Packaging

PACKAGING ARTICLES



Many mixes to match litho apps

04/29/2016  The world’s leading lithographers gather each year in San Jose, California at SPIE’s Advanced Lithography conference to discuss how to extend optical lithography. So of all the NGL technologies, which will win out in the end?

Global Semiconductor Packaging Materials Market to grow at 4.79% CAGR from 2016-2020

04/29/2016  Research and Markets’ recent report, "Global Semiconductor Packaging Materials Market 2016-2020", expects the global semiconductor packaging materials market to grow at a CAGR of 4.79% during the period of 2016-2020.

Cartamundi, imec and Holst Centre win "Best Product" award at Printed Electronics Europe

04/27/2016  Cartamundi, imec and Holst Centre (set up by imec and TNO) are proud to announce to have just won the "Best Product" - Award at Printed Electronics Europe for their ultra-thin plastic RFID technology integrated into Cartamundi's playing cards.

Apple drove entire foundry sales increase at TSMC in 2015

04/26/2016  Without Apple, TSMC’s 2015 foundry sales would have dropped by 2% as compared to a 6% increase.

Latest advancements in sensor technology examined at SEMI European MEMS Summit

04/25/2016  SEMI today announced the second annual edition of the SEMI European MEMS Summit, dedicated to MEMS and sensors, to be held on September 15-16.

Cadence CFO Geoff Ribar to retire in March 2017

04/25/2016  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that, Geoff Ribar, senior vice president and chief financial officer, who joined the company in 2010, has decided to retire from Cadence effective March 31, 2017.

North American semiconductor equipment industry posts March 2016 book-to-bill ratio of 1.15

04/22/2016  Order activity remains steady and is on par with both the previous quarter and one year ago.

Park Systems' global expansion in AFM market includes appointment of new executives

04/20/2016  Park Systems announced today the appointments of Charlie Park as Senior Vice President of Global Sales, and Jong-Pil Park as Vice President of Production.

EU regulation update: What could impact the industry next?

04/20/2016  In a global industry, monitoring regulatory developments across different regions can be a challenge.

UW-Madison engineers fabricate fastest flexible silicon transistor

04/20/2016  Working in collaboration with colleagues around the country, University of Wisconsin-Madison engineers have pioneered a unique method that could allow manufacturers to easily and cheaply fabricate high-performance transistors with wireless capabilities on huge rolls of flexible plastic.

Semiconductor experts chart chip industry's future direction beyond the "Moore's Law" horizon

04/20/2016  Program unveiled for 2016 Symposia on VLSI Technology & Circuits – includes short courses, focus sessions, and panel discussions on "Inflections for a Smart Society" theme.

Sandia National Laboratories licenses ZiBond and DBI technologies

04/19/2016  Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., announced today that Sandia National Laboratories signed a new license agreement for ZiBond and Direct Bond Interconnect (DBI) technologies.

14 IC product categories to exceed total IC market growth in 2016

04/19/2016  Cellphone App MPUs and Signal Conversion top the list; Tablet MPU growth stalls, DRAM tumbles.

Extended supply chain presents exhibitors with new opportunities at SEMICON West

04/18/2016  Leading innovators in today's integrated electronics supply chain are preparing to showcase their products and services at SEMICON West 2016 on July 12-14 in San Francisco, Calif.

IEEE International Electron Devices Meeting announces 2016 Call for Papers

04/15/2016  The 62nd annual IEEE International Electron Devices Meeting (IEDM), to be held at the San Francisco Union Square Hilton hotel December 3 - 7, 2016, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

The advanced packaging industry has reached its zenith

04/14/2016  To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies.

Imec Technology Forum Brussels puts nanotechnology in the hot seat

04/13/2016  Imec, the nanoelectronics research center, today announced that its annual Imec Technology Forum (ITF) in Brussels will take place May 24-25, 2016 in Brussels, Belgium at SQUARE, Brussels Meeting Centre

Packaging materials: Strong growth rates for small form factors

04/13/2016  While much of the recent attention has been focused on the growth of wafer level packages (WLPs), specifically fan-out WLPs, this is not the only segment forecast to undergo strong unit growth.

Micron accelerates data center storage with new NVMe PCIe SSD portfolio

04/12/2016  Micron Technology, Inc. today announced a new portfolio of PCIe solid state drives (SSDs) that leverage the high-performance NVMe protocol.

Tech companies creating strategic platforms to support the Internet of Things

04/12/2016  IHS forecasts that the IoT market will grow from an installed base of 15.4 billion devices in 2015 to 30.7 billion devices in 2020 and 75.4 billion in 2025.




TWITTER


WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Trends in MEMS

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Fan-Out Wafer Level Packaging

May 2016 (Date and time TBD) / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
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TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS