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Semiconductor Manufacturing: ASMC 2016 - Nov. 2 "call for papers" deadline

09/22/2015  SEMI announced today that the deadline for presenters to submit an abstract for the 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is November 2.

Microcontroller market growth tied to IoT applications, IHS

09/22/2015  The market for microcontroller units (MCUs) used in Internet of things (IoT) applications is on the rise, which is having a positive effect on overall MCU market growth.

Perovskite photovoltaics excitement

09/22/2015  Perovskite photovoltaics efficiency gains are double those of organic PV, exciting researchers from KIMM in Korea to Dyesol in Australia.

SUNY Poly announces joint development agreement with INFICON

09/21/2015  The collaboration is expected to advance semiconductor manufacturing processes and lead to the creation of 50 jobs at SUNY Poly statewide facilities.

North American semiconductor equipment industry posts August 2015 book-to-bill ratio of 1.06

09/21/2015  North America-based manufacturers of semiconductor equipment posted $1.67 billion in orders worldwide in August 2015 (three-month average basis) and a book-to-bill ratio of 1.06, according to the SEMI's August EMDS Book-to-Bill Report.

Mentor Graphics Presents at TSMC Forum

09/21/2015  Mentor Graphics had a hand in presenting two of the 30 papers offered Thursday at Taiwan Semiconductor Manufacturing’s Open Innovation Platform Ecosystem Forum in Santa Clara, Calif.

TSMC Moves from 16nm to 10nm to 7nm

09/21/2015  While Taiwan Semiconductor Manufacturing continues to fine-tune its 16-nanometer FinFET process, the world’s largest silicon foundry will begin making chips with 10nm features later this year and will put 7nm chips into risk production in early 2017.

Dialog Semiconductor to acquire Atmel for $4.6 billion

09/21/2015  Dialog Semiconductor and Atmel Corporation announced today that Dialog has agreed to acquire Atmel in a cash and stock transaction for total consideration of approximately $4.6 billion.

Power module market to comprise nearly one-third of power semiconductor market by 2019, IHS

09/18/2015  The global power module market is projected to comprise nearly one third (30 percent) of the power semiconductor market by 2019, growing at twice the rate of power discretes, from 2014 to 2019.

Process Watch: Risky business

09/18/2015  This is the ninth in a series of 10 installments that explore certain fundamental truths about process control--defect inspection and metrology--for the semiconductor industry.

S3S - the conference for IoT technologies

09/18/2015  The upcoming IEEE S3S Conference 2015 in Sonoma, CA, on October 5-8, will focus on key technologies for the IoT era.

TSMC Forum Emphasizes Industry Collaboration

09/17/2015  Taiwan Semiconductor Manufacturing kicked off its Open Innovation Platform (OIP) Ecosystem Forum with thanks – not for another beautiful day in Silicon Valley, but for the collaborative work it does with its customers, suppliers, and other industry partners.

New motion sensor from STMicroelectronics enhances user interface and image stabilization in smartphones and tablets

09/17/2015  STMicroelectronics has introduced a six-axis motion-sensing device fully supporting image stabilization in smartphones, tablets, and digital still cameras.

Professors from UT Austin and Carnegie Mellon honored for excellence in semiconductor technology and design research

09/16/2015  The Semiconductor Industry Association, in consultation with Semiconductor Research Corporation, today presented its University Research Award to professors from the University of Texas at Austin and Carnegie Mellon University in recognition of their outstanding contributions to semiconductor research.

2015 International Conference on Planarization/CMP Technology (ICPT 2015)

09/16/2015  September 30 - October 2, 2015, Wild Horse Pass Hotel & Casino, Chandler, AZ, USA. ICPT 2015 provides the largest forum for academic researchers, industrial practitioners and engineers from around the world dedicated to the exchange of information on the state-of-the-art in Chemical Mechanical Polishing (CMP) and other planarization technologies.

Soitec and Simgui announce first 200-MM SOI wafers produced in China

09/15/2015  Soitec and Simgui jointly announced today that the first 200-mm silicon-on-insulator (SOI) wafers have been produced at Simgui's manufacturing facility in Shanghai.

SEMI Reports Second Quarter 2015 Worldwide Semiconductor Equipment Figures

09/15/2015  SEMI reported that worldwide semiconductor manufacturing equipment billings reached US$9.4 billion in the second quarter of 2015.

OEM Group Announces New Cintillio-S (TM) Automated Batch Wet Chemical Processing System

09/14/2015  Global semiconductor capital equipment manufacturer OEM Group announced today that it has launched its new Cintillio-S (TM) automated batch wet chemical processing system.

Greenpeak and Dusan Launch Smart Parking system

09/14/2015  GreenPeak Technologies and Dusun Electron Ltd recently announced a partnership with the launch of their first Smart City assisted parking application that addresses the growing parking problems in China's larger cities.

Realizing carbon nanotube integrated circuits

09/09/2015  Encapsulation layers keep carbon nanotube transistors stable in open air.




Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers



September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:


September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Trends in Flexible and Printed Electronics

October 2015 (Date and time TBD)

Printed electronics are at a pivotal moment. There are not only tremendous opportunities for innovation and growth in new verticals and industries, but a new way of thinking about how electronics are made, combining techniques and materials used by printed electronics with those of 3D printing. Presenters will review printed electronics and discuss future directions, from smart labels and wearables, to trends and technologies that enable the printing of IoT devices with embedded sensors, transistors, displays, batteries and memory.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015