2018: Big changes in mask manufacturing and what it means for mask models

03/01/2018  There are big changes on the horizon for semiconductor mask manufacturing, including the imminent first production use of multi-beam mask writers, and the preparation of all phases of semiconductor manufacturing for the introduction of extreme ultra-violet (EUV) lithography within the next few years.

High-res 3D X-ray microscopy for non-destructive failure analysis of chip-to-chip micro-bump interconnects in stacked die packages

03/01/2018  3D integration and packaging has challenged failure analysis (FA) techniques and workflows due to the high complexity of multichip architectures, the large variety of materials, and small form factors in highly miniaturized devices.

Experimentally demonstrated a toffoli gate in a semiconductor three-qubit system

02/28/2018  A new progress in the scaling of semiconductor quantum dot based qubit has been achieved at Key Laboratory of Quantum Information and Synergetic Innovation Center of Quantum Information & Quantum Physics of USTC.

Samsung Electronics breaks ground on new EUV line in Hwaseong

02/28/2018  Construction will be completed in the second half of 2019 and ready for production in 2020 Samsung aims to maintain its leadership in cutting-edge process technology under 7nm.

imec and Cadence tape out industry's first 3nm test chip

02/28/2018  Extreme ultraviolet and 193 immersion lithography technology and Cadence digital tools used to design 3nm CPU core.

GLOBALFOUNDRIES strengthens 22FDX eMRAM platform with eVaderis' ultra-low power MCU reference design

02/27/2018  Co-developed technology solution enables significant power and die size reductions for IoT and wearable products.

Brewer Science announces new OptiLign DSA product family

02/27/2018  Brewer Science, Inc., today from SPIE Advanced Lithography 2018 introduced its OptiLign commercial-quality directed self-assembly (DSA) material set developed in collaboration with Arkema.

Top semiconductor metrology/inspection equipment vendors continue to increase share of total market

02/27/2018  The top five semiconductor metrology/inspection equipment vendors grew 17.7% in 2017 according to the report “Metrology, Inspection, and Process Control in VLSI Manufacturing”, recently published by The Information Network.

ClassOne Equipment selected to upgrade major UK fab

02/27/2018  ClassOne Equipment, Atlanta-based provider of refurbished name-brand semiconductor processing equipment, has announced the sale of multiple systems to a major global components manufacturer as part of a significant upgrade to their UK fab.

New technique allows printing of flexible, stretchable silver nanowire circuits

02/26/2018  Researchers at North Carolina State University have developed a new technique that allows them to print circuits on flexible, stretchable substrates using silver nanowires. The advance makes it possible to integrate the material into a wide array of electronic devices.

SILTECTRA's "twinning" breakthrough promises to vastly reduce wafering costs for manufacturers of silicon carbide-based IC devices

02/26/2018  SILTECTRA GmbH today reports that it has validated a breakthrough capability for its COLD SPLIT technology.

imec announces advances in EUV lithography

02/26/2018  Imec presents initial electrical results on N5 32nm pitch metal-2 layer.

North American semiconductor equipment industry posts January 2018 billings

02/23/2018  "The strong billings levels from late 2017 have carried over into the new year," said Ajit Manocha, president and CEO of SEMI.

Supermicro expands its Silicon Valley corporate headquarters

02/23/2018  Super Micro Computer, Inc. today announced that it has expanded its Silicon Valley Headquarters to over two million square feet of facilities with the grand opening of its new Building 22.

Gigaphoton ships latest ArF Excimer Laser GT65A

02/22/2018  In January, Gigaphoton Inc., a major manufacturer of lithography light sources, announced the shipment of an ArF Excimer Laser for advanced immersion exposure (lithography) devices, the "GT65A" Unit 1, as a new product that meets the growing demand for semiconductors in recent years.

Peter Trefonas elected SPIE Fellow

02/22/2018  Peter Trefonas, Ph.D., corporate fellow in Dow Electronic Materials, has recently been elected a Fellow of SPIE, for achievements in design for manufacturing and compact modeling.

Entering 2018 on solid ground

02/22/2018  2017 finished on an upturn – both in the USA and globally. Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16.

Integrated circuit technology advances continue to amaze

02/21/2018  Despite increasing costs of development, IC manufacturers are still making great strides.

Cymer qualifies and ships new argon fluoride light source

02/21/2018  Cymer, a developer of lithography light sources used by chipmakers to pattern advanced semiconductor chips, today announced the first shipment of the newly qualified XLR 800ix light source that improves performance and productivity, as well as lowers cost-of-ownership for leading-edge argon fluoride (ArF) immersion lithography systems.

Qualcomm enters into amended definitive agreement with NXP

02/20/2018  Qualcomm Incorporated today announced that Qualcomm River Holdings B.V. has reached an agreement with NXP Semiconductors N.V.



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

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