne uncrated its Magnum semiconductor test system with a proprietary scalable chassis design and tester-per-board architecture for high compound parallel test efficiency on consumer digital devices.
03/19/2012 — New LTXC semiconductor test tools suit ASSP, RF test
LTX-Credence Corporation (Nasdaq:LTXC) released the Diamondx test platform for ASSP and the DragonRF for RF device test. In addition, LTX-Credence launched a SerDes test instrument and new testing software.
03/16/2012 — TEL acquires advanced packaging tool supplier NEXX
TEL will acquire semiconductor packaging equipment supplier NEXX Systems. NEXX makes advanced deposition equipment, including ECD and PVD tools, for wafer-level packaging (WLP).
03/16/2012 — Amkor (AMKR) names Taiwan leader with semiconductor packaging background
Amkor Technology Inc. (Nasdaq: AMKR) added Mike Liang as president of Amkor Technology Taiwan. Liang's background includes stints with Phoenix Semiconductor, Ti-Acer, UMC, and others.
03/15/2012 — Presto installs LTX-Credence semiconductor test platform for RF wireless devices
Presto Engineering selected an LTX-Credence Corporation (Nasdaq:LTXC) X-Series platform for testing wireless communications, automotive and industrial customer devices.
03/14/2012 — AMEC debuts TSV etch tool with Chinese installations
Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.
03/14/2012 — Shin-Etsu Chemical joins EVG wafer bonding supply chain
EV Group (EVG) welcomed Shin-Etsu Chemical into its open platform for temporary bonding/debonding materials supporting 3D semiconductor packaging.
03/13/2012 — ULVAC cuts gold from package-level solder deposition process with sputtering methods
ULVAC Inc. developed solder deposition processes for silicon device manufacturing, including power devices, that sputters solder to deposit it rather than printing or evaporating the materials. The 2 processes eliminate gold, or gold and nickel, from the step.
03/12/2012 — Interposer supply/ecosystem examined at IMAPS Device Packaging
Dr. Phil Garrou, a contributing editor and regular blogger on Solid State Technology, shares the highlights of an Evolving 2.5D/3D Infrastructure panel he hosted at IMAPS Device Packaging. On the table: where TSVs and interposers are made, a TSV/interposer timeline and cost analysis, and the requirements of mobile electronics.
03/09/2012 — KLIC wire bonder debuts for low-pin-count, discrete packaging
Kulicke & Soffa Industries Inc. (K&S, NASDAQ:KLIC) introduced its ConnX Plus high-speed ball bonder for low-pin-count semiconductor packaging.
03/09/2012 — K&S capillary specifically suits LED wire bonding
Kulicke & Soffa launched the LUMOS Capillary for LED die wire bonding. The capillary can bond with gold or gold-alloy wires and uses a new TG ceramic material for better workability.
03/09/2012 — Kulicke & Soffa semiconductor wafer dicing blades tuned for discretes
Kulicke & Soffa Industries Inc. (K&S, NASDAQ:KLIC) launched its AccuPlus Hub Blades product line, customizable blades for discrete wafer dicing.
03/08/2012 — Micro glass drilling enables 0.1mm semiconductor interposers
AGC (Asahi Glass Co. Ltd.) developed ultra-high-speed processing technology for micro hole drilling of 0.1mm-thin glass, targeting leading-edge applications such as 3D semiconductor packages.
03/08/2012 — SMIC releases Cu-BEOL manufacturing platform library
March 8, 2012 - PRNewswire-Asia/ -- Semiconductor Manufacturing International Corporation (SMIC; NYSE:SMI; SEHK:0981.HK), China-based advanced semiconductor foundry, announced an ultra high density (UHD) library solution for its 0.11um copper back end of line (Cu-BEOL) manufacturing platform that can reduce chip size by an average of 31%. SMIC's comprehensive[...]
03/07/2012 — Surrey NanoSystems commercializing advanced packaging innovations with $7M new funding
Surrey NanoSystems raised third-round funding of
03/07/2012 — AMAT, Singapore's microelectronics institute open 3D semiconductor packaging R&D lab
Applied Materials Inc. (AMAT) opened the new Centre of Excellence in Advanced Packaging at Singapore
03/06/2012 — Henkel underfill boasts high Tg for WLCSP and PoP devices
Henkel developed LOCTITE UF3810 underfill for high reliability and ease of rework when applied to next-generation wafer-level chipscale packages (WLCSP) and package-on-package (PoP) devices.
03/06/2012 — Package and micro-mechanical test equipment installed at DfR Solutions
DfR Solutions installed micro testing tools from XYZTEC for JEDEC qualification, dynamic bend testing, copper wire bond pull and shear testing, and material characterization of lead-free solders.
03/06/2012 — STATS ChipPAC brings FOWLP to stacked packages for
STATS ChipPAC Ltd. (SGX-ST:STATSChP) uncrated its next-generation eWLB package-on-package (PoP) technology, with a package profile height below 1.0mm.
03/06/2012 — Flip chip bumping, WLP partnership unites FCI and NANIUM
"Together, FCI and NANIUM offer a complete WLP service portfolio covering 150, 200 and 300mm wafer sizes," summarized Armando Tavares, NANIUM president of Executive Board.
03/05/2012 — Plessey Semiconductors debuts ECG sensor from passive component project
Plessey Semiconductors developed the Electric Potential Integrated Circuit (EPIC) sensor, optimized for use as an ECG sensor, at a reportedly lower cost and better resolution than conventional electrodes. It enables ECG monitoring in mobile phone applications.
03/02/2012 — Multitest test contactor suits large-array, high-pin-count digital chip test
Multitest launched a new Quad Tech contactor, the Triton contactor, for high-end digital test applications such as server, computer, mobile smartphone, digital TV, and graphics chips.
03/02/2012 — WACKER opens silicone R&D center for Korean electronics makers
WACKER expanded and relocated its South Korea technical laboratories and offices, bringing together R&D operations, applications technology, and basic and advanced training in silicones and polymers applications.
03/01/2012 — AMAT, A*STAR Advanced Packaging Centre of Excellence plans grand opening
Applied Materials and Singapore's A*STAR Institute of Microelectronics will officially open the Centre of Excellence in Advanced Packaging, in Singapore
10/29/2012 — Lockheed Martin develops new Cu solder
Lockheed Martin scientists have developed a new "nanotechnology" copper-based solder that it says will produce joints with up to 10
10/22/2012 — ICECool puts 3D thermal issues back in focus
With the approach of full commercial production of 3DIC products, Dr. Phil Garrou shifts his attention to thermal performance questions and proposed thermal solutions for the future.
10/18/2012 — SPTS Technologies, Fraunhofer IZM researching lower-temp films for TSVs
Fraunhofer IZM's All Silicon System Integration Dresden (ASSID) center will add SPTS' etch and PECVD process capabilities to investigate low-temperature dielectric films for through-silicon vias (TSV) in 3D IC packaging.
10/12/2012 — Why SATS consolidation needs to happen
The advent of leading-edge semiconductor packaging technologies dictates efficient use of capital, and only the top-tier semiconductor assembly and test services (SATS) companies will have the financial wherewithal to develop required expertise and capacity, says one analyst.
10/10/2012 — Nanium ships 200 millionth eWLB component
Nanium says it has shipped its 200 millionth embedded wafer-level ball grid array technology (eWLB) component, a 10% year-over-year productivity increase that reflects full conversion to the company's eWLB overmold technology that allows thinner and more robust packages.
10/05/2012 — Tessera to CEO: Spin off a business by 2015, vest $7.5M shares
Tessera Technologies is giving CEO Robert A. Young a big financial incentive to spin off one of its two businesses by March 2015, one of the company's key long-term strategic goals.
09/27/2012 — KIT develops "photonic wire bond" for optical chip connections
Researchers at the Karlsruhe Institute of Technology (KIT) say they have developed a novel optical connection process for semiconductors using "photonic wire bonding" that achieves data transmission rates of several Tbit/sec.
09/19/2012 — SPTS unveils low-temp PECVD cluster tool for 3D ICs
SPTS' Delta fxP cluster system achieves low-temperature deposition of TEOS oxides and nitrides for via-reveal passivation in 3D IC packaging, solving two key problems of low temperatures and bonding adhesive outgassing.
09/10/2012 — EVG updates modular coater/developer with OmniSpray, NanoSpray coating options
EV Group's updated modular EVG150 high-volume coater/developer adds new modules for conformal coating of high topography surfaces, and coating surfaces with vertical sidewall angles, such as through-silicon vias (TSV).
09/10/2012 — UMC, ST to develop 65nm backside CMOS image sensors
09/06/2012 — Rudolph wins order for advanced packaging metrology systems
An unidentified "premier global industry research center in Asia" will use Rudolph Technologies' MetaPulse G metrology system in its advanced packaging process development activities.
09/04/2012 — Ultra Tec adds endpoint detection module for chip package sampling
Ultra Tec Manufacturing has released a new endpoint detection module for its ASAP-1 IPS selected area preparation system, for improving electronic package decapsulation and sample preparation.
08/27/2012 — Microsemi unveils tiny die packaging for implantable medical devices
Microsemi says its new die packaging technology, targeting implantable medical devices such as pacemakers and cardiac defibrillators, can be paired with an ultralow-power radio for wireless health monitoring.
08/24/2012 — Conflict mineral -- Au, Ta, Sn, W -- legislation passes in the US
The US SEC adopted a rule that requires companies to publicly disclose their use of conflict minerals -- including tantalum, tin, gold, and tungsten -- that originated in the Democratic Republic of the Congo (DRC) or an adjoining country.
04/13/2011 — Beyond ball shear test Microprobing chip/package stress at Stanford
New work from Stanford goes beyond simple bump shear testing to allow simulation of stresses exerted on chips during semiconductor packaging. The researchers are able to explore how the stresses affect back-end structures. Alex Hsing, a PhD student in Professor Reinhold Dauskardt's Group at Stanford University, summarizes the group's approach.
04/12/2011 — Multi depth imaging system shows defect progress
Sonoscan has demonstrated the single-scan imaging of a sample at 50 different depths, or gates, a technique called PolyGate. It reveals how features, including defects, change from one gate to the next.
04/08/2011 — Thermal analysis system tracks temp, air velocity and pressure from multiple points
Advanced Thermal Solutions, ATS, has released the iQ-200 thermal analysis system for precisely and simultaneously measuring the temperatures of solid materials and the surrounding air, as well as tracking air velocity and air pressure at multiple points to comprehensively profile heat sinks, components, and PCBs.
04/06/2011 — Keithley 2652A SourceMeter tests high power semiconductors
Keithley Instruments Inc., advanced electrical test instruments and systems provider, introduced the Model 2651A High Power System SourceMeter instrument to characterize high-power electronics, like HB-LEDs, power semiconductors, DC-DC converters, batteries, etc.
09/23/2011 — Wafer packaging database provides WLP data
Research and Markets released "Wafer Packaging Fab Database," providing a global overview over 150 companies' 250+ mid-end semiconductor packaging houses.
09/22/2011 — Rogers names president and CEO from specialty materials industry
Rogers Corporation's (NYSE:ROG) Board of Directors elected Bruce D. Hoechner as the materials company's new president and CEO, effective October 3, 2011. Hoechner's past positions were with Rohm and Haas and Dow Chemical.
09/22/2011 — Open microfocus X-ray tubes gain automatic venting
X-RAY WorX GmbH introduced electronically controlled venting valves for open X-ray tubes. This avoids the manual venting typically performed during X-ray tool maintenance.
09/20/2011 — Present on interposer technology
The first annual Global Interposer Technology Workshop at Georgia Tech will convene students, academics, researchers, and industry to share information on silicon and glass interposers for semiconductor packaging.
09/14/2011 — IRphotonics installs thermal camera for IR cure R&D
IRphotonics added a high-resolution FLIR thermal imaging camera to its application engineering lab. The camera will be used to analyze heat distribution during iCure use.
09/08/2011 — Multi-die face-down packaging suits existing wire bond lines
Invensas Corporation, a Tessera subsidiary, will demonstrate dual-face down implementation of its new multi-die face-down packaging technology at the Intel Developer's Forum. The multi-die package is wire bonded, mounting ICs upside down and staggering them in a shingle-like configuration.
09/07/2011 — EVG enhances fusion wafer bonder throughput, accuracy
EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20WPH with enhanced automation capabilities and low-temperature processing.
09/07/2011 — 3M, IBM to make 3D chip adhesives
Forget "3D stacking" -- the two companies say a special electronic "glue" applied to the wafer will help stack dozens of chips into a "silicon skyscraper" that will be much faster and more efficient than current chip technology.
09/06/2011 — Alchimer TSV barrier-layer film shows 100% deposition coverage
Alchimer's AquiVia film-deposition technology promises to cut fill deposition times and cost even with complex through-silicon via (TSV) 3D packaging structures. The product targets TSV ramp-up at production levels, according to the company.
09/01/2011 — Multitest position detection system prevents jams in test handlers
The PDC concept on the Multitest MT2168 uses sensor-based alignment in the standard pick-and-place processes to reduce small package misplacements and test system jams.
11/17/2011 — STATS ChipPAC expands wafer-level chipscale packaging in Taiwan
STATS ChipPAC Ltd. completed the expansion of its 300mm wafer bump and wafer-level chipscale packaging (WLCSP) operation in Taiwan.
11/15/2011 — SUSS MicroTec sends equipment to SVTC in MEMS, 3D IC dev partnership
Nanotechnology accelerator SVTC Technologies partnered with SUSS MicroTec on wafer-level packaging for MEMS, and 3D IC bonding technology development.
11/14/2011 — Microsemi taps Amkor for SoC package test
Microsemi SoC Products Group will use outsourced semiconductor assembly and test (OSAT) provider Amkor Philippines (ATP) for final electrical package test on nearly all its products.
11/11/2011 — Fujikura, FlipChip International improve embedded die packages
Fujikura Ltd. and FlipChip International LLC (FCI) released ChipletT and ChipsetT embedded die packages for single die or multi-die semiconductor packaging applications.
11/11/2011 — Backside-illuminated image sensors: Optimizing manufacturing for a sensitivity payoff
Backside-illuminated image sensors require more precise wafer processing -- uniform extreme wafer thinning, dopant control, epitaxy growth, trench manipulation, etc. -- but the payoff in image quality is significant. Researchers at imec experimented with different wafer fab technologies to make a record BSI sensor. They also consider new architectures/packaging techniques for this technology.
11/10/2011 — LED maker shrinks heatsinks with air holes
LED lighting maker Gem Hsin Electronics reduced the size of heatsinks in its LED products by drilling miniscule holes beneath LEDs. The holes allow heated air to escape the LED package.
11/10/2011 — Thin-film chip boosts LED optical output without changing footprint
OSRAM Opto Semiconductors increased its IR Power Topled with lens optical output by 80% over the standard version by integrating a thin-film chip. The IR LED maintains the same surface area and drive current.
11/09/2011 — WLP start-up combines SunPower solar silicon fab with Cypress semiconductor interconnect
Deca Technologies, a new company backed by Cypress Semiconductor and SunPower, will combine solar wafer manufacturing methods with semiconductor manufacturing support to create wafer-level chipscale packaging (WLCSP) derivatives.
11/08/2011 — 3D Direct Write technology for microelectronics packaging
Invenios developed a 3D Direct Write laser patterning technology for microelectronics packaging that integrates optical, mechatronic, and housing functionalities into the package substrate.
11/08/2011 — PVA debuts coating and dispensing workcell with updated design
PVA is introducing the PVA6000 flexible coating and dispensing tool with new features based on customer feedback to improve accessibility for maintenance and improve ease of use.
11/07/2011 — SEMATECH creates 3D packaging standards development forum
SEMATECH has created an online 3D Standards Dashboard, allowing 3D semiconductor and MEMS interconnect professionals to exchange standards activity information.
11/04/2011 — Thailand flood update from key semiconductor assembly and test companies
Numerous global semiconductor suppliers maintain assembly and test operations in Thailand. Many of these facilities have been affected by the disaster. IHS iSuppli pulled together a list of those affected, and those that have thus-far escaped damage.
11/04/2011 — Amkor transitions PBGA packaging to pin-gate molding
Amkor will convert all of its 19mm through 31mm body size plastic ball grid array (PBGA) packages to pin-gate molding (PGM) over the next few years.
11/04/2011 — Steve Adamson passes; Nordson plans memorial scholarship
Nordson Corporation will honor the life of Steven J. Adamson, former Nordson ASYMTEK marketing specialist and electronics industry mentor, by funding a $3,000 annual scholarship in Adamson's name with the IMAPS Educational Foundation.
11/04/2011 — Multitest passes BGA test evaluation at IDM
Multitest's Mercury contactor passed a "thorough BGA test evaluation," landing on the qualified contactors list for all business units of an international IDM.
11/03/2011 — Amkor awards top suppliers in 2011
Amkor Technology Inc. (NASDAQ:AMKR) honored 7 companies with its 2011 Supplier Award, for substrates, materials, and equipment.
11/02/2011 — Halogen-free underfill uncrated at Henkel
Henkel will launch several new electronics assembly materials at Productronica, November 15-18 in Munich, Germany. The new HYSOL underfill is a halogen free, reworkable epoxy capillary underfill with a high Tg.
11/02/2011 — Henkel debuts automotive sensor packaging adhesive
Henkel will launch several new electronics assembly materials at Productronica. The ABLESTIK ICP-4000 has been qualified to bond components to metal leadframes in plastic housings.
11/02/2011 — MOSAID taps Winpac to package fastest NAND Flash device
MOSAID launched the 256Gb HLNAND2 semiconductor memory device, operating at up to 800MB/s per channel for mass storage applications. Winpac will package and distribute HLNAND devices for MOSAID.
04/25/2011 — Molded flip chip imaging improved at Sonix
Sonix Inc. introduced its Molded Flip Chip Imaging (MFCI) enhancement. Sonix MFCI improves image quality and defect detection in molded flip chips and packages with polyimide (PI) layers.
04/19/2011 — Multitest ECON contactor exceeds 4.5M insertions
Multitest's ECON contactor exceeded 4.5 million insertions at an Asian test house. The contactor performance resulted in a 99% stable test yield.
03/30/2011 — MENT tailors 3D and 2.5D IC test
Mentor Graphics (MENT) says many of its EDA customers are designing, verifying, manufacturing and testing integrated circuit products using multi-die vertical stacking technology, 3D-IC. The company is deploying a multiple-component Tessent design-for-test product line for integrated multi-die hierarchical scan and built-in self-test methodologies.
03/29/2011 — 3D CT X ray imaging fills inspection gaps says Xradia
Xradia has unveiled its latest micro computed tomography (CT) 3D X-ray imaging system, the VersaXRM. Kevin Fahey, PhD, VP of marketing at Xradia, discusses how the new platform uses geometrical magnification in tandem with an X-ray microscope.
03/28/2011 — Henkel conductive die attach film for thin die advanced packages
Henkel Electronics released 2 formulations of Ablestik C100 conductive die attach film for leadframe packages, including QFNs. It eliminates die tilt, processes thin wafer die, and enables bondline control.
03/25/2011 — Stacked semiconductor die inspection debuts from Sonix
Sonix Inc., scanning acoustic microscope designer and manufacturer, introduced its Stacked Die Imaging (SDI) enhancement, which effectively inspects for defects in semiconductor stacked die and wafer level packages (WLP) by selectively increasing the ultrasonic signal gain for deeper interfaces of interest.
12/09/2011 — Honeywell taps Tezzaron Semiconductor to stack rad-hard die
Honeywell Microelectronics will use Tezzaron's 3D stacking on Honeywell
12/09/2011 — KLIC appoints Director from telecom industry
Kulicke & Soffa Industries Inc. (NASDAQ:KLIC or K&S) named Chin Hu Lim to its Board of Directors, also serving on KLIC's Management Development & Compensation Committee.
12/07/2011 — TSMC, Arteris develop silicon-interposer-based NOCs
Arteris Inc., network-on-chip (NoC) interconnect IP company, will incorporate its FlexNoC NoC interconnect IP into an SoC die on silicon interposer test chip with TSMC.
12/06/2011 — Silicon interposer partnership sets roadmap
Singapore's A*STAR IME and 3D IC developer Tezzaron Semiconductor signed a research collaboration agreement to develop and exploit advanced through silicon interposer (TSI) technology.
12/06/2011 — TEL's 3D packaging tool suite unveiled
Tokyo Electron Limited (TEL) launched a suite of 3D packaging tools: the Tactras FAVIAS TSV deep-silicon etch system; the TELINDY PLUS VDP film deposition tool; and the wafer bonder/debonder Synapse Series.
12/06/2011 — TEL power chip dynamicing occurs at the wafer level
Tokyo Electron Limited (TEL) has successfully demonstrated dynamicing -- device switching/dynamic characteristic (AC) -- of a power device at the wafer level.
12/06/2011 — 2.5D announcements at the Global Interposer Tech conference
At the recent Global Interposer Technology workshop at Georgia Tech, Xilinx and TSMC discussed 2.5D chip packaging technologies and others touted the potential of glass as an interposer substrate material, reports Dr. Phil Garrou.
12/05/2011 — Technic gold-reduction packaging technology unleashed
Technic Inc. is entering the last development phase on technologies to reduce gold consumption in electronics packaging and connector applications, a product group it will call "Goldeneye."
12/05/2011 — SUSS Microtec launches high-volume temporary wafer bonder with 1st install
SUSS MicroTec launched the XBS300 temporary bonder for high-volume wafer manufacturing. The Bond Cluster is configured to temporarily bond 200mm and 300mm wafers for 3D integration applications as well as other processes that require thin wafer handling.
12/05/2011 — SUSS Microtech adds Brewer Science ZoneBond to wafer bonders
Brewer Science Inc. will offer the ZoneBOND process on equipment supplier SUSS MicroTec's XBC300 and XBS300 wafer bonding platforms.
12/02/2011 — IBM fabs Micron memory cube with TSV tech
Using the advanced through-silicon via (TSV) fabrication process at IBM (NYSE:IBM), Micron Technology Inc. (NASDAQ:MU) will begin producing its Hybrid Memory Cube. The companies claim that this is the first CMOS design to go commercial with TSV interconnects.
12/01/2011 — IR orders NEXX metallization systems for IGBT fab
International Rectifier (IR) purchased multiple Apollo physical vapor deposition (PVD) systems from packaging equipment maker NEXX Systems for its Newport, Wales fab.
11/29/2011 — Partnership forms to commercialize advanced photonic chip innovations
The Institute of Microelectronics, a research institute of Singapore's A*STAR, plans to commercialize key innovations in silicon photonic chips designed to support high-speed, high-bandwidth optical communications.
11/29/2011 — Dainippon Screen develops maskless direct imaging exposure system
Dainippon Screen Mfg. Co. Ltd. developed the DW-3000 direct imaging exposure system for next-generation semiconductor packaging, exposing complex 3D multilayer substrates while adjusting for warping and distortion of individual wafers.
11/29/2011 — OSRAM envelops LED chip in reflective package
OSRAM Opto Semiconductors introduced the Oslon Square LED for lighting applications, packaged enclosed in a reflective layer to boost light output.
11/28/2011 — Cirrus Logic awards STATS ChipPAC for packaging services
SATS provider STATS ChipPAC Ltd. (SGX-ST:STATSChP) was named "Supplier of the Year" by Cirrus Logic Inc. (NASDAQ:CRUS), analog and mixed-signal processing components maker.
11/28/2011 — Leti on 3D CMOS and photonics interconnect
11/24/2011 — Hynix renews Tessera license
Hynix Semiconductor Inc. exercised the renewal option in its March 31, 2005 license agreement with Tessera Technologies Inc. (NASDAQ:TSRA) to extend the term of that license to May 22, 2017.
11/22/2011 — AKM consigns chip test equipment to ChipMOS' ThaiLin under new service agreement
ChipMOS subsidiary ThaiLin Semiconductor Corp. will take on dedicated semiconductor testing capacity for a new long-term service agreement with its client Asahi Kasei Microdevices Corporation (AKM).
12/30/2011 — 22nm requires foundry-to-packaging-house cooperation
At the 22nm node, die fragility and challenging interconnect materials will necessitate foundry collaborations with packaging houses, co-designing silicon and package, asserts E. Jan Vardaman, TechSearch International.
12/28/2011 — Newport to buy photonics test tool maker
Newport Corporation (NASDAQ:NEWP) will acquire ILX Lightwave Corporation, which makes high-performance test and measurement products for laser diodes and other photonics components. Newport will pay $9.3 million in cash.
12/27/2011 — GSA publishes 3D/2.5D packaging studies
The Global Semiconductor Alliance released "3D IC Architecture: A Natural Evolution," a report sponsored by Macronix International and Etron Technology. GSA also published the 2nd edition of the 3D IC Design Tools and Services Tour Guide.
12/27/2011 — Advanced package technologies' growth through 2015
Small, mobile, Internet-connected devices are bucking the slow economy and use advanced packaging technologies to pack an enormous amount of functionality into a very small form factor, notes New Venture Research, which provides forecasts for each advanced packaging device type.
12/24/2011 — Amkor PoP tech surpasses 100M units
Amkor Technology Inc. (Nasdaq:AMKR), semiconductor assembly and test services (SATS) provider, has shipped more than 100 million units of its Through Mold Via (TMV) package-on-package (PoP) products.
12/22/2011 — Fan-in WLCSP outpaces semiconductor packaging market
Yole identifies the fan-in wafer-level chipscale packaging (WLCSP) market for strong growth, and a diverse base of chip technologies. Fan-in WLCSP reached 2.3 million 300mm-equivalent wafers shipped in 2011, or about $1.7 billion in revenue.
12/20/2011 — High-temp area-array package test sockets suit military, geophysical apps
Aries Electronics debuted AR4HT Series chipscale package (CSP) test sockets that accept any area-array device for testing up to 200
12/21/2011 — AVX eliminates conflict tantalum
AVX Corporation has ensured that all its tantalum powder and wire suppliers are fully compliant with the independently audited Conflict-Free Smelter Program (CFS).
12/19/2011 — Powertech seeks 30-51% of Greatek
Powertech Technology Inc. (PTI) has approved a tender offer of NT$25.28 per share for the common shares of Greatek with a minimum acquisition target of 30% of outstanding shares.
12/16/2011 — Copper wire bonding offered from Quik-Pak
Quik-Pak, a division of Delphon Industries, is performing copper wire bonding on a Kulicke & Soffa (K&S) Maxum Ultra wire bonder. Available wires include bare copper and palladium-coated copper.
12/15/2011 — ITRI brings 3D packaging expertise to Rambus partnership
Licensing company Rambus Inc. (Nasdaq:RMBS) is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan on the development of interconnect and 3D packaging technologies.
12/15/2011 — IPC, JEDEC devise package strain test
IPC and JEDEC created
12/15/2011 — Bond shear inspection and 300mm wafer handling integration enables Class-2 cleanliness
CHAD Industries integrated its WaferMate300-1 automated wafer handling workcell with Nordson DAGE's 4300 Bond Shear inspection tool, allowing for hands-off 300mm handling and bond shear inspection.
12/14/2011 — Underfill, wafer-level dielectrics, Cu-compatible resins among packaging material winners
Semiconductor packaging materials will be a $22.8 billion market this year, and should grow to $25.7 billion by 2015, says SEMI and TechSearch International.
12/14/2011 — ST eliminates wafer probes for on-wafer die test
Secember 14, 2011 -- STMicroelectronics (NYSE:STM) produced a semiconductor wafer tested via electromagnetic waves rather than physical wafer probes. ElectroMagnetic Wafer Sort (EMWS) was developed from Electrical Wafer Sort (EWS), performed at the end of wafer processing and before package assembly and final test. In EMWS, each die contains a[...]
12/13/2011 — inTEST to acquire Thermonics division of Test Enterprises
inTEST will acquire the assets and certain liabilities of Thermonics from Test Enerprises. inTEST's Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.
12/12/2011 — Mentor Graphics integrates T3Ster and FloTHERM for power device thermal management
Mentor Graphics Corporation (NASDAQ:MENT) has combined technologies for thermal characterization and simulation with T3Ster hardware test products and its FloTHERM software, enabling better heat management in power semiconductor packages, such as LEDs.
06/14/2011 — Rudolph launches TSV inspection tool, wins first order
Rudolph Technologies debuted the NSX 320 Automated Macro Inspection System for through silicon vias (TSV) and other advanced package process inspection, edge trimming metrology, wafer alignment for bonding, and inspection of sawn wafers on film frames and other TSV-related processes.
06/21/2011 — Flip chip probe card from Wentworth Laboratories withstands high-power, high-density test
The AccumaxDirect premier vertical probe card from Wentworth Laboratories withstands "severe test parameters" in high-volume flip chip/C4 test. It was just approved for use with Verigy testers.
06/08/2011 — FormFactor next-gen DRAM tester contacts 850+ die in parallel
FormFactor (NASDAQ:FORM) introduced its new generation of the SmartMatrix 300mm full wafer contact probe cards for DRAM device test. The SmartMatrix 100XP probe card uses FORM's MicroSpring 3D MEMS contact technology and increases probe card parallelism to over 850 die, enabling single touchdown DRAM wafer test.
05/24/2011 — Agilent debuts benchtop SMU line to compete with expensive semiconductor analyzers
Agilent Technologies Inc. (NYSE:A) released the B2900A Series line of compact benchtop source/measure units (SMU) for semiconductor, component, and materials testing. The company claims that these SMUs offer capabilities competitive with semiconductor device analyzers.
05/23/2011 — Cascade Microtech's WinCalXE integrates SussCal for better on-wafer VNA measurements
Cascade Microtech Inc. (NASDAQ: CSCD) released WinCalXE version 4.5 calibration software, with improved model and process quality. WinCalXE 4.5 contains the features of WinCalXE and SussCal, and operates with all manual and semi-automatic Cascade Microtech and former SUSS MicroTec probe stations.
05/12/2011 — Rudolph's 3D package inspection system meets TSV, RDL, bump inspection needs
Rudolph Technologies (NASDAQ: RTEC) released the Wafer Scanner 3880 to inspect micro and standard bumps, through silicon via (TSV) post-via-fill copper protrusions (nails) and re-distribution layers (RDL) used in 3D IC packaging.
05/01/2011 — Configurable Kelvin contacting for today's advanced packages
In the precision analog marketplace Kelvin testing is becoming increasingly important to adequately test today's advanced packages. Jeff Sherry, Johnstech International, Minneapolis, MN USA
05/06/2011 — Multitest adds extended temp control to MT9510 test handler
Multitest, a designer and manufacturer of final test handlers, contactors and load boards, now provides extended temperature control with its extended temperature calibration (XTX) on the MT9510 test handler.
05/06/2011 — CSCD WLCSP HVM test probe card retains pin, scales from x1 to x8
Cascade Microtech (CSCD) launched a WLCSP probe card series that retains pin position, scales from x1 to x8 on a per-die basis, and can be configured for individual die testing. The Viper series will be used for high-volume test to qualify known good die (KGD).
08/24/2012 — Amkor, Carsem patent dispute over wafer-level packaging continues
The U.S. Court of Appeals for the Federal Circuit issued a favorable ruling in Amkor's appeal in its patent infringement case against Carsem and affliates before the U.S. ITC, Amkor reports.
08/24/2012 — Help define semiconductor packaging equipment requirements
iNEMI is starting a new convergence project on semiconductor packaging equipment requirements, and is seeking input from the industry.
08/21/2012 — Tessera receives initial Amkor payment in court award
Tessera received an initial payment of approximately $20 million from semiconductor packaging company Amkor, related to the interim award issued by the International Court of Arbitration of the International Chamber of Commerce (ICC).
08/20/2012 — Assembleon adds wafer handling to its flip-chip bonder
08/17/2012 — Wafer-level packaging start-up Deca Technologies appoints leader for Philippines
Deca Technologies, wafer-level packaging (WLP) services to the semiconductor industry, added Iain Meikle as VP of operations and managing director in the Philippines.
08/16/2012 — See 3mil wire bonding at IMAPS with Hesse & Knipps
Hesse & Knipps Inc. will demo a new 3mil wire bonding capability on its BJ935 automatic heavy wire bonder for back-end semiconductor packaging at IMAPS in San Diego.
08/16/2012 — Tessera changes CFO, Neely brings high-tech experience
Tessera appointed Rick Neely, Jr. as EVP and CFO, responsible for the company
08/15/2012 — Hybrid Memory Cube interface specification draft includes protocol, short-reach PHY interconnection
The Hybrid Memory Cube Consortium released the initial draft of the Hybrid Memory Cube (HMC) interface specification, with the final version planned for end of 2012.
08/15/2012 — Kulicke & Soffa drives semiconductor packaging tool quality with new CQO
Kulicke & Soffa Industries, Inc. (K&S, NASDAQ:KLIC) appointed Irene Lee to the role of chief quality officer. Lee will oversee quality assurance functions across Kulicke & Soffa
08/14/2012 — Fabless Monolithic Power Systems implements yieldWerx test and yield management
Monolithic Power Systems (MPS) implemented yieldWerx Semiconductor Test and Yield Management tools. MPS required a robust and centralized system for effective storage, analysis, and sharing of testing and product data received from multiple foundries, assembly, and testing facilities in the US and Asia.
08/09/2012 — ASE tests NCKU lower-cost packaging solder as better than SAC
Researchers at National Cheng Kung University (NCKU) in southern Taiwan developed a tin/zinc/silver/aluminum/gallium solder alloy for semiconductor packaging, which was tested by ASE.
08/09/2012 — Flooding in the Philippines threatens microelectronics facilities
Heavy monsoons moving through the Philippines are causing floods in and around Manila, the capital. The Philippines is a small but growing area for microelectronics manufacturing and packaging facilities.
08/08/2012 — Multitest test handler adds 2D code reader option for traceability
Multitest, semiconductor test equipment supplier, added a 2D code reader option to its MT2168 pick-and-place test handler, for package test customers that require 100% device traceability and lot integrity.
08/08/2012 — Henkel underfill reduces warpage for thinner flip chip packages
Henkel Electronic Materials developed a new underfill system designed to reduce flip chip package stress by controlling die and substrate warpage, LOCTITE ECCOBOND UF 8840.
08/08/2012 — ASIC developers can now access multi-project wafer runs at Tektronix Component Solutions
Tektronix Component Solutions, a custom microelectronics services provider, tapped supply chain aggregator MOSIS to help its customers develop complete, high-performance ASICs with lower early-stage ASIC development costs.
08/07/2012 — Agilent
Agilent debuted its compliance test application, Agilent N6462A DDR4, for systems using DDR4 memory.
08/03/2012 — Zuken improves FPGA/ASIC co-design with PCBs in CR-5000
Zuken updated its CR-5000 design software to version 14, with greater collaboration in FPGA development and targeting high-speed design. Many enhancements have also been included in CR-5000 Lightning, Zuken
08/02/2012 — Unisem appoints COO with semiconductor packaging experience
Unisem named Lee Hoong Leong as group COO, replacing Ang Chye Hock, who has retired. Lee brings experience from UTAC, STATS ChipPAC, TI, and National Semiconductor.
08/01/2012 — PKE halts Nelco circuit materials ops in Zhuhai, China: Will serve Asia from Singapore
Park Electrochemical plans to cease operations at its Nelco Technology (Zhuhai FTZ) Ltd. facility in Zhuhai, China. Nelco products include microwave and RF component substrates, printed circuit materials, and advanced substrates such as BT.
08/01/2012 — Flip Chip International names leader for Asia
FlipChip International (FCI), wafer-level packaging and flip chip bumping provider, named Weng Kay Lui as Asian sales director, overseeing sales for, among other areas, FCI's recently expanded FlipChip Millennium (Shanghai).
07/31/2012 — Mesuro secures funding to expand semiconductor test offering
Mesuro, semiconductor testing and services provider, raised
07/31/2012 — Cascade Microtech modular wafer probe system offers 6 measurement packages
Cascade Microtech introduced the modular MPS150 manual wafer probe station with six application-specific test packages for RF, mmW, and I-V/C-V measurement; failure analysis; and high-power device characterization.
07/30/2012 — Henkel Electronic Materials pre-cuts die attach film for 150mm, 200mm wafers
Henkel Electronic Materials added LOCTITE ABLESTIK CDF 200P to its conductive die attach film offering. The pre-cut film is available in 150mm and 200mm diameter sizes for easy wafer-form matching. The film is both a dicing tape and die attach tape.
07/27/2012 — Nanya implements 3D IC TSV technology for DDR3, future DDR4 devices
Dr. Phil Garrou, contributing editor, shares Nanya Technology
07/27/2012 — Cascade Microtech touts wafer-level test innovators at inaugural Innovation Awards
Cascade Microtech Inc. (NASDAQ:CSCD), supplier of wafer-level measurement instruments for ICs, held its first Innovation Awards Ceremony to honor inventors, authors and other innovators at the company.
07/26/2012 — ASM Pacific Technology delivers 100 x 300mm leadframe packaging set up
ASM Pacific Technology Limited noted in its H1 2012 results a record level of orders for leadframes in Q2. It also delivered what it calls the largest leadframe packaging set up to date.
07/25/2012 — 3D TSV Summit planned for European semiconductor industry
SEMI Europe will host a new event, the European 3D TSV Summit, January 22-23, 2013 in Grenoble, France. This inaugural meeting will revolve around the theme: "On the Road towards TSV Manufacturing," denoting how device designers and manufacturers are crossing from 2D packaging to 3D for more functionality in a smaller form factor.
07/25/2012 — STATS ChipPAC adds director with experience from Intel to Zarlink
STATS ChipPAC appointed Gary Tanner as a member to its Board of Directors. Tanner brings experience from Zarlink Semiconductor, Intel, Texas Instruments, and other semiconductor companies.
07/24/2012 — New MEMS, 3D IC packaging working group chairs at GSA
Global Semiconductor Alliance (GSA) recently named Jay Esfandyari, STMicroelectronics, as its MEMS Working Group chairman and Ken Potts, Cadence Design Systems, as the 3D IC Working Group chairman.
07/19/2012 — 3D TSV packages outgrow semiconductor industry by 10X
3D TSV chips will represent 9% of the total semiconductors value in 2017, according to Yole D
07/18/2012 — Kyocera room-temp epoxy molding compound competes with frozen semiconductor package encapsulants
Kyocera Industrial Ceramics Corporation, Chemical Sales Division introduced the environmentally friendly XKE-G5633 Epoxy Molding Compound (EMC) for BGA and LGA package encapsulation.
07/18/2012 — STATS ChipPAC rewards top suppliers of 2011
STATS ChipPAC presented its annual Supplier Awards to its top supplier partners for their excellent performance and outstanding support in 2011. Supplies are scored on technology, quality, delivery, responsiveness, service, and cost competiveness criteria.
07/17/2012 — Semiconductor test terminology guide aims to clarify docking and handling ops
SEMI's Collaborative Alliance for Semiconductor Test released a Docking and Mounting Generic Terminology Guideline document that can be used to improve the
07/17/2012 — Ziptronix wafer bonding technology adopted for high-volume cellphone component
Ziptronix Inc., which develops direct bonding technology for advanced semiconductor applications, has licensed its technology for a high-volume cellular handset application.
07/16/2012 — Sonoscan software enables acoustic imaging of 3D IC and die stacks
Sonoscan introduced a simulator software, SonoSimulator, that enables stacked die makers to check nondestructively for delaminations between layers. SonoSimulator software is now a standard feature on the Gen6 C-SAM acoustic microscope.
07/16/2012 — Notes from SEMICON West: Detecting solder joint fractures
Jennifer Wrigley and Robert Bellinger, Olympus, share insights on SEMICON West
07/13/2012 — Nordson MARCH plasma treatment system handles sensitive semiconductor packaging substrates
Nordson MARCH uncrated the FasTRAK Plasma System at SEMICON West. The automated, high-throughput vacuum plasma treatment system processes leadframe strips, laminate substrates, and other strip-type microelectronic components.
07/13/2012 — 2012 ITRS update: Back-end packaging and MEMS
At SEMICON West, the working groups of the International Technology Roadmap for Semiconductors (ITRS) outlined 2012 updates to the roadmap. Check out the back-end process info here.
08/11/2010 — SemiProbe patent for modular test system approved
SemiProbe has developed proprietary technologies awarded a patent by the United States Patent and Trademark Office. The Probe System for Life allows the company and users to configure test and inspection systems that meet unique requirements usually served by custom products.
08/05/2010 — Docking and Mounting Interface Workgroup releases main goals
The group will work on standard terminology and reference points for the mechanical interfaces of probers, handlers, testers, dockings, contactors and load boards. All companies that use or supply test equipment are invited to actively contribute.
01/26/2010 — Viscom introduces measurement tools for wire bond inspection
Wire bond inspection system maker Viscom introduced software tools for its very high resolution (VHR) camera module, which has the ability to provide exact measurements of balls and wedges. With this technology, 25-µm gold thin-wire wedge sizes can be measured with a standard deviation of 1 µm. In addition to inspecting qualitative characteristics of wire bonds, balls and wedges statistical evaluation and trend analysis of critical geometric dimensions can also be performed in the production process.
07/21/2010 — Multitest intros contactors for ICs with differential signals
Multitest designed differential contactors that are customized for each semiconductor test application. The selection of the contactor materials and probes are optimized for the desired impedance.
07/14/2010 — Listen to the podcast: Back-end test moves to more flexible model
Mark Allison, VP, Strategic Marketing, Verigy Ltd., points out that the economic downturn helped promote the outsourced semiconductor assembly and test (OSAT) model, which pushes test platforms into more configurable models.
07/13/2010 — MicroProbe debuts MEMS-based, multi-DUT, ultra-fine-pitch probe card for IC wafer test
MicroProbe Inc., supplier of wafer test technology to the global semiconductor industry, released the MEMS-based Mx-FinePitch (Mx-FP) probe card. The test card series targets ultra-fine-pitch testing of leading-edge SoC and logic devices found in applications like digital cameras, set-top boxes and digital TVs.
07/07/2010 — Multitest expands spare parts center for pogo pin test contactors
Multitest expanded the portfolio of its Singapore spare parts distribution center for pogo pin-based test contactors. With this step, all major spare parts for semiconductor package test handlers and contactors are now available for fast delivery to Asian package test sites.
09/29/2010 — Probe cards for combo wireless package test get boost from Cascade Microtech S-Technology
Cascade Microtech (NASDAQ: CSCD), supplier of production probe cards with signal integrity for multi-site die testing, released S-Technology, which provides a unique mechanical architecture for Pyramid probe cards to consistently deliver evenly distributed contact force for solder bump technologies in die tests.
09/27/2010 — Picotest Signal Injectors improve regulator, power supply test accuracy
Picotest released a new family of Signal Injectors, or adapters, to improve voltage regulator, LDO, and power supply testing accuracy. Increased bandwidth and higher resolution measurements are enabled for PSRR, stability, crosstalk, reverse transfer, input impedance, Bode plots, and crosstalk tests along with non-invasive ICT for load transients, stability and output impedance.
09/07/2010 — Next-gen bond tester software launch from Nordson DAGE
Nordson DAGE, a subsidiary of Nordson Corporation (NASDAQ: NDSN) and provider of bond testing technology, introduced Paragon intelligent bond testing software for semiconductor packaging.
09/01/2010 — GaAs test services debut from WIN Semiconductors, Presto Engineering
Users of WIN's GaAs foundry services can engage in wafer-level and package test in Silicon Valley, CA, and Grenoble, France.
11/29/2010 — GE-intros-CT-system-for-3D-metrology-and-analysis
The phoenix nanotom m, from GE´s Inspection Technologies business, has been developed for high resolution and high precision X-ray computed tomography (CT) in non-destructive 3D analysis and 3D metrology.
11/04/2010 — LTX-Credence-adds-low-cost-analog-tester-ASLx
LTX-Credence (LTXC) introduced the ASLx, a new test system extending the capabilities of the ASL low-cost analog and mixed-signal test platform. ASLx provides 4x the analog and digital pin count and 5x the power capability of the ASL1000.
12/01/2010 — MicroProbe direct-dock extended to ADvantest T2000 SoC test
MicroProbe, wafer test technology supplier, is extending its direct-dock offering to support Advantest's T2000 SoC test platform. The T2000 platform-compatible option enables test coverage at wafer sort. More than 100 direct-dock probe cards are already in the field.
12/01/2010 — Focus on 3D TEST at IEEE Workshop
The test community is embracing 3D ICs, as evidenced by presentations at the first IEEE International Workshop on Testing 3D stacked ICs that addressed a range of test challenges and solutions, reports Dr. Phil Garrou.
02/26/2010 — Burn-in and Test Socket (BiTS) Workshop Preview
The Burn-in & Test Socket (BiTS) Workshop will take place March 7–10, 2010 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ. More than 30 papers and posters will be presented; participants include end users and suppliers of sockets, boards, burn-in systems, handlers, and packages; and other related equipment, materials, and services. The TechTalk session on PCB design, fabrication and assembly is booked full, as is the tutorial on RF socket characterization by Gert Hohenwarter, Ph.D. of Gatewave Northern Inc. Here are some of the show highlights.
07/13/2012 — Roadmapping More than Moore: When the application matters
At the ITRS 2012 update, back-end technologies session, at SEMICON West, roadmapping for More than Moore was addressed as both a philosophical and technical matter.
07/11/2012 — EVG's wafer bonder passes SEMATECH/ISMI 3D integration tool assessment
SEMATECH qualified EVG's GEMINI automated wafer bonding system through its Equipment Maturity Assessment implemented within SEMATECH's 3D Interconnect program and ISMI's EMA team.
07/11/2012 — MicroProbe enhances wafer probe card reliability with CCC improvement
MicroProbe introduced current-carrying capability of >1A/probe in 90
07/10/2012 — Contemporary semiconductor packaging experts open up on cost
The bulk of packaging falls under the
07/10/2012 — ULIS invests EUR20M in advanced IR imaging sensor fab and packaging
ULIS invested EUR20 million in a new state-of-the-art facility to meet increasing market demands for IR technology, with a move to 200mm wafers and pixel/wafer-level packaging techniques.
07/10/2012 — Ultratech named advanced packaging tool supplier of choice by top-tier packaging houses
Ultratech formed 'exclusive supplier' and 'preferred tool vendor' agreements with several top-tier advanced packaging companies around the world.
07/10/2012 — STATS ChipPAC ramps advanced flip chips to HVM, adds TCB processing capability
STATS ChipPAC brought its fcCuBE advanced flip chip semiconductor packaging technology with copper column bumps, bond-on-lead interconnection, and enhanced assembly processes into high-volume manufacturing for multiple customers.
07/09/2012 — Multitest releases 3D packaging test combination for sensitive bare die
Multitest installed the first Multitest Plug & Yield integrated hardware set up for testing 3D semiconductor packages at a customer. The Plug & Yield design enables highly parallel electrical in-process test of stacked dies during the assembly process of 3D packages.
07/09/2012 — 2.5/3D interposers fabbed at 30% lower COO with USHIO
USHIO Inc. is introducing the large-field stepper lithography tool
07/05/2012 — Xilinx boosts silicon and electronics engineering in Ireland
Xilinx will invest $50 million to expand its electronics engineering operations, located at the company
07/04/2012 — EVG temporary wafer bonding platform doubles throughput for 3D packaging
EVG introduced the EVG 850TB/DB automated temporary bonding and debonding system built on the company's new XT Frame platform, which has been optimized to support thin-wafer processing for high-volume 3D IC and TSV manufacturing.
07/03/2012 — MLCC manufacturers order ESI high-throughput test system
Electro Scientific Industries Inc. (ESI, NASDAQ:ESIO) received multiple-unit orders for its model 3510 test system from leading Japanese and Korean MLCC manufacturers.
07/02/2012 — Epson launches high-throughput IC test handler for volume test
Seiko Epson launched the NX1032XS pick-and-place IC test handler, boasting high throughput for transferring, inspecting, and sorting semiconductors.
07/02/2012 — Tessera: Adding Vista Point Technologies, losing Powertech Technology?
Tessera received notice from Powertech Technology Inc. (PTI) that it will terminate its license agreement with the semiconductor packaging and optics technology company. Tessera also completed phase 1 of its acquisition of camera module technologies from Flextronics.
06/29/2012 — Unisem focuses new business model on Tier-1 customers and high-value technologies
UNISEM relaunched its business model with the name
06/29/2012 — Ultratech acquires IBM patents for semiconductor packaging processes
Ultratech acquired IBM patents on semiconductor packaging technologies, including C4 bumping, ball grid array (BGA) methods, lead-free solders, and 3D packaging.
06/26/2012 — 3D and 2.5D Integration: A Status Report preview with TechSearch International
Solid State Technology is hosting 3D and 2.5D Integration: A Status Report, sponsored by EVG and ALLVIA, and is free for all attendees. This preview shares a sneak peek at
06/26/2012 — Xilinx speaker joins 3D packaging webcast roster
Solid State Technology is hosting a free webcast, 3D and 2.5D Integration: A Status Report. A fourth presenter has just been announced, Brent Przybus, Senior Director, Product Line Marketing, Xilinx Inc.
06/25/2012 — Dow Corning teams with SUSS on TSV bonding process
Dow Corning will collaborate with SUSS MicroTec on a temporary bonding process (materials and equipment) for through-silicon vias (TSV) in high-volume advanced semiconductor packaging.
06/25/2012 — New speaker added for 3D and 2.5D Integration webcast
Solid State Technology will present 3D and 2.5D Integration: A Status Report on June 27, free for all attendees. William Chen, ASE, will join speakers David McCann, GLOBALFOUNDRIES and E. Jan Vardaman, TechSearch International.
06/22/2012 — SEMICON West 2012 exhibits preview: Semiconductor packaging products
SEMICON West is taking place July 10-12 in San Francisco, CA. Following are new products for semiconductor packaging and test that will be at the show, from wafer bonders to LED die attach materials.
06/20/2012 — Fast-curing conductive chip-attach adhesive meets RFID packaging needs
DELO introduced the DELOMONOPOX AD268 epoxy resin to meet the low-cost, reliable-attach needs of RFID device makers. The anisotropic, electrically conductive adhesive provides fast cure at chip attach, and is designed for flip-chip RFID packaging, as well as other packaging applications.
06/20/2012 — Wafer-level RF testing bottleneck resolved with Advantest, Hua Hong NEC methodology
Pure-play foundry Shanghai Hua Hong NEC and test equipment supplier Advantest co-developed a wafer-level, multi-site parallel test scheme for RFID semiconductor devices that meets industry-standard ISO 14443 guidelines.
06/19/2012 — Signetics bolsters mobile chip packaging capacity with large tool buy
Signetics Corporation approved plans to purchase additional semiconductor assembly process equipment -- wafer grinders, wafer saws, die attach tools, and wire bonders -- to grow its packaging capacity for mobile chips.
06/18/2012 — STATS ChipPAC ships 1 billionth package using copper wire bonds
STATS ChipPAC Ltd. (SGX-ST: STATSChP) marked the milestone of 1 billion copper wirebonded semiconductor units shipped.
06/18/2012 — DARPA seeks microfluidic thermal management for 3D ICs
06/15/2012 — ECTC
Attendance was high at this year's Electronic Component Technology Conference (ECTC) in San Diego. Sandra Winkler is senior industry analyst at New Venture Research and IEEE/CPMT Luncheon Program Chair, shares the key trends in ECTC's sessions, like WLP, 2.5D, LED packaging, and more.
06/15/2012 — Anritsu plans on-wafer high-frequency test demo at IMS
Anritsu will demonstrate its broadband Vector Network Analyzer (VNA), which conducts single sweeps from 70kHz to 140GHz during wafer probe test, at IMS, showcasing a new 0.8mm connector.
06/13/2012 — StratEdge improves thermal management in power semiconductors with LL packages
The LL leaded laminate copper-moly-copper base packages dissipates heat from high-power compound semiconductor devices, such as gallium nitride, gallium arsenide, and silicon carbide chips.
06/12/2012 — USI process produces copper-filled vias on ceramic substrates
UltraSource Inc. announced CopperVia, a process that fills vias with pure copper to yield low-cost, high-conductivity, reliable electrical and thermal interconnects in ceramic thin film circuit substrates.
06/12/2012 — ESCATEC offers package-on-package stacking for low-volume designs
ESCATEC added package-on-package (PoP) capability at its Heerbrugg, Switzerland, facility, adding a dipping unit for ball grid array (BGA) packages on its Siplace assembly line.
06/12/2012 — Rockwell Automation helps scale Terepac circuits miniaturization method
Terepac Corp. will produce high volumes of its proprietary micro circuits for Rockwell Automation, supporting the "Internet of Things" with RFID tags. Rockwell Automation will support the infrastructure that Terepac uses, enabling it to miniaturize significantly more circuits than its current capability.
06/12/2012 — Kulicke & Soffa (KLIC) appoints treasurer with Asia experience
Semiconductor assembly tool maker Kulicke & Soffa (KLIC) named Pui Yee Lee as VP and corporate treasurer, reporting to SVP and CFO Jonathan Chou.
06/11/2012 — ams offers foundry customers KGD with enhanced IC test
The Full Service Foundry business unit of ams extended its dedicated test solutions for foundry customers, offering known good die (KGD), with customers' complex analog/mixed-signal ICs 100% electrically tested according to their own test specification.
06/08/2012 — Advantest tackles 3D package test with new product line
Advantest is developing a line of fully automated and integrated test and handling solutions for TSV-based 2.5D and 3D packages. The concept model test cell, DIMENSION, integrates a high parallel test cluster along with singulated die and 3D die stack automated handling capabilities.
06/08/2012 — Multitest test loader/unloader offered in various configurations
Multitest has made its InCarrier Loader/Unloader available in a variety of configurations, e.g. for loading from tube, bowl, tray and for unloading into tube, bulk or metal mag in any combination.
06/08/2012 — UMC developing TSV tech for BSI CMOS image sensors with A*STAR
06/07/2012 — Conference report: IITC closes with talks from EUV to TSV
Day 3 of the 15th IITC (International Interconnect Technology Conference) opened in San Jose, CA under clear sunny skies and a pleasant breeze. The herd thinned a bit, down to ~150 hearty souls from the original 230 the prior two days.
05/19/2010 — Multitest MT9928 bowl feed module meets small package test handling requirements
The Multitest next-generation MT9928 bowl feed module, which passed the strict QA and production approval requirements of an international IDM, is a gravity feed handler with a variety of loading and unloading options. With a throughput of up to 14,500 uph, the bowl feed loading module is the loading option of choice for small package sizes during semiconductor test.
03/24/2010 — Maxtek adds component test and COTS screening for military, space, commercial aerospace markets
Through the Component Test organization of Sypris Test & Measurement, Maxtek now provides component testing, including electrical and package integrity testing, COTS up-screening, qualification, and characterization. These complement Maxtek's full-custom ASIC design, package development, assembly, and test services.
10/09/2009 — Rudolph scores backend inspection biz from ASE
Taiwanese subcon ASE has ordered "multiple" tools for backend inspection from Rudolph Technologies, illustrating a trend to incorporate real-time process control into advanced backend fabrication processes.
10/19/2010 — CT X-ray tube cooling system released by X-RAY WorX
X-RAY WorX presented its new concepts for the cooling of high resolution microfocus X-ray tubes. The company offers a new, modular cooling concept with an optimized internal cooling of the target inside the tube head.
10/11/2010 — Probe supplier Cascade Microtech targets lower costs and increased access
Cascade Microtech Inc. (NASDAQ: CSCD) announced new programs to drive down ownership costs and provide customers with increased access to experts in probe technology. The new programs involve direct sales channels and a repair program, among other efforts.
10/05/2010 — IC sockets business report released
Global Industry Analysts released a report analyzes the global market for IC sockets in US$ Million by dual in-line memory module sockets, production sockets, test/burn-in sockets, and others. Regional IC sockets markets are analyzed as a consolidated whole with no granular level breakup offered by product group/segment. Annual estimates and forecasts are provided for the period 2006 through 2015.
06/25/2010 — Aries Adds CSP Optical FA Test Sockets for EMMI or Optical Sensor Applications
Aries Electronics, manufacturer of interconnection products, now offers a CSP test socket with a window that optically exposes 100% of the top of the device under test (DUT) for failure analysis (FA) testing for emission microscopy (EMMI) or optical sensor applications.
05/14/2012 — ASMPT integrates European business with SIPLACE organization
Asia-based ASM Pacific Technology (ASMPT) Group, a supplier of semiconductor assembly, bonding, and packaging equipment, will integrate with the SIPLACE organization in Europe.
05/07/2012 — FormFactor knocked off semiconductor probe card podium
Sales of semiconductor probe cards grew 17% in 2011, reaching $1.17 billion, VLSIresearch reports. While short of a record, 2011 was one of the probe card sector
05/04/2012 — SATS provider Carsem begins LED packaging and test
Semiconductor packaging and test services provider Carsem will assemble and test LED packages, partnering with a key customer and applying semiconductor packaging technologies for better LEDs.
05/03/2012 — GaN Systems collaborates with APEI to optimize power electronics packaging
GaN Systems and Arkansas Power Electronics International will co-develop a high-temperature, high-performance package optimized for gallium nitride (GaN) transistors and diodes.
05/03/2012 — Nitto Denko transfers semiconductor encapsulant business to Hitachi Chemical
Nitto Denko Corporation approved a transfer of its semiconductor encapsulating materials business to Hitachi Chemical Co. Ltd.
05/03/2012 — High-power semiconductor test contactor hits 500 Amperes
Multitest introduced the ecoAmp Kelvin contactor for high-power device test of 500+ Amperes. It meets the needs of high voltage/high current test with high thermal and mechanical stability.
05/01/2012 — Top OSATS raise 2012 capex with semiconductor test focus
The top three outsourced semiconductor assembly and test services (OSATS) providers raised 2012 capex during their earnings reports, from initial plans announced in January, report analysts at Citi.
04/26/2012 — Interposer consortium ready to expand at Georgia Tech PRC
After pioneering low-cost wafer- and panel-based glass and silicon interposers in Phase 1 of its SiGI consortium, Georgia Tech Packaging Research Center is beginning Phase 2 in June.
04/26/2012 — GLOBALFOUNDRIES installs TSV fab tools for 20nm stacked die
At its Fab 8, GLOBALFOUNDRIES is installing a special set of production tools to create TSV in 20nm wafers. 3D die stacking of leading-edge chips will enable mobile and consumer electronics.
04/25/2012 — One-piece jetting cartridge for semiconductor packaging inspired by ink jet designs
Nordson ASYMTEK uncrated the NexJet System for jetting, with a newly designed jet cartridge and new software control for semiconductor packaging applications.
04/24/2012 — NXP increases pad pitch while shrinking package form factor
NXP Semiconductors released the new SOT1226 "Diamond" package using a
04/24/2012 — EoPlex builds packaging facility in Malaysia
EoPlex Limited, a subsidiary of ASTI Holdings Limited, Singapore, will open a new factory for its xLC semiconductor package technology in Q2 2012, in Malaysia.
04/23/2012 — Aeroflex brings test line-up to Qualcomm customers
Aeroflex will supply manufacturing test technology for radio frequency (RF) devices at Qualcomm customers, under a new licensing agreement with Qualcomm.
04/23/2012 — STATS ChipPAC adds Pasquale Pistorio, STMicroelectronics leader, to Board
Semiconductor packaging service provider STATS ChipPAC Ltd. (SGX-ST:STATSChP) appointed Pasquale Pistorio as a member of the Board of Directors, effective immediately.
04/19/2012 — Mold packaging meets metal TSV for 5-10x density of conventional substrates
Silex Microsystems brought its Met-Via full-wafer-thickness TSV technology into Chip Architectures by Joint Associated Labs for European Diagnostics, where it is being used to create cost-effective molded chip-level packaging with through metal vias.
04/19/2012 — Ultratech brings former member back to Board
Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech
04/16/2012 — ChipMOS expands semiconductor assembly and test services with new building in Taiwan
ChipMOS TECHNOLOGIES INC. (ChipMOS Taiwan), purchased a 393,173sq.ft. building adjacent to its existing facility in Southern Taiwan Science Park.
04/16/2012 — Burn-in and test system offers device-by-device temperature control
Micro Control Company uncrated the HPB-5C High-Power Burn-In System, with variable airflow control for active thermal control of each device under test. The HPB-5C provides individual temperature control to each device under test.
04/16/2012 — Advanced semiconductor packaging start-up Deca could take over SPWR fab
WLCSP start-up Deca Technologies might take over SunPower Corp.'s Fab 1, when the solar photovoltaics supplier consolidates its Philippine manufacturing operations to Fab 2 this quarter.
04/12/2012 — DARPA funds GaN-on-diamond device development at Raytheon
DARPA gave Raytheon an 18-month, $1.8 million contract to develop next-generation GaN devices on diamond substrates, named Thermally Enhanced Gallium Nitride (TEGaN). The diamond packaging boosts GaN power handling capability by at least 3x.
04/12/2012 — Die attach adhesive suits temperature-sensitive electronics
DELO introduced DELOMONOPOX die attach adhesives, promising strong mechanical/environmental protection, low-temperature cure, and compatibility with various substrates.
04/11/2012 — Georgia Tech targets thin 3D packaging with new consortium
Georgia Tech's Packaging Research Center proposes a new consortium on 3D semiconductor packaging called 3D ThinPack for ultra-miniaturized 3D heterogeneous, RF, digital and power modules in partnership with global companies.
04/11/2012 — Invensas face-down die packaging replaces SODIMM
Invensas Corporation, a wholly owned subsidiary of Tessera, unveiled a DIMM-IN-A-PACKAGE multi-die face-down (xFD) packaging architecture for memory semiconductors in low-profile devices.
04/11/2012 — Agilent nanomechanical materials tester makes 100 indents in 100 seconds
Agilent launched Express Test for ultra-fast, high-precision nanomechanical testing on thin films, low-k materials, composites, and more. It allows 100 indents on 100 surface sites in 100 seconds.
04/10/2012 — Endicott Interconnect names David Van Rossum new CFO
Endicott Interconnect Technologies has appointed David W. Van Rossum to the position of Chief Financial Officer, effective immediately.
04/10/2012 — ALD enables 3D capacitors for CEA-Leti and IPDiA
CEA-Leti and passive component maker IPDiA developed an atomic layer deposition (ALD) process to apply medium-k dielectric layers on a metal-insulator-metal capacitor architecture, enabling 3D capacitors.
04/09/2012 — ONNN
ON Semiconductor (Nasdaq: ONNN) will develop a next-generation star tracker CMOS image sensor with the European Space Agency. The sensor will be used in star trackers, sun sensors and other scientific applications.
04/09/2012 — Rogers restructures to better serve power electronics, PCB, foam customers
Rogers Corporation (NYSE: ROG) shared an update on its restructuring and streamlining initiatives, which are expected to save about $13 million (annualized savings) by Q4.
04/05/2012 — MOSAID multi-chip package stacks 16 NAND Flash die on 1 channel
MOSAID Technologies Inc. is sampling a 16-die stack NAND Flash device operating on a single high-performance channel, the 5126Gb HLNAND.
04/04/2012 — Georgia Tech increases interposer development work
Georgia Tech's Packaging Research Center is adding ultra-fine-pitch interconnect, thermal reliability, and more to its work on silicon and glass interposers for 2.5D semiconductor packaging.
04/04/2012 — Henkel surface mount adhesive validated for non-contact dispensing
04/04/2012 — Mereco silver adhesive suits chip and leadframe bonding in heat-sensitive components
Mereco Technologies' METADUCT 1202 is an electrically conductive silver epoxy adhesive for lead attachment cold soldering, chip bonding, and leadframe bonding applications.
04/03/2012 — Ferro expands LTCC offering with cost-sensitive materials set
Ferro Electronic Materials expanded its LTCC portfolio, adding a line of cost-effective matched materials. The L8 LTCC system claims better performance over a greater range of frequencies and easier manufacturability.
04/03/2012 — Terepac builds miniaturized embedded circuits with wireless connectivity
Terepac Corporation, developer of tiny digital electronics, has launched the TereTag miniaturized circuit design that is embedded in items to enable the "Internet of Things."
04/02/2012 — Bruker bolsters CT imaging line with SkyScan buy
Bruker Corporation acquired all of the shares of SkyScan NV, a scientific instruments company serving materials science and life sciences/pre-clinical imaging needs.
03/30/2012 — Yamaichi enables embedded module test and programming with new test adapter
Yamaichi developed a test adapter with the European Design Centre, suitable for test and programming of embedded modules such as Qseven or MXM.
03/30/2012 — Amkor licenses 3D packaging tech to SHINKO
Amkor Technology Inc. granted SHINKO ELECTRIC INDUSTRIES CO., LTD. (Tokyo:6967) a non-exclusive license to its proprietary Through Mold Via (TMV) semiconductor packaging technology.
03/30/2012 — SUSS buys Tamarack for lithography, laser structuring lines
SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.
03/27/2012 — Cypress Semiconductor transfers back-end packaging lines to China
Cypress Semiconductor transferred 7 back-end semiconductor package assembly lines from its Philippines facility to Chinese packaging subcontractor Jiangsu Changjiang Electronics Technology Co.
03/27/2012 — TI adds bare die to small-quantity semiconductor packaging options
Texas Instruments Incorporated (TI, TXN) now offers bare die in quantities as low as 10 pieces for initial prototyping, and larger quantities (full waffle trays) for production volumes.
03/26/2012 — OSAT provider orders wafer inspection tools from Camtek
Camtek Ltd. sold $3.5 million of Falcon inspection tools to a global outsourced semiconductor assembly and test (OSAT) provider, for various applications in the backend assembly process.
03/26/2012 — Synopsys launches 3D packaging EDA line-up
Synopsys is combining several products into a 3D-IC initiative for semiconductor designers moving to stacked-die silicon systems in 3D packaging. The 3D-IC initiative will bring in leading IC design and manufacturing companies to work with Synopsys on a comprehensive EDA solution.
03/23/2012 — Imec ultrathin chip packaging yields improved
Research organization imec introduces important changes to its ultrathin chip packaging (UTCP) technology, increasing yields 15-20%.
03/23/2012 — Keithley power semiconductor tester uses 3000V source
Keithley Instruments introduced the Model 2657A High Power System SourceMeter instrument, adding high voltage test to its line of high-speed, precision source measurement units for power semiconductors.
04/03/2012 — Semiconductor makers spend record amount on materials for second straight year
The global semiconductor materials -- wafer fabrication and packaging materials -- market increased 7% in 2011 compared to 2010, with record revenues of $47.86 billion, said SEMI.
04/02/2012 — SEMICON West heralds 22nm, EUVL, 450mm, mobile electronics speakers
Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.
03/29/2012 — Semiconductor wafer fab utilization rates bucked expectations in late 2011
The Global Semiconductor Alliance (GSA) released its GSA Q1 Wafer Fabrication & Back-End Pricing Reports, tracking fab utilization rates, wafer and mask costs, and package pricing.
03/29/2012 — Field Report: Sensors in Design 2012
Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.
03/27/2012 — Glass-coated bonding wire targets copper, small diameter market
RED Micro Wire (RWM), a subsidiary of RED Equipment, announced a new high-quality copper wire featuring glass insulation for use in semiconductor wire bonding.
03/26/2012 — Applied Materials analyst day preview
Applied Materials will host its annual Analyst meeting this week (March 28). Barclays Capital shares its expectations for AMAT's update and the wafer fab equipment (WFE) outlook in general.
02/08/2012 — 2011 ITRS: DRAM, 3D Flash, MEMS, nano scaling steal the show
The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.
03/19/2012 — SUSS combines resist coat and develop platforms
SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.
03/19/2012 — CVD Equipment doubles manufacturing space with new NY facility
CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.
03/19/2012 — Silicon Genesis wafering tool designed for solar, LED, packaging sectors
SiGen developed its second-generation production system for fabricating thin-silicon solar wafers, as well as HB-LED, and 3D semiconductor packaging wafers. The system tailored for silicon, GaAs, germanium, SiC, GaN and sapphire materials.
03/15/2012 — Samsung, IBM and GlobalFoundries look to the future: A report from the Common Platform Technology Forum
Execs from Samsung, IBM, GlobalFoundries and ARM looked to the future at The Common Technology Platform Forum in Santa Clara. They focused on the innovation pipeline for 20nm and 14nm technology nodes, and the role that EUV, FinFETs, TSVs, CNTs and DSA will play.
03/13/2012 — Semiconductor manufacturing equipment sales rose 9% in 2011
Worldwide sales of semiconductor manufacturing equipment totaled $43.53 billion in 2011, representing a year-over-year increase of 9%, shows SEMI. North America surpassed Taiwan as the region with the highest amount of spending.
04/11/2012 — Conference report: MRS Spring 2012, Day 2
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the second day: OLED TFT displays, single transistor DRAMs, silicon photonic wires, CNTs, 3D optical interconnects, graphene for RF and sensing, transparent ZnO, epidermal electronic systems, stretchable electronics, ultra-low-k dielectrics, patterning of electroceramics, PRAM (an alternative to NRAM), and inkjet printing of superconducting films.
04/10/2012 — Attend joint sessions at VLSI Technology and Circuits
The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.
04/10/2012 — Semiconductor wafer fab equipment trends: Test
Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse looks at the growth areas for test.
01/24/2012 — CWS upgrades on-wafer accelerated reliability line for Agilent testers
Core Wafer Systems, subsidiary of Action Products International, upgraded its PDQ-WLR on-wafer accelerated reliability product line to version 7.0, designed specifically for Agilent Technologies' Parametric Testers.
02/13/2012 — European microelectronics fab database tracks major changes over past 5 years
Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.
02/09/2012 — Theta Delta's burn-in & long-term semiconductor testers gain Core Wafer Systems technologies
Theta Delta will incorporate Core Wafer Systems technologies into its burn-in test and long-term reliability test systems for semiconductors. Core Wafer Systems provides parallel measurement schema for semiconductor test.
01/13/2012 — Apple shares list of suppliers
For the first time, Apple Inc. has publicly published a list of over 150 companies that the electronics giant says represent 97% of its procurement expenditures for materials, manufacturing, and assembly of products worldwide.
01/09/2012 — Camtek launches TEM for advanced semiconductor makers
Camtek launched Xact200, a transmission electron microscope (TEM) sample preparation system for the semiconductor industry. Camtek calls the system an alternative to FIB analysis.
01/02/2012 — Will 22nm need a mid-node?
Art Zafiropoulo of Ultratech shares predictions for 22nm: that everyone will be using gate-last fabrication, that there may be a mid-node at 20nm, and that TSVs and 450mm wafers will play an important role at the new node.
01/03/2012 — 22nm node semiconductors: Technical forecasts
Solid State Technology asked top analysts and technologists to provide insights on the transition to 22nm semiconductor devices. Read through the whole 10-forecast series, or check out the individual articles as you have time to see perspectives on lithography, device architecture, and more.
01/27/2012 — Apple iPhone 4S steals smartphone show in Q4 2011; Samsung wins the year
While Apple's release of the iPhone 4S in Q4 2011 "unleashed tremendous pent-up demand" from consumers, Samsung used its broad range of smartphones to take the top spot, reports IHS.
01/26/2012 — BSE Group achieves milestones in semiconductor equipment financing biz
Test Advantage Capital Group, a business of BSE Group, surpassed $150M in its portfolio of semiconductor manufacturing equipment under management. Boston Semi Equipment's fab equipment leasing business also received a $100M annual commitment from its financial backer, Wafra Capital Partners.
04/26/2012 — SEMATECH highlights from VLSI-TSA
SEMATECH experts reported on innovative processes for advanced CMOS logic and memory device technologies and 3D TSV manufacturing at the International VLSI Technology, System and Applications Symposium (VLSI-TSA).
04/24/2012 — Toshiba builds semiconductor fab in Thailand to replace flooded fab
Toshiba Corporation (TOKYO: 6502) will rebuild its semiconductor manufacturing operations in Thailand by relocating Toshiba Semiconductor Thailand Co., Ltd. (TST) to a new manufacturing facility.
04/23/2012 — Metrology tool offers economical price point with high accuracy
Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.
04/19/2012 — Texas Instruments (TI, TXN) names top suppliers
Texas Instruments awarded 15 of its 12,000 suppliers with Supplier Excellence Awards for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality.
04/18/2012 — ASMC will focus on productivity and technology challenges
The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “Competing for R&D Dollars,” moderated by Solid State Technology Editor-in-Chief Pete Singer.
04/13/2012 — Intel awards 9 elite suppliers in 2011
Intel Corporation announced 9 winners of the company's Supplier Continuous Quality Improvement (SCQI) award for outstanding commitment to quality and performance excellence.
04/12/2012 — Conference Report: MRS Spring 2012, Day 3
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.
04/12/2012 — Economy, fabless relationships, 450mm and more on deck at The ConFab 2012
The ConFab 2012, an invitation-only global conference and business meeting on semiconductor manufacturing, June 3-6 in Las Vegas, selected speakers and sessions for 2012.
04/12/2012 — Intel’s top suppliers in 2011
Intel Corporation announced its 2011 Intel Preferred Quality Supplier (PQS) awards, selecting 19 of its thousands of suppliers. Two suppliers received Intel’s Achievement Award.
02/17/2012 — Shin-Etsu Chemical releases low-RI LED encapsulants
Shin-Etsu Chemical Co. Ltd.'s new KER-7000 Series silicone encapsulating materials offer a low (1.38) refractive index (RI) for HB-LED packaging with lower gas permeability and higher transparency.
02/17/2012 — Semiconductor industry expectations for 2012: Take the WWK survey
Wright Williams & Kelly, Inc. (WWK) opened its 2012 semiconductor industry survey on equipment and process timing. Only participants will receive the full results, free of charge.
05/07/2012 — Camtek ships semiconductor inspection tools to leading US IDM
A leading, US-based IDM ordered about $5 million of front- and back-end semiconductor automatic optical inspection (AOI) tools from Camtek Ltd.
05/03/2012 — David McCann of GLOBALFOUNDRIES to speak at The ConFab 2012
Solid State Technology is proud to announce that David McCann will speak at The ConFab 2012. David, the Senior Director for Packaging R&D at GLOBALFOUNDRIES in Malta, New York, will speak on the evolution toward silicon-based interconnect and packaging, which is having profound impact on how we think about technology development and the supply chain.
05/11/2012 — CMOS image sensor suppliers ramp up 300mm capacity
CMOS image sensors (CIS) are breaking sales records again, after several years without upward momentum, reports IC Insights. New portable systems and embedded imaging are lifting CIS to $6.3 billion in 2012 and new record sales each year through 2016.
03/02/2012 — Elpida begins reorganization in Tokyo court: Analysts weigh in
Elpida Memory Inc. (Tokyo: 6665) resolved to file a petition for the commencement of corporate reorganization proceedings, and filed the same with the Tokyo District Court. Akita Elpida Memory Inc. also saw the commencement of corporate reorganization proceedings
02/24/2012 — HB-LED grade aluminum nitride meets thermal needs of today's LEDs
In this series, CMC Laboratories describes a new LED-grade AlN and what it accomplishes as a ceramic substrate. The AlN offers better heat dissipation for LED packages than alumina, at a lower cost than previous formulations.
02/23/2012 — SEMICON China: Challenges and opportunities for semiconductors, emerging techs
SEMICON China takes place March 20-22 in Shanghai. Check out the special pavillions and events, and keynote speakers scheduled.
02/23/2012 — Present at coolingZONE LED 2012 in Berlin
coolingZONE LED, May 29-31 in Berlin, is soliciting technical presentations on LED energy consumption, LED packaging, heat and air-flow simulations of LED products, and related topics.
02/22/2012 — ISSCC round-up: 2.5D packaging for IVRs, smallest NAND flash chip, more
International Solid-State Circuits Conference (ISSCC) is going on now, gathering semiconductor design and device architecture presentations from research firms like imec to chip companies like IBM. Here are some highlighted presentations.
02/22/2012 — Chip substrate factory begins producing thermal-control substrates in Russia
MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.
02/21/2012 — IRPS set for April in Anaheim
The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 – April 19, 2012, in Anaheim, CA.
03/02/2012 — HB-LED grade aluminum nitride (AlN) sintering
Part 2 of this series covers furnace considerations for a new HB-LED-grade AlN, as well as furnace throughput. Jonathan Harris, CMC Laboratories, covers the role of the oxide sintering phase in AlN in defining the materials microstructure and thus determining key properties such as thermal conductivity and mechanical strength.
03/01/2012 — DuPont sells CMP JV interests to Air Products
Air Products will acquire all of DuPont's interest in DuPont Air Products NanoMaterials LLC (DA NanoMaterials), a 50-50 JV that the companies set up for the semiconductor and wafer polishing industries.
05/24/2012 — MEMS Symposium Report: Chasing 1 Trillion
The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.”
03/23/2012 — SEMICON Europa 2012 seeks presenters
SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.
03/22/2012 — DOW opens semiconductor/display R&D center in Seoul with OLED focus
The Dow Chemical Company (NYSE: DOW) inaugurated its Dow Seoul Technology Center, a global R&D center with focus on technological advances in display and semiconductor applications.
03/22/2012 — Apple A5X processor teardown: Bigger die, higher heat?
Apple’s ARM-based processors have created a point of hardware differentiation in applications processors. With the A5X, Apple is going with a much larger die at the 45nm node (shared across the 2 prior generations), shares Chipworks. It's also turned off the PoP track.
03/21/2012 — Taiwan allows higher Chinese investments in LCDs, semiconductors, fab equipment, more
Taiwan raised investment ceilings for Chinese investors in LCDs, semiconductors, IC assembly and test, microelectronics production equipment, and metal tool manufacturing.
03/21/2012 — Semiconductor capex to fall 11.6% in 2012, says Gartner
Worldwide semiconductor manufacturing equipment spending is projected to total $38.9 billion in 2012, an 11.6% decline from 2011 spending of $44 billion, according to Gartner Inc.
03/21/2012 — Fraunhofer delivers 300mm wafer processing to North America with Axus Technology
Fraunhofer IZM and Fraunhofer CNT will use CMP supplier Axus Technology exclusively to provide advanced 300mm wafer process development and foundry services to North American customers.
03/09/2012 — IBM drills optical vias in chip for 1Tbit/sec transmission
IBM scientists developed a prototype optical chipset, Holey Optochip, that can transfer 1Tbit per second as a parallel optical transceiver, using optical vias through a standard 90nm CMOS chip.
10/22/2012 — Semi equipment demand still sinking
In case anyone needed a reminder or a wake-up, new data from SEMI reiterates chip tool sales are slumping badly in the latter part of this year.
10/16/2012 — SEMI adds session, extends abstract deadline for China chip conference
SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.
10/16/2012 — GSA forms technology steering committee to guide working groups
The Global Semiconductor Alliance (GSA) says it has formed a Technology Steering Committee to help address key business and technology areas of interest to its members, and "encourage the advancement and adoption of leading technology and practices."
12/12/2012 — STMicro: 28nm FD-SOI is ready for manufacturing
STMicroelectronics is getting out of the JV chip business with Ericsson, but it's still full-steam ahead for its use of (FD-SOI) technology with its partners.
12/11/2012 — Process Watch: Cycle time’s paradoxical relationship to inspection
In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
12/11/2012 — IEDM: Nanoelectronics provide a path beyond CMOS
At the International Electron Devices Meeting in San Francisco, An Chen of GLOBALFOUNDRIES presented a survey of emerging nanoelectronic devices, which he divided into two categories: Charge-based and non-charge based.
12/11/2012 — IEDM keynote: It tastes like chicken
Attendees at this year’s International Electron Devices Meeting (IEDM) were delighted and perhaps somewhat horrified when the plenary speaker popped some electronics gear in his mouth and proclaimed, “It tastes like chicken!”
12/10/2012 — Sony and Toshiba fight declines with chip spending -- can it work?
Despite weak financial performances, sluggish global markets and strong regional competition, Japanese consumer electronics giants Sony and Toshiba are increasing their investments in new products to revitalize their businesses.
12/06/2012 — SEMI: Chip equipment slump extending into 2013, across-the-board rebound in 2014
Semiconductor equipment demand is persistently sluggish as the industry takes a break from a "multiyear expansion period" to digest recent investments and wrestle with a broader economic slowdown, acknowledges SEMI in its updated year-end forecast. But make no mistake: leading-edge technology investments are still happening, and growth will return in the typical cyclical pattern.
11/15/2012 — Advantest will introduce three tools at Semicon Japan
In prep for Semicon Japan in December, Advantest announces three new tools: 2 SEMs and a litho system.
11/12/2012 — ICPT 2012: Five themes summarizing CMP work and progress
This year's International Conference on Planarization/CMP Technology (ICPT) encompassed five themes describing use of CMP: new device structures, equipment and methods, Cu interconnects, consumables, and new CMP methods and processes.
11/28/2012 — Advanced non-etching adhesion promoters eliminate interposer layer
New NEAPs are independent of the adhesion performance of various types of dielectric materials, and the new NEAP process adds surface area to the conductors.
11/28/2012 — EV Group completes cleanroom expansion, opens new R&D labs
EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.
11/21/2012 — GSA, IC Insights team on 5th edition of IC Foundry Almanac
A reference book from the Global Semiconductor Alliance (GSA) and IC Insights puts foundry information at the fingertips of those who need it the most.
11/21/2012 — Electronic gases slowing to modest growth in 2012, 2013
Sales of electronic gases are seen growing a modest 3.2% growth overall in 2012, following a 15% increase in 2011 to $3.1B, according to an updated report from Techcet Group.
11/19/2012 — STATS ChipPAC to expand in South Korea
STATS ChipPAC Ltd. plans to expand its semiconductor assembly and test operation in South Korea.
11/16/2012 — Semiconductor equipment demand: Shades of 2009?
The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.
11/15/2012 — Brewer Science introduces CNT inks for printed electronics
Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.
11/15/2012 — ATMI introduces a safe domestic solution for handling electronic waste components
ATMI Inc. has introduced the eVOLV process and system that represents a sustainable solution for recycling electronic waste (e-waste).
12/05/2012 — iSuppli trims chip forecast again, still expects 2013 rebound
Chip sales growth continues to soften in 2012 as the industry slips from "stagnation" to "slump," but the stage is still set for a rebound in 2013, according to updated analysis from IHS iSuppli.
12/04/2012 — Scholarship created for women going into engineering
TechSearch International and the IEEE Women in Engineering Committee (WIE) are establishing a $2500 scholarship for women going into the field of engineering.
12/28/2012 — Semi execs see a bright 2013, says survey
Industry watchers have been lowering their outlooks for 2013 over the past few weeks, but there's one set of opinions that still see optimism for an industry rebound in 2013 -- chip industry executives themselves.
12/28/2012 — FlexTech Alliance, 4D Technology developing R2R surface metrology system
The FlexTech Alliance has awarded 4D Technology (Tucson, AZ) a contract to develop an optical system that addresses a shortcoming in roll-to-roll (R2R) electronics manufacturing: in situ, high-resolution mapping of surface topography and defects on a moving, flexible web.
12/20/2012 — Gartner: Fab equipment still getting softer, next upcycle starts in 2014
Global spending on wafer fab equipment (WFE) is now on pace to finish 2012 with a -17% annual decline, and 2013 now looks like it'll only be slightly better at a -10% dropoff, before the next cyclical spending upturn begins in 2014, according to an updated forecast from Gartner.
12/20/2012 — SMIC claims breakthrough in backside-illuminated image sensors
SMIC is claiming a breakthrough in its development of backside-illuminated (BSI) CMOS image sensor (CIS) technology, with the first test chip demonstrating good image quality even in low-light conditions.
12/17/2012 — Samsung reaffirms plans for $4B investment in Austin fab: What it means
Samsung's reaffirmation of its planned $4B investments in its Austin, TX facilities don't offer much extra info, but do serve as a message to the market about its future plans -- with or without Apple.
12/17/2012 — IBM 5 in 5: Five innovations that will change our lives within five years
Each December, IBM unveils the 5 in 5 -- five predictions about technology innovations that will change the way we work, live and play within the next five years.
12/13/2012 — Rudolph enters back-end lithography market
Rudolph Technologies, Inc. (Nasdaq: RTEC) has entered the back-end advanced packaging lithography market, with the acquisition of Azores Corp., and the introduction of a new 2X reduction stepper called the JetStep.
08/02/2012 — The ConFab 2012: A retrospective
The ConFab, Solid State Technology’s invitation-only event for the semiconductor industry, took place in June, with presenters from top companies and analyst firms. If you couldn’t be there, check out all the coverage from the event -- reports, presentations, video interviews and more.
07/31/2012 — LED encapsulants grow with increased LED adoption
LED encapsulants are closely related to the LED’s lifespan and light transmittance. With high-power and high-brightness LEDs emerging, the encapsulant’s role is becoming more important, says Displaybank.
07/30/2012 — CGI Americas brings C Sun ovens to North American fabs
CGI Americas is introducing the QMO Series inert gas and vacuum ovens and MOL Series Class 100 cleanroom ovens, based on the SMO Series precision ovens from C Sun, to the North American market.
07/27/2012 — EMCORE switches fab management and process control to Camstar system
EMCORE, compound semiconductor-based components and subsystems supplier, will replace multiple legacy manufacturing systems in its compound semiconductor fab and back-end packaging operations with the Camstar Enterprise Platform.
06/28/2012 — 2012 “Best of West” award finalists announced
Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain.
06/28/2012 — SEMICON West preview: Metrology, inspection, and process control products
Following are some of the process control, device inspection, defect detection, and other metrology and test products that will be on display at SEMICON West 2012, July 10-12 in San Francisco, CA.
06/26/2012 — JPSA picosecond laser micromachining platform reduces debris and thermal damage
JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.
07/18/2012 — Major semiconductor players increase capex in 2012, total capex falls 3%
IC Insights’ latest survey and ranking of the major semiconductor capital spenders shows that only 6 of the 35 major semiconductor suppliers -- Intel, Samsung, Hynix, TSMC, UMC, and Rohm -- with significant capital expenditure budgets are expected to spend more in 2012 than they did in 2011.
07/12/2012 — Fabless keynote: Xilinx on programmability @ SEMICON West
SEMICON West’s Day 2 keynote speaker represented a fabless company: Ivo Bolsens, PhD, SVP and CTO of Xilinx presented on how programmable chips and innovative packaging can advance semiconductors.
07/12/2012 — Interviews with CEA-Leti researchers at SEMICON West
CEA-Leti presented research updates alongside SEMICON West this week. After the talks on device architecture, 3D and 2.5 packaging interconnects, large-scale computing and power consumption, and more, CEA-Leti’s researchers joined Solid State Technology to talk about their fields of interest.
07/12/2012 — Semiconductor fab tool capex trends gleaned @ SEMICON West
After meeting with various semiconductor manufacturing tool suppliers -- Applied Materials, KLA-Tencor, Lam Research, Tokyo Electron, Teradyne and Cymer -- at SEMICON West, Citi analysts share impressions on foundry spending plans and tool choices.
06/01/2012 — Osram plans LED packaging facility in Wuxi
OSRAM AG will build a new LED assembly plant in Wuxi, Jiangsu, China, packaging LED chips fabbed at its Regensburg, Germany and Penang, Malaysia wafer processing facilities.
06/01/2012 — ECTC: Focus on 3D integration and TSVs
A main focus of this year’s Electronic Components and Technology Conference (ECTC), held this week in San Diego, is 3D integration and through silicon vias (TSVs).
06/04/2012 — A virtual IDM concept can unite semiconductor foundries, fabless companies, and packaging houses
The ConFab 2012, Solid State Technology’s invitation-only meeting of the semiconductor industry, opened today in Las Vegas with a keynote address from John Chen, PhD, VP of technology and foundry operations at Nvidia Corporation.
07/11/2012 — Chat with Intel’s Shekhar Borkar @ SEMICON West 2012: Overpowering power consumption
In this video interview, Intel's Shekhar Borkar shares some key topics from SEMICON West keynote: Near-threshold voltage transistor designs, 3D integration for DRAM, unconventional interconnect, and more.
07/11/2012 — Semicon West Day 1: FDSOI and TSV R&D with CEA-Leti
Michael A. Fury, Ph.D., reports on the opening day of SEMICON West (July 10), covering exaflop computing, FDSOI, TSV and other integration schemes, and silicon photonics with CEA-Leti.
07/10/2012 — Imec at SEMICON West: Interview with Luc Van den hove
Luc Van den hove, president and CEO, imec, spoke with Solid State Technology, covering imec’s major announcements and research presentations to take place during SEMICON West 2012.
07/10/2012 — Semiconductor equipment spending to contract 2.6% in 2012, grow in 2013
Semiconductor equipment sales will reach $42.4 billion in 2012, according to the mid-year edition of the SEMI Capital Equipment Forecast, released at SEMICON West 2012.
07/08/2012 — More SEMICON West exhibit previews
Following are some of the new and flagship products that will appear this week at SEMICON West, July 10-12 in the Moscone Center of San Francisco, CA.
07/06/2012 — Top conference reports from H1 2012
We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.
07/20/2012 — Printed electronics standards initiative starts with substrate materials
IPC and JPCA released their first operational-level standard for the printed electronics industry, defining terms and establishes basic requirements for substrate materials used in printed electronics: ceramic, organic, metal, glass and other.
07/20/2012 — North American semiconductor fab tool book-to-bill drops below parity in June
"Following seven months of increases, the three-month average bookings declined in June and likely reflects some slowing in investment plans attributed to weaknesses in the broader economy," said Denny McGuirk, SEMI. "While order activity may slow, equipment spending this year will continue to be directed towards advanced technologies in wafer processing and packaging assembly."
06/21/2012 — Rudolph buys NanoPhotonics to bolster advanced packaging inspection offering
Rudolph Technologies Inc. (NASDAQ:RTEC) acquired the assets of NanoPhotonics GmbH, adding inspection technology and an intellectual property (IP) portfolio to serve its advanced package inspection tool customers.
06/20/2012 — June 27th webcast on 3D integration
In a webcast scheduled for June 27th at 1:00 Eastern, 11:00 Pacific, David McCann of GLOBALFOUNDRIES will provide a status report on advanced packaging and 3D integration. McCann is responsible for Packaging R&D and back-end strategy and implementation at GLOBALFOUNDRIES.
06/20/2012 — AMAT’s Varian integration continues with Dickerson named president
In mid-2011, semiconductor manufacturing and assembly equipment supplier Applied Materials (NASDAQ:AMAT) acquired Varian Semiconductor Equipment Associates Inc. Now, the company is adding Varian’s former CEO Gary Dickerson as president.
06/18/2012 — Silicon chip-on-board LED substrate enables best thermal dissipation
Daewon Innost achieved what it says is the LED industry’s best thermal dissipation performance on its Glaxum LED Array family, based on the proprietary Nano-Pore Silicon Substrate (NPSS) technology.
06/14/2012 — Luminus Devices cuts LEDs’ thermal resistance 30% with new packaging
Luminus Devices Inc. is reducing thermal resistance in its Big Chip LED devices by 30% with new packaging technology.
06/13/2012 — Metrology merger: MicroSense acquires SigmaTech
MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.
09/14/2012 — iPhone 5: Which semiconductor suppliers are the big winners?
As the dust settles after the launch of the iPhone 5, analysts tally which suppliers in the semiconductor ecosphere are most likely to gain the most.
09/14/2012 — A*STAR and Hitachi to collaborate on 3D ICs
Singapore’s A*STAR’s Institute of Microelectronics (IME), and Hitachi Chemical Co., will be collaborating on a joint research program to develop high performance material technologies for thin wafer processing for 3D IC packaging.
09/10/2012 — UMC, ST to develop 65nm backside CMOS image sensors
09/07/2012 — Waiting for the next "golden year"
While various industry segments appear to be tapping the brakes, others are revving their engines, observes SEMI's Christian Gregor Dieseldorff -- and a 2012 stall could pave the way for a record-breaking 2013.
09/04/2012 — Singapore IME, MOSIS to offer silicon photonics wafer prototyping service
Singapore's Institute of Microelectronics (IME) and MOSIS have signed a memorandum of understanding (MOU) to offer a multiple-project wafer service targeting silicon integrated photonics.
08/31/2012 — Bruker lands order for multiple 3D optical microscopes
Bruker said that a leading semiconductor supplier purchased multiple ContourGT-X 3D optical microscope systems for its packaging factories in Asia and North America to support copper wire bond inspection and process control needs.
08/31/2012 — K&S launches manual wire bonder series
Kulicke & Soffa Industries, Inc. launched its next generation manual wire bonder series, the iBond5000. The series, which is based on the company’s 4500 line, includes ball, wedge and dual-capability bonding options.
08/10/2012 — Laser nanofabrication for mass production at the nanoscale
Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.
08/10/2012 — Supply chain readiness in an era of accelerated change
In this SEMI News and Views blog, Karen Savala covers EUV lithography, 450mm wafers, and 3D IC developments, based on her recent presentation at SEMICON West, “Supply Chain Readiness in an Era of Accelerated Change.”
10/12/2012 — From fuzzy to focused: Phase I in project development
Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.
10/09/2012 — Devan Iyer, director of TI's semiconductor packaging operations, joins The ConFab advisory board
Devan Iyer, director of Semiconductor Packaging in Texas Instrument’s Manufacturing Group, has joined the advisory board of The ConFab.
10/08/2012 — Semiconductors and healthcare converging
At the recent imec International Technology Forum Press Gathering in Leuven, Belgium, imec CEO Luc Van den hove outlined uses in blood cell sorting, mobile apps for personalized medicine (such as brain monitoring of EEG activity), and advanced bio research.
10/08/2012 — EEG headset prototype developed
Imec, Holst Centre and Panasonic have developed a new prototype of a wireless EEG (electroencephalogram) headset.
10/08/2012 — Europe to unite research efforts in Silicon Europe cluster alliance
Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”
08/22/2012 — Present on semiconductor metrology and more at ASMC 2013
ASMC 2013, the leading international technical conference for exploring solutions to improve collective microelectronics manufacturing expertise, has issued a call for papers.
08/29/2012 — SRC to host TECHCON conference in September
Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, is poised to celebrate its 30th anniversary at its annual TECHCON conference Sept. 10-11.
08/29/2012 — STATS ChipPAC expands TSV work into mid-end-of-line
STATS ChipPAC says it has expanded its through-silicon via (TSV) capabilities with a 300mm mid-end manufacturing operation targeting mid-end-of-line semiconductor manufacturing, including microbump technology down to 40μm, temporary bond/de-bonding, backside via reveal, isolation, and metallization.
08/28/2012 — Hesse & Knipps introduces new heavy wire bondhead
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders.
08/28/2012 — Bonding and cleaving at low temperatures
Brian Cronquist, MonolithIC 3D Inc.'s VP of Technology and IP reports on recent progress on low temperature (less than 400°C) bonding and cleaving processes.
08/23/2012 — Technology licensing company Rambus restructures, creates CTO role
Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.
10/05/2012 — ON Semiconductor joins imec’s GaN-on-Si research program
ON Semiconductor has joined imec to collaborate on the development of next-generation GaN-on-Si power devices. ON Semiconductor is presently building a GaN processing line in its Oudenaarde facility in Belgium Oudenaarde, and it is expected to employ GaN-on-Si technology.
10/04/2012 — Applied Materials cutting 1300 jobs, reallocating funds to "key growth initiatives"
Applied Materials says it will reduce its work force by between 6% and 9% (900-1300 positions) amid a global realignment deemed necessary to achieve certain strategic objectives, freeing up to $190M annually "to fund key growth initiatives."
10/04/2012 — Analyst: Fab spending softness 2012 extending into 2013
Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.
10/03/2012 — Japan's semiconductor industry: Fabs, equipment, and materials
Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy, the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.
10/01/2012 — Tezzaron takes over SVTC's Austin fab amid layoff reports
Tezzaron Semiconductor is taking over SVTC Technologies' wafer fab in Austin, TX, amid reports that the semiconductor/MEMS development organization is cutting back activities in Austin and in California.
09/20/2012 — On-board heaters can self-heal flash memories
At the upcoming International Electron Device Meeting, Macronix researchers will describe how they built flash memories that could heal themselves by means of tiny onboard heaters that provide thermal annealing just at the spots where it is needed.
09/20/2012 — Everspin to unveil highest-density ST-MRAM
In an invited paper at the International Electron Devices Meeting, researchers from Everspin Technologies will describe how they built the largest functional ST-MRAM circuit ever built, a 64-Mb device with good electrical characteristics.
09/18/2012 — imec advances electronics that flex and stretch
imec announced that it has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts dynamically to curving and bending surfaces.
09/18/2012 — IBM demos high-performance CMOS on flexible plastic substrates
At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.
09/17/2012 — IEDM unveils 2012 program highlights
The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.
09/26/2012 — EV Group sells first ZoneBOND tech for compound semi work
EV Group says it has received an order for its EVG850 temporary bonding/debonding systems from a leading maker of compound semiconductor-based components, what it says is the first use of its ZoneBOND technology in this area.
09/21/2012 — Chip demand still sliding, hopes for soft 3Q landing and recovery
Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.
09/20/2012 — RRAM synapses mimic the brain
At this year’s IEDM, a team led by Korea’s Gwangju Institute of Science and Technology will detail a high-speed pattern-recognition system comprising CMOS “neurons” and an array of resistive-RAM (RRAM)-based “synapses,” which demonstrated STDP, a brain-like function.
06/24/2013 — Deca Technologies appoints Chris Seams as CEO
Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced it has named semiconductor industry veteran Chris Seams its new CEO.
06/21/2013 — Beyond silicon: Transistors without semiconductors
For decades, electronic devices have been getting smaller, and smaller, and smaller. It's now possible—even routine—to place millions of transistors on a single silicon chip. But transistors based on semiconductors can only get so small.
06/21/2013 — Market participants back microelectronics development potential in Russia
Over 45 percent market participants forecast a positive market trend with their company turnover growth outpacing that of the industry as a whole.
06/21/2013 — Technology visionary Edward Iacobucci passes away at 59
VirtualWorks Group co-founder and Chairman Edward E. Iacobucci passed away at his home this morning after a 16-month battle with pancreatic cancer.
06/20/2013 — Global semiconductor manufacturing equipment spending to decline in 2013, says Gartner
Outlook for semiconductor equipment market improves, but remains soft in the short term.
06/17/2013 — Samsung now mass producing industry’s first PCI-Express solid state drive
Samsung announced today that it has begun mass producing the industry’s first PCI-Express (PCIe) solid state drive (SSD) for next-generation ultra-slim notebook PCs.
06/17/2013 — Shipments of NFC-enabled handsets grew 300 percent in 2012
Global sales of handsets featuring Near Field Communication (NFC) grew 300 percent in 2012 to reach 140 million units, according to a new research report by Berg Insight.
06/18/2013 — Tablet IC sales to rise 37% in 2013
New market update shows integrated circuit revenues for tablets hitting $27 billion in 2016.
06/19/2013 — SoC design cost analysis: Costs for higher complexity continue to rise
Everywhere we turn we hear speakers give presentations at conferences and industry events despairing how the rise in silicon design costs is hampering the semiconductor industries growth path.
06/19/2013 — TowerJazz to service infrared markets
Markets predicted by Maxtech International to reach >$5B by 2015.
06/19/2013 — Researchers report quantum networking milestone
Using clouds of ultra-cold atoms and a pair of lasers operating at optical wavelengths, researchers have reached a quantum network milestone: entangling light with an optical atomic coherence composed of interacting atoms in two different states. The development could help pave the way for functional, multi-node quantum networks.
06/18/2013 — Market for hard drives in video surveillance to hit billion-dollar mark by 2017
Revenue for both internal and external HDDs in video-surveillance applications will rise from $638.7 million this year to $1.0 billion by 2017, a remarkable 57 percent increase.
06/18/2013 — Rockchip launches new tablet SoCs on GLOBALFOUNDRIES’ 28nm HKMG process technology
The combination of Rockchip’s design and GLOBALFOUNDRIES’ 28nm HKMG process technology resulted in a mainstream tablet System-on-Chip (SoC) capable of operating at up to 1.8 GHz performance, while still maintaining the power efficiency expected by mobile device users.
06/18/2013 — Imec presents 4K2K CMOS image sensor together with Panasonic
The co-developed imager sensor chip targets high speed, high resolution imaging applications such as next generation HDTV.
06/18/2013 — Multitest VP to discuss quality in 3D assembly at SEMICON West
Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA.
06/19/2013 — DRAM market grows up
Industry’s newfound maturity yields growth amid adversity.
06/14/2013 — TSMC keynoter suggests WLSI at IITC
In a keynote at the IEEE International Interconnect Technology Conference (IITC), Douglas Yu from TSMC talked about Moore’s Law scaling becoming increasingly difficult.
06/13/2013 — Multitest to host annual Open House Week
Multitest today announced that it will hold its annual Open House Week July 9-11, 2013.
06/13/2013 — Imec shows multiple enhancement options for next-generation finFETs
Nano-electronics R&D center addresses key challenges of Germanium finFET technology at VLSI 2013.
06/12/2013 — Spansion appoints Robin Jigour as senior vice president and general manager
Spansion Inc., a provider of flash memory solutions for embedded markets, today announced the appointment of Robin J. Jigour as senior vice president and general manager of the company's Flash Memory Business Group.
06/11/2013 — SEMI releases report on first quarter 2013 manufacturing equipment billings
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013.
06/17/2013 — EVG and Dynaloy develop single-wafer cleaning solution
Single-wafer cleaning solution is suitable for 3D-IC/TSV, advanced packaging, MEMS and compound semiconductor applications.
06/11/2013 — ISORG and Plastic Logic co-develop the world’s first image sensor on plastic
ISORG and Plastic Logic have co-developed the first conformable organic image sensor on plastic, with the potential to revolutionize weight/power trade-offs and optical design parameters for any systems with a digital imaging element.
06/11/2013 — Applied Seals North America partners with SEMATECH
SEMATECH announced today that Applied Seals North America (ASNA) has joined SEMATECH’s Manufacturing Technology Center, which is designed to improve semiconductor equipment manufacturing productivity, yield and cost.
06/10/2013 — CEA-Leti wins Avantex Innovation Prize for E-Thread technology
CEA-Leti announced today that researchers Dominique Vicard and Jean Brun received the Avantex Innovation Prize for the use of the E-Thread technology in textiles.
06/06/2013 — Leti Innovation Days to present preview of future developments in nanotechnologies
CEA-Leti will present recent advances and a preview of future developments in micro- and nanotechnologies, followed by workshops on key technical fields, during Leti Innovation Days, June 25-28, on the MINATEC campus.
06/06/2013 — "Generation Mobile": Advanced Packaging Technology at SEMICON West
Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.
06/07/2013 — Silicon Labs to acquire Energy Micro
Silicon Labs today announced that it has signed a definitive agreement to acquire Energy Micro AS.
06/10/2013 — Altera Corp introduces Generation 10 FPGAs and SoCs
Altera Corporation today introduced its Generation 10 FPGAs and SoCs, offering system developers breakthrough levels of performance and power efficiencies.
05/30/2013 — Peregrine Semiconductor completes license agreement with Murata
Peregrine Semiconductor Corporation, a fabless provider of high-performance radio frequency integrated circuits (RFICs), today announced the signing of a collaborative agreement with Murata Manufacturing Company.
05/31/2013 — GLOBALFOUNDRIES introduces certified design flows for multi-die integration using 2.5D IC technology
The foundry plans to unveil a comprehensive set of certified design flows to support 2.5D IC product development with its most advanced manufacturing processes at next week’s 50th Design Automation Conference (DAC) in Austin, Texas.
05/31/2013 — GLOBALFOUNDRIES unveils plans to accelerate adoption of 20nm-LPM and 14nm-XM FinFET processes
At next week's 50th Design Automation Conference in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support its most advanced manufacturing processes.
05/30/2013 — Aptina appoints Phil Carmack as CEO
Aptina’s board of directors yesterday announced that Phil Carmack has joined Aptina as chief executive officer and as a member of the board of directors.
06/04/2013 — Smartphones forecast to represent over 50% of total cellphone sales for the first time in 2013
A new report from IC Insights shows that we could be on the verge of entering into “the post-PC era.”
05/28/2013 — Signetics announces plans to increase their flip chip package assembly capacity
Signetics Corporation today announced that it has again approved capex plans that will further expand their capacity for flip chip package assembly at their factory in Paju, South Korea.
05/29/2013 — Mentor Graphics and TSMC collaborate on 20nm IC physical verifications
Mentor Graphics Corp. today announced significant achievements in its continued collaboration with TSMC on 20nm physical verification kit optimizations.
05/28/2013 — New power management IC helps reduce thermal stress on processors in phones and tablets
ams AG, a provider of high performance analog ICs and sensors, today introduced the AS3721, a power management IC (PMIC) with an innovative remote-feedback circuit that helps reduce the thermal stress of applications processors in smartphones and tablets.
05/29/2013 — Dow Corning and SÜSS MicroTec report new temporary bonding solution for 2.5D and 3D IC packaging
The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at ECTC 2013, with the report of an advanced new temporary bonding solution for 3D TSV semiconductor packaging.
05/29/2013 — Abu Dhabi doubles down on semiconductor research
ATIC and SRC today launched the ATIC-SRC Center of Excellence for Energy Efficient Electronic Systems (ACE4S), to be hosted jointly in Abu Dhabi by Khalifa University of Science, Technology and Research, and Masdar Institute of Science and Technology.
05/29/2013 — Updated: STMicroelectronics announces sale of ST-Ericsson mobile connectivity GNSS business to Intel
ST-Ericsson, a joint venture of STMicroelectronics and Ericsson, today announced the signature of a definitive agreement to sell the assets and intellectual property rights associated with its mobile connectivity Global Navigation Satellite System (GNSS) business to a semiconductor company.
05/29/2013 — Element Six acquires assets of Group4Labs
Element Six today announced it has acquired the assets and intellectual property of Group4 Labs, Inc. (Group4), a semiconductor wafer materials company that manufactured gallium nitride (GaN) on-diamond semiconductor technology for RF and high-power devices.
05/29/2013 — OMRON develops MEMS non-contact thermal sensor utilizing wafer-level vacuum packaging
OMRON Corporation today announced that they have finished development work on the world's first infrared sensor manufactured with wafer-level vacuum packaging technology to create a 16x16 element MEMS non-contact infrared thermal sensor capable of highly precise 90-degree area detection.
05/20/2013 — Mentor and Tezzaron optimize Calibre 3DSTACK for 2.5/3D-ICs
Mentor Graphics Corp. and Tezzaron Semiconductor Corp. today announced they are collaborating to integrate the Mentor Calibre 3DSTACK product into Tezzaron’s 3D-IC offerings.
05/20/2013 — How Intel can enable a successful $200 PC in the age of the media tablet
Can PC makers produce ultrathin, touch-screen PCs that are appealing to consumers—and that are priced at just $200?
05/16/2013 — Vishay Intertechnology enhances precision thin film chip resistor arrays
Vishay Intertechnology, Inc. today announced that the company has enhanced its ACAS 0606 AT and ACAS 0612 AT precision thin film chip resistor arrays with tighter absolute tolerance, relative tolerance, and relative TCR for the new S, T, and U accuracy grades.
05/16/2013 — EU announces achievements of three-year power microelectronics program
LAST POWER, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements.
05/15/2013 — Yole Developpement conducts 2.5D, 3DIC and TSV interconnect patent investigation
Yole Développement announced its 2.5D, 3DIC and TSV Interconnect Patent Investigation report. For this analysis of 3D packaging technology patents, more than 1800 patent families have been screened.
04/23/2013 — Critical updates on EUV, 3D transistors and 450mm manufacturing at SEMICON West 2013
The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing.
04/23/2013 — AG Semiconductor appoints new senior director of sales
AG Semiconductor Services today announced that Michael (Mike) Mardesich has joined the company in the role of senior director of sales.
05/03/2013 — IEDM announces 2013 call for papers
The 59th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking original work in microelectronics research and development. The paper submission deadline is Monday, June 24, 2013.
05/02/2013 — Intel board elects Brian Krzanich as CEO, Renée James as President
Intel announced that the board of directors has unanimously elected Brian Krzanich as its next chief executive officer (CEO), succeeding Paul Otellini. The board also named Renée James, 48, to be president of Intel.
05/02/2013 — MOSIS collaborates with imec, Tyndall and ePIXfab on silicon photonics
MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with imec, Ireland's Tyndall National Institute and ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs.
05/02/2013 — EI
Endicott Interconnect Technologies, Inc. (EI) announced that its System-In-Package (SiP) technology performed successfully in a military test of a small hit-to-kill interceptor designed to defeat rocket, artillery and mortar attacks.
05/02/2013 — SATS market grew 2.1 percent in 2012
The worldwide semiconductor assembly and test services (SATS) market totaled $24.5 billion in 2012, a 2.1 percent increase from 2011, according to final results from Gartner, Inc.
05/01/2013 — Amkor Technology appoints Steve Kelley president and CEO
Amkor Technology, Inc. today announced that Stephen D. Kelley has been appointed to serve as president and chief executive officer and as a director of the company, effective May 8, 2013.
03/07/2013 — Strategic approach to R&D is goal at National Photonics Initiative Event
More than 100 representatives from government and the photonics industry convened in Washington, D.C., on February 28 to identify focus areas for a national photonics initiative (NPI), engaging academia, industry, and government in a collaboration to address barriers to continued U.S. leadership in photonics.
03/07/2013 — AIXTRON sees signs of market stabilization in report of 2012 fiscal year
Management expects demand for MOCVD production equipment to potentially improve as demand for LEDs increases later in the current year.
03/07/2013 — Aptina and LFoundry to partner on CMOS image sensor manufacturing
LFoundry to manufacture wafers for Aptina following LFoundry’s purchase of Micron’s Avezzano, Italy semiconductor fabrication facility.
03/06/2013 — January DRAM, NAND flash sales indicate a promising year
Industry consolidation to just three big DRAM suppliers and a reduction in capital expenditures among these manufacturers helped propel DRAM average selling prices (ASPs) up 13% year over year in January, which contributed to a 19.9% jump in the total memory market and a 6.2% increase for the total IC market in January 2013.
03/06/2013 — Car infotainment semiconductor market hits speed bump in 2013
Following a healthy expansion in 2012, the growth of the global automotive semiconductor market will decelerate slightly this year because of a slowdown in the aftermarket and portable navigation device (PND) segments.
03/06/2013 — Diodes Incorporated closes acquisition of BCD Semiconductor
Diodes Incorporated today announced that it has completed its acquisition of BCD Semiconductor Manufacturing Limited in an all cash deal, valued at approximately $151 million.
05/09/2013 — Top industrial electronics semiconductor suppliers suffer declining revenue in 2012
The eight leading suppliers of industrial electronics suffered revenue declines in 2012, reflecting weak conditions for the beleaguered market.
05/08/2013 — Despite overall power electronics 2012 downturn, SiC kept on growing
Starting late in 2011, the power electronics downturn in 2012 was quite severe, exhibiting -20 percent negative growth. However, the SiC device market kept on growing with a +38 percent increase year to year.
05/08/2013 — Multitest announces ecoAmp for high-power applications
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive application at a European based IDM.
05/07/2013 — SSDs to account for one-third of worldwide PC storage shipments by 2017
Global shipments of solid state drives (SSD) in PCs are set to rise by a factor of seven by 2017, allowing them to claim more than one-third of the market for PC storage solutions by that time.
05/07/2013 — Intel launches low-power, high-performance microarchitecture
Intel Corporation today took the wraps off its brand new, low-power, high-performance microarchitecture named Silvermont.
05/23/2013 — Photonics societies launch the National Photonics Initiative to increase R&D and economy
Photonics societies across the United States today announced the launch of the National Photonics Initiative.
05/22/2013 — Invensas demos new high bandwidth packaging solution for mobile devices at 2013 ECTC
Invensas Corporation, a subsidiary of Tessera Technologies, Inc., will showcase its latest mobility solution, an ultra-high bandwidth Bond Via Array (BVATM) Package-on-Package (PoP) product, at the upcoming IEEE Electronic Components & Technology Conference (ECTC) in Las Vegas, NV on May 28 - 31, 2013.
05/22/2013 — IDC predicts semiconductor market to experience 3-4% revenue growth in 2013
IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.
05/22/2013 — North American semiconductor equipment industry posts April 2013 book-to-bill ratio of 1.08
North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08.
05/21/2013 — NSF and SRC to fund research to create failure-resistant systems and circuits
Leaders of the National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC) today announced 18 new projects funded through a joint initiative to address research challenges in the design of failure-resistant circuits and systems.
05/21/2013 — Mouser Electronics’ president and CEO celebrates 40 years of service
In 1973, Pong was cutting edge in the world of video games, music came on eight-track tapes, TV viewing was limited to three networks and Glenn Smith was a college kid who went to work part-time in the warehouse of what was little more than a mom and pop electronics catalog start-up in San Diego.
05/21/2013 — Qualcomm and Samsung pass AMD in MPU ranking
Slow notebook and desktop PC sales and strong growth in mobile processors for smartphones and tablet PCs continues to lower Intel's marketshare as well.
05/21/2013 — Toshiba to start mass production of next generation NAND flash memory
Toshiba Corporation today announced that the company has developed second generation 19nm process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month.
04/30/2013 — Samsung now producing 4Gb LPDDR3 mobile DRAM at 20nm
Samsung Electronics Co., Ltd. today announced the industry’s first production of ultra-high-speed four gigabit (Gb) low power double data rate 3 (LPDDR3) mobile DRAM, which is being produced at a 20nm-class process node.
04/29/2013 — China becomes world’s leading PC market in 2012
China rose to the top of the PC market for the first time ever on an annual basis last year, relegating the United States to second place with a lead of more than 3 million units, according to an IHS iSuppli PC Dynamics Market Brief from information and analytics provider IHS.
04/29/2013 — Semiconductor industry to recognize Philip Yeo and Lee Kok Choy at SEMICON Singapore 2013
SEMI today announced that Philip Yeo, chairman of SPRING Singapore, and Lee Kok Choy, country manager of Micron Technology Inc. Singapore, have been voted by the SEMI Singapore Regional Advisory Board as recipients of two prestigious awards recognizing their contributions to the development and success of the Southeast Asian semiconductor industry.
04/29/2013 — Rudolph purchases assets from Tamar Technology
Rudolph Technologies, Inc. announced today that it has purchased selected assets, including a patent portfolio, relating to metrology capability from Tamar Technology, Newbury Park, Calif.
04/26/2013 — Handset market grows in Q1, despite Samsung and Apple’s different approaches
An estimated 405 million handsets, including 197 million smartphones, were shipped in the first quarter of 2013, according to market intelligence firm ABI Research.
04/25/2013 — Breakthroughs in transistors and more to be discussed at VLSI Symposia 2013
About 1,000 of the world’s leading experts in the field of microelectronics will gather here for the 2013 Symposia on VLSI Technology and Circuits, from June 11-13, 2013 (Technology) and from June 12-14, 2013 (Circuits).
04/24/2013 — STATS ChipPAC appoints James A. Norling as chairman
STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, today announced the appointment of Mr. James A. Norling to succeed Mr. Charles R. Wofford as chairman of the Board of Directors with immediate effect.
04/11/2013 — Personal computer shipments post worst quarter on record, says IDC
In another sign of the worldwide shift in preferred personal devices, PC shipments posted the steepest decline ever in a single quarter, according to the International Data Corporation Worldwide Quarterly PC Tracker (IDC).
04/11/2013 — Memory, foundry and LED markets drive fab spending in southeast Asia
Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.
04/11/2013 — Natcore announces advancements and new applications in black silicon
Natcore Technology Inc. announced major strides in advancing its black silicon solar cells to commercial levels of efficiency and, as part of its development process, has discovered that its technology could finally provide a low-cost selective emitter application.
04/10/2013 — NikkoIA SAS announces production of new organic image sensors
NikkoIA announces the production of several innovative organic image sensors, confirming the potential of its technology, and validates the technology building blocks that can be immediately implemented to build its product lines.
04/10/2013 — ESI acquires Semiconductor Systems business of GSI Group
Electro Scientific Industries, Inc. today announced it had signed a definitive agreement to acquire the Semiconductor Systems business of GSI Group, Inc., a supplier of precision photonics, laser-based solutions and precision motion devices to the medical, industrial, scientific, and electronics markets
04/09/2013 — Alliance Memory introduces new high-speed CMOS synchronous DRAMs
Alliance Memory today extended its 128M and 256M lines of high-speed CMOS synchronous DRAMs (SDRAM) with new devices in a 54-ball 8 mm by 8mm by 1.2mm TFBGA package.
04/09/2013 — SEMI reports 2012 global semiconductor materials sales of $47.1 billion
The global semiconductor materials market decreased 2 percent in 2012 compared to 2011 while worldwide semiconductor revenues declined 3 percent. Revenues of $47.11 mark the first decline in the semiconductor materials market in three years.
05/15/2013 — Opportunities for electronics manufacturing services in medical industry are increasing
Original equipment manufacturers (OEMs) are increasingly turning to electronics manufacturing service (EMS) providers to better handle the escalating volumes of electronic content in the medical industry.
05/14/2013 — Global semiconductor sales outpace last year through Q1 of 2013
Sales in March 2013 were up slightly compared to February 2013 and March 2012.
05/14/2013 — Chip Memory Technologies Inc. reveals unique embedded NV memory solution
Chip Memory Technology Inc. (CMT), a new embedded memory technology developer, has emerged from stealth mode to reveal company details and its latest product.
05/14/2013 — HELIOS develops supply chain for integrating photonics with CMOS circuit
The €8.5 million European Commission project developed a complete design and fabrication supply chain for integrating a photonic layer with a CMOS circuit, using microelectronics fabrication processes.
05/13/2013 — Silex joins ENIAC project to develop new solutions for TSV and wafer bonding
Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced that it has joined an international European Union-funded program aimed at developing a new MEMS manufacturing platform based on advanced inkjet-based printing technologies.
04/19/2013 — Bluetooth chip shipments to nearly double by 2017
The market for Bluetooth semiconductors is expected to boom by nearly 100 percent from 2011 to 2017, with the majority of the growth driven by demand for wireless combination integrated circuits (ICs) and mobile system-on-chip (MSoC) devices with integrated wireless connectivity that are used in mobile devices like smartphones and media tablets.
04/19/2013 — SEMI reports March book-to-bill ratio of 1.14
North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.
04/18/2013 — Smartphones, tablets, SSDs propelling NAND flash sales in 2013
Increasing HD video content, social networking, shared data via the cloud, low power consumption, and “instant on” features continue to drive growth of consumer, communication, and computing devices that use NAND flash memory.
04/18/2013 — More than one-third of companies completely unprepared for US Conflict-Materials rules
With time running out until U.S. component manufacturers are legally required to disclose their usage of conflict minerals to the federal government, many companies are woefully unprepared for the new regulations, with more than one-third of firms indicating they haven’t even commenced compliance planning, according to a survey from information and analytics provider IHS.
04/17/2013 — Intermolecular announces agreement with Micron
Intermolecular, Inc. today announced that it has entered into a multi-year technology development and IP licensing agreement with Micron Technology, Inc., focused on technology development and related IP for advanced memory technologies.
04/17/2013 — BeSpoon and CEA-Leti establish world-record distance measurement on a single chip
BeSpoon, a fabless semiconductor company, and CEA-Leti have demonstrated an IR-UWB integrated circuit able to measure distances within a few centimeters’ accuracy, and have established a world-record operating range at 880m (standard regulation) and 3,641m (emergency situations).
04/15/2013 — Thin-layer germanium may replace silicon in semiconductors
Chemists at Ohio State University have developed the technology for making a one-atom-thick sheet of germanium, and found that it conducts electrons more than ten times faster than silicon and five times faster than conventional germanium.
04/15/2013 — SPIE leaders encouraged by increased science funding in Obama budget proposal
Proposed increases in funds for scientific R&D and a greater emphasis on STEM education in the 2014 budget proposal announced by the White House this week reflect the President’s commitment to science and engineering, SPIE leaders said.
04/12/2013 — IBM announces $1B investment in flash memory R&D
IBM announced plans on Thursday to invest $1 billion in flash memory research and development and launch a series of systems that will use solid state drives.
04/11/2013 — Cracking the potential of the glass wafer market
Over the last few years, glass has gained considerable interest from the semiconductor industry due to its very attractive electrical, physical and chemical properties, as well as its prospects for a relevant and cost-efficient solution. The application scope of glass substrates in the semiconductor field is broad and highly diversified.
02/22/2013 — Painting with catalysts: Nano-engineered materials for detoxifying water
Only light, aerial oxygen, and a catalyst are needed to remove pollutants from water. Ruhr-Universitat Bochum researchers led by Professor Radim Beránek are collaborating with colleagues from seven different countries in order to develop a photocatalyst that is efficient enough to be profitable.
02/22/2013 — UNL research moving closer to cracking silicon barrier
The ability to improve silicon transistors is reaching its fundamental limit, so researchers are searching for new ways to keep making electronic devices faster and more powerful. University of Nebraska-Lincoln physicists and colleagues have taken a major step toward breaking that silicon barrier.
02/21/2013 — Ultra-low power processor operates at near-threshold voltage
At this week’s International Solid State Circuits Conference (ISSCC 2013), imec and Holst Centre presented an ultra-low power processor that operates reliably at near-threshold voltages.
02/21/2013 — New Product: O2/Ar ion gun spots the difference
The Hiden IG20 high-brightness gas ion gun is further enhanced by the introduction of a new beam optic and ion source configuration to enable both increased beam brightness and beam contrast, together with a significant reduction in ultimate spot size.
02/20/2013 — Leti to coordinate European supply chain in silicon photonics
CEA-Leti today announced that it will coordinate a four-year project aimed at building a European-based supply chain in silicon photonics and speeding industrialization of the technology.
02/20/2013 — STMicroelectronics 28nm FD-SOI technology hits 3GHz operating speed
STMicroelectronics announced today another milestone in its testing of its 28nm FD-SOI Technology Platform.
01/03/2013 — 2013: 450mm is the next big opportunity
In semiconductor manufacturing, 450mm is the next big opportunity. Issues of economic scale and complexity will force fab designers, OEMs and process integrators to investigate all open avenues in the search for solutions to the huge challenges that accompany 450mm.
01/03/2013 — 2013: The year of the diamond?
Recent advances in diamond applications (diamond-on-silicon, MEMS, optical) suggest that its utilization into a broader scope of commercial products is not far away.
01/03/2013 — 2013: Outlook for secondary equipment
The multibillion-dollar secondary or used semiconductor equipment market has gone through significant changes over the past five years and has become increasingly sophisticated in its approach.
01/03/2013 — 2013: Continued strength in 200mm
80 percent of the devices used for portable and mobile applications are currently manufactured on 200mm or smaller wafers. How this plays out going forward could change who the dominant players will be.
01/03/2013 — 2013: Accelerating R&D and decreasing time to yield
In order to maintain profitability manufacturers must increase the productivity and return from their R&D investments.
01/02/2013 — 2013: Advanced packaging requirements are more complex, require new solutions
Advanced packaging requirements are driving the evolution of back end manufacturing to become more similar to the front end.
01/02/2013 — 2013: Building the internet of things with MEMS and 3D advances
It is becoming increasingly clear that new MEMS and 3D high-volume, low-cost manufacturing technologies will accelerate a radical change to society’s cyber skyline.
01/02/2013 — 2013: Look for continued consolidation
In 2013, it is anticipated that M&A transaction activities will increase and result in further consolidation of the semiconductor supply chain.
01/02/2013 — 2013: The beginning of the next IC industry upturn
2013 will mark the beginning of the next cyclical upturn—one in which the IC market CAGR will more than triple to 7.4% in the 2012-2017 time period.
01/02/2013 — 2013: Fab Equipment Spending Shrinks Back to Flat
The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.
02/12/2013 — Solid state thin film batteries market worth $6 Billion by 2019
Markets for solid state thin-film batteries at $65.9 million in 2012 are anticipated to reach $5.95 billion by 2019, according to a new report released by ReportsnReports.com.
02/12/2013 — Silicon wafer revenues decline in 2012
Worldwide silicon wafer revenues declined by 12 percent in 2012 compared to 2011, according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.
02/07/2013 — SEMI China releases Top Ten list of packaging and assembling facilities
Although many are small companies manufacturing low-pin count devices, all of the world’s “Top 10” OSAT, Outsourced Semiconductor Assembly and Test, players have one or more assembly and testing facilities in China.
02/07/2013 — Econometric Forecast: Regional developments to affect growth of semiconductor industry
In the first of two installments, we examine the global issues facing the semiconductor industry, as released by Linx Consulting in The Econometric Semiconductor Forecast.
02/07/2013 — Econometric forecasting service predicts 6% growth in semiconductor wafers in 2013
A new econometric semiconductor industry forecast predicts semiconductor wafer area production to grow slightly less than 6% in 2013, according to Linx Consulting.
02/06/2013 — TU Dresden realized 28nm low-power test chip with Tensilica processor and RacyICs power management
Technische Universität (TU) Dresden announced Monday the successful initial operation of a low-power test chip featuring a Tensilica Xtensa LX4 DSP equipped with RacyICs power management IP implemented in GLOBALFOUNDRIES' advanced 28nm Super Low Power, or SLP, technology.
02/06/2013 — ISMI to partner with Araca
SEMATECH announced today that Araca Inc., a leading provider of products and services for chemical mechanical planarization research and development, and the International SEMATECH Manufacturing Initiative (ISMI) are partnering to deliver CMP processing and productivity solutions to help chip manufacturers increase yields, reduce equipment downtime and lower consumables costs.
02/05/2013 — Microchip unveils three new low-power devices
Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, announced an expansion of its SPI Flash memory portfolio yesterday.
02/05/2013 — Dow Corning and IBM scientists develop new materials for board-level photonics
Dow Corning and IBM scientists unveiled a major step in photonics yesterday at the Photonics West conference, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers.
02/05/2013 — Semiconductor R&D spending rises 7% despite weak market
Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion.
02/04/2013 — Hard disk drive market revenue set for double-digit decline
Facing a relentless onslaught from tablets, smartphones and solid state drives (SSD), global hard disk drive (HDD) market revenue in 2013 will decline by about 12 percent this year, according to IHS.
02/04/2013 — FAME center to focus on advanced electronics
Five University of California, Riverside professors will receive a total of $5 million as part of a $35 million research center aimed at developing materials and structures.
01/30/2013 — BGA guideline features expanded focus on mechanical reliability
IPC recently released the C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
01/30/2013 — STATS ChipPAC and UMC unveil 3D IC developed under open ecosystem
STATS ChipPAC and UMC announced the world's first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration.
01/30/2013 — Renesas and J-Devices sign MoU on transfer of back-end facilities
Renesas and J-Devices signed a memorandum of understanding regarding the transfer of the semiconductor back-end production business of three facilities operated by Renesas’ wholly owned manufacturing subsidiaries
02/18/2013 — Shimadzu introduces high-sensitivity gas chromatograph
Shimadzu Corporation today introduced the Tracera, a high-sensitivity gas chromatograph. Tracera is equipped with the newly developed barrier discharge ionization detector BID, which is capable of detecting all types of trace organic and inorganic compounds.
02/18/2013 — Global 3D IC market report reveals major challenges
TechNavio's analysts forecast the global 3D IC market to grow at a CAGR of 19.7 percent over the period 2012-2016. However, the thermal conductivity issues could pose a challenge to the growth of this market.
02/18/2013 — ISSCC 2013: High-performance digital trends
Subcommittee chair Stefan Rusu of Intel in Santa Clara, CA will present on trends in high-performance digital. The relentless march of process technology, he says, brings more integration and performance.
02/14/2013 — SEMI announces Silicon Innovation Forum to bridge funding gaps for early-stage companies
SEMI, in collaboration with strategic investing groups throughout the global semiconductor industry, has announced the Silicon Innovation Forum, or SIF, to bridge funding gaps for new and early-stage companies with valuable semiconductor manufacturing and technology solutions.
02/14/2013 — Engineers at University of Buffalo develop hyperbolic metamaterial waveguide
By creating a material that slows light, engineers open new possibilities in solar energy, military technology and other fields of research.
01/15/2013 — ISS 2013: Semiconductor leaders see massive industry transformation
The rise in mobile computing, changes to the fabless-foundry model, uncertainties in technical innovation, and global macroeconomic trends are becoming the dominant forces in 2013 and beyond, according to industry leaders speaking at this week's SEMI Industry Strategy Symposium (ISS).
01/11/2013 — GlobalFoundries adding R&D facility to NY fab campus
GlobalFoundries says it plans to build a $2 billion "Technology Development Center" R&D facility at its Fab 8 campus in Saratoga County, NY, for semiconductor technology development and manufacturing: EUV lithography photomasks to new interconnect and packaging technologies enabling 3D chip stacking, "and everything in between."
01/09/2013 — CES 2013: The brains behind smart devices are front and center
Components are prominent this year, on the main stage, and the CES exhibit floors.Todd Traylor of Smith & Associates reports.
01/04/2013 — IDC: Semiconductor revenues will grow 4.9% in 2013
The International Data Corporation is forecasting that semiconductor revenues worldwide will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% from 2011-2016.
01/04/2013 — 2013: Healthy revenue growth, but capex likely flat
Based on current indications, capital spending would seem to be flat in 2013. However, Semico predicts healthy revenue growth this year, which may encourage more spending, particularly in the second half of the year. This may bring total capex for 2013 into the positive range.
01/03/2013 — SK Hynix licensing Tessera, Invensas patents
Korean DRAM maker SK Hynix has entered into new eight-year patent licensing agreements with Tessera Inc. and Invensas.
01/29/2013 — Foreign acquisitions are just the beginning of China’s global ambition
China’s rapid transition from a low-cost manufacturing hub to an innovation hotspot with growing foreign ambitions represents both a threat and an opportunity for companies and investors around the globe, according to Lux Research.
01/28/2013 — IEDM 2012: The pivotal point for monolithic 3D ICs
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc., blogs about the evolution of 3D technology seen at the International Electron Devices Meeting.
01/22/2013 — Is Apple changing its mind on touch panel structures?
Reports are circling around Apple's supply chain of a potential shift in the company's display technology for its future iPhones and iPads -- moving back to LCDs and away from touch panels -- but a drastic realignment of its supply chain is probably not likely, observes DisplaySearch.
01/17/2013 — Report: "Glaring imbalances" in printed electronics venture funding
Printed, flexible, and organic electronics have garnered more than $7.5 billion in venture funding from 1996-2011, though it's declined sharply since 2007. A new Lux Research report looks at who's getting attention and who's not.
02/20/2013 — Five IC suppliers to hold one-third of 300mm wafer capacity in 2013
Samsung tops list; IC foundries expected to show biggest capacity gains through 2017.
02/20/2013 — Researchers create semiconductor 'nano-shish-kebabs' with potential for 3-D technologies
Researchers at North Carolina State University have developed a new type of nanoscale structure that resembles a “nano-shish-kebab,” consisting of multiple two-dimensional nanosheets that appear to be impaled upon a one-dimensional nanowire.
12/04/2012 — Energy-Efficiency Trends
Attribution: By gillyberlin (Flickr: Motorola Milestone Test) [CC-BY-2.0 (http://creativecommons.org/licenses/by/2.0)], via Wikimedia Commons Demand for mobile functionality to achieve enhanced productivity, a better social-networking experience and improved multimedia quality continues to drive innovation in technologies that will deliver these objectives in an energy and cost-efficient manner. Subcommittee[...]
12/04/2012 — Analog Trends
Subcommittee chair Bill Redman-White of NXP/Southhampton University in the United Kingdom discusses the global challenges facing analog circuit research. While the manipulation and storage of information is efficiently performed digitally, the conversion and storage of energy must fundamentally be performed with analog systems. As a result, the key technologies[...]
12/04/2012 — RF Trends
The RF chips presented at ISSCC 2013 confirm that RF devices will continue to see larger levels of integration at the chip- and package- level for years to come. This year has shown increased innovation, integration and technical maturity across RF frequency bands. ISSCC authors will present on an[...]
12/04/2012 — Large-Area Flexible Electronics Trends
The prime application for thin-film-transistors are backplanes for active-matrix displays, including in particular flexible displays. They are well-suited for integration with temperature or chemical sensors and more. Hoi-Jun Yoo of KAIST in South Korea presents. Technology directions in the field of large-area and low-temperature electronics focuses on lowering the[...]
12/04/2012 — Imagers, MEMs, Medical & Displays
The market for MEMS sensors is becoming more robust with demands coming from automotive, industrial, mobile and scientific markets. By Uploaded by Michael Schmid (Cropped image from ) [Public domain], via Wikimedia Commons. Since 2010, there has been growth beyond expectations in the adoption of mobile devices, e.g[...]
02/19/2013 — ISSCC 2013 Slideshow: Highlights
ISSCC, the International Solid-State Circuits Conference, is being held on February 17-21, 2013, at the San Francisco Marriott Marquis Hotel. This year, in honor of the conference’s 60th anniversary, we have assembled highlights of the topics and trends that are being discussed.
12/04/2012 — Memory Trends
Memory capacity trend of emerging nonvolatile memories will be discussed by Kevin Zhang of Intel in Oregon. Subcommittee chair Kevin Zhang of Intel will be discussing trends in memory in 2013. According to Zhang, we continue to see progressive scaling in embedded SRAM, DRAM, and floating-gate based Flash for[...]
02/19/2013 — 300-millimeter thin-wafer products by Infineon now being shipped worldwide
In February, Infineon received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at their site in Villach, Austria.
02/26/2013 — GaN Systems expands with new UK location
New marketing and technical support center opened in Reading, UK.
02/26/2013 — Qualcomm processor first to use TSMC’s 28 HPM advanced process technology
Snapdragon 800 processor on 28nm HPM process delivers high performance and low power for mobile devices.
02/26/2013 — Messe Düsseldorf and ESNA Coorperation to address fast-growing printed electronics market
Messe Düsseldorf and ESNA have formed a cooperation to address the printed electronics market by organizing a new tradeshow, PEPSO.
02/26/2013 — New Product: Engineered Material Systems introduces die attach for temperature-sensitive applications
Engineered Material Systems, a global supplier of electronic materials for circuit assembly applications, debuts its DB-1568-1 low-temperature cure die attach adhesive for attaching semiconductor die in temperature-sensitive devices.
02/26/2013 — Infographic: Computers with human senses
We are entering the era of cognitive systems, where electronic devices will mimic the human senses—in their own way, to see, smell, touch, taste and hear. IBM assembled this infographic to illustrate what they call the “5 in 5,” five innovations that will change our lives within five years.
02/26/2013 — New Product: KLA-Tencor announces two new litho/etch process control tools
New metrology and inspection products facilitate advanced patterning techniques for manufacturing sub-20nm memory and microprocessor chips.
02/25/2013 — Tech spending still strong, despite economic volatility
China looks a good bet to be the engine of growth again in 2013, while U.S. will see improving PC market and more software growth.
02/25/2013 — Rise of smartphones reshapes competitive order in the cellphone chip market
The competitive landscape of the cellphone core integrated circuit (IC) business has completely transformed over the past five years, with Qualcomm Inc. and Samsung capitalizing on the rise of smartphones and 4G.
02/25/2013 — Toshiba develops CMOS image sensor for small and low power applications
Toshiba Corporation announced the development of a CMOS image sensor with a small area and low power pixel readout circuits. A sample sensor embedded with the readout circuits shows double the performance of a conventional one. Toshiba presented this development at ISSCC 2013 in San Francisco, CA on Feb. 20.
02/25/2013 — Scientists develop multicolor LEDs without heavy metals
Silicon nanocrystals have a size of a few nanometers and possess a high luminous potential. Scientists of Karlsruhe Institute of Technology (KIT) and the University of Toronto/Canada have now succeeded in manufacturing silicon-based light-emitting diodes (SiLEDs). They are free of heavy metals and can emit light in various colors.
02/22/2013 — Toshiba develops low power technology for embedded SRAM
-27% active power reduction and 85% standby power reduction is confirmed at International Solid-State Circuits Conference 2013.
03/06/2013 — eMemory’s eNVM SIPs reach 5 million wafer production record
eMemory announced today that the accumulated number of customers’ wafers incorporating eMemory’s eNVM SIPs have now surpassed 5 million production mark.
03/06/2013 — Fab Spending Forecast: Equipment spending is expected to remain flat in 2013
Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.
03/05/2013 — EV Group to develop equipment to enable covalent bonds at room temperature
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature.
03/05/2013 — Peregrine Semiconductor to license its UltraCMOS design to Murata
Peregrine Semiconductor Corporation, a fabless provider of high-performance radio frequency integrated circuits (RFICs), yesterday announced plans to collaborate with Murata Manufacturing Company on a multisource arrangement for RF switches and other components based on Peregrine’s proprietary UltraCMOS technology
03/04/2013 — Flip-Chip expected to grow at a steady 9% pace, reaching $35 billion by 2018
Flip-Chip is big on value: in 2012, it was a $20B market, making it the biggest market in the middle-end area, and Yole Développement expects it to continue growing at a 9% clip, ultimately reaching $35 billion by 2018.
03/04/2013 — Spansion and UMC to partner on tech development
Companies will develop integrated logic and Flash memory to enable creation of high-performance and low power electronics.
03/01/2013 — World Semiconductor Trade Statistics predicts worldwide semiconductor market to rebound in 2013
After experiencing a slowdown in 2012, the global semiconductor market is set for growth. The World Semiconductor Trade Statistics predicts the global semiconductor market to grow by 4.5% in 2013 after declining 3.2 percent in 2012.
03/01/2013 — GEO Semiconductor to partner with Tensoft
Tensoft's web-based product will streamline operations for recently-acquired product line.
03/14/2013 — Seven opto-sensor-discrete products achieved record sales in 2012
O-S-D’s marketshare of total semiconductor sales in 2012 was highest since 1991. Seven O-S-D product categories and device groups reached record-high sales in 2012 compared to 14 new records being set in 2011, according to data shown in the 2013 edition of IC Insights’ O-S-D Report.
03/13/2013 — Yoon-Woo Lee of Samsung Electronics to give keynote address at The ConFab 2013
Solid State Technology is proud to announce that Yoon-Woo Lee will be speaking at The ConFab 2013. The event will be held June 23-26, 2013 at The Encore at The Wynn in Las Vegas. Lee is the Executive Advisor of Samsung Electronics.
03/13/2013 — Intel leads unexpectedly large decline in semiconductor market inventory
After reaching a worrisome high in the third quarter of 2012, global semiconductor inventories held by chip suppliers fell at a surprisingly fast rate in the fourth quarter, led by dramatic reductions for market leader Intel Corp.
03/13/2013 — EV Group ships 300mm wafer bonding system to leading Chinese semiconductor foundry
Foundry to use wafers for 3D IC and advanced packaging volume production applications.
03/13/2013 — Is the power electronics industry a world apart?
In the power electronics field, the fabless business model is not as common compared to the MEMS industry. For example, most power electronics players have their own capabilities/fabs dedicated mainly to silicon wafer manufacturing. According to Yole Développement, $4B was generated by MEMS fabless companies in 2012, against less than $300K in the power electronics area. Is power electronics a world apart?
03/12/2013 — ATLIS Semiconductor selected as IBM Microelectronics’ long-term foundry partner for 180nm SOI technology
ALTIS Semiconductor, a global specialty foundry based in France, announced today the finalization of a foundry agreement with IBM Microelectronics. Under the terms of this agreement, ALTIS will be the foundry partner for the IBM 180nm SOI technology. ALTIS will deliver high volume products starting Q2 2013 and will secure capacity increase for 2014 and beyond to address the IBM forecasted demand.
03/12/2013 — Signetics introduces an alternative to standard plastic ball grid array packages
Signetics Corporation today introduced their new MapBGA package to the industry. This alternative to standard PBGA packaging has improved reliability and design flexibility due to its unique assembly process.
03/12/2013 — OKI delivers exhaust gas treatment equipment for ON Semiconductor’s European plants
OKI Engineering, provider of reliability evaluations and environmental conservation technologies for the OKI Group, recently delivered KGT-3MM-AP exhaust gas treatment equipment for atmospheric pressure CVD manufacturing equipment to semiconductor manufacturer ON Semiconductor's European plants.
03/12/2013 — Cadence to acquire Tensilica
Cadence Design Systems, Inc. today announced plans to aquire Tensilica, Inc. for approximately $380 million in cash. Tensilica had approximately $30 million of cash as of December 31, 2012.
02/28/2013 — Georgia Tech’s research on improving energy storage
Neutron scattering technique provides new data on absorption of ion in microporous materials.
02/28/2013 — GLOBALFOUNDRIES enhances 55nm CMOS logic process
55nm LPe 1V is optimized for ultra-low power, reduced cost and improved design flexibility.
02/28/2013 — India's efforts to appeal to semiconductor manufacturers
This week, India’s Finance Minister P Chidambaram offered incentives to chip makers to set up headquarters in India, in an effort to encourage local electronics manufacturing. However, the response from the industry has been less than positive. Many believe that is it is a good start, but far from sufficient.
02/28/2013 — A single European semiconductor strategy is on its way
STM, Imec, CEA-LETI, ASML, Soitec and EU representatives discussed directions at ISS Europe 2013 in Italy.
02/28/2013 — Brooks Instrument to launch new mass flow controller at SEMICON China
Brooks Instrument, a provider of flow measurement and control instrumentation to the microelectronics industry, will launch the GF135 pressure transient insensitive (PTI) mass flow controller at SEMICON China, March 19-21 at Shanghai New International Expo Center.
02/27/2013 — Researcher finds faster, more efficient technique for creating high-density ceramics
A researcher from North Carolina State University has developed a technique for creating high-density ceramic materials that requires far lower temperatures than current techniques – and takes less than a second, as opposed to hours. Ceramics are used in a wide variety of technologies, including body armor, fuel cells, spark plugs, nuclear rods and superconductors.
02/27/2013 — Altera to build FPGAs on Intel’s 14nm tri-gate technology
Intel announced Monday a major move to expand its foundry business. Altera Corporation and Intel Corporation have entered into an agreement for the future manufacture of Altera FPGAs on Intel's 14nm tri-gate transistor technology.
02/27/2013 — Emerging technologies create strong opportunity for automotive ICs
New automotive technologies that go beyond touchscreens, satellite radio, and voice-activated GPS commands are being tested and improved, and will soon begin to appear in many more new car models, resulting in solid growth for the automotive IC market through 2016.
02/27/2013 — LFoundry to acquire Micron manufacturing plant
LFoundry, an analog mixed signal and specialized technologies foundry, today announced that it has entered into an agreement with Micron Technology, Inc. (NASDAQ: MU) to acquire Micron Technology Italia, Srl. and all of its semiconductor fabrication facility assets in Avezzano, Italy.
02/27/2013 — STMicroelectronics is first $1 billion MEMS company
Yole Développement’s research has credited STMicroelectronics for capitalizing on the booming demand for MEMS in mobile devices by shipping 58% more MEMS units in 2012, to become the first company to reach $1 billion in MEMS sales.
03/25/2013 — IME to address copper interconnects reliability issues at Copper Wire Consortium
The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) in Singapore, has launched the Copper (Cu) Wire Bonding Consortium II. The consortium which rides on the successes of Phase I launched in 2010 aims to improve the reliability of semiconductor devices by tackling copper wire bonding issues related to corrosion and stress.
03/22/2013 — North American semiconductor equipment industry posts February 2013 book-to-bill ratio of 1.10
North America-based manufacturers of semiconductor equipment posted $1.07 billion in orders worldwide in February 2013 (three-month average basis) and a book-to-bill ratio of 1.10, according to the February Book-to-Bill Report published today by SEMI. A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.
03/12/2013 — AGC and nMode launch subsidiary to develop advanced packaging technology
Tokyo-based Asahi Glass Co., Ltd. and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co-found a subsidiary business, Triton Micro Technologies , to develop via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.
03/11/2013 — New products to be presented at Semicon China 2013
Heraeus will present numerous product highlights with regard to bonding wires, assembly materials and sputtering targets at this year's Semicon China, taking place on March 19-21, 2013 in Shanghai.
03/08/2013 — MRAM: Disruptive technology for storage applications
Everyone wants faster access to stored data, and the issue is becoming critical with Big Data and cloud initiatives. With the speed of DRAM and the non-volatility of storage, Magnetoresistive Random Access Memory (MRAM) encourages a new way of thinking about storage applications. Storage is associated with longer latencies, but with MRAM storage can have similar latencies to memory. These capabilities and others make MRAM a catalyst for new thinking about how we design storage applications.
03/08/2013 — STMicroelectronics proximity sensor solves smartphone hang-ups
Smartphones are set to become even more flexible and more satisfying to use, thanks to a unique sensor system developed by STMicroelectronics. Combining three optical elements in a single compact package, the VL6180 is the first member of ST’s FlightSense family and uses a new optical-sensing technology that reduces the incidence of dropped calls and enables innovative new user interactions with smartphones.
03/08/2013 — Broadcom tops three ABI Research wireless connectivity IC competitive assessments
Broadcom has been ranked number one vendor in three recent competitive assessments released by ABI Research on wireless connectivity IC markets. One was for overall wireless connectivity ICs, another on Bluetooth ICs, and a final on Wi-Fi ICs.
03/21/2013 — Blog: Dimensional scaling and the SRAM bit-cell
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. and Benjamin S. Louie of Zeno Semiconductor blog about dimensional scaling as it relates to EUV and future per transistor device cost.
03/20/2013 — InnoLas Semiconductor on course for 450mm
Wafers with a diameter of 450mm enable the micro-chip industry an increase in yield of up to 80%. This leads to an enormous increase in productivity. In order to control the product quality, these wafers receive a specific marking from the manufacturer.
03/20/2013 — Modern power design challenges to be discussed at APEC 2013
ON Semiconductor will demonstrate new digital AC-DC PWM controllers, motor drivers and IGBTs at industry’s premier power electronics show.
03/19/2013 — SEMICON West 2013 to address industry R&D challenges and opportunities
Dynamic changes to R&D processes, tools, technical challenges, and funding/business models will be highlighted at SEMICON West 2013, along with product displays of the latest semiconductor manufacturing technology, components and subsystems.
03/19/2013 — Next-generation batteries eye slice of $10 billion Li-ion market
Mobile energy storage is critical for everything from the phones and computers we carry, to the soldiers and weapons that protect us – and even to the cars we drive. While lithium-ion (Li-ion) batteries have established themselves as the leading technology today, exotic ideas such as lithium-air, lithium-sulfur, solid-state and zinc-air batteries offer up to 10 times better energy density.
04/09/2013 — Silex and BroadPak partnership produces 2.5D IC packaging capabilities
Silex Microsystems and BroadPak today announced the immediate availability of their jointly developed silicon interposer solution in high-volume manufacturing.
04/08/2013 — Cadence and TSMC to collaborate on design infrastructure for 16nm FinFET process technology
Cadence Design Systems, Inc. today announced an ongoing multi-year agreement with TSMC to develop the design infrastructure for 16-nanometer FinFET technology, targeting advanced node designs for mobile, networking, servers and FPGA applications.
04/05/2013 — Implementation of next-generation device technology to be discussed at The ConFab 2013
Solid State Technology is excited to announce that Mark Thirsk, managing partner at Linx Consulting, will be discussing the cost and technology needed to implement next-generation device technology at The ConFab 2013. Thirsk has over 20 years of experience in the chemical industry, working with a variety of materials and processes utilized in wafer fabrication.
04/04/2013 — ARM and Cadence to partner to implement 64-bit processor on TSMC 16nm FinFET process
Fulfilling the promise of performance and power scaling at 16nm, ARM and Cadence today announced details behind their collaboration to implement the first ARM Cortex-A57 processor on TSMC's 16nm FinFET manufacturing process.
04/04/2013 — Manchester leads the way in graphene membrane research
University of Manchester graphene researchers have been awarded a £3.5 million (or approximately US$5 million) funding boost that could bring desalination plants, safer food packaging and enhanced disease detection closer to reality.
04/04/2013 — How Samsung is climbing the charts
It’s no secret that Samsung is up against Apple in many ways, in products, sales and innovation. However, even in the face of Apple’s patent infringement lawsuits, Samsung is still climbing the charts.
03/19/2013 — Kotura establishes fabless semiconductor model
Kotura inks fab agreement; announces relationships with Mindspeed and BinOptics.
03/18/2013 — FlipChip International and EZconn Czech a.s. announce partnership
FlipChip International (FCI), a developer of flip chip bumping, Wafer Level and embedded die packaging and EZconn Czech a.s. announced a partnership agreement today.
03/15/2013 — President of IC Insights, Inc. to discuss the “new” IC industry cycle at The ConFab 2013
It’s no secret: the past five years for the IC industry have been full of challenges. From 2007-2013, the IC market grew at an average annual rate of only 2.1%. One of the speakers slated to speak at The ConFab 2013 in Las Vegas has good reason to believe the IC industry is set to emerge from this difficult cycle.
03/15/2013 — PCB growth rate to slow to 2.7% in 2013
In 2012, global PCB industry saw a jump in terms of output value, benefitting in a large part from the rapid growth in the shipment of Apple and Samsung. However, there is no such possibility of a huge jump in 2013, as the report states the expected growth rate will slow down to 2.7%.
03/15/2013 — $14 trillion opportunity in Internet of Things, predicts Cisco
Cisco Systems is preparing for a major shift in the industry, as the Internet of Things starts to become a reality. At an annual press event in San Jose, California this week, Cisco officials claimed that the much-anticipated IoT industry could be a $14 trillion opportunity, and they are ready to embrace the change.
03/15/2013 — OneChip announces partnerships and plans to expand into the DCI and PON markets
OneChip Photonics this week revealed strategic, outsourcing plans to expand into new markets, with announcements of newly-established relationships with semiconductor foundry GCS and wafer supplier IQE. Both announcements related to OneChip’s bigger, strategic plan to expand its services into the high-volume DCI market.
03/27/2013 — NAND flash market defies trends and grows to record level in Q4
Despite facing five consecutive quarters of decline and a slowdown in consumption in smartphones and tablets, the global market for NAND flash memory pulled off a surprise growth spurt during the last three months of 2012, causing sales to reach a record high.
03/26/2013 — IBM Fellow Subu Iyer to give keynote address at The ConFab 2013
Solid State Technology is pleased to announce Subu Iyer, IBM Fellow, will be giving the keynote address at The ConFab 2013 in Las Vegas on Tuesday, June 25, 2013. Iyer will speak on orthogonal scaling to fill today’s fabs in the future.
03/26/2013 — University of Central Florida launches new undergrad program in photonics
A new undergraduate program approved this week at the University of Central Florida (UCF) will help the U.S. stay competitive in global technology as well as broaden the path for students seeking rewarding careers in the important field of optics and photonics, say leaders of SPIE, the international society for optics and photonics.
04/03/2013 — Cleanzone 2013 focuses on technology and life sciences
The second Cleanzone on October 22 and 23, 2013 in Frankfurt am Main is off to a promising start with a stronger profile. Last year, the trade fair and congress made a successful debut as the new international industry meeting point for cleanroom technology. It is targeted towards all companies and sectors in which industrial production is taking place under cleanroom conditions today and tomorrow.
04/02/2013 — Nitronex welcomes new VP of engineering
Nitronex, a designer and manufacturer of gallium nitride (GaN) based RF solutions for high performance applications, has named David W. Runton as its new Vice President of Engineering.
04/02/2013 — Clariant acquires Nano-Silver Ink Technology from Bayer
Swiss specialty chemicals group Clariant International AG acquired the nano-silver ink technology platform developed under the trademark Bayink from Bayer Group, Germany.
04/02/2013 — GLOBALFOUNDRIES demonstrates 3D TSV capabilities on 20nm technology
GLOBALFOUNDRIES today announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications.
12/29/2011 — Diodes keeps MOSFETs cool with new package
Diodes Incorporated (Nasdaq:DIOD) began packaging MOSFETs in the miniature DFN1212-3 package for cooler operation than the equivalent-footprint SOT723 package.
12/29/2011 — IEST cleanroom apparel doc update includes measurement guide
The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.
12/22/2011 — Microcapsules give a new take on "self-healing" chips
A group from the U. of Illinois has devised a way to identify and patch flaws in semiconductors within seconds, saving much analysis and manual fixing and sparing otherwise functioning chips from the trash heap.
12/05/2011 — EVG doubles process module space in XT Frame platform
EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool functionality. The platform will be used for all high-volume manufacturing tool offerings.
11/29/2011 — Applied Materials' Onyx treatment restores lost carbon, strengthens film structure
Applied Materials released a new film treatment, Applied Producer Onyx, that reduces the power consumption in semiconductor chips while increasing mechanical strength. The product targets the challenges associated with 3D packaging applications and technologies.
11/23/2011 — DAC seeks speakers bureau experts
The Design Automation Conference (DAC) is soliciting semiconductor industry experts for participation in invited sessions, panels, and other events at the 49th DAC, June 3-7, 2012 in San Francisco, CA.
12/12/2011 — SEMICON West 2012: Submit an abstract today
SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.
12/07/2011 — imec's IEDM papers reach "record number"
imec is presenting a record number of 17 papers at the IEEE International Electron Device Meeting (IEDM), ending today in Washington, DC.
11/15/2011 — Applied Materials' 2011 supplier awards
Applied Materials Inc. (Nasdaq:AMAT) presented five companies with awards for helping Applied meet its strategic business goals in 2011.
09/15/2011 — Negative 2011 semiconductor industry growth is possible, warns Gartner
Jim Walker, VP, Research of Semiconductor Manufacturing and Emerging Technologies, at Gartner, speaks with Solid State Technology about revising Gartner
08/30/2011 — SEMICON Taiwan preview: Forums span key technology, markets
SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.
08/12/2011 — Inside Leti: FDSOI, 3D packaging, Si photonics work
Laurent Malier, CEO of Leti, described the research group's work and the outlook on fully depleted silicon on insulator (FDSOI), 3D packaging technologies, and integrated photonics on silicon.
10/24/2011 — Present at VLSI Technology and Circuits
The 2012 Symposia on VLSI Technology & Circuits, to be held in Hawaii, June 12-14 (Technology) and 13-15 (Circuits), will accept innovative, original work on microelectronics, ranging from gate stacks and advanced lithography to 3D packaging.
10/13/2011 — SEMI honors industry leaders at SEMICON Europa
SEMI honored Dr. Tibor Pavelka (Semilab) with the European SEMI Award; Heinz Kundert (SEMI Europe) with the IC Industry Award for Excellence; and Christian Prischmann (UIbrich) with the SEMI Europe Standards Leadership Award.
09/28/2011 — Graphene races CNT for nanomaterial commercialization
Both graphene and carbon nanotubes (CNT) suit applications from flexible displays to silicon-replacing transistors. In a relatively short time, graphene has emerged as a low-cost, tunable material for all kinds of electronics. Will graphene overtake CNTs as the nanomaterial of future devices?
12/26/2011 — MEMS die size grows, test evolves, and other trends
Yole studies the evolution of inertial MEMS and magnetometers and provides reverse costing analysis of the MEMS devices in "Technology Trends for Inertial MEMS." The report considers 23 MEMS devices.
10/11/2011 — STMicroelectronics uses TSV in high-volume MEMS devices
STMicroelectronics (NYSE:STM) has implemented through-silicon vias (TSV) in high-volume micro electro mechanical system (MEMS) devices. ST is using TSV in its smart sensors and multi-axis inertial modules.
10/17/2011 — iPhone 4S first with 5-lens autofocus camera, other component changes
IHS and Chipworks share details from their preliminary teardowns of the Apple iPhone 4S. The device resembles an iPad/iPhone hybrid, and the 5-lens autofocus camera module is the first IHS has encountered in a smartphone.
10/21/2011 — Imec wafer-level MEMS packaging relies on nanoporous alumina membrane
Imec engineers have simplified the thin-film wafer-level MEMS packaging process with nanopores that prevent leaks into the package and a low-temperature processing approach.
11/25/2011 — SUSS MicroTec partners for health research
SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announces the cooperation with Swansea University´s Centre for NanoHealth (CNH).
12/05/2011 — AMAT BSI image sensor CVD tool operates at low processing temps
Applied Materials Inc. (AMAT) launched the Applied Producer Optiva chemical vapor deposition (CVD) system for back-side-illuminated (BSI) image sensor manufacturing. It deposits low-temperature conformal films that boost the low-light performance of the sensor while improving its durability.
11/02/2011 — Silex MEMS TSV tech licensed to Nanoshift
Silex Microsystems licensed its Silex Sil-Via through-silicon-via (TSV) packaging platform to Nanoshift for use in early development of complex MEMS products.
11/02/2011 — MEMS alternatives for miniature auto-focus cameras
Dr. Giles Humpston, Tessera, presents the free, on-demand webcast Lens Tilt in Small Auto-Focus Cameras. Dr. Humpston covers the dominant auto-focus miniature camera technology today -- VCM -- and an improved technology based on MEMS, which is being commercialized now.
11/03/2011 — BSI image sensors avoid distortion with Ziptronix bonding process
Ziptronix ZiBond direct bonding process contribute minimum distortion in backside illuminated (BSI) image sensors because of its low-temperature processing and high bond strength, the company reports.
11/08/2011 — MEMS packaging and test project aims for space
The Heterogeneous Technology Alliance in Europe is developing new packaging and test methods for MEMS targeting space missions.
11/16/2011 — US atmospheric plasma tech company joins Precision Mechatronics
Precision Mechatronics Pty Ltd acquired Surfx Technologies, which specializes in high-speed atmospheric plasma technology for MEMS, microfluidics, semiconductors, solar cells, medical devices, and other manufacturing.
06/05/2012 — ST packages MEMS in plastic for reliability and form factor upgrade
June 5, 2012 -- Semiconductor supplier STMicroelectronics (ST, NYSE:STM) is now mass manufacturing its micro electro mechanical system (MEMS) microphones in plastic packages. Plastic packaging increases durability for consumer and professional end-use sectors, in mobile phones, tablets, headphones and more. The technology also saves space in the device compared to[...]
06/11/2012 — Tohoku University and imec partner to advance research
Tohoku University of Sendai, Japan and imec signed a collaboration agreement during the Belgian economic mission to Japan, expanding their R&D into areas such as MRAM and 3D semiconductor packaging.
06/20/2012 — High-volume MEMS manufacturer adds FOGALE metrology tool
A major high-volume MEMS maker has purchased a FOGALE nanotech T-MAP DUAL 3D 200A for its US manufacturing facility. The tool will be equipped with 2 load ports and will be fully automated.
11/01/2012 — X-Fab takes majority stake in MFI, widens MEMS portfolio to support growth push
X-Fab Silicon Foundries says it has become the majority shareholder in German MEMS Foundry Itzehoe GmbH (MFI), the latest in a series of recent moves to raise its profile as a top MEMS foundry.
08/15/2012 — MEMS Industry Group plans webinars on fab challenges, applications, more
The MEMS Industry Group (MIG) is planning webinars on micro electro mechanical systems (MEMS) from packaging challenges to how MEMS can benefit healthcare.
08/21/2012 — Wafer-level optics maker orders Heidelberg Instruments lithography tool
Heptagon, wafer-level optics maker, ordered an advanced DWL 2000 maskless lithography system from Heidelberg Instruments. The tool has sophisticated Gray Scale Exposure capability.
10/02/2012 — GlobalFoundries to fab Sand 9's MEMS timing products
Sand 9 is partnering with GlobalFoundries for high-volume manufacturing of its microelectromechanical systems (MEMS) timing technology, which incorporates silicon-on-insulator (SOI) and through-silicon vias (TSV).
04/13/2012 — MEMS and microelectronics undergo contactless delamination tests at Georgia Tech
April 13, 2012 -- Georgia Institute of Technology researchers have used magnetic repulsion force as a fixtureless, noncontact tool for measuring the adhesion strength between thin films in microelectronic devices, photovoltaic cells, and micro electro mechanical systems (MEMS). The magnetically actuated peel test (MAPT) could help electronics engineers understand and[...]
05/03/2012 — Micropelt raises EUR6.5M for wafer-based energy harvesting technology
Micropelt has raised EUR6.5 million for the roll-out and global expansion of its thin-film thermoelectric energy harvesting technology: EUR5 million by Ludgate Environmental Fund (LEF); EUR1 million from the MUCAP; and EUR0.5 million by the existing shareholders IBG/Goodvent, KfW, L-Bank and SHS.
07/10/2012 — SUSS coating/developing platform suits MEMS, packaging, LED fab, more
SUSS MicroTec uncrated the third generation of the ACS200 Coating and Developing Platform, developed from the company’s ACS200Plus and Gamma platforms for a compact, highly precise MEMS, LED, and related fab tool.
07/11/2012 — MiQro Innovation Collaborative Center adds process tools, MES to MEMS facility
The MiQro Innovation Collaborative Centre (C2MI) is improving its state-of-the-art MEMS facility with Eyelit Manufacturing software to support R&D and the commercial activities of sponsor companies. C2MI is also installing a suite of new wafer processing tools from SPTS Technologies.
01/03/2012 — JCAP, Enpirion partner on MEMS manufacturing
Enpirion, Inc. entered into a strategic partnership agreement with JiangyinChangdian Advanced Packaging Co., Ltd. (JCAP) for the manufacturing of silicon-based magnetics utilizing Enpirion's proprietary micro electronic magnetic silicon (MEMS) technology.
01/23/2012 — Silex devs wafer-level MEMS fab technologies for mobile devices
Silex Microsystems joined Energy-efficient Piezo-MEMS Tunable RF Front-End Antenna Systems for Mobile Devices to develop TSVs, PZT thin films, and other technologies for high-performance RF systems targeting mobile devices.
01/24/2012 — Si-Ware platform creates MOEMS on-wafer with lithographic alignment
Si-Ware Systems debuted the SiMOST platform to fab and package single-chip optical systems with validated MEMS components. Multiple MOEMS structures can be patterned and etched on SOI wafers using DRIE. The structures are then wafer-level packaged and diced.
02/06/2012 — Nextreme brings thin-film on-par with bulk thermoelectrics
Nextreme Thermal Solutions announced that its thin-film thermoelectric technology has achieved a 60.1°C temperature difference between its cold and hot sides at an ambient temperature of 24.7°C, bringing it on par with the performance of bulk thermoelectric technology.
02/13/2012 — CMOS image sensors keep pushing CCDs out of the picture
CMOS image sensors in 2011 continued to push CCD sensors into a smaller, isolated section of the market. CMOS image sensors are growing on use in mobile electronics and emerging applications, shows analyst firm IHS, and will find more adoption as back-side illumination costs come down.
09/25/2013 — 3D-IC: Two for one
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about upcoming events related to 3D ICs.
08/06/2013 — STI Certified Electronics appoints new VP of business development
STI Certified Electronics announced the appointment of Jim Panfil as Vice President of Business Development.
08/06/2013 — ISSI announces 72Mb Synchronous SRAM family
Integrated Silicon Solution, Inc. today announced the sampling of its new family of 72Mb Synchronous SRAMs.
08/06/2013 — Samsung starts mass producing industry’s first 3D vertical NAND flash
New technology represents a breakthrough in overcoming NAND scaling limit and ushers in a new 3D memory era.
08/06/2013 — After 43 years, DRAM market finally reaches maturity
DRAM capex as a percent of sales forecast to reach all-time low in 2013.
08/06/2013 — Monolithic 3D is now in production: Samsung starts mass producing first 3D vertical NAND flash
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about Samsung's recent announcement on 3D vertical NAND.
08/05/2013 — Ultratech/Cambridge NanoTech expands operations
Ultratech, Inc. announced last week that it has moved Ultratech/Cambridge NanoTech to Waltham, Mass.
08/05/2013 — Graphene sees explosive demand in a variety of industries
Graphene has moved swiftly from the research laboratory to the marketplace, driven by demand from markets where advanced materials are required.
08/05/2013 — Crossbar unveils resistive RAM with simple, three-layer structure
Crossbar, Inc., a start-up company, unveiled a new Resistive RAM (RRAM) technology that will be capable of storing up to one terabyte (TB) of data on a single 200mm2 chip.
08/05/2013 — SEMATECH and SILVACO collaborate on advanced modeling tool development
SEMATECH today announced that Silvaco, Inc., a provider of Technology Computer Aided Design and Electronic Design Automation (EDA) software, has joined SEMATECH to collaboratively develop advanced modeling and simulation tools.
08/02/2013 — Spansion and XMC announce licensing agreement
Spansion Inc., a developer of Flash memory-based embedded systems solutions, and XMC, China's fastest growing 300mm semiconductor foundry, today announced an agreement for XMC to license Spansion's floating gate NOR Flash technology.
08/05/2013 — First half of 2013 shows big changes to top 20 semiconductor supplier ranking
Later this month, IC Insights’ August Update to the 2013 McClean Report will show a ranking of the top 25 semiconductor suppliers in 1H13.
08/01/2013 — Micron and Elpida announce closing of sponsor agreement transactions
Micron Technology, Inc. and Elpida Memory, Inc. trustees announced today the closing of Micron’s acquisition of 100 percent of Elpida’s equity, pursuant to a Sponsor Agreement entered into on July 2, 2012 in connection with Elpida's corporate reorganization.
08/01/2013 — Monolithic 3D is now on the roadmap for 2019
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about the appearance of 3D integration on several roadmaps.
08/05/2013 — Analyst: Image sensors market in U.S. will reach USD 3.7 billion in 2017
The U.S. image sensors market was worth USD 2.0 billion in 2011 and is forecasted to reach USD 3.7 billion in 2017 at a CAGR of 11.1 percent from 2011 to 2017.
08/05/2013 — Quarterly semiconductor sales increase 6%, outperforming industry forecast
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $74.65 billion during the second quarter of 2013, an increase of 6 percent from the first quarter when sales were $70.45 billion.
08/14/2013 — Samsung introduces world’s first 3D V-NAND-based SSD
Samsung today introduced the first solid state drive (SSD) based on its recently released 3D V-NAND technology. Samsung announced its new SSD, designed for use in enterprise servers and data centers, during a keynote at the Flash Memory Summit 2013.
08/13/2013 — Tablet and cellphone processors offset PC MPU weakness
Total microprocessor sales are forecast to rise 8 percent in 2013 and reach $61.0 billion.
08/07/2013 — SSD market scores big in Q1, thanks to Ultrabooks and PC tablets
Solid-state drives (SSD) got a huge push in the first quarter from greatly expanded usage in ultrathin/Ultrabook PCs as well as in PC tablets, where shipment volume to those sectors tripled within a year’s time in a mighty display of growth,
08/07/2013 — Magnetic switching simplified
An international team of researchers has described a new physical effect that could be used to develop more efficient magnetic chips for information processing.
08/12/2013 — Everspin raises $15M growth financing
Everspin Technologies today announced that it has closed a Series B financing, raising $15 million to accelerate growth in the enterprise storage market and support the launch of its ground-breaking Spin-Torque MRAM (ST-MRAM) products.
08/12/2013 — Adapteva introduces Parallella University Program
Advanced semiconductor and computer manufacturer Adapteva today introduced its Parallella University Program (PUP) for academic institutions that conduct leading parallel programing research and/or education.
08/12/2013 — New insights into the polymer mystique for conducting charges
For most of us, a modern lifestyle without polymers is unthinkable…if only we knew what they were.
08/07/2013 — Second quarter shows increase in silicon wafer shipments
Worldwide silicon wafer area shipments increased during the second quarter 2013 when compared to first quarter 2013 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
08/08/2013 — Diving deep — because materials matter
A note from Karen Sevala, president, SEMI Americas.
08/14/2013 — The positive sides of doping
Flexible thin film solar cells that can be produced by roll-to-roll manufacturing are a highly promising route to cheap solar electricity.
08/14/2013 — Second quarter graphics chip shipments: AMD tops the chart, Intel is up, Nvidia is down
While the news was disappointing year-to-year, the news was encouraging quarter-to-quarter.
08/13/2013 — Primoceler develops world’s first sapphire-to-sapphire welding machine
New technology allows process even more difficult than glass-to-glass welding, expanding the ways in which industries can take advantage of the versatile and popular sapphire.
08/19/2013 — Bruker appoints Thomas Bachmann as president of the Bruker BioSpin Group
Bruker Corporation today announced the appointment of Thomas Bachmann as the new president of its Bruker BioSpin Group.
08/15/2013 — Despite challenges, industrial semiconductor market reports positive Q1
The market for semiconductors used in industrial electronics applications relished a better-than-expected first quarter as macroeconomic headwinds turned out to be less severe than initially feared.
08/15/2013 — Applied Materials names Gary E. Dickerson as CEO
Michael R. Splinter will serve as executive chairman.
08/15/2013 — Toshiba honored with Best of Show Award at Flash Memory Summit
The Storage Products Business Unit of Toshiba is pleased to announce that its solid state hybrid drive (SSHD) series has been honored with a Best of Show Award at this year’s Flash Memory Summit.
08/26/2013 — Anapass announces mass production of leading-edge LCD panel controller
Anapass, Inc, a display SoC solution provider, today announced that it has successfully completed development of a leading-edge panel controller system on chip “SoC” for UHD TV applications and has recently started mass production.
08/23/2013 — MTPV Power Corp. receives top award at SEMICON West’s Silicon Innovation Forum
MTPV received the Top Pitch award for its breakthrough technology for converting heat to electricity using semiconductor chips as judged by several industry professionals, strategic partners and investors at SEMICON West’s Silicon Innovation Summit held in July of this year.
08/23/2013 — SunEdison to spin off semiconductor business in solar push
SunEdison Inc said it would spin off its semiconductor business in an initial public offering and use the proceeds to build solar farms.
08/22/2013 — $5.2B in printed electronics is expected to be sold in 2015
The total applied market created by printed electronics technology is expected to grow at a compound annual growth rate (CAGR) of 47 percent to $24.3 billion by 2020 from $3.3 billion in 2013
08/27/2013 — Lone Japanese semiconductor supplier ranked among top 10 in 1H13
Competitive pressures, collapse of vertically integrated business model, increasing "asset-lite" strategies lead to Japan mergers, spinoffs
08/27/2013 — RFMD surpasses shipment milestone with breakthrough CMOS power amplifiers
RFMD today announced it has shipped more than one million RF7196D high-power, high-efficiency CMOS power amplifiers (PAs).
08/27/2013 — TSMC becomes the largest semiconductor supplier in the world in 2Q13
Share of total IC market by foundry-produced devices is forecast to reach over 45 percent in 2017.
08/28/2013 — TowerJazz announces the creation and accreditation of Jazz Semiconductor Trusted Foundry
Expands support for the US Aerospace and Defense market in its Newport Beach, CA facility
08/28/2013 — Entegris and imec collaborate on 3D wafer handling and shipping challenges
Entegris, Inc. and imec announced they are collaborating to advance the development and broaden the adoption of 3D integrated circuits.
07/11/2013 — Solid State Technology and SEMI announce 2013 “Best of West” award winner
Solid State Technology and SEMI announced the recipient of the 2013 “Best of West” Award — Mentor Graphics — for its Tessent TestKompress with Cell-Aware ATPG.
07/11/2013 — Growing opportunities in the Asian secondary semiconductor equipment market
Bruce Kim, CEO of SurplusGLOBAL, expects a slight upturn in the Asian Secondary Semiconductor Equipment Market at Semicon West.
07/11/2013 — Continued strength of Taiwan’s semiconductor market on display
SEMICON Taiwan is set to open in September amidst an improving global and regional outlook for 2013 and 2014 that sees Taiwan remaining the largest and strongest market for semiconductor manufacturing.
07/10/2013 — SEMI Standards honors industry leaders at SEMICON West 2013
SEMI honored 14 industry leaders for their outstanding accomplishments in developing standards for the microelectronics and related industries. The SEMI Standards awards were announced at a reception held during SEMICON West 2013.
07/10/2013 — Mobile PC market suffers worst Q2 performance in more than a decade
Battered by the nonstop onslaught of media tablets, the mobile PC market in 2013 delivered the worst second-quarter performance in 11 years.
07/10/2013 — Memory and foundry account for more than half of worldwide IC capacity
Memory and foundry account for more than half of worldwide IC capacity.
07/10/2013 — Leti and EV Group launch a common lab on wafer bonding technologies
Project targets more efficient 3D TSV integration and covalent bonding at room temperature
07/09/2013 — Dow Corning joins imec for advancement of enabling technologies for 3D-IC
Dow Corning announced Monday that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics.
07/09/2013 — EV Group announces strong growth and new manufacturing processes at SEMICON West 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved strong revenue growth and expanded its headcount for the first half of 2013.
07/09/2013 — Alchimer signs collaboration with CEA-Leti
Alchimer, S.A. today announced a collaboration with the French research institute CEA-Leti to evaluate and implement Alchimer's wet deposition processes for 300mm high-volume manufacturing.
07/09/2013 — SEMI sees 21% increase in chip equipment spending for 2014
SEMI forecasts semiconductor equipment sales will reach $43.98 billion in 2014, a 21 percent increase over estimated 2013 equipment spending.
07/09/2013 — SEMICON West keynoter outlines The Big Five Challenges of the semiconductor industry
When Ajit Manocha, GlobalFoundries CEO, polled his audience during his keynote address on Tuesday at SEMICON West 2013, nearly 60 percent of the audience believed that the biggest challenge facing the semiconductor industry was the economy. However, during his presentation, Manocha seemed to suggest otherwise.
07/10/2013 — SEMICON West R&D panel discusses the future of semiconductor technology
Leaders of research consortia from around the world sat down to share updates and insights with SEMICON West attendees on Wednesday morning.
07/16/2013 — SRC and Environmental Research Center create new cyclic purge technique
Researchers sponsored by Semiconductor Research Corporation (SRC), the world's leading university-research consortium for semiconductors and related technologies, today announced that they have developed a more efficient purge technique that reduces the consumption of ultra-high purity (UHP) purge gases by more than 20 percent during the production of semiconductors.
07/16/2013 — Micron unveils 16nm Flash memory technology
World’s smallest semiconductor process node will feed the storage demands of consumer applications and data centers.
07/17/2013 — SEMI announces Vietnam Semiconductor Strategy Summit
Executives from the world’s leading microelectronics companies will meet with delegates representing Vietnamese government, academia, research, and industry to explore and discuss the key strategies and opportunities in the growing Vietnam semiconductor industry at the SEMI Vietnam Semiconductor Strategy Summit.
07/17/2013 — Cornucopia of choices spurs smartphone market to double by end of 2017
With most of the top brands introducing new flagship models in the first half of 2013, smartphone buyers now have more choices than ever, a phenomenon that will contribute to an expected doubling in market shipments from 2012 to 2017.
07/16/2013 — Waves of change in advanced electronics materials to be explored at SEMI Strategic Materials Conference 2013
The latest trends, challenges and business opportunities in advanced materials for semiconductors, MEMs, power devices, storage, and other electronic devices will be addressed at the 2013 SEMI Strategic Materials Conference (SMC), to be held on October 16-17 at the Santa Clara Marriott in Silicon Valley, California.
07/02/2013 — SEMI recognizes GLOBALFOUNDRIES CEO
SEMI today announced that Ajit Manocha, CEO of GLOBALFOUNDRIES, has been selected to receive the “SEMI Outstanding EHS Achievement Award — Inspired by Akira Inoue.”
07/02/2013 — Options for adding memory and logic to printed or flexible electronics
Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.
07/02/2013 — Getting ready for 10/100/20 – Europe’s manufacturing initiative is underway
Europe’s recently launched industrial strategy to reinforce micro- and nanoelectronics manufacturing is more than just a vision — it’s a major opportunity for equipment and material suppliers to participate to large-scale investment projects, increase their holding in key technologies and reach out to new customers and markets.
07/01/2013 — Samsung exec speaks on future innovations
The future is bright for the future semiconductor and IT industry, according to Samsung exec Yoon Woo (Y.W.) Lee. In a keynote talk at The ConFab, Mr. Lee described a future with dramatic advances in almost every field, including healthcare, nano, energy and the environment, all powered by semiconductors
07/02/2013 — Imec solves metallization issues in advanced interconnects for the sub-1X technology node
This technology paves the way towards interconnect Cu metallization into the 7nm node and beyond.
07/24/2013 — Foreign IC companies to represent 70% of China’s IC production in 2017
China’s total IC production is forecast to represent only 6% of the worldwide IC market in 2017.
07/22/2013 — OEM chip spending returns to growth in 2013
After a flat year in 2012, global purchasing of semiconductors by the world’s top electronic brands is set to return to growth in 2013, as Apple Inc. and Samsung Electronics contend to claim the title of biggest spender.
07/22/2013 — Cree SiC MOSFETs to be incorporated into advanced power suppliers from Delta Elektronika
Cree, Inc. announces that its 1200 V SiC MOSFETs are being incorporated into the latest advanced power supplies from Delta Elektronika BV.
07/17/2013 — Hybrid Memory Cube nears engineering sample milestone
Engineering samples of The Hybrid Memory Cube (HMC) are expected this summer, with high volume manufacturing coming next year. It will be one of the first high volume devices employing 3D integration and through silicon vias (TSVs), employing a bottom logic layer and 4-8 stacked DRAM layers.
07/19/2013 — Book-to-bill ratio: Six consecutive months above parity
North America-based manufacturers of semiconductor equipment posted $1.33 billion in orders worldwide in June 2013 (three-month average basis) and a book-to-bill ratio of 1.10.
07/18/2013 — Thin is in: Sales of slender hard disk drives soar as PCs slim down
A new generation of thin hard disk drives (HDD) only 5.0 and 7.0mm thick are expected to enjoy fast sales growth in coming years, as mobile computers including ultrathin PCs and PC tablets drive up demand by a factor of more than 25 from 2012 to 2017.
07/18/2013 — Brewer Science: Simpler bonding/debonding process needed
A variety of techniques and materials have been developed to successfully achieve bonding/debonding for 3D integration, but Tony Flaim, chief technology officer of Brewer Science (Rolla, MO) says they are still too complicated.
07/24/2013 — Rudolph announces new metrology suite for advanced packaging
Rudolph Technologies, Inc., a provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations of its industry-leading NSX 320 Automated Macro Defect Inspection System.
07/23/2013 — Dialog Semiconductor announces Richard Beyer as new chairman of the board
Dialog Semiconductor plc, a provider of highly integrated power management, audio, AC/DC and short-range wireless technologies today announced that Richard Beyer, appointed to the board in February this year, as an independent non-executive director, will succeed Gregorio Reyes as chairman of the board. Greg will continue to serve as a board member.
07/23/2013 — European-Japanese collaboration focuses on ‘Cloud of Things’ to support smart cities
CEA-Leti today announced that a group of European and Japanese companies, research institutes, universities and cities will work together in the ClouT project to deliver ways for cities to leverage the Internet of Things (IoT) and cloud computing – to become smart cities.
07/25/2013 — EU FP7 continues to support Europractice IC services
Together with its partners STFC and Fraunhofer IIS, imec announced today that the European Commission has pledged to continue funding the Europractice IC services for another three years under the Seventh Framework Programme (FP7).
07/31/2013 — Amkor completes acquisition of Toshiba’s Malaysian semiconductor packaging and test operations
Toshiba Corporation and Amkor Technology, Inc. today announced that the companies have completed Amkor’s acquisition of Toshiba Electronics Malaysia Sdn. Bhd., Toshiba’s semiconductor packaging operation in Malaysia.
07/31/2013 — EUV vs TSV: Which one will become production ready first?
Israel Beinglass, CTO of MonolithIC 3D Inc., blogs about roadmap misses and the relationship between two seemingly unrelated technologies.
07/26/2013 — Spansion announces new family of flash memory devices
Spansion Inc. today announced production of a new family of 16 Mb, 32 Mb and 64 Mb Spansion FL-1K Serial Flash memory devices.
07/26/2013 — Samsung now mass producing industry’s fastest embedded memory
Samsung announced today that it is mass producing the world’s fastest embedded memory – the industry’s first eMMC 5.0 devices – in 16 gigabyte (GB), 32GB and 64GB densities for next-generation smartphones and tablets.
08/01/2013 — Cascade Microtech and imec successfully probe 25µm-diameter micro-bumps
Cascade Microtech, Inc. and imec today announced breakthroughs in probing stacked integrated circuits (3D-SICs), fueling an important growth engine for the semiconductor market.
07/30/2013 — IDC forecasts worldwide semiconductor revenue will grow 6.9% in 2013
Semiconductor revenue worldwide will see improved growth this year of 6.9 percent and reaching $320 billion according to the mid-year 2013 update of the Semiconductor Applications Forecaster (SAF) from International Data Corporation (IDC).
07/30/2013 — Applied Materials CEO receives 2013 SIA Robert N. Noyce Award
Mike Splinter, chairman and chief executive officer of Applied Materials, was awarded the 2013 Robert N. Noyce Award, presented annually by the Semiconductor Industry Association, for outstanding achievement and leadership in support of the U.S. semiconductor industry. Splinter has been on the SEMI International Board of Directors since 2005.