Semiconductors

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SEMICONDUCTORS ARTICLES



SEMI extends ASMC Call for Papers deadline to November 10

10/30/2014  SEMI announced today that the deadline for presenters to submit an abstract for the 26th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 10.

Synopsys announces availability of DesignWare, non-volatile memory IP for TowerJazz 180nm process technology

10/30/2014  Synopsys, Inc. today announced the availability of the silicon-proven DesignWare AEON Few Time Programmable (FTP) Trim Non-Volatile Memory (NVM) IP for TowerJazz 180-nanometer (nm) SL process technology.

SEMICON Japan 2014: New venue and new ideas for rebounding industry

10/29/2014  Today, SEMI announced an exceptional lineup of speakers for SEMICON Japan’s Opening Day — Accenture, Applied Materials, ARM, IBM Japan, Intel K.K., NIICT, Scripps, Toshiba, and Toyota.

TSI Semiconductors and Silvaco extend collaboration to accelerate launch of 0.25um BCDMOS process

10/29/2014  Silvaco, Inc. (Silvaco) and TSI Semiconductors, LLC (TSI) today announced that they have extended their collaboration to accelerate the development and production launch of TSI's 0.25um BCDMOS process technology.

MegaChips to acquire SiTime for $200M

10/29/2014  SiTime Corporation, a MEMS and analog semiconductor company, today announced that it has signed a definitive agreement under which MegaChips Corporation, a top 25 fabless semiconductor company based in Japan, will acquire SiTime for $200 million in cash.

TSMC, Kilopass deliver non-volatile memory for the 16nm finFET process node

10/28/2014  Kilopass Technology Inc., a provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), announced today that it has successfully ported its one-time programmable (OTP) NVM technology to TSMC's 16 nanometer (nm) FinFET process.

UMC enters volume production for Lantiq's Communication ICs

10/28/2014  United Microelectronics Corporation, a global semiconductor foundry, and Lantiq, a supplier of broadband access and home networking technologies, today announced that UMC has entered volume production for Lantiq's SPT170 high voltage Power Management ICs.

MORE SEMICONDUCTORS ARTICLES

HEADLINES

Semiconductor Manufacturing: Present at ASMC 2015 -- 'Call for Papers' Deadline Extended to November 10
October 31, 2014

Scientists worked for over 18 hours to keep MOM costs low
October 31, 2014

Mouser Team Wins Top Marketing Honors from ECIA
October 30, 2014

1366 Technologies Direct Wafer(TM) Achieves New Technical Milestones; Company Attains 18% Cell Efficiency and Accomplishes Solar Industry First: Eliminates the "Low Efficiency Tail" for Cell Manufacturers
October 30, 2014

STMicroelectronics Introduces World's Smallest Integrated 6-Axis Inertial Measurement Unit; Automotive-telematics and navigation-sensor leader keeps motor vehicles on track
October 30, 2014

Lattice Semiconductor, Fairchild Imaging and Helion Vision to Demonstrate New FPGA-Based Image Sensor Solution at VISION 2014; Reference Design Enables Manufacturers to Develop HD Camera Systems Ideal for High-End Security Systems and Intelligent Transportation Applications; Click to Tweet
October 30, 2014

REMINDER - MEDIA ALERT: ProPlus Design Solutions to Participate in ICCAD Workshop Titled, "TCAD to EDA"; Lianfeng Yang to Present "SPICE Modeling Challenges, Solutions and Its Impact to Advanced IC Designs"
October 30, 2014

Allied Minds Announces the Formation of Seamless Devices, Inc.
October 30, 2014

Over 300 Engineers in 43 Countries Discovered How to Generate an Executable Quote Online in Just Minutes; Join eSilicon's Webinar to Explore the Impact of Online Quoting for Custom Chips
October 30, 2014

Design for Manufacturability Engineering 9884334
October 30, 2014

FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

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WEBCASTS



Metrology and Failure Analysis

Nov. 2014 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Interconnects

Nov. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

Materials

Nov. 2014 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:

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VIDEOS