ARTICLES



CSTIC and SEMICON CHINA 2018: Brooks Instrument to present new mass flow controller with self-diagnostics​

02/09/2018  Brooks Instrument will showcase its newly enhanced GF125 mass flow controller (MFC) with high-speed EtherCAT connectivity and embedded self-diagnostics at the China Semiconductor Technology International Conference (CSTIC) in conjunction with SEMICON China 2018 in Shanghai.

Leak check semiconductor process chambers quickly and reliably

02/08/2018  INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams to easily check the tightness of vacuum chambers for wafer production.

OEM Group announces post-dice clean solutions for plasma and laser dicing methods

09/28/2017  OEM Group announced today a post-dice clean solution on the proven Cintillio Batch Spray platform following plasma and laser dicing methods.

Understanding the impact of valve flow coefficient (Cv) in fluid systems

09/26/2017  Understanding the impact of valve flow coefficient (Cv) in fluid systems for microelectronics manufacturing.

New deionized water vapor delivery module from Brooks Instrument

09/11/2017  Brooks Instrument will be exhibiting at SEMICON Taiwan 2017 with a new vaporization product, mass flow controllers with high-speed EtherCAT, and a broad range of other mass flow meters, controllers and capacitance manometers for semiconductor manufacturing.

ALD tools evolve with industry needs

07/13/2017  Veeco Instruments (Veeco) recently announced that Veeco CNT -- formerly known as Ultratech/Cambridge Nanotech -- shipped its 500th Atomic Layer Deposition (ALD) system to the North Carolina State University.

EV Group optimizes resist and lithographic processing for plasma dicing

06/20/2017  EVG resist processing and lithography systems provide pre-processing solution to enable complete damage-free advanced dry plasma dicing on thin semiconductor wafers.

New prospects for universal memory -- high speed of RAM and the capacity of flash

06/16/2017  Thin films created at MIPT could be the basis for future development of ReRAM.

ClassOne initiative aims to reduce CoO in ≤200mm copper plating

02/22/2017  ClassOne Technology announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.

Murphy, Choh and Pilla join ClassOne Technology's Board of Advisors

12/01/2016  ClassOne Technology, manufacturer of advanced wet processing equipment for ≤200mm substrates, announced the formation of a Board of Advisors.

Managing particle flows in process exhaust for safety and profitability

10/28/2016  Solid particles in the abatement exhaust must be properly managed, and in some cases, substantially reduced from the gas stream before it is released into the environment.

Lam Research introduces dielectric atomic layer etching capability for advanced logic

09/07/2016  Lam Research Corp., an advanced manufacturer of semiconductor equipment, today announced that it is expanding its atomic layer etching (ALE) portfolio with the addition of ALE capability on its Flex dielectric etch systems.