Packaging

PACKAGING ARTICLES



DRAM, NAND flash, automotive analog/logic among bestgrowing ICs

08/15/2017  Topping the chart of fastest-growing products is DRAM, which comes as no surprise given the strong rise of average selling prices in this segment throughout the first half of 2017.

Large wafers, complex IC designs among advanced packaging trends

08/15/2017  The global semiconductor advanced packaging market is expected to grow at a CAGR of 8.45% during the period 2017-2021, according to Research and Markets.

Vacuum subsystems: largest and fastest growing market segment

08/14/2017  The increase in vacuum process intensity of the semiconductor industry means that by 2022, the market for vacuum subsystems could be up to 62 percent higher than today’s value of $1.9 billion.

Samsung introduces far-reaching V-NAND memory solutions to tackle data processing and storage challenges

08/09/2017  Samsung Electronics Co., Ltd. has announced new V-NAND (Vertical NAND) memory solutions and technology that will address the pressing requirements of next-generation data processing and storage systems.

GLOBALFOUNDRIES demonstrates 2.5D high-bandwidth memory solution

08/09/2017  GLOBALFOUNDRIES today announced that it has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14 integrated design system for application-specific integrated circuits (ASICs).

Toshiba announces next generation client SSD with 64-layer 3D Flash memory

08/08/2017  Toshiba America Electronic Components, Inc. (TAEC) announces the new SG6 series, the latest Toshiba client SSD to feature 64-layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH to deliver better transfer speeds and power efficiency.

IntelliProp announces Gen-Z persistent memory controller combining DRAM and NAND

08/08/2017  This controller combines DRAM and NAND and sits on the Gen-Z fabric, not the memory bus.

Cadence full-flow digital, signoff and Verification Suite optimized to support Arm Cortex-A75, Cortex-A55 CPUs and Arm Mali-G72 GPU

08/07/2017  Cadence delivered new 7nm-ready Rapid Adoption Kits (RAKs) for the Cortex-A75 and the Cortex-A55 CPUs, which include the DynamIQ Shared Unit (DSU) that provides a shared level 3 cache between the CPUs, and a 7nm-ready RAK for the Mali-G72 GPU.

Worldwide semiconductor capital spending is forecast to grow 10.2% in 2017

08/07/2017  Worldwide semiconductor capital spending is projected to increase 10.2 percent in 2017, to $77.7 billion, according to Gartner, Inc.

NXP announces production of security chips in its US manufacturing facilities

08/04/2017  NXP Semiconductors N.V. announced a $22 million dollar program that expands its operations in the United States.

Mid-year global semiconductor sales up 21% compared to 2016

08/04/2017  Q2 sales are highest on record, 5.8 percent more than previous quarter, 23.7 percent higher than Q2 of last year.

Kuala Lumpur debut for SEMICON Southeast Asia in 2018

08/01/2017  SEMICON Southeast Asia will make its debut in Kuala Lumpur, Malaysia on May 8-10 at the new Malaysia International Trade & Exhibition Centre (MITEC).

Silicon wafer shortage starts in 2018

07/31/2017  TECHCET's model shows all slack soon gone from supply-chain for both 300mm and 200mm diameter.

The pervasiveness of ASICs in the IoT era

07/28/2017  For an increasing number of designs, companies are finding it beneficial to design their own ASICs with system-on-a- chip (SoC) complexity. For reasons of cost reduction, quality improvement, IP protection and security, a full turn-key ASIC can be achieved for $1-5 million, particularly if the design can be built using mature technology nodes.

What’s next in leading edge semiconductor manufacturing?

07/27/2017  Solid State Technology will be conducting a new survey will take aim at understanding what this evolution means to the semicon-ductor manufacturing industry supply chain in terms of the technology that will be needed.

Overcoming challenges in 3D NAND volume manufacturing

07/27/2017  As 3D NAND becomes the mainstream technology, its challenging roadmap poses opportunities for continued innovation.

Laser debonding for ultrathin and stacked fan out packages

07/27/2017  Fan-out packaging is an established technology for many mobile applications. Whereas early semiconductor packages have been single-chip packages, the continuing trend of expanding the wiring surface to support increased functionality has led to more complex packages, stacked packages, systems inpackageaswellashigh-performancepackages. With this development, fan-out technology is bridging a gap between cost-competitive packaging and high performance.

Dow Corning receives Global Supplier Award from Bosch

07/26/2017  Issued every two years, Bosch’s coveted awards recognize companies that have demonstrated outstanding performance in the manufacture and supply of products or services to Bosch.

North American semiconductor equipment industry posts June 2017 billings

07/26/2017  Through the first half of the year, 2017 equipment billings are 50 percent above the same period last year.

Second quarter 2017 silicon wafer shipments increase quarter-over-quarter

07/25/2017  Worldwide silicon wafer area shipments increased during the second quarter 2017 when compared to first quarter 2017 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



ITPC2017
Big Island, Hawaii
http://www.semi.org/en/itpc
November 05, 2017 - November 08, 2017
SEMICON Europa
Munich, Germany
http://www.semiconeuropa.org/
November 14, 2017 - November 17, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018

VIDEOS