Semiconductors

SEMICONDUCTORS ARTICLES



North American semiconductor equipment industry posts August 2016 book-to-bill ratio of 1.03

09/27/2016  A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

NXP introduces low power ARM Cortex-A7 based processor to fuel growth of the IoT

09/27/2016  At NXP FTF China today, NXP Semiconductors N.V. (NASDAQ:NXPI), officially announced the i.MX 6ULL applications processor which delivers up to 30 percent more power efficiency than its nearest competitors.

Process Watch: Salami slicing your yield

09/26/2016  The Process Watch series explores key concepts about process control -- defect inspection and metrology -- for the semiconductor industry. This new series of articles highlights additional trends in process control, including successful implementation strategies and the benefits for IC manufacturing.

EV Group extends volume manufacturing expertise to biotech and medical applications

09/26/2016  EV Group today announced that it is increasing its focus on bringing its high-volume manufacturing process solutions and services to the biotechnology and medical device market.

Shanhai Capital to acquire Analogix Semiconductor

09/23/2016  Analogix Semiconductor, Inc. and Beijing Shanhai Capital Management Co, Ltd. today jointly announced that they have entered into a definitive merger agreement under which a consortium led by Shanhai Capital will acquire all of the outstanding shares of Analogix for over $500 million.

SRC honors professors from University of Chicago and University of Michigan

09/22/2016  The Semiconductor Industry Association (SIA), in consultation with Semiconductor Research Corporation (SRC), today presented its University Research Award to professors from the University of Chicago and the University of Michigan in recognition of their outstanding contributions to semiconductor research.

Leti orders HERCULES NIL system from EV Group for joint nanoimprint lithography program

09/21/2016  EV Group (EVG) and Leti, an institute of CEA Tech, announced today that Leti has ordered a HERCULES NIL track system from EV Group.

2016 a sequel to last year’s M&A mania

09/21/2016  Value of semiconductor industry M&A agreements already over $50 billion this year.

Solid State Technology announces expanded conference for The ConFab 2017

09/21/2016  The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

NuMat Technologies and Linde form global partnership

09/20/2016  NuMat Technologies and The Linde Group have announced a collaborative partnership focused on the development of next generation separation and storage technologies that critically depend on material performance.

Intel appoints Bob Swan Executive Vice President and Chief Financial Officer

09/20/2016  Intel Corporation today announced the appointment of Robert H. Swan as executive vice president and chief financial officer (CFO), effective Oct. 10, 2016.

≤200mm semiconductor manufacturing is here to stay

09/20/2016  Ted Shafer of ASML reports on the highlights from the ≤200mm manufacturing session during SEMICON West, organized by the SEMI Secondary Equipment and Applications Special Interest Group.

Synopsys and TSMC collaborate on development of interface and foundation IP for 7nm FinFET process

09/19/2016  Synopsys, Inc. today announced the successful tapeout of multiple customer test chips with DesignWare Logic Libraries and Embedded Memories for TSMC's 7nm FinFET process.

Moore's Law did indeed stop at 28nm

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

GLOBALFOUNDRIES to deliver industry's leading-performance offering of 7nm FinFET technology

09/15/2016  This technology provides more processing power for data centers, networking, premium mobile processors, and deep learning applications.

Cascade Microtech introduces wafer-level electromigration test system

09/15/2016  Cascade Microtech today announced the launch of the Estrada-EM system.

GLOBALFOUNDRIES launches embedded MRAM on 22FDX platform

09/15/2016  High-performance embedded non-volatile memory solution is ideally suited for emerging applications in advanced IoT and automotive.

Actions Semiconductor enters into merger agreement for going private transaction

09/14/2016  Actions Semiconductor Co., Ltd. today announced that it has entered into a definitive merger agreement on September 12, 2016 pursuant to which the Company will be acquired by a consortium of investors.

Global semiconductor sales rebound in July

09/14/2016  The Semiconductor Industry Association announced worldwide sales of semiconductors reached $27.1 billion for the month of July 2016.

The future of Europe pitch their startups at SEMICON Europa's Innovation Village

09/14/2016  SEMI today announced that twenty-one start-ups have been selected to pitch to investors and exhibit their products at SEMICON Europa's INNOVATION VILLAGE in Grenoble, France at the Alpexpo from 25-27 October, 2016.




TWITTER


WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

September 27, 2016 at 1 p.m. ET / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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EVENTS



SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017

VIDEOS