Process Materials

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PROCESS MATERIALS ARTICLES



Engaging diamond for next-era transistors

05/22/2017  Materials scientists in Japan have developed a new diamond transistor fabrication process that promises to advance the development of more robust and energy-efficient electronics.

Next-gen solar cells could be improved by atomic-scale redesign

05/15/2017  Researchers have uncovered the exact mechanism that causes new solar cells to break down in air, paving the way for a solution.

Hafnia dons a new face

05/12/2017  As computer chips become smaller, faster and more powerful, their insulating layers must also be much more robust -- currently a limiting factor for semiconductor technology. A collaborative University of Kentucky-Texas A&M University research team says this new phase of hafnia is an order of magnitude better at withstanding applied fields.

Soitec names new VP of Strategic Business Development in China

05/11/2017  Soitec, a designer and manufacturer of semiconductor materials for the electronics industry, has appointed Stephen Lin to the newly created position of vice president of strategic business development in China, a key region for the company's future growth plans.

At last: Beautiful, consistent carbon belts

05/11/2017  Synthesis of a carbon nanobelt with potential applications in nanotechnology.

Chemically tailored graphene

05/09/2017  Graphene is considered as one of the most promising new materials. However, the systematic insertion of chemically bound atoms and molecules to control its properties is still a major challenge. Now, for the first time, scientists of the Friedrich-Alexander-Universität Erlangen-Nürnberg, the University of Vienna, the Freie Universität Berlin and the University Yachay Tech in Ecuador succeeded in precisely verifying the spectral fingerprint of such compounds in both theory and experiment.

'Persistent photoconductivity' offers new tool for bioelectronics

05/03/2017  Researchers at North Carolina State University have developed a new approach for manipulating the behavior of cells on semiconductor materials, using light to alter the conductivity of the material itself.

Discovery of new PVD chalcogenide materials for memory applications

04/28/2017  A case study is presented based on the use of high throughput experimentation (HTE) for the discovery of new memory materials.

Wonder material? Novel nanotube structure strengthens thin films for flexible electronics

04/24/2017  Reflecting the structure of composites found in nature and the ancient world, researchers at the University of Illinois at Urbana-Champaign have synthesized thin carbon nanotube (CNT) textiles that exhibit both high electrical conductivity and a level of toughness that is about fifty times higher than copper films, currently used in electronics.

Conax Technologies announces the acquisition of Arizona-based Quartz Engineering

04/24/2017  Conax Technologies announced the acquisition of Quartz Engineering, a manufacturer of quartz sheaths for temperature sensors headquartered in Tempe, AZ.

Avantor acquires Puritan Products

04/21/2017  Avantor Performance Materials, LLC, announced today the acquisition of Puritan Products, Inc., a supplier of cGMP buffers and solutions for Biopharma customers, and high-purity chemistries for Research and Electronic Materials customers.

New ClassOne chamber cuts copper plating costs 95%

04/20/2017  ClassOne Technology announced it's new CopperMax chamber -- a design that is demonstrating major copper plating cost reductions for users of ≤200mm wafers.

Brewer Science earns GreenCircle Certification for zero waste to landfill for second consecutive year

04/19/2017  Brewer Science announced the achievement of Zero Waste to Landfill Certification for the second consecutive year.

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TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

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TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

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