08/27/2014 The Plastics Electronics Conference and Exposition will co-locate with SEMICON Europa. Plastic Electronics 2014 (PE 2014) is themed Enabling Applications beyond Limits in Electronics and will be held at Alpexpo in Grenoble on 7-9 October.
08/26/2014 Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced that it has obtained IEC 61508 (Functional Safety) certification for the RX631, RX63N Safety Package.
08/25/2014 When ClassOne Technology introduced its new Solstice electroplating systems at SEMICON West last month they didn’t expect to actually sell their first production unit off the show floor, but that’s what happened.
08/25/2014 Fairchild Semiconductor, a supplier of high performance power and mobile products, today announced it will eliminate its internal five-inch and significantly reduce six-inch wafer fabrication lines.
08/25/2014 JEDEC Solid State Technology Association today announced the publication of JESD209-4 Low Power Double Data Rate 4 (LPDDR4).
08/25/2014 Electro Scientific Industries, Inc., a supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced that Richard H. Wills, former Chairman and Chief Executive Officer of Tektronix, Inc., was appointed to the company’s Board of Directors.
08/25/2014 The TECHCON 2014 conference hosted by Semiconductor Research Corporation (SRC), the university-research consortium for semiconductors and related technologies, will feature immediate past GLOBALFOUNDRIES CEO Ajit Manocha among the list of executive speakers at the Sept. 7-9 annual event.
Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014Sponsored by Master Bond, Inc.,
Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014Sponsored by Mentor Graphics
This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014Sponsored by Phoseon Technology
September 2014 (date and time TBD)
Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.
Sept. 2014 (Date and time TBD)
Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.
Oct. 2014 (Date and time TBD)
This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.