Semiconductors

SEMICONDUCTORS ARTICLES



Sensors driving next-generation wearable devices

04/12/2016  Last week, IDTechEx gave the opening presentation at the 2016 Korea Summit for Smart Wearable Devices, excellently hosted by KDIA and KSA in Seoul, Korea.

Presto Engineering and Peraso Technologies Develop Innovative Test Solution for 60 GHz Transceiver

04/12/2016  Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, and Peraso Technologies, a leading wireless chipset manufacturer, today jointly announced their successful collaboration in developing a comprehensive test solution for Peraso’s recently-launched 60 GHz semiconductor products.

SEMI reports 2015 global semiconductor materials sales of $43.4B

04/11/2016  The global semiconductor materials market decreased 1.5 percent in 2015 compared to 2014 while worldwide semiconductor revenues decreased 0.2 percent.

Cadence to Acquire Rocketick

04/11/2016  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it has entered into a definitive agreement to acquire Rocketick Technologies Ltd.

Mentor Graphics U2U Meeting April 26 in Santa Clara

04/11/2016  Mentor Graphics’ User2User meeting will be held in Santa Clara on April 26, 2016. The meeting is a highly interactive, in-depth technical conference focused on real world experiences using Mentor tools to design leading-edge products.

Penn engineers develop first transistors made entirely of nanocrystal 'inks'

04/08/2016  University of Pennsylvania engineers have shown a new approach for making these devices: sequentially depositing their components in the form of liquid nanocrystal "inks."

Quantum dots enhance light-to-current conversion in layered semiconductors

04/08/2016  Harnessing the power of the sun and creating light-harvesting or light-sensing devices requires a material that both absorbs light efficiently and converts the energy to highly mobile electrical current.

Rudolph adds high-speed 3D metrology to the NSX Series for advanced packaging process control

04/07/2016  Rudolph Technologies, Inc. today announced the availability of new, high-speed 3D metrology on its flagship NSX Series, a highly-flexible inspection and measurement platform for process development and control of die-level interconnects.

Semiconductor market in Vietnam up by 14.3% by 2019

04/07/2016  SEMI, the global industry association serving the electronics manufacturing supply chain, will include programs pertinent to Vietnam’s semiconductor industry at the upcoming SEMICON SEA 2016, the region’s premier showcase for microelectronics innovation.

Cadence and University of Oxford Foster the Advancement of Formal Verification Innovation

04/07/2016  Cadence Design Systems, Inc. and the University of Oxford today announced a move to foster the advancement of formal verification innovation with the appointment of Dr. Ziyad Hanna, Cadence vice president of R&D, as a visiting professor in Oxford's Department of Computer Science for the next three years.

SIA's VP of Global Policy to address China's new role in the semiconductor industry at The ConFab 2016

04/06/2016  Solid State Technology is pleased to announced that Jimmy Goodrich of the Semiconductor Industry Association is the latest distinguished guest confirmed to speak at The ConFab 2016.

Worldwide semiconductor wafer-level manufacturing equipment market declined 1% in 2015

04/06/2016  Worldwide semiconductor wafer-level manufacturing equipment revenue totaled $33.6 billion in 2015, a 1 percent decline from 2014, according to final results by Gartner, Inc.

NREL reveals potential for capturing waste heat via nanotubes

04/06/2016  A finely tuned carbon nanotube thin film has the potential to act as a thermoelectric power generator that captures and uses waste heat, according to researchers at the Energy Department's National Renewable Energy Laboratory (NREL).

Entegris appoints new Senior Vice President and General Counsel

04/05/2016  Ms. Lee is assuming the role from Peter Walcott, who is retiring after a 35-year career with Entegris and its predecessor companies.

TowerJazz announces its SiGe Terabit Platform

04/05/2016  TowerJazz, the global specialty foundry, today announced its SiGe Terabit Platform targeting high-speed wireline communications for the terabit age.

U.S. companies continue to capture bulk of IDM and fabless IC sales

04/05/2016  IC Insights recently released its March Update to the 2016 McClean Report. The Update includes a review of IC company sales by headquarters location.

Samsung starts mass producing industry's first 10nm class DRAM

04/05/2016  Samsung Electronics Co., Ltd. announced today that it has begun mass producing the industry’s first 10-nanometer (nm) class, 8-gigabit (Gb) DDR4 (double-data-rate-4) DRAM chips and the modules derived from them.

IEEE Photonics Society's Issues Call for Papers for 13th International Group IV Photonics Conference

04/04/2016  The 2016 International Group IV Photonics Conference, sponsored by the IEEE Photonics Society, has announced the Call for Papers seeking original research on the Novel Materials & Nanophotonics; Photonic Devices; and Silicon Photonics Applications & Systems.

Nanotubes line up to form films

04/04/2016  A simple filtration process helped Rice University researchers create flexible, wafer-scale films of highly aligned and closely packed carbon nanotubes.

Update on neon shortage 2016 highlighted at the Critical Materials Conference

04/04/2016  Communication with suppliers in the Ukraine and China have continued to verify expected shortages occurring toward the end of 2016. Although supply appears stable now, inventories purchased during the second half of 2015 will deplete inventories on the supplier side toward the end of this year.




TWITTER


WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Trends in MEMS

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Fan-Out Wafer Level Packaging

May 2016 (Date and time TBD) / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
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TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS