Power Electronics

POWER ELECTRONICS ARTICLES



200mm equipment market gaining new lease on life

06/16/2014  In 2004/2005, shipments of 300mm wafer fab equipment (WFE) began to outpace that of 200mm platforms.

Industry sustainability efforts mount with III-Vs and other advanced technologies

06/12/2014  The introduction of new materials, such as III-Vs, into high-volume manufacturing of semiconductors, likely will occur sometime around the 7nm and/or 5nm nodes.

Dow Corning launches power electronic industry's first SiC wafer grading structure

06/11/2014  Dow Corning today established a higher industry standard for silicon carbide (SiC) crystal quality by introducing a product grading structure that specifies ground-breaking new tolerances on killer device defects.

Wireless infrastructure drives RF power semiconductor markets to well over $1B in 2013

06/04/2014  Spending on RF power semiconductors for the wireless infrastructure markets has taken another jump in 2013.

First automotive MCU manufactured using GlobalFoundries' 55nm automotive-specific platform

06/04/2014  Scaleo chip, the fabless semiconductor company in automotive electronics for powertrain, body control and driver-information, has used the GLOBALFOUNDRIES 55nm eFlash NVM Platform to develop a new family of microcontrollers.

Synopsys, STMicroelectronics and Samsung to collaborate on adoption of 28nm FD-SOI technology

06/04/2014  Synopsys, Inc. today announced it has extended its collaboration with STMicroelectronics to include Samsung Electronics, enabling broader market adoption of ST's 28nm FD-SOI technology for SoC design.

Strengthening recovery: Fab equipment spending - 24% increase in 2014, possible record in 2015

06/04/2014  After two years of decline, fab equipment spending is expected to increase 24 percent in 2014 and about 11 percent (US$39.5 billion).

Osamu Nakamura named President of SEMI Japan

06/03/2014  Nakamura will succeed Yoichi Nakagawa, who is retiring from SEMI.

Global semiconductor leaders develop plan to promote worldwide industry growth

05/28/2014  The Semiconductor Industry Association (SIA) today announced that global semiconductor industry leaders reached an agreement at the 18th annual meeting of the World Semiconductor Council (WSC) last week on a series of policy proposals to strengthen the industry through international cooperation.

IEDM announces 2014 Call for Papers

05/28/2014  The 60th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

Top 10 power supply vendors vie in tumultuous market; rankings shift for the year

05/21/2014  The global market for AC-DC and DC-DC power supplies rose by a modest 2.4 percent last year, but much of this growth was limited to specific markets, leading to some substantial shifts in the rankings of major players.

ON Semiconductor introduces new family of low voltage power MOSFETs

05/20/2014  ON Semiconductor has introduced a new family of six N-channel MOSFETS that have been designed and optimized to deliver efficiency.

Increase in first quarter 2014 silicon wafer shipments

05/20/2014  Worldwide silicon wafer area shipments increased during the first quarter 2014 when compared to fourth quarter 2013 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

SMIC and other groups collaborate to setup the "IC Advanced Technology Research Institute"

05/19/2014  China's, largest and most advanced semiconductor foundry, today announced that SMIC, Wuhan Xinxin, Tsinghua University, Beijing University, Fudan University and the Chinese Academy of Sciences and Microelectronics have collaborated to setup the "IC Advanced Technology Research Institute" to create the most advanced IC technology research and development institution in China.

Domestic outsourcing: A key component in successful reshoring

05/16/2014  After nearly a quarter of a century, the off-shoring manufacturing trend that decimated the U.S. manufacturing sector and played a significant role in the slow pace of the current economic recovery seems to be ending.

Improving financial predictability – is it chasing a mirage?

05/15/2014  There is continued evidence that despite spending several millions on IT transformations, improving internal planning processes, maturing supply chains, and streamlining product development processes- several companies still struggle with predicting their financial and operational performance.

New policy helps combat counterfeit semiconductors

05/14/2014  A newly finalized Department of Defense (DoD) rule reduces the risk of counterfeit semiconductor products being used by our military by implementing needed safeguards in the procurement of semiconductors and other electronic parts.

Transphorm obtains exclusive licensing rights to Furukawa Electric's GaN patent portfolio

05/14/2014  Transphorm Inc. today announced that it has obtained a sole worldwide license to Furukawa Electric Co., Ltd.'s extensive Gallium Nitride (GaN) power device portfolio that includes approximately 40 U.S. issued patents and 110 Japanese issued patents.

Element Six's GaN-on-diamond wafers proven to provide three times improvement in power density in RF devices

05/14/2014  Element Six today announced that its Gallium Nitride (GaN)-on-Diamond wafers have been proven by Raytheon Company to significantly outperform industry standard Gallium Nitride-on-Silicon Carbide (GaN-on-SiC) in RF devices.

Mentor Graphics launches MicReD industrial power tester for power cycle testing of electronic components

05/13/2014  Mentor Graphics Corporation today announced the new MicReD Industrial Power Tester 1500A for power cycling and thermal testing of electronics components to simulate and measure lifetime performance.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Advanced Packaging

September 2015 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
http://www.semiconjapan.org/en/
December 16, 2015 - December 18, 2015