Power Electronics

POWER ELECTRONICS ARTICLES



Taking great ideas from the lab to the fab

08/05/2014  NSF and Intel support the development of domain-specific hardware to address health care needs.

Global semiconductor industry on pace for record sales through first half of 2014

08/05/2014  Sales up across every region and nearly all product categories compared to last year; Americas region shows strongest growth.

Atomic Layer Etch now in Fab Evaluations

08/04/2014  Lam’s CTO talks about the future of etch in beta-site tests.

TriQuint becomes first manufacturer to achieve MRL 9 for GaN

07/30/2014  TriQuint Semiconductor, Inc., a RF solutions supplier and technology innovator, announced that it is the first gallium nitride (GaN) RF chip manufacturer to achieve Manufacturing Readiness Level (MRL) 9.

A call to provide advanced equipment to growth companies

07/28/2014  Historically, the major semiconductor capital equipment manufacturers have focused on supporting the bigger semiconductor companies at the expense of the smaller ones.

Harnessing big data

07/28/2014  Addressing the analytics challenges in supply chain management.

Can lean innovation bring growth and profits back to semiconductors?

07/25/2014  New approaches to start-ups can unlock mega-trend opportunities.

Compact vibration harvester power supply with highest efficiency opens door to “Fix-and-Forget” sensor nodes

07/23/2014  OMRON and Holst Centre/imec have unveiled a prototype of an extremely compact vibrational energy harvesting DC power supply with worlds’ highest efficiency.

SEMI announces new South America Semiconductor Strategy Summit

07/22/2014  SEMI today announced the launch of the association's first-ever event in Latin America.

Allegro MicroSystems announces new silicon carbide Schottky barrier diode FMCA series

07/22/2014  Allegro MicroSystems, LLC announces the release of the next generation series of silicon carbide Schottky barrier diodes.

Power supply market to grow by $3.5B in four years

07/16/2014  The global market outlook for AC-DC and DC-DC power supplies is set for healthy expansion starting this year until at least 2018, with revenue during these four years projected to grow by $3.5 billion.

Sustainability through Materials Recovery

07/16/2014  Recovering and reusing materials is becoming an increasingly essential consideration in order to ensure consistent quality, a stable supply of materials, and lower costs. On- and off-site options are reviewed for helium, argon, sulfuric acid and Xenon.

IBM announces $3B research initiative

07/15/2014  IBM announced it is investing $3 billion over the next 5 years in two broad research and early stage development programs to push the limits of chip technology needed to meet the emerging demands of cloud computing and Big Data systems.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isn’t slowing down. But its steady acceleration isn’t happening spontaneously, and Tuesday’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.

The Connected Experience: A Manufacturer’s Dream?

07/09/2014  Imagine being able to not only track and address equipment degradation in real time, but also analyze patterns in your factories’ equipment and address potential issues before they even present a problem. It may sound too good to be true, but Microsoft’s Sanjay Ravi explained in Wednesday morning’s keynote that this innovation is becoming available now to manufacturers.

Trends in Next-Generation MEMS Discussed in TechXPOT Forum

07/09/2014  The microelectromechanical system (MEMS) device market is forecast to increase at a compound annual growth rate of 13 percent over the next five years, reaching $24 billion in 2019, according to Jean-Christophe Eloy, president and CEO of Yole Développement.

The End of Scaling?

07/09/2014  Are we reaching the end of scaling? Yes and no. Let me explain.




FINANCIALS



TECHNOLOGY PAPERS



How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON China 2015
Shanghai
http://www.semiconchina.org
March 17, 2015 - March 19, 2015
LED Taiwan 2015
Taipei, Taiwan
http://www.ledtaiwan.org/en/
March 25, 2015 - March 28, 2015
SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015