Packaging

PACKAGING ARTICLES



IXYS announces 200V power MOSFETs with fast body diodes and lowest on-resistances

12/14/2017  Fabricated using a charge compensation principle and IXYS' own process technology, these new MOSFETs exhibit the lowest on-state resistances in the industry.

QuickLogic collaborates with Mentor to provide seamless design environment for eFPGA technology

12/14/2017  QuickLogic Corporation, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, display bridge and programmable logic solutions, announced that it has collaborated with Mentor, a Siemens business, to provide a seamless design and development environment for its embedded FPGA (eFPGA) technology.

4Q DRAM sales put exclamation point on an amazing year of growth

12/13/2017  Forecast for record quarterly DRAM sales of $21.1 billion, with 74% annual growth expected.

aveni extends copper interconnects to 5nm and below for BEOL integration

12/12/2017  aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node.

$55.9B semiconductor equipment forecast: New record with Korea at top

12/12/2017  Today, SEMI, the global industry association representing the electronics manufacturing supply chain, released its Year-end Forecast at the annual SEMICON Japan exposition.

EVG installs low-temp plasma activation system at the University of Tokyo

12/12/2017  EVG 810LT system enables low-temperature direct wafer bonding of III-V compound semiconductor materials and germanium-on-silicon wafers with field-proven high-quality plasma surface preparation.

Leti develops world's first micro-coolers for CERN particle detectors

12/11/2017  Leti, a research institute of CEA Tech, today announced it has created the world's first microfluidic circuit for cooling a particle detector, perhaps paving the way to a revolutionary, new detector technique at the Large Hadron Collider.

Leti memory breakthrough point way to significant improvements in SoC memories

12/08/2017  Leti, a research institute of CEA Tech, demonstrated significant improvements in the field of memory systems at IEDM 2017 this week.

3D acoustic images expand their usefulness

12/07/2017  3D acoustic imaging is useful for measuring the heights of bumps on BGAs, flip chips, and other devices. But it can also be used to image and quantify depth/height variation of features within a particular sample.

How to tame the electromagnetic interference in the fabs and beyond

12/07/2017  Electromagnetic interference (EMI) is an increasingly important topic across the global electronics manufacturing supply chain.

Global semiconductor sales increase 21.9% year-to-year in October

12/05/2017  October marked the global industry's largest-ever monthly sales total.

Solutions for controlling resin bleed out

12/05/2017  The hows and whys of resin bleed-out (RBO) are discussed, as well as the impact it makes and how to control it.

Reveal previously invisible defects and contaminants in advanced packaging applications

12/05/2017  A new illumination technology compares favorably to conventional bright field illumination.

Nambi Seshadri wins 2018 IEEE Alexander Graham Bell Medal

12/05/2017  Awarded for exceptional contributions to communications and networking sciences and engineering.

Researchers quantify factors for reducing power semiconductor resistance by two-thirds

12/05/2017  Discovery expected to lower energy consumption in electric power equipment.

SEMI reports record quarterly billings of $14.3B

12/05/2017  Quarterly billings of US$14.3 billion set an all-time record for quarterly billings, exceeding the record level set in the second quarter of this year.

ISS Europe 2018: Strategies and innovations to compete globally

12/01/2017  Electronics manufacturing executives will attend Europe’s SEMI Industry Strategy Symposium (ISS Europe) in Dublin, Ireland on 4-6 March.

Google’s head of Quantum AI Lab to keynote at The ConFab 2018

12/01/2017  The ConFab 2018, to be held at The Cosmopolitan of Las Vegas on May 21-23, is thrilled to announce the newest opening day Keynote speaker, Professor John M. Martinis.

Semiconductor industry continues upward trend toward record year

11/30/2017  The semiconductor industry continued its upward trend in the third quarter of 2017, notching 12 percent sequential growth with strength across all application markets, according to IHS Markit.

Soitec announces substrate breakthrough for 3D image sensing devices

11/30/2017  Soitec, a designer and manufacturer of semiconductor materials for the electronics industry, today announced the latest generation of silicon-on-insulator (SOI) substrates in its Imager-SOI product line designed specifically for fabricating front-side imagers for near-infrared (NIR) applications including advanced 3D image sensors.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


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VIDEOS