Process Materials

MAGAZINE



PROCESS MATERIALS ARTICLES



Breakthrough with a chain of gold atoms

02/17/2017  In the field of nanoscience, an international team of physicists with participants from Konstanz has achieved a breakthrough in understanding heat transport.

'Lossless' metamaterial could boost efficiency of lasers and other light-based devices

02/17/2017  Engineers at the University of California San Diego have developed a material that could reduce signal losses in photonic devices.

A new spin on electronics

02/15/2017  Information transport by spin as an alternative to conventional computing technology.

Turning up the heat for perfect (nano)diamonds

02/14/2017  Researchers are taking rough, defective diamonds and using high temperatures to perfect them for quantum sensing.

A new platform to study graphene's electronic properties

02/13/2017  IBS scientists model the electronic structure of graphene.

A new sensitive and stable self-powered photodetector

02/10/2017  Researchers in Singapore and China collaborate to create new photodetector based on GdNiO3/Nb-doped SrTiO3 p-n heterojunction.

Penn researchers are among the first to grow a versatile 2-dimensional material

02/09/2017  University of Pennsylvania researchers are now among the first to produce a single, three-atom-thick layer of a unique two-dimensional material called tungsten ditelluride.

Intel announces $7B investment in next-gen semiconductor fab in Arizona

02/09/2017  The announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House.

UNIST to engineer dream diodes with a graphene interlayer

02/08/2017  A team of researchers, affiliated with UNIST has created a new technique that greatly enhances the performance of Schottky Diodes (metal-semiconductor junction) used in electronic devices.

UNIST engineers oxide semiconductor just single atom thick

02/08/2017  A new study, affiliated with UNIST has introduced a novel method for fabrication of world's thinnest oxide semiconductor that is just one atom thick. This may open up new possibilities for thin, transparent, and flexible electronic devices, such as ultra-small sensors.

NREL research pinpoints promise of polycrystalline perovskites

02/07/2017  A team of scientists from the Energy Department's National Renewable Energy Laboratory (NREL) determined that surface recombination limits the performance of polycrystalline perovskite solar cells.

Annual silicon volume shipments remain at record highs

02/07/2017  Revenues continue to be under pressure.

Towards new IT devices with stable and transformable solitons

02/06/2017  Multi-digit systems, solitonics and brain-like machines

MORE PROCESS-MATERIALS ARTICLES

TWITTER


WEBCASTS



Internet of Things

February 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
ISS Europe 2017
Munich, Germany
http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017

VIDEOS