Semiconductors

SEMICONDUCTORS ARTICLES



Dialog Semiconductor declines to revise bid for Atmel

01/18/2016  UK-based chipmaker Dialog Semiconductor plc's board of directors has determined not to revise its proposal to acquire US-based microcontroller and touch solutions specialist Atmel Corp., the company said.

Microsemi Corporation completes acquisition of PMC-Sierra, Inc.

01/18/2016  Microsemi Corporation, a provider of semiconductor solutions, announced today that Microsemi's wholly-owned subsidiary Lois Acquisition Corp. successfully merged with and into PMC-Sierra, Inc., completing Microsemi's acquisition of PMC.

Engineers invent a bubble-pen to write with nanoparticles

01/14/2016  Researchers at the Cockrell School of Engineering at The University of Texas at Austin have developed a device and technique, called bubble-pen lithography, that can gently and effectively handle nanoparticles.

Annihilating nanoscale defects

01/14/2016  Researchers at the University of Chicago and the U.S. Department of Energy's Argonne National Laboratory, led by Juan de Pablo and Paul Nealey, may have found a way for the semiconductor industry to hit miniaturization targets on time and without defects.

Qualcomm and TDK announce joint venture

01/14/2016  Qualcomm and TDK to expand their collaboration across multiple technologies.

Microchip's proposal to acquire Atmel deemed a "superior proposal" by Atmel's Board of Directors

01/14/2016  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions today announced that it was informed last night that the Board of Directors of Atmel Corporation had determined that Microchip's proposal to acquire Atmel for $8.15 per share in a cash and stock transaction constitutes a "Superior Proposal" under the terms of Atmel's merger agreement with Dialog Semiconductor PLC.

SEMI Awards honor process and technology integration achievements

01/14/2016  SEMI announced the recipients of the 2015 SEMI Awards for the Americas.

Growth and a changing ecosystem at SEMI ISS 2016

01/13/2016  The SEMI Industry Strategy Symposium (ISS) opened yesterday with the theme “Integrating for Growth: Markets, Technology, Ecosystem.” The packed conference of C-level executives gave the year’s first strategic outlook of the global electronics manufacturing industry.

GLOBALFOUNDRIES engineers receive international recognition

01/12/2016  Two GLOBALFOUNDRIES engineers, one in New York and one in Vermont, have been designated as IEEE Fellows by the Institute of Electrical and Electronics Engineers.

Ferrotec receives multi-system endorsement of e-beam evaporator systems from WIN Semiconductors

01/12/2016  Ferrotec Corporation this week announced that the largest pure-play GaAs foundry company, WIN Semiconductors Corp., has selected Temescal systems from Ferrotec Corporation for its next stage of expansion by ordering multiple e-beam evaporators for metal deposition

Semiconductor capital spending to decline 4.7% in 2016, according to Gartner

01/12/2016  Worldwide semiconductor capital spending is projected to decline 4.7 percent in 2016, to $59.4 billion, according to Gartner, Inc.

Stanford researchers advance area selective ALD to develop more energy efficient electronics

01/12/2016  Stanford University researchers sponsored by Semiconductor Research Corporation (SRC) have developed a new area selective atomic layer deposition (ALD) process that promises to accelerate the manufacturing of higher performing, more energy efficient semiconductors.

Semiconductor capital spending market in the US to reach over $31B by 2019

01/11/2016  Technavio's market research analysts estimate the semiconductor capital spending market in the US, to grow at a CAGR of around 9% between 2015 and 2019.

Flash, STT-MRAM and resistive RAM: They all come with different challenges

01/11/2016  Research in memory is really exciting these days: in parallel you have the scaling of classical memories (SRAM, DRAM, Flash) and the emergence of new memories capable of enabling new applications or even new system hierarchies. At imec, we mostly focus on three concepts which all come with different challenges.

Collaboration is the centerpiece to push the limits of lithography

01/11/2016  The continuation of Moore’s Law requires a combination of both physical and functional scaling, where our main challenge in lithography is to continue pushing the physical scaling limits in a controlled and cost-effective way.

Viewpoints: 2016 outlook

01/11/2016  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2016.

Worldwide semiconductor revenue declined 1.9% in 2015, Gartner reports

01/08/2016  Worldwide semiconductor revenue totaled $333.7 billion in 2015, a 1.9 percent decrease from 2014 revenue of $340.3 billion, according to preliminary results by Gartner, Inc.

AKHAN Semiconductor deploys 200mm manufacturing process in new diamond-based chip production facility

01/08/2016  AKHAN Semiconductor, Inc. this week announced that it is deploying 200mm manufacturing equipment and process in its new production facility in Gurnee, Illinois, continuing its preparation for delivering AKHAN diamond semiconductor based-technology products to the company’s first commercial customer this quarter.

Samsung, TSMC remain tops in available wafer fab capacity

01/07/2016  GlobalFoundries, TSMC, SK Hynix show greatest gains in wafer capacity in 2015.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016