Packaging Materials

MAGAZINE



PACKAGING MATERIALS ARTICLES



A new window into electron behavior

11/17/2017  Scientists invent technique to map energy and momentum of electrons beneath a material's surface.

'Ion billiards' cue novel material synthesis method

11/17/2017  A team of Hokkaido University researchers has developed a novel material synthesis method called proton-driven ion introduction (PDII) which utilizes a phenomenon similar to "ion billiards." The new method could pave the way for creating numerous new materials, thus drastically advancing materials sciences

U.S. semiconductor chemical suppliers lost market share over past decade

11/10/2017  U.S. semiconductor chemical suppliers lost market share to Japanese and European competitors in every major segment over the past decade, according to a new report from The Information Network.

Third quarter 2017 silicon wafer shipments hit another quarterly record

11/08/2017  Worldwide silicon wafer area shipments increased during the third quarter 2017 when compared to second quarter 2017 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

How to solve the BEOL RC delay problem?

11/07/2017  The RC delay issues started a few nodes ago, and the problems are becoming worse.

Lightning-fast communications

11/06/2017  University of Utah researchers develop milestone for ultra-fast communications and computing.

Global semiconductor industry posts highest-ever quarterly sales

11/01/2017  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $107.9 billion for the third quarter of 2017, marking the industry’s highest-ever quarterly sales and an increase of 10.2 percent compared to the previous quarter.

NREL research yields significant thermoelectric performance

11/01/2017  Addition of thin films to fabrics could power portable electronics, sensors.

Deep-depletion: A new concept for MOSFETs

10/26/2017  An international team of researchers has created a proof of concept that uses the deep-depletion regime in bulk-boron-doped diamond MOSFETs to increase hole channel carrier mobility.

Nanotube fiber antennas as capable as copper

10/23/2017  Rice University researchers show their flexible fibers work well but weigh much less.

Strong solar and semiconductor demand but still a sizeable oversupply of polysilicon

10/18/2017  An oversupply of polysilicon will double in 2018 despite strong demand in solar and semiconductor markets, according to a report recently published by The Information Network.

Long nanotubes make strong fibers

10/17/2017  Rice University researchers advance characterization, purification of nanotube wires and films.

2017 IEDM features rich technical program, focus sessions

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

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TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018

VIDEOS