Semiconductors

SEMICONDUCTORS ARTICLES



Microsemi launches PIN diode switch element

01/21/2016  Microsemi Corporation today announced a new high power monolithic microwave surface mount (MMSM) series-shunt SP2T PIN diode reflective switch.

Molecular-like photochemistry from semiconductor nanocrystals

01/21/2016  Researchers from North Carolina State University have demonstrated the transfer of triplet exciton energy from semiconductor nanocrystals to surface-bound molecular acceptors, extending the lifetime of the originally prepared excited state by six orders of magnitude.

Semiconductor R&D growth slows in 2015

01/21/2016  Industry-wide R&D expenditures grew 0.5% to a record-high $56.4 billion in 2015. Top 10 R&D spenders collectively increased expenditures by nearly 2% in the year.

Semiconductor veteran Tom Werthan to lead finance operations as Chief Financial Officer of Phononic

01/20/2016  Tom Werthan, a veteran semiconductor and finance executive experienced in leading financial operations at public and privately-held technology companies, has been appointed Chief Financial Officer at Phononic.

Worldwide device shipments to grow 1.9% in 2016, while end-user spending to decline for the first time

01/20/2016  Worldwide combined shipments of devices (PCs, tablets, ultramobiles and mobile phones) are expected to reach 2.4 billion units in 2016 , a 1.9 percent increase from 2015, according to Gartner, Inc.

AMD Net Loss Widens in 2015 on Lower Revenue

01/20/2016  Advanced Micro Devices on Tuesday reported a net loss of $660 million on revenue of $3.99 billion for 2015, compared with a net loss of $403 million on revenue of $5.51 billion in 2014.

ASML Has Record Revenue for 2015; Will Raise Dividend, Buy Back More Stock

01/20/2016  ASML Holding today reported net income of about $1.5 billion on revenue of $6.855 billion for 2015. That compared with 2014’s net income of $1.3 billion on revenue of $6.385 billion.

Gartner analysts reveal unexpected implications arising from the Internet of Things

01/19/2016  More than half of major new business processes and systems will incorporate some element of the Internet of Things (IoT) by 2020, according to Gartner, Inc.

Microchip Technology to acquire Atmel

01/19/2016  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Atmel Corporation) today announced that Microchip has signed a definitive agreement to acquire Atmel for $8.15 per share in a combination of cash and Microchip common stock.

Dialog Semiconductor declines to revise bid for Atmel

01/18/2016  UK-based chipmaker Dialog Semiconductor plc's board of directors has determined not to revise its proposal to acquire US-based microcontroller and touch solutions specialist Atmel Corp., the company said.

Microsemi Corporation completes acquisition of PMC-Sierra, Inc.

01/18/2016  Microsemi Corporation, a provider of semiconductor solutions, announced today that Microsemi's wholly-owned subsidiary Lois Acquisition Corp. successfully merged with and into PMC-Sierra, Inc., completing Microsemi's acquisition of PMC.

Engineers invent a bubble-pen to write with nanoparticles

01/14/2016  Researchers at the Cockrell School of Engineering at The University of Texas at Austin have developed a device and technique, called bubble-pen lithography, that can gently and effectively handle nanoparticles.

Annihilating nanoscale defects

01/14/2016  Researchers at the University of Chicago and the U.S. Department of Energy's Argonne National Laboratory, led by Juan de Pablo and Paul Nealey, may have found a way for the semiconductor industry to hit miniaturization targets on time and without defects.

Qualcomm and TDK announce joint venture

01/14/2016  Qualcomm and TDK to expand their collaboration across multiple technologies.

Microchip's proposal to acquire Atmel deemed a "superior proposal" by Atmel's Board of Directors

01/14/2016  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions today announced that it was informed last night that the Board of Directors of Atmel Corporation had determined that Microchip's proposal to acquire Atmel for $8.15 per share in a cash and stock transaction constitutes a "Superior Proposal" under the terms of Atmel's merger agreement with Dialog Semiconductor PLC.

SEMI Awards honor process and technology integration achievements

01/14/2016  SEMI announced the recipients of the 2015 SEMI Awards for the Americas.

Growth and a changing ecosystem at SEMI ISS 2016

01/13/2016  The SEMI Industry Strategy Symposium (ISS) opened yesterday with the theme “Integrating for Growth: Markets, Technology, Ecosystem.” The packed conference of C-level executives gave the year’s first strategic outlook of the global electronics manufacturing industry.

GLOBALFOUNDRIES engineers receive international recognition

01/12/2016  Two GLOBALFOUNDRIES engineers, one in New York and one in Vermont, have been designated as IEEE Fellows by the Institute of Electrical and Electronics Engineers.

Ferrotec receives multi-system endorsement of e-beam evaporator systems from WIN Semiconductors

01/12/2016  Ferrotec Corporation this week announced that the largest pure-play GaAs foundry company, WIN Semiconductors Corp., has selected Temescal systems from Ferrotec Corporation for its next stage of expansion by ordering multiple e-beam evaporators for metal deposition

Semiconductor capital spending to decline 4.7% in 2016, according to Gartner

01/12/2016  Worldwide semiconductor capital spending is projected to decline 4.7 percent in 2016, to $59.4 billion, according to Gartner, Inc.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD) / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD) / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016