Semiconductors

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SEMICONDUCTORS ARTICLES



A diamond as the steppingstone to new materials, using plasma physics technology

12/11/2017  Heating a mixture of gases to furnace temperatures is one way to make a diamond film, nature's hardest substance. Adding boron to the gas mixture may create new materials.

CVD completes purchase of 180,000 sq. ft. facility

12/08/2017  This new facility will be the primary manufacturing center for the Company’s wholly owned subsidiary, CVD Materials Corporation.

New power devices could drastically reduce energy waste

12/08/2017  New design could dramatically cut energy waste in electric vehicles, data centers, and the power grid.

Leti memory breakthrough point way to significant improvements in SoC memories

12/08/2017  Leti, a research institute of CEA Tech, demonstrated significant improvements in the field of memory systems at IEDM 2017 this week.

How to tame the electromagnetic interference in the fabs and beyond

12/07/2017  Electromagnetic interference (EMI) is an increasingly important topic across the global electronics manufacturing supply chain.

Smart management in the sub-fab improves safety, reliability, cost and yield

12/06/2017  With the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates.

Leti integrates hybrid III-V silicon lasers on 200mm wafers using standard CMOS process

12/06/2017  Leti, a research institute of CEA Tech, has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow.

The quantum waltz of electrons hints at the next generation of chips

12/06/2017  EPFL researchers have successfully measured some of the quantum properties of electrons in two-dimensional semiconductors. This work in the field of spintronics could one day lead to chips that are not only smaller but that also generate less heat.

Surface preparation technology provides pristine and stable hydrogen passivated semiconductor surfaces

12/06/2017  A new technology enables dramatically lower thermal budget capability that is enabling to thermal processes like epitaxy, CVD and diffusion, without any semiconductor material consumption.

Global semiconductor sales increase 21.9% year-to-year in October

12/05/2017  October marked the global industry's largest-ever monthly sales total.

Reveal previously invisible defects and contaminants in advanced packaging applications

12/05/2017  A new illumination technology compares favorably to conventional bright field illumination.

Researchers quantify factors for reducing power semiconductor resistance by two-thirds

12/05/2017  Discovery expected to lower energy consumption in electric power equipment.

SEMI reports record quarterly billings of $14.3B

12/05/2017  Quarterly billings of US$14.3 billion set an all-time record for quarterly billings, exceeding the record level set in the second quarter of this year.

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TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

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EVENTS



ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


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