Online Archives

03/11/2008 — Europractice IC Service Expands to MEMS Prototyping

(March 11, 2008) CROLLES, France, and LEUVEN, Belgium — Tronics Microsystems SA and IMEC, representing Europractice IC Service, announced today their collaboration to enable Europractice IC Service to add MEMS to its Multi-Project Wafer (MPW) programs. Tronics, a manufacturer of custom MEMS components, is the first technology provider selected by IMEC to support Europractice IC Service's extension of its production portfolio to MEMS.

03/10/2008 — LSI to Purchase Infineon Hard Drive Semiconductor Business

(March 10, 2008) Milpitas, CA — LSI Corp. today announced that it has signed a definitive agreement to acquire the assets and IP of the hard disk drive semiconductor (HDD) business of Infineon Technologies AG, including product designs, related software, inventory, and test equipment. Financial terms are not being disclosed.

02/04/2008 — Glass for Wafer-Level CSP and Optics

The AF 32 glass is designed for leading-edge opto-electronics, image sensor packaging, WLO, and MEMS applications. It matches the CTE of silicon, which helps prevent warp during the manufacture of complex assemblies and during reflow, when a WLCSP imager is attached to a printed circuit board.

01/01/2002 — IMAPS Workshop Report

IMAPS held its third Advanced Technology Workshop on "Packaging of MEMS and Related Micro Integrated Nano Systems" in early November in Scotts Valley, Calif.

01/01/2002 — Boeing introduces automated MEMS aligner

The Boeing Company has engineered a MEMS device and soldering technique that provides rapid and precise alignment of single-mode optical fibers to laser sources, photodetectors and other single-mode optical fibers

04/01/2002 — Wafer-level MEMS packaging

Microelectromechanical systems (MEMS) contain fragile parts that require encapsulation in a hermetically sealed cavity for reasons of protection, reliability and tuning of performance

08/01/2003 — In the News

SEMI Publishes StandardsSAN JOSE, Calif. — SEMI published 13 new technical standards relating to key aspects of semiconductor and flat panel display manufacturing.The standards released include:SEMI D33-0703 — Measuring Method of Optical Characteristics for Backlight UnitSEMI D34-0703 — Test Method for Measurement of FPD Polarizing FilmsSEMI E122.1-0703 &mdash[...]

08/01/2003 — Acoustic System-on-chips Aim to Revolutionize Sound

From the advent of the telephone and the world's first radio broadcast to the development of the electronic hearing aid and the cellular phone, technology has transformed the way people use sound at work, home and play.

08/01/2003 — New Products

Ball, Wedge Bonders Click here to enlarge imageModel 5060 Automatic Ball Bonder and Model 5070 Automatic Wedge Bonder reportedly offer large area, deep access, ball and wedge wire bonding for microelectronics packaging applications. The bonders feature a 25 percent smaller footprint than other systems in the company's platform as[...]

11/01/2003 — MEMS Applications for Scanning Acoustic Microscopy

Microelectromechanical systems (MEMS) are finding applications in products or systems that require reliable operation over extended periods of time.

05/01/2002 — Movers and shakers

Stephan H. Schmidt, general manager, has been elected to the LPKF Laser & Electronics USA (Wilsonville, Ore.) board of directors.

04/01/2002 — Integrated packaging and testing of optical MEMS

Working toward fully integrated solutions

01/09/2007 — Collaboration Joins Sensor, PCB, and MEMS Companies

(January 9, 2007) PITTSBURGH, PA and HSINCHU, Taiwan — Virtus Advanced Sensors, which specializes in MEMS-based sensors, entered into a collaboration agreement with several UMC Group companies including PCB manufacturer Unimicron and affiliated MEMS foundry Chipsense, both based in Taiwan.

01/05/2007 — Software Strengthens MEMS Performance

(January 5, 2007) LONDON — ViaLogy, Boeing, and NASA's Jet Propulsion Laboratory (Pasadena, CA) collaborated to create active-error-suppression software to improve stability of MEMS in harsh environments.

03/28/2007 — Infotonics Selects SUSS Bonders for MEMS

(March 28, 2007) MUNICH, Germany and CANANDAIGUA, NY — Infotonics, a collaborative center of excellence for photonics and microsystems in Canandaigua, chose the SUSS ABC200 wafer-bonding cluster tool and FC150 device bonder as strategic investments for its MEMS packaging laboratory.

03/23/2007 — SUSS, STS Launch MEMS Show

(March 23, 2007) MUNICH, Germany — SUSS MicroTec and Surface Technology Systems (STS) will cohost a MEMS technology showcase, "MEMS Technology: Embracing the Future." The show will debut in Boston on April 20, and include speakers from various aspects of the MEMS manufacturing process.

03/12/2007 — SEMICON China to Host Advanced Technologies

(March 12, 2007) SHANGHAI, China — SEMICON China 2007, March 21–23 in Shanghai, will include CEO forums on wafer processing and test-and-assembly, a discussion of MEMS opportunities, various talks on the logistics of operating in China and in cooperation with China RoHS, and an IC-design suppliers pavilion, in conjunction with the FSA and SICA. Various exhibitors will also highlight cleanroom technologies, advanced automation, and multi-metal compatibilities.

05/01/2007 — High-accuracy Bonder

The KADETT semi-automatic device bonder, designed for R&D labs, university research, and pre-production environments, performs high-accuracy placement and bonding processes for advanced packaging, MEMS, and other assembly tasks.

05/08/2007 — Mainstream MEMS MEPTEC's Focus

(May 8, 2007) SAN JOSE, Calif. — MEPTEC's final program for the 5th annual MEMS Packaging Symposium, "MEMS in the Mainstream: $50 Billion and Growing," will include industry, academia, and financial institutions discussing various commercial and volume markets for MEMS, and innovations to fuel a viable MEMS industry. The symposium will occur May 16 and 17 in San Jose.

05/07/2007 — Unisem Buys AIT

(May 7, 2007) BATAM, Indonesia — Unisem Berhad of Malaysia will purchase Advanced Interconnect Technologies (AIT) of Singapore for approximately $70 million. The acquisition brings Unisem into the advanced packaging and test arena, with BGA, QFN, and flip chip capabilities. AIT will become a full subsidiary.

08/13/2007 — Consortium Undertakes MEMS, Advanced Electronics

(August 13, 2007) LIVINGSTON, Scotland, U.K. — Scotland-based R&D-focused institutions and companies founded a consortium to engage emerging technology companies in MEMS, biomedical, control electronics, remote sensing, and advanced technology sectors. The Institute for System-level Integration (iSLI), the Scottish Microelectronics Centre (SMC), Optocap, and Photonix Limited plan to provide R&D, commercial scaling, and higher-value services to U.K.-based and global industry members.

08/10/2007 — SEMI Appoints International Board

(August 10, 2007) SAN FRANCISCO — Jerry Coder, president emeritus of the semiconductor materials business unit of Dupont Electronic Technologies, was elected by SEMI as chairman of the industry association's International Board of Directors. Coder succeeds Archie Hwang, chairman and CEO of Hermes-Epitek, who served for the past year.

08/08/2007 — Yole, Chipworks Host Asia Briefing

(August 8, 2007) TOKYO — Yole Développement (Lyons, France) and Chipworks, Inc. (Ottawa, Canada), presented their first MEMS market briefing in Asia, with speakers from BOSCH Japan and Silex Microsystems. The event occurred this July at Micromachine 2007 in Tokyo.

08/08/2007 — Unisem Names Group CEO from AIT

(August 8, 2007) KUALA LUMPUR — Unisem Berhad appointed Bruno Guilmart executive director and group CEO, as part of integrating Advanced Interconnect Technologies Limited (AIT) into the SATS company. Ang Chye Hock, formerly president, will assume the role of executive director and group chief operating officer (COO), Unisem.

06/18/2007 — MEMS Metrology System

The DSM200 automated metrology system performs cassette-to-cassette front-to-back alignment for front- to back-side alignment applications, such as MEMS, power semiconductor, and optoelectronics assembly.

06/18/2007 — MEMS/Nano Software Suite

Targeting the MEMS and nanotechnology industries, the IntelliSuite v8.2 software tool for MEMS/nano-device development includes nanostructure design tools to enable carbon nanotube (CNT) and nano-structure use in computing, display, medical, sensor, and related devices.

06/05/2007 — Molded Ceramic Packages

MIL-STD-883-certified hermetic, the molded ceramic surface-mount packages are low profile and target aerospace, avionics, and telecom applications, packaging LEDs, MEMS, and optical devices.

05/01/2007 — Shaken, Not Stirred: IMAPS N.E. Connects to Bond Theme

By Meredith Courtemanche, assistant editor

IMAPS New England, May 1st in Boxborough, MA, was a regional show with a national feel — a strong technical program, about 70 exhibitors, and approximately 450 attendees checking out booths and listening to detailed keynotes and presentations. The show included a new vendor workshop on the exhibit floor and a Bond, James Bond theme complete with playing cards, tuxedos, and an energetic environment.

04/27/2007 — MEMS Roadshow Highlights 300-mm Technologies

By Françoise von Trapp, managing editor

MEMS technology spans the entire semiconductor industry, with wafer processes through test, assembly, and packaging. As these micro-sized devices involve delicate structures, processes continue to evolve to address the complexities of MEMS manufacturing. SUSS and STS joined forces to present a U.S.-based roadshow "MEMS Technology: Embracing the Future," to share developments that are bringing manufacturing processes into the 300-mm range.

04/20/2007 — Getter Services for MEMS WLP

(April 20, 2007) SANTA BARBARA, CA — Innovative Micro Technology (IMT) began offering getter deposition services of wafer-level packaging (WLP) of MEMS devices, and other components requiring a hard vacuum. In testing, IMT reportedly demonstrated vacuum levels below 10 mTorr for inorganic devices — equal to or better than industry standard.

04/20/2007 — March Book-to-Bill Even

(April 20, 2007) SAN JOSE, CA — North America-based semiconductor equipment manufacturers posted $1.42B in orders and billings in March, generating an even book-to-bill of 1.00, according to SEMI's monthly book-to-bill report. Bookings improved slightly while billings remained at February levels. The book-to-bill had dropped slightly below parity in February at 0.98.

04/19/2007 — Major MEMS Manufacturers Dominate Market Share

(April 19, 2007) LYON, France — Yole Développement compiled a list of major MEMS manufacturers globally, market drivers, and industry shifts in "Analysis: Top 30 MEMS Manufacturers." The top 30 represent 88% of the total MEMS industry, with $5.2B in 2006 sales. Minimum sales in the top ranking grew to $26 million, up from $15 million in 2005. Yole noted that military MEMS business is difficult to track, and may represent a larger portion of the industry than predicted.

04/18/2007 — IEEE Recognizes Fraunhofer's Reichl

(April 18, 2007) BERLIN — The IEEE components, packaging, and manufacturing technology (CPMT) society — an international forum for scientists and engineers in microsystems packaging design and manufacture R&D and development — named professor Herbert Reichl, director of Fraunhofer IZM, recipient of its electronics manufacturing technology award.

04/18/2007 — Tronics Expands MEMS Capabilities

(April 18, 2007) CROLLES, France — Tronics Microsystems SA expanded its characterization, assembly, packaging, and testing capabilities with additional space and tools. The expansion will support design-to-manufacturing services, and support its MEMS device supply chain.

04/18/2007 — SEMI Lowers Early 2007 Book-to-Bill Estimates

(April 18, 2007) SAN JOSE, CA — SEMI released corrections to its January and February book-to-bill estimates for the North America semiconductor equipment manufacturing industry, lowering the ratios to 1.00 and 0.98, respectively. SEMI blames a data-input error for the incorrect averages initially reported.

06/28/2007 — SPP Adds to MEMS Equipment Holdings

(June 28, 2007) AMAGASAKI, Japan — Sumitomo Precision Products Co. Ltd. (SPP) completed its acquisition of Primaxx, Inc., adding MEMS etch-release equipment to its businesses. SPP holds majority stake in Surface Technology Systems plc (STS) and considers Primaxx equipment complementary to STS's advanced deep silicon etch and deposition technologies. Primaxx plans to develop its MEMS business under SPP, as well as venturing into related fields, such as wafer-surface modification.

06/27/2007 — Analysts Probe RF Developments, End Markets

(June 27, 2007) LYONS, France and CAMBRIDGE, U.K. — Yole Développement will release a report on the RF MEMS switches market in July, outlining market potential in defense, industrial, automotive, and telecom applications. The report is in-line with forecasts by IDTechEx regarding end markets for RFID components, including medical, defense/aerospace/military, and telecom.

06/22/2007 — Collaborative Focus on MEMS Forecasts

(June 22, 2007) LYON, France and OTTAWA — Chipworks and Yole Développement signed an agreement to collaborate on in-depth business and technical analysis for the MEMS industry. Chipworks, which provides reverse engineering and technical analysis of semiconductors and microelectronic systems, will supplement Yole's market research and business development data.

06/19/2007 — Database Targets MEMS Manufacturability

(June 19, 2007) MATERIALS PARK, OH — ASM International released its MEMS Materials Database: Packaging Module, a licensed database containing mechanical, physical, processing, and component data for materials selection in MEMS packaging. The database targets improvements to time-to-market, reliability, and design and manufacturing of MEMS devices.

01/24/2007 — Consumers, Integration Dictate Future of MEMS, 3-D Packages

(January 24, 2007) LYON, France and PITTSBURGH — The future of MEMS and 3-D packages relies on similar factors — consumer drivers and increased integration — according to industry analysts. 3-D integration will affect MEMS and IC packaging industries, says Yole Développement's "3-D ICs." Advanced packages require acceptance from the consumer market to reach targets for technological advancement, commercialization, and sector revenues.

01/19/2007 — Endevco Appoints MEMS Business Manager

(January 19, 2007) SUNNYVALE, CA — Endevco Corporation, a Meggitt group company, named Jennifer MacDonell MEMS business manager, with responsibility for the MEMS research and production facility in Sunnyvale.

09/12/2007 — Emerging MEMS Manufacturers Look Beyond Auto Apps

(September 12, 2007) PHOENIX — The MEMS market is an attractive area to operate in, according to Semiconductor Partners, because MEMS revenue will double from $5B in 2005 to $10B in 2011. "Driving MEMS Beyond Automotive," suggests that a "select group of large, well-established MEMS suppliers" will benefit from growth in the automotive sector, while "new, emerging entrants" to the MEMS market will capitalize on opportunities in consumer, communications, and portable product sectors.

09/10/2007 — tMt Installs Alcatel DRIE Tool for MEMS Fab

(September 10, 2007) TAIPEI, Taiwan — Alcatel Micro Machining Systems (Annecy, France) shipped an advanced deep reactive ion etch (DRIE) production tool to Touch Micro-system Technology (tMt — Yang-Mei, Taoyuan, Taiwan), allowing the MEMS foundry to begin producing advanced MEMS devices, including micro mirrors, silicon microphones, and gyroscopes.

09/04/2007 — MEMS Show Travels to Europe

(September 4, 2007) MUNICH, Germany — SUSS MicroTec and Surface Technology Systems (STS) will bring their "MEMS Technology: Embracing the Future" Roadshow to Europe in September, following a five-city tour in the U.S. this April. The Roadshow event features presentations from SUSS, STS, Primaxx, and XACTIX, covering trends in wafer bonding, wafer-level test, and other manufacturing steps.

09/04/2007 — Alcatel Supplies Next-gen DRIE for STMicro

(September 5, 2007) ANNECY, France — STMicroelectronics SAS (Tours, France), a division of STMicroelectronics NV Group, ordered the AMS 4200 DRIE production tool from Alcatel Micro Machining Systems. STMicro will use the tool for deeper advanced etching to realize 3D semiconductors and integrated MEMS packages.

09/20/2007 — Redshift Systems Partners with IMT to Develop Next-gen Thermal Imaging Device

(September 20, 2007) BURLINGTON, MA— RedShift Systems, provider of next-generation thermal imaging solutions, will join forces with MEMS manufacturer,Innovative Micro Technology (IMT) to produce a solid-state, passive optical component that shifts long-wavelength thermal infrared radiation to visible light to allow standard CMOS and CCD digital cameras to "see heat."

04/03/2007 — Analysts Weigh In

As 2007 progresses, analysts are examining the past and future for electronic components and advanced technology applications. Following are summaries of reports from iSuppli, Henderson Ventures, Yole Développement and SEMI, and In-Stat, covering MEMS, NAND and NOR flash, SoC, and other technologies.

02/20/2007 — AOI for MEMS

The Falcon 600 automated optical inspection (AOI) system targets MEMS and other special applications for the semiconductor manufacturing and packaging industries. The model targets applications that require special handling and inspection capabilities, such as optoelectronic devices, MEMS, wafer-level packaging (WLP), and glass substrates.

02/14/2007 — MEMS Reaching Broader Industries

(February 14, 2007) SCOTTSDALE, AZ — The commercial use of MEMS and nanotechnology ranges from display, gyro-sensor, and ink-jet printing to smart-RFID, RF-MEMS, and wireless-sensing sectors; this technology expansion is creating competitive and converging applications for MEMS devices, according to Bourne Research. The research firm released seven market briefs outlining the dynamics of MEMS and nanotechnology in emerging applications.

02/08/2007 — MEMS Lab to Use SUSS Bonders

(February 8, 2007) MUNICH, Germany — SUSS MicroTec will supply advanced wafer-bonding equipment to the University of Juarez (UACJ), Mexico, for MEMS research and hybrid packaging developments.

10/11/2007 — Austrian Semiconductor Manufacturer Installs Fouth EVG Aligner

(October 9, 2007) ST. FLORIAN, AUSTRIA — EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, announced the installation of its fourth IQ Aligner System for packaging applications at a major semiconductor manufacturing facility in Austria. This purchase reportedly strengthens the customer's capacity for wafer-level packaging of MEMS and display devices.

10/04/2007 — Alcatel Receives DRIE Cluster Tool Order

(October 4, 2007) ANNECY, FRANCE— Alcatel Micro Machining Systems, a supplier of deep silicon etching equipment (DRIE) for MEMS and 3D semiconductors, has received an order for its AMS 4200 DRIE multi-chamber production tool from Boehringer Ingelheim microParts GmbH to increase volume production of MEMS micro-nozzles for Respimat inhaler.

10/04/2007 — ISSYS Receives NSF Grant to Develop Wafer-level, Hermetic, Hybrid Integration of MEMS and Electronics

(October 4, 2007) YPSILANTI, MI— Integrated Sensing Systems, Inc. (ISSYS) was awarded a Phase II Small Business Innovation Research contract from the National Science Foundation (NSF). The 2-year project, "Wafer-Scale, Hermetic, Packaging of MEMS-Based Systems," is aimed towards development of a novel packaging method to simplify the packaging of MEMS and their associated electronics.

10/02/2007 — STMicroelectronics' Next-generation MEMS Motion Sensors Meet Demand

(OCTOBER 2, 2007) GENEVA — STMicroelectronics, manufacturer of MEMS devices, have introduced next-generation 'nano' three-axis linear accelerometers to meet the demand for miniaturized motion-sensing solutions in the consumer and industrial markets.

08/30/2007 — Micropelt Introduces MEMS-based Thermoelectric Cooler Technology

(August 30, 2007) FREIBURG, GERMANY — Micropelt GmbH, manufacturer of thin film thermoelectric devices, introduced a technology advancement in its ultra-small, microchip thermoelectric coolers (TECs) that is expected to open possibilities for laser and photonic sensor manufacturers whose applications require a large bandwidth of thermal control.

08/27/2007 — Discera Qualifies MEMS Oscillators

(August 27, 2007) SAN JOSE, CA — Discera, Inc., qualified its MEMS-based oscillators with a series of frequency-stability and standard semiconductor qualification and reliability tests, comparing the silicon-based MEMS resonators to quartz for timing devices. Discera tested three separate manufacturing lots to prove process consistency in high-volume production, said Venkat Bahle, VP of marketing, Discera.

08/24/2007 — RF Integration — A Paradigm Shift

By Per Vicklund, Mentor Graphics

The character of RF design has changed quite dramatically in the past few years. It's quite rare that RF designs are isolated pieces of circuitry, but rather part of a much bigger context. RF designs today typically are much larger and much more complex. They are multi-technology designs consisting of multiple RF modules integrated with high-speed digital, analog, power, and bias networks, all on the same dense circuit board.

08/24/2007 — Photovoltaic Show Highlights Product Intros

(August 24, 2007) MILANO, Italy — The 22nd European Photovoltaic Solar Energy Conference, September 3–7 in Milano, will feature an increased presence of electronics materials companies launching products targeting the photovoltaics market. Following are the introductions Cookson and Indium plan for the show.

08/01/2001 — Movers and shakers

Etalon, a division of Piezo Technologies (Indianapolis), has hired Andreas Hadjicostis to head up its engineering development group

12/01/2002 — Wafer-scale Encapsulation: Controlling MEMS Packaging Costs

Microelectromechanical systems (MEMS) technology quickly made the transition from innovative concepts to practical demonstrations and on to early products.

09/01/2002 — Automated MEMS assembly

Design and process issues in optoelectronics

10/26/2011 — Lasers package ultrathin semiconductors at low cost, high volume

North Dakota State University, Fargo, researchers have developed a packaging technology using Thermo-Mechanical Selective Laser Assisted Die Transfer (tmSLADT) to reduce the size and cost of microelectronics packages.

10/19/2011 — TSV electroplating dev team unites SVTC, Amerimade Technology, Shanghai Sinyang Semiconductor Materials

Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will collaborate on electroplating processes for TSV that are production-ready for advanced packages and MEMS.

10/06/2011 — Thin wafers win majority in electronics by 2016

Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole D

08/28/2008 — Embedded RF Component and Devices in 3D LCP Package, Part 2

Laminated Thin Film Resistors on LCP
By Swapan K. Bhattacharya, Stephen Horst, and John Papapolymerou, Georgia Institute of Technology
Embedded resistors are generally implemented with either thick- or thin-film processes. Thin-film processes use a variety of metal alloys usually deposited by sputtering process under vacuum An alternative to this approach involves the use of commercially available resistive films on a carrier conductive copper foil.5-8

11/20/2008 — EV Group Reports Continued Growth

(November 20, 2008) ST. FLORIAN, Austria,— Crediting the continued demand in the 3D interconnect interconnect/through-silicon via (TSV) an nanoimprint lithography markets, EV Group reports an increase in revenue for 2008 of more than 15%. Despite the current global economic slowdown, the company says it remains cautiously optimistic about its outlook for 2009 given the expected growth opportunities to ensue as these novel technologies gain market acceptance/penetration.

11/17/2008 — IMAPS International 2008 In Review

By Gail Flower, Editor-in-Chief
This year's IMAPS International Symposium had great international participation, good attendance and excellent presentations from keynoters to the technologically cutting-edge educational papers. It was election day when the IMAPS conference began, and by the second day of the conference, a new president entered the picture. Therefore, the first day proceeded without a rush of attendees as expected, but the second perked up with lively conversation.

07/07/2008 — Countdown to SEMICON West: Exhibitor Preview

(July 7, 2008) SAN FRANCISCO, CA — With SEMICON West 2008 just one week away, July 15-17,at the Moscone Center, San Francisco CA, exhibitors are getting the word out to make sure attendees don't miss a thing. While SEMI has a full-line up of conferences, keynotes, and workshops planned, many exhibitors will be leveraging the venue to announce new processes, technologies, products, and more.

06/17/2008 — MEPTEC Symposium Highlights MEMS Evolution

By Julia Goldstein, Ph.D., contributing editor
(June 3, 2008) SAN JOSE, CA — When Advanced Packaging magazine covered MEPTEC's first MEMS Symposium in 2003, MEMS was a technology with potential that needed to move from a technology-driven to a market-driven approach to succeed commercially. This year's symposium on May 22, 2008 was subtitled "MEMS Market Evolution — From Technology Push to Market Pull," suggesting that the potential has been realized.

06/27/2008 — electronica 2008 to Showcase on Micro and Nanoelectronics

(June 25, 2008) MUNICH, Germany — Microelectronics is a driving force behind innovation for industries such as automotive, biomedical technology, telecommunications, automation technology, environmental engineering and building technology. Micro-nano systems have become so important that electronica 2008 will dedicate a focus area to sub-miniature electronics. Exhibitors will display micro-nano products for automotive, consumer, medical and environmental applications.

11/18/2008 — Photonic Interconnects Enable the Continuation of Moore's Law

By Fran

10/14/2008 — Automatic Wafer Inspection

Viscom AG has broadened its platform into the semiconductor market with the introduction of the MX20000IR fully automatic wafer inspection system. The application scope of the system includes MEMS, wafer bonds, flip chip and photovoltaics. Wafers can be composed of various materials including silicon, gallium arsenide, aluminum oxide or III-IV composites, and others.

08/04/2008 — RF Components and Devices in 3D LCP Package

Part 1: Embedded Actives
By Swapan K. Bhattacharya, Chad Patterson, and John Papapolymerou, Georgia Tech
As real estate in electronic packages has been compromised in the Z direction, thin has become the buzz word — encompassing die, dielectric, passives, and ultimately resulting in thin packages. This series of articles will overview trends from thick to thin packages with embedded RF passive and active components.

08/04/2008 — Plasma Etching/Cleaning System

The PE-200-RIE Convertible, from Plasma Etch, is a convertible RIE configuration of the companies PE-200 plasma etching/cleaning system. Designed for anisotropic etching of nitrides, oxides, and polyimide, the system features a 13

04/04/2008 — Tessera Acquires IP Rights from Kronos

(April 4, 2008) San Jose, CA and Belmont, MA— Tessera Technologies, Inc. provider of miniaturization technologies for the electronics industry, and Kronos Advanced Technologies, Inc. developer of ionic- based products and technologies for air movement and purification, announced the sale and licensing of certain intellectual property (IP) rights related to Kronos proprietary technologies to Tessera.

04/01/2008 — 3D Packaging Technologies Steal the Show at IMAPS

By Fran

09/05/2008 — Tegal to Acquire Alcatel Micro Machining Systems Product Line

(September 5, 2008) PETALUMA, CA — Tegal Corporation announced an agreement with Alcatel Micro Machining Systems (AMMS) and Alcatel-Lucent to acquire their deep reactive ion etch (DRIE) and plasma-enhanced chemical vapor deposition (PECVD) products, and the related intellectual property. The addition of these capabilities to Tegal's plasma-etch and deposition systems will reportedly enable Tegal to further expand into MEMS and 3D wafer level packaging applications.

09/01/2008 — From the Advisory Board

Temperature Stabilization for MEMS Devices
By Seri Lee, Ph.D., Nextreme Thermal Solutions
Advances in thin-film thermoelectrics enable novel temperature stabilization for applications in MEMS packaging. As the electronics industry moves towards smaller packaging form factors and higher heat densities, non-uniform thermal conditions can directly affect the performance and reliability of MEMS devices.

09/01/2008 — Wafer Bond Cluster Tool

Designed for advanced MEMS manufacturing and 3D wafer bonding, the CBC200 from SUSS MicroTec is a fully-automated, wafer bond cluster with up to 90 kN bond force and 600°C thermal capacity. These features are said to enable die size and cost reduction for MEMS devices. Additional features include post-bond alignment accuracy for metallic bonds to 1.25µm and cluster design concept and software for 24/7 production.

07/22/2009 — International Wafer-Level Packaging Conference (IWLPC) Finalized

(July 22, 2009) MINNEAPOLIS — The 6th Annual International Wafer-Level Packaging Conference (IWLPC), October 27-30, 2009, Santa Clara, CA includes tutorials, expert panel discussions, Dr. Rao Tummala keynoting, and 18 tech sessions.

02/23/2009 — L


08/16/2011 — MEMS, 3D packaging major factors in iNEMI roadmap

The 2011 iNEMI Roadmap, published by the International Electronics Manufacturing Initiative (iNEMI), includes a new chapter on MEMS and sensors, and an expanded chapter on packaging to include substrates discussions.

03/08/2011 — Hermetic wafer level packaging lowers cost with IMT Au Au bond

IMT introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding for wafer-level packaging (WLP). In development for nearly a year, this bond is being actively used in production.

02/01/2011 — The road ahead for SiPs

With the proper up-front evaluation of SiP designs, a tool box of enabling technologies, and strong team interactions between all involved parties, SiP solutions can enable novel electronic products with faster time to market than would be possible with traditional scaling. Darvin Edwards, Masood Murtuza, Texas Instruments, Dallas, TX USA

01/18/2012 — Hesse & Knipps discusses wedge bonding for RF and microwave devices at workshop

Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Wedge Bonding for RF and Microwave Devices" at the Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging

01/10/2012 — Upcoming SMTA events: IWLPC keynote named, SMTAI seeks presenters

The SMTA released its call for presenters for SMTA International (SMTAI) 2012, October 14-18 in Orlando, FL. The association, along with Chip Scale Review magazine, also announced the keynote for the International Wafer-level Packaging Conference (IWLPC), held November 5-8, San Jose, CA.

01/05/2012 — Advantest to expand beyond semiconductor test

Haruo Matsuno, president and CEO of Advantest Corporation (TSE:6857, NYSE:ATE) shares the company's major goals, including expansion into new measurement applications, utilization of cloud computing, and more.

05/15/2012 — DRIE expands from MEMS to advanced packaging and more applications

02/09/2011 — CEA Leti adds SPTS on 3D IC line with 300mm PVD order

SPP Process Technology Systems (SPTS) received a follow-on purchase order from CEA-Leti for its Sigma fxP PVD system. The 300mm system will be used for advanced TSV development at Leti's new 300mm fab extension in Grenoble.

02/01/2011 — RF MEMS packaging collab DelfMEMS KFM

DelfMEMS and KFM Technology signed a common agreement to combine their expertise in RF micro-electro-mechanical systems (MEMS) and thin film packaging (TFP) technology. DelfMEMS will use the collaboration to provide packaged MEMS switches, fixed capacitors, and high-Q inductors on the same chip.

01/11/2011 — 22nm: The era of wafer bonding

The migration to the 22nm node is about more than just scaling down, it's also about scaling up with thinner devices stacked into a single package -- and these require new manufacturing considerations with wafer bonding playing a central role, writes Bioh Kim from EV Group.

03/07/2011 — TSV substrates for power amplifiers A*STAR IME partners with ELTA Systems

The collaboration will result in new applications in multi-chip modules in radar, communication, and electronic warfare systems. The new technology platform would enable miniaturization of wireless applications that are faster, lighter and can withstand higher temperatures.

02/21/2012 — Present at ESTC 2012 in Amsterdam

Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.

02/03/2012 — X-FAB Silicon Foundries adopts SFT software

X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18

02/02/2012 — 3M debuts high-capacitance ECM for IC packaging, RF, other apps

3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI).

01/25/2012 — 3D MID sensor fabricated with Ticona laser-activated LCP circuits

2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic circuits. The Vectra E840i forms circuits on 3D injection moldings produced with an LDS process.

01/24/2012 — USPTO seeks nominees for National Medal of Technology and Innovation

The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."

03/14/2012 — AMEC debuts TSV etch tool with Chinese installations

Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.

09/10/2012 — UMC, ST to develop 65nm backside CMOS image sensors


09/09/2011 — Wafer-level packaging emerges for uncooled IR imagers

Yole D

09/07/2011 — EVG enhances fusion wafer bonder throughput, accuracy

EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20WPH with enhanced automation capabilities and low-temperature processing.

08/31/2011 — Sony licenses Ziptronix oxide wafer bonding patents

Ziptronix Inc. has licensed use of its oxide bonding technology for backside illumination imaging sensors patents to Sony Corporation. ZiBond technology enables more die per wafer, improving costs and quality for consumer, automotive, and other end-use applications.

11/18/2011 — Smart systems research group tackles design methodology

SMArt systems Co-design (SMAC) launched today, bringing together a multinational, multidisciplinary partnership of leading companies on a three-year project for design and integration of smart systems.

11/15/2011 — SUSS MicroTec sends equipment to SVTC in MEMS, 3D IC dev partnership

Nanotechnology accelerator SVTC Technologies partnered with SUSS MicroTec on wafer-level packaging for MEMS, and 3D IC bonding technology development.

11/07/2011 — SEMATECH creates 3D packaging standards development forum

SEMATECH has created an online 3D Standards Dashboard, allowing 3D semiconductor and MEMS interconnect professionals to exchange standards activity information.

04/27/2011 — C2MI's 3D MEMS fab adds Akrion Systems' advanced wet stations

The MiQro Innovation Collaborative Centre (C2MI) will purchase three Akrion Systems GAMA automated wet process systems for the development and manufacture of advanced devices at C2MI's state-of-the-art MEMS facility in Quebec.

03/02/2011 — Silicon interposers embedded capacitors subject of ALLVIA presentation at IMAPS Device Packaging

ALLVIA, through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the IMAPS Conference on Device Packaging in Scottsdale, AZ, March 9. Dr. Sergey Savastiouk, CEO at ALLVIA, will present "Silicon Interposers Enable High Performance Capacitors."

12/09/2011 — Honeywell taps Tezzaron Semiconductor to stack rad-hard die

Honeywell Microelectronics will use Tezzaron's 3D stacking on Honeywell

12/06/2011 — Silicon interposer partnership sets roadmap

Singapore's A*STAR IME and 3D IC developer Tezzaron Semiconductor signed a research collaboration agreement to develop and exploit advanced through silicon interposer (TSI) technology.

12/13/2011 — inTEST to acquire Thermonics division of Test Enterprises

inTEST will acquire the assets and certain liabilities of Thermonics from Test Enerprises. inTEST's Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.

06/15/2011 — Embedded WLP, TSV interposers, copper pillar, materials: 4 projects of IME packaging consortium

Singapore's Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) launched the 11th cycle of its 15-year packaging R&D with 23 companies and 4 main projects.

06/13/2011 — FEI plasma FIB tool targets packaging apps

High-speed sectioning of TSVs with plasma FIB. The device was located, cross-sectioned, polished, and imaged with PFIB. SOURCE: FEI FEI's new Vion plasma focused ion beam (PFIB) system based on inductively-coupled plasma (ICP) source technology using a xenon ion beam generates more than a micro-amp of beam current and can remove material faster than liquid metal ion sources, says product marketing manager Peter Carleson.

05/17/2011 — Wafer bonding: Many options for many devices

Wafer bonding. SOURCE: Yole May 2011. Wafer bonding is a complex process, used on 2" to 12" wafers for MEMS, image sensors, advanced packaging, LEDs, and other chips. Yole Développement published a technology study and market research report, "Permanent wafer bonding," to derive trends in the market and technology through 2016.

06/30/2011 — What SEMICON West offers packaging professionals in 2011

SEMICON West is a major conference for semiconductor manufacturing professionals. Semiconductor packaging has become a major focus in recent years, and this year, BEOL attendees have ATE Vision 2020, 3D IC standards meetings, a keynote, and multiple sessions dedicated to packaging technologies. Here's your guide to attending SEMICON West on a packaging track.

05/23/2011 — Cascade Microtech's WinCalXE integrates SussCal for better on-wafer VNA measurements

Cascade Microtech Inc. (NASDAQ: CSCD) released WinCalXE version 4.5 calibration software, with improved model and process quality. WinCalXE 4.5 contains the features of WinCalXE and SussCal, and operates with all manual and semi-automatic Cascade Microtech and former SUSS MicroTec probe stations.

05/19/2011 — Non-planar device scaling: SEMATECH talks TSV, SoC, SiP

The semiconductor industry is moving to 3D device structures, says Raj Jammy, SEMATECH, at The ConFab 2011, discussing TSV and system-in-package (SiP) opportunities and challenges. He also summarizes logic and memory roadmaps.

08/16/2012 — Tessera changes CFO, Neely brings high-tech experience

Tessera appointed Rick Neely, Jr. as EVP and CFO, responsible for the company

07/24/2012 — New MEMS, 3D IC packaging working group chairs at GSA

Global Semiconductor Alliance (GSA) recently named Jay Esfandyari, STMicroelectronics, as its MEMS Working Group chairman and Ken Potts, Cadence Design Systems, as the 3D IC Working Group chairman.

07/13/2012 — 2012 ITRS update: Back-end packaging and MEMS

At SEMICON West, the working groups of the International Technology Roadmap for Semiconductors (ITRS) outlined 2012 updates to the roadmap. Check out the back-end process info here.

08/11/2010 — SemiProbe patent for modular test system approved

SemiProbe has developed proprietary technologies awarded a patent by the United States Patent and Trademark Office. The Probe System for Life allows the company and users to configure test and inspection systems that meet unique requirements usually served by custom products.

01/26/2010 — Viscom introduces measurement tools for wire bond inspection

Wire bond inspection system maker Viscom introduced software tools for its very high resolution (VHR) camera module, which has the ability to provide exact measurements of balls and wedges. With this technology, 25-µm gold thin-wire wedge sizes can be measured with a standard deviation of 1 µm. In addition to inspecting qualitative characteristics of wire bonds, balls and wedges statistical evaluation and trend analysis of critical geometric dimensions can also be performed in the production process.

12/08/2010 — IMT-adds-TSV-geometry-point

Innovative Micro Technology Inc. (IMT) added a new geometry point in its technology roadmap for through silicon vias (TSVs). Joining the copper-filled 15 by 60um depth TSV configuration that has been in production for nearly 2 years, 50 by 250um copper-filled TSV is planned for production at the beginning of 2011.

12/09/2010 — MEMS packaging facility lands Canadian grant

The MiQro Innovation Collaborative Centre (MICC; Bromont, QC, Canada) will receive a $14.1 million grant as part of the Canadian government's Centres of Excellence for Commercialization and Research (CECR) program. The grant will be used for 200mm MEMS and WLP research.

12/06/2010 — Logic apps for Si interposers and embedded capacitors: ALLVIA talk at 3D Packaging Forum

Dr. Nagesh Vodrahalli, vice president of technology and manufacturing at ALLVIA, will present a discussion on December 9 titled "Silicon Interposers with TSVs and Embedded Capacitors for Advanced Logic Applications."

07/13/2010 — MicroProbe debuts MEMS-based, multi-DUT, ultra-fine-pitch probe card for IC wafer test

MicroProbe Inc., supplier of wafer test technology to the global semiconductor industry, released the MEMS-based Mx-FinePitch (Mx-FP) probe card. The test card series targets ultra-fine-pitch testing of leading-edge SoC and logic devices found in applications like digital cameras, set-top boxes and digital TVs.

11/11/2010 — Bond-align-mask-align-SUSS-MicroTec-Fraunhofer-collab

SUSS MicroTec and Fraunhofer for Surface Engineering and Thin Films IST launched SELECT, a technology for bond aligners and mask aligners that selectively activates parts of wafer surfaces through plasma.

08/16/2010 — IDTechEx launches active RFID and sensor networks report

The IDTechEx report, "Active RFID and Sensor Networks 2011-2021," comprehensively analyzes the technologies, players and markets with detailed 10-year forecasts, including tag numbers, unit prices and interrogator numbers and prices.

08/05/2010 — IDTechEx releases RFID forecast publication

IDTechEx announced "RFID Forecasts, Players & Opportunities 2011-2021," which shows RFID as a $5.63 billion market in 2010.

12/01/2010 — Focus on 3D TEST at IEEE Workshop

The test community is embracing 3D ICs, as evidenced by presentations at the first IEEE International Workshop on Testing 3D stacked ICs that addressed a range of test challenges and solutions, reports Dr. Phil Garrou.

11/30/2010 — Alchimer-Electrografting-for-3D-TSV-apps-validated-by-RTI

Alchimer's Electrografting (eG) technology has been validated by scientists at RTI International (RTI). The paper confirmed that electrografting is a proven technology for depositing "insulator, barrier and seedlayer into high aspect ratio TSVs for 3D integration applications."

02/01/2010 — Hymite will sell portfolio of wafer-level semiconductor packaging patents

ICAP Ocean Tomo, the intellectual property brokerage division of ICAP Plc (IAP.L), is offering for sale a patent portfolio relating to wafer-level semiconductor packaging owned by Hymite A/S. The 77 issued U.S. and foreign patents and patent applications cover new packaging technologies for optical communications components, LED emitters, and semiconductor fabrication.

08/23/2010 — Gyroscope integrates MEMS/ASIC in custom package

Sensonor Technologies is developing SAR500, a novel high-precision, low-noise, high-stability, calibrated and compensated digital oscillatory gyroscope with SPI interface housed in a custom-made ceramic package.

07/13/2012 — Roadmapping More than Moore: When the application matters

At the ITRS 2012 update, back-end technologies session, at SEMICON West, roadmapping for More than Moore was addressed as both a philosophical and technical matter.

07/02/2012 — Tessera: Adding Vista Point Technologies, losing Powertech Technology?

Tessera received notice from Powertech Technology Inc. (PTI) that it will terminate its license agreement with the semiconductor packaging and optics technology company. Tessera also completed phase 1 of its acquisition of camera module technologies from Flextronics.

06/07/2012 — Conference report: IITC closes with talks from EUV to TSV

Day 3 of the 15th IITC (International Interconnect Technology Conference) opened in San Jose, CA under clear sunny skies and a pleasant breeze. The herd thinned a bit, down to ~150 hearty souls from the original 230 the prior two days.

07/12/2011 — Gold pattern transfer/bonding tech for MEMS, LED packaging under dev at SUSS, Tanaka

Tanaka Kikinzoku Kogyo KK will partner with SUSS MicroTec KK to develop pattern transfer and bonding technology using sub-micron gold particles. The companies hope to replace gold bumping, sputtering, and other technologies in MEMS, LED, and 3D IC packaging.

06/22/2011 — 300-450mm manual wafer test probe configuration out from SemiProbe

SemiProbe released a 300mm manual test probe configuration of its Probe System for Life, M-12. The M-12 is field-upgradable to 450mm.

10/01/2010 — Forging a TSV supply chain in a consolidated market

Steve Lerner, Alchimer S.A., Massy, France

10/26/2010 — Nanoplas targets 200mm MEMS and 3D TSV packaging with dry processing tool

Nanoplas toolNanoplas introduced a fully automatic dry-processing batch system for high-volume 200mm production. The DSB 9000A is based on Nanoplas’s High Density Radical Flux (HDRF) technology.

11/30/2009 — IMAPS 2009: Fusion bonding for 3D/TSV, wafer-level/multichip packaging for MEMS

Presentations at this year's International Symposium on Microelectronics (IMAPS, San Jose, Nov. 1-5) included discussion of TSV/3D integration challenges and temporary bonding steps qualified for different process flows, and a wafer-level packaging (WLP) encapsulation process and stacked multi-chip package (MCP) for a MEMS variable capacitor and control IC chip.

10/04/2010 — 3D roadmaps begin to converge

Last month's SEMICON Taiwan 3D Technology Forum shed some insight into what several foundries, assembly houses and customers are thinking about the timing for 3D interposers and full 3D IC, reports Phil Garrou.

04/01/2007 — AP Interview: Ann Witvrouw, manager, MEMS integration research program, IMEC

Advanced Packaging talked with IMEC’s Ann Witvrouw about recent developments in MEMS and CMOS processing, and how the technology could lead to advanced packaging techniques across the spectrum of MEMS structures.

03/01/2007 — API Diversifies with MEMS

TORONTO - API Nanotronics Corp. closed acquisition of National Hybrid Inc.

05/01/2007 — Extreme Environment Advancements

Extreme-environment electronics operate in conditions outside the parameters of mainstream electronics.

03/01/2007 — Sockets Meet Future Technology Challenges: Part I

Though the basic requirement of sockets remains unchanged - making a stable electrical contact from the device to the PCB - the future holds even more demands on this important electrical/mechanical device.

07/01/2007 — Dicing MEMS

Micro-electromechanical systems (MEMS) include a variety of miniaturized intelligent mechanical systems such as accelerometers, flow sensors, motion mirrors, and radio-frequency (RF) devices.

07/01/2007 — IN THE NEWS

AP Welcomes Board MembersAdvanced Packaging Magazine appointed Dirk Baars of Rogers Corporation (Rogers, CT) and Michael Todd, Ph.D., of the electronics group of Henkel (Irvine, CA) to its Editorial Advisory Board. Click here to enlarge imageBaars, director of advanced materials for Rogers Corp., manufacturer of advanced specialty materials for[...]

07/01/2007 — MEMS Market Shows Growth

Micro-electromechanical systems (MEMS) comprise a broad category of packages - sensors, gyroscopes, accelerometers, and more - that attract attention everywhere.

01/01/2007 — The Times, They Are A-changin’

The times, they are a-changin’ - Bob Dylan famously announced in 1964, creaing an anthem for America’s social revolution in the 1960s.

04/19/2012 — Mold packaging meets metal TSV for 5-10x density of conventional substrates

Silex Microsystems brought its Met-Via full-wafer-thickness TSV technology into Chip Architectures by Joint Associated Labs for European Diagnostics, where it is being used to create cost-effective molded chip-level packaging with through metal vias.

03/30/2012 — SUSS buys Tamarack for lithography, laser structuring lines

SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.

04/02/2012 — Conference Report: MEMS Executive Congress Europe

Karen Lightman, the Managing Director of the MEMS Industry Group, blogs from the MEMS Executive Congress Europe, which was held March 20th, in Zurich, Switzerland.


04/02/2012 — SEMICON West heralds 22nm, EUVL, 450mm, mobile electronics speakers

Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.

03/29/2012 — Field Report: Sensors in Design 2012

Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.

02/08/2012 — 2011 ITRS: DRAM, 3D Flash, MEMS, nano scaling steal the show

The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.

02/08/2012 — JPSA expands Ultrafast laser machining technology

JP Sercel Associates, Inc. (JPSA) expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques.

02/08/2012 — UPDATED: Record semiconductor sales in 2011, 2012 outlook

The SIA shows 2011 worldwide semiconductor sales hit $299.5 billion, a 0.4% year-on-year increase and new record. Semico Research's forecast for 2012 shows a 10.11% growth in semiconductors revenues over 2011. Barclays Capital and Strategy Analytics also weigh in.

02/03/2012 — Tokyo Electron (TEL) establishes organic EL and FPD departments, eliminates MEMS dev

Tokyo Electron Ltd. (TEL) restructured its organization, with a new "Organic EL Division" established under GM Takeshi Okubo, as well as other new and consolidating subsidiaries in the semiconductor and liquid crystal production segments.

03/19/2012 — SUSS combines resist coat and develop platforms

SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.

03/19/2012 — CVD Equipment doubles manufacturing space with new NY facility

CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.

03/14/2012 — MATHESON incorporates RFID, pressure monitoring in compressed gas control system

MATHESON debuted the Lasso System, a customer-centric supply chain and inventory management system that can monitor the location and operating status of gas products and other assets in the REAL-Time Gas and Asset Management System.

04/10/2012 — Vacuum pumps improve throughput by 90% with new rotary design

Edwards Limited uncrated the STP-iXR1606 series magnetically-levitated turbo-molecular pumps (TMP) with fully integrated onboard controllers. Its new rotary design improves throughput by about 40% at high gas flow rates; nearly 90% percent in maximum gas flow.

04/10/2012 — Attend joint sessions at VLSI Technology and Circuits

The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.

01/23/2012 — New biochip measures glucose in saliva, not blood

Researchers at Brown University are working on a new sensor, based on plasmaonic interferometers, that can check blood sugar levels by measuring glucose concentrations in saliva instead.

01/19/2012 — Supramolecular researchers install NanoInk lithography system

Researchers at INCDTIM in Romania will use NanoInk's NanoFabrication Systems Division's DPN 5000 system for supramolecular structure fabrication, molecular recognition and self-assembling process applications.

01/18/2012 — Fabs in high-risk zones, 450mm, 3D IC themes of Semico's Semiconductor Fab Database

36% of semiconductor fabs are in high-risk zones, finds Semico, noting the industry disruptions caused by the Japan earthquake and tsunami and Thai flooding and the challenges these presented to chip makers in the regions. 

02/13/2012 — European microelectronics fab database tracks major changes over past 5 years

Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.

01/13/2012 — Apple shares list of suppliers

For the first time, Apple Inc. has publicly published a list of over 150 companies that the electronics giant says represent 97% of its procurement expenditures for materials, manufacturing, and assembly of products worldwide.

01/12/2012 — Qualcomm MEMS Technologies reports 2 e-reader design wins in China

Qualcomm MEMS Technologies Inc.'s mirasol display technology is used in 2 new e-readers for the Chinese market, the Hanvon C18 and the Bambook Sunflower from Shanda Networking.

01/31/2012 — Qualcomm MEMS Technologies brings color display to Jin Yong e-reader

Qualcomm MEMS Technologies Inc. and e-reader provider Koobe announced the next-generation Jin Yong Reader uses MEMS display technology. The original Jin Yong Reader had a black and white display.

01/27/2012 — Apple iPhone 4S steals smartphone show in Q4 2011; Samsung wins the year

While Apple's release of the iPhone 4S in Q4 2011 "unleashed tremendous pent-up demand" from consumers, Samsung used its broad range of smartphones to take the top spot, reports IHS.

04/23/2012 — Metrology tool offers economical price point with high accuracy

Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.

04/19/2012 — EPIC names new director general, promises closer ties with EU

EPIC, the European Photonics Industry Consortium, announced at its annual general meeting that Carlos Lee has been appointed as director general, succeeding Thomas Pearsall, who has led the association since its founding in 2003.

04/19/2012 — Texas Instruments (TI, TXN) names top suppliers

Texas Instruments awarded 15 of its 12,000 suppliers with Supplier Excellence Awards for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality.

04/13/2012 — Conference Report: MRS Spring 2012, Day 4

Blogger Michael A. Fury, Techcet Group, reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: nanowire FETs, laminate MEMS, nanoparticles in security printing, graphene nanoribbons, Ta2O5 memristors, redox flow batteries, graphene, and more.

04/12/2012 — Conference Report: MRS Spring 2012, Day 3

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.

02/20/2012 — International Solid-State Circuits preview: imec's wireless sensor, organic electronics work

At International Solid-State Circuits Conference (ISSCC), imec and Holst Centre are presenting 14 papers on low-power design for wireless communication and wireless sensor networks, and organic electronics.

02/22/2012 — MIT's nanowire growth control method could optimize LEDs, other semiconductors

MIT researchers used gases to precisely control nanowires' width and composition as they grow, which could yield complex structures optimally designed for particular applications, like LED substrates or solar panels.

02/22/2012 — Chip substrate factory begins producing thermal-control substrates in Russia

MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.

05/24/2012 — MEMS Symposium Report: Chasing 1 Trillion

The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.”

05/23/2012 — Present at IEEE IEDM 2012

IEEE International Electron Devices Meeting (IEDM) is seeking original presentations on microelectronics research and development, with a focus on silicon and non-silicon device and process technology, circuit/device interactions; energy-harvesting, biomedical, and power electronics; magnetics and spintronics; and other topics.

03/23/2012 — SEMICON Europa 2012 seeks presenters

SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.

05/02/2012 — Top 50 “internet of things” applications

Libelium, a wireless sensor networks platform provider, has released a list of 54 sensor applications for a smarter world, covering the most disruptive sensor and “internet of things” applications.

05/09/2012 — SEMI lauds Congressman Dave Camp (R-MI) for microelectronics/photovoltaics support

SEMI presented US Congressman Dave Camp (R-MI) with its 2012 North American Government Leadership Award for his leadership and support of the US microelectronics and photovoltaic manufacturing value chain.

04/30/2012 — SST Book Review: Energy Harvesting for Autonomous Systems

Contributing editor Steve Groothuis reviews a book titled “Energy Harvesting for Autonomous Systems (Smart Materials, Structures, and Systems).” The book highlights the progression from the basic principles behind energy harvesting to the comprehensive systems that control the sensing, actuation, and transmission of those devices. 

04/27/2012 — MEI semiconductor wet process tools built to prevent contamination

MEI uses Vycom Flametec PVC-C for chemical rinse tanks and other wafer-contacting elements of its process tools, reducing tool-based contamination and protecting fab workers. Bill McGinty, MEI operations manager, discusses the benefits the new-generation plastic for semiconductor fab tools.

03/09/2012 — Media tablets join top 5 semiconductor end-markets in 2012

Media tablets, experiencing "remarkably rapid ascension," will become the 4th largest application for semiconductors by 2014, up from 35th in 2010, according to IHS.

03/09/2012 — Confovis taps Digital Surf for metrology tool imaging software

Confovis will begin providing MountainsMap imaging and surface analysis software from Digital Surf with its ConfoCAM LED grid-confocal measuring systems for inspection and research.

03/07/2012 — NCSU researchers create functional oxide films

Researchers from North Carolina State University have developed the first functional oxide thin films that can be used efficiently in electronics, opening the door to an array of new high-power devices and smart sensors.

11/06/2012 — GSA working group evaluates new semiconductor startup models to attract investors

The Global Semiconductor Alliance (GSA) has formed a new working group and identify various alternatives to encourage startups to innovate, woo investors, generate returns, and keep generating sustainable industry M&A.

11/02/2012 — O-S-D market momentum fades as world economy stalls

After a strong surge in 2010 and solid growth in 2011, the market for optoelectronics, sensors/actuators, and discrete semiconductors (O-S-D) has lost most of its momentum amid a wobbling world economy, says IC Insights.

10/26/2012 — Comm, auto apps are now driving the IC market

Communications applications are far and away the leading growth market for ICs over the next five years, and PCs and consumer applications have fallen far back in the pack.

10/22/2012 — Semi equipment demand still sinking

In case anyone needed a reminder or a wake-up, new data from SEMI reiterates chip tool sales are slumping badly in the latter part of this year.

10/16/2012 — SEMI adds session, extends abstract deadline for China chip conference

SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.

10/16/2012 — GSA forms technology steering committee to guide working groups

The Global Semiconductor Alliance (GSA) says it has formed a Technology Steering Committee to help address key business and technology areas of interest to its members, and "encourage the advancement and adoption of leading technology and practices."

12/11/2012 — Process Watch: Cycle time’s paradoxical relationship to inspection

In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.

12/11/2012 — IEDM 2012: Late papers on silicon photonics, large TFTs, III-V devices

With this week's IEEE International Electron Devices Meeting (IEDM 2012) now underway, here are four of the papers that were accepted late: on 90nm integrated silicon photonics, ZnNO for next-gen displays, and III-V TFETs for the 7nm node.

12/11/2012 — IEDM: Nanoelectronics provide a path beyond CMOS

At the International Electron Devices Meeting in San Francisco, An Chen of GLOBALFOUNDRIES presented a survey of emerging nanoelectronic devices, which he divided into two categories: Charge-based and non-charge based.

12/11/2012 — IEDM keynote: It tastes like chicken

Attendees at this year’s International Electron Devices Meeting (IEDM) were delighted and perhaps somewhat horrified when the plenary speaker popped some electronics gear in his mouth and proclaimed, “It tastes like chicken!”

12/10/2012 — Sony and Toshiba fight declines with chip spending -- can it work?

Despite weak financial performances, sluggish global markets and strong regional competition, Japanese consumer electronics giants Sony and Toshiba are increasing their investments in new products to revitalize their businesses.

12/06/2012 — SEMI: Chip equipment slump extending into 2013, across-the-board rebound in 2014

Semiconductor equipment demand is persistently sluggish as the industry takes a break from a "multiyear expansion period" to digest recent investments and wrestle with a broader economic slowdown, acknowledges SEMI in its updated year-end forecast. But make no mistake: leading-edge technology investments are still happening, and growth will return in the typical cyclical pattern.

12/06/2012 — KLA-Tencor's updated LED wafer inspection tool boosts throughput, efficiency

KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.

11/12/2012 — MIPI Alliance forms group to study sensor integration in mobile systems

MIPI Alliance has formed an open "Birds of a Feather" (BoF) group that will investigate the requirements related to integrating sensors into mobile systems. The group will address challenges facing the sensor and wireless markets.

11/28/2012 — EV Group completes cleanroom expansion, opens new R&D labs

EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.

11/21/2012 — GSA, IC Insights team on 5th edition of IC Foundry Almanac

A reference book from the Global Semiconductor Alliance (GSA) and IC Insights puts foundry information at the fingertips of those who need it the most.

11/15/2012 — Brewer Science introduces CNT inks for printed electronics

Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.

12/04/2012 — Qualcomm expands IGZO display tech agreement with Sharp

Qualcomm Incorporated announced an expansion of its display technology agreement between its subsidiary Pixtronix, Inc. and  Sharp Corporation to develop and commercialize high-quality color, low-power MEMS displays incorporating IGZO technology.

12/04/2012 — Scholarship created for women going into engineering

TechSearch International and the IEEE Women in Engineering Committee (WIE) are establishing a $2500 scholarship for women going into the field of engineering.

12/28/2012 — Semi execs see a bright 2013, says survey

Industry watchers have been lowering their outlooks for 2013 over the past few weeks, but there's one set of opinions that still see optimism for an industry rebound in 2013 -- chip industry executives themselves.

12/27/2012 — Singapore IME, Nikon building R&D lab for sub-20nm semiconductor litho

Nikon and the Singapore A*STAR IME are jointly setting up a R&D lab to develop optical ArF lithography technology for semiconductor manufacturing to and below the 20nm device node.

12/20/2012 — SMIC claims breakthrough in backside-illuminated image sensors

SMIC is claiming a breakthrough in its development of backside-illuminated (BSI) CMOS image sensor (CIS) technology, with the first test chip demonstrating good image quality even in low-light conditions.

12/20/2012 — Ultratech buys Cambridge Nanotech assets, adds ALD tech

Ultratech has acquired the assets of Cambridge Nanotech, a developer and supplier of atomic-layer deposition (ALD) technology, which had quietly been put on the auction block after ceasing operations in November.

12/18/2012 — Canon stepper targets LED, MEMS, power device manufacturing

Canon U.S.A., Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors.

12/17/2012 — IBM 5 in 5: Five innovations that will change our lives within five years

Each December, IBM unveils the 5 in 5 -- five predictions about technology innovations that will change the way we work, live and play within the next five years.

12/14/2012 — Gartner reduces 2012-2013 chip outlooks, but 2014 looks better

Joining the growing chorus of industry watchers lowering their outlooks on the semiconductor sector, Gartner has reduced both its 2012 and 2013 forecasts for semiconductor sales but is remarkably more bullish on prospects in 2014.

08/06/2012 — Wireless consumer devices reenergize magnetic sensor IC sector

Magnetic sensor semiconductors are robust but steady in application sectors like automotive, military/medical, and data processing. But the devices saw 50% growth in one segment last year: wireless/consumer, according to IHS.

06/26/2012 — Edwards tailors vacuum pump for LED, compound semiconductor manufacturing

Edwards (NASDAQ:EVAC) introduced the new iXH645H dry pump, optimized for metal-organic chemical vapor deposition, a key step in LED and compound semiconductor manufacturing.

06/26/2012 — JPSA picosecond laser micromachining platform reduces debris and thermal damage

JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.

07/13/2012 — Terry Brewer chats about SEMI and semiconductors at SEMICON West

Terry Brewer, one of the newest members of SEMI's North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution.

06/05/2012 — The ConFab: Turning the technology knobs for system scaling

Chip scaling will go on for the foreseeable future, enabling new product with more compute power, more memory, faster on-chip communication. That was one of the conclusions put forth by imec’s An Steegen, speaking on technology trends at The ConFab 2012.

06/04/2012 — @ The ConFab: Semiconductor industry experts look to the future

The ConFab’s sessions opened with “The Economic Outlook for the Semiconductor Industry,” featuring Jackie Sturm of Intel, Dan Hutcheson of VLSIresearch, and Jim Feldhan of Semico.

05/25/2012 — Conference report: MEMS Business Forum

The first MEMS Business Forum, sponsored by MEMS Journal and MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 24 at the Santa Clara Biltmore Hotel. Ten speakers presented on topics ranging from near- and mid-term business opportunities to roles of MEMS in broad visions for the future.

05/25/2012 — ITF: New approaches in the battle against cancer

At imec's International Technology Forum, Denis Wirtz, co-director of the John Hopkins Institute for NanoBio Technology, described the latest efforts to fight cancer.

05/24/2012 — How emerging growth sectors impact the overall semiconductor industry: ConFab preview

Intel's Jackie Sturm will bring to light some of the emerging, growth markets for semiconductors, and what they mean for chipmakers and the fab suppliers in the first session of The ConFab, “The Economic Outlook for the Semiconductor Industry.”

07/06/2012 — Top conference reports from H1 2012

We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.

06/20/2012 — AMAT’s Varian integration continues with Dickerson named president

In mid-2011, semiconductor manufacturing and assembly equipment supplier Applied Materials (NASDAQ:AMAT) acquired Varian Semiconductor Equipment Associates Inc. Now, the company is adding Varian’s former CEO Gary Dickerson as president.

06/13/2012 — Metrology merger: MicroSense acquires SigmaTech

MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.

09/14/2012 — iPhone 5: Which semiconductor suppliers are the big winners?

As the dust settles after the launch of the iPhone 5, analysts tally which suppliers in the semiconductor ecosphere are most likely to gain the most.

09/04/2012 — Singapore IME, MOSIS to offer silicon photonics wafer prototyping service

Singapore's Institute of Microelectronics (IME) and MOSIS have signed a memorandum of understanding (MOU) to offer a multiple-project wafer service targeting silicon integrated photonics.

08/10/2012 — AKM tops magnetic sensor rankings, but competition looms with 6-axis compasses

Propelled by strong sales to tablet and cellphone manufacturers, AKM led the semiconductor magnetic sensor market for the third year in a row in 2011. Of the top-10 magnetic sensor suppliers, Memsic saw the highest growth: 1340%.

08/10/2012 — Laser nanofabrication for mass production at the nanoscale

Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.

10/12/2012 — From fuzzy to focused: Phase I in project development

Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.

10/08/2012 — Semiconductors and healthcare converging

At the recent imec International Technology Forum Press Gathering in Leuven, Belgium, imec CEO Luc Van den hove outlined uses in blood cell sorting, mobile apps for personalized medicine (such as brain monitoring of EEG activity), and advanced bio research.

10/08/2012 — TEL and imec extend partnership into life science related research

Tokyo Electron (TEL) and imec announce the participation of TEL in imec’s bio-research program Human++. The agreement includes collaboration on bio-sensors and specialty imaging.   

10/08/2012 — EEG headset prototype developed

Imec, Holst Centre and Panasonic have developed a new prototype of a wireless EEG (electroencephalogram) headset.

08/17/2012 — Gartner identifies fast-moving technologies with Hype Cycle report

Big data, 3D printing, activity streams, Internet TV, Near Field Communication (NFC) payment, cloud computing and media tablets are some of the fastest-moving technologies identified in Gartner Inc.'s 2012 Hype Cycle for Emerging Technologies.

08/30/2012 — Fraunhofer develops new silicon photomultiplier

Scientists at Fraunhofer Research Institution for Modular Solid State Technologies EMFT, together with Ketek GmbH, have developed a novel, silicon-based optical sensor component called a silicon photomultiplier (SiPM).

08/23/2012 — Technology licensing company Rambus restructures, creates CTO role

Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.

10/04/2012 — Analyst: Fab spending softness 2012 extending into 2013

Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.

10/03/2012 — Japan's semiconductor industry: Fabs, equipment, and materials

Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy,  the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.

10/03/2012 — SIA: Chip sales essentially flat in August

Macroeconomic malaise continues to weigh down global semiconductor sales, although there's a possible ray of hope for a boost by year's end thanks to introduction of much-desired electronics devices (hello iPhone 5).

10/01/2012 — Tezzaron takes over SVTC's Austin fab amid layoff reports

Tezzaron Semiconductor is taking over SVTC Technologies' wafer fab in Austin, TX, amid reports that the semiconductor/MEMS development organization is cutting back activities in Austin and in California.

09/20/2012 — On-board heaters can self-heal flash memories

At the upcoming International Electron Device Meeting, Macronix researchers will describe how they built flash memories that could heal themselves by means of tiny onboard heaters that provide thermal annealing just at the spots where it is needed.

09/18/2012 — imec advances electronics that flex and stretch

imec announced that it has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts dynamically to curving and bending surfaces.

09/18/2012 — IBM demos high-performance CMOS on flexible plastic substrates

At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.

09/17/2012 — IEDM unveils 2012 program highlights

The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.

09/21/2012 — Chip demand still sliding, hopes for soft 3Q landing and recovery

Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.

06/21/2013 — Market participants back microelectronics development potential in Russia

Over 45 percent market participants forecast a positive market trend with their company turnover growth outpacing that of the industry as a whole.

06/21/2013 — Two-dimensional atomically-flat transistors show promise for next-generation green electronics

UC Santa Barbara researchers demonstrate first n-type field effect transistors on monolayer tungsten diselenide with record performance.

06/20/2013 — MEMS for mobile industry will reach $6.4B by 2018

Market demand for new sensors will lead to a $6.4B market by 2018.

06/18/2013 — Multitest VP to discuss quality in 3D assembly at SEMICON West

Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA.

06/11/2013 — SEMI releases report on first quarter 2013 manufacturing equipment billings

SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013.

06/17/2013 — EVG and Dynaloy develop single-wafer cleaning solution

Single-wafer cleaning solution is suitable for 3D-IC/TSV, advanced packaging, MEMS and compound semiconductor applications.

06/11/2013 — Bosch and STM hold joint honors as No. 1 MEMS suppliers for 2012

For the first time ever, no clear winner has emerged to claim top honors in the MEMS business for 2012, with Bosch of Germany and French-Italian STMicroelectronics ending up evenly splitting the title of No. 1 supplier for the year.

06/11/2013 — Alchimer to collaborate with imec on advanced nano-interconnect technologies

In an industry where finer features are driving market needs, current deposition processes are no longer sufficient to address challenges like interconnect dimensions below 16/14nm or high aspect ratio TSVs (>8) without experiencing defects, voids, or low reliability.

06/10/2013 — Necessary attributes of a MEMS engineer for new product development

In the development of new MEMS products, the team is the most important factor.

06/04/2013 — Bosch reaches 3 billion sensor milestone

Since the start of production in 1995, Bosch has manufactured well in excess of three billion MEMS sensors.

06/06/2013 — Leti Innovation Days to present preview of future developments in nanotechnologies

CEA-Leti will present recent advances and a preview of future developments in micro- and nanotechnologies, followed by workshops on key technical fields, during Leti Innovation Days, June 25-28, on the MINATEC campus.

06/06/2013 — "Generation Mobile": Advanced Packaging Technology at SEMICON West

Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.

06/04/2013 — Fab equipment spending: 23% growth for 2014

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.

06/04/2013 — Smartphones forecast to represent over 50% of total cellphone sales for the first time in 2013

A new report from IC Insights shows that we could be on the verge of entering into “the post-PC era.”

05/29/2013 — Leti to present latest R&D results in MEMS at Transducers’ 2013 in Barcelona

CEA-Leti will host a workshop for industrial companies to present its latest advances in MEMS and an overview of the success of its recent MEMS startup, Wavelens, during Transducers’ 2013 and Eurosensors XXVII in Barcelona, Spain.

05/29/2013 — Abu Dhabi doubles down on semiconductor research

ATIC and SRC today launched the ATIC-SRC Center of Excellence for Energy Efficient Electronic Systems (ACE4S), to be hosted jointly in Abu Dhabi by Khalifa University of Science, Technology and Research, and Masdar Institute of Science and Technology.

05/29/2013 — Updated: STMicroelectronics announces sale of ST-Ericsson mobile connectivity GNSS business to Intel

ST-Ericsson, a joint venture of STMicroelectronics and Ericsson, today announced the signature of a definitive agreement to sell the assets and intellectual property rights associated with its mobile connectivity Global Navigation Satellite System (GNSS) business to a semiconductor company.

05/29/2013 — OMRON develops MEMS non-contact thermal sensor utilizing wafer-level vacuum packaging

OMRON Corporation today announced that they have finished development work on the world's first infrared sensor manufactured with wafer-level vacuum packaging technology to create a 16x16 element MEMS non-contact infrared thermal sensor capable of highly precise 90-degree area detection.

05/17/2013 — STMicroelectronics announces winners of the iNEMO Design Contest 2013

The winning teams successfully conceptualized, developed and built demonstrable prototypes of entirely new applications using ST's iNEMO MEMS sensor-fusion modules.

05/16/2013 — EU announces achievements of three-year power microelectronics program

LAST POWER, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements.

04/23/2013 — New nanowire structure has potential to increase semiconductor applications

New research led by University of Cincinnati physics professors Howard Jackson and Leigh Smith could contribute to better ways of harnessing solar energy, more effective air quality sensors or even stronger security measures against biological weapons such as anthrax

04/23/2013 — Critical updates on EUV, 3D transistors and 450mm manufacturing at SEMICON West 2013

The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing.

04/23/2013 — M2M Forum 2013 explores MEMS and the future of medical devices

MEMS Industry Group (MIG), a global industry organization with more than 140 member-companies and partners, will welcome micro-electromechanical systems (MEMS), medical industry and academic experts to Cambridge, Mass. for Member-to-Member (M2M) Forum 2013, a conference on the MEMS connection to advancements in healthcare, medical and biomedical applications.

04/23/2013 — AG Semiconductor appoints new senior director of sales

AG Semiconductor Services today announced that Michael (Mike) Mardesich has joined the company in the role of senior director of sales.

04/23/2013 — MEMSIC to be acquired by IDG-Accel China

MEMSIC, Inc., a MEMS solution provider, today announced that it has agreed to be acquired by IDG-Accel China Capital II, L.P. and its affiliates MZ Investment Holdings Limited and MZ Investment Holdings Merger Sub Limited, for $4.225 per share in cash.

04/22/2013 — SAMCO to relocate and expand Silicon Valley office

SAMCO Inc, head quartered in Kyoto, Japan, has expanded its OPTO Films Research Laboratory in California’s Silicon Valley in order to strengthen its research structure and after-sale process support.

04/22/2013 — Automotive, wireless applications to drive pressure sensors to become top-selling MEMS devices

MEMS pressure sensors will achieve accelerated growth this year and become the leading type of MEMS device, driven by increasing use in automotive and the fast-growing handset space, according to insights from the IHS iSuppli MEMS & Sensors Service from information and analytics provider IHS.

04/22/2013 — University of Illinois researchers measure behavior of semiconductor plasmonic microparticles

Recent progress in the engineering of plasmonic structures has enabled new kinds of nanometer-scale optoelectronic devices as well as high-resolution optical sensing.

04/22/2013 — STMicroelectronics’ SoC powers next-generation smart IPTV set-top boxes

STMicroelectronics has revealed that its Orly system-on-chip (SoC) is powering a new generation of advanced set-top boxes announced on April 17 from NTT Plala Inc., an Internet / IPTV service provider in Japan. This STB has been developed by Sumitomo Electric Networks, Inc., a Japanese equipment producer for home entertainment and broadband service providers, with operations around the world.

05/06/2013 — Element Six and Delft University demonstrate milestone in solid-state diamond research

Element Six last week announced, in collaboration with Delft University of Technology, the entanglement of electron spin qubits (quantum bits) in two synthetic diamonds separated in space.

05/03/2013 — IEDM announces 2013 call for papers

The 59th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking original work in microelectronics research and development. The paper submission deadline is Monday, June 24, 2013.

05/02/2013 — Intel board elects Brian Krzanich as CEO, Renée James as President

Intel announced that the board of directors has unanimously elected Brian Krzanich as its next chief executive officer (CEO), succeeding Paul Otellini. The board also named Renée James, 48, to be president of Intel.

05/01/2013 — SRC and NSF partner to develop compact models for emerging nanotech

Semiconductor Research Corporation (SRC) recently joined the National Science Foundation (NSF) as a partner in an ongoing NSF project to further develop compact models of emerging nanoelectronic devices such as might be used in next-generation consumer electronics.

05/01/2013 — IBM Research makes world’s smallest movie using atoms

Scientists from IBM today unveiled the world's smallest movie, made with one of the tiniest elements in the universe: atoms. Named "A Boy and His Atom," the Guinness World Records -verified movie used thousands of precisely placed atoms to create nearly 250 frames of stop-motion action.

05/01/2013 — Leading MEMS microphone suppliers ride Apple’s gravy train to the top

Once again demonstrating Apple’s power to ordain winners in the electronics supply chain, the top suppliers last year of microelectromechanical systems microphones were those that provided devices for iPhones and iPads.

04/30/2013 — Kurt Petersen, MEMS industry pioneer and technology vision, joins IMT board of directors

IMT, the largest pure-play MEMS foundry in the US, announced today the appointment of MEMS industry pioneer and technology visionary Dr. Kurt Petersen to the IMT board of directors.

03/06/2013 — Short-range wireless technology IC market to reach almost 5 billion units shipped in 2013

The total market for open short-range wireless (SRW) technology based ICs, such as Bluetooth, Wi-Fi, ZigBee, NFC, and GPS, is expected to reach almost 5 billion units in 2013 and grow to nearly 8 billion by 2018, according to ABI Research. This includes standalone wireless connectivity ICs, wireless connectivity combo ICs, and also platforms with integrated wireless connectivity.

05/09/2013 — A new way to discover and monitor defects

In the world of optical defect inspection, finding on defect on a 300mm wafer can be like trying to find a single coin on the island of Taiwan. Now imagine being able to find that coin in just an hour, along with any other coins that look exactly like it.

05/09/2013 — First quarter 2013 reports slight decrease in silicon wafer shipments

Worldwide silicon wafer area shipments decreased during the first quarter 2013 when compared to fourth quarter 2012 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

05/08/2013 — Second phase of Nanoelectronics Research Initiative to focus on post-CMOS electronics

SRC and NIST will provide a combined $5 million in annual funding for three multi-university research centers tasked with demonstrating non-conventional, low-energy technologies that outperform current technologies on critical applications in 10 years and beyond.

05/23/2013 — Photonics societies launch the National Photonics Initiative to increase R&D and economy

Photonics societies across the United States today announced the launch of the National Photonics Initiative.

05/22/2013 — IDC predicts semiconductor market to experience 3-4% revenue growth in 2013

IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.

04/29/2013 — China becomes world’s leading PC market in 2012

China rose to the top of the PC market for the first time ever on an annual basis last year, relegating the United States to second place with a lead of more than 3 million units, according to an IHS iSuppli PC Dynamics Market Brief from information and analytics provider IHS.

04/26/2013 — Handset market grows in Q1, despite Samsung and Apple’s different approaches

An estimated 405 million handsets, including 197 million smartphones, were shipped in the first quarter of 2013, according to market intelligence firm ABI Research.

04/26/2013 — TSMC


04/25/2013 — Dongbu HiTek starts volume production of ALPS chips for Clairpixel

Dongbu HiTek today announced that it has begun volume production of Ambient Light Proximity Sensor (ALPS) chips for Clairpixel Co., Ltd., a Korean company specializing in single-chip image and motion sensor solutions for mobile, automotive, medical and security applications.

04/25/2013 — Breakthroughs in transistors and more to be discussed at VLSI Symposia 2013

About 1,000 of the world’s leading experts in the field of microelectronics will gather here for the 2013 Symposia on VLSI Technology and Circuits, from June 11-13, 2013 (Technology) and from June 12-14, 2013 (Circuits).

04/25/2013 — A*Star and Veredus create first lab-on-chip for the detection of tropical infectious diseases

The Agency for Science, Technology and Research (A*STAR) and Veredus Laboratories, a supplier of innovative molecular diagnostic tools, announced the launch of VereTropTM, the first biochip in the molecular diagnostics market that can identify 13 different major tropical diseases from a single blood sample.

04/24/2013 — Nanowires grown on graphene have surprising structure

When a team of University of Illinois engineers set out to grow nanowires of a compound semiconductor on top of a sheet of graphene, they did not expect to discover a new paradigm of epitaxy.

04/11/2013 — Personal computer shipments post worst quarter on record, says IDC

In another sign of the worldwide shift in preferred personal devices, PC shipments posted the steepest decline ever in a single quarter, according to the International Data Corporation Worldwide Quarterly PC Tracker (IDC).

04/11/2013 — Memory, foundry and LED markets drive fab spending in southeast Asia

Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.

04/11/2013 — Carnegie Mellon research team develops edible electronics for medical device industry

It sounds futuristic, but today Carnegie Mellon University researchers are developing edible electronic devices that can be implanted in the body to improve patient care.

04/10/2013 — Fourth-quarter reprieve spurs 2013 rebound for semiconductor makers

Despite stronger-than-expected growth during the fourth quarter, 2012 was still a miserable year for the semiconductor market and suppliers, with only eight out of the Top 25 chipmakers managing to eke out revenue growth—but nine suffering double-digit declines.

04/10/2013 — Veredus confirms VereFlu lab-on-chip detects the current subtype of avian flu

Veredus Laboratories today announced that the current version of VereFlu detects the current subtype of H7N9 (Avian Flu) that is responsible for the flu outbreak in China. H7N9 is the latest mutation to cause concern and increased surveillance in the region.

04/09/2013 — Health awareness spurs quadrupling in MEMS sensor market for wearable electronics

From smart wristwatches that record heart rates, to intelligent armbands that track physical activities, wearable electronics and fitness monitoring devices are attracting increased attention from health-conscious consumers, causing shipments of MEMS sensors used in these products to more than quadruple in just five years.

04/09/2013 — memsstar appoints Tony McKie CEO

memsstar Limited, a provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and MEMS, today announced the appointment of Tony McKie as its new chief executive officer (CEO). McKie is tasked with capitalising on the company's experience and reputation in the semiconductor and MEMS markets to drive its growth.

04/09/2013 — SEMI reports 2012 global semiconductor materials sales of $47.1 billion

The global semiconductor materials market decreased 2 percent in 2012 compared to 2011 while worldwide semiconductor revenues declined 3 percent. Revenues of $47.11 mark the first decline in the semiconductor materials market in three years.

04/09/2013 — Researchers find surface diffusion plays significant role in shapes of catalytic nanoparticles

Controlling the shapes of nanometer-sized catalytic and electrocatalytic particles made from noble metals such as platinum and palladium may be more complicated than previously thought.

05/15/2013 — Opportunities for electronics manufacturing services in medical industry are increasing

Original equipment manufacturers (OEMs) are increasingly turning to electronics manufacturing service (EMS) providers to better handle the escalating volumes of electronic content in the medical industry.

05/15/2013 — Trends and techniques in sensor fusion to be discussed at 2013 Sensors Expo and Conference

MEMS Industry Group (MIG) today announced its conference and exposition line-up for the 2013 Sensors Expo and Conference.

05/14/2013 — MEMS New Product Development Blog: The technology development process and design review checklist

After a functional A-sample prototype is built, it doesn't take long for a project to gain traction that has market pull.  This is usually the point that a project becomes highly visible within a company and it enters the Technology Development Process (TDP).

05/13/2013 — Combo MEMS inertial sensors report brisk growth in automotive market

Combo MEMS sensors for automotive applications are off to another exhilarating ride this year as revenue continues to climb, spurred by rapidly accelerating use in car safety systems.

05/10/2013 — New magnetic graphene may revolutionize electronics

Researchers from IMDEA-Nanociencia Institute and from Autonoma and Complutense Universities of Madrid have managed to give graphene magnetic properties.

04/19/2013 — Bluetooth chip shipments to nearly double by 2017

The market for Bluetooth semiconductors is expected to boom by nearly 100 percent from 2011 to 2017, with the majority of the growth driven by demand for wireless combination integrated circuits (ICs) and mobile system-on-chip (MSoC) devices with integrated wireless connectivity that are used in mobile devices like smartphones and media tablets.

04/19/2013 — SEMI reports March book-to-bill ratio of 1.14

North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.

04/19/2013 — Top 30 MEMS companies of 2012

The fast growing market for sensors for smart phones is re-shuffling the ranks of MEMS suppliers. For the first time, suppliers of inertial sensors have surpassed the major makers of micro mirrors and inkjet heads that have long dominated the industry on Yole Développement’s annual ranking of the Top 30 MEMS companies.

04/18/2013 — Smartphones, tablets, SSDs propelling NAND flash sales in 2013

Increasing HD video content, social networking, shared data via the cloud, low power consumption, and “instant on” features continue to drive growth of consumer, communication, and computing devices that use NAND flash memory.

04/17/2013 — “Smart Skin” sensors could provide remote monitoring of aging infrastructure

Researchers at the Georgia Institute of Technology are developing a novel technology that would facilitate close monitoring of structures for strain, stress and early formation of cracks.

04/17/2013 — Examining the MEMS gyroscope patent landscape

The gyroscope market is driven by mobile applications, where until recently only two players, STMicroelectronics (ST) and InvenSense, were competing.

04/16/2013 — New microbatteries could mean a big boost for electronics

Though they be but little, they are fierce. The most powerful batteries on the planet are only a few millimeters in size, yet they pack such a punch that a driver could use a cellphone powered by these batteries to jump-start a dead car battery – and then recharge the phone in the blink of an eye.

04/16/2013 — Layered '2-D nanocrystals' are a promising new semiconductor

Researchers are developing a new type of semiconductor technology for future computers and electronics based on "two-dimensional nanocrystals" layered in sheets less than a nanometer thick that could replace today's transistors.

04/15/2013 — Thin-layer germanium may replace silicon in semiconductors

Chemists at Ohio State University have developed the technology for making a one-atom-thick sheet of germanium, and found that it conducts electrons more than ten times faster than silicon and five times faster than conventional germanium.

04/15/2013 — SPIE leaders encouraged by increased science funding in Obama budget proposal

Proposed increases in funds for scientific R&D and a greater emphasis on STEM education in the 2014 budget proposal announced by the White House this week reflect the President’s commitment to science and engineering, SPIE leaders said.

04/12/2013 — Net loss for netbooks: Product set for extinction by 2015

Once a white-hot PC product that sold in the tens of millions of units annually, netbook computers are now marking their final days, with the rise of tablets causing their shipments to wind down to virtually zero after next year, according to an IHS iSuppli Compute Electronics Market Tracker Report from information and analytics provider IHS.

04/11/2013 — Cracking the potential of the glass wafer market

Over the last few years, glass has gained considerable interest from the semiconductor industry due to its very attractive electrical, physical and chemical properties, as well as its prospects for a relevant and cost-efficient solution. The application scope of glass substrates in the semiconductor field is broad and highly diversified.

02/22/2013 — Corporate partnership produces next generation MEMS handler

TESEC Corporation today announced the development and sales of the ULTRA MEMS Handler, targeting Inertial (Accelerometer, Gyroscope and Magnetometer) MEMS devices.

02/22/2013 — Painting with catalysts: Nano-engineered materials for detoxifying water

Only light, aerial oxygen, and a catalyst are needed to remove pollutants from water. Ruhr-Universitat Bochum researchers led by Professor Radim Beránek are collaborating with colleagues from seven different countries in order to develop a photocatalyst that is efficient enough to be profitable.

02/22/2013 — UNL research moving closer to cracking silicon barrier

The ability to improve silicon transistors is reaching its fundamental limit, so researchers are searching for new ways to keep making electronic devices faster and more powerful. University of Nebraska-Lincoln physicists and colleagues have taken a major step toward breaking that silicon barrier.

02/21/2013 — Key patent analysis on quantum dot displays released

The quantum dot recently emerged as a next-generation display material. Quantum dots, whose diameter is just a few nanometers, are semiconductor crystals.

02/21/2013 — Report delivers latest analysis on nanobiotechnology applications, markets and companies

Nanobiotechnology, an integration of physical sciences, molecular engineering, biology, chemistry and biotechnology holds considerable promise of advances in pharmaceuticals and healthcare.

01/03/2013 — 2013: Beyond CMOS, steady growth and accelerating change across non-mainstream chip markets

Sensors and optoelectronics will continue to grow faster than the mainstream semiconductor market. We currently expect 9%-13% growth in these sectors in 2013, accompanied by rapid changes in technology and  market structures.

01/03/2013 — 2013: The year of the diamond?

Recent advances in diamond applications (diamond-on-silicon, MEMS, optical) suggest that its utilization into a broader scope of commercial products is not far away.

01/03/2013 — 2013: MEMS devices better, faster, smaller

While the consumer market continues to evolve and the demand for better, faster, smaller increases even further, MEMS should continue to grow and find success as they are designed into more and more devices.

01/02/2013 — 2013: Building the internet of things with MEMS and 3D advances

It is becoming increasingly clear that new MEMS and 3D high-volume, low-cost manufacturing technologies will accelerate a radical change to society’s cyber skyline.

01/02/2013 — 2013: Look for continued consolidation

In 2013, it is anticipated that M&A transaction activities will increase and result in further consolidation of the semiconductor supply chain.

01/02/2013 — 2013: The beginning of the next IC industry upturn

2013 will mark the beginning of the next cyclical upturn—one in which the IC market CAGR will more than triple to 7.4% in the 2012-2017 time period.

02/13/2013 — Global market for MEMS microphone to more than double in five years

The global market for MEMS microphones has reached approximately $422 million in 2012. The market is predicted to increase to $865 million in 2017.

02/13/2013 — MEMS devices shape medical industry, microsystem devices to reach $6.6 billion in 2018

Microelectromechanical (MEMS) devices are shaping the competitive landscape in the global medical device industry.

02/12/2013 — 10 IC product segments to exceed total IC market growth in 2013

Tablet and cellphone processors, NAND flash, and telecom-specific ICs to enjoy best growth.

02/12/2013 — Solid state thin film batteries market worth $6 Billion by 2019

Markets for solid state thin-film batteries at $65.9 million in 2012 are anticipated to reach $5.95 billion by 2019, according to a new report released by

02/11/2013 — ISSCC 2013: Imagers, MEMS, medical and displays

Roland Thomas, subcommittee chair of ISSCC, writes of the substantial growth and future in key areas of technology.

02/11/2013 — Tronics to produce submicron MEMS technology of CEA-LETI

Tronics kicks-off the industrialization of a unique piezoresistive nanowire MEMS technology that can take 9 DOF motion sensors to a new level of competitiveness.

02/11/2013 — Opinion: MEMS new product development: The first prototype

In the second article of the MEMS new product development blog, the importance of the first prototype will be discussed.

02/07/2013 — STMicroelectronics and University of Amsterdam Faculty of Science use advanced MEMS to soar with birds

STMicroelectronics and the University of Amsterdam Faculty of Science have announced that a sophisticated bird-tracking system developed by the university is using advanced MEMS sensing technology from ST.

02/07/2013 — MEMS revenue to climb a healthy 8 percent this year

A strong uptake in consumer and mobile devices will power the market for microelectromechanical systems (MEMS) to solid revenue growth in 2013, with breakthroughs in new sensor applications also expected this year, according to insights from the IHS iSuppli MEMS service at information and analytics provider IHS.

02/05/2013 — Agilent Technologies commits $90 million gift of software to Georgia Institute of Technology

Agilent Technologies Inc. announced yesterday the intent to donate a $90 million in software to Georgia Institute of Technology, the largest in-kind software donation ever in its longstanding relationship with the university.

02/04/2013 — Hard disk drive market revenue set for double-digit decline

Facing a relentless onslaught from tablets, smartphones and solid state drives (SSD), global hard disk drive (HDD) market revenue in 2013 will decline by about 12 percent this year, according to IHS.

02/04/2013 — FAME center to focus on advanced electronics

Five University of California, Riverside professors will receive a total of $5 million as part of a $35 million research center aimed at developing materials and structures.

01/31/2013 — A*STAR and PGS to collaborate on MEMS sensor for oil and gas applications

A*STAR’s Institute of Microelectronics signed an agreement to collaborate with Petroleum Geo-Services to develop a high performance MEMS-based sensor for deep sea seismic oil and gas exploration.

02/15/2013 — STMicroelectronics and Hyundai Autron cooperate to develop integrated products for next-generation vehicles

Joint effort will drive innovative engine-train and smart-power products

02/15/2013 — Institute of Microelectronics and Stanford University to develop switch technology for efficiency in mobile devices

A*STAR’s Institute of Microelectronics, or IME, and Stanford University will collaborate to advance innovations in nano-electromechanical systems (NEMS) switch technology for ultra-low power digital systems.

02/14/2013 — APIX Technology introduces gas chromatography device based on silicon nano-scale components

GCAP targets a range of industrial applications as well as research labs, advanced gas analysis and biomedical screening.

02/14/2013 — SEMI announces Silicon Innovation Forum to bridge funding gaps for early-stage companies

SEMI, in collaboration with strategic investing groups throughout the global semiconductor industry, has announced the Silicon Innovation Forum, or SIF, to bridge funding gaps for new and early-stage companies with valuable semiconductor manufacturing and technology solutions.

02/14/2013 — Smartphones and tablets drive continued double-digit growth in MEMS motion sensor market

Smartphones and media tablets continue to the prime movers of technology industries, with the two mobile platforms spurring a double-digit increase in the market for microelectromechanical system (MEMS) motion sensors this year.

01/15/2013 — ISS 2013: Semiconductor leaders see massive industry transformation

The rise in mobile computing, changes to the fabless-foundry model, uncertainties in technical innovation, and global macroeconomic trends are becoming the dominant forces in 2013 and beyond, according to industry leaders speaking at this week's SEMI Industry Strategy Symposium (ISS).

01/09/2013 — CES 2013: The brains behind smart devices are front and center

Components are prominent this year, on the main stage, and the CES exhibit floors.Todd Traylor of Smith & Associates reports.

01/09/2013 — Opinion: MEMS new product development, a sellable plan

In David DiPaola's blog, he discuss the critical factors needed for success in the early stage of new MEMS product development.

01/04/2013 — IDC: Semiconductor revenues will grow 4.9% in 2013

The International Data Corporation is forecasting that semiconductor revenues worldwide will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% from 2011-2016.

01/04/2013 — SIA: November chip sales best of the year

Global semiconductor sales in November 2012 were the largest monthly tally of the entire year,according to the SIA -- and growth was especially sparkling in the North America region.

01/04/2013 — 2013: Healthy revenue growth, but capex likely flat

Based on current indications, capital spending would seem to be flat in 2013.  However, Semico predicts healthy revenue growth this year, which may encourage more spending, particularly in the second half of the year.  This may bring total capex for 2013 into the positive range.

01/29/2013 — memsstar lands multiple MEMS etch R&D system orders in Asia

memsstar Limited announced two etch system order wins from new MEMS customers in Asia

01/28/2013 — SiTime expands portfolio with +125C MEMS oscillators

SiTime Corp. introduced the SiT8920 MEMS oscillator for industrial and high reliability applications.

01/28/2013 — MEMS Industry Group announces MEMS Executive Congress Europe 2013

MEMS Industry Group (MIG) will host its second annual MEMS Executive Congress® Europe, March 12, 2013 in Amsterdam.

01/25/2013 — Samsung, Apple swap spots as top chip consumers, while total market lags

Given the ascension of smartphones, it's no surprise that Samsung and Apple remain far and away the biggest end-users of semiconductors, and are widening their lead on the rest of the field, according to the latest Gartner rankings.

01/17/2013 — World’s most complex 2d laser beamsteering array demonstrated

DARPA researchers have recently demonstrated the most complex 2-D optical phased array ever. The array, which has dimensions of only 576µm x 576µm is composed of 4,096 (64 x 64) nanoantennas integrated onto a silicon chip.

02/20/2013 — Researchers create semiconductor 'nano-shish-kebabs' with potential for 3-D technologies

Researchers at North Carolina State University have developed a new type of nanoscale structure that resembles a “nano-shish-kebab,” consisting of multiple two-dimensional nanosheets that appear to be impaled upon a one-dimensional nanowire.

12/04/2012 — Energy-Efficiency Trends

Attribution: By gillyberlin (Flickr: Motorola Milestone Test) [CC-BY-2.0 (], via Wikimedia Commons Demand for mobile functionality to achieve enhanced productivity, a better social-networking experience and improved multimedia quality continues to drive innovation in technologies that will deliver these objectives in an energy and cost-efficient manner. Subcommittee[...]

12/04/2012 — Analog Trends

Subcommittee chair Bill Redman-White of NXP/Southhampton University in the United Kingdom discusses the global challenges facing analog circuit research. While the manipulation and storage of information is efficiently performed digitally, the conversion and storage of energy must fundamentally be performed with analog systems. As a result, the key technologies[...]

12/04/2012 — RF Trends

The RF chips presented at ISSCC 2013 confirm that RF devices will continue to see larger levels of integration at the chip- and package- level for years to come. This year has shown increased innovation, integration and technical maturity across RF frequency bands. ISSCC authors will present on an[...]

12/04/2012 — High-Performance Digital Trends

As technology continues to scale to finer dimensions, large caches are being integrated into microprocessor die. This chart shows the general trend of large cache integration. Subcommittee chair Stefan Rusu of Intel in Santa Clara, CA will present on trends in high-performance digital. The relentless march of process technology[...]

12/04/2012 — Large-Area Flexible Electronics Trends

The prime application for thin-film-transistors are backplanes for active-matrix displays, including in particular flexible displays. They are well-suited for integration with temperature or chemical sensors and more. Hoi-Jun Yoo of KAIST in South Korea presents. Technology directions in the field of large-area and low-temperature electronics focuses on lowering the[...]

12/04/2012 — Imagers, MEMs, Medical & Displays

The market for MEMS sensors is becoming more robust with demands coming from automotive, industrial, mobile and scientific markets. By Uploaded by Michael Schmid (Cropped image from [1]) [Public domain], via Wikimedia Commons. Since 2010, there has been growth beyond expectations in the adoption of mobile devices, e.g[...]

02/19/2013 — ISSCC 2013 Slideshow: Highlights

ISSCC, the International Solid-State Circuits Conference, is being held on February 17-21, 2013, at the San Francisco Marriott Marquis Hotel. This year, in honor of the conference’s 60th anniversary, we have assembled highlights of the topics and trends that are being discussed.

12/04/2012 — Memory Trends

Memory capacity trend of emerging nonvolatile memories will be discussed by Kevin Zhang of Intel in Oregon. Subcommittee chair Kevin Zhang of Intel will be discussing trends in memory in 2013. According to Zhang, we continue to see progressive scaling in embedded SRAM, DRAM, and floating-gate based Flash for[...]

02/19/2013 — DRS Technologies and Cypress Semiconductor reach agreement to manufacture uncooled detectors

DRS Technologies, Inc., a Finmeccanica Company, and Cypress Semiconductor Corp. (NASDAQ: CY) today announced that DRS will transfer its Microbolometer technology for uncooled infrared detectors to Cypress for high-volume manufacturing.

02/19/2013 — Manufacturing innovations to drive MEMS equipment market to a >5% CAGR over 2012-2018

In its new report MEMS Front-End Manufacturing Trends, Yole Développement goes further in the equipment and materials market forecasts and in the manufacturing trends for MEMS. The report gives detailed analyses about MEMS device technology process flow, manufacturing trends and manufacturing cost breakdown.

02/26/2013 — Infographic: Computers with human senses

We are entering the era of cognitive systems, where electronic devices will mimic the human senses—in their own way, to see, smell, touch, taste and hear. IBM assembled this infographic to illustrate what they call the “5 in 5,” five innovations that will change our lives within five years.

02/25/2013 — Tech spending still strong, despite economic volatility

China looks a good bet to be the engine of growth again in 2013, while U.S. will see improving PC market and more software growth.

02/25/2013 — UCLA researchers refine 'NanoVelcro' device to grab single cancer cells from blood

Improvement in nanotechnology enables 'liquid biopsies' for metastatic melanoma.

02/25/2013 — JEDEC elects two new members to its Board of Directors

JEDEC Solid State Technology Association, a developer of standards for the microelectronics industry, announced today that its Board of Directors has appointed two new members: Mr. Jong H. Oh, Vice President, SK hynix and Mr. Hung Vuong, Qualcomm. 

02/25/2013 — Toshiba develops CMOS image sensor for small and low power applications

Toshiba Corporation announced the development of a CMOS image sensor with a small area and low power pixel readout circuits. A sample sensor embedded with the readout circuits shows double the performance of a conventional one. Toshiba presented this development at ISSCC 2013 in San Francisco, CA on Feb. 20.

03/06/2013 — eMemory’s eNVM SIPs reach 5 million wafer production record

eMemory announced today that the accumulated number of customers’ wafers incorporating eMemory’s eNVM SIPs have now surpassed 5 million production mark.

03/06/2013 — NIST quantum refrigerator offers extreme cooling and convenience

Researchers at the National Institute of Standards and Technology (NIST) have demonstrated a solid-state refrigerator that uses quantum physics in micro- and nanostructures to cool a much larger object to extremely low temperatures.

03/06/2013 — Fab Spending Forecast: Equipment spending is expected to remain flat in 2013

Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.

03/05/2013 — Smart new sensor fusion chip enables mobile devices to operate multiple sensors

PNI Sensor Corporation and EM Microelectronic -Marin SA announce the introduction of the Sentral sensor fusion hub: a new, highly effective way to integrate complex motion sensors on mobile devices.

03/05/2013 — Toshiba develops intelligent, wearable vital signs sensor module

Toshiba Corporation today announced that it has developed an intelligent vital signs sensor module: Smart healthcare Intelligent Monitor Engine and Ecosystem with Silmee, that simultaneously senses information on key vital signs, Electric Cardio Gram, pulse, body temperature and movements, and that can deliver the data to smartphones and tablet PCs with wireless technology.

03/05/2013 — EV Group to develop equipment to enable covalent bonds at room temperature

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature.

03/01/2013 — Avnet Memec signs agreement with MEMS sensor line

InvenSense, Inc. and Avnet Memec this week announced the formation of a pan-European distribution agreement. With the new partnership, Avnet Memec is chartered with sales and support for InvenSense’s MotionTracking devices throughout Europe and Israel.

03/14/2013 — Seven opto-sensor-discrete products achieved record sales in 2012

O-S-D’s marketshare of total semiconductor sales in 2012 was highest since 1991. Seven O-S-D product categories and device groups reached record-high sales in 2012 compared to 14 new records being set in 2011, according to data shown in the 2013 edition of IC Insights’ O-S-D Report.

03/13/2013 — Yoon-Woo Lee of Samsung Electronics to give keynote address at The ConFab 2013

Solid State Technology is proud to announce that Yoon-Woo Lee will be speaking at The ConFab 2013. The event will be held June 23-26, 2013 at The Encore at The Wynn in Las Vegas. Lee is the Executive Advisor of Samsung Electronics.

03/13/2013 — Avago MEMS Filter: The highest volume production MEMS using TSV

System Plus Consulting analyzed a BAW MEMS Filter manufactured by Avago Technologies, assessing its manufacturing process, costing results and breakdown. With more than 1 billion units produced per year and a market share of 65%, System Plus Consulting found that Avago Technologies clearly dominates the BAW filter market. Avago BAW filters are all-silicon MEMS devices manufactured with Avago's FBAR and Microcap technologies.

03/12/2013 — ATLIS Semiconductor selected as IBM Microelectronics’ long-term foundry partner for 180nm SOI technology

ALTIS Semiconductor, a global specialty foundry based in France, announced today the finalization of a foundry agreement with IBM Microelectronics. Under the terms of this agreement, ALTIS will be the foundry partner for the IBM 180nm SOI technology. ALTIS will deliver high volume products starting Q2 2013 and will secure capacity increase for 2014 and beyond to address the IBM forecasted demand.

02/28/2013 — MEMS microphone shipments to climb 30% this year

Shipments of MEMS microphones in 2012 amounted to 2.05 billion units, up 57% from 1.30 billion in 2011, according to IHS iSuppli. Shipments will climb by another 30% to 2.66 billion units in 2013, to be followed by at least three more years of notable double-digit-rate increases.

02/28/2013 — Brooks Instrument to launch new mass flow controller at SEMICON China

Brooks Instrument, a provider of flow measurement and control instrumentation to the microelectronics industry, will launch the GF135 pressure transient insensitive (PTI) mass flow controller at SEMICON China, March 19-21 at Shanghai New International Expo Center.

02/27/2013 — Emerging technologies create strong opportunity for automotive ICs

New automotive technologies that go beyond touchscreens, satellite radio, and voice-activated GPS commands are being tested and improved, and will soon begin to appear in many more new car models, resulting in solid growth for the automotive IC market through 2016.

02/27/2013 — STMicroelectronics is first $1 billion MEMS company

Yole Développement’s research has credited STMicroelectronics for capitalizing on the booming demand for MEMS in mobile devices by shipping 58% more MEMS units in 2012, to become the first company to reach $1 billion in MEMS sales.

02/26/2013 — Connecting the (quantum) dots

New spin technique moves researchers at the University of Pittsburgh and Delft University of Technology closer to creating the first viable high-speed quantum computer.

03/26/2013 — IDT announces world’s lowest jitter MEMS oscillators with integrated frequency margining capability

Integrated Device Technology, Inc. yesterday announced the industry’s first differential MEMS oscillators with 100 femtosecond (fs) typical phase jitter performance and integrated frequency margining capability.

03/25/2013 — “State of the MEMS Industry” market study to be presented at Smart Systems Integration Conference

Roger Grace to present MEMS Commercialization Report Card at annual international technical forum.

03/25/2013 — ASU scientists develop innovative twists to DNA nanotechnology

In a new discovery that represents a major step in solving a critical design challenge, Arizona State University Professor Hao Yan has led a research team to produce a wide variety of 2-D and 3-D structures that push the boundaries of the burgeoning field of DNA nanotechnology.

03/25/2013 — SPIE volunteers urge Congress to boost jobs, economy through photonics support

Volunteers sponsored by SPIE, the international society for optics and photonics, were in Washington, D.C., last week to thank Congressional representatives for recent support for photonics R&D and to urge future support for in several key areas vital to economic growth and scientific progress.

03/25/2013 — IME to address copper interconnects reliability issues at Copper Wire Consortium

The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) in Singapore, has launched the Copper (Cu) Wire Bonding Consortium II. The consortium which rides on the successes of Phase I launched in 2010 aims to improve the reliability of semiconductor devices by tackling copper wire bonding issues related to corrosion and stress.

03/22/2013 — North American semiconductor equipment industry posts February 2013 book-to-bill ratio of 1.10

North America-based manufacturers of semiconductor equipment posted $1.07 billion in orders worldwide in February 2013 (three-month average basis) and a book-to-bill ratio of 1.10, according to the February Book-to-Bill Report published today by SEMI.  A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.

03/22/2013 — MEMS new product development, critical design and process steps for successful prototypes (Part 1)

In the third article of the MEMS new product development blog, critical design and process steps that lead to successful prototypes will be discussed.

03/22/2013 — Non-volatile memory market report: Drivers and challenges of emerging memory technologies

Next generation memories are the emerging non-volatile memory technologies, which are expected to replace existing memories. However, not all existing memories will be replaced.

03/12/2013 — STMicroelectronics requests ITC investigation of InvenSense

STMicroelectronics yesterday filed a complaint with the United States International Trade Commission (ITC). The complaint requests that the ITC initiate an investigation into the alleged infringement of five ST patents covering all of InvenSense, Inc.'s MEMS device offerings, as well as products from two of InvenSense's customers.

03/12/2013 — China’s RFID card market to nearly double to $807 million in 2017

The futuristic “Internet of Things” will more than double to 2.1 billion units, leading to a dramatic growth of domestic companies, says Lux Research.

03/11/2013 — STMicroelectronics announces resignation of COO and Interim President, Didier Lamouche

STMicroelectronics announced today that Didier Lamouche, Chief Operating Officer, whose operational role was suspended when he took the assignment as President and Chief Executive Officer at ST-Ericsson in December 2011, has decided to resign from the company effective March 31, 2013 to pursue other opportunities.

03/11/2013 — OE automotive semiconductor market grew 12% in 2012

According to the latest analysis by Semicast Research, Renesas Electronics was again the leading vendor of semiconductors to the OE automotive sector in 2012, ahead of Infineon Technologies. STMicroelectronics retained its position as third largest supplier, with Freescale fourth and NXP fifth. Semicast calculates that revenues for OE automotive semiconductors grew by 12% to USD $25.5 billion in 2012, while the total semiconductor industry is judged to have declined by almost three percent to USD $292 billion.

03/11/2013 — Long-predicted atomic collapse state observed in graphene

Berkeley Lab researchers recreate elusive phenomenon with artificial nuclei; highly relevant for future nanoscle devices where electrical charge is concentrated into very small areas

03/11/2013 — Lattice announces world’s smallest FPGA

Lattice Semiconductor Corporation today announced the iCE40 LP384 FPGA, the smallest member of its iCE40 family of ultra-low density FPGAs. Enabling designers to rapidly add new features and differentiate cost-sensitive, space-constrained, low-power products, the new small footprint FPGA is ideal for applications such as portable medical monitors, smartphones, digital cameras, eReaders, and compact embedded systems.

03/08/2013 — Digi-Key Corporation and MEMSIC announce global distribution agreement

Global electronic components distributor Digi-Key Corporation today announced the signing of a global distribution agreement with MEMSIC, a provider of MEMS sensor components, sophisticated inertial systems, and leading-edge wireless sensor networks.

03/08/2013 — STMicroelectronics proximity sensor solves smartphone hang-ups

Smartphones are set to become even more flexible and more satisfying to use, thanks to a unique sensor system developed by STMicroelectronics. Combining three optical elements in a single compact package, the VL6180 is the first member of ST’s FlightSense family and uses a new optical-sensing technology that reduces the incidence of dropped calls and enables innovative new user interactions with smartphones.

03/08/2013 — Nanoelectronics Conference will focus on semiconductor industry’s future

How the semiconductor industry can create the next generations of nanoscale computing technology will be one of the themes of the 2013 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics, to be held at the National Institute of Standards and Technology (NIST), March 25-28, 2013, at its campus in Gaithersburg, Md.

03/21/2013 — Fujitsu releases new 1 Mbit and 2 Mbit FRAM products

Latest offerings enhance power efficiency and miniaturization for smart meters, industrial machinery and medical devices.

03/20/2013 — MEMS pressure sensors in cellphones set to rise to 681M units in 2016

Shipments this year are expected to double to 162 million units, as presented in the attached figure, primarily due to Samsung’s usage of pressure sensors in the Galaxy S4 and other smartphone models.

03/19/2013 — SEMICON West 2013 to address industry R&D challenges and opportunities

Dynamic changes to R&D processes, tools, technical challenges, and funding/business models will be highlighted at SEMICON West 2013, along with product displays of the latest semiconductor manufacturing technology, components and subsystems.

03/19/2013 — STMicroelectronics and CMP’s MEMS manufacturing process available for prototyping

STMicroelectronics and CMP today announced that ST's THELMA MEMS manufacturing process, the process ST uses for its industry-leading accelerometers and gyroscopes, which have shipped in billions of units, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.

04/09/2013 — Silex and BroadPak partnership produces 2.5D IC packaging capabilities

Silex Microsystems and BroadPak today announced the immediate availability of their jointly developed silicon interposer solution in high-volume manufacturing.

04/08/2013 — New miniaturization record by STMicroelectronics makes more room for mobile functionality

STMicroelectronics has introduced the world's smallest TVS diode for protecting sensitive electronics in consumer products and handhelds.

04/08/2013 — MEMS New Product Development Blog: Critical design and process steps for successful prototypes Part 2

The fourth article of the MEMS new product development blog is Part 2 of the critical design and process steps that lead to successful prototypes.  In the last article, the discussion focused on definition of the customer specification, product research, a solid model and engineering analysis to validate the design direction.  The continuation of this article reviews tolerance stacks, DFMEA, manufacturing assessment and process mapping.  

04/04/2013 — AIXTRON leads workpackage production in Graphene Flagship project

AIXTRON SE today announced that it is participating as a key partner in the recently announced European Union (EU) Future Emerging Technology (FET) flagship project “Graphene.”

04/04/2013 — Manchester leads the way in graphene membrane research

University of Manchester graphene researchers have been awarded a £3.5 million (or approximately US$5 million) funding boost that could bring desalination plants, safer food packaging and enhanced disease detection closer to reality.

04/04/2013 — How Samsung is climbing the charts

It’s no secret that Samsung is up against Apple in many ways, in products, sales and innovation. However, even in the face of Apple’s patent infringement lawsuits, Samsung is still climbing the charts.

04/04/2013 — STMicroelectronics heads European research team in advanced MEMS devices development

STMicroelectronics has begun working with research partners to develop a pilot line for next-generation MEMS devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging. The project was launched by the European Nanoelectronics Initiative Advisory Council (ENIAC) Joint Undertaking (JU), a public-private partnership in nanoelectronics.

03/18/2013 — EU-funded SYNAPTIC project delivers design-synthesis tool flow

A joint industry/academia consortium, supported by the European Union's Seventh Framework Programme, has reported the successful conclusion of a three-year project and the release of its design-synthesis tool flow and related litho-friendly cell libraries and evaluation metrics.

03/18/2013 — American Graphite Technologies announces successful test production of graphene paper

American Graphite Technologies Inc. announced today the successful production of test samples of a graphene paper product by its development and manufacturing partner, CTI Nanotechnologies LLC.

03/18/2013 — Ericsson and STMicroelectronics agree on strategic way forward for ST-Ericsson

Ericsson and STMicroelectronics today announced an agreement on the way forward for the joint venture ST-Ericsson. As communicated by the parent companies in December 2012, both have been working together toward a strategic solution for the JV. After months of intensive joint work, the parent companies have selected the strategic option which maximizes their respective future prospects and growth plans.

03/18/2013 — Brewer Science installs scale-up reactor to support electronics-grade carbon nanotube materials

Brewer Science, a developer of lithography enhancement materials for semiconductor manufacturing, announces the installation of a scale-up reactor to increase production of its CNTRENE C100 family of electronics-grade CNT materials by tenfold.

03/15/2013 — KIT researchers develop smallest vibration sensor in the quantum world

Researchers of Karlsruhe Institute of Technology and French colleagues from Grenoble and Strasbourg have now found a way to combine both carbon nanotubes and magnetic molecules on the atomic level and to build a quantum mechanical system with novel properties.

03/15/2013 — $14 trillion opportunity in Internet of Things, predicts Cisco

Cisco Systems is preparing for a major shift in the industry, as the Internet of Things starts to become a reality. At an annual press event in San Jose, California this week, Cisco officials claimed that the much-anticipated IoT industry could be a $14 trillion opportunity, and they are ready to embrace the change.

03/14/2013 — Imec to offer fully integrated silicon photonics platform in a multi-project wafer service

Imec announced today the launch of its fully integrated silicon photonics platform through a cost-sharing Multi-Project Wafer (MPW) service via ePIXfab.

03/14/2013 — Nanoplas introduces a new class of dry-etching technology

Nanoplas, a global supplier of plasma processing equipment to the semiconductor industry, today announced a new dry-etch process offering virtually unlimited etch selectivity for removing dielectric films on microprocessors and memories at high throughput.

04/01/2013 — Coherent launches highest power UV laser for microelectronics manufacturing

The newest AVIA micromachining laser from Coherent, Inc. (Santa Clara, CA) delivers the highest power commercially available at its wavelength and repetition rate.

03/28/2013 — Pixelligent Technologies launches PixClear Zirconia nanocrystals for increased light output in touchscreens

Pixelligent Technologies, a manufacturer of nanocrystal additives for the electronics and semiconductor markets, last week announced the launch of its PixClear Zirconia nanocrystals. When incorporated into existing products, the nanoadditives can dramatically increase light output and readability of modern touch screens and displays.

03/28/2013 — Microstructures made of adjoining semiconductor disks could lead to powerful nanoscale sensors

Many users of microwave ovens have had the frightening experience of leaving a fork, crumpled piece of aluminum foil or some other pointy metal item inside the cooking chamber. The sharp metal object acts as an antenna for the oven’s microwave radiation, causing strong local heating or sparking.

03/28/2013 — Freescale Semiconductor installs Advantest's production platform for testing MEMS-based sensors

Semiconductor test equipment supplier Advantest Corporation entered the high-growth market for testing MEMS-based sensors by installing V93000 Smart Scale systems at several of Freescale Semiconductor's facilities around the world.

03/28/2013 — Chinese cellphone and tablet makers gain share in MEMS sensor purchasing in 2012

China-based manufacturers of cellphones and tablets in 2012 more than doubled their share of purchases of MEMS motion sensors, reflecting the rising prominence of the companies in the global market, according to an IHS iSuppli MEMS Topical Report from information and analytics provider IHS.

03/27/2013 — SiTime enters smartphone market with first MEMS oscillator

SiTime Corporation, one of the fastest growing semiconductor companies, today introduced the SiT15xx family of 32 kHz MEMS oscillators that are intended to replace legacy quartz crystal resonators.

03/26/2013 — New energy-efficient interface IC to provide voltage regulation for piezoelectric energy harvesters

Holst Centre and imec have developed an integrated piezoelectric energy interface IC with zero bias rectifier circuit and energy-aware supply regulator.

03/27/2013 — NAND flash market defies trends and grows to record level in Q4

Despite facing five consecutive quarters of decline and a slowdown in consumption in smartphones and tablets, the global market for NAND flash memory pulled off a surprise growth spurt during the last three months of 2012, causing sales to reach a record high.

03/26/2013 — Emerging consumer applications are boosting the growth of the MEMS pressure sensor market

MEMS pressure sensor is one of the very first MEMS components appearing in the microsystem world. The technologies are quite mature and the market is big and expected to grow from $1.9B in 2012 to $3B in 2018.

03/26/2013 — University of Central Florida launches new undergrad program in photonics

A new undergraduate program approved this week at the University of Central Florida (UCF) will help the U.S. stay competitive in global technology as well as broaden the path for students seeking rewarding careers in the important field of optics and photonics, say leaders of SPIE, the international society for optics and photonics.

03/26/2013 — Smallest MEMS microphone designed for hearing aid applications features low EIN and power consumption

Analog Devices ADMP801 MEMS microphone delivers 27 dBA EIN, consumes only 17 µA at 1 V supply, and is available in a 7.3 mm³ package.

04/02/2013 — Over 221 million mobile devices shipped in India during 2012

India registered 221.6 million mobile handset shipments during 2012, according to CMR’s India Mobile Handsets Market Review, CY 2012, March 2013 release. During the same period, 15.2 million smartphones were shipped in the country.

04/02/2013 — SUNY’s CNSE undergrad to receive the nation’s most prestigious award for science and engineering

Zachary Olmsted, a junior Nanoscale Engineering major at SUNY’s College of Nanoscale Science and Engineering (CNSE), has been chosen to receive the prestigious Barry M. Goldwater Scholarship, the second consecutive year that a CNSE student has been honored with the nation’s premier undergraduate award designed to foster and encourage outstanding students to pursue careers in the fields of mathematics, the natural sciences, and engineering.

04/02/2013 — High-value MEMS market growth slows due to weak medical electronics and industrial sectors

The high-value microelectromechanical system (MEMS) market experienced soft growth last year, mainly due to weakness in the mainstay medical electronics and industrial sectors, according to an IHS iSuppli MEMS High-Value MEMS Market Tracker Report from information and analytics provider IHS.

04/02/2013 — Nanosys expands U.S. manufacturing as demand for displays with lifelike color heats up

Nanosys, enabling a new generation of high color fidelity, energy-efficient displays with its quantum-dot technology, today announced that it has expanded into a new, high-capacity production facility in Milpitas, California.

04/02/2013 — Unsettled economic situation leaves mark on microtechnology industry

A year ago, the microtechnology, nanotechnology, and advanced materials industry looked out on the year 2012 with quite positive expectations. As it turned out, the unstable economic situation has left its mark on these industries, too. For 2013, at least, the companies expect a slight upwards trend.

04/01/2013 — MIT researchers observe nanowires lifting liquids as effectively as tubes

Imagine if you could drink a glass of water just by inserting a solid wire into it and sucking on it as though it were a soda straw. It turns out that if you were tiny enough, that method would work just fine — and wouldn’t even require the suction to start.

06/14/2010 — IITC Day 2: Backend memory, MEMS, 3D/TSV -- and no firearms

Techcet's Michael A. Fury continues his observations from this year's IEEE International Interconnect Technology Conference (IITC) meeting near San Francisco. From Day 2:  Back-end memory, MEMS, reliability/characterization, and posters spanning the breadth of interconnect topics, especially 3D TSV and MEMS integration.

06/11/2010 — IITC Day 1: 3D/TSV, Cu barrier films, critical collaboration

Techcet's Michael A. Fury continues his observations from this year's IEEE International Interconnect Technology Conference (IITC) meeting near San Francisco. From Day 1: Themes including variations on 3D and through-silicon vias (TSV), and barrier films for reducing copper electromigration.

06/04/2010 — Broad-based demand underpins brighter chip forecasts

Analysts speaking at a breakfast seminar near Boston agree that current chip sales estimates are "conservative" -- even after one of them breaks out new optimistic forecasts -- and strong demand is pulling the industry back into seasonal trends and more reliable growth patterns.

04/19/2010 — MRS Day 4: TSVs and CMOS+MEMS, wafer bonding, CNT interfaces, ALD for rare-earth HK, graphene redux

Highlights from Day 4 of the 2010 MRS Spring meeting, reported by Techcet's Michael A. Fury: TSVs and flexible interconnects for 3D CMOS/MEMS; 300mm BCB wafer bonding; carbon nanotube interfaces for interconnects and vias; phase-change memory devices; interfaces during ALD of rare earth-based high-k dielectrics; and graphene's use in on-chip interconnects and transparent conductor electrodes.

02/19/2010 — Keithley's latest system goes for ultra-fast I-V solution

Keithley exec Lee Stauffer explains how adding ultra-fast voltage waveform generation and current/voltage measurement capabilities to the company's Model 4200-SCS semiconductor characterization system benefits a range of applications, from flash memory to CMOS and MEMS.

12/01/2010 — Tegal-expands-ProNova-ICP-silicon-DRIE-reactor-family

Tegal Corporation (Nasdaq: TGAL) is launching a new member of its ProNova family of high-density inductively coupled plasma (ICP) reactors for the company’s DRIE series wafer processing products. The ProNova2 is targeted for fast-growing 200mm MEMS and 3D IC applications.

07/12/2010 — SEMICON West Exhibits Preview

Following are some of the highlights of the SEMICON West exhibit halls, open July 13-15 at the Moscone Center in San Francisco, CA. Products on display include TSV technology, ALD systems, vacuum and wafer transport tools, and more for semiconductor and package manufacturing.

08/16/2010 — SEMI reorgs, splits into three-way focus groups

SEMI has reorged into three groups to align its focus areas into IC manufacturing, solar photovoltaic (PV), and related/tangential markets including MEMS and LEDs.

09/03/2010 — SEMICON Taiwan welcomes French wafer fab equipment suppliers, research orgs

SEMICON Taiwan will say "bienvenue" to 10 companies from France, including research group CEA-Leti, international development agency UBI France, and suppliers like Satin Technologies and IBS.

08/19/2010 — Imec IEDM presentations to cover More than Moore, ITRS

16 papers with imec authors were accepted for IEEE International Electron Devices Meeting (IEDM), December 6-8, 2010, in San Francisco. Both ITRS-related as well as More-than-Moore-related research papers have been accepted, rewarding imec’s multidisciplinary R&D platform (featuring two state-of-the-art R&D fabs).

12/17/2010 — IEDM Reflections, Day 2: Graphene, RRAM, MEMS, and Jedi circuit designs

Techcet's Michael A. Fury continues with observations from the second day of IEDM 2010 presentations, examining papers on several graphene-based devices, a RRAM device stack on flexible substrates, using MEMS for RF channel switching, and Jedi tricks for post-FinFET circuit design.

07/14/2011 — SEMICON West: Roaming the floor, LEDs, CMP pads, kudos to Napoleon

Exotic pads for CMPs, flow meters with a nod to Napoleon, and driving down LED costs were among themes pursued by Techcet's Michael A. Fury on a walk through the SEMICON West show floor.

06/13/2011 — Intel, Samsung, Toshiba lead semiconductor sales

Semiconductor industry heavyweights Intel, Samsung and Toshiba (in that order) topped semiconductor sales so far in 2011, according to a report from ABI Research. As a whole, the semiconductor market should see about 4% growth during 2011.

12/30/2011 — UMC debuts 200mm Al BEOL fab process

United Microelectronics Corporation (UMC) launched the A+ technology platform, a specialized 0.11

12/29/2011 — IEST cleanroom apparel doc update includes measurement guide

The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.

12/20/2011 — Color displays could boost e-reader sales in coming years

Displays for pure-play e-book readers will see 108% higher shipments in 2011, but slower growth ahead. In the future, e-reader makers will turn to color display technologies, predicts IHS iSuppli.

12/06/2011 — EVG installs UV-lithography system at Asahi Kasei

Asahi Kasei E-Materials Corporation purchased an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EV Group (EVG).

12/01/2011 — ULVAC CVD-Co, -Ni system suits 3D gate, MEMS fab

ULVAC Inc. developed the ENTRONTM-EX2 W300 CVD-Ni/CVD-Co system for CVD-Ni and CVD-Co silicidation of 3D semiconductor gates and MEMS. The system is a response to a semiconductor industry transition from PVD to CVD in advanced 3D gate structure film step coverage, ULVAC reports.

11/28/2011 — IEDM 2011 slideshow: Sneak-peek at 10 conference papers

Ahead of next week's 57th IEEE International Electron Devices Meeting (IEDM, Dec. 5-7), we've scanned the entire program to present a quick slideshow sampling of some of the more intriguing papers.

12/16/2011 — STM: Semiconductor maker, MEMS specialist, venture capitalist?

STMicroelectronics (NYSE: STM), a global semiconductor company, launched ST New Ventures, its corporate venture capital fund currently under incorporation.

12/12/2011 — SEMICON West 2012: Submit an abstract today

SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.

12/07/2011 — imec's IEDM papers reach "record number"

imec is presenting a record number of 17 papers at the IEEE International Electron Device Meeting (IEDM), ending today in Washington, DC.

05/11/2011 — Silicon semiconductor wafer shipments edged up from Q1 2010 to Q1 2011

Worldwide silicon wafer area shipments decreased slightly during the first quarter 2011 when compared to fourth quarter 2010 area shipments, and were marginally higher than first quarter 2010, according to the SEMI Silicon Manufacturers Group.

04/18/2011 — Rudolph's new F30 advanced macro inspection module wins foundry, MEMS orders

Rudolph's F30 module The F30 module offers improved throughput over the entire sensitivity range. Two European fabs, a leading Asian foundry, a leading MEMS producer, and a process equipment manufacturer that is developing an integrated inspection solution have ordered the Rudolph system.

05/25/2011 — Imec ITF: Vision systems entering a new era of digital optics

In an SST-exclusive series of blogs, imec reports from its International Technology Forum this week in Brussels. Francesco Pessolano, manager of imec's NVision program, reviews how digital optics can make future vision systems smaller, faster, cheaper, and more reliable.

02/10/2011 — DRIE tech transferred from Tegal to SPTS

SPTS completed the acquisition of deep reactive ion etch (DRIE) technology and certain related assets from Tegal Corporation. In addition, the deal includes the transfer to SPTS of the capital stock and operations of Tegal France SAS.

03/16/2011 — EVG-wins-SOI-order-from-Shenyang-Silicon-Technology

EV Group (EVG) received an order from new customer Shenyang Silicon Technology Co. Ltd. (SST). SST will use an EVG850LT automated production bonding system for silicon-on-insulator (SOI) wafers.

08/24/2011 — IC market to top $300 billion in 2013

The IC industry, which had a phenomenal growth year in 2010, is in a cautious mode under greater macro-economic uncertainty and hesitancy. Some positive milestones are on the horizon, however, shows data within IC Insight's Mid-Year Update, such as the 200 billion IC shipment milestone in 2011, and the $300 billion mark expected in 2013.

10/07/2011 — GlobalFoundries signs onto new A*STAR productivity enhancement program

Singapore has launched the Manufacturing Productivity Technology Centre at A*STAR's Singapore Institute of Manufacturing Technology. GlobalFoundries signed a 5-year Manufacturing Productivity Enhancement master plan agreement with SIMTech, working on materials recycling, wafer transport, and more.

08/30/2011 — SEMICON Taiwan preview: Forums span key technology, markets

SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.

09/27/2011 — Fab management, packaging, 450mm on our SEMICON Europa agenda

SEMICON Europa is coming up fast (Oct. 11-13), and SST (and some friends) will be reporting on-scene. Here's a summary of the presentations we're looking forward to, from the Fab Managers' Forum to conferences on test, packaging, MEMS, and hot topics including 3D ICs and 450mm.

10/13/2011 — SEMICON Europa 2011: Hopes for 2012 growth, no room for gloom

ATREG's Barnett Silver reports from SEMICON Europa, where the overall mood on the show floor is optimistic yet cautious, with hope for strong growth by mid-2012. Key themes include a slowdown in 200mm demand, an elite membership for 450mm, and keen interest in MEMS.

10/12/2011 — Flat silicon wafer shipments will pick up in 2012, 2013

While the market has currently softened, early-2011 momentum will carry the year's semiconductor silicon sales to a higher total than 2010, said Stanley T. Myers, president and CEO of SEMI, noting the figures are an industry record. Growth will continue at "modest levels" through 2013.

05/08/2008 — Qualcomm, Foxlink expanding MEMS work

May 8, 2008 - Qualcomm's MEMS subsidiary and Cheng Uei Precision Industry Co. Ltd. (dba "Foxlink") say they are opening a new dedicated fab in Taoyuan, Taiwan, to make Qualcomm's "mirasol" displays. The plant is slated to become fully operational in 2009.

05/21/2008 — IDM economics at 32nm and beyond

by Ed Korczynski, senior technical editor, Solid State Technology
May 21, 2008 - Masaaki Kinugawa, GM of Toshiba's Oita operations, discussed the tough challenges faced by fabs developing advanced processes today in his Confab talk, including increasing complexity of process and device technologies (and proportionally rising costs) -- and an ugly truth waiting around the corner at the 32nm node.

05/07/2008 — Two different approaches to integrated MEMS

by Dick James, Senior Technology Advisor, Chipworks
May 12, 2008 - After the 45nm hype of the last few months, let's go to the other end of the CMOS scale and examine some interesting MEMS devices that are leading the penetration into new markets like consumer electronics -- and would not have been manufacturable without the deep etching processes that have evolved over the last few years.

05/05/2008 — TSMC announces entry into MEMS market

May 5, 2008 - Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) has unveiled plans to enter the MEMS business, presenting a roadmap of the MEMS process and desires to cover trends in MEMS production at "CMOS integrated MEMS foundries," according to Nikkei Microdevices magazine.

06/30/2008 — MEMS at SEMICON West: Smaller consumer die creates need for new etch, clean processes

by Dr. Paula Doe, Contributing Editor, Solid-State Technology
New technologies in MEMS etching is one of the hot topics at this year's SEMICON West (July 13-17, San Francisco). Growing demand for MEMS systems in consumer gear means higher volumes and price pressures, so device-makers are shrinking geometry die to cut costs -- and the finer processes needed on those smaller die may require new kinds of etching and cleaning processes.

06/26/2008 — Researchers tout metallization technique with magnetic materials

June 26, 2008 - Researchers from the National Institute of Standards and Technology (NIST) say they have developed a process to build 3D nanoscale structures using magnetic materials, using techniques "compatible with semiconductor manufacturing," which they say could open doors to new classes of sensors and MEMS devices.

03/28/2008 — Analyst: MEMS sensor/actuator growth taking off

Mar. 28, 2008 - After growing at a 9% CAGR over the past five years, demand for MEMS-based semiconductor sensors and actuators is expected to accelerate to 19% CAGR through 2012, as emerging MEMS technologies find traction in new markets and applications, according to a report by IC Insights. The firm projects MEMS sensors/actuator sales will increase to $9.7B by 2012, vs. $4.1B in 2007.

03/18/2008 — Analyst: Silicon MEMS microphones demand stalls

Mar. 18, 2008 - The silicon MEMS microphone sector grew 12.4% in 2007 to 238M units, well off the pace of the prior two years (2005-2006) where installations doubled to account for 20% of mobile phones manufactured, due to a drop in cell phone growth and converged devices, according to a new report from The Information Network.

02/08/2008 — Freescale chairman/CEO stepping down

Feb. 8, 2008 - Michel Mayer, chairman and CEO of Freescale Semiconductor, is stepping aside, four years after joining the company and leading it through its spinoff from Motorola, subsequent IPO, and leveraged buyout. The company indicated that Mayer will stay on in his current role until the search for a new CEO is completed, and will remain chairman through the transition.

02/04/2008 — Test firms KVD, Unisem sharing US facilities

Feb. 4, 2008 - Unisem Berhad, a Malaysian semiconductor assembly/test services provider, has agreed to lease part of its facilities in Sunnyvale, CA, to KVD, a test supplier located down the coast in Carlsbad, CA, to use the site for analog test and final test/wafer sorting.

01/28/2008 — AMIS hands future "Smart Power" R&D to IMEC

Jan. 28, 2008 - AMI Semiconductor and European R&D consortium IMEC say they have entered into a new two-year program to develop AMIS' future 14T "Smart Power" platform technology, which will allow the creation of complex systems-on-chip integrating high-voltage and power functions with dense logic, processors and memories.

03/10/2008 — RF MEMS designer nails down $7M funding

Mar. 10, 2008 - WiSpry, a developer of programmable radio frequency (RF) semiconductor products, says it has tacked on another $7M to its Series B round of funding, for a total of $18M raised in the round. The funds will be used to transition from technology development into product qualification, the company noted in a statement.

03/28/2008 — Analyst: MEMS test equipment priorities: low-cost, standardized

Mar. 28, 2008 - In a sector dominated by expensive customized products, the best opportunities in the MEMS test equipment market are to develop cost-effective standardized technologies, according to a new report from Frost & Sullivan.

02/05/2008 — Will MEMS + nanoprobes succeed flash memory scaling?

by Debra Vogler, Senior Technical Editor, Solid State Technology
Feb. 5, 2008 - With flash process technology scaling approaching its limits, along comes Nanochip, a developer of MEMS silicon data storage chips, with a technology that does not use lithography in its manufacture. Company execs tell WaferNEWS about their planned >100GB/chipset products, which could start prototyping this year and be ready for manufacturing by 2010.

06/25/2008 — SEMI tips standards for FPDs, MEMS, chips

June 25, 2008 - SEMI has published four new technical standards targeting substrate and processes in LCD, MEMS, and semiconductor manufacturing, as part of its triannual standards update.

10/07/2008 — Suss swaps CEO over "differing" strategic views

Suss MicroTec has replaced board member and CEO Stefan Schneidewind with Christian Schubert effective immediately, citing "differing views regarding the future strategy of the company." A search for a new permanent CEO will take place.

09/08/2008 — Tegal+AMMS eyes growth in 3D packaging, MEMS

Tegal Corp.'s proposed acquisition of Alcatel Micro Machining Systems' (AMMS) deep reactive ion etch (DRIE) and plasma-enhanced chemical vapor deposition (PECVD) products is "a critical part of our growth strategy" to extend into higher-growth markets in 3D IC packaging and MEMS devices, the company asserts.

08/22/2008 — HP optimizes low-cost processing for inkjet printheads

One of the most common and most ignored types of chips is on almost every desk in this electronic world of ours -- the inkjet printhead. This edition of Chip Forensics examines a three-color printhead device out of Hewlett Packard's low-cost HP 60 Tricolor ink cartridge launched earlier this year.

07/14/2008 — Aviza's Cutini optimistic about 3D IC, MEMS market

Speaking at the SEMInvest forum on Monday, Aviza's CEO Jerry Cutini said that the MEMS and through-silicon-via/3D IC markets are finally starting to buy equipment in production quantities. He said these markets plus ALD represent a billion dollar TAM (total available market) by 2011 for all products, with a compound annual growth rate of ~18%.

08/18/2008 — TSMC approves capex, buyback plans

Taiwan foundry TSMC says its board of directors has approved new capex expenditures for 200mm and 300mm capacity, and a new stock buyback program.

04/18/2008 — Custom fit: Tronics surges in MEMS foundry sector

by Debra Vogler, Senior Technical Editor, Solid State Technology
April 18, 2008 - MEMS foundry and LETI spinoff Tronics Microsystems says its 2007 sales were nearly double the sector's CAGR for the year. WaferNEWS talked with them to find out how this custom component manufacturer is getting it done, what it feels is its key differentiator, and what it's working on next.

01/14/2008 — Freescale starts up 200mm MEMS line in TX

Jan. 14, 2008 - Freescale Semiconductor has established a new 200mm MEMS line at its Oak Hill fab in Austin, TX, complementing an existing 150mm MEMS line in Japan.

12/16/2008 — IEDM: IMEC touts 11MP micromirror array

Dec. 15, 2008 - In a paper discussed at this week's IEDM, researchers from IMEC reveal a monolithically integrated 11-megapixel 10cm2micromirror array, double the pixel density of comparable micromirrors, and a 10312 cycle mechanical lifetime, also a record, they claim.

01/07/2008 — Electroglas patents "active vibration cancellation" tech

Jan. 7, 2008 - Electroglas, a supplier of wafer probing systems for semiconductor manufacturing, has received a patent for its proprietary "active vibration cancellation" hardware and software algorithms.

01/18/2008 — Navigating the coming flood of used 200mm tools

Market analysts are projecting an imminent surge of 200mm wafer processing tools swamping the market, valued in billions of dollars each year through 2012. It seems clear that an extra 100 fabs will be for sale over the next few years, with MEMS and advanced packaging lines likely snapping up this extra manufacturing capacity -- but watch out if a used 200mm tool flood washes over into mainstream CMOS.

09/08/2008 — iSuppli: Auto MEMS sensors to surge by 2012

New government mandates will help nearly double the global shipments of automotive microelectromechanical systems (MEMS) from 2006-2012 (a 12% CAGR), while sales surge to $2.1B (8% CAGR), according to data from iSuppli.

09/03/2008 — Tegal to Acquire Alcatel's DRIE, PECVD product lines

Sept. 3, 2008 - Tegal Corp., a designer and manufacturer of plasma etch and deposition systems, has agree to acquire ' (AMMS) and Alcatel-Lucent's deep reactive ion etch (DRIE) and plasma-enhanced chemical vapor deposition (PECVD) products and related IP in a $5M in cash-and-stock transaction.

09/09/2008 — Tegal seeks "DRIE" land in MEMS

Tom Mika, CEO of Tegal, gives SST some further insights into his company's plans behind its proposed acquisition of Alcatel Micro Machining Systems' deep reactive ion etch and other technologies -- including how the company will leverage its existing presence in MEMS, finding the balance between serving R&D and production needs, and fighting much larger competitors.

07/31/2008 — Analyst: Next big MEMS market is cell phones

A new report from Yole Développement criticizes MEMS-based sensor and actuator firms for not figuring out how tap into what it says is the largest growth opportunity for MEMS devices over the next five years: wireless handsets.

08/31/2009 — Commercializing a WLCSP passivation layer solution

Lord Corp. exec Russell Stapleton talks with SST about the company's first-generation passivation layer solution for wafer-level chipscale packaging, due to launch in 1Q10.

09/04/2009 — DALSA to play major role in Quebec Microelectronics Innovation Center

DALSA Semiconductor VP/GM Claude Jean talks with SST about the new $218M microelectronics center being formed in Quebec, and how the company will contribute to its focus on MEMS and 3D wafer-level packaging and vice-versa.

08/25/2009 — Report: MEMS-based system market to generate $13B supply chain revenue in 2012

MEMS-based systems were a $46 billion business in 2008, and despite the recession MEMS-based systems should see 12% annual growth through 2012 to an $83 billion industry, meaning a $13 billion market for MEMS devices and the equipment and materials needed to produce them, according to a report on the MEMS supply chain from SEMI and Yole Développement.

11/24/2009 — ClassOne Equipment Purchases Assets of Colibrys MEMS Facility

Atlanta-based ClassOne Equipment, Inc., a supplier of refurbished equipment for the semiconductor and nanotechnology markets, has recently purchased all of the equipment assets of Colibrys’ MEMS facility in Stafford, Texas, outside of Houston.

03/30/2009 — MEMS sector takes hit from auto, economy slump

As the economy slogs along, big-ticket consumer purchases such as cars have dried up -- car shipments slipped 8% in 2008 and are expected to sink 19% in 2009. And that's bad news for, among others, suppliers of automotive electronics, notes iSuppli in a recent report.

12/03/2009 — Semefab building new 150mm MEMS fab

Scottish foundry Semefab says it is investing £6.6M (US $11M) ina new wafer fab for frontend processing of MEMS structures.

10/06/2009 — IMEC Tech forum: Leading-edge "insight," radio chips, multithreaded processors

Among a spate of presentations at IMEC's annual Technology Forum this week, the European R&D consortium trotted out a new program for foundries and fabless companies, an "incubation" pact with TSMC, and developments in multithreading and radio chips.

08/05/2009 — How CMP enables innovation in memory, 3D, MEMS

Robert Rhoades, CTO, Entrepix, describes the nontraditional technology behind TFT-dual gate memory and how CMP enables that innovation among others -- e.g., TSVs, 3D packaging, MEMS, and engineered substrates.

01/08/2009 — Foundries, IDMs will catalyze broad adoption of 3D/TSV and NIL

The macroeconomic issues that plagued the second half of 2008 will continue to impact the semiconductor and MEMS markets in 2009, specifically in segments that are automotive and consumer-product driven. Despite the effects, companies in these markets remain committed to innovation, and in turn, are expected to continue to invest in new manufacturing technologies (e.g., 3D/TSVs and nanoimprint lithography) to bring to market novel devices.

01/28/2009 — SVTC, Entrepix expand CMP work to 300mm

An extended partnership between SVTC and Entrepix widens their outsourced CMP services to 300mm wafers, for both semiconductor manufacturers and suppliers -- and, execs tell SST, gets them on an early track for growth areas several years down the road.

04/17/2009 — MRS Spring Day 3: DNA origami, silicon ribbons, self-assembled 3D cubes

In an exclusive daily blog for SST, Techcet's Michael A. Fury reviews talks about new technology in mobile phones; "DNA origami" self-assembly; hyperspectral imaging; single-crystal silicon ribbons; 3D patterned devices made with MEMS and self-assembly techniques; and the utility of "toys" based on electro-osmotic ionic flux.

01/08/2009 — Effective partnering and an outsourced service/process model needed in 2009

Looking ahead to 2009, we believe the semiconductor market will continue further down the newly split paths as announced in the 2007 ITRS Roadmap. That is, there are now two distinct groups of device manufacturers: 1) The leading edge (scaling) -- "More Moore," with a focus on 300mm and larger wafers, and 90nm and smaller technology nodes; and 2) functional diversification/mainstream -- "More than Moore," with a focus on 200mm and smaller wafers, and 90nm and larger technology nodes.

07/19/2006 — VC buys into analytical probe firm

July 19, 2006 - The Micromanipulator Co., Carson City, NV, a developer of analytical probe systems, said that venture capital firm Flywheel Ventures has purchased a majority ownership in the firm for an undisclosed amount, and will invest an extra $1 million in cash to support future growth and acquisitions.

08/15/2006 — Synova using extra funding for global expansion

August 15, 2006 - Synova, a privately held Swiss developer of water jet-guided laser technology, has secured an additional $8.1 million (CHF 10 million) in funding from Swiss banks, to help fuel its push to create several micromachining centers in key high-tech regions around the world.

07/25/2006 — Report from SEMICON West: MEMS going mainstream

The MEMS market is currently fragmented in terms of the types of devices being produced and the companies producing them, but over the next ten years MEMS components will increasingly be integrated into modules that will replace existing electronics systems, and manufacturing will be absorbed by mainstream semiconductor companies. That was the message delivered at SEMICON West by Jean-Christophe Eloy, GM of market research firm Yole Developpement.

10/11/2006 — MEMS sensor firm adds 150mm line

October 11, 2006 - Silicon Microstructures, Inc. (SMI), a developer of silicon pressure sensors, says it has ramped to 40,000 sensors/day on a new 150mm MEMS manufacturing line.

09/11/2006 — Japan's ULVAC testing C4NP molds

September 11, 2006 - Ulvac Coating Corp.'s glass MEMS division has demonstrated trial production of reusable glass molds used in C4NP (Controlled Collapse Chip Connection - New Process), the wafer bumping technology developed by IBM, according to the companies.

10/10/2006 — Packaging materials, CMOS integration promise best growth opportunities in MEMS market

A new report from SEMI and Yole Developpement Group finds several emerging trends in MEMS that promise new opportunities for chip companies and suppliers to expand their business. Integration of CMOS continues, with synergies in technology and processes flowing both ways. Demand for new supporting technologies is taking shape, particularly for packaging materials, and large chipmakers (including foundries) are lending legitimacy to the market with their increasing activity in MEMS development.

10/26/2006 — Omron buying Seiko Epson 200mm chip fab

October 26, 2006 - Automation and control technology firm Omron Corp. has agreed to acquire a 200mm CMOS semiconductor factory in Yasu, Shiga, Japan from Yasu Semiconductor Corp., a consolidated subsidiary of Seiko Epson. Terms of the deal were not disclosed.

05/23/2006 — Report: MEMS in handsets topping $1B by 2010

May 23, 2006 - Mobile handsets, the second largest market for semiconductors after PCs, also presents big opportunities for microelectromechanical systems (MEMS), with consumption poised to soar from $157 million in 2005 to more than $1.0 billion by 2010, according to a new report from In-Stat Inc.

05/23/2006 — UAlbany, Corrnell top nano institute rankings

May 23, 2006 - Ten US universities from New York to Texas to the midwest have been ranked as tops among universities' efforts in micro- and nanotechnology research, according to a survey conducted by Solid State Technology sister publication Small Times.

04/28/2006 — Purdue touts MEMS on-chip microcooler

April 28, 2006 - Scientists at Purdue U. have developed a MEMS-based micropump small enough to fit on a computer chip that circulates coolant through channels etched directly into the chip.

05/05/2006 — April 2006 Exclusive Feature: LITHOGRAPHY Processing and characterization of a positive thick photoresist

By Shang-Chou Chang, Shen Chi Hsieh, Kun Shan U., Taiwan; Tsung Chieh Cheng , Bau Tong Dai, National Nano Device Laboratories, Taiwan

OVERVIEW There is increasing interest in the thick, positive, epoxy-based photoresist made of the material AZ P4620 because of its wide applications in micro-fluidic devices and micro-electromechanical systems (MEMS). The optimization of polymerization for this material under near ultraviolet (UV) lithography...

06/29/2006 — sp3 wins Fed deal to develop GaN on silicon/diamond

June 29, 2006 - sp3 Diamond Technologies Inc., Santa Clara, CA, a developer of diamond substrate technology for enhancing thermal management, has received a $750,000 Phase II contract from the Missile Defense Agency to develop gallium nitride (GaN) on silicon-on-diamond devices.

06/14/2006 — Interconnect startup scores $32M in funds

June 14, 2006 - NanoNexus, San Jose, CA, a developer of semiconductor interconnect technology, has secured $32 million in an oversubscribed Series A round of financing, with participation from new investor Cypress Semiconductor.

06/13/2006 — Fuji Photo buys Dimatix for inkjet technology

June 13, 2006 - Fuji Photo Film Co. Ltd. has agreed to acquire Dimatix Inc., a developer and manufacturer of industrial inkjet printheads, precision micropumps, and specialized print systems, for an undisclosed amount. The company develops systems for jetting fluids such as nanoparticle-based metallic and organic materials in applications such as microelectronic packaging substrates.

06/08/2006 — Soitec adds CEA-Leti spinoff's thin-film layer transfer tech

June 8, 2006 - Soitec, Bernin, France, has acquired CEA-Leti spinoff TraciT Technologies for an undisclosed amount, adding to its portfolio technology for thin-film layer transfers used in MEMS and power circuit production.

05/26/2006 — FlipChip, Engent to make 3D packaging tech

May 26, 2006 - FlipChip International LLC and Engent Inc. are partnering to develop 3D wafer-level CSP (WLCSP) technologies, seen as a low-cost alternative to system-on-chip for highly integrated stacked die packaging applications.

04/26/2006 — TEL tips MEMS tester

April 4, 2006 - Tokyo Electron Ltd. is offering a new wafer-level microelectromechanical system (MEMS) tester to help manufacturers isolate and validate electrical and mechanical functionality at the wafer level prior to packaging.

06/05/2006 — Test methods, safety, CD photomask spec on SEMI standards list

June 5, 2006 - SEMI has published eight new technical standards for the semiconductor, flat-panel display (FPD), and MEMS manufacturing industries, including safety guidelines for hydrogen peroxide storage and handling systems, specifications for critical dimension (CD) measurement information data for photomask manufacturing, and test methods for measurement of the resistivity of resin black matrix for LCD color filters.

06/01/2006 — X-Fab, Akustica partner for CMOS MEMS microphones

June 1, 2006 - Akustica Inc., a start-up that is developing acoustic components in silicon using micro-electromechanical systems (MEMS) manufacturing processes, has signed on with X-Fab Semiconductor Foundries AG to produce MEMS-based single-chip microphones.

06/29/2006 — Analyst: Probe card market nearing $1B in 2006

June 29, 2006 - After a 20% surge in 2005, the probe card market is expected to enjoy another solid year of growth in 2006 due largely for memory test needs, according to a new report from VLSI Research Inc.

06/26/2006 — AMD commits to 300mm fab in upstate NY

June 26, 2006 - In another vote of support for the US' semiconductor manufacturing industry, Advanced Micro Devices Inc. (AMD) said it will build a new 300mm semiconductor manufacturing facility in upstate New York, investing together with the state as much as $5.0 billion over the next few years.

11/06/2006 — IMEC, India groups tie knot for chip R&D

November 6, 2006 - European R&D consortium IMEC has signed memorandums of understanding with SemIndia and the Indian Institute of Science (IISc), moves that help solidify India's plans for developing into a semiconductor fabrication center, as well as IMEC's inroads into the region.

11/27/2006 — ST fires up 200mm MEMS line

November 27. 2006 - STMicroelectronics has inaugurated a new 200mm wafer fab line at its Agrate site near Milan, Italy, dedicated to manufacturing MEMS devices, saying it is the first major MEMS maker to make the devices on 200mm wafers.

02/27/2006 — Scottish MEMS program gets more funding

February 27, 2006 - Semefab is establishing a new design and development center for nanotechnology in its Glenrothes, Fife, operation, under a GBP15 million (US $26.2 million) project jointly managed by the Scottish Enterprise and the UK's Department of Trade and Industry.

04/18/2006 — Analyst: MEMS sales slowing, demand shifting

April 18, 2006 - Sales growth for MEMS devices slowed dramatically in 2005 despite "very strong" unit shipments, with demand increasing for newer markets outside the mainstays, according to a new report by In-Stat.

02/06/2007 — SVTC to expand into MEMS, help customers "get hands dirty," says exec

February 6, 2007 - The new owners of Cypress Semiconductor's Silicon Valley Technology Center bring two varied backgrounds of technology and services expertise, both of which will help the center expand into new areas such as MEMS, and possibly extend relationships with foundries, according to GM Bert Bruggeman, in an interview with WaferNEWS.

02/26/2007 — Cypress tabs UMC for 65nm SRAM manufacturing

February 26, 2007 - Cypress Semiconductor Corp. says it will contract with Taiwan foundry United Microelectronics Corp. (UMC) to produce its next-generation flagship SRAM products, continuing efforts to retreat from leading-edge manufacturing and development following the planned sale of its 65nm process R&D shop, the Silicon Valley Technology Center (SVTC).

04/03/2007 — The progeny of chip commoditization: Fab-lite AND process-lite

With silicon manufacturing fast becoming -- if not already -- a commodity, those who do not have IP and design as value adders will start dropping lower and lower on the food chain. That's ushering in a new class of "process-lite" firms that rely heavily on foundries for process development, according to Gartner analyst Dean Freeman, speaking at a SEMI lunch panel. And that makes life harder for equipment and materials suppliers.

04/02/2007 — Omron, Seiko finalize 200mm fab sale

April 2, 2007 - Omron Corp. has finalized its acquisition of a 200mm CMOS semiconductor factory in Yasu, Shinga, Japan, from Yasu Semiconductor Corp., a consolidated subsidiary of Seiko Epson., five months after announcing the deal, according to the companies.

04/23/2007 — Study: TI, inkjet print heads top MEMS drivers ranks

April 23, 2007 - Texas Instruments is the number one MEMS company worldwide thanks to its DLP chips business, raking in a record-setting $905 million in sales in 2006, nearly twice as much as No. 2 ranked Hewlett-Packard, according to German research firm Wicht Technologie Consulting. The firm's updated MEMS market survey also shows that HP led a pack of firms focusing on the biggest current MEMS cash cow: inkjet print heads.

04/23/2007 — Getter services for MEMS WLP

April 23, 2007 - Innovative Micro Technology has begun offering getter deposition services of wafer-level packaging (WLP) of MEMS devices and other components requiring a hard vacuum, saying it has demonstrated vacuum levels below 10 mTorr for inorganic devices, equal to or better than industry standard.

04/05/2007 — Analyst: Silicon MEMS microphones gaining adoption in phones

April 5, 2007 - Silicon MEMS microphones were installed in 20% of mobile phones manufactured in 2006, up from 10% in the previous year, but in reality there are only two suppliers who reap the benefits, according to data from The Information Network.

04/03/2007 — Synova, Manz Automation eye growth in PV sector

April 3, 2007 - Manz Automation AG, a laser process technology component supplier, and Synova SA, a privately held Swiss developer of water jet-guided laser technology, will integrate their technologies into manufacturing equipment for photovoltaics applications through a new technology licensing agreement.

04/25/2007 — Lam, DNS climb 2006 tool ranks

April 25, 2007 - The top 10 suppliers of semiconductor equipment remained largely unchanged in 2006, even though only half beat the entire equipment industry's 23% growth rate, according to new data from VLSI Research.

07/10/2007 — SEMICON WEST TiS PREVIEW: Quantum modeling software, diamond films, and nanoimprint tools start to go mainstream in semiconductors

Despite the fact that it's done much of its manufacturing in nanoscale dimensions for years, the semiconductor industry hasn't yet had much use for the unique nanoscale properties of the nanoparticles, nanowires, quantum dots, etc. usually considered nanotechnology, nor found much use for the nanoscale patterning processes developed by the chipmakers. But that may be starting to change, judging by the crop of emerging technologies selected for SEMICON West's Technology Innovation Showcase.

07/10/2007 — IMEC looks to the future as SEMICON West opens

As another SEMICON West opens, IMEC's experts discussed with WaferNEWS what they see are they major keys to the future of semiconductor industry: exploring new markets, bringing finFETs into manufacturing, mastering 3D integration, and addressing sub-32nm low-k deposition challenges.

07/18/2007 — FormFactor announces new test technology

July 18, 2007 - FormFactor Inc. has developed a probing contact technology capable of full-area wafer probing of high pin density, ultra-fine pitch devices, announced the company at SEMICON West.

07/24/2007 — Is a new business model in the works for small foundries?

Silterra recently announced an extension of its JDP with IMEC to create a foundry-compatible 90nm CMOS process technology, with the intent to further scale to 65nm. WaferNEWS caught up with both Silterra president/COO Tzu Yin Chiu and IMEC's Ludo Deferm to talk about the competitive landscape, and the larger issue of what smaller foundries need to do to withstand the industry's drive to consolidate.

07/18/2007 — FormFactor endeavors to reduce cost of test

In the past week, two announcements by FormFactor, provider of advanced wafer probe cards, illustrate the company's pursuit to bring down the cost of test by taking IC testing upstream to the wafer level. "The only cost-efficient way to test is to test on the wafer," stated Igor Khandros, CEO, FormFactor.

07/20/2007 — Big push coming on two routes to 3D

3D chip packaging with through-silicon vias (TSV) will sweep across the industry over the next 3-5 years, based on presentations and discussions at SEMICON West. Using TSVs will enable very compact packaging offering much better performance. Many chipmaker roadmaps include 3D as an interim step from the 45nm to the 32nm node, sources said.

07/18/2007 — Emerging PV and MEMS markets poised for growth

Photovoltaics (PV) and micro-electromechanical systems (MEMS) equipment and materials were singled out as emerging market growth leaders through the end of the decade by SEMI president and CEO Stan Myers, during a press conference on Monday detailing SEMI's new consensus market forecast.

07/27/2007 — SUSS spins off device bonder unit

July 27, 2007 - SUSS MicroTec has carved out its device bonder division through a management buyout initiated by SUSS France president Gael Schmidt, in order to gain independence from the parent company which has little strategic synergies.

07/18/2007 — ICOS introduces automated 300mm wafer handling system

July 18, 2007 - ICOS Vision Systems Corp. NV, Leuven, Belgium, has introduced its new HM-300 automated wafer handling system for 300mm wafers at the SEMICON West trade show. Key market segments for the new product are semiconductor ICs, optoelectronics, advanced packaging, and MEMS.

07/18/2007 — SAFC, memsstar pair for SPD precursor mats for nanocoatings

July 17, 2007 - SAFC Hitech, part of the Sigma-Aldrich Group, has signed a deal to supply standard precursor chemical materials for memsstar Technology's surface preparation and deposition systems, to develop surface coatings on microdevices such as MEMS.

07/16/2007 — Startup shows new diamond-coated wafers for MEMS

July 16, 2007 - Advanced Diamond Technologies, Inc. (ADT), a startup targeting development and applications for diamond films, is revealing new product lines of diamond-coated wafers at SEMICON West.

01/30/2007 — Cypress selling STVC R&D site to private equity firms

January 30, 2007 - Count one more chipmaker that's decided to get out of the leading-edge R&D rat-race. Cypress Semiconductor Corp. says it is selling its Silicon Valley Technology Center (SVTC) 65nm process R&D shop to a pair of private equity firms for approximately $53 million in cash.

05/30/2007 — Fab owners group adds trio to roster

May 30, 2007 - The Fab Owners Association (FOA), a collection of an association of mainly second-tier semiconductor manufacturers, has expanded its roster with the addition of three chipmakers: Austriamicrosystems AG (analog), Avago Technologies (analog+mixed-signal, opto), and X-Fab (mixed-signal foundry).

07/10/2007 — Final score: Half-Pitchers 0.00000035, Red Brick Walls 0.000000022

Looks like the US has a lot to learn from European soccer superiority, even in the nanoscale world. ETH Zurich took home three top prizes in last weekend's nanogram demonstration at the RoboCup games, placing first in all three skills tests -- a goal-to-goal "2mm dash" (316ms), slalom around fixed polymer photoresist posts patterned onto the "field" (583ms), and ball handling drill (3 goals in 3 minutes).

06/07/2007 — Alcatel, Tronics join for MEMS DRIE

June 7, 2007 - Tronics Microsystems SA and Alcatel Micro Machining Systems (AMMS) say they will jointly develop deep reactive ion etch (DRIE) systems for "extreme-performance" MEMS.

06/28/2007 — Japan's Sumitomo buys US MEMS etch firm

June 28, 2007 - Primaxx Inc., an Allentown, PA-based developer of MEMS etch equipment, has agreed to be acquired by Sumitomo Precision Products Co. Ltd., its partner in Japan for selling and servicing MEMS-CET etching products, for an undisclosed all-cash deal.

06/14/2007 — Synova, Disco to develop hybrid dicing tool

June 13, 2007 - Swiss firm Synova SA and the German subsidiary of Japan's Disco Corp. say they are developing a hybrid dicing tool that combines Synova's Laser Microjet water-jet-guided laser technology with Disco's blade-saw dicing technology, to give semiconductor customers a high-throughput tool that minimizes damage to silicon and advanced-material wafers.

05/21/2007 — More flavors season the consortia "stew" in a fab /process-lite environment

In a fab-lite/process-lite business environment, consortia would be expected to have even more power and responsibility as more companies rely upon a shared cost model for process and materials R&D. In addition to the usual consortia membership (IDMs, foundries, and equipment/materials suppliers), IMEC's director of strategic program partnerships, Lode Lauwers, expects memory manufacturers, and more recently, fab-lite converts, to add their own needs or "flavors" to consortia research programs.

05/30/2007 — SVTC, TSMC pave silicon R&D pathway

May 30, 2007 - Fulfilling one of the strategic plans laid out when spinning out into a standalone entity, SVTC Technologies -- nee the Silicon Valley Technology Center, which was sold by Cypress Semiconductor in February to private equity investors -- has announced a "technology incubation program" with top foundry TSMC.

05/17/2007 — ST, SAES Getters partnership eyes booming MEMS gyroscope biz

May 17, 2007 - STMicroelectronics and the SAES Getters Group say they will integrate SAES' PageWafer getter thin-film technology, used in high-vacuums in wafer-level packaged MEMS devices, into ST's next-generation MEMS gyroscopes, targeting consumer devices, gaming, and navigation devices.

06/04/2007 — Fab owners' group launches purchasing program

June 4, 2007 - The Fab Owners Association (FOA), a collection of an association of mainly second-tier semiconductor manufacturers, has formed a group purchasing organization, FOA Purchasing Partners Inc., to represent the FOA and its devicemaker members with procurement services for semiconductor manufacturing consumables.

05/22/2007 — Prescription for pure-play MEMS foundries outlined at MEPTEC

Seeking to accelerate the growth of the MEMS device market, CEO and founder of LV Sensors Inc. (LVSI), Janusz Bryzek, called for the formation of a world-class pure MEMS foundry business with customizable standard unit processes at last week's MEPTEC conference. These unit processes, characterized and modeled over a broad range of settings, would be enabled by state-of-the-art high-volume processing equipment with first pass process yields similar to what is achievable in CMOS manufacturing.

03/19/2007 — New study compiles European fab stats

March 19, 2007 - The firm Research and Markets has released a new market study that compiles European fab stats. The company found that Europe accounts for more than 280 production and research fabs active in one or more of the investigated technology fields, including ICs and MEMS. Also, Europe employs about 65,000 people related to fab manufacturing activity.

08/27/2007 — UK etch/dep firm going private

August 27, 2007 - Surface Technology Systems Plc (STS), a UK-based supplier of deep silicon etch and deposition systems, says its parent company Sumitomo Precision Products Co. (SPP) has offered to buy back the 37% of shares in the company it does not own, in order to register the firm as a private company.

09/12/2007 — Emerging MEMS manufacturers look beyond auto apps

September 12, 2007 - MEMS revenue will double from $5B in 2005 to $10B in 2011, with a "select group of large, well-established MEMS suppliers" benefiting from growth in the automotive sector, and "new, emerging entrants" to the MEMS market capitalizing on opportunities in consumer, communications, and portable end-product sectors, according to Semiconductor Partners.

09/10/2007 — Taiwan's MediaTek buying ADI's baseband chipset unit

September 10, 2007 - Analog Devices Inc. has agreed to sell parts of its baseband chipset division to Taiwan's MediaTek for $350 million in cash.

08/14/2007 — Outsourcing spreads for process development and manufacturing

Chipmakers are turning to collaborations and partnerships to help manage escalating costs, as well as compressed cycle times and margins brought by "consumerization." Part of their strategy involves expanding their use of outsourcing, especially for process development. Speakers at a SEMICON West panel discussed this increased interest in outsourcing, citing the benefits of flexible capacity, better IP management, and assurances that outsourcing is viable even in an industry slowdown.

08/14/2007 — Semefab expanding capacity for MEMS output

August 14, 2007 - Scotland's Semefab Ltd. says it has acquired the building next to its Fab 1 and Fab 2 operations, as part of an expansion phase to create 3000 sq. m of new cleanroom floorspace for MEMS frontend processing

03/09/2007 — Silicon Valley Technology Center becomes independent company

March 9, 2007 - Silicon Valley Technology Center (SVTC), a development foundry for silicon-based technologies, has announced it is now an independent company, having closed its previously announced purchase by two private equity firms.

10/22/2007 — FOA inks first "preferred vendor" agreements

October 22, 2007 - The Fab Owners Association (FOA), an association of mainly second-tier semiconductor manufacturers and suppliers, says its recently-formed purchasing organization, FOA Purchasing Partners Inc., has signed several agreements for services including logistics/transportation, cleanroom supplies, publishing, telecom services, B2B office supplies/equipment, and auto rentals.

09/15/2007 — Firm touts "breakthrough" for 32nm maskless litho

September 14, 2007 - Dutch firm Mapper Lithography says it has achieved "massively parallel electron beam writing" with its newest maskless litho technology, demonstrating 45nm dense patterns in resist.

09/05/2007 — Synova, Manz ready combined PV "edge isolation" system

September 5, 2007 - Synova SA and Manz Automation say they've created a hybrid tool combining their technologies: an inline laser edge isolation system for photovoltaic manufacturing of solar cells.

10/04/2007 — Who needs through-silicon vias?

Experts at the recent daylong International Wafer-Level Packaging Conference in San Jose expressed confidence that technology integration can create a manufacturable fab flow using through-silicon vias. But while 3D-WLP is already commercially viable, wire-bonding already can handle up to 16 chips, and two-level connections can be easily flip-chipped. So let's acknowledge the elephant in the room: besides MEMS and optoelectronics, does anyone really need TSVs for commercial ICs?

10/01/2007 — Bosch: Deep etch tools on target for 100µm/min throughput in 2-3 years

Deep etching equipment is about to make a big jump in throughput. Franz Laermer of Robert Bosch GmbH, inventor of the widely used Bosch process for deep reactive ion etching, told SST partner Nikkei Microdevices how faster volume production speeds will not only bring down the costs of MEMS devices to expand their use in consumer applications and wafer-level packaging, but will also make production of 3D interconnect with through-silicon vias practical.

10/02/2007 — Semicon Europa sneak peek: Tracking Europe's present, future in PV, R&D, TAP, MEMS

After bouncing around on the calendar and in venue, Semicon Europa, formerly a springtime event in Munich, Germany, is ready to open its doors next week in Stuttgart (conveniently at the same time as Germany's second-biggest beer festival, Cannstatter Volksfest...complete with multistory fruit tower). Here follows a quick scan of highlights from Europa's program schedule, and sessions you'll want to bookmark.

12/04/2007 — SVTC, SEMATECH's ATDF merge to expand R&D capabilities

December 4, 2007 - Months after significant reorgs on both sides, the SVTC (nee the Silicon Valley Technology Center) and SEMATECH's R&D foundry subsidiary Advanced Technology Development Facility (ATDF) in Austin, TX, are merging to expand their ability to offer an alternative to dedicated R&D fabs or shared development/production operations, months after both sides took steps earlier this year to reorganize and expand.

11/19/2007 — MEMS, packaging groups to support others' efforts

November 19, 2007 - The MEMS Industry Group, a trade association representing MEMS and microstructure industries, and the MicroElectronics Packaging and Test Engineering Council (MEPTEC) have formed a strategic alliance to support each other's goals and industry events, through a variety of marketing programs.

11/01/2004 — MCNC-RDI, Lucent team on nanotechnology for the DOD

November 1, 2004 - MCNC Research & Development Institute, a North Carolina-based nonprofit research organization, has contracted with Lucent Technologies to provide 3D interconnect technology as part of a joint R&D project for the US Department of Defense's Coherent Communications, Imaging, and Targeting (CCIT) program.

10/14/2004 — EV, Datacon combine bonder equipment

October 13, 2004 - EV Group, Scharding, Austria, and Datacon Technology AG, Radfeld, Austria, have agreed to jointly develop and market a new chip-to-wafer bonding platform combining their technologies.

02/19/2004 — AML: No more MEMS fabless model for us

February 19, 2004 - UK-based AML said it is abandoning the foundry model for fabricating MEMS devices, calling it a "flawed concept" and "not flexible enough" to meet its demands, and is reverting back to in-house fabrication.

02/05/2004 — SEMI releases new standards

February 5, 2004 - SEMI, San Jose, CA, has published 25 new standards governing various steps for manufacturing semiconductors and flat-panel displays.

06/22/2004 — Cypress acquires CMOS sensor firm

June 22, 2004 - Cypress Semiconductor Corp., San Jose, CA, has agreed to acquire FillFactory NV, a Belgium-based developer of active-pixel CMOS image sensor technology, for $100 million in cash.

06/07/2004 — IEEE, SEMI sit at MEMS table

June 7, 2004 - SEMI and IEEE have signed an agreement to support each other's efforts in creating nanotechnology and microelectromechanical systems (MEMS) standards, the first standards collaboration between the two organizations.

08/25/2004 — EV Group expands UV-nanoimprint consortium

August 25, 2004 - EV Group today announced that a major Canadian research organization has joined its nanoimprint lithography (NIL) consortium formed to commercialize this technology.

04/20/2004 — Euro firms combine for MEMS packaging

April 20, 2004 - Alphasem AG, a Swiss supplier of die attach equipment, has acquired Sister Semiconductor Equipment GmbH (SSE), Singen, Germany, in an effort to expand into both upstream and downstream processes.

09/09/2004 — CEA Leti and Thales form joint microwave microsystems lab

September 9, 2004 - Thales and the French atomic energy commission CEA have formed a new joint laboratory in Grenoble, France, to work on RF MEMS to design and develop high-power microwave microswitches and ICs based on them.

05/18/2005 — Akrion will ship multiple systems to major MEMS supplier

May 18, 2005 - Akrion Inc. today announced the receipt of several orders from a long-time customer, one of the world's largest suppliers of MEMS. The order, valued at more than $2.5 million, includes 2 V3 batch-immersion systems and an upgrade to an existing GAMA Series wet cleaning system.

05/18/2005 — STG and SEMI partner to offer online education for standards

May 18, 2005 -The Standards Technology Group Inc. (STG) and SEMI today announced a partnership to provide SEMI standards training and online courses to the semiconductor industry. Under the terms of the agreement, SEMI standards courses will be designed and presented by STG and marketed by SEMI. Seminars are now available for GEM300 and EDA standards.

03/14/2005 — View from Japan: MEMS players to watch

By Paula Doe, Contributing Editor

A crowd of Japanese suppliers are gambling that rising demand for MEMS devices for high volume products is about to spur a real volume market for production tools and services. There are now 20 Japanese companies offering microelectromechanical foundry services and 12 supplying MEMS etching equipment, according to a recent report from PennWell partner Nikkei Microdevices.

03/14/2005 — Panelists discuss MEMS growth challenges at Photonics West

By Debra Vogler, Senior Technical Editor

Whether it's pursuing MEMS in medical device applications, or MEMS/MOEMS for use in displays, communications, consumer products, lithography, or sensors and actuators - especially those used for toys - the opportunities for MEMS span sectors and industries. A panel discussion moderated by Edward Motamedi, CTO of Revoltech Microsystems, covered the challenges and possibilities for MEMS growth at Photonics West, held Jan. 22-27.

05/31/2005 — Heard at Europa: ITRS stewards seek clarity, consensus for Roadmap priorities

By Paula Doe, Contributing Editor, WaferNews

Key issues under discussion for the 2005 edition of the International Technology Roadmap for Semiconductors include the introduction of 450mm wafers, the problem of improving critical dimension control, and clearer definitions for half pitch to keep everybody honest, said regional committee chairmen in a press conference at the recent SEMICON Europa.

04/01/2005 — European collaboration will use SOI for MEMS fabrication

New technology developed by QinetiQ, Malvern, UK, is to be used by Tronic's Microsystems SA, Crolles, France, for the volume production of innovative micro-electromechanical system (MEMS) devices. The technology teams will collaborate to achieve process design and compatibility, including full process statistics.

10/14/2005 — Eight new SEMI standards cover FPDs and MEMS

October 13, 2005 - Semiconductor Equipment and Materials International (SEMI) has published eight new technical standards for the semiconductor, flat-panel display (FPD), and microelectromechanical systems (MEMS) manufacturing industries.

02/08/2005 — Fab owners form manufacturing alliance

February 8, 2005 - Nine global semiconductor companies, representing 500,000 200mm-equivalent wafers/month and $7 billion in combined annual revenues, have formed the Fab Owners Association (FOA) to identify problems and potential solutions for common manufacturing issues.

01/21/2005 — Europe seeks flexible solutions to minifab manufacture

High-volume production of standard devices that have a long lifetime, such as DRAMs, continues to move towards Southeast Asia. However, in other regions there is a growing need for very flexible "minifabs" that can be rapidly and economically set up to make low-volume products that have very short lifetimes.

01/20/2005 — MEMS industry group receives funding from DARPA

January 20, 2005 - The MEMS Industry Group (MIG) announced that it has received funding from the Defense Advanced Research Projects Agency (DARPA) to continue its MEMS Cost Assessment Tool (MEMS CAT) project, and has chosen ISMI to modify its software for MIG.

03/24/2005 — EV Group ships Gemini production wafer bonder to DALSA

March 24, 2005 - EV Group today announced that it has successfully installed a Gemini production wafer bonder at DALSA Corp.'s Semiconductor Division in Bromont, Quebec, Canada. The Gemini wafer bonder is designed for alignment and low-temperature plasma bonding for a wide variety of wafer types and sizes.

03/23/2005 — Oki retools chip lines to handle different wafer sizes

March 23, 2005 - Oki Electric Industry Co. has retooled the semiconductor manufacturing lines at Miyazaki Oki Electric Co. so that its three fabrication lines can handle different wafer sizes, said the Nihon Keizai Shimbun.

08/18/2005 — IME to create lab-on-chip using EV Group equipment

August 18, 2005 - EV Group, Scharding, Austria, has announced lab-on-a-chip (LoC) developments achieved at its Singapore customer Institute of Microelectronics (IME).

08/10/2005 — RSL opens packaging R&D lab with Suss MicroTec

August 10, 2005 - RoseStreet Labs (RSL), Phoenix, AZ, has announced the opening of its 3D Research and Development laboratory for next-generation semiconductor packaging, as well as an alliance with Suss MicroTec, which will provide the lab with a full suite of lithography and 3D packaging equipment.

08/01/2005 — August 2005 Exclusive Feature: DEPOSITION Molecular vapor deposition of coatings for MEMS devices

Boris Kobrin, Victor Fuentes, Srikanth Dasaradhi, Applied MicroStructures; Robert Ashurst, Carlo Carraro, Roya Maboudian, U. of California at Berkeley

Results of a surface modification technique called molecular vapor deposition (MVD) are presented. The method is an enhancement of a generic vapor deposition process of self-assembling monolayers (SAM) with various surface preparation techniques, precise dosing of vapor precursors, and temperature control...

07/17/2002 — Transparent Networks moves to new HQ

July 17, 2002 - Milpitas, CA - Transparent Networks Inc., a developer of intelligent photonic switching systems, has expanded and relocated its headquarters from Santa Clara to Milpitas, CA.

