Packaging and Testing

PACKAGING AND TESTING ARTICLES



Gartner identifies the top 10 Internet of Things technologies for 2017 and 2018

03/03/2016  Gartner, Inc. has highlighted the top 10 Internet of Things (IoT) technologies that should be on every organization's radar through the next two years.

STATS ChipPAC honored with Supplier of the Year Award from Inphi

03/01/2016  STATS ChipPAC Ltd. today announced that it has been honored with the “Supplier of the Year” award from Inphi Corporation.

Design-for-Testability (DFT) Verified with Hardware Emulation

02/25/2016  Several years ago, while at Automatic Test Equipment (ATE) leader Teradyne, I witnessed frequent debates on a fundamental dilemma: On the production/testing floor, is it better to pass a failing device or reject a good device?

What’s the Next-Gen Litho Tech? Maybe All of Them

02/25/2016  The annual SPIE Advanced Lithography symposium in San Jose, Calif., hasn’t offered a clear winner in the next-generation lithography race.

Laser Suppliers Move Past the Neon Gas Crisis

02/24/2016  That neon gas shortage? So 2015.

Canon, Toshiba Join eBeam Initiative Group

02/24/2016  The eBeam Initiative announced that Canon and Toshiba are new members of the industry organization.

New NTU microchip shrinks radar cameras to fit into a palm

02/23/2016  NTU's new radar chip was presented and published at the prestigious International Solid-State Circuits Conference (ISSCC) 2016.

Vesper partners with AAC Technologies on piezoelectric MEMS microphones

02/22/2016  Vesper today announced a partnership with AAC Technologies Holdings Inc. for the commercialization of the world’s first piezoelectric MEMS microphones for consumer electronic devices.

What to See at the SPIE Advanced Lithography Show

02/22/2016  The SPIE Advanced Lithography conference, from Tuesday, February 23, to Thursday, February 25, offers an incredible amount of technical information in a few long, fun days.

imec and iMinds to merge and create high-tech research center

02/22/2016  Nanoelectronics research center, imec, and digital research and incubation center, iMinds, announced that its respective board of directors have approved the intention to merge the research centers.

SEMI launches new integrated packaging assembly and test group

02/10/2016  SEMI announced today the launch of the European Semiconductor integrated Packaging and Test (ESiPAT) Special Interest Group.

Led by iPhone 6S, sensor hubs market is growing fast

01/25/2016  The demand for sensor hubs, dedicated processing elements used for low-power sensor processing tasks, is booming.

Memristor Variants and Models from Knowm

01/22/2016  Knowm Inc., a start-up pioneering next-generation advanced computing architectures and technology, recently announced the availability of two new variations of memristors targeting different neuromorphic applications.

Technavio: Top two emerging trends impacting the global MEMS microphone market through 2020

01/22/2016  According to the report, the global MEMS microphone market is expected to reach close to USD 2 billion by 2020, posting a CAGR of over 12%.

Vesper collaborates with GLOBALFOUNDRIES to deliver first piezoelectric MEMS microphones

01/20/2016  Acoustic sensing company works with top foundry to support mass-market consumer products.

AMD Net Loss Widens in 2015 on Lower Revenue

01/20/2016  Advanced Micro Devices on Tuesday reported a net loss of $660 million on revenue of $3.99 billion for 2015, compared with a net loss of $403 million on revenue of $5.51 billion in 2014.

ASML Has Record Revenue for 2015; Will Raise Dividend, Buy Back More Stock

01/20/2016  ASML Holding today reported net income of about $1.5 billion on revenue of $6.855 billion for 2015. That compared with 2014’s net income of $1.3 billion on revenue of $6.385 billion.

Startup Works on Ultralow-k Materials for Chips, Displays

12/21/2015  The very last presentation at the 12th annual 3D Advanced Semiconductor Integration and Packaging conference was given by Hash Pakbaz, president and chief executive officer of SBA Materials, a developer of nanoporous and mesoporous materials for semiconductor manufacturing and other applications.

3D ASIP Conference Hears from EDA, IC Gear Companies

12/18/2015  John Ferguson of Mentor Graphics provided the electronic design automation perspective on packaging technology at the 12th annual 3D ASIP conference in Redwood City, Calif.

SPTS Technologies installs a 300mm MEMS vapor HF etch release solution at CEA-Leti

12/18/2015  SPTS Technologies has supplied CEA-Leti, one of Europe’s largest micro- and nanotechnologies research institutes, with its vapor HF etch release systems for 300mm microelectromechanical systems (MEMS) on CMOS development.




TWITTER


WEBCASTS



Smartphone Market Driving 7nm & 5nm Node 3-D Transistors and Stacked Devices

December 15, 2016 at 1 p.m. ET / Hosted by Solid State Technology

The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



Industry Strategy Symposium 2017
Half Moon Bay, CA
http://www.semi.org/en/en/node/71404
January 08, 2017 - January 11, 2017
European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS