Packaging Materials

PACKAGING MATERIALS ARTICLES



Nano-polycrystalline film leads to stronger magnetism compared to single-crystal films

03/17/2017  Oxygen defects like nanopillars enhanced magnetic and magnetooptical response of STF films.

UC researchers use gold coating to control luminescence of nanowires

03/17/2017  University of Cincinnati physicists manipulate nanowire semiconductors in pursuit of making electronics smaller, faster and cheaper.

Entegris partners with China's Spectrum Materials to manufacture Entegris specialty chemicals in China

03/13/2017  Entegris Inc. today announced it has signed an agreement with Spectrum Materials Co., Ltd. to expand its presence in China.

Sandia National Laboratories creates 3-D metasurfaces with optical possibilities

03/10/2017  The new Sandia metamaterials can be fabricated in multiple layers to form complex, three-dimensional meta-atoms that reflect more light than shiny gold surfaces, usually considered the ultimate in infrared reflectivity. The III-V materials also emit photons when excited -- something that silicon, which can reflect, transmit and absorb -- can't do.

Polymer-coated silicon nanosheets as an alternative to graphene

03/08/2017  Researchers at the Technical University of Munich (TUM) have, for the first time ever, produced a composite material combining silicon nanosheets and a polymer that is both UV-resistant and easy to process.

Coffee-ring effect leads to crystallization control

03/06/2017  Varying the thickness of crystallizing materials facilitates control over the patterns and properties of crystals.

Technavio reports top three drivers promoting growth for the carbon nanotube market

03/03/2017  Technavio analysts forecast the global carbon nanotube (CNT) market to grow at a staggering CAGR of almost 22% during the forecast period, according to their latest report.

Versum Materials expands manufacturing capacity

03/01/2017  Versum Materials, Inc. announced today that it would expand its manufacturing capacity at its Delivery Systems and Service (DS&S) headquarters in Allentown, Pennsylvania.

Materion Corporation completes Heraeus target materials acquisition

03/01/2017  Materion Corporation announced today that it has completed the previously announced acquisition of the target materials business of the Heraeus Group.

Researchers pave the way for ionotronic nanodevices

02/24/2017  Discovery helps develop a new kind of electrically switchable memories.

Versum Materials names Edward Shober as senior VP of Materials

02/24/2017  Versum Materials, Inc., a materials supplier to the semiconductor industry, announced today that Edward “Ed” Shober has been appointed to the position of senior vice president of its Materials segment.

SEMI appoints Ajit Manocha as president and CEO

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

Breakthrough with a chain of gold atoms

02/17/2017  In the field of nanoscience, an international team of physicists with participants from Konstanz has achieved a breakthrough in understanding heat transport.

'Lossless' metamaterial could boost efficiency of lasers and other light-based devices

02/17/2017  Engineers at the University of California San Diego have developed a material that could reduce signal losses in photonic devices.

A new spin on electronics

02/15/2017  Information transport by spin as an alternative to conventional computing technology.

Turning up the heat for perfect (nano)diamonds

02/14/2017  Researchers are taking rough, defective diamonds and using high temperatures to perfect them for quantum sensing.

A new platform to study graphene's electronic properties

02/13/2017  IBS scientists model the electronic structure of graphene.

Penn researchers are among the first to grow a versatile 2-dimensional material

02/09/2017  University of Pennsylvania researchers are now among the first to produce a single, three-atom-thick layer of a unique two-dimensional material called tungsten ditelluride.

Intel announces $7B investment in next-gen semiconductor fab in Arizona

02/09/2017  The announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House.

NREL research pinpoints promise of polycrystalline perovskites

02/07/2017  A team of scientists from the Energy Department's National Renewable Energy Laboratory (NREL) determined that surface recombination limits the performance of polycrystalline perovskite solar cells.




TWITTER


WEBCASTS



Semiconductors and the IoT

Tuesday, March 28, 2017 at 1pm ET / Sponsored by Epicor

The rise of Internet of Things (IoT) and the cloud and their associated technologies and platforms are slowly but surely fueling the emergence of new market segments that are shaping and transforming our way of life. Learn how the IoT applications and use-cases that span clients/devices, networks, and data centers are driving new requirements for semiconductors including ultra-low power, ultra-low leakage, smaller and denser packaging, and cost effectiveness. And find out exactly how this IoT trend represents a growth opportunity for the semiconductor industry that has not been seen since the early days of the Internet.

Sponsored By:
Advanced Process Control in Microelectronics Manufacturing: Leveraging Smart Manufacturing and Big Data

Friday, April 7, 2017 at 1pm ET / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017

VIDEOS