04/18/2002 — European NanoBusiness Assoc. launches in Brussels

Brussels, Belgium - The European NanoBusiness Association has been launched with the goal of ensuring that Europe's strong scientific base in nanotechnology is successfully translated into innovative and dynamic European-based businesses.

08/01/2002 — Sandia and Ardesta: A partnership changed by 9-11

Roughly a year ago, Sandia National Laboratories, Albuquerque, NM, and Ardesta LLC, Ann Arbor, MI, announced a partnership aimed at transferring MEMS and microsystems technology to start-up companies in the commercial sector.

05/29/2002 — Jazz Semi partners with MEMSCAP for MEMS-based wireless ICs

May 29, 2002 - Newport Beach, CA and San Jose, CA - Jazz Semiconductor, an independent mixed-signal and RF silicon wafer foundry, has entered into a joint manufacturing and marketing agreement with MEMSCAP, a provider of MEMS solutions.

08/27/2002 — Europeans ponder: Whither MEMS?

While development of microelectromechanical systems (MEMS) has been going strong all over the world for at least a decade, Europe has been in the vanguard.

03/07/2002 — Veeco signs distribution agreement with Epion

March 7, 2002 - Woodbury, NY - Veeco Instruments Inc. has entered a distribution agreement with Epion Corp., a JDS Uniphase company, to distribute Epion's gas cluster ion beam (GCIB) product to the data storage, MRAM, MEMs, photomask, and wireless telecommunications markets.

02/26/2002 — US MEMS industry is growing rapidly, says MIG

"We are on our way" seems to be the sentiment coming from the MEMS Industry Group (MIG), which recently reported that the US MEMS industry will grow from 2000's $2 to $5 billion to an $8 to $15 billion industry by 2004.

01/24/2002 — Big excitement over tiny explosives

Chemists at U-Cal, San Diego have discovered that silicon wafers can be easily made into tiny explosives that might be used one day to chemically analyze samples in the field or serve as power sources for teensy electronic sensors the size of a speck of dust.

01/22/2002 — SiGen, Umicore partner for thick-SOI wafers

Jan. 22, 2002 - Campbell, CA - Silicon Genesis Corp. (SiGen), a developer of SOI wafer technologies, and Umicore, a Belgian-based metals and materials supplier, are collaborating to manufacture thick silicon-on-insulator wafers for electronic, photonic, and MEMS applications.

11/21/2002 — MEMS industry group and NEXUS form partnership

Nov. 21, 2002 - Pittsburgh, PA - The MEMS Industry Group (MIG), the trade association representing the North American MEMS and microstructure industries, and NEXUS, the European Microsystems Network, based in Grenoble, France, have announced that they have entered into a partnership to foster greater development and commercialization of MEMS and MEMS-enabled devices in Europe and North America.

04/23/2003 — NEXX Systems acquires All Wet Technologies

April 23, 2003 - Wilmington, MA - NEXX Systems has completed the acquisition of All Wet Technologies Inc. (AWT). AWT has developed electro-deposition technology for metal and photoresist. Arthur Keigler, president of AWT, joins NEXX Systems as VP of technology and board member.

01/02/2003 — TriQuint completes acquisition of optoelectronics biz from Agere Systems

Jan 2, 2003 - Hillsboro, OR - TriQuint Semiconductor Inc. has completed the acquisition of a substantial portion of the Agere Systems optoelectronics business for $40 million in cash.

07/01/2003 — Web broadcast to highlight impact of IC interconnects

July 1, 2003 - Dr. Kenneth A. Monnig, interconnects program associate director, International SEMATECH, will give the keynote presentation of the 3rd annual Surface Conditioning Process Symposium, held July 9-11, 2003, in Chaska, MN. Dr. Monnig's talk on the impact of challenges in IC interconnects on the semiconductor industry will be broadcast live on the Web via the Process Outlook Forum.

07/17/2003 — FEI scoops up firms

July 16, 2003 - FEI Co., Hillsboro, OR, has acquired two companies to complement its circuit edit and design-to-yield business.

10/24/2003 — Atmospheric-pressure plasma for surface prep/bonding

A new surface activation and wafer-to-wafer bonding process that uses atmospheric pressure plasma has been developed by SUSS MicroTec, eliminating the need for a vacuum chamber and associated process time.

09/02/2003 — MEMGen changes name

September 2, 2003 - MEMGen, Burbank, CA, has changed its name to Microfabrica, in order to more clearly define what the company does.

06/13/2003 — VLSI ranks 2002 probe card suppliers

June 9, 2003 - San Jose, CA - Advanced probe card technologies, including MEMS, continue to take a bite out of the semiconductor wafer test probe card market, according to a report from VLSI Research Inc., San Jose, CA.

08/04/2003 — Primaxx, ST Systems link for MEMS

August 4, 2003 - Primaxx, Allentown, PA, a manufacturer of thin film deposition and dry etch systems, has chosen ST Systems, Redwood City, CA, as the North American representative for its MEMS etching products. ST Systems will provide sales and service for Primaxx's MEMS-CET dry etch system.

09/02/2003 — MEMS group names leader

August 29, 2003 - The International MEMS Steering Group, a special interest group launched earlier this year by Semiconductor Equipment and Materials International (SEMI), has appointed Joseph Brown as its first chairman.

09/22/2003 — SMI finishes MEMS fab

September 16, 2003 - Silicon Microstructures Inc. (SMI), Milpitas, CA, says it has completed expansion at its MEMS wafer fab in Milpitas two months ahead of schedule.

09/16/2003 — Olympus forms MEMS division

September 15, 2003 - Olympus Optical Co. Ltd, Tokyo, Japan, has formed a new MEMS technology division to unify its MEMS activities.

10/26/2000 — Xicor Sells Milpitas Fab to Standard MEMS

Milpitas, California--Oct. 26, 2000--A definitive agreement has been signed by Xicor, Inc. to sell its Milpitas 6-inch wafer fab assets and inventory to Standard MEMS for approximately $12.5 million. Under a related agreement, Standard MEMS will become Xicor's fourth foundry.

12/05/2000 — RPI and Standard MEMS team up for micropackaging R&D

Burlington, Massachusetts--Standard MEMs, Inc. and Rensselaer Polytechnic Institute's Center for Automation Technologies have teamed up to create a joint micropackaging research and development (R&D) program that will focus on developing and prototyping state-of-the-art micromanufacturing technologies.

09/25/2000 — Fab joint venture announced

Itzehoe, Germany--Sept. 25, 2000--Standard MEMS, Inc. and Philips Semiconductors have announced a joint venture to build a MOS 8-inch wafer manufacturing facility for micro-electro mechanical systems (MEMS) and integrated discrete semiconductors in Itzehoe, Germany.

09/21/2000 — STMicroelectronics Acquires Waferscale Integration, Inc.

Geneva, Switzerland--Sept. 21, 2000--STMicroelectronics recently completed its aquisition of Silicon Valley-based Waferscale Integration, Inc., a leader in flash-based programmable system devices (PSDs).

06/14/2000 — JDS Uniphase to Purchase Motorola facility for MEMS Expansion

SAN JOSE, Calif.--June 14, 2000--JDS Uniphase Corp. announced a definitive agreement to purchase a North Carolina facility to expand its Cronos MEMS manufacturing capacity.

07/28/2000 — Cypress Acquires Silicon Light Machines

SAN JOSE, Calif.--July 27, 2000--Cypress Semiconductor Corporation has acquired Silicon Light Machines, moving Cypress into the optical networking market.

08/20/2001 — STMicroelectronics introduces MEMS-based rotational accelerometer

Aug. 20, 2001 - Geneva, Switzerland - STMicroelectronics has introduced a new rotational acceleration sensor device based on MEMS technology that addresses applications in hard disk drives and consumer products.

09/25/2001 — How to survive a downturn: Find hot niches

While the downturn in the chip industry has humbled even the mightiest semiconductor equipment companies, there are a handful of firms that have steered into good market niches. While no one is immune to this downturn, some companies are faring better than average due to management decisions fostering market adaptation based on core competencies.

09/05/2001 — Clare And Linear Dimensions team up to drive optical switching equipment

September 5, 2001 - Beverly, MA - Clare Inc. designer and manufacturer of high-voltage ICs, has entered into a product licensing and services agreement with Linear Dimensions Inc. to design, develop and market high-voltage linear amplifier products.

08/29/2001 — MEMS testing makes the grade

In recent months a trend has hit the semiconductor industry - and it has nothing to do with the economy or the downturn. While a few companies have earned money testing MicroElectroMechanical Systems (MEMS), it is a fairly new niche that is beginning to play host to companies throughout the chip industry.

10/15/2001 — Motorola moves ahead with the new accelerometer generation and MEMS technology

October 15, 2001 - Paris, France - Motorola and CEA-Leti, a department of CEA (Atomic Energy Commission of France), an R&D laboratory for MEMS products and technologies, have entered into an agreement to jointly develop and industrialize the next generation of surface micro-machined linear inertial sensors.

11/14/2001 — Modeling MEMS at Sandia

Modelers at Sandia National Laboratories are helping micromachine designers choose the device they want fully fabricated through new nano-modeling programs.

09/11/2001 — Mitsubishi Electric to ship MEMS samples

Mitsubishi Electric plans to start shipping samples of a new MEMS acceleration sensor chip set in October.

12/26/2001 — Equipment suppliers pursue MEMS opps

At a time when few business opportunities should be ignored, one is the infrastructure required for MEMS manufacturing. This is an area where growth has been limited by a lack of major support in key segments of the equipment industry. Although a number of suppliers recognized the business potential years ago, more work is needed.

01/25/2001 — MEMS-Industry Group trade association launches

Pittsburgh, Pennsylvania--A new trade association has been launched by leading microelectromechanical systems (MEMS) developers in the U.S. to represent the growing $2 billion technology sector. The association, MEMS-Industry Group, will function as a member-resource, sharing technology roadmaps, global market information, state of the industry reports, and acting as an advocate in public policy issues.

05/02/2001 — Suss enters new markets

May 2, 2001 - Munich, Germany - Drawing on the company's knowledge of MEMS equipment and probe systems, Karl Suss has added vacuum and cryogenic stations to its range of analytical probe systems.

03/13/2001 — August Technology expands wafer inspection applications to include MEMS and photonics markets

March 13, 2001--Bloomington, Minnesota--August Technology Corp. today announced that it has received orders for NSX Series inspection systems from two new U.S.-based customers with applications in the emerging markets of microelectromechanical systems (MEMS) and photonics.

01/22/2008 — From the Editor: Getting My Fix

I'm becoming an emerging technology junkie. One of the great things about my job is learning about new developments before everyone else in the world. Most of the time, I get to write about what I learned. Sometimes I don't. It's that word "embargoed" and the phrase "off-the-record" that hold me back. Eventually, I usually get to write about it — hopefully before anybody else does.

01/30/2008 — IMAPS Global Business Council's Spring 2008 Meeting Answers Industry Challenges

(January 30, 2008) WASHINGTON, DC — "Addressing Cost and Performance-driven Semiconductor Packaging through the Supply Chain." is the theme of this year's Global Business Council of the International Microelectronics And Packaging Society (IMAPS) Spring Meeting, set to take place March 17, 2008 at the Fort McDowell Resort, Scottsdale, AZ.

01/30/2008 — MEMS Forecast: Consumer Applications Drive Steady Growth

(January 30, 2008) PARIS — The latest market research released by Yole D

01/22/2008 — MEMS Software Tools

The schematic-based MEMS design environment ARCHITECT features a 3D visualization tool called Scene3D, which allows users to create 3D views of an ARCHITECT schematic and visualize simulation results with fully contoured 3D animations.

01/22/2008 — 300-mm Wafer Bonding Tool

The GEMINI platform is a production manufacturing solution for high-volume wafer bonding applications for MEMS, 3D integration, and advanced packaging, as well as compound semiconductor applications.

01/22/2008 — Wafer Inspection Tool

Suited to inspection of MEMS devices, the AW200 Series C-SAM acoustic micro imaging system from Sonoscan performs automated inspection, analysis and sorting of bonded wafers up to 200-mm in diameter.

01/22/2008 — Automated Submicron Bonder

The FEMTO is the newest bonder in the FINEPLACER family, capable of handling the assembly and bonding of laser bars and diodes, flip chips, VCSELs, MEMs, sensors, micro-optics, surface mount photonics, as well as simple die attach.

01/11/2008 — Renesas Expands Back-end Facility, Establishes Design Company in Malaysia

(January 11, 2008) TOKYO — Renesas Technology Corp. has announced plans to expand its back-end process plant in Malaysia to further strengthen the company's analog and discrete semiconductor business. In addition, Renesas has established a new analog and discrete semiconductor design company in Malaysia to increase its design resources.

01/14/2008 — Freescale Establishes Advanced 200-mm MEMS Production Line

(January 14, 2008) TUCSON, AZ — Freescale Semiconductor has established an advanced microelectromechanical systems (MEMS) 200-mm (8-in.) production line to address growing sensors market demand. The newly added line at Freescale's Oak Hill Fab in Austin, TX, complements the company's existing 150-mm (6-in.) MEMS capacity in Sendai, Japan.

01/16/2008 — Tessera Licenses Consumer Optics Technologies to Nemotek

(January 16, 2008) SAN JOSE, CA — Tessera Technologies Inc. has announced that it has licensed its OptiML wafer-level camera (WLC) technology and SHELLCASE wafer-level chip scale packaging (WLCSP) solutions to Nemotek S.A. The combination of these consumer optics technologies enables Nemotek to offer a full range of cost-efficient camera solutions from wafer-level packaging of image sensors and wafer-level lenses to fully-integrated camera modules.

01/16/2008 — Freescale Selects 200mm SUSS Tool Set for MEMS Facility

(January 16, 2008) MUNICH, Germany — SUSS MicroTec has shipped and successfully installed several microelectromechanical systems (MEMS) production tools at Freescale Semiconductor. The equipment included a new DSM200 Series front-to-back alignment verification system, the latest generation SUSS MA200 compact mask aligner as well as a SUSS ABC200 series wafer bond cluster system for use in MEMS sensor applications.

01/17/2008 — Freescale Ramps Up with Advanced 200-mm MEMS Production Line

(January 17, 2008) AUSTIN — Freescale Semiconductor has established an advanced microelectromechanical systems (MEMS) 200-mm (8-inch) production line to address growing sensors market demand. The newly added line at Freescale's Oak Hill Fab in Austin, TX, complements the company's existing 150-mm (6-inch) MEMS capacity in Sendai, Japan.

04/09/2008 — Datacon Technology Joins EMC-3D Consortium

(April 9, 2008) Radfeld, AUSTRIA — EMC3D, an international semiconductor equipment and materials consortium dedicated to the cost-effective development of 3D through silicon via (TSV) interconnects, announced the addition of Datacon Technology to the organization. Datacon, manufacturer of die bonding & sorting equipment will provide high-precision assembly expertise to the consortium.

04/10/2008 — MEMS Accelerometers Find Multiple Applications

(April 10, 2008) Scottsdale, AZ — - MEMS accelerometers have hit the limelight with all the consumer applications in gaming devices, such as the Nintendo Wii, and smart phones like Apple's iPhone. But these popular products are only the high-profile advance wave of what will be a rising tide of new and innovative uses for the tiny motion sensors, says Douglas McEuen, senior analyst at ABI Research.

04/15/2008 — STMicroelectronics Introduces High-performance MEMS Motion Sensors

(April 15, 2008) GENEVA — STMocroelectronics, a supplier of the MEMS devices found in many gaming and mobile multimedia applications, announced the addition of two accelerometers to its ultra-compact portfolio of devices in 4

04/18/2008 — Lee to Deliver Keynote at MEPTEC MEMS Packaging Symposium

(April 18, 2008) Medicine Park, OK — Luke P. Lee, Ph.D., from the Department of Bioengineering at UC Berkeley has been selected as keynote speaker for MEPTEC's 6th Annual MEMS Packaging symposium titled "MEMS Market Evolution: From Technology Push to Market Pull" on May 22, 2008. This one-day event will take place at the Wyndham Hotel, San Jose, CA.

02/12/2008 — SEMI Publishes Eight New Technical Standards

(February 12, 2008) San Jose, CA — SEMI has published eight new technical standards applicable to the semiconductor, flat panel display (FPD), and MEMS manufacturing industries. One of the standards, the SEMI MS6, provides a guide for design and materials for interfacing MEMS microfluidic systems.

02/13/2008 — Slotting MEMS Inkjet Devices with Water-jet Guided Lasers

By Tuan Anh Mai, Ph.D. and Bernhold Richerzhagen, Ph.D., Synova
February 20, 2008 — Inkjet printer heads hold one of the largest shares of the MEMS market. Printer manufacturers generally use thermal bubble jet technology or piezoelectric jet technology. A silicon chip is used as a barrier between the orifice plate, which contains hundreds of nozzles, and the ink reservoir.

02/15/2008 — Yole Releases WLP Report

(February 15, 2008) Lyon, France — Yole Developpement has just released a new report entitled "WLP & Embedded Die Technologies 2008". This report presents the manufacturing challenges faced by the wafer level packaging industry in terms of MEMS, CMOS image sensors and semiconductor ICs.

02/19/2008 — SEMICON West Courses Announced

(February 19, 2008) — Going to SEMICON West? PTI Seminars and SEMI have announced semiconductor courses at the San Francisco show in July. Some courses of interest include: Fundamentals of MEMS Design and Fabrication, Introduction to Chip and Wire Assembly in Microelectronics Packaging, and Low-cost Flip Chip, WLCSP, and Lead-free Technologies.

02/26/2008 — Georgia Tech orders STS DRIE Tool for Nano and MEMS Research

(February 26, 2008) NEWPORT, WALES and ATLANTA, GA — Surface Technology Systems (STS)announced that Georgia Institute of Technology (Georgia Tech) ordered a Pegasus Deep Reactive Ion Etch (DRIE) tool for their new Nanotechnology Research Center Building (NRCB), which is due for completion in fall 2008. Georgia Tech is the first university to acquire the latest generation of STS' advanced silicon etch (ASE) systems.

03/27/2008 — New Analysis Estimates MEMS Market to Reach $120.2M in 2014

(March 27, 2008) PALO ALTO, CA — If the MEMS test equipment market is to match the pace of the overall MEMS market, it has to develop cost-effective, standardized solutions. This is especially pertinent in a market where expensive customized products vastly outnumber off-the-shelf products. New analysis from Frost & Sullivan "World MEMS Test Equipment Markets," finds that the market earned revenues of $56.5M in 2007 and estimates this to reach $120.2M in 2014.

05/14/2008 — Vietnam - Chipscale Advanced Packaging Services Receives Certification

(May 14, 2008) Hanoi, VIETNAM — Vietnam-Chipscale Advanced Packaging Services, an outsource semiconductor assembly and test services provider based in Vietnam, has been presented with its investment certificate from th Vietnamese government, recognizing the company as a 100% foreign owned venture.

05/14/2008 — EV Group Expands Presence in Korea

(May 14, 2008) St. Florian, AUSTRIA — EV Group, equipment manufacturer for semiconductor, MEMS, and nanotechnology applications, announced the opening of a subsidiary, EV Group Korea Ltd., in Seoul, Korea to serve as a direct-to-customer site for sales, service, and support efforts for EVG's existing and potential new customer base. The subsidiary will reportedly house sales, service, process/application and administrative capabilities.

05/19/2008 — Wet Copper Seed Deposition Process Spells the End for PVD in TSV Construction

By Steve Lerner, CEO, Alchimer
It seems hard to believe that in just half a century the semiconductor industry has emerged from obscurity to become a key indicator for global economic prosperity. In that time it has developed a cyclic nature; periods of high growth followed by periods of low (or even negative) growth that, due to our overriding dependency on semiconductors, now impacts greatly on the developed world.

05/19/2008 — Standardization of Automotive MEMS Sensor Tests

Cost Pressure Switches from Consumer to Automotive Applications
By Andreas Nagy, Multitest
For every semiconductor company, final test and quality control adds cost without adding additional functional value to their product. That is why cost of test is constantly under pressure. In the early days of MEMS, cost-per-unit were not considered that critical, as MEMS prices were sometimes lower then traditional sensor prices by a factor of 100.

07/03/2007 — AML Ships R&D and Production Systems

(July 3, 2007) DIDCOT, OXON, U.K. — Applied Microengineering Ltd. (AML) won a European tender to supply Fraunhofer Institute for Mechanics of Materials (IWMH — Halle, Germany) with a wafer bonder for R&D, and an order from Semefab (Scotland, U.K.) for a production-volume bonder for use in MEMS manufacture.

07/16/2007 — TechXPOT at SEMICON West: MEMS

(July 16, 2007) SAN FRANCISCO — Discera, Inc., chief technology officer (CTO) Wan-Thai Hsu will present "The New Heart Beat for Electronics — MEMS Oscillators," at the Emerging Technologies and Markets TechXPOT, July 18, during SEMICON West, July 16–20 in San Francisco.

12/15/2008 — DALSA Semiconductor to License Alchimer's eG ViaCoat Technology

(December 15, 2008) BROMONT, Canada and MASSY, France —DALSA Semiconductor, supplier of specialized and custom wafer foundry services announced successful tests creating conformal copper seed layers on through-silicon via structures (TSVs) using the eG ViaCoat process from Alchimer S.A. As a result DALSA reportedly intends to license Alchimer's technology to enhance its MEMS production capabilities.

02/01/2008 — MEMUNITY Announces 8th Workshop on Wafer-Level MEMS Testing

(February 1, 2008) Dresden, GERMANY — Following a successful series of events held in Europe, MEMUNITY has announced its eighth workshop under the title "Critical Success Factors for Commercialization: Production Test of MEMS at Wafer Level". The workshop will be held on March 13 at the Institute for Microelectronic and Micromechanical Systems (IMMS) in Ilmenau, Germany.

02/04/2008 — Unisem, KVD Partner to Share US Testing Facilities and Equipment

(February 04, 2008) SUNNYVALE, CA — Unisem Berhad today announced that KVD, a provider of test solutions for the analog-dominant device market, will be leasing part of Unisem's Sunnyvale testing facilities for KVD's analog testing services and solutions for final test and wafer sorting. KVD will have its own engineering staff onsite and will utilize Unisem's onsite training facilities to provide classes for engineers and operators.

02/05/2008 — IIT Bombay Selects EV Group Bonders for Micro-Fabricated Sensor R&D Project

(February 5, 2008) St Florian, Austria — EV Group (EVG) has announced it has received an order from the Indian Institute of Technology (IIT), Bombay, for two of EVG's MEMS-focused systems. The systems will be for a new Indian government-supported automotive MEMS R&D project and are slated for installation this month in IIT Bombay's Mumbai facility.

05/01/2006 — In The News

SAN JOSE, CA - In response to the success of Technology Innovations Showcase (TIS), SEMI has expanded the idea, introducing TechXPOTs to SEMICON West 2006, July 11-14 at the Moscone Center in San Francisco, CA.

05/01/2005 — 3-D Integration of ICs


06/01/2005 — Growth Markets for Advanced Packages

Summertime offers lots of opportunities to look at new markets, refocus on those in the past, and regroup in general.

07/01/2006 — In the News

With silver prices almost double what they were in the fourth quarter of 2005, materials costs are starting to be affected.

04/01/2005 — Extreme-Environment Electronics for the Future

Electronics have dramatically changed the way we live, conduct business, communicate, and educate.

04/01/2005 — What Is IC/Package Co-design?

Enabling Global Optimization & Characterization of Design

05/01/2005 — Is ‘Packaging’ a Valid Academic Subject?

The answer is yes. First, we need to define ‘packaging.

09/01/2006 — A New Hierarchy for Electronic Interconnections

The hierarchy of electronic interconnections has undergone some significant changes over the last several years.

09/01/2005 — MEMS Packaging Update

Providing a foundation for future packaging advancements

10/01/2005 — MEMS: Poised for Success

Diving competitions always draw my attention. Having the courage to align one’s body in a head-downward position from a precipice high above the water seems illogical, risky, and difficult.

04/01/2008 — To Infinity and Beyond

When it comes to semiconductor and MEMS devices, it is well-known that the industry is experiencing certain limitations – whether they are related to functionality, reliability or cost.


Privacy groups could slow down RFID chip growth The optimism surrounding Wal-Mart's June announcement that strongly encouraged its top 100 suppliers to start using radio frequency identification (RFID) tags by 2005 (see WaferNews, V10n24, June 16, 2003) may have been premature.
(September 17)
Click here for these and more WaferNews briefs.


Mid-4Q updates: Happy holidays for chipmakers
(December 15, 2003) Halfway through the current fiscal quarter, several big chipmakers are spreading holiday cheer with revised financial outlooks — but one chipmaker will also receive a lump of coal in its stocking.

11/01/2006 — Developing MEMS for Marine Sensors

MEMS is an enabling technology allowing for the development of smart products, augmenting the computational ability of microelectronics with the perception and control capabilities of microsensors and microactuators and expanding the space of possible designs and applications.

08/01/2004 — In the News

Amkor Acquires Unitive Click here to enlarge imageCHANDLER, ARIZ. — Amkor Technology Inc. recently signed a deal to acquire Unitive Inc., a Research Triangle Park, N.C-based provider of wafer-level technology and services for flip chip and wafer-level packaging applications. The acquisition comes at a time when industry analysts expect[...]

04/01/2004 — Trends in Wafer-level Packaging of MEMS

Microelectromechanical systems (MEMS) are miniaturized systems with electrical and non-electrical components.

11/01/2005 — In the News

Kulicke & Soffa Expands Operation in ChinaWILLOW GROVE, PA - Kulicke & Soffa Industries, Inc., a supplier of semiconductor wire bonding assembly equipment, recently announced the expansion of its Suzhou, China plant; increasing manufacturing capabilities to produce both dicing hub blades and test sockets in addition to its existing capillary[...]

04/01/2004 — Advances in MEMS Packaging

The microelectromechanical systems (MEMS) component market size is forecasted to continue growing over the next few years. This article presents design considerations to provide a better understanding of the unique challenges facing MEMS packaging engineers, when compared to traditional IC packaging. Automatic MEMS assembly requires optimized equipment and processes.

10/01/2004 — Technology Drivers Still Changing the Packaging Industry

Those involved in the packaging industry are quite familiar with two key technology drivers: Moore's Law (which dictates that the number of transistors will double in an IC every 24 months), and the increasing need to pack more capability (MIPs, Mbytes, GB/sec) into less space.

09/01/2004 — Standard Open Tool Packages for MEMS-enabled Products


07/01/2004 — In the News

SEMI, IEEE Collaborate on MEMS, Nano and Smart Materials StandardsSAN JOSE, CALIF. — SEMI and IEEE recently signed a memorandum agreeing to support each other's efforts to create standards for nanotechnology and MEMS. The two organizations plan to appoint liaisons, define a regular exchange of information and schedule periodic[...]

05/14/2002 — MEETING REPORT

Updates on folded flex and thin packaging at ICAPS
The International Microelectronics and Packaging Society held its first International Conference on Advanced Packaging and Systems (ICAPS) in March in Reno. The event featured sessions on most critical areas of advanced packaging technology, including design and test, 3-D packaging, MEMS packaging, and thermal management. Tabletop exhibits accompanied the two parallel technical sessions.

08/30/2002 — ESEC Introduces 5 µm Die Attach Solution

Cham/Switzerland, July 17, 2002 - ESEC, a leading provider of chip-assembly equipment and system solutions for the semiconductor industry, announces the introduction of a 5 µm Die Attach solution on its Micron 5003 Die and Flip Chip Attach Machine. This tool fulfills an important request from ESEC's customers and will insure more accurate bonding performance and overall superior results.

03/01/2008 — IN THE NEWS

Setting the tone for the 9th annual BITS Workshop, March 9-12, Mesa, AZ, with a presentation entitled “Packaging & Assembly in Pursuit of Moore’s Law and Beyond”, keynoter Karl Johnson , Ph.D., V.P and senior fellow at the advanced packaging systems integration laboratory, Freescale Semiconductor, will address new challenges, trends in packaging and assembly, and some unique solutions including system-on-chip (SOC) , 3D, system-in-package (SiP) and wafer-level assembly.

01/01/2008 — IN THE NEWS

STAMFORD, CT - A glut in the DRAM market, slower than expected growth in NAND spending, and concerns about a U.

11/19/2003 — IMAPS inaugurates president for 2004

(November 19, 2003) Boston, Mass.—Yesterday, at its annual meeting held in Boston, the International Microelectronics and Packaging Society - North America (IMAPS) inaugurated Phillip J. Zulueta as president for the 2004 term.

12/14/2007 — Wafer Probe Card

The TrueScale PP40 wafer probe card is designed to enable high-efficiency and high parallelism wafer probing on advanced wire bond logic and SoC devices. By supporting pad pitches down to 40 microns, this probe card allows IC manufacturers to shrink the size of their test pads, enabling some users to retain a single-row pad layout.

05/22/2006 — April '06 Book-to-Bill Ratio Continues Climb

San Jose, CA — On a 3-month average basis, North American-based semiconductor equipment manufacturers posted $1.60 billion in orders and a book-to-bill ratio of 1.11 in April 2006, according to SEMI's April 2006 Book-to-Bill Report.

05/25/2006 — Freescale Orders SUSS Production Wafer-bonding System

Munich, Germany — Freescale Semiconductor recently ordered one of SUSS MicroTec's ABC200 automated production wafer-bonding systems. Silicon wafer bonding is a critical wafer-level packaging technology and an enabling technology for the mass production of cost-effective MEMS accelerometers for Freescale, so SUSS' automated production wafer bonders ideally suit their needs.

05/26/2006 — FlipChip International and Engent Form Strategic Alliance

Phoenix, AZ — Aiming to speed up development and deployment of 3-D wafer-level chip-scale packages(WLCSP) for integrated stack-die packages, FlipChip International (FCI) and Engent have formed a strategic alliance. FCI specializes in wafer-level bumping, while Engent's focus is 3-D flip chip assembly.

07/07/2006 — Digital Hearing Aids Adopt RF

(July 7, 2006) POCATELLO, ID — Interton, a hearing aid system manufacturer, has selected AMI Semiconductor (AMIS) to develop advanced wireless capabilities for hearing aid devices. The battery life expectancy for hearing devices complicates additions of wireless technology; therefore, AMIS will develop ultra low-power radio frequency (RF) subsystems for devices.

07/10/2006 — Micralyne Expands with SUSS

(July 10, 2006) EDMONTON, Alberta — Micralyne, a MEMS components manufacturer, announced it has purchased SB6e wafer bonder and BA6 aligner systems from SUSS MicroTec, Inc.

11/08/2007 — Infotonics' MEMS Facility Selects Eyelit's Integrated MES and QM Software Suite

(November 08, 2007) TORONTO, Canada — Infotonics Technology Center (ITC) in upstate New York has selected Eyelit's Enterprise Manufacturing Execution (MES) and Quality Management Software Suite for improving overall process control in Infotonics collaborative manufacturing facility. Eyelit Inc. is a manufacturing software provider for visibility, control and coordination of manufacturing operations.

11/15/2007 — Early MEMS Accelerometer Adopters See Profits Roll In

(November 15, 2007) SCOTTSDALE, AZ — Accelerometers — devices that sense motion — have been with us for a long time, but only recently have they have been miniaturized as silicon-based devices. Consumer electronics makers who saw their hidden potential and built new products such as Nintendo's Wii, Apple's iPhone, and Activision's "Guitar Hero" game around them have achieved huge market success by revolutionizing the user-interface.

11/19/2007 — MEMS Congress Grows as Applications Abound

By Gail Flower, Editor-in-Chief

On November 4–5, 2007, the MEMS Congress met in San Diego to discuss new applications and future technology challenges for MEMS with keynotes and panel discussions. Last year's gathering numbered 110 participants; this year it grew to 150 attendees. Day one was taken up with social events: a golf outing and a wine and beer tour, and ended with a reception for worldwide attendees.

11/19/2007 — Joanne Solomon Named Amkor Technology CFO

(November 19, 2007) CHANDLER, AZ — Amkor Technology Inc. has announced that Joanne Solomon has been appointed Corporate VP and CFO, succeeding Ken Joyce in that position. Solomon will continue to report to Joyce, who has been named to the new position of Chief Administrative Officer.

08/30/2006 — Magnetometer Designed on MEMS Chip

(August 30, 2006) LITTLE FALLS, NJ — A prototype magnetometer that could improve perimeter control in war zones and border control for various military organizations is currently under development at the New Jersey Nanotechnology Consortium's Laboratory, Murray Hill, NJ. The prototype, developed by mPhase Technologies, accurately locates a metal object more than 30 ft. away, using a MEMS device to sense changes in magnetic fields.

09/05/2006 — MEMS: Getting Under Your Skin

By Meredith Courtemanche, assistant editor

MEMS are a seductive option for manufacturers of medical devices. Microscopic mechanical structures on MEMS chips open a range of sensing and detection options — pressure sensors, magnetic and light detection, microinjections, and more. Bio-MEMS are creating a niche in the industry for high-reliability, critical-application, sophisticated sensors that doctors can implant or inject into a human body.

03/30/2006 — SUSS Installs Probe Systems in IMEC Research Center

Munich, Germany — SUSS MicroTec AG has installed PA300PS ProbeShield semiautomatic probe systems with ReAlign and ContactView technology and PA300 probe systems for RF-noise and S-parameter measurements at IMEC, a Leuven, Belgium-based nanoelectronics research center. The two companies will also collaborate on enhancing 300-mm probe systems in the future.

03/31/2006 — Device Packaging Conference Takes Off

Phoenix, AZ — The second annual IMAPS Device Packaging Conference, March 20–23, drew double the audience of last year. Sessions were crowded, exhibit space was sold out, and excitement was high. The conference, which this year incorporated the former IMAPS Flip Chip Workshop, offered three keynote speakers and five parallel tracks, with 26 sessions totaling about 100 papers.
By George Riley, Ph.D., contributing editor

10/16/2007 — SEMICON Europa: An Editor's Perspective

For an editor of a semiconductor manufacturing publication, there are several sides to every trade show. On one hand are the technical sessions, where we get a glimpse of the latest and greatest technologies being developed. On the other hand, are the industry players

10/18/2007 — Aviza Receives System Order from Bosch

(October 18, 2007) SCOTTS VALLEY, CA— Aviza Technology, Inc. (NASDAQ:AVZA), a supplier of advanced semiconductor capital equipment and process technologies announced a system order of its Omega fxP cluster system from Robert Bosch GmbH, a MEMS sensor manufacturer specializing in automotive sensors and consumer devices. This is Aviza's second major MEMS customer to be announced in three months.

10/22/2007 — Tire Pressure Monitoring Market to Reach $183M in 2012

(October 22, 2007) Lyon, France— The current market for tire pressure monitoring system (TPMS) sensors is expected to reach $183M in 2012 from $168M in 2007, seeing a CAGR of 2% till 2012 in revenue due to a strong erosion of prices, despite an increase of 12% in volume, says a new report from Yole Developpement. 99% of direct TPM systems use MEMS pressure sensors.

10/25/2007 — WiSpry Introduces MEMS-tunable Digital Capacitors

(October 25, 2007) IRVINE, CA — WiSpry Inc. has introduced its product family of MEMS tunable digital capacitors for cellular applications. These products integrate low power CMOS control and voltage generation logic with an array of tunable RF-MEMS digital capacitors. Samples of these capacitors will be available in 2Q08.

10/25/2007 — Expanding MEMS Market to Draw Industry to MEMS Congress

(October 24, 2007) PITTSBURGH, PA — With the market for microelectromechanical systems (MEMS) technology expected to grow to US$10.7 billion by 2011, both traditional semiconductor companies with MEMS divisions and MEMS-centric companies will meet to discuss this expanding market at the Annual MEMS Industry Group Event and Congress on November 4-5 in Del Mar, CA.

10/31/2007 — Sensors Strip Off their Packaging with VTI Chip-On-MEMS

(October 31, 2007) VANTAA, Finland — VTI Technologies has developed manufacturing concepts that offer better ways of combining MEMS and ASIC technology to create smaller, smarter, and lower cost sensing devices suitable for large volume production. The work being carried out by VTI could open up a raft of new sensing applications for a wide range of handheld devices.

11/05/2007 — Teneo, GA Tech Combine on Precision Microtools for MEMS

(November 5, 2007) ATLANTA, GA — Teneo Micro Instruments LLC, an IP2Biz company, has launched the Teneo TM70xx line of mechanically actuated microtools. The tool set, created by researchers at the Georgia Institute of Technology, offers a diversity of tool materials, requires no electrical or thermal power to operate, and seamlessly integrates and augments standard microprobe and micromanipulator stations.

04/17/2006 — MEMS Microphone Chip

The AKU2000 surface-mountable complementary metal oxide semiconductor (CMOS) microelectromechanical systems (MEMS) microphone integrates an acoustic transducer, output amplifier, and 4th-order sigma-delta modulator in a single chip.

06/06/2006 — Another Word on Nano

The day after I wrote my last editorial entitled Nano-inspiration, I attended the MEMS and Nanotechnology session at the IMAPS New England Symposium, May 16, in Boxborough, MA. There was so much discussion about nano-hype, multiple definitions of nano, how nanomaterials are made, and what you can do with them that I wished the session had occurred a few days earlier.

06/06/2006 — SEMI Holds Meeting on MEMS Packaging Standards

(June 6, 2006) SAN JOSE, CA — If you're like most people who responded to SEMI's survey on MEMS packaging standards, you're not aware that SEMI has published three MEMS-related standards. Existing standards cover microscale fluidic systems, terminology, and wafer bonding. SEMI's MEMS technical committee has identified MEMS packaging as a task force area, and standardization efforts are just beginning.

07/24/2006 — MEMS Propel High-vacuum Bonding

(July 24, 2006) MUNICH, Germany — A prototype wafer-bonding system designed for high-vacuum applications debuted at SEMICON West 2006, billed as a MEMS-centric wafer bonder. SUSS MicroTec's M-Lock, expected in production in Q'03 2006, is a load-locked system developed for the specific challenges presented by advanced MEMS devices.

07/26/2006 — Technology Exchange Offers Diamonds

(July 26, 2006) SANTA CLARA, CA — The MEMS and Nanotechnology Exchange will incorporate sp3 Diamond Technologies Inc.'s diamond-on-silicon (DOS) foundry service into processes they offer. Developers with the Exchange can access proprietary chemical vapor deposition (CVD) services and thermal, mechanical, and wear properties of diamond technology.

07/27/2006 — Companies Collaborate for Etching Tool Suite

(July 27, 2006) SAN FRANCISCO — XACTIX and Surface Technology Systems have released a suite of etching tools specific to MEMS, combining STS and XACTIX products. The xenon difluoride silicon-etch systems enable unconventional processes, "such as etching after package insertion and wire-bonding," says David Springer, president of XACTIX. They use xenon difluoride gas to selectively isotropic etch into bulk silicon or remove sacrificial layers made by silicon, germanium, or molybdenum.

01/19/2006 — MEMS Market Forecasted to Hit $12.5B in 2010

Norwalk, CT — The global market for MEMS devices and production equipment was worth an estimated $5 billion in 2005, and will increase to $12.5 billion through 2010, an average annual growth rate (AAGR) of more than 20%, claims a soon-to-be-released, updated technical market research report, RGB-270R MEMS: A Roadmap to Technologies and Applications from Business Communications Co. Inc.

11/19/2007 — 300mm Wafer Probe Card for Burn-In Test

The latest addition to its Harmony family of full-area, 300mm wafer probe solutions — the Harmony wafer-level burn-in (WLBI) probe card — is reportedly designed to maximize throughput, as well as ensure higher quality and reliability of semiconductor devices.

12/04/2007 — BPM Microsystems' Flash Programmer Reduces Programming Time for STMicro

(December 4, 2007) Houston, TX — BPM Microsystems has announced that its newest flash memory programmer, the Flashstream, has dramatically reduced the programming time for the NAND Flash Large Page Family from chipmaker STMicroelectronics.

12/04/2007 — From the EditorA Household Word

As I waited my turn at the grocery checkout recently, I passed the time scanning magazines for juicy tabloid gossip. Much to my surprise, tucked between covers revealing the truth about Britney's drug problem and Brad and Angelina's most recent tiff, was a cover line on Diabetic Living, a Better Homes and Gardens publication, about ultra-small insulin pumps, which reportedly rely on MEMS devices to achieve miniature size and increased functionality.

06/23/2006 — May Book-to-Bill Increases 3%

(June 23, 2006) SAN JOSE, CA — North American-based semiconductor equipment manufacturers posted $1.65B in orders in May 2006 with a book-to-bill ratio of 1.12, according to SEMI's May 2006 Book-to-Bill Report. Average worldwide bookings in May 2006 equaled $1.65B, up three percent from last month and 62% from May 2005.

10/24/2003 — 'Growing' microchip circuits

(October 24, 2003) TUCSON, Ariz.—The University of Arizona's nanotechnology research group is using proteins from living cells to "grow" wires for microchips, with funding from a U.S. National Science Foundation grant.

10/24/2003 — IMEC, EV Group team to work on wafer-level packaging

(October 24, 2003) Schärding, Austria—A collaboration agreement on wafer-level packaging and MEMS bonding is bringing together EV Group, an Austria-based manufacturer of MEMS and wafer processing equipment, and IMEC, a Belgium-based independent research institute on microelectronics and micro/nanotechnology.

08/26/2004 — IMAPS and ACerS call for papers for International Conference on Ceramic Interconnect and Ceramic Microsystems Technology

(August 26, 2004) Washington, D.C.—The International Microelectronics and Packaging Society (IMAPS) and The American Ceramic Society (ACerS) recently issued a call for papers for the first International Conference on Ceramic Interconnect and Ceramic Microsystems Technology. The conference will take place April 10-13, 2005, at the Baltimore Marriott Waterfront Hotel in Baltimore, Maryland, and will be co-located with the 107th Annual Meeting and Exposition of The American Ceramics Society.

04/01/2004 — Penn State researchers creating tiny lubricants for MEMS

(April 1, 2004) University Park, Penn.—Tiny machines built as part of silicon chips are all around us, and their need for lubrication is the same as large machines such as automobile engines, but conventional lubricants, like oils, are too heavy for these microelectromechanical systems (MEMS), so Penn State researchers are looking to gases to provide thin films of slippery coating.

04/28/2004 — Nanogold doesn't glitter, but its future looks bright

(April 27, 2004) Bethlehem, Pa.—All that glitters is not gold, goes the old adage. But the shrinking frontiers of science require a qualifier: gold itself does not always glitter. In fact, if gold is created in small enough chunks, it turns red, blue, yellow and other colors, says Chris Kiely, who directs the new Nanocharacterization Laboratory in Lehigh's Center for Advanced Materials and Nanotechnology.

05/03/2004 — Merging MEMS and wafer-level packaging

(May 3, 2004) Contributed by Jody Mahaffey, JDM Resources.
If you've been reading the trade-press these past couple months, you may think that MEMS are one of the hottest topics in the industry today. It's been reported by varying sources that MEMS revenues are forecast to increase at a compound annual growth rate of 15-20 percent over the next few years, while units shipped are forecast to grow at a compound annual growth rate of 25-30 percent.

01/19/2004 — SUSS MEMS equipment package chosen by SensoNor to make tire pressure sensors

(January 19, 2004) Munich, Germany—SUSS MicroTec AG's MEMS production systems have been chosen by SensoNor, a MEMS manufacturer for the automotive industry, to manufacture tire pressure sensors. Lithography and wafer-to-wafer bonding are two important steps in the MEMS fabrication process.

10/04/2004 — China IC packaging and testing firm to offer chip-scale packaging

(October 4, 2004) Taipei—China-based Jiangyin Changdian Advanced Packaging (JCAP) is setting up chip-scale packaging lines and wafer-bumping lines, slated for mass production next year.

06/04/2004 — Freescale joins E3 Lead-free initiative, makes it E4

(June 4, 2004) Munich, Germany—Freescale Semiconductor Inc., a subsidiary of Motorola Inc., has joined STMicroelectronics, Infineon Technologies and Philips to further lead-free electronics packaging. Formerly E3, the group is now called E4 (environmental 4) and focuses on accelerating the use of lead-free packages while stimulating further development of environmentally friendly package technologies.

06/07/2004 — SEMI, IEEE collaborate on MEMS, nano standards

(June 7, 2004) San Jose, Calif.—SEMI and IEEE recently agreed to support each other's efforts to create nanotechnology and MEMS standards. The organizations will appoint liaisons, define a regular exchange of information and schedule periodic joint meetings to present updates and disseminate standards information on nanotechnology and MEMS.

06/29/2004 — New report predicts 'banner year' for MEMS industry

(June 29, 2004) Scottsdale, Ariz.—While the first half of 2003 was not terribly promising for microelectromechanical systems (MEMS) suppliers, business activity picked up considerably in the fourth quarter of 2003, and has remained strong through the first half of 2004, reports In-Stat/MDR in its new report, Step by Step to Success: 2004 MEMS Industry Overview and Forecast. This high-tech market research firm predicts that 2004 will be a banner year for this industry.

06/29/2004 — SEMICON West 2004 to include keynote speakers, panel discussions and special programs

(June 29, 2004) San Jose, Calif.—SEMICON West 2004, the largest exposition in North America for the semiconductor and microelectronics manufacturing industry, will feature keynote presentations by industry leaders, focused panel discussions among technology experts and other programs designed to facilitate information exchange between the global IC community and their manufacturing technology providers.

09/09/2005 — Microfabrica Kicks Off MEMS Design Competition

Burbank, Calif. — Microfabrica and MOSIS have launched the EFAB Access Design Competition for microdevices. Offered by MOSIS, EFAB Access, a low-cost prototyping service for MEMS and microdevice development, is the first multi-project run service to offer Microfabrica's EFAB 3-D micromanufacturing technology. The three winning microdevice designs will be built free of charge through the EFAB Access program.

10/06/2005 — Bright Future Predicted at IMAPS

By Françoise von Trapp, Advanced Packaging Associate Editor
Projected industry growth, offshore migration of manufacturing, challenges caused by rapid developments in technology, and advances in nanotechnology dominated industry discussion at the 2005 International Microelectronics and Packaging Society (IMAPS) Symposium, September 25-29th in Philadelphia.

08/05/2005 — SMT, SMT China Announce Call for Papers for Upcoming Conference

Shanghai, China — Advanced Packaging Magazine sister publications, SMT and SMT China, along with the China Electronics Appliance Corporation (CEAC), announce the Call for Papers for the 2005 SMT China International Conference on Emerging Technologies & Lead-free Challenges. Held annually, SMT and SMT China Magazines will focus on SMT, emerging technologies, and hot topics for modern assembly methods.

08/09/2005 — MEMS Industry Group Adds New Members

Pittsburgh, Pa. — The MEMS Industry Group (MIG), a trade association representing the MEMS and microstructures industries, has added 9 new members during the second quarter of 2005 to its roster, including Boston Micromachines, Eyelit Inc., IceMos Technology, Makino, Meggitt Electronics, MicroBridge Technologies, SAES Getters, SiTime, and Tronics Microsystems.

11/14/2006 — Vectron, Discera to Co-develop MEMS Devices

(November 15, 2006) MUNICH, Germany — Discera, Inc., and Vectron International will work together to commercialize MEMS oscillators for electronics manufacturing. The companies announced during electronica 2006, November 14 – 17 in Munich, that quartz-crystal resonator company Vectron tested and approved the MEMS-based timing devices offered by Discera, and that they will work closely together to gain exposure for the MEMS devices and develop new products.

12/01/2006 — EV Group Partners at Wafer Level

(December 1, 2006) ST. FLORIAN, Austria — Sonix, Inc., selected EV Group as exclusive worldwide reseller and distributor for select products. Sonix (Springfield, VA), a wholly owned subsidiary of the Danaher Corporations, manufactures acoustic NDT solutions for bonded wafers and MEMS.

12/04/2006 — University Selects SUSS Wafer Bonder

(December 4, 2006) MUNICH, Germany — The University of Alberta's NanoFab chose SUSS MicroTec's ELAN CB6L wafer-bonding equipment for its research and production activities. The NanoFab is an open access micro- and nano-fabrication facility used by more than 130 research groups from the University of Alberta, other Canadian universities, and industry. The manual bonder will be used in nanotechnology research, RF MEMS switches for wireless applications, and other research activities.

12/05/2006 — The News from SEMICON Japan

(December 6, 2006) TOKYO — Celebrating its 30th anniversary, SEMICON Japan drew exhibitors showcasing products and processes alongside symposia, seminars, and standards meetings December 6 – 8 in Chiba, Japan. Vanguard topics of MEMS and nanotechnology demonstrated the show's motto "sharing expertise, making innovation." The SEMI Technology Symposium (STS), seminars, and a 30th anniversary gala provide a range of opportunities for networking.

12/05/2006 — Yole Reports on MEMS

(December 5, 2006) LYON, France — Yole Développement's market research report, "Status of the MEMS Industry," examines markets, fiscal forecasts, and geographical considerations for MEMS through 2010. Yole studies various business models in the sector as well as emerging MEMS activities in India and China. Analysis of the packaging and test business linked to MEMS manufacturing is also supplied. Yole expects MEMS to reach $10B by 2010, and defines reasons for growth.

10/11/2006 — Dynamic Summits from Cadence and Microsoft

By Julia Goldstein, Ph.D., contributing editor

More companies are holding summits where they present recent corporate news and invite their customers, partners, and/or suppliers as presenters and attendees. While these events are high on glitz — huge screens, video demonstrations, special effects — they also tend to bring in dynamic speakers and provide an opportunity for networking among various players in the supply chain.

01/19/2005 — ChipMOS Reports Revenue for December 2004

(January 19, 2005) Hsinchu, Taiwan — ChipMOS Technologies (Bermuda) Ltd. has reported unaudited consolidated revenue for the month of December 2004.

01/19/2005 — MEMS Industry Group Continues Phase II of MEMS CAT Project

(January 19, 2005) Pittsburgh, Pa. — The MEMS Industry Group (MIG) announces that it has received funding from the Defense Advanced Research Projects Agency (DARPA) to continue its MEMS Cost Assessment Tool (MEMS CAT) project.

01/25/2005 — Model Predicts Weaker IC Demand in the Second Half of 2005

(January 25, 2005) Saratoga, Calif. — The contracting IC industry may face another setback later this year, according to Advanced Forecasting's quantitative forecasting model. The model is predicting a downward turning point in the second half for underlying demand for ICs, but the slowdown currently being experienced in the industry reduces the impact, according to the firm's founder, Moshe Handelsman.

01/26/2005 — Lab-on-a-Chip Technology Catches on in MEMS Field

(January 26, 2005) Scottsdale, Ariz. — After two decades of development, and despite increased competition from alternative technologies and more companies developing lab-on-a-chip products, lab-on-a-chip technology finally appears to be making its mark within the MEMS industry, according to In-Stat (

09/11/2006 — SUSS Chooses ULCOAT for C4NP

(September 11, 2006) MUNICH, Germany — At SEMICON Taiwan, SUSS MicroTec, Inc., announced that it has selected a potential commercial source for controlled collapse chip connection – new process (C4NP) glass molds. The glass MEMS division of ULVAC Coating Corporation, based in Saitama, Japan, demonstrated trial production of the reusable glass molds needed to bump wafers using IBM's C4NP process.

09/12/2006 — STS Develops 300-mm DRIE Plasma Source

(September 12, 2006) TAIPEI, Taiwan — Surface Technology Systems (STS) developed a deep reactive ion etch (DRIE) plasma source compatible with 300-mm wafers. The 300-mm platform is founded on the technology in the company's Pegasus DRIE source, released for MEMS customers in 2005.

09/15/2006 — MOEMS Market Geared Toward End-users

(September 15, 2006) DUBLIN, Ireland — Research and Markets has released a report, "MEMS4Display 06: Market Analysis of MEMS-based Microdisplays," which reveals that consumer interests will control the application of MEMS in display technology. Branding, portability, reliability, and picture quality will determine growth in the MEMS display sector.

10/03/2006 — Upcoming Symposium Sweats the Small Stuff

(October 4, 2006) NISKAYUNA, NY — The annual National Trends in Small-scale Systems and Microelectronics Packaging symposium hosts scientists and researchers from around the country. Jointly operated by Binghamton University of NY and General Electrics' Global Research Center, the symposium educates industry members and students on packaging advances made at the molecular level, including nanotechnology and MEMS. Sessions will take place October 23 and 24, 2006, in Niskayuna, NY.

06/24/2005 — SEMI Issues 13 New Technical Standards

(June 24, 2005) San Jose, Calif. — Included in SEMI's new July 1, 2005 standards are 13 new specifications and guidelines for ellipsometer equipment for integrated metrology, sensor/actuator network communications, silicon carbide wafers, and safety in multi-employer work areas. The 13 new technical standards apply to the semiconductor, flat panel display (FPD), and MEMS manufacturing industries.

04/04/2005 — Global Semiconductor Sales Strengthen in February

(April 4, 2005) San Jose, Calif. — Normally a weak month for microchip sales, worldwide sales of $18.1 billion in February were 2% below the revised January sales of $18.4 billion, but were 15.8% higher than February 2004 sales of $15.6 billion, according to the Semiconductor Industry Association (SIA).

04/05/2005 — MEMS Component Vendors Challenged by Price-sensitive Market

(April 5, 2005) Palo Alto, Calif. — Innovation's slow rate in the recovering telecom market is holding back the rapid expansion of the micro-electromechanical systems (MEMS)-based components market. Although MEMS technology is important, time-based value engineering in a potentially high-demand industry compels vendors to adopt different strategies to stay active in a price-sensitive market.

04/26/2005 — EV Group Installs Wafer Bonder at SMI

(April 26, 2005) Schärding, Austria — EV Group (EVG) has installed a low-temperature wafer-bonding system at Silicon Microstructures Inc. (SMI), a silicon pressure and inertial sensors provider for automotive, medical, and industrial applications.

12/06/2006 — ISSYS Selects Wafer Bonder for MEMS

(December 6, 2006) SAN JOSE, CA — Integrated Sensing Systems (ISSYS), Ypsilanti, MI, purchased and installed an AML Bonder from OAI, along with a mask aligner system. ISSYS purchased the stand-alone wafer bonder and complementary mask system to increase production of MEMS devices.

12/13/2006 — SEMI Announces Competition

(December 13, 2006) SAN JOSE, CA — SEMI put out a call for innovations for the fifth annual Technology Innovation Showcase (TIS) to be held in conjunction with SEMICON West 2007, July 17 – 19, 2007, in San Francisco. Nanotechnology, MEMS, test, assembly, packaging, and wafer processing submissions are sought by February 2, 2007.

12/18/2006 — Biomedical MEMS Drive Research Project

(December 18, 2006) CALDICOT, U.K. — With the aim of powering implanted medical devices with "two feet and a heartbeat," a U.K. industry consortium will develop prototypes — expected in 2007 — for medical devices powered by the human body. The self-energizing implantable medical micro-system (SIMM) project, with collaboration from the Department of Trade and Industry, will use microgenerators created as MEMS devices to convert human energy expenditure into electrical power.

07/08/2005 — Rite Track announces first European orders with Tokyo Electron Limited (TEL)

WEST CHESTER, Ohio--(BUSINESS WIRE)--July 7, 2005--Rite Track, a leading provider of track systems for the semiconductor, MEMS and thin film head industries, today announced the receipt of their first European order for remanufactured TEL CLEAN TRACK MARK series.

11/12/2001 — Kionix Completes MEMS Facility

November 12, 2001 -- ITHACA, NY -- MEMS-based product manufacturer Kionix has completed a new self-contained fabrication facility that includes 40,000 square feet of cleanroom and office space.

03/01/2005 — Particles

SCOTTSDALE, Ariz.-According to research conducted by In-Stat (, companies are increasingly developing lab-on-a-chip products despite increased competition and alternative technologies.

05/01/2005 — Particles

ROLLING MEADOWS, Ill.-Gordon Ely of Nelson Laboratories will lead an online class covering biocontamination issues, Wednesday, June 22, at 11 a.m. (CDT) via the IEST's Web site (

06/01/2005 — Cassette-to-cassette system targets new semi processes

NEWPORT, Wales-Designed for 200-mm semiconductor processes, Trikon Technologies ( began shipments in April for its Omega i2L dry-etch system, which combines the company's inline cassette-to-cassette handling subsystem with Windows NT control software and process modules from the company's fxP series cluster tools.

02/01/2006 — Collaboration to manufacture high-sensitivity biosensors for food and clinical samples

A new mass-detection system utilizing microelectromechanical systems (MEMS) and a unique resonating sensor is being developed by a collaboration of academic, industrial and government groups, and initially promises several performance improvements over existing technologies in the detection of foodborne pathogens, infectious diseases and cancer.

04/01/2008 — SEMI publishes eight new technical standards

SEMI has published eight new technical standards applicable to the semiconductor, flat-panel display, and MEMS manufacturing industries.

07/31/2007 — STS ships VPX Pegasus to Semefab for volume production of nano/MEMS products

July 17, 2007 -- /PRNewswire/ -- NEWPORT, U.K. -- Surface Technology Systems plc (STS) today announced that it has sold a VPX Pegasus system to Semefab, a Scottish-based semiconductor company that specializes in the design and manufacture of silicon IC and MEMS devices.

06/05/2007 — MicroFluidic Systems begins Phase III contract to prepare BAND system for manufacturing

May 23, 2007 -- /PRNewswire/ -- FREMONT, CA -- MicroFluidic Systems, a privately held company, announced today that it will begin its Phase III effort of the Bioagent Autonomous Networked Detector (BAND) development contract from the Department of Homeland Security's (DHS) Science and Technology Directorate.

08/16/2007 — RASIRC delivers 25th Steamer

August 8, 2007 -- SAN DIEGO, CA -- RASIRC(TM), the steam purification company, announces it has sold and shipped its 25th Steamer.

07/12/2007 — Harvard University Center orders ICP and PECVD tools from STS for nanoscale research

July 4, 2007 -- /PRNewswire/ -- NEWPORT, U.K. -- Surface Technology Systems plc (STS) today announced that it has sold two plasma processing systems to Harvard University.

03/11/2005 — Apogee Begins Test and Research Initiative for MEMS-Based Medical Device with University of Medicine and Dentistry New Jersey

NORWOOD, Mass.--(BUSINESS WIRE)--March 10, 2005--

06/21/2005 — Innovative Micro Technology selects Eyelit's manufacturing suite to support increased customer demand at world's largest independent MEMS foundry

SAN JOSE, Calif.--(BUSINESS WIRE)--June 21, 2005--Eyelit, Inc., a manufacturing software provider for visibility, control and coordination of manufacturing operations for the electronics, life sciences, and semiconductor industries announced today that Innovative Micro Technology (IMT), a leading MEMS manufacturing partner, purchased Eyelit's enterprise manufacturing suite to manage and control its wafer fab R & D and production operations.

05/09/2005 — Polychromix and Ocean Optics partner to deliver cost-effective NIR spectroscopy solutions to a variety of industries

WILMINGTON, Mass. & DUNEDIN, Fla.--(BUSINESS WIRE)--May 9, 2005--Polychromix, Inc., a leading developer of advanced wavelength management solutions, and Ocean Optics announced a worldwide distribution agreement to market cost-effective spectroscopy solutions for general purpose applications.

04/20/2007 — Tronics strengthens characterization, assembly and test capabilities for custom MEMS

April 12, 2007 -- /BUSINESS WIRE/ -- CROLLES, FRANCE -- Tronics Microsystems SA today announced that is has expanded the characterization, assembly, packaging and testing capabilities at its Crolles headquarters.

02/13/2007 — Micralyne breaks ground on new expansion

February 7, 2007 -- /Micralyne/ -- Edmonton, Alberta -- Micralyne Inc., a world leading independent MEMS microfabrication company, has broken ground on a facility expansion that will increase its manufacturing capacity to accommodate its growing customer base.

01/11/2007 — Tanner Labs now offers scanning electron micrograph (SEM) services in its MEMS R&D and fabrication facility

January 8, 2007 -- /BUSINESS WIRE/ -- PASADENA, CA -- Tanner Labs, a division of Tanner Research, today said it will begin offering scanning electron micrograph (SEM) services in its MEMS R&D and Fabrication Facility in Pasadena.

06/05/2003 — MEMS market building steam

JUNE 5--NEWPORT, Wales--The market for micro-electro-mechanical systems (MEMS) will see approximately 45 percent compound annual growth rate (CAGR) in unit volumes in the next two years according to Ian Smith, chief executive of Surface Technology Systems (STS), a supplier of plasma etch systems.

02/18/2003 — Intel donates fab tools

FEB. 18--RIO RANCHO, N.M.--Intel Corp. has donated $17.5 million worth of old six-inch process tools to the University of New Mexico's (UNM) Manufacturing Training and Technology Center for microelectromechanical systems (MEMS) research and development.

05/09/2003 — Tronic's Microsystem unveils new facility

MAY 9--GRENOBLE, France--Tronic's Microsystems, a maker of micro electro mechanical systems (MEMS), is making the finishing touches on a production facility in Crolles, France, which will include a 4,300-square-foot cleanroom that is expected to be completed by July and in full volume production by year's end.

05/20/2003 — MEMS pavillion, other new programs at SEMICON West 2003

MAY 20--SAN JOSE, Calif.-- A MEMS Pavilion is just one of the new programs that will be featured at SEMICON West 2003, a tradeshow highlighting the global supply chain for semiconductor and related microelectronics manufacturing.

04/21/2006 — Use of silver nanoparticles rapidly expanding in the consumer and medical markets, according to Bourne Research

April 18, 2006 -- /BUSINESS WIRE/ -- SCOTTSDALE, Ariz. -- Silver nanoparticles are emerging as one of the fastest growing product categories in the Nanotechnology industry, according to Bourne Research (

03/01/2002 — MEMS without cleanrooms

BURBANK, CA—Saying it will revolutionize the micro-machining industry, a toolmaker has unveiled a micro electro mechanical systems (MEMS) fabrication process that eliminates the need for cleanrooms.

06/01/2003 — Achieving the finely tuned world of the microminiaturized

Whoever coined the phrase "good things come in small packages" would be amazed to learn about the evolution of MicroElectroMechanical Systems, or MEMS.

09/01/1997 — New technologies drive demand for cleanrooms

While aerospace, medical and pharmaceutical applications drove the cleanroom industry in the 1960s and 1970s, high technology areas such as semiconductors, microelectromechanical, flat-panel displays and newer industries such as biotechnology will carry the cleanroom into the next century.

06/01/2003 — A cast of reasonable predictions

Where were you in your career 10 years ago? Where will you be 10 years from now? Take a look at your situation today: Did you have any idea you'd be where you are?

05/01/2001 — Out with the laminar flow hoods, in with the cleanrooms

These are the times that try the souls of optical component manufacturers. No matter where they turn, they are faced with heated demands for bandwidth; ever-changing network traffic patterns; a slew of fiber deployments; emerging technologies; and, of course, increased costs and competitive pressures.

09/22/2011 — MEMS drive supply chain changes with new applications

Yole Développement shares highlights from its latest "Status of the MEMS Industry" report, noting changes in the MEMS supply chain as companies add foundries or go fab-lite, and multi-chip MEMS packages create new relationships between companies.

09/23/2011 — MEMS product development -- why is it so hard?

Commercializing MEMS can take years and millions of dollars. While the MEMS industry shares some aspects with the larger semiconductor industry, the comparison is not fair in product development. Karen Lightman, MEMS Industry Group and Alissa M. Fitzgerald of A.M. Fitzgerald & Associates explain what makes developing new MEMS devices so hard.

09/23/2011 — China taking automotive MEMS consumption lead

Increasing sensor counts in Chinese cars, upcoming government mandates for sensors, and the booming automotive market in the country will push China's automotive MEMS consumption to a higher growth rate than that of the rest of the world.

09/27/2011 — Energy harvesting thermoelectrics uncrated by Marlow Industries

Marlow Industries launched the EverGen series, thermoelectric-based energy harvesting devices offering low-cost, zero-maintenance power for wireless sensor applications.

09/28/2011 — Graphene races CNT for nanomaterial commercialization

Both graphene and carbon nanotubes (CNT) suit applications from flexible displays to silicon-replacing transistors. In a relatively short time, graphene has emerged as a low-cost, tunable material for all kinds of electronics. Will graphene overtake CNTs as the nanomaterial of future devices?

09/28/2011 — NIST etches MEMS out of diamonds

NIST developed a method to etch diamond crystals, exploiting the cubic nature of diamond crystals. These diamond-etched features could lead to better micro electro mechanical system (MEMS) devices.

09/28/2011 — Hamamatsu Photonics helps Lemoptix commercialize MOEMS

Lemoptix and Hamamatsu Photonics signed a long-term collaboration agreement to develop, industrialize and commercialize micro optical electro mechanical system (MOEMS) laser scanning and microprojection devices.

09/28/2011 — PI (Physik Instrumente) opens Singapore office

Precision positioning systems specialist PI (Physik Instrumente) opened a direct office in Singapore to expand its Asia market presence.

09/29/2011 — MIT names Microsystems Technology Lab leader

MIT named Vladimir Bulović as director of MIT's Microsystems Technology Laboratories (MTL). Bulović has experience in a range of advanced electronics technologies, from photovoltaics to MEMS.

09/30/2011 — Bosch incorporates MEMS for lower-cost personal robots

Bosch Research and Technology Center is developing "Alan," a personal robot designed to be affordable, capable, and safe to serve residential users in chores. Automotive and consumer MEMS sensors are helping Alan navigate and perform tasks for less.

10/03/2011 — MEMS motion sensors' continuing evolution in commercial markets

Beginning in 2005, consumer/mobile electronics makers started integrating MEMS motion sensors into devices. Almost every consumer device or cell phone today has a motion sensor embedded inside. Jay Esfandyari, STMicroelectronics, writes about motion sensing’s evolution and future in this blog, in association with MEMS Industry Group.

10/04/2011 — memsstar expands in Silicon Glen

The maturing MEMS market and increased adoption of secondary equipment for semiconductor manufacturing have led deposition and etch tool supplier memsstar Limited to expand in Livingston, Scotland. memsstar added new positions in logistics, administration, and skilled and semi-skilled engineering to its jobs roster in conjunction with the expansion.

10/04/2011 — Sensor fusion drives mobile electronics' future apps

Sensor fusion -- where inputs from multiple micro electro mechanical systems (MEMS) are "fused" to increase response and accuracy -- is the next step for tablet/smartphone designs, according to a new IHS iSuppli MEMS & Sensors Special Report.

10/05/2011 — Present on MEMS manufacturing, inspection

Submit an abstract now to present at a group of co-located micro/nano manufacturing conferences. MM Live USA 2012 will co-locate with MEMS Live USA and NANO Live USA in Rosemont, IL, March 7-8.

10/05/2011 — BU lab-on-chip wins NIH funding

The National Institutes of Health awarded Boston University engineering and microbiology researchers $4.8 million to develop a chip-sized, low-cost and easily deployed virus detection platform. The product is conceived as an easily transported and simply operated detector for the front lines of an outbreak.

10/06/2011 — Inkjet heads: Mature MEMS market, with room for growth

Despite being a mature market -- and the largest one for MEMS -- inkjet heads are seeing increased sales as consumers print more digital photos, and as industrial and electronics manufacturers look to print product, according to GIA.

10/06/2011 — InvenSense CEO keynotes Semicon Europa MEMS Forum

InvenSense Inc. founder and CEO Steve Nasiri will deliver a keynote "MotionTracking - Driving Hi-Impact Motion-Based Applications in the Digital World" at Semicon Europa's International MEMS Forum.

12/13/2011 — MEMS: The year past and the year ahead

Jean-Christophe Eloy, president & CEO, Yole Développement, shares an analyst's view of the micro electro mechanical system (MEMS) industry, calling 2011 a year of transition and changes.

12/15/2011 — MEMS combo sensors bring price, size advantages to auto and consumer sectors

Combo sensors, comprising MEMS accelerometers, gyroscopes, or electronic compasses, are filling a need in consumer and automotive applications. Combined revenue from these sectors will grow by a factor of 50 over 5 years, shows IHS iSuppli.

12/16/2011 — ST's Taiwan iNEMO contest lauds smart hula hoop

STMicroelectronics has hosted 3 2011 iNEMO Campus Design Contests, for the US, China and Taiwan. This week, Taiwan's first place went to students from the National Yunlin University of Science and Technology for a smart hula hoop design.

12/19/2011 — Microfluidics: $4B in 2016, thanks to life sciences

In its new report, Emerging Markets For Microfluidic Applications, Yole Développement asserts that microfluidics are a "key technology" for the life sciences market, which will prop up microfluidics growth to $4 billion in 2016.

12/21/2011 — NASA grants BMC contract to refine microfabrication process

Boston Micromachines Corporation will use a NASA contract to develop better microfabrication processes for deformable mirrors, which will be used in exoplanet imaging research.

12/26/2011 — MEMS die size grows, test evolves, and other trends

Yole studies the evolution of inertial MEMS and magnetometers and provides reverse costing analysis of the MEMS devices in "Technology Trends for Inertial MEMS." The report considers 23 MEMS devices.

12/28/2011 — Bosch fabs 2B MEMS sensors

After taking 13 years to fab its first 1 billion MEMS sensors, Bosch has added another billion in just 3 years. The company's MEMS sensor production is nearing half a billion a year.

12/30/2011 — Tegal sells deposition patents

Tegal sold over 30 patents from the NLD portfolio, Lots 1-3, covering pulsed-chemical vapor deposition (CVD), plasma-enhanced atomic-layer deposition (PEALD) and NLD.

10/10/2011 — Imec: First poly-SiGe MEMS on Cu-backend CMOS

Imec says it has built an integrated poly-SiGe-based piezoresistive pressure sensor on top of 0.13μm copper backend CMOS, the first such device directly fabricated above its readout circuit and the first poly-SiGe MEMS device of any kind processed on top of Cu-backend CMOS.

10/10/2011 — Imec demos faster HBTs in SiGe for wireless, imaging

Imec says it has developed a fT/fMAX 245GHz/450GHz SiGe:C heterojunction bipolar transistor (HBT) device, useful for future high-volume millimeter-wave circuits in various applications.

10/11/2011 — Custom SOI wafers debut from IQE for MEMS, related manufacturing

Wafer supplier IQE released a customizable range of silicon on insulator (SOI) products that IQE reports afford improved thickness and doping control.

10/11/2011 — VTI Technologies sold to Murata Manufacturing

EQT III will sell VTI Technologies, leading independent designer and manufacturer of high-performance MEMS sensors, to the publicly listed Japanese electronic components company Murata Manufacturing.

10/11/2011 — STMicroelectronics uses TSV in high-volume MEMS devices

STMicroelectronics (NYSE:STM) has implemented through-silicon vias (TSV) in high-volume micro electro mechanical system (MEMS) devices. ST is using TSV in its smart sensors and multi-axis inertial modules.

10/11/2011 — Electronic compasses: Strong revenues from nav, gaming, military apps

The market for electronic compasses is set to grow 73% this year to $419.1 million, according to a new IHS iSuppli MEMS & Sensors special report on magnetic sensors. This high growth is projected to continue, with Japanese manufacturers dominating the space.

10/12/2011 — Deformable-mirror MEMS improve glaucoma research

The University of Houston College of Optometry is using MEMS-based deformable mirrors, Multi-DM, from Boston Micromachines Corporation (BMC) in glaucoma research.

10/12/2011 — CTS contracted for 2 piezo-ceramic programs

CTS Electronic Components, of CTS Corporation (NYSE:CTS), received 2 production orders for piezoceramic products from a major US sonar manufacturer. Revenues should total about $5 million.

10/13/2011 — X-FAB, Senodia ramp MEMS gyroscope production

X-FAB Silicon Foundries Group and Senodia Technologies (Shanghai) Co., Ltd today announced they have concluded development and are ramping production of microelectromechanical system (MEMS) gyroscopes for high-volume consumer applications.

10/14/2011 — COWIN medical/diagnostics sensor initiative update

The COWIN project is a European Commission (EC) initiative under FP6 and FP7 European research projects for smart nano and micro technologies benefiting diagnostic and medical applications. The 3-year project has a January 2012 closing for micro and nano bioconvergence systems’ research projects.

10/14/2011 — mPhase develops MEMS membrane at Argonne Labs

mPhase Technologies was granted access to the technical facilities at the Center for Nanoscale Materials, Argonne National Labs, for work on its MEMS Smart silicon membrane, a key component of the mPhase Smart NanoBattery.

10/14/2011 — Multi-cantilever MEMS technology basis of Panorama Synergy, UWA partnership

Panorama Synergy has formed an exclusive worldwide licensing agreement with the University of Western Australia for optical technologies related to highly sensitive measurements by multiple, simultaneous micro-cantilever MEMS sensors.

10/17/2011 — iPhone 4S first with 5-lens autofocus camera, other component changes

IHS and Chipworks share details from their preliminary teardowns of the Apple iPhone 4S. The device resembles an iPad/iPhone hybrid, and the 5-lens autofocus camera module is the first IHS has encountered in a smartphone.

10/19/2011 — MIT etches MEMS structures with glass stamp

MIT researchers developed a glass-stamp-based technique that helps fabricate lab-on-chip sensors at a lower cost than e-beam lithography and in a more reproducible manner than nanoimprint lithography.

10/20/2011 — Intel, pico projector, surf boards and heart monitors: Meet the MEMS Executive Congress Technology Showcase finalists

At the MEMS Executive Congress 2011 in November, a demo event will showcase MEMS-enabled applications from medical devices to entertainment and computing systems. Here are the Showcase finalists.

10/20/2011 — AKM stays atop silicon magnetic sensor rankings with Apple wins

Asahi Kasei Microsystems (AKM) in 2010 retained its position as the world’s largest supplier of silicon magnetic sensors, according to an IHS iSuppli Magnetic Sensors Special Report. AKM has scored design wins for its 3-axis electronic compasses in the iPad, iPad 2, iPhone 3GS and iPhone 4, among other notable smartphone and tablet products.

10/21/2011 — Imec wafer-level MEMS packaging relies on nanoporous alumina membrane

Imec engineers have simplified the thin-film wafer-level MEMS packaging process with nanopores that prevent leaks into the package and a low-temperature processing approach.

10/21/2011 — Scientific & Biomedical Microsystems awarded Schedule 871 contract

Scientific & Biomedical Microsystems, a developer of scientific and medical sensors and systems based on MEMS and other microfabrication technologies, was awarded a 5-year Schedule 871 contract by the US General Services Administration.

10/24/2011 — NIST, CU microchip combines microfluidics and magnetism without power drain

Researchers from NIST and University of Colorado Boulder developed a low-power microchip combining microfluidics and magnetic switches to trap and transport magnetic beads.

10/25/2011 — CALIENT raises $19M+ to bring photonic MEMS switches to cloud computing

CALIENT Technologies raised $19.4 million in venture financing to expand into data center and cloud computing markets and ramp its new portfolio of 3D MEMS photonic switching systems and modules for OEMs and system integration partners.

10/26/2011 — MEMS display from Pixtronix and Chimei Innolux boasts low power, high resolution

Pixtronix Inc. and Chimei Innolux Corp. (CMI) collaborated on the development of 5"-diagonal micro electro mechanical system (MEMS) display prototypes. The displays use Pixtronix's proprietary MEMS technology and were built by CMI.

10/27/2011 — ScanNano partners with STMicroelectronics on MEMS devices

Helsinki-based ScanNano,a private Finnish R&D firm that specializes in MEMS technology at the nanoscale, has partnered with STMicroelectronics with the goal of combining RF MEMS and CMOS.

11/23/2011 — Energy harvesting event keynotes showcase key applications, new technologies

The co-located Energy Harvesting & Storage and Wireless Sensor Networks & RTLS USA 2011 conference were held in Boston, MA recently. Following are some main points and announcements from the keynoters.

11/24/2011 — Qualcomm MEMS display launched in Korean e-readers

Qualcomm MEMS Technologies and Kyobo Book Centre of Korea launched the first e-reader using mirasol display technology. The touch display features vibrant color in bright sunlight and power management enables weeks of reading.

11/25/2011 — SUSS MicroTec partners for health research

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announces the cooperation with Swansea University´s Centre for NanoHealth (CNH).

11/28/2011 — MEMS sensor technology used to train competitive rowers

Whether it’s keeping athletes in top form, improving navigation in medical robots, helping industrial operators extend factory equipment life, or preventing automotive rollovers, high-performance MEMS inertial sensing technology adds a new dimension that transforms many conventional applications, says blogger Howard Wisniowski, Analog Devices.

11/28/2011 — Innovative Solutions Bulgaria buys large MEMS fab

Innovative Solutions Bulgaria Ltd. acquired Bulgaria’s largest MEMS fab, built north of Sofia in 2004. This new facility provides space to expand production capacity of AFM products.

11/29/2011 — Nanomedical collaboration improves drug delivery system

Drug delivery companies Leonardo Biosystems Inc. and NanoMedical Systems Inc. (NMS) will collaborate, with NMS developing and establishing a commercial process to manufacture nanoporous silicon particles for Leonardo's multi-stage drug delivery system.

11/30/2011 — IDT MEMS oscillator commercializes piezoelectric resonators

Integrated Device Technology, Inc. (IDT, NASDAQ:IDTI) developed and demonstrated commercially available oscillators incorporating piezoelectric micro electro mechanical system (pMEMS) resonators.

11/18/2011 — MEMS win, DRAM lose in ultrabook designs

Sensors are hot items for ultrabook functionalities, boosting MEMS sales. The thin form factor of ultrabooks will deter DRAM device integration and DRAM use as memory upgrades, according to IHS iSuppli Semiconductor Value Chain.

12/01/2011 — Semiconductor magnetic sensors rev up in auto sector

IHS shares the growth map for semiconductor magnetic sensors in automotive applications, where the sensors are used in vehicles, and technology trends. Top suppliers are also listed.

12/01/2011 — ST chooses China's winning iNEMO student designs

STMicroelectronics (NYSE:STM), MEMS maker, named a winner in its 2011 iNEMO Campus Design Contest in China: Sky Worker Team 1 from Tsinghua University. ST operates the open competition in China and Taiwan, and the US.

12/02/2011 — New sensors use ancient metallurgical technique

A multi-institution team has produced a cobalt/iron alloy that could be the basis for a new class of sensors and micromechanical devices controlled by magnetism. The alloy does not use rare-earth elements to achieve its properties.

12/05/2011 — AMAT BSI image sensor CVD tool operates at low processing temps

Applied Materials Inc. (AMAT) launched the Applied Producer Optiva chemical vapor deposition (CVD) system for back-side-illuminated (BSI) image sensor manufacturing. It deposits low-temperature conformal films that boost the low-light performance of the sensor while improving its durability.

12/05/2011 — Ushio releases lithography tools for MEMS, power device, and LSI fab

USHIO Inc. is introducing the UX4-MEMS FFPL 200 with the overlay accuracy of 0.5µm for manufacturing MEMS devices, mounted with the newly developed lens module having a maximum depth of focus of 500µm and the auto mask changer module for manufacturing multiple device types.

12/07/2011 — Cornell, SRC develop RF MEMS technologies

Semiconductor Research Corporation (SRC), university-research consortium for semiconductors and related technologies, is working with Cornell University researchers to develop on-chip silicon technologies for mobile devices. The aim is a micro-mechanical resonator for RF MEMS.

12/08/2011 — AFM images MEMS structures with quantitative measurements

JPK Instruments introduced QI, or quantitative imaging mode, for the recently launched NanoWizard3 AFM analytical system. QI enables full control of tip-sample force at every pixel.

12/08/2011 — imec presents MEMS energy harvester at IEDM

Imec and Holst Centre micromachined a vibration-energy harvester with 489µW output power, using piezoelectric material in a MEMS cantilever. The team presented results at IEEE's International Electron Devices Meeting (IEDM) this week in Washington DC.

12/12/2011 — MEMS at CES: MEMS Industry Group events

MEMS Industry Group (MIG) shares the MEMS-related exhibits and discusses at the 2012 International CES, which covers consumer electronics, January 10-13 in Las Vegas.

12/12/2011 — NASA Curiosity Rover takes Teledyne-DALSA sensors to Mars

Teledyne DALSA manufactured the CCD sensors -- designed by NASA -- on the NASA mission to Mars. The sensors will help the Rover navigate the surface of the planet.

12/13/2011 — Tronics wins MEMS fab contract from DelfMEMS

DelfMEMS SA named Tronics as its micro electro mechanical systems (MEMS) foundry partner. Tronics will manufacture RF MEMS switches for DelfMEMS, with high-capacity runs starting in 2012.

12/14/2011 — MEMS-aligned optical devices ship to Linkstar customer

Linkstar customers have qualified the pilot shipment of silicon optic devices fabricated with Singapore's A*STAR Institute of Microelectronics MEMS technology. The IME silicon MEMS technology enables accurate alignment of optical devices to the optical fiber arrays.

10/27/2011 — China MEMS purchases slow to "healthy rate" in 2011

China's MEMS spending will see a 12.1% CAGR 2010-2015, driven in the near future by expanding smartphone/tablet demand, new consumer experiences, and a rapid drop in MEMS production costs as MEMS designs and production processes improve, says IHS.

10/27/2011 — Paper-based sensor can detect explosive devices

Researchers at the Georgia Institute of Technology have developed a prototype wireless sensor capable of detecting trace amounts of a key ingredient found in many explosives.

10/27/2011 — Pressure sensors squeeze to top of MEMS ranks

MEMS pressure sensors have relatively high average selling prices and a range of applications, making them to leading MEMS device by 2014, according to IHS iSuppli MEMS & Sensors Market Tracker. The largest application? Automotive.

10/28/2011 — ORBT delivers power supply for Navy's electro-optical sensor system

The Behlman Electronics subsidiary of Orbit International received 3 new orders, totaling in excess of $1.5 million, for COTS power supplies to an electro-optical sensing system, a computer system, and an all-weather airborne reconnaissance aircraft.

11/01/2011 — AFM attachment uses rare-earth magnets for conductive and magnetic microscopy

Asylum Research introduced the Variable Field Module2 (VFM2) for the MFP-3D AFM. It allows researchers to apply magnetic fields in conductive AFM experiments, magnetic force microscopy, and other applications.

11/01/2011 — Micrel ramps MEMS manufacturing in San Jose foundry

Micrel Inc. (Nasdaq:MCRL) has begun manufacturing MEMS at its San Jose, CA wafer foundry operations, offering 6" wafer fab and tools to produce advanced MEMS devices.

11/01/2011 — HUN sells MEMS printing fab technology to DDD

Huntsman Corporation (NYSE:HUN) Advanced Materials division sold its stereolithography resin and Digitalis MEMS manufacturing machine businesses to 3D Systems Corporation (NYSE:DDD) for $41 million in cash.

11/02/2011 — Silex MEMS TSV tech licensed to Nanoshift

Silex Microsystems licensed its Silex Sil-Via through-silicon-via (TSV) packaging platform to Nanoshift for use in early development of complex MEMS products.

11/02/2011 — MEMS alternatives for miniature auto-focus cameras

Dr. Giles Humpston, Tessera, presents the free, on-demand webcast Lens Tilt in Small Auto-Focus Cameras. Dr. Humpston covers the dominant auto-focus miniature camera technology today -- VCM -- and an improved technology based on MEMS, which is being commercialized now.

11/02/2011 — Micronit launches MEMS division

Micronit opened its MEMS division, specializing in the design, prototyping and manufacturing of MEMS devices and wafers based on glass and silicon.

11/03/2011 — BSI image sensors avoid distortion with Ziptronix bonding process

Ziptronix ZiBond direct bonding process contribute minimum distortion in backside illuminated (BSI) image sensors because of its low-temperature processing and high bond strength, the company reports.

11/04/2011 — Sensor fusion opens MEMS supply chain to sensor management players

Yole Développement's new report, "Inertial Combo Sensors for Consumer & Automotive" shows that supply chains need to adapt to the "very large market opportunity" for inertial combo sensors.

11/04/2011 — Sand 9 is halfway to $6M funding goal

Sand 9, a MEMS oscillator developer, reports that it has raised $3,095,262 of its 6,190,528 equity funding round, in a recent SEC filing.

11/07/2011 — Silex, AMFitzgerald accelerate MEMS ramp with DfM

MEMS foundry Silex Microsystems and MEMS development firm A.M. Fitzgerald & Associates completed a multi-year collaboration on medical and biotech MEMS development, halving device development time.

11/07/2011 — Micralyne brings MEMS design, prototyping partner into foundry model

MEMS foundry Micralyne Inc. brought Nanoshift LLC, a product development firm specializing in emerging technologies, on board for design, process development, fabrication and packaging partnerships.

11/08/2011 — MEMS packaging and test project aims for space

The Heterogeneous Technology Alliance in Europe is developing new packaging and test methods for MEMS targeting space missions.

11/08/2011 — Low-cost MEMS sensors drive automotive integration at all levels

The automobile industry is a "lucrative" sensor integration market globally, as sensors that enhance comfort, fuel-efficiency, and safety are integrated by vehicle manufacturers. MEMS sensor production costs are set to drop, which will bring automotive sensors into the price/benefit range of every level of automobile, says Global Industry Analysts.

11/09/2011 — Multiple-memory material garners Ontario entrepreneurship award

The Ontario Centres of Excellence gave the Martin Walmsley Fellowship for Technological Entrepreneurship award, totalling $50,000, to Innovative Processing Technologies Inc.

11/09/2011 — Measurement Specialties amends credit facility

Measurement Specialties Inc. (NASDAQ:MEAS), sensor designer and manufacturer, entered into an amendment to its senior secured credit facility dated June 1, 2010, among JPMorgan Chase Bank N.A. and certain other parties.

11/10/2011 — EVG moves Chinese SOI bonder customer to full automation

Shanghai Simgui Technology Co. Ltd., a Chinese wafer manufacturer, placed a follow-on order for an EVG850 automated production bonding system for SOI wafer bonding. Simgui is moving from EVG's semi-automated wafer bonder to advance high-volume SOI production.

11/11/2011 — MicroVision public offering of stock

MicroVision Inc. (Nasdaq:MVIS), maker of ultra-miniature laser display technology based on MEMS, intends sell shares of its common stock in an underwritten public offering, using the funds for general corporate purposes.

11/14/2011 — NSF funds MEMS made with cellulose nanocrystals

Auburn University chemical engineering researchers William R. Ashurst and Virginia A. Davis were awarded a National Science Foundation grant to investigate cellulose nanocrystals in MEMS.

11/14/2011 — 25% jump in MEMS Executive Congress attendance signals emerging MEMS "mainstream"

Micro electro mechanical systems (MEMS) are seen in mainstream devices and creating "exciting new ways" of interacting with the world, say MEMS Executive Congress organizers MEMS Industry Group (MIG).

11/15/2011 — Thin-film ferroelectric sensor challenges microbolometers

Optex Systems entered into an MoU with Bridge Semiconductor Corporation to develop and sell thermal systems for a range of military applications. The thin-film ferroelectric technology aims to displace microbolometers for uncooled thermal sensing applications.

11/16/2011 — US atmospheric plasma tech company joins Precision Mechatronics

Precision Mechatronics Pty Ltd acquired Surfx Technologies, which specializes in high-speed atmospheric plasma technology for MEMS, microfluidics, semiconductors, solar cells, medical devices, and other manufacturing.

11/16/2011 — InvenSense (INVN) prices IPO

MEMS maker InvenSense Inc. (NYSE:INVN) priced its initial public offering of 10 million shares of common stock at a price to the public of $7.50 per share.

11/16/2011 — DARPA looks to Aurrion for E-PHI program to mix electronic, photonic, and MEMS components on one silicon chip

Microelectronics experts at Aurrion Inc. are seeking to develop military microelectronics technology for optoelectronic microsystems, under terms of a $13.9 million DARPA contract.

11/17/2011 — TowerJazz brings European partner to India and Brazil

Specialty foundry TowerJazz signed a non-exclusive memorandum of understanding (MOU) with a European entity to transfer processes and projects to India and Brazil, including semiconductor and MEMS devices.

11/17/2011 — MVIS closes stock offering

MicroVision Inc. (NASDAQ:MVIS) closed its public offering of 17,948,716 shares of its common stock with a draw of approximately $9.8 million after expenses.

11/21/2011 — MEMS costing tool calculates price structure of MEMS designs

System Plus Consulting releases MEMS CoSim+ V3.0, a comprehensive simulation tool for the non-standard manufacturing process of MEMS sensors.

11/21/2011 — Microfabricated piezoelectric creates hyper-active MEMS

University of Wisconsin-Madison engineers and physicists have integrated highly piezoelectric single-crystal material onto silicon to fabricate a low-voltage MEMS for communications, energy harvesting, sensing, actuators and other applications.

11/22/2011 — Gentex acquires InterSense for precise motion tracking tech

Gentex Corporation has acquired substantially all assets of InterSense, which makes MEMS-based hybrid motion tracking systems.

09/15/2011 — Multitest launches MEMS microphone tester with European order

The InPhone microphone test system can be combined with the Multitest InStrip test handler for highly parallel MEMS test and the calibration of MEMS microphones.

09/15/2011 — Alphabet Energy raises $12M for Si thermoelectric dev

Alphabet Energy Inc. closed its Series A funding round with $12 million, led by TPG Biotech, the venture arm of TPG. Alphabet Energy's prototype device converts waste heat to electricity. The silicon device leverages MEMS/semiconductor manufacturing technologies.

09/16/2011 — Sensor research benefits planes to prosthetics at TECHCON 2011

Sensors have the potential to do everything from monitor airplane fuselages for cracks to improve wrist rotation in prostetic arms. Student researchers describe their sensor development work in video blogs from TECHCON 2011.

09/19/2011 — Tronics expands MEMS manufacturing, HQ

MEMS foundry Tronics upgraded its Grenoble headquarters and manufacturing facilities, making a more than half a million euro investment, along with new equipment capital expenditures.

09/19/2011 — 2012 sees automotive sensor market back to healthy growth track

IHS iSuppli's Richard Dixon looks at the market for automotive MEMS sensors over the next few years: which technologies and regions are driving growth, who are the top auto MEMS firms today and the up-and-comers, and how China is emerging as a market driver and supplier base.

09/19/2011 — Sanmina-SCI tapped for Kaiam MEMS-based optical component fab

Sanmina-SCI Corporation (Nasdaq:SANM) will produce a family of optical components based on Kaiam's MEMS hybrid integration technology.

09/20/2011 — MEMS "transition period" toward market maturity evident in mobile boom

MEMS vendors comprise MNC and MEMS-centric and small-portfolio companies. The market will grow as tablet/smartphone adoption increases, and MEMS makers co-opt the economies of scale that other semiconductor segments have used to reach maturity, according to ABI Research.

09/21/2011 — Microfluidics foundry opens under A*STAR in Singapore

A*STAR's Singapore Institute of Manufacturing Technology opened the SIMTech Microfluidics Foundry, offering microfluidics development, customization, and manufacturing. A*STAR's goal is to combine biomedical and engineering expertise to foster a microfluidics industry in Singapore.

09/21/2011 — MEMS oscillator maker taps Multitest for test handling

A MEMS oscillator maker chose the MT9928 xm tri-temp test handler from Multitest for a novel oscillator application. The MEMS device required extremely accurate temperature calibration.

07/21/2011 — Halma acquires photonics packaging company Avo Photonics

Halma plc, safety, health, and sensor technology group, acquired Avo Photonics Inc., opto-electronic design, packaging, and manufacturing specialist.

07/22/2011 — Qualtre raises $10m on gyroscope success

Qualtré Inc. recently demonstrated its first tri-axial solid-state silicon BAW MEMS gyroscope, prompting investors to supply an additional $10 million in capital to the company for a commercial ramp.

07/25/2011 — MEMS Executive Congress keynote line-up

The MEMS Executive Congress 2011, November 2-3 in Monterey, CA, keynote speakers include a strategist, financial expert, and technologist.

07/25/2011 — STM launches MEMS design competitions in Asia

STMicroelectronics (NYSE: STM) opened 2 2011 iNEMO Campus Design Contests, in China and Taiwan. The contest encourages students and young engineers to design innovative products based on STM's iNEMO MEMS platform.

07/27/2011 — mPhase hints at new auto and marine energy product

mPhase Technologies Inc. (OTC.BB: XDSL) completed its 2nd working prototype of a new automotive and marine product, reducing size by 20% and increasing the product's functionality.

07/28/2011 — CNSE adds mask aligner for MEMS fab

ClassOne Equipment sold its 150th mask aligner, which will be installed in the Smart System Technology & Commercialization Center of the College of Nanoscale Science and Engineering (CNSE) at UAlbany.

08/01/2011 — MEMS maker Synkera recognized in CO

The state of Colorado named Synkera (HQ: Longmont, CO) among 50 Colorado Companies to Watch, honoring the second-stage, growing company.

08/01/2011 — Sensirion expands CMOS sensor production

Sensor manufacturer Sensirion inaugurated a new building in mid-July 2011 in Stäfa, Switzerland, and will move all of its production there.

08/02/2011 — Multitest MEMS tester performs earth magnetic test

Multitest added a new application to its MEMS test and calibration portfolio, MT MEMS tester, testing 3D earth magnetic field sensors for mobile applications and GPS-free state-of-the-art navigation applications.

08/04/2011 — COMS 2011 to be held August 28-31

MANCEF announce that the Commercialization of Micro-and Nano-Systems (COMS) 2011 conference will be held in Greensboro, North Carolina, August 28th – 31st, 2011, at the Grandover Resort.

08/04/2011 — Epson uncrates sensor platforms based on QMEMS and semi tech

Epson Electronics America (EEA) launched two new series of sensing platforms, based on Epson's QMEMS and semiconductor technologies. The new Epson evaluation tools will help developers create and evaluate consumer applications.

08/10/2011 — Report: Mexico MEMS profs hurt in bomb attack

Two researchers at Mexico's Monterrey Technological Institute have reportedly been the subjects of a targeted letter-bomb attack by an "anti-technology anarchist group" for their work in nanotechnology including MEMS.

08/10/2011 — MEMS tracker report shows sensors outpacing semiconductor growth

Sensors are experiencing faster growth than the overall semiconductor chip industry, according to the Q3 Sensors and MEMS Market Tracker released by Sensors hit almost $7 billion in 2010, with 6.5 million units shipped.

03/16/2011 — EVG wins SOI order from Shenyang Silicon Technology

EV Group (EVG) received an order from new customer Shenyang Silicon Technology Co. Ltd. (SST). SST will use an EVG850LT automated production bonding system for silicon-on-insulator (SOI) wafers.

03/17/2011 — Symmetricom MEMS based chip scale atomic clock integrated onto Jackson Labs Technologies GPSDO

Symmetricom SA.45s chip-scale atomic clock (CSAC).Symmetricom Inc. (NASDAQ:SYMM) and Jackson Labs Technologies Inc. signed a joint marketing agreement to market and sell Jackson Lab's CSAC GPSDO timing and frequency board with Symmetricom's atomic oscillator, the SA.45s chip-scale atomic clock (CSAC).

03/18/2011 — CMP selects TowerJazz CMOS image sensor power management processes

TowerJazz advanced 0.18µm power management and CMOS image sensor (CIS) technology and sophisticated process design kits are now available for prototyping to companies, universities and research labs through the services provided by CMP.

03/21/2011 — Dolomite launches Small Droplet Chip

Small Droplet Chip from DolomiteFor producing and analyzing microemulsions, the Small Droplet Chips allow the user to create micro-droplets from 5 to 30μm in diameter. Microemulsions offer increased stability, a higher interfacial area, and the capacity to solubilize both aqueous and oil-soluble compounds.

03/22/2011 — Honeywell to develop precision micro sensor gyro for smart munitions and hand held devices

miniature gyroscopeHoneywell Aerospace Microelectronics & Precision Sensors is developing miniature rate-integrating gyroscope technology for precision-guided munitions, ships, vehicles, aircraft, and individual combatants under a $5.9 million DARPA contract. The micro-sensor vibrating-structure gyroscope will measure rotation under harsh conditions immune to temperature, vibration, or other influences.

03/23/2011 — VTI ramps 3 axis gyro sensor production

CMR3000 from VTITo capture part of the fast-growing consumer electronics MEMS market, VTI Technologies will ramp volume production of its CMR3000.

03/25/2011 — Digital compass manufacturing: With nearly all makers in Japan, will the earthquake affect supply?

Global digital compass shipment forecast (Millions of units) SOURCE: IHS iSuppli March 2011.IHS iSuppli research indicates that 97% of all digital compass manufacturing worldwide in 2010 was conducted in Japan. Japan's March 11 earthquake has decimated transportation and utility power in the country. The top digital compass manufacturers in Japan say their operations are "normal."

03/25/2011 — 5B MEMS to ship in 2016 thanks to consumer market

MEMS can take the form of (or be incorporated in) accelerometers, gyroscopes, magnetometers, altimeters, screens, projectors, and microphones. Often, consumer devices contain more than 1 MEMS component, and that trend is growing.

04/05/2011 — Akustica MEMS saves space by turning to semiconductor not MEMS fab

Semico chief of technology and blogger Tony Massimini looks at the AKU230 MEMS microphone from Akustica, and finds the tiny device trimmed down by use of semiconductor manufacturing processes rather than traditional MEMS fab.

04/06/2011 — Texas Instruments regains MEMS leadership in 2010, thanks to DLP chips

Five years after losing its leadership position in the global market for microelectromechanical systems (MEMS), Texas Instruments Inc. reclaimed the top spot in 2010 because of resurgent demand for the company's Digital Light Processing (DLP) chips, new IHS iSuppli research indicates.

04/06/2011 — BioScale scales up with new MEMS sensor fab cleanrooms, HQ

BioScale's new headquarters in Lexington MA include cleanroom space to manufacture MEMSBioScale relocated its corporate headquarters to scale up its commercial, scientific, R&D, and manufacturing functions in a newly renovated 30,000 square foot facility including Biological Level 2 laboratories and a clean room for its MEMS sensor manufacturing and assembly.

04/07/2011 — Agilent NanoSuite software improves nano indentation, tensile testing

NanoSuite 6.0 promises speed, flexibility, ease of use and new application methods for nanomechanical properties measurements involving polymers, composites, thin film materials, MEMS, surface topology, stiffness mapping, and scratch testing.

04/07/2011 — STMicro installs Heidelberg litho system for lab on chip development

ST Microelectronics has installed a µPG101 from Heidelberg Instruments in the "More Than Moore" Research Labs in Agrate Brianza to develop prototypes of new microfluidics devices for medical diagnostic, and lab-on-chip applications.

04/11/2011 — Miniaturized IMU from Movea measures 9 degrees of freedom

MotionPod from MoveaMovea created a wireless, miniaturized, inertial measurement unit (IMU) that uses MEMS sensors (partnering an accelerometer, gyroscope and magnetometer) to accurately measure 9 degree-of-freedom (DOF) motion for healthcare through gaming apps.

04/12/2011 — Top 4 MEMS suppliers rake in 1/3 total MEMS revenues

The MEMS industry grew 25% in 2010, and the 4 largest companies grew even faster, increasing their domination of Yole Développement's annual top 30 MEMS company ranking. These giants now account for some $2.9 billion of the sector's $8.6 billion in total sales.

04/13/2011 — Optical systems capture microfluidic experiment data

Optical systems that capture high-quality still and moving images of microfluidic experiments from DolomiteDolomite launched a range of optical systems that capture high-quality still and moving images of microfluidic experiments. Applications include testing various microfluidic chips for droplet generation and particle imaging, etc.

02/11/2011 — STMicro bTendo partner on pico projectors for mobile

STMicroelectronics (NYSE: STM) and bTendo Ltd. will jointly develop the world's smallest pico projector for smart phones and other portable consumer-electronics devices, based on bTendo's Scanning Laser Projection engine technology and ST's MEMS, video processing, and semiconductor process technology expertise.

02/14/2011 — Fluidigm prices FLDM IPO

Fluidigm Corporation priced its initial public offering (IPO) under the symbol FLDM. Fluidigm develops, manufactures, and markets microfluidic systems comprising instruments and consumables, including chips and reagents.

02/15/2011 — Draper Lab USF making microfluidic systems to test malaria drugs

A microfluidic device used to create human mimetic tissue models for testing potential malaria drugs.The University of South Florida received $5.45 million in grants from the Bill & Melinda Gates Foundation to create advanced devices that mimic the human liver to better study the life cycle of the malaria parasite, and to develop effective therapies for the disease.

02/17/2011 — Panasonic Seiko Epson lead MEMS resurgence in Japan

Panasonic Corp. and Seiko Epson Corp. are leading Japanese companies' resurgence in the MEMS market. Japanese firms were global leaders back in the 1990s, making such parts as sensors for car airbags. But the 2000s saw major U.S. and European semiconductor companies enter the field, grabbing market share by making massive capital investments and sharply boosting production efficiency.

02/18/2011 — Smart catheter funded for commercialization at NCSU

A North Carolina State University endowment fund established to bridge pure research and product commercialization for entrepreneurs has awarded a $10k grant to a biomedical engineering project that will use MEMS to make catheters flexible, then stiff, for stent delivery.

02/21/2011 — MEMSCAP thermally actuated variable optical attenuator demonstrates 200 million cycle+ reliability in die level tests

MEMSCAP (MEMS) completed die-level reliability testing beyond 200 millions cycles on its Thermally Actuated Variable Optical Attenuators. MEMS-based Variable Optical Attenuators are gaining momentum and market share over competing traditional technologies, according to MEMSCAP.

02/23/2011 — Nitto Denko plans prototyping center in Singapore for biosensors

Current R&D successes with Singapore's A*STAR IMRE prompted Nitto Denko to invest more in Singapore by building a prototyping center there, which will be incubated at local research institute. The prototyping center will focus on an optical waveguide for biosensing applications.

02/24/2011 — Energy harvesting lets NEC sensor measure power consumption without external power supply

NEC announced the development of a compact sensor that measures the power consumption of electronic devices and delivers this information to energy management systems, without needing an external power supply or battery.

02/25/2011 — CNSE wins 6M in sensor projects for military power gen

The Smart System Technology & Commercialization Center at U Albany's CNSE was selected by SPAWAR to build innovative sensor systems for U.S. military intelligence gathering and by EPRI to develop a groundbreaking wireless sensor network to monitor the efficiency of power generation. The two initiatives are valued at $6 million.

02/22/2011 — Auto consumer resurgence bodes well for global MEMS consumption

An uptick in passenger car production, improving consumer demand, and dwindling stockpiles in the supply chain have revived MEMS shipments. Investments in new product development, innovation, and expansion of production capacity bode well for the future of the market.

02/01/2011 — Aerotech nanopositioners provide lab accuracy at fab

ANT95-R and ANT130-R rotary stages Aerotech ANT95-R and ANT130-R direct-drive rotary stages offer in-position stability of 0.005 arc sec and incremental motion of 0.01 arc sec using the company's direct-drive technology. They suit disk-drive and MEMS manufacture and test, fiber-optic device alignment, as well as laboratory R&D applications.

02/07/2011 — Imec taps into silicon photonics advanced imaging 3D visualization

MEMS, imecResearchers at imec -- Danae Delbeke and Francesco Pessolano -- discuss announcements made in conjunction with Photonics West regarding the research consortium's NVISION program (for advanced imaging solutions) and silicon. Imec's silicon photonics platform allows for the miniaturization of complex photonic functions on a single chip.

02/23/2011 — USHIO brings NIL ashing system to US market

USHIO develops and begins marketing nano-imprint VUV ashing system "CHIPs" (Photo: Business Wire)USHIO America will start marketing the nano-imprint vacuum ultra violet (VUV) ashing system "CHIPs (Compact HiPower System)" in the US. Incorporated into nano-imprint lithography (NIL) equipment, the CHIPs allows non-contact and damage-free cleaning, surface improvement, and ashing of templates and workpieces.

02/02/2011 — Helios Crew SemiLEDs intros LED packaged with MEMS

MEMS packaged LED from HCCHelios Crew Corporation (HCC) Taiwan released its LED product S35, a packaged component LED that integrates MEMS with semiconductor processing to produce a unique silicon packaging technology.

02/14/2011 — Dolomite chip holder allows microfluidic temperature control

Dolomite's Hotplate Adaptor - Chip Holder HDolomite, microfluidic designer and manufacturer, expanded its range of temperature control systems with the Hotplate Adaptor - Chip Holder H, which allows control over internal temperatures of microfluidic chips without any disruptions to the fluid flow.

02/01/2011 — IC MEMS design partnership imec Coventor

Coventor and imec formed a strategic partnership to improve and expand the use of advanced design and manufacturing techniques for the development of CMOS-integrated MEMS. The partnership includes strategic alignment on R&D roadmaps and collaboration on advanced research topics.

02/03/2011 — MEMS foundry combo X FAB grabs 25 share in MFI

X-FAB Silicon Foundries and MEMS Foundry Itzehoe will combine their existing MEMS foundry capabilities and resources. MFI's contract MEMS manufacturing experience will broaden X-FAB's foundry capacity in 8" wafers, while MFI will access X-FAB's analog/mixed-signal Si foundry technology.

02/07/2011 — In Mexico MEMS course brings students in partnership with Sandia National Labs

A Mexican student works on MEMS design in a cleanroomSandia National Labs will leverage the traditional electronics manufacturing expertise in Mexico into MEMS design lessons for University of Guadalajara students. It says MEMS R&D can stabilize Mexico's economy while adding to US/Mexico border defense technologies.

02/07/2011 — SPTS acquires Primaxx etch tech for MEMS manufacturing

Primaxx provides residue-free MEMS dry etch release products, and is based in Allentown, PA. The transfer strengthens SPTS' etch technology portfolio that includes deep silicon etch, dielectric etch, inductively coupled plasma (ICP) etch, and now hydrogen fluoride (HF) vapor oxide etch.

02/22/2011 — MEMS venture chip tech companies among semi finalists in Zell Lurie Institute Annual Michigan Business Challenge

Update, February 22: MEMStim received $27,000 for best business and presentation, and outstanding team. The Samuel Zell & Robert H. Lurie Institute for Entrepreneurial Studies at the University of Michigan Ross School of Business announced that eight teams have advanced to the semi-finals of this year's Michigan Business Challenge, including MEMStim, an ODM that sells MEMS electrode leads for medical devices.

02/09/2011 — Sand 9 plans commercial MEMS oscillator production adds director

Sand 9, Inc. is planning volume launch of its MEMS oscillator technology for wireless applications. The company appointed Skyworks EVP Greg Waters to their Board of Directors, using his experience in wireless communications to help Sand 9 manage the transition from development to volume production.

02/10/2011 — DRIE tech transferred from Tegal to SPTS

SPTS completed the acquisition of deep reactive ion etch (DRIE) technology and certain related assets from Tegal Corporation. In addition, the deal includes the transfer to SPTS of the capital stock and operations of Tegal France SAS.

02/10/2011 — STMicro TriQuint make marks on MEMS market says iSuppli

Capitalizing on their design wins in Apple Inc.'s iPhone 4 and iPad, semiconductor suppliers STMicroelectronics and TriQuint in 2010 achieved industry-leading growth in the global market for MEMS in consumer electronics and mobile devices, new IHS iSuppli research indicates.

02/28/2011 — MEMS 3D researchers license wet deposition from Alchimer

Alchimer announced that the Centre de Collaboration MiQro Innovation/MiQro Innovation Collaborative Centre (C2MI) has licensed its suite of products and its Electrografting (eG) technology to support the center’s 3D MEMS programs.

03/07/2011 — NASA grant for MEMS deformable mirror fab awarded to Boston Micromachines

Boston Micromachines Corporation (BMC) won a $100k contract from NASA to support space-based imaging research. The contract will help develop a micro electromechanical deformable mirror (MEMS-DM) with critical enhancements to reliability and fault-tolerance.

03/08/2011 — CMOS image sensors overrun CCD for digital cameras

Figure. Digital still camera (DSC) image sensor unit shipments by technology (millions of units). SOURCE: IHS iSuppliCMOS image sensors for digital still cameras are set for rapid growth over the next 3 years, allowing shipments to exceed those of CCDs for the first time in 2013, according to IHS iSuppli. CMOS image sensors are winning over Sony, Canon, and other OEMs with better power consumption, lower fab costs, and circuit integration, among other benefits.

03/08/2011 — Hermetic wafer-level packaging lowers cost with IMT Au-Au bond

IMT introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding for wafer-level packaging (WLP). In development for nearly a year, this bond is being actively used in production.

03/02/2011 — MIG seminar targets MEMS testing

A two-day seminar later this month in San Jose will offer insights into testing of MEMS inertial sensors and a "strategic plan" to decrease cost and increase efficiency of MEMS device testing.

03/03/2011 — MSGI blends nanotechnology, chemical-sensing IP in iPhone lab-on-chip for NASA

MSGI lab-on-chip for iPhone, developed with NASAMSGI Technology Solutions provided a science and technology update to its investors on its lab-on-chip chemical sensing technology being developed for NASA. Applications range from blood-less diabetes tests to bio-terrorism detection.

03/03/2011 — Nanotechnology researchers in Greece install Vistec lithography system

Vistec Lithography received a major order from Greece's National Center for Scientific Research (NCSR Demokritos) Institute of Microelectronics (IMEL). This will be the first 100kV lithography system in Greece.

03/01/2011 — Novel bulk metallic glasses mold like plastics, perform like metals

Yale materials scientist Jan SchroersYale's Jan Schroers and his team are using a new processing technique to fabricate miniature resonators for microelectromechanical systems (MEMS) as well as gyroscopes and other resonator applications from bulk metallic glasses (BMGs) twice as strong as steel.

04/01/2011 — Microchannel heat exchanger cuts bonding costs 90

Surface-mount adhesives can create microchannels on a wide variety of metals. SOURCE: Oregon State UniversityEngineers at Oregon State University have invented a new way to use surface-mount adhesives (SMAs) in the production of low-temperature, microchannel heat exchangers. University officials are now seeking a commercial partner in private industry to continue development and marketing of the technology.

04/04/2011 — Micro sensor enabled smart materials

The shape of more-complex surfaces can be acquired using multiple sensor ribbons in a comb structure.CEA-Leti has been developing microsensors capable of precisely measuring their orientation in relation to the Earth's gravitational and magnetic fields. Dominique Vicard and Nathalie Sprynski, CEA-Leti, say they are now beginning to incorporate arrays of these tiny micro sensors into new kinds of instrumented -- or proprioceptive -- materials.

04/04/2011 — MEMS ferroelectric thin films report

Ferroelectric materials were considered exotic semiconductor materials in the past. Thanks to better knowledge and industrialization of these materials, they are increasingly used in many new applications, especially in the MEMS field, says Yole Développement.

03/30/2011 — Discera ships application programmable MEMS oscillators

Discera Inc. launched high-performance DSC21XX I2C and DSC22XX SPI application programmable MEMS oscillators. The products fit into flexible FPGA- and CPLD-based designs.

03/30/2011 — Akustica digital microphone uses smallest fully integrated MEMS

The AKU230 is the first Akustica CMOS MEMS microphone manufactured by Bosch. The company claims that the monolithic microphone die is world's smallest at 0.70mm2. The package is industry-standard.

03/31/2011 — MEMS growth drives Coventor expansion

Coventor Inc., software supplier for developing micro-electromechanical systems (MEMS), expanded its reach in two key geographies with the opening of a new office in Italy, and a new distribution agreement in China.

03/08/2011 — MIT adds TESCAN SEM for nano MEMS microfluidics studies

TESCAN's VEGA 3 SEMTESCAN, scanning electron microscope and focused ion beam workstation maker, delivered a VEGA 3 scanning electron microscope (SEM) to the Massachusetts Institute of Technology (MIT) Micro and Nano Engineering lab.

03/07/2011 — Coventor updates SEMulator3D software for semiconductor and MEMS processes

Coventor Inc. announced availability of SEMulator3D 2011, the latest version of its virtual fabrication software for semiconductor and MEMS process development organizations. It includes the debut of SEMulator3D Reader.

03/14/2011 — Plasma Therm acquires majority share of Advanced Vacuum

Plasma-Therm LLC, plasma etch and deposition equipment supplier, secured majority shareholder status of Advanced Vacuum, a vacuum and thin film equipment provider headquartered in Sweden.

03/16/2011 — MEMS Japan earthquake updates

In light of the March 11 earthquake and tsunami that devastated northwestern Japan, and led to power outages and transport disurptions across the nation, we provide here a list of MEMS companies that have issued updates on their facilities and staff.

03/16/2011 — European MEMS top dogs led the pack in 2010, says IHS iSuppli

Top MEMS manufacturers in Europe. SOURCE: IHS iSuppliThe top European MEMS manufacturers -- Bosch, STMicroelectronics and VTI -- beat out the overall MEMS segment in 2010 growth. Growth came from automotive and consumer markets, with new product launches laying the groundwork for a strong 2011 as well.

04/13/2011 — Panasonic plans medical MEMS launch

To enter the MEMS for medical apps market, Panasonic could scale up MEMS operations in Fukui Prefecture, Japan, reports Nikkei. Panasonic, which already produces MEMS for consumer electronics, could enter the medical MEMS sector as early as 2011.

04/15/2011 — Russian university adopts MEMS/MOEMS CAE software from Open Engineering

OPEN ENGINEERING, the Multiphysics branch of the SAMTECH Group, signed a cooperation agreement with the Russian University of Information Technologies, Mechanics and Optics (ITMO).

04/18/2011 — Display tech commercialization, student collaboration goals of MicroVision global R&D center in Singapore

MicroVision (Nasdaq: MVIS), ultra-miniature display technology provider, opened a research and development center at Nanyang Technological University (NTU), Singapore. MicroVision plans to staff the new R&D facility with up to 25 engineers by 2012.

04/19/2011 — New MEMS flex muscle in 2011

New MEMS, a 4-yr old segment of the MEMS market specifically for consumer electronics (CE) and mobile handsets, will grow by 157.4% in 2011, powering the expansion of the overall MEMS industry, according to new IHS iSuppli research.

04/20/2011 — Electronic + photonic + MEMS chip: DAPRA requests proposals

Microelectronics scientists at DARPA are reaching out to industry to find new ways of blending electronic, photonic, and MEMS components on one silicon IC using today's semiconductor manufacturing technologies.

04/21/2011 — MEMS microphone providers see big market opps, big competition

Yole released a new report, MEMS Microphone, presenting MEMS microphones technologies, the related supply chain and its key players. The mobile phone market is still the largest consumer of MEMS microphones, and Knowles is still the dominant market player, though other companies are finding space in the sector.

04/25/2011 — Self compensating oscillator tech beats quartz and SiMEMS, says SWS

Si-Ware Systems (SWS) announced a novel Self Compensating Oscillator (SCO) technology, which produces an all-silicon oscillator that can achieve an overall frequency stability better than 100ppm over a temperature range of -20 to +70ºC.

08/11/2011 — CES adds MEMS program for 2012

The CES, annual consumer electronics show, will feature for the first time a MEMS TechZone and MEMS conference program at CES 2012.

08/16/2011 — Stanford adds 3 dry etch systems from Plasma-Therm

Stanford University will install 3 Plasma-Therm dry etch systems in its research facility for nanotechnology and photonics, joining 2 Plasma-Therm deposition systems the university requisitioned during a facility upgrade in February 2010.

08/16/2011 — MEMS watch motor brings 3-phase motor onto Si

At the Swiss EPFL Integrated Actuactors Laboratory, researchers have constructed an electromagnetic three-phase motor on silicon that could make watches 3x more efficient and add other applications to time keeping.

08/17/2011 — FLIR public offering could fund acquisitions, subsidiary expansions

FLIR Systems priced a public offering of $250 million aggregate principal amount, planning to fund general corporate needs, such as working capital, investments in or extensions of credit to FLIR subsidiaries, capital expenditures, stock repurchases, and acquisitions.

08/18/2011 — STM MEMS exec keynotes International Microtech/MEMS Conference in Korea

Benedetto Vigna, group VP and GM of ST Microelectronics MEMS, Sensors, and High-Performance Analog Division, will keynote the International Microtech/MEMS Conference with "The Future of MEMS and Challenges to Success."

08/18/2011 — Potomac Photonics adds QC, inspection to micro-machine services

Potomac Photonics added advanced quality control (QC) and inspection capabilities to its service offerings for micro-electronics, MEMS, micro-fluidics and other projects.

08/19/2011 — Sporian sensors in development for Gen IV nuclear use

Sporian Microsystems received a DOE contract to evaluate harsh-environment materials, MEMS, and packaging technologies for Generation IV nuclear reactor use.

08/22/2011 — Imec, Holst MEMS readout chip eschews customization

Imec and Holst Centre showcase research on an ASIC architecture that provides readout functions for accelerometers and strain sensors without draining device power. The chip could be used for various sensors in a continuous monitoring application, as for seismic activity.

08/23/2011 — Automotive MEMS sensors recalculating for growth after 2010-2011 disruptions

The automotive MEMS sensor market will rise starting in 2012, according to IHS. Revenues will increase 16% to $2.31 billion, thanks to vehicle production ramp-up as Japan recovers from the earthquake/tsunami and various countries implement safety regulations.

08/25/2011 — MEMS bring magnetic sensors growth in mobile applications

Magnetic sensors will exceed $3.2 billion in sales by 2017 driven largely by "E-compassing" applications, according to Global Industry Analysts. Unique end-use applications, along with technology innovations, interoperability with devices and competitive pricing, will fuel "robust" magnetic sensors growth.

06/28/2011 — EVG installs MEMS bonder at Quebec research center

EVG will install a 200mm Gemini fully automated wafer-bonding system with cleaning module at the MiQro Innovation Collaborative Centre in Quebec.

06/28/2011 — See the MEMS tech showcase at SEMICON West

The MEMS DemoZone Display, presented by the MEMS Industry Group, will display MEMS products and suppliers at SEMICON West, showcasing the diversity, enabling capabilities, and nuances of MEMS technology.

06/30/2011 — OmniVision brings wafer-level lens fab in-house, for $45 million

OmniVision Technologies Inc. (NASDAQ:OVTI) will acquire wafer-level lens production and assembly processes out of its TSMC JV, VisEra.

07/01/2011 — Silicon Sensor International expands auto sensor fab deal

Silicon Sensor International's subsidiary Microelectronic Packaging Dresden will extend its sensor fab contract for an auto maker, doubling production of a steering angle detection sensor. The contract could be worth EUR50M.

07/05/2011 — MEMS foundry rankings show STM's dominance, pure-play foundry growth

Frontrunner STMicroelectronics is winning by a distance in the MEMS foundry race: outpacing mixed-model and pure-play MEMS makers alike by at least 5x. While mixed-model players earned more than pure-play foundries in 2010, the pure foundries are where growth is happening, says IHS iSuppli.

07/07/2011 — Quadcopters take top prize in STM MEMS iNEMO contest

A quadcopter designed by "Team McGill," students at McGill University, won the iNEMO Design Contest, hosted by STMicroelectronics and Digi-Key. Team McGill used the iNEMO evaluation board and 9 embedded degrees of freedom for their winning quad-copter design.

07/07/2011 — poLight raises $18.5 million for MEMS-based auto-focus lenses

poLight AS, reflowable autofocus actuated cameraphone lenses maker, closed its Series B financing round with NOK100 million (USD 18.5 million), led by Norway's Investinor.

07/08/2011 — tMt joins MEMS research at IME, growing foundry presence

tMt will help refine areas in IME's three-party collaboration model for MEMS prototyping and mass production for medical, consumer, and other applications.

07/12/2011 — A.M. Fitzgerald and Micralyne partner to bring MEMS concepts to HVM

Pure-play MEMS foundry Micralyne Inc. and A.M. Fitzgerald & Associates (AMFitzgerald), a MEMS product development firm, partnered to fast-track product commercialization.

07/13/2011 — CEA-Leti improves MEMS reliability with new packaging, ruthenium

CEA-Leti has revamped its RF MEMS manufacturing for higher reliability and performance, using thin-film packaging and replacing gold with ruthenium for the contacts. The design also prevents contact between the electrodes when the bridge is down.

07/14/2011 — ALD tool from Lesker suits MEMS, nano fab

Kurt J. Lesker's new Atomic Layer Deposition system, the ALD 150LX, can operate as a stand-alone or fully integrated cluster tool system for nano, microelectronics, optics, MEMS, semiconductor, photovoltaics, photonics, catalysis & fuel cells, and OLED manufacturing.

07/14/2011 — Fraunhofer MEMS enable Vuzix video glasses goal

Fraunhofer and Vuzix have partnered on R&D, with the goal being a MEMS device that integrates the display and optics into a monolithic display engine, aiming for "sunglass-styled" video glasses.

07/15/2011 — MEMS testing units bolster Rasco product line with high parallelism

Rasco GmbH, a Cohu Inc. (NASDAQ: COHU) subsidiary, added the Pressure Test Unit (PTU) and the Acoustic Test Unit (ATU) to its line of testers for MEMS ICs.

07/18/2011 — MXIM buys SensorDynamics, builds MEMS portfolio

Maxim Integrated Products (MXIM) acquired SensorDynamics, an Austrian semiconductor company that develops proprietary sensor and microelectromechanical (MEMS) devices, for $130 million plus about $34 million of debt.

07/19/2011 — Round microchannels prove better than rectangular channels

MuSES Laboratory researchers at Michigan Tech have characterized the output flow power of round and square/rectangular microfluidic channels, revealing distinct improvements with round geometries.

07/19/2011 — MEMS Workshop aims to fill ecosystem gaps

iNEMI and the MEMS Industry Group will host MEMS Needs and Opportunities, a workshop running September 15-16, with the goal of identifying gaps in technologies, processes, and test methodologies and forming collaborations to tackle them.

07/21/2011 — MEMS manufacturing on retuned CMOS lines

Tony McKie, GM of MEMSSTAR, tackles the question of how to make MEMS truly manufacturable. "Nobody builds a MEMS manufacturing line anymore," says McKie.

06/06/2011 — TI's single-chip IR MEMS thermometer targets mobile devices with small form factor and low power consumption

Texas Instrument's (TI) TMP006 MEMSTI developed a single-chip passive IR MEMS temperature sensor for contactless temperature measurement in portable consumer electronics. The TMP006 integrates an on-chip MEMS thermopile sensor, signal conditioning, a 16-bit ADC, local temperature sensor and voltage references on a single 1.6mm2 chip.

06/21/2011 — Sandia MEMS design student contest winners

A dragonfly with beating wings and an ultra-sensitive microvalve were top winners at Sandia National Lab's student design contest for MEMS.

06/22/2011 — Dolomite debuts microfluidics connector line

Dolomite, microfluidic device maker, designed the Multiflux range of microfluidic connectors and interfaces.

06/23/2011 — Freescale adds MEMS pressure sensor to Xtrinsic line

Freescale Semiconductor (NYSE:FSL) debuted a high-precision MEMS pressure sensor, Xtrinsic MPL3115A2, for altitude detection.

06/23/2011 — Melexis contactless MEMS IR temp sensors avoid temp-induced errors

The new Melexis MLX90614ESF-DCH and MLX90614ESF-DCI offer heightened acuracy thanks to a combination of sensors and digital processing technology.

06/24/2011 — Measurement Specialties' China operation wins gov funding for R&D

Sensor maker Measurement Specialties Inc. (MEAS) was awarded the R&D Technology Certification along with RMB3 million funding from the Shenzhen government.

05/10/2011 — MEMS post-earthquake: Japan's MEMS industry dodges disaster

For the MEMS industry in general and for Japan's MEMS sector in particular, the damage from the March 11 earthquake and tsunami was not as severe as initially feared due to a fortuitous accident of geography. Only three of the 22 most important MEMS and compass fabrication plants in Japan suffered direct damage, IHS iSuppli research shows.

05/11/2011 — Knowles MEMS microphones using ADI IP banned from US by ITC

The International Trade Commission ruled in Analog Devices' favor and found that Knowles Electronics infringed ADI's Wafer Anti-Stiction Application (WASA) patent. The ITC also issued an exclusion order prohibiting further importation into the US of Knowles' infringing "MEMS [microphone] devices and products containing the same."

05/11/2011 — CMOS image sensors see growth beyond cellphones

Figure. CMOS vs CCD image sensor dollar volumes. Source: IC Insights May 2011.CMOS image sensors did not see the same strong rebound in 2010 that the semiconductor industry at large experienced. New momentum, driven by new system applications outside of camera phones and digital still cameras, could focus CMOS image sensors on growth from 2011 on, says IC Insights.

05/12/2011 — CNT-based thin-film structures create new MEMS/NEMS

Using lithography-compatible nano self-assembly, plasma etching, and sacrificial etch release, University of Minnesota researchers created carbon nanotube (CNT) based thin film MEMS/NEMS structures.

05/12/2011 — McGill, STMicro co-create sensor course

STMicroelectronics (NYSE: STM) and McGill University collaborated on an undergraduate course that teaches the integration of multiple state-of-the-art sensors into embedded computer systems, via lab exercises and projects based around STM's iNEMO platform. Some 35 students have already completed the course, with final projects in gaming, aerospace electronics, and more.

05/18/2011 — DARPA commissions MEMS from Northrop Grumman, GA Tech: New fab process underway

Northrop Grumman Corporation (NYSE:NOC) and Georgia Tech are developing a new type of MEMS gyroscope based on a new MEMS fabrication process that should allow smaller size, lighter weight, and lower power consumption with same performance to current silicon MEMS devices.

05/23/2011 — SiTime's new MEMS oscillators offer jitter, stability improvements for telecom, networking, storage and wireless

SiTime SiT820X The SiTime SiT820X family consists of the SiT8208 and SiT8209 programmable oscillators that operate from 1 to 80MHz and 80 to 220MHz respectively. These devices achieve 2x better stability over the industrial temperature range than quartz-based solutions, the company reports.

04/26/2011 — ULIS IR imaging sensor has military, surveillance apps

ULIS launched Pico640E, a video graphics array (VGA) 640 x 480 17µm IR imaging sensor that offers new advantages in size, performance and factor of merit.

04/26/2011 — Silicon magnetically actuated MEMS micromirror from Lemoptix replaces galvanometer and rotating mirrors

MEMS mirror chip.To significantly reduce size and power consumption and increase performance of micromirror devices, Lemoptix used semiconductor-like equipment to build micromirrors with actuation based on magnetic and heat-dissipating principles instead of gearings.

04/27/2011 — MEMS IDMs grab consumer, auto biz; top 20 MEMS foundries lag market

MEMS foundries shared unequally in the MEMS market's 25% growth in 2010. Total combined revenues of the top 20 MEMS foundries climbed only 10%, as companies doing internal production instead grabbed most of the big growth in consumer and automotive markets. Not to worry though, specialized foundry work yielded higher margins than the volume stuff.

04/27/2011 — C2MI's 3D MEMS fab adds Akrion Systems' advanced wet stations

The MiQro Innovation Collaborative Centre (C2MI) will purchase three Akrion Systems GAMA automated wet process systems for the development and manufacture of advanced devices at C2MI's state-of-the-art MEMS facility in Quebec.

04/27/2011 — MEMS + smart phones: Better together, says Semico

Smart phones are a booming market. MEMS and sensors are a booming market. Semico estimates that the total available market for MEMS and sensors in the smartphone market will reach $3.0 billion in 2011, an annual growth of 52.7%.

04/28/2011 — Nano bead could revolutionize sensor technology

Immunoassay based sensor: Oregon State UniversityOregon State University scientists tap into the capability of ferromagnetic iron oxide nanoparticles to detect chemicals with sensitivity and selectivity. These ferromagnetic iron oxide nanoparticles can be incorporated into a system of ICs to instantly display the findings.

04/28/2011 — Samsung Apple Nintendo buy most consumer/mobile MEMS sensors in 2010

Top consumer and mobile MEMS purchasers (millions of USD). IHS iSuppliSamsung Electronics in 2010 recaptured the top spot from Nintendo as the largest buyer of MEMS sensors for mobile phones and other consumer electronics, while Apple Inc. grabbed second place to move within striking distance of number 1, according to new research from Jérémie Bouchaud of IHS iSuppli.

04/29/2011 — Energy harvesting beyond the lab thanks to silicon micromachining

Photo. A new energy harvester developed by University of Michigan researchers can harness energy from vibrations and convert it to electricity with five to ten times greater efficiency and power than other devices in its class. Credit: Erkan AktakkaUniversity of Michigan engineers have developed a vibration energy harvester with high-quality piezoelectrics built using silicon micro-machining processes that would allow high-volume production. The harvester could operate wireless sensor networks in factories for 20+ years without maintenance.

04/12/2011 — Optoelectronics, sensors and discretes sight another record year

Figure. Sales changes in the economic downturn and recovery. SOURCE: IC InsightsSlightly above average growth rates in 2011 will lift sales of optoelectronics, sensors and actuators, and discrete semiconductors to new record-high levels again this year, thanks to growth in MEMS and LED markets, says IC Insights.

05/02/2011 — Bosch deploys Cadence for custom/analog flow

Robert Bosch GmbH (Bosch), one of the top 4 MEMS suppliers, has standardized on an enhanced custom/analog flow based on Virtuoso v6.1 technology from Cadence Design Systems Inc.

05/03/2011 — CMOS image sensor IDM orders multiple Camtek AOI systems

Camtek received a follow-on order for its new Gannet automatic optical inspection (AOI) system from a leading Asian integrated device manufacturer (IDM) for the application of CMOS image sensor inspection.

05/03/2011 — Wafer-level MEMS mic debuts from 3S

SSSM100 is a tiny analog output CMOS MEMS microphone manufactured under standard CMOS process and wafer level packaging (WLP) technology.

05/03/2011 — SB Microsystems named COMSOL Certified Consultant

SB Microsystems, specializing in the design, simulation, prototyping, and testing of microfluidic devices and micro electromechanical system (MEMS) fabrication, is now certified as COMSOL Multiphysics experts.

05/04/2011 — DelfMEMS RF MEMS delivered to NTT DOCOMO

DelfMEMS has delivered custom RF MEMS samples to telecom operator NTT DOCOMO. DelfMEMS provided arrays of custom MEMS ohmic switches to enable tunability into RF FEM for mobile applications. Voltage, size, losses, isolation, ultra-fast switching time and power handling will be evaluated by NTT DOCOMO.

05/05/2011 — Piezoelectric deposition tech wins $3M investment, SolMateS plans MEMS fab equip penetration

SolMateS PiezoFlare 1200SolMateS received investments for the final development of the PiezoFlare 1200 piezoelectric thin film deposition machine. PiezoFlare 1200 is an automated deposition system for PZT thin films on 6" or 8" wafers, based on pulsed laser deposition.

05/05/2011 — MEMS unaffected, crystals disrupted by Japan earthquake

MEMS fabs in Japan after earthquakeCrystals and MEMS are used in electronic components as the basis of oscillators. Both are popular in consumer electronics devices like smartphones. Crystal growth was significantly interupted by the major March 11 earthquake off the coast of Sendai, Japan. MEMS, on the other hand, seem to have escaped the disaster largely unscathed, show 2 new reports from IHS iSuppli.

05/06/2011 — STM sensing hardware uses 3 MEMS for 10 DoF

STMicroelectronics (NYSE: STM) launched a complete hardware solution for advanced sensing applications with 10 degrees of freedom. A set of 3 thin, high-performance MEMS sensors provides accurate and comprehensive information on linear, angular, and magnetic motion together with altitude readings.

05/06/2011 — Optics Balzers offers optical patterning processes

Optics Balzers is offering a portfolio of patterning technologies for producing high-grade optical components. Depending on the application, patterning techniques such as photolithography, laser ablation, or masked coatings are available.

05/09/2011 — Dolomite, Sphere Fluidics collaborate on microfluidics

Dolomite and Sphere Fluidics established a collaboration, wherein Dolomite will help bring Sphere Fluidics microdroplet technologies to market faster. Dolomite expects to gain new capabilities via the partnership.

05/23/2011 — MEMS showcase at SEMICON West proves MEMS role in mainstream electronics

The MEMS Industry Group (MIG) is organizing the inaugural "MEMS in the Machine" DemoZone at SEMICON West, sharing compelling examples of MEMS in action.

05/19/2011 — Microfluidics consortium eyes standards in chip interconnect

The MF3 Microfluidics Consortium, which includes Philips, STMicroelectronics (STM) and others, recognizes a need for standards in how microfluidic chips are connected to systems. Since microfluidics perform diverse tasks, three main interconnect types were identified.

05/24/2011 — Analog Devices iMEMS accelerometers bypass temperature compensation circuitry

Analog Devices Inc. (ADI) released the ADXL206 high precision, low power, dual-axis iMEMS accelerometer with signal conditioned analog voltage outputs. Instead of using additional temperature compensation circuitry, ADI's design techniques ensure that high performance is built in.

05/24/2011 — MEMS wafers characterized by Zebraoptical integrated metrology tool

Zebraoptical Integrated Metrology Tool (ZIMT)Sunrise Optical LLC debuted the Zebraoptical low coherence fiber optic interferometer with microscope attachment. The Zebraoptical Integrated Metrology Tool (ZIMT) provides metrology readings on micro electromechanical system (MEMS) wafers.

05/25/2011 — Newport laser microfabrication station optimized for MEMS research

Laser µFAB from Newport CorporationNewport Corporation, lasers and photonics technology provider, introduced the Laser µFAB tabletop laser microfabrication workstation for researchers. Equipped with submicron resolution and a large stage, the tool can perform polymerization and ablation for MEMS, microelectronics, and other applications.

05/25/2011 — STM ramps MEMS production to 3 million a day

STMicroelectronics (NYSE: STM) will bump up its MEMS production capacity to more than 3 million sensors a day by year's end. The capacity ramp is being supported by a "beefed-up manufacturing machine," said Benedetto Vigna, group VP and GM of ST's MEMS, Sensors and High Performance Analog Division

05/25/2011 — MEMS + CMOS aim of IME, Towerjazz partnership

Specialty foundry TowerJazz will collaborate as a manufacturing partner with Singapore's Institute of Microelectronics (IME) on MEMS, packaging and ASICs. This marks another notch in TowerJazz's Asia expansion, which includes new China offices and a potential fab buy in Japan.

05/26/2011 — Sensors worth $91.5B in 2016; Bio/chemical sensing tops growth

Figure. Global sensors market, 2009-2016 in $ millions. Source: BCC Research May 2011.The sensors industry will be worth $91.5 billion in five years, according to BCC Research. While the largest segment -- image, flow and level sensors -- will see 8.5% CAGR, biosensors and chemical sensors will see the fastest market growth at 9.6% CAGR.

05/26/2011 — Imec ITF: A world of opportunities for nanoelectronics

Nanoelectronics is not only about smaller transistors and more complex chips, it's about a whole new world of opportunities and solutions to major societal challenges, underlined imec president/CEO Luc Van de hove, in his opening keynote at imec's annual International Technology Forum this week in Brussels.

05/17/2011 — Wafer bonding: Many options for many devices

Wafer bonding. SOURCE: Yole May 2011. Wafer bonding is a complex process, used on 2" to 12" wafers for MEMS, image sensors, advanced packaging, LEDs, and other chips. Yole Développement published a technology study and market research report, "Permanent wafer bonding," to derive trends in the market and technology through 2016.

05/17/2011 — Graphene, CNT NEMS resonators exhibit nonlinear damping

A depiction of the nanoscale mechanical resonators constructed with graphene and CNTs.Catalan Institute of Nanotechnology Professor Adrian Bachtold and his research group created resonators from nanoscale graphene and carbon nanotubes (CNT) that exhibit nonlinear damping. This result could lead to supersensitive detectors of force or mass.

08/26/2011 — Fraunhofer ISIT joins MEMS Industry Group

The MEMS Industry Group welcomed Frauhofer Institute for Silicon Technology to its membership. The research facility focuses on microelectronics and microsystems technology. Siconnex, which builds diverse MEMS fab equipment, also joined the association.

08/31/2011 — Record MEMS revenues from tablet, smartphone adoption

Consumer and mobile MEMS devices will see record revenue growth in 2011, thanks to higher MEMS content in smartphones and tablets, as well as increased smartphone/tablet adoption. New MEMS devices coming on the scene promise continued growth.

08/31/2011 — CellGuide chooses Baolab MEMS-based compass for GPS

CellGuide selected Baolab's 3D NanoCompass IC technology as a companion to its location and positioning products, fully integrating GPS and compass functionalities in the CLIOX-C. The nanoscale MEMS manufacturing technique used for the NanoCompass supports high-volume, space-constrained applications.

09/02/2011 — STM exec keynotes MEMS workshop from iNEMI

Benedetto Vigna, group VP and GM of ST Microelectronics' MEMS, Sensors, and High-Performance Analog Division, will keynote the iNEMI MEMS workshop.

09/06/2011 — poLight taps SVTC for optical MEMS commercialization ramp

poLight will work with SVTC Technologies to optimize its TLens production process for large volumes.

09/07/2011 — Asian MEMS foundry installs SPTS DRIE tool

SPTS Technologies received an order for an Omega deep reactive ion etch (DRIE) process module from an Asian MEMS foundry. This marks SPTS' 900th DRIE tool sold.

09/08/2011 — NanoInk sells nanofabrication tool to West Virginia University

NanoInk's NanoFabrication Systems Division will deliver an NLP 2000 nanofabrication system to West Virginia University's Multifunctional and Energy Ceramics Laboratory for research on developing micro-sensors based on complex nanomaterials and nanocomposites.

09/08/2011 — Smartphone/tablet motion sensor MEMS: What's next?

Jérémie Bouchaud, IHS, reports on motion sensing MEMS growth through 2015, including new motion sensors to be integrated into smartphones and tablets. These devices are driving a sales boom for MEMS sensors.

09/09/2011 — Microsystem commercialization center breaks ground in OH

The Entrepreneurship Innovation Center at Lorain County Community College in Ohio hosted a groundbreaking ceremony today for its Richard Desich SMART Commercialization Center for Microsystems.

09/12/2011 — Goodrich MEMS IMU ordered for Turkish missiles

Turkey's Roketsan Missiles Industries Inc. ordered Goodrich (NYSE:GR) SiIMU02 inertial measurement units (IMU) for precision guidance tasks on Roketsan's new CIRIT 70mm laser-guided missile for attack helicopters.

09/12/2011 — Silicon magnetic sensors follow the right course through 2015

Silicon magnetic sensors are riding an upswing in automotive production and the expansion in tablet/smartphone adoption to 23.7% revenue growth in 2011, according to IHS iSuppli. This amounts to $1.46 billion in revenue.

09/13/2011 — Nanostart's Microlight Sensors stake increases

Nanostart AG (OTCQX:NASRY) is progressing in its planned stake increase in Microlight Sensors, now holding 31% of the optical sensor maker.

09/14/2011 — MicroVision may sell Azimuth $35M in common stock

MicroVision Inc. (Nasdaq: MVIS) secured a committed equity financing facility, wherein it can sell Azimuth Opportunity Ltd. up to $35 million of its shares of common stock over a 24-month period.

09/14/2011 — MIT redesigns MEMS for better energy harvester

MIT researchers have constructed a piezo-MEMS energy harvester using a bridge design rather than a cantilever. The bridge allows a wider frequency range to generate electricity, and keeps the piezoelectric material to a single layer.

05/31/2011 — Microcantilevers sense interactions between nanomaterials and living cells

Micro-cantilevers can measure lipid bilayers interactions with surfactants with a new level of sensitivity, say Rice University researcher Sibani Lisa Biswal and Kai-Wei Liu, a graduate student. Applications range from better detergents to buckyball/cell interaction research, to investigations of how viruses penetrate cells.

05/27/2011 — Microfluidics module handles single- and multi-phase flow simulation

Based on COMSOL Multiphysics simulation software, the new COMSOL Inc. Microfluidics Module enables users to study microfluidic devices and rarefied gas flows. The module is designed for microfluidics and vacuum researchers and engineers.

05/30/2011 — NIST collaborates on MEMS roadmaps: ITRS, iNEMI

As smartphones usher in a host of new high-volume MEMS applications, semiconductor and electronics roadmaps are paying serious attention to the manufacturing and costs gaps in MEMS production. NIST's Michael Gaitan and the MEMS Industry Group are helping shape iNEMI, ITRS roadmaps with MEMS in the spotlight.

06/07/2011 — The future of MEMS: Rethinking business strategies and manufacturing technology for volume systems markets

SEMICON West preview: Rapid growth in mainstream consumer markets is changing the structure of the MEMS industry from an artisanal to a volume manufacturing business -- creating a new set of challenges and opportunities to companies to find better ways to speed the production ramp, find better ways to integrate multiple die and software, and to find the right business models.

06/08/2011 — Peptides, electrodes work together on bio-circuit at U Penn

University of Pennsylvania researchers formed biological molecules connected to electrodes, paving the way for direct biological integration into electronic circuits. The team also developed a new microscope technique to measure the electrical properties of these constructs.

06/06/2011 — Deep silicon etch from Oxford Instruments offers process flexibility

PlasmaPro Estrelas100 deep silicon etch technology from Oxford Instruments.Oxford Instruments debuted the PlasmaPro Estrelas100 deep silicon etch technology for the MEMS R&D and fabrication market. The tool is designed to be flexible, accomodating multiple processes without changing chamber hardware, and multiple wafer sizes for R&D-to-production ramp.

06/01/2011 — Asia package test house selects Multitest equip for MEMS test

Multitest InFlipA major test house in Asia will install Multitest's InCarrier loader/unloader, InStrip, and InMEMS module for accelerometer MEMS test.

06/08/2011 — Knowles patents upheld against MemsTech

The US Court of Appeals for the Federal Circuit affirmed that MemsTech's importation and sale of certain MEMS microphone packages infringes Knowles Electronics LLC's US Patents 7,242,089 and 6,781,231.

06/09/2011 — NASA grants BMC Phase II space imaging contract

Boston Micromachines Corporation (BMC) will use a $1.2M NASA award to expand on an existing NASA project to develop fault-tolerant microelectromechanical deformable mirror (MEMS-DM) arrays and smaller, lower-power drive electronics.

06/06/2011 — Moog buys MEMS device maker Crossbow Technology for $32M

Moog acquired Crossbow Technology for its innovative MEMS technology, which will complement Moog's controls products. The purchase price was $32 million.

06/02/2011 — Omron shares MEMS dev at Sensors Expo

Omron's Micro Device Division (MDD) will release numerous MEMS products in the coming year, notably an absolute pressure sensor for high-accuracy navigation and a thermal IR sensing array for smart buildings and appliances.

06/15/2011 — More MEMS-per-device coming to automotive safety systems

 In 2016, about 150 million systems will be installed in vehicles, containing over 830 million MEMS chips, says ABI Research. The growth is thanks to more MEMS in each safety or performance device, as well as government and consumer demand for new cars with integrated safety features.

06/10/2011 — Gas-based etch enables MEMS materials flexibility, commercial reliability at Fraunhofer

A researcher operates Fraunhofer's MEMS production tools. Copyright Fraunhofer IMS.Fraunhofer Institute for Microelectronic Circuits and Systems IMS developed a gas-based etch step that allow MEMS designers to use a wider range of materials for the functional layer, while preventing device damage during etch.

06/03/2011 — NEMS sensor improves AFM

The US National Institute of Standards and Technology's (NIST) Center for Nanoscale Science and Technology (CNST) has improved atomic force microscopy (AFM) by replacing the microscope's optical instrumentation with a nanomechanical cantilever probe and nanophotonic interferometer on a chip.

06/15/2011 — Industrial MEMS market headed for consolidation, says Frankfurt Partners

A major consolidation is coming to the industrial MEMS market in the next 12-18 months, predicts Frankfurt Partners. The industrial MEMS market is both highly attractive and highly fragmented.

06/14/2011 — Levelling tech from NanoInk enables better nano-printed arrays

NanoInk's NanoFabrication Systems Division is launching a force sensor and levelling devices at the Nanotech Conference and Expo, part of TechConnect World. NanoInk will also be presenting on Dip Pen Nanolithography (DPN) advances.

06/09/2011 — Kaiam MEMS-based optical ICs attract investors

Kaiam closed its Series B investment round with over $5 million. TriplePoint Capital, which led the round, cited Kaiam's MEMS-based optical integration as "applicable as much for high-end high-capacity data transport as for low cost FTTH applications."

06/01/2011 — ITRI installs EVG bonders to ramp 200mm MEMS

Taiwan's Industrial Technology Research Institute (ITRI) will install more EV Group (EVG) wafer bonding tools to research and develop advanced manufacturing processes for next-generation micro electro mechanical system (MEMS) devices, especially on 200mm wafers.

06/02/2011 — Projected 23% CAGR in MEMS microphone market attracts crowd of entrants

SEMICON West preview: Companies are scrambling for a piece of the growing market of MEMS microphones for mobile phones, where applications are widening and demands are getting more sophisticated.

06/13/2011 — FEI plasma FIB tool suits MEMS, 3D packaging

High-speed sectioning of TSVs with plasma FIB. The device was located, cross-sectioned, polished, and imaged with PFIB. SOURCE: FEI FEI's new Vion plasma focused ion beam (PFIB) system based on inductively-coupled plasma (ICP) source technology using a xenon ion beam generates more than a micro-amp of beam current and can remove material faster than liquid metal ion sources, says product marketing manager Peter Carleson.

06/13/2011 — STM branches MEMS tech out into touchscreen displays

STMicroelectronics (NYSE:STM) debuted "FingerTip" technology, which enables a single-chip solution for capacitive touchscreens up to 10" diameter with multi-touch capability. FingerTip shares STM's MEMS sensors methodology: a sensing element connected to a high-performance capacitance-sensing circuit.

06/02/2011 — X-FAB MEMS accelerometer design IP blocks shorten dev time

X-FAB Silicon Foundries released ready-to-use design IP blocks for MEMS accelerometers, as part of its MEMS foundry service offerings. The IP blocks can be used in gyroscopes and accelerometers spec'd up to 100 G-force, shortening NPI and HVM ramp.

06/03/2011 — Plures, MEMS and spintronics foundry, merges with CMSF Corporation

CMSF Corporation (OTCBB:CMSF) will merge with Plures, which, through its 95%-owned subsidiary, Advanced MicroSensors Corporation, is a semiconductor foundry developing and fabricating high-quality, high-margin MEMS and spintronics products.

07/26/2010 — SEMICON West Lesson #5: Interests outside CMOS

Wrap-up of what we heard and saw at SEMICON West 2010. Lesson 5: Interest was overflowing for high-growth areas outside traditional CMOS: MEMS, LEDs, solar. And the industry really can reach everywhere around us.

11/15/2010 — Introduction to MEMS gyroscopes

MEMS gyroscope introductionJay Esfandyari, Roberto De Nuccio, Gang Xu, STMicroelectronics, introduce how MEMS gyroscopes work and their applications, the main parameters of a MEMS gyroscope with analog or digital outputs, practical MEMS gyroscope calibration techniques, and how to test the MEMS gyroscope performance in terms of angular displacement.

11/18/2010 — MEMS-in-2011-and-beyond: POVs from the MEMS Executive Congress

Dan Siewiorek, Karen Lightman, Rich Duncombe, Vida Ilderem, and other speakers from the MEMS industry shared their visions for the future at the MEMS Executive Congress 2010. Following are summaries of their talks, from the "iPhone 20" lifetime smart-companion to seisic imaging developments, energy management, and more MEMS opportunities.

11/30/2010 — Automotive-MEMS-sensor-market-on-a-roll

Driven by the rapid recovery in automotive production and inventory rebuilding among sensor component suppliers, the market for automotive microelectromechanical system (MEMS) sensors will expand to record size in 2010, according to market research firm iSuppli, now part of IHS.

11/01/2010 — Faster inspection of MEMS possible with microinterferometer arrays

Scientists involved in the European Union's "Smart inspection systems for high-speed and multifunctional testing of MEMS and MOEMS" (SMARTHIEHS) project are developing a new test concept based on parallel inspection of devices at wafer level.

11/10/2010 — InvenSense-integrates-3-axis-gyroscope-3-axis-accelerometer-on-single-silicon-die

InvenSense released its MPU-6000 product family. The MPU-6000 MEMS motion sensing technology integrates a 3-axis gyroscope and a 3-axis accelerometer on the same silicon die together with an onboard Digital Motion Processor (DMP) capable of processing complex 9-axis sensor fusion algorithms.

11/09/2010 — Kionix-extends-reach-in-inertial-MEMS-sensors-debuts-gyros-accelerometers

Kionix Inc. announced a portfolio of MEMS inertial sensors featuring 3 new accelerometers that set company benchmarks for low power, performance over temperature, and user programmability. Kionix also released its first two gyros for mass-market consumer applications.

11/02/2010 — Silicon-etch-for-microelectronics-research-at-university-Texas-at-Austin

The Microelectronics Research Center of the University of Texas at Austin increased its facility capabilities by installing a Plasma-Therm VERSALINE DSE system. The addition of leading deep silicon etch technology enables process advances in MRC’s micro, nano and opto-electronics research. 

12/22/2010 — Automotive MEMS market witnessing a record 2010

iSuppli MEMS analyst Richard Dixon takes a closer look at what's driving the market for MEMS sensors in automotive applications (hint: safety and China), new applications and market shifts, and the long-awaited arrival of consumer-oriented suppliers.

12/28/2010 — MEMS packaging conference planned for 2011

The University of Michigan College of Engineering will present Packaging for MEMS March 31 to April 1, 2011, in Boston, MA. MEMS packaging is a significant part of product cost. This program highlights what to consider in developing application-specific packaging that will meet your goals for product performance, durability, and total cost.

12/02/2010 — Quiet revolution: MEMS thrives on application diversity

iSuppli MEMS analyst Richard Dixon analyzes one of the fastest-growing MEMS sectors today: "high-value" technologies specifically built for use in industry, medical, energy, and wired telecommunications.

12/09/2010 — Lab-on-chip system could provide fast detection of single nucleotide variations in DNA: IEDM news

At IEDM, Panasonic and imec discussed components of their lab-on-chip collaboration: miniaturized pump for on-chip generation of high pressures, a micropillar filter optimized for DNA separation achieving record resolution, and a SNP detector allowing on-chip detection using very small sample volumes.

12/09/2010 — Printed everything: PE/PV show highlights flexible 3D interconnects, biosensors, memory, PV cell hybrids

Techcet's Michael A. Fury continues his report from IDTechEx's combined Printed Electronics/ PV USA events, with talks about 3D stacked interconnects made from printed inks, printed biosensors for textiles, a disposable explosives-detecting wipe, silicon-organic PV cells, printed rewritable permanent memory devices, and more.

12/13/2010 — Quantum-computing-focus-of-MEMS-mirrors

A new laser-beam steering system that aims and focuses bursts of light onto single atoms for use in quantum computers has been demonstrated by collaborating researchers from Duke University and the University of Wisconsin-Madison.

12/16/2010 — Reduced-gravity-NASA-funded-rHEALTH-microfluidics-sensor-test

NASA testing of a lab-on-chip microfluidics sensorThe DNA Medicine Institute (DMI) successfully completed reduced-gravity experiments on its rHEALTH sensor for the 2010 Facilitated Access to the Space Environment for Technology (FAST) program, at NASA in Houston.

12/17/2010 — iPhone-4-MEMS-microphone-technology-boon

Highlighted by their adoption in Apple Inc.’s iPhone 4, microelectromechanical system (MEMS) microphones are set to achieve a more than 50% increase in shipments in 2010 and a fourfold rise by 2014, according to the market research firm iSuppli, now part of IHS Inc. (NYSE: IHS).

12/22/2010 — Automotive MEMS market witnessing a record 2010

iSuppli MEMS analyst Richard Dixon takes a closer look at what's driving the market for MEMS sensors in automotive applications (hint: safety and China), new applications and market shifts, and the long-awaited arrival of consumer-oriented suppliers.

01/27/2011 — Microvisk raises third funding round for MEMS based blood clot monitor

Microvisk Technologies, developer of a system to monitor the blood clotting status of patients taking Warfarin, raised £6 million through a rights issue to existing investors in an oversubscribed round. Microvisk has developed a medical diagnostic strip based on MEMS technology.

01/13/2005 — Measurement Specialties buys MWS Sensorik

Jan. 13, 2005 -- Measurement Specialties Inc., a Fairfield, N.J., designer and manufacturer of sensors and sensor-based consumer products, announced it has closed its acquisition of MWS Sensorik GmbH of Pfaffenhofen, Germany. The deal, worth approximately $1.2 million, was originally announced on Dec. 14, 2004. The transaction was[...]

01/26/2005 — IMT raises $17 million

Jan. 26, 2005 -- Innovative Micro Technology (IMT), a MEMS manufacturer, announced it raised $17 million in institutional venture capital. The round was led by Investor Growth Capital Ltd. BA Venture Partners and Miramar Venture Partners also participated. WR Hambrecht + Co. acted as financial advisor to IMT. IMT will[...]

01/04/2005 — Microfabrica and MOSIS launch MEMS fab service

Jan. 4, 2005 -- Microfabrica Inc. and MOSIS announced today the introduction of EFAB Access, the first multi-project run service to offer Microfabrica's 3-D micromanufacturing technology. The service is intended to give companies, universities, research labs and individuals the ability to design three-dimensional MEMS and microdevices and have their prototypes[...]

01/06/2005 — JPSA announces micromachining for medical device manufacture

Jan. 6, 2005 -- JPSA Laser, a Hollis, N.H., provider of UV micromachining and other systems, announced it is offering UV laser micromachining services for medical device manufacturing. The company said it can provide micromachining services with micron-scale features and sub-micron tolerances for applications in microfluidics, sensors, nozzles, micro-screens[...]

01/06/2005 — Rite Track announces Tokyo Electron agreement

Jan. 6, 2005 -- Rite Track, a leading provider of track systems for the semiconductor, MEMS and thin film head industries, today announced the completion of a multiyear agreement with Tokyo Electron Limited (TEL). This expansion of an agreement reached in July of 2003 includes multiyear terms and increased territory[...]

01/12/2005 — Akrion GAMA systems to ship to Singapore fab

Jan. 12, 2005 -- Akrion Inc. of Allentown, Pa., announced the sale of two GAMA series tool sets to a leading device manufacturer. The GAMAs will be used for pre-diffusion cleaning and will ship to the customer's Singapore site as part of a fab expansion. The pre-diffusion clean GAMA systems[...]

02/03/2005 — Dust sweeps up $22 million and a pair of new partners

Feb. 3, 2005 -- Dust Networks added $22 million to its coffers through a Series B round of financing that is expected to help it grow its customer base in key regions. The company, which specializes in wireless sensor networks, announced today that it completed a funding round led by[...]

02/02/2005 — Rite Track to ship deep UV track system

Feb. 2, 2005 -- Rite Track, a manufacturer of track systems for the semiconductor, MEMS and thin film head industries, announced it has taken a major order for a deep UV (DUV) 90-S system. The customer fab is located in the eastern United States but its identity is not being[...]

02/02/2005 — Coventor names new VP of marketing, biz dev

Feb. 2, 2005 -- Coventor Inc., a Cary, N.C., supplier of MEMS design software, announced the appointment of Joost van Kuijk as vice president of marketing and business development. van Kuijk has been managing the firm's European technical operations for more than six years and has been working in[...]

02/08/2005 — Kionix ships tiny tri-axis accelerometer

Feb. 8, 2005 -- Kionix Inc., an Ithaca, N.Y.-based MEMS sensor provider, announced it has shipped a new tri-axis accelerometer, the KXP74, that measures just 5 x 5 x 1.2mm. Along with the first shipment the company also announced general availability of the product. The ultra-thin design[...]

02/09/2005 — MEMS Industry Group releases '05 report

Feb. 9, 2005 -- The MEMS Industry Group (MIG), a Pittsburgh-based trade association representing the MEMS and microstructures industries, announced the release of its latest report. The publication, titled "2005 Industry Report -- Focus on Accelerated Lifetime Test", includes findings and recommendations from working groups at the MIG's conference, METRIC[...]

02/10/2005 — Companies launch fab owner's association

Feb. 10, 2005 -- Senior manufacturing executives from nine global semiconductor companies announced the formation of an international, not-for-profit semiconductor manufacturing association, the Fab Owners Association (FOA). The announcing member companies are AMI Semiconductor, Cypress Semiconductor, Delphi Electronics, Fairchild Semiconductor, Intersil, LSI Logic, Micrel Semiconductor, ON Semiconductor, and ZME AG[...]

02/25/2005 — Dalsa, Primaxx partner on MEMS

Feb. 25, 2005 -- DALSA Semiconductor of Bromont, Quebec, has selected Primaxx Inc. of Allentown, Penn., as a strategic supplier for MEMS etch release production equipment. Its new cluster based production tool was shipped last month to DALSA's Bromont facility with a single, 25-wafer etching module customized to DALSA'S specifications[...]

02/11/2005 — From the 2004 archives: Michigan researchers, companies continue to engineer growth

Each year, Small Times ranks the U.S. states for their research, development and commercialization proficiency in the areas of nanotechnology, MEMS and microsystems. Last year, Michigan ranked eighth. Its 2004 report card follows.

12/15/2005 — Hymite announces new silicon MEMS package

Dec. 15, 2005 -- Hymite, a manufacturer of silicon-based packaging products for MEMS and electronic devices, announced the availability of its HyCap S -- QFN/SON, a packaging product that offers a small, hermetic MEMS and IC package that is conformant with standard specifications for high volume applications. The company said[...]

12/16/2005 — Tegal announces etch tool orders

Dec. 16, 2005 -- Tegal Corp. (Nasdaq:TGAL), a designer and manufacturer of plasma etch and deposition systems used in the production of integrated circuits and nanotechnology devices, announced the sale of several 900 and 980ACS plasma etch systems to four different customers in the U.S. and Europe. The company[...]

12/19/2005 — SUSS nets Chinese MEMS order

Dec. 19, 2005 -- SUSS MicroTec AG announced that it received an order from a Chinese company worth $3 million dollars. The equipment, including mask aligners, coater/developers, bonders and a probe system, will be used to develop new MEMS devices. The order was received in November and the machines are[...]

01/18/2005 — Sensant to put MEMS into ultrasound

Jan. 18, 2005 -- Sensant Corp., a developer of silicon-based ultrasound imaging technology, announced that it has received its first commercial order for its silicon ultrasound imaging probes from Italian imaging systems manufacturer Esaote S.p.A. The order is for Sensant's newly developed broadband Silicon Ultrasound array transducer, according[...]

01/06/2005 — MEMS enable smart golf clubs

Jan. 6, 2005 -- Analog Devices Inc. announced today that its iMEMS accelerometers and gyroscopes are used in the SmartSwing golf club. The company's accelerometers are used to measure the acceleration and swing plane of the user's golf swing while the gyroscopes measure the twist of the hands. The SmartSwing[...]

01/03/2005 — A VC's perspective on valuation

We at Harris & Harris Group are more confident than ever that nanotechnology will spawn some great new companies. But we and other venture capitalists are not paying – and should not pay – premium valuations for nanotechnology-enabled companies.

01/21/2005 — 2005 may be a momentous year for MEMS, or maybe just a momentum-building year

As a new year begins, it seems to be a good time to ask: What will 2005 bring? Within the MEMS industry, there’s always something interesting afoot, so let’s answer that question by exploring 2004’s accomplishments and developments that could shape 2005. Accelerometers got their foot in the door with cell phones in 2004 – a huge accomplishment. But, will the use of accelerometers for peripheral applications, such as pedometers and game controllers, really catch on?

01/24/2005 — Metconnex appoints Peter Becke CEO

Jan. 24, 2005 -- Metconnex, a provider of wavelength selective switch modules, announced the appointments of Peter Becke as chief executive officer and Phil Wilkinson as vice president of operations. Becke succeeds company co-founder Thomas Ducellier, who will continue to lead technology development as chief technology officer. Becke was previously[...]

01/19/2005 — EV installs IQ aligner at Promerus

Jan. 19, 2005 -- EV Group, a manufacturer of MEMS, nano and semiconductor wafer-processing equipment, said it has shipped and successfully installed an IQ Aligner at Promerus LLC, a developer of materials for applications in the semiconductor, optoelectronic and semiconductor packaging markets. Promerus will use the IQ aligner for development[...]

01/19/2005 — MEMS Industry Group to provide cost assessment tool

Jan. 19, 2005 -- The MEMS Industry Group (MIG), a Pittsburgh-based trade association, announced it has received funding from the Defense Advanced Research Projects Agency (DARPA) to continue its MEMS cost assessment tool project. In addition, the group said that semiconductor consortium SEMATECH's subsidiary, the International SEMATECH Manufacturing Initiative, will[...]

01/26/2005 — TRONIC'S to open U.S. MEMS office

Jan. 26, 2005 -- TRONIC'S Microsystems, a Crolles, France-based manufacturer of MEMS-based custom components, announced it has opened a North American office. The company has named Ariel Cao to serve as North American director of business development. TRONIC'S says establishing a U.S. presence is part of its strategy to[...]

01/10/2005 — Semi groups announce nanoelectronics study

Jan. 10, 2005 - SEMI and the Semiconductor Industry Association (SIA) today announced an agreement to jointly conduct a comprehensive study on nanotechnology applications in the electronics industry. The study will provide definition of the emerging global nanoelectronic markets and offer a global perspective of requirements and opportunities for equipment[...]

01/19/2005 — Ohio's 2004 performance in Small Times' rankings: diversity, practicality pay off

Click here to enlarge imageJan. 19, 2005 -- Each year, Small Times ranks the U.S. states for their research, development and commercialization proficiency in the areas of nanotechnology, MEMS and microsystems. Last year, Ohio ranked tenth. Its 2004 report card follows. Look to Small Times' upcoming March issue[...]

01/19/2005 — Kronos and U Washington collaborating on chip cooling

Jan. 19, 2005 -- Kronos Advanced Technologies Inc. (OTC.BB: KNOS) announced that the Washington Technology Center (WTC) has awarded the company's Kronos Air Technologies, Inc. subsidiary and the University of Washington funding for a research and technology development project entitled "Heat Transfer Technology for Microelectronics and MEMS." The[...]

02/09/2005 — Side-impact regulations could drive more demand for MEMS sensors

The airbag accelerometer is generally regarded as one of the best examples of a MEMS sensor giving automakers a simultaneous price and performance advantage. The same may one day be said of MEMS-based tire pressure monitors, now being integrated in mainstream models in response to safety legislation. Now there’s another area where MEMS is poised to make inroads in automotive – side-impact crash protection.

09/25/2006 — NanoCon wraps up with talks on biotech, funding

Small Times NanoCon International in Las Vegas came to a close on Friday with a keynote address by a veteran of the biotech industry and a second keynote on how the Sarbanes-Oxley act affects nanotech, as well as a trio of panels that covered the life sciences, what it takes to go public, and how to get early stage funding for a nanotech startup.

09/12/2006 — STS announces development of 300mm DRIE plasma source for high volume IC manufacturing

Surface Technology Systems plc (STS), a developer of plasma process technologies required in the manufacturing and packaging of MEMS and advanced electronic devices, announced the development of a new Deep Reactive Ion Etch plasma source which is compatible with 300mm silicon wafers.

06/07/2005 — Crossbow unveils uNAV sensor pack

June 7, 2005 -- Crossbow Technology Inc., a San Jose, Calif., provider of inertial systems, released its uNAV, a low cost, miniature air/ground vehicle sensor package. The uNAV is a calibrated digital sensor system and servo control board targeted at miniature ground and airborne vehicles. Typical applications include navigation and[...]

06/13/2005 — BEI to supply MEMS to Thales Aerospace

June 13, 2005 -- BEI Technologies Inc., a San Francisco-based manufacturer of sensors, motors and other motion control products, announced that its Systron Donner Inertial Division entered into a five-year agreement with Thales Aerospace of France for the supply of QRS11 quartz rate sensors. The MEMS-based sensors are intended for[...]

06/17/2005 — Changing mindsets is key to success

The Washington Technology Center's (WTC) Microfabrication Laboratory is celebrating its tenth anniversary. Like any entrepreneurial venture, we experienced successes and challenges in achieving this milestone.

06/03/2005 — American Sensor acquires Macro Sensors

June 3, 2005 -- American Sensor Technologies, a Landing, N.J., manufacturer of MEMS pressure sensors, transducers and transmitters announced it has acquired in its entirety the capital stock of Macro Sensors. American Sensor says the acquisition will allow it to offer a greater depth of sensor products and expertise[...]

06/06/2005 — Swiss institute mixes training, languages

The Swiss Federal Institute of Technology (EPFL) in Lausanne may be located on the idyllic banks of Lake Leman, but the institute has its feet solidly on the ground. Its programs combine technical training with something rarely emphasized in science and engineering: linguistic dexterity. Its leaders believe that mix will make the institute more attractive to students and to the businesses that eventually hire them.

06/20/2005 — Globalization alters manufacturers' rules Are nano, micro as vulnerable as anything else?

As globalization continues its relentless onslaught, the question inevitably arises: Precisely who benefits from this scenario? Certainly shareholders stand to benefit from innovation and the industrial development that follows. The employees of new firms benefit, too. And then there are the local economies in which such industries develop. They benefit from the creation of new jobs, the expansion of the local service sector, and from the reinvigorated tax base that results.

02/02/2005 — '04 nano funding report: less money but record number of rounds

The amount of money invested by venture capitalists in U.S. companies commercializing nanotechnology fell a precipitous 35 percent last year, according to data released today by Small Times. However, the number of companies receiving funding increased 32 percent, to the highest level Small Times has tracked in data going back to 1995.

06/02/2005 — FormFactor announces first delivery from new factory

June 2, 2005 -- FormFactor Inc. (Nasdaq: FORM), a Livermore, Calif., developer of wafer test probe cards for semiconductor manufacturers, announced the commercial delivery of the first probe card built in its new manufacturing facility. The company called the delivery a "major milestone" in a news release, citing the fact[...]

06/14/2005 — IMT partners with MEMTronics on RF MEMS

June 14, 2005 - Innovative Micro Technology of Santa Barbara, Calif., announced it will partner with MEMtronics Corp. on MEMtronics' second phase of a $3.69 million, three-year development contract from the Defense Advanced Research Projects Agency entitled "Robust, Reliable RF MEMS Capacitive Switches." IMT will fabricate and package[...]

03/10/2005 — Akrion names senior VP for sales

Mar. 10, 2005 -- Akrion Inc., an Allentown, Pa., maker of wet cleaning systems for semiconductor and MEMS production, announced that Richard Darlow was hired for the role of senior vice president of worldwide sales. Darlow comes to Akrion from SiVal Advisors LLC, an investment banking firm specializing in technology-based[...]

03/18/2005 — Fabrinet to supply BEI division

Mar. 18, 2005 -- Fabrinet, an engineering and electromechanical manufacturing services company, announced it has signed a volume supply agreement with Systron Donner Automotive Division to manufacture its MicroGyro assemblies. Initial low-volume manufacturing will begin in the second half of 2005 at Fabrinet's facilities in Bangkok, Thailand, the company said[...]

03/11/2005 — Apogee begins testing MEMS medical device

Mar. 11, 2005 -- Apogee Technology Inc., a provider of silicon-based innovations for specialized applications, announced it has signed an agreement with the University of Medicine and Dentistry New Jersey's Laboratory for Drug Delivery to conduct research and testing on the company's MEMS-based transdermal drug delivery device. Apogee selected the[...]

04/06/2006 — SUSS expands wafer bonder line

SUSS MicroTec, a supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, announced it is extending its existing wafer bonder range to include a new platform designed specifically for research, development and other low volume bonding applications. Currently the bonder carries the project name of "Elan".

04/25/2006 — Cascade introduces new measurement platform

Cascade Microtech of Beaverton, Ore., announced the introduction of a 150mm device measurement platform for measuring anything from semiconductor wafers, ICs, printed circuit boards and MEMS to bioscience devices.

12/19/2005 — IMT forms biosensor division

Dec. 19, 2005 -- Innovative Micro Technology, a Santa Barbara, Calif., maker of MEMS devices, announced the formation of a division to develop new biosensor technologies using MEMS. The division's initial aim is to develop resonating beam sensors in partnership with Professor Scott Manalis of Massachusetts Institute of Technology. The[...]

12/06/2005 — Chinese auto sensor companies move into India

China Automotive Systems Inc., a Wuhan, Hubei, China, power steering components and systems supplier and Sensor System Solutions Inc., an Irvine, Calif., manufacturer of MEMS sensors, interface electronics and control systems, announced a new project for its joint venture to manufacture and distribute manifold absolute pressure (MAP) and temperature and manifold air pressure (TMAP) sensors in India, as well as provide technical and commercial support to an unnamed Indian automobile manufacturer.

12/02/2005 — Measurement Specialties acquires MEMS sensor company

Dec. 2, 2005 - Measurement Specialties Inc., a Hampton, Va., designer and manufacturer of sensors and sensor-based consumer products, announced it has acquired the capital stock of HL Planartechnik GmbH, a sensor company located in Dortmund, Germany for $7.1 million ($3 million at close and the assumption of $4[...]

04/10/2006 — SiTime announces sampling of MEMS oscillators

By his own admission, MEMS industry veteran Kurt Petersen didn't think MEMS resonators were a viable commercial product. For starters, moisture would eventually creep into the packaging, undermining performance. And to make matters worse, the packaging itself would make it difficult if not impossible to compete in a price-driven market.

04/13/2006 — Richardson to distribute TeraVicta RF MEMS

April 13, 2006 -- Richardson Electronics announced a global distribution partnership with TeraVicta Technologies of Austin, Texas, to distribute its complete line of MEMS-based RF switching solutions. The switches are designed to provide the low insertion losses, high isolation, and high linearity of electromechanical relays, with the size, power consumption[...]

04/21/2006 — Amtech announces solar order

Amtech Systems Inc., a supplier of production and automation systems and related supplies to the semiconductor, solar cell and silicon wafer industries, announced that a major U.S. manufacturer of solar energy products awarded the company an order for its Bruce Technologies horizontal BDF 200 diffusion furnace.

04/04/2006 — SUSS sells to MiPlaza

April 4, 2006 - SUSS MicroTec announced that Microsystems Plaza (MiPlaza), a MEMS and nanotechnology research and development facility and service provider at the HighTech Campus in Eindhoven, the Netherlands, has selected SUSS MicroTec wafer bonding equipment for the manufacture of MEMS and and biomedical devices. The two systems, consisting[...]

04/05/2006 — Tokyo Electron delivers new MEMS tester

April 5, 2006 - Tokyo Electron Ltd. announced it has delivered a new wafer level MEMS tester, the TEMEON, to a leading MEMS device manufacturer located in Japan. The system enables manufacturers to stimulate a MEMS device and accurately isolate and validate the electrical and mechanical functionality at the wafer[...]

04/14/2006 — Olympus, Movaz launch joint venture

April 14, 2006 - Olympus Corp. and Movaz Networks Inc. announced the creation of a joint venture company named Olympus Microsystems America Inc. which will provide MEMS technologies and products for optical equipment suppliers worldwide. The companies say that by combining Movaz intellectual property and engineering resources with Olympus' established[...]

04/25/2006 — sp3 unveils diamond deposition system

April 25, 2006 - sp3 Diamond Technologies Inc., a Santa Clara, Calif., supplier of diamond film products, equipment and services, introduced its Model 650 hot filament CVD diamond deposition reactor. The Model 650 is a fourth generation system which builds on the process automation and safety features of sp3's earlier[...]

05/23/2006 — Publicly-traded nano VC firm rings NASDAQ closing bell

Saying that its listing on the NASDAQ has played a big role in Harris & Harris (NASDAQ: TINY) becoming one of the venture capital firms with the most investments in nanotechnology, company Chairman and CEO, Charles Harris, rang the closing bell.

05/16/2006 — MEMSIC opens design center

May 16, 2006 - MEMSIC Inc., a CMOS-based MEMS accelerometer and motion sensor provider, announced it has opened an IC design center in Chicago, Ill. The center will focus on the next generation of new products. MEMSIC is planning to launch several products designed at the Chicago design center[...]

05/24/2006 — Freescale orders production wafer bonding system from SUSS MicroTec

May 24, 2006 - SUSS MicroTec announced it received an order for a production wafer bonding system from Freescale Semiconductor (NYSE:FSL)(NYSE:FSL.B). Freescale calls silicon wafer bonding is a key enabling technology for the mass production of cost effective MEMS accelerometers. SUSS MicroTec is a precision manufacturing and test equipment[...]

03/24/2006 — INEX completes facilities upgrade

Mar. 24, 2006 -- INEX, a UK-based public-sector facility that works with companies to develop and commercialize MEMS, microsystems and thin film sensor technologies, announced it has completed the upgrade of its 100mm fabrication line to 150mm. The organization also announced it has added an additional 400 square meters to[...]

03/29/2006 — IMEC installs SUSS systems

Mar. 28, 2006 - SUSS MicroTec, a manufacturer of probe systems used to characterize semiconductor devices at wafer level, has installed its latest 300mm technology in wafer probe systems at the nanoelectronics research center IMEC in Leuven, Belgium. Both PA300PS ProbeShield semiautomatic probe systems with ReAlign and ContactView technology and[...]

03/30/2006 — Surface Technology nets MEMS order

Mar. 30, 2006 -- Surface Technology Systems plc (STS) , a maker of plasma processing technologies used in the manufacturing and packaging of advanced electronic devices, announced that it has received an order worth more than $3.4 million from a major manufacturer for MEMS production equipment.The order includes multiple[...]

03/02/2006 — Lightconnect announces new VOA with polarization maintaining fiber

Lightconnect, a supplier of MEMS optical components, announced a new variable optical attenuator with polarization maintaining fiber for power control and receiver protection in next generation optical networks.

03/06/2006 — JDSU introduces new MEMS optical product

JDSU introduced three new optical communications products under its Agile Optical Network (AON) strategy, which is intended to address the need for more agile, dynamically reconfigurable networks for consumer and business services.

03/09/2006 — Xponent begins production at IMT

Xponent Photonics, a maker of optical components, announced that it has begun production volumes of silicon planar lightwave circuits (PLCs) at Innovative Micro Technology.

05/10/2006 — Nintendo sources tri-axis accelerometer to Analog, ST Micro

Analog Devices Inc. and ST Microelectronics announced on Tuesday that they would be supplying tri-axis MEMS accelerometers for use in Nintendo's new home video game console, the Wii. The accelerometers will be used to provide a motion-activated user interface for the gaming machine.

02/15/2006 — mPhase names nano researcher chief scientist

Feb. 15, 2006 -- Little Falls, N.J.-based mPhase Technologies Inc. (OTC: XDSL) has named its lead nanotechnology researcher Victor Lifton to the position of chief scientist. He will have a larger responsibility for the company's emphasis on "small" technology, including its "smart" nanostructured battery and ultra-sensitive uncooled magnetometer[...]

02/15/2006 — Nano financiers aim to reinvent seed funding

Private funding works a certain way. Entrepreneurs bootstrap their moonlight tinkerings into small startups. They raise early financing from friends, family and angel investors. They go to venture capitalists. But a couple of companies actively funding nanotech are not so certain that's the best way after all.

02/17/2006 — Integral Vision announces new orders

Feb. 17, 2006 -- Integral Vision Inc. of Wixom, Mich., announced that it has received two additional orders for MEMS display inspection systems. One of the orders is from a repeat customer and the other order is from a new customer. Integral Vision's products provide for detection of display defects[...]

02/22/2006 — IMT installs new SUSS wafer bonder

Feb. 22, 2006 -- SUSS MicroTec, a supplier of precision manufacturing equipment for the semiconductor and emerging markets, announced the new installation of an additional wafer bonding system at Innovative Micro Technology (IMT) in Santa Barbara, Calif. IMT required additional wafer bonding capacity as part of its ramp up to[...]

03/14/2006 — Sensor System Solutions signs agreement with X-Labs Global

Sensor System Solutions Inc., a manufacturer of MEMS sensors, intelligent sensor interface electronics and intelligent embedded control systems, announced it has signed an agreement with X-Labs Global, a technology advisory and consulting firm based in Los Angeles.

03/30/2006 — Companies partner on automotive sensor development

Methode Electronics International GmbH, a division of Methode Electronics Inc., a global developer and manufacturer of electronic component and subsystem devices, and SensorDynamics AG, a development company manufacturing intricate microchip and micro-sensor systems, announced that they have signed a long-term collaboration agreement.

12/05/2006 — GenISys announces Layout LAB simulation software for MEMS

Developers of MEMS and flat panel displays now have a powerful new development and productivity tool from GenISys GmbH, a leading-edge provider of software solutions for efficient processing optimization of microstructure fabrication.

12/01/2006 — EV Group, Sonix collaborating

EV Group (EVG), a St. Florian, Austria, supplier of wafer-bonding and lithography equipment for the advanced packaging, MEMS and semiconductor markets, and Sonix Inc., a supplier of advanced acoustic NDT solutions for bonded wafers & MEMS, announced they are joining forces as Sonix selects EVG as their exclusive worldwide reseller/distributor of selected Sonix products.

12/08/2006 — SemiSurplus revamps site

SemiSurplus Inc. of West Chester, Ohio, launched a new web site for sales of semiconductor, MEMS, and nanotechnology equipment.

12/22/2006 — Tegal receives order for 6500 advanced etch system from Skyworks Solutions

Tegal Corp., a San Jose, Calif., designer and manufacturer of plasma etch and deposition systems, announced that it had received an order for an 6500 Advanced Etch cluster tool from Skyworks Solutions Inc.

08/23/2006 — Companies partner on MEMS communication devices

Advanced Diamond Technologies Inc. announced that the company and its collaborators received a $1.4 million Phase II program award from the Defense Advanced Research Projects Agency (DARPA) to advance next-generation broadband communication devices based on Advanced Diamond's Ultrananocrystalline Diamond (UNCD).

08/23/2006 — Siargo announces low power MEMS fuel cell sensors

Siargo Ltd. of Santa Clara, Calif., announced the release of its low power MEMS sensors for fuel cell systems, including a gas mass flow sensor for solid oxide fuel cells and a methanol concentration sensor for direct methanol fuel cells.

08/08/2006 — MEMSIC opens new Asia offices

MEMSIC Inc., a provider of CMOS-based MEMS accelerometers/motion sensors, announced it has opened branch offices in Tokyo, Japan and in Taipei, Taiwan. The company said it will open additional offices in Shanghai and in Shenzhen, mainland China for local customer support in Asia.

08/17/2006 — IMT receives ISO 9001 certification

Innovative Micro Technology (IMT), a Santa Barbara, Calif.-based contract manufacturer for MEMS, announced that it received ISO 9001:2000 certification from Det Norske Veritas (DNV).

12/11/2006 — Discera names Japanese distributors

Discera Inc., a San Jose, Calif.-based company developing MEMS resonator technology and provider of MEMS-based timing solutions, announced a pair of partnerships to distribute Discera's MEMS resonator-based timing products.

12/04/2006 — XCOM Wireless selects IMT to make RF relays

Dec. 4, 2006 -- XCOM Wireless Inc., a Signal Hill, Calif., developer of radio frequency products, announced it selected Innovative Micro Technology, a Santa Barbara, Calif., MEMS contract manufacturer, to manufacture die for its RF MEMS relay product.

12/06/2006 — SiTime names new operations VP

SiTime Corp., a Sunnyvale, Calif., start-up commercializing silicon MEMS resonators, announced the appointment of Regina Rekhtman as vice president of operations.

12/11/2006 — WiSpry names new management team members

WiSpry Inc., an Irvine, Calif., company developing RF MEMS tunable components and devices for the wireless industry, announced the appointment of Scott Feltenberg and Collin Baker to its executive team. Feltenberg joins WiSpry as vice president of finance and Baker joins WiSpry as vice president of customer engineering.

12/15/2006 — Entrepix selected by defense contractor to provide CMP for infrared sensor production

Entrepix Inc., a Tempe, Ariz., provider of CMP foundry and equipment services, announced the signing of a CMP FastForward volume pricing agreement with a leading aerospace defense contractor.

12/15/2006 — austriamicrosystems announces 50V high-voltage CMOS process with embedded flash

austriamicrosystems' foundry business unit announced a 50V High-Voltage CMOS process with embedded Flash. The company says this is the consequent next step in extending austriamicrosystems' position in High-Voltage CMOS technology.

12/15/2006 — EV Group, Sawatec extend agreement

EV Group (EVG), a St. Florian, Austria supplier of wafer-bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets and Sawatec, a manufacturer of advanced components and manual loaded instruments for photolithography, have signed a reseller agreement.

12/20/2006 — The Nov/Dec issue

Read our predictions for the year ahead, a review of the aerospace market, the 2006 MEMS industry report card and more. Plus a report on how 2-year colleges are training the nano workforce of the future, MEMS-based energy monitoring, and how microfluidics solved the spinach scare.

12/22/2006 — The Small Times staff will be on a nano (or micro, depending on your point of view) break starting Dec. 23 and will return Jan. 2

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As the publisher of Small Times, I want to take this opportunity to wish all of our readers, advertisers, sponsors, and contributing writers a very happy ...

03/22/2006 — Air mouse threatens to replace TV remotes

As MEMS-based products make their way into the consumer electronics market, one promising application is a device a reviewer dubbed the "remote control bagel."

03/02/2006 — Dalsa receives new CCD contracts

Mar. 2, 2006 - Dalsa Corp., a semiconductor and electronics company and MEMS foundry, announced that it has received two contracts totaling $2.3 million from customers in the professional imaging and life sciences end markets. The first contract is for the development and delivery of a new high performance[...]

10/30/2006 — Omron to buy Seiko Epson subsidiary's semi assets

OMRON Corp., a developer of automation, sensing and control technologies, announced that it has reached a preliminary agreement to acquire the semiconductor business assets of Seiko Epson's consolidated subsidiary, Yasu Semiconductor Corp.

10/23/2006 — EV Group and Datacon extend cooperation on advanced-chip-to-wafer technology

EV Group, a St. Florian, Austria, supplier of wafer-bonding and lithography equipment for the advanced packaging, MEMS and semiconductor markets and Datacon Technology GmbH, a leading supplier of flip-chip and die bonding equipment, announced the installation of an EVG540C2W System at Datacon.

10/03/2006 — Integral Vision announces additional SharpEye order

Integral Vision Inc. of Wixom, Mich., announced that it has received an additional order for its SharpEye inspection system from a MEMS display manufacturer. This customer currently uses several SharpEye systems in the manufacture of displays. Integral Vision's products provide for detection of display defects to assure quality in the manufacturing process.

10/05/2006 — Block MEMS nets funds to develop gas sensor

Block MEMS LLC of Marlborough, Mass., announced it was recently awarded a $4.5 million contract by the U. S. Army Research Office.

10/10/2006 — SMI moves into high volume with 6-inch MEMS fab

Silicon Microstructures Inc. (SMI) of Milpitas, Calif., announced production levels of more than 40,000 pressure sensors per day on its recently installed six-inch wafer MEMS manufacturing line.

10/24/2006 — Hymite expands North American effort

Hymite A/S, a manufacturer of silicon-based packaging products for electronic devices, announced the expansion of its North American sales operations with the addition of a worldwide sales director and new offices in Rockwall, Texas. The expansion is designed to answer the growing market need for wafer-scale packages for consumer and industrial, medical and automotive components, including LEDs.

10/30/2006 — Virtus expanding MEMS development program

Virtus Advanced Sensors, a developer of MEMS multi-axis inertial sensors, announced plans to expand its program for accelerometers, gyroscopes and integrated motion sensors.

10/31/2006 — MEMS fab nets automotive ISO certification

Silicon Microstructures Inc. (SMI), a Milpitas, Calif., silicon sensor designer and manufacturer, announced it has achieved ISO/TS 16949:2002 certification for its new six-inch MEMS production line.

10/18/2006 — Researchers developing self-cleaning PV arrays, non-stick MEMS

Researchers at the Georgia Institute of Technology are mimicking one of Nature's best non-stick surfaces to help create more reliable electric transmission systems, photovoltaic arrays that retain their efficiency, MEMS structures unaffected by water and improved biocompatible surfaces able to prevent cells from adhering to implanted medical devices.

09/19/2006 — ULCOAT chosen as potential mold supplier for SUSS C4NP

SUSS MicroTec announced that the first potential commercial source for C4NP glass molds has been selected. SUSS explained that the Glass MEMS Division of ULVAC COATING CORPORATION (ULCOAT) of Saitama, Japan has successfully demonstrated trial production of the reusable glass molds needed to bump wafers using IBM's C4NP process.

09/18/2006 — NanoWorld selects SUSS wafer bonding system

SUSS MicroTec, a Munich, Germany, supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, announced an order for its ELAN CB6L wafer bonding system to NanoWorld Services.

09/20/2006 — Small Times announces upgrade to publication Web site

Small Times today announced the re-launch of its web site -- The premier online destination covering commercial micro and nanotechnology, has been enhanced with an upgrade to its Web platform. The announcement was made at Small Times NanoCon International in Las Vegas.

09/21/2006 — Small Times Magazine announces Best of Small Tech Awards at leading nanotech business event

Small Times (TM) Magazine presented its highly respected Best of Small Tech Awards at the Small Times NanoCon International conference and trade show today in Las Vegas. This is the fifth annual Small Times (TM) Magazine Best of Small Tech Awards, which spotlight the top leaders and the biggest successes in nanotechnology, MEMS, and microsystems during the past year.

08/17/2006 — Applied Microstructures ships MVD150 series

Applied MicroStructures, a San Jose, Calif., provider of molecular vapor deposition equipment and contract deposition services, announced it has delivered its first MVD150 automated production system to a leading global manufacturer of MEMS devices for use in the deposition of anti-stiction layers.

08/28/2006 — Tegal nets repeat orders for 900 series etcher

Tegal Corp., a designer and manufacturer of plasma etch and deposition systems used in the production of integrated circuits and nanotechnology devices, announced that two leading Japanese companies had placed repeat orders for Tegal 900 series plasma etch systems.

08/25/2006 — PI announces new translation stage

PI of Auburn, Mass., announced its P-652 piezoelectric linear-motor driven translation stage.

09/05/2006 — Collaborating on aero and defense can be like shooting for the moon

The French city of Toulouse is an aerospace town. The headquarters of Airbus and the French National Center for Space Studies are nearby, as is Aerospace Valley, a French cluster of hundreds of companies and state bodies focused on space.

10/09/2006 — Bifano to lead BU Photonics Center

Boston University announced that Thomas Bifano, a professor in its College of Engineering, has been named director of the Boston University Photonics Center. Bifano has served as the center's interim director since January, when founding director Donald Fraser retired.

02/28/2006 — Bell Helicopter chooses Honeywell MEMS system

Bell Helicopter selected Honeywell to provide five key avionic products for the new Bell 429 helicopter, Honeywell announced this week. The centerpiece of the avionics is the new KSG-7200 Air Data Attitude Heading Reference System (ADAHRS).

02/28/2006 — Akustica launches single-chip microphone

Feb. 28, 2006 - Akustica, a builder of electronic products using MEMS technology, announced the availability of single-chip microphones. The Akustica microphone chips are small, thin, light devices designed to replace the electret condenser microphone, a fifty-year-old technology that has been used in billions of portable electronic devices.As a[...]

12/20/2007 — XCOM, IMT process makes RF relays more economical

XCOM Wireless Inc., a developer of radio frequency products, and Innovative Micro Technology, a MEMS contract manufacturer, say they have reached a "critical milestone" in producing a joint RF MEMS relay product.

12/27/2007 — Sensors strip off packaging with VTI chip-on-MEMS

VTI Technologies has developed manufacturing concepts that it says offer better ways of combining MEMS and ASIC technologies.

12/27/2007 — Explosives-on-a-chip improve military detonators

Developed by a team of scientists from the Georgia Tech Research Institute, tiny copper structures with pores at both the nanometer and micron size scales could play a key role in the next generation of detonators used to improve the reliability, reduce the size and lower the cost of certain military munitions.

08/02/2007 — ISE releases five-recipe controller for MEMS production

ISE has released a five-recipe temperature timer controller (TTC) is designed for use with virtually all process etch, strip, and develop wet-process baths.

08/09/2007 — launches idea-exchange platform has officially launched its membership-based network to join innovators and idea seekers.

08/20/2007 — Tegal sells plasma etch system to Japanese sensor and control maker

Tegal Corp., designer and manufacturer of plasma etch and deposition systems used in the production of integrated circuits, MEMS, and nanotechnology devices, has received an order for a Tegal 915 batch etch system from a leading Japanese sensor and control system maker.

08/22/2007 — Lam Research ships first 300 mm system for 3-D IC through-silicon via etch

Lam Research Corp. has shipped its first 300 mm 2300 Syndion etch system, designed for 3-D IC through-silicon via (TSV) etch applications.

12/26/2007 — Coventor software used in MEMS design contest

Coventor Inc.'s 3D MEMS Designer and Analyzer software has been selected by Hong Kong University and Kyoto University as the platform for a MEMS design contest.

12/14/2007 — Microvision has deal with Tier 1 auto supplier

Microvision Inc., a U.S. developer of light scanning technologies for display and imaging products, has signed a development agreement with an unnamed European supplier of automotive and industrial technologies.

12/21/2007 — Tong Hsing predicts MEMS will help drive 2008 sales

Tong Hsing Electronic Industries, based in Taiwan, said that it plans to extend its foothold into niche markets in 2008 and predicted that LED substrates and MEMS devices for projectors and the automotive sector will drive annual sales growth by more than 20 percent.

12/17/2007 — Omron's MEMS air flow sensor available from TTI

Omron's new MEMS-based air flow sensor, suitable for flow rate monitoring and dumper control in HVAC/VAV (variable air volume) applications, is now available through TTI. The D6F-P delivers uni- or bi-directional sensing; a key feature is its integrated, patent-pending dust-segregation system.

12/04/2007 — MEMSIC prices IPO

MEMSIC Inc. has filed a statement with the U.S. Securities and Exchange Commission setting its planned initial public offering at 6 million shares, with an estimated price range of $11 to $13 a share.

12/27/2007 — MEMSIC IPO raises $60 million

MEMSIC Inc., an Andover, Mass., company that develops MEMS technology for sensors and accelerometers, has raised $60 million in its recent IPO in a transaction that values the firm at $226 million.

06/21/2007 — ASM service to facilitate successful MEMS packaging

Recognizing that packaging and manufacturing are among the most crucial challenges facing MEMS engineers, ASM International has announced its MEMS Materials Database: Packaging Module to facilitate materials selection for MEMS packages.

08/31/2007 — SiTime surpasses MEMS production milestone of 100,000/week

SiTime Corp., developer of MEMS-based timing solutions, says that its SiT8002 and SiT1 oscillator families are shipping at a production rate of more than 100,000 units per week. This, the company says, makes these products the top-selling MEMS-based oscillators worldwide.

08/14/2007 — New AlwaysReady CEO Fred Allen to lead MEMS/nano commercialization

AlwaysReady, Inc. has named Dr. Fred Allen as Chief Executive Officer. AlwaysReady, Inc. was created in April 2007 to create shareholder value in mPhase's leading-edge nanotechnology battery and MEMS based products.

05/30/2007 — SVTC-TSMC partnership bridges MEMS development-production gap

Process development foundry SVTC Technologies has unveiled a technology incubation program with TSMC, the world's largest dedicated semiconductor foundry. The deal aims to streamline the transfer of designs to high-volume manufacturing. Small Times' Barbara Goode puts the announcement in context.

05/31/2007 — Yole's new MEMS foundry ranking reveals dramatic growth, key differences

In a just-released update to its MEMS Foundry Ranking, Yole Developpement reports that global MEMS foundry and contract manufacturing grew at a rate of 35% in 2006. The firm predicts similar growth for the next three years.

05/14/2007 — Micralyne and Polychromix partner for manufacturing

Micralyne Inc., an independent MEMS fabrication company, has announced a partnership with Polychromix, developer of inspection and analysis tools, to manufacture MEMS near-infrared (NIR) devices for the Polychromix's Phazir product line.

05/09/2007 — Boston Micromachines' MEMS advance multiphoton microscopy

Boston Micromachines Corp. says its MEMS-based deformable mirror products have helped realize achievements in multi photon microscopy, an advanced optical technique that increases the imaging depth in living tissue. Boston University's Biomedical Engineering Biomicroscopy Lab has recently demonstrated high resolution images of biological tissue using BMC's deformable mirrors in its multiphoton microscopy research.

05/25/2007 — MEMS enhance Microvision's PicoP display engine

Microvision Inc., developer of ultra-miniature projection display and image capture products for mobile applications, has announced new advancements to its PicoP display system.

05/02/2007 — SUSS targets MEMS production with double-sided alignment tool

SUSS MicroTec's new DSM200 is an automated metrology system for double-sided (front-to-back) alignment and exposure applications. The tool serves applications in the manufacture of MEMS devices, power semiconductors, and optoelectronics.

12/13/2007 — Oxford Instruments to equip new UK lab

Oxford Instruments has received an order for nine process tool systems worth more than £2.5m ($5m) to equip a new cleanroom facility at the University of Southampton in the UK, the company announced in a news release.

07/06/2007 — Melexis and UMC to deliver chips for automobile applications

After several years of collaboration, Melexis and UMC have delivered chips to market for diversified automotive applications, using UMC's 0.18um eFlash process and eFlash micro.

07/09/2007 — ISSYS wins patent for wireless, batteryless, implantable sensors

The U.S. Patent Office has granted to MEMS producer Integrated Sensing Systems, Inc. (ISSYS) a patent titled "System for monitoring conduit obstruction." The patent covers design and manufacture of a wireless implantable sensing system for non-invasive monitoring of pressure and/or pressure gradients in a cardiac conduit.

07/12/2007 — ICx launches "industry first" low-power MEMS CO2 sensor

ICx Photonics has launched its SensorChip CO2 4P, which it calls "a revolutionary technology" for carbon dioxide detection. ICx reduced power consumption from the original design of 132 mW down to 99 mW, and says it has produced the lowest power sensor of this type.

07/06/2007 — Semefab to offer U.K.'s first MEMS open access facility

Scotland semiconductor technology company, Semefab, is set to become the U.K.'s primary center for the design and development of MEMS and nano-systems, helping to drive advances in medicine, drug discovery, communications, and manufacturing in the U.K.

06/27/2007 — Tegal professorship to honor micro/nano pioneer Clarke

Tegal professorship at CSNI to honor Peter Clarke's micro/nano achievements

06/05/2007 — Knowles and Akustica agree to cross-license MEMS microphones

Immediately following product announcements by both Knowles Acoustics and Akustica, Inc., the two MEMS microphone suppliers now announce a cross-licensing arrangement that hopes to reinforce the partners' respective patent portfolios.

06/13/2007 — NemeriX/Bosch collaboration promises "revolutionary" vertical accuracy in MEMS GPS

NemeriX and Bosch Sensortec say they have successfully integrated their technologies to deliver a multi-sensing GPS solution that promises significantly enhanced results for navigating urban stacked road systems and multi-level bridges and tunnels.

01/08/2007 — MEMS in space: Draper inertial stellar compass fully operational

Draper Laboratory in Cambridge, Mass., announced that its Inertial Stellar Compass (ISC) is now fully operational on board the TacSat-2 spacecraft, representing the first use of a MEMS gyro in a complete spacecraft attitude determination system.

08/02/2007 — MEMS enables FormFactor's wafer test "breakthrough"

FormFactor Inc. says it has developed a breakthrough probing contact technology capable of full area wafer probing of high pin density, ultra fine-pitch devices. Compared to today's probing capabilities, FormFactor's new technology promises a 10x reduction in pitch (spacing between contacts), and potentially allow the probing of 1000x more contacts on a 300 mm wafer in a single touchdown.

08/03/2007 — First Nano ships first of its EasyTube 6000 systems for labs

First Nano, a division of CVD Equipment Corp., has shipped its first EasyTube 6000 chemical vapor deposition system. The unit is available with processes for research in the semiconductor, MEMS, nanotechnology, and solar cell markets.

01/10/2007 — Virtus to collaborate with Unimicron Group and affiliated MEMS foundry ChipSense

Virtus Advanced Sensors of Pittsburgh announced it has entered into a strategic collaboration agreement with several Taiwan-based UMC Group companies including Unimicron, Taiwan's largest printed circuit board (PCB) manufacturer and affiliated MEMS foundry ChipSense.

06/04/2007 — Knowles introduces MEMS ultrasonic acoustic sensor

Knowles Acoustics has introduced its Ultrasonic Acoustic Sensor (UAS) for use as a component to detect/receive ultrasonic sound in air. The Ultrasonic Acoustic Sensor uses MEMS innovations to provide performance over a wide environmental range. Sampling and low volume production is being offered now with mass production available beginning of Q2 2007. Pricing is comparative to current piezo ultrasonic receiving sensors on the market.

06/06/2007 — Nanomanufacturing supply chain reaches beyond R&D

The nascent nano supply-chain and production infrastructure shows signs of moving beyond R&D, says Small Times' Tom Cheyney, in our third report of findings from NSTI Nanotech 2007. He quotes keynoter John Hofmeister of Shell Oil (right).

06/07/2007 — Tronics and Alcatel partner on advanced MEMS DRIE

Tronics Microsystems SA and Alcatel Micro Machining Systems have announced a joint development project on DRIE for extreme-performance MEMS. The partners hope to establish a new performance benchmark for the MEMS industry.

06/08/2007 — Okmetic's high-uniformity SOI wafers promise super-sensitive MEMS

Okmetic Oyj, supplier of silicon wafers for MEMS sensors, says it has transferred highly homogeneous silicon on insulator (SOI) wafers into production. The new material reportedly enables greater sensitivity.

06/05/2007 — Fab Owners Association forms FOA Purchasing Partners, Inc.

The Fab Owners Association (FOA), the association of semiconductor / MEMS manufacturing executives and suppliers, has announced the formation of a semiconductor Group Purchasing Organization (GPO), to be called FOA Purchasing Partners, Inc. (PPI). PPI will be the official group purchasing organization of the FOA and its device maker members, providing procurement services, including aggregation of demand, contract negotiations and contract management for semiconductor manufacturing consumables.

06/15/2007 — Bennington Microtechnology and Apogee partner for process development

Bennington Microtechnology Center (BMC) has formed a process development partnership with Apogee Technology for manufacturing process design of Apogee's Sensilica pressure sensor line.

06/28/2007 — InvenSense's patented MEMS process addresses consumer market

InvenSense's patented MEMS process addresses consumer market

06/13/2007 — Chipworks and Yole partner for in-depth MEMS analysis

Specialists collaborate to deliver technical and business analysis

08/04/2004 — ADT announces first Series A close

Aug. 4, 2004 -- Advanced Diamond Technologies Inc. (ADT), a Champaign, Ill.-developer of nanocrystalline diamond, announced the first close of its Series A financing. The round is led by LaSalle Investments. An amount was not disclosed. ADT licenses a portfolio of diamond synthesis and application patents from Argonne National[...]

08/16/2004 — Report: MEMS move into consumer market

Aug. 16, 2004 - Drops in price and size are boosting the profile and proliferation of MEMS sensors in consumer electronics devices, according to a new report. "MEMS & Consumer Electronics: Growing up Fast," written by In-Stat/MDR senior analyst Marlene Bourne, said revenues for MEMS in consumer electronics are[...]

08/17/2004 — EV Group opens next customer center in Japan

Aug. 17, 2004 - EV Group, an Austrian maker of MEMS and semiconductor wafer processing equipment, has opened a second customer-support center in Japan. The center is in the city of Fukoka on the island of Kyushu, an area that accounts for nearly one-third of Japan's semiconductor production, according to[...]

08/24/2004 — Q2 report: Funding data strong despite weaker IPO market

Despite a weakening stock market and the withdrawal of a high-profile nanotech IPO, don't expect the pace of small tech investment to slacken much. That's the message from investors, who put $222.5 million into 29 companies involved small tech in the second quarter. The amount invested and the number of deals is up over the first quarter.

08/19/2004 — Lifetime testing focus of MEMS conference

Aug. 19, 2004 - This year's MEMS Technology Roadmap and Industry Congress (METRIC) -- the annual meeting of the MEMS Industry Group -- will be a sequel of sorts. The Pittsburgh-based trade association said the Sept. 29-30 conference in its hometown will focus on accelerated lifetime testing. The group considers[...]

01/19/2004 — SensoNor chooses SUSS tools for tire sensors

SensoNor ASA (News, Web) has chosen SUSS MicroTec AG's (News, Web) MEMS production systems to make tire pressure sensors, according to a news release.

01/21/2004 — BioMEMS firm Proteus raises $5.3 million

Proteus Biomedical, a Menlo Park, Calif., developer of MEMS devices to treat congestive heart failure, raised $5.3 million in a Series B round of financing, according to the company's chief executive. The company’s Series A was a seed round.

01/22/2004 — Asia-Pacific governments invest in nano labs and research centers

A number of new research parks have opened in the Asia-Pacific region in the past few months, illustrating an increased level of commitment by local governments toward investment in nanotechnology and related fields. Among the new centers is Singapore's Biopolis research park, aimed at establishing bio and nanotech businesses.

01/13/2004 — Small tech tackles concussion syndrome with MEMS helmets

By the time the 2004 football season rolls around, scientists at Virginia Tech expect small tech to help them better understand how gravitational force triggers head trauma. Researchers say the key to unlocking those secrets lies in data gathered from specially designed helmets equipped with MEMS accelerometers. Selected Virginia Tech football players wore the special headgear during the 2003 season.

01/27/2004 — Analog announces tiny new accelerometers

Analog Devices Inc. (NYSE: ADI, News, Web), a Norwood, Mass., developer of MEMS and integrated circuits for analog and digital applications, introduced its ADXL32x family of iMEMS accelerometers.

08/31/2004 — MEMS researchers perfect fabrication of atomic clock

A Colorado-based government lab has moved forward in its quest to make a precise clock available to more industries. Researchers with the National Institute of Standards and Technology(NIST) reported last Friday that they have developed the core technology for a MEMS-based atomic clock.

08/23/2004 — IMT gets 2nd grant for cell purifier

Aug. 23, 2004 - The Defense Advanced Research Projects Agency (DARPA) has awarded Innovative Micro Technology (IMT) $2.3 million to continue development of a MEMS-based system for purifying human blood stem cells. Santa Barbara, Calif.-based IMT said the Phase II study allows it to improve the cell processing[...]

08/03/2004 — Prospects for nanomaterial windows take flight

A window on military aircraft, whether it is a canopy on a fighter jet or the covering on an infrared sensor, faces a far different environment from its counterpart on land. It must be exceptionally sturdy to withstand being battered by debris at high velocities, yet remain transparent to allow the pilot to see out, or the infrared signal to reach in.

08/26/2004 — Companies that began with defense funding look for diversity

Defense contracts, the boon and bane of many a young technology startup, have been welcomed by several small tech firms in the Pacific Northwest. These are welcome sales for young companies trying to build a revenue base. But government project delays and shifting defense priorities make this base a shaky one.

03/15/2004 — Small Times Magazine names 2004 Top 10 Small Tech Hot Spots

Which states lead the race to become hot spots in nanotechnology, MEMS and microsystems? Small Times magazine features its yearly list of the Top 10 Small Tech Hot Spots in its March/April issue, due out next week.

03/15/2004 — California is top small tech state; Why? Just follow the money flows

Small tech companies' ability to ferret out federal awards is critical for their growth, especially when venture capital is tight. Small Times identified hundreds of companies selected to receive federal grants in 2003 as part of its annual analysis of small tech’s leading states. This year’s final ranking placed California in the lead, followed by Massachusetts.

03/05/2004 — MEMSIC opens China fab

MEMSIC Inc., a North Andover, Mass., developer of CMOS-based MEMS accelerometers, opened a 45,000-square-foot manufacturing facility in Wuxi, Jiangsu Province, China, according to a news release.

03/15/2004 — Akrion acquires equipment supplier Verteq

A subsidiary of Akrion LLC, an Allentown, Pa.-based maker of equipment for cleaning MEMS and other semiconductor-related devices, has acquired Verteq Inc., according to a news release.

03/18/2004 — Taiwan institute selects SUSS tools

Taiwan's Industrial Technology Research Institute (ITRI) has selected SUSS MicroTec AG's (News, Web) wafer and direct bonding equipment for expanding its MEMS and nanoscale activities, according to a news release.

03/30/2004 — Polychromix bucks offshoring trend, unveils new Mass. plant

Put yourself in Polychromix’s shoes. You endured the telecom shakeout. You raised some venture money. You recently rolled out a product and have some orders. It would appear to be time to set up offshore manufacturing. Instead, the 25-person optical equipment startup is expected to unveil a new manufacturing facility in Wilmington, Mass., today.

08/16/2005 — Akrion ships system to MEMS manufacturer

Aug. 16, 2005 -- Akrion Inc. announced receipt of a purchase order for a GAMA Series pre-diffusion cleaning tool. The $2.5 million system will ship to a repeat customer's MEMS device manufacturing facility on the west coast of the United States. The company says the 200mm system incorporates its[...]

08/24/2005 — Company, lab to make MEMS explosives detector

Aug. 24, 2005 -- Sense Holdings Inc. (OTC.BB: SEHO), a Fort Lauderdale, Fla., provider of biometrically secured identification systems and homeland security solutions, announced that the company has entered into an agreement with Oak Ridge National Laboratory for the launching of the first phase of a joint development project[...]

09/26/2005 — Eksigent moves to new facilities

Sep. 26, 2005 -- Eksigent Technologies announced that it has relocated its corporate headquarters to the Creekside Business Park in Dublin, Calif. The new 43,000 square-foot facility will double the company's original space and will accommodate research and development, operations, manufacturing and shipping, as well as sales and marketing[...]

09/22/2005 — Akustica joins mobile phone alliance

Sep. 22, 2005 -- Akustica Inc., a Pittsburgh developer of acoustic MEMS system-on-chip products, announced it has strengthened its commitment to the cell phone market by joining the Mobile Industry Processor Interface (MIPI) Alliance as an Adopter Member. Akustica says it is the only dedicated MEMS manufacturer on the list[...]

09/29/2005 — MEMSIC releases tri-axis accelerometer

Sep. 29, 2005 -- MEMSIC Inc., a leading provider of CMOS-based MEMS accelerometers, announced volume production availability of the MXX9000 tri-axis accelerometer available with both ratiometric and PWM outputs. The accelerometer, as is the case with all Memsic products, is offered in a RoHS compliant ceramic LCC package. The device[...]

09/02/2005 — NextEnergy appoints new board members

Sep. 2, 2005 - NextEnergy, a Michigan-based non-profit advanced energy initiative, announced the appointment of Michael Boulus, Robert Buckler, Lana Pollack and Chris Rizik to its board of directors. Boulus is executive director of Presidents Council, State Universities of Michigan. Buckler is president and chief operating officer for DTE Energy[...]

09/21/2005 — They're in the money: pair of nano financings announced

Two large nanotech-related private financings were announced on Tuesday. Molecular Imprints raised $17 million in the first closing of a Series C round. Kereos announced a $19.5 million Series B.

10/05/2005 — Amtech Systems receives $1.2 million in new orders

Oct. 5, 2005 - Amtech Systems Inc. (Nasdaq:ASYS), a supplier of production and automation systems and related supplies for the semiconductor, silicon wafer, solar cell and MEMS sectors, announced two new orders for its Tempress brand diffusion furnaces totaling $1.2 million. The orders are from a customer that produces[...]

10/05/2005 — Ask the experts: Eyes on exit markets

As of midsummer, stock markets in the United States had largely ignored micro and nanotechnology. However, nanotech-related companies went public in Germany and England. What gives?

10/05/2005 — Tegal ships Endeavor tool to wireless device supplier

Oct. 5, 2005 -- Tegal Corp. (Nasdaq:TGAL) announced it had shipped an Endeavor AT PVD cluster tool to be used by a leading analog and mixed signal device supplier. The devices are used in a wide variety of wireless, networking and cell phone applications. The tool, valued at $1.2[...]

10/27/2005 — SUSS announces trio of wafer bonder orders

Oct. 27, 2005 -- SUSS MicroTec, an equipment supplier for MEMS manufacturing and testing, received three purchase orders from leading device manufacturing companies for its production wafer bonder ABC200. The orders, which the company says were worth a total of more than $4 million, were received in September and October[...]

08/04/2004 — Magnetic sensors turn cell phones into locators

Honeywell is making millions of the anisotropic major mobile phone makers. The sensor-enabled phones are being launched this year – first in Europe, followed closely by Asia. Eventually, the technology will make its way to phones manufactured in the U.S.

08/19/2004 — Oki set to enter MEMS sensor market

Aug. 19, 2004 - Oki Electric Industry Co. has developed its first MEMS-based product, a tri-axis accelerometer module. The Tokyo-based company said the ML8950, a sensor chip combined with an integrated circuit, is designed for mobile phones as well as other consumer electronic and entertainment products. The module, which Oki[...]

08/09/2004 — Focus on energy: Nation’s electric grid needs overhaul

Chances are, the electric grid of the future will look a lot like the grid of today. But certainly it won’t behave the same as today’s grid, whether it undergoes an overhaul, upgrades or is left unchanged. The grid is a dynamic and complex construct linking power generators, substations and transmission lines across continents.

08/11/2004 — Focus on energy: Nanotech extracts benefits for oil industry

Big oil companies such as ChevronTexaco Corp. and ConocoPhillips Co. have dedicated resources to researching and developing micro and nanoscale technologies for exploration, production or refining. Their efforts include investing in or collaborating with startups, and establishing in-house business units.

08/17/2004 — Focus on energy: Sensors head for lower cost, more miniaturization

Wireless sensor network developers have had to refine hardware and software so that sensing modules will get three, five or 10 years of working life from the coin cell batteries that power them. For industrial tasks such as monitoring temperature, humidity and vibrations throughout a semiconductor fab or power plant, wireless sensor nets are designed to improve productivity.

03/04/2004 — Ion Optics picks IMT for sensor chip fab

Ion Optics Inc., a Waltham, Mass., developer of optical MEMS gas detection sensors, announced that it is working with MEMS manufacturer Innnovative Micro Technology (IMT) of Santa Barbara, Calif., to move its SensorChip products into production.

03/31/2004 — MEMS doesn’t spell auto opportunity, despite market report

A recent report from a French market research firm says the market for MEMS gyros and accelerometers is growing, but industry experts say that does not necessarily mean more opportunity for independent MEMS makers.The report, released earlier this year, said the market should be strong the next few years as growth in gyros outpaces that of more established accelerometers and gyro costs come down.

03/01/2004 — Verimetra shares fetal heart grant

Verimetra Inc., a Pittsburgh-based maker of MEMS devices for the medical industry, received a $100,000 grant to develop tools and technologies that would help surgeons perform fetal heart surgeries.

10/20/2005 — IMT announces results for MEMS rare cell purifier

Oct. 20, 2005 -- Innovative Micro Technology announced that it has demonstrated integrated operation with its rare cell purification system, including sorting viable human cells at high speeds with greater than 95 percent purity. The device is based on MEMS technology. In its final configuration, the company says it will[...]

10/07/2005 — Apogee sells audio division, refocuses on MEMS and nanotech

Oct. 7, 2005 -- Apogee Technology Inc. (AMEX: ATA), a provider of audio integrated circuits and an emerging MEMS device supplier, reported that it has sold the assets of its audio division, including its Direct Digital Amplifier technology to SigmaTel Inc.The engineering and marketing staff related to the audio[...]

10/13/2005 — ST launches new tri-axis accelerometers

Oct. 13, 2005 - STMicroelectronics, a supplier of MEMS devices, announced that it has expanded its portfolio of three-axis accelerometers with three new models designed to address different system needs from hard disk drive protection to motion user interfaces. The company's LIS3LV02DQ features adjustable bandwidth and direction detection, as well[...]

03/26/2004 — A few billion years in development, biomimetics emerge at last

In the 1940s, Swiss engineer George de Mestral returned from a hike with his dog and discovered that his pants and his pooch’s coat were covered with cockleburs. Examining the burrs’ hooks under a microscope, de Mestral was struck with an idea for a fabric fastener. Velcro was born. Velcro is the quintessential example of biomimetics.

03/23/2004 — Where's the road to the 'last mile'? Perhaps in the packaging

Industry watchers predict 2004 will see progress in getting “fiber to the home” – telecom’s long-sought solution to the problem of directly delivering high-quality and high-speed video, voice and data. But the rollout still moves at a glacial pace because of the high costs of deploying fiber-optic networks to individual homes and businesses. Two Danish firms hope to offer some price-busting help in a small package.

03/08/2004 — Nanochip to make memories with $20 million more

Armed with new investment, Nanochip Inc. expects to make a memorable impact on the removable storage market. The Oakland, Calif., firm today received $20 million from a syndicate of institutional and industry investors, including Microsoft Corp. That is about $5 million more than the company sought during its second funding round.

03/09/2004 — Hymite raises $12 million for MEMS packaging

Hymite A/S, a Denmark-based manufacturer of silicon-based hermetic packages for optoelectronic and MEMS components, announced it closed a second round of financing for $12 million.

04/09/2004 — Knowles Acoustics links with Sony, MEMSCAP

Knowles Acoustics of Itasca, Ill., has selected MEMSCAP SA (News, Web) and Sony Semiconductor Kyushu Corp. to make its MEMS microphone wafers, according to news releases.

04/06/2004 — MEMS technology magnifies opportunities for low-cost SEM

NOVELX wants to do to the optical microscope what computing did to the slide rule: make it obsolete. The two-man startup plans to use MEMS technology to build a miniaturized modular scanning electron microscope for commercial and defense markets."We want to build an SEM at a cost similar to an optical microscope, with a footprint similar to an optical microscope, that gives the resolution they would get with a top-of-the-line SEM," said James Spallas of NOVELX.

05/03/2004 — Orthonics gets funding for spinal repair work

May 3, 2004 -- Orthonics Inc., an Atlanta-based spinout of Georgia Institute of Technology, received initial funding from New York-based venture firm Viscogliosi Brothers LLC to develop microfabricated biomaterials for spinal disc repair and regeneration, according to a news release. The funding provides a private-sector match for the company's grant[...]

10/21/2004 — Serial entrepreneurs: True tales from industry veterans

Serial entrepreneurs, they're called. The phrase refers to those who by choice or force leave one venture to start or lead another. It isn't always pretty, but neither is the business world. Here, a few of small tech's survivors provide answers to questions posed by Small Times' Jeff Karoub.

04/28/2004 — Increasing demand for microfluidics leads to market optimism

Microfluidics, or the manipulation of minuscule amounts of fluids, got a good deal of attention at Germany's Hanover Trade Fair last week. The technology has matured and its wide range of potential uses has become more apparent. "More people are recognizing the possibilities of microfluidics," said Remco A. de Vos, marketing manager at Micronit Microfluidics B.V. in the Netherlands.

04/27/2004 — NanoVance creates one-stop nano shop

April 27, 2004 -- Several veterans of the micro- and nanotechnology industries have launched a new company that bills itself as a full-service nanotechnology device provider. NanoVance Inc., based in Austin, Texas, will use the fabrication capacity and technical expertise of its partners to design, develop, manufacture, package and test[...]

04/01/2004 — IntelliSense launches piezo MEMS modeling tool

IntelliSense Software Corp has launched tools for modeling piezoresistive and piezoelectric MEMS devices that could be used for energy and communications, according to a news release.

09/30/2004 — Unifying approaches sought at MEMS conference

PITTSBURGH, Penn., Sept. 30, 2004 - MEMS industry leaders say interest is growing in sensors and other microsystems, and that hurdles to broader market acceptance include myriad approaches to proving reliability and making devices. The two issues were discussed Wednesday at METRIC, a two-day annual meeting of the MEMS Industry[...]

09/28/2004 — Honeywell, Sioptical to co-develop MEMS-based components

Honeywell International Inc. and SiOptical Inc. announced Friday that they will develop MEMS-based components for next-generation communication networks for military and commercial use. The companies will work together to produce two technologies for faster, better performing communications networks by 2006.

10/11/2004 — 'Don't be afraid to brand nano,' says Wilson exec

Should you brand nanotechnology? Wilson Sporting Goods sees no fault in serving it up strong. In ordinary tennis rackets, tiny voids exist between individual carbon fibers that can create stress and weak points. In Wilson’s nCode racket, nanoscale crystalline structures fill those voids and boost the racket's power.

10/05/2004 — MEMS, aka 'Big Nano,' seeks to elevate its political profile

Although nobody predicts a MEMS sequel to the nanotech bill signed into law last year, some say it is the right time for micro to raise its profile in Washington. Nanotech's bigger, older cousin has real revenues coming from major players. The industry also has a history of support from DARPA.

10/19/2004 — Stabilizing MEMS system lifts hovering vehicle’s chances

Honeywell successfully completed flight tests in August for an aerial surveillance vehicle designed to scope out places too dangerous for soldiers. The aircraft proved it could take off vertically, dart about, hover over a point of interest and redirect itself and land.

09/02/2004 — COMS 2004 kicks off with upbeat look at state of industry

With more than 320 delegates registered at the annual Commercialization of Micro and Nano Systems (COMS) Conference, held this year in the Canadian city of Edmonton, Alberta, those in attendance were told that small-tech gold isn’t totally out of reach.

09/27/2004 — True tales from PR industry veterans

Do you ever wonder what public relations folks really think about every tool or technology they have to promote? Well, they’ll never tell. But you may gain insights – if not a free tip or two – from the small tech PR veterans below. Most received behind-the-scenes help from colleagues.

05/28/2004 — FBI taps MicroFluidic Systems for DNA analyzer

MicroFluidic Systems Inc. (MFSI) is developing a device to automatically analyze DNA during criminal investigations, courtesy of an FBI contract.

05/20/2004 — ADI sells MEMS sensors to InFocus

Analog Devices Inc. (ADI) is providing accelerometers to InFocus Corp. to correct image distortion in two projectors.

05/14/2004 — MicroFluidic Systems gets $4.5M

MicroFluidic Systems Inc. has received a $4.5 million contract from the U.S. Department of Homeland Security to develop and build an automated system to identify airborne pathogens, according to a news release.

05/19/2004 — Microfabrica delivers RF parts for Air Force

May 19, 2004 -- Microfabrica Inc., a Burbank, Calif.-based microsystems fabrication firm, has delivered to the Air Force Research Laboratory a series of radio frequency and microwave devices based on Microfabrica's EFAB technology, according to a news release. Air Force engineers at the Antenna Technology Unit conceived and designed[...]

05/06/2004 — Wanted: Skilled nanotechnology workers; Anyone? Anyone?

Even at this early stage in nanotechnology business development, some labor shortages are starting to show up. In the short time the nanotech career site Working In Nanotechnology has been active, one of the site's creators has noted "a shortage of skilled workers in what I call the middle market at the Ph.D. level."

05/06/2004 — Glimmerglass links with MEMSCAP

May 6, 2004 -- Glimmerglass Networks Inc. has selected MEMSCAP SA (News, Web) as a key supplier for its MEMS-based photonic switches, according to a news release. The Hayward, Calif.-based microphotonics firm said it's using France-based MEMSCAP's North Carolina manufacturing facility for volume production of its products. Glimmerglass' switching[...]

05/14/2004 — Q1 funding report: VCs proceed cautiously despite IPO anticipation

Despite the year’s first nanotech IPO in April and another likely coming this summer, small tech funding activity is continuing to proceed at a measured pace. Twenty-six companies raised $173.6 million in the first quarter, versus the same number of deals and $183.2 million raised in the year-earlier period.

09/20/2004 — Radant takes lead in race to bring MEMS RF to market

With only 25 employees and barely two years old, Radant Technologies has taken the lead in a race to bring MEMS-based radio frequency switches to market. It squeezed out defense-contracting giants Northrop Grumman and TRW Corp. along the way, and now has a $5-million government grant.

09/17/2004 — MEMS may make smart homes more affordable

Smart homes, those high-tech houses where the lights, sprinkler systems, appliances and heating and cooling systems all communicate through Web-based wireless networks, still appear to be only for the very wealthy. Thanks to MEMS, the basic building blocks are actually there for bringing intelligent homes to the masses.

09/09/2004 — Qualcomm to acquire Iridigm Display

Wireless communications firm Qualcomm Inc. announced plans Thursday to acquire Iridigm Display Corp., a MEMS-based, flat panel display maker. Qualcomm, which originally invested in Iridigm in 2002 and followed up in July of this year, said it would pay about $170 million for the 86 percent of Iridigm it does not own.

12/20/2004 — Colibrys acquires Applied MEMS

Dec. 20, 2004 -- Colibrys SA of Neuchatel, Switzerland announced it has completed the acquisition of the Applied MEMS subsidiary from Stafford, Texas-based Input/Output Inc. (NYSE: IO). The all-stock transaction is intended to increase the privately held Colibrys' competitiveness in the MEMS fabrication sector. The company will continue to operate[...]

12/06/2004 — Software, tools key markets in China

In 2003, the Chinese government selected Cary, N.C.-based Coventor and its suite of design tools as the software provider for its MEMS program, an initiative to build the nation's microsystems capabilities through universities and companies. The deal is among several recent agreements between the Chinese government and U.S.-based businesses.

12/13/2004 — Former steel city Dortmund recasts itself as a micro hub

MST.factory Dortmund will be a 21,000-square-foot center serving as an incubator for startups, joint ventures, and research and development groups. Services will include prototyping and development work, as well as consulting and training. The center also will rent space for offices, laboratories and clean rooms.

10/18/2004 — Japan's Oki set to enter MEMS sensor market

After several years of helping others bring MEMS to market, a Tokyo-based fab facility is launching its own line. Oki Electric Industry Co. Ltd. has developed a tri-axis accelerometer module designed for mobile phones as well as other products. Oki expects to send sample shipments in October to Japanese and North American customers, and ramp up to high volume by April.

10/04/2004 — Firms get over $20 million for micro and nano products

Companies developing micro and nanotechnology-related products will receive more than $20 million from the federally funded Advanced Technology Program beginning this month. The funding makes it easier for companies to take on otherwise fiscally risky projects, according to the recipients.

07/19/2004 — Measurement Specialties acquires Entran

July 19, 2004 - Measurement Specialties Inc. (Amex: MSS, News, Web) has acquired micro sensor maker Entran Devices Inc. of Fairfield, N.J., and its French affiliate Entran SA . Measurement Specialties, a MEMS sensor maker also based in Fairfield, is expected to close Monday on the $9.5-million deal. It[...]

07/27/2004 — Athena Technologies unveils SensorPac

July 27, 2004 -- Athena Technologies, a Warrenton, Va., developer of dynamics and control technology for flight control and other systems, announced its SensorPac, an all-in-one flight control and inertial navigation system instrument. The device combines GPS, autopilot and other features and weighs less than 1.75 pounds. It uses[...]

07/27/2004 — Doctors test sensor-enabled tool for fetal heart surgery

Verimetra Inc. and a Pittsburgh-based team of medical and robotic researchers have begun testing what could lead to groundbreaking fetal surgeries. The group met in June to begin animal tests with a sensor-enabled surgical tool that one day could repair a defective fetus heart while measuring the blood flow and providing other tactile feedback to surgeons.

07/16/2004 — MEMS update: 2004 likely to be banner year

The first half of 2004 is looking a lot like the last half of 2003 for the MEMS industry, only better. If trends continue, 2004 will be a banner year, or in the very least, an interesting successor to 2003. Year-to-year revenues were up 35.7 percent in 2003 from 2002, with much of that occurring in the last half of 2003.

07/12/2004 — Active Spectrum switches gears with wireless

Active Spectrum Inc. has a bold vision. It wants to kick in the locked doors of wireless communication. Right now, makers of wireless devices — from military contractors to cellular handset giants like Nokia and Samsung — can only build devices that communicate on a specific frequency. None can talk to devices that use other frequencies, unless they include additional transceivers for those other frequencies.

02/02/2004 — Polychromix raises $8 million

Feb. 2, 2004 -- Polychromix Inc. (Profile, News, Web), a Woburn, Mass., developer of MEMS products for optical networking, raised $8 million in second round of funding, according to a news release. New investor Siemens Venture Capital (News, Web) and existing investors Seed Capital Partners (News, Web) and Vanguard Ventures[...]

02/04/2004 — Kionix lures new MEMS investors

Kionix Inc., an Ithaca, N.Y. provider of MEMS products, brought on a slew of new investors to close a $28.5 million second funding round, according to Greg Galvin, president and chief executive.

02/05/2004 — Customer-focused small tech companies were rewarded in '03

Small tech accounted for 4.9 percent of the $4.9 billion in venture capital invested in the United States during the fourth quarter. Typical for the year was the experience of Kionix Inc., which managed to raise VC funds by focusing on market opportunity rather than sexy technology. Not surprisingly, California dominated the states list, with 10 deals worth $69.6 million in Q4.

02/12/2004 — MEMS USA hires executive, going public

MEMS USA Inc. (OTCBB: MEMS, Web has hired an executive in charge of operations and technology while it goes public.

02/19/2004 — Teravicta takes $6 million round

Teravicta Technologies Inc., an Austin, Texas, developer of RF MEMS switches and integrated products, raised $6 million in a second round of funding, according to a news release.

02/20/2004 — AML drops MEMS design, foundry services

Applied Microengineering Ltd., a U.K.-based MEMS equipment supplier, is giving up on its design house and foundry services and reverting to more traditional fabrication of MEMS chips, according to a news release.

02/23/2004 — Micralyne signs MEMS manufacturing deal

Micralyne Inc., an Edmonton, Alberta, based MEMS manufacturer, has signed a contract worth more than $2 million to make components for chemical analysis instrumentation, according to a news release.

02/23/2004 — Olympus adds optical to foundry services

Olympus Partnership Development Group (Profile, Web) has added an optical foundry to its MEMS design and manufacturing facility, according to a news release.

06/08/2004 — Microvision gets a heads-up on auto service market

When we think of head-up displays, we tend to think of supersonic jet pilots careening through the upper atmosphere with data hovering before their eyes. But Microvision, a maker of MEMS-based head-up display technology, is also pursuing more common niches like wearable displays for auto technicians. The firm is ramping up to sell a $3,995 device called the Nomad Expert Technician System.

06/10/2004 — Crossbow integrates GPS with MEMS

June 10. 2004- Crossbow Technology Inc. has launched a series of systems that provide navigation, position and leveling information to air and watercraft. The NAV420 series packs MEMS-based accelerometer and gyro clusters with a global positioning satellite receiver and other sensors and software in a 3-inch cube. San Jose, Calif[...]

06/16/2004 — MEMSCAP sensor cleared for takeoff

June 16, 2004 - An aircraft supplier has selected MEMSCAP SA's (News, Web) pressure sensor for a new line of cockpit instruments, according to a news release. The France-based MEMS maker will provide Clearwater, Fla.-based Aerosonic Corp. its TP 3100 pressure sensor in microprocessor-based instruments, including a standby altimeter[...]

06/08/2004 — Cavendish announces memory technology

Cavendish Kinetics, a Holland-based semiconductor company working to integrate MEMS devices into standard CMOS processes, announced its Nanomech technology for creating submicron structures for use as computer memories.

06/09/2004 — Kodak’s new image: Century-old firm develops nano strategy

You don’t have to be a professional futurist to see that the days of conventional film are numbered. Sales of digital cameras now outpace those of film. Digital cameras are increasingly cheaper, easier to use and often take better pictures. Nice for consumers, but nothing short of scary for a company like Kodak that generates enormous revenues from film sales.

06/15/2004 — New low-g accelerometer unveiled by Freescale at Sensors Expo

Sensors have long been on the short list of next big things. And this year’s Sensors Expo clearly showed that the benefits made possible by sensors span a wide array of applications. And if the Sensors Expo showed the variety of markets served by sensors, it also showed how hard companies like Freescale Semiconductor are working to create new markets for sensors.

06/30/2004 — Two MEMS sensor lines aim to please on greens and in streams

Paul Kolen and Noel Perkins are independent innovators 2,000 miles apart. But the professors share a passion for microsensors, and moving them out of their labs. Kolen licensed his Inertial Magnetic Motion Capture technology as a golf club maker, while Perkins developed his own motion sensor-based device that provides data on a swing or an angler's casting technique.

06/16/2004 — MEMS sensors may speed work of jet engine designers

NASA made quite a bit of noise in late March when it successfully deployed its X-43A aircraft in a 10-second test flight. The craft reached a record-breaking – and ear-shattering – Mach 7 before beginning its descent toward the Pacific Ocean. It was powered by a scramjet engine, the shortened term for supersonic combustion ramjet. NASA and the military are developing the engines for next-generation missiles, aircraft and space vehicles.

06/25/2004 — Manned mission to Mars could drive change

A manned mission to Mars may be one of the greatest technological challenges ever attempted by humankind. To meet such a mission's unprecedented requirements, considerable innovation is needed to further reduce weight, energy consumption and maintenance requirements.

06/23/2004 — You say you want a one-chip solution? Firms say soon

Consumers could soon find a little more – and less – in their mobile phones, thanks in part to the packing power of integrated microsystems. Agilent Technologies, Discera Inc. and Intel Corp. have announced progress in developing modules that combine such components as filters, antennas, duplexers and oscillators. One way or another, they all are taking steps toward the ultimate goal of one-chip integration.

01/07/2004 — Movaz Networks' MEMS picked for NSF project

Movaz Networks Inc.'s MEMS-based optical switch technology has been selected for a U.S. government optical network project, according to a news release.

01/12/2004 — New video offers intro to MEMS

The MEMS Industry Group has launched an educational video aimed at introducing MEMS to a new audience.

01/08/2004 — Europe's MEMS research program surprisingly spawns startups

While many economic regions around the world are trying to foster startup company growth à la Silicon Valley, Europractice, a European research program, has inadvertently spawned more than a dozen small tech startups. The idea was to serve the industry, but a number of researchers just couldn't resist the temptation to go into business for themselves.

01/14/2004 — H&H picks its next president

Harris & Harris Group Inc., announced that Douglas Jamison will become president, chief operating officer and chief financial officer on January 1, 2005 after the retirement of Mel Melsheimer, current president, COO and CFO.

01/15/2004 — Nanotech VC to join Harris & Harris and open West Coast office

In another sign that the nascent nanotechnology sector is evolving into a viable area of specialization, Harris & Harris Group Inc. announced this morning that Daniel Leff, a senior associate at Sevin Rosen Funds, will join the firm as executive vice president and managing director on Jan. 19. Leff will establish and run the firm’s West Coast office in Los Angeles.

07/02/2004 — Is telecom ready to embrace MEMS-based solutions?

Three years ago, optical networking was a highly anticipated end use for optical MEMS. Just as the buzz reached a fever pitch, the market collapsed and all opportunity evaporated. Now that the market appears to be coming back to life, a critical question must be asked: Is telecom finally ready to embrace MEMS-based solutions? And if so, then is this market still worth pursuing?

09/16/2004 — MEMSIC's sensors selected for in-car navigation system

Sept. 16, 2004 - An Amsterdam-based provider of personal navigation devices has selected MEMSIC Inc.'s thermal accelerometers to help determine travel distance in a car-based product, according to a company news release. TomTom BV will use North Andover, Mass.-based MEMSIC's sensors in its TomTom GO, a navigation system[...]

09/21/2004 — MicroFluidic Systems, Quantum Magnetics to make biothreat detector

Sept. 21, 2004 - MicroFluidic Systems Inc. (MFSI) is teaming up with Quantum Magnetics  to develop an automated system to identify airborne pathogens such as bacteria, viruses and toxins, according to a news release. Pleasanton, Calif.-based MFSI has been awarded a contract by the Department of Homeland Security's Homeland[...]

02/23/2004 — Lightconnect launches VOA for wireless

Lightconnect Inc., a Newark, Calif., MEMS component supplier, has launched a variable optical attenuator for free-space optical (FSO) communications, according to a news release

02/20/2004 — Gyros to go: Sensors will keep moving for military, auto

Vacuum cleaners that are self-directed, jogging suits that tell you when to run faster, robots that dance. The new millennium brought with it a focus on “smart” devices. Being able to sense rotational movement adds an extra layer of precision and smarts for more-complex next-generation systems – and this is where gyroscopes come into play.

02/20/2004 — Grenoble-based MEMS company shuts down

PHS MEMS, a Grenoble, France-based MEMS designer and manufacturer, has made a "crash landing," in the words of a news release issued today after the company closed its operations and began dismissing its 95 employees.

02/26/2004 — Colibrys, Bookham link on optical MEMS

Colibrys SA (News, Web) and Bookham Technology PLC have teamed up to make smaller and cheaper optical products, according to a news release (PDF, 45.7 KB).

07/21/2004 — Nano takes to the Street: Second IPO ready to go

Just two short years ago, the idea of a micro- or nanotechnology company going public was, well, wishful thinking. There were fewer than 100 IPOs in 2002, with 22 venture-backed, compared to nearly 500 in 1999.

07/26/2004 — MEMS Tech IPO oversubscribed

July 26, 2004 -- The IPO of MEMS Technology Bhd (MemsTech) has been dramatically oversubscribed, according to Malaysian newspaper reports. The Malay Mail said the public portion of the offering has been oversubscribed by over 151 percent, saying a total of 22,861 applications had been received for 228,893[...]

06/15/2004 — MEMS integrator raises almost $2 million

June 15, 2004 -- SENSE Holdings Inc. of Fort Lauderdale, Fla., has announced a $1.96-million private placement. The financing consists of common stock and warrants issued to accredited investors through investment bank Joseph Stevens & Co. of New York, according to a news release. SENSE received net proceeds of[...]

06/21/2004 — MemsTech on board with products, public offering

As MemsTech is preparing to raise money, it is also raising its profile as a product-oriented company. The Singapore-based company is planning an initial public offering this summer on Malaysia's Mesdaq market. MemsTech expects to raise about $15 million for research and development. But MemsTech wants to be seen as more than the sum of the services it provides.

06/30/2004 — Report: Interest, investment increasing for MEMS

June 30, 2004 - After a lackluster start in 2003, the MEMS industry experienced increases in customer and investor interest during the past several months. A new report finds the trend is expected to continue during the next several years. "Step-by-Step to Success: 2004 MEMS Industry Overview and Forecast,"[...]

01/21/2004 — Report: Market for MEMS sensors growing

The market for MEMS gyroscopes and accelerometers should continue to be strong during the next few years, with gyros growing at an even faster rate as the technology matures and costs come down, according to a new report.

01/28/2004 — Ion Optics closes $4 million round

Ion Optics Inc. (News, Web), a Waltham, Mass., developer of MEMS-based gas sensors and other products, closed a $4 million Series C round of financing, according to a news release.

01/28/2004 — MEMS group names new managing director

The MEMS Industry Group, a Pittsburgh trade association representing the MEMS and microstructure industry, promoted Ellen McDevitt to the position of managing director.

01/22/2004 — MEMSCAP launches new version of design tool

MEMSCAP SA (News, Web), a France and Silicon Valley-based MEMS designer and manufacturer, released a second version of its MemsMaster design tool, according to a news release.

01/23/2004 — Microbridge chooses German foundry

Microbridge Technologies Inc., a Montreal-based microsystems developer, has chosen X-FAB Semiconductor Foundries AG to make its microresistor device that adjusts the electrical current flow of components in a circuit.

02/13/2004 — NASA grants ISSYS some MEMS money

Integrated Sensing Systems Inc. (ISSYS) (Profile, News, Web) received a Small Business Innovation Research (SBIR) contract from NASA to continue its work on MEMS sensors for medical and space applications.

01/09/2006 — Integral Vision secures repeat order

Jan. 9, 2006 - Integral Vision Inc. (OTC.BB: INVI) of Farmington Hills, Mich., announced that it has received a repeat order for a SharpEye inspection system to be used for the inspection of MEMs displays. The SharpEye product provides analysis of functional and cosmetic defects in the display to[...]

01/11/2006 — Boston Micromachines unveils new MEMS mirror

Jan. 11, 2006 -- Boston Micromachines Corp., a Watertown, Mass., provider of MEMS products for adaptive optics systems, announced the Mini-DM, a new MEMS deformable mirror. The company says the mirror is cost effective and offers high resolution. It is slated for use in microscopes, telescopes, and ophthalmic instruments. "Because[...]

01/26/2006 — Micralyne to use Eyelit software

Jan. 26, 2006 -- Micralyne Inc., an Edmonton, Alberta, manufacturer of MEMS components, announced it has purchased the Manufacturing Execution Software system from Eyelit Inc., a provider of collaborative production management solutions for manufacturing companies. Micralyne said in a release that the purchase was driven by an increase in customer[...]

01/13/2006 — MEMS pioneer Pister wins Schwarzkopf prize

Kristofer Pister, an engineering professor and MEMS pioneer at the University of California, Berkeley, received national recognition for his invention of "smart dust" wireless sensor networks. The Industry/University Cooperative Research Centers (I/UCRC) announced today that Pister won the Alexander Schwarzkopf Prize for Technology Innovation. The I/UCRC is an independent association made up of 41 National Science Foundation-funded centers representing more than 60 universities.

01/31/2006 — MEMS Industry Group releases report

Jan. 31, 2006 -- The MEMS Industry Group, a trade association based in Pittsburgh that represents the MEMS and microstructures industries, has released its Industry Report -- Focus on Technical and Scientific Challenges to Successful MEMS Commercialization. The report discusses the industry's success factors, including the increased availability of materials[...]

06/27/2006 — Invensense unveils MEMS sensor for handhelds

InvenSense, a provider of motion sensing devices for mobile applications, announced a gyroscope-based solution for handsets intended to enable easier and more intuitive user interaction through hand motions.

06/13/2006 — Fuji acquiring Dimatix

Dimatix Inc., a Santa Clara, Calif., developer and manufacturer of industrial ink jet printheads, precision micropumps and specialized print systems, announced that it has agreed to be acquired by Fuji Photo Film Co. Ltd. The transaction is expected to close in late July.

01/30/2006 — Sense Holdings expands staff for MEMS project

Sense Holdings Inc., a developer of next-generation biometric and explosive detection security technologies for government and commercial security markets, increased the size of its scientific research staff based at the Oak Ridge National Laboratory in Tennessee. The team is accelerating product development of an efficient MEMS-based handheld explosives detection device.

01/30/2006 — 2005 VC report: late stage funding pumps up nano numbers

Venture capitalists invested more than twice as much money in U.S. nanotechnology companies in 2005 than they did in 2004, according to a Small Times analysis released today. The record investment amount reflects the maturing of the first generation of nanotech startups that were founded earlier this decade, many of which raised large later stage rounds during 2005.

01/12/2007 — Heidelberg Instruments announces record order intake

Heidelberg Instruments, a German manufacturer of maskless lithography systems, announced a record order intake in 2006.

01/23/2007 — Vistec selling to sensor and MEMS manufacturers

Vistec Semiconductor Systems received orders for infrared inspection equipment from a Japanese sensor manufacturer and an European MEMS manufacturer.

04/27/2007 — Sensata's new MEMS sensors promise improved auto seat belt alerts

Sensata Technologies, formerly the Sensors & Controls business of Texas Instruments, has demonstrated several occupant sensing approaches that it says can help engineers design better seat belt alert systems. At the recent SAE World Congress, the company showed a new piezo electric sensor, as well as a current Monocrystalline Silicon Strain Gauge (MSG) force sensor, both of which promise engineers a range of design options.

04/09/2007 — MEMS timing device developer, Discera, plots ABI-forecasted "Everest climb"

A new ABI Research report on the timing devices market and MEMS developers' efforts to unseat decades-old quartz technology says the upstarts face an uphill battle. But Discera, one of the startups looking to win big in this application area, indicates that uneven market acceptance is no surprise—and no problem.

07/07/2006 — Micralyne buys Suss bonder and aligner

July 7, 2006 - Micralyne Inc., an Edmonton, Alberta, manufacturer of MEMS components, announced it has purchased the SB6e wafer bonder and BA6 aligner system from SUSS MicroTec Inc., a supplier of precision manufacturing and test equipment for the semiconductor and emerging markets. Micralyne said that due to increasing production[...]

07/13/2006 — SiTime partners With Jazz Semiconductor for MEMS resonator manufacturing

July 13, 2006 - SiTime Corp., a privately held start-up focused on developing MEMS silicon resonators, and Jazz Semiconductor, an independent wafer foundry focused primarily on specialty CMOS process technologies, announced a partnership to bring SiTime's MEMS First silicon mechanical oscillator products to market at Jazz Semiconductor's 200mm wafer foundry[...]

07/11/2006 — Tessera introduces wafer-level technology for optical components

Tessera Technologies Inc., a provider of miniaturization technologies for the electronics industry, unveiled Shellcase CF, a wafer-level technology for optical components integrated into electronic products such as miniaturized cameras in camera phones, digital still cameras and video camcorders.

07/20/2006 — SUSS MicroTec develops wafer bonder for high vacuum apps

SUSS MicroTec, a supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, showed for the first time a unique wafer bonding system designed for high vacuum applications. The company says it will be available in the third quarter of 2006.

07/20/2006 — XACTIX, STS unveil line of xenon difluoride silicon etch systems

XACTIX Inc. and Surface Technology Systems PLC announced a comprehensive line of production-oriented release etching tools for MEMS.

10/23/2006 — Infineon unveils integrated MEMS tire pressure sensor

Infineon Technologies introduced its SP35 Tire Pressure Sensor, the first device to incorporate all the major active functions of a wheel-mounted Tire Pressure Monitoring System (TPMS) module into a single package.

10/31/2006 — MEMS to the moon: Polychromix partners with NASA on lunar spectroscopy

Polychromix Inc., a Wilmington, Mass., developer of spectroscopy solutions, announced a collaboration agreement with NASA to provide Digital Transform Spectrometers tools for determining water content on the surface of the moon.

10/12/2006 — Aldagen, IMT form bio alliance

Aldagen Inc. of Durham, N.C., and Innovative Micro Technology (IMT) of Santa Barbara, Calif., announced that they have formed an alliance to co-develop and commercialize a version of IMT's Rare Cell Purification System, customized specifically for clinical cell therapies.

10/24/2006 — SiTime intros tiniest MEMS resonator

SiTime, a Sunnyvale, Calif., company bringing MEMS-based all silicon timing solutions to market, introduced what it claims is the smallest and thinnest megahertz resonator.

10/04/2006 — Bosch unveils new tri-axis accelerometer

Bosch Sensortec announced that at the Ceatec MEMS trade show in Tokyo it is presenting its SMB363, a new analog acceleration sensor. In doing so, the company is adding an analog variant to its product line of triaxial accelerometers.

10/06/2006 — STMicro unveils new 3-axis accelerometer

STMicroelectronics, a leading supplier of MEMS devices, introduced the first two devices in its new family of low-g linear accelerometers, distinguished by small form factor and low power consumption. The LIS302 sensors are intended to meet the growing demand for smart functionality, such as hard-disk drive protection and motion-controlled operation, in mobile phones, digital audio players, and laptops.

10/18/2006 — RF MEMS company raises $13.5 million

WiSpry Inc., a fabless semiconductor company developing dynamically tunable radio frequency integrated circuits for wireless devices, announced it has raised a $13.5 million Series B financing.

11/09/2006 — Sanyo using InvenSense MEMS gyroscopes for camera image stabilization

InvenSense, a Santa Clara, Calif., provider of motion sensing solutions for mobile applications, announced that Sanyo Electric Co. Ltd. has selected its single-chip gyroscope for use in its new generation of digital still camera models with image stabilization (IS) features.

11/28/2006 — STMicroelectronics announces 8-inch MEMS line

Nov. 28, 2006 -- STMicroelectronics, one of the world's largest semiconductor suppliers and an industry leader in MEMS devices, announced it has inaugurated a new 200mm (8-inch) semiconductor wafer fabrication line dedicated to MEMS devices at its manufacturing site at Agrate, near Milan, Italy.

11/09/2006 — SUSS, SAES working together on wafer-level packaging

The SAES Getters Group, a provider of getter technology for high vacuum applications, and SUSS MicroTec, a supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, are working together to develop their technologies for wafer-level packaging applications for the MEMS industry.

11/20/2006 — FUJIFILM Dimatix ships 5,000th materials cartridge

FUJIFILM Dimatix Inc. of Santa Clara, Calif., announced it has shipped more than 5,000 Dimatix Materials Cartridges to customers in the first year of production of its Dimatix Materials Printer (DMP) systems.

11/21/2006 — Touchdown Technologies to use Eyelit software

Eyelit Inc., a San Jose, Calif., manufacturing software provider for visibility, control and coordination of manufacturing operations for the electronics, life sciences, MEMS and semiconductor industries, announced that Touchdown Technologies, a developer and manufacturer of advanced MEMS probecards, has purchased Eyelit's Enterprise Manufacturing Execution suite to manage and control its production operations.

11/22/2006 — Canadian NanoFab installing SUSS wafer bonder

SUSS MicroTec., the Munich, Germany-based supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, announced that the University of Alberta's NanoFab has selected its new ELAN CB6L wafer bonding equipment for its research and production activities.

11/27/2006 — Heidelberg Instruments sells maskless litho system to Swedish lab

Heidelberg Instruments announced the sale of an advanced DWL200 maskless laser lithography system to the Angstrom Microstructure Laboratory of the University of Uppsala, Sweden.

04/02/2007 — Kebaili's compact reverse pulse plating controller targets MEMS and nanotech R&D.

Kebaili calls its new CPG-500 Series the first compact current pulse generator designed specifically for electrodeposition applications in MEMS and nanotechnology development. The company says most reverse pulse plating systems and potentiostat/ galvanostat are large and not optimized for cleanrooms, whereas the CPG-500 is ergonomic and compact.

04/13/2007 — IntelliSense software now enables nano, MEMS, and hybrid design

IntelliSense has announced a major new version of its software for small-tech designers. With IntelliSuite v8.2, says company CEO, Sandeep Akkaraju, "we have now entered the nano domain." IntelliSuite v8.2, a standard bearer for MEMS design, promises to facilitate the creation of nanostructures as well as combined MEMS-nanostructure products.

04/04/2007 — Infotonics gains MEMS fabrication and packaging flexibility with new SUSS bonding systems

Infotonics gains MEMS fabrication and packaging flexibility with new SUSS bonding systems

06/01/2006 — X-FAB manufacturing Akustica MEMS microphone

Akustica Inc. and X-FAB Semiconductor Foundries AG announced a strategic supplier partnership to focus on wafer processing of Akustica's AKU2000 Microphone Chip.

06/08/2006 — Veeco introduces automated optical profiler for dynamic MEMS measurements

June 8, 2006 - Veeco Instruments Inc. (Nasdaq: VECO) announced the introduction of its new automated Wyko NT3300 Optical Profiler with DMEMS, or dynamic MEMS, measurement option. With an increase in the number of unique micro-devices being used in consumer products, the company said the MEMS industry requires metrology tools[...]

06/28/2006 — IntelliSense ships IntelliSuite upgrade

IntelliSense announced the availability of a major upgrade to its IntelliSuite family of MEMS and Nano CAD tools. IntelliSuite v8.1 (2006) includes several new capabilities.

11/30/2006 — Veeco intros next-gen optical profilers

Nov. 30, 2006 -- Veeco Instruments Inc., a Woodbury, N.Y., supplier of instrumentation to the nanoscience community, announced the release of the Wyko NT9300 and NT9800 Optical Profilers.

11/13/2006 — SiTime enters agreement with Swatch division

SiTime, a Sunnyvale, Calif., company that makes MEMS-based, all silicon timing solutions, and Micro Crystal, a division of Swatch and a European leader in the frequency control market, have begun a strategic partnership to develop, promote, and distribute MEMS-based oscillator products.

11/17/2006 — Vectron, Discera to collaborate on MEMS oscillators

Discera Inc., a developer of MEMS resonator technology and provider of next-generation timing solutions, and Vectron International, a maker of frequency control and timing solutions, announced that they will work together on MEMS oscillators for electronics manufacturers.

11/14/2006 — STMicro providing MEMS for wireless motion controller

STMicroelectronics, one of the world's leading semiconductor manufacturers, and Ball-IT Oy, a leading provider of advanced real-time wireless sensor solutions, announced a novel MEMS-based wireless motion-control device.

11/15/2006 — Knowles ships 300 millionth MEMS microphone

Knowles Acoustics announced it had reached a major milestone in the history of MEMS microphone technology with the shipment of its 300 millionth SiSonic surface mount MEMS microphone.

11/16/2006 — Infineon unveils MEMS microphone

Infineon Technologies AG unveiled a silicon microphone for consumer and computer communications devices that is approximately one-half the size and operates on one-third the power of conventional microphones.

11/29/2006 — InvenSense supplying integrated dual-axis gyroscopes for consumer products

InvenSense, a Santa Clara, Calif., provider of integrated motion sensing solutions for mobile applications, announced that its family of integrated dual-axis gyroscopes is currently being manufactured in high volume and is being shipped to a number of Japanese, Taiwanese, and American original equipment manufacturers.

04/23/2007 — InvenSense demos MEMS-based "instant gesture" technology

InvenSense has completed the first public demonstration of its iG -- instant gesture -- technology. Made at the Spring Intel Developers Forum in Beijing, China, the demo featured several motion sensing applications running on Intel's UMPC and MID mobile platforms, including user interface control, gaming, and GPS navigation.

04/10/2007 — IMT offers getter deposition for wafer-level MEMS packaging

Innovative Micro Technology (IMT) now offers getter deposition services for wafer-level packaging of MEMS and other devices requiring hard vacuum for performance. IMT says it has routinely achieved vacuum levels below 10 mTorr in production of inorganic devices.

04/18/2007 — WTC reveals MEMS industry drivers, rankings

Texas Instruments is still the number one MEMS company worldwide, with record revenue of $905 million in 2006, according to German research firm WTC. WTC has updated its MEMS market data with rankings of the top 30 MEMS developers and the top 10 MEMS foundry service providers.

04/19/2007 — Debiotech and ST to bring MEMS-based insulin pump to market

Debiotech and STMicroelectronics have announced a strategic cooperation agreement aimed at producing a miniaturized insulin-delivery pump. Enabled by microfluidic MEMS and semiconductor manufacturing technology, the Nanopump aims to broadly improve patients' lives.

04/12/2007 — Tronics expands to strengthen MEMS design-to-manufacturing services

Tronics Microsystems SA has expanded MEMS characterization, assembly, packaging, and testing capabilities at its Crolles, France headquarters. The additional space and new tools strengthen the company's design-to-manufacturing services.

11/02/2006 — Grape Networks announces production of micro-climate monitoring system

Grape Networks Inc., a San Ramon, Calif., developer of MEMS sensors and mesh networks for monitoring vineyards, announced that production systems for the monitoring of micro-climates for vineyards will be available in the first quarter of 2007. The Company also announced the expansion of its current system at Beringer Vineyards in Napa Valley.

11/29/2006 — Hyphenated Systems unveils new automated NanoScale optical profiler

Nov. 29, 2006 -- Hyphenated Systems, a Burlingame, Calif., provider of hybrid microscopy solutions for three-dimensional imaging and metrology in micro and nanotechnology, announced the release of its new HS200A NanoScale Optical Profiler.

11/17/2006 — Heidelberg Instruments sells direct write litho system to Chinese firm

Heidelberg Instruments GmbH, a Heidelberg, Germany-based supplier of direct write laser lithography systems, announced the order for an advanced MW800fs system by Shenzhen New Way Electronic Co. Ltd. of Shenzhen, China.

07/31/2006 — PixDro installs inkjet system at Degussa incubator

PixDro Ltd., a developer and manufacturer of inkjet technologies and dispensing printing technologies, announced it has installed its LabP150 high precision inkjet laboratory system at Creavis Technologies & Innovation in Marl, Germany.

07/20/2006 — ECSI announces new bench-top electroplater

ElectroChemical Systems Inc. (ECSI), a Denville, N.J., maker of wet processing equipment for MEMS and other markets, announced a new version of its IKo bench-top electroplater.

07/05/2006 — Austriamicrosystems orders Pegasus DRIE tool from STS

July 5, 2006 - Surface Technology Systems plc (STS), a Newport, Wales-based maker of plasma process technologies required in the manufacturing and packaging of MEMS and advanced electronic devices, announced that Austriamicrosystems has purchased one of its VPX Pegasus Deep Reactive Ion Etch (DRIE) systems for advanced IC production. The[...]

07/05/2006 — Akrion books more GAMA wet station orders

July 5, 2006 - Akrion Inc. of Allentown, Pa., announced receipt of orders for GAMA Series systems from two repeat customers. Both tool sets will ship in the third quarter, the company said.One of the systems will be used for back-end-of-line (BEOL) cleaning at a leading foundry in China[...]

05/05/2003 — Applied MEMS to supply seismic sensors

Applied MEMS Inc. of Houston will manufacture its MEMS Si-Flex accelerometer for Refraction Technology Inc., a maker of seismic recording systems for earthquake monitoring, according to a news release.

05/29/2003 — Micralyne may be a model for making money in MEMS

A Canadian company says it is the exception to the general rule that MEMS companies will not become profitable until after the financial gray skies clear up. Micralyne's CEO says the firm is “the only profitable MEMS developer and manufacturer.” Its secret? Don't seek the "killer app." Focus on profitability "from day one."

05/07/2003 — MEMS group names new director

The MEMS Industry Group named a Honeywell International Inc. official as its new executive director.

05/16/2003 — Nanotechnology business plan earns respect – and cash – at MIT

Yet another sign that nanotechnology has arrived: A nanotech business plan won the prestigious $50K Entrepreneurship Contest at MIT. SmartCells, a team of five graduate researchers and business students using nanoparticles to treat diabetes, trumped seven other finalists. The team already plans to secure a license to commercialize the technology.

05/28/2003 — SensoNor board urges 'yes' to Infineon takeover

SensoNor ASA's board of directors said Wednesday that shareholders should accept an acquisition offer from Infineon Technologies AG, according to a company statement.

05/29/2003 — Ziptronix announces $17M second round

Ziptronix Inc., a developer of semiconductor and MEMS design and manufacturing processes, announced $17.4 million second-round funding.

05/01/2003 — What can Europe teach America? A little self-help, for starters

Is the United States from Mars, Europe from Venus? Europeans' affinity for debate vs. Americans' penchant to go it alone seems to be swirling around many arenas these days. Recent world events aside, the contrast might also apply to the MEMS industry: Europeans like to talk, while Americans remain stoically silent.

05/09/2003 — Colibrys launches new accelerometer

May 9, 2003 - Colibrys SA  has launched a high-shock resistant MEMS accelerometer for precision-guided missiles and smart weapons, according to a company release.Colibrys, which has offices in Switzerland and North Carolina, said the SMD MS 8000 series accelerometers have built-in temperature sensors that boost stability. The launch is[...]

05/15/2003 — Tanner launches new software for MEMS

Tanner EDA, a California-based maker of integrated circuit design tools, has launched the latest version of its L-Edit Pro with several features dedicated to MEMS and microsystems design.

05/16/2003 — Dalsa gets $9M MEMS order

May 16, 2003 - Dalsa Corp.'s semiconductor foundry in Quebec received an order worth about $9 million for MEMS-based sensor devices to be used in the automotive industry, according to a company release.Dalsa did not name the customer, but said it's a foundry specializing in automotive products. The[...]

05/20/2003 — BAE, AMI making new MEMS gyro

May 20, 2003 -- BAE Systems and AMI Semiconductor have teamed up to develop next-generation MEMS gyroscopes for vehicle stability control, wheelchairs and model aircraft, according to a news release.BAE said it chose Idaho-based AMI's I3T80 platform because the application-specific chips combine high-speed and low-power operation. BAE's U.K[...]

05/23/2003 — OnStream bankrupt again, leaving MEMS projects homeless

OnStream Holding, which makes wireless MEMS switches, has declared bankruptcy for the second time since it was spun off from Royal Philips Electronics in 1998. OnStream's management is looking at ways to restart its MEMS projects, and there are a few interested investors.

05/23/2003 — Infineon makes bid for SensoNor

May 23, 2003 - Infineon Technologies AG plans to acquire SensoNor ASA to boost its position as a provider of sensors for the automotive industry.Infineon, a German maker of semiconductor and systems technology, expects to pay about $56 million to complete the acquisition. The shareholders of SensoNor, a Norwegian[...]

05/13/2003 — Agilent looks 10 years ahead in small tech research, products

Three years after branching off from Hewlett-Packard, Agilent Technologies Inc. is building on its history to become a leader in the emerging world of small tech. To do so, it is investing in research that won't show up in products for five to 10 years.

05/20/2003 — 3D MEMS built for C Speed easier to manufacture, package

As the slump in the telecommunications market drags on, the entire industry is experiencing the kind of forced consolidation that would make Darwin proud. Thanks to overfunding in 2000 and 2001, the optics industry in particular has been left with lots of startups targeting markets that may now be years away from materializing. One promising startup that has thus far managed to survive the downturn is Santa Clara, Calif.-based C Speed Corp.

05/05/2003 — Abtech Scientific uses small tech to sense the future of medicine

One of the most frustrating problems for doctors who prescribe medicine is determining the effective dosage. A dose that barely has an effect on one patient's symptoms could be dangerously toxic for another. Abtech Scientific Inc. hopes to solve this problem.

05/19/2003 — Read/write heads teach Advanced MicroSensors small tech 'rithmatic

They say a little bit of know-how can go a long way. Advanced MicroSensors took a lot of know-how and went further – to growth in the MEMS business. The Boston-area company has roots in a close cousin to MEMS: read/write heads for computer hard drives. With that understanding of how to make microscale thin films, AMS gambled on the next logical step.

05/16/2003 — Market opportunities are growing in microfluidic biomedical systems

Improved microfluidic channels are playing a key role in the next generation of biomedical applications. New advances in materials have brought forth much better and tinier microchannels, closing the loop between in vitro (test tube) diagnostics and in vivo (inside the body) therapies for medical problems using microfluidic drug-delivery systems. The optimism is not without some impressive market projections, though some are more bullish than others.

05/22/2003 — Analog sells accelerometers to Omron

May 22, 2003 - Analog Devices Inc., Norwood, Mass., is providing MEMS accelerometers to Omron Corp.'s Healthcare Business Co. for its new, portable digital blood pressure monitoring devices, according to a news release.The iMEMS ADXL202E enables accurate tilt measurements of the user's arm in relation to the[...]

05/29/2003 — Software firms keep hard times at bay with new business models

The struggle for software design firms specializing in microsystems once revolved around the technology itself. But now that they have succeeded in developing tools to help companies progress, they face a new challenge: designing business models to support them until the industry moves into the mainstream.

05/10/2003 — MEMS pioneer takes a yearoff school to sell his wares

Ken Gabriel, co-founder of the MEMS Industry Group, is taking at least a year off from his job as a Carnegie Mellon University professor to focus on Akustica, a MEMS-based startup specializing in acoustic technology he helped develop in CMU's lab. "There's only so much you can do within a university environment."

05/17/2003 — Company counts on hot sales for smaller and cheaper chills

Cool Chips wants to start a revolution in refrigeration. The company claims that its devices could chill everything from electronic equipment to your whole house. If the firm can leap some commercial hurdles, its chips could be on the market in a year.

11/09/2004 — NanoFab and research institute help Edmonton gain prominence

Edmonton was known in the 1800s as a fur-trading post. In the 1900s, it gained fame for its oil and gas industry. This century, it appears to be evolving into Canada's showcase for micro and nanotechnologies, and a possible world leader in their commercialization. A new $31-million NINT building now under construction is designed to be one of the world’s most technologically advanced research facilities.

05/07/2003 — Applied MEMS to package Ion's sensor

May 7, 2003 -- Applied MEMS Inc.of Houston is providing packaging foundry services for Massachusetts-based Ion Optics' MEMS-based gas sensors, according to a company news release. Applied MEMS, a subsidiary of Input/Output Inc., will offer vacuum-packaging services for the SensorChip, which uses silicon micromachined infrared gas detector elements[...]

05/30/2003 — Advanced MicroSensors names CTO

May 30, 2003 - Advanced MicroSensors Inc. (AMS) has hired Hirokazu Tamura as its chief technical officer, according to a news release.Tamura joins the Shrewsbury, Mass.-based maker of MEMS devices and tape drive recording components from Fitel Technologies, where he served as vice president in charge of R&[...]


When 32 gentlemen and one lady start their engines Sunday, tiny devices will feed a stream of performance information to the race teams

09/08/2003 — IntelliSense to cease operations, blames telecom downturn

The oldest microsystems software design firm and a pioneering industry toolmaker is scheduled to close – another casualty of the telecom drought. An analyst says the loss may not indicate any larger woes in the MEMS industry, but the company's products and management will be missed.

09/25/2003 — Chromux, NP Photonics link on optical MEMS

Chromux Technologies Inc., an Oxnard, Calif.-based optical MEMS supplier, will manufacture MEMS devices for NP Photonics Inc. and serve as an Asian distributor for the Tucson, Ariz.-based firm, according to a news release.

09/30/2003 — Fujitsu develops MEMS-based optical switches

Fujitsu Ltd. and wholly owned subsidiary Fujitsu Laboratories Ltd. have developed an 80-channel optical switch based on MEMS mirrors, according to a news release.

09/23/2003 — SMI launches new sensor chip

Sept. 23, 2003 – Silicon Microstructures Inc., a Milpitas, Calif., developer and manufacturer of MEMS-based silicon pressure sensors and custom microstructures, announced it has added a new pressure sensor chip to its line of MEMS sensors.


Firefighters in New York City are using thermal imaging cameras, equipped with sensors made with MEMS technology, to help them in their search and rescue operations in the rubble of the World Trade Center. The cameras use military infrared technology to give firefighters the ability to see in dark, smoke-filled environments.

11/11/2004 — MEMS fabrication demands close collaboration

By using known manufacturing processes, a foundry can shorten development time and ensure higher yields during early fabrication runs. While that puts the onus on the foundry to offer well-defined and repeatable processes, the benefit is that customers know that a product will work right out of the gate.

11/15/2004 — Best of Small Tech winners named

The third annual Best of Small Tech Awards is Small Times Magazine's ultimate annual performance review of the people, products and companies in micro and nanotechnology. After rigorous evaluation by nearly 30 industry leaders and experts, Small Times editors present 31 winners and runners-up who represent the best work and biggest successes in the categories of product, company business leader, researcher, innovator, advocate and lifetime achievement.

05/13/2004 — MEMS group releases report, launches site

The MEMS Industry Group (MIG) has released a report on reliability and launched a related Web site.

05/14/2004 — Coventor retools MEMulator

Coventor Inc. (Profile, News, Web) has released an updated version of its tool for 3-D modeling software for MEMS and semiconductor processes, according to a news release.

05/18/2004 — IntelliSense, PhoeniX link on MEMS software

IntelliSense Software Corp. and PhoeniX BV will combine their MEMS design tools as part of a strategic alliance, according to a news release.

05/10/2004 — Chiral Photonics brings a new twist to optical devices, lasers

A strand of customized optical fiber, seen through a microscope, is heated in a miniature oven and rapidly twisted as it is pulled downward. The resulting corkscrew, or chiral, in the core of the fiber is the foundation of Chiral Photonics' business. The startup's first products are in the hands of potential customers. But the technology may also enable more effective lasers and light filters for optical systems.

05/13/2004 — Nano goes to college this fall with its own academic program

Come this fall semester, Albany Nanotech and the University at Albany will open one of the world's first full-fledged College of Nanoscale Science and Engineering. Ph.D.s and M.S. degrees won't be awarded in traditional fields such as physics or chemistry, but will revolve around novel multidisciplinary "clusters" such as Nanosystems Sciences and Technologies or Molecular Materials and Architectures.

05/25/2004 — Small-tech trio faces stiff competition in MIT's $50K challenge

Advanced Diamond was one of three small tech business plans to squeak into MIT’s famed $50K Entrepreneurship Competition this year, with its diamond-copper composite that acts as a coolant for microchip components. Other small-tech finalists were Active Spectrum, using MEMS to build a transceiver for wireless devices, and LumArray, with a nanoscale lithography technique that eliminates costly design masks.

09/22/2003 — Matsushita to launch MEMS relays, sensors

Sept. 22, 2003 – Matsushita Electric Works Ltd. plans to launch pilot production of MEMS-based mechanical relays and 3-axis accelerometers by year's end, according to the Japan Corporate News Network.

09/10/2003 — NHTSA won’t appeal tire pressure decision

Sept. 10, 2003 – The National Highway Traffic Safety Administration will not appeal an August court decision that overthrew the rule governing tire pressure monitoring systems, according to an agency spokesman.

09/24/2003 — BEI selects TI technology for IMU

BEI Technologies Inc.'s Systron Donner Inertial Division picked Texas Instruments Inc.'s digital signal controller for a MEMS-based inertial measurement unit (IMU), according to a news release.

09/12/2003 — Knowles to sell MEMS microphone in Japan

Sept. 12, 2003 -- Knowles Acoustics Inc. is introducing its MEMS-based SiSonic silicon microphone in the Japanese market for mobile phones, according to Asia Pulse. Knowles, the Itasca, Ill.-based division of hearing aid parts maker Knowles Electronics LLC, will sell its product via Japanese firms Takachiho Koheki Co. and[...]

05/21/2003 — Visionaries see the promise and the nightmare of nanotech

Inventor Ray Kurzweil and political nano-advocate Newt Gingrich see small tech leading to longer life expectancies and a melding between human and machine. They also see it as a "double-edged sword," and possibly "the greatest threat to human civilization."

05/07/2003 — Small tech battle-tested in Iraq in prelude to warfare's new wave

The war in Iraq caught the U.S. military in the very early stages of the small tech revolution. Only a few MEMS systems were used inside the weapons that overthrew Saddam Hussein. But it's likely they will play a bigger role in any future war as MEMS-based military hardware move into advanced stages of development.
Tomorrow: Companies combat unseen bio/chem enemies
Friday: Military eager to end 'false positives' plague

05/01/2003 — Microlab becomes Magfusion

Microlab Inc. is changing its name today to Magfusion Inc., according to a news release.

05/14/2003 — Xerox runs this up the (telephone) pole: MEMS for magical 'last mile'

On-demand digital video and Internet delivered rapidly and cheaply to your home or business could be made possible by a new technology from Xerox. The company has developed a MEMS switch that controls the flow of light on a single silicon chip. Xerox says the technology allows it to shrink what normally would require racks of equipment into a 1-inch-square package.

05/13/2003 — PHS MEMS launches devices, services for RF market

May 13, 2003 - PHS MEMS, a Grenoble, France-based MEMS manufacturer, has launched production-ready devices and services for wireless hand-held equipment, according to a company news release.PHS' Integrated Passive Devices (IPD), designed for direct integration onto a chip or radio-frequency module, are made for mobile phones, wireless PDAs and[...]

05/22/2003 — Neonode multimedia phone to use Emkay SiSonic MEMS mike

Neonode Corp. of Sweden will use the SiSonic silicon micromachined microphone from Emkay Innovative Products of Itasca, Ill., in its Neonode N1 portable multifunction device. The N1 combines a cellular phone with an MP3 music player, a digital camera, a personal organizer and a portable game machine.

05/30/2003 — Ad hoc modeling shapes nanotech’s near future

The co-founder of a nanotechnology startup that prides itself on its modeling capabilities predicts the industry will have commercialized design software tools like those used for microsystems, but not anytime soon. Over time, commercial design software tools likely will replace today's do-it-yourself approach.

11/02/2004 — Time spent developing trust pays off with Japanese firms

Partnerships have become more commonplace in today's global economy. Companies concentrate resources on their core competencies and seek companies with complementary resources, products and technologies for acquisition, joint ventures, partnerships or outsourcing.

11/23/2004 — Lab-on-a-chip just what doctor ordered

Fifteen years ago, lab-on-a-chip was considered the next big thing for MEMS. The cluster of startups that brought lab-on-a-chip to market went public fairly quickly. Today those firms are still struggling to generate revenues, not to mention recover the huge sums spent on developing products.

11/10/2004 — Discera demonstrates MEMS for mobile devices

Nov. 10, 2004 - Discera Inc. has demonstrated prototypes of its tunable oscillator, the first example of a commercial-grade application built around the firm's miniature silicon parts, according to a news release. The San Jose, Calif.-based company's micro-oscillator is powered by its PureSilicon Resonator, radio-frequency/analog circuitry and packaging technologies[...]

11/19/2004 — MEMS makers tune in to digital TV market

Until now, Texas Instruments has effectively owned the market for rear-projection televisions that use micromirrors, but three other outfits developing MEMS projection technologies could challenge it in the years ahead. This could create more price competition and present consumers with a potentially dizzying array of TV technology choices.

11/30/2004 — Flash market offers MEMS ray of hope

In the same way that digital cameras boosted demand for flash memory, high-resolution cameras, cell phones and digital camcorders are expected to drive demand for next-generation portable storage. Firms developing MEMS-based memory think that these applications will most likely be the first market for their devices.

11/03/2004 — UK gives out $26 million for industry development

The United Kingdom divvied out more than $26 million in late August through its micro and nanotechnology manufacturing initiative to a score of companies, research organizations and universities. In all, 25 recipients received grants for facilities and research.

11/05/2004 — Q3 report: Funding up with $267.7 million in nano, micro and MEMS

Investors put $267.7 million into 35 companies involved in MEMS, microsystems or nanotechnology in the third quarter, according to a Small Times analysis. Both the amount invested and number of deals are higher than the second quarter results, when investors put $222.5 million into 29 companies.

11/08/2004 — Prudence and practice help reduce risks of partnerships

It seemed like a match made in small tech heaven: Zyvex Corp. and Standard MEMS Inc. in 2001 were awarded a $25 million federal grant to develop low-cost assemblers for high-volume micro- and nanoscale systems. Less than a year later, however, Standard MEMS was on the skids, and so was the cost-sharing contract with the National Institute of Standards and Technology’s Advanced Technology Program.

10/16/2003 — TI to clear air with AppliedSensor's MEMS

Oct. 16, 2003 - Texas Instruments Inc. (TI) has selected AppliedSensor Inc.'s MEMS-based gas sensor for an automotive air quality control system, according to a news release.

10/03/2003 — Zyvex getting down to business; Nanobots? That's for another day

Tom Cellucci has a very simple job description. “He’s going to start bringing money in,” said his new boss, Jim Von Ehr, chief executive of Zyvex Corp. The company is shifting its focus from the distant possibilities of nanotech to the practical realities of cash flow. It's a big change for Von Ehr, who has regaled listeners over the years with his dreams of molecular manufacturing.

10/09/2003 — DARPA gives $1.2M to UC Irvine team for new antenna

Oct. 9, 2003 - The Defense Advanced Research Projects Agency gave a $1.2 million grant to a University of California, Irvine, professor to make light and low-cost antennas based on radio frequency (RF) MEMS that could provide direct TV in a car.

10/30/2003 — Company’s IPO shows good form, but it will be a tough act to follow

FormFactor Inc. has proven that a MEMS company could go public. But the company’s experience also highlights how many stars must align to make a compelling IPO – a lesson for small tech startups looking to leap from late-stage venture funding to the public markets.

10/07/2003 — MEMS detect falls; help protect data in IBM laptops

Oct. 7, 2003 – IBM has launched an updated line of its ThinkPad laptop computers with models that include MEMS accelerometers in a system to protect data from drops and damage, according to a news release.

10/14/2003 — Coventor offers conversion for Corning IntelliSense customers

Oct. 14, 2003 - Coventor Inc. has developed a replacement package for software made by Corning IntelliSense Corp., which announced last month it would close. Cary, N.C.-based Coventor said the conversion program has been designed to help IntelliSense customers switch from IntelliSuite to CoventorWare MEMS development software. The[...]

10/14/2003 — FormFactor honored by In-Stat/MDR

Oct. 14, 2003 - FormFactor Inc. received market research firm In-Stat/MDR's Kachina Award, an annual recognition of outstanding semiconductor and electronics firms. Livermore, Calif.-based FormFactor was honored for contributing to and enabling key segments of the electronics industry's technologies and infrastructure. The 10-year-old company, which uses MEMS processes to[...]

10/27/2003 — Tegal makes sale for MEMS, nano devices

Tegal Corp. said a European semiconductor manufacturer has ordered two of its plasma etch systems so the company can expand into manufacture of MEMS and nanoscale devices, according to a company news release.

11/17/2003 — Oki Electric to make its own MEMS

Oki Electric Industry Co. has created a team to commercialize its own line of MEMS sensors, according to Asia Pulse.

11/21/2003 — Sumitomo to sell Ziptronix's MEMS technology

Sumitomo Corp. will distribute Ziptronix Inc.'s engineered substrates, MEMS packaging and integrated circuits in Japan, according to a news release.

11/24/2003 — Foundry orders MEMS line from SUSS

MicroFAB Bremen GmbH, a German MEMS foundry and microsystems supplier, has ordered a complete MEMS process line from SUSS MicroTec, according to a news release.

09/02/2003 — MEMGen becomes Microfabrica

MEMGen Corp. has changed its name to Microfabrica Inc. to put the focus on manufacturing, not MEMS, according to a news release.

09/03/2003 — SUSS director to steer MEMS group

Joe Brown, a regional marketing director for Germany-based SUSS MicroTec, has been elected the first chair of International MEMS Steering Group, according to a news release.

09/04/2003 — MEMS industry wants to be a reliable source

Reliability, one of the biggest challenges facing the MEMS industry, is the topic of a two-day conference scheduled for Sept. 18-19 in Pittsburgh.

09/05/2003 — Coventor to sell Zyvex micro design tool

Coventor Inc. will license and sell a microdevice design tool developed by Zyvex Corp., according to a news release.

09/10/2003 — Olympus Optical forms MEMS division

Olympus Partnership Development Group Ltd. announced that its parent company, Tokyo-based Olympus Optical Co. Ltd. of Japan, has formed a new MEMS Technology Division, according to a news release.

09/17/2003 — Zyvex, Keithley partner on nano resources

Zyvex Corp., a Richardson, Texas developer of nanotechnology tools and products, and Keithley Instruments Inc., a Cleveland provider of optical and electrical measurement solutions, announced an agreement to collaborate in nanotechnology.

09/17/2003 — Silicon Microstructures completes fab expansion

Sept. 17, 2003 – Silicon Microstructures Inc., a Milpitas, Calif., developer and manufacturer of MEMS-based silicon pressure sensors and custom microstructures, announced the completion of its MEMS fab expansion and renovation.

09/17/2003 — Magfusion completes facility project

Sept. 17, 2003 – Magfusion Inc., a Chandler, Ariz., developer of RF MEMS switches, announced the completion of a facility expansion the company said will allow it to bring more production in-house. The project included the installation of new production equipment and building modifications at its Arizona headquarters.

09/18/2003 — Lightconnect announces compact MEMS VOA

Sept. 18, 2003 – Lightconnect Inc., a Newark, Calif., MEMS component supplier, announced a new compact variable optical attenuator, according to a news release. The Fast VOA 5000 measures 5.4 mm x 18 mm and is designed the withstand mechanical shock and vibration. Applications include power control and equalization, receiver and channel protection, on/off switching, and others.

09/25/2003 — Discera picks DALSA to make its MEMS

Sept. 25, 2003 - Discera Inc. has selected DALSA Semiconductor as its high-volume manufacturer for a suite of RF MEMS devices for mobile phones and other portable electronics products, according to a news release.

09/26/2003 — Falling riders force Segway recall, but the MEMS stay stable

U.S. regulators and the maker of the Segway Human Transporter launched a recall Friday after receiving reports of riders falling off the MEMS-enabled machine when batteries run low. Segway said the recall will allow it to upgrade software that tells the rider if it's approaching critically low power. The improvements are not directly related to the scooter's MEMS gyros and tilt sensors.

09/02/2003 — Focal Point's 3-D lithography could lower barrier to MEMS use

Focal Point Microsystems LLC of Tucson, Ariz., believes its technology ends the quest for cost-effective nanoscale lithography for MEMS devices – an elusive industry Holy Grail. One of a number of companies pursuing maskless lithography for production of microscopic devices, the firm's technology "is basically like having the ability to produce a book without having to print one page at a time."

09/22/2003 — NanoVia shapes its own success with a laser-like focus

Sure, every company is supposed to focus on its business opportunity with laser-like intensity. At NanoVia Inc., they take that saying literally. Using a patented technology that employs the same type of optics used to make holograms, NanoVia fires powerful lasers at microstructures to sculpt them into carefully aligned shapes -- and produce a raft of business opportunities.

07/11/2003 — MEMS and the mask muddle: Small isn't cheap

As silicon chip features get smaller, the cost of making the masks that print them is exploding. At 90 nanometers, the next step down for chip makers, a set of masks costs $1.5 million. At the step beyond that, 65 nanometers, those masks will probably cost about $4 million. And a single chip can use 20 or more masks. Mask makers are in hot pursuit of an "innovative" solution to the cost dilemma.

07/03/2003 — Drug-coated scaffolds prevent scar tissue from forming in arteries

As a longtime trucker and owner of an expedited freight company, Elton “Tony” Brazeel knows the value of just-in-time delivery. But he never expected to benefit from it in the operating room. The Michigan man was among the first in the nation to get a drug-coated stent. He had four blockages and his cardiologist first told him of the advanced medical device only days before.

07/21/2003 — European firms try to carve their niche in tiny channels

Dozens of companies in Europe are making new microarray and microfluidic devices for very specific applications, but European industry has yet to commercialize lab-on-chip (LOC) devices that can be used in a more flexible way. “We are looking for the flexibility of a mass spectrometer or a chromatograph for quality control in industry,” said Andreas Manz, an Imperial College of London professor and pioneer in LOC technology.

07/28/2003 — JMAR's in motion to grab a corner of the microchips bag

If what they say about tool companies being necessary precursors to a successful nanotech industry, then JMAR Technologies Inc. is in the right spot. The San Diego-based company makes X-ray lithography steppers, which are motion control systems, for the microelectronics industry.

10/22/2003 — MEMS vs. nanotubes: Cell phones could use both

Two researchers at the University of California, Irvine, are using a $300,000 grant from the Defense Advanced Research Projects Agency to develop radio frequency signal processing components for wireless communication based on carbon nanotubes. Peter Burke and William Tang’s research could lead to a mobile phone with its electronic and mechanical functions on a single chip – saving power, space and cost.

10/24/2003 — All the world’s a stage for Kamen and the tempest around Segway

Book Review:In the end, it was much ado about something, and author Steve Kemper held a front-row seat for all but the last act. “Code Name Ginger: The Story behind Segway and Dean Kamen’s Quest to Invent a New World” is a modern drama with a Shakespearean hero in the visionary inventor whose character flaws undermine his ultimate goal to – yes – change the world.

07/09/2003 — Imaging tool tops in Micralyne design contest

July 9, 2003 – A MEMS-based tool for internal biomedical imaging took top honors in Micralyne Inc.'s annual Microsystems Design Award, according to a news release.

07/16/2003 — Dutch MEMS: Strong research, but no mass production . . . yet

The Netherlands is strong in MEMS research, but it fares badly compared with other European countries when it comes to boasting companies that actually produce components. Its lack of mid-size producers to drive commercialization partially explains why it lags neighboring countries.

07/16/2003 — FEI makes microelectronic acquisitions

FEI Co. has acquired a company and products to boost its efforts in microelectronics, according to a news release.

07/17/2003 — Tokyo Electron launches wafer tester for MEMS

Tokyo Electron Ltd. has released a new wafer test system for MEMS devices, according to a news release.

07/14/2003 — With new cash, facility and focus, Tronic's tries for new markets

Tronic’s Microsystems does not intend to remain at the research stage. The French company recently announced a new MEMS production facility and the close of two rounds of funding worth more than $12 million. Its next goal: The U.S. and Asian markets.

07/18/2003 — Companies compete to be heard on the increasingly noisy MEMS phone market

As tiny microphones built with small tech are getting ready to leap into mobile phones, hearing aids, personal digital assistants and MP3 players, there’s already some competition brewing. Akustica Inc. and Knowles Acoustics Inc., with Denmark’s SonionMEMS as a dark horse, are vying for market leadership in MEMS-made mikes.

07/01/2003 — Optical MEMS sees light in other tunnels

Optical MEMS developers are finding signs of life beyond the stagnant telecom market, according to a new report.

07/03/2003 — BEI to reacquire OpticNet

July 3, 2003 – BEI Technologies Inc. of San Francisco and OpticNet Inc. of Hayward, Calif. announced an acquisition agreement.

07/07/2003 — DALSA names CFO

DALSA Corp., a Waterloo, Ontario-based semiconductor and MEMS manufacturer, has named Paul Van Bakel its chief financial officer.

07/08/2003 — A delicious idea -- but it may be too pricey to be palatable

Call it a dielectric sandwich. That’s one approach behind Raytheon Co.’s attempt to commercialize radio frequency MEMS components: Etch a circuit onto a silicon wafer, slap on a layer of dielectric material, then put a MEMS switch on top of that. Voila – an integrated RF MEMS device.

07/11/2003 — Omron launches last-mile MEMS devices

Omron Corp. has launched what it calls "ultracheap" MEMS-based optical devices for fiber-optic networks, according to a news release.

11/10/2003 — Sony to make and sell MEMS devices

Nov. 10, 2003 -- Sony Corp. plans to make and market its own MEMS devices, according to a report in Japan's Nihon Keizai Shimbun news service.nullThe company, which offers MEMS foundry services, said it will produce devices such as gyros, switches and filters while using its production methods to[...]

11/13/2003 — Report: Sound future for MEMS microphones

MEMS-based microphones will grow from 1 percent of the 1.2 billion microphones sold this year to 20 percent of the 1.6 billion sold in 2006, according to a new report.

11/10/2003 — Small Times magazine recognizes small tech in today's world

Recognizing the people, products and companies that are leading the growth of the micro and nanotechnology industry, Small Times Media announces its 2003 Small Times Magazine Best of Small Tech Awards. These awards represent the best of the best in nanotechnology, MEMS and microsystems.

11/14/2003 — Acceleration sensor technologies fight for market share in new areas

Guest Column: If one thinks of acceleration sensors, the air bag in today’s automobile and the inertial navigation system used in modern avionics come to mind. But who would think of the various applications of accelerometers in industry, consumer markets, harsh environments or defense?

11/20/2003 — India MEMS program selects Coventor software

An advanced technology development program in India has selected Coventor Inc.'s software for a MEMS Initiative Program, according to a news release.

11/03/2003 — FLX Micro nabs new funding

FLX Micro has closed on an additional, but undisclosed, amount of venture financing.

11/11/2003 — Southeast France plants seeds for a fertile small tech future

With the recent launch of a MEMS fab in Crolles, near Grenoble, the southeast of France is beginning to look more like the French version of Silicon Valley. Tronic's Microsystems' new facility will start producing custom-made MEMS later this year and will allow the company to quadruple its production capacity.

11/20/2003 — Sensor maker Sionex nets $12.8 million

Sionex Corp., a Waltham, Mass. developer of chemical sensor chips and systems using MEMS technology, announced the completion of a $12.8 million Series B round of funding.

10/23/2003 — New enhanced air bags are creeping into midrange cars

August’s court decision scuttling a U.S. rule on tire monitors left sensor makers wondering what sort of MEMS pressure sensor market they’ll be facing. While their fate remains murky, companies that specialize in MEMS-based accelerometers and gyros may see demand grow through another auto-safety feature: enhanced air bags.

10/30/2003 — STMicro, MobiDiag link on lab-on-a-chip

STMicroelectronics, a Geneva-based developer of MEMS and semiconductor products, has teamed up with Finland's MobiDiag to create a microfluidic system that detects infectious diseases, according to a news release.

10/31/2003 — TI's micromirrors power Gateway TV

Gateway Inc. has entered the rear-projection television market with a product powered by Texas Instruments'Digital Light Processing (DLP) technology, according to a news release.

10/10/2003 — Numbers may not gauge it, but MEMS industry is moving at midyear

The past year has been challenging for those in the MEMS industry. Year-over-year revenues increased from $3.8 billion in 2001 to $3.9 billion in 2002 – even though unit shipments increased 47.6 percent. However, that disparity in growth rates shouldn’t be cause for concern. Economies of scale have come into play as more companies move from ramp-up to volume production.

08/24/2005 — Sports markets could benefit micro, nano

Aug. 24, 2005 -- The sporting goods market is turning out to be a favorite entry point for MEMS and nanotech companies, according to a new report from EmTech Research, a division of Small Times Media. "It's an ideal way for a startup and its technology to gain visibility in[...]

08/01/2005 — Opinion: Micro, nano wrestle with similar challenges

Micro and nano address matter, devices, and products on a scale where the phenomena differ from traditional science and engineering.

08/10/2005 — Xerox, Dalsa collaborating on MEMS

The relationship will combine Xerox's expertise in design with DALSA's MEMS and high-voltage device manufacturing.

05/26/2005 — mPhase Technologies, Bell Labs announce device sample

May 26, 2005 -- mPhase Technologies Inc. and Bell Labs, the research and development arm of Lucent Technologies, announced they have produced the first core components of a magnetometer. The company predicts its device could be up to 1,000 times more sensitive than conventional sensors used in metal detectors[...]

05/06/2005 — A decade of analyzing the MEMS industry opens the door to a lifetime of tracking high tech's next big hits

People often ask me how I became an industry analyst specializing in MEMS. The truth is, it was mostly a case of being in the right place at the right time with the right skills to tackle a complex subject like MEMS. Now I find myself in that position again, with the opportunity to research, analyze and write not only about MEMS, but all sorts of emerging technologies for EmTech Research, a new division of Small Times Media.

05/10/2005 — Turning a hurdle into a product that pleases clients (and investors)

Interestingly enough, we did not have the feeling of embarking on an adventure when Lutz Weber and I founded thinXXS four years ago. Perhaps that's because you sort of stumble into it. You are so preoccupied with organizing yourself and the business that it is only with hindsight you tend to think of it this way. It is also from today's perspective that I see how I have changed. Not so much as a person, but concerning my perception of the world around me.

05/11/2005 — Cash flow strategy helps tide company over in lean times

The business plan we created to start LioniX BV included a financial strategy that called for a set sum of funding. We based our plan on getting funding for one year to cover 50 percent of the salaries, the necessary investment for equipment as well as for taking care of cash flow. We estimated that our first revenues would appear after six to nine months, and break-even would be reached after one year.

05/17/2005 — Making profitability a priority ensures funding options in future

In the MEMS industry five years ago, venture capital financing was relatively easy to secure and many MEMS-based businesses raised millions of dollars at sky-high company valuations. Today, most of those companies are out of business or at the very least did not deliver on the promises made to their financiers. We could have followed the same path but didn't.

05/04/2005 — Optical networking report predicts rough times

May 4, 2005 -- Emtech Research, an Ann Arbor, Mich., micro and nanotechnology market analysis group, released its MEMS optical networking report. Revenues for MEMS devices sold into the optical networking market declined by 27.2 percent from 2003 to 2004, according to the report, although the level of unit[...]

05/06/2005 — EnOcean raises $13 mil for US expansion

May 5, 2005 - EnOcean GmbH, an Oberhaching, Germany, a start-up producing wireless radio sensors and switches without batteries, announced it raised $13 million for expansion of its U.S. business and to support integration of its technology within ASICs and MEMS.The company was founded in 2001 and[...]

04/29/2005 — EV Group installs system at SMI

April 29, 2005 -- EV Group, a Sharding, Austria, supplier of wafer bonders, aligners, photoresist coaters, cleaners and inspection systems, announced it installed a low-temperature wafer bonding system at Silicon Microstructures Inc. in Milpitas, Calif., a high-volume provider of silicon pressure and inertial sensors for automotive, medical, and industrial applications[...]

05/12/2005 — Apogee Technology unveils its first MEMS sensor

Apogee Technology Inc., a provider of integrated circuits and an emerging MEMS sensor supplier, today announced the introduction of its Sensilica family of "all silicon" pressure sensors. In addition to its first Sensilica product being sampled to customers, Apogee plans to introduce six new Sensilica designs in 2005 for various pressure sensor applications.

05/24/2005 — Report details opportunities for tri-axis MEMS accelerometers

The ability to sense linear motion (X and Y axis) and angular movement (Z axis), on a single chip, at a cost approaching $1 per axis, is opening the door for the rapid growth of tri-axis MEMS accelerometers, according to a report by EmTech Research, a division of Small Times[...]

05/23/2005 — NASA to put sensor in latest black boxes

NASA is using nanotechnology to guide near-term explorations of the moon and eventual trips to Mars. A joint project of NASA and El Segundo, Calif.-based Aerospace Corp. will develop a "black box" that uses nanosensors weighing a few grams. The nanosenors will be used to gather data about flight vehicles re-entering the earth's atmosphere from space. After the perilous high-speed part of re-entry, the black box will "phone home" by satellite and send data.

03/28/2005 — MEMS makers’ efforts bear fruit as Apple embraces sensor

If there is any one company whose use of a new technology signals that innovation’s arrival in the mainstream, it is Apple Computer. Apple’s use of the computer mouse and the graphical user interface 20 years ago catapulted those technologies into homes and offices as other computer makers adopted them in a rush to compete. In more recent years, Apple has done the same with wireless networking and devices like the MP3 player.

03/30/2005 — Qualcomm names team for new MEMS subsidiary

Mar. 30, 2005 -- Qualcomm Inc. announced the appointment of an executive management team for the newly formed Qualcomm MEMS Technologies Inc., a wholly owned subsidiary of Qualcomm. The Company also announced a strategic relationship with Prime View International to support its strategy of increasing the capability of consumer-targeted mobile[...]

03/07/2005 — Investing in nano: venture capitalists tell their side of the story

Micro and nanotech have many supporters, yet few put their money where their mouth is quite like venture capitalists. Four veteran VCs recently took a break from doling out dollars, and put their due diligence to work on a few questions posed by Small Times' Jeff Karoub.

03/04/2005 — Microfabrica takes EFAB process to new heights

Mar. 4, 2005 -- Microfabrica, a Burbank, Calif., developer of a MEMS manufacturing process, announced it has extended the capabilities of its EFAB process to fabricate complex three-dimensional microdevices over a millimeter tall. The company says its process is now the first micro-manufacturing technology to allow the fabrication of 1mm[...]

03/01/2005 — Polychromix unveils MEMS-based spectrometer

Polychromix Inc., a developer of advanced wavelength management solutions for optical systems, yesterday announced the launch of its Near Infrared Digital Transform Spectrometer (DTS) product family. Based on a MEMS spatial light modulator, the devices are designed to be compact, low cost chemical analysis systems.

03/02/2005 — Lightconnect ships 40,000th MEMS optical device

Lightconnect, a Newark, Calif., developer of MEMS-based components and modules for optical networks, announced today that it recently shipped its 40,000th variable optical attenuator (VOA) to a large optical system manufacturer.

11/11/2005 — Harris & Harris invests in Kovio

Nov. 11, 2005 - Harris & Harris Group, Inc. announced that it has invested $3 million in privately held Kovio Inc., of Sunnyvale, Calif. Kovio is developing semiconductor products using thin film technologies, printed electronics and nanoparticle inks. Harris & Harris is a publicly traded venture capital company that now[...]

11/15/2005 — Rite Track buys

Nov. 15, 2005 - Rite Track, a West Chester, Ohio, manufacturer of track systems, announced the acquisition of on-line equipment broker Tim Hayden, president and CEO of Rite Track, said the acquisition gives the company another source for the components it uses in its business and provides it[...]

11/30/2005 — NASA selects Boston Micromachines for phase 2 project

Nov. 30, 2005 -- Boston Micromachines Corp., a provider of MEMS-based deformable mirror products for adaptive optics systems, announced that it has been selected by NASA for a Phase 2 contract. NASA's Small Business Innovation Research Program (SBIR) awarded Boston Micromachines an approximately $600,000 contract to develop a deformable[...]

11/15/2005 — Polychromix releases new devices for its spectrometers

Nov. 15, 2005 -- Polychromix Inc., a Wilmington, Mass., developer of innovative material analysis, chemical sensing and spectroscopy solutions, announced the launch of its MobiLight products, a family of long life, portable lightsource and probe devices that support a broad range of spectroscopy applications. The release of the MobiLight family[...]

04/14/2005 — Joint venture to make sensors in China

China Automotive Systems Inc. of Hubei Province, China, announced it signed a joint venture agreement with Sensor System Solutions Inc. of Irvine, Calif., to produce sensors for the automotive market.

05/16/2005 — Dimatix opens MEMS fabrication facility

May 16, 2005 -- Dimatix Inc., a provider of commercial and industrial ink jet products, opened its Silicon Valley headquarters, research and development center and silicon MEMS fabrication facility today in Santa Clara, Calif. Dimatix has developed a unique MEMS process to create ultra-miniature ink jet structures within silicon. Dimatix[...]

05/16/2005 — CVD Equipment to buy some of First Nano’s assets

May 16, 2005 -- CVD Equipment Corp. of Ronkonkoma, N.Y., signed a contract with First Nano, Inc. of Carpinteria, Calif., to purchase some assets of its nanotechnology process development and equipment business. First Nano develops and manufactures process equipment suited to nanotechnology applications, including carbon nanotubes, nanowires and other[...]

05/16/2005 — Apogee Technology hires CFO

May 16, 2005 -- Apogee Technology Inc., a global provider of integrated circuits and an emerging MEMS sensor supplier, named Paul Murphy as its chief financial officer and vice president of finance and treasurer. Murphy's 25-year career includes positions with Artel Video Systems, UroMed Systems, Xyplex and Lexidata Corp. Apogee[...]

05/18/2005 — EV Group’s CEO, CFO step down

May 18, 2005 -- Two top executives at an Austrian supplier of MEMS, nano and semiconductor wafer-processing equipment resigned, the company announced today. Peter Podesser, chief executive officer, and Peter Hofmann, chief financial officer, left Scharding-based EV Group "due to different opinions in business policy," according to a written[...]

05/24/2005 — Colibrys to supply MEMS to BAE Systems

May 24, 2005 -- The Plymouth, UK-based division of BAE Systems named Colibrys SA its preferred supplier of accelerometers for use within BAE Systems' Inertial Measurement Units (IMUs) for defense and aerospace applications, Colibrys announced today. Colibrys, in Neuchâtel, Switzerland, provides standard MEMS products and custom MEMS solutions. BAE Systems[...]

05/24/2005 — Surface Technology Systems opens office in Singapore

May 24, 2005 -- Surface Technology Systems plc (FTSE: SRTS), a Newport, UK-based company that provides silicon etching within the MEMS market, officially opened a dedicated sales office today in Singapore. The Singapore office will provide local sales and service support to customers and STS agents in Asia and Australia[...]

05/10/2005 — Ocean Optics to distribute Polychromix spectrometers

May 10, 2005 -- Polychromix, a developer of advanced wavelength management solutions, and Ocean Optics, a diversified electro-optics company, have entered into a worldwide distribution agreement. Ocean Optics will distribute Polychromix's MEMS-based Near Infrared (NIR) Digital Transform Spectrometer (DTS)™ product family, consisting of three spectrometer versions: the DTS-1700 covering the[...]

07/22/2005 — Schneider Electric acquires BEI Technologies

BEI Technologies and Schneider Electric SA reached a definitive agreement for Schneider Electric to acquire all of the outstanding shares of BEI.

07/29/2005 — IQ Medical names new officers, directors

July 29, 2005 -- IQ Medical (OTC: IQMC) of West Palm Beach, Fla., announced it appointed new officers and a new board of directors. It named Johnny Christiansen president and chief executive officer and named Svein Milford chairman. It also named Robert Rudman chief financial officer, secretary and treasurer. All[...]

07/08/2005 — Opinion: Outsourcing offers more advantages than cost savings

Technology and the communications revolution have enabled an integrated world economy and have unleashed hypercompetitive enterprises.

04/07/2005 — Ask the analyst: four micro/nano experts show what life's like inside market research

Market analysts sometimes get a bad rap – for being overly optimistic, overemphasizing a trend or being just plain wrong. But when the data gathering's done and the modeling completed, it's still as much an art as a science. Small Times' David Forman turned the tables on four analysts, putting them in the position of answering rather than asking the questions.

04/26/2005 — Innovators who view the fossil fuel industry as a fossil industry miss out on opportunities

If you are a nanotechnology or MEMS entrepreneur, why should you care about the fossil fuel industry? The answer is two-fold. First, fossil fuels will provide much of the world's energy for the foreseeable future. Second, the fossil fuel industry needs technological innovation and has the ability to pay for those technologies. The key is to identify which technologies the industry needs.

04/25/2005 — Re-entry after a $750 million exit: A Small Times Q&A with Jesko von Windheim

A MEMS startup gets swooped up for $750 million in stock. Two years later it's sold again in a deal worth $10 million. Vast difference? Not according to Jesko von Windheim, who was along for Cronos Integrated Microsystems' wild ride after it was bought by JDS Uniphase. He now leads Nextreme Thermal Solutions, which is developing nanoscale materials that pump heat from integrated circuits and other electronic devices.

04/04/2005 — Analog ships 200 millionth MEMS

April 4, 2005 -- Analog Devices Inc. (NYSE: ADI) announced that it has shipped its two hundred millionth MEMS-based inertial sensor. The company's MEMS product portfolio now includes low-g and high-g accelerometers and gyroscopes in use by the automotive industry for applications such as multiple airbag, rollover, navigation, car alarm[...]

11/14/2005 — CardioMEMS announces FDA clearance, product launch

Nov. 14, 2005 -- CardioMEMS Inc., an Atlanta company focused on the application of MEMS technology to create innovative medical devices, announced U.S. Food and Drug Administration (FDA) clearance and the U.S. market launch of its EndoSure Wireless AAA Pressure Measurement System. CardioMEMS says FDA clearance was based[...]

07/26/2005 — Slower growth rate in revenues fits high-volume, low-cost trend

Gyros and optical MEMS are the last of their kind – devices that enter the market at very high prices. The next wave is entering the market in a completely different way.

07/01/2005 — A few microsystems suppliers will survive telecom's bust

Five years ago companies developing MEMS-based solutions for use in optical networking appeared to be on the road to riches. Over the next 18 months, a few may finally reach the entrance ramp.

07/21/2005 — Euro's gains push costs up for U.S. customers

The U.S. currency experienced a boost since STMicroelectronics outlined its restructuring strategy in June, but its overall weakness compared to the euro is forcing ST and other companies to engage in a difficult balancing act.

07/08/2005 — Rite Track announces first European orders for TEL track systems

July 8, 2005 -- Rite Track, a provider of track systems for the semiconductor, MEMS and thin film head industries, announced the receipt of its first European order for a remanufactured Tokyo Electron Limited (TEL) CLEAN TRACK MARK series track system. The multi-system order was made possible through the completion[...]

07/19/2005 — Bill adds $1.5 million for tabletop SEM

Soon educators may get another tool they hope will help students better understand nanotechnology and develop nano-related skills.

07/11/2005 — Report: Increases in MEMS revenue to slow as unit shipments grow

July 11, 2005 -- Although revenue and unit shipments of MEMS both rose by 15.2 percent in 2004, the pattern of growth in the sector is changing, according to a report recently issued by EmTech Research, a division of Small Times Media. While unit shipments are forecast to continue[...]

07/12/2005 — FormFactor ships 500th BladeRunner 175

July 12, 2005 -- FormFactor Inc. (Nasdaq: FORM), a Livermore, Calif., provider of wafer probe cards made using MEMS manufacturing, announced shipment of its 500th FormFactor BladeRunner 175 product, a 175 micrometer pitch wafer probing solution for high-performance flip chip System-On-Chip devices targeted to 90-, 65- and 45-nanometer process nodes[...]

07/13/2005 — Tegal receives expanded order

July 13, 2005 -- Tegal Corp. (Nasdaq: TGAL), a designer and manufacturer of plasma etch and deposition systems used in the production of integrated circuits and nanotechnology devices, announced that a European integrated device manufacturer that had previously placed a multiple system order with Tegal has increased the order to[...]

07/13/2005 — Integral Vision sells to Qualcomm

July 13, 2005 -- Integral Vision Inc. of Farmington Hills, Mich., announced it has received an order for its SharpEye inspection system from QUALCOMM. The system will be used for production testing of their iMoD MEMS Display. Integral Vision's SharpEye product can provide analysis of functional and cosmetic defects in[...]

07/15/2005 — SQI makes materials dept., hires new VP

July 15, 2005 -- Silicon Quest International (SQI) announced the development of its new materials engineering department focused on technical consulting and business development services. The new department is slated to provide materials and processing expertise for semiconductor companies, especially start-ups in the areas of MEMS, analog applications and telecommunications[...]

07/29/2005 — Bosch forms MEMS subsidiary

Headquartered in Kusterdingen, Germany, Bosch Sensortec GmbH will apply MEMS sensors to high growth markets like consumer electronics.

07/20/2005 — Startups rebuild amid telecom's rubble

Startups cocooned themselves as they overhauled products and business plans. This may be the year they re-emerge.

07/27/2005 — Nano's answer to the Nobel A Small times Q&A with Fred Kavli

Fred Kavli's Kavli Foundation announced this year that it was establishing the Kavli Prizes, three $1 million awards to be given in a biennial ceremony.

12/08/2003 — Report: Gyros a hot dish for auto, military

Revenues for MEMS gyros are expected to grow by more than $100 million in the next four years based on their ability to sense and measure rotational motion in automotive and military applications, according to a new report.

12/11/2003 — Researchers devise slick lab-on-a-chip

North Carolina State University researchers have designed a way to manipulate microscopic floating droplets on a chip – a technique that could expand the capabilities of lab-on-a-chip devices, according to a university news release.

12/18/2003 — Cepheid patent could boost DNA testing

Cepheid Inc. has been issued a U.S. patent that covers the design of a sample preparation cartridge containing a microfluidic chip for extracting and purifying multiple DNA targets simultaneously, according to a news release.

12/02/2003 — New IBM ThinkPad retains data even if owner is thoughtless

These accelerometers won't save your life. But they soon might save your data. IBM announced recently that it was launching an updated line of its ThinkPad laptop computers with accelerometers in a system to protect data during drops. The IBM Active Protection System includes a motion sensor that detects acceleration, such as in a fall.

12/12/2003 — Here's a new spin (cycle) on small tech: smart appliances

If you believe the hype, small technology will eventually find its way into everything but the kitchen sink. In the white goods category, this may not be too much of an overstatement. Over the next several years, “intelligent” appliances tricked-out with microscale sensors and actuators will hit home.

12/19/2003 — Don't stop after you set standards; VCs also look at best practices

This summer, while discussing the push for MEMS standardization with a venture capitalist, a very interesting question was posed in regard to current business models: What about best practices? This question is very well-timed because the MEMS industry's focus seems to be shifting toward sustaining a successful business.

12/01/2003 — Boob tubes in your Buick? Antenna arrays may make it possible

The results of a project funded by a $1.2 million federal defense grant could send a clear signal to developers of next-generation military and commercial communication systems. A University of California, Irvine, professor is working on light and low-cost antennas based on radio frequency (RF) MEMS. Such technology could provide satellite TV in a car, and eventually, laptops.

12/16/2003 — IntelliSense vets buy Corning's MEMS software unit

Original employees of IntelliSense have acquired the MEMS software business unit assets of Corning IntelliSense, which will close early next year.

04/02/2003 — Dutch company positions itself for the growing MEMS market

MEMS manufacturers are generally still years behind their colleagues in the conventional integrated circuit industry when it comes to feature size. While everybody seems to be focusing on next-generation lithography tools that enable nanometer-size resolution, ASML has a new tool targeted at MEMS.

04/02/2003 — Texas Instruments joins MEMS Industry Group

April 2, 2003 -- Texas Instruments (TI), whose Digital Light Processing technology is among the most successful examples of MEMS in the marketplace, has joined the industry's trade association. The Pittsburgh-based MEMS Industry Group (MIG) announced today that TI joined its roster of nearly 40 members, including Honeywell, Corning IntelliSense[...]

04/15/2003 — Microtech's plumbers reach for tools to unclog production

The shape of an hourglass might best describe the route from initial design to final realization of microtechnology products. Production and assembly represent the narrow part in the middle that holds up the flow. This bottleneck in the process is created by faulty approaches and entrenched self-interest, according to participants at a special section of Hannover Fair 2003 devoted to microproduction.

04/22/2003 — Transparent Networks to close

April 22, 2003 -- Transparent Networks Inc., an optical MEMS startup that said it had developed the largest mixed signal integrated circuit in the world, is closing. "Considering that the nuclear winter in the telecom market delayed significantly the sales cycle for the next-generation products, (our) board requested the[...]

04/25/2003 — As privacy vs. security debate heats up, NSF primes sensor pump

The Palo Alto Research Center (PARC) has an illustrious history of technological innovation, including Ethernet networking and the personal computer. In the future, it hopes to add wireless sensors to its list.

04/29/2003 — Small tech companies outduel all comers at Purdue competition

Small tech companies took two out of three top prizes at Purdue University’s Life Sciences Business Plan competition last week, besting contenders that offered cures for multiple sclerosis, high blood pressure and improvements in pharmaceutical manufacturing.

04/22/2003 — Akustica launches MEMS microphone

Akustica Inc. has launched its first product – a MEMS-based acoustic microphone chip.

04/02/2003 — Report: Sensor market to reach $4B by 2007

Despite interest and expectations heightened by war and terrorism, development of MEMS sensors for real-time detection and monitoring of biological and chemical weapons remains a few years away, according to a new report.

04/01/2003 — German MEMS maker buys Electroglas system

April 1, 2003 -- A German MEMS device maker bought an automated wafer inspection system from San Jose, Calif.-based Electroglas Inc., according to a news release. The purchase price was not disclosed. HL Planartechnik GmbH said the QuickSilver IIe, which identifies, measures and classifies defects on processed[...]

04/21/2003 — MEMS shine in telecom forecast

A new report says that 2002 sales of MEMS devices for optical networking were strong despite the continued tough telecom market.

04/22/2003 — Here's a new idea: the Internet; customers demand e-commerce

Small tech companies are increasingly using the "last big thing" as a moneymaking tool. Nanotech and MEMS companies are using e-commerce as a way to shrink sales costs. "The hype about it died and the revenue opportunity for investing in it died, but the usefulness for selling over the Internet never died," said one analyst.

06/12/2003 — Illumina launches new microarray platform

June 12, 2003 - Illumina Inc. is manufacturing a microarray for large-scale analysis of genetic variation and function, according to a news release. Sentrix BeadChips, based on Illumina's BeadArray technology, are made using highly flexible MEMS technology. The method allows for the creation of any number of microfabricated wells[...]

06/19/2003 — Chips, other small devices help patients battle eye diseases

For more than 40 million people around the world, blindness is a fact of life. But for the many millions who are afflicted with progressive eye diseases and disorders, restored vision one day may be found in tiny chips implanted in the eye. The chips stimulate the optic nerve that links the eye and brain and may help patients battling macular degeneration or retinitis pigmentosa.

06/27/2003 — Coatings and arrays help put medication where it's needed

Small tech is helping medicinal molecules such as proteins, peptides, genes and vaccines reach the right destination with greater precision, speed and control. And the mechanisms – including implants, particles and patches – are as varied as the types of payloads delivered. Delivering materials directly inside targeted cells could improve cancer treatments and help reduce side effects, and it holds promise as a better way to offer gene therapies.

06/27/2003 — One man's solution to micromachines' power problem looks good on paper

If Baruch Levanon of Israel’s Power Paper Ltd. has his way, billions of batteries may soon be rolling off the printing presses just like your morning newspaper. Levanon believes it is just a matter of time before his slender, flexible batteries are used to power applications ranging from smarter smart cards to MEMS-driven health-care devices.

06/13/2003 — Microvision revs MEMS printer engine

Microvision Inc. will develop a new scanning engine for high-speed laser printers based on its micromirror technology for an Asian manufacturer of printers and office equipment, according to a news release.

06/24/2003 — Rainier adds MEMS PR practice

Rainier Corp., a Princeton, Mass.-based public relations and advertising agency, has launched a MEMS practice, according to a news release.

06/26/2003 — Bush's choice for science adviser has big background in small tech

June 26, 2001 -- The man expected to have President Bush's ear on science and technology issues understands the potential of nanotechnology and MEMS. null John H. Marburger III stands in the collider tunnel at Brookhaven NationalLaboratories. Marburger is President Bush'schoice for science and technology adviser. Brookhaven National Laboratories photoFor[...]

06/05/2003 — Hitachi enters a house haunted with ghosts of optical past

Remember OMM, the now-bankrupt company with great MEMS technology but not enough customers? One lesson learned from the networking crash is that cheaper products are the most cheerful sellers in this miserable market. Nonetheless, engineers at Hitachi are convinced that their technology can go where other higher-priced, all-optical switches haven’t: into optical networks.

06/04/2003 — Advisers urge India not to let country miss out on another revolution

Having missed the semiconductor revolution, India can't afford to let another tech monsoon blow by, the country's science advisers are warning their leaders. The plea has not been completely ignored, especially by India's minister for science and technology, who understands that India is a sleeping giant that is only slowly waking up to the challenges of small tech.

06/03/2003 — Tanner adds new Spice to software design

June 3, 2003 -- Tanner EDA, a California-based maker of integrated circuit design tools, has launched the latest version of its T-Spice Pro software for MEMS, and integrated circuit designs, according to a news release. T-Spice Pro 9 features several enhancements to boost the precision and speed of simulation and[...]

06/09/2003 — EV Group launches wafer-edge inspection system

June 9, 2003 - EV Group, an Austrian maker of MEMS and semiconductor wafer processing equipment, has launched a new system for wafer-edge defect inspection, according to a news release.The SmartEdge automatically detects defects such as scratches, chips, cracks, as well as crystal growth with a robotic handling system[...]

06/10/2003 — Three up to MEMS Design Challenge

June 10, 2003 - A rugged, reliable gyroscope that could be useful in aerospace, military, automotive and consumer markets took top honors in MEMGen Corp's 3-D MEMS Design Challenge, according to a news release.Cenk Acar, a Ph.D. student in the University of California, Irvine's MicroSystems Lab, submitted the[...]

06/11/2003 — ISSYS launches nanomaterial subsidiary

Integrated Sensing Systems Inc. (ISSYS) has launched a new business for its nanomaterial designed to boost the performance of MEMS and other devices.

06/13/2003 — Ultrasound works like bat's ears to make real-time 3-D images

MEMS exploded the old way of triggering automobile air bags, rewrote the hard drive business and may now be about to change the picture for the $3.3 billion medical imaging industry. Sensant Corp.’s Silicon Ultrasound Technology uses a MEMS technique similar to the way a bat’s ears work to make real-time 3-D images of the carotid artery, breast cancer lesions and the musculoskeletal system.

06/18/2003 — Micralyne, Canada collaborate to mass-produce MEMS on the cheap

Creating customized chips for specific purposes is time-consuming and expensive. Mass-producing chips can bring the cost down, but only when there is a broad demand for a specific type. Researchers at Micralyne, with the help of the Canadian government, think they have the answer to the problem.

06/20/2003 — SUSS launches lithography package

June 20, 2003 -- SUSS MicroTec, a Munich, Germany, supplier of production and process technology for the small tech and semiconductor industries, has launched a new package of lithography tools, according to a news release. The package of four technologies, known as SupraYield, boosts throughput and resolution, and reduces lithography[...]

06/23/2003 — Discera's dilemma: Making enough noise to merit mobile's attention

Cell phones. Everybody’s got them. No one thinks much about what’s inside. Discera wants you to, especially if you’re a mobile phone manufacturer. The company has developed a tiny mechanical device that vibrates at predetermined frequencies. “The first challenge is to go after a market we know is out there,” says Discera's CEO.

06/30/2003 — Olympus' partnership across the Pacific expands its MEMS borders

Experience can be an advantage when establishing yourself in a new market, and the Olympus Partnership Development Group of San Jose, Calif., is banking on its parent company’s 20 years worth of expertise in MEMS to be successful. It also doesn’t hurt to have a global brand presence and the deep resources of a multibillion-dollar company like Olympus Optical Co.

06/25/2003 — Bioinformatics grows to keep pace with petabytes of small tech data

A microfluidic device can function as a "liver-on-a-chip." Forests of nano-pillars can unravel strands of DNA. These small tech-enabled leaps in life science involve increasingly complex interactions, and the result is new data for scientists working on curing diseases. In fact, so much data that humans alone cannot possibly make sense of it all. Muscling such large and complex raw results into useful knowledge is the goal of bioinformatics.

06/27/2003 — Omron to offer MEMS flow sensor

Omron Corp. will begin selling a MEMS-based gas flow sensor for medical, industrial and consumer applications, according to a news release.

06/03/2003 — Nanosys round shows small tech turning heads in big boardrooms

In another sign that established companies are paying more attention to small tech startups, a pair of decidedly old-economy firms are investing in Nanosys Inc. The extension of the Palo Alto, Calif., nanotech outfit's second funding round was announced this morning.

06/04/2003 — Nanostream nets $22M in ongoing round

Nanostream Inc., a Pasadena, Calif., developer of microfluidic systems to automate laboratory procedures, announced a $22 million commitment from institutional investors in an ongoing round of financing.

06/06/2003 — Reality is the concept that governs the new nanobusiness world

Did you know that 13 of the top 30 Dow component companies discuss nanotechnology on their Web sites? "This year's about who's getting real," said Jim Hurd, founder of the NanoScience Exchange in Silicon Valley. That was evident at a recent nano conference that featured very real industrial giants.

06/12/2003 — Rich single company ISO nano for LTR, not ready for marriage

It was only a matter of time before more big firms came hunting for small tech deals and acquisitions. If the last few weeks are any clue, publicly listed corporations are increasingly interested in their smaller, privately funded brethren. Those scouting the nanotech startup field, however, say that for now it’s more about collaboration than consolidation.

08/28/2003 — MEMSCAP to acquire GalayOr and more cash

MEMSCAP SA, a France and Silicon Valley-based MEMS designer and manufacturer, plans to acquire Israel-based GalayOr Inc. and raise $3.5 million from its original investors, according to a news release.

08/05/2003 — Nano tool market is no small change

Gerd Binnig still recalls what it felt like in 1981 when he tested his technical innovations and saw atomic structures for the first time. “It was like a dream to discover all this,” said Binnig, a fellow at IBM Zurich Research Laboratory who shared a Nobel Prize in physics for designing the scanning tunneling microscope (STM) and helped create the atomic force microscope (ATM). “It was like being for the first time on the moon.”

08/19/2003 — Phoseon launches MEMS inspection system

Phoseon Technology Inc. has launched an automated optical inspection system for advanced packaging applications in MEMS, according to a news release.

08/26/2003 — MEMS standards, while small, may mean much for the industry

Standards in the MEMS industry may have taken a small step with the recent publication of National Institute of Standards and Technology (NIST) micromachine measurements, but the larger debate continues over standardization of such a diverse industry. Industry leaders say they hope the new development leads to more efficient manufacturing, improved reliability and greater trust from MEMS purchasers.

08/04/2003 — STS sharpens its MEMS tools to carve a niche in industry

Surface Technology Systems, a respected supplier of deep-etching tools to MEMS researchers, is now ready to serve the market for full-scale MEMS production. It just hopes the market is ready. STS's tools are popular among academic and industrial MEMS research labs because they can make silicon structures that are much taller than they are wide.

08/11/2003 — Palomar hopes to dominate assembly with its one-stop shop

Palomar Technologies began life as a small assembly and test division of a major aerospace company. Two decades later, the company went out on its own, switched its focus from manufacturing assembly equipment to providing complete assembly-line products for high-end MEMS that require customized precision.

08/25/2003 — Axsun isn't sitting by the phone, waiting for telecom to call again

Axsun makes MEMS components for the telecommunications industry. To put it mildly, that does not seem to be the best business plan these days. Jack Kay, Axsun's own chief executive, knows this and he is unafraid to say so. He banished telecom to Axsun's back burner while the company pitches its capacity to manufacture MEMS components.

08/22/2003 — MEMS companies don’t need foundries, they need partners

Guest Column: The MEMS industry has seen mixed success over the last decade. Today, there are only a few high-volume MEMS products available. Despite a major infusion of funds, efforts have not yet produced working MEMS in high volumes. The customer-foundry relationship is a significant factor. The “foundry” must be more than just a foundry; it must be a true manufacturing partner.

08/19/2003 — What's wrong with the grid? It's dumb; sensors might make it smarter

Even as the energy industry struggles to understand why last week's blackout occurred, experts are examining ways in which small tech could help prevent it from happening again. And they're finding at least one new way to make the grid run more efficiently: microsensors. Not only more efficiently, but "smarter." The MEMS-based systems can do that by circulating up-to-date information about what’s going on within the power systems.

08/18/2003 — Sensant gets $500,000 for medical imaging

Sensant Corp. received a $500,000 federal grant to develop a new generation of MEMS sensors for medical imaging, according to a news release.

08/22/2003 — Gabriel to give keynote at MEMS forum

Aug. 22, 2003 -- MEMS pioneer and entrepreneur Ken Gabriel will be the keynote speaker at the MEMS Executive Forum.nullGabriel, co-founder, chairman and chief technology officer of Akustica Inc. as well as former executive director of the MEMS Industry Group, will discuss lessons learned from holding key posts in[...]

04/07/2003 — IMMI is switching from telecom to more promising products

A funny thing happened to Integrated Micromachines Inc. on the way to creating an all-optical switch: The bottom fell out of telecom. So, the Monrovia, Calif.-based company switched gears and diversified its business. Today, IMMI is focused on building low-pressure sensors and gyros, and demand is growing quickly for its foundry services.

04/21/2003 — FlyTimer jettisons half of 'a wing and a prayer' for small planes

FlyTimer Inc., an eight-person startup next door to Hanscom Airport in suburban Boston, has devised a MEMS-based datalink transceiver for aircraft communications. The system-on-a-chip device will let corporate aircraft and private pilots tap into a nationwide network of ground-based flight services that currently only commercial airlines can afford to use.

04/28/2003 — Its cells may be thin, but Cymbet says they pack a big punch

Small tech engineers are constantly challenged in their quest to come up with adequate batteries or power supplies for products. Cymbet Corp. of Elk River, Minn., says it has the solution. The company manufactures thin-film rechargeable batteries that can be incorporated into any chip design, will last the full life cycle of any product and can be recharged up to 70,000 times.


Electricity disruptions like those that plague California could be averted using microsensors and other small tech devices.

06/23/2003 — Infineon: SensoNor agrees to acquisition

Infineon Technologies AG, a Munich, Germany, semiconductor firm, is expected to announce today that the major obstacle in its friendly acquisition of Norway’s SensoNor ASA has been overcome.

06/10/2003 — Microarrays get their 15 minutes, but routine use still 10 years away

The U.S. Centers for Disease Control and Prevention recently released its latest test for the SARS virus, but it will be another decade before microarray technology brings quick, accurate tools for detection of this and other viruses directly to the doctor's office. Microarrays had a brief moment in the spotlight when researchers used the devices to quickly identify the virus that causes SARS.

08/07/2003 — Court deflates rule on tire pressure monitors

A federal appeals court in New York has nullified a rule that set the performance requirements and deadlines for automakers to install tire pressure monitoring (TPM) systems in U.S. passenger vehicles.

08/21/2003 — Kionix launches two MEMS accelerometers

Aug. 21, 2003 - Kionix Inc. has launched two MEMS accelerometers for automotive applications, according to a news release.

08/12/2003 — Researchers aim to end agonizing wait for transplants

Organ farming has always been one of the more macabre slices of science fiction: mad scientists growing livers, brains, kidneys and the like in strange tanks, awaiting transplantation into some Frankenstein creation. Dr. Joseph Vacanti is trying to make organ farming a reality. His work is anything but a horror show – and thanks to MEMS technology, it won’t be the stuff of fiction forever.

08/20/2003 — Tire sensor makers gauging pressures of court decision

This month's appeals court decision scuttling a U.S. rule on tire monitors leaves sensor makers in an awkward position. They know they will be dealing with a regulated market, but they don't know what the rules will be. Analysts say sensor and component suppliers are left wondering whether they'll soon face more demand, or a market similar to the one they had anticipated. So they must plan for the different scenarios.

08/20/2003 — Report: MEMS sector still solid

Aug. 20, 2003 – Last year was one of the toughest to date for the MEMS industry, with revenues inching up only slightly and many companies going out of business, according to a new report.

08/04/2003 — BEI supplies more MEMS for Predator

BEI Technologies Inc. will supply another round of MEMS sensors for the Predator missile program, according to a news release.

08/01/2003 — Not exactly quicker than a ray of light, but optical MEMS will fly

Say the word “communications,” and chances are you’ll think of optical networking. This is mostly due to the staggering drop in earnings over the past couple of years, high-profile bankruptcy filings and countless failed startups that took with them loads of VC money and any remaining faith in the market.

06/05/2002 — U.S. gives automakers choice in tire sensors

June 5, 2002 -- The U.S. National Highway Traffic Safety Administration (NHTSA) will allow automakers to install either one of two types of tire pressure monitoring systems that warn motorists when tires are dangerously underinflated, beginning with 2004 model vehicles. One method incorporates MEMS pressure sensors while the other[...]

06/07/2002 — Verimetra names CFO, directors

June 7, 2002 -- Joseph Anania was named chief financial officer of Verimetra Inc., a Pittsburgh-based maker of MEMS devices for the surgical industry. Anania served as UPMC Health System's director of corporate development. He also has a decade of experience as a financial consultant for midsize companies. Verimetra also[...]

06/12/2002 — Owens ships microfluidic processing system

June 12, 2002 -- Owens Design Inc. said it has delivered a microfluidic-based system for use in DNA analysis, proteomics and other life science applications. The company said it engineered the mechanical and microfluidic systems for the machine, which automates the coating of the walls of a 96-well pattern microfluidic[...]

06/24/2002 — Company brushes up on better dental implants and prosthetics

Orthogen Corp. has developed a new dental implant with microgrooves designed to improve how bone and soft tissue grow into it. The device has already been implanted in 70 patients in Italy and clinical trials are starting in the United States. Researchers are also trying to apply the technology to more safely attach permanent prosthetics.

06/04/2002 — U.S. military's research agency gets a new microsystems chief

For only the fourth time in its history, the branch of the U.S. Defense Department that helped jump-start the microsystems industry is welcoming a new director to oversee its MEMS efforts. The changing of the guard is part of the Defense Advanced Research Projects Agency’s mission to ensure that a spectrum of technologies gets consideration.

11/15/2002 — Standard MEMS to liquidate

The case of Standard MEMS Inc., the Burlington, Mass.-based MEMS fab that sought Chapter 11 reorganization protection in September, has been converted to a Chapter 7 liquidation bankruptcy, according to court records.

11/15/2002 — Saab to exit MEMS business

Saab AB said it will close its wholly owned unit, Saab MicroTech AB, according to a news release. Saab said the 10-person subsidiary

11/22/2002 — Swiss MEMS fab navigates new funding while it guides missiles

Intel Capital, along with others, has invested $10 million in MEMS manufacturer Colibrys. Its fastest growing market at the moment is aerospace and military. These customers are ordering inertial navigation systems and accelerometers, which have to be robust enough to withstand the shock of a missile launch, but sensitive enough to do the job once the system is in flight.

11/21/2002 — MEMS groups link across Atlantic

Two continents' leading MEMS trade groups say they will join forces on several projects to boost small tech development and commercialization in Europe and North America.

11/27/2002 — Nanotech fund off to slow start; could spur industry investment

The first mutual fund of publicly traded small tech companies was launched this month, and it got off to a slow start. But industry experts think it has great promise and the timing is right. As for the first day of trading, “It was quite sluggish,” said a portfolio manager. “People are hesitant because they don’t know nanotechnology sufficiently well.”

11/15/2002 — How does nanotech measure up? First, you need the right yardstick

How fully nanotechnology realizes its business potential will hinge on the industry’s ability to accurately test and measure its products. Companies won’t trust their mission-critical procedures to nanotech unless the test and measure dragon is slain. Gauging dimensions, thermal properties, strength and other elements is key in creating “manufacturability,” or the ability to create a duplicate object on an ongoing basis. Progress appears mixed.

11/22/2002 — Process is MUSiC to FLX Micro's ears

FLX Micro said it has finished the first manufacturing run of a micromachining process using a material it said is stronger and more durable than standard silicon.

11/04/2002 — Telecom is next on the continuum for 'smart ceramic' MEMS company

You can say that Continuum Photonics has bounced from one idea to another. When the company was founded, it made vibration-dampening equipment for the aerospace and defense industries. Then came a foray into athletics: Continuum designed a chipset that went into tennis racket that helps absorb the shock of a ball. Up next: the risky telecom business.

11/11/2002 — Coventor co-invents products while it reinvents itself

In 1994, Mike Jamiolkowski became fascinated by MEMS technology and incorporated Microcosm Technologies to develop MEMS design software. Today, the company now known as Coventor Inc. is getting ready for a December unveiling of its latest software release, CoventorWare2003. But the past eight years have seen many Coventor technology makeovers.

11/13/2002 — MEMS in games, gadgets grows

Consumer electronics makers will put MEMS devices in more products because they offer more performance and functionality for the same or lower price. But the expanding market comes with growing pains, according to a new report.

11/26/2002 — DARPA taps Radant for RF MEMS project

Radant MEMS Inc. said it has been selected by the U.S. Defense Advanced Research Projects Agency for a multimillion-dollar radio-frequency (RF) MEMS Improvement Program.

11/12/2002 — OMM supplies MEMS to Chinese telecom

OMM Inc. said ZTE Corp. of China has incorporated OMM's MEMS-based products into a metro telecommunications system.

11/19/2002 — MEMS really is the word at Munich electronics trade show

Germans might not have a reputation for being the jolliest people around, but those presenting a forum on the outlook for the European MEMS industry at the Electronica 2002 trade fair recently were all smiles. The scientists, officials and market watchers painted a generally rosy picture of an industry that has enjoyed steady growth despite the general downturn in the tech sector.

11/12/2002 — Report: MEMS sensor market growing

Tire pressure monitoring and global positioning systems are among the areas spurring billion-dollar growth for MEMS sensors, according to a new report.

11/01/2002 — MEMSCAP releases Q3 revenues

MEMSCAP S.A. (Euronext: MEMS), a MEMS provider based in Grenoble, France, announced third quarter revenues of $1.29 million, versus $0.99 million for the same period last year. The company did not release information about earnings or losses.

11/06/2002 — Firm launches patent profiles on MEMS, NEMS

Thomson Derwent, a provider of patent and scientific information, said it has launched a global source of patent information related to micro- and nanosystems.

11/07/2002 — Dalsa raises cash for more investments

Dalsa Corp., a Waterloo, Ontario-based provider of semiconductor and electronic components in MEMS and other technology areas, announced a deal to raise (U.S.) $20.6 million (CDN $32 million) according to a news release. The proceeds are intended to reduce debt to enable the company to consider investments or acquisitions, the release said.

11/12/2002 — New Jersey pools its resources for faster-to-market small tech

The goal of the New Jersey Nanotechnology Consortium, a nonprofit corporation headquartered at Bell Labs, is to leverage the center's 40 years of experience commercializing technology. CTO Om Nalamasu says that companies that want to unlock the commercial potential of small tech need to pool resources.

12/17/2002 — DARPA gives IMT $1.8M grant for cell therapy

Innovative Micro Technology (IMT) said it received $1.8 million from the Defense Advanced Research Projects Agency and the U.S. Army to develop a MEMS-based system for purifying human blood stem cells.

12/18/2002 — Olympus zooms in on MEMS

Olympus Optical Co. said it will spend more than $80 million overhauling one of its Japanese plants to make MEMS, according to Asia Pulse.

12/20/2002 — Verimetra receives 'cutting-edge' patent

Dec. 20, 2002 -- Verimetra Inc. said it has received its first patent for the use of MEMS sensors on metal cutting instruments. The Pittsburgh-based maker of MEMS devices for the medical industry said the U.S. patent allows it to expand its business to include cutting instruments for personal[...]

12/10/2002 — Small tech gets a larger piece of the U.S. defense research pie

The research arm of the U.S. Department of Defense earmarked more than $124 million of its 2003 budget specifically for MEMS, microsystems and nanotechnology, and listed programs totaling $805 million that likely involve small tech, according to a Small Times review.

12/19/2002 — Lightconnect sells MEMS in China

Lightconnect Inc., a Newark, Calif.-based supplier of MEMS components and modules for optical networks, said it will supply a dynamic gain equalizer to China's largest listed telecommunications equipment maker.

12/27/2002 — European study says only the big photonics players will survive

Only 15 percent of Europe's more than 100 optical components suppliers, many of which are small tech firms, will survive in the medium term, according to research from Yole Developpement. The Lyon, France-based research firm polled and profiled some 90 European optical components companies for its newest study. It concluded that the sector is facing rapid consolidation.

12/10/2002 — New company to make wireless sensor networks

A new Massachusetts-based firm said it plans to develop and sell low-power, battery-operable wireless sensor network systems for commercial, industrial, agricultural and security industries.

11/12/2002 — Small Times magazine announces Best Of Small Tech Award winners

Small Times magazine has announced its 2002 Small Times Magazine Best of Small Tech Awards, recognizing the best people, products and companies in nanotechnology, MEMS and microsystems.

12/30/2002 — Trikon debuts DSi module for deep silicon etch processes

Trikon Technologies Inc. has introduced a new DSi module for high rate, anisotropic, deep silicon etch processes for the fabrication of microelectromechanical systems (MEMS).

12/05/2002 — Inventor's long, strange trip to market fueled by MEMS

As the Segway throws itself on the mercy of the market on Amazon, its older cousin, the iBOT, moves closer to opening new worlds for the wheelchair-bound. An FDA board recommended approval for the iBOT, a wheelchair with MEMS gyroscopes and accelerometers that enable it to climb stairs and balance on two wheels.

12/30/2002 — Segway rolls toward top of Amazon list

The Segway Human Transporter, a self-balancing personal transportation vehicle, is among the best selling items on Inc.’s Web site, the Reuters news service reported.

12/06/2002 — Cryonics conference brings out nanotech's extreme optimists

At a recent Conference on Extreme Life Extension, two well-known scientists presented their visions for the far-out future of nanotechnology. Imagine a time, they said, when doctors will routinely inject billions of nanosized robots into patients’ bodies. Sound far-fetched? Maybe, but the only way to really find out whether nanomedicine is achievable is to give it a try.

10/28/2002 — Santec launches optical MEMS device

Santec Corp. of Japan said it has launched a new MEMS-based variable optical attenuator for optical networking systems.

10/08/2002 — Veeco came, saw, acquired majority of the AFM market

When Veeco was founded in 1945, the name was an acronym for Vacuum Electronic Equipment Company. Today, it might stand for Very Enormous Electronics Company. Recently, its acquisitions have revealed a move toward nanotechnology and MEMS. Most notable are Veeco’s purchases of three companies that manufacture atomic force microscopes.

10/04/2002 — TRONIC'S inks deals with two Japanese firms

TRONIC'S Microsystems SA said it has signed distribution deals with two Japanese firms.

10/10/2002 — Uncle Sam sends its money where VCs and angels fear to tread

The U.S. government’s Advanced Technology Program has given $101.6 million to 40 research projects, at least seven of which involve small tech. This batch of awards contains the largest number of nanotech projects the ATP has ever selected. The program awards grants to companies engaged in “innovative” but “high risk” research that private investors won't touch.

10/10/2002 — Zyvex makes pact with Honeywell

Zyvex Corp. on Thursday officially announced the addition of Honeywell International Inc. to an existing five-year, $25 million industry-government program to create microscale assemblers and then bring them down to nanoscale.

11/21/2002 — For MEMS, the key to lowering cost is all in the packaging

Carsten Bahle of Wicht Technologie Consulting doesn’t mince words when it comes to the need to rethink MEMS packaging. “The biggest stumbling block to commercial success is the lack of general, simple and effective packaging techniques,” he said. The reason is simple: cost. Although these microsystems are getting smaller all the time, that doesn’t mean packaging costs are shrinking as well.

11/13/2002 — Few firms have figured out how to make MEMS quickly and cheaply

The transition from concept to high-volume MEMS production is expensive and risky. While engineering resources exist for taking a good idea for a microdevice through design, prototyping, testing and high-volume production, the infrastructure for doing so is still evolving. There are no guarantees of success, no standards to follow and packaging problems continue to be almost insurmountable.

11/13/2002 — Merger gives MEMSCAP MUMPS

MEMSCAP said it has launched a one-stop software and service package for designing and prototyping MEMS-based products.

11/20/2002 — Competitive Technologies licenses automotive MEMS

Competitive Technologies Inc. said it has licensed MEMS-based technology for vehicle safety.

10/23/2002 — Agere to sell optical MEMS to TriQuint

Oct. 23, 2002 -- Agere Systems is selling most of its optoelectronics business, including MEMS, to Oregon-based TriQuint Semiconductor Inc. The sale includes the products, technology and some facilities related to the business, but not Agere's components for cable television transmission systems. Agere seeks a buyer for that business, according[...]

10/31/2002 — SpectRx narrows third quarter loss

SpectRx Inc., a Norcross, Ga., developer of medical detection, monitoring and treatment devices using MEMS and other technologies, posted a $1.1 million third quarter loss, or 10 cents per share, compared with $1.6 million for the year-earlier period, according to a news release.

12/04/2002 — Survey indicates U.K. could lose on small tech commercialization

The U.K.'s business community has to put small tech on its agenda or lose the race to commercialize the technology, according to a recent report, "2010 Micro/Nanotechnology in the U.K." It was based on a survey of 200 company officials conducted for the Institution of Electrical Engineers.

12/12/2002 — Private money fails to make the small world go 'round

Nanotechnology may be the next big thing, but that doesn’t mean nanotech startups are getting funded. Numbers are hard to come by, but one estimate says only 20 nanotech deals were done in the first half of 2002, and the pace has not quickened. “The private capital hasn’t flowed in quite as aggressively” as expected, said Nathan Tinker of the NanoBusiness Alliance.

12/12/2002 — SpectRx moves to SmallCap

Dec. 12, 2002 -- SpectRx Inc., a Norcross, Ga., developer of medical detection, monitoring and treatment devices using MEMS and other technologies, announced that its common stock will trade on the Nasdaq SmallCap market, effective today. The stock had previously traded on the Nasdaq National market, but no longer meets[...]

12/23/2002 — Microlab seeks funding as it prepares launch of RF MEMS switch

With an experienced management team and a manufacturing deal in place, Microlab Inc. plans to go to market with its electromagnetic radio frequency (RF) MEMS switch early in 2003. Some challenges still remain, including a bid to close the company's last round of funding this year, but the firm believes that its core technology will be the funding clincher.

06/03/2002 — Calient launches new switch, payment plan

June 3, 2002 -- Calient Networks said it has expanded its product line with a new MEMS-based optical switch, according to a news release. Calient officials said the DiamondWave 128 system offers lower costs than competitors' switches through high-yield MEMS manufacturing and significant design breakthroughs. The switch, designed for regional[...]

06/05/2002 — Agere wriggles free of Lucent, tries to make it alone in MEMS

Agere Systems should succeed in staking a name and claim separate from Lucent Technologies, despite a rocky road to independence and rough economic times, analysts said. Lucent has completed the spinoff of optical MEMS maker Agere after many months of delays.

06/11/2002 — IBM's Millipede getting legs

June 11, 2002 -- IBM researchers said they have demonstrated the ability to store 25 million printed textbook pages on a surface the size of a postage stamp using small tech. IBM achieved the milestone -- which it says is 20 times higher than the densest magnetic storage available today[...]

06/12/2002 — IBM'S Millipede crawls toward replacement of flash memory

The latest announcement from IBM's Zurich Research Laboratory about its progress in making memory devices based on MEMS and atomic force microscope tips hints at a leap in data storage capacity, but also highlights some of the hurdles still to be overcome.

06/14/2002 — Big Blue wants its little MEMS working inside your cell phone

A year and a half from now, your next mobile phone may be smaller and more powerful with the help of new micromachines from IBM. The company has announced a new process for building RF, or radio frequency, microdevices directly onto chips. The typical cell phone today uses about 10 of the components IBM would like to replace with MEMS versions.

06/26/2002 — MegaSense launches MEMS-based module

June 26, 2002 -- MegaSense Inc. said it has launched a MEMS-based variable optical attenuator (VOA) array module for photonic systems. The module, based on the VOA MegaSense introduced in March, is designed to reduce the parts count in optical networks and testing manufacturing steps. MEMS help to boost system[...]

06/27/2002 — Report: MEMS, nano in optical's future

June 27, 2002 -- Semiconductors are the devices of choice for optical switches, but MEMS and nanotech-based technologies will make inroads in the next five years, according to a new report. Semiconductor-based network processors will grow from $613.6 million of the optical integrated circuit market this year to $4[...]

06/28/2002 — Motorola to cut 7,000 more jobs

June 28, 2002 -- Motorola Inc. announced Thursday that it would cut 7,000 additional jobs from its worldwide operation as part of a restructuring plan. The Schaumburg, Ill.-based corporation will trim 3,000 positions from its wireless network business, said Scott Wyman, director of financial communications. The remaining[...]

09/24/2010 — MEMS track at SEMICON Europa covers applications and manufacturing

The MEMS/MST track at SEMICON Europa in October will focus on MEMS in end-market applications, manufacturing and design techniques, and keynotes from industry leaders such as Analog Devices, STMicroelectronics, and Bosch.

10/20/2010 — Imec R&D launch in Taiwan includes MEMS focus

Imec Taiwan signed the co-funding contract with the Taiwanese Ministry of Economic Affairs (MOEA) for its R&D activity Imec Taiwan Innovation Centre (ITIC). The new R&D centre will focus on a variety of innovative applications in bioelectronics, MEMS and "green" electronics.

10/06/2010 — IMU and high-performance inertial MEMS 2011: New Yole report

This complete review of the inertial sensor market 2009-2015, provided by Yole Developpement, includes the market for high-performance sensing products, technologies currently available, IMU prices and penetration, key companies, and more information.

10/13/2010 — Coventor MEMS design update enhances MEMS and IC integration

Coventor released the latest version of its MEMS+ design suite. The new release, MEMS + 2.0, includes tight integration and simulation within the widely used Simulink environment from MathWorks, updated library, and more.

10/15/2010 — MEMS is the new fab filler, and more: Semico Spin blog

Recently, MEMS devices have experienced high growth rates in consumer products, and the MEMS potential extends into safety and automotive apps. Semico's bloggers Joanne Itow and Tony Massimini say foundries and EDA/IP vendors are salivating over the revenue growth potential for MEMS development.

10/20/2010 — Water_on_the_moon_NASA_MEMS_based_Phazir_spectrometer_chat_with_Steve_Senturia

When NASA wanted to look for water on the moon, it used a MEMS-enabled near-IR portable spectrometer. At the MEMS Technology Summit, Steve Senturia, Professor of Electrical Engineering, Emeritus. MIT, presented details about the Phazir spectrometer NASA used.

10/22/2010 — IEDM Preview: CMOS imager works from light to night

At the upcoming IEDM conference in December, researchers from NoblePeak Vision will explain how they achieved the first large-scale integration of a single-crystal germanium photodiode into a silicon imager, creating a CMOS sensor that offers high-resolution night imaging under moonless conditions.

10/25/2010 — MEMS cantilevers enable better MEMS sensors: Chat with Beth Pruitt, Stanford

MEMS cantilevers are the force and displacement sensor backbone of all of the MEMS sensors in our cars, cell phones, and other products. The basic cantilever can be manipulated to serve cutting edge research applications, says Beth Pruitt, Stanford University.

10/26/2010 — Five major MEMS commercialization hurdles entrepreneurs need to know

Steven Walsh, U of NM Albert Franklin Black Professor of Entrepreneurship, recently spoke about the lessons learned from 25 years of MEMS technology, educating attendees of the MEMS Technology Summit. Walsh discusses MEMS with ElectroIQ editor Debra Vogler.

10/29/2010 — MEMS-traps-to-avoid-ST-Micro

Debra Vogler, senior technical editor, spoke with Benedetto Vigna, Group VP, GM, MEMS, Sensors and High Performance Analog Division at STMicroelectronics. Vigna described what he calls MEMS "traps" -- ways of thinking about MEMS that hold back the industry and slow its growth.

10/29/2010 — HP-takes-MEMS-sensors-from-inkjets-to-wireless-networks-to-cloud-computing

In this podcast interview, Hartwell describes how HP has been leveraging its inkjet cartridge technology and high-volume manufacturing to tackle the need for distributed wireless sensing networks, in particular, sensing in harsh environments. By harnessing the compute power in “the cloud,” the large amounts of data generated from wireless sensors provides the information required to monitor infrastructure.

