Semiconductors

SEMICONDUCTORS ARTICLES



The future of electronics -- now in 2-D

02/20/2015  The future of electronics could lie in a material from its past, as researchers from The Ohio State University work to turn germanium--the material of 1940s transistors--into a potential replacement for silicon.

Penn researchers develop new technique for making molybdenum disulfide

02/20/2015  University of Pennsylvania researchers have made an advance in manufacturing one such material, molybdenum disulphide.

Micron appoints Robert Peglar as Vice President of Advanced Storage Solutions

02/19/2015  Micron Technology, Inc. today announced that Robert Peglar has been named as vice president of Advanced Storage Solutions.

KLA-Tencor extends its 5D patterning control solution with new metrology systems

02/19/2015  Today, KLA- Tencor Corporation introduced two advanced metrology systems that support the development and production of 16nm and below IC devices: Archer 500LCM and SpectraFilm LD10.

Mentor Graphics announces call for entries for Don Miller Award for Thermo-Fluid Design Excellence

02/19/2015  Mentor Graphics Corporation today announced the call-for-entries for its first annual Don Miller Award for Excellence in System Level Thermo-Fluid Design.

Call for Papers open for SEMICON Europa 2015 and Plastic Electronics 2015

02/19/2015  SEMI today announced the "Call for Papers" for technical sessions and presentations for SEMICON Europa 2015 which takes place October 6-8 in Dresden, Germany. Technical presentation abstracts are due April 30.

China's semiconductor investment plans focus of SEMICON China 2015

02/19/2015  China's new industry investment and government promotion policies outlined in the recent "National Guidelines for Development and Promotion of the IC Industry" represents major opportunities for China and global semiconductor companies.

Imec reports breakthrough results on DSA

02/19/2015  At next week’s SPIE advanced lithography conference, to be held in San Jose, Calif., Feb. 22-26, imec will present breakthrough results on Directed Self-Assembly (DSA) process development.

Novel crumpling method takes flat graphene from 2-D to 3-D

02/17/2015  Researchers at the University of Illinois at Urbana-Champaign have developed a unique single-step process to achieve three-dimensional (3D) texturing of graphene and graphite.

Samsung announces mass production of industry’s first 14nm finFET mobile application processor

02/17/2015  Samsung Electronics Co., Ltd. announced that it has begun mass production of industry’s first mobile application processor using the advanced 14-nanometer (nm) FinFET process technology.

Novel solid-state nanomaterial platform enables terahertz photonics

02/17/2015  cientists are pioneering the use of nanomaterials in compact, sensitive, fast, low-cost terahertz detectors with potential in applications such as biomedical diagnostics, airport security screening and high data-rate wireless communication

eBeam Initiative announces education and collaboration focus on reactivating density benefits of Moore's Law

02/17/2015  The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced that its top theme for 2015 will be the reactivation of the density benefits of Moore's Law through eBeam technology.

Gigaphoton achieves continuous 140W EUV light source output at 50% duty cycle

02/17/2015  Further contributing to the realization of a mass production-quality LPP light source for EUV scanners

Security should not be hard to implement

02/17/2015  Data is ubiquitous today. It is generated, exchanged and consumed at unprecedented rates.

Ghent University and imec demonstrate interaction between light and sound in nanoscale waveguide

02/17/2015  Silicon photonics enables extreme light-matter interaction.

Extreme-temperature electronics

02/13/2015  Many industries are calling for electronics that can operate reliably in a harsh environment, including extreme temperatures above 200° Celsius.

Researchers glimpse distortions in atomic structure of materials

02/13/2015  Researchers from North Carolina State University are using a technique they developed to observe minute distortions in the atomic structure of complex materials, shedding light on what causes these distortions and opening the door to studies on how such atomic-scale variations can influence a material's properties.

Giga-scale challenges will dominate 2015

02/13/2015  It wasn’t all that long ago when nano-scale was the term the semiconductor industry used to describe small transistor sizes to indicate technological advancement.

Imec and Holst Centre to present key achievements at ISSCC 2015

02/12/2015  At this year’s International Solid State Circuits Conference to be held in San Francisco, Calif., Feb. 22-26, imec and Holst Centre will present eight scientific papers covering groundbreaking results on ultra-low power design for wireless broadband communication, for wireless sensor networks, and organic electronics.

Silicon wafer shipments reach record levels in 2014

02/11/2015  Worldwide silicon wafer area shipments increased 11 percent in 2014 when compared to 2013 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.




FINANCIALS



TECHNOLOGY PAPERS



How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015