Packaging Materials

MAGAZINE



PACKAGING MATERIALS ARTICLES



Technavio releases market research report and forecast on gallium arsenide components

01/12/2017  The global gallium arsenide (GaAs) components market is expected to grow at a CAGR of over 4% during the forecast period, according to Technavio’s latest report.

CWRU directly measures how perovskite solar films efficiently convert light to power

01/11/2017  Measurement shows potential for building better solar cells by imaging fundamental properties of the material.

Air Products to expand nitrogen capacity in Pyeongtaek City to support demand of semiconductor industry

01/10/2017  Air Products today announced it will increase nitrogen production to serve the growing demand of its existing customer in Pyeongtaek City, Gyeonggi Province, South Korea.

2-D materials enhance a 3-D world

01/10/2017  2-D layer increases effectiveness of optoelectronics.

Illinois team advances GaN-on-Silicon for scalable high electron mobility transistors

01/09/2017  A team of researchers at the University of Illinois at Urbana-Champaign has advanced gallium nitride (GaN)-on-silicon transistor technology by optimizing the composition of the semiconductor layers that make up the device

Atomera selects TSI Semiconductors to accelerate semiconductor materials advancements

01/05/2017  Foundry to provide manufacturing, electrical test and characterization services to shorten Atomera's time to market.

Germanium's semiconducting and optical properties probed under pressure

01/04/2017  Germanium may not be a household name like silicon, its group-mate on the periodic table, but it has great potential for use in next-generation electronics and energy technology.

Global semiconductor sales up 7% year-to-year

01/04/2017  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $31.0 billion for the month of November 2016, an increase of 7.4 percent compared to the November 2015 total.

A year in review: Top 10 stories of 2016

12/23/2016  From the ground-breaking research breakthroughs to the shifting supplier landscape, these are the stories the Solid State Technology audience read the most during 2016.

Stability challenge in perovskite solar cell technology

12/23/2016  New research reveals intrinsic instability issues of iodine-containing perovskite solar cells.

New material with ferroelectricity and ferromagnetism may lead to better computer memory

12/21/2016  Scientists at Tokyo Institute of Technology (Tokyo Tech) have demonstrated that ferroelectricity and ferromagnetism coexist at room temperature in thin films of bismuth-iron-cobalt oxide. The research could have implications in the next generation of computer memory and sensors.

Researchers work to improve the lifecycle of materials

12/15/2016  When most living creatures get hurt, they can self-heal and recover from the injury. But, when damage occurs to inanimate objects, they don't have that same ability and typically either lose functionality or have their useful lifecycle reduced. Researchers at the Beckman Institute for Advanced Science and Technology are working to change that.

Rapid and mass production of graphene, using microwaves

12/13/2016  Graphene, a material that could usher in the next generation of electronic and energy devices, could be closer than ever to mass production, thanks to microwaves.

MORE PACKAGING-MATERIALS ARTICLES

TWITTER


WEBCASTS



Internet of Things

January 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
ISS Europe 2017
Munich, Germany
http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS