Semiconductors

SEMICONDUCTORS ARTICLES



Advancing the path to organic electronics beyond cell phone screens

01/12/2018  A discovery by an international team of researchers from Princeton University, the Georgia Institute of Technology and Humboldt University in Berlin points the way to more widespread use of an advanced technology generally known as organic electronics.

Worldwide PC shipments declined 2% in 4Q17 and 2.8% for the year

01/12/2018  Amid market consolidation, the top four PC vendors accounted for 64% of shipments in 2017.

Analog IC market forecast with strongest annual growth through 2022

01/12/2018  Power management, signal conversion, and automotive-specific analog markets drive expansion.

Worldwide semiconductor revenue grew 22.2% in 2017; Samsung takes over No. 1 position

01/11/2018  Worldwide semiconductor revenue totalled $419.7 billion in 2017, a 22.2 percent increase from 2016, according to preliminary results by Gartner, Inc. Undersupply helped drive 64 percent revenue growth in the memory market, which accounted for 31 percent of total semiconductor revenue in 2017.

Luc Van den hove to receive SEMI Sales and Marketing Excellence Award

01/11/2018  SEMI today announced that Luc Van den hove, president and CEO of imec, has been selected as the 2018 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham. He will be honored for outstanding achievement in semiconductor equipment and materials marketing during ceremonies at ISS 2018 on January 17 in Half Moon Bay, California.

Extremely bright and fast light emission

01/11/2018  An international team of researchers from ETH Zurich, IBM Research Zurich, Empa and four American research institutions have found the explanation for why a class of nanocrystals that has been intensively studied in recent years shines in such incredibly bright colours.

Process Watch: The (automotive) problem with semiconductors

01/11/2018  This article is the first in a five-part series on semiconductors in the automotive industry. In this article, we introduce some of the challenges involved in the automotive supply chain. Future articles in the series will address specific process control solutions to those challenges.

Talent pipeline key to enabling industry growth: Takeaways from SEMI Member Forum

01/10/2018  These were key highlights from a SEMI Member Forum in December that brought together industry representatives and students in Dresden to weigh in on job-skills challenges facing the electronics manufacturers and solutions for the industry to consider.

Making the Internet of Things possible with a new breed of 'memristors'

01/10/2018  Easily printable, organic thin films can retain data for more than 10 years without power, work with low voltages -- and become the building block of future computers that mimic the human brain.

New oxide and semiconductor combination builds new device potential

01/10/2018  Researchers integrated oxide two-dimensional electron gases with gallium arsenide and paved the way toward new opto-electrical devices.

New Multibeam patent enhances highly-localized precision material removal

01/10/2018  Multibeam Corporation today disclosed a new patent that describes the innovative use of e-beam technology for highly localized precision etching in manufacturing advanced memory and logic ICs.

ON Semiconductor and ConvenientPower Systems announce strategic collaboration in automotive wireless charging

01/09/2018  ON Semiconductor has announced a strategic collaboration with ConvenientPower Systems (CPS) whereby CPS will design, develop and market in-vehicle wireless charging solutions using ON Semiconductor’s NCV6500 application dedicated, power management controller.

Arrow completes acquisition of eInfochips

01/09/2018  Arrow Electronics, Inc. announced today the successful completion of its acquisition of eInfochips, one of the world’s largest design and managed services companies.

Semtech appoints Chris Chang to executive management team

01/09/2018  Semtech Corporation, a supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, today announced Chris Chang has joined the Company as Senior Vice President, Corporate Marketing and Business Development.

STMicroelectronics selects GLOBALFOUNDRIES 22FDX to extend its FD-SOI platform

01/09/2018  GLOBALFOUNDRIES and STMicroelectronics today announced that ST has selected GF's 22nm FD-SOI (22FDX) technology platform to support its next-generation of processor solutions for industrial and consumer applications.

Semtech enables IoT of the future with next generation LoRa platform

01/08/2018  Semtech Corporation, a supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced its next generation LoRa devices and wireless radio frequency (RF) technology (LoRa Technology) chipsets enabling innovative LPWAN use cases for consumers with its advanced technology.

Micron and Intel announce update to NAND memory joint development program

01/08/2018  Micron and Intel today announced an update to their successful NAND joint development partnership that has helped the companies develop and deliver industry-leading NAND technologies to market.

Room-temperature multiferroic thin films and their properties

01/08/2018  Scientists at Tokyo Institute of Technology (Tokyo Tech) and Tohoku University have developed high-quality GFO epitaxial films and systematically investigated their ferroelectric and ferromagnetic properties. They also demonstrated the room-temperature magnetocapacitance effects of these GFO thin films.

SEMI and Fab Owners Association strengthen supply chain

01/08/2018  With integration complete, FOA is managed as a Special Interest Group (SIG) within SEMI. FOA member companies will become full SEMI members, with FOA continuing to expand its global membership through SEMI's global network, while maintaining its unique community.

NRL improves optical efficiency in nanophotonic devices

01/05/2018  A team of physicists, headed by the U.S. Naval Research Laboratory (NRL), have demonstrated the means to improve the optical loss characteristics and transmission efficiency of hexagonal boron nitride devices, enabling very small lasers and nanoscale optics.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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EVENTS



DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


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