Packaging

MAGAZINE



PACKAGING ARTICLES



ALLVIA launches new product lines for Through Glass Vias and Through Quartz Vias

06/29/2016  ALLVIA, Inc. has expanded its capacity into glass and quartz via manufacturing to accommodate customer requests in via-fill technology from silicon interposers to glass and quartz interposers.

Tiniest imperfections make big impacts in nano-patterned materials

06/28/2016  A Clarkson University research team reports surprising findings that could have significant impact for constructing nano-patterned materials in electronic, magnetic or optical devices.

Ultratech receives multiple system, follow-on order for fan-out wafer-level packaging applications

06/28/2016  Ultratech's AP300 lithography systems will be used for next-generation, high-volume, fan-out wafer-level packaging applications.

Photovoltaic cells replicate rose petals

06/24/2016  With a surface resembling that of plants, solar cells improve light-harvesting and thus generate more power.

Process Watch: Process control and production cycle time

06/24/2016  In the early stages of development, having more process control can help reduce both the number and duration of cycles-of-learning (the iterations required to solve a particular problem).

Increased use of semiconductors in auto industry to boost global semiconductor capital equipment until 2020

06/23/2016  According to the latest market research report by Technavio, the global semiconductor capital equipment market is expected to reach $47.34 billion mark by 2020.

AI Technology, Inc. introduces temporary bonding adhesive for thin wafer handling

06/23/2016  For fan-out wafer-level packaging and 3D packaging, thin wafer handling is critical; the wafer must not warp, bend or shift during any wafer-processing steps.

Power transistors to see less volatility in second half of this decade

06/22/2016  Greater demand for energy efficiency in systems, cars, portable electronics, and new connections to the Internet of Things will steadily drive power transistor sales to new record-high levels in the next three years.

Building U.S. manufacturing ecosystems for emerging advanced packaging technologies

06/22/2016  Emerging opportunities for advanced packaging solutions for heterogeneous integration include a lot more than logic, memory and sensors.

Amkor Technology receives Qualcomm Technologies’ 2015 Supplier of the Year award

06/21/2016  Amkor Technology Inc., a provider of semiconductor packaging and test services, today announced it has received the Supplier of the Year award from Qualcomm Technologies, Inc.

Ultratech receives follow-on order from major Asian foundry for laser spike annealing system

06/21/2016  The LSA101 tool will be used to support the foundry's 28nm and 40nm production efforts, and Ultratech expects to ship the system in the third quarter of 2016.

EV Group scores fourth consecutive triple crown win in annual VLSIresearch customer satisfaction survey

06/21/2016  EV Group (EVG) today announced that, for the fourth successive year, it has earned all three awards resulting from VLSIresearch Inc.'s annual Customer Satisfaction Survey.

Dialog Semiconductor announces director appointment

06/17/2016  Dialog Semiconductor plc, a provider of highly integrated power management, AC/DC power conversion, solid state lighting (SSL) and Bluetooth low energy technology, today announced the appointment of Nick Jeffery to the company's Board of Directors.

MORE PACKAGING ARTICLES

TWITTER


WEBCASTS



Airborne Molecular Contamination Monitoring – Efficient Troubleshooting Techniques

July 28, 2016 at 10 AM MT / Sponsored by Particle Measuring Systems, Inc.

Decreasing the time to detect, contain and mitigate very low levels of Airborne Molecular Contamination (AMC) is critical for high tech manufacturers. Costs associated with AMC-related quality issues and yield losses are well understood, and adequate reduction of AMC is critical for clean manufacturers to stay competitive. Technical personnel need the flexibility to efficiently collect AMC data with good temporal-spatial resolution anywhere in the clean environment for both sustaining sample plans, as well as to collect site-specific data to converge on AMC sources during troubleshooting events. A brief overview of AMC will be presented along with the latest technology for efficiently identifying AMC sources in the cleanroom.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS