Packaging

MAGAZINE



PACKAGING ARTICLES



Nordson Corporation announces acquisition of MatriX Technologies GmbH

09/04/2015  Nordson Corporation today announced it has acquired Munich, Germany-based MatriX Technologies GmbH, a manufacturer of automated X-ray inspection (AXI) equipment used to ensure the quality of electronic printed circuit boards, critical electronic devices and fully assembled products in consumer, automotive and other industrial end markets worldwide.

Key industry leaders join The ConFab Advisory Board

09/04/2015  Solid State Technology is thrilled to announce that several key industry leaders have joined the Advisory Board for its annual conference and networking event, The ConFab.

Global semiconductor sales down slightly in July

09/04/2015  Softening demand, currency devaluation lead to slower sales.

QEOS and GLOBALFOUNDRIES to offer industry’s first CMOS platform for millimeter-wave markets

09/04/2015  QEOS, Inc., a designer of connectivity and sensing CMOS millimeter-wave (mmWave) solutions, and GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced they are partnering to co-develop the industry’s first mmW CMOS platform.

Asia-Pacific to dominate IC sales across system categories in 2015

09/04/2015  Europe to remain largest regional market for auto ICs, but Asia-Pacific gaining fast.

Automotive industry now the third largest end market for power semiconductors

09/03/2015  In 2014, the automotive sector significantly outperformed the overall market average for semiconductors.

CyberOptics demonstrates new WaferSense and ReticleSense Auto Multi Sensors

09/02/2015  CyberOptics Corporation, a global developer and manufacturer of high precision 3D sensing technology solutions, will demonstrate the first wireless sensor to combine leveling, vibration and Relative humidity (RH) measurement in an all-in-one device at SEMICON Taiwan in Taipei, September 2-4, 2015.

20th annual SEMICON Taiwan 2015 opens today

09/02/2015  SEMICON Taiwan 2015 opened today starting a three-day event drawing over 43,000 attendees from electronics manufacturing.

Wearables and bioelectronics seek better energy storage

09/01/2015  Energy storage players are eyeing emerging opportunities in bioelectronics as wearable, implantable and other medical devices create energy demands and design requirements beyond conventional batteries, according to Lux Research.

Tech, academic leaders call for robust research investments to bolster U.S. tech leadership, advance IoT

09/01/2015  A coalition of leaders from the tech industry and academia, led by the Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC), today released a report highlighting the urgent need for robust investments in research to advance the burgeoning Internet of Things (IoT) and develop other cutting-edge innovations that will sustain and strengthen America’s global technology leadership into the future.

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TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

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WEBCASTS



System Scaling and Integration Platforms for Mobile Devices and IoT

September 9, 2015 at 8:00 p.m. ET

In this presentation, recent developments in interconnects and packaging technologies that will enable mobile devices, and IoT will be discussed. Some of these packaging technologies include high density fan-out wafer level packaging, passive and active interposers, high throughput chip-on-wafer bonding, as well as wafer level chip scale packaging for MEMS and sensors.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015