Semiconductors

SEMICONDUCTORS ARTICLES



New computing system takes its cues from the human brain

06/12/2017  The new system employs a network of electronic oscillators to solve graph coloring tasks – a type of problem that tends to choke modern computers.

Cypress Executive Chairman Ray Bingham steps down from Board

06/12/2017  Cypress Semiconductor Corporation announced that Executive Chairman Ray Bingham has tendered his resignation as Executive Chairman and is stepping down from the Board of Directors.

The drive to smart manufacturing

06/09/2017  What does Smart Manufacturing mean for the future of the electronics manufacturing supply chain?

Researchers image quasiparticles that could lead to faster circuits, higher bandwidths

06/09/2017  A research team led by Iowa State University's Zhe Fei has made the first images of half-light, half-matter quasiparticles called exciton-polaritons. The discovery could be an early step to developing nanophotonic circuits that are up to 1 million times faster than current electrical circuits.

SEMICON West preview: Equipment components and subsystems

06/08/2017  Attention turns to subcomponents to improve yields at advanced nodes.

Imec achieves record-low source/drain contact resistivity for PMOS transistors

06/08/2017  Imec is wrapping up at the Symposia on VLSI Technology this week with two announcements: the reporting of record breaking values below 10^-9 Ohm.cm² for PMOS source/drain contact resistivity and new process improvements for next generation devices.

Long-term IoT semiconductor forecast reduced

06/08/2017  Total IoT forecast scaled back mostly because of lower revenue projections for connected cities.

Global semiconductor sales increase 21% year-to-year in April

06/07/2017  Double-digit annual growth projected for 2017.

Imec demonstrates breakthrough in CMOS-compatible ferroelectric memory

06/07/2017  Imec has proved the validity of ferroelectric memory as a promising technology at various points in the memory hierarchy, and as a new technology for storage class memory -- today, it demonstrated the world's first a vertically stacked ferroelectric Al doped HfO2 device for NAND applications.

Supply chain needs paradigm shift in how to look at defect control

06/07/2017  The future of contamination control in the next-generation supply chain for beyond 14nm-node semiconductor processes faces stringent challenges.

SIA welcomes DARPA initiative to advance transformative semiconductor technologies

06/06/2017  New program aims to progress beyond traditional scaling, catalyze next-generation semiconductor technologies.

SEMI reports record quarterly billings of $13.1B

06/06/2017  The quarter ended very strong, with March billings reaching $5.6 billion, an all-time monthly record.

Record fab spending for 2017 and 2018

06/06/2017  In 2017, over US$49 billion will be spent on equipment alone, a record for the semiconductor industry. Spending on new fab construction is projected to reach over $8 billion, the second largest year on record.

Engineer unveils new spin on future of transistors with novel design

06/05/2017  All-carbon, spintronic proposal could lead to smaller, better performing structures in electronics.

Seeing the invisible with a graphene-CMOS integrated device

06/05/2017  Flagship researchers integrate graphene and quantum dots with CMOS technology to create an array of photodetectors, producing a high resolution image sensor.

IBM Research Alliance builds new transistor for 5nm technology

06/05/2017  Less than two years since announcing a 7nm test chip, scientists have achieved another breakthrough.

Model for 2-D materials based RRAM found

06/02/2017  The group lead by Prof. Mario Lanza develops a resistive random access memory device using only 2-D materials (graphene electrodes and hexagonal boron nitride insulators), and develop a complete theoretical model to describe its functioning.

Queen's researcher's 'miracle material' discovery could end cracked smart devices

06/02/2017  A Queen's University researcher has led an international team of scientists to the discovery of a new material, which could finally bring an end to the misery of cracked smartphone and tablet screens.

"Billion Dollar Capex Club" forecast to swell to 15 companies in 2017

06/01/2017  Top spenders expected to represent 83% of total semiconductor industry spending this year.

Volatility in electronic equipment supply chain

06/01/2017  SEMI’s year-to-date worldwide semiconductor equipment billings year-to-date through March show a 59.6 percent gain to the same period last year.




TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Date and time TBD

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Microelectronics Tech Asia Singapore 2017
ITE College Center, Singapore
http://www.microelectronics.sg
July 04, 2017 - July 05, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017
SEMICON West 2017
San Francisco, CA
http://www.semiconwest.org
July 11, 2017 - July 13, 2017

VIDEOS