The ConFab 2018 announces conference agenda and speakers

03/16/2018  Browse this slideshow for a look at this year's speakers, keynotes, panel discussions, and special guests.

Broadcom withdraws offer to acquire Qualcomm

03/16/2018  The Trump administration issued a Presidential Order this week to block the acquisition.

Synopsys and industry technologists to address the path to 2nm SoC design

03/16/2018  Synopsys, Inc. today announced it is hosting an advanced-technology panel on "EUV, High-NA, Metallurgy and FinFET++ - Where We Go from Here for Next-Generation Design" at the Synopsys Users Group (SNUG) Silicon Valley event on Thursday, March 22.

Synopsys' John Rogers named SPIE Fellow

03/15/2018  Each year, SPIE recognizes distinguished individuals in the field of optics and optoelectronics through its Fellows program.

Scientists observe nanowires as they grow

03/15/2018  For the first time, x-ray experiment reveals exact details of self-catalyzed growth.

Chemists use abundant, low-cost and non-toxic elements to synthesize semiconductors

03/15/2018  Javier Vela of Iowa State University and the Ames Laboratory has worked with two of his graduate students to synthesize a new material for semiconductors. The chemists think the material will work well in solar cells, but without the toxicity, scarcity or costs of other semiconductors. They report their discovery in a paper recently published online by the Journal of the American Chemical Society.

IC Insights raises 2018 IC market forecast from 8% to 15%

03/15/2018  Increased expectations for the DRAM and NAND flash markets spur upward revision.

Imec honors Qualcomm founder Irwin M. Jacobs with Lifetime of Innovation Award

03/14/2018  Imec, a research and innovation hub in nanoelectronics and digital technologies, today presented its annual Lifetime of Innovation Award to Dr. Irwin Jacobs, Founding Chairman and CEO Emeritus of Qualcomm.

Thermo Fisher Scientific showcases new solutions for enhancing productivity in the fab and lab at SEMICON China 2018

03/14/2018  New products focus on advanced analytical capabilities for failure analysis and process control.

Si2 approves two IC design simulation standards for fast-growing gallium nitride market

03/14/2018  The Silicon Integration Initiative's (Si2) Compact Model Coalition (CMC) has approved two integrated circuit design simulation standards that target the fast-growing global market for gallium nitride semiconductors.

EV Group and IBM sign license agreement on laser debonding technology

03/14/2018  IBM's Hybrid Laser Release Process technology complements EV Group's low-temperature laser debonding equipment and process portfolio designed to enable highly flexible, high-throughput solution.

GLOBALFOUNDRIES extends silicon photonics roadmap to meet explosive demand for datacenter connectivity

03/14/2018  Integrated photonics technologies enable improved bandwidth and energy efficiency for next-generation optical interconnects.

Researchers develop spectroscopic thermometer for nanomaterials

03/13/2018  A scientific team led by the Department of Energy's Oak Ridge National Laboratory has found a new way to take the local temperature of a material from an area about a billionth of a meter wide, or approximately 100,000 times thinner than a human hair.

Trump blocks Broadcom's takeover of Qualcomm

03/13/2018  Qualcomm Incorporated received a Presidential Order to immediately and permanently abandon the proposed takeover of Qualcomm by Broadcom Limited.

Silicon photonics industry is at the very beginning of a massive deployment

03/13/2018  Silicon photonics is today one of the most valuable answers to high data rate/low cost for distances beyond VCSEL's reach.

SEMI-THERM to take place March 19-23

03/13/2018  The 34th annual conference and exhibition will bring together leading industry experts to San Jose, CA to share ideas that will shape future technologies.

Flat gallium joins roster of new 2-D materials

03/12/2018  Scientists at Rice University and the Indian Institute of Science, Bangalore, have discovered a method to make atomically flat gallium that shows promise for nanoscale electronics.

Breakthrough in circuit design makes electronics more resistant to damage and defects

03/12/2018  A newly published paper in Nature Electronics details how researchers at the Advanced Science Research Center, GC/CUNY, used an array of nonlinear resonators to overcome signal disruption when electronic circuits are broken or damaged.

Fab spending poised for remarkable fourth year of growth

03/12/2018  The latest update to the SEMI World Fab Forecast report, published on February 28, 2018, reveals fab equipment spending will increase at 5 percent in 2019 for a remarkable fourth consecutive year of growth.



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
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Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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San Jose, CA
March 19, 2018 - March 23, 2018
LED Expo Thailand
Bangkok, Thailand
May 10, 2018 - May 12, 2018

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