Semiconductors

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SEMICONDUCTORS ARTICLES



Cambridge Nanotherm appoints Ralph Weir as CEO

07/31/2014  Cambridge Nanotherm, a producer of semiconductor heatsink technology, today announced that it has appointed semiconductor industry veteran Ralph Weir as its CEO.

Wireless connectivity semiconductors maintain strong double-digit growth in health and fitness

07/31/2014  Semiconductors providing wireless connectivity in health and fitness devices are set for solid double-digit growth in 2014 and beyond, especially as a clutch of wireless technologies make their way into a growing number of wearable devices.

A call to provide advanced equipment to growth companies

07/28/2014  Historically, the major semiconductor capital equipment manufacturers have focused on supporting the bigger semiconductor companies at the expense of the smaller ones.

Harnessing big data

07/28/2014  Addressing the analytics challenges in supply chain management.

Superfast stress inspection for overlay control

07/28/2014  Tighter overlay requirements are motivating device manufacturers to explore new ways to characterize and manage overlay to improve yield.

Cryogenic etching reduces plasma-induced damage of ultralow-k dielectrics

07/28/2014  Reducing plasma-induced damage is key to advancing the scaling limits.

Can lean innovation bring growth and profits back to semiconductors?

07/25/2014  New approaches to start-ups can unlock mega-trend opportunities.

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HEADLINES

Sula Iron & Gold Plc Results from 2nd Drill -2-
August 01, 2014

The Zacks Analyst Blog Highlights: ProFunds Semiconductor UltraSector ProFund; Service, T Rowe Price Global Tech Fund, ProFunds Technology UltraSector ProFund; Investor, Fidelity Select Electronics Portfolio and USAA Science and Technology Fund
July 31, 2014

GigOptix Introduces Its Newest GNSS RF Receiver with Dual-Mode, High Linearity, and Low Power Consumption
July 31, 2014

CFO Thad Trent To Address Pacific Crest Global Technology Leadership Forum On August 11
July 31, 2014

Skyworks Receives Mexico's Technology and Innovation Award; First Company to be Recognized in Two Categories in the Same Year
July 31, 2014

Case Study by LightPointe Highlights Free Space Optics Wireless Bridge Reliability, as Customers Enjoy Over 10 Years of Point-to-Point Connectivity; SRC, a Leading Provider of Cloud Technologies and Enterprise IT Solutions, Deployed FSO Link in 2005
July 31, 2014

The Designers Lighting Forum of New England Announces ESS Lighting/Legrand as Platinum Sponsor of Boston Lights Exposition 2014
July 31, 2014

Pure Wafer PLC Trading Update & Proposed Maiden Dividend
July 31, 2014

Fujitsu Semiconductor and ON Semiconductor Announce Strategic Partnership; The companies have entered into i) a foundry services agreement under which Fujitsu will manufacture wafers for ON Semiconductor, and ii) a definitive agreement pursuant to which ON Semiconductor will become a minority shareholder of Fujitsu's 8-inch wafer fab in Aizu-Wakamatsu, Japan;
July 31, 2014

Cypress CFO Thad Trent to Address Pacific Crest Global Technology Leadership Forum on August 11; Presentation to be Webcast on Cypress Website at www.cypress.com/investors
July 31, 2014

FINANCIALS



TECHNOLOGY PAPERS



Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

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WEBCASTS



Advances in Wet Processing and Wafer Cleaning

August 14th at 1:00 p.m. ET Wet Processing, including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions, including a new concept of tailoring chemistries to dissolve very small particles rather than physically removing them.

Sponsored By:
450 Update

July 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.

Sponsored By:

Metrology

August 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
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