Packaging

PACKAGING ARTICLES



Wireless nanorod-nanotube film enables light stimulation of blind retina

12/03/2014  Breakthrough could lead to artificial retinas for visually impaired. Combining semiconductor nanorods and carbon nanotubes, it could potentially form part of a future prosthetic device that replaces damaged retinal cells.

AXSEM and SIGFOX announce ‘ultra-low-power’ System-on-Chip solution

12/03/2014  AXSEM, a developer of lowest-power radio microcontrollers, and SIGFOX, a developer of cost-effective, energy-efficient Internet of Things connectivity, today announced that AXSEM’s system-on-chip (SoC) with an AX8052 microcontroller has been certified SIGFOX Ready for two-way connectivity.

SEMI Industry Strategy Symposium to focus on changing supply chain ecosystem and directions for growth

12/03/2014  Microelectronics industry executives will convene at the SEMI Industry Strategy Symposium (ISS) on January 11-14 to discuss “Riding the Wave of Silicon Magic.”

Cypress and Spansion to merge in $4B all-stock transaction

12/03/2014  Cypress Semiconductor Corp. and Spansion, Inc. this week announced a definitive agreement to merge in an all-stock, tax-free transaction valued at approximately $4 billion.

Soitec announces new world record for solar cell efficiency at 46%

12/03/2014  The record multi-junction solar cell converts 46 % of the solar light into electrical energy.

Semiconductor equipment sales forecast: $38B in 2014 to nearly $44B in 2015

12/02/2014  SEMI projects that worldwide sales of new semiconductor manufacturing equipment will increase 19.3 percent to $38.0 billion in 2014, according to the SEMI Year-end Forecast, released today at the annual SEMICON Japan exposition.

SEMICON Korea focuses on breaking through the limitations of semiconductor technology

12/01/2014  Over 500 exhibiting companies from 20 countries and more than 40,000 attendees are expected to attend SEMICON Korea 2015, to be held February 4-6 at COEX in Seoul.

TSV based memory going to volume production: the era of 3DIC finally begins

12/01/2014  With the recent Samsung announcement of mass production of 64 GB DDR4 DIMMs that use TSV technology for enterprise servers and cloud-based applications, all three of the major DRAM memory manufactures, Samsung, Hynix and Micron, have now announced the commercialization of TSV based memory architectures.

Slideshow: IEDM 2014 Preview

11/26/2014  Browse for an advance look at some of the most newsworthy topics and papers to be presented at the 60th annual meeting, to be held at the Hilton San Francisco Union Square Hotel from December 15-17, 2014.

Applied Materials Introduces New Hardmask Process, Saphira

11/24/2014  A new hardmask material, called Saphira, and accompanying processes was introduced Applied Materials. The material, which is transparent and offers high selectivity and good mechanical strength, could reduce manufacturing costs by 35% per module.

Micron Technology CFO to retire in 2015

11/24/2014  Micron Technology, Inc. announced that Ronald C. Foster, Chief Financial Officer (CFO) and Vice President of Finance, will retire from Micron next year.

Hybrid Memory Cube Consortium releases new specification

11/24/2014  The Hybrid Memory Cube Consortium (HMCC), dedicated to the development and establishment of an industry-standard interface specification for Hybrid Memory Cube (HMC) technology, today announced the finalization and public availability of its HMCC 2.0 specification (HMCC 2.0).

North American book-to-bill report shows equipment order activity has moderated

11/21/2014  North America-based manufacturers of semiconductor equipment posted $1.10 billion in orders worldwide in October 2014 (three-month average basis) and a book-to-bill ratio of 0.93, according to the October EMDS Book-to-Bill Report published today by SEMI.

NFC IGZO TFT for Game Cards

11/20/2014  Holst Centre, imec, and Cartamundi work on flexible Near Field Communication tags embedded in paper cards.

European 3D TSV Summit 2015: Keynote speakers announced

11/19/2014  This week, SEMI announced the keynote speakers for the third edition of the European 3D TSV Summit, event that will take place on January 19-21, 2015 in Grenoble, France.

TSV integration is creating growth and significant interest in the equipment and materials industry

11/18/2014  The materials market will grow from $789M in 2013 to over $2.1B with a CAGR of 18%.

Notebook PC shipments rise year over year as tablet PCs decline

11/18/2014  Notebook PC growth was primarily driven by the developed regions of North America and Western Europe, which increased year-over-year shipments by more than 20 percent in the third quarter.

DuPont Microcircuit Materials introduces pure copper conductive ink

11/14/2014  DuPont Microcircuit Materials introduced its first pure copper conductive ink for photonic curing, DuPont PE510 copper conductor.

Intel CEO Brian Krzanich elected chairman of Semiconductor Industry Association

11/13/2014  The Semiconductor Industry Association (SIA) today announced that the SIA board of directors has elected Brian Krzanich, CEO of Intel, as its 2015 chairman and Dr. Necip Sayiner, president, CEO and director of Intersil, as its 2015 vice chairman.

Professors from UC Berkeley and UT Dallas honored for excellence in semiconductor research

11/13/2014  The Semiconductor Industry Association (SIA), in consultation with Semiconductor Research Corporation (SRC), today presented its University Research Award to professors from University of California, Berkeley and University of Texas at Dallas in recognition of their outstanding contributions to semiconductor research.




FINANCIALS



TECHNOLOGY PAPERS



Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



FinFETs

February 2015 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
LithoVision 2015
San Jose, California United States
https://www.nikonprecision.com/lithovision/
February 22, 2015 - February 22, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015