Semiconductors

MAGAZINE



SEMICONDUCTORS ARTICLES



GlobalFoundries' momentum in China

10/23/2017  Company shares details of technology roadmap and customer adoption in the world’s fastest-growing market for semiconductors.

Researchers bring optical communication onto silicon chips

10/23/2017  Ultrathin films of a semiconductor that emits and detects light can be stacked on top of silicon wafers.

Taming 'wild' electrons in graphene

10/23/2017  Discovery could lead to novel electronic devices.

NRL clarifies valley polarization for electronic and optoelectronic technologies

10/20/2017  Many of today's technologies, such as, solid-state lighting, transistors in computer chips, and batteries in cell phones rely simply on the charge of the electron and how it moves through the material. In certain materials, such as the monolayer transition metal dichalcogenides (TMDs), electrons can be selectively placed into a chosen electronic valley using optical excitation.

Leti coordinating European project to improve drivetrains for electric vehicles

10/20/2017  CEA Tech's contribution includes Liten's knowhow in magnetic materials and simulation and Leti's expertise in wide-bandgap semiconductors.

North American semiconductor equipment industry posts September 2017 billings 

10/20/2017  Global semiconductor equipment billings of North American headquartered suppliers for September were $2.0 billion, down 12 percent from the peak level set in June of this year.

Microsemi launches Mi-V ecosystem to accelerate adoption of RISC-V

10/19/2017  The announcement comes as the company also introduces Mi-V RV32IMA and additional field programmable gate array (FPGA)-based soft CPU solutions ideally suited for designs utilizing RISC-V open instruction set architectures (ISAs).

IBM Technology influencer to deliver keynote address at The ConFab 2018

10/19/2017  The ConFab, to be held May 20-23 at The Cosmopolitan of Las Vegas, is excited to announce IBM's Dr. Rama Divakaruni will be the opening keynote for the 2018 conference.

New material for digital memories of the future

10/19/2017  Ferroelectric self-assembled molecular materials

IC Insights raises 2017 IC market forecast to +22%

10/19/2017  Strong growth to be driven by a 74% surge in the DRAM market and 44% jump in the NAND flash market.

Praxair signs long-term agreement to supply nitrogen to GLOBALFOUNDRIES

10/18/2017  Praxair will build, own and operate a plant to support GLOBALFOUNDRIES’ advanced manufacturing processes at its Malta fabrication facility.

Samsung completes qualification of 8nm LPP process

10/18/2017  Samsung Electronics Co., Ltd. announced today that 8-nanometer (nm) FinFET process technology, 8LPP (Low Power Plus), has been qualified and is ready for production.

2017 IEDM features rich technical program, focus sessions

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

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TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

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EVENTS



ITPC2017
Big Island, Hawaii
http://www.semi.org/en/itpc
November 05, 2017 - November 08, 2017
SEMICON Europa
Munich, Germany
http://www.semiconeuropa.org/
November 14, 2017 - November 17, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018

VIDEOS