Semicon West

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SEMICON WEST ARTICLES



The danger that lurks below

07/19/2016  The semiconductor industry is moving quickly to adopt a variety of new materials in an effort to increase chip performance.

Three-in-one tool speeds bump inspection

07/19/2016  Last year, Rudolph Technologies, Inc. announced the widespread adoption and success of its newest macro defect inspection tool, the NSX 330 Series.

NSTAR Global Services announces facilities management services

07/14/2016  NSTAR Global Services is now offering facilities management services for operations and maintenance (O&M) of installed OEM facility equipment or previously constructed systems that support fab operations in high-tech industries.

Sono-Tek introduces photoresist ultrasonic coating system

07/14/2016  Sono-Tek Corp. unveiled a new photoresist ultrasonic coating system in Booth #2146.

Pall intros 5nm PTFE filtration membrane

07/14/2016  Pall Corporation announced this week the availability of its new 5nm XpressKleen filter.

Flexible medical device manufacturing developments

07/14/2016  The SEMICON West 2016 Flexible Electronics Forum provided two days of excellent presentations by industry experts on these topics, and the second day focused on the medical applications of flexible circuits.

Busch launches re-manufacturing capabilities

07/14/2016  Busch LLC has launched a new program where, at key sites around the world, they have the ability to re-manufacture any major brand of vacuum pump, including high vacuum turbos and cryos.

SEMICON West Day 3: Don't Miss

07/14/2016  Don’t miss these big events today at SEMICON West!

Coventor wins "Best of West" Award

07/13/2016  Solid State Technology and SEMI today announced the recipient of the 2016 "Best of West" Award — Coventor — for its SEMulator3D.

New materials need new handling approaches

07/13/2016  Wenge Yang of Entegris spoke with the Show Daily about major trends in High Volume Manufacturing (HVM), and about the topics that will be discussed in the Entegris Yield Breakfast Forum “Yield Enhancement Challenges in Today’s Memory IC Production” happening Thursday morning, July 14.

Packaging and displays drive new litho requirements

07/13/2016  Fan-out wafer level packaging (FOWLP) is gaining traction, leading to higher I/Os and larger formats, and new mobile displays are pushing the limits of pixel per inch (PPI) while also moving to larger formats.

Standards industry leaders honored at SEMICON West 2016

07/13/2016  SEMI honored four industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries.

Leti and Korea Institute of Science and Technology to collaborate on key growth areas for growing digital era

07/13/2016  Leti, an institute of CEA Tech, and the Korea Institute of Science and Technology (KIST) today announced an agreement to jointly explore a variety of technologies, including monolithic 3D, neuromorphic architectures, non-volatile 3D memory, spintronics and ultra-low power semiconductors.

Kateeva: Enabling OLED success

07/13/2016  Kateeva is out to change the way displays are being made, and during Tuesday’s Silicon Innovation Forum keynote, Kateeva President and COO Conor Madigan, PhD, laid out how their YIELDJet inkjet system is making that happen.

MORE SEMICON-WEST ARTICLES

TWITTER


WEBCASTS



Internet of Things

February 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
ISS Europe 2017
Munich, Germany
http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017

VIDEOS