Semiconductors

MAGAZINE



SEMICONDUCTORS ARTICLES



Carbonics aims for improved power consumption and performance with new carbon nanomaterials

11/19/2014  Startup is backed by $5.5M investment, leveraging carbon research conducted at UCLA and USC.

New process isolates promising material

11/18/2014  Molybdenum disulfide has emerged as a leading successor to graphene.

Notebook PC shipments rise year over year as tablet PCs decline

11/18/2014  Notebook PC growth was primarily driven by the developed regions of North America and Western Europe, which increased year-over-year shipments by more than 20 percent in the third quarter.

Revolutionary solar-friendly form of silicon shines

11/18/2014  Silicon is the second most-abundant element in the earth's crust. When purified, it takes on a diamond structure, which is essential to modern electronic devices--carbon is to biology as silicon is to technology. A team of Carnegie scientists led by Timothy Strobel has synthesized an entirely new form of silicon, one that promises even greater future applications.

GigOptix appoints Darren Ma as Vice President and Chief Financial Officer

11/18/2014  GigOptix, Inc., a supplier of advanced high speed semiconductor components, today announced the appointment of Darren Ma as Vice President and Chief Financial Officer.

SK Hynix Memory Solutions opens office in Longmont, Colorado

11/18/2014  SK Hynix Memory Solutions (SKHMS), a provider of NAND flash solutions, today announced the opening of its new engineering development center in Longmont, Colorado.

SCREEN Semiconductor Solutions and imec sign collaboration agreement for joint R&D on advanced nodes

11/17/2014  Today, nanoelectronics research center imec announced that SCREEN Semiconductor Solutions Co., Ltd., a leading manufacturer of advanced systems for the semiconductor industry, has joined imec’s suppliers hub for joint R&D in cleaning, wet etch and advanced lithography coat/develop processing.

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FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

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WEBCASTS



Trends in Semiconductor Materials

Thursday, November 20, 2014 at 1 p.m. EST

The electronics industry is facing a growing crisis in being able to continue providing cost-effective processes and designs to support the continuation of what’s been referred to as ‘Moore’s Law.’ This ‘Law’, or more accurately ‘observation of the economics involved in scaling integrated circuits,' has been a very useful guideline for several decades, but as with any similar types of projections, has been expected to some day run its course. While the exact timeframe is still uncertain, that ‘day’ is now within sight, and yet there are still no clear paths forward beyond that point. This presentation will provide a brief glimpse of some of the key materials-related challenges that exist within the frontend (devices), lithography, and backend-of-line (chip level interconnects). It will also include just a few of the research concepts that offer some potential paths forward, which the Semiconductor Research Corporation and its member companies are exploring alongside the university researchers they are supporting.

Sponsored By:
Extending Moore's Law

December 4, 2014 at 1:00 p.m. EST

Will IC capability, affordability and diversity continue to grow on a Moore’s Law cadence? Will our ability to make ICs denser and transistors smaller and cheaper slow down any time soon? Intel's Yan Borodovsky will discuss multiple path ahead for the industry to continue Moore’s Law for years to come, from the lithographer's perspective.

Sponsored By:

How the IoT is Driving Semiconductor Technology

January 2014 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
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VIDEOS



EVENTS



2014 IEEE International Electron Device Meeting
San Francisco, CA
http://www.his.com/~iedm/
December 15, 2014 - December 17, 2014
International Strategy Symposium 2015
Half Moon Bay, CA
http://www.semi.org/en/node/35136
January 11, 2015 - January 14, 2015
European 3D TSV Summit
Grenoble, France
www.semi.org/european3DTSVSummit
January 19, 2015 - January 21, 2015
SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015