Packaging and Testing

PACKAGING AND TESTING ARTICLES



SEMICON China 2017 opens tomorrow in Shanghai

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

Global MEMS manufacturer selects ULVAC Technologies' plasma ashing system

03/01/2017  ULVAC Technologies, Inc. has been selected by a global MEMS inertial sensor manufacturer to deliver an ULVAC ENVIRO-1Xa advanced plasma ashing system for running critical low-temp descum processes and high-temp bulk photoresist strip processes.

Flemish government increases financial support of imec

02/21/2017  Today, the research and innovation hub in nanoelectronics and digital technology imec, and the Flemish Government announced a new, 5-year strategic commitment that aims at strengthening the pioneering role of Flanders' renowned research hub.

SEMI appoints Ajit Manocha as president and CEO

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

Invensas announces Teledyne DALSA sign DBI technology transfer and license agreement

02/17/2017  Wafer bonding and 3D interconnect technology to enable delivery of next-generation MEMS and image sensor solutions.

Intel announces $7B investment in next-gen semiconductor fab in Arizona

02/09/2017  The announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House.

Qualcomm and TDK announce launch of joint venture

02/03/2017  Qualcomm Incorporated and TDK Corporation today announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd.

Do not go where the path may lead

01/27/2017  What follows, in Part 1 of this two-part article, is a quick look back at the industry in 2016 and the road ahead in 2017 followed by what SEMI achieved in 2016 and where SEMI’s road will lead in 2017 to keep pace our industry charging forward where there is no path.

Executive viewpoints: 2017 outlook

01/25/2017  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.

ams announces completion of transaction to acquire Heptagon

01/25/2017  ams, a worldwide supplier of high-performance sensor and analog solutions, announces the completion of the transaction to acquire 100% of the shares in Heptagon and related capital.

ISS Europe 2017: European innovation leadership

01/24/2017  Electronics manufacturing solutions for Automotive, Smart Manufacturing and Healthcare enabling the future of European technology.

New report from IHS Markit names top four trends driving the IoT in 2017 and beyond

01/24/2017  Fueled by lightning-fast demand for ubiquitous connectivity, the number of connected Internet of Things (IoT) devices globally will jump by 15 percent year-over-year to 20 billion in 2017, according to new analysis from IHS Markit.

Microsemi honored as M2M Network Equipment Technology Company of the Year by IoT Breakthrough Awards

01/06/2017  Microsemi Corporation, a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it was named M2M Network Equipment Technology Company of the Year by the inaugural IoT Breakthrough Awards.

A year in review: Top 10 stories of 2016

12/23/2016  From the ground-breaking research breakthroughs to the shifting supplier landscape, these are the stories the Solid State Technology audience read the most during 2016.

Lab4MEMS project recognized with European Innovation Award

11/28/2016  Project developed pilot line for next-generation MEMS devices.

SATS market driven by increasing demand for high-end packaging solutions

11/22/2016  The SATS market is anticipated to have substantial growth mainly driven by the increasing costs for advanced packaging solutions, according to a report by Persistence Market Research.

SMIC and IMECAS sign an agreement for MEMS R&D and foundry platform

11/15/2016  Semiconductor Manufacturing International Corporation and The Institute of Microelectronics of the Chinese Academy of Sciences announced the signing of a cooperation agreement for a MEMS R&D foundry platform to jointly develop MEMS sensor standard processes and build a complete MEMS supply chain.

MicroVision and STMicroelectronics to co-market MEMS mirror-based laser beam scanning solutions

11/10/2016  MicroVision, Inc. and STMicroelectronics today announced that they plan to work together to develop, sell, and market Laser Beam Scanning (LBS) technology.

Automotive systems forecast to show strongest growth through 2020

11/03/2016  Newly updated report reviews many of the end-use system applications that are presently impacting and that are forecast to help propel the IC market through 2020.

WORLD OF IOT grows with 30 new exhibitors at SEMICON Japan

11/03/2016  Today, SEMI announced that WORLD OF IOT, a show-within-a-show at SEMICON Japan 2016, will expand with the addition of 30 new exhibitors.




TWITTER


WEBCASTS



Semiconductors and the IoT

Tuesday, March 28, 2017 at 1pm ET / Sponsored by Epicor

The rise of Internet of Things (IoT) and the cloud and their associated technologies and platforms are slowly but surely fueling the emergence of new market segments that are shaping and transforming our way of life. Learn how the IoT applications and use-cases that span clients/devices, networks, and data centers are driving new requirements for semiconductors including ultra-low power, ultra-low leakage, smaller and denser packaging, and cost effectiveness. And find out exactly how this IoT trend represents a growth opportunity for the semiconductor industry that has not been seen since the early days of the Internet.

Sponsored By:
Advanced Process Control in Microelectronics Manufacturing: Leveraging Smart Manufacturing and Big Data

Friday, April 7, 2017 at 1pm ET / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017

VIDEOS