Semiconductors

SEMICONDUCTORS ARTICLES



EV Group unveils room-temperature covalent bonder

10/06/2014  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 580 ComBond.

Europe: Strong growth in chip equipment spending in 2015

10/06/2014  Global capital spending on semiconductor equipment is projected to grow 21.1 percent in 2014 and 21.0 percent in 2015.

Crumpled graphene could provide an unconventional energy storage

10/03/2014  Two-dimensional carbon 'paper' can form stretchable supercapacitors to power flexible electronic devices.

Silicon Cloud International launches semiconductor collaborative platform in Singapore

10/03/2014  Silicon Cloud International (SCI), a provider of secure and private cloud computing infrastructure, announced today successful pilot program launch of its semiconductor workflow platform in Singapore.

Photomask Technology speaker says EUV is nearly production-ready

10/03/2014  Highlights at the recent SPIE Photomask Technology 2014 conference included a confident announcement from ASML about current EUV source capabilities, an insightful industry-expert panel discussion on mask-making complexities, and fresh energy from the co-located SPIE Scanning Microscopies conference.

ARM and TSMC unveil roadmap for 64-bit ARM-based processors on 10FinFET process technology

10/02/2014  ARM and TSMC today announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10FinFET process technology.

Dow Corning releases new 150mm SiC wafers

10/02/2014  Dow Corning, a developer of silicon and wide-bandgap semiconductor technology, announced that it now offers 150mm diameter silicon carbide (SiC) wafers under its Prime Grade portfolio.

FlipChip International creates 250 multi-product wafer bump designs

10/01/2014  FlipChip International (FCI), the global technology leader in flip chip bumping and advanced wafer level packaging, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013.

Boston Semi Equipment creates industry's largest independent ATE organization

10/01/2014  Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name.

SEMICON Japan features "World of IoT"

10/01/2014  Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs.

All directions are not created equal for nanoscale heat sources

10/01/2014  Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths.

New technology may lead to prolonged power in mobile devices

09/30/2014  Researchers from The University of Texas at Dallas have created technology that could be the first step toward wearable computers with self-contained power sources or, more immediately, a smartphone that doesn’t die after a few hours of heavy use.

A new dimension for integrated circuits: 3D nanomagnetic logic

09/30/2014  Electrical engineers at the Technische Universität München (TUM) have demonstrated a new kind of building block for digital integrated circuits.

Kurita, SEMATECH partner on wafer surface contamination and cleaning technology in semiconductor processing

09/30/2014  SEMATECH, the global consortium of chipmakers, announced today that Kurita Water Industries Limited has partnered with SEMATECH to develop innovative technologies for low defectivity ultrapure water (UPW) applications used in semiconductor manufacturing.

Gigaphoton introduces "eGrycos" for ArF immersion lasers

09/29/2014  Gigaphoton Inc., a lithography light source manufacturer, announced today that it has completed development of an electricity-reduction technology for its flagship “GT Series” of argon fluoride (ArF) immersion lasers used for semiconductor lithography processing.

Tessera Technologies names Craig Mitchell as CTO and president of Invensas

09/29/2014  Tessera Technologies, Inc. today announced it has named Craig Mitchell as chief technology officer for Tessera and president of Invensas Corporation, effective immediately.

United States photomask market to reach around $475M by 2019

09/29/2014  According to the recently published TechSci Research report, "United States Photomask Market Forecast & Opportunities, 2019", the photomask market in the United States is forecast to reach $474.58 billion by 2019.

TSMC delivers first fully functional 16 finFET networking processor

09/29/2014  TSMC today announced that its has successfully produced the foundry segment's first fully functional ARM-based networking processor with FinFET technology, through its collaboration with HiSilicon Technologies Co, Ltd.

Printed, flexible, and organic electronics will account for 18% of wearable athletics sensors in 2024

09/26/2014  Printed, flexible and organic electronic (PFOE) sensors can offer flexible form factors, larger area, lower cost, lower power, and better disposability compared to conventional sensors, key attributes for wearable applications.

Silicon Motion elects Han-Ping Shieh to Board of Directors

09/26/2014  Mr. Shieh will replace Mr. Kenneth Kuan-Min Lin, who had chosen not to stand for reelection to the Board of Directors in order to focus more on his venture capital and other activities.




FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Metrology and Failure Analysis

Nov. 2014 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

Materials

Nov. 2014 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:

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VIDEOS