Packaging and Testing

PACKAGING AND TESTING ARTICLES



Solid State Technology announces expanded conference for The ConFab 2017

09/21/2016  The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

Moore's Law did indeed stop at 28nm

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

SEMI and MSIG join together in strategic association partnership

09/15/2016  SEMI announced that MEMS & Sensors Industry Group (MSIG) will become a SEMI Strategic Association Partner effective January 1, 2017.

SEMI European MEMS Summit brings industry leaders to Stuttgart

09/06/2016  Leading sensors and actuators companies will present the latest trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September 2016.

Solid State Watch: August 19-25, 2016

08/30/2016  TowerJazz and SMIC’s sales forecast to surge in 2016; Intel to produce 10nm ARM chip designs; GlobalWafers to acquire SunEdison Semiconductor; SEMI posts July 2016 book-to-bill report

Global MEMS market to grow at a CAGR of close to 12% until 2020

08/26/2016  According to the latest market study released by Technavio, the global micro-electro-mechanical-systems (MEMS) market is expected to reach USD 20.26 billion by 2020, growing at a CAGR of nearly 12%.

Full program for SEMI European MEMS Summit announced

08/24/2016  Leading companies will present the latest and most impactful trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September, 2016.

MEMS & Sensors Industry Group Conference Asia explores MEMS, sensors in IoT of today and tomorrow

08/08/2016  MEMS & Sensors Industry Group (MSIG) will hold its third annual MEMS & Sensors Industry Group Conference Asia in Shanghai, China on September 13-14, 2016.

Hardware/Software Co-Development for IoT Applications: Q&A with Marie Semeria, CEO of CEA-Leti

08/03/2016  Marie Semeria, chief executive officer of CEA-Leti (http://www.leti.fr/en), sat down with SemiMD during SEMICON West to discuss how the French R&D and pilot manufacturing campus—located at the foot of the beautiful French alps near Grenoble—is expanding the scope of it’s activities to develop systems solutions for the Internet-of-Things (IoT).

Top MEMS sensor suppliers of 2015

08/02/2016  Micro-electrical mechanical systems (MEMS) sensor revenue declined by 3.4% in 2015 with slow growth expected to start from 2017. While microphones and other MEMS categories grew, other categories declined -- most notably, motion sensors.

STMicroelectronics earns MEMS Manufacturer of the Year Award

08/01/2016  STMicroelectronics has been named the MEMS Manufacturer of the Year at the MEMS World Summit, the MEMS Manufacturing Conference gathering the top executives in the Worldwide MEMS Manufacturing Industry.

Why are some MEMS devices successful while others are not?

07/28/2016  Beyond its gloom, the MEMS industry is showing numerous emerging devices that hold promise for future growth.

A*STAR'S IME kicks off consortia to develop packaging solutions for IoT applications

07/26/2016  Innovative capabilities developed will lead to higher power efficiency and lower costs for MEMS and silicon photonics devices.

Sensor sales keep hitting new records but price erosion curbs growth

07/22/2016  Double-digit unit shipment increases continue with demand being strong for low-cost sensors in wearable systems, Internet of Things, and automated embedded control.

Automotive MEMS sensor unit-shipments rose in 2015, even as revenue stalled

07/21/2016  Although shipments of microelectromechanical systems (MEMS) sensors used in automotive applications grew 8.4 percent in 2015, revenues were flat compared to the previous year, reaching $2.7 billion.

Research team led by NUS scientists develop plastic flexible magnetic memory device

07/20/2016  Novel technique to implant high-performance magnetic memory chip on a flexible plastic surface without compromising performance.

Unisem ships 1 billion packaged MEMS devices

07/19/2016  Unisem reported it recently shipped its one billionth packaged MEMS device and continues to invest capex in both MEMS assembly equipment and the development of additional factory floor space for this expanding market.

Global Neon Demand Expected to Exceed Increasing Supply

07/13/2016  Linde Electronics and Specialty Gases has made yet another investment to support its vertically integrated neon supply chain, by adding neon production capability to the company’s largest US based atmospheric gases unit (ASU) in La Porte, Texas, which produces oxygen, nitrogen and argon for the petroleum and petrochemical markets in the Houston area.

200mm fabs reawakening

07/13/2016  Buoyed by strong investments in China, 200mm wafer production is seeing a re-awakening, with overall 200mm capacity expected to match its previous 2006 peak level by 2019.

Test Protocols for the IoT

07/12/2016  The Internet-of-Things (IoT) will require components that can sense the world, process and store data, and communicate autonomously within a secured environment.




TWITTER


WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

September 27, 2016 at 1 p.m. ET / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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EVENTS



SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017

VIDEOS