Packaging

PACKAGING ARTICLES



SEMICON Japan 2015 opens tomorrow at Tokyo Big Sight

12/14/2015  SEMICON Japan 2015, an exhibition in Asia for semiconductor manufacturing and related processing technology, opens tomorrow at Tokyo Big Sight.

2016 bounce to modest gains

12/14/2015  After deflated 2015, 3D leads the way.

SEMI reports third quarter 2015 worldwide semiconductor equipment figures

12/11/2015  SEMI this week reported that worldwide semiconductor manufacturing equipment billings reached US$9.6 billion in the third quarter of 2015.

SEMI European 3D Summit: Beyond TSV in advanced ICs

12/11/2015  SEMI this week announced details about the fourth annual European 3D Summit.

Cellphones remain the largest driver of IC sales, but growth stalls

12/11/2015  The total production value of electronic systems is forecast to decrease 2% in 2015 to an estimated $1,423 billion, marking only the fourth time in history that the systems market registers a decline.

China Bolsters its IC Gear Business with Mattson Acquisition

12/10/2015  Mattson Technology agreed this month to be acquired by Beijing E-Town Dragon Semiconductor Industry Investment Center, a limited partnership in China, for about $300 million in cash.

Imec advances drive current in vertical 3D NAND memory devices

12/09/2015  At this week’s IEEE IEDM conference, nano-electronics research center imec showed for the first time the integration of high mobility InGaAs as a channel material for 3D vertical NAND memory devices formed in the plug (holes) with the diameter down to 45nm.

Fab equipment spending: Look for upward swing into 2016

12/09/2015  Worldwide semiconductor fab equipment capital expenditure growth (new and used) for 2015 is expected to be 0.5 percent (total capex of US$35.8 billion), increasing another 2.6 percent (to a total of $36.7 billion) in 2016, according to the latest update of the quarterly SEMI World Fab Forecast report.

Imec improves performance and reliability of deeply-scaled CMOS logic devices

12/09/2015  At this week’s IEEE International Electron Devices Meeting 2015, nano-electronics research center imec presented breakthrough results to increase performance and improve reliability of deeply scaled silicon CMOS logic devices.

Advanced lithography and electroplating approach to form high-aspect ratio copper pillars

12/08/2015  It is possible to fabricate copper pillars more than 100μm in height, with aspect ratios up to 6:1, using advanced packaging stepper lithography in conjunction with electroplating.

Variation in build-up substrate layer thicknesses and its impact on FCBGA BLR performance

12/08/2015  Subtleties in thicknesses between the alternating Cu metal and dielectric layers within a build-up substrate can impact BLR performance.

Leti develops local-strain techniques in FD-SOI fabrication to improve next-generation performance

12/08/2015  CEA-Leti today announced it has developed two techniques to induce local strain in FD-SOI processes for next-generation FD-SOI circuits that will produce more speed at the same, or lower, power consumption, and improve performance.

Smart Rock Bolt Wins Prize at Designers of Things Conference

12/07/2015  When it comes to Internet of Things products, most people would think of the Apple Watch or Fitbit fitness-tracking devices. A device aimed at the mining industry has proved to be a popular entry at the Designers of Things conference in San Jose, Calif.

CEA-Leti and CEA-Inac pave the way for quantum information processing on SOI CMOS platform

12/07/2015  CEA-Leti today announced preliminary steps for demonstrating a quantum bit, or qubit, the building block of quantum information, in a process utilizing a silicon-on-insulator (SOI) CMOS platform.

Leti to collaborate with Keysight Technologies to enable expansion of FD-SOI technology

12/07/2015  CEA-Leti today announced it has signed an agreement with Keysight Technologies, a device-modeling software supplier, to adapt Leti’s UTSOI extraction flow methodology within Keysight’s device modeling solutions for high-volume SPICE model generation.

Semiconductor sales: slight growth projected for next three years

12/07/2015  Market projected to grow by 0.2 percent in 2015, 1.4 percent in 2016, and 3.1 percent in 2017.

Mobile sector continues to dominate the advanced packaging market; IoT looms on the horizon

12/03/2015  Advanced packaging will reach 44% of packaging services and a revenue of US$ 30 billion by 2020.

IDMs could top fabless semiconductor company growth for only the second time in history

12/03/2015  Sales of top 10 IDMs forecast to be flat; top 10 fabless companies expected to slip into negative growth this year.

SEMI Foundation appoints Leslie Tugman as Executive Director

12/02/2015  SEMI Foundation, created by global industry association SEMI to support education and career awareness in the field of high-tech, has announced the appointment of Leslie Tugman as its executive director.

GaN Systems announces 10x production increase at TSMC

12/01/2015  GaN Systems, a manufacturer of gallium nitride power transistors, announces that its foundry, Taiwan Semiconductor Manufacturing Corporation (TMSC), has expanded the high volume production of products based on GaN System’s proprietary Island Technology by 10X in response to surging global demand from consumer and enterprise customers.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD) / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD) / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016