Packaging

PACKAGING ARTICLES



Texas Instruments names Devan Iyer Vice President

03/29/2016  Texas Instruments Incorporated (TI) announced that Devan Iyer has been elected vice president of the company.

How finFETs ended the service contract of silicide process

03/25/2016  A look into how the silicide process has evolved over the years, trying to cope with the progress in scaling technology and why it could no longer be of service to finFET devices.

Amkor announces shipment of 700M RF and advanced SiP modules

03/25/2016  Amkor Technology Inc. announced it has shipped 700 million RF and front-end advanced system-in-package (SiP) modules for mobile device applications.

India PC shipments grew 10.6% in fourth quarter of 2015

03/22/2016  PC shipments in India totalled nearly 2.6 million units in the fourth quarter of 2015, a 10.6 percent increase over the fourth quarter of 2014, according to Gartner, Inc.

3D Chips, New Packaging Challenge Metrology and Inspection Gear

03/21/2016  Metrology and inspection technology is growing more complicated as device dimensions continue to shrink. Discussing crucial trends in the field are Lior Engel, vice president of the Imaging and Process Control Group at Applied Materials, and Rudolph Technologies.

Molecular Modeling of Materials Defects for Yield Recovery

03/21/2016  New materials are being integrated into High Volume Manufacturing (HVM) of semiconductor ICs, while old materials are being extended with more stringent specifications.

Mentor Graphics Enhances Support for TSMC 7nm Design Starts and 10nm Production

03/17/2016  Mentor Graphics Corporation today announced further enhancements and optimizations to the Calibre® platform and Analog FastSPICE™ (AFS) platform by completing TSMC 10nm FinFET V1.0 certification.

Replacement for silicon devices looms big with ORNL discovery

03/17/2016  Two-dimensional electronic devices could inch closer to their ultimate promise of low power, high efficiency and mechanical flexibility with a processing technique developed at the Department of Energy's Oak Ridge National Laboratory.

Linde Supports New Wave of PV Plants in SE Asia

03/17/2016  The Linde Group supports the expansion of photovoltaic solar cell manufacturing in Southeast Asia by offering its full portfolio of gases and wet chemicals, along with engineering services, to help the new PV cell plants being established in the region.

New MEMS Design Contest Encourages Advances in MEMS Technology

03/16/2016  Jointly sponsored by Cadence Design Systems, Coventor, X-FAB and Reutlingen University, a new MEMS Design Contest is being launched at DATE 2016.

ARM and TSMC announce multi-year agreement to collaborate on 7nm FinFET process

03/16/2016  ARM and TSMC announced a multi-year agreement to collaborate on a 7nm FinFET process technology which includes a design solution for future low-power, high-performance compute SoCs.

Making electronics safer with perovskites

03/16/2016  Scientists in Japan are developing methods to manufacture safer ceramic capacitors.

SEMI reports 2015 global semiconductor equipment sales of $36.5B

03/15/2016  SEMI today reported that worldwide sales of semiconductor manufacturing equipment totaled $36.53 billion in 2015, representing a year-over-year decrease of 3 percent.

SEMICON China 2016 opens in Shanghai

03/14/2016  Over 50,000 attendees are expected at SEMICON China 2016 which opens tomorrow at Shanghai New International Expo Centre.

Mentor Graphics Adds Support for Integrated Fan-Out (InFO) Packaging Technology at TSMC

03/14/2016  Mentor Graphics Corporation today announced a design, layout, and verification solution to support design applications for TSMC’s Integrated Fan-Out (InFO) wafer-level packaging technology.

High-K precursors for ICs to reach ~$400M by 2020

03/14/2016  Chemical precursors (inorganic and organic) used to form high dielectric constant (High-K) materials, metals and metal nitrides needed in advanced ICs are forecasted to reach $400M USD in global sales by 2020, as highlighted in TECHCET’s 2016 Critical Materials Report.

SMIC and Crossbar announce strategic partnership agreement

03/11/2016  Semiconductor Manufacturing International Corporation and Crossbar, Inc. jointly announced today that they had signed a strategic partnership agreement on non-volatile RRAM development and production.

Multitest introduces mmWave Contactor

03/10/2016  Multitest successfully introduced a contacting solution for testing of extremely high frequency semiconductors in high volume production.

Thailand's semiconductor sector on-track to tap $280B global automotive electronics industry

03/09/2016  SEMICON SEA 2016 to feature Thailand specific forums and discussions.

CyberOptics and Nordson ink a strategic OEM supplier agreement for 3D MRS sensors

03/09/2016  CyberOptics today announced an OEM supplier agreement with Nordson YESTECH to supply its proprietary 3D Multi-Reflection Suppression (MRS) sensors.




TWITTER


WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
MEMS: Current Status and Future Directions

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

In 2015, the MEMS market did not grow as much as we initially expected. In the past, the Smart Phone industry was a strong driver of the MEMS industry with ever increasing volume. Today, MEMS are becoming commodity products with very low price. The webcast will review the latest market data and forecasts for the future. The MEMS “commoditization” paradox will be discussed as well as latest technical trends (sensors combos, packaging).

Sponsored By:
Fan-Out Wafer Level Packaging

May 26, 2016 at 1 PM ET / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
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TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS