The ConFab 2018 announces conference agenda and speakers

03/16/2018  Browse this slideshow for a look at this year's speakers, keynotes, panel discussions, and special guests.

Broadcom withdraws offer to acquire Qualcomm

03/16/2018  The Trump administration issued a Presidential Order this week to block the acquisition.

Synopsys and industry technologists to address the path to 2nm SoC design

03/16/2018  Synopsys, Inc. today announced it is hosting an advanced-technology panel on "EUV, High-NA, Metallurgy and FinFET++ - Where We Go from Here for Next-Generation Design" at the Synopsys Users Group (SNUG) Silicon Valley event on Thursday, March 22.

IC Insights raises 2018 IC market forecast from 8% to 15%

03/15/2018  Increased expectations for the DRAM and NAND flash markets spur upward revision.

Trump blocks Broadcom's takeover of Qualcomm

03/13/2018  Qualcomm Incorporated received a Presidential Order to immediately and permanently abandon the proposed takeover of Qualcomm by Broadcom Limited.

Fab spending poised for remarkable fourth year of growth

03/12/2018  The latest update to the SEMI World Fab Forecast report, published on February 28, 2018, reveals fab equipment spending will increase at 5 percent in 2019 for a remarkable fourth consecutive year of growth.

Qualcomm Board names Jeffrey Henderson Non-Executive Chairman

03/09/2018  The Board has discontinued the role of Executive Chairman, which was established in 2014 as part of a leadership transition plan, based on its belief that an independent Chairman is now more appropriate for Qualcomm. The Board has named Jeffrey W. Henderson, an independent Qualcomm director since 2016, to serve as Non-Executive Chairman.

Synopsys collaborates with Samsung Foundry to develop DesignWare IP for Samsung 8nm finFET process

03/08/2018  Synopsys, Inc. today announced a collaboration with Samsung Foundry to develop DesignWare Foundation IP for Samsung's 8nm Low Power Plus (8LPP) FinFET process technology.

KLA-Tencor receives Intel's Preferred Quality Supplier award

03/08/2018  KLA-Tencor Corporation has been recognized by Intel as a recipient of a 2017 Preferred Quality Supplier (PQS) award.

Are the major DRAM suppliers stunting DRAM demand?

03/07/2018  Skyrocketing DRAM prices potentially open the door for startup Chinese competitors.

A treasure trove for nanotechnology experts

03/06/2018  A team from EPFL and NCCR Marvel has identified more than 1,000 materials with a particularly interesting 2D structure. Their research paves the way for groundbreaking technological applications.

Presto Engineering provides high-volume wafer-level test for Maja Systems wireless data-center connectivity solutions

03/06/2018  Launch of Maja Systems terabit connectivity solutions in millimeter wave CMOS accelerated by Presto’s high-volume wireless and RF test expertise.

Executive viewpoints: 2018 outlook

03/05/2018  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.




3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts


Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

More Technology Papers


San Jose, CA
March 19, 2018 - March 23, 2018
LED Expo Thailand
Bangkok, Thailand
May 10, 2018 - May 12, 2018

More Events