Packaging Materials

PACKAGING MATERIALS ARTICLES



Application of air-sensitive semiconductors in nanoelectronics

09/21/2017  2-D semiconductor gallium selenide in encapsulated nanoelectronic devices.

SEMICON Europa moves to Munich: Empowering innovation and shaping the value chain

09/20/2017  New programs on Materials, Automotive, and Flexible Electronics expand SEMICON Europa's impact.

Graphene and other carbon nanomaterials can replace scarce metals

09/19/2017  Scarce metals are found in a wide range of everyday objects around us. They are complicated to extract, difficult to recycle and so rare that several of them have become "conflict minerals" which can promote conflicts and oppression. A survey at Chalmers University of Technology now shows that there are potential technology-based solutions that can replace many of the metals with carbon nanomaterials, such as graphene.

IMAPS 2017 to showcase advances in microelectronics technology

09/15/2017  Researchers and exhibitors will showcase their work during a comprehensive conference program of technical papers, panels, special sessions, short courses/tutorials, and an exhibition that will spotlight premier work in the fields of microelectronics, semiconductor packaging and circuit design.

New insights into nanocrystal growth in liquid

09/15/2017  Understanding process that creates complex crystals important for energy applications.

New study on graphene-wrapped nanocrystals makes inroads toward next-gen fuel cells

09/14/2017  Simulations and analysis at Berkeley Lab provide new atomic-scale clues to material's enhanced hydrogen storage properties.

Entegris expands its Taiwan tech center to add new microcontamination analysis and tech development capacity

09/13/2017  Entegris Inc., a specialty materials provider, today announced the expansion of its Taiwan Technology Center for Research and Development (TTC) in Hsinchu, Taiwan.

Quantum sensors decipher magnetic ordering in a new semiconducting material

09/13/2017  For the first time, physicists have successfully imaged spiral magnetic ordering in a multiferroic material.

Stay ahead of the curve with SMC 2017 - Materials accelerating innovation

09/06/2017  Slated for September 18-20 in San Jose, Calif., the 18th annual SMC “offers a unique chance to network and discover opportunities in and around the industry in a year where dramatic growth has returned to the semiconductor market,” observes SMC 2017 co-chair Mark Thirsk of Linx Consulting, who will provide opening remarks at the conference.

A revolution in lithium-ion batteries is becoming more realistic

09/05/2017  The modern world relies on portable electronic devices such as smartphones, tablets, laptops, cameras or camcorders. Many of these devices are powered by lithium-ion batteries, which could be smaller, lighter, safer and more efficient if the liquid electrolytes they contain were replaced by solids. A promising candidate for a solid-state electrolyte is a new class of materials based on lithium compounds, presented by physicists from Switzerland and Poland.

Flexible hybrid electronics & sensors impacting the automotive industry

09/05/2017  FlexTech, a SEMI strategic association partner, will host a one-day Flexible Hybrid Electronics and Sensors Automotive Industry workshop in Detroit, Michigan on September 13, 2017 to explore how FHE adds functionality, decreases weight and impacts design. Automotive and electronics industry leaders will gather to discuss the market demands and challenges with automotive technology and present disruptive changes brought by flexible hybrid electronics (FHE) and sensors.

ASE K7 receives Green Factory Label

09/01/2017  Advanced Semiconductor Engineering, Inc, a semiconductor assembly and test service provider, announced that its K7 manufacturing facility in Kaohsiung has received the Green Factory Label from the Industrial Development Bureau, Ministry of Economic Affairs, Taiwan.

New device could turn heat energy into a viable fuel source

08/31/2017  A new device being developed by Washington State University physicist Yi Gu could one day turn the heat generated by a wide array of electronics into a usable fuel source.

Physicists learn how to create nanopores of specified size in graphene

08/30/2017  A group of international physicists, jointly with NUST MISIS researchers, have conducted a series of experiments on graphene bombardment by swift heavy ions.

Nagoya-led team flips the switch on ferroelectrics

08/28/2017  Nagoya University-led team controls the configuration of domains in nanorod- and thin-film ferroelectric systems.

Semiconductor industry capital spending forecast to jump 20% in 2017

08/22/2017  Samsung remains the “wild card” with regard to 2H17 capital expenditures.

Large wafers, complex IC designs among advanced packaging trends

08/15/2017  The global semiconductor advanced packaging market is expected to grow at a CAGR of 8.45% during the period 2017-2021, according to Research and Markets.

Reality check for 'wonder material'

08/04/2017  Topological insulators, a class of materials which has been investigated for just over a decade, have been heralded as a new 'wonder material', as has graphene. But so far, topological insulators have not quite lived up to the expectations fueled by theoretical studies. University of Groningen physicists now have an idea about why.

Scientists discover new magnet with nearly massless charge carriers

08/04/2017  Advances in modern electronics has demanded the requisite hardware, transistors, to be smaller in each new iteration. Recent progress in nanotechnology has reduced the size of silicon transistors down to the order of 10 nanometers. However, for such small transistors, other physical effects set in, which limit their functionality. The recent discoveries of topological materials -- a new class of relativistic quantum materials -- hold great promise for use in energy saving electronics.

Atomic discovery opens door to greener, faster, smaller electronic circuitry

07/26/2017  Scientists find way to correct communication pathways in silicon chips, making them perfect.




TWITTER


WEBCASTS



3D NAND: Trends in Processes, Circuits

October 3, 2017 at 1 p.m. ET

Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS