Packaging and Testing

PACKAGING AND TESTING ARTICLES



STMicroelectronics reveals advanced silicon-carbide power devices

05/16/2016  STMicroelectronics announced advanced high-efficiency power semiconductors for Hybrid and Electric Vehicles (EVs) with a timetable for qualification to the automotive quality standard AEC-Q101.

Latest advancements in sensor technology examined at SEMI European MEMS Summit

04/25/2016  SEMI today announced the second annual edition of the SEMI European MEMS Summit, dedicated to MEMS and sensors, to be held on September 15-16.

Heat and light get larger at the nanoscale

04/01/2016  In a new study recently published in Nature Nanotechnology, researchers from Columbia Engineering, Cornell, and Stanford have demonstrated heat transfer can be made 100 times stronger than has been predicted, simply by bringing two objects extremely close--at nanoscale distances--without touching.

A new virtuous cycle for the MEMS industry

03/24/2016  Since 2000, we have entered the age of sensing and interacting with the wide diffusion of MEMS and sensors that give us a better, safer perception of our environment. MEMS have grown in volume to be almost a 15 billion units market today.

Entrepreneurs to compete in MEMS Shark Tank at Hilton Head 2016

03/24/2016  Teams vie for expert consulting services, MEMS foundry package, specialized software tools, industry group membership.

IoT Planet to co-locate with SEMICON Europa in 2016

03/09/2016  IoT Planet, a new European event dedicated to the Internet of Things (IoT), will co-locate this year with SEMICON Europa (25-27 October) in Grenoble, France.

CyberOptics and Nordson ink a strategic OEM supplier agreement for 3D MRS sensors

03/09/2016  CyberOptics today announced an OEM supplier agreement with Nordson YESTECH to supply its proprietary 3D Multi-Reflection Suppression (MRS) sensors.

Gartner identifies the top 10 Internet of Things technologies for 2017 and 2018

03/03/2016  Gartner, Inc. has highlighted the top 10 Internet of Things (IoT) technologies that should be on every organization's radar through the next two years.

STATS ChipPAC honored with Supplier of the Year Award from Inphi

03/01/2016  STATS ChipPAC Ltd. today announced that it has been honored with the “Supplier of the Year” award from Inphi Corporation.

New NTU microchip shrinks radar cameras to fit into a palm

02/23/2016  NTU's new radar chip was presented and published at the prestigious International Solid-State Circuits Conference (ISSCC) 2016.

Vesper partners with AAC Technologies on piezoelectric MEMS microphones

02/22/2016  Vesper today announced a partnership with AAC Technologies Holdings Inc. for the commercialization of the world’s first piezoelectric MEMS microphones for consumer electronic devices.

imec and iMinds to merge and create high-tech research center

02/22/2016  Nanoelectronics research center, imec, and digital research and incubation center, iMinds, announced that its respective board of directors have approved the intention to merge the research centers.

SEMI launches new integrated packaging assembly and test group

02/10/2016  SEMI announced today the launch of the European Semiconductor integrated Packaging and Test (ESiPAT) Special Interest Group.

Led by iPhone 6S, sensor hubs market is growing fast

01/25/2016  The demand for sensor hubs, dedicated processing elements used for low-power sensor processing tasks, is booming.

Technavio: Top two emerging trends impacting the global MEMS microphone market through 2020

01/22/2016  According to the report, the global MEMS microphone market is expected to reach close to USD 2 billion by 2020, posting a CAGR of over 12%.

Vesper collaborates with GLOBALFOUNDRIES to deliver first piezoelectric MEMS microphones

01/20/2016  Acoustic sensing company works with top foundry to support mass-market consumer products.

SPTS Technologies installs a 300mm MEMS vapor HF etch release solution at CEA-Leti

12/18/2015  SPTS Technologies has supplied CEA-Leti, one of Europe’s largest micro- and nanotechnologies research institutes, with its vapor HF etch release systems for 300mm microelectromechanical systems (MEMS) on CMOS development.

SITRI and Bosch announce IoT technology collaboration

12/02/2015  The agreement covers IoT applications such as smart home, wearable devices, smart city, Industry 4.0 and robotics.

The inertial MEMS device market keeps on growing. What's next?

11/23/2015  Gyroscope and accelerometer production volumes are also growing, with the following CAGR: 7.9% and 1.6% respectively over the same period. Every sector will keep growing. So, what’s next?

Europe’s secondary industry in the spotlight

11/17/2015  The dramatic shift from the trend for increasingly advanced technology to a vast array and volume of application-based devices presents Europe with a huge opportunity.




TWITTER


WEBCASTS



Fan-Out Wafer Level Packaging

May 26, 2016 at 1 PM ET / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
High Mobility Transistors

June 21, 2016 at 1 PM ET / Sponsored by Air Products

Transistor performance has been greatly improved with strained silicon and high-k metal gates. Further performance improvements could be had by implementing III-V materials in the channel of nMOS transistors. Both III-V and Ge-based channels being considered for the pMOS device. High electron-mobility III-V semiconductors have been intensely researched as alternative channel materials for sub-7 nm technology nodes, but one of the main stumbling blocks is how to integrate them monolithically and cost-effectively with traditional CMOS silicon technology. This webcast will discuss the latest efforts in this area, including vertically stacked III-V nanowire.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS