Packaging Materials

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PACKAGING MATERIALS ARTICLES



X-rays reveal 'handedness' in swirling electric vortices

01/18/2018  Scientists at Berkeley Lab study exotic material's properties, which could make possible a new form of data storage.

Solid-state physics offers insights into dielectric properties of biomaterials

01/09/2018  In this paper, researchers characterize the behavior of proteins, considered as classical amorphous semiconductors, with the help of the formalism of condensed matter physics. The authors have clearly shown the powerful methodology and instrumentation of condensed matter physics to be effective for fundamental research into the electrodynamics of biological objects. The next step could involve the application to biomaterials research of the wide range of other theories and models that have been effectively used by the physics community for many decades.

Understanding the impact of defects on the properties of moS2

12/21/2017  Researchers at the Center for Integrated Nanostructure Physics, within the Institute for Basic Science (IBS), have shown that defects in monolayer molybdenum disulfide (MoS2) exhibit electrical switching, providing new insights into the electrical properties of this material. As MoS2 is one of the most promising 2D semiconductors, it is expected that these results will contribute to its future use in opto-electronics.

Revision to SEMI E142: Specification for substrate mapping

12/21/2017  The Korea Advanced Back-end Factory Integration Task Force, in response to the industry's demand, has decided to revise SEMI E142-0211 (Reapproved 1016), Specification for Substrate Mapping by adding an assembly and packaging raw materials traceability method.

Thermally activated delayed photoluminescence from semiconductor nanocrystals

12/18/2017  Researchers from North Carolina State University have found that the transfer of triplet excitons from nanomaterials to molecules also creates a feedback mechanism that returns some energy to the nanocrystal, causing it to photoluminesce on long time scales. The mechanism can be adjusted to control the amount of energy transfer, which could be useful in optoelectronic applications.

A transistor of graphene nanoribbons

11/30/2017  Empa researchers in collaboration with the Max Planck Institute for Polymer Research in Mainz and the University of California at Berkeley have now succeeded in growing ribbons exactly nine atoms wide with a regular armchair edge from precursor molecules.

A new window into electron behavior

11/17/2017  Scientists invent technique to map energy and momentum of electrons beneath a material's surface.

'Ion billiards' cue novel material synthesis method

11/17/2017  A team of Hokkaido University researchers has developed a novel material synthesis method called proton-driven ion introduction (PDII) which utilizes a phenomenon similar to "ion billiards." The new method could pave the way for creating numerous new materials, thus drastically advancing materials sciences

U.S. semiconductor chemical suppliers lost market share over past decade

11/10/2017  U.S. semiconductor chemical suppliers lost market share to Japanese and European competitors in every major segment over the past decade, according to a new report from The Information Network.

Third quarter 2017 silicon wafer shipments hit another quarterly record

11/08/2017  Worldwide silicon wafer area shipments increased during the third quarter 2017 when compared to second quarter 2017 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

How to solve the BEOL RC delay problem?

11/07/2017  The RC delay issues started a few nodes ago, and the problems are becoming worse.

Lightning-fast communications

11/06/2017  University of Utah researchers develop milestone for ultra-fast communications and computing.

Global semiconductor industry posts highest-ever quarterly sales

11/01/2017  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $107.9 billion for the third quarter of 2017, marking the industry’s highest-ever quarterly sales and an increase of 10.2 percent compared to the previous quarter.

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TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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EVENTS



DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


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