Semiconductors

MAGAZINE



SEMICONDUCTORS ARTICLES



Solving molybdenum disulfide's 'thin' problem

03/27/2015  Research team increases material's light emission by twelve times.

Chemists make new silicon-based nanomaterials

03/27/2015  Chemists from Brown University have come up with a way to make new nanomaterials from a silicon-based compound.

Micron and Intel unveil new 3D NAND flash memory

03/26/2015  Micron Technology, Inc. and Intel Corporation today revealed the availability of their 3D NAND technology, the world’s highest-density flash memory.

Imec demonstrates 50GHz Ge waveguide electro-absorption modulator

03/25/2015  At this week’s OFC 2015, the largest global conference and exposition for optical communications, nanoelectronics research center imec, its associated lab at Ghent University (Intec), and Stanford University have demonstrated a compact germanium (Ge) waveguide electro-absorption modulator (EAM) with a modulation bandwidth beyond 50GHz.

Dr. Terry Brewer receives the Kathryn C. Hach Award for Entrepreneurial Success from the American Chemical Society

03/25/2015  Dr. Terry Brewer, founder and CEO of Brewer Science, was presented the Kathryn C. Hach Award for Entrepreneurial Success on Tuesday, March 24, 2015, at the American Chemical Society’s 249th National Meeting.

Optoelectronics, sensors/actuators, and discretes growth accelerates

03/25/2015  After two years of sluggishness, O-S-D sales strengthen with an improving economy and a boost from new applications, says new 2015 report.

Silicon Space Technology appoints Bernd Lienhard as New CEO

03/24/2015  Silicon Space Technology today announced that its Board of Directors appointed Bernd Lienhard as the company’s Chief Executive Officer, replacing David Patterson who has been interim CEO for the past three months.

MORE SEMICONDUCTORS ARTICLES

HEADLINES

Government to Invest 10 Billion US $ in the Chip Manufacturing Facilities Coming up in Gujarat and Uttar Pradesh
March 28, 2015

INVESTOR ALERT: Levi & Korsinsky, LLP Notifies Shareholders of FREESCALE SEMICONDUCTOR, LTD. of Commencement of an Investigation Concerning the Fairness of the SALE OF THE COMPANY TO NXP SEMICONDUCTORS N.V. -- FSL
March 27, 2015

Technical Coverage of Semiconductors Equities -- NVIDIA, Microchip Technology, Trina Solar, Lattice Semiconductor, and Ascent Solar Technologies
March 27, 2015

NXP Semiconductors N.V. Enters Strategic Cooperation with B.M. Holding and Digital China Sign for Shanghai Smart City Project
March 27, 2015

NXP, B.M. Holding and Digital China Sign Strategic Cooperation Agreement for Shanghai Smart City Project; Official Memorandum of Understanding Signing Ceremony Took Place in China Attended by the Dutch Prime Minister
March 27, 2015

Advanced Line Scan Cameras Win Gold in Vision Systems Design 2015 Innovators Awards Program; Vision Systems Design presents Two Gold Awards for the Piranha4 Multispectral Camera and the Piranha XL 16k Camera at Automate 2015
March 27, 2015

MRS Communications Publishes New Manufacturing Process from Stanford Which Could Yield Better Solar Cells, Faster Chips
March 27, 2015

ICE Acquires QFI QuantumScope for Failure Analysis Laboratory.
March 27, 2015

A New Publication from RadioFM Highlights the Radio FM Application Enabled for Android* Tablets Powered by Intel; R Atom™ Processors.CM Intel Corp.
March 27, 2015

CISC Semiconductor and MET Labs Work Together to Provide GS1 EPC Gen2v2 Compliance Tests.
March 26, 2015

FINANCIALS



TECHNOLOGY PAPERS



High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



3D Integration

April 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015