07/01/2010 — Buckle up: MEMS auto sensors rev up in 2010

After a tough year in 2009, MEMS auto sensors will rebound sharply in 2010 and continue to surge through 2014, thanks to regional mandates and a surge in one region in particular, says analyst firmiSuppli.

10/28/2010 — MEMS-gyroscope-market-for-gaming-smartphones

The battle to introduce the 3-axis gyroscopes on smartphones has just started, but the major market for MEMS gyroscopes is still gaming. In a $418 million consumer gyroscope market in 2010, gaming represents a market segment of $162 million, according to Yole Développement.

10/27/2010 — MEMS celebrate 25 years: Industry experts share insights

Roger Grace, Janusz Bryzek, and Sverre Horntvedt were among the MEMS industry executives, entrepreneurs, and experts that spoke with ElectroIQ at the recent MEMS Technology Summit at Stanford University. They share a reflection on the past 25 years of MEMS, and insights into where MEMS will go in the next 25.

10/29/2010 — VTI-expands-into-consumer-gyroscopes-timing-devices

The new VTI consumer gyro, which will be introduced at the Electronica 2010 fair in Munich, is superior in terms of size, power consumption and performance compared to products on the market today, according to VTI.

10/27/2010 — Digital MEMS microphones from Wolfson target high-quality audio processing in mobile devices

Wolfson digital MEMS microphoneWolfson Microelectronics plc (LSE: WLF.L) launched its next-generation digital silicon micro-electro-mechanical-systems (MEMS) microphones, the WM7210 and the WM7220. The digital MEMS are manufactured with Wolfson’s CMOS/MEMS membrane technology.

10/19/2010 — MEMS accelerometers for solar PV: Advancing safety and security

MEMS accelerometers for solar PV: Advancing safety and securityFrancesco Doddo, Roberto Condorelli, Roberto De Nuccio, STMicroelectronics, say that safety and security concerns have accompanied PV installations from the start. Among the MEMS applications in the solar market are vibration analysis and anti-theft and include residential inverters, inverters mounted on poles, and solar street lighting. With PV installations on the rise globally, the authors look at various MEMS applications in this renewable energy system.

08/03/2010 — Wet and mobile: Murata launches ultra-thin waterproof piezoelectric speaker

Murata Electronics North America debuted an ultra-thin waterproof piezoelectric speaker with greater design freedom for the rapidly growing and evolving mobile market.

08/09/2010 — Mobile handsets to capture most of embedded pico projector market by 2014: In-Stat

Technologies used to project images have been relentlessly miniaturized, and many companies are actively looking into embedding these pico projectors into consumer products. "Pico Projectors: One Reason Bigger Isn't Better," provides worldwide market share and shipment forecasts of pico projector module adoption.

08/18/2010 — Asian MEMS industry boost: Multitest cooperates with Semi Taiwan MEMS Committee

Asian MEMS industry boost: Multitest cooperates with Semi Taiwan MEMS CommitteeMultitest, MEMS test and calibration equipment provider, sees great opportunities for the MEMS industry in Asia. Alex Chen, Taiwan regional manager, recently became a member of the Semi Taiwan MEMS Committee to actively contribute to the success of the Asian MEMS industry.

08/27/2010 — MEMS accelerometer, Analog Devices, enables mini CPR rescue device

The PocketCPR device uses an ADI digital iMEMS accelerometer to convert the motion of PocketCPR into real-time measurement data to accurately read the rate and depth of CPR chest compressions.ZOLL Medical Corporation selected Analog Devices' iMEMS technology to enable its palm-sized CPR device. The PocketCPR device uses an ADI digital iMEMS accelerometer to convert the motion of PocketCPR into real-time measurement data to accurately read the rate and depth of CPR chest compressions.

03/18/2010 — Seiko Instruments, IME develop Si-based resonator, wafer-level packaging tech

Seiko Instruments Inc. (SII) and the Institute of Microelectronics (IME) of Singapore's Agency for Science, Technology and Research (A*STAR) say they have developed a high-precision silicon-based MEMS resonator that they say solves a key problem with such devices, to help ensure precise output frequency and enable low-power consumption and miniaturization. They've also devices a new wafer-level packaging technology that improves the mechanical strength and lowers fabrication cost.

03/04/2010 — SVTC's post-recession plans to expand services, widen tech reach

Bert Bruggeman, newly promoted CEO of SVTC, talks with Small Times lays out the group's three-pronged plan to expand its services and be more customer-focused as it emerges from the industry downturn -- including expanded "low-volume" production, and a new management consulting feature.

03/10/2010 — Baolab shows off MEMS built inside CMOS

A Spanish startup claims to have come up with a new way to build MEMS devices using standard CMOS manufacturing: put the devices directly in the wafer rather than on top of it, which it says simplifies production and greatly reduces costs.

03/19/2010 — TI, Bosch, Panasonic, Dalsa climb MEMS ranks in 2009

MEMS companies sold $7B worth of devices in 2009, down about -5% from the previous year, and there were some changes among top-ranked suppliers thanks to comparative growth (or lack of) in some key markets, according to statistics from Yole Développement.

03/23/2010 — Daring to DRIE: Tegal's move into MEMS, 3D segments

Tegal president/CEO Thomas Mika explains to SST the company's reasons for offloading much of its legacy tools business, and where the company is putting its emphasis. Gartner's Dean Freeman also examines the deal.

03/31/2010 — Qualcomm's approach to displays

LCD displays are prevalent in today's handheld devices, but power efficiency and readability issues give incentive to uncover alternative approaches. Qualcomm senior engineer Rashmi Rao shared the company's MEMS-based approach to displays at a recent IEEE Bay Area Nanotechnology Council meeting, reports Neha K. Choksi.

09/01/2010 — Lab-on-chip project aims to diagnose cancer faster

The MIRACLE project aims to develop an operational lab-on-chip for the isolation and detection of circulating and disseminated tumor cells in blood. The new lab-on-chip is an essential step towards faster and cost-efficient diagnosis of cancer.The MIRACLE project aims to develop an operational lab-on-chip for the isolation and detection of circulating and disseminated tumor cells in blood. The new lab-on-chip is an essential step towards faster and cost-efficient diagnosis of cancer.

09/15/2010 — MEMS industry update: Growth benefits a select few

Growth is back, but the MEMS industry infrastructure has changed: a limited number of companies (STM, Bosch, etc) are taking full benefit of the growth of the market, and foundries are attractive for a new set (think TSMC). Growth is back, but the MEMS industry infrastructure has changed: a limited number of companies (STM, Bosch, etc) are taking full benefit of the growth of the market, and foundries are attractive for a new set (think TSMC). Industry restructuration is now about to happen, said Jean-Christophe Eloy, CEO and GM, Yole Développement.

09/08/2010 — Analyst: "High-value" MEMS demand surging

Outside of consumer/mobile electronics, the strongest growth for MEMS devices isn't in autos or inkjet printers -- it's in "high-value" areas spanning industrial, medical, energy, and defense applications, according to a new report from iSuppli.

09/13/2010 — CMOS, MEMS meld enabled with advanced TSV, flexible interconnects

Professor Muhannad Bakir and student Hyung Suk Yang of Georgia Institute of Technology (Georgia Tech), discuss their TECHCON 2010 paper, “Marriage of CMOS and MEMS using Flexible Interconnects and TSVs.”

09/14/2010 — Freescale debuts accelerometers to extend battery life in consumer devices

Freescale Semiconductor today unveiled an advanced 3-axis accelerometer family designed to deliver enhanced battery life for smart mobile devices without compromising performance. This article includes a podcast interview about the technology.

09/29/2010 — SPAWAR looks to Smart System Technology & Commercialization Center for MEMS sensor technology

SPAWAR MEMS design and production contract.Military sensors specialists at the U.S. Space and Naval Warfare Systems Command (SPAWAR) in San Diego are looking to microelectronics experts at the Smart System Technology & Commercialization Center to fabricate MEMS for military sensor systems.

09/03/2010 — Strain-gating piezotronics: Nanowires enable new piezoelectric logic devices

archers at the Georgia Institute of Technology have developed a new class of electronic logic device in which current is switched by an electric field generated by the application of mechanical strain to zinc oxide nanowires.

10/25/2010 — Nanotechnology promises have gone unfulfilled, says Stanford prof

“If we define a technology as the ability to make something exactly the way we want it, over and over, we do not have this capability at the nanoscale for many structures,” says Thomas Kenny, Professor of Mechanical Engineering at Stanford University.

10/12/2010 — ISSYS completes MEMS product manufacturing expansion

Integrated Sensing Systems Inc. (ISSYS) has completed its 2010 manufacturing expansion project, adding 5,400 square feet to its existing facility for high-quality manufacturing of system-level products based on ISSYS MEMS chips.

10/12/2010 — DiCon multimode optical switch consumes less than 170 mW

A MEMS optical switch made with multimode 50 µm core fiber is now available in a single fiber-optic switch device.

10/25/2010 — DiCon Fiberoptics optical channel monitor offers voltage control

The Optical Channel Monitor (OCM) for DWDM networks supports 88 channels with options to cover 96, and is suitable for either 50 or 100 GHz channel plans.

03/02/2010 — HP: Making distributed sensing a reality

At a IEEE Bay Area Nanotechnology meeting on February 16, Peter Hartwell revealed new efforts at Hewlett Packard that could change the game for distributed sensor networks (aka "smart dust") and how they will impact human interaction, just as the Internet revolution did.

03/11/2010 — Silicon magnetic sensors head for big time

Silicon sensors are outgunning competition from a host of older sensor and switching technologies by offering improvements ranging from robustness to cost. iSuppli MEMS analyst Richard Dixon summarizes the overall market for silicon magnetic sensor elements and ICs (e.g. Hall, AMR, and GMR-based devices), comparing the technologies and highlighting some of their applications.

09/29/2010 — MEMS manufacturing rotary stages from Aerotech enable speed, accuracy

Aerotech rotary stages for MEMS manufactureANT95-R and ANT130-R direct-drive rotary stages, part of Aerotech's nano Motion Technology product line, offer in-position stability (0.005 arc sec) and incremental motion (0.01 arc sec) using the company's direct-drive technology.

09/01/2010 — Defense device maker adds Plasma-Therm VERSALINE RIE etch

Plasma-Therm LLC VERSALINE RIE etch systemThe customer designs, develops and produces high-technology defense systems for aerospace, naval, and land-based applications. The VERSALINE system complements other Plasma-Therm process equipment at this facility.

09/01/2010 — RF MEMS to explode, solve phone antenna problems

Radio frequency (RF) MEMS technology is poised for a bit surge in 2010-2011, just in time to maybe help Apple solve a vexing problem with its iPhone.

07/01/2010 — Where Have All the New Apps Gone?

Pete Singer, Editor-in-Chief

07/15/2010 — ECSI FIBRotools intros MEMS, nano, and HDI electroplaters

ElectroChemical Systems, Inc. (ECSI) FIBRotools is introducing two products for development of advanced MEMS/nano and high-density interconnect (HDI) fabrication technologies: IKoCLASSIC-SL and IKoCLASSIC-MG.

07/12/2010 — Fraunhofer ISIT selects Rudolph for MEMS inspection

Rudolph Technologies, Inc. (NASDAQ: RTEC), provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced that the Fraunhofer Institute for Silicon Technology (ISIT) in Germany has placed an order for an NSX® Series Macro Inspection System for advanced MEMS processing. The system will be installed this summer in the state-of-the-art 200mm MEMS pilot production line at ISIT.

07/13/2010 — Affinity Biosensors partners with MEMS foundry IMT

Affinity Biosensors and IMT entered into a strategic foundry partnership today for volume production of SMR MEMS devices enabling particle measurement in fluidic solutions with femtogram resolution. The SMR MEMS devices are the chips that drive Affinity Biosensors' ARCHIMEDES Particle Measurement System.

07/14/2010 — SEMI Announces New Technical Standards for MEMS, PV, 450mm Wafers and more

The release of these new SEMI International Standards covers a wide range of applications, including display, PV, and 450 mm wafers. These standards address issues that are active today, and those that will arise when and if the industry moves to larger-diameter silicon.

07/14/2010 — Very strong MEMS growth expected: Analysts weigh in

At SEMICON West 2010, top analysts from Yole and iSuppli discuss the market for MEMS devices; outsourcing MEMS foundries; and the relationship between manufacturing processes, cost, and MEMS adoption. Chief editor Pete Singer summarizes the findings.

07/23/2010 — MEMS career trends: Specialization, HVM, backend in demand

With the US reeling from record unemployment, many are wondering how the MEMS job market is fairing. Neha K. Choksi talks with Jason Weigold, founder and president of MEMStaff, about his observations based on clients' hiring and consulting needs.

06/10/2002 — MEMGen is building a bridge between micro, macro worlds

MEMGen Corp., a MEMS fabrication company, has widened its scope to include applications that are not strictly MEMS. "We view ourselves as a MEMS manufacturer, but with additional capabilities," said Adam Cohen, MEMGen's founder, president and chief executive officer.

06/17/2002 — ISSYS makes strategic decision to focus on the medical market

While securing grants and providing contract services to industrial firms have been the mainstay of revenue for Integrated Sensing Systems Inc. (ISSYS), this small tech company is staking its future economic success on the medical industry.

06/24/2002 — Swiss Mimotec sees the future in the U.S. microfluidics market

Quietly perking away in a small town in Switzerland is Mimotec, which expects to use income from sales of its micromachined metal parts to finance its current push into the microfluidic component market. In fact its CEO believes micromolds will be the company's best shot at the U.S. market.

06/05/2002 — TRONIC'S, CEA-Leti rejoin for MEMS

June 5, 2002 -- TRONIC'S Microsystems SA and CEA-Leti, the French Atomic Energy Commission's scientific and electronics research lab, said they have signed a three-year pact to research and develop MEMS. The Grenoble, France-based concerns will dedicate common resources to work on silicon-on-insulator-based MEMS, which were transferred from CEA-Leti to[...]

06/27/2002 — Only a few community colleges training future MEMS workforce

It’s a rare breed they nurture at the Albuquerque Technical Vocational Institute: students studying MEMS. TVI had a classroom full of them this spring, and local employers are welcoming the move to train more future engineers in MEMS. But TVI's program is rare on the ground floor of higher education. For the most part, MEMS is still stuck in the ivory tower.

07/22/2002 — PHS MEMS counts on growth in market for mobile handsets

PHS MEMS is one of the few French companies that specialize in MEMS. Created in 1998, the Grenoble-based firm is focused on the communication market. But what really drives the company is "MEMS' foreseable market growth," as CEO Thierry Touchais, puts it. "We believe that the addressable market for MEMS in the mobile communications market is $2 to $3 per handset in 2006."

07/19/2002 — N.Y. lands SEMATECH North: a center for nanoscale chip R&D

New York Gov. George Pataki delivered a big steak Thursday to support the sizzle of turning New York's Capitol District into a "Tech Valley." SEMATECH North's goal: developing technology to drastically shrink chip components to less than 100 nanometers. Nanoscale chipmaking will also be the mother of invention for production equipment that will employ small technologies such as MEMS devices and tiny sensors.

07/25/2002 — India ready to launch its first privately funded MEMS lab

The small tech industry in India is poised to take a step forward this October, with the launch of the new CranesSci MEMS Lab, a collaboration between the Indian Institute of Science and Cranes Software International Ltd. The MEMS industry in India is still in its infancy, but given the interest some companies are showing, it is expected to grow very quickly.


Development of a MEMS-based Braille display system may prove to be a miracle worker for the thousands of blind people unable to access information via computer.


The microtechnology hall at Hannover this past week was filled with wondrously complex micromachines, but there were also some everyday items on display. It shows that older industries are going through something of a small tech revolution as they realize that small tech has the potential to improve traditional products.


Two years ago this month, employees at Cronos Integrated Microsystems in North Carolina celebrated what was a sizable coup for a MEMS startup: a $750 million stock deal to join JDS Uniphase Corp. Now, what is now called the MEMS Business Unit of JDSU is celebrating still – but soberly, with the conviction that as tough as the past year has been, it would have been worse had Cronos remained independent.


By Richard AcelloSmall Times Correspondent SAN DIEGO, April 22, 2002 -- OMM Inc., a four-year-old San Diego firm, is tapping into its reserves of patience as it waits for the telecom industry to adopt its MEMS-powered technology for optical switches. MEMS-based switches route voice and data traffic from one fiber[...]


By Richard AcelloSmall Times Correspondent SAN DIEGO, April 29, 2002 -- LightConnect Inc. says it has the kind of forward-thinking technology that could fundamentally improve transportation of long-haul voice and data traffic. Using proprietary MEMS technology, LightConnect's products are designed to control the wavelengths used in optical telecom systems so[...]


Europe may have a reputation for endless bureaucracy when it comes to adapting the programs that are taught at university level, but widespread enthusiasm for small tech has resulted in the creation of a number of nanotechnology and MEMS focused courses. However, as excitement builds for the enormous manufacturing opportunities that small tech presents, U.K. academia and business realize that it is important to extend the training beyond the specialist doctoral level.


A study by members of Europe’s key MEMS and microsystems association sees the world market for the products more than doubling from its 2000 level by 2005. A new market research report predicts that the worldwide market for microsystems technology will grow from $30 billion in 2000 to $68 billion in 2005.


While many MEMS applications focus on the nuts-and-bolts worlds of aerospace or defense, MIT researcher Joseph Paradiso has tinkered with the technology for a more aesthetic pursuit: dance. He bolted a few microsize gyroscopes and accelerometers to footwear, and now dancers and choreographers can lace up a pair of Paradiso’s shoes, turn on the computer and make music just by moving.


More than 20 companies are showing off MEMS-enabled gadgets at the Consumer Electronics Show in Las Vegas. It's still not a high percentage, but it's a beginning. They include home theater devices powered by micromirrors, a plug-in module that might make your Palm Pilot easier to use and a sensor-filled glove that could be handy for game playing.


When the fourth quarter of 2001 began, it was seen as a critical time for MEMS development in optical switching. Analysts had hoped to spend the end of the year tallying companies that released new products. Instead, they were forced to make a couple of new lists: those who delayed and those who dropped out of the game altogether. Now, they wonder how many more could be close to closing.


In its second appearance as its own show within Hannover Fair 2002, small tech’s profile remains, well, small. The microtechnology section has 350 exhibitors – the fewest of the exposition’s seven self-contained fairs, most of which boast between 800 and 1,200 exhibitors. But what it lacks in bulk, it’s making up for in buzz.


A forum on international road maps for the microsystems industry featured speakers from four countries and three continents. Although everybody gave their presentations in English, listeners were left wondering whether they really did speak the same language.


Yelling “stop the presses!” when a newspaper is being printed means something is wrong, but a German firm said its process of halting production to package parts could help move MEMS in the right direction. MicroTEC has launched 3-D Chip-Size Packaging, which lets fabricators stop at any point in the process, integrate parts, then resume production.


He holds more than 124 patents, including some of the earliest for tiny pressure sensors micromachined out of silicon, with the first awarded in 1964. Turning 73 next week, Anthony "Tony" Kurtz, founder of Kulite Semiconductor Products, continues to innovate. "Who do you think started this whole MEMS business?" he says with a sly smile.


Like many regions across the United States, the Northern California span dubbed Silicon Valley sees small tech as an engine that can help pull the nation out of a two-year stall and turbo charge its local economy in the process.


About two years ago, Stony Brook Professor Benjamin Chu, 70, started looking for an entrepreneurial challenge to cap his career in research. Commercializing his process for electrospun nanofibers was a logical place to start, and STAR Inc. was born.


Verizon recently launched the first 3G, or third generation, wireless network in the United States. Sprint and AT&T are rolling out similar broadband wireless services in 2002. But as wireless networks advance, so too are challenges for mobile phone designers. RF (radio frequency) MEMS may help engineers add new capabilities and improved power efficiency while keeping wireless devices small and affordable.


The name of a Swiss custom MEMS manufacturer, Colibrys, tells much about current trends in the industry. The name comes from the French word for hummingbird, a creature that moves up, down and sideways. Colibrys officials say they are keeping with the spirit of their name in the company's ability to quickly move in any direction, altering its MEMS designs to fit the customers.


What used to be Nanovation Technologies Inc.'s Michigan headquarters became the scene of a gigantic liquidation sale this week. Much can be blamed on the weak telecom sector, but more MEMS companies will drop out because there is only so much demand for optical components – even in good times. "I think it’s just the beginning," said one analyst. "There are too many companies out there."


Ever since Microlab Inc. developed its "better mousetrap" – actually, a microscopic latching switch that it says uses less energy and is more durable than other MEMS switches – the startup has been attracting the attention of venture capitalists. What attracted investors was a team of "two very bright engineers" who are using the cash judiciously to bring the product to market.


Swiss small tech entrepreneurs, research institute executives, government officials and venture investors will visit three major U.S. cities in May to learn from their American counterparts – and possibly even lure some Swiss scientists back home. Switzerland, long known for its precision machine enterprises, is dedicating an increasing amount of public and private investment to small-tech projects, and the May road show is part of that effort.


What's life inside a MEMS fab like? Small Times takes a snapshot inside the high-pressure, high-precision challenge of spinning up a state-of-the-art, multimillion-dollar MEMS foundry. Kionix Inc. of Ithaca, N.Y., built one of the most sophisticated MEMS production sites in the world from the ground up.

10/27/2003 — MEMSCAP to acquire French optics firm

Oct. 27, 2003 – MEMSCAP SA, a France and Silicon Valley-based MEMS designer and manufacturer, plans to acquire Opsitech SA, a Grenoble, France-based integrated optics firm, according to a news release.

10/28/2003 — MEMS industry recognizes packaging can make or break a product

Experts say packaging is hands down the biggest challenge for commercializing more MEMS devices. The technical difficulties involved in packaging can be considerable. But even more problematic is an industry wide mindset that views packaging as secondary – if it is considered at all. The experts say that attitude is beginning to change, though, as the industry matures.

10/29/2003 — Partnering makes difference for packaging, testing, assembly

Startups are generally short on infrastructure and under pressure to generate an immediate return, while large firms have the equipment and the time to refine processes. Given these pressures, experts say, startups need to find partners who not only can integrate packaging with sensor design, but who also can test MEMS devices and address aspects of assembly such as calibration.

11/18/2003 — EV Group supplies equipment to DALSA

EV Group, an Austrian maker of MEMS and semiconductor wafer processing equipment, has been selected by DALSA Semiconductor to supply MEMS production equipment, according to a news release.


In what is likely to poke one more hole in the technology bubble, a report released this morning places the nanotechnology industry at a mere $30 million in annual sales. Previous reports have placed sales at $45 billion or more than 1,000 times larger. "We are trying to come up with rational numbers for nanotechnology," said the report's co-author.


By John CarrollSmall Times Correspondent DALLAS, March 11, 2002 -- The nanotechnologists and venture capitalists who mingled during Nanoventures 2002 here late last week were in for some blunt talk about commercialization prospects. This conference never lost its focus on the bottom line. "We didn't want to have just another[...]


Optobionics Inc., one of three U.S.-based developers of retinal replacement technology, appears to be gaining ground in the race to produce the first microscopic system to help the blind see. The Illinois-based private firm picked up $20 million in new funding.


To succeed in the increasingly crowded biotech field, you need to know your market, not just the technology. Some German small tech companies have already learned that lesson.


Glass is about 80 percent cheaper than silicon. That's not the only reason GeneFluidics Inc. is a contender in the nanobio business, but the company's turning point came when it switched from silicon to glass as the material to use beneath its microfluidic and sensor system.


You might think an additive that makes plastics lighter, stronger, more heat-resistant and better at keeping foods and beverages fresh would have a large and admiring customer base. And when it comes to nanoclay, you might be right … eventually. But 20 years after the first patents were filed, things are just beginning to pick up. Two companies are banking on its future.


Research institutions and the Louisiana Technology Council – with the financial backing of the federal government – are pushing development of nano- and MEMS-based technologies in Louisiana. They don’t have pretensions of turning the birthplace of jazz into the next Silicon Valley, but they do want to diversify the local economy and create jobs.


Standing on the third floor of the construction site that is soon to become the biggest MEMS factory in the world, MEMSCAP'S president and chief executive still can't get over it. “Seven months ago, this was a corn field,” he said, pointing at the fields on the outskirts of Grenoble, France. “We actually had to buy the corn from the farmer before we could start construction.” Jean Michel Karam doesn't like to go step by step when building his company. He plunges head first.

01/14/2002 — French megaproject for microtech hopes to cultivate new companies

When Jean-Charles Guibert looks at what is now a handful of abandoned military buildings near the heart of Grenoble, France, he sees great things. "At the end of 2003, when all the construction will be finished, you will have 120,000 square meters of facilities devoted to micro and nanotechnology," he said, sweeping his arm in the direction of the crumbling barracks.


Five years ago, Texas Instruments unveiled a killer technology called Digital Light Processing. Using a projector chip packed with hundreds of thousands of micromirrors, movies could be distributed digitally and the picture on the silver screen would be more brilliant than ever. But a funny thing happened on the way to the tech revolution. The theater industry decided not to come.


A U.S. congressional act that calls for tire monitor standards appears to be stuck in a political quagmire between federal regulators and the Bush administration. In the meantime, some automakers already are incorporating microsystems into their tire systems to monitor pressure and temperature.


With 55 patents in its portfolio and 90 more pending, a Bothell, Wash., company is locking up a competitive lead in virtual retinal display products. Microvision's MEMS-based components can be used in everything from portable display devices for cell phones to helmet mounted displays.

09/04/2002 — Where have all the brainiacs gone? Ph.D. dearth may stymie small tech

University students around the world seem to be snubbing science – a worrying trend for small tech businesses. In France, undergraduate science programs have seen a 24 percent drop in student bodies since 1995 and staff shortages are already being felt in some clean rooms. Germany, Asia and the United States are facing the same problems.

09/09/2002 — Michigan is host to COMS 2002,gathering of microsystems leaders

More than 300 small tech executives, researchers, investors and analysts from around the world are expected to attend the 2002 International Commercialization of Micro and Nanosystems Conference (COMS) in Ypsilanti, Mich., this week.

09/12/2002 — Intel unveils its nano inside with new small tech initiatives

Semiconductor giant Intel Corp. today revealed plans to apply nanotechnology and MEMS devices across a range of projects, including sensor networks and optical “building blocks” that will advance the integration of computing and communications.

07/10/2002 — BodyMedia completes $6.5M second round

July 10, 2002 -- BodyMedia Inc., a Pittsburgh-based provider of body monitoring products, announced the close of a $6.5 million second round of financing led by Draper Fisher Jurvetson ePlanet.nullPrescient Partners II LLC, the University of Pittsburgh Medical Center and previous investors Draper Triangle and Saturn Partners also[...]

07/15/2002 — MEMGen nets additional $5.7 million

July 15, 2002 -- MEMGen Corp., a Burbank, Calif.-based developer of microdevice manufacturing technology, announced it has closed on $5.7 million in Series A1 financing, an extension to its first round of venture capital. Partech International led the investment. Also participating were original investors DynaFund Ventures, Draper Fisher[...]

07/18/2002 — Tax credits help keep small tech companies proud to be Canadian

Canada has only 31 million people, but it's among the world's most populous nations when it comes to micro and nanotechnology companies. A key reason for this is its tax system. Canada's grants, subsidies, tax credits and reimbursements can shave the cost of R&D in half. “We would be crazy not to” take advantage of Canada’s tax breaks, said the CEO of one nanotech company.

07/19/2002 — Harris posts higher net asset value

July 19, 2002 -- Harris & Harris Group Inc., a New York publicly traded venture capital company that invests in MEMS, microsystems and nanotechnology, announced that, for the quarter ended June 30, 2002, its net asset value per share had increased from $2.63 to $2.68. Harris & Harris[...]

07/24/2002 — MEMS cut from a different cloth; firm finds new polymer process

Call it serendipity. Call it luck. Call it the convergence of microsystems and dental floss. Some of the greatest business breakthroughs have come when designers applied a process from one realm into another. That's kind of how it went at a North Carolina development firm, which made a MEMS-type device out of the same process that makes fishing line, carpet and dental floss.

07/29/2002 — Veeco reports Q2 results

July 29, 2002 -- Veeco Instruments Inc., a Woodbury, N.Y., provider of process equipment and metrology tools used in development of MEMS and other devices, announced it lost $1.6 million, or 6 cents per share in the second quarter, compared to income of $10 million dollars for the[...]

07/29/2002 — Measurement Specialties appoints CFO

July 29, 2002 -- Measurement Specialties, a Fairfield, N.J. designer and manufacturer of MEMS sensors, has appointed John Hopkins as chief financial officer, according to a company spokeswoman. Hopkins was most recently vice president of finance at Cambrex Corp., which supplies products and services to the pharmaceutical and biotechnology[...]

07/30/2002 — Harris & Harris completes rights offering

July 30, 2002 -- Harris & Harris Group Inc., a publicly traded venture capital company that invests in nanotechnology, microsystems and MEMS, announced that its rights offering, closed July 26, resulted in 2,634,614 shares of common stock subscribed. In addition to the 8,864,231 shares outstanding, there[...]

07/15/2002 — Measurement Specialties delays report, sells fab

July 15, 2002 -- Measurement Specialties Inc., a Fairfield, N.J.-based designer and manufacturer of MEMS sensors and sensor-based consumer products undergoing a restructuring, today announced it has delayed filing its annual report for fiscal year 2002. The American Stock Exchange has halted trading of the company's stock. Measurement[...]

07/17/2002 — Surface, Xactix to co-market products

July 17, 2002 -- Surface Technology Systems plc (STS), a Newport, England-based provider of specialist plasma etch and deposition systems for MEMS development and other applications, has signed a joint marketing agreement with Xactix Inc., a Pittsburgh-based developer of equipment for making MEMS. The agreement, according to Andrew McQuarrie, STS[...]

07/18/2002 — Transparent Networks moves, expands

July 18, 2002 -- A Silicon Valley optical MEMS firm is moving into bigger digs -- and a far cry from its start in the CEO's dining room. Transparent Networks Inc. said it moved into new headquarters that doubles the size of its previous office space and quadruples its research[...]

07/01/2002 — A DARPA-funded project turned intoMEMS telecom supplier Polychromix

Though the dream of a truly all-optical network has been put on hold while the telecom industry reacquaints itself with fiscal responsibility, a phalanx of startups continue to position themselves. The latest to announce its entry into optical components is Polychromix, which uses MEMS technology for monitoring and managing multiple wavelengths in long-haul and metro optical networks.


Charles Harris, chief executive of H&H since 1984, believes small tech is "going to be a major area of technology development for the rest of our lives." With nano and MEMS applications cutting across many different industries, Harris also believes that H&H's portfolio can remain diverse, even with a small tech focus.


At Fornos Restaurant in Newark's Ironbound District, a meeting of MEMS minds is under way. The MEMS Journal Club, New Jersey branch, is in session. It's the second oldest of about a half-dozen informal groups, where MEMS educators, researchers, engineers, journal editors and thought leaders gather to talk about the industry's past and future.


Researchers at the Detroit Medical Center hope to spin off a company that will design, build and sell MEMS-based probes to be used in robotic, computer-aided surgery. The probes will help doctors – even if they're located halfway around the world – differentiate between tumor cells and normal cells and will give them better “touch” feedback during delicate procedures.


By Richard AcelloSmall Times Correspondent SAN DIEGO, March 12, 2002 -- The telecom slump is leading many companies into a vicious spiral: Carriers are reluctant to purchase equipment from suppliers. But those suppliers, who are also financially strapped, are selling equipment that can reduce costs and increase competitiveness for the[...]

07/22/2002 — Segway to roll into U.K. market

July 22, 2002 -- BAE Systems and Segway LLC said they will jointly market the Segway Human Transporter in the United Kingdom, according to a news release. The partnership's initial efforts for the self-balancing, electric-powered device, which contains MEMS gyroscopes and accelerometers, will be on the United Kingdom's aerospace and[...]

07/02/2002 — Gaming may be the 'Trojan horse' that sneaks MEMS into your Palm

Games may gently introduce the tilt-based user interface into handheld devices, making users comfortable with it in the same way that computer solitaire trained a generation of workers to use the mouse. Pure play gaming companies like Nintendo are already there.

07/08/2002 — Microstrain's orientation sensor gets the attention of U.S. Navy

Microstrain Inc.'s MEMS-based orientation sensor for monitoring and treating paralyzed limbs fell onto the radar screen of military organizations this year. Now, Microstrain’s newest product, the 3DM-G orientation sensor, has been deployed by the U.S. Navy for unmanned aerial vehicles.

06/06/2002 — Kionix raising $15 million

June 6, 2002 -- Kionix Inc., a MEMS designer and manufacturer, is attempting to raise $15 million in financing by issuing a combination of common stock and Series A preferred stock, according to Jim Kirkwood, Kionix vice president and chief financial officer. Thus far, the only investor announcing participation is[...]

06/18/2002 — Sionex raises $3.6 million in 1st round

June 18, 2002 -- Sionex Corp., a MEMS chemical sensor developer based in Waltham, Mass., closed on $3.6 million in a first round of institutional venture financing, according to Navigator Technology Ventures LLC. In addition to Navigator, participants included Rho Ventures and TechFarm. Rho led the round. According to[...]

06/20/2002 — MEMS group expands membership

June 20, 2002 -- The MEMS Industry Group (MIG) said it's opening its doors to more than just makers of microelectromechanical systems. The group, which has 23 member companies, has created a category called "Supporting Member," which is open to firms representing venture capitalists, lawyers and accountants, as well[...]

06/03/2002 — PHS MEMS unveils prototyping service

June 3, 2002 -- PHS MEMS said it has introduced an accelerated MEMS prototyping service through its new office in Emeryville, Calif. The France-based maker of MEMS for telecom and wireless applications said the new program allows the firm to serve its customers from design to production. It also enables[...]

06/06/2002 — Tegal sells system to Taiwanese MEMS maker

June 6, 2002 -- Tegal Corp. said it has sold one of its plasma etch systems to an undisclosed Taiwanese MEMS maker. The 903e plasma etch system, which can be used to produce structures in silicon and other materials during MEMS fabrication, was sold to a firm that is developing[...]

06/06/2002 — Alcatel drops Dutch MEMS plant

June 6, 2002 -- Alcatel Optronics said it's selling its MEMS operation in the Netherlands as part of a massive cost-cutting plan. A spokeswoman for the independently operated optical parts business of French-based Alcatel SA said it would sell its 40-person unit in Enschede, which makes MEMS and planar waveguide[...]

06/13/2002 — Saab, SensoNor make one-stop MEMS shop

June 13, 2002 -- Saab MicroTech AB and SensoNor ASA said they will design, develop and make MEMS-based devices. Under the deal, Saab MicroTech, a unit of Swedish automaker and high-tech giant Saab AB, will provide design, development and simulation of micro devices and systems. SensoNor's MEMS foundry in[...]

06/25/2002 — Clare launches MEMS foundry services

June 25, 2002 -- Clare Inc. said it has launched wafer foundry services for MEMS and other processing technologies, according to a company news release. The firm said its expertise in high-voltage processing and experience with several customers have enabled it to make 125 millimeter silicon wafer foundry services commercially[...]

06/03/2002 — BigBangwidth sets out to create a new universe of smart switches

Brian Moore, president and chief technology officer for BigBangwidth, wants to revolutionize the use of fiber optic networks through his Edmonton, Alberta-based company.

05/08/2002 — Two firms use small techin life-saving heart devices

Guidant Corp. is launching its small-tech enabled heart device into the U.S. market, and Medtronic Inc. expects to quickly follow with its own version. Both devices combine treatment for heart failure with a defibrillator to regulate heartbeats.


Cyrano Sciences Inc. makes an $8,000 electronic nose the size of a large walkie-talkie. Just wave the Cyranose 320’s sniffing tube over a vat of petrochemicals, a barrel of wine or a pallet of fish, and it will inform you of the substance’s quality by flashing the information on an illuminated LCD monitor.


PricewaterhouseCoopers' MoneyTree Survey, one of the best-known instruments for tracking venture investment, is starting to register enough deals in small tech that it may soon rate its own category.

05/07/2002 — Movaz secures series C funding

May 7, 2002 -- Movaz Networks Inc. has announced the closing of a $60 million funding round consisting of series C financing and strategic business agreement. The company's founder and board chairman, Bijan Khosravi, said he thinks this will be the last round of funding. The company, which makes hardware[...]

05/09/2002 — MoneyTree survey findsinvestors are going small

PricewaterhouseCoopers' MoneyTree Survey, one of the best-known instruments for tracking venture investment, is starting to register enough deals in small tech that it may soon rate its own category.


By Candace StuartSmall Times Senior Staff Writer CHICAGO - One of the best ways to extend the life of a car is to change its oil before the lubricants degrade, according to most car owner guides. Small technology could soon eliminate the guesswork from that routine. Delphi Automotive Systems announced[...]


The playboy days are over for Small Tech. Now, it needs to choose a partner, defining how if not with whom it wants to make its destiny, industry experts say.


By Candace Stuart Small Times Senior Staff Writer CHICAGO, June 7, 2001 -- Three people who have been watching small tech evolve over the years expect the MEMS world - and most of their relationships to it - will change in the next 12 months. Marlene Bourne, an industry analyst[...]


June 13, 2001 - The premiere issue of bimonthly Small Times magazine will debut at a Sept. 19 luncheon for 800 attendees at the Small Tech 2001 conference and trade show in the Ronald Reagan Building and International Trade Center in Washington, D.C. The 64-page issue will offer an[...]


Seventeen-year-old Ryan Randall Patterson of Grand Junction, Colo., watched a flurry of hand gestures at a fast-food restaurant, and thought there must be a better way for the hearing impaired to communicate. So, he had an idea. Why not take his familiarity with sensors and microprocessors to make a device that translates sign language into text? Within 10 months, he had a working model.


June 20, 2001 - A business and government executive with extensive experience in science and engineering has been named to lead the Defense Advanced Research Projects Agency (DARPA). Anthony J. Tether was appointed June 18 by U.S. Secretary of Defense Donald Rumsfeld to lead DARPA, the central research and[...]


Keeping the load light and cost low will be critical for any future mission to Mars. Researchers say the secrets lie in MEMS, microsystems and nanotechnology, which will help solve problems associated with heat, propulsion, communications and electronics - the biggest hitches to pulling off such a mission.


Small technology was a featured player at a gala performance that demonstrated the industry's future in everything from nanoskin aircraft coating to cool cars. And, yes, NASA brought along Oscar, the wisecracking robot.


A corporation best known for its cell phones and semiconductor business will soon release two new small tech products that have little to do with communications, but perhaps everything to do with its future. Motorola's new approach may give it a foothold in some potentially lucrative markets - genetic diagnostics and the research branch of the pharmaceutical industry.

07/24/2002 — BEI supplies MEMS for Predator

July 24, 2002 -- BEI Technologies Inc., a San Francisco manufacturer of sensors, motors and actuators, has received an order from Lockheed Martin Electronics for 1,000 quartz angular rate MEMS sensors to be used in the Predator missile. BEI's Systron Donner Inertial Division, which BEI says has been working[...]

07/11/2002 — Teravicta to offer RF MEMS-based products

July 11, 2002 -- Teravicta Technologies officials announced its first product Wednesday: the Teravicta TT612 MEMS switch. The company said in a news release that a dozen leading product suppliers have already sampled an evaluation board containing the switch. nullTeravicta said it is focused on becoming the leading RF MEMS[...]

07/12/2002 — Alcatel Optronics sells Dutch arm

July 12, 2002 -- Alcatel Optronics said the sale of its Dutch arm to the management has been completed for an undisclosed sum, according to AFX News.nullAlcatel Optronics Netherlands covers the MEMS and Planar design software that the French company bought from Scottish company Kymata in 2001. nullThe MBO[...]

07/16/2002 — Research firm: 'It's raining MEMS'

July 16, 2002 -- In-Stat/MDR, a Scottsdale, Ariz.-based provider of business information, issued a report predicting worldwide MEMS revenues will grow from $3.9 billion in 2001 to $9.6 billion in 2006. Titled "It's Raining MEMS: 2002 Industry Overview," the report costs $3,495 and predicts unit[...]

07/16/2002 — OMM, Lightwave integrate technologies

July 16, 2002 -- OMM Inc., a supplier of MEMS-based photonic switching modules, and Lightwave Microsystems Corp., a designer and manufacturer of semi-custom planar lightwave circuits (PLCs) and integrated optical communications devices, announced an agreement to develop a new line of wavelength management and switching products that integrate both MEMS[...]

07/19/2002 — NP Photonics acquires Solus assets

July 19, 2002 -- NP Photonics. Inc., a Tucson, Ariz.-based provider of amplifiers for fiber optic networks, has acquired the intellectual property, MEMS technology and tunable filter products of Solus Micro Technologies and will operate it as a wholly owned subsidiary named Parvenu Inc, according to Daryl Eigen, NP[...]

07/25/2002 — Ultratech CEO to chair industry association

July 25, 2002 -- Arthur Zafiropoulo, chairman and chief executive of Ultratech Stepper Inc., will serve as chairman of Semiconductor Equipment and Materials International (SEMI), an industry trade group representing over 2,500 companies, according to a news release. Zafiropoulo, a SEMI board member since 1995 and vice chairman for[...]

07/29/2002 — Axsun appoints chief executive

July 29, 2002 -- Axsun Technologies Inc., a Billerica, Mass., developer and manufacturer of MEMS and other photonic components and subsystems, announced the appointment of Jack Kay as president and chief executive. Kay, who was also appointed to Axsun's board, had recently been a consultant for Axsun. He was previously[...]

07/24/2002 — Input/Output acquires Colorado firm

July 24, 2002 -- Input/Output Inc. said the acquisition of a Colorado-based seismic data service company will boost plans to sell its new MEMS-based product for oil and gas exploration, production and reservoir monitoring, according to a news release. Input/Output said it bought AXIS Geophysics Inc., which provides specialized data[...]

07/11/2002 — Enter the Mesh: How Small Tech and Pervasive Computing Will Weave A New World

Click here to enlarge imageThey will watch you. They will know you. They will be all but invisible to you. By 2010 there will be 10,000 connected microsensors for every person on the planet, an Ernst & Young report predicted in 1999.The broad idea of "pervasive" computing[...]

07/25/2002 — Analog fab meets industry standard

July 25, 2002 -- Analog Devices Inc. said its plant in Northern Ireland that fabricates wafers for optical MEMS devices has achieved an international environmental standard. The Belfast-based fab joins other Analog facilities in the United States, Europe and Asia to meet the ISO-14001 standard, which consists of defined international[...]

07/01/2002 — That's nanotainment! 'Minority'begins era of cinema small tech

John Underkoffler, a science adviser for Steven Spielberg's "Minority Report," has the Hollywood thing down. An MIT expert in MEMS and nanoscience, Underkoffler already has moved to his next film gig. He's helping director Ang Lee get the science and technical stuff right for the upcoming film "The Incredible Hulk." He's finished another Spielberg project called "Taken," a miniseries about alien abductions.

07/09/2002 — Measurement Specialties meets restructuring milestone

July 9, 2002 -- Measurement Specialties Inc., a Fairfield, N.J., designer and manufacturer of MEMS sensors and sensor-based consumer products, announced it has negotiated a forbearance agreement with lenders. Under the agreement, the lenders will not take action as a result of defaults on loans until Nov. 1, 2002[...]

07/01/2006 — State Rankings

The first category - venture capital - of our state rankings shows few surprises in the first and second slots.


This issue of Small Times marks many milestones. It marks the fifth anniversary of our initial print publication.

09/01/2006 — Critical balance: Going fabless while designing MEMS for package and test

Manufacturers and other MEMS players have come to realize the importance of incorporating packaging into the design and manufacturing process.

05/01/2006 — Timing’s right for MEMS veteran Petersen

In the MEMS community, Kurt Petersen is among the legends. A paper he authored more than two decades ago about the mechanical properties of silicon paved the way for devices that have become the bread-and-butter for the MEMS industry.

05/01/2006 — MEMS II: return of the fabs

Those that survived the shakeout are coming on strong

05/01/2006 — MEMS temperature regulator hitches a ride into space

NASA’s current space mission was designed to demonstrate that good things come in small packages - and part of its plan is to showcase the role MEMS can play in space.

05/01/2006 — Analyzing the analysts when they don’t agree

When market analysts are right, they are revered. When they’re wrong, they’re reviled.

07/01/2006 — Dear reader,

I recently had the opportunity to interview a living legend of nanotechnology. Morinobu Endo is unassuming about the role he has played in commercial nanotech.

07/01/2006 — There’s plenty of room at the top for nanotech research

Small Times has run its share of stories that were, well, out of this world. We have tracked the use of MEMS in satellites and covered the development of nanomaterials for spacecraft.

07/01/2006 — MEMS fab services

Just a few short years ago the MEMS fab business was decidedly in the doldrums. Today it is catching a tailwind.

03/01/2007 — Small tech meets ‘impossible’ defense goals

Aerospace systems engineers are famous for their tendency to levy impossible specifications on materials and components.

09/01/2006 — Case study: In-line metrology provides hands-free MEMS manufacturing

More MEMS companies are going fabless every day and pushing production and process development to contract manufacturers and foundries.

09/01/2006 — A package deal: enabling silicon resonators

Silicon resonators are by no means novel technology. They have been demonstrated in laboratories for more than 30 years.

09/01/2006 — Turn on a dime: putting tilt nav into handhelds

Motion sensing is quickly becoming the next critical technology to enable innovative applications for the handheld consumer market.

09/01/2006 — Taking NeoPhotonics from tiny startup to global player

Last year Tim Jenks pulled off one of the hardest tricks in the global economy: He merged his company with another one.

11/01/2006 — Aerospace market still struggling to take off

Structural nanomaterials, sensors show promise but providers must prove reliability first

03/01/2007 — Dear reader

“[Nanotechnology] is becoming real a lot faster than I was anticipating,” says Feynman Prize-winning researcher Stan Williams, whose work is profiled in this issue’s Q&A feature.

05/01/2007 — Community colleges are critical

Go to any small-tech seminar or conference these days and you’re almost guaranteed to hear folks lamenting the shortage of workers skilled in small-tech topics.

07/01/2007 — Dear reader,

The MEMS industry’s two major annual market research studies both report dramatic growth from 2005 to 2006.

09/01/2006 — Lobbying for a nationwide industry from a Midwest perch

Go to any meeting sponsored by the NanoBusiness Alliance and you’ll see Sean Murdock in half a dozen places at once - introducing speakers, making sure things are running smoothly, and furiously hobnobbing in the hallways.

09/01/2006 — State Rankings

The second category - industry - of our state rankings shows California and Massachusetts taking the top two slots once again.

11/01/2006 — Dear reader

At Small Times we have always prided ourselves on staying ahead of the curve. Whether it is trends in MEMS fab outsourcing, the latest tools or materials innovations, or even nano startup financing, we have always aimed to report and analyze what has recently happened, and also point out for readers what we expect to come next.

11/01/2006 — The 2006 MEMS industry report card

Evaluating the sector for its efforts at developing standards, building clusters, rolling out products and more

11/01/2006 — Aiming for the top of their class

Community colleges integrate micro, nanotech into curricula in drive to support local industry development

11/01/2006 — A new national asset: the Hispanic nanotechnologist

More needs to be done to attract this burgeoning population to fill the growing number of high tech jobs

05/01/2006 — Gateway to greatness

A guide for students, researchers, inventors and CEOs

01/01/2006 — Dear reader,

Here’s some advice for 2006: Always try to anticipate who is gunning for your tailpipe.

01/01/2006 — Nano financiers aim to reinvent seed funds

Can a pair of innovators get ahead of the angels and VCs?

01/01/2006 — Nano VC funding hits high in 2005

Private nanotechnology funding in the United States climbed significantly in 2005.

01/01/2006 — PRODUCTS

Applied Biosystems Group, an Applera Corp. business based in Foster City, Calif., and joint venture partner MDS Sciex, a division of MDS Inc., announced the launch of the Tempo Liquid Chromatography systems. The systems are designed to provide integrated front-end solutions for researchers conducting proteomics, biomarker and drug discovery studies[...]

07/02/2001 — SMALL TECH WORLD IN BRIEFJuly 2, 2001

CARBON NANOTUBE REPORT RELEASED Everything you ever wanted to know about carbon nanotube technology can be yours - for $2,000. DisplaySearch, an Austin, Texas-based market research and consulting firm, has released its Carbon Nanotube Technology Report, a 70-page document that explains what carbon nanotubes are, how they are manufactured[...]


With microsystem technology, the grip of approved gun users -- police officers or parents, for example -- would be recognized by sensors, based on hand size and pressure. The goal is to use small technology to keep guns out of the hands of criminals and children.

07/11/2001 — SMALL TECH WORLD IN BRIEFJuly 11, 2001

NANOPHASE LAUNCHES PRODUCT, NAMES DIRECTOR Nanophase Technologies Corp. on Tuesday named a board member and commercially launched three custom-engineered nanocrystalline oxides, the company said. James A. Henderson, former chairman and chief executive of Cummins Engine Co., has joined the board of directors. Henderson, who has 35 years of global management[...]


By Candace StuartSmall Times Senior Writer July 11, 2001 -- One of the nation's leading authorities on MEMS and microsystems announced Wednesday that he will trade in his post at a federal laboratory on Aug. 6 to help build the small tech industry in the Southwest. David Williams, director of[...]

07/12/2001 — SMALL TECH WORLD IN BRIEFJuly 12, 2001

JAPAN'S SCIENCE BUDGET EMPHASIZES NANOTECHNOLOGY Japan has targeted nanotechnology as one of four priorities in its fiscal 2001 science and technology budget, according to the Japanese wire service Jiji Press. The Council for Science and Technology Policy, chaired by Prime Minister Junichiro Koizumi, decided Wednesday that life science, information and[...]


Engineering professors at Michigan Technological University are designing what they say is the country's first Web-based master of engineering program in small tech and hope to have the first courses online by fall 2002.


June 21, 2001 -- Calient Networks Inc., recently rated one of the top start-up companies of the year, is laying off 60 of its 269 employees. The San Jose, Calif.-based developer of photonic switching systems and software is cutting jobs at its headquarters, as well as its MEMS design[...]

06/27/2001 — SMALL TECH WORLD IN BRIEFJune 27, 2001

NANOGRAM CREATES NEW POSITION A corporate attorney and consultant will be NanoGram Corp.'s first vice president of strategic and subsidiary development. The Fremont, Calif.-based nanomaterial company hired Jason M. Lemkin, who will be responsible for global initiatives supporting nanomaterial applications and intellectual property. Lemkin has held executive posts[...]

06/28/2001 — SMALL TECH WORLD IN BRIEFJune 28, 2001

NANOTECH CENTER NAMED FOR EX-TAIWAN LEADER Lee Teng-hui, former president of Taiwan and Cornell University alumnus, came back to campus this week for the groundbreaking of a nanotechnology center named after him. The Lee Teng-hui Institute for Scientific Research will be part of a new $60 million high-tech research center[...]

06/29/2001 — SMALL TECH WORLD IN BRIEFJune 29-July1, 2001

MICRODEVICE COULD HELP FIGHT DISEASEResearchers at the U.S. Department of Energy's Oak Ridge National Laboratories have developed a micro-instrument that could aid in the detection and diagnosis of diseases, according to, a UK-based Web site for engineers. The device, which detects genetic mutations by identifying mismatches in[...]


NASA is counting on small businesses developing micromachines to help it explore the cosmos. "The smaller you can make it the more interested we are," said one official. And smaller companies are "more adaptable and lighter on their feet."


Using MEMS and microsystems, the latest generation of dropsondes provides real-time readings of a storm's vital signs. "This technology allows us to make measurements that we never could before," said one meteorologist.


By Candace StuartSmall Times Senior Writer JUNE 12, 2001 -- While today's severe weather monitoring technology is good, it could be better with a few upgrades and alterations, according to the designers of a key part of today's tracking system. And Terrence Hock, an engineer at the National Center for[...]


Universities that excel in research hook up with companies in need of small tech solutions. If all goes well, the two sides combine their expertise and resources to forge a new destiny.


By Tom HendersonSmall Times Senior Writer June 15, 2001 -- For the sake of a promotion, Kenneth "Beau" Farmer has decided not to practice what he preaches. He's going to publish his work on micromirrors and miss out on a chance to make a profit through patent rights. The alternative[...]


At least 15 university-level nanocenters have sprung up across the United States. For researchers, it's about being pioneers in an area that is expected to influence medicine, science and the environment. For universities, it's about tapping into public dollars.

01/01/2006 — Agilent Technologies acquires AFM maker

Agilent Technologies Inc., the Palo Alto, Calif.-based test and measurement company, has become a player in the atomic force microscope market by acquiring Molecular Imaging Corp. of Tempe, Ariz.

03/01/2006 — Sony sends AIBO to the pound

Doggone. AIBO, the robotic dog that barks, plays fetch and follows commands, is being discontinued.

03/01/2006 — Patenting in a global economy

Making the various patent systems of the world work more effectively together is a perennial concern.


Nano washing machines, nano textiles, even nano bags for babies. Where "smart" was the marketing modifier in the last millennium, nano is today's premium prefix – whether it's used to describe a product that's a billionth of a meter or not.


Scientists are developing tiny devices that remotely detect land mines. They predict no single approach will provide the solution, but are optimistic that nations one day will have an inexpensive tool for reclaiming land that has been made inhospitable by abandoned mines.

07/09/2001 — SMALL TECH WORLD IN BRIEFJuly 9, 2001

HITACHI DEMONSTRATES MULTIPLE OPTICAL SWITCHING SYSTEMS Hitachi Telecom Inc. said it is the first company to demonstrate a dense wavelength division multiplexing (DWDM) system with multiple optical switches. The DWDM contains an all-optical switching system, developed by Calient Networks, and an optical-to-electrical-to-optical (OEO) grooming switch system, from Brightlink Networks. DWDM[...]


If Comcast succeeds in buying AT&T Broadband, it would do more than create the nation’s largest cable company: The sale could accelerate the spread of small technology in the form of the DCT 5000, a next-generation digital cable terminal made by Motorola Inc.

07/10/2001 — SMALL TECH WORLD IN BRIEFJuly 10, 2001

SILICON GENESIS DEVELOPS FABRICATION PROCESS Increasing chip performance is one goal of a new fabrication process developer of Silicon-on-Insulator (SOI) wafer technologies. Silicon Genesis Corp. of Campbell, Calif., has developed a commercial process for thick SOI wafers, or wafers thicker than 1 micron. SiGen said the new process provides a[...]


As thousands of jobs are scrapped at companies nationwide, those who work in MEMS, microsystems and nanotechnology are being spared. Firms know that this research will become a key part of future products. By 2002, consumers will see the benefits of MEMS research and development – about the time the U.S. economy is expected to recover, one analyst said.


A new company hopes its small technology will dial up the performance of cell phones and other wireless devices while driving down the cost and size. Discera Inc.'s goal is to combine all electronics and mechanics onto a single chip.


By Jeff KaroubSmall Times Staff Writer July 27, 2001 -- JDS Uniphase Corp.'s steep earnings drop announced Thursday has led the optical network maker to write down by $40 billion the value of companies it has bought in the past two years. But the biggest reported loss in business[...]


Lake Linden, Mich., one of the snowiest and most remote places in the United States, managed to avoid ghost-town status when its copper mine closed. Today, it is home to the Keweenaw Nanoscience Center, founded by a scientist whose research is being noticed hundreds of miles away.


The dinosaurs could have used small technology. While Monday's spectacular meteor show managed to frighten many residents of the Eastern United States, it apparently was nothing more than a suitcase-sized chunk that fizzled harmlessly in the atmosphere. But it may be of small comfort to know that scientists plan to use more energy- and cost-efficient MEMS-based sensors in space and on Earth to record the impact of any extinction-inducing event.

10/10/2001 — SMALL TECH WORLD IN BRIEFOct. 10, 2001

ARMY AWARDS GRANT TO NANOGEN FOR BIOWARFARE DETECTION Nanogen said it has received a three-year, $1.5 million grant from the U.S. Army for continued development of biological warfare detection systems. The San Diego, Calif.-based company, which markets its NanoChip technology to scientists and laboratories conducting genomic research[...]

10/19/2001 — SMALL TECH WORLD IN BRIEFOct. 19, 2001

COVENTOR MAKES LIST OF FASTEST GROWING FIRMS Coventor Inc., a maker of MEMS software, ranked 152 on the Inc. 500, Inc. magazine's list of the top 500 fastest growing companies in the United States. Coventor said it is the first MEMS company to make the list, which recognizes privately held[...]

10/22/2001 — SMALL TECH WORLD IN BRIEFOct. 22, 2001 (updated 12:55 p.m. EDT)

WHEN IS A BUBBLE FLAT? WHEN IT'S A NANOBUBBLEAustralian researchers obtained the first direct images of nanobubbles on water-repellent surfaces immersed in water, which could lead to advances in development of advanced materials, according to the American Institute of Physics' Physics News Update . The team from of the University of[...]


OMM Inc.'s introduction of its 32X32 switch module is being viewed as a sign of forward momentum, both for the San Diego-based supplier of photonic switching modules and the MEMS industry as a whole. "Anything they do bears watching, because they're typically in the forefront of innovation," said one analyst.


After billions of dollars in investments -- followed by an economy heading for recession -- MEMS optical switch startups are about to be tested by the market.


Small tech could help prevent future terrorist attacks like those in New York and Washington, D.C., on Tuesday that destroyed the World Trade Center and part of the Pentagon. Microsystems and nanotechnology can help gather intelligence, make potential targets more secure and increase the value of forensic evidence after an attack.


MEMS companies overall aren't worried about the stock market. Those with defense and security applications stand to gain.

09/24/2001 — Buckeye state is going biotech to create new base

While Ohio still lags in high-tech economic development, a consortium of government and university researchers are getting together to develop small tech. They hope to turn Ohio into what one researcher calls "a center of excellence."


Researchers have discovered a way to eventually eliminate many of the 500,000 bone grafts in the United States each year. They envision growing adult stem cells, then implanting it in the body as a treatment for severe fractures. Later, they'll incorporate MEMS devices to further improve bone growth and reduce healing time.


An Australian maker of all-electronic firearms, is opening up an office near Washington, D.C., to work on U.S.-funded projects for the next generation of military weapons. In the works is a MEMS-powered mortar system to replace land mines. It's a potentially lucrative market as the United States hopes to have an alternative in place before it complies with a land mine ban.


Small tech will play a supporting role in the unfolding response to terrorist attacks against the United States. MEMS and microsystems are making their way into the U.S. arsenal, helping to guide weapons to their targets, sensing for toxic substances, spying on the enemy and storing vast amounts of information in small places.


By Jeff KaroubSmall Times Staff Writer Nov. 2, 2001 -- A group recently formed to promote the business of nanotechnology predicts massive growth for the small tech industry. But some scientists say it's still too early to pop the cork and toast the tiny bubbles. The NanoBusiness Alliance released a[...]


MEMS gyroscopes and accelerometers, used in the new Segway scooters, are not new themselves. They have been used in military and automotive applications for several years. But the Segway brings the technology to a mainstream use that consumers can easily understand, and might pave the way for other innovations.


For the MEMS industry, friction is a key problem. It's one of the main impediments to successfully making some micromachined gears and moving parts. But on Monday, two teens from New York state turned that sticky problem into a successful science fair project, winning a $100,000 scholarship in the Siemens Westinghouse Science and Technology Competition.


Earth Day 2001 finds scientists using MEMS to clean the water, monitor the air, avoid toxic spills.


Small tech companies should brace for a rocky year as the economy teeters toward a recession. But in the long run, the shakeup may benefit some tech startups and their investors.


Reiner Wechsung has a fast-growing company and more promising products being developed.


Faced with multiple offers, pay has become secondary to opportunity and compatibility, top students say.


A survivor of the Iran-Iraq war landed a secure job at IBM. But that wasn't enough. "I wanted to bring MEMS from something gathering dust on papers on the shelf to real products that affect society." So Integrated Sensing Systems Inc. was born.


Sandia is inviting the nation’s top science and engineering students to come to Albuquerque, N.M., to work on small tech projects in its world-class laboratories and clean rooms. It's part of the MESA program, a $370 million project that aims to build the world’s premier research and design center in microsystems.


Texas undergrad wins IEEE award for her work on device that could save thousands of lives.


Venture capitalists say e-commerce crash has created attractive values in optical, biomed startups.


In a city known for Oscars, Emmys and Grammys, Convergent Ventures is targeting L.A. for funding start-ups.


A Small Times guide to the long and short of micro measurements.


Researchers are developing techniques to make diamond films that far outshine many materials used in MEMS. When they're commercially available, they'll look attractive to makers of nanomachines. But they're not flawless.


Brownian motion, the random movement of tiny objects caused by thermal energy, could be harnessed and directed, physicist says. If he's correct, scientists might have a power source for future nanoscale machines that cruise through the body to a cancer cell, then deliver tumor-killing enzymes.


The small technology that measures the speed of the U.S. Navy's sea-launched torpedoes soon could accurately track the knots of racing yachts. In the next few years, the sensors could also measure the speed of aircraft as well as the flow of liquids in retail gas pumps and industrial pipes.


By Candace StuartSmall Times Senior Writer OXFORD, England, Sept. 4, 2001 - Companies that specialize in microsystems need to look beyond their technical strengths if they hope to survive in today's global marketplace, analysts said Monday at an international conference on commercializing microsystems being held here. They also said that[...]


What do an Andy Warhol painting and a deep space probe have in common? They both depend on atomic oxygen to stay pristine. An offshoot of the ion-propulsion technology that is powering Deep Space I is also getting rid of unwanted lipstick stains on a famous Warhol.


By Candace StuartSmall Times Senior WriterOXFORD, Sept. 5, 2001 - Small tech entrepreneurship and innovation could spark the next economic boom in the United Kingdom if the fledgling industry receives sufficient support and resources, the nation's top proponent for science and technology said Tuesday. "There's a cultural revolution taking place[...]


SEPT. 13, 2001 - Out of respect for the national recovery period, Small Times Media announced Wednesday that it is restructuring "Small Tech 2001: The Microsystems Advantage," a conference and trade show that had been scheduled for Sept. 18-21 at the Ronald Reagan International Trade Center in Washington, D[...]


Small tech will soon lead to a "revolution" that "will change the ways in which neurosurgeons interact with the environment," says a group of researchers. Medical devices that contain MEMS will allow neurosurgeons to perform with better precision. But there are critics who say the high cost of the devices and difficulty in training surgeons remain tough barriers.


An examination of the small tech solutions and applications expected during the next five years. Panelists: Dr. Barry Alexia, John Deere Worldwide; Mr. Erik Puik, TNO Industries, the Netherlands; and Jim Walker, Tellium Inc.null Walker           Puik1. Please discuss the big picture for small tech[...]


Small tech can take a tiny share of the credit for a 90 percent drop in child deaths from air bags in the past five years. But in the years ahead, the MEMS that help make air bags work are expected to save even more lives.


A new study predicts dramatic growth in small tech components for mobile phones – from $1 million this year to nearly $350 million in 2006. But the dollars go well beyond that if you include the larger world of wireless MEMS, components that can be integrated into vehicle tire-monitoring systems, environmental monitoring and global positioning satellite systems.


Aug. 10, 2001 -- The appeal of the consumer market for the MEMS industry is obvious -- from tens of millions of digital cameras, and hundreds of millions of CD and DVD players, to a billion or so cell phones -- the potential unit volume is astounding. null Bourne With[...]


Using the "augmented vision" offered by Microvision Inc.'s Nomad, the company says that mechanics will increase their efficiency, pilots will fly more safely and surgeons will operate more effectively. The Nomad uses MEMS technology in a scanning chip that directs a tiny ray of light to write images and other information directly onto the wearer's retina.

08/29/2001 — SMALL TECH WORLD IN BRIEFAug. 29, 2001

REPORT: MEMS AN OASIS IN TELECOM DROUGHT MEMS manufacturers have suffered some cuts in jobs and funding, but small tech has managed to avoid the brunt of the troubles facing the telecommunications market, according to a new report. Cahners In-Stat Group said MEMS is attracting record investment from venture capitalists[...]


A new small tech business eliminates the need for costly photomasks in making many bioMEMS and sensor devices. One potential client says the "superior process" makes it easier to prototype new components because making modifications is no longer a cumbersome process.


GM spinoff to dedicate scientists, patents for nonsilicon research.


Micromachines, because of their size, are naturally capable of taking a beating. Still, they have many enemies, from humidity to electrostatic shock.


Spinoffs from national labs are transferring weapons-based technology into such non-military applications as drug detection, medical delivery and environmental sensing.


Sandia spin-off uses new method to create all-optical digital switch using tiny, highly functional mirrors.


World auto industry turns to small tech monitors to make tires safer and more energy efficient.


MEMS mascots bug some as small tech industry looks to the future.


Engineering Research Center is developing a large-scale treatment for deafness.

06/25/2001 — SMALL TECH WORLD IN BRIEFJune 25, 2001

LAWMAKER PRAISES NANOTECH INCREASE The new chairwoman of the U.S. Senate appropriations subcommittee praised the Bush administration's commitment to nanotechnology, but criticized funding cuts in other sciences. Sen. Barbara Mikulski, (D-Md.), whose subcommittee funds the National Science Foundation (NSF), said she is pleased with the proposed 16 percent[...]


The University of Michigan and its partners in an Engineering Research Center in wireless integrated microsystems (WIMS), wanted to get public school science teachers excited about teaching small technology. And excitement was what they got at a two-day conference this week.


By Jeff KaroubSmall Times Staff Writer July 2, 2001 -- Small technology is at the heart of an advanced pacemaker implanted in Vice President Dick Cheney's chest on Saturday. The Medtronic GEM III DR, a pacemaker and implantable cardioverter-defibrillator (ICD), now constantly records Cheney's heart activity and can speed up[...]


The InSync implantable pacemaker, about the size of a half-dollar coin, could greatly improve the quality of life for heart-failure patients. One analyst says the market for the device could be $1.1 billion by 2005.


Toys are on the verge of a revolution powered by small tech. "You’ll pick up a toy and it’ll know who’s using it, and the environment it’s in," said an expert. "We’ll have toys for kids that will seem alive."


July 2, 2001 - opened a message board today, available to all registered users. The new board was created to host comments and discussions concerning the fast-growing field of small technology: MEMS, microsystems and nanotechnology. "Small tech is expanding and evolving daily, and with that change comes competing[...]


Tired of how slowly new technology is being commercialized, donors are no longer simply writing checks. Entrepreneurs themselves, they are not content simply to get a building named after them. They're involved in a hands-on way.

03/24/2003 — EnOcean proffers piezo power so low-energy products see the light

EnOcean is reinventing the light switch. The Siemens spinoff makes a battery-free power source for low-energy products like its radio signal generator that wirelessly turns lights on and off. What sets EnOcean’s switch apart is the way it gets the power: A piezoelectric unit converts the force of a finger pressing on it into enough energy to emit the radio signal to a remote receiver.

04/01/2003 — STMicroelectronics puts some marketing muscle into bioMEMS

STMicroelectronics, the world's third-largest semiconductor company, is ramping up its involvement in medical MEMS. Although ST has long produced MEMS for autos and industry, this new product is its first foray into bioMEMS. The company is punctuating this new chapter by investing in state-of-the-art research facilities to build up a bioMEMS product line.

02/27/2003 — Optical MEMS: It isn't just for telecom anymore

The telecom drought hasn't dried up all hope for optical MEMS, according to a new report.

02/26/2003 — Not content to gather Dust in the lab, pioneer brings motes to market

Most of us think of motes, if we think of them at all, because one was in someone’s eye in the Bible. We’ll soon think of them differently if Kris Pister has his way. The Berkeley pioneer in wireless sensor networks finally jumped from academia to create Dust Inc., and is dedicating himself full time to commercializing his tiny wireless radio and semiconductor motes.

02/04/2003 — Small tech's voice heard amid clamor of competing agendas

Recently in Davos, Switzerland, loud beats could be heard from two drums: the Iraq war drums and the economic doldrums. But amid the din of discussion and dissent at the World Economic Forum's annual meeting, a small tech leader and advocate quietly worked the crowd to make the emerging industry's voice heard – and hopes the message resonates at future gatherings.

02/04/2003 — Measurement Specialties secures $15M credit line

Feb. 4, 2003 -- Measurement Specialties, a Fairfield, N.J., provider of MEMS and other types of sensors and sensor-based products, has secured a three-year, $15 million revolving credit facility with Fleet Capital Corp., according to a company news release. Measurement Specialties has been restructuring since June, when Frank Guidone[...]

02/06/2003 — NanoInk to net $1M financing from Chicago

NanoInk Inc., a Chicago-based developer of nanoscale fabrication platform processes, is close to securing $1 million in tax increment financing (TIF) from the city of Chicago.

02/12/2003 — MEMX nets $8 million B round

MEMX Inc., a Palo Alto, Calif., developer of MEMS and MEMS processes, has secured $8 million in a Series B round of financing, according to a news release.

01/22/2003 — Mancal increases Micralyne stake

Mancal Corporation Ltd., a Calgary, Alberta, diversified holding company, has increased its stake in Edmonton, Alberta-based MEMS foundry Micralyne Inc., according to Chris Lumb, Micralyne's president and chief executive. Mancal increased its share in Micralyne to a percentage "in the teens," Lumb said.

01/09/2003 — Companies put their MEMS together to drum up more customers

Four businesses have struck a partnership to offer unified MEMS product development, an effort to jump-start broader industrial interest in microtechnology. The Generics Group crafted the deal with Coventor Inc. Epigem Ltd. and LioniX BV. The main goal is to give customers an easier way to integrate MEMS into their products.

01/08/2003 — Nano-Or launches tabletop tool for MEMS imaging

Inspecting MEMS devices is among the applications eyed for a new three-dimensional imaging and measurement instrument.

01/08/2003 — Pacific Nanotechnology launches new AFM

Pacific Nanotechnology Inc. said it has launched an atomic force microscope (AFM) for the imaging of wafers and storage media disks.

01/09/2003 — Coventor launches upgraded MEMS software

Coventor Inc. said it has launched a major upgrade to its CoventorWare MEMS design software.

01/10/2003 — NanoVia launches cutting tool for MEMS

NanoVia LP of Londonderry, N.H., said it has developed a diffractive optic dicing tool for cutting holes and slots in micro tubing for MEMS devices.

01/15/2003 — MEMS meet semiconductors in beginning of a beautiful friendship

From gas control to optics, MEMS are used in an increasing number of areas in the semiconductor-making process. Right now, the market is small, but it should grow as semiconductor feature sizes shrink and MEMS-based devices prove themselves in chip-making equipment. Historically, chip makers have changed technologies to get the results they need. MEMS simply represent the next logical step.

01/15/2003 — MEMGen lays down MEMS challenge

MEMGen Corp. said it has launched what it's dubbed the world's first microdevice design contest.

01/20/2003 — SMI relocates fab, begins expansion

Silicon Microstructures Inc. (SMI), a subsidiary of Elmos Semiconductor AG, is almost done transferring equipment from its Hawthorne, Calif. facility to the Milpitas, Calif., foundry it purchased in July from the IC Sensor Division of Measurement Specialties Inc. and has commenced an expansion of its MEMS wafer foundry capabilities.

01/21/2003 — SUSS to install litho line in Taiwan lab

Jan. 21, 2003 -- SUSS MicroTec, a Munich, Germany, supplier of production and process technology for the semiconductor industry, will install a lithography line at the National Nano Device Laboratories (NDL) in Taiwan, according to a company news release. The line consists of an MA150 production mask aligner and ACS200[...]

01/24/2003 — Digital Matrix launches small tech division

Digital Matrix Corp. has launched a new division focusing on MEMS and nanotechnology manufacturing equipment, the company announced in a news release.

01/06/2003 — Iolon's MEMS-driven lasers reduce need for spare telecom 'tires'

MEMS-directed lasers may sound complicated, but not if you compare them to everyday items, such as tires. “In a car for example, you have four tires,” explains Saeid Aramideh of Iolon Inc. “If every tire was tuned separately, you’d have to carry four spares.” In this instance, the car is a long haul optical transmission network, and the tires are the tunable lasers that help move traffic.

02/14/2003 — After Columbia: Small tech can help make space travel safer

It will be some time before NASA can say whether damage to the fragile insulating tiles that cover the underbelly of the space shuttle caused the Columbia to disintegrate on Feb. 1. What is known for certain is Columbia was destroyed by a “thermal event,” and the shuttle program uses thermal protection technology that is decades old. NASA will increasingly look to small tech for ways to avert future tragedies.

03/05/2003 — BEI signs $10.5M deal with Rockwell Collins

BEI Technologies Inc. has signed a $10.5 million deal to supply Rockwell Collins Inc. with MEMS sensors for aerospace applications, according to a news release.

03/07/2003 — MEMS worn to be wild, but air bag vests a hard sell to easy riders

You could say MEMS has a vested interest in motorcycle safety. Two companies are developing a vest that contains three air bags and gas generators to protect a motorcycle rider in an accident. The air bags, governed by a system that includes MEMS accelerometers and gyroscopes, deploy into a protective balloon-shaped cushion by breaking through the vest's seams. But a motorcyclist group is curbing its enthusiasm.

03/19/2003 — New Motown MEMS lab will steer Delphi beyond the automobile

A state-of-the-art lab for commercial development of MEMS and microsystems opened Tuesday at Detroit's Wayne State University with the help of Troy, Mich.-based Delphi Corp., which will use the space to adapt its sensor technologies to biomedicine and other markets. The facility is part of the Smart Sensors and Integrated Microsystems program at the University's College of Engineering.

01/29/2003 — In telecom's long, dark winter, MEMS survivors keep it simple

Despite the serious slump that has kept telecom systems makers from buying just about anything, MEMS-based optical components, such as variable optical attenuators are helping pave the way for the industry's eventual turnaround. Companies such as Lightconnect and MegaSense are surviving with simple approaches that are easy to manufacture.

01/06/2003 — Cellucci named Zyvex COO

Thomas Cellucci has been promoted to chief operating officer at Zyvex Corp.

01/08/2003 — PHS MEMS raises $10.5M in ongoing round

PHS MEMS, a Grenoble, France, MEMS manufacturer, has raised $10.5 million in an ongoing round of financing, according to a news release.

01/09/2003 — Measurement Specialties chief to step down

Joseph Mallon, chairman of the board of Fairfield, N.J.-based sensor provider Measurement Specialties Inc., will step down from his position effective Jan. 31 to pursue other opportunities, according to a news release. He will remain a member of the board.

01/10/2003 — MEMS industry hopes to hire, while veterans see growing pains

Although few are currently hiring, companies operating in the MEMS industry intend to hire new employees this year, according to a recent survey. Industry veterans say turnover is necessary for growth and compare it to the early years of semiconductors. Out of 42 companies responding, only one company reported it would not be hiring one year from now and only two companies indicated fewer employees than they had a year ago.

01/22/2003 — Akustica extends first round financing to $4.5M

Akustica Inc., a Pittsburgh developer of MEMS-based acoustic chips, extended its first round of financing to $4.5 million, according to a company news release. Akustica previously closed the round in October at $2.25 million.

02/12/2003 — Kionix sells MEMS to Korean auto supplier

Kionix Inc. will supply MEMS accelerometers to Kefico Corp. of South Korea for electronic control systems designed for the automotive industry, according to a news release.

02/04/2003 — Emkay launches MEMS microphone

Emkay Innovative Products, a division of Knowles Electronics, said it has launched a microphone based on MEMS technology.

02/28/2003 — MEMSIC launches MEMS for model rockets

Blacksky Corp., a Carlsbad, Calif.-based maker of consumer model rockets, has chosen MEMSIC Inc.'s dual-axis MEMS sensor in a precision event timer, according to a news release.

02/07/2003 — IntelliSense, Northrop Grumman team up

Corning IntelliSense Corp., a division of Corning Inc., said it is working with Northrop Grumman Corp. to demonstrate the reliability of radio frequency (RF) MEMS switches for defense applications, according to a news release.

02/13/2003 — Incubator at Army arsenal aims for nanotech boom in New Jersey

Could a 6,500-acre military base become one of nanotech's next hot zones? That's the vision a group of enterprising civilian managers are reaching for at the U.S. Army's Picatinny Arsenal. They plan to transform part of the facility into "Nano Valley," an industrial park and incubator for small companies with mission-critical military nanotechnologies.

02/06/2003 — Tronic's names new CEO

Tronic's Microsystems SA, a France-based designer and maker of MEMS devices, has hired Peter Pfluger as its chief executive officer, according to a news release.

02/06/2003 — Network Photonics launches next MEMS switch

Network Photonics, a Boulder, Colo.-based developer of MEMS-based optical switches, said it's shipping its CrossWave 1400 to customers.

02/10/2003 — Calient logs onto OptIPuter

Calient Networks, a San Jose, Calif.-based maker of MEMS optical switches, said it is joining the University of Illinois at Chicago and California Institute for Telecommunications and Information Technology to develop the OptIPuter, a global experimental network designed to support data-intensive scientific research and collaboration.

03/12/2003 — California, Massachusetts locked in bicoastal clash for supremacy

California towers over nation in sheer volume of small tech companies, with Massachusetts a faraway second, according to a Small Times analysis. But if you forget volume and measure density, or the number of small tech companies compared to the state’s total number of private businesses, then the Atlantic Coast commonwealth trumps its Pacific Coast competition.

03/24/2003 — MEMSCAP reports $29.6M net loss

MEMSCAP SA reported a net loss of $29.6 million for its fiscal year ending Dec. 31.

03/11/2003 — Micro-opto group gets IntelliSense

Corning IntelliSense Corp., a Wilmington, Mass., subsidiary of Corning Inc., announced today that it will manufacture products for a consortium led by Xerox Corp. The group is developing a better process of manufacturing and commercializing micro-optoelectromechanical systems (MOEMS), according to a Corning IntelliSense news release.

03/13/2003 — Thin film tool maker announces shipments

Jet Process Corp., a New Haven, Conn., provider of thin film production tools, announced the shipment of its new jet vapor deposition (JVD) thin film coating tools. The tools are used by customers to produce thin film solder and other coatings for lasers, sensors, MEMS, biomedical devices, cell phones and other products.

03/03/2003 — BioProcessors breaks a bottleneck in the drug-discovery process

For all the science involved in the search for new drugs, there comes a time to make the drugs themselves – usually in large quantities. Andrey Zarur knows firsthand that it's not easy to ensure that drug samples are cooking under the best conditions possible. That's why he founded BioProcessors, which takes a MEMS approach to cultivating biological products.

02/19/2003 — MEMSCAP lays off 70 in cost-cutting move

MEMSCAP SA will cut about 70 jobs as part of a plan to reduce costs and become profitable, according to a news release.

02/12/2003 — Survey finds 'disconnects' between MEMS developers and fabs

Launching the next MEMS device that duplicates the success of the air bag accelerometer will require a closer bond between makers and sellers, according to a new MEMS Industry Group report. "Focus on Fabrication" found that the largest issue looming in the MEMS industry is lack of standardized materials and processes in making MEMS devices.

02/12/2003 — Coventor, Cadence link on MEMS software

Coventor Inc. is teaming up with Cadence Design Systems Inc. to offer new MEMS design software, according to a news release.

02/13/2003 — EV Group makes deal with Taiwan foundry

EV Group, an Austrian maker of MEMS and semiconductor wafer processing equipment, has completed a multimillion-dollar deal to sell equipment to Asia Pacific Microsystems Inc. (APM) in Taiwan, according to a news release.

02/17/2003 — Intel donates $17.5M in tools for MEMS fab

Intel Corp. is donating $17.5 million worth of equipment to a public-private economic development group for a MEMS fabrication facility in New Mexico.

02/18/2003 — OMM, Fairchild sign wafer production deal

Fairchild Semiconductor signed a long-term production deal with OMM Inc. to supply its MEMS wafers for optical networking applications, according to a news release.

02/18/2003 — Honeywell buys Unaxis' MEMS etching system

Honeywell International Inc. bought plasma etching equipment for advanced MEMS manufacturing from Unaxis Semiconductors, according to a news release.

02/20/2003 — Nanoimprint equipment companies set to make market impression

The first generation of tools for molding tiny devices with nanoimprint lithography is on its way to market. NIL encompasses a variety of methods for stamping ultrasmall patterns and structures onto a surface. It could also serve as a low-cost alternative to the photolithography processes currently used to carve out MEMS devices, microfluidic systems and computer chips.

02/21/2003 — Akrion books equipment orders

Akrion, an Allentown, Pa.-based maker of equipment for cleaning MEMS and other semiconductor-related devices, has booked two orders during the first quarter, according to a news release.

03/04/2003 — Neophotonics has eye on optical future with Lightwave buy

Buy low. It's a time-honored strategy being followed by NeoPhotonics, a California-based nano-optics firm that is taking advantage of the optical components slump to buy up good technology on the cheap. Its latest quarry is Lightwave Systems. “This gives us both the broadest and deepest photonic capability in the industry for making optical circuits,” says NeoPhotonics' CEO.

03/06/2003 — OMM dies in telecom's waiting room; customers mourn while IP's on ice

OMM Inc. could have been a contender. The San Diego startup had a novel technology for MEMS-based optical switches, an experienced management team and more than $150 million in funding. But it'll be all over for OMM on Friday, when it'll close its doors for the last time. Picking through the pieces, clues emerge as to why telecoms are reluctant to take on new technologies.

03/06/2003 — AOMEMS launches optical switch

Advanced Optical MEMS Inc. (AOMEMS) launched what it said is the market's lowest priced optical switch of its kind, according to a news release.

03/10/2003 — Michigan, Small Times launch new site

A Web site serving the Michigan small tech industry launched today. The site,, is a collaboration between the Michigan Economic Development Corporation (MEDC), a public-private partnership supported by state and corporate funds, and Small Times Media.

03/13/2003 — Crossbow launches Dust support

Crossbow Technology Inc., a San Jose, Calif., provider of wireless MEMS sensor networks, announced the launch of its "Smart-Dust-Service" program to provide technical support and consulting services.

03/14/2003 — LNL mans the photonic torpedoes to prepare for telecom's return

You can’t say enough bad things about telecom these days. Carriers are clutching their purse strings like octogenarian widows on a midnight Manhattan subway. And yet, analysts say, a world of insatiable bandwidth demand and multimedia-rich interactive everything is still ahead. That could mean opportunity for component providers, and LNL Technologies of Cambridge, Mass., wants to be prepared for it.

03/17/2003 — CIR releases optical forecasts

Communications Industry Researchers Inc., based in Charlottesville, Va., has released market forecasts for optical switching, amplifiers and transmission components. The three reports include forecasts for the period from 2003 to 2006.

03/26/2003 — Xerox develops integrated MEMS switch

Xerox Corp. has developed a MEMS-based switch that incorporates planar light circuits on a single silicon chip, according to a news release.

01/22/2003 — Small tech auto applications begin their trip in high-end vehicles

Visitors to the 2003 North American International Auto Show were greeted by vehicles with many small tech-powered amenities such as active chassis systems, side impact air bags and rollover detection systems. These types of new applications are ripe for small tech, but they're currently more common in high-end vehicles and will take years to migrate into midrange models.

01/22/2003 — Microvision signs two new auto deals

Microvision Inc., a Bothell, Wash., developer of MEMS-based light scanning technologies, announced it has signed two agreements for development of automotive display prototypes, according to a company news release.

01/30/2003 — Report: Use of MEMS in cars accelerating

The use of MEMS devices in vehicles is expected to nearly double in the next five years, despite the automotive industry's historically slow rollout of the technology beyond air bag accelerometers and manifold air pressure sensors, according to a new report.

01/30/2003 — Patent promises to place smart scalpels in surgeons' hands

A Pittsburgh company believes it is close to carving out a unique piece of the MEMS market with its first patent. Verimetra Inc. says its U.S. patent for embedding sensors on cutting tools will help it commercialize smart surgical devices and, down the road, other consumer and industrial applications.

01/14/2003 — Akustica signs MEMS hearing aid deal

Akustica Inc. said it has signed a deal to develop acoustic MEMS technology for a major manufacturer of advanced hearing instruments.

01/31/2003 — Analog names new MEMS VP

Analog Devices Inc. has named William Giudice vice president and general manager for the Micromachined Products Division, which includes MEMS product development and manufacturing.

01/03/2003 — Tiny radio signal switches set to turn on RF MEMS market

When Bob Miracky started talking to potential customers about a radio frequency switch his company was developing that offered less signal loss than existing components, he didn't emphasize that it was a MEMS device. "Companies buy business solutions, not technology," said Miracky, president of Teravicta Technologies Inc. of Austin, Texas.

01/03/2003 — Report looks at small tech in optical chips

The role of microsystems and nanotechnology in global optical networking is the topic of a new report.

01/03/2003 — TriQuint completes Agere opto acquisition

TriQuint Semiconductor Inc., a Hillsboro, Ore., supplier of communications components, has completed its acquisition of a portion of Allentown, Pa., Agere Systems Inc.'s optoelectronics business, according to a news release.

05/12/2010 — Using Casimir forces to lubricate MEMS devices

Researchers have come up with a way to calculate and manipulate the effects of Casimir forces, and then use them to keep microelectromechanical systems (MEMS) components from sticking together, which could greatly reduce failure rates and enable new, more affordable devices.

05/13/2010 — Sonoscan demos MEMS cavity seal integrity inspection

Defects most frequently take the form of voids within the MEMS cavity seal. In some locations on a wafer, the seal may be breached.

05/12/2010 — Leveraging nanoimprint lithography for diverse applications

Molecular Imprints founder/CTO S.V. Sreenivasan shared the company's J-FIL nanoimprint lithography approach with attendees at a recent IEEE San Francisco Bay Area Nanotechnology Council meeting, reports Neha K. Choksi.

05/17/2010 — Top 20 MEMS foundry ranks gain an IC foundry

An IC foundry has made it into the ranks of the Top 20 MEMS foundries for the first time, as TSMC’s roughly $10 million in MEMS foundry revenues put it into 14th place on Yole Developpement’s 2009 listing. STMicro improved slightly, continuing to dominate the MEMS foundry arena. TI slipped, holding onto #2; Dalsa gained, and grabbed the #3 slot.

08/25/2010 — PhyloChip tech detects microbial community alterations in dispersed oil plumes from BP spill

PhyloTech Inc.'s PhyloChip technology was used in analysis of oil-degrading bacteria during the BP oil spill from the Deepwater Horizon. A peer-reviewed article on the work will be published in the journal Science, titled “Deep-sea oil plume enriches indigenous oil-degrading bacteria.” The presence of hydrocarbon-degrading microbial communities implies “a potential for intrinsic bioremediation of oil contaminants in the deep-sea.”

08/13/2010 — MEMS sales rise in consumer, cellphone markets

Cell phones and a slew of emerging devices will power the market for consumer electronics and cell phone Microelectromechanical (MEMS) sensors toward solid, uninterrupted growth in 2010 and beyond, according to the market research firm iSuppli Corp.Cell phones and a slew of emerging devices will power the market for consumer electronics and cell phone Microelectromechanical (MEMS) sensors toward solid, uninterrupted growth in 2010 and beyond, according to the market research firm iSuppli Corp.

08/16/2010 — Modeling energy and reliability of a CNT-based WSN on an HPC setup

Rohit Pathak and Satyadhar Joshi analyzed the effect of innovations in nanotechnology on wireless sensor networks and modeled CNT-based sensor nodes from a device prospective. A WSN model was programmed in Simulink-MATLAB and a library developed. Average energy consumption for the system has been formulated and its reliability shown holistically. Changes are needed in existing sensor node structure to improve efficiency and the assimilation of CNT-based devices in a WSN. Finally, the authors comment on the challenges and factors of reliability.

11/01/2007 — Better MEMS, NIL with surface engineering

Advanced thin-film deposition methods and tools promise to facilitate device production and operation

01/01/2008 — Welcome home

Come on in … to the redesigned Small Times!

01/01/2008 — Tools + Services

Park Systems’ new XE-NSOM/Raman atomic force microscope (AFM) is designed to provide unsurpassed versatility for advanced near-field scanning optical microscopy (NSOM) and Raman spectrometry experiments, according to company claims. Unlike conventional NSOM systems that provide shear-force feedback by means of tuning forks, the XE-NSOM uses cantilever-based, closed loop feedback, available[...]

01/01/2008 — Development + Research

Plasmonic QC laser nanoantennasHarvard University engineers have demonstrated a plasmonic quantum cascade (QC) laser nanoantenna capable of chemical imaging of materials and biological specimens in unprecedented detail.The antenna is used to concentrate light to the subwavelength scale. Graduate students Nanfang Yu and Ertugrul Cubukcu worked with Professor Federico Capasso[...]

01/01/2008 — Components + Materials

Analog Devices Inc. says its new dual-axis inclinometer makes extremely accurate, easy-to-use tilt sensing affordable and accessible for industrial equipment manufacturers—and that functionally equivalent options are typically 100x larger. Click here to enlarge imageThe MEMS-based ADIS16209 programmable, dual-mode inclinometer promises a fully compensated direct angle output with less than[...]

07/01/2009 — Emerging commercial applications of nano electronics

Nanoscale properties enable improved thermoelectrics, NEMS gas sensors

07/01/2009 — Pressure sensors provide indoor competency for navigation

Inside of buildings, even the newest GPS navigation units quickly hit their limits–their navigational abilities are so inexact that a few floors can stand between the goal they indicate and the actual one.

01/11/2010 — Better drug discovery using microfluidics ... and worms

Researchers at McMaster University in Canada have developed a way to direct microscopic-sized worms along a microchannel device using an electric field, seen as a step toward high-throughput microscreening devices for drug discovery.

01/05/2010 — Analyst: Strong growth in silicon magnetic sensors

Silicon magnetic sensors, among the most ubiquitous types of sensors sold, will continue to see strong growth in 2010 thanks to demand from a trio of key markets, according to a report from iSuppli.

01/01/2009 — You tell us: Who’s the Nanotech Idol among universities?

Universities and technical colleges around the world are where people go to obtain “higher learning.

01/01/2009 — MEMS resonators vs. crystal oscillators for IC timing circuits

Since the early 1980s, companies have been trying to replace quartz with silicon MEMS-based oscillators as the frequency reference in clock and timing oscillators.

01/01/2009 — 2008: A watershed year for consumer and mobile MEMS sensors

For the first time in its history, the MEMS market will fail to generate any growth in 2008.

03/01/2008 — Compensation mirrors economy

While Small Times’ latest compensation survey reveals lackluster growth, small-tech salaries are still on the upswing and employers indicate growing need for a broad range of talent.

09/01/2008 — MEMS of high sophistication

I set off on what I thought was a simple quest a couple of months ago, to identify a few of the most sophisticated microelectromechanical system (MEMS) devices in the world.

09/01/2008 — Global MEMS/Microsystems markets and opportunities

Burgeoning demand for a host of new products enabled by MEMS devices means the sector will likely see a healthy increase this year despite any general semiconductor slowdown, and will remain on track to maintain its 17% average growth for the next five years.

09/01/2008 — The eight-inch advantage: MEMS development at SVTC

Q: What’s new at SVTC?

09/01/2008 — MEMS State of the Nation

I’ll attempt to provide here a brief review and update of the “MEMS State of the Nation” by using my MEMS Commercialization Report Card”1 to help track the recent changes and the trends in the critical success factors to the commercialization of MEMS.

09/01/2008 — PRODUCTS

FEI Co. has released its new extreme field emission gun (X-FEG) electron source module for its Titan family of scanning transmission electron microscopes (S/TEMs).

09/01/2008 — Riding the wave of consumerization

New MEMS devices are inexpensive and ultracompact, with low power consumption.

09/01/2007 — In the air and on the ground

MEMS and nanotechnology are solving challenges in defense and security applications-and promise to further change military and aerospace operations in the future

09/01/2007 — MEMS is moving. Here’s where.

The Nintendo Wii’s use of a MEMS-enabled motion controller and the Apple iPhone’s use of accelerometers to change the display from horizontal to vertical are examples of how MEMS are creating new ways for people to interact with electronic devices.

02/08/2010 — Microfluidics: Practical advice and predictions

With the exception of inkjet printing, a key killer application for microfluidics has yet to be identified, and many wonder whether the field has true potential or if reality is masked in hype. Dr. Holger Becker, co-founder of microfluidic ChipShop GmbH, recently shared his 20 years of insights and perspective with the Bay Area MEMS Journal Club.

02/01/2010 — Analyst: MEMS sectors suffer, thrive in tumultuous 2009

Like sister electronics/device industries, MEMS suffered through a lousy early 2009 but managed to make it somewhat respectable for the full year -- thanks to a handful of key applications that are pushing into "major commoditization" for high-volume markets, according to an overview by iSuppli.

05/11/2010 — "Ice fishing," lollipops to measure nanopores

US researchers have developed methods to more accurately measure the length of nanopores in membranes, seen as a first step in calibrating tailor-made versions for applications such as rapid DNA analysis.

05/24/2010 — Back-side illumination, wafer-scale optics drive 2X-5X jump in CMOS image sensor performance

Ultrathin silicon that enables back-side illumination (BSI), and integrated wafer-level optics are bringing sharply improved performance, lower costs, and smaller size, driving CMOS image sensors into more and more markets -- and perhaps soon to impact other IC manufacturing as well, writes Yole Développement's Jerôme Baron.

07/01/2009 — Matchmaker’ portal matches MEMS customers, partners

The MEMS Industry Group, a trade association representing the MEMS and microstructures industries, has launched a MEMS Marketplace online “matchmaking” portal that enables MEMS companies to connect with prospective customers and partners.

07/01/2009 — MEMS equipment diffuses into mainstream IC markets, finds ways to improve yields

Quicker 3D simulation, more practical dry etch, and automated die inspection

09/01/2008 — A new take on MEMS innovation

With three of the key end markets for MEMS devices currently struggling I find it especially interesting that current emerging market drivers aren’t necessarily coming in the form of new MEMS devices as in the past, but rather new ways to apply existing MEMS devices

09/01/2008 — Enabling next-generation MEMS devices with metal eutectic bonding

Microelectrical-mechanical systems (MEMS) devices have experienced impressive and steady growth as they are integrated into people’s everyday lives.

12/01/2008 — Moving parts: Applied Materials as a MEMS tool supplier

Applied Materials is a well-known supplier of processing and inspection equipment to the semiconductor manufacturing industry, and now also the photovoltaics (PV) industry.

12/01/2008 — Emulation-based virtual manufacturing techniques for integrated MEMS

Integration of MEMS devices and CMOS electronics on one die can bring powerful capabilities, including reduced system power consumption and improved volume-to-area ratio to automotive, biomedical, RF, photonics, information technology, and other applications.

12/01/2008 — Detecting failure modes in today’s MEMS

Microelectricalmechanical systems (MEMS) are taking a whole new role in our day-to-day life, and are much more widely used than ever before, due to a wide range of benefits including their low mass, fast mechanical response, low power consumption, and potential for lowering end costs.

12/01/2008 — Thinking outside the chip: MEMS-based systems solutions

In the September/October issue of Small Times (p.32) I introduced a “MEMS Commercialization Report Card” which addressed 14 barriers needed to be overcome to realize a successful commercialization process for MEMS.

01/01/2008 — Small World

By Marcy KoffMEMS makers disagree—and agreeSmall Times’ online report of Tronics Microsystems’ fifth-consecutive-quarter net profit announcement drew a response from competitor Micralyne Inc.Tronics’ claim is wrong, says Micra-lyne CEO Chris Lumb, explaining that “it is not the first pure-play contract manufacturer of advanced MEMS devices to achieve[...]

01/01/2008 — MEMS metrology grows in importance—and complexity

Just as MEMS developers are waking up to the fact that metrology tools can add value to development and fabrication of MEMS devices, tool suppliers are facing the challenges—and opportunities—of serving an increasingly complex market.

01/01/2008 — The state of standards: MEMS

A survey of MEMS industry players reveals points of agreement and divergence on the ever-controversial topic of production standards.

05/01/2007 — Meeting production pressures

Are today’s test-and-measurement tools up to the demands of high-volume small-tech manufacturing?

01/01/2007 — Weight, not height, driving VC dollars

Disappointing. That sums up my opinion of the venture capital numbers for the first three quarters of 2006.

01/01/2007 — MEMS the word in consumer electronics

MEMS components have been in projectors since 1996 and in TVs since 2002, but the cell phone market is the latest, greatest frontier

01/01/2007 — Mainstream MEMS: monolithic or hybrid?

A recent spate of spectacular MEMS product developments aimed at large mainstream applications has kindled debate about MEMS’ suitability for high-volume CMOS manufacturing.

01/01/2007 — Stem cell sorting gets mega boost from micro technology

When research scientist Bruce E. Torbett is isolating stem cells from blood in his laboratory at The Scripps Research Institute’s Department of Molecular and Experimental Medicine, he relies on a hefty device that costs about $30,000.

07/01/2007 — MEMS insect to flutter into enemy camps

We’ve come a long way since Maxwell Smart, a fictional character in the 1965-1970 NBC/CBS spy spoof series, Get Smart, used a pencil listening device and other assorted gadgets to help him spy on the bad guys.

07/01/2007 — Semi suppliers court MEMS, PV, emerging markets

Despite the relative health of a semiconductor equipment sector that topped $40 billion in 2006, market maturation and consolidation have driven many companies to seek new outlets for their products and technologies.

07/01/2007 — MEMS infrastructure advancements drive services shift

Improvements in the assortment and depth of MEMS manufacturing services is propelling a business-model shift.

11/01/2007 — Nanobots compete in ‘nanoleague’ soccer

They’re neither David Beckham nor Pelé, and they are not playing Major League Soccer.

11/01/2007 — A revolution in information gathering

One of the hottest topics in microelectronics today is microsystems in which low-power electronics and wireless interfaces are being merged with sensors to form networks of miniature information-gathering devices.

11/01/2007 — IC-industry model enables more powerful RFID

As logistical supply-chain management increasingly helps determine success for both commercial and military objectives, the application of MEMS sensors and circuit integration with radio frequency identification (RFID) technology is becoming crucially competitive.

11/01/2007 — Effective monitoring for congestive heart failure

Congestive heart failure (CHF) is an epidemic, affecting more than five million U.S. patients and contributing to 300,000 deaths annually.

11/01/2007 — MEMS, MCU, and RF integrate for better tire-pressure monitoring

Freescale ( has combined advanced MEMS technology with a microcontroller and RF transmitter to create a versatile, system-in-package (SiP) tire pressure monitoring system (TPMS) that differs from most others.

03/01/2008 — Hermans leads accelerated MEMS development at IMEC

There’s much more going on at the Belgian research center IMEC than the relentless pursuit of Moore’s Law and semiconductor process technology scaling.

03/01/2008 — Fab+Lab

Equipment, software, and services news for small-tech developers

03/01/2008 — R+D UPDATE

News in small-tech research and development

03/01/2008 — More than IP: Tech transfer for micro/nano commercial success

Micro and nano tech transfer aims ultimately to result in product or process commercialization.

03/01/2008 — Small World

A snapshot of small-tech, including a MEMS milestone projection

03/01/2008 — A slow road to big impact: small tech in medicine

Strict regulations and costly ramp up are delaying efforts to bring nano- and MEMS-based medical application to commercial reality.

09/01/2007 — Still limitless after all these years

When I started with Small Times five-and-a-half years ago, the potential for MEMS and nanotechnology seemed limitless.

09/01/2007 — Packaging edges into the spotlight

At last, the importance of MEMS packaging and interconnection has gained recognition.

07/01/2007 — Simulation software speeds microfluidics development

Physical testing will tell you whether your MEMS or NEMS design works-but only after a time-consuming process of prototype creation.

07/01/2007 — State Rankings Part Six: The all-category summary

In this summation of the category-specific state rankings that Small Times has produced over the past several issues, we reveal the ultimate all-category standings of U.S. states that lead the nation in small tech.

09/01/2007 — Dear reader,

Life is all about balancing. While we weigh the potential risks of using nanomaterials in long-lasting, super-efficient batteries for cars and electronics, for instance, we are dumping alkaline batteries into landfills, generating nuclear waste, and filling the air with toxic emissions.

01/12/2011 — Nano particles lessen cancer drug side effects

Researchers at MIT and Brigham and Women’s Hospital have shown that they can deliver the cancer drug cisplatin much more effectively and safely in a form that has been encapsulated in a nanoparticle, targeted to prostate tumor cells and activated once it reaches its target. The results from lab cells were confirmed in mice.

01/13/2011 — New MEMS manufacturing approaches

MEMS and sensors analysis. Source: YoleYole Développement released details of its upcoming report, MEMS Manufacturing & Packaging. This report analyzes the main MEMS manufacturing evolution. MEMS drivers include size, cost, and performance, though in different ways than ICs. New MEMS manufacturing and packaging technologies and specific materials are necessary.

01/01/2011 — Wafer level packaging of image sensors

Wafer-level packages that use a glass cover over the package cavity and through-silicon vias to interconnect the die bond pads satisfy the packaging requirements for CMOS image sensors: compact, reliable, low cost, and accommodate both front- and back-illuminated image sensors with no external changes. Giles Humpston, Tessera Inc., San Jose, California, USA

01/24/2011 — 3D MEMS profiler from E M Optomechanical

E M Optomechanical Inc. (EMOpto) developed a new low-cost version of its OPTOPro line of 3D MEMS Optical Profilers for use in testing and characterizing MEMS devices. The OPTOPro Model 622-Xe enables capital equipment purchase at less than $20K.

01/04/2011 — LumaSense buys microbolometer maker for thermal imaging

LumaSense, a global provider of temperature and gas sensing solutions, acquired Buellton, CA-based InfraredVision Technology Corp. (ITC) from L-3 Communications. Financial terms of the acquisition were not disclosed.

01/05/2011 — LG Electronics chooses InvenSense MEMS gyroscope for 3D TV controller

InvenSense Inc., provider of MotionProcessors for consumer electronics, announced that LG Electronics (LG) has selected the IXZ-500 dual-axis MEMS gyroscope for the Magic Motion Remote Control within their ultra-slim INFINIA line of LED-backlight LCD 3D TVs.

01/05/2011 — Hillcrest sets sights on MEMS in TV remotes at CES

Hillcrest Labs announced a low-cost, embedded motion-control system for TV manufacturers. The new turnkey solution is designed to support new motion pointing and gesture-enabled user interfaces for navigating the Web, Internet-based applications, and games on televisions.

01/07/2011 — MEMS enable rapid viscosity measurements in RheoSense viscometer

µVISC (micro VISC), the newest viscometer utilizing VROC technologyRheoSense Inc. released µVISC (micro VISC), the newest viscometer utilizing VROC technology. VROC (Viscometer-Rheometer-On-a-Chip) is a MEMS microfluidic chip-based viscometry technology.

01/12/2011 — DiCon MEMS optical switch a success in Boeing aircraft test

DiCon Fiberoptics announced that its MEMS fiber-optic switching system was a successful participant in Boeing's first test flight of the new P-8A Poseidon aircraft.

01/12/2011 — Boeing Northrop Grumman inertial reference units satellites

Northrop Grumman Corporation (NYSE:NOC) announced that its Scalable Space Inertial Reference Unit (Scalable SIRU) has been selected as the inertial reference unit of choice for Boeing Space and Intelligence Systems satellite platforms.

01/13/2011 — Fraunhofer IMS orders Tegal equipment for MEMS fab

Tegal Corporation (NASDAQ:TGAL) received an order from the Fraunhofer Institute for Microelectronic Circuits and Systems in Duisburg, Germany for a Tegal 200 SE DRIE system equipped with the new Tegal ProNova2 reactor.

01/17/2011 — OMRON adds MEMS flow sensors for fuel cell systems

Omron's new D6F-70. A 70L/min MEMS flow sensor optimized for fuel cell systems. (Photo: Business Wire)OMRON Corporation (TOKYO:6645)(ADR:OMRNY) will release the D6F-70, a 70L/min MEMS flow sensor optimized for measuring the gas flow rate of fuel cell systems. Omron also plans to release in FY2011 a similar MEMS flow sensor capable of measuring up to 200L/min.

01/19/2011 — UMC produces MEMS sensor products

United Microelectronics Corporation (NYSE:UMC) (TWSE:2303), a semiconductor foundry, said today that it has produced customer micro electromechanical systems (MEMS) sensor products and volume production is scheduled to start this year.

01/19/2011 — MEMS highlight of upcoming Sensors Expo & Conference

Micro electromechanical systems (MEMS) will be a key technology featured in the educational sessions and throughout the Expo Hall during the 2011 Sensors Expo & Conference taking place June 6-8 in Rosemont, IL.

01/20/2011 — STMicro Bluechiip manufacture MEMS tags for biobank apps

STMicroelectronics (NYSE: STM) and Bluechiip Limited, an early-stage company that has developed a tracking solution, will cooperate in the manufacturing of MEMS-based tracking tags, aimed initially at healthcare applications, such as biobanks.

01/24/2011 — Rambus adds Imagine Designs portfolio MEMS and LCD tech

Rambus Inc. (NASDAQ: RMBS) acquired the lighting and display portfolio of patents and technology from privately held Imagine Designs Inc. The patented innovations include technology for general lighting, LCD backlighting, and MEMS displays.

01/25/2011 — Discera ships MEMS oscillators with femtosecond jitter

Discera Inc. debuted high-performance MEMS oscillators for networking, server, storage, and video applications. The DSC11XX silicon oscillators are available at accuracies up to 10ppm, and temperature ranges up to 125°C.

12/04/2010 — SUSS-Rolith-developing-nanolithography-for-next-gen-solar

SUSS MicroTec entered into a joint development and exclusive license agreement with Rolith Inc. to develop and build nanostructuring equipment using a nanolithography method developed by Rolith.

11/01/2010 — GigOptix-ramps-Thin-Film-Polymer-on-Silicon-optical-modulator-chip-fab-at-MEMS-foundry

GigOptix (GGOX) named Innovative Micro Technology (IMT) as its optical chip fabrication partner. GGOX is now in the process of transferring production of its Thin Film Polymer on Silicon  (TFPS) optical modulator chips to IMT in expectation of volume production ramping in 2011.

12/01/2010 — Wafer-level microlens molding process from EV Group pushes CMOS image sensor roadmap by eliminating glass substrates

EV Group (EVG) developed a micro-lens molding process that can enable volume production of very-high-resolution (up to 8MP and higher) wafer-level optics for use in smart phones, pico projectors and myriad other applications.

12/02/2010 — Tegal-expands-ProNova-ICP-silicon-DRIE-reactor-family

Tegal Corporation (Nasdaq: TGAL) is launching a new member of its ProNova family of high-density inductively coupled plasma (ICP) reactors for the company’s DRIE series wafer processing products. The ProNova2 is targeted for fast-growing 200mm MEMS and 3D IC applications.

12/07/2010 — IEDM: IMEC, Panasonic tip record MEMS resonator

At this week's IEDM, IMEC and Panasonic reveal a new MEMS resonator with the industry's highest-recorded quality factor, thanks to two key process and manufacturing steps.

12/17/2010 — IEDM observations: Getting back to the mechanical in MEMS

MEMS at IEDMTechcet's Michael A. Fury reports in-depth from sessions at IEDM 2010, looking at paper 18.3, "Prospects for MEM Logic Switch Technology," on a reverse trend from electronic switching back to mechanical switching in the form of MEMS devices.

12/28/2010 — MEMS packaging conference planned for 2011

The University of Michigan College of Engineering will present Packaging for MEMS March 31 to April 1, 2011, in Boston, MA. MEMS packaging is a significant part of product cost. This program highlights what to consider in developing application-specific packaging that will meet your goals for product performance, durability, and total cost.

12/01/2010 — SiTime-brings-MEMS-to-resonator-market

SiTime Corporation, MEMS-based silicon timing product maker, introduced the SiT1052, a MEMS resonator for real-time clock and time-keeping applications. The all-silicon SiT1052 can be integrated inside a plastic package.

12/03/2010 — Brewer-Science-expands-in-Asia

Brewer Science opened new offices in Tokyo and Seoul. The company also operates offices in Taipei, Shanghai, and Hong Kong. The expanded Asian presence will serve the semiconductor, MEMS, and LED industries.

12/07/2010 — Deformable-MEMS-mirrors-aim-of-Boston-Micromachines-collab-with-Bridger-Photonics

Boston Micromachines Corporation (BMC) has signed a consulting agreement with Bridger Photonics to quantitatively assess a new MEMS membrane deformable mirror design using Boston Micromachines' facilities.

12/08/2010 — CNT-based-nanoelectromechanical-systems-NEMS-see-reliability-boost-at-Northwestern

CNTs are attractive building blocks for next-generation NEMS devices, including high-performance sensors, logic devices, and memory elements. Researchers at Northwestern University, the Center for Integrated Nanotechnologies at Sandia and Los Alamos National Laboratories, and Binghamton University have found a way to dramatically improve the reliability of CNT-based NEMS.

12/09/2010 — MEMS-packaging-facility-lands-Canadian-grant

The MiQro Innovation Collaborative Centre (MICC; Bromont, QC, Canada) will receive a $14.1 million grant as part of the Canadian government's Centres of Excellence for Commercialization and Research (CECR) program. The grant will be used for 200mm MEMS and WLP research.

12/14/2010 — PCB-Piezotronics-begins-MEMS-production-taps-Plasma-Therm

PCB Piezotronics expanded their sensor product line to include several MEMS devices using silicon-based technology. Development and production of these sensors used a Plasma-Therm VERSALINE DSE system for several critical deep silicon etching fabrication steps. 

12/14/2010 — Silicon Biosystems forms U.S. subsidiary to commercialize lab-on-chip

Silicon Biosystems formed a U.S. subsidiary operation, Silicon Biosystems, Inc., to be headquartered in San Diego, CA. The newly formed business will focus on commercial operations and the development of the North American research and clinical diagnostics markets for the company’s DEPArray technology platform.

12/16/2010 — Syndiant-expands-into-Hong-Kong

Syndiant, maker of high-resolution microdisplays for pico projectors, is expanding its global reach to include offices in the Hong Kong Science and Technology Park.

12/21/2010 — A-STAR-GLOBALFOUNDRIES-collab-on-MEMS-capacitive-sensor-tech

The Institute of Microelectronics (IME), a research institute of A*STAR in Singapore, and GLOBALFOUNDRIES are joining forces to develop MEMS Capacitive Sensor Platform Technology for power-efficient and highly sensitive motion sensing applications that are relevant to consumer electronics, automotive and aerospace industries.

12/21/2010 — Fabless-Multigig-raises-$10m-in-Series-C-Zarlink-leads

Zarlink Semiconductor has invested US$5 million as part of a US$10 million Series C financing in Multigig, a fabless semiconductor company that provides advanced clock generation and timing products for the wired and wireless communications markets.

12/22/2010 — Teledyne Technologies acquires DALSA in bid to expand markets

Teledyne Technologies and DALSA announced that they have entered into a definitive agreement that provides for the acquisition of DALSA by a wholly-owned subsidiary of Teledyne. Teledyne will acquire all of the outstanding common shares of DALSA for CAD $18.25 per share payable in cash.

12/27/2010 — Knowles-MEMS-microphones-infringe-Analog-Devices-patent

Analog Devices Inc . (NYSE: ADI) announced that the U.S. International Trade Commission ruled decisively in favor of Analog Devices in its lawsuit against Knowles Electronics. Administrative Law Judge Robert K. Rogers, Jr. concluded that Knowles infringes valid claims from one of ADI's Wafer Anti-Stiction Application (WASA) patents.

12/29/2010 — Fraunhofer-adds-SPTS-etch-system-to-MEMS-line

SPP Process Technology Systems (SPTS), a supplier of advanced capital equipment and process technologies for the global semiconductor industry and related markets, has shipped an APS etch system to Fraunhofer ISIT (FhG-ISIT).

01/20/2011 — NCKU Center for Micro Nano Science and Technology moves

The Center for Micro/Nano Science and Technology at National Cheng Kung University (NCKU), Tainan, Taiwan, has moved from Building of Science and Technology, Tzu-Chiang Campus, to the Building for Instrumentation Equipments, which occupies more than 600 square meters and includes cleanrooms and laboratories.

02/18/2011 — Smart catheter funded for commercialization at NCSU

A North Carolina State University endowment fund established to bridge pure research and product commercialization for entrepreneurs has awarded a $10k grant to a biomedical engineering project that will use MEMS to make catheters flexible, then stiff, for stent delivery.

02/04/2011 — MEMS adoption growing for tablet PCs iSuppli

MEMS IHS iSuppli researchApple's iPad and the Android-based tablets, along with other media tablets, make up the fastest growing MEMS sector in the consumer electronics and mobile segments, says IHS iSuppi research. MEMS sales for tablet use is predicted to increase nearly 400% YOY. Cell phones remain the largest sector for MEMS adoption, however.

02/08/2011 — Bruker lab on chip IDs toxins in the field

Bruker's compact, fully automated and fast toxin identification system, pTD, or portable Toxin Detector, is intended for smaller, field, and mobile laboratories for use by non-expert operators in homeland security applications.

02/16/2011 — NPL focuses on characterization of MEMS energy harvesting devices

The realization of self-powered microsystems for medical implants, drug delivery, remote monitoring, or safety-driven applications forms the basis behind a new project being run at the UK's NPL by the Functional Materials Group.

02/18/2011 — Seaweed microsponges combine with microfluidics to diagnose disease

Combining biological sponges with nanotechnology and semiconductors enables Rice University researchers to develop a diagnostic system for various diseases.

02/22/2011 — Motion sensors market: Device types, business models, and technology growth

Market evolution for motion sensors. Source: YoleAccelerometers, gyroscopes, compasses, and sensor combos are proliferating, to reach $2.56B in 2015, says Yole. Competition exists between companies, technologies, business models, and devices, which makes motion sensing a dynamic sector.

01/03/2011 — Car MEMS sensor sales made records in 2010

Driven by the rapid recovery in automotive production and inventory rebuilding among sensor component suppliers, the market for automotive microelectromechanical system (MEMS) sensors will expand to record size in 2010, according to the market research firm iSuppli, now part of IHS Inc. (NYSE: IHS).

01/12/2011 — DiCon MEMS optical switch a success in Boeing aircraft test

DiCon Fiberoptics announced that its MEMS fiber-optic switching system was a successful participant in Boeing's first test flight of the new P-8A Poseidon aircraft.

01/03/2011 — Car MEMS sensor sales made records in 2010

Driven by the rapid recovery in automotive production and inventory rebuilding among sensor component suppliers, the market for automotive microelectromechanical system (MEMS) sensors will expand to record size in 2010, according to the market research firm iSuppli, now part of IHS Inc. (NYSE: IHS).

01/06/2011 — Nanotechnology at CES nanoLambda spectrumsensor inspired by mantis shrimp

nanoLambda Inc., an advanced nano sensor startup, announced at the Consumer Electronics Show (CES 2011) that its spectrumsensor sample is now available to potential customers and development partners for alpha test, with more broad availability expected in H2 2011.

01/07/2011 — MEMS screen metastatic breast cancer cells

Research by engineers and cancer biologists at Virginia Tech (Virginia Polytechnic Institute and State University) indicate that using specific silicon microdevices might provide a new way to screen breast cancer cells' ability to metastasize.

01/26/2011 — MEMS enjoy cell integration China demand

IHS iSuppli MEMS forecastWith the iPhone 4 paving the way, global demand for MEMS devices in cell phones will rise robustly during the coming years, helping the total MEMS market to expand in healthy measure at least through 2014, according to IHS iSuppli. Also pushing growth: BRIC countries and new applications, such as healthcare products.

01/31/2011 — Personalized medicine Imec proposes lab on chip for SNP detection in DNA

Researchers at Imec proposed a portable, lab-on-a-chip system for single nucleotide polymorphism (SNP) detection in DNA at IEDM 2010. Maaike Op de Beeck, program manager Human++, Heterogeneous Integrated Microsystems Department, Imec, provides background on the research.

01/11/2011 — Dual axis MEMS gyroscope Wii gets reverse costing engineering analysis by Research and Markets

Research and Markets added the "Invensense IDG 600/650 MEMS gyro 2-axes Reverse Costing" report to their offering. The report offers reverse costing & engineering process analysis of the Dual-Axis MEMS Gyroscope IDG-600/650 supplied by InvenSense and integrated in Wii motion accessory, including physical analysis, reconstruction of the process flow, and estimates on manufacturing and selling prices.

12/07/2010 — IEDM: IMEC, Panasonic tip record MEMS resonator

At this week's IEDM, IMEC and Panasonic reveal a new MEMS resonator with the industry's highest-recorded quality factor, thanks to two key process and manufacturing steps.

12/22/2010 — Teledyne Technologies acquires DALSA in bid to expand markets

Teledyne Technologies and DALSA announced that they have entered into a definitive agreement that provides for the acquisition of DALSA by a wholly-owned subsidiary of Teledyne. Teledyne will acquire all of the outstanding common shares of DALSA for CAD $18.25 per share payable in cash.

04/21/2010 — MHI ships first 200mm MEMS bonder

Mitsubishi Heavy Industries says it has delivered its first automated room-temperature bonding system for 200mm wafers for production use, to a MEMS manufacturer in Japan.

04/09/2010 — Singapore launches MEMS consortium

A group of eight global companies, supported by local research and government, have formed a consortium to facilitate and grow Singapore's expertise in microelectromechanical systems (MEMS).

06/30/2010 — Nanoporous silicon for diagnostics

Proteomics is important for drug discovery, vaccine development, and drug manufacturing, but prevalent methods require fluorescent labeling and 2D evaluation through electrophoresis or mass spectrometry. Hus Tigli, CEO of Silicon Kinetics, shared an alternative approach that leverages nanotechnology at the San Francisco Bay Area IEEE Nanotechnology's Sixth Annual Symposium.

08/12/2002 — Harris & Harris nixes 'Tiny' transformation

Aug. 12, 2002 -- Harris & Harris Group Inc. has decided not to ask shareholders to approve a name change to Tiny Technology Venture Capital Inc.nullThe publicly traded venture capital company that invests in nanotechnology, microsystems and MEMS said in a news release that it had planned to ask[...]

08/12/2002 — IMT secures $5M equity investment

Aug. 12, 2002 -- Innovative Micro Technology (IMT) said securing an equity investment valued at $5 million from a defense firm will help bring its MEMS to market faster. Under the deal, L-3 Communications of New York will receive 935,000 shared of IMT common stock, which represents about 17[...]

08/19/2002 — SensoNor reports net loss for quarter

Aug. 19, 2002 -- SensoNor ASA, a Norwegian maker of MEMS sensors, reported a net loss of $3.9 million during the second quarter, compared with a $4.1 million loss for the same period last year. Operating revenue was $852,000 during the most recent quarter, compared with $2[...]

08/28/2002 — MEMS market gets second opinion

Aug. 28, 2002 -- A new report predicts the MEMS market will grow to $11 billion in 2005, triple its size in 2000. The 100-page, $995 report, by Peripheral Research Corp., sees optical switches, sensors and medical devices as the MEMS industry's biggest growth sectors. Sensors, in particular, will find[...]

08/05/2002 — Dutch C2V wants to keep customers from concept to volume production

When Alcatel Optronics announced the management buyout of its Dutch division, the new company decided on a name that describes what it does: C2V – "Concept to Volume." The company uses a process it calls Seamless Microsystem Engineering, which incorporates MEMS design for manufacturing, packaging and assembly.

08/19/2002 — NanoInk writes its own ticket using quills on the nanoscale

NanoInk, a mere seven months old, has released its first product: a software-and-supplies package that turns any atomic force microscope into a Dip-Pen Nanolithography machine that's targeted to research labs. Now comes the hard part – making a bunch of AFM pen tips work in an array large enough for manufacturing. The company promises an array product by early 2003.

09/03/2002 — Micralyne links with MicroCHIPS

Micralyne Inc. and MicroCHIPS Inc. said they have formed a partnership to make MicroCHIPS' drug-releasing, implantable MEMS chips.

09/05/2002 — New technology to seal MEMS could speed integration with chips

MEMS devices need to be tightly sealed against contaminants. Yet packaging MEMS remains an expensive final step. For complex devices, packaging can run as high as 80 percent of the cost. Ziptronix Inc. hopes to seal its own success with a simple, low-cost process for hermetically encapsulating entire MEMS wafers inside a foundry's clean rooms.

08/01/2002 — MEMSCAP to buy JDSU's MEMS unit

Aug. 1, 2002 -- MEMSCAP Inc. said it plans to acquire JDS Uniphase Corp.'s MEMS business unit in a stock deal worth at least $10 million. France-based MEMSCAP, which offers MEMS products and services for telecommunications, biotechnology and other sectors, said it will issue 10.5 million shares to[...]

08/02/2002 — What a difference two years makes:MEMSCAP to buy former Cronos for $10M

France-based MEMSCAP said Thursday it will buy JDS Uniphase's MEMS Business Unit in a stock deal valued at about $10 million - the very same unit JDSU acquired in 2000 for stock worth $750 million. At least half of the unit's 80 employees are expected to get pink slips, as machinery is moved from North Carolina to Bernin, France.

08/07/2002 — Omron develops next-generation MEMS switch

Aug. 7, 2002 -- Omron Corp. said it has developed a MEMS-based relay capable of switching high-frequency signals that it hopes will promote the spread of high-speed, wireless communication. The MMR, or micromachined relay, uses tiny mechanical contacts and switching that minimizes power loss. It also is designed to be[...]

08/08/2002 — LightConnect launches more MEMS

Aug. 8, 2002 -- LightConnect Inc. said it has expanded its line of MEMS-based variable optical attenuators. The Fast Variable Optical Attenuator (FVOA) Series 4000, now shipping in volume, is designed for preventing system damage. It can block the transmission of light when no voltage is applied and reduce the[...]

08/15/2002 — Agere to dump optical business, leaving MEMS in state of limbo

Agere Systems Inc., one of only a few makers of MEMS-based switches, said it would cut 4,000 jobs and either sell off or shut down its optical components business by June 30, 2003. Analysts said Agere’s decision is bleak news for small tech research and development projects within the company.

08/28/2002 — Report: Strong growth seen for wireless MEMS

Revenues for wireless MEMS are expected to grow at a compound annual rate of 37.2 percent to $850 million by 2006, according to a new report from In-Stat/MDR.

08/30/2002 — Wireless MEMS are loud and clear while telecom suffers static

Even the most bullish small tech executive has taken the word "optimistic" out of his PowerPoint on prospects in optical networking. But an emerging side of the otherwise slumping telecom industry leaves room for confidence. Revenues in wireless MEMS are expected to grow from $2.5 million in 2001 to $200 million by 2006, according to a new report.

08/02/2002 — GE unit to acquire MEMS division from TRW

In the second major MEMS deal announced this week, General Electric Co.'s Industrial Systems business said it agreed to acquire MEMS sensor developer NovaSensor Inc. from auto and aerospace provider TRW Inc.

08/01/2002 — SpectRx posts $3.3M loss

Aug. 1, 2002 -- SpectRx Inc., a Norcross, Ga., developer of medical detection, monitoring and treatment devices using MEMS and other technologies, reported a second quarter loss of $3.3 million, or 29 cents per share, compared with $1.4 million for the same period last year. Revenue was $774[...]

10/02/2002 — For Triad, it's not the MEMS, it's the method of making them

Triad Sensors prefers to think of its new MEMS chip as a bargaining chip. The startup has made hundreds of them primarily to pitch its process – a potentially better way to make MEMS. Triad serves a field that has many different production methods, but no set standard. So, it's touting its approach as a way to make many different microdevices in existing foundries.

10/02/2002 — Report: MEMS attractive to semiconductor industry

MEMS can provide a boost to the slumping semiconductor market, according to a new report.

10/15/2002 — Kodak, Kionix make MEMS for imaging R&D

Eastman Kodak Co. has tapped Kionix Inc. to provide MEMS fab services at its new manufacturing plant in New York.

10/22/2002 — QinetiQ launches MEMS prototyping

QinetiQ has launched a new program for MEMS prototyping, according to Semiconductor Business News.

10/29/2002 — Corning launches lens for MEMS

Corning Inc. said it has launched a miniature lens that enables a significant reduction in size for MEMS and other optical parts packaging.

10/01/2002 — MEMS for everyman? Analog gyro puts a new spin on price

It’s been a long time coming, but this week Analog Devices delivered what product engineers have anticipated for years: an affordable self-contained MEMS gyroscope. Analog spent six years developing the product, a gyro that will sell for as little as $10 and lead to a host of new market uses.

10/17/2002 — BEI ships 5 millionth auto MEMS sensors

BEI Technologies Inc. said it has shipped its 5 millionth GyroChip automotive sensor.

10/21/2002 — Pirelli to offer MEMS tire monitors

Italian tiremaker Pirelli Pneumatici will begin offering a MEMS-based tire monitoring system to European consumers by the end of 2002.

10/29/2002 — MEMS give farmers the straight story on productive planting

Workers in most rural areas toiled hard this fall to haul in their summer harvests and get the ground prep done before winter cold freezes the soil. But Cameron Calaway, cool as a cucumber in his button-up shirt and jeans, doesn’t seem stressed at all. Thanks to the Beeline Technologies Differential Global Positioning System installed on his tractor.

10/18/2002 — Michigan State to use Xeotron's microfluidic tool

Xeotron Corp. of Houston and Michigan State University (MSU) said they collaborating on researching microorganisms in the environment using Xeotron's microfluidic technology.

10/03/2002 — IMT, L-3 team up on MEMS for military

Innovative Micro Technology said it has secured a $1.3 million contract with L-3 Communications' Interstate Electronics Corp. (IEC) to make a MEMS-based inertial measurement unit.

10/01/2002 — Samsung sells unit to focus on MEMS, photonics

Samsung Electro-Mechanics Corp. said it plans to sell a unit to focus more on MEMS and other areas, according to EETimes Asia.

10/04/2002 — OMM gets four MEMS patents

OMM Inc. said it has been awarded four U.S. patents for innovations in MEMS photonic switching.

10/08/2002 — Small Times gives readers the latest with new Advantage news service

To our readers:
I'm pleased to announce a new option from Small Times Media for those who need to stay current with small tech's developments but don't have time for the daily searching. Small Tech Advantage is a daily paid news service that collects, analyzes and categorizes stories about nanotechnology, MEMS and microsystems from major news services around the world.
Steve Crosby
VP/Managing Editor

10/14/2002 — Teravicta ties up with Dow-Key on RF MEMS

Teravicta Technologies has signed a deal with Dow-Key Microwave to sell Teravicta's radio frequency (RF) MEMS switches worldwide, according to a news release.

10/16/2002 — Transparent Networks names president, CEO

Transparent Networks has named Harvey Scull its president and chief executive.

10/24/2002 — Supertex launches IC for driving MEMS

Supertex Inc. launched a high-voltage integrated circuit for driving MEMS-based optical networking systems.

08/19/2002 — Pennsylvania uses 'greenhouses' to grow nanotech jobs, startups

In an effort to forge market ties between bioscience and small tech in Pennsylvania, three Life Sciences Greenhouses may absorb the state’s Nanotechnology Institute. Companies that participate would get first crack at new technology from the nanotech center.

08/23/2002 — Team has many obstacles to leap before the Doctor-on-a-Chip is in

Diagnostic tests on patients at or near the site of their care face three major barriers if they're ever to become a reality: continued funding, approval from U.S. and European regulators and eventual "manufacturability." At Brunel University in London, Professor Wamadeva Balachandran's research team expects its Doctor-on-a-Chip to be commercially viable by 2005.

08/13/2002 — MEMS micromirrors reflecting the big picture in home theater

What packs a million microscopic mirrors, each tilting 5,000 times a second, into an area the size of a postage stamp and could turn your den into a miniature multiplex for $2,000? A micromachine that is becoming a formidable factor in the $4 billion digital projector industry. Texas Instruments' micromirror devices powered 64 percent of all home theater projectors sold in the first quarter of 2002.

08/15/2002 — MicroFluidic Systems gets Army grant

Aug. 15, 2002 -- MicroFluidic Systems Inc., a Pleasanton, Calif., developer of automated microfluidic systems for biological assays, has received a $550,000 contract from the U.S. Army's Soldier Biological and Chemical Command in Edgewood, Md., according to a news release. The contract is to develop a microfluidic-based pathogen[...]

09/19/2002 — Standard MEMS files for Chapter 11

Standard MEMS, a Burlington, Mass., MEMS provider, has filed for Chapter 11 bankruptcy protection in Delaware, according to Glenn Fricano, former vice president of engineering and fab operations manager.

09/19/2002 — Standard MEMS tries to reorganize as it files Chapter 11 protection

Burlington, Mass., MEMS outfit Standard MEMS filed to reorganize under Chapter 11 protection in Wilmington, Del., on Monday.

09/23/2002 — GE completes NovaSensor acquisition

GE Industrial Systems, a division of General Electric Co., announced the completion of its acquisition of MEMS sensor developer NovaSensor Inc. from TRW Inc.

09/25/2002 — MEMSIC gets $1.9M in ongoing round

MEMSIC Inc., a North Andover, Mass.-based provider of MEMS sensors, announced it has secured $1.9 million from unnamed investors so far in an ongoing third round of funding, according to Dennis Buchenholz, vice president of sales and marketing.

09/27/2002 — Professor leaves the lab to 'join' the nano market

Scientists have long been frustrated in their hunt to find a good way to join together materials like metal and ceramic, but a team of researchers is getting ready to manufacture a nanoengineered product that might solve the problem. Reactive NanoTechnologies is aiming for a $10 billion to $12 billion slice of the "joining" industry.

08/14/2002 — Rise and decline of Standard MEMS: Was it just 'too much, too early'?

Six months ago, Standard MEMS Inc. was one of five companies voted "most promising" at San Francisco's Semiconductor Venture Fair. Now it is down to 25 employees from its height of 270. One fab is closed and another is idle. Even its Web site's home page is offline. What happened?

08/29/2002 — Palomar unveils MEMS packaging system

Palomar Technologies, a California-based maker of precision assembly equipment, said it has launched an automated MEMS packaging system.

08/20/2002 — DALSA to make MEMS sensors for Motorola

Aug. 20, 2002 -- DALSA Corp. said it's ramping up production of MEMS-based sensors at its Quebec foundry for Motorola Corp.nullThe pressure sensors, which will be used in the automotive, industrial and health care industries, will reach full production by early next year, according to a news release. Motorola[...]

09/24/2002 — MicroStrain launches GLink sensor system

MicroStrain Inc. said it has launched a new product line of wireless triaxial sensors, according to a news release.

09/26/2002 — Smart artillery shells promise a major MEMS device market

The U.S. is spending millions of dollars to develop MEMS-based artillery shells and even more for a MEMS-based guidance unit for everything from shells to smart bombs. The goal is to produce an inertial guidance system small enough to fit in an artillery shell, tough enough to be shot from guns and cheap enough to buy by the hundreds of thousands.

09/03/2002 — Simpler Networks gets grant for MEMS

Canada's National Research Council (NRC) awarded nearly (U.S.) $175,000 to Simpler Networks for a MEMS-based research project, according to a company news release.

09/05/2002 — Transparent Networks, SMI sign foundry pact

Transparent Networks said it has signed a MEMS foundry services deal with Silicon Microstructures Inc.

09/10/2002 — Teravicta aims to turn up volume of its RF MEMS

Teravicta Technologies said it's seeking to ramp up production of its radio-frequency MEMS switches through a partnership with a California-based supplier of magnetic recording heads.

09/17/2002 — OMM taps Israeli distributor

Sept. 17, 2002 - OMM Inc. said it has signed an agreement with Vectronics Ltd. to distribute OMM's MEMS-based products in Israel. OMM said it chose Vectronics because of its 30-year history of selling telecommunications products. OMM also said it sees significant growth potential in the Israeli[...]

09/23/2002 — PHS MEMS to make Microlab's RF switches

Microlab Inc. said PHS MEMS will produce its line of radio frequency (RF) MEMS switches, according to a news release

09/24/2002 — Memories: Nanochip's Knight calls up his history in storage

Even with a recently closed funding round that netted Nanochip Inc. $1.8 million and a $15 million Series C round already under way, Gordon Knight, the MEMS memory developer's newly installed chief executive, admits he has his work cut out. He will have to call upon every day of his 25 years of storage industry experience to be successful.

09/26/2002 — Corning, Movaz sign deal on switches

Corning Inc. and Movaz Networks said they have signed an agreement to boost deployment of MEMS and other optical networking devices.

09/06/2002 — What's small tech worth? Investors use some science, some gut instinct

Think it’s tough to deduce the right price for that stock you might buy? Spare a thought for Alex Wong – it’s his job to deduce the right price for businesses that don’t even exist yet. Wong is a partner at Apax Partners Inc., a venture capital firm that invests in small tech, who decides what a small tech business is worth, often with precious little to show the way.

09/06/2002 — Report: RF MEMS set for blockbuster market

The market for radio frequency (RF) MEMS will exceed $1 billion by 2007, according to a report being released this month, as manufacturers of wireless communication devices incorporate the devices into mobile phones, GPS components and computer networking products.

09/09/2002 — U.S., Taiwan to talk nano and MEMS

Sept. 9, 2002 -- The 26th Joint Conference of ROC-USA and U.S.-Taiwan Business Councils will kick off in Taipei today to allow its participants to discuss business opportunities, according to the China Post. The conference will be held in conjunction with the 19th Modern Engineering & Technology Seminar[...]

09/11/2002 — MEMSCAP launches fab's first MEMS

MEMSCAP Inc. said it has begun shipping samples of photonic switches and variable optical attenuators for metro and access levels of optical networks.

09/25/2002 — MEMGen appoints RF MEMS expert to board

MEMGen Corp. said it has named Elliott Brown to its advisory board to boost the firm's expertise in radio-frequency (RF) MEMS technology.

09/16/2002 — EV Group launches Taiwanese operation

 Sept. 16, 2002 - EV Group, a maker of MEMS and semiconductor wafer processing equipment, said it's setting up shop in Taiwan as part of a new joint venture. EVG-Jointech Corp. will start operations next month. It will serve EV Group's customer base in Taiwan, which includes industrial[...]

09/19/2002 — General Nanotechnology unveils nanotool

General Nanotechnology LLC, a Berkeley, Calif., developer of hardware and software for nanoscale imaging and manipulation, announced the availability of its nanotool V series of cantilevers with diamond tips. The announcement was made at the Integrated Nanosystems 2002 show in Berkeley.

09/03/2002 — Analog: 100 million MEMS served

Analog Devices, the semiconductor giant that helped introduce MEMS technology to the world 15 years ago, said today that it has sold its 100 millionth MEMS device.

09/10/2002 — Michigan will help lead the drive toward small tech, governor says

It may always be Motown. But the region named for its ties to the auto industry offers a lot of potential as the next Microtown, Michigan Gov. John Engler told an audience of small tech leaders Monday. Michigan provides the critical educational, industrial and governmental support to help turn small tech innovations into products, he said.

09/06/2002 — MEMSIC takes on ADI with new accelerometer

MEMSIC Inc., which makes CMOS-based MEMS accelerometers/sensors, is now offering an accelerometer with sensitivity compensation over temperature that is, according to the company, pin-for-pin compatible with Analog Devices' (ADI) 14-lead CERPAK, cutting costs up to 50 percent and shortening lead times

09/11/2002 — Military calling all MEMS as U.S. beats Iraq war drums

With the U.S. military sizing up its battlefield needs for a new confrontation with Iraq, Army procurement directors have sped up a program to mass-manufacture new MEMS-based navigation and guidance systems for missiles and munitions.

12/29/2003 — H&H to sell additional shares

Harris & Harris Group Inc. announced a follow-on offering last week. The company will sell 2 million shares of its common stock at $8 per share.

12/04/2003 — PHS MEMS partners with Agilent on design kit

PHS MEMS, a Grenoble, France-based MEMS designer and manufacturer, has introduced a design kit for Agilent Technologies' Advanced Design System electronic design automation software, according to a news release.

12/23/2003 — Zyvex announces new tool

Zyvex Corp., a Richardson, Texas, developer of nanotechnology tools and devices, announced the release of its, a manipulation and assembly tool that is used with a scanning electron or optical microscope.

10/03/2008 — Michelson Diagnostics diversifies into non-medical markets

October 3, 2008: Michelson Diagnostics Ltd. (MDL) says it is broadening the commercial application of its 'multibeam' optical coherence tomography (OCT) technology into markets outside its core target of cancer diagnosis, such as industrial metrology, product inspection, tissue engineering, and developmental biology.

10/03/2008 — Asylum research appoints ex-MEMS foundry exec

October 3, 2008: Asylum Research, a maker of atomic force and scanning probe microscopy (AFM/SPM) for materials and bioscience applications, has named small-tech veteran Monteith Heaton as EVP of marketing and business development for the company's line of atomic force and scanning probe microscopes (AFM/SPM).

07/08/2008 — Greatbatch and ISSYS announce strategic partnership

July 8, 2008 -- Greatbatch, Inc. and Integrated Sensing Systems, Inc. (ISSYS) have entered into an agreement to collaboratively develop miniature wireless implantable sensing solutions to be commercialized in partnership with OEM medical device manufacturers servicing the cardiac rhythm management (CRM), neurosurgical, neuromodulation, ophthalmology and orthopedic markets.

07/31/2008 — Analyst: Next big MEMS market is cell phones

July 31, 2008 -- A new report from Yole Développement criticizes MEMS-based sensor and actuator firms for not figuring out how tap into what it says is the largest growth opportunity for MEMS devices over the next five years: wireless handsets.

07/01/2008 — Sonion MEMS microphone business to be renamed Pulse

July 1, 2008 -- Pulse, an electronic component and subassembly design and manufacturer, announced that its Sonion division, which manufactures micro-electromechanical systems (MEMS) microphone technology, is now operating under the Pulse name.

10/02/2008 — Ecliptek: New MEMS oscillators provide cost savings, reduce EMI

October 2, 2008: Ecliptek Corp. has expanded its EMO family of MEMS oscillator products to include a new MEMS spread spectrum low EMI output surface mount oscillator.

10/21/2008 — Wolfson introduces high-performing ultracompact MEMS microphones

October 21, 2008: Wolfson Microelectronics has launched the first devices in its new family of silicon microphones due for release over the next 12 months.

10/28/2008 — Sorenson Legacy Foundation gives $15M to U. of Utah

October 28, 2008: The University of Utah has announced that the Sorenson Legacy Foundation has made the lead donation of $15 million to begin constructing a 193,000-sq. ft. biomedical and neurosciences building designed to help create and develop the next wave of health sciences technology.

10/21/2008 — Micralyne named one of Alberta's Top 40 employers

October 21, 2008: Independent MEMS foundry Micralyne Inc. has been named one of Alberta's Top 40 Employers for 2009 by Mediacorp Canada, for the third year in a row.

10/06/2008 — EV Group receives orders from leading European universities for MEMS R&D

October 6, 2008: EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that three European universities have placed orders for multiple EVG systems worth >$2.9M.

07/29/2008 — Draper Laboratory establishes BioMEMs and MCM centers in Tampa Bay

July 29, 2008 -- The Charles Stark Draper Laboratory, a non-profit, research and development lab, is establishing a BioMEMS R&D Center at the University of South Florida in Tampa, and a Multi Chip Module (MCM) Center in St. Petersburg.

07/28/2008 — Acutronics releases AC217 two-axis motion table for MEMS industry

July 28, 2008 -- Acutronics USA has released its AC217 two-axis motion table, a new product aimed at providing manufacturers of inertial MEMS devices and inertial MEMS-based products a cost effective solution for product testing.

07/01/2008 — Novomer announces clean-burning binder for advanced industrial applications

July 1, 2008 -- Novomer Inc., a renewable plastics, polymers and chemicals company, has made its first product commercially available. NB-180 is a poly (propylene carbonate) (PPC) sacrificial binder that burns cleaner, more uniformly and at lower temperatures than currently available products.

07/23/2008 — APM and UMC partner for MEMS wafer fab

July 23, 2008 -- Asia Pacific Microsystems Inc. (APM) has reached an alliance agreement with semiconductor foundry UMC for 8-inch MEMS wafer fab capacity.

08/06/2008 — MEMS: On the Defensive

MEMS technology is gaining popularity in security and defense applications, but selling technology to the military takes commitment, flexibility and the ability to ramp-up production before you make the sale.

08/09/2008 — IntelliSense ships new version of IntelliSuite, introduces Clean Room

August 8, 2008: IntelliSense, a supplier of design and development solutions for the MEMS industry, has released a new version of its MEMS software, IntelliSuite v8.5, which includes upgrades to almost every module of IntelliSuite and introduces several new features.

08/27/2008 — SUSS MicroTec uncrates wafer bonders for advanced MEMS

August 27, 2008: SUSS MicroTec, a supplier of process and test solutions for the semiconductor industry, announced the CB Series semi- and fully automated wafer bonders, for advanced MEMS devices used in automotive and consumer applications.

08/29/2008 — Virtus launches MEMS motion sensing devices

August 29, 2008: Virtus Advanced Sensors, a developer of multi-axis inertial sensor technology, has introduced its first sensor product, an analog 3-axis accelerometer for low-cost consumer electronics applications. Its affiliated company, applications developer Virtus Asia Ltd., has developed two products utilizing this technology, including a wireless motion sensing mote kit and multi-sensing data recorder.

08/04/2008 — Crossbow develops new OEM AHC for aviation

August 4, 2008 -- Crossbow Technology, Inc., a developer of stand-alone Federal Aviation Administration (FAA) Certified MEMS attitude heading reference systems (AHRS), announced a new OEM single-card AHC525 attitude heading reference.

08/25/2008 — MEMS-based asthma monitor offers low-cost solution for developing countries

August 25, 2008: An inexpensive web-enabled MEMS-based device for measuring lung function in patients with asthma and other disorders is being developed by researchers at Texas Instruments in Bangalore, India, and co-workers.

08/14/2008 — Yole predicts MEMS switch and varicaps market to reach $700 million by 2012

August 11, 2008 -- Yole Developpement released a report stating that the MEMS switch and varicaps markets will reach $700 million in sales by 2012. Growth is driven by handset applications.

08/14/2008 — Siimpel's MEMS-based camera tech shipping in Motorola's A1600 handset

August 12, 2008 -- Siimpel Corporation, a supplier of optical microsystems solutions, announced that it's SiimpelFocus SF9x MEMS-based silicon camera technology is now shipping in Motorola's recently announced MING A1600 cellular handset, which integrates the industry's first MEMS-based, continuous autofocus camera, enhanced GPS capabilities, and a suite of mobile business applications.

10/28/2008 — Dolomite sees 200% sales growth in microfluidic products

October 28, 2008: Microfluidic pioneer Dolomite is celebrating both the opening of its Japanese office and sales growth of over 200% during the past year.

11/06/2007 — MEMSCAP transducers key for cabin pressure control in Airbus Airlifter

Diehl Aerospace has selected MEMSCAP to supply its MEMS technology for the Airbus Military A400M Airlifter. MEMSCAP will supply its Digital Pressure Transducers -- a key element of the Doors Control and Monitoring System (DCMS) developed by Diehl onboard the A400M military transport aircraft.

11/01/2007 — Boston Micromachines to develop MEMS-based ophthalmoscope

Boston Micromachines Corp., a provider of MEMS-based deformable mirror products for adaptive optics systems, has been awarded a $750,000 Phase II Small Business Innovation Research Grant from the National Eye Institute of the National Institutes of Health.

11/19/2007 — RF Micro Devices introduces MEMS for 3G phones

RF Micro Devices, designer and manufacturer of high-performance radio frequency systems, has introduced RF MEMS transmit/receive switch and mode switch for 3G (third generation) mobile phone handsets.

11/08/2007 — TI's new stereo codecs offer digital microphone support for portable consumer devices

Texas Instruments Inc. (TI) has introduced three new audio codecs featuring low power consumption and noise filtering capabilities to maximize battery life and enhance performance in portable consumer applications such as wireless handsets. According to TI, these are the industry's first I2S codecs capable of interfacing directly to digital or analog microphones.

11/19/2007 — MEMS in consumer products: You ain't heard nothin' yet

iPhone, 'Guitar Hero,' Wii, are the early adopters. When price goes down, MEMS will see even bigger growth, says ABI Research

11/16/2007 — Silicon Clocks gets a well-timed $8M from Lux Capital

Silicon Clocks, developer of MEMS-based timers for electronic systems, has announced completion of $8 million in financing.

04/03/2008 — memsstar MEMS tools enter Japanese market under Canon agreement

memsstar Technology, a supplier of etch and deposition equipment supplier to the MEMS industry, has signed a memorandum of understanding with Canon Marketing Japan to market and promote memsstar products to Japanese MEMS manufacturers and developers.

10/01/2008 — STMicroelectronics introduces MEMS accelerometer for automotive applications

October 1, 2008: STMicroelectronics has introduced its first automotive-qualified three-axis MEMS accelerometer, the first of a range of products spearheading a strategy to bring economies of scale from its MEMS consumer business consumer to new automotive MEMS applications.

06/30/2009 — Analyst: MEMS tool market on the rebound

June 30, 2009: MEMS device demand has held steadier than the overall semiconductor market, but the market for equipment to make MEMS devices has struggled like the overall chip tools sector -- but now it's poised to surge ahead of the broader sector, according to an industry analyst.

01/27/2009 — Report: Cell phones drive market for MEMS switches

January 27, 2009: MEMS switches and varicap products are finding their way into commercial products despite the economic downturn, thanks to increased interest from cell phone companies, according to >a report from research group Yole Développement.

04/27/2009 — Analog Devices, Infineon link for next-gen auto airbags

April 27, 2009: Analog Devices Inc. and Infineon Technologies AG aim to align their product roadmaps and ensure sensor/chipset interoperability to advance development of next-generation automotive airbag systems.

02/21/2009 — EPCOS's tiny sensor comes with MEMS packaging

February 20, 2009: EPCOS AG is introducing what the Munich-based company is calling the world's most compact packaged sensors for barometric pressure measurement, and it comes with the firm's chip-sized MEMS packaging.

02/13/2009 — NanoInk intros new desktop nanofabrication system

February 13, 2009: NanoInk has introduced its next-generation Dip Pen Nanolithography system for desktop nanofabrication, the DPN 5000, which it says offers versatile nanopatterning capabilities and AFM imaging to characterize deposited patterns.

02/24/2009 — Seer announces MEMS-based personal navigation system

February 24, 2009: Seer Technology Inc. has announced a new MEMS-based personal navigation system called the NaviSee.

02/04/2009 — Korea develops MEMS telescope/camera

February 3, 2009: Researchers at Korea's Ewha Womans University reportedly have developed a MEMS-based combination telescope and camera that can "instantly track and film events that occur without prior warning.

01/02/2008 — Presens's new MEMS pressure sensor promises extreme accuracy

The Norwegian pressure sensor company Presens AS has launched a new MEMS sensor geared to applications such as calibrators and digital gauges requiring high accuracy and resolution, and low drift.

01/26/2009 — SiTime intros low-power MEMS oscillators

January 26, 2009: SiTime Corp., which develops MEMS-based silicon timing solutions, has introduced a new family of programmable oscillators that are designed to extend battery life in portable and consumer electronics by delivering what the company called the industry's lowest power consumption and fastest start-up time.

01/08/2009 — DALSA launches first phase of new 200mm MEMS line

January 8, 2009: DALSA Semiconductor says it has launched the first phase of a 200mm MEMS manufacturing line at its semiconductor wafer foundry in Bromont, Quebec, Canada, following several new MEMS supply contracts the company has recently received for delivery of product in 2009 and for new product development.

01/29/2009 — CETR releases new nano, micro indenters

January 28, 2009: CETR has released its next-generation Apex nanomechanical test instrument designed for use with thin-films, PVD & CVD coatings, microelectronics, solar cells, MEMS, and other applications.

01/06/2009 — South Bend's legacy of innovation sparks Ignition Park

January 6, 2009: Through an aggressive environmental restoration effort in South Bend, IN, two sites near Notre Dame are set to house Indiana's first two-site State-Certified Technology Park.

01/07/2009 — Toronto physicists squeeze light to quantum limit

January 7, 2009: A team of University of Toronto physicists have demonstrated a new technique to squeeze light to the fundamental quantum limit, a finding that has potential applications for high-precision measurement, next-generation atomic clocks, novel quantum computing and our most fundamental understanding of the universe.

01/08/2009 — FDLI sponsors conference on nanotechnology law, regulation and policy

January 8, 2009: Nanotechnology was incorporated into more than $60 billion in manufactured goods in 2008. By 2014, the market will grow to $2.6 trillion. By 2011, over $15 billion in nano-enabled drugs and therapeutics will be sold--up from more than $3 billion in 2006. And industry experts project that nanotechnology will be incorporated into $20 billion worth of consumer food products by 2010.

08/06/2009 — JC Eloy: What's in store for MEMS

August 6, 2009: Jean Christophe (J.C.) Eloy, president and CEO of Yole Développement, talks with Small Times' Pete Singer at SEMICON West, about the MEMS market and notable trends.

08/25/2009 — Report: MEMS-based system market to generate $13B supply chain revenue in 2012

MEMS-based systems were a $46 billion business in 2008, and despite the recession MEMS-based systems should see 12% annual growth through 2012 to an $83 billion industry, meaning a $13 billion market for MEMS devices and the equipment and materials needed to produce them, according to a report on the MEMS supply chain from SEMI and Yole Développement.

12/18/2009 — CH2M Hill, HP eye progress in infrastructure monitoring

One of the proposed applications for HP's recently announced inertial MEMS sensing technology is bridge monitoring -- a particularly hot topic given the recent fuss over emergency repairs on San Francisco's Bay Bridge. CH2M Hill's Michael O'Halloran tells Small Times what his company thinks of the new technology and where it has the most potential.

12/15/2009 — IEDM 2009: IMEC's piezoelectric energy harvester, plastic transponder circuit

At this year's International Electron Devices Meeting (IEDM), IMEC and partners disclosed their latest work in creating a MEMS-based piezoelectric energy harvesting device with record power generation, and a "world-first" organic transponder circuit with bit rate of 50kbits/s, nearing requirements for Electronic Product Coding (EPC) standards.

01/13/2008 — MIT gas sensor is tiny, quick and energy efficient

Engineers at MIT are developing a tiny sensor that could be used to detect minute quantities of hazardous gases, including toxic industrial chemicals and chemical warfare agents, much more quickly than current devices.

01/30/2008 — Colibrys MEMS sensors certified for railway applications

Swiss MEMS developer Colibrys says its inertial, vibration and tilt sensors have been certified for safety critical railway applications by the CENELEC (European center for electronic and electro-technique normalization).

01/03/2008 — Microvision to unveil MEMS projector for mobile devices at CES

Microvision Inc. will unveil at the Consumer Electronics Show (CES) in Las Vegas next week an advanced prototype of the first handheld, battery-powered, "plug-and-play" projector based on the company's single micro-mirror laser scanning display technology.

01/11/2008 — STMicroelectronics's MEMS sensor in new Air Mouse and Music Remote

Three-axis acceleration sensors made by MEMS device manufacturer STMicroelectronics are enabling motion control in the new Air Mouse and Music Remote from Gyration.

01/22/2008 — Falco's battery-powered high-voltage amplifiers target MEMS

Falco Systems' new WMA-01 and WMA-01LF high-voltage amplifiers are designed for applications such as MEMS devices and PZT (piezo) positioning systems. They support a wide voltage range and can be battery powered.

01/29/2008 — InvenSense claims "world's smallest" dual-axis gyroscope

InvenSense, provider of motion-sensing solutions for portable consumer electronics, has introduced what it calls the world's smallest dual-axis gyroscopes at 4 x 5 x 1.2 mm.

01/04/2008 — Measurement Specialties acquires Intersema

Measurement Specialties Inc., a global designer and manufacturer of MEMS sensors and sensor-based systems, has acquired the Swiss-based pressure sensor maker Intersema Sensoric SA.

01/11/2008 — Technitrol to acquire MEMS maker Sonion

Technitrol Inc. has agreed to acquire the capital stock of Sonion A/S, a producer of microacoustic transducers and micromechanical components for manufacturers of hearing instruments, advanced acoustic devices, medical devices and mobile communication devices in addition to MEMS microphone technology.

01/15/2008 — MEMS maker KWJ Engineeering acquires Eco Sensors

KWJ Engineering Inc., a Newark, Calif., manufacturer of MEMS and nanotechnology based gas sensing instruments., has acquired Eco Sensors Inc. of Santa Fe, N.M.

01/21/2008 — MEMSCAP's Q407 earnings report reveals sustained profitability

MEMSCAP, the France-based provider of MEMS products, has announced its earnings for the fourth quarter ending December 31, 2007.

01/29/2008 — KWJ acquires MEMS developer Eco Sensors

KWJ Engineering Inc. has acquired Eco Sensors Inc.

01/23/2008 — Nanochip raises $14M for high-capacity data storage chips

Nanochip Inc., a developer of advanced MEMS silicon data storage chips, has completed a $14 million financing round that will enable the company to complete development of its first prototypes this year, and begin design verification and sampling in 2009.

01/15/2008 — Freescale establishes 200-mm MEMS line to address sensor demand growth

Freescale's new advanced MEMS 200-mm (8-inch) production line addresses growing demand for sensors in the price-sensitive automotive, industrial, medical and consumer markets.

01/31/2008 — Yole releases latest "Top 30" list of MEMS producers

A new report by market research firm Yole Développement ranks the top MEMS manufacturers of 2007. "Nine companies are above $200 million sales, compared to only four companies two years ago," said Jean Christophe Eloy, Yole's founder.

01/08/2008 — Korean firm selects Qualcomm MEMS display technology

Qualcomm MEMS Technologies Inc., a wholly owned subsidiary of Qualcomm Inc. (Nasdaq: QCOM), has announced that KT Freetel, one of Korea's largest operators and the country's first WCDMA wireless operator, has selected Qualcomm's MEMS-based mirasol display technology for its SHOW WCDMA Monitoring Systems.

01/28/2008 — New book covers MEMS reliability

Research and Markets has announced the availability of a new book, Reliability of MEMS.

08/21/2009 — Bosch buys Akustica, gains MEMS consumer inroads

August 21, 2009: In what seems to be a bid to expand beyond its auto position into an increasingly crowded (and promising) consumer sphere, Robert Bosch's US division is acquiring MEMS microphone maker Akustica.

08/28/2009 — mPhase touts progress for nanobattery polymer coating

August 28, 2009: mPhase Technologies says that work with a MEMS foundry partner has determined that a recently-discovered polymer coating for its Smart NanoBattery "appear[s] to be able to be replicated in a foundry manufacturing environment."

02/09/2007 — Micralyne begins MEMS manufacturing expansion for microfabrication, testing, and assembly

Micralyne's facility renovation will substantially increase its manufacturing capacity to accommodate a growing customer base. The addition includes 10,000 sq ft of new manufacturing space with Class 10 and Class 1000 clean rooms for silicon MEMS fabrication, testing, and assembly.

02/02/2007 — Small Times welcomes new Editor-in-Chief to drive nano & micro coverage

Barbara G. Goode, a veteran chief editor, has been announced as the new Editor-in-Chief of Small Times magazine. Goode will parlay her MEMS and nano expertise to continue Small Times' drive to be the leading global media source for driving the commercialization of micro and nano technologies into the market.

02/12/2007 — Consortium researches healthcare benefits of MEMS microgenerators

Innos, a U.K.-based research and development company for innovations in nanoscale technology, is part of a consortium that has won funding from the Department of Trade and Industry (DTI) to research the medical applications of a MEMs microgenerator.

05/11/2007 — Newly formed Meggitt Sensing Systems invests in MEMS

Meggitt PLC has created its Meggitt Sensing Systems (MSS) division by merging the company's Aerospace Systems and Electronics groups. The new entity includes Endevco and other notable sensor companies.

05/16/2007 — SAES Getters and ST partner on next-gen MEMS gyroscopes

SAES Getters Group and STMicroelectronics have agreed to incorporate SAES' PageWafer technology into ST's multi-axis gyroscopes, with a goal of delivering higher sensitivity and stability for angular-speed measurement.

05/15/2007 — Palomar offers volume microelectronics manufacturing services

Palomar Technologies, known for its automation equipment and process development for microelectronic assembly, now offers microelectronic packaging services through its new division, Palomar Microelectronics.

05/02/2007 — MEMS/nanotech key to patenting of 3G hyperspectral imager

Earth Search Sciences, Inc. has received a patent on its hyperspectral remote sensing instrument, the OmniProbe. Thanks to MEMS and nanotechnology, the OmniProbe promises dramatic advantages over its leading-edge predecessor.

10/31/2007 — Micralyne disputes Tronics' claim as first pure-play MEMS foundry to achieve consistent profitability

Small Times' report of Tronics' recent profit announcement has drawn a response from Chris Lumb, CEO of rival Micralyne Inc. "Tronics' profitability claim . . . is wrong: It is not the first pure play contract manufacturer of advanced MEMS devices to achieve consistent profitability," he noted.

10/09/2007 — Book introduces kids to MEMS and nanotechnology

Bourne Research LLC has published a new science and engineering book aimed at children. "MEMS and Nanotechnology for Kids," written by Marlene Bourne, president and principal analyst of Bourne Research, gives readers a basic overview of MEMS and nanotechnology, describing how they work, where they are found and why they are useful.

03/29/2007 — ViaLogy will base long-range explosives detector on ORNL technology

ViaLogy PLC has completed an agreement for exclusive commercialization rights of dual-beam Reverse Photo- Acoustic Spectrometer (REPAS) technology developed by Oak Ridge National Laboratory. ViaLogy will combine REPAS with its own weak signal processing to enable long-range detection of chemical weapons.

03/16/2007 — Crossbow launches business unit for MEMS-based wireless sensor "Motes"

Crossbow Technology announced the formation a new business unit focused on commercializing the company's MEMS-based wireless technology. The business will be led by former Intel executive Michael Dierks.

03/19/2007 — Virtus establishes subsidiary and key MEMS partnership in Japan

Virtus Advanced Sensors, a US company commercializing MEMS multi-axis inertial sensors, established a subsidiary in Tokyo and signed a collaboration agreement with USC, the largest trading company of Sony Corp. The companies will work together on design-in projects for USC customers in Japan and Asia, while USC makes a direct investment in Virtus.

03/21/2007 — Sensor Platforms' micro interface leverages sensor functionality

Sensor Platforms' new SSP1401 six-channel interface is designed for high-volume applications demanding sensor fusion capability. The chip aims to help product designers save on cost, power consumption, and space; and it supports a wide variety of sensors.

03/27/2007 — Discera raises $17.5 million, expands distribution for MEMS oscillators

Discera Inc. has completed a Series C funding round, and expanded its distribution with the addition of frequency control manufacturer ABRACON, whose channels include some of the top distributors in North America. Discera recently began shipping its first products for direct replacement of quartz crystal oscillators in electronics devices. The company will use its new funding to support increased production, distribution, and marketing.

03/21/2007 — Sensirion's new microfluidic flow sensors feature integration

Sensirion's new microfluidic flow sensors feature integration

11/07/2007 — Sale of FIBRotools MEMS/nano equipment based on flexibility and value, says ECSI

ElectroChemical Systems Inc. (ECSI), manufacturer of IKo Classic electroplating and electroforming tools for MEMS, nanostructures, and HDIs, says that its recent sales of FIBRotools equipment stem from flexibility, ease of use, and value. The company's recent installations include the Indian Institute of Technology in Mumbai, India; the Naval Research Laboratory in Washington, DC; and MIT's Lincoln Laboratory in Lexington, Mass., among others.

09/07/2007 — VTI intros new smart MEMS sensor for automotive

VTI has designed its new automotive digital accelerometer family to support smart sensing, improved reliability, and self-test features. The new digital sensor platform promises a cost effective system for diverse applications.

09/28/2007 — Simbex provides first high-school football helmets with MEMS impact monitors

Football helmets equipped with Analog Devices MEMS accelerometers and data acquisition technology are helping researchers study head trauma in a small Illinois town. When a player's helmet registers a hit, it beams impact data to a laptop computer monitored by the team's athletic trainer. The system is the first to be deployed at a high school.

09/11/2007 — Vashist is SiTime's new CEO

SiTime Corp., designer, manufacturerer, and marketer of MEMS-based silicon resonators, oscillators, and timing solutions, says that its board of directors has appointed Rajesh Vashist as the company's new CEO.

09/10/2007 — Midwest MicroDevices brings commercial MEMS services online

MMD, a commercial MEMS foundry, has announced the availability of silicon wafer fabrication services. The company had been in limited-volume production for the past 12 months and is now accepting emerging and production orders on a broad scale.

09/25/2007 — RedShift, IMT partner to disrupt thermal imaging with MEMS device

RedShift Systems has selected MEMS foundry Innovative Micro Technology (IMT) to produce its Thermal Light Valve (TLV), which allows standard CMOS and CCD digital cameras to "see heat." RedShift says the TLV enables new, affordable devices that will rapidly expand the market for thermal imaging.

10/31/2007 — Systron Donner Automotive aims to make MEMS shopping like new-car shopping

Systron Donner Automotive, developer of automotive inertial measurement products, has launched a new brand image and interactive Web site that, according to the company, makes "selecting a MicroGyro feel more like shopping for a new car."

10/16/2007 — As MEMS "consumerization wave" surges, developers address production challenges

[MEMS] "sensors are revolutionizing the way people use handheld devices," said Benedetto Vigna of STMicroelectronics during the MEMS/MST Industry Forum at last week's Semicon Europa. Small Times' Tom Cheyney reports from the event, explaining current thinking on how MEMS companies can take ride the big wave to consumer-application success.

10/26/2007 — Motorola funds Siimpel to develop MEMS for sophisticated phone features

Motorola Ventures has made an equity investment in Siimpel Corp., a developer and manufacturer of silicon MEMS-based solutions for mobile imaging applications.

10/30/2007 — Qualcomm, Audiovox to bring MEMS direct-view display to market by holiday season

Qualcomm MEMS Technologies Inc., in collaboration with Audiovox Accessories Corp., will bring to market by November 2007 the industry's first direct-view MEMS display. Unlike traditional displays, Qualcomm says this display is readable even in bright sunlight -- and consumes less power.

10/01/2007 — U.S. Digital's new dual-axis absolute inclinometer is MEMS based

U.S. Digital, a Vancouver, Wash., company that makes MEMS-based motion control components, has released a new dual-axis absolute inclinometer.

10/11/2007 — WSJ honors MEMS developer Discera as a technology innovator

Discera Inc., a developer of CMOS MEMS oscillators and resonators, and provider of next-generation timing solutions, is one of four semiconductor companies singled out for the Technology Innovation Awards by The Wall Street Journal.

10/23/2007 — MEMSCAP reports profitability in Q3 2007

MEMS technology provider MEMSCAP has announced its earnings for the third quarter ending September 30.

10/10/2007 — Popularity of MEMS-based products bodes well for MEMSIC IPO

The fact that MEMS are at last making it into mainstream consumer applications was enough to encourage MEMS developer MEMSIC Inc. to file for a $100 million initial public offering. Small Times' Howard Lovy reports.

10/23/2007 — Tronics says its sustained profitability validates pure-play custom MEMS model

Tronics Microsystems says its fiscal quarter that ended September 30 marks its fifth consecutive quarter of net profit, and makes it the first pure-play contract manufacturer of advanced MEMS devices to achieve consistent profitability.

10/11/2007 — Scotland's memsstar Technology intros suite of tools for MEMS R&D, manufacture

memsstar Technology of Edinburgh, Scotland, has completed introduction of a full range of research, development, and production platforms for its SVR and SPD process chambers, which enable dry isotropic etching and surface coating with ultra thin films.

10/15/2007 — Okmetic SOI with gettering properties targets MEMS sensor apps

A new silicon-on-insulator product with built-in gettering properties, Okmetic G-SOI, promises IC-integrated MEMS processes with such benefits as reduced device size, improved yields, streamlined process, and decreased cost.

10/29/2007 — Analog Devices calls latest MEMS tilt sensor the industry's most accurate

The ADIS16209 programmable, dual-mode inclinometer is suited to a variety of industrial applications including surveying equipment, factory machine tools, and satellite antenna stabilization systems, says Analog Devices. The company adds that typically, functionally equivalent sensors are 100 times larger.

10/16/2007 — MEMS nozzle maker ramps up with Alcatel tool

Alcatel Micro Machining Systems, manufacturer of deep reactive ion etch (DRIE) equipment for the MEMS and semiconductor industries, says it has received an order for its new AMS 4200 DRIE multi-chamber production tool from Boehringer Ingelheim microParts GmbH, which plans to increase production of MEMS nozzles for its Respimat inhaler.

10/02/2007 — Small tech makes strong showing among last NIST ATP grant winners

About 30% of the 56 projects awarded grants by the National Institute of Standards and Technology's (NIST) 2007 Advanced Technology Program contain a microsystems or nanotechnology element. Small Times Howard Lovy reports.

10/03/2007 — Infineon, Hosiden harmonize on MEMS microphone development

Infineon Technologies AG and Japanese microphone vendor Hosiden are cooperating to develop MEMS microphones.

10/04/2007 — ISSYS gets grant for MEMS, electronics integration

Integrated Sensing Systems Inc. (ISSYS) has received a Phase II Small Business Innovation Research contract from the National Science Foundation. The two-year project, Wafer-Scale, Hermetic Packaging of MEMS-Based Systems," is aimed toward development of a novel packaging method that will greatly simplify the packaging of MEMS and their associated electronics

10/04/2007 — Veratag licenses MEMflake resonator IP to Cornell

Veratag LLC, an Albany, N.Y., company commercializing a security protocol for use in MEMS-based RFID devices, has announced it will license its IP to Cornell Research Foundation Inc.

10/25/2007 — Roy awarded $3.2M to develop MEMS-based artificial kidney

Shuvo Roy and his team at the Cleveland Clinic are using MEMS technology to create an implantable, self-regulating bioartificial kidney that will filter toxins and absorb necessary salts and water like human kidneys.

03/23/2007 — MicroChem's new plating resists enable tall, dense microstructures

MicroChem Corp. introduces two new products that together promise high aspect ratio imaging with vertical sidewalls, enabling the design of tall and dense microplated structures not previously achievable.

03/26/2007 — Quantum Leap's "industry breakthrough" in hermetic packaging targets MEMS

Quantum Leap boasts "industry breakthrough" in hermetic packaging

03/30/2007 — Microchip, Skyworks join Fab Owners Association for best-practices exchange

Fab Owners Association attracts new device-maker members

02/23/2007 — Bosch's new MEMS sensor monitors car batteries

Bosch has begun manufacture of its Electronic Battery Sensor (EBS), which promises to help motorists avoid flat batteries, the most common cause of breakdowns. In 2007, more vehicles equipped with the sensor will go into series production.

02/27/2007 — Discera begins shipping MEMS oscillators

In addition to announcing the shipment of long-anticipated silicon oscillators, Discera Inc. boasts an agreement to help push those MEMS into OEM products. Discera hopes the moves will shake up the $3.5 billion market for quartz crystal oscillators.

11/12/2007 — IMEC's MEMS programs seek life beyond Moore's Law

IMEC has become one of the world's leading R&D centers for advanced semiconductor manufacturing. But there's more to the research group than the relentless pursuit of the Moore's Law CMOS scaling path: MEMS and nanotechnology play an increasingly important role. Small Times' Tom Cheyney reports.

06/11/2008 — Knutti, Allen launch Acuity Inc. for high-performance MEMS pressure sensors

June 11, 2008 -- MEMS industry veterans Jim Knutti and Henry Allen have formed Acuity Inc., which they say will bring to market a line of high-performance, MEMS-based pressure sensors. The new company has a production agreement with MEMS foundry Semefab, where first product wafers are already in process.

06/27/2008 — SVTC Technologies selects SUSS processing tools fors MEMS development

June 27, 2008 -- SUSS MicroTec, Inc., a supplier of process and test solutions for the semiconductor industry, announced that a suite of processing tools, which enable new generations of micro-electromechanical systems (MEMS), has been selected for SVTC Technologies' facility in Austin, Texas.

06/06/2008 — Digital Surf's 4D module tracks evolution of micro, nano, MEMS surfaces

June 6, 2008—Digital Surf, developer of topographical analysis tools for micro and nano-surfaces, has released Mountains Technology version 5. The new software enables metrological analysis of the evolution of a 3D surface, for instance nanotechnology or a MEMS device, in a fourth dimension.

09/06/2008 — Stevens' Shi awarded NSF grant to test MEMS actuator for medical apps

September 5, 2008: Dr. Yong Shi of the Stevens Institute of Technology was recently awarded a NSF grant for his project, a "MEMS umbrella-shaped actuator with active structure for medical applications." The objective of the research is to design, fabricate and test an umbrella-shaped micro-actuator based on an integrated micro/nanofabrication technique for thrombus retrieval in stroke therapy.

06/04/2008 — Toshiba develops cost-reducing MEMS packaging

June 3, 2008 -- Toshiba has optimized for MEMS two packaging technologies that promise significant cost reductions. The company says it will further develop them for practical use.

06/23/2008 — DARPA funds Argonne project to develop MEMs and CMOS-based mobile communication technology

June 23, 2008 -- The U.S. Department of Energy (DOE) Argonne National Laboratory has received $1.4 million in funding from The Defense Advanced Research Projects Agency (DARPA) to a Phase III research project to develop high-performance integrated diamond microelectro-mechanical system (MEMS) and complementary metal-oxide-semiconductors devices (CMOS) for radar and mobile communications using an Argonne-developed Ulananocrystalline Diamond (UNCD) film technology.

06/05/2008 — Micro-sensor tape to track exposure to explosive blasts

Palo Alto Research Center Incorporated (PARC), a Xerox company that develops MEMS and nano-based technologies, has been selected by the U.S. Defense Advanced Research Projects Agency (DARPA) to develop and prototype, all-printed, disposable, blast dosimeters.

06/10/2008 — ST's new MEMS gyroscope targets consumer, industrial

June 10, 2008 -- STMicro-electronics' new LISY300AL is a surfac