Semicon West

SEMICON WEST ARTICLES



IC makers maximize 300mm, 200mm wafer capacity

10/13/2017  A total of 25 new 300mm wafer fabs is expected between 2016 and 2021 as the outlook for 450mm wafers fades.

ASM International launches Intrepid epitaxy tool

07/13/2017  ASM International introduced the Intrepid ES 300mm epitaxy (epi) tool for advanced-node CMOS logic and memory high-volume production applications.

ALD tools evolve with industry needs

07/13/2017  Veeco Instruments (Veeco) recently announced that Veeco CNT -- formerly known as Ultratech/Cambridge Nanotech -- shipped its 500th Atomic Layer Deposition (ALD) system to the North Carolina State University.

Industry acting to reduce greenhouse gases

07/13/2017  Semiconductor manufacturers use a variety of high global warming potential (GWP) gases to process wafers and to rapidly clean chemical vapor deposition (CVD) tool chambers.

Big data in autonomous driving

07/13/2017  On Wednesday, Intel Corporation’s Katherine Winter, Vice President of the Automated Driving Group, delivered a keynote that many would think is off-topic from the usual at SemiCon West: ”Big Data in Autonomous Driving.”

Day 3 of SEMICON West: Don't Miss

07/13/2017  Don't miss these events today at SEMICON West!

EUV patterning materials evolving

07/13/2017  Global industry R&D hub IMEC defines the “IMEC 7nm-Node” (I7N) for finFETs to have 56 nm Contacted Gate Pitch (CGP) with 40 nm Metal Pitch (MP), and such critical mask layers can be patterned with a single exposure of 0.33 N.A. EUVL as provided by the ASML NXE:3400B tool.

SEMI Awards honor process and technology integration achievements

07/13/2017  SEMI announced the recipients of the 2017 SEMI Awards for the Americas.

Standards industry leaders honored at SEMICON West 2017

07/12/2017  SEMI honored four industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries. The SEMI Standards awards were announced at the SEMI International Standards reception held during SEMICON West 2017.

Solid State Technology and SEMI announce the 2017 Best of West Award winner

07/12/2017  Solid State Technology and SEMI today announced the recipient of the 2017 "Best of West" Award -- Microtronic Inc.-- for its EAGLEview 5.

Bridging the macro and micro world of defects

07/12/2017  When it comes to defects and contamination in the semiconductor manufacturing industry, most people tend to think of small, sub-nm defects at the transistor level. As important as those are, there are plenty of things that can go wrong and be seen at the macro level.

New materials, new challenges

07/12/2017  In order to increase device performance, the semiconductor industry has slowly been implementing many new materials.

$49.4B semiconductor equipment forecast: New record, Korea at top

07/12/2017  Worldwide sales of new semiconductor manufacturing equipment are projected to increase 19.8 percent to total $49.4 billion in 2017, marking the first time that the semiconductor equipment market has exceeded the market high of $47.7 billion set in 2000.

James C. Morgan unveils Applied Wisdom

07/12/2017  James C. Morgan will be a special guest presenter during the SEMICON West keynote session this morning at the Yerba Buena Center.

AI and collaboration key to future success

07/12/2017  Keynote speakers Terry Higashi of Tokyo Electron Ltd. and Tom Caulfield of GlobalFoundries took the stage at the Yerba Buena Theater Tuesday morning to predict major changes in the goals and operations of the semiconductor industry.

Day 2 of SEMICON West: Don't Miss

07/12/2017  Don't miss these big events today at SEMICON West!

SEMI's Board election results and leadership appointments announced

07/11/2017  SEMI today announced that Mike Allison, president of the Semiconductor Division at Edwards, and Daisuke Murata, president and CEO of Murata Machinery, were elected as new directors to the SEMI International Board of Directors in accordance with the association's by-laws.

200mm fabs thriving

07/11/2017  Today, at SEMICON West in San Francisco, Calif., SEMI issued an update to its 200mm Fab Outlook report, with improved and expanded report forecasting of 200mm fab trends out to 2021.

Exploring smart sensor explosive growth

07/11/2017  MEMS & Sensors Industry Group (MSIG), the industry association advancing MEMS and sensors across global markets, is hosting a TechXPOT program today, titled “What’s Next for MEMS & Sensors: Big Growth of Disruptive Applications for Smart Sensing Changes the Business.”

Linde Group announces rare gas capacity expansions

07/11/2017  The Linde Group is expanding production of the rare gases used by the semiconductor industry, including xenon, which is in increasing demand for etching 3D semiconductor structures.




TWITTER


WEBCASTS



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: The Rise of Computational Process Control

Thursday, May 17, 2018 at 1:00 p.m. ET

The increased use of artificial intelligence (AI) and machine learning (ML) techniques such as deep learning is creating a myriad of both challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The semiconductor industry poses somewhat unique challenges arising from its complex, high precision and highly dynamic production environment. One key way that these challenges are being addressed in semiconductor is by using an approach called “computational process control” or “CPC” in which AI and ML are combined with subject matter expertise to provide higher quality analytical solutions. This webcast will look at the AI/ML explosion, what it means to the semiconductor industry, and how CPC is being used to enhance the benefits of these analytical techniques.

Sponsored By:
Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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