Semiconductors

SEMICONDUCTORS ARTICLES



Global semiconductor sales increase in February compared to last year

04/06/2015  The Semiconductor Industry Association today announced worldwide sales of semiconductors reached $27.8 billion for the month of February 2015, an increase of 6.7 percent from February 2014 when sales were $26.0 billion.

TSMC certifies Synopsys design tools for 16nm finFET plus production and for 10nm early design starts

04/06/2015  This certification enables mutual customers to deploy tools in Synopsys' Galaxy Design Platform for 16nm production designs and 10nm early engagements.

AWSC purchases ClassOne’s Solstice S8 electroplater

04/03/2015  Semiconductor equipment manufacturer ClassOne Technology announced the sale and delivery of its Solstice S8 Plating System to Advanced Wireless Semiconductor Company (AWSC) of Taiwan.

U.S.-headquartered companies capture bulk of IDM, fabless IC sales

04/03/2015  Recent acquisitions expeted to boost Europe's share in coming years.

Southeast Asia to spend $19B for semiconductor equipment and materials by 2016

04/02/2015  Programme information is now available on the inaugural SEMICON Southeast Asia, which will run from 22–24 April at SPICE in Penang.

Imaging tomorrow’s components, acoustically

04/02/2015  Packages are changing. Acoustic methods provide a way to image and analyze them.

Advanced analytics for yield improvement and zero defect in semiconductors

04/02/2015  Machine learning based advanced analytics for anomaly detection offers powerful techniques that can be used to achieve breakthroughs in yield and field defect rates.

Supplier Hub answers the needs of a changing semiconductor industry

04/02/2015  Supplier Hub answers the needs of a changing semiconductor industry.

Pibond introduces a new product line for logic, memory, power and MEMS devices

04/01/2015  Targeting 10nm node semiconductor processing, 3D NAND, power ICs as well as MEMS applications, this technology enables advanced device manufacturing through reduced cost of ownership (COO) and simplified processing.

NXP-Freescale fusion creates automotive semiconductor powerhouse, IHS Says

03/31/2015  The merged company would become the leading supplier of semiconductors to the automotive market, with at least $1 billion more revenue than the next-largest supplier, Renesas.

Imec and sureCore collaborate on SRAM Design IP

03/31/2015  sureCore Ltd., the low power SRAM IP company and nanoelectronics R&D center imec today announced that they are collaborating on low-power SRAM IP.

University of Illinois at Urbana-Champaign research reduces microprocessor serial link power consumption

03/31/2015  SRC sponsored research promises to cut serial link power by 80 Percent, helping extend Moore’s Law.

Deeper Dive: Xpedition Enables Co-Design of Chips, Packages, Boards

03/31/2015  A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools. The platform enables chip, package and board designers to easily see how changing various design elements impact adjacent designs, an industry first.

Solving molybdenum disulfide's 'thin' problem

03/27/2015  Research team increases material's light emission by twelve times.

Chemists make new silicon-based nanomaterials

03/27/2015  Chemists from Brown University have come up with a way to make new nanomaterials from a silicon-based compound.

Micron and Intel unveil new 3D NAND flash memory

03/26/2015  Micron Technology, Inc. and Intel Corporation today revealed the availability of their 3D NAND technology, the world’s highest-density flash memory.

Synopsys founder has plenty of work to do, isn't interested in politics

03/26/2015  Aart de Geus is not running for governor of California.

Imec demonstrates 50GHz Ge waveguide electro-absorption modulator

03/25/2015  At this week’s OFC 2015, the largest global conference and exposition for optical communications, nanoelectronics research center imec, its associated lab at Ghent University (Intec), and Stanford University have demonstrated a compact germanium (Ge) waveguide electro-absorption modulator (EAM) with a modulation bandwidth beyond 50GHz.

Dr. Terry Brewer receives the Kathryn C. Hach Award for Entrepreneurial Success from the American Chemical Society

03/25/2015  Dr. Terry Brewer, founder and CEO of Brewer Science, was presented the Kathryn C. Hach Award for Entrepreneurial Success on Tuesday, March 24, 2015, at the American Chemical Society’s 249th National Meeting.

Optoelectronics, sensors/actuators, and discretes growth accelerates

03/25/2015  After two years of sluggishness, O-S-D sales strengthen with an improving economy and a boost from new applications, says new 2015 report.




HEADLINES

FINANCIALS



TECHNOLOGY PAPERS



ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

More Technology Papers

WEBCASTS



3D Integration: The Most Effective Path for Future IC Scaling

Thursday, April 23, 2015 at 12:00 p.m. EST

It is well recognized that dimensional scaling has reached its diminishing return phase. The industry is now looking at monolithic 3D to be the future technology driver. Yet, until recently, the path to monolithic 3D has required the development of new transistor types and processes. This Webcast will present game-changing monolithic 3D process flows which use the existing transistor of existing manufacturing line and existing process flows. Now the most effective path for future IC scaling is indeed monolithic 3D, which offers the lowest development and manufacturing cost for future ICs.

Sponsored By:
Trends in Materials: The Smartphone Driver

Thursday, April 30, 2015 at 1:00 p.m. EST

To understand 3-D FinFET doping and high mobility channel material, this talk will first review the current doping and Fin/channel mobility enhancement techniques used for 22nm FinFET production by Intel for both high performance logic and SOC devices and the changes they made for their 2nd generation 14nm FinFET.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015