Brewer Science and Arkema announce partnership to bring high-performance material to semiconductor market

10/27/2015  Brewer Science, Inc., and Arkema announced a partnership to produce high-quality directed self-assembly (DSA) materials for use in semiconductor manufacturing.

Manipulating wrinkles could lead to graphene semiconductors

10/26/2015  RIKEN scientists have discovered that wrinkles in graphene can restrict the motion of electrons to one dimension, forming a junction-like structure that changes from zero-gap conductor to semiconductor back to zero-gap conductor.

Light goes infinitely fast with new on-chip material

10/23/2015  Researchers at the Harvard John A. Paulson School of Engineering and Applied Sciences (SEAS) have designed the first on-chip metamaterial with a refractive index of zero.

Berkeley Lab researchers demonstrate atomically thin excitonic laser

10/23/2015  An important step towards next-generation ultra-compact photonic and optoelectronