Packaging and Testing

PACKAGING AND TESTING ARTICLES



What’s next for MEMS?

12/16/2014  The proliferation of sensors into high volume consumer markets, and into the emerging Internet of Things, is driving the MEMS market to maturity, with a developed ecosystem to ease use and grow applications. But it is also bringing plenty of demands for new technologies, and changes in how companies will compete.

System Plus analyzes the world's smallest microbolometer-based thermal imaging camera core released by FLIR

12/11/2014  Initially focused on the military, uncooled thermal camera sales have grown significantly due to substantial cost reduction of micro bolometers and growing adoption in commercial markets, including thermography, automotive and surveillance applications.

3D TSV begins

12/10/2014  “Engineering samples have already started to ship and preparation is on-going for entering volume manufacturing,” announces Yole.

OCEASOFT harnesses SIGFOX IoT network in Cobalt S3 sensor family for cloud connectivity

12/09/2014  Industrial Internet of Things sensor-monitoring solution opens new vistas in pollution and environmental applications, other remote-sensing sectors.

What to expect from the 3rd Edition of the European 3D TSV Summit

12/04/2014  Interview with SEMI Europe’s Yann Guillou gives attendees a preview of the event.

AXSEM and SIGFOX announce ‘ultra-low-power’ System-on-Chip solution

12/03/2014  AXSEM, a developer of lowest-power radio microcontrollers, and SIGFOX, a developer of cost-effective, energy-efficient Internet of Things connectivity, today announced that AXSEM’s system-on-chip (SoC) with an AX8052 microcontroller has been certified SIGFOX Ready for two-way connectivity.

X-FAB MEMS Foundry wins “Foundry of the Year” Award at MEMS Executive Congress

11/20/2014  X-FAB MEMS Foundry today announced it received the “MEMS Foundry of the Year” award at the Best in MEMS & Sensors Innovation Awards ceremony, as part of the MEMS Industry Group’s 10th annual MEMS Executive Congress held in Scottsdale, Arizona last week.

SCHOTT advances MEMS technology by using HermeS glass wafers with through glass vias

11/19/2014  The international technology group SCHOTT is expanding its HermeS wafers with hermetically sealed, solid through glass vias (TGV) into MEMS applications.

Holst Centre, imec and CARTAMUNDI join forces to create the near field communication chip of the future

11/19/2014  Holst Centre, set up by the Belgian nanoelectronics research center imec and the Dutch research institute TNO, and Cartamundi NV have announced a collaboration to develop ultra-thin flexible near field communication (NFC) tags.

mCube named MEMS Start-Up of the Year at MEMS Executive Congress

11/13/2014  mCube, provider of the world’s smallest MEMS motion sensors, today announced the company secured three awards at last week’s MEMS Executive Congress for its significant innovations in MEMS and sensors

Cavendish Kinetics secures funding to accelerate the growth of the RF MEMS market

11/11/2014  Cavendish Kinetics, the provider of high-performance RF MEMS tuning solutions for mobile and wearable devices, today announced the closing of a $7 million funding round as well as the appointment of Gilles Delfassy to its board of directors.

Sand 9 granted core patent for piezoelectric MEMS microphones

11/10/2014  Sand 9, Inc., a developer of piezoelectric MEMS timing products for wireless and wired applications, today announced that the United States Patent and Trademark Office has granted the company a core patent based on the use of piezoelectric MEMS for a wafer-level, chip-scale packaged microphone.

MEMS Industry Group announces first open-source Algorithm Community

11/06/2014  MEMS Executive Congress -- Karen Lightman, executive director of MEMS Industry Group (MIG), today announced the first open-source algorithm cooperative, Accelerated Innovation Community (AIC), during her opening remarks at MEMS Executive Congress US 2014.

Apple and Samsung drive adoption of next-generation sensors

11/03/2014  Propelled by the race between Apple and Samsung to enhance their mobile products with cutting-edge sensor technology, the market for sensors in cellphones and tablets is set to nearly triple from 2012 through 2018, according to IHS Technology.

MegaChips to acquire SiTime for $200M

10/29/2014  SiTime Corporation, a MEMS and analog semiconductor company, today announced that it has signed a definitive agreement under which MegaChips Corporation, a top 25 fabless semiconductor company based in Japan, will acquire SiTime for $200 million in cash.

IMAPS Award Winners for 2014

10/24/2014  At the IMAPS (International Microelecronics & Packaging Society) meeting last week, several of their key annual awards were given out.

STMicroelectronics tops five billion MEMS sensors shipped

10/23/2014  Beyond gaming systems, smartphones, tablets, navigation systems, and other widely adopted applications, ST’s sensors have also been used in thousands of other useful, fun, and valuable applications.

Finalists announced for MEMS Executive Congress US 2014

10/23/2014  Six companies selected from a pool of applicants will compete in MEMS Industry Group's (MIG)'s MEMS & Sensors Technology Showcase at MEMS Executive Congress.

MEMS Industry Group goes to the 'Shark Tank' for MEMS and sensor-based products

10/20/2014  MIG announces finalists for Elevator Pitch Session at MEMS Executive Congress US 2014.

Wearable sensor market to expand sevenfold in five years

10/16/2014  Driven by rising demand for fitness and health monitoring features as well as by improved user interfaces, shipments of sensors used in wearable electronic devices will rise by a factor of seven from 2013 through 2019




FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Extending Moore's Law

January 2015 (Date and time TBD)

Will IC capability, affordability and diversity continue to grow on a Moore’s Law cadence? Will our ability to make ICs denser and transistors smaller and cheaper slow down any time soon? Intel's Yan Borodovsky will discuss multiple path ahead for the industry to continue Moore’s Law for years to come, from the lithographer's perspective.

Sponsored By:

How the IoT is Driving Semiconductor Technology

January 2015 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
FinFETs

February 2015 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



International Strategy Symposium 2015
Half Moon Bay, CA
http://www.semi.org/en/node/35136
January 11, 2015 - January 14, 2015
European 3D TSV Summit
Grenoble, France
http://www.semi.org/eu/node/8566
January 19, 2015 - January 21, 2015
SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
LithoVision 2015
San Jose, California United States
https://www.nikonprecision.com/lithovision/
February 22, 2015 - February 22, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015