Semiconductors

SEMICONDUCTORS ARTICLES



TI expands lead among top analog suppliers in 2017

05/02/2018  Top 10 suppliers held 59% of analog market last year with ON Semi showing strongest growth.

Mentor enhances tool portfolio for TSMC 5nm FinFET and 7nm FinFET Plus processes and wafer-on-wafer stacking technology

05/01/2018  Mentor, a Siemens business, has announced that several tools in its Calibre nmPlatform and Analog FastSPICE (AFS) Platform have been certified by TSMC for the latest versions of TSMC's 5nm FinFET and 7nm FinFET Plus processes.

Global semiconductor sales up 20% year-to-year in Q1

05/01/2018  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $111.1 billion during the first quarter of 2018, an increase of 20 percent compared to the first quarter of 2017.

Valleytronics discovery could extend limits of Moore's Law

05/01/2018  Study finds that light polarization properties of candidate material offer additional computing degrees of freedom.

Annual Washington forum brings top industry priorities to policymakers

05/01/2018  Just as the annual Cherry Blossom festival wraps up, international trade has flowered as a top concern for SEMI members, requiring immediate action as 20 SEMI member executives carried the torch for the industry in recent meetings with lawmakers at the annual SEMI Washington Forum.

Cyient acquires semiconductor firm AnSem N.V.

04/30/2018  Cyient Limited today announced that its step down subsidiary Cyient Europe Ltd. has acquired AnSem N.V.

TSMC certifies Synopsys Design platform for high-performance 7nm FinFET Plus technology

04/30/2018  Synopsys, Inc. today announced certification of the Synopsys Design Platform with TSMC's latest Design Rule Manual (DRM) for advanced 7nm FinFET Plus process technology.

Spin Transfer Technologies announces breakthrough MRAM technology for SRAM and DRAM applications

04/30/2018  Spin Transfer Technologies, Inc. announced results of its unique Precessional Spin Current (PSC) structure.

Speeding up material discovery

04/30/2018  Algorithm take months, not years, to find material for improved energy conversion.

Jim Keller joins Intel to lead silicon engineering

04/27/2018  Intel today announced that Jim Keller will join Intel as a senior vice president. He will lead the company's silicon engineering, which encompasses system-on-chip (SoC) development and integration.

Key findings for the global lithography systems market

04/27/2018  According to Technavio market research analysts, the CAGR for the global lithography systems market is projected to be over 5% during the forecast period.

A powerful laser breakthrough

04/27/2018  Lehigh research team demonstrates terahertz semiconductor laser with record-high output power.

Samsung begins mass production of 10nm-class 16Gb LPDDR4X DRAM for automobiles

04/26/2018  The latest LPDDR4X features high performance and energy efficiency while significantly raising the thermal endurance level for automotive applications that often need to operate in extreme environments.

Barbara Humpton named Siemens U.S. CEO

04/26/2018  Siemens Corporation today announced that Barbara Humpton has been appointed CEO for the United States, effective June 1, 2018.

Cell membrane inspires new ultrathin electronic film

04/26/2018  Japanese researchers have developed a new method to build large areas of semiconductive material that is just two molecules thick and a total of 4.4 nanometers tall.

Cheaper and easier way found to make plastic semiconductors

04/25/2018  Cheap, flexible and sustainable plastic semiconductors will soon be a reality thanks to a breakthrough by chemists at the University of Waterloo.

TSMC continues to dominate the worldwide foundry market

04/25/2018  Top eight companies held 88% of global foundry market last year.

North American semiconductor equipment industry posts March 2018 billings

04/25/2018  "March 2018 monthly billings for North American equipment manufacturers remain at robust levels," said Ajit Manocha, president and CEO of SEMI.

Global expansion at more subdued pace

04/25/2018  Most key countries/regions saw a slowdown in growth in March based on their respective Purchasing Managers Indices. And in one case – South Korea – manufacturing moved into contraction.

Worldwide semiconductor revenue grew 21.6% in 2017 as Samsung takes over No. 1 position

04/24/2018  Booming memory market overshadows high growth in other segments.




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WEBCASTS



Enabling EUV and the patterning roadmap

Tuesday, June 5, 2018 at 1:00 p.m. ET

EUV lithography has steadily been gaining momentum in recent years and edges closer and closer to insertion in manufacturing. While considerable progress has been made and the first uses of EUV appear imminent, there remain some difficulties that will challenge the rate and degree to which EUV can be employed. This talk will aim to explore the patterning-related challenges that remain, summarize some of the ongoing efforts to tackle these challenges, and give an outlook towards the future.

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Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

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Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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