Semiconductors

SEMICONDUCTORS ARTICLES



GaAs device market posts record revenues in 2013

09/05/2014  Ongoing growth in cellular and Wi-Fi applications will continue to drive GaAs device revenues higher.

UCSB researchers develop ultra sensitive biosensor from molybdenite semiconductor

09/04/2014  Move over, graphene. An atomically thin, two-dimensional, ultrasensitive semiconductor material for biosensing developed by researchers at UC Santa Barbara promises to push the boundaries of biosensing technology in many fields, from health care to environmental protection to forensic industries.

GLOBALFOUNDRIES adds Louis Lupin as Chief Legal Officer

09/04/2014  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, announced today that Louis “Lou” Lupin has joined the company as senior vice president and chief legal officer.

Contour Semiconductor awarded three new U.S. patents

09/04/2014  Contour Semiconductor, Inc., a developer of non-volatile memory technologies, today announced it has been awarded three new patents to back its Diode Transistor Memory (DTM) technology, the world's lowest production-cost, non-volatile memory technology.

Shinichi Machida named President and CEO of Fujitsu Semiconductor America

09/04/2014  Fujitsu Semiconductor America (FSA) today announced that Shinichi "James" Machida, who led the company from late 2008 until spring of 2011, has been named as the new president and CEO of FSA.

Samsung adopts ProPlus Designs' 14nm finFET process

09/03/2014  ProPlus Design Solutions, Inc. today announced Samsung Electronics has extended its partnership with ProPlus through the deployment of ProPlus' BSIMProPlus modeling platform for its 14-nanometer (nm) FinFET SPICE modeling.

Credo Semiconductor appoints Jeff Twombly as Vice President of Sales and Business Development

09/03/2014  Credo Semiconductor today announced the appointment of Jeff Twombly as vice president of sales and business development.

Edwards marks milestone with 1,000th shipment of EZENITH system

09/03/2014  Edwards Limited announced today that it has marked an important milestone with the shipment of its 1,000th EZENITH integrated vacuum and exhaust management system, which will ship to a US-based semiconductor manufacturing fab in October 2014.

Research Alert: September 3, 2014

09/03/2014  A new, tunable device for spintronics; Copper shines as flexible conductor; Competition for graphene

SEMICON Taiwan 2014 opens today with spotlight on 3D-IC, sustainable manufacturing, and MEMS

09/03/2014  Taiwanese chipmakers, LED manufacturers, and Outsourced Semiconductor Assembly and Test (OSAT) firms will spend firm nearly $24 billion in the next two years on equipment and materials, powering excitement for SEMICON Taiwan 2014, which opened today in Taipei.

Breakthrough in light sources for new quantum technology

09/02/2014  Electronic circuits are based on electrons, but one of the most promising technologies for future quantum circuits are photonic circuits, i.e. circuits based on light (photons) instead of electrons.

IDC lowers tablet projections for 2014 as demand in mature markets levels off

09/02/2014  Following a second consecutive quarter of softer than expected demand, International Data Corporation (IDC) has lowered its worldwide tablet plus 2-in-1 forecast for 2014 to 233.1 million units.

SUNY CSNE to use yield management software from Rudolph Technologies

09/02/2014  Rudolph Technologies, Inc. announced today that the SUNY College of Nanoscale Science and Engineering (CNSE), Albany, NY, has selected its Discover Enterprise Yield Management Software (YMS) to provide an integrated data warehouse and analytics system for the Global 450 Consortium (G450C) equipment development program.

MEI Wet Processing Systems reveals performance data for new critical etch system

09/02/2014  MEI Wet Processing Systems and Services revealed performance data today on its newly released Cu & TiW Critical Etch System for compound semiconductor manufacturing.

Semiconductor and circuit manufacturing: one of the top export industries in the United States

09/02/2014  Although operators will continue to face strong international competition, new opportunities in next-generation semiconductors and electronic inputs will encourage operators to invest in product development.

Intel Announces “New Interconnect” for 14nm

09/02/2014  Intel has just announced that “Embedded Multi-die Interconnect Bridge (EMIB”) packaging technology will be available to 14nm foundry customers.

Lithography: What are the alternatives to EUV?

09/01/2014  Hopes remain high for EUV, but long delays has caused attention to shift to various alternatives.

The significance of IBM's EUV benchmark

09/01/2014  IBM’s NXE3300B scanner, at the EUV Center of Excellence in Albany, recently completed a “40W” EUV light source upgrade.

The Week in Review: August 29, 2014

08/29/2014  Intel releases new packaging technologies; Fairchild Semiconductor to close two facilities; KLA-Tencor introduces new metrology tools; UMC joins Fujitsu's new foundry company; Thinnest-possible semiconductor; SEMI announces keynotes for Vietnam Semiconductor Strategy Summit

UMC joins Fujitsu's new foundry company

08/29/2014  United Microelectronics Corporation and Fujitsu Semiconductor Limited today announced an agreement for UMC to become a minority shareholder of a newly formed subsidiary of Fujitsu Semiconductor that will include its 300mm wafer manufacturing facility located in Kuwana, Mie, Japan.




FINANCIALS



TECHNOLOGY PAPERS



Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS



Metrology

September 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014
Strategic Materials Conference
Santa Clara, CA
http://www.semi.org/node/41386
September 30, 2014 - October 01, 2014
SEMICON Europa
Grenoble, France
http://www.semiconeuropa.org
October 07, 2014 - October 09, 2014
MEMS Executive Congress US 2014
Scottsdale, AZ
http://us2014.memscongress.com
November 05, 2014 - November 07, 2014