Semiconductors

SEMICONDUCTORS ARTICLES



SEMI April 2015 book-to-bill report shows continued improvements in bookings and billings

05/21/2015  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

Research institutes globally invest in Oxford Instruments' plasma systems for graphene and 2D materials development

05/21/2015  As developments in graphene and 2D materials technology continue to increase, research institutes globally are investing in Oxford Instruments’ plasma processing Nanofab equipment using CVD, PECVD and ICPCVD techniques to further their work in this important area.

Advantest develops semiconductor circuit analysis terahertz technology

05/21/2015  Semiconductor test equipment supplier Advantest Corporation announced today that it has developed a technology utilizing short-pulse terahertz waves for analysis of electrical circuits.

Samtec joins IRT Nanoelec Silicon Photonics Program

05/21/2015  Samtec, Inc., a supplier of high-speed interconnects, microelectronics, and micro-optical solutions, is pleased to announce its entrance in the Silicon Photonics Program of the IRT Nanoelec.

SRC awarded NIST funding to develop Semiconductor Synthetic Biology Consortium

05/21/2015  Semiconductor Research Corporation announced that it has received funding from the National Institute of Standards and Technology (NIST) Advanced Manufacturing Technology (AMTech) program to create a Semiconductor Synthetic Biology (SemiSynBio) consortium whose mission is to develop a SemiSynBio roadmap.

Six top 20 semiconductor suppliers show >20% growth

05/21/2015  SK Hynix moves into top 5, MediaTek climbs into top 10, and Sharp and UMC move into the top 20 ranking.

3D NAND, MRAM, RRAM: Emerging opportunities and challenges for the changing memory market

05/21/2015  Ever growing volumes of data to be stored and accessed, and advancing process technologies for sophisticated control of deposition and etch in complex stacks of new materials, are creating a window of opportunity for an emerging variety of next-generation non-volatile memory technologies.

imec and Tokyo Electron demonstrate electrical advantages of direct Cu etch scheme for advanced interconnects

05/20/2015  Today, at the IEEE IITC conference, nano-electronics research center imec and Tokyo Electron Limited (TEL) presented a direct Cu etch scheme for patterning Cu interconnects.

GLOBALFOUNDRIES offers new low-power 28nm solution for high-performance mobile and IoT applications

05/20/2015  Technology is the first in the industry to provide design enablement support optimized to meet low power requirements of RF SoCs.

Advantest launches its first integrated test solution for optical transceivers

05/19/2015  Semiconductor test equipment supplier Advantest Corporation has introduced its new 28G OPM (28-gigabit Optical Port Module), the company's first solution designed specifically for testing optical transceivers.

Freescale introduces its first GaN RF power transistor for cellular base stations

05/19/2015  Freescale Semiconductor today introduced its first gallium nitride (GaN) RF power transistor for cellular base stations.

Peregrine Semiconductor announces new general manager VP

05/19/2015  Peregrine Semiconductor Corp., founder of RF SOI, today announced the promotion of Duncan Pilgrim to vice president and general manager of the newly formed high performance analog (HPA) business unit.

Computing at the speed of light

05/19/2015  University of Utah engineers have taken a step forward in creating the next generation of computers and mobile devices capable of speeds millions of times faster than current machines.

EV Group NILphotonics Competence Center sees strong demand For emerging photonic applications

05/19/2015  Newly launched center assisting customers in developing products and applications in photonics; leads to multiple system orders.

imec and Lam Research develop novel metallization method

05/19/2015  During the IEEE IITC conference in Grenoble, the nanoelectronics research center imec and Lam Research Corporation today presented a novel bottom-up prefill technique for vias and contacts.

First quarter silicon wafer shipments reach record levels

05/19/2015  Worldwide silicon wafer area shipments increased during the first quarter 2015 when compared to fourth quarter 2014 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Applied Materials' breakthrough patterning hard mask enables copper interconnect scaling

05/19/2015  Applied Materials, Inc. today announced its Applied Endura Cirrus HTX PVD system with breakthrough technology for patterning copper interconnects at 10nm and beyond.

Random nanowire configurations increase conductivity over heavily ordered configurations

05/15/2015  Researchers at Lehigh University have identified for the first time that a performance gain in the electrical conductivity of random metal nanowire networks can be achieved by slightly restricting nanowire orientation.

Silicon Storage Technology, GLOBALFOUNDRIES announce qualification of automotive grade 55nm embedded flash tech

05/15/2015  Microchip Technology Inc. and GLOBALFOUNDRIES today announced the full qualification and availability of SST's 55nm embedded SuperFlash non-volatile memory (NVM) on GLOBALFOUNDRIES' 55nm Low Power Extended (LPx)/ RF enabled platform.

SEMICON West 2015 focuses on the most critical issues in semiconductor manufacturing

05/15/2015  SEMI today announced the SEMICON West 2015 technical and business program agenda tackling the most important issues facing the future of semiconductor manufacturing.




HEADLINES

FINANCIALS



TECHNOLOGY PAPERS



Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Sensor Fusion and the Role of MEMS in IoT

Thursday May 28, 2015 at 1:00 p.m. EST

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Interconnects

June 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Understanding Defects

July 2015 (Date and time TBD)

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015
Design Automation Conference (DAC)
San Francisco, CA
https://dac.com
June 07, 2015 - June 11, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015