Process Materials


The ConFab 2018 announces conference agenda and speakers

03/16/2018  Browse this slideshow for a look at this year's speakers, keynotes, panel discussions, and special guests.

Chemists use abundant, low-cost and non-toxic elements to synthesize semiconductors

03/15/2018  Javier Vela of Iowa State University and the Ames Laboratory has worked with two of his graduate students to synthesize a new material for semiconductors. The chemists think the material will work well in solar cells, but without the toxicity, scarcity or costs of other semiconductors. They report their discovery in a paper recently published online by the Journal of the American Chemical Society.

Si2 approves two IC design simulation standards for fast-growing gallium nitride market

03/14/2018  The Silicon Integration Initiative's (Si2) Compact Model Coalition (CMC) has approved two integrated circuit design simulation standards that target the fast-growing global market for gallium nitride semiconductors.

Flat gallium joins roster of new 2-D materials

03/12/2018  Scientists at Rice University and the Indian Institute of Science, Bangalore, have discovered a method to make atomically flat gallium that shows promise for nanoscale electronics.

UCLA researchers develop a new class of two-dimensional materials

03/09/2018  New kinds of 'superlattices' could lead to improvements in electronics, from transistors to LEDs.

Simulation and experiment help TU Dresden researchers study next-generation semiconductors

03/08/2018  Theoretical physicists and experimentalists collaborate to identify dopants capable of enabling new designs of semiconducting materials.

Linde LienHwa announces investment commitment in China and additional new special gas production in Taiwan

03/07/2018  Linde LienHwa, a key supplier of gases and chemicals to the electronics industry, continues to invest with its customers in Mainland China and Taiwan.

Researchers reshape the energy landscape of phonons in nanocrystals

03/07/2018  Light and vibrations intertwine inside a nanoscale cavity.

Materials 'sandwich' breaks barrier for solar cell efficiency

03/05/2018  NYU Tandon Professor André D. Taylor's research team combines materials and borrows lessons from nature to build a better organic solar cell.

Executive viewpoints: 2018 outlook

03/05/2018  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

Mining hardware helps scientists gain insight into silicon nanoparticles

03/02/2018  Researchers first developed a three-dimensional dynamic model of an interaction between light and nanoparticles.

Practical spin wave transistor one step closer

03/02/2018  University of Groningen physicists have managed to alter the flow of spin waves through a magnet, using only an electrical current.

Experimentally demonstrated a toffoli gate in a semiconductor three-qubit system

02/28/2018  A new progress in the scaling of semiconductor quantum dot based qubit has been achieved at Key Laboratory of Quantum Information and Synergetic Innovation Center of Quantum Information & Quantum Physics of USTC.

Phase-transition cubic gallium nitride doubles ultraviolet emission efficiency

02/20/2018  Novel photonics materials are becoming pivotal for energy conversion, communications, and sensing, largely because there is a global desire to enhance energy efficiency, and reduce electricity consumption.

Precision experiments reveal gaps in van der Waals theory

02/16/2018  Experiments reveal the inadequacies of theory for modelling two-dimensional (2-D) van der Waals materials.

Engineers develop smart material that changes stiffness when twisted or bent

02/15/2018  A new smart and responsive material can stiffen up like a worked-out muscle, say the Iowa State University engineers who developed it.

Graphene on toast, anyone?

02/13/2018  Rice University scientists create patterned graphene onto food, paper, cloth, cardboard.

Scientists observe nanowires as they grow

02/08/2018  X-ray experiments reveal exact details of self-catalyzed growth for the first time.

Entegris' strong fourth-quarter caps record year

02/07/2018  Entegris, Inc. (NasdaqGS: ENTG), a developer of specialty chemicals and advanced materials solutions for the microelectronics industry, today reported its financial results for the Company’s fourth quarter and fiscal year ended December 31, 2017.



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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