The ConFab 2018, to be held May 20-23 at The Cosmopolitan of Las Vegas, is a conference and networking event designed to inform and connect leading semiconductor executives from all parts of the supply chain. Now in its 14th year, it is produced by Solid State Technology magazine, the semiconductor industry’s oldest and most respected business publication.
The goal of The ConFab this year is to show how today’s semiconductor manufacturers and their suppliers can they best position themselves to take advantage of the tremendous growth the industry is expecting to see in the near future, propelled by a wide array of new applications, including artificial intelligence, virtual and augmented reality, automotive, 5G, the IoT, cloud computing and healthcare.
Here’s a quick look at the agenda as it stands now.
After a welcome reception on Sunday evening, we’ll kick things off on Monday with a talk by IBM’s Rama Divakaruni on “How A.I. is Driving the New Semiconductor Era.” Although A.I. (and associated deep learning and machine learning) is now in its infancy, it will likely to have a major impact on how semiconductors will be designed and manufactured in the future. A.I. will demand dramatic enhancement in computational performance and efficiency, which in turn will drive fundamental changes in algorithms, systems and chip design. Devices and materials will also change.
Following Rama’s talk, we’ll hear from John M. Martinis, Google who heads up Google’s Quantum A.I. Lab. The lab is particularly interested in applying quantum computing to artificial intelligence and machine learning.
After the keynote talks, we’ll hear from a number of industry visionaries, including John Hu, Director of Advanced Technology for Nvidia, Dan Armbrust, Founder and Director of Silicon Catalyst, and Tom Sonderman, President of Sky Water Technology Foundry. On Monday afternoon, invited industry experts, such as Bill Von Novak of Qualcomm will drill down into the applications most critical to semiconductor industry growth, including automotive, networking, healthcare and the IoT.
On Tuesday, the talks will focus on manufacturing trends and challenges with mainstream semiconductor manufacturing the focus of the morning session and advanced packaging the focus in the afternoon. George Gomba, VP of technology research at GlobalFoundries, will provide an update on EUV lithography, followed by Koukou Suu, of Ulvac, a leading expert on materials for phase change memories. Howard Witham, Vice President of Texas Operations, Qorvo, will provide some insights in using artificial intelligence and automation in semiconductor manufacturing.
The advanced packaging session on Tuesday afternoon is organized and sponsored by IEEE CPMT, notably Li Li, Distinguished Engineer, Cisco and William Chen, Fellow, ASE. The semiconductor industry is increased relying on advanced packaging to deliver far more integrated, complex and advanced solutions for different market segments.
On Wednesday, we’ll hear from leading analysts, including Len Jelinek, Senior Director, Semiconductor Manufacturing at IHS Markit, and Jim Feldhan, President of Semico, on market trends and the expected business climate moving forward.
You can register and keep up-to-date by visiting www.theconfab.com. For sponsorship inquiries, contact Kerry Hoffman at firstname.lastname@example.org. For those interested in attending as a guest or qualifying as a VIP, contact Sally Bixby at email@example.com.