06/29/2016 ALLVIA, Inc. has expanded its capacity into glass and quartz via manufacturing to accommodate customer requests in via-fill technology from silicon interposers to glass and quartz interposers.
06/28/2016 A Clarkson University research team reports surprising findings that could have significant impact for constructing nano-patterned materials in electronic, magnetic or optical devices.
06/28/2016 Ultratech's AP300 lithography systems will be used for next-generation, high-volume, fan-out wafer-level packaging applications.
06/24/2016 With a surface resembling that of plants, solar cells improve light-harvesting and thus generate more power.
06/24/2016 In the early stages of development, having more process control can help reduce both the number and duration of cycles-of-learning (the iterations required to solve a particular problem).
06/23/2016 According to the latest market research report by Technavio, the global semiconductor capital equipment market is expected to reach $47.34 billion mark by 2020.
06/23/2016 For fan-out wafer-level packaging and 3D packaging, thin wafer handling is critical; the wafer must not warp, bend or shift during any wafer-processing steps.
06/22/2016 Greater demand for energy efficiency in systems, cars, portable electronics, and new connections to the Internet of Things will steadily drive power transistor sales to new record-high levels in the next three years.
06/22/2016 Emerging opportunities for advanced packaging solutions for heterogeneous integration include a lot more than logic, memory and sensors.
06/21/2016 Amkor Technology Inc., a provider of semiconductor packaging and test services, today announced it has received the Supplier of the Year award from Qualcomm Technologies, Inc.
06/21/2016 The LSA101 tool will be used to support the foundry's 28nm and 40nm production efforts, and Ultratech expects to ship the system in the third quarter of 2016.
06/21/2016 EV Group (EVG) today announced that, for the fourth successive year, it has earned all three awards resulting from VLSIresearch Inc.'s annual Customer Satisfaction Survey.
06/17/2016 Dialog Semiconductor plc, a provider of highly integrated power management, AC/DC power conversion, solid state lighting (SSL) and Bluetooth low energy technology, today announced the appointment of Nick Jeffery to the company's Board of Directors.
July 28, 2016 at 10 AM MT / Sponsored by Particle Measuring Systems, Inc.
Decreasing the time to detect, contain and mitigate very low levels of Airborne Molecular Contamination (AMC) is critical for high tech manufacturers. Costs associated with AMC-related quality issues and yield losses are well understood, and adequate reduction of AMC is critical for clean manufacturers to stay competitive. Technical personnel need the flexibility to efficiently collect AMC data with good temporal-spatial resolution anywhere in the clean environment for both sustaining sample plans, as well as to collect site-specific data to converge on AMC sources during troubleshooting events. A brief overview of AMC will be presented along with the latest technology for efficiently identifying AMC sources in the cleanroom.
June 2016 (Date and time TBD)/ Sponsored by Air Products
June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,
This whitepaper provides a comprehensive overview of parylene conformal
coating, advantages of parylene, and applications for parylene to
protect electronic devices.
As technology continues to advance, devices will encounter rugged
environments and it is vital that they are properly protected. Parylene
conformal coating is one way that manufacturers are giving their devices
a higher level of protection, along with increasing the overall quality
of their products.
Parylene conformal coating applications for Electronics include:
· I/O & PCI Modules
· Power Converters and Supplies
· Other Embedded Computing applications
· Other specialty electronics and assemblies April 26, 2016Sponsored by Diamond-MT
XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016Sponsored by XwinSys Technology Development Ltd.