Power Electronics

POWER ELECTRONICS ARTICLES



Multi-core, wireless, advanced materials top trends in industrial embedded systems market

11/21/2016  Technavio's latest report on the global industrial embedded systems market provides an analysis on the most important trends expected to impact the market outlook from 2016-2020.

Xaar and Lawter collaborate to deliver nanoink printing

11/10/2015  Xaar plc and Lawter announced a collaboration to optimize the performance of a line of nanosilver conductive inks in the Xaar 1002 industrial inkjet printhead.

UPDATED - Semiconductor Manufacturing: ASMC 2016 - Nov. 11 "call for papers" deadline

11/03/2015  SEMI announced today that the deadline for presenters to submit an abstract for the 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is November 2.

IDT to Acquire ZMDI for $310 Million

10/27/2015  Integrated Device Technology, Inc. announced an agreement to acquire privately held ZMDI for total consideration of $310M in cash.

Mentor Graphics updates Nucleus RTOS for Internet of Things and embedded connected devices

10/26/2015  Mentor Graphics Corporation announced an update to the Mentor (R) Embedded Nucleus (R) real time operating system (RTOS) targeting low power, next-generation applications for connected embedded and IoTdevices.

Slideshow: 2015 IEDM Preview

10/20/2015  An advance look at some of the most newsworthy topics and papers that will be presented at this year's IEEE International Electron Devices Meeting.

SEMICON Japan 2015: Lineup of speakers

10/16/2015  SEMI announced the lineup of speakers for SEMICON Japan's keynote stage, which focuses on key market and technology challenges and developments, and their impact on the semiconductor supply chain.

Scientists paint quantum electronics with beams of light

10/12/2015  Scientists from the University of Chicago and Penn State University accidentally discovered a new way of using light to draw and erase quantum-mechanical circuits in a unique class of materials called topological insulators.

JSAP research highlights - Power electronics: Silicon carbide gains traction

10/08/2015  Research reported in the Japanese Journal of Applied Physics by researchers at Mitsubishi Electric Corporation describes the development of a new power module made from a SiC metal-oxide-semiconductor field-effect transistor and a SiC Schottky barrier diode.

Leti joins GLOBALFOUNDRIES' ecosystem partners supporting 22FDX platform

10/07/2015  CEA-Leti announced that it has joined the GLOBALSOLUTIONS ecosystem as an ASIC provider, specifically to support GLOBALFOUNDRIES' 22FDX (TM) technology platform.

Altatech adds new high-speed inspection system dedicated to ultra-thin substrates for 3D applications

10/05/2015  Altatech announced the expansion of its Eclipse series with a new, high-speed inspection system dedicated to ultra-thin, transparent and bonded substrates inspection for 3D applications in power, MEMS, and mobile technologies.

SDK to Offer SiC Epitaxial Wafers with very low defect density

10/05/2015  Showa Denko has developed a new grade of silicon carbide (SiC) epitaxial wafers for power devices with very low defect density.

Outlook: Healthy equipment spending into 2015

09/10/2014  The general consensus for the semiconductor industry is for this year’s positive trend to continue into 2015 as both revenue growth and unit shipment growth are expected to be in the mid- to high- single digit range.

The semiconductor industry: Out in front, but lagging behind

09/10/2014  Capital equipment suppliers must provide advanced analytical systems that leverage data generated by their tools to help their fab customers address the challenges of Big Data and advanced analytics.

Equipment spending shows strong growth for 2014 and 2015

09/10/2014  Front End fab equipment spending is projected to increase up to another 20 percent in 2015 to US$ 42 billion.

A fundamental truth of process control

09/09/2014  You can’t fix what you can’t find. You can’t control what you can’t measure.

Rigorously tuned compact models: Extending predictive models to full-chip

09/09/2014  Fast and predictive 3D resist compact models are needed for OPC applications. A methodology to build such models is described, starting from a 3D bulk image, and including resist interface effects such as diffusion.

New Swedish manufacturer of advanced deposition equipment for wide band gap semiconductor materials

09/09/2014  A new company, Epiluvac AB, has entered the scene with the ambition to supply the needed deposition equipment.

GLOBALFOUNDRIES and SRC announce new scholarship for undergraduate engineering students

09/09/2014  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced the “GLOBALFOUNDRIES Undergraduate Research Scholarship,” a new scholarship recognizing and rewarding aspiring, leadership-oriented engineering students interested in careers in the semiconductor industry.




TWITTER


WEBCASTS



Smartphone Market Driving 7nm & 5nm Node 3-D Transistors and Stacked Devices

December 15, 2016 at 1 p.m. ET / Hosted by Solid State Technology

The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.

Sponsored By:

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TECHNOLOGY PAPERS



Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



Industry Strategy Symposium 2017
Half Moon Bay, CA
http://www.semi.org/en/en/node/71404
January 08, 2017 - January 11, 2017
European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017

VIDEOS