Semiconductors

SEMICONDUCTORS ARTICLES



SiFive and UltraSoC partner to accelerate RISC-V development through DesignShare

09/07/2017  SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced that UltraSoC will provide debug and trace technology for the SiFive Freedom platform, based on the RISC-V open source processor specification as part of the DesignShare initiative.

Microsemi appoints Richard Beyer to its Board of Directors

09/07/2017  Microsemi Corporation today announced the appointment of Richard M. Beyer to its board of directors.

Cypress appoints Catherine Lego to Board of Directors

09/06/2017  Cypress Semiconductor Corp. today announced the appointment of Catherine P. Lego to its board of directors.

Defects in next-generation solar cells can be healed with light

09/06/2017  Researchers have shown that defects in the molecular structure of perovskites - a material which could revolutionise the solar cell industry - can be "healed" by exposing it to light and just the right amount of humidity.

Newly-discovered semiconductor dynamics may help improve energy efficiency

09/06/2017  Researchers examining the flow of electricity through semiconductors have uncovered another reason these materials seem to lose their ability to carry a charge as they become more densely "doped." Their results, which may help engineers design faster semiconductors in the future, are published online in the journal ACS Nano.

Stay ahead of the curve with SMC 2017 - Materials accelerating innovation

09/06/2017  Slated for September 18-20 in San Jose, Calif., the 18th annual SMC “offers a unique chance to network and discover opportunities in and around the industry in a year where dramatic growth has returned to the semiconductor market,” observes SMC 2017 co-chair Mark Thirsk of Linx Consulting, who will provide opening remarks at the conference.

Securing talent to connect, collaborate and innovate

09/06/2017  Our industry has a significant need for additional workers and several trends are working against us.

ASE K7 receives Green Factory Label

09/01/2017  Advanced Semiconductor Engineering, Inc, a semiconductor assembly and test service provider, announced that its K7 manufacturing facility in Kaohsiung has received the Green Factory Label from the Industrial Development Bureau, Ministry of Economic Affairs, Taiwan.

Update on the sale of Toshiba Memory Corporation

09/01/2017  There have been media reports speculating that Toshiba will make a decision on Aug 31 at Toshiba’s Board of Directors meeting.

DARPA's drive to keep the microelectronics revolution at full speed builds its own momentum

09/01/2017  A dozen performer teams with DARPA’s CHIPS program convene to kick off an ambitious push for an era of versatile, plug-and-play "chiplets."

SiC & GaN technologies upset the traditional benchmarks of the IGBT industry

09/01/2017  How is the IGBT market evolving for different applications? How will the IGBT market face the adoption of high performance WBG based devices?

New device could turn heat energy into a viable fuel source

08/31/2017  A new device being developed by Washington State University physicist Yi Gu could one day turn the heat generated by a wide array of electronics into a usable fuel source.

Most of 2017 capital spending will go to foundry and flash memory

08/31/2017  Spending for DRAM expected to show biggest percentage gain in 2017.

Leti launches emulator service to boost ROI and speed time to market for European chipmakers

08/31/2017  Leti, a technology research institute of CEA Tech, and Mentor, a Siemens business, today announced Leti will provide access to the Mentor Veloce emulator to SMEs and startups and will introduce emulation technology to global companies beginning Q3 2017.

Silicon solves problems for next-generation battery technology

08/30/2017  Silicon - the second most abundant element in the earth's crust - shows great promise in Li-ion batteries, according to new research from the University of Eastern Finland. By replacing graphite anodes with silicon, it is possible to quadruple anode capacity.

Researchers validate UV light's use in improving semiconductors

08/29/2017  A discovery by two scientists at the Energy Department's National Renewable Energy Laboratory (NREL) could aid the development of next-generation semiconductor devices.

Two-dimensional semiconductor process and device simulator MicroTec: Development status update

08/28/2017  Siborg Systems Inc. develops new tools for practical optical sensor prototype development using MicroTec.

Littelfuse to acquire IXYS Corporation

08/28/2017  Acquisition significantly expands capabilities across high growth power semiconductor markets.

The ConFab announces mainstream semiconductor and emerging technologies 2018 conference focus

08/28/2017  The ConFab – an exclusive conference and networking event for semiconductor manufacturing and design executives from leading device makers, OEMs, OSATs, fabs, suppliers and fabless/design companies – announces the 2018 event will be held at THE COSMOPOLITAN of LAS VEGAS on May 20-23.

New results reveal high tunability of 2-D material

08/28/2017  Berkeley Lab-led team also provides most precise band gap measurement yet for hotly studied monolayer moly sulfide.




TWITTER


WEBCASTS



3D NAND: Trends in Processes, Circuits

October 3, 2017 at 1 p.m. ET

Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

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TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

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EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS