Packaging

PACKAGING ARTICLES



Cadence unveils expanded Virtuoso Advanced-Node Platform for 7nm processes

04/05/2017  Cadence Design Systems, Inc. today announced the release of the new Virtuoso Advanced-Node Platform supporting advanced 7nm designs.

A novel method for the fabrication of active-matrix 3-D pressure sensors

04/05/2017  A recent study, affiliated with UNIST has created a three-dimensional, tactile sensor that could detect wide pressure ranges from human body weight to a finger touch. This new sensor with transparent features is capable of generating an electrical signal based on the sensed touch actions, also, consumes far less electricity than conventional pressure sensors.

Carbon nanotubes self-assemble into tiny transistors

04/05/2017  University of Groningen scientists, together with colleagues from the University of Wuppertal and IBM Zurich, have developed a method to select semiconducting nanotubes from a solution and make them self-assemble on a circuit of gold electrodes.

Advanced packaging industry: What we could expect in 2017

04/04/2017  2016 was the year of strong consolidations in the semiconductor industry. Yole Developpement (Yole) highlights many mergers and acquisitions with several billions of dollars transactions.

Global semiconductor sales up 16.5% year-to-year

04/04/2017  Year-to-year sales increased by double digits across most regional markets, with the China and Americas markets showing particularly strong growth.

New business models emerging

04/01/2017  Jim Walker, who retired from Gartner and is now consulting as World Level Packaging Concepts, gave a plenary talk at the recent IMAPS Device Packaging Conference in Scottsdale on the state of the semiconductor industry which contained some interesting perspectives on emerging new business models.

The ConFab preview

04/01/2017  The agenda is set for The ConFab, to be held May 14-17, 2017 in San Diego at the iconic Hotel del Coronado.

IEEE unveils next lifecycle phase of the IRDS to drive computing industry beyond Moore’s Law

03/31/2017  Series of nine white papers mark milestone effort for strategic initiative that identifies challenges and solutions to help guide future roadmaps.

Global MRAM market to grow at an impressive CAGR of 94% through 2021, says Technavio

03/31/2017  Technavio market research analysts forecast the global MRAM market to grow at a CAGR of close to 94% during the forecast period, according to their latest report.

Semiconductor industry sets out research needed to advance emerging technologies

03/30/2017  New SIA-SRC report calls for robust research investments throughout the semiconductor industry and value chain.

IC Insights more than doubles its 2017 IC market growth forecast

03/30/2017  Huge spike in DRAM and NAND flash ASPs prompts market forecast revision to 11% increase.

Synopsys' IC Validator used for physical sign-off on more than 100 finFET production tapeouts

03/29/2017  Synopsys, Inc. today announced that its IC Validator physical verification product has been successfully used for signoff on more than 100 tapeouts at advanced FinFET nodes.

A big leap toward tinier lines

03/29/2017  Self-assembly technique could lead to long-awaited, simple method for making smaller microchip patterns.

Ultratech receives follow-on, multiple system orders from world's leading OSATs for advanced packaging applications

03/28/2017  Ultratech, Inc. today announced that it has received follow-on, multiple system orders from several outsourced semiconductor assembly and test (OSAT) companies in Taiwan, Korea and China.

Silego announces GFET3 integrated power switches in wafer level chip scale packaging

03/27/2017  Silego Technology, a developer of Configurable Mixed-signal Integrated Circuits (CMICs), announced today an extension of its performance-driven GFET3 Integrated Power Switch (IPS) portfolio.

​ATTOPSEMI Technology joins FDXcelerator Program

03/27/2017  ATTOPSEMI Technology, Ltd. today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program, to provide a scalable, non-volatile one-time programmable (OTP) memory IP to be compatible with GF's 22FDX technology.

Transphorm announces first automotive-qualified GaN FETs

03/27/2017  Transphorm Inc. announced that its second generation, JEDEC-qualified high voltage gallium nitride (GaN) technology is now the industry's first GaN solution to earn automotive qualification -- having passed the Automotive Electronics Council’s AEC-Q101 stress tests for automotive-grade discrete semiconductors.

Intel elects two new members to Board of Directors

03/23/2017  Intel Corporation today announced that Omar Ishrak and Greg Smith have been elected to Intel’s board of directors.

Mentor Graphics Team Receives the Harvey Rosten Award for Thermal Heatsink Optimization Methodology

03/23/2017  Mentor Graphics Corporation today announced that Dr. Robin Bornoff, Dr. John Parry and John Wilson, a team from Mentor Graphics Mechanical Analysis Division, received the Harvey Rosten Award for Excellence in thermal modeling and analysis of electronics.

European SEMI Award honors advanced packaging technologists

03/23/2017  At the SEMI Industry Strategy Symposium in Munich, SEMI announced recipients of the European SEMI Award for 2016.




TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Date and time TBD

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Microelectronics Tech Asia Singapore 2017
ITE College Center, Singapore
http://www.microelectronics.sg
July 04, 2017 - July 05, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017
SEMICON West 2017
San Francisco, CA
http://www.semiconwest.org
July 11, 2017 - July 13, 2017

VIDEOS