Packaging

PACKAGING ARTICLES



SPTS Technologies opens new office in Korea

02/13/2014  SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets today announced the opening of a new office in Korea.

EV Group unveils high-volume manufacturing photoresist processing system

02/11/2014  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing.

Executives debate innovation drivers and cost reduction in microelectronics supply chain

02/06/2014  The closing Executive Panel discussion at the SEMI Industry Strategy Symposium on January 15 provoked diverse views on the drivers and future of innovation in the microelectronics manufacturing supply chain.

Silicon reclaim wafer market increased 14% in 2013

02/06/2014  The worldwide reclaim wafer market is estimated at $460 million in 2013 and is forecasted to reach $493 million by 2015, according to SEMI.

The 2014 European 2.5/3DIC Summit

02/06/2014  SEMI’s second annual European 3D TSV Summit was held in Grenoble in late January. Three hundred and twenty attendees met to discuss the status of 2.5/3DIC and other advanced packaging technologies.

Experts At The Table: Commercial potential and production challenges for 3D NAND memory technology

02/06/2014  In this roundtable discussion focused on 3D NAND , we hear from Samsung Electronics (SE) in South Korea, Bradley Howard, Vice President of Advanced Technology Group, Etch Business Unit, at Applied Materials and Jim Handy from Objective Analysis.

Global wafer-level packaging equipment market to grow at a CAGR of 2.9

02/05/2014  Analysts at ReportsNReports.com forecast the global wafer-level packaging equipment market to grow at a CAGR of 2.9 percent over the period 2013-2018.

Research Alert: Feb. 4, 2014

02/04/2014  Diamond defect boosts quantum technology; Quantum dots provide complete control of photons; New theory may lead to more efficient solar cells

2014 capital spending up in Korea; SEMICON Korea to address mobile innovation

01/31/2014  With Korea expected to be the second largest region for fab construction spending in 2014, industry leaders will convene at SEMICON Korea 2014 in Seoul on February 12-14 to discuss the latest trends and technologies shaping the future of microelectronics manufacturing.

University of Strathclyde demonstrates world’s first continuously operating diamond Raman laser

01/31/2014  Achievements prove diamond’s viability as a material for solid-state laser engineering, even in the most demanding intracavity applications.

Novoset, LLC and Lonza introduce new, ultra-low dielectric loss and high temperature materials

01/30/2014  Novoset, LLC and Lonza are pleased to announce the introduction of Primaset ULL-950 and Primaset HTL-300 ultra-low loss and high temperature thermoset materials for the telecommunication and advanced semiconductor packaging industries.

New "photodetector" nanotechnology allows photos in near darkness

01/29/2014  Dark and blurry low light photos could soon be a thing of the past, thanks to the development of game-changing ultrathin “nanosheets,” which could dramatically improve imaging technology used in everything from cell phone cameras, video cameras, solar cells, and even medical imaging equipment such as MRI machines.

Crocus licences MLU technology to ARM

01/29/2014  Crocus Technology today announces it has licensed its Magnetic Logic Unit technology to ARM.

Cooling microprocessors with carbon nanotubes

01/28/2014  Researchers with the U.S. Department of Energy (DOE)’s Lawrence Berkeley National Laboratory (Berkeley Lab) have developed a “process friendly” technique that would enable the cooling of microprocessor chips through carbon nanotubes.

Slimpin promoted to director in SwRI’s Applied Physics Division

01/28/2014  David G. Slimpin has been promoted to director of the Electronics Systems and Robotics Department in the Applied Physics Division at Southwest Research Institute (SwRI). He was previously a program manager in the department.

Mobile PCs, smartphones will be top revenue opportunities for IC suppliers in high-speed wireless device market

01/27/2014  Mobile PCs and smartphones will represent the top revenue opportunities for high-speed wireless integrated circuit (IC) suppliers by 2018, as these devices are projected to be the highest-volume applications in this market over the next five years.

Apple and Samsung are top OEMs, again, in semiconductor spending for 2013

01/27/2014  Apple and Samsung remained the world’s largest buyers of semiconductor chips in 2013, but the intensifying battle between the two for the hearts and minds of consumers in their product offerings could presage another mighty showdown this year for the top ranking, according to a new report from IHS Technology.

Paradigm shift: Semi equipment tells the future

01/27/2014  Looking at the semi-equipment booking should be the first step in any attempt to assess future semiconductor trends.

Book-to-bill ratio continues to improve

01/24/2014  The December three-month average bookings were at the highest level since June 2012 — a positive sign for the 2014 spending outlook.

2014 Outlook: An era of unprecedented change

01/24/2014  We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.




FINANCIALS



TECHNOLOGY PAPERS



UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014