Mentor Graphics announces collaboration with GLOBALFOUNDRIES

11/25/2015  Mentor Graphics Corp. announced it is collaborating with GLOBALFOUNDRIES to qualify the Mentor RTL to GDS platform, including the RealTime Designer physical RTL synthesis solution and Olympus-SoC place & route system, for the current version of the GLOBALFOUNDRIES 22FDX platform reference flow.

Silicon Labs acquires Telegesis, a provider of ZigBee modules

11/24/2015  A privately held company founded in 1998 and based near London, Telegesis has established itself as a ZigBee expert with strong momentum in the smart energy market, providing ZigBee module solutions to many of the world’s top smart metering manufacturers.

InvenSense CEO touts the Internet of Sensors

11/23/2015  InvenSense president and chief executive officer Behrooz Abdi sees the Internet of Things as an Internet of Sensors, a theme he explored Tuesday afternoon (November 17) at the opening of the fourth annual InvenSense Developers Conference.

InvenSense Developers Conference Tackles Sensor Security, New Technologies

11/23/2015  The second day of the InvenSense Developers Conference saw presenters get down to cases – use cases for sensors.

Highlights from Day 2 of IDTechEx Printed Electronics USA 2015

11/23/2015  IDTechEx Printed Electronics USA 2015, held in Santa Clara, CA Nov 18-19, is one mega conference with 8 co-located tracks ranging from sensor technology & wearables to IoT, energy harvesting & storage to electric vehicles, 3D printing and graphene.

Bookings and billings in semiconductor equipment industry weaken for second consecutive month

11/20/2015  North America-based manufacturers of semiconductor equipment posted $1.33 billion in orders worldwide in October 2015 (three-month average basis) and a book-to-bill ratio of 0.98.

Highlights from Day 1 of IDTechEx Printed Electronics USA 2015

11/19/2015  IDTechEx Printed Electronics USA 2015, held in Santa Clara, CA Nov 18-19, is one mega conference with eight co-located tracks ranging from sensor technology & wearables to IoT, energy harvesting & storage to electric vehicles, 3D printing and graphene.

SEMI Industry Strategy Symposium: Integrating market, technology and ecosystem growth

11/19/2015  Today, SEMI announced details about the SEMI Industry Strategy Symposium (ISS) on January 10-13 where semiconductor executives will discuss “Integrating for Growth: Markets, Technology, and Ecosystem” in Half Moon Bay, Calif.

Leti and partners announce developments on three mature platforms

11/18/2015  CEA-Leti and its partners in the European FP7 project PLAT4M today announced they have built three silicon photonics platforms.

Stacking instead of mixing

11/18/2015  A team from Jülich and Aachen has now found a way to control the desired conducting properties of this type of material more precisely and reliably than ever before.

Intel and ASM look to TCB

11/17/2015  Is there any question that TCB is real and will be the next big bonding technology? The focus this month is more on this very important new assembly process from Intel and ASM.

Europe’s secondary industry in the spotlight

11/17/2015  The dramatic shift from the trend for increasingly advanced technology to a vast array and volume of application-based devices presents Europe with a huge opportunity.

What lies beneath? 50 years of enabling Moore’s Law

11/17/2015  Vacuum technology trends can be seen over the period of innovation defined by Moore’s Law, particularly in the areas of increasing shaft speed, management of pumping power, and the use computer modeling.

Wafer bonding for high performance MEMS, power devices, and RF components

11/17/2015  Recent trends and future directions for wafer bonding are reviewed, with a focus on MEMS.

Photons on a chip set new paths for secure communications

11/16/2015  Researchers from RMIT University in Melbourne have helped crack the code to ultra-secure telecommunications of the future in an international research project that could also expedite the advent of quantum computing.

Wally Rhines of Mentor Graphics Gets Phil Kaufman Award

11/16/2015  The Phil Kaufman Award is presented by the Electronic Design Automation Consortium (EDAC) and the IEEE Council on Electronic Design Automation (CEDA). It honors the memory of Philip A. Kaufman, the EDA industry pioneer, electronics engineer, and entrepreneur, who died in 1992.

SEMICON Korea 2016: Connect to the future

11/13/2015  The theme for the January 27 through 29 exhibition at Seoul’s COEX is “Connect to the Future – Markets, Technology, and People.”

Cut costs: Improve competitive advantage

11/13/2015  Systematic – and predictive – cost reduction in semiconductor equipment manufacturing

Silicon shipment levels decline in third quarter 2015

11/13/2015  Worldwide silicon wafer area shipments decreased during the third quarter 2015 when compared to second quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Security by design

11/13/2015  The advent of Internet-connected devices, the so-called Internet of Things (IoT), offers myriad opportunities and significant risks. It is our collective responsibility, as an industry, to secure the transport and storage of the data. Failing to properly secure the data risks turning the digital threat into a physical threat.




Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

More Technology Papers


3D NAND Challenges and Opportunities

December 16, 2015 at 12:00 p.m. ET

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation will discuss this (r)evolution as well as its major scaling limitations.

Sponsored By:
IoT Device Trends and Challenges

January 2016 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015