08/02/2016 Micro-electrical mechanical systems (MEMS) sensor revenue declined by 3.4% in 2015 with slow growth expected to start from 2017. While microphones and other MEMS categories grew, other categories declined -- most notably, motion sensors.
08/01/2016 STMicroelectronics has been named the MEMS Manufacturer of the Year at the MEMS World Summit, the MEMS Manufacturing Conference gathering the top executives in the Worldwide MEMS Manufacturing Industry.
07/28/2016 Beyond its gloom, the MEMS industry is showing numerous emerging devices that hold promise for future growth.
07/26/2016 Innovative capabilities developed will lead to higher power efficiency and lower costs for MEMS and silicon photonics devices.
07/22/2016 Double-digit unit shipment increases continue with demand being strong for low-cost sensors in wearable systems, Internet of Things, and automated embedded control.
07/21/2016 Although shipments of microelectromechanical systems (MEMS) sensors used in automotive applications grew 8.4 percent in 2015, revenues were flat compared to the previous year, reaching $2.7 billion.
07/20/2016 Novel technique to implant high-performance magnetic memory chip on a flexible plastic surface without compromising performance.
07/19/2016 Unisem reported it recently shipped its one billionth packaged MEMS device and continues to invest capex in both MEMS assembly equipment and the development of additional factory floor space for this expanding market.
07/13/2016 Linde Electronics and Specialty Gases has made yet another investment to support its vertically integrated neon supply chain, by adding neon production capability to the company’s largest US based atmospheric gases unit (ASU) in La Porte, Texas, which produces oxygen, nitrogen and argon for the petroleum and petrochemical markets in the Houston area.
07/13/2016 Buoyed by strong investments in China, 200mm wafer production is seeing a re-awakening, with overall 200mm capacity expected to match its previous 2006 peak level by 2019.
07/12/2016 The Internet-of-Things (IoT) will require components that can sense the world, process and store data, and communicate autonomously within a secured environment.
06/29/2016 Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology, Inc. today announced it is ramping up a new MEMS and sensor packaging line at its facility in Shanghai.
06/10/2016 Semiconductor Industry Association announced worldwide sales of semiconductors reached $25.8 billion; SEMI announced that 19 new fabs and lines are forecasted to begin construction in 2016 and 2017; Tiny lasers enable faster, less power-hungry next-gen microprocessors; IC Insights releases update to Market Drivers Report
06/06/2016 The Tanner Calibre One IC verification suite is now an integral part of the Tanner analog/mixed-signal (AMS) physical design environment
06/05/2016 Mentor Graphics Corporation announced that customers and ecosystem partners are expanding their use of Calibre Pattern Matching solution to overcome previously intractable IC verification and manufacturing problems.
06/05/2016 Mentor Graphics Corp. announced that Samsung Foundry’s Closed-Loop DFM solution uses production Mentor Calibre and Tessent platforms to accelerate customer yield ramps
06/03/2016 GLOBALFOUNDRIES announced a joint venture with the government of Chongqing; Texas Instruments maintains leadership in analog IC marketshare; Micron releases two new solid state drive products; UT Dallas physicists research topological insulators
05/31/2016 SEMI releases new book-to-bill ratio report; Infineon and imec share details of their CMOS-based 79 GHz sensor chip; Synopsys introduces pre-wafer simulation solution; Researchers find new method for doping single crystals of diamond
05/27/2016 According to Yole Développement (Yole) analysts, this market will triple from US$2.7 billion in 2015 to US$7.6 billion in 2021.
05/25/2016 With a market reaching US$ 1 billion in 2021, the MEMS printhead is one of the most mature MEMS devices.
December 15, 2016 at 1 p.m. ET / Sponsored by Versum Materials
The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.
As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016Sponsored by Master Bond, Inc.,
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,