Packaging

MAGAZINE



PACKAGING ARTICLES



S. Korean University employs Advanced Vacuum plasma systems in nanotechnology research

08/24/2016  A leading South Korean research university has successfully integrated two Advanced Vacuum plasma processing systems from Plasma-Therm into its nanotechnology fabrication lab, which supports multiple users engaged in wide-ranging nanotechnology research.

North American semiconductor equipment industry posts July 2016 book-to-bill ratio of 1.05

08/24/2016  North America-based manufacturers of semiconductor equipment posted $1.79 billion in orders worldwide in July 2016 (three-month average basis) and a book-to-bill ratio of 1.05.

Will fan-out packaging be sustainable long-term?

08/23/2016  2016 is a turning point for the Fan-Out market since both leaders, Apple and TSMC, changed the game and may create a trend of acceptance of Fan-Out packages

TowerJazz and SMIC’s sales forecast to surge in 2016

08/23/2016  Total pure-play foundry market expected to jump 9% this year, up from 6% growth in 2015.

Microsemi announces engineering scholarship program with University of Limerick

08/23/2016  Microsemi Corporation today announced it is renewing its current 50,000 euros scholarship program for University of Limerick engineering students living in County Clare, where the company has its European headquarters in Ennis, Ireland.

New theory could lead to new generation of energy friendly optoelectronics

08/22/2016  Researchers at Queen's University Belfast and ETH Zurich, Switzerland, have created a new theoretical framework which could help physicists and device engineers design better optoelectronics.

Intel to produce 10nm ARM chip designs

08/19/2016  ARM and Intel Custom Foundry this week at the Intel Developer Forum in San Francisco an agreement to accelerate the development and implementation of ARM SoCs on Intel’s 10nm process.

Innodisk unveils its next-generation M2DOM

08/19/2016  Innodisk unveiled its Next Generation innovation in flash storage design technology last week during its VIP product launch at the Hyatt Hotel in Santa Clara, CA.

Advanced packaging: Hot topic at SEMICON Taiwan 2016

08/17/2016  SEMI announced today that over 43,000 visitors are expected to attend SEMICON Taiwan September 7-9 at the TWTC Nangang Exhibition Hall in Taipei.

Reno Sub-Systems secures first EVC matching network design win and large production order

08/16/2016  Reno Sub-Systems today announced that it has secured its first platform design win for its Electronically Variable Capacitor (EVC) matching network.

Ensuring safety in the sub-fab

08/16/2016  Problems frequently arise as a result of an incomplete or absent formal risk assessment when processes are modified or new materials introduced.

Fan-Out Wafer Level Packaging: Breakthrough advantages and surmountable challenges

08/16/2016  New wafer processing technologies overcome FOWLP’s technical hurdles, paving the way for a new generation of ultra compact, high I/O electronic devices.

Time to uncover the process mystery for IC designs

08/15/2016  Semiconductor processes have long been a mystery for many circuit designers. They didn’t need to worry about how chips were fabricated most of the time, thanks to the many EDA innovations that make their jobs easier and complex designs possible.

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TWITTER


WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

Date and time TBD / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
Interconnection Technologies

August 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

More Technology Papers

EVENTS



European MEMS Summit 2016
Stuttgart, Germany
http://www.semi.org/eu/node/8871
September 15, 2016 - September 16, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS