"Technology, Circuits & Systems for Smart Living" theme for 2018 Symposia on VLSI Technology & Circuits

03/21/2018  Bringing together a technical program that encompasses 'big integration' of a number of critical industry trends -- machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, and cloud computing -- the 2018 Symposia on VLSI Technology & Circuits will showcase a convergence of technologies needed for 'smart living.'

Automotive chip manufacturing in Japan drives innovation

03/21/2018  In Tokyo, Shanghai, Moscow, London, Paris or New York – wherever you are in the world –Japanese vehicles passing by on the roadways are a common sight.

RIT researchers improve fabrication process of nano-structures for electronic devices

03/21/2018  Use of indium gallium phosphide with I-MacEtch processing shows promise for more cost effective fabrication and increased performance in devices from photonics to telecommunications.

U.S. trade tensions with China hit fever pitch

03/21/2018  Stiff tariffs and the dismantling of longstanding trade agreements – cornerstones of these new actions – will ripple through the semiconductor industry with particularly damaging effect.

SEMICON West 2018 to spotlight smart technologies, workforce development

03/20/2018  SEMICON West has opened registration for the July 10-12, 2018, exposition at the Moscone Center in San Francisco, California.

CEA shows path to creating building blocks of quantum processors

03/20/2018  CEA-Leti, a French technology research institute of the CEA and Inac, a joint fundamental research institute between the CEA and the University Grenoble Alpes, today announced a breakthrough towards large-scale fabrication of quantum bits, or qubits, the elementary bricks of future quantum processors.

GLOBALFOUNDRIES launches RF ecosystem program to accelerate time-to-market for wireless connectivity, radar and 5G applications

03/20/2018  GLOBALFOUNDRIES today announced a new ecosystem partner program, called RFWave, designed to simplify RF design and help customers reduce time-to-market for a new era of wireless devices and networks.

UnitySC acquires HSEB Dresden GMBH

03/20/2018  Following the acquisition, the new entity's extended line of leading-edge process control solutions will provide a unique and essential inspection and metrology capability to semiconductor manufacturers.

Everspin signs long-term patent license agreement with Alps Electric

03/19/2018  Under the agreement, Alps and Everspin will mutually grant licenses to magnetoresistive-based 3D sensor patent portfolios for magnetoresistive sensor products.

Unexpected effect could lead to lower-power memory, computing devices

03/19/2018  An unexpected phenomenon known as zero field switching (ZFS) could lead to smaller, lower-power memory and computing devices than presently possible.

A future colorfully lit by mystifying physics of paint-on semiconductors

03/19/2018  Some novel materials that sound too good to be true turn out to be true and good. An emergent class of semiconductors, which could affordably light up our future with nuanced colors emanating from lasers, lamps, and even window glass, could be the latest example.

The ConFab 2018 announces conference agenda and speakers

03/16/2018  Browse this slideshow for a look at this year's speakers, keynotes, panel discussions, and special guests.

Broadcom withdraws offer to acquire Qualcomm

03/16/2018  The Trump administration issued a Presidential Order this week to block the acquisition.




3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

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Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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