Wet Processing, including wafer cleaning, is one of the most common yet most critical processing steps in semiconductor manufacturing, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions, including a new concept of tailoring chemistries to dissolve very small particles rather than physically removing them.

More than 100 steps in a standard IC manufacturing process flow involve wafer cleaning or surface preparation, which include post-resist strip/ash residue removal, native oxide removal, and even selective etching. Although dry processes continue to evolve and offer unique advantages for some applications, most cleaning/surface prep processes are “wet,” involving the use of a mixture of chemicals such as hydrofluoric; hydrochloric (HCl), sulfuric or phosphoric acid; or hydrogen peroxide, along with copious amounts of deionized water for dilution and rinsing. Wafers are typically processed in a batch immersion or batch spray system or, increasingly, with a single-wafer approach. The trend is toward more dilute chemistries, aided by the use of some form of mechanical energy, such as megasonics or jet-spray processing.

An important distinction in wafer cleaning today is that the main goal is not particle removal, but some other function, such as removing native oxide or photoresist residue removal after strip/ash.

Additional Reading

Wet process technologies for scalable through silicon vias

Simple wet cleaning improvements can meet new silicon surface preparation criteria

ARTICLES



North American semiconductor equipment industry posts November 2016 book-to-bill ratio of 0.96

12/16/2016  A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.

Murphy, Choh and Pilla join ClassOne Technology's Board of Advisors

12/01/2016  ClassOne Technology, manufacturer of advanced wet processing equipment for ≤200mm substrates, announced the formation of a Board of Advisors.

Managing particle flows in process exhaust for safety and profitability

10/28/2016  Solid particles in the abatement exhaust must be properly managed, and in some cases, substantially reduced from the gas stream before it is released into the environment.

Lam Research introduces dielectric atomic layer etching capability for advanced logic

09/07/2016  Lam Research Corp., an advanced manufacturer of semiconductor equipment, today announced that it is expanding its atomic layer etching (ALE) portfolio with the addition of ALE capability on its Flex dielectric etch systems.

Cabot Microelectronics appoints Thomas F. Kelly as VP of Corporate Development

09/02/2016  Cabot Microelectronics Corporation announced the appointment of Thomas F. Kelly, Vice President, Corporate Development, which is effective as of September 6, 2016.

Lam Research enables next-generation memory with industry's first ALD process for low-fluorine tungsten fill

08/09/2016  Lam Research Corp. (NASDAQ: LRCX), an advanced manufacturer of semiconductor equipment, today introduced an atomic layer deposition (ALD) process for depositing low-fluorine-content tungsten films, the latest addition to its ALTUS family of products.

Nitrous oxide no laughing matter

07/13/2016  N2O, or Nitrous Oxide, also known as laughing gas, is a weak anesthetic gas that has been in use since the late 18th century.

Samco boosts shipment capacity with second production center

06/21/2016  Samco, a Japan-based semiconductor processing equipment manufacturer, held a completion ceremony for its second production center on June 17.

Equipment spending up: 19 new fabs and lines to start construction

06/10/2016  While semiconductor fab equipment spending is off to a slow start in 2016, it is expected to gain momentum through the end of the year. For 2016, 1.5 percent growth over 2015 is expected while 13 percent growth is forecast in 2017.

ClassOne announces major savings with Solstice gold plating

06/02/2016  ClassOne Technology, manufacturer of budget-friendly wet processing equipment, is reporting significant savings in the plating of gold in ≤200mm applications using its Solstice systems.

Busch wins annual NXP Semiconductors Best Supplier Award

05/25/2016  NXP Semiconductors N.V. announced Busch Semiconductor Vacuum Group LLC as the Best Supplier for Front-end equipment (semiconductor equipment) at NXP’s first Supplier Day Awards ceremony in Austin, Texas.

First quarter 2016 silicon wafer shipments increase quarter-over-quarter

05/17/2016  Worldwide silicon wafer area shipments increased during the first quarter 2016 when compared to fourth quarter 2015 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.