Semiconductors

MAGAZINE



SEMICONDUCTORS ARTICLES



Gov. Baker announces $4M grant to UMass Lowell to fuel emerging printed electronics cluster

01/29/2015  Gov. Charlie Baker today announced a $4 million dollar grant from the Massachusetts Technology Collaborative (“MassTech”) to UMass Lowell to support development of a printed and flexible electronics industry cluster, an emerging field that has the potential to become a $76 billion global market in the next decade.

New MES operations improvement software from critical manufacturing features integrated scheduling

01/28/2015  Critical Manufacturing, a supplier of integrated manufacturing execution systems (MES), introduces cmNavigo 4.0, the industry’s first comprehensive MES software with embedded finite scheduling.

2014 was bumper year for automotive semiconductors

01/27/2015  The automotive semiconductor market did exceptionally well in 2014, according to new analysis from IHS.

New pathway to valleytronics

01/27/2015  A potential avenue to quantum computing currently generating quite the buzz in the high-tech industry is "valleytronics," in which information is coded based on the wavelike motion of electrons moving through certain two-dimensional (2D) semiconductors.

Researchers at Penn, UC Berkeley and Illinois use oxides to flip graphene conductivity

01/27/2015  Graphene, a one-atom thick lattice of carbon atoms, is often touted as a revolutionary material that will take the place of silicon at the heart of electronics. The unmatched speed at which it can move electrons, plus its essentially two-dimensional form factor, make it an attractive alternative, but several hurdles to its adoption remain.

New Soitec eSI90 RF-SOI wafer improves RF performance of high-end smart phone components

01/26/2015  Soitec (Euronext) has introduced its eSI90 substrate, the newest high-end wafer in its radio-frequency silicon-on-insulator (RF-SOI) product family.

Emerging non volatile memory technological choices are about to be made: STTMRAM or MRAM?

01/26/2015  “The technological choice between STTMRAM/MRAM and RRAM will be made in the next two years,” announces the “More Than Moore” market research, technology and strategy consulting company, Yole Développement (Yole).

MORE SEMICONDUCTORS ARTICLES

HEADLINES

Indosolar soars on inking Wafer Supply pact with Osung LST; Osung LST Co will supply state-of-the-art high efficiency wafers manufactured at its South Korean facility
January 30, 2015

Indosolar inks Wafer Supply pact with Osung LST; Osung LST Co will supply state-of-the-art high efficiency wafers manufactured at its South Korean facility
January 30, 2015

Broadcom Board of Directors Declares Quarterly Dividend
January 29, 2015

Toshiba Microcontrollers Target Home Appliances And Factory Automation Systems; High-efficiency devices enable simultaneous single-chip control of two DC brushless motors
January 29, 2015

ZEISS Enters the Software Sector with Analysis Solution; ZEISS has developed and released the new software solution ZEISS AutoAnalysis. The application software analyses aerial images, taken by the ZEISS photomask qualification tool AIMS(TM). It runs fully automated and provides immediate, standardized results.;
January 29, 2015

CyberOptics Announces New ReticleSense Airborne Particle Sensor Quartz; Quartz Housing Designed to be Compatible with ASML, Nikon and Canon Scanners in Semiconductor Fabs
January 29, 2015

WiSpry and SkyeTek Release World's First RF MEMS-Tuned UHF RFID Antenna; SkyeModule Nova UHF RFID Module Leverages WiSpry Tunable RF Technology to Improve Tag Read Range and Save Energy
January 29, 2015

Bangalore-based Graphene Semiconductor raises $800K from Karnataka govt's VC fund KARSEMVEN
January 29, 2015

Govt reconstitutes panel for promoting semiconductor wafer fabrication
January 29, 2015

NXP Semiconductors Awarded D-PAS Certification; NXP ICs Now Available for the Manufacture of All U.S. EMV Cards, Reinforcing NXP's Leadership in Payments and Contactless Technologies
January 29, 2015

FINANCIALS



TECHNOLOGY PAPERS



Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



FinFETs

February 2015 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
LithoVision 2015
San Jose, California United States
https://www.nikonprecision.com/lithovision/
February 22, 2015 - February 22, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015