Semiconductors

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SEMICONDUCTORS ARTICLES



Peregrine Semiconductor and RF Micro Devices settle outstanding litigation

07/23/2014  Peregrine Semiconductor Corporation, founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, and RF Micro Devices, Inc. (Nasdaq:RFMD), a designer and manufacturer of high-performance radio frequency solutions, today announced that they have settled all outstanding claims between the companies.

Micron 16nm NAND flash memory awarded Most Innovative Memory Device and Semiconductor of the Year

07/23/2014  Micron Technology, Inc. and TechInsights today announced that Micron has been honored with both the Most Innovative Memory Device and Semiconductor of the Year awards for their 16nm NAND Flash memory technology in TechInsights' 11th Annual Insight Awards.

A new multi-bit 'spin' for MRAM storage

07/23/2014  Interest in magnetic random access memory (MRAM) is escalating, thanks to demand for fast, low-cost, nonvolatile, low-consumption, secure memory devices. MRAM, which relies on manipulating the magnetization of materials for data storage rather than electronic charges, boasts all of these advantages as an emerging technology, but so far it hasn't been able to match flash memory in terms of storage density.

Understanding graphene’s electrical properties on an atomic level

07/23/2014  Graphene, a material that consists of a lattice of carbon atoms, one atom thick, is widely touted as being the most electrically conductive material ever studied. However, not all graphene is the same. With so few atoms comprising the entirety of the material, the arrangement of each one has an impact on its overall function.

Fundamental chemistry findings could help extend Moore’s Law

07/23/2014  A Berkeley Lab-Intel collaboration outlines the chemistry of photoresist, enabling smaller features for future generations of microprocessors.

Compact vibration harvester power supply with highest efficiency opens door to “Fix-and-Forget” sensor nodes

07/23/2014  OMRON and Holst Centre/imec have unveiled a prototype of an extremely compact vibrational energy harvesting DC power supply with worlds’ highest efficiency.

SEMI announces new South America Semiconductor Strategy Summit

07/22/2014  SEMI today announced the launch of the association's first-ever event in Latin America.

MORE SEMICONDUCTORS ARTICLES

HEADLINES

FORM 8-K: TRIQUINT SEMICONDUCTOR FILES CURRENT REPORT
July 24, 2014

Power Integrations' New LinkSwitch-3 ICs Meet 2016 DoE 6 EPS Efficiency Regulations for Smartphone and Tablet Chargers; Highly integrated devices enable charger designs up to 10 W with only 28 components
July 23, 2014

The polariton laser: With 250x lower power consumption, could this be the answer to on-chip optical interconnects?
July 23, 2014

The polariton laser: With 250x lower power consumption, could this be the answer to on-chip optical interconnects?
July 23, 2014

The Zacks Analyst Blog Highlights: Intel, NVIDIA, ARM Holding, VMware and Texas Instruments
July 23, 2014

A*STAR and Industry Form S$200M Semiconductor R&D Joint Labs
July 23, 2014

A*STAR and Industry Form S$200M Semiconductor R&D Joint Labs
July 23, 2014

AFTER YEARS OF LEADING THE CHARGE, SCHUMER ANNOUNCES LONG-AWAITED ARMY CORPS OF ENGINEERS PERMIT WILL BE SIGNED, SEALED AND DELIVERED THIS WEEK FOR THE MARCY NANO MULTI-BILLION DOLLAR COMPUTER CHIP MANUFACTURING PLANT; Schumer Has Relentlessly Pushed to Secure This Permit, Which Gives Project Long- Awaited Green Light - Schumer Has Repeatedly Met With Top-Ranking Army Corps Officials and Arranged First-Ever Meeting With EDGE, CNSE and Army Corps In Syracuse To Hatch New End-User Strategy; Sen. Charles E. Schumer (D-NY) News Release
July 23, 2014

Global English (Middle East and North Africa Financial Network)
July 18, 2014

Automotive semiconductor market size to exceed USD41 bln by 2021, report
June 12, 2014

FINANCIALS



TECHNOLOGY PAPERS



Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Wet Processing

July 2014 (date and time TBD) Wet processing including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions.

Sponsored By:
450 Update

July 2014 (date and time TBD) The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. Will you be ready? 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018. Unprecedented technical challenges still need to be overcome, but work is well underway. This webcast will provide an update on the current status of activities, key milestones and schedules, and the status of 450mm research on processes and devices.

Sponsored By:

Metrology

August 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
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