Semiconductors

SEMICONDUCTORS ARTICLES



Synopsys and TSMC collaborate on development of interface and foundation IP for 7nm FinFET process

09/19/2016  Synopsys, Inc. today announced the successful tapeout of multiple customer test chips with DesignWare Logic Libraries and Embedded Memories for TSMC's 7nm FinFET process.

Moore's Law did indeed stop at 28nm

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

GLOBALFOUNDRIES to deliver industry's leading-performance offering of 7nm FinFET technology

09/15/2016  This technology provides more processing power for data centers, networking, premium mobile processors, and deep learning applications.

Cascade Microtech introduces wafer-level electromigration test system

09/15/2016  Cascade Microtech today announced the launch of the Estrada-EM system.

GLOBALFOUNDRIES launches embedded MRAM on 22FDX platform

09/15/2016  High-performance embedded non-volatile memory solution is ideally suited for emerging applications in advanced IoT and automotive.

Actions Semiconductor enters into merger agreement for going private transaction

09/14/2016  Actions Semiconductor Co., Ltd. today announced that it has entered into a definitive merger agreement on September 12, 2016 pursuant to which the Company will be acquired by a consortium of investors.

Global semiconductor sales rebound in July

09/14/2016  The Semiconductor Industry Association announced worldwide sales of semiconductors reached $27.1 billion for the month of July 2016.

The future of Europe pitch their startups at SEMICON Europa's Innovation Village

09/14/2016  SEMI today announced that twenty-one start-ups have been selected to pitch to investors and exhibit their products at SEMICON Europa's INNOVATION VILLAGE in Grenoble, France at the Alpexpo from 25-27 October, 2016.

Asia-Pacific to top 2016 regional IC sales in major system categories

09/14/2016  Government/Military only end-use segment where Asia-Pacific does not have top IC marketshare.

Tuning materials and devices to adapt to their environment

09/13/2016  University of California, Santa Barbara researchers pursue future radio-frequency materials and devices.

UC Berkeley, University of Minnesota professors recognized at annual SRC TECHCON Conference

09/13/2016  Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, presented its highest honors Sept. 12 to professors from University of California, Berkeley and University of Minnesota at SRC's annual TECHCON conference in Austin, Texas.

SEMI’s new interactive mobile fab forecast: SEMI FabView

09/13/2016  SEMI, a supplier of independent semiconductor market research, today announced SEMI FabView, a mobile-friendly, interactive version of its popular World Fab Forecast quarterly report for electronic supply chain players and analysts.

Silicon nanoparticles instead of expensive semiconductors

09/12/2016  Within an international collaboration, physicists of the Moscow State University replace expensive semiconductors with affordable silicon nanoparticles for display production.

One-pot synthesis towards sulfur-based organic semiconductors

09/12/2016  A short and simple synthetic route for thiophene-fused aromatic compounds.

Qualcomm Communication Technologies opens in Shanghai for semiconductor test manufacturing

09/12/2016  Qualcomm Incorporated (NASDAQ: QCOM) today announced the opening of Qualcomm Communication Technologies (Shanghai) Co. Ltd., a semiconductor test facility in the Waigaoqiao (WGQ) free-trade zone in Shanghai, and its first foray into providing manufacturing services for semiconductors.

Liquid to liquid ambient cooling systems for semiconductor tools

09/09/2016  An overview of liquid-to-liquid cooling systems and their operating principles.

Synopsys joins GLOBALFOUNDRIES' FDXcelerator partner program

09/09/2016  Synopsys, Inc. and GLOBALFOUNDRIES today announced that Synopsys has joined the foundry's FDXcelerator Partner Program, an ecosystem designed to facilitate 22FDX system-on-chip (SoC) designs.

GLOBALFOUNDRIES extends FDX roadmap with 12nm FD-SOI technology

09/08/2016  GLOBALFOUNDRIES today unveiled a new 12nm FD-SOI semiconductor technology, extending its leadership position by offering the industry's first multi-node FD-SOI roadmap.

Fab equipment spending ascending

09/08/2016  Expect 4% growth (YoY) for 2016 and 11% for 2017

M+W Group presents an integrated waste program for semiconductor facilities

09/08/2016  The global high-tech engineering and construction company M+W Group has presented current and future trends, as well as state of the art solutions, for an integrated approach to waste reduction in order to improve the sustainability of semiconductor fabs




TWITTER


WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

September 27, 2016 at 1 p.m. ET / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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EVENTS



SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017

VIDEOS