Packaging

PACKAGING ARTICLES



Silicon Innovation Forum to expand in 2014

03/13/2014  Coordinated by SEMI, the Silicon Innovation Forum is organized by leading strategic investment groups in the global semiconductor industry including: Applied Ventures, Dow Ventures, Intel Capital, Micron Ventures, TEL Venture Capital, BASF Ventures, and Samsung Ventures.

SanDisk files lawsuit against SK Hynix for theft of trade secrets

03/13/2014  These actions relate to the theft of trade secrets related to NAND flash technology by a former engineer of SanDisk who left the company in 2008 to work for SK Hynix.

Imec achieves record 8.4 percent conversion efficiency in fullerene-free organic solar cell

03/12/2014  In this week’s Nature Communications, imec presents the development of fullerene-free organic photovoltaic (OPV) multilayer stacks achieving a record conversion efficiency of 8.4 percent.

Advancing the Russian microelectronics industry — SEMICON Russia 2014

03/12/2014  On May 13-15, the key industry players, science institutes and innovation business representatives will gather in Moscow at SEMICON Russia — the premier Russian semiconductor exhibition and conference.

STATS ChipPAC introduces breakthrough manufacturing method for wafer level packaging

03/12/2014  STATS ChipPAC, a provider of advanced semiconductor packaging and test services, has designed and implemented an innovative new manufacturing method that is a significant paradigm shift from conventional wafer level manufacturing.

Samsung now mass producing the most advanced 4Gb DDR3 using 20nm process technology

03/11/2014  Samsung Electronics today announced that it is mass producing the most advanced DDR3 memory, based on a new 20nm process technology, for use in a wide range of computing applications.

Plug-and-play test strategy for 3D ICs

03/11/2014  Three-dimensional (3D) ICs, chips assembled from multiple vertically stacked die, are coming. They offer better performance, reduced power, and improved yield.

Big sell: IP Trends and Strategies

03/10/2014  Experts from Semico Research, Cadence, Uniquify and Sonics challenge growth trends for semiconductor intellectual property (SIP) with FinFETs, the IoT and more.

MACOM introduces new addition to GaN in Plastic series

03/07/2014  M/A-COM Technology Solutions Inc. (MACOM), a supplier of high performance RF, microwave, and millimeter wave products, introduced today its newest addition to the GaN in Plastic series.

The Week in Review: March 7, 2014

03/07/2014  University Research Award recipient; SEMI World Fab Forecast; Resesarchers develop Source-Gated Transistor; Global failure analysis equipment market increase; Industry revenues reach record high

Weaker yen impact on the 2013 material and equipment market size

03/06/2014  Semiconductor industry revenues reported by the World Semiconductor Trade Statistics (WSTS) reached a record high in 2013 with global revenues totaling over $305 million.

Micron appoints Darren Thomas as VP of Storage Business Unit

03/06/2014  Micron Technology, Inc. this week announced that Darren Thomas has been named as vice president of Micron's Storage business unit.

New research could help make "roll-up" digital screens a reality for all

03/06/2014  Researchers from the University of Surrey worked together with scientists from Philips to further develop the 'Source-Gated-Transistor' (SGT) - a simple circuit component invented jointly by the teams.

Samsung expands its 28nm technology offerings

03/06/2014  Samsung Electronics, Co., Ltd. today announced that it has expanded its 28nm technology offerings with the addition of RF capabilities.

Global failure analysis equipment market to grow at CAGR of 8.8% from 2013 to 2019

03/05/2014  Rapid growth in nanotechnology coupled with growth in medical applications in the Asia Pacific region has fueled the growth of failure analysis equipment market.

Moore's Law has stopped at 28nm

03/05/2014  While many have recently predicted the imminent demise of Moore’s Law, we need to recognize that this actually has happened at 28nm.

GlobalFoundries and Fraunhofer IIS to collaborate on EUROPRACTICE, Europe's MPW wafer shuttle program

02/26/2014  GLOBALFOUNDRIES and Fraunhofer Institute for Integrated Circuits IIS today announced the extension of their long-term collaboration, focusing on 40nm and 28nm processes. GLOBALFOUNDRIES will also join the European Multi Product Wafer (MPW) Program EUROPRACTICE.

Call for Papers open for SEMICON Europa 2014, Plastics Electronics Conference

02/24/2014  SEMI announced the “Call for Papers” for technical sessions and presentations for SEMICON Europa 2014 which takes place October 7-9 in Grenoble, France.

International Rectifier opens ultra-thin wafer processing facility in Singapore

02/24/2014  International Rectifier, IR, today announced that the company has commenced initial production at its new ultra-thin wafer processing facility in Singapore (IRSG).

North American semiconductor equipment industry posts January 2014 book-to-bill ratio of 1.04

02/21/2014  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.




FINANCIALS



TECHNOLOGY PAPERS



Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014