Beyond the wafers themselves, the semiconductor industry employs thousands of different kinds of materials. These range from the materials used in wafer manufacturing — chemicals and gases, photoresists and developers, anti-reflection coatings, CMP slurries, adhesion promoters, etc. — to the materials used in the manufacturing equipment and the wafer carriers. On the packaging side, materials include laminate substrates, leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics, and thermal interface materials.

The market for semiconductor materials is on the same level as capital equipment. In 2015, SEMI reported that the total wafer fabrication materials and packaging materials markets in 2014 were $24.0 billion and $20.4 billion, respectively. Comparable revenues for these segments in 2013 were $22.7 billion for wafer fabrication materials and $20.4 billion for packaging materials. The wafer fabrication materials segment increased 6 percent year-over-year, while the packaging materials segment remained flat. However, if bonding wire were excluded from the packaging materials segment, the segment increased more than 4 percent last year. The continuing transition to copper-based bonding wire from gold is negatively impacting overall packaging materials revenues.

For the fifth consecutive year, Taiwan was the largest consumer of semiconductor materials due to its large foundry and advanced packaging base, totaling $9.8 billion. Japan claimed the second spot during the same time. Annual revenue growth was the strongest in the Taiwan market. The materials market in North America had the second largest increase at 5 percent, followed by China, South Korea and Europe. The materials markets in Japan and Rest of World were flat relative to 2013 levels. (The ROW region is defined as Singapore, Malaysia, Philippines, other areas of Southeast Asia and smaller global markets.)

SUBCATEGORIES:


SUPPLIERS


Indium Corporation: http://www.indium.com



Amkor Technology: http://www.amkor.com



QuantumClean: http://www.quantumclean.com



ARTICLES



North American semiconductor equipment industry posts November 2016 book-to-bill ratio of 0.96

12/16/2016  A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.

Murphy, Choh and Pilla join ClassOne Technology's Board of Advisors

12/01/2016  ClassOne Technology, manufacturer of advanced wet processing equipment for ≤200mm substrates, announced the formation of a Board of Advisors.

Managing particle flows in process exhaust for safety and profitability

10/28/2016  Solid particles in the abatement exhaust must be properly managed, and in some cases, substantially reduced from the gas stream before it is released into the environment.

Lam Research introduces dielectric atomic layer etching capability for advanced logic

09/07/2016  Lam Research Corp., an advanced manufacturer of semiconductor equipment, today announced that it is expanding its atomic layer etching (ALE) portfolio with the addition of ALE capability on its Flex dielectric etch systems.

Cabot Microelectronics appoints Thomas F. Kelly as VP of Corporate Development

09/02/2016  Cabot Microelectronics Corporation announced the appointment of Thomas F. Kelly, Vice President, Corporate Development, which is effective as of September 6, 2016.

Lam Research enables next-generation memory with industry's first ALD process for low-fluorine tungsten fill

08/09/2016  Lam Research Corp. (NASDAQ: LRCX), an advanced manufacturer of semiconductor equipment, today introduced an atomic layer deposition (ALD) process for depositing low-fluorine-content tungsten films, the latest addition to its ALTUS family of products.

Nitrous oxide no laughing matter

07/13/2016  N2O, or Nitrous Oxide, also known as laughing gas, is a weak anesthetic gas that has been in use since the late 18th century.

Samco boosts shipment capacity with second production center

06/21/2016  Samco, a Japan-based semiconductor processing equipment manufacturer, held a completion ceremony for its second production center on June 17.

Equipment spending up: 19 new fabs and lines to start construction

06/10/2016  While semiconductor fab equipment spending is off to a slow start in 2016, it is expected to gain momentum through the end of the year. For 2016, 1.5 percent growth over 2015 is expected while 13 percent growth is forecast in 2017.

ClassOne announces major savings with Solstice gold plating

06/02/2016  ClassOne Technology, manufacturer of budget-friendly wet processing equipment, is reporting significant savings in the plating of gold in ≤200mm applications using its Solstice systems.

Busch wins annual NXP Semiconductors Best Supplier Award

05/25/2016  NXP Semiconductors N.V. announced Busch Semiconductor Vacuum Group LLC as the Best Supplier for Front-end equipment (semiconductor equipment) at NXP’s first Supplier Day Awards ceremony in Austin, Texas.

Global semiconductor sales increase slightly in March

05/06/2016  The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $26.1 billion for the month of March 2016, a slight increase of 0.3 percent compared to the previous month's total of $26.0 billion.