05/24/2016 Tessera Technologies, Inc. announced today that it and certain of its subsidiaries filed legal proceedings for patent infringement in both domestic and international jurisdictions against Broadcom.
05/24/2016 The nanoelectronics research centers imec and Holst Centre (set up by imec and TNO), presented a low-power wide-area (LPWA) multi-standard radio chip today at imec's annual technology forum in Brussels (ITF Brussels 2016).
05/23/2016 GLOBALFOUNDRIES today announced a next-generation radio-frequency (RF) silicon solution for its Silicon Germanium (SiGe) high-performance technology portfolio.
05/20/2016 Synopsys, Inc. today announced that the company's Custom Compiler tool has been enabled by Samsung for 14 nanometer (nm) LPP and LPC FinFET production.
05/19/2016 Fujitsu Limited today announced that it has with Intel Corporation carried out a field trial to visualize manufacturing processes at Shimane Fujitsu Limited.
05/18/2016 For the first time, scientists at IBM Research have demonstrated reliably storing 3 bits of data per cell using a relatively new memory technology known as phase-change memory (PCM).
05/18/2016 The CEA (Atomic Energy Commission) and Intel are boosting their collaboration through a new R&D agreement signed in Paris on Thursday 12 May.
05/18/2016 The 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2016), opened today (May 17) in Saratoga Springs, New York.
05/16/2016 STMicroelectronics announced advanced high-efficiency power semiconductors for Hybrid and Electric Vehicles (EVs) with a timetable for qualification to the automotive quality standard AEC-Q101.
05/12/2016 Qualcomm, Micron, and SK Hynix registered ≥25% drops, with total top-20 sales off by 6%.
05/11/2016 Standard solutions and devices are compared to a 60 V MOSFET with monolithic Schottky diode as evaluated in SMPS and motor control environments.
05/11/2016 EV Group (EVG) announced that it has received multiple orders for its GEMINI FB XT automated fusion wafer bonders from multiple leading device manufacturers.
05/11/2016 William (Bill) P. Sullivan, currently a member of Maxim's Board, will assume the Board Chair position, effective immediately.
May 26, 2016 at 1 PM ET / Sponsored by Zeta Instruments
Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.
June 21, 2016 at 1 PM ET / Sponsored by Air Products
June 2016 (Date and time TBD)/Sponsored by Air Products
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,
This whitepaper provides a comprehensive overview of parylene conformal
coating, advantages of parylene, and applications for parylene to
protect electronic devices.
As technology continues to advance, devices will encounter rugged
environments and it is vital that they are properly protected. Parylene
conformal coating is one way that manufacturers are giving their devices
a higher level of protection, along with increasing the overall quality
of their products.
Parylene conformal coating applications for Electronics include:
· I/O & PCI Modules
· Power Converters and Supplies
· Other Embedded Computing applications
· Other specialty electronics and assemblies April 26, 2016Sponsored by Diamond-MT
XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016Sponsored by XwinSys Technology Development Ltd.