Semiconductors

SEMICONDUCTORS ARTICLES



Diamond-based light sources could lay a foundation for quantum communications of the future

08/08/2016  Electrified quantum diamond could become the heart of quantum networks and computers of the future.

ON Semiconductor joins Automotive Equipment Supplier Association

08/05/2016  ON Semiconductor (Nasdaq: ON) this week announced that it is joining the Original Equipment Suppliers Association.

IBM scientists imitate the functionality of neurons with a phase-change device

08/05/2016  Technology could lead to the development of neuromorphic computers with highly co-located memory and processing units to speed up cognitive computing and analyze IoT Big Data.

Cascade Microtech releases 1/f measurement solution with Keysight Technologies

08/05/2016  Cascade Microtech today announced the release of a comprehensive low-frequency noise measurement solution for device modeling, characterization and reliability testing with MeasureOne solution partner Keysight Technologies.

Park Systems launches Park NX20 300mm research AFM with full 300mm semiconductor wafer scan

08/05/2016  Park Systems announced NX20 300mm, the only AFM on the market capable of scanning the entire sample area of 300mm wafers using a 300mm vacuum chuck while keeping the system noise level below 0.5angstrom RMS.

Microsemi announces production release of second generation high performance Flashtec NVMe controllers

08/04/2016  Microsemi Corporation today announced the production release of its Flashtec NVM Express (NVMe)2032 and NVMe2016 controllers.

Intel appoints new CIO

08/04/2016  Intel appointed Paula Tolliver as corporate vice president and chief information officer (CIO), replacing Kim Stevenson who will take on a new role at the company.

Samco opens new office in Malaysia

08/04/2016  Samco, a semiconductor process equipment developer and manufacturer based in Japan, announced that it will open its Malaysia branch office on Aug. 10, 2016 in Petaling Jaya, a suburb of Kuala Lumpur.

Huge 2H16 spending surge expected from Samsung, TSMC, and Intel

08/04/2016  Combined outlays from the “Big 3” spenders is forecast to almost double in 2H16 over 1H16.

Mouser Electronics appoints new VP to run Japan operation

08/03/2016  Mouser Electronics, Inc., the global authorized distributor with the newest semiconductors and electronic components, today announced the appointment of Sam Katsuta as Vice President of Mouser Electronics-Japan.

Hardware/Software Co-Development for IoT Applications: Q&A with Marie Semeria, CEO of CEA-Leti

08/03/2016  Marie Semeria, chief executive officer of CEA-Leti (http://www.leti.fr/en), sat down with SemiMD during SEMICON West to discuss how the French R&D and pilot manufacturing campus—located at the foot of the beautiful French alps near Grenoble—is expanding the scope of it’s activities to develop systems solutions for the Internet-of-Things (IoT).

GLOBALFOUNDRIES appoints Wallace Pai as General Manager to oversee China business development

08/02/2016  GLOBALFOUNDRIES announced that Wallace Pai has been appointed as vice president and general manager of China.

Global semiconductor sales increase in second quarter

08/02/2016  The Semiconductor Industry Association today announced worldwide sales of semiconductors reached $79.1 billion during the second quarter of 2016, an increase of 1.0 percent over the previous quarter and a decrease of 5.8 percent compared to the second quarter of 2015.

Ultratech receives 'Outstanding Supplier Award' from SJ Semiconductor

08/02/2016  Ultratech, Inc. today announced that it has received an 'Outstanding Supplier Award' from SJ Semiconductor Corp.

OnChip announces semiconductor wafer fabrication services

08/01/2016  OnChip’s wafer foundry offers Thin Film, CMOS, and BiPolar processes and has produced more than 250 different high-volume products under the OnChip brand as well as for other companies globally.

Swapping substrates improves edges of graphene nanoribbons

08/01/2016  Using inert boron nitride instead of silica creates precise zigzag edges in monolayer graphene.

Analog Devices and Linear Technology to merge

07/29/2016  Analog Devices, Inc. (NASDAQ: ADI) and Linear Technology Corporation (NASDAQ: LLTC) this week announced that they have entered into a definitive agreement under which Analog Devices will acquire Linear Technology in a cash and stock transaction that values the combined enterprise at approximately $30 billion.

Scientists find a way of acquiring graphene-like films from salts to boost nanoelectronics

07/29/2016  Physicists use supercomputers to find a way of making 'imitation graphene' from salt.

Vortex laser offers hope for Moore's Law

07/29/2016  The optics advancement may solve an approaching data bottleneck by helping to boost computing power and information transfer rates tenfold.

Busch to open a new service center in Austin, Texas

07/28/2016  Busch, LLC this week announced plans to build a new 44,000 sq. ft. building in Austin, Texas.




TWITTER


WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

Date and time TBD / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
Interconnection Technologies

August 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

More Technology Papers

EVENTS



European MEMS Summit 2016
Stuttgart, Germany
http://www.semi.org/eu/node/8871
September 15, 2016 - September 16, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS