Semiconductors

MAGAZINE



SEMICONDUCTORS ARTICLES



Physicists heat freestanding graphene to control curvature of ripples

09/22/2014  An international team of physicists, led by a research group at the University of Arkansas, has discovered that heating can be used to control the curvature of ripples in freestanding graphene.

NVIDIA unveils Maxwell GPU architecture

09/19/2014  In a major leap forward for gaming, NVIDIA today introduced the first high-end products based on its Maxwell chip architecture -- the new GeForce GTX 980 and 970 GPUs -- delivering unmatched performance, major new graphics capabilities and twice the energy efficiency of the previous generation.

Northeastern University researchers develop novel method for working with nanotubes

09/19/2014  Northeastern University researchers have developed a novel method for controllably constructing precise inter-nanotube junctions and a variety of nanocarbon structures in carbon nanotube arrays.

Photonics community celebrates bipartisan passage of Revitalizing American Manufacturing and Innovation Act

09/19/2014  Photonics community leaders including SPIE, the international society for optics and photonics, are celebrating bipartisan passage by the U.S. House of Representatives of a bill designed to stimulate development and commercialization of new technologies and promote growth of high-value jobs.

North American semiconductor equipment industry posts August 2014 book-to-bill ratio of 1.04

09/18/2014  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

ProPlus Design Solutions expands sales operations to Europe

09/18/2014  ProPlus Design Solutions, Inc. announced today it expanded its sales operations to Europe.

EMCORE Corporation announces CEO transition plan

09/18/2014  EMCORE Corporation, a provider of compound semiconductor-based components and subsystems for the fiber optic and space solar power industries, today announced a transition plan of its Chief Executive Officer position in connection with the announced sale of its Space Photovoltaics business.

MORE SEMICONDUCTORS ARTICLES

HEADLINES

Thin Film PZT for Semiconductor Application Trends & Technology Update; From FeRAM to Integrated Passive Devices (IPDs): will MEMS applications be the driver for future growth of thin film PZT?
September 22, 2014

Amkor Technology Receives Excellent Service Provider Award from SMIC
September 22, 2014

Pulsed RF Power Semiconductor Device Markets Will Exceed $US300M by 2019 with Gallium Nitride Driving Growth, Says ABI Research
September 22, 2014

BitFury Forms Strategic Advisory Board With Technology and Venture Industry Leaders; Advisory board to guide the company through its rapid expansion
September 22, 2014

Lattice Announces Production of MachXO3L Devices in WLCSP and caBGA Packages; The most capable non-volatile solution optimized for a wide range of power, size and cost-efficient applications
September 22, 2014

Lattice Announces Production of MachXO3L Devices in WLCSP and caBGA Packages; The most capable non-volatile solution optimized for a wide range of power, size and cost-efficient applications
September 22, 2014

Semtech Enables the Next Generation of 100G Optical/Electrical Modules and Backplane Applications at ECOC 2014; The company's ECOC 2014 products showcased at the OIF's 2014 Multivendor Interoperability forum highlight Semtech's leadership in providing industry leading re-timer products to support both the next generation of small form factor 100G optical modules as well as applications targeted at 100G backplanes and active copper modules
September 22, 2014

NeoPhotonics Announces General Availability of Dual Rate 100G CFP2 LR4 Transceiver; Low power, Dual Rate and Compact 100G CFP2 Pluggable Optical Transceiver Module Designed to Enable High Bandwidth and High Density Client Interface
September 22, 2014

ClariPhy Accelerates 400G Networks by Shipping its 200G Coherent Optical SoC to Customers; Key Highlights:
September 22, 2014

NeoPhotonics Introduces Low Power Consumption High Performance Laser and Driver for Dual Rate 100G LR4/ER4 CFP2 Transceivers; Low Power Consumption Laser and Driver Provide a Matched Solution for Dual Rate 100G LR4/ER4 CFP2 Form Factor Pluggable 100G Optical Transceiver Modules
September 22, 2014

FINANCIALS



TECHNOLOGY PAPERS



Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS



Metrology

September 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014
Strategic Materials Conference
Santa Clara, CA
http://www.semi.org/node/41386
September 30, 2014 - October 01, 2014
SEMICON Europa
Grenoble, France
http://www.semiconeuropa.org
October 07, 2014 - October 09, 2014
MEMS Executive Congress US 2014
Scottsdale, AZ
http://us2014.memscongress.com
November 05, 2014 - November 07, 2014