Semiconductors

SEMICONDUCTORS ARTICLES



Dr. Terry Brewer receives the Kathryn C. Hach Award for Entrepreneurial Success from the American Chemical Society

03/25/2015  Dr. Terry Brewer, founder and CEO of Brewer Science, was presented the Kathryn C. Hach Award for Entrepreneurial Success on Tuesday, March 24, 2015, at the American Chemical Society’s 249th National Meeting.

Optoelectronics, sensors/actuators, and discretes growth accelerates

03/25/2015  After two years of sluggishness, O-S-D sales strengthen with an improving economy and a boost from new applications, says new 2015 report.

Silicon Space Technology appoints Bernd Lienhard as New CEO

03/24/2015  Silicon Space Technology today announced that its Board of Directors appointed Bernd Lienhard as the company’s Chief Executive Officer, replacing David Patterson who has been interim CEO for the past three months.

Stephen G. Daly joins MACOM's Board of Directors

03/24/2015  M/A-COM Technology Solutions Holdings, Inc., a supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor products, today announced the appointment of Stephen G. Daly as an independent director.

'Goldilocks material' could change spintronics

03/24/2015  Attempting to develop a novel type of permanent magnet, a team of researchers at Trinity College in Dublin, Ireland has discovered a new class of magnetic materials based on Mn-Ga alloys.

UW scientists build a nanolaser using a single atomic sheet

03/24/2015  University of Washington scientists have built a new nanometer-sized laser -- using the thinnest semiconductor available today -- that is energy efficient, easy to build and compatible with existing electronics.

Silicon Labs and Digi-Key challenge developer innovation with "Your IoT" design competition

03/24/2015  Silicon Labs and Digi-Key today announced an IoT design contest for pioneering developers who want to create connected "things" that will help make the world a smarter, more connected and energy-friendly place.

NXP and GlobalFoundries announce production of 40nm embedded non-volatile memory technology

03/24/2015  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, and NXP Semiconductor N.V, a semiconductor company for secure connection solutions, today announced that they have jointly developed a next-generation embedded non-volatile memory.

North American semiconductor equipment industry posts February 2015 book-to-bill ratio of 1.02

03/20/2015  A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

NC State researchers create 'nanofiber gusher'

03/19/2015  Engineers and researchers at North Carolina State University and one of its start-up companies have now reported a method that can produce unprecedented amounts of polymer nanofibers, which have potential applications in filtration, batteries and cell scaffolding.

GSA announces 2015 Board of Directors election results and appointment

03/19/2015  The Global Semiconductor Alliance (GSA) announced the appointment of two key executives as well as the results of its 2015 Board of Directors’ election.

Small powerful systems give rise to medical semiconductor sales

03/19/2015  Market for medical semiconductors seen rising to $8.2 billion in 2018.

NXP-Freescale merger to result in world's eighth largest chip maker

03/18/2015  The recent acquisition of Freescale Semiconductor by NXP Semiconductors would catapult the merged entity into the world’s eighth-largest chipmaker, positioning the newly minted giant for an even more formidable presence in key industrial sectors, according to IHS.

Rice fine-tunes quantum dots from coal

03/18/2015  Rice University scientists gain control of electronic, fluorescent properties of coal-based graphene.

MACOM announces new 650 W GaN on SiC HEMT pulsed power transistor

03/18/2015  M/A-COM Technology Solutions Inc. today announced a 650 W gallium nitride (GaN) on silicon carbide (SiC) HEMT pulsed power transistor for L-band pulsed avionics applications.

AKM Semiconductor signs global distribution agreement with Digi-Key

03/18/2015  Global electronic components distributor Digi-Key Corporation, a provider of electronic component selection, availability and delivery, has partnered with AKM Semiconductor Inc., to facilitate the global distribution of AKM’s products.

Process Watch: Know your enemy

03/18/2015  Anything that degrades the quality of the measurement also degrades the quality of the process because it introduces more variability into the Statistical Process Control (SPC) charts which are windows into the health of the process.

Notchless wafer standard approved

03/17/2015  450mm notchless wafer standardization has been under discussion for over a year.

Entrepix adds 300mm CMP capabilities to Phoenix foundry

03/17/2015  Entrepix, Inc., a provider of chemical mechanical polishing (CMP) equipment and process services, today announced that it has expanded its foundry operations in Phoenix, Arizona by installing 300mm chemical mechanical planarization (CMP) processing.

Poised for more growth

03/17/2015  Strong fab equipment spending expected in 2015; Slower but positive 2016.




HEADLINES

FINANCIALS



TECHNOLOGY PAPERS



ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

How to Use Imaging Colorimeters for FPD Automated Visual Inspection

The use of imaging colorimeter systems and analytical software to assess display brightness and color uniformity, contrast, and to identify defects in FPDs is well established. A fundamental difference between imaging colorimetry and traditional machine vision is imaging colorimetry's accuracy in matching human visual perception for light and color uniformity. This white paper describes how imaging colorimetry can be used in a fully-automated testing system to identify and quantify defects in high-speed, high-volume production environments.February 27, 2015
Sponsored by Radiant Vision Systems

More Technology Papers

WEBCASTS



3D Integration: The Most Effective Path for Future IC Scaling

Thursday, April 23, 2015 at 12:00 p.m. EST

It is well recognized that dimensional scaling has reached its diminishing return phase. The industry is now looking at monolithic 3D to be the future technology driver. Yet, until recently, the path to monolithic 3D has required the development of new transistor types and processes. This Webcast will present game-changing monolithic 3D process flows which use the existing transistor of existing manufacturing line and existing process flows. Now the most effective path for future IC scaling is indeed monolithic 3D, which offers the lowest development and manufacturing cost for future ICs.

Sponsored By:
Trends in Materials: The Smartphone Driver

Thursday, April 30, 2015 at 1:00 p.m. EST

To understand 3-D FinFET doping and high mobility channel material, this talk will first review the current doping and Fin/channel mobility enhancement techniques used for 22nm FinFET production by Intel for both high performance logic and SOC devices and the changes they made for their 2nd generation 14nm FinFET.

Sponsored By:
MEMS

May 2015 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Southeast Asia 2015
Penang, Malaysia
http://www.semiconsea.org
April 22, 2015 - April 24, 2015
ASMC 2015
Saratoga Springs, NY
http://www.semi.org/en/asmc2015
May 03, 2015 - May 06, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015