Semiconductors

SEMICONDUCTORS ARTICLES



Smaller and faster: The terahertz computer chip is now within reach

03/28/2018  Hebrew university researcher shows proof of concept for nanotechnology that will make computers run 100 times faster.

Making the most of color in your multi-patterning layouts

03/28/2018  There are many different situations in which special attention to color choices provide the potential to improve the manufacturing results of multi-patterned masks.

Exploring the thermoelectric properties of tin selenide nanostructures

03/27/2018  Researchers discover that nanometer-thick tin selenide crafted in thin films of connected 'nanoflakes' shows promise for thermoelectric energy conversion.

The future of photonics using quantum dots

03/27/2018  Quantum-dot lasers are promising for integrated photonic circuits.

Veeco achieves milestone with 100 automated MBE systems installed worldwide

03/27/2018  The installation of Veeco's GEN10 MBE System last month at Silanna Semiconductor PTY Ltd. in Australia marks this significant company milestone.

Xcerra announces preferred supplier agreement with Elmos

03/26/2018  Xcerra testers offer high quality and efficiency of test solutions for automotive semiconductor and sensor devices.

New insights from failures

03/26/2018  To be able to guarantee the reliability of transistors, we have been conducting research for some years now at imec to see what happens when transistors operate properly and when they fail.

Improving human-data interaction to speed nanomaterials innovation

03/26/2018  New application of data analysis, visualization techniques achieves better representation of multidimensional materials data; Work is part of Lehigh University's initiative to accelerate understanding of materials through improved human-data interaction

Semiconductor Industry Association issues statement on Trump administration Section 301 action on China

03/23/2018  The Semiconductor Industry Association (SIA) today released the following statement from President & CEO John Neuffer in response to the Section 301 action taken by the Trump Administration to address China's trade practices.

EUV lithography adds to increasing hydrogen demand at leading-edge fabs

03/23/2018  On-site production an option for supply.

North American semiconductor equipment industry posts February 2018 billings

03/23/2018  February billings remain at a level indicating another positive year for semiconductor equipment spending.

U.S. companies maintain largest share of fabless company IC sales

03/23/2018  China-based companies show the largest fabless IC marketshare gain since 2010.

Mechanism and improvements of Cu voids under via bottom

03/22/2018  This work explores the effect of underlying metallic alloys and the influence of Cu loss under via bottom after dry etching and wet cleaning processes. To Improve the Cu loss under via bottom, effective approaches are proposed. The modified actions for via bottom improve not only wafer yield but also reliability of the device.

Synopsys acquires Silicon and Beyond Private Limited

03/22/2018  Synopsys, Inc. today announced it has acquired Silicon and Beyond Private Limited, a provider of high-speed SerDes technology used in data intensive applications such as machine learning, cloud computing, and networking.

Golden touch: Next-gen optical disk to solve data storage challenge

03/22/2018  New technology offer cost-efficient and sustainable solution to global data storage challenge, while enabling the pivot from Big Data to Long Data and opening new realms of scientific discovery.

Electric textile lights a lamp when stretched

03/22/2018  Working up a sweat from carrying a heavy load? That is when the textile works at its best. Swedish researchers have developed a fabric that converts kinetic energy into electric power. The greater the load applied to the textile and the wetter it becomes the more electricity it generates.

High-performance, cost-effective, thin-film solar cell technology provides an attractive source of portable and mobile power

03/22/2018  Magnolia Optical Technology, Inc. announced that it is working with the Defense Advanced Research Projects Agency (DARPA) under the Phase II SBIR Program for Development of High-Performance Thin-Film Solar Cells for Portable Power Applications.

"Technology, Circuits & Systems for Smart Living" theme for 2018 Symposia on VLSI Technology & Circuits

03/21/2018  Bringing together a technical program that encompasses 'big integration' of a number of critical industry trends -- machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, and cloud computing -- the 2018 Symposia on VLSI Technology & Circuits will showcase a convergence of technologies needed for 'smart living.'

Automotive chip manufacturing in Japan drives innovation

03/21/2018  In Tokyo, Shanghai, Moscow, London, Paris or New York – wherever you are in the world –Japanese vehicles passing by on the roadways are a common sight.

RIT researchers improve fabrication process of nano-structures for electronic devices

03/21/2018  Use of indium gallium phosphide with I-MacEtch processing shows promise for more cost effective fabrication and increased performance in devices from photonics to telecommunications.




TWITTER


WEBCASTS



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: The Rise of Computational Process Control

Thursday, May 17, 2018 at 1:00 p.m. ET

The increased use of artificial intelligence (AI) and machine learning (ML) techniques such as deep learning is creating a myriad of both challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The semiconductor industry poses somewhat unique challenges arising from its complex, high precision and highly dynamic production environment. One key way that these challenges are being addressed in semiconductor is by using an approach called “computational process control” or “CPC” in which AI and ML are combined with subject matter expertise to provide higher quality analytical solutions. This webcast will look at the AI/ML explosion, what it means to the semiconductor industry, and how CPC is being used to enhance the benefits of these analytical techniques.

Sponsored By:
Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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