Semiconductors

SEMICONDUCTORS ARTICLES



Studying post-etching silicon crystal defects on 300mm wafers by automatic defect review AFM

05/09/2016  Atomic force microscopy is essential for obtaining three- dimensional information of crystal defects.

NUS scientists develop method to improve photoluminescence efficiency of 2-D semiconductors

05/09/2016  A team led by researchers from the National University of Singapore (NUS) has developed a method to enhance the photoluminescence efficiency of tungsten diselenide, a two-dimensional semiconductor, paving the way for the application of such semiconductors in advanced optoelectronic and photonic devices.

Best of both worlds

05/09/2016  More, faster, better, cheaper. These are the demands of our device-happy and data-centered world. Meeting these demands requires technologies for processing and storing information.

Global semiconductor sales increase slightly in March

05/06/2016  The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $26.1 billion for the month of March 2016, a slight increase of 0.3 percent compared to the previous month's total of $26.0 billion.

New report highlights benefits, impact of global semiconductor value chain

05/06/2016  The Semiconductor Industry Association (SIA) today released a new report highlighting the evolution, complexity, and pivotal importance of the global semiconductor value chain.

Making invisible physics visible

05/06/2016  The Jayich Lab has created a new sensor technology that captures nanoscale images with high spatial resolution and sensitivity.

A compact, efficient single photon source that operates at ambient temperatures on a chip

05/06/2016  Highly directional single photon source concept is expected to lead to a significant progress in producing compact, cheap, and efficient sources of quantum information bits for future applications.

Dow's Peter Trefonas, Ph.D, to receive prestigious Perkin Medal

05/05/2016  The Society of Chemical Industry (SCI), America Group, announced today that Peter Trefonas, Ph.D., corporate fellow in Electronic Materials at The Dow Chemical Company, has won the 2016 SCI Perkin Medal.

Amkor and Cadence to Develop Packaging Assembly Design Kits for Amkor's SLIM and SWIFT Packaging Technologies

05/05/2016  Amkor Technology, Inc., a outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cadence Design Systems, Inc. to streamline semiconductor package verification with the joint development of a package assembly design kit (PADK) for Amkor's SLIM and SWIFT advanced fan-out package technologies.

North America vital to advanced semiconductor manufacturing

05/05/2016  North America has a long and rich history of semiconductor manufacturing and innovation.

Maturing smartphone market signals falling growth for wireless semiconductors

05/04/2016  Revenue associated with the wireless competitive landscape continued to serve as a bright spot in the larger semiconductor market in 2015, growing almost 4 percent to over $56 billion, year over year, while total semiconductor revenue fell 2 percent to $347 billion during the same period.

FemtoMetrix announces license agreement with Boeing

05/04/2016  FemtoMetrix, a developer of non-destructive optical inspection systems, announced today that it has entered into a patent and technology license agreement with The Boeing Company.

IEEE introduces new international roadmap for devices and systems to set the course for end-to-end computing

05/04/2016  Together, this group will ensure alignment and consensus across a range of stakeholders to identify trends and develop the roadmap for all of the related technologies in the computer industry.

Imec honors Dr. Gordon Moore with "Lifetime of Innovation Award"

05/03/2016  Nanoelectronics research center imec has announced that Dr. Gordon E. Moore, creator of the famous Moore’s law theory and co-founder of Intel, is the recipient of its lifetime of innovation award.

SEMICON West 2016 delivers new programs; Free registration ends May 6

05/03/2016  SEMI today announced the SEMICON West 2016 program agenda with a focus on today’s issues facing the future of semiconductor manufacturing.

How to Boost Verification Productivity with SystemVerilog/UVM and Emulation

05/03/2016  Use of emulation for hardware-assisted testbench acceleration is growing as design verification teams find that simulation alone cannot deliver the coverage or performance needed to get large, complex designs to market on time. If your design requires millions of clock cycles to fully verify, you need both simulation and emulation.

Could aluminum nitride be engineered to produce quantum bits?

05/02/2016  Silicon semiconductors are reaching their physical limits—it’ll probably happen within the next five to 10 years—but if we can implement qubits into semiconductors, we will be able to move beyond silicon.

From catching up to forging ahead: China’s new role in the semiconductor industry

05/02/2016  China has become the largest and fastest growing semiconductor market in the world, absorbing 40% of the worldwide semiconductor shipments. For US semiconductor firms, nothing compares to the China market.

Demand for miniaturization and integration of ICs to drive the global semiconductor stepper system market until 2020

05/02/2016  According to the latest research study released by Technavio, the global semiconductor stepper system market is expected to reach over USD 6 billion by 2020.

Many mixes to match litho apps

04/29/2016  The world’s leading lithographers gather each year in San Jose, California at SPIE’s Advanced Lithography conference to discuss how to extend optical lithography. So of all the NGL technologies, which will win out in the end?




TWITTER


WEBCASTS



High Mobility Transistors

June 21, 2016 at 1 PM ET / Sponsored by Air Products

Transistor performance has been greatly improved with strained silicon and high-k metal gates. Further performance improvements could be had by implementing III-V materials in the channel of nMOS transistors. Both III-V and Ge-based channels being considered for the pMOS device. High electron-mobility III-V semiconductors have been intensely researched as alternative channel materials for sub-7 nm technology nodes, but one of the main stumbling blocks is how to integrate them monolithically and cost-effectively with traditional CMOS silicon technology. This webcast will discuss the latest efforts in this area, including vertically stacked III-V nanowire.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS