12/24/2012 — Lifting the veil on silicon interposer pricing
Are we closer than we think to our needed mass production costs for silicon interposers? Phil Garrou gleans some insights from the year-ending RTI Architectures for Semiconductor Integration and Packaging conference.
11/20/2012 — Will the $2 interposer be silicon or glass?
Dr. Phil Garrou reports from the 2nd annual Georgia Tech 2.5D Interposer Conference: what's the market projection for silicon and glass interposers, what's preventing high-volume manufacturing, and is there a crossover with flat-panel display glass manufacturing?
11/07/2012 — Deca tips new M-Series chip-scale packaging offering
Deca Technologies has introduced a new chip-scale packaging (CSP) product line for applications where its existing wafer-level CSP option isn't a good fit. Details and analysis to come.
10/22/2012 — ICECool puts 3D thermal issues back in focus
With the approach of full commercial production of 3DIC products, Dr. Phil Garrou shifts his attention to thermal performance questions and proposed thermal solutions for the future.
10/12/2012 — Why SATS consolidation needs to happen
The advent of leading-edge semiconductor packaging technologies dictates efficient use of capital, and only the top-tier semiconductor assembly and test services (SATS) companies will have the financial wherewithal to develop required expertise and capacity, says one analyst.
09/19/2012 — SPTS unveils low-temp PECVD cluster tool for 3D ICs
SPTS' Delta fxP cluster system achieves low-temperature deposition of TEOS oxides and nitrides for via-reveal passivation in 3D IC packaging, solving two key problems of low temperatures and bonding adhesive outgassing.
09/10/2012 — EVG updates modular coater/developer with OmniSpray, NanoSpray coating options
EV Group's updated modular EVG150 high-volume coater/developer adds new modules for conformal coating of high topography surfaces, and coating surfaces with vertical sidewall angles, such as through-silicon vias (TSV).
09/04/2012 — FormFactor to acquire Microprobe, creates top probe card supplier
Wafer probe card maker FormFactor has agreed to acquire fellow probe card supplier MicroProbe, with a combined entity rivaling top-seller Micronics in the high-growth probe card market.
04/18/2012 — ASMC will focus on productivity and technology challenges
The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “Competing for R&D Dollars,” moderated by Solid State Technology Editor-in-Chief Pete Singer.
05/02/2012 — Top 50 “internet of things” applications
Libelium, a wireless sensor networks platform provider, has released a list of 54 sensor applications for a smarter world, covering the most disruptive sensor and “internet of things” applications.
11/09/2012 — SMC 2012: Supply chain opportunities in OLEDs, energy storage, and power semiconductors
Materials experts from across the supply chain gathered at the 2012 Strategic Materials Conference 2012 in San Jose in October, discussing key materials needs for micromanufacturing outside the CMOS mainstream: OLEDs and GaN-on-silicon power semiconductors, graphene, CNTs, and self-assembling polymers.
11/08/2012 — Advancing CNTs for next-gen chips
Researchers from IBM and Georgia Tech have disclosed significant progress in manipulating carbon nanotubes in transistors and interconnects, in ways compatible with traditional fabrication techniques, advancing toward using the materials for next-generation devices.
11/06/2012 — September IC sales bounce in Americas, tracking to -4% for FY2012
A big boost in demand in the US helped ratchet up chip sales growth in September, according to the latest data from the Semiconductor Industry Association (SIA), but annual growth is on pace for a -4% decline from 2011.
11/06/2012 — GSA working group evaluates new semiconductor startup models to attract investors
The Global Semiconductor Alliance (GSA) has formed a new working group and identify various alternatives to encourage startups to innovate, woo investors, generate returns, and keep generating sustainable industry M&A.
11/05/2012 — OLED TV panels' breakout year delayed, but it's coming
Despite continued delays from its two big proponents, OLED TV technology will finally start ramping over the next year, reaching one million unit shipments in 2014 and a 3% market penetration by 2016, says NPD DisplaySearch.
11/05/2012 — US semiconductor industry employs nearly 250,000 workers
Hours away from the US presidential election, here's one last message about jobs and growth in the semiconductor sector.
11/02/2012 — OLED lighting sales could reach $1.7B by 2020 -- if panel makers commit now
There's a new battleground slowly emerging for OLEDs in lighting applications where the technology could offer some advantages in design and efficiency -- if panel makers are willing to make some sacrifices.
10/31/2012 — Applied unveils new PVD, PECVD tools for display manufacturing
Applied Materials has announced two new tools for display manufacturing: one with a new design for depositing IGZO films for TFTs, the other handling bigger LTPS-deposited substrates to help lower manufacturing costs.
10/29/2012 — Why the new Windows 8 won't spur DRAM sales
In a departure from past iterations, Windows 8 will not cause any significant rise in DRAM unit shipments, predicts IHS iSuppli.
10/30/2012 — After worst-ever 2012, FPD equipment to see a brighter 2013
This year is shaping up to be a historically lousy year for makers of flat-panel display (FPD) manufacturing equipment, but expectations are looking up that demand will catch up to supply in 2013 and balance the market, according to NPD DisplaySearch projections.
10/26/2012 — Comm, auto apps are now driving the IC market
Communications applications are far and away the leading growth market for ICs over the next five years, and PCs and consumer applications have fallen far back in the pack.
10/24/2012 — Why node shrinks are no longer offsetting equipment costs
Semiconductor manufacturers can expect equipment costs to increase about 15% for each new process node, but previously enjoyed advantages of moving to smaller feature sizes are no longer offsetting those costs -- even with a 450mm wafer transition.
10/23/2012 — Wafer shipments back on track: Inside the numbers
Wafer demand is slowly turning back toward growth, and a closer look at the numbers from SEMI and Semico Research shows what's behind the trends -- and why they give purchasing managers headaches.
10/18/2012 — Flat-panel displays rebounding in 2012 as prices fall, performance rises
Worldwide flat-panel display (FPD) revenues will reach a record $120 billion in 2012, up 8% from a challenging year in 2011, and the recovery is entirely on the backs of TFT-LCDs and AMOLED displays, according to NPD DisplaySearch.
10/18/2012 — European consortia, ASML, supplier network plan for 450mm transition
At SEMICON Europa, European government representatives, consortia, and suppliers discussed programs to support and participate in the 450mm wafer-size transition -- including a comprehensive presentation from ASML about its roadmap for 450mm EUV platforms.
10/17/2012 — ASML buying Cymer to push EUV litho development
Pulling Cymer's EUV source technology in-house is hoped to accelerate progress in the technology's long slow march toward production readiness.
10/17/2012 — Intel offers muted optimism in 3Q12 results, but cutting capex
Intel spoke of caution in end markets when discussing its 3Q12 results, but a big dip in capex and lack of 2013 visibility will likely cause concern in the semiconductor manufacturing ecosystem.
12/11/2012 — IEDM 2012: Late papers on silicon photonics, large TFTs, III-V devices
With this week's IEEE International Electron Devices Meeting (IEDM 2012) now underway, here are four of the papers that were accepted late: on 90nm integrated silicon photonics, ZnNO for next-gen displays, and III-V TFETs for the 7nm node.
12/11/2012 — IEDM: Nanoelectronics provide a path beyond CMOS
At the International Electron Devices Meeting in San Francisco, An Chen of GLOBALFOUNDRIES presented a survey of emerging nanoelectronic devices, which he divided into two categories: Charge-based and non-charge based.
12/11/2012 — IEDM keynote: It tastes like chicken
Attendees at this year’s International Electron Devices Meeting (IEDM) were delighted and perhaps somewhat horrified when the plenary speaker popped some electronics gear in his mouth and proclaimed, “It tastes like chicken!”
12/10/2012 — Sony and Toshiba fight declines with chip spending -- can it work?
Despite weak financial performances, sluggish global markets and strong regional competition, Japanese consumer electronics giants Sony and Toshiba are increasing their investments in new products to revitalize their businesses.
12/07/2012 — AMD-GlobalFoundries' new wafer deal: What it means
A new wafer supply deal between AMD and GlobalFoundries will free up cash in the near-term, but industry watchers fear that long-term issues still loom.
12/06/2012 — SEMI: Chip equipment slump extending into 2013, across-the-board rebound in 2014
Semiconductor equipment demand is persistently sluggish as the industry takes a break from a "multiyear expansion period" to digest recent investments and wrestle with a broader economic slowdown, acknowledges SEMI in its updated year-end forecast. But make no mistake: leading-edge technology investments are still happening, and growth will return in the typical cyclical pattern.
11/15/2012 — Mapping the mismatch in the LCD TV supply chain
NPD DisplaySearch's examination of the projected 2013 LCD TV panel product mix finds some big differences between what suppliers offer and what buyers want.
11/12/2012 — ICPT 2012: Five themes summarizing CMP work and progress
This year's International Conference on Planarization/CMP Technology (ICPT) encompassed five themes describing use of CMP: new device structures, equipment and methods, Cu interconnects, consumables, and new CMP methods and processes.
11/29/2012 — IDTechEx forecasts a $100 million graphene market in 2018
Despite graphene's promise as a material in future electronics with excellent properties in almost all applications, it still faces difficulties in market acceptance, according to a report from IDTechEx.
11/28/2012 — Black Friday impressions: Bargains, bigger TVs, and Walmart's muscle
NPD DisplaySearch analyst Paul Gagnon took the pulse of consumer shoppers on Black Friday and came away with three observations: bargains are a priority, consumers want bigger upgrades, and Walmart flexed its muscles.
11/27/2012 — LED market for indoor residential lighting poised to surge
Technology improvements and supportive legislation are gathering momentum to help push LED adoption for residential buildings -- the largest lighting application sector.
11/26/2012 — Global GDP, smartphones bode good tidings for semiconductor growth
Despite lingering clouds obscuring near-term visibility for the semiconductor manufacturing industry, signs of macroeconomic life bode well for sales of electronics devices, and by association the chip technologies that power them.
11/23/2012 — Growth outlook for industrial semiconductors dims to 3% in 2012
Growth in the industrial electronics semiconductor market is set to fall short of previous expectations in 2012 as the business is buffeted by weakening global economic conditions, with the LED market the sole bright spot, says IHS iSuppli.
11/16/2012 — Semiconductor equipment demand: Shades of 2009?
The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.
12/05/2012 — iSuppli trims chip forecast again, still expects 2013 rebound
Chip sales growth continues to soften in 2012 as the industry slips from "stagnation" to "slump," but the stage is still set for a rebound in 2013, according to updated analysis from IHS iSuppli.
12/04/2012 — IEDM 2012 slideshow: Sneak preview of 14 conference papers
We've scanned the entire conference program for next week's 58th annual IEEE International Electron Devices Meeting (IEDM), to present a quick sampling of some of the more intriguing papers.
11/30/2012 — In-cell touch, DITO tech gaining ground for mobile device displays
More than 7% of all mobile phones will use in-cell touch technology in 2012 while tablet PCs start adopting "DITO" film structures, as both technologies strive to overcome production challenges, explains NPD DisplaySearch.
12/20/2012 — Gartner: Fab equipment still getting softer, next upcycle starts in 2014
Global spending on wafer fab equipment (WFE) is now on pace to finish 2012 with a -17% annual decline, and 2013 now looks like it'll only be slightly better at a -10% dropoff, before the next cyclical spending upturn begins in 2014, according to an updated forecast from Gartner.
12/17/2012 — Samsung reaffirms plans for $4B investment in Austin fab: What it means
Samsung's reaffirmation of its planned $4B investments in its Austin, TX facilities don't offer much extra info, but do serve as a message to the market about its future plans -- with or without Apple.
12/14/2012 — Gartner reduces 2012-2013 chip outlooks, but 2014 looks better
Joining the growing chorus of industry watchers lowering their outlooks on the semiconductor sector, Gartner has reduced both its 2012 and 2013 forecasts for semiconductor sales but is remarkably more bullish on prospects in 2014.
12/13/2012 — Rudolph enters back-end lithography market
Rudolph Technologies, Inc. (Nasdaq: RTEC) has entered the back-end advanced packaging lithography market, with the acquisition of Azores Corp., and the introduction of a new 2X reduction stepper called the JetStep.
12/12/2012 — Tablet PCs are shifting supply chain strategies...can you say 100M iPads?
Increased tablet adoption, with Apple's continued dominance and emergence by new players (see Google, Microsoft) are changing the mobile PC competitive landscape -- and supply-chain partners are having to rethink their strategies to stay atop the game.
06/05/2012 — Conference Report: International Interconnect Technology Conference, IITC
The 15th IITC (International Interconnect Technology Conference) opened Monday, June 4 at the Doubletree Hotel in San Jose, CA. Recurring themes this year were variations on 3D and TSV, novel systems and packaging, and back end memory. Mike Fury reports.
09/14/2012 — iPhone 5: Which semiconductor suppliers are the big winners?
As the dust settles after the launch of the iPhone 5, analysts tally which suppliers in the semiconductor ecosphere are most likely to gain the most.
09/14/2012 — DAS tips system for safe, clean LED waste process gas disposal
DAS Environmental Expert says it has a new system that offers a more environmentally friendly way to clean waste process gases produced in LED manufacturing.
09/12/2012 — Samsung breaks ground for memory manufacturing in China
Samsung Electronics Co., Ltd., held a groundbreaking ceremony for a major new memory fabrication line in Xi'an, China. Once completed, the new facility will make use of advanced 10-19nm technology to produce NAND flash memory chips, according to the company.
09/12/2012 — LED makers urge DoE for more support
Stakeholders in LED manufacturing have met with US Department of Energy officials to plead their case for increased support in solid-state lighting (SSL) R&D and manufacturing, asserting that the technology's energy conservation benefits and ROI surpasses those of renewable energy technologies that get much more backing.
09/11/2012 — Tablets, smartphones driving turnaround in power management chips
Demand for power management semiconductors recovered in 2Q12 after declining for half a year, thanks to strong demand from electronic products such as smartphones and media tablets, according to IHS iSuppli.
09/11/2012 — TSMC, UMC sales rise in August on customer pull-ins
Taiwan's two biggest semiconductor foundries saw sales jump in August, and business for the full third quarter is looking up as customers pull in some orders.
09/07/2012 — Intel lowers 3Q outlook: What's the real driving factor?
Analysts weigh the reasons behind Intel's downwardly-revised 3Q12 results, from macroeconomic sluggishness to tablet-PC cannibalization -- and whether its pullback in 2012 capex plans spells trouble for the market overall.
09/07/2012 — Intel lowers 3Q outlook: What's the real driving factor?
Analysts weigh the reasons behind Intel's downwardly-revised 3Q12 results, from macroeconomic sluggishness to tablet-PC cannibalization -- and whether its pullback in 2012 capex plans spells trouble for the market overall.
09/07/2012 — Waiting for the next "golden year"
While various industry segments appear to be tapping the brakes, others are revving their engines, observes SEMI's Christian Gregor Dieseldorff -- and a 2012 stall could pave the way for a record-breaking 2013.
09/06/2012 — Semiconductor R&D spending rising 10% in 2012 to meet design, process challenges
Spending on R&D by semiconductor companies worldwide is expected to grow 10% in 2012 to a record $53.4 billion, as companies all across the ecosystem try to keep up with more complex IC designs and new process technologies, according to data from IC Insights.
09/05/2012 — DisplaySearch: LCD industry poised for recovery in 2012
Despite the gloomy economy and softness in consumer LCD products, suppliers of thin-film transistor liquid crystal displays (TFT-LCD) expect moderate 8%-13% growth in sales and shipments in 2012, according to DisplaySearch.
09/05/2012 — SIA: July semiconductor sales inch up, unevenly
Global semiconductor sales totaled $24.34B in July, a scant 0.2% increase from the prior month and down -1.9% from a year ago, as macroeconomic challenges weigh down demand particularly in Europe and the Americas, according to the latest monthly data from the Semiconductor Industry Association (SIA).
08/31/2012 — Technology alliance formed for glass and brittle materials processing
Three leaders in their respective fields have formed a technology alliance to bring a new glass cutting technology to market. InnoLas Systems GmbH licensed process technology developed by FiLaser LLC and will use ultra-short pulse lasers produced exclusively for InnoLas by LUMERA LASER GmbH.
08/31/2012 — Reports: Renesas targeted by investment firm KKR
US-based investment firm Kohlberg Kravis Roberts and Co. (KKR) reportedly is seeking to snap up struggling chip firm Renesas for ¥100 billion (US $1.3B)
10/15/2012 — Measuring inside an active OLED
Researchers at the National Institute of Advanced Industrial Science say they have devised a way to selectively and nondestructively evaluate molecules within a sealed organic light-emitting diode (OLED) in operation, in hopes to further understand and eventually minimize performance degradation.
10/12/2012 — From fuzzy to focused: Phase I in project development
Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.
10/09/2012 — EUV Symposium takeaways: Slow and steady progress, much improvement expected in early 2013
EUV Symposium host imec and a pair of industry analysts gauge the pace of improvements in EUV lithography and its long march toward production readiness.
10/08/2012 — Europe to unite research efforts in Silicon Europe cluster alliance
Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”
08/27/2012 — ASML adds Samsung as third chipmaker investor, closes funding plan
Lithography leader ASML completes its Co-Investment Program, tallying €3.85 billion in equity funds and €1.38B to support R&D into EUV and 450mm.
08/27/2012 — IHS iSuppli downgrades chip market outlook on PC weakness
IHS iSuppli now predicts a decline in global semiconductor revenues in 2012, the first since 2009, due to a weakening economy that has eroded demand for PCs and related components.
10/04/2012 — Analyst: Fab spending softness 2012 extending into 2013
Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.
10/03/2012 — Japan's semiconductor industry: Fabs, equipment, and materials
Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy, the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.
10/03/2012 — SIA: Chip sales essentially flat in August
Macroeconomic malaise continues to weigh down global semiconductor sales, although there's a possible ray of hope for a boost by year's end thanks to introduction of much-desired electronics devices (hello iPhone 5).
10/02/2012 — New method monitors, catalyzes semiconductor etch in real time
Researchers at the U. of Illinois have devised a method to monitor a semiconductor surface as it is etched, in real time, with nanometer precision.
10/02/2012 — LED industry shifting production to 6-inch wafers
Driven by market demand, the semiconductor industry is progressing toward consensus on building-block standards for automating LED production on 6-in wafers, explains Paula Doe in an article for SST sister magazine LEDs Magazine.
10/01/2012 — Tezzaron takes over SVTC's Austin fab amid layoff reports
Tezzaron Semiconductor is taking over SVTC Technologies' wafer fab in Austin, TX, amid reports that the semiconductor/MEMS development organization is cutting back activities in Austin and in California.
09/04/2012 — Why 2Q makes or breaks a "good" year for IC sales
In an analysis of quarterly IC market growth rates, IC Insights pulls up an unusual phenomenon: the performance during the second calendar quarter takes the spotlight in years of better growth, which is counter to historical norms.
09/28/2012 — Foundries, leading-edge nodes, and profits: Narrowing the field in a two-man race
Want another snapshot of who's leading the pack among pure-play foundries, and who's falling off the curve? Look more closely at <45nm offerings, as framed by a recent analysis from IC Insights.
09/20/2012 — Molybdenum sulfide: the new graphene?
Researchers have begun to investigate a new 2D material—molybdenum sulfide (MoS)—which has similar characteristics but offers something graphene doesn’t: a wide energy bandgap, enabling transistors and circuits to be built from it directly.
09/20/2012 — Everspin to unveil highest-density ST-MRAM
In an invited paper at the International Electron Devices Meeting, researchers from Everspin Technologies will describe how they built the largest functional ST-MRAM circuit ever built, a 64-Mb device with good electrical characteristics.
09/20/2012 — Better than FinFETs: Hybrid-Channel SOI
At the International Electron Devices Meeting (IEDM) in December, a team led by IBM will report on the world’s first high-performance hybrid-channel ETSOI CMOS device.The researchers built a ring oscillator circuit to benchmark performance that worked even better than FinFETs.
09/20/2012 — Why IC market growth will expand despite economic and technology challenges
Even with the persistent troubles in global economics and various technology hurdles in advanced semiconductor manufacturing, IC market growth will continue to improve -- and the key is a shift away from what's been driving the market dynamics, explains IC Insights.
09/18/2012 — Process Watch: Taming the overlay beast
In the fourth installment in a series called Process Watch, the authors discuss overlay registration and new capabilities to align to buried layers. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
09/17/2012 — Tablet display shipments booming in 2012, big panel makers joining the fray
Shipments of tablets are booming, and that means demand for tablet displays is set to spike as well -- and some new panel makers are getting in on the action, reports IHS iSuppli.
09/26/2012 — TSMC's schedule for 450mm mass production -- and lithography is the key
During sessions at this month's SEMICON Taiwan, execs from TEL, Lam Research, Applied Materials and KLA-Tencor revealed the latest developments in 450mm technology.
09/25/2012 — GlobalFoundries tips 14nm FinFETs with 20nm underpinnings
GlobalFoundries announced it has developed a 14nm process technology built off its 20nm planar (LPM) process, which it says will offer improved battery life and higher performance vs. other 20nm 2D planar transistors.
09/25/2012 — EU partners complete three-year OLED materials program
NEMO, a three-year European project to research solution-processable materials for OLEDs, has concluded with newly developed materials that can be integrated into large-surface OLED components and are suited for printing processes.
09/24/2012 — Sharp, Intel tieup rumored for ultrabook LCDs
Sharp Corp. reportedly is in discussions with Intel to use the Japanese firm's LCD panels in new ultrabook laptops, and could be seeking a more substantial partnership that would make the chipmaking giant its top stakeholder.
09/21/2012 — Chip demand still sliding, hopes for soft 3Q landing and recovery
Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.
09/20/2012 — TSMC integrates Ge on Si in p-type FinFETs
At this year’s International Electron Devices Meeting (IEDM), foundry TSMC will describe a heterogeneous epitaxial growth process which for the first time enables Ge to be directly grown on Si.
09/20/2012 — Horizontal channels key to ultra-small 3D NAND
The first working 3D NAND flash memory at sub-40nm feature sizes will be described by Macronix researchers at this year’s International Electron Devices Meeting (IEDM).
09/20/2012 — RRAM synapses mimic the brain
At this year’s IEDM, a team led by Korea’s Gwangju Institute of Science and Technology will detail a high-speed pattern-recognition system comprising CMOS “neurons” and an array of resistive-RAM (RRAM)-based “synapses,” which demonstrated STDP, a brain-like function.
06/06/2013 — 450mm – It’s bigger than you think
Much has been said of the 450mm transition. But the description of this inflection is something of a misnomer.
03/07/2013 — 'Key' EUV milestone, DSA progress, more reported at SPIE Advanced Lithography
Over 2,000 industry professionals attended last week’s SPIE Advanced Lithography, where important progress reports were revealed on extreme ultraviolet (EUV), lithography, directed self-assembly (DSA), metrology, and related topics. The event ran February 24-28 in San Jose, California.
04/19/2013 — Reinventing Intel
The semiconductor chip giant revealed plans to branch out beyond PCs. Will it work?
04/19/2013 — Top 30 MEMS companies of 2012
The fast growing market for sensors for smart phones is re-shuffling the ranks of MEMS suppliers. For the first time, suppliers of inertial sensors have surpassed the major makers of micro mirrors and inkjet heads that have long dominated the industry on Yole Développement’s annual ranking of the Top 30 MEMS companies.
04/12/2013 — IBM announces $1B investment in flash memory R&D
IBM announced plans on Thursday to invest $1 billion in flash memory research and development and launch a series of systems that will use solid state drives.
01/03/2013 — Small, medium-size AMOLED displays doubling by 2015
Active matrix OLED (AMOLED) displays will continue to encroach upon LCD technology through small and medium-sized (9-in. and smaller) displays used in mobile phones, according to recent analysis by NPD DisplaySearch.
02/13/2013 — Global market for MEMS microphone to more than double in five years
The global market for MEMS microphones has reached approximately $422 million in 2012. The market is predicted to increase to $865 million in 2017.
02/13/2013 — MEMS devices shape medical industry, microsystem devices to reach $6.6 billion in 2018
Microelectromechanical (MEMS) devices are shaping the competitive landscape in the global medical device industry.
02/11/2013 — ISSCC 2013: Large-area flexible electronics
Hoi-Jun Yoo, subcommittee chair of ISSCC 2013, writes on the focus of technology directions in the field of large-area and low-temperature electronics.
02/08/2013 — Econometric Forecast: Semiconductor growth should recover by 2014
In the second of two installments, Linx Consulting reports a steady growth in semiconductor production, as released in The Econometric Semiconductor Forecast.
02/07/2013 — Econometric Forecast: Regional developments to affect growth of semiconductor industry
In the first of two installments, we examine the global issues facing the semiconductor industry, as released by Linx Consulting in The Econometric Semiconductor Forecast.
02/07/2013 — MEMS revenue to climb a healthy 8 percent this year
A strong uptake in consumer and mobile devices will power the market for microelectromechanical systems (MEMS) to solid revenue growth in 2013, with breakthroughs in new sensor applications also expected this year, according to insights from the IHS iSuppli MEMS service at information and analytics provider IHS.
02/18/2013 — Gigaphoton achieves maximum 20W EUV light source output
Gigaphoton, Inc., a major lithography light source manufacturer, announced today that the company has achieved EUV light output equivalent to maximum of 20W for its laser-produced plasma, or LPP light sources for EUV lithography scanners.
02/14/2013 — Smartphones and tablets drive continued double-digit growth in MEMS motion sensor market
Smartphones and media tablets continue to the prime movers of technology industries, with the two mobile platforms spurring a double-digit increase in the market for microelectromechanical system (MEMS) motion sensors this year.
01/15/2013 — ISS 2013: Semiconductor leaders see massive industry transformation
The rise in mobile computing, changes to the fabless-foundry model, uncertainties in technical innovation, and global macroeconomic trends are becoming the dominant forces in 2013 and beyond, according to industry leaders speaking at this week's SEMI Industry Strategy Symposium (ISS).
01/11/2013 — CES: Phablets and table PCs break the PC mold
Among the usual confluences of useful and cool gadgets (not to mention bizarre) at this week's annual Consumer Electronics Show in Las Vegas, two types of devices with new formfactors aimed to rethink the PC model.
01/08/2013 — The gleam of well-polished sapphire
Is it time for high-brightness LED manufacturing to get serious about process control? If so, what lessons can be learned from traditional, silicon-based integrated circuit manufacturing?
01/07/2013 — Look for 4K LCDs, OLEDs at CES
As the annual Consumer Electronics Show and hordes of techie enthusiasts descends over Las Vegas this week, NPD DisplaySearch revisits the battle between two display technologies -- 4K × 2K vs. OLEDs.
01/22/2013 — Is Apple changing its mind on touch panel structures?
Reports are circling around Apple's supply chain of a potential shift in the company's display technology for its future iPhones and iPads -- moving back to LCDs and away from touch panels -- but a drastic realignment of its supply chain is probably not likely, observes DisplaySearch.
01/18/2013 — LED manufacturing investment declines as industry contemplates future directions
Spending on LED fab manufacturing equipment will decline 9.2% in 2013 as the industry faces weak long-term demand and consolidates manufacturing capacity.
01/17/2013 — Samsung grabs No.3 foundry spot on smartphone dominance
In the ranks of top foundries, there's a new Number Three in town: Samsung, which climbed up the ranks again in 2012 thanks to its ubiquity in smart phone technology, according to updated rankings by IC Insights.
02/20/2013 — Five IC suppliers to hold one-third of 300mm wafer capacity in 2013
Samsung tops list; IC foundries expected to show biggest capacity gains through 2017.
02/25/2013 — Scientists develop multicolor LEDs without heavy metals
Silicon nanocrystals have a size of a few nanometers and possess a high luminous potential. Scientists of Karlsruhe Institute of Technology (KIT) and the University of Toronto/Canada have now succeeded in manufacturing silicon-based light-emitting diodes (SiLEDs). They are free of heavy metals and can emit light in various colors.
03/04/2013 — Samsung issues apology for fatal acid spill at its Korean semiconductor plant
Samsung Vice-President Kwon Oh-hyun released a statement today, apologizing for the fatal hydrofluoric acid spill that left one worker dead and four others injured.
03/04/2013 — Flip-Chip expected to grow at a steady 9% pace, reaching $35 billion by 2018
Flip-Chip is big on value: in 2012, it was a $20B market, making it the biggest market in the middle-end area, and Yole Développement expects it to continue growing at a 9% clip, ultimately reaching $35 billion by 2018.
03/01/2013 — Corning believes flexible displays with Willow glass are still three years out
CEO believes that the technology may be made available in simple products this year.
03/13/2013 — Intel leads unexpectedly large decline in semiconductor market inventory
After reaching a worrisome high in the third quarter of 2012, global semiconductor inventories held by chip suppliers fell at a surprisingly fast rate in the fourth quarter, led by dramatic reductions for market leader Intel Corp.
02/28/2013 — A single European semiconductor strategy is on its way
STM, Imec, CEA-LETI, ASML, Soitec and EU representatives discussed directions at ISS Europe 2013 in Italy.
02/27/2013 — STMicroelectronics is first $1 billion MEMS company
Yole Développement’s research has credited STMicroelectronics for capitalizing on the booming demand for MEMS in mobile devices by shipping 58% more MEMS units in 2012, to become the first company to reach $1 billion in MEMS sales.
03/11/2013 — The UV LED market is booming
Yole Développement announced today its new report “UV LEDs: Technology & Application Trends” which presents UV LED new applications and associated market metrics for the period 2012-2020, and a deep analysis of UV LED technology and UV LED lighting industry.
03/11/2013 — Long-predicted atomic collapse state observed in graphene
Berkeley Lab researchers recreate elusive phenomenon with artificial nuclei; highly relevant for future nanoscle devices where electrical charge is concentrated into very small areas
03/08/2013 — MRAM: Disruptive technology for storage applications
Everyone wants faster access to stored data, and the issue is becoming critical with Big Data and cloud initiatives. With the speed of DRAM and the non-volatility of storage, Magnetoresistive Random Access Memory (MRAM) encourages a new way of thinking about storage applications. Storage is associated with longer latencies, but with MRAM storage can have similar latencies to memory. These capabilities and others make MRAM a catalyst for new thinking about how we design storage applications.
03/08/2013 — Student develops brighter, smarter and more efficient LEDs
Rensselaer Polytechnic Institute student Ming Ma has developed a new method to manufacture light-emitting diodes (LEDs) that are brighter, more energy efficient and have superior technical properties than those on the market today.
03/20/2013 — MEMS pressure sensors in cellphones set to rise to 681M units in 2016
Shipments this year are expected to double to 162 million units, as presented in the attached figure, primarily due to Samsung’s usage of pressure sensors in the Galaxy S4 and other smartphone models.
04/08/2013 — Plessey is first to release GaN on silicon LEDs
Plessey today announced that samples of its Gallium Nitride (GaN) on silicon LED products are today available. These entry level products are the first LEDs manufactured on 6-inch GaN on silicon substrates to be commercially available anywhere in the world.
04/04/2013 — How Samsung is climbing the charts
It’s no secret that Samsung is up against Apple in many ways, in products, sales and innovation. However, even in the face of Apple’s patent infringement lawsuits, Samsung is still climbing the charts.
03/28/2013 — The secrets of 14nm lithography
The long-expected demise of optical lithography for manufacturing ICs has been delayed again, even though the technology itself has reached a plateau with a numerical aperture of 1.35 and an exposure wavelength of 193nm. Immersion lithography is planned for the 20/22nm node, and with the continued delay of EUV, is now the plan of record for 14nm.
04/02/2013 — GLOBALFOUNDRIES demonstrates 3D TSV capabilities on 20nm technology
GLOBALFOUNDRIES today announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications.
12/13/2011 — Worldwide semiconductor equipment bookings decline in Q3
SEMI reports worldwide semiconductor manufacturing equipment bookings fell 38% year-over-year in Q3 2011; billings dropped 5% for the same quarter.
01/23/2013 — MEMS microphones surge, thanks to Apple
The market for MEMS microphones has nearly quintupled in just the past three years, topping a projected 2 billion shipments in 2012, thanks mainly for capabilities the technology enables in high-end smartphones, according to IHS iSuppli.
11/01/2012 — X-Fab takes majority stake in MFI, widens MEMS portfolio to support growth push
X-Fab Silicon Foundries says it has become the majority shareholder in German MEMS Foundry Itzehoe GmbH (MFI), the latest in a series of recent moves to raise its profile as a top MEMS foundry.
11/08/2012 — Disposable, monitoring devices spur MEMS pressure sensors in medical electronics
Growing use of disposable devices and respiratory monitoring are underpinning growing use of microelectromechanical systems (MEMS) used as pressure sensors in medical electronics, according to IHS iSuppli.
12/20/2012 — MEMS are in the mainstream – so what’s next?
Mike Rosa, MEMS global product manager at Applied Materials, blogs about recent advances in MEMS, as described at the recent MEMS Executive Congress.
12/28/2012 — Low-cost MEMS fabrication using injection molding
Researchers in Japan have devised a MEMS fabrication technology using lower-cost production methods of printing and injection molding, enabling MEMS devices to be applied for fields such as lighting -- and producable by firms outside the semiconductor sector.
09/27/2012 — Micro-rheometer, microdevice adsorbtion get nods in Sandia student MEMS design contest
A device that measures very thin quantities of liquid, such as the synovial fluid in knee joints, and a device that measures change in mass when a microdevice adsorbs small amounts of material, earned top honors in Sandia National Labs' annual student MEMS design contest.
10/05/2012 — Industrial magnetic sensors get a boost from green energy
The market for semiconductor magnetic sensors used in industrial and medical applications expanded by 6% in 2011 to $118.2 million, with green energy initiatives acting as a major growth driver, according to IHS iSuppli.
10/11/2012 — Ultrabook outlook slashed for 2012-2013, but growth still promising
High pricing and ineffective marketing are weighing down expectations for ultrabook demand, but the future's still bright with new models promising new features -- and that's great news for one component sector.
11/19/2012 — Antenna-on-a-chip promises faster light processing with silicon photonics
Researchers from Rice U. say they have developed a micron-scale spatial light modulator (SLM) built on SOI that runs orders-of-magnitude faster than its siblings used in sensing and imaging devices.
07/10/2013 — New methods to reduce time and cost of R&D
SEMICON West 2013 included a robust set of technical and marketing presentations on the general theme of developing new semiconductor devices in the session “Lab to Fab: From R&D to High Volume Manufacturing” held 1:30-3:30PM on July 9.
07/09/2013 — SEMICON West keynoter outlines The Big Five Challenges of the semiconductor industry
When Ajit Manocha, GlobalFoundries CEO, polled his audience during his keynote address on Tuesday at SEMICON West 2013, nearly 60 percent of the audience believed that the biggest challenge facing the semiconductor industry was the economy. However, during his presentation, Manocha seemed to suggest otherwise.
07/15/2013 — Semiconductor roadmapping update: Front-end technologies Part 1
In the afternoon of the last day of SEMICON/West 2013, a session was devoted to updates from the International Technology Roadmap for Semiconductors (ITRS) Front End of Line Technologies.
07/01/2013 — Samsung exec speaks on future innovations
The future is bright for the future semiconductor and IT industry, according to Samsung exec Yoon Woo (Y.W.) Lee. In a keynote talk at The ConFab, Mr. Lee described a future with dramatic advances in almost every field, including healthcare, nano, energy and the environment, all powered by semiconductors
07/17/2013 — Hybrid Memory Cube nears engineering sample milestone
Engineering samples of The Hybrid Memory Cube (HMC) are expected this summer, with high volume manufacturing coming next year. It will be one of the first high volume devices employing 3D integration and through silicon vias (TSVs), employing a bottom logic layer and 4-8 stacked DRAM layers.
07/18/2013 — Brewer Science: Simpler bonding/debonding process needed
A variety of techniques and materials have been developed to successfully achieve bonding/debonding for 3D integration, but Tony Flaim, chief technology officer of Brewer Science (Rolla, MO) says they are still too complicated.