Packaging

PACKAGING ARTICLES



ROHM Semiconductor announces monolithic EDLC cell balancing IC

02/05/2015  ROHM recently announced the development of a cell balancing IC that contributes to increased miniaturization, greater stability, and longer life for EDLCs.

Imec introduces new snapshot hyperspectral image sensors with mosaic filter architecture

02/04/2015  At next week’s SPIE Photonics West 2015, imec will present a new set of snapshot hyperspectral CMOS image sensors featuring spectral filter structures in a mosaic layout, processed per-pixel on 4x4 and 5x5 ‘Bayer-like’ arrays.

SEMICON Show Highlights Chip Manufacturing in South Korea

02/04/2015  The SEMICON Korea conference and exhibition opens Wednesday in Seoul for a three-day run. The show highlights the importance of semiconductor manufacturing in South Korea, home to two of the biggest memory chip makers in the world, Samsung Electronics and SK Hynix.

The CMOS image sensors industry is about to change, with major investment in manufacturing & design

02/03/2015  Driven by mobile and automotive applications, the CIS industry is expected to grow at a CAGR of 10.6 percent from 2014 – 2020.

SEMICON Korea opens tomorrow: Korea IC manufacturing fueled by memory and mobility

02/03/2015  SEMICON Korea 2015 at COEX in Seoul opens tomorrow with more than 500 exhibiting companies and an expected 40,000 attendees.

Global semiconductor industry posts record sales in 2014

02/02/2015  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that the global semiconductor industry posted record sales totaling $335.8 billion in 2014, an increase of 9.9 percent from the 2013 total of $305.6 billion.

ClassOne acquires Microprocess Technologies product lines

02/02/2015  ClassOne Technology, the wet-chemistry semiconductor equipment manufacturer, has announced the acquisition of two complete product lines from Microprocess Technologies.

Status of the power electronics industry: It is now a question of integration

02/02/2015  According to Yole Développement’s team, wide band gap (WBG) technologies are almost ready to be used by power electronics integrators. The question is now: How?

New method allows for greater variation in band gap tunability

01/30/2015  If you can't find the ideal material, then design a new one.

Gov. Baker announces $4M grant to UMass Lowell to fuel emerging printed electronics cluster

01/29/2015  Gov. Charlie Baker today announced a $4 million dollar grant from the Massachusetts Technology Collaborative (“MassTech”) to UMass Lowell to support development of a printed and flexible electronics industry cluster, an emerging field that has the potential to become a $76 billion global market in the next decade.

New MES operations improvement software from critical manufacturing features integrated scheduling

01/28/2015  Critical Manufacturing, a supplier of integrated manufacturing execution systems (MES), introduces cmNavigo 4.0, the industry’s first comprehensive MES software with embedded finite scheduling.

"The Electrical Arts" and the First Trans-Atlantic Telegraph Cable

01/28/2015  Before there were electrical engineers and standard definitions for the ampere, ohm and volt, entrepreneurs and scientists in the United Kingdom and the United States worked on the issue of improving communications between the Old World and the New World.

2014 was bumper year for automotive semiconductors

01/27/2015  The automotive semiconductor market did exceptionally well in 2014, according to new analysis from IHS.

New Soitec eSI90 RF-SOI wafer improves RF performance of high-end smart phone components

01/26/2015  Soitec (Euronext) has introduced its eSI90 substrate, the newest high-end wafer in its radio-frequency silicon-on-insulator (RF-SOI) product family.

Emerging non volatile memory technological choices are about to be made: STTMRAM or MRAM?

01/26/2015  “The technological choice between STTMRAM/MRAM and RRAM will be made in the next two years,” announces the “More Than Moore” market research, technology and strategy consulting company, Yole Développement (Yole).

North American semiconductor equipment industry posts December 2014 book-to-bill ratio of 0.98

01/26/2015  North America-based manufacturers of semiconductor equipment posted $1.37 billion in orders worldwide in December 2014 (three-month average basis) and a book-to-bill ratio of 0.98, according to the December EMDS Book-to-Bill Report published today by SEMI.

EMCORE Corporation announces the appointment of Dr. Hank Blauvelt as Chief Technology Officer

01/23/2015  EMCORE Corporation, a provider of compound semiconductor-based components, subsystems and systems for the broadband and specialty fiber optics market, announced today the appointment of Dr. Hank Blauvelt to Chief Technology Officer for EMCORE Corporation, reporting to Chief Executive Officer, Jeffrey Rittichier.

Graphene enables all-electrical control of energy flow from light emitters

01/23/2015  Scientists from ICFO, MIT, CNRS, CNISM and Graphenea have now demonstrated active, in-situ electrical control of the energy flow from erbium ions into photons and plasmons.

Will new policy in China trigger big changes?

01/21/2015  In June 2014, the State Council of China issued the "National Guideline for the Development and Promotion of the IC Industry,” to support the domestic semiconductor industry. The document addresses development targets, approaches, and measures.

2015 outlook: Tech trends and drivers

01/20/2015  Leading industry experts provide their perspectives on what to expect in 2015. 3D devices and 3D integration, rising process complexity and “big data” are among the hot topics.




FINANCIALS



TECHNOLOGY PAPERS



How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON China 2015
Shanghai
http://www.semiconchina.org
March 17, 2015 - March 19, 2015
LED Taiwan 2015
Taipei, Taiwan
http://www.ledtaiwan.org/en/
March 25, 2015 - March 28, 2015
SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015