Packaging

PACKAGING ARTICLES



How low can we go?

07/11/2017  In the advanced CMOS technology programs ongoing in the Belgium city of Leuven, imec works to extend the building-blocks of integrated circuits (IC).

Meniscus-assisted technique produces high efficiency perovskite PV films

07/10/2017  A new low-temperature solution printing technique allows fabrication of high-efficiency perovskite solar cells with large crystals intended to minimize current-robbing grain boundaries.

SUNY Poly-led AIM Photonics and NY-Power Electronics Manufacturing Consortium to highlight research, collaboration at SEMICON West 2017

07/06/2017  Prominent New York State Tech Pavilion and Nanotech Summit at SEMICON West Exhibition to showcase innovation-based business growth opportunities

Busch COBRA BC achieves 12 year milestone at GlobalFoundries Fab 1

06/29/2017  Twelve years of continuous operation amounts to over 18.9 billion rotations.

Leti and Fraunhofer team up to strengthen microelectronics innovation in France and Germany

06/29/2017  Two European research institutes today announced their new collaboration to develop innovative, next-generation microelectronics technologies to spur innovation in their countries and strengthen European strategic and economic sovereignty.

Nonstop CMOS image sensor sales records seen through 2021

06/28/2017  Embedded imaging applications in cars, security, machine vision, medical, virtual reality, wearable systems, and other new uses will offset slow growth in camera phones, says O-S-D Report.

SEMI and Solid State Technology announce 2017 “Best of West” Award finalists

06/28/2017  Each year at SEMICON West, the “Best of West” awards are presented by Solid State Technology and SEMI.

It’s time for new innovation

06/20/2017  What if the automotive industry had achieved the incredible pace of innovation as the semiconductor industry during the last 52 years?

How SEMI Standard E175 is saving energy and cutting costs

06/20/2017  Industry experts answer questions about the new standard in a virtual roundtable.

Synopsys, GlobalFoundries collaborate to deliver design platform and IP enablement for 7nm finFET process

06/20/2017  Synopsys, Inc. today announced the enablement of the Synopsys Design Platform and DesignWare Embedded Memory IP on GLOBALFOUNDRIES 7nm Leading-Performance (7LP) FinFET process technology.

Cellphone IC sales will top total personal computing in 2017

06/20/2017  Higher memory prices accelerate sales growth in both cellphones and personal computing systems but cellular handsets will become the largest application for ICs this year.

What TechInsights analysts are watching in 2017

06/19/2017  TechInsights analysts share their view on where technology is going, how it’s changing, and what new developments are emerging.

GLOBALFOUNDRIES, ON Semiconductor deliver the industry's lowest power Bluetooth low energy SoC family

06/19/2017  GLOBALFOUNDRIES and ON Semiconductor (Nasdaq: ON) today announced the availability of a System-on-Chip (SoC) family of devices, on GF's 55nm Low Power Extended (55LPx), RF-enabled process technology platform.

The automotive electronics market: A view from a material supplier

06/16/2017  With the increasing sophistication of future vehicles, new and more advanced semiconductor technologies will be used and vehicles will become technology centers.

HPC, chiplets and interposers

06/15/2017  The need for ever more computational power continues to grow and exaflop (1018 ) capabilities may soon become necessary.

Advanced packaging brings more value and cost reduction to future semiconductor products

06/15/2017  Yole Developpement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth between 2016 and 2022: +7% in revenue.

GLOBALFOUNDRIES on track to deliver Leading-Performance 7nm FinFET technology

06/14/2017  GLOBALFOUNDRIES this week announced the availability of its 7nm Leading-Performance (7LP) FinFET semiconductor technology, delivering a 40 percent generational performance boost.

Breakthrough by Queen's University paves way for smaller electronic devices

06/14/2017  Queen's University Belfast researchers have discovered a new way to create extremely thin electrically conducting sheets, which could revolutionise the tiny electronic devices that control everything from smart phones to banking and medical technology.

Imec world-first to develop 200V, 650V dispersion free normally-off/e-mode power devices on 200mm/8-inch Si wafers

06/13/2017  Imec announced today that it has developed 200V and 650V normally-off/enhancement mode (e-mode) on 200mm/8-inch GaN-on-Silicon wafers.

The drive to smart manufacturing

06/09/2017  What does Smart Manufacturing mean for the future of the electronics manufacturing supply chain?




TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Wednesday, August 9, 2017 at 1 p.m. ET

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:
Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS