Packaging and Testing

PACKAGING AND TESTING ARTICLES



MEMS microphones broadcast strong growth

04/04/2014  Global revenue for MEMS microphones is forecast to reach $1.04 billion this year, up a robust 24 percent from $836.9 million in 2013.

Eveon and Leti mark milestone in fabrication of smart bolus-type micro-pump for drug delivery

03/13/2014  Eveon and CEA-Leti today announced the demonstration of liquid-pumping for smart drug delivery in the bolus mode using a silicon-based micro-pump fabricated with a standard MEMS process.

Akustica's newest MEMS microphone targets smartphones and wearables

03/11/2014  Akustica, Inc., a Bosch Group company and provider of MEMS microphones, has added four new high-performance analog microphones to its high definition (HD) voice product line, including the AKU346, the industry’'s smallest MEMS microphone to achieve 64dB SNR.

Global failure analysis equipment market to grow at CAGR of 8.8% from 2013 to 2019

03/05/2014  Rapid growth in nanotechnology coupled with growth in medical applications in the Asia Pacific region has fueled the growth of failure analysis equipment market.

Multitest ships fully integrated test cell for pressure sensor application

03/05/2014  Early this year, Multitest shipped the first fully integrated test cell for a pressure sensor application consisting of handling systems, ATE and contactors including the pressure unit.

Samsung and UCSF partner to accelerate new innovations in preventive health technology

02/21/2014  Samsung Electronics Co., Ltd., and the University of California, San Francisco (UCSF) announced a partnership to accelerate validation and commercialization of promising new sensors, algorithms, and digital health technologies for preventive health solutions.

"MEMS and NEMS processing advances" discussed at IEMN, Lille, France workshop on 8th April 2014

02/03/2014  "Nanoscale Processing for NEMS and MEMS" is the topic for the next Oxford Instruments technical workshop, being hosted in conjunction with the Institute of Electronics Micro-electronics and Nanotechnology (IEMN) in Lille, France on 8th April 2014.

Presto and DelfMEMS collaborate to design ultra fast RF MEMS test solution

01/30/2014  Presto Engineering, Inc. and DelfMEMS announced today that they have worked together to design, from specification to integration, the first full PXI-based test system for ultra-fast characterization testing of radio frequency (RF) micro-electro-mechanical-systems (MEMS).

MEMS Industry Group explores the “MEMS-enabled Life” at MEMS Executive Congress Europe 2014

01/28/2014  MEMS Industry Group (MIG) will host its third annual MEMS Executive Congress® Europe, 11 March, 2014 in Munich, Germany.

2014 Outlook: An era of unprecedented change

01/24/2014  We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.

Yole Développement addresses MEMS sensor challenges at January technology seminar

01/09/2014  Yole Développement will host a MEMS & Imaging Technology Seminar in Korea on January 16, 2014.

Oxford Instruments shares expertise with nanotechnology researchers in India

01/07/2014  Oxford Instruments has just completed its second series of successful and well attended seminars in India following its first in Bangalore in 2012.

STMicroelectronics reveals 9-axis movement/position sensor

01/07/2014  STMicroelectronics has revealed its most advanced module for 9-axis movement and position sensing in next-generation mobiles and tiny wearable devices.

SPTS named Supplier of the Year at the Annual MEMS Executive Congress

12/16/2013  SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, was named MEMS Supplier of the Year at the MEMS Executive Congress U.S. 2013 held in Napa last month

STMicroelectronics imaging technology helps visually impaired

12/04/2013  STMicroelectronics announced that its 5.1 mega-pixel camera module and low-power digital image processor are being used in the revolutionary OrCam camera, a small device that clips on to eyeglasses and dramatically improves the mobility and ability of visually-impaired people to "read" signs, packaging and publications.

STMicroelectronics reveals advanced MEMS accelerometers

12/03/2013  Innovative design boosts the sensor's thermal and mechanical stability to deliver robust high performance in ultra space-saving footprint.

Leti announces MEMS research collaboration with OMRON

11/27/2013  CEA-Leti today announced a development agreement that will utilize Leti’s deep MEMS expertise and leading-edge infrastructure with OMRON, a global leader in factory automation and control solutions for the transportation, healthcare and consumer-goods industries.

STMicroelectronics boosts safety, reliability and efficiency of industrial-automation systems

11/21/2013  STMicroelectronics announced that it is launching its new ISO8200B, an innovative isolated power switch that enables smaller, more robust and energy-efficient controllers for industrial automation equipment.

Will MEMS applications be the driver for future growth of thin film PZT?

11/21/2013  In September 2013, EPSON announced its next generation inkjet technology, PrecisionCore, introducing for the first time MEMS inkjet heads manufactured with thin film PZT technology. This announcement has been highly publicized: first, thin film PZT MEMS applications are now on the market, proving the reliability and maturity of this technology. Second, more inkjet head players will soon follow.

Annual MEMS Executive Conference shows why MEMS is growing 2x faster than semiconductors

11/15/2013  MEMS Industry Group (MIG)'s MEMS Executive Congress -- held November 7-8, 2013 in Napa, CA -- showed why the MEMS industry is outpacing the semiconductor industry, in both growth and innovation.




FINANCIALS



TECHNOLOGY PAPERS



Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014