Every electronic device — whether it is an integrated circuit, an LED, a MEMS device, a passive component or anything else — must be connected to the outside world at some point and this requires a series of process steps to connect the “wiring” and protect the device, typically in some kind of encapsulant.

Wafers of consisting of hundreds or thousands of Individual components are cut up through a process known as dicing or “singulation,” typically by attaching the wafer to a plastic wafer carrier and cutting them with a high speed saw. Many different types of packaging technologies exist, but individual die are typically placed on a leadframe or flip chip substrate; the die attachment process is known as die bonding. This involves a machine known as a die bonder and an electrically conductive die adhesive

The next step is wire bonding, where a gold or copper wire is bonded to the contact pads on the wafer and an I/O pin on the leadrame (or, in the case of flip chip bonding, a ball bond connects the bonding pad on the chip to the substrate, and an underfill adhesive is “jetted’ in to fill voids).

After the chip is electrically connected to the carrier, it is encapsulated in the familiar black epoxy, or an alternative method of protecting the device.

SUBCATEGORIES:


SUPPLIERS


Berliner Glas KGaA Herbert Kubatz GmbH & Co.: http://www.berlinerglas.com



HEIDENHAIN CORPORATION: http://www.heidenhain.com



Sikama International Inc.: http://www.sikama.com



SIKAMA INTERNATIONAL, INC: http://www.sikama.com



ARTICLES



ALD tools evolve with industry needs

07/13/2017  Veeco Instruments (Veeco) recently announced that Veeco CNT -- formerly known as Ultratech/Cambridge Nanotech -- shipped its 500th Atomic Layer Deposition (ALD) system to the North Carolina State University.

SEMI and Solid State Technology announce 2017 “Best of West” Award finalists

06/28/2017  Each year at SEMICON West, the “Best of West” awards are presented by Solid State Technology and SEMI.

EV Group optimizes resist and lithographic processing for plasma dicing

06/20/2017  EVG resist processing and lithography systems provide pre-processing solution to enable complete damage-free advanced dry plasma dicing on thin semiconductor wafers.

SEMICON West preview: Equipment components and subsystems

06/08/2017  Attention turns to subcomponents to improve yields at advanced nodes.

Global semiconductor wafer-level equipment revenue to grow 11% in 2016

04/20/2017  Worldwide semiconductor wafer-level manufacturing equipment (WFE) revenue totaled $37.4 billion in 2016, an 11.3 percent increase from 2015, according to final results by Gartner, Inc.

3D-Micromac receives large volume orders from solar industry for its microCELL TLS system

04/18/2017  3D-Micromac AG today announced that the total received order volume for its microCELL TLS high-throughput half-cell cutting tools tops 1.5 GW for tool deliveries in 2017 to date.

EVG breaks speed and accuracy barrier in mask alignment lithography for semiconductor packaging

03/08/2017  New IQ Aligner NT achieves double throughput and alignment accuracy over previous-generation platform; opens up new applications for EVG lithography solutions.

Record spending for fab equipment expected in 2017 and 2018

03/07/2017  Today, SEMI announced updates to its World Fab Forecast report, revealing that fab equipment spending is expected to reach an industry all-time record − more than US$46 billion in 2017.

Global MEMS manufacturer selects ULVAC Technologies' plasma ashing system

03/01/2017  ULVAC Technologies, Inc. has been selected by a global MEMS inertial sensor manufacturer to deliver an ULVAC ENVIRO-1Xa advanced plasma ashing system for running critical low-temp descum processes and high-temp bulk photoresist strip processes.

ClassOne initiative aims to reduce CoO in ≤200mm copper plating

02/22/2017  ClassOne Technology announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.

SEMI appoints Ajit Manocha as president and CEO

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

Executive viewpoints: 2017 outlook

01/25/2017  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.