03/03/2016 Gartner, Inc. has highlighted the top 10 Internet of Things (IoT) technologies that should be on every organization's radar through the next two years.
03/01/2016 STATS ChipPAC Ltd. today announced that it has been honored with the “Supplier of the Year” award from Inphi Corporation.
02/25/2016 Several years ago, while at Automatic Test Equipment (ATE) leader Teradyne, I witnessed frequent debates on a fundamental dilemma: On the production/testing floor, is it better to pass a failing device or reject a good device?
02/25/2016 The annual SPIE Advanced Lithography symposium in San Jose, Calif., hasn’t offered a clear winner in the next-generation lithography race.
02/24/2016 That neon gas shortage? So 2015.
02/24/2016 The eBeam Initiative announced that Canon and Toshiba are new members of the industry organization.
02/23/2016 NTU's new radar chip was presented and published at the prestigious International Solid-State Circuits Conference (ISSCC) 2016.
02/22/2016 Vesper today announced a partnership with AAC Technologies Holdings Inc. for the commercialization of the world’s first piezoelectric MEMS microphones for consumer electronic devices.
02/22/2016 The SPIE Advanced Lithography conference, from Tuesday, February 23, to Thursday, February 25, offers an incredible amount of technical information in a few long, fun days.
02/22/2016 Nanoelectronics research center, imec, and digital research and incubation center, iMinds, announced that its respective board of directors have approved the intention to merge the research centers.
02/10/2016 SEMI announced today the launch of the European Semiconductor integrated Packaging and Test (ESiPAT) Special Interest Group.
01/25/2016 The demand for sensor hubs, dedicated processing elements used for low-power sensor processing tasks, is booming.
01/22/2016 Knowm Inc., a start-up pioneering next-generation advanced computing architectures and technology, recently announced the availability of two new variations of memristors targeting different neuromorphic applications.
01/22/2016 According to the report, the global MEMS microphone market is expected to reach close to USD 2 billion by 2020, posting a CAGR of over 12%.
01/20/2016 Acoustic sensing company works with top foundry to support mass-market consumer products.
01/20/2016 Advanced Micro Devices on Tuesday reported a net loss of $660 million on revenue of $3.99 billion for 2015, compared with a net loss of $403 million on revenue of $5.51 billion in 2014.
01/20/2016 ASML Holding today reported net income of about $1.5 billion on revenue of $6.855 billion for 2015. That compared with 2014’s net income of $1.3 billion on revenue of $6.385 billion.
12/21/2015 The very last presentation at the 12th annual 3D Advanced Semiconductor Integration and Packaging conference was given by Hash Pakbaz, president and chief executive officer of SBA Materials, a developer of nanoporous and mesoporous materials for semiconductor manufacturing and other applications.
12/18/2015 John Ferguson of Mentor Graphics provided the electronic design automation perspective on packaging technology at the 12th annual 3D ASIP conference in Redwood City, Calif.
12/18/2015 SPTS Technologies has supplied CEA-Leti, one of Europe’s largest micro- and nanotechnologies research institutes, with its vapor HF etch release systems for 300mm microelectromechanical systems (MEMS) on CMOS development.
December 15, 2016 at 1 p.m. ET / Hosted by Solid State Technology
The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.
As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016Sponsored by Master Bond, Inc.,
XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,