11/28/2016 Project developed pilot line for next-generation MEMS devices.
11/22/2016 The SATS market is anticipated to have substantial growth mainly driven by the increasing costs for advanced packaging solutions, according to a report by Persistence Market Research.
11/15/2016 Semiconductor Manufacturing International Corporation and The Institute of Microelectronics of the Chinese Academy of Sciences announced the signing of a cooperation agreement for a MEMS R&D foundry platform to jointly develop MEMS sensor standard processes and build a complete MEMS supply chain.
11/10/2016 MicroVision, Inc. and STMicroelectronics today announced that they plan to work together to develop, sell, and market Laser Beam Scanning (LBS) technology.
11/03/2016 Newly updated report reviews many of the end-use system applications that are presently impacting and that are forecast to help propel the IC market through 2020.
11/03/2016 Today, SEMI announced that WORLD OF IOT, a show-within-a-show at SEMICON Japan 2016, will expand with the addition of 30 new exhibitors.
10/31/2016 UCSB electrical and computer engineers design an infinitesimal computing device.
10/21/2016 Knowles, Goertek and AAC ranked as the top three global suppliers of packaged MEMS microphones for 2015.
10/11/2016 MSIG today announced the shortlist of finalists who will compete for the title of winner at this year's event.
10/07/2016 New research, led by the University of Southampton, has demonstrated that a nanoscale device, called a memristor, could be used to power artificial systems that can mimic the human brain.
10/04/2016 imec and Holst Centre (established by imec and TNO), today announced a new sensor hub integrated as a system-on-chip (SoC) intended for a broad range of wearable health devices and applications.
09/27/2016 SiTime Corporation today introduced an innovative Elite Platform encompassing Super-TCXOs (temperature compensated oscillators) and oscillators.
09/26/2016 MEMS & Sensors Industry Group (MSIG) today announced highlights of its twelfth annual business conference, MEMS & Sensors Executive Congress 2016 in Scottsdale, AZ on November 9-11, 2016.
December 15, 2016 at 1 p.m. ET / Sponsored by Versum Materials
The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.
As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016Sponsored by Master Bond, Inc.,
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,