Power Electronics

POWER ELECTRONICS ARTICLES



Xaar and Lawter collaborate to deliver nanoink printing

11/10/2015  Xaar plc and Lawter announced a collaboration to optimize the performance of a line of nanosilver conductive inks in the Xaar 1002 industrial inkjet printhead.

New MEMS, Sensors Emerge at MEMS Executive Congress US

11/09/2015  A wide variety of microelectromechanical system (MEMS) devices, sensors, and MEMS sensors were described and introduced at the MEMS Executive Congress US in Napa, Calif.

MEMS, Sensors Poised for Growth in the Internet of Things Era

11/09/2015  Not all segments in MEMS and sensors are enjoying hockey-stick growth forecasts, as commoditization and pricing pressures take hold. This was just one of the insights gleaned at last week’s MEMS Executive Congress US 2015.

MEMS Executive Congress US Speaker Looks at MEMS Past, Present, and Future

11/04/2015  Much has changed in the world of microelectromechanical system (MEMS) devices in the past 20 years, and much more will change in the next two decades, said Steve Nasiri of Nasiri Ventures in his keynote address Wednesday (November 4) at the MEMS Executive Congress US conference in Napa, Calif.

UPDATED - Semiconductor Manufacturing: ASMC 2016 - Nov. 11 "call for papers" deadline

11/03/2015  SEMI announced today that the deadline for presenters to submit an abstract for the 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is November 2.

Practical Limits for Metallization Scaling in Fabs

11/02/2015  On-chip interconnects for ICs have evolved to meet different exacting needs, and the most advanced chips require multiple levels of copper (Cu) metal lines and via connections between transistors.

Meeting the IoT Design Challenge

11/02/2015  Mentor Graphics acquired Tanner EDA in March of 2015, in an effort to better address the design, layout and verification of analog/mixed-signal and MEMS ICs, key building blocks in the IoT. Since then, the Tanner team has moved offices and successfully been integrated into Mentor’s corporate structure.

IDT to Acquire ZMDI for $310 Million

10/27/2015  Integrated Device Technology, Inc. announced an agreement to acquire privately held ZMDI for total consideration of $310M in cash.

Mentor Graphics updates Nucleus RTOS for Internet of Things and embedded connected devices

10/26/2015  Mentor Graphics Corporation announced an update to the Mentor (R) Embedded Nucleus (R) real time operating system (RTOS) targeting low power, next-generation applications for connected embedded and IoTdevices.

Lam Research, KLA-Tencor to Combine in $10.6 Billion Deal

10/21/2015  Lam Research has agreed to acquire KLA-Tencor for $10.6 billion in cash and stock. The two giant suppliers of semiconductor capital equipment expect to close the transaction in mid-2016, subject to regulatory and shareholder approval.

Slideshow: 2015 IEDM Preview

10/20/2015  An advance look at some of the most newsworthy topics and papers that will be presented at this year's IEEE International Electron Devices Meeting.

Mentor Graphics Veloce VirtuaLAB Adds Next-Generation Protocols for Leading-edge Networking Designs

10/19/2015  Mentor Graphics Corp. today announced the Veloce® VirtuaLAB Ethernet environment with support for 25G, 50G and 100G Ethernet. This support enables highly efficient, emulation-based verification for the massive Ethernet-based designs being created today.

SEMICON Japan 2015: Lineup of speakers

10/16/2015  SEMI announced the lineup of speakers for SEMICON Japan's keynote stage, which focuses on key market and technology challenges and developments, and their impact on the semiconductor supply chain.

Scientists paint quantum electronics with beams of light

10/12/2015  Scientists from the University of Chicago and Penn State University accidentally discovered a new way of using light to draw and erase quantum-mechanical circuits in a unique class of materials called topological insulators.

Infineon CEO Says Robot Cars Will Drive Semiconductor Demand

10/12/2015  Infineon’s CEO, Reinhard Ploss, says that the autonomously driven cars of the future will create a large demand for a variety of new semiconductors and sensors.

JSAP research highlights - Power electronics: Silicon carbide gains traction

10/08/2015  Research reported in the Japanese Journal of Applied Physics by researchers at Mitsubishi Electric Corporation describes the development of a new power module made from a SiC metal-oxide-semiconductor field-effect transistor and a SiC Schottky barrier diode.

Leti joins GLOBALFOUNDRIES' ecosystem partners supporting 22FDX platform

10/07/2015  CEA-Leti announced that it has joined the GLOBALSOLUTIONS ecosystem as an ASIC provider, specifically to support GLOBALFOUNDRIES' 22FDX (TM) technology platform.

Mentor Graphics Tackles SoC Design Challenges

10/06/2015  System-on-a-chip designs are complex endeavors, and they are growing more complicated by the day. Mentor Graphics is cognizant of the many challenges in SoC design and is working to ease the troubles of chip designers.

Applied Materials Prospers in CMP, Deposition, Etch

10/06/2015  The company, founded in 1967, has a Silicon Systems Group which last year accounted for 66 percent of Applied's revenue. The SSG includes a number of other wafer fab equipment categories, such as epitaxy, ion implantation, metrology and wafer inspection, rapid thermal processing, and wet cleaning.




TWITTER


WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
MEMS: Current Status and Future Directions

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

In 2015, the MEMS market did not grow as much as we initially expected. In the past, the Smart Phone industry was a strong driver of the MEMS industry with ever increasing volume. Today, MEMS are becoming commodity products with very low price. The webcast will review the latest market data and forecasts for the future. The MEMS “commoditization” paradox will be discussed as well as latest technical trends (sensors combos, packaging).

Sponsored By:
Fan-Out Wafer Level Packaging

May 2016 (Date and time TBD) / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
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TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS