Semiconductors

SEMICONDUCTORS ARTICLES



Toshiba and Western Digital reach global settlement and agree to strengthen flash memory collaboration

12/14/2017  As part of this agreement, TMC and Western Digital will participate jointly in future rounds of investment in Fab 6, the memory fabrication facility now under construction at Yokkaichi, including the upcoming investment round announced by Toshiba in October 2017.

IXYS announces 200V power MOSFETs with fast body diodes and lowest on-resistances

12/14/2017  Fabricated using a charge compensation principle and IXYS' own process technology, these new MOSFETs exhibit the lowest on-state resistances in the industry.

New insight into battery charging supports development of improved electric vehicles

12/14/2017  First technique capable of determining lithium metal plating during lithium ion battery charging reported in Materials Today.

QuickLogic collaborates with Mentor to provide seamless design environment for eFPGA technology

12/14/2017  QuickLogic Corporation, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, display bridge and programmable logic solutions, announced that it has collaborated with Mentor, a Siemens business, to provide a seamless design and development environment for its embedded FPGA (eFPGA) technology.

Industry enters the age of WOW

12/13/2017  The semiconductor industry has been there before, with large increases in investments followed by dramatic downturns. While the most dramatic downturns, 2001 and 2009, were due to, in a large part, acro-economic factors, the industry has typically observed one to two years of increased investment spending followed by a down period. This time around, the industry will achieve a “WOW” with three consecutive years of fab investment growth, a pattern not observed since the mid-1990s.

4Q DRAM sales put exclamation point on an amazing year of growth

12/13/2017  Forecast for record quarterly DRAM sales of $21.1 billion, with 74% annual growth expected.

New silicon structure opens the gate to quantum computers

12/12/2017  In a major step toward making a quantum computer using everyday materials, a team led by researchers at Princeton University has constructed a key piece of silicon hardware capable of controlling quantum behavior between two electrons with extremely high precision.

ProPlus and MPI Corporation establish strategic partnership

12/12/2017  ProPlus Design Solutions Inc. and MPI Corporation today announced a strategic partnership agreement and immediate availability of a characterization and modeling solution that integrates ProPlus' SPICE modeling and noise characterization solution with MPI's advanced probing technologies.

National Academy of Inventors announces SUNY Poly professor Dr. Bin Yu selected as 2017 NAI Fellow

12/12/2017  Dr. Yu selected for significant contributions to semiconductor-based devices, nanotechnology research after being awarded more than 300 U.S. patents.

$55.9B semiconductor equipment forecast: New record with Korea at top

12/12/2017  Today, SEMI, the global industry association representing the electronics manufacturing supply chain, released its Year-end Forecast at the annual SEMICON Japan exposition.

EVG installs low-temp plasma activation system at the University of Tokyo

12/12/2017  EVG 810LT system enables low-temperature direct wafer bonding of III-V compound semiconductor materials and germanium-on-silicon wafers with field-proven high-quality plasma surface preparation.

A diamond as the steppingstone to new materials, using plasma physics technology

12/11/2017  Heating a mixture of gases to furnace temperatures is one way to make a diamond film, nature's hardest substance. Adding boron to the gas mixture may create new materials.

CVD completes purchase of 180,000 sq. ft. facility

12/08/2017  This new facility will be the primary manufacturing center for the Company’s wholly owned subsidiary, CVD Materials Corporation.

New power devices could drastically reduce energy waste

12/08/2017  New design could dramatically cut energy waste in electric vehicles, data centers, and the power grid.

Leti memory breakthrough point way to significant improvements in SoC memories

12/08/2017  Leti, a research institute of CEA Tech, demonstrated significant improvements in the field of memory systems at IEDM 2017 this week.

How to tame the electromagnetic interference in the fabs and beyond

12/07/2017  Electromagnetic interference (EMI) is an increasingly important topic across the global electronics manufacturing supply chain.

Smart management in the sub-fab improves safety, reliability, cost and yield

12/06/2017  With the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates.

Leti integrates hybrid III-V silicon lasers on 200mm wafers using standard CMOS process

12/06/2017  Leti, a research institute of CEA Tech, has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow.

The quantum waltz of electrons hints at the next generation of chips

12/06/2017  EPFL researchers have successfully measured some of the quantum properties of electrons in two-dimensional semiconductors. This work in the field of spintronics could one day lead to chips that are not only smaller but that also generate less heat.

Surface preparation technology provides pristine and stable hydrogen passivated semiconductor surfaces

12/06/2017  A new technology enables dramatically lower thermal budget capability that is enabling to thermal processes like epitaxy, CVD and diffusion, without any semiconductor material consumption.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

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EVENTS



ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


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VIDEOS