Packaging

MAGAZINE



PACKAGING ARTICLES



An increasing number of healthcare applications is using bioMEMS components

05/27/2016  According to Yole Développement (Yole) analysts, this market will triple from US$2.7 billion in 2015 to US$7.6 billion in 2021.

MACOM launches new GaN power transistors

05/26/2016  MACOM Technology Solutions reported the newest entries in its MAGb series of GaN on Silicon power transistors for use in macro wireless basestations.

SEMICON West 2016 expands technical programming by nearly 50%

05/26/2016  As the opening day of SEMICON West (July 12-14) approaches, the electronics manufacturing industry is experiencing disruptive changes, making “business as usual” a thing of the past. To help technical and business professionals navigate this fast-changing landscape, SEMICON West programming has been upgraded extensively.

Communications, computer systems drive IC sales across all regions

05/25/2016  Automotive systems forecast to remain a major application in Europe and Japan.

NXP introduces new high performance GaN RF power transistors

05/25/2016  NXP Semiconductors N.V. today announced an expansion to its portfolio of 48V Gallium Nitride (GaN) RF power transistors optimized for Doherty power amplifiers for use in current and next-generation cellular base stations.

North American semiconductor equipment industry posts April 2016 book-to-bill ratio of 1.10

05/24/2016  North America-based manufacturers of semiconductor equipment posted $1.59 billion in orders worldwide in April 2016 (three-month average basis) and a book-to-bill ratio of 1.10.

Tessera files legal proceedings against Broadcom for patent infringement

05/24/2016  Tessera Technologies, Inc. announced today that it and certain of its subsidiaries filed legal proceedings for patent infringement in both domestic and international jurisdictions against Broadcom.

Imec and Holst Centre present multi-standard low-power wide-area radio chip

05/24/2016  The nanoelectronics research centers imec and Holst Centre (set up by imec and TNO), presented a low-power wide-area (LPWA) multi-standard radio chip today at imec's annual technology forum in Brussels (ITF Brussels 2016).

GLOBALFOUNDRIES releases performance-enhanced 130nm SiGe RF technology

05/23/2016  GLOBALFOUNDRIES today announced a next-generation radio-frequency (RF) silicon solution for its Silicon Germanium (SiGe) high-performance technology portfolio.

Synopsys' Custom Compiler enabled for Samsung Foundry's 14nm finFET process

05/20/2016  Synopsys, Inc. today announced that the company's Custom Compiler tool has been enabled by Samsung for 14 nanometer (nm) LPP and LPC FinFET production.

Fujitsu boosts efficiency of manufacturing processes at Shimane Fujitsu through IoT collaboration with Intel

05/19/2016  Fujitsu Limited today announced that it has with Intel Corporation carried out a field trial to visualize manufacturing processes at Shimane Fujitsu Limited.

IBM scientists achieve storage memory breakthrough

05/18/2016  For the first time, scientists at IBM Research have demonstrated reliably storing 3 bits of data per cell using a relatively new memory technology known as phase-change memory (PCM).

The CEA announces expanded collaboration with Intel

05/18/2016  The CEA (Atomic Energy Commission) and Intel are boosting their collaboration through a new R&D agreement signed in Paris on Thursday 12 May.

MORE PACKAGING ARTICLES

TWITTER


WEBCASTS



High Mobility Transistors

June 21, 2016 at 1 PM ET / Sponsored by Air Products

Transistor performance has been greatly improved with strained silicon and high-k metal gates. Further performance improvements could be had by implementing III-V materials in the channel of nMOS transistors. Both III-V and Ge-based channels being considered for the pMOS device. High electron-mobility III-V semiconductors have been intensely researched as alternative channel materials for sub-7 nm technology nodes, but one of the main stumbling blocks is how to integrate them monolithically and cost-effectively with traditional CMOS silicon technology. This webcast will discuss the latest efforts in this area, including vertically stacked III-V nanowire.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS