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SEMICON WEST ARTICLES



ASM International launches Intrepid epitaxy tool

07/13/2017  ASM International introduced the Intrepid ES 300mm epitaxy (epi) tool for advanced-node CMOS logic and memory high-volume production applications.

ALD tools evolve with industry needs

07/13/2017  Veeco Instruments (Veeco) recently announced that Veeco CNT -- formerly known as Ultratech/Cambridge Nanotech -- shipped its 500th Atomic Layer Deposition (ALD) system to the North Carolina State University.

Industry acting to reduce greenhouse gases

07/13/2017  Semiconductor manufacturers use a variety of high global warming potential (GWP) gases to process wafers and to rapidly clean chemical vapor deposition (CVD) tool chambers.

Big data in autonomous driving

07/13/2017  On Wednesday, Intel Corporation’s Katherine Winter, Vice President of the Automated Driving Group, delivered a keynote that many would think is off-topic from the usual at SemiCon West: ”Big Data in Autonomous Driving.”

Day 3 of SEMICON West: Don't Miss

07/13/2017  Don't miss these events today at SEMICON West!

EUV patterning materials evolving

07/13/2017  Global industry R&D hub IMEC defines the “IMEC 7nm-Node” (I7N) for finFETs to have 56 nm Contacted Gate Pitch (CGP) with 40 nm Metal Pitch (MP), and such critical mask layers can be patterned with a single exposure of 0.33 N.A. EUVL as provided by the ASML NXE:3400B tool.

SEMI Awards honor process and technology integration achievements

07/13/2017  SEMI announced the recipients of the 2017 SEMI Awards for the Americas.

Standards industry leaders honored at SEMICON West 2017

07/12/2017  SEMI honored four industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries. The SEMI Standards awards were announced at the SEMI International Standards reception held during SEMICON West 2017.

Solid State Technology and SEMI announce the 2017 Best of West Award winner

07/12/2017  Solid State Technology and SEMI today announced the recipient of the 2017 "Best of West" Award -- Microtronic Inc.-- for its EAGLEview 5.

Bridging the macro and micro world of defects

07/12/2017  When it comes to defects and contamination in the semiconductor manufacturing industry, most people tend to think of small, sub-nm defects at the transistor level. As important as those are, there are plenty of things that can go wrong and be seen at the macro level.

New materials, new challenges

07/12/2017  In order to increase device performance, the semiconductor industry has slowly been implementing many new materials.

$49.4B semiconductor equipment forecast: New record, Korea at top

07/12/2017  Worldwide sales of new semiconductor manufacturing equipment are projected to increase 19.8 percent to total $49.4 billion in 2017, marking the first time that the semiconductor equipment market has exceeded the market high of $47.7 billion set in 2000.

James C. Morgan unveils Applied Wisdom

07/12/2017  James C. Morgan will be a special guest presenter during the SEMICON West keynote session this morning at the Yerba Buena Center.

AI and collaboration key to future success

07/12/2017  Keynote speakers Terry Higashi of Tokyo Electron Ltd. and Tom Caulfield of GlobalFoundries took the stage at the Yerba Buena Theater Tuesday morning to predict major changes in the goals and operations of the semiconductor industry.

MORE SEMICON-WEST ARTICLES

TWITTER


WEBCASTS



3D NAND: Trends in Processes, Circuits

October 3, 2017 at 1 p.m. ET

Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS