Semiconductors

MAGAZINE



SEMICONDUCTORS ARTICLES



Harnessing big data

07/28/2014  Addressing the analytics challenges in supply chain management.

Superfast stress inspection for overlay control

07/28/2014  Tighter overlay requirements are motivating device manufacturers to explore new ways to characterize and manage overlay to improve yield.

Cryogenic etching reduces plasma-induced damage of ultralow-k dielectrics

07/28/2014  Reducing plasma-induced damage is key to advancing the scaling limits.

Can lean innovation bring growth and profits back to semiconductors?

07/25/2014  New approaches to start-ups can unlock mega-trend opportunities.

A*STAR and industry partners form S$200M semiconductor R&D joint labs

07/24/2014  Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners.

VCs still investing in semiconductor technology, but need strategic partners and capital efficiency

07/24/2014  Investors are still looking for differentiated technologies that solve high-value problems in semiconductor manufacturing, or that bring semiconductor technology to disruptive applications in other fields, particularly in the medical and environmental sectors

Peregrine Semiconductor and RF Micro Devices settle outstanding litigation

07/23/2014  Peregrine Semiconductor Corporation, founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, and RF Micro Devices, Inc., a designer and manufacturer of high-performance radio frequency solutions, today announced that they have settled all outstanding claims between the companies.

MORE SEMICONDUCTORS ARTICLES

HEADLINES

Global Rectifiers Market 2014-2018
July 28, 2014

Sony DADC BioSciences and TSMC Receive AACC Industry Division Award
July 28, 2014

Silicon Image Appoints New Chief Financial Officer
July 28, 2014

Fairchild Appoints Gaurang Shah as Senior Vice President For Newly Formed Power Systems Group
July 28, 2014

ON Semiconductor Offers Integrated Switching Regulators to Enable High Efficiency Offline Power Converters for Consumer Applications; Integrated 650 volt avalanche-rated MOSFETs enable robust, compact switching solutions for power-hungry applications such as household appliances, DVD players and set top boxes
July 28, 2014

DSP & Microcontrollers Market Growing at 6.96% CAGR to 2020: Global Analysis and Forecast in New Research Report Available at ReportsnReports.com; ReportsnReports.com offers "Microcontrollers, DSP, & IP Core Chip Market by Type, Applications (Automotive & Transportation, Consumer Electronics, Industrial, Communications, Security, and Medical & Healthcare) and Geography (Americas, Europe, APAC & ROW) - Analysis & Forecast to 2014 - 2020" global research report in its store.
July 28, 2014

STATS ChipPAC's Encapsulated Wafer Level Chip Scale Package (eWLCSP) Delivers Superior Quality Benefits; Dual Benefits of Superior Quality and Lower Cost of eWLCSP(TM) Leads to Strong Customer Response and Adoption
July 28, 2014

Sony Increases Production Capacity For Stacked CMOS Image Sensors
July 28, 2014

Semicon West 2014: Positive outlook for chip makers, suppliers
January 01, 1970

Semicon West 2014: Positive outlook for chip makers, suppliers
January 01, 1970

FINANCIALS



TECHNOLOGY PAPERS



Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Wet Processing

July 2014 (date and time TBD) Wet processing including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions.

Sponsored By:
450 Update

July 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.

Sponsored By:

Metrology

August 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
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VIDEOS