Packaging and Testing

PACKAGING AND TESTING ARTICLES



Moore's Law did indeed stop at 28nm

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

SEMI and MSIG join together in strategic association partnership

09/15/2016  SEMI announced that MEMS & Sensors Industry Group (MSIG) will become a SEMI Strategic Association Partner effective January 1, 2017.

SEMI European MEMS Summit brings industry leaders to Stuttgart

09/06/2016  Leading sensors and actuators companies will present the latest trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September 2016.

Solid State Watch: August 19-25, 2016

08/30/2016  TowerJazz and SMIC’s sales forecast to surge in 2016; Intel to produce 10nm ARM chip designs; GlobalWafers to acquire SunEdison Semiconductor; SEMI posts July 2016 book-to-bill report

Global MEMS market to grow at a CAGR of close to 12% until 2020

08/26/2016  According to the latest market study released by Technavio, the global micro-electro-mechanical-systems (MEMS) market is expected to reach USD 20.26 billion by 2020, growing at a CAGR of nearly 12%.

Full program for SEMI European MEMS Summit announced

08/24/2016  Leading companies will present the latest and most impactful trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September, 2016.

MEMS & Sensors Industry Group Conference Asia explores MEMS, sensors in IoT of today and tomorrow

08/08/2016  MEMS & Sensors Industry Group (MSIG) will hold its third annual MEMS & Sensors Industry Group Conference Asia in Shanghai, China on September 13-14, 2016.

Hardware/Software Co-Development for IoT Applications: Q&A with Marie Semeria, CEO of CEA-Leti

08/03/2016  Marie Semeria, chief executive officer of CEA-Leti (http://www.leti.fr/en), sat down with SemiMD during SEMICON West to discuss how the French R&D and pilot manufacturing campus—located at the foot of the beautiful French alps near Grenoble—is expanding the scope of it’s activities to develop systems solutions for the Internet-of-Things (IoT).

Top MEMS sensor suppliers of 2015

08/02/2016  Micro-electrical mechanical systems (MEMS) sensor revenue declined by 3.4% in 2015 with slow growth expected to start from 2017. While microphones and other MEMS categories grew, other categories declined -- most notably, motion sensors.

STMicroelectronics earns MEMS Manufacturer of the Year Award

08/01/2016  STMicroelectronics has been named the MEMS Manufacturer of the Year at the MEMS World Summit, the MEMS Manufacturing Conference gathering the top executives in the Worldwide MEMS Manufacturing Industry.

Why are some MEMS devices successful while others are not?

07/28/2016  Beyond its gloom, the MEMS industry is showing numerous emerging devices that hold promise for future growth.

A*STAR'S IME kicks off consortia to develop packaging solutions for IoT applications

07/26/2016  Innovative capabilities developed will lead to higher power efficiency and lower costs for MEMS and silicon photonics devices.

Sensor sales keep hitting new records but price erosion curbs growth

07/22/2016  Double-digit unit shipment increases continue with demand being strong for low-cost sensors in wearable systems, Internet of Things, and automated embedded control.

Automotive MEMS sensor unit-shipments rose in 2015, even as revenue stalled

07/21/2016  Although shipments of microelectromechanical systems (MEMS) sensors used in automotive applications grew 8.4 percent in 2015, revenues were flat compared to the previous year, reaching $2.7 billion.

Research team led by NUS scientists develop plastic flexible magnetic memory device

07/20/2016  Novel technique to implant high-performance magnetic memory chip on a flexible plastic surface without compromising performance.

Unisem ships 1 billion packaged MEMS devices

07/19/2016  Unisem reported it recently shipped its one billionth packaged MEMS device and continues to invest capex in both MEMS assembly equipment and the development of additional factory floor space for this expanding market.

Global Neon Demand Expected to Exceed Increasing Supply

07/13/2016  Linde Electronics and Specialty Gases has made yet another investment to support its vertically integrated neon supply chain, by adding neon production capability to the company’s largest US based atmospheric gases unit (ASU) in La Porte, Texas, which produces oxygen, nitrogen and argon for the petroleum and petrochemical markets in the Houston area.

200mm fabs reawakening

07/13/2016  Buoyed by strong investments in China, 200mm wafer production is seeing a re-awakening, with overall 200mm capacity expected to match its previous 2006 peak level by 2019.

Test Protocols for the IoT

07/12/2016  The Internet-of-Things (IoT) will require components that can sense the world, process and store data, and communicate autonomously within a secured environment.

Amkor opens MEMS packaging line in China

06/29/2016  Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology, Inc. today announced it is ramping up a new MEMS and sensor packaging line at its facility in Shanghai.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS