Packaging

PACKAGING ARTICLES



ClassOne reports record sales, crediting WLP and "More than Moore"

12/07/2016  “We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt.

Five suppliers to hold 41% of global semiconductor marketshare in 2016

12/07/2016  Two years of busy M&A activity boost marketshare among top suppliers.

Stanford engineers find that a new memory technology may be more energy efficient than previously thought

12/07/2016  While exploring the atomic-level forces at play in a new type of computer chip, researchers found an energy-saving surprise that could translate into longer battery life for next-generation mobile devices.

Tessera completes acquisition of DTS

12/02/2016  Tessera Holding Corporation today announced it has completed the acquisition of DTS, Inc.

QuickLogic joins GLOBALFOUNDRIES FDXcelerator Partner Program

12/01/2016  QuickLogic Corporation, a developer of ultra-low power programmable sensor processing, display bridge and programmable logic solutions, today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program.

Synopsys completes acquisitions of Cigital and Codiscope

12/01/2016  Synopsys, Inc. has completed its acquisitions of Cigital, a privately held provider of software security managed and professional services, and Codiscope, a 2015 spinoff of Cigital and provider of complementary security tools.

ChipMOS and Tsinghua Unigroup agree to form joint-venture

11/30/2016  ChipMOS TECHNOLOGIES INC. and Tsinghua Unigroup Ltd. today announced an agreement to form a joint-venture and to mutually terminate Tsinghua Unigroup's earlier private placement plan.

SEMI adds industry veteran to Americas leadership

11/30/2016  David Anderson joins as SEMI Americas President.

IoT and automotive to drive IC market growth through 2020

11/30/2016  New report also projects good IC sales increases in medical electronics, digital TVs, and servers.

SATS market driven by increasing demand for high-end packaging solutions

11/22/2016  The SATS market is anticipated to have substantial growth mainly driven by the increasing costs for advanced packaging solutions, according to a report by Persistence Market Research.

Qualcomm, Samsung collaborate on 10nm process tech for the latest Snapdragon 835 mobile processor

11/17/2016  Qualcomm Incorporated today announced that its subsidiary, Qualcomm Technologies, Inc., and Samsung Electronics Co., Ltd., have extended their decade-long strategic foundry collaboration to manufacture Qualcomm Technologies' latest Snapdragon premium processor, Qualcomm Snapdragon 835, with Samsung's 10nm FinFET process technology.

UMC holds grand opening ceremony for new 12-inch wafer fab in China

11/16/2016  The fab, which was completed in record time, realized volume production for customer products merely 20 months after groundbreaking in March of 2015.

TriLumina appoints Brian Wong as president and CEO

11/16/2016  TriLumina Corp., a developer of semiconductor laser illuminators for solid-state LiDAR systems that enable autonomous vehicles and new automotive safety systems, announced that Brian Wong has been named as the company's new President and Chief Executive Officer and as a member of the board of directors.

Registration open for SEMICON Korea 2017's special 30-Year anniversary

11/16/2016  Celebrating its 30th anniversary, the largest-ever SEMICON Korea will be held from February 8 to 10, featuring 600 exhibiting companies and an expected 40,000 attendees at COEX, Seoul.

Mentor Graphics Signs Agreement with ARM to Accelerate Early Hardware/Software Development

11/16/2016  Mentor Graphics Corporation (NASDAQ: MENT) has signed a multiyear license agreement with ARM to gain early access to a broad range of ARM Fast Models, Cycle Models and related technologies.

Fueling the industry with innovation at SEMICON Japan 2016

11/15/2016  Today, SEMI announced that Innovation Village at SEMICON Japan 2016 has been expanded with participation by 31 start-up companies.

Synopsys advances test and yield analysis solution for 7nm process node

11/15/2016  Synopsys, Inc. today announced it expanded its test and yield analysis solution targeting FinFET-specific defects to enable higher quality testing, repair, diagnostics and yield analysis of advanced 7nm SoCs.

Siemens announces plans to acquire Mentor Graphics in $4.5B deal

11/14/2016  Siemens and Mentor Graphics today announced that they have entered into a merger agreement under which Siemens will acquire Mentor for an enterprise value of $4.5 billion.

Fan-in wafer-level packaging market to grow due to high demand for miniaturized electronics

11/11/2016  According to the latest market study released by Technavio, the global fan-in wafer-level packaging (WLP) market is expected to reach USD 4.75 billion by 2020, growing at a CAGR of almost 10%.

Smartphone unit shipments forecast to grow at single-digit rates through 2020

11/09/2016  IC Market Drivers 2017 analyzes end-use applications and impact on IC market growth.




TWITTER


WEBCASTS



Smartphone Market Driving 7nm & 5nm Node 3-D Transistors and Stacked Devices

December 15, 2016 at 1 p.m. ET / Sponsored by Versum Materials

The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.

Sponsored By:
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TECHNOLOGY PAPERS



Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



Industry Strategy Symposium 2017
Half Moon Bay, CA
http://www.semi.org/en/en/node/71404
January 08, 2017 - January 11, 2017
European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017

VIDEOS