Packaging

PACKAGING ARTICLES



Epoxy Technology and John P. Kummer Group announce a new specialty adhesive packaging company

02/20/2014  Epoxy Technology, Inc. and John P. Kummer Group announce the formation of a new specialty adhesive packaging company, Epoxy Technology Europe Ltd (ETEL).

Semiconductor industry posts record sales in 2013

02/20/2014  The Semiconductor Industry Association announced that worldwide semiconductor sales for 2013 reached $305.6 billion, the industry’s highest-ever annual total and an increase of 4.8 percent from the 2012 total of $291.6 billion.

The most expensive SRAM in the world - 2.0

02/20/2014  Embedded SRAM scaling is broken and, with it, Moore's Law.

World's first 79 GHz radar transmitter in 28nm CMOS

02/18/2014  Imec, in collaboration with Vrije Universiteit Brussel, Brussels, Belgium, presents the world’s first 79 GHz radar transmitter implemented in plain digital 28nm CMOS.

Breakthrough development in 1D-1R memory cell array

02/18/2014  Dr. Tae-Wook Kim at KIST announced their successful development of a 64-bit memory array using flexible and twistable carbon nano material and organo-polymer compound, which can accurately store and delete data.

Renesas Electronics develops industry's first 28nm embedded flash memory tech for microcontrollers

02/18/2014  Renesas Electronics Corporation today announced that it has developed the industry's first 28nm flash memory intellectual property (IP) for microcontrollers (MCUs) using a 28nm process technology.

Honeywell releases new RadLo low alpha plating anodes for semiconductor packaging applicatons

02/14/2014  Honeywell announced today that it has introduced new RadLo low alpha plating anodes based on proprietary technology to help reduce alpha particle radiation that can lead to data errors in semiconductors.

SPTS Technologies opens new office in Korea

02/13/2014  SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets today announced the opening of a new office in Korea.

EV Group unveils high-volume manufacturing photoresist processing system

02/11/2014  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing.

Executives debate innovation drivers and cost reduction in microelectronics supply chain

02/06/2014  The closing Executive Panel discussion at the SEMI Industry Strategy Symposium on January 15 provoked diverse views on the drivers and future of innovation in the microelectronics manufacturing supply chain.

Silicon reclaim wafer market increased 14% in 2013

02/06/2014  The worldwide reclaim wafer market is estimated at $460 million in 2013 and is forecasted to reach $493 million by 2015, according to SEMI.

The 2014 European 2.5/3DIC Summit

02/06/2014  SEMI’s second annual European 3D TSV Summit was held in Grenoble in late January. Three hundred and twenty attendees met to discuss the status of 2.5/3DIC and other advanced packaging technologies.

Experts At The Table: Commercial potential and production challenges for 3D NAND memory technology

02/06/2014  In this roundtable discussion focused on 3D NAND , we hear from Samsung Electronics (SE) in South Korea, Bradley Howard, Vice President of Advanced Technology Group, Etch Business Unit, at Applied Materials and Jim Handy from Objective Analysis.

Global wafer-level packaging equipment market to grow at a CAGR of 2.9

02/05/2014  Analysts at ReportsNReports.com forecast the global wafer-level packaging equipment market to grow at a CAGR of 2.9 percent over the period 2013-2018.

Research Alert: Feb. 4, 2014

02/04/2014  Diamond defect boosts quantum technology; Quantum dots provide complete control of photons; New theory may lead to more efficient solar cells

2014 capital spending up in Korea; SEMICON Korea to address mobile innovation

01/31/2014  With Korea expected to be the second largest region for fab construction spending in 2014, industry leaders will convene at SEMICON Korea 2014 in Seoul on February 12-14 to discuss the latest trends and technologies shaping the future of microelectronics manufacturing.

University of Strathclyde demonstrates world’s first continuously operating diamond Raman laser

01/31/2014  Achievements prove diamond’s viability as a material for solid-state laser engineering, even in the most demanding intracavity applications.

Novoset, LLC and Lonza introduce new, ultra-low dielectric loss and high temperature materials

01/30/2014  Novoset, LLC and Lonza are pleased to announce the introduction of Primaset ULL-950 and Primaset HTL-300 ultra-low loss and high temperature thermoset materials for the telecommunication and advanced semiconductor packaging industries.

New "photodetector" nanotechnology allows photos in near darkness

01/29/2014  Dark and blurry low light photos could soon be a thing of the past, thanks to the development of game-changing ultrathin “nanosheets,” which could dramatically improve imaging technology used in everything from cell phone cameras, video cameras, solar cells, and even medical imaging equipment such as MRI machines.

Crocus licences MLU technology to ARM

01/29/2014  Crocus Technology today announces it has licensed its Magnetic Logic Unit technology to ARM.




FINANCIALS



TECHNOLOGY PAPERS



Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014