10/02/2015 Yamaichi Electronics presents Test Contactors for lab and reliability applications and ultra fine pitch semiconductor devices.
10/01/2015 IBM Research announced an engineering breakthrough that could accelerate carbon nanotubes replacing silicon transistors to power future computing technologies.
10/01/2015 Yang and his collaborators have created a synthetic “leaf” that is a hybrid system of semiconducting nanowires and bacteria.
10/01/2015 Invention of the first integrated circularly polarized light detector on a silicon chip opens the door for development of small, portable sensors that could expand the use of polarized light for many applications.
10/01/2015 Flip Chip technology is expected to reach $25 billion market value and wafer demand of 32 million (12” eq. wafers) in 2020, supported by the wider adoption of Cu pillar technology.
09/30/2015 Novati Technologies Inc. announced the availability of an advanced Integrated Sensor Platform, placing a wide variety of sensors onto multi-layer stacks of wafers in order to consume less power and perform significantly faster while reducing overall footprint.
09/30/2015 ASML announced the first shipment of its new TWINSCAN (TM) NXT:1980Di immersion lithography system to support increasingly demanding multiple-patterning performance requirements.
09/30/2015 At the 61st annual IEEE International Electron Devices Meeting (IEDM) subjects under discussion will encompass a range of topics critical to the continuing progress of the industry.
09/29/2015 The eBeam Initiative announced the completion of its fourth annual eBeam Initiative members' perceptions survey.
09/29/2015 D2S announced that it has partnered with Advantest to integrate D2S' Wafer Plane Analysis engine into Advantest's Mask MVM-SEM (Multi Vision Metrology Scanning Electron Microscope) systems.
View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015Sponsored by Epicor
Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015Sponsored by Fit-LINE, Inc.
Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015Sponsored by Master Bond, Inc.,
September 2015 (Date and time TBD)
October 2015 (Date and time TBD)
Printed electronics are at a pivotal moment. There are not only tremendous opportunities for innovation and growth in new verticals and industries, but a new way of thinking about how electronics are made, combining techniques and materials used by printed electronics with those of 3D printing. Presenters will review printed electronics and discuss future directions, from smart labels and wearables, to trends and technologies that enable the printing of IoT devices with embedded sensors, transistors, displays, batteries and memory.