Packaging

PACKAGING ARTICLES



Ultralow power transistors could function for years without a battery

10/21/2016  A new design for transistors which operate on 'scavenged' energy from their environment could form the basis for devices which function for months or years without a battery, and could be used for wearable or implantable electronics.

New perovskite solar cell design could outperform existing commercial technologies

10/21/2016  Stanford, Oxford team creates high-efficiency tandem cells.

Avalanche Technology announces the start of volume production of STT-MRAM on 300mm wafers

10/20/2016  Avalanche Technology, Inc., has entered into a manufacturing agreement with Sony Semiconductor Manufacturing Corporation to begin production of it's Spin Transfer Torque Magnetic RAM (STT-MRAM) on 300mm wafers at various advanced geometry nodes.

2016 IC market forecast raised from -2% to +1%

10/19/2016  Rebound in DRAM market helps raise outlook for total IC market.

SEMI Korea Members Day provides industry insights and networking

10/19/2016  SEMI Korea has hosted a SEMI member event every year for its members since 2008 to provide networking opportunities and insight on the ever-changing issues in the industry.

HSA Foundation announces new developments in heterogeneous systems architecture from Northeastern University

10/18/2016  The HSA Foundation has expanded its Academic Partnership Program with the addition of Northeastern University as the first HSA Academic Center of Excellence.

Samsung starts industry's first mass production of System-on-Chip with 10nm finFET technology

10/17/2016  Samsung Electronics Co., Ltd. today announced that it has commenced mass production of System-on-Chip (SoC) products with 10-nanometer (nm) FinFET technology for which would make it first in the industry.

Nanowires as sensors in new type of atomic force microscope

10/17/2016  A new type of atomic force microscope (AFM) uses nanowires as tiny sensors. Unlike standard AFM, the device with a nanowire sensor enables measurements of both the size and direction of forces. Physicists at the University of Basel and at the EPF Lausanne have described these results in the recent issue of Nature Nanotechnology.

Compact graphene-based plasmon generator developed by physicists from MIPT

10/17/2016  Russian and Japanese scientists demonstrate that compact coherent plasmon sources based on van der Waals heterostructures can be designed for use in optoelectronics.

Peregrine Semiconductor wins 2016 ECN IMPACT Award

10/14/2016  Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator), announces that the UltraCMOS PE42723 high linearity RF switch has won an ECN IMPACT Award in the market disruptor category.

The future of electronics at SEMICON Europa 2016

10/13/2016  SEMICON Europa 2016, opening in less than two weeks in Grenoble, will explore the issues facing Europe's semiconductor and electronics industries, including processes, materials, equipment and supply chain.

SMIC Shanghai starts construction of a new 12-inch wafer fab

10/13/2016  Semiconductor Manufacturing International Corporation, the largest and most advanced foundry in Mainland China, today held the groundbreaking ceremony of a new 12-inch wafer fab in Shanghai to meet SMIC Shanghai's increasing production and development needs.

Murata to acquire IPDiA

10/12/2016  Murata Manufacturing Co., Ltd. and IPDiA S.A. today announced that Murata Electronics Europe B.V., a wholly-owned subsidiary of Murata is about to acquire IPDiA, a 3D silicon capacitor technology developer headquartered in France, and IPDiA will become a subsidiary of Murata.

A novel battery design for making dual-ion batteries efficient

10/11/2016  Dual-ion batteries (DIBs) are a new type of battery developed in recent years, typically using graphite as both the cathode and anode material.

Mentor Graphics acquires Galaxy Semiconductor

10/10/2016  Mentor Graphics Corporation today announced that it has acquired Galaxy Semiconductor, a provider of test data analysis and defect reduction software for the semiconductor industry.

Thinfilm secures fabrication facility in Silicon Valley to house new roll-to-roll manufacturing line

10/07/2016  The company announced today that it has leased a former Qualcomm-owned manufacturing facility in Silicon Valley and will relocate its current US headquarters and NFC Innovation Center in the first quarter of 2017.

New sensor material could enable more sensitive readings of biological signals

10/07/2016  Scientists have created a material that could make reading biological signals, from heartbeats to brainwaves, much more sensitive.

3D TSV is for the development of heterogeneous interconnection, high end memory and performance applications

10/06/2016  This year again, both market segments, high end and low end, are the main targets of the TSV technologies providers.

Researchers use novel materials to build smallest transistor

10/06/2016  In the quest for faster and more powerful computers and consumer electronics, big advances come in small packages.

KLA-Tencor, Lam Research call off merger deal

10/06/2016  The parties decided to it was not in the best interests of their respective stakeholders to continue pursuing the merger after the U.S. Department of Justice advised KLA-Tencor and Lam Research that it would not continue with a consent decree that the parties had been negotiating.




TWITTER


WEBCASTS



Internet of Things

January 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
ISS Europe 2017
Munich, Germany
http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS