Packaging and Testing

PACKAGING AND TESTING ARTICLES



MEMSIC introduces the world's first monolithic and wafer level packaged 3D-axis accelerometer

08/15/2014  MEMSIC, Inc., a MEMS sensing solution provider, announced today the availability of its MXC400xXC, the world's first monolithic 3D accelerometer, and also the first 3D accelerometer to utilize WLP technology.

SRC, UC Davis explore new materials and device structures to develop next-generation “Race Track Memory” technologies

08/12/2014  University of California, Davis researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, are exploring new materials and device structures to develop next-generation memory technologies.

NJR and UMC extend collaboration on MEMS microphone manufacturing

08/07/2014  New Japan Radio Co., Ltd. and United Microelectronics Corporation, a global semiconductor foundry, today announced that the two companies have successfully collaborated to achieve high-volume manufacturing for NJR's MEMS microphone products.

Materials matter — Enabling the future of IC fabrication and packaging

07/31/2014  The SEMI Strategic Materials Conference, held September 30–October 1 in Santa Clara, Calif., will examine the drivers for new materials and how they impact material suppliers and the value chain they serve.

Solid State Equipment wins 2014 3D InCites Award for WaferEtch TSV Revealer

07/22/2014  Solid State Equipment LLC (SSEC), a provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment.

Imaging without limits: Phones lead growth but innovative applications expanding the market

07/18/2014  To address the rising demands of imaging systems in mobile, medical, automotive and other technology applications, the Imaging Without Limits Conference (7-8 October) will be introduced at SEMICON Europa 2014 this year to address this surging market.

ANSYS and Intel collaborate on reference flow for power, EM and reliability sign-off

06/11/2014  ANSYS, Inc., and Intel Corporation announced the availability of a production-proven reference flow for power, EM and reliability sign-off using ANSYS simulation solutions for Intel's 14nm Tri-Gate process, showcasing it at last week's Design Automation Conference.

Memory design challenges require giga-scale SPICE simulation

05/15/2014  Embedded memory is now consuming most of the area on an SoC chip. Complexity and circuit size are only growing, which means smaller process geometries, larger designs, and tighter design margins.

MEMS microphones broadcast strong growth

04/04/2014  Global revenue for MEMS microphones is forecast to reach $1.04 billion this year, up a robust 24 percent from $836.9 million in 2013.

Eveon and Leti mark milestone in fabrication of smart bolus-type micro-pump for drug delivery

03/13/2014  Eveon and CEA-Leti today announced the demonstration of liquid-pumping for smart drug delivery in the bolus mode using a silicon-based micro-pump fabricated with a standard MEMS process.

Akustica's newest MEMS microphone targets smartphones and wearables

03/11/2014  Akustica, Inc., a Bosch Group company and provider of MEMS microphones, has added four new high-performance analog microphones to its high definition (HD) voice product line, including the AKU346, the industry’'s smallest MEMS microphone to achieve 64dB SNR.

Global failure analysis equipment market to grow at CAGR of 8.8% from 2013 to 2019

03/05/2014  Rapid growth in nanotechnology coupled with growth in medical applications in the Asia Pacific region has fueled the growth of failure analysis equipment market.

Multitest ships fully integrated test cell for pressure sensor application

03/05/2014  Early this year, Multitest shipped the first fully integrated test cell for a pressure sensor application consisting of handling systems, ATE and contactors including the pressure unit.

Samsung and UCSF partner to accelerate new innovations in preventive health technology

02/21/2014  Samsung Electronics Co., Ltd., and the University of California, San Francisco (UCSF) announced a partnership to accelerate validation and commercialization of promising new sensors, algorithms, and digital health technologies for preventive health solutions.

"MEMS and NEMS processing advances" discussed at IEMN, Lille, France workshop on 8th April 2014

02/03/2014  "Nanoscale Processing for NEMS and MEMS" is the topic for the next Oxford Instruments technical workshop, being hosted in conjunction with the Institute of Electronics Micro-electronics and Nanotechnology (IEMN) in Lille, France on 8th April 2014.

Presto and DelfMEMS collaborate to design ultra fast RF MEMS test solution

01/30/2014  Presto Engineering, Inc. and DelfMEMS announced today that they have worked together to design, from specification to integration, the first full PXI-based test system for ultra-fast characterization testing of radio frequency (RF) micro-electro-mechanical-systems (MEMS).

MEMS Industry Group explores the “MEMS-enabled Life” at MEMS Executive Congress Europe 2014

01/28/2014  MEMS Industry Group (MIG) will host its third annual MEMS Executive Congress® Europe, 11 March, 2014 in Munich, Germany.

2014 Outlook: An era of unprecedented change

01/24/2014  We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.

Yole Développement addresses MEMS sensor challenges at January technology seminar

01/09/2014  Yole Développement will host a MEMS & Imaging Technology Seminar in Korea on January 16, 2014.

Oxford Instruments shares expertise with nanotechnology researchers in India

01/07/2014  Oxford Instruments has just completed its second series of successful and well attended seminars in India following its first in Bangalore in 2012.




FINANCIALS



TECHNOLOGY PAPERS



Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Metrology

August 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



SEMICON Taiwan 2014
Taiwan
http://www.semicontaiwan.org/en/
September 03, 2014 - September 05, 2014
Vietnam Semiconductor Strategy Summit
Ho Chi Minh City, Vietnam
http://www.semi.org/en/node/46001
September 16, 2014 - September 17, 2014
APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014