Packaging

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PACKAGING ARTICLES



SEMICON West preview: MEMS

05/23/2017  Autonomous automobiles, smart manufacturing, smart buildings, mobile human health monitoring, and 4G+ communications hardware for connecting all these devices will drive strong 24 percent growth in units and 14 percent in value for the MEMS sector.

North American semiconductor equipment industry posts April 2017 billings

05/23/2017  North America-based manufacturers of semiconductor equipment posted $2.17 billion in billings worldwide in April 2017 (three-month average basis), according to the April Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

GLOBALFOUNDRIES and Chengdu partner to expand FD-SOI ecosystem in China

05/23/2017  GLOBALFOUNDRIES and the Chengdu municipality today announced an investment to spur innovation in China's semiconductor industry.

Amkor Technology completes acquisition of NANIUM

05/22/2017  Amkor Technology, Inc. today announced that it has completed the acquisition of NANIUM S.A., a provider of wafer-level fan-out (WLFO) semiconductor packaging solutions.

Engaging diamond for next-era transistors

05/22/2017  Materials scientists in Japan have developed a new diamond transistor fabrication process that promises to advance the development of more robust and energy-efficient electronics.

China's semiconductor industry and "win-win" growth

05/22/2017  As China embarks on the Made in China 2025 plan with electronics and semiconductor technology as one of the Top 10 focus areas, China's semiconductor industry has an unprecedented growth opportunity.

Worldwide semiconductor revenue grew 2.6% in 2016, reports Gartner

05/15/2017  Worldwide semiconductor revenue totaled $343.5 billion in 2016, a 2.6 percent increase from 2015 revenue of $334.9 billion, according to final results by Gartner, Inc.

Renesas Electronics announces absorption-type merger with consolidated subsidiary

05/12/2017  Renesas Electronics Corporation announced it will consolidate its subsidiary Renesas System Design, Co., Ltd. through an absorption-type merger.

Synopsys IC Validator physical signoff verifies 10 billion+ transistors within hours

05/11/2017  Synopsys, Inc. today announced that its IC Validator was successfully deployed on some of the industry's largest and most advanced designs to accelerate design rule checking (DRC) closure.

StratEdge semiconductor packages now sold on Amazon.com

05/03/2017  High-performance packages now available for on-line purchase.

Multiple orders for Rudolph's Firefly Inspection System marks early success

05/01/2017  The Firefly System with Clearfind Technology helps manufacturers find defects earlier in the process – improving reliability of devices.

Worldwide smartphone market gains steam in the first quarter of 2017 with shipments up 4.3%, according to IDC

04/27/2017  Phone companies shipped a total of 347.4 million smartphones worldwide in the first quarter of 2017 (1Q17).

Diamond quantum sensor reveals current flows in next-gen materials

04/27/2017  World-first images of electric currents in graphene released.

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WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

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TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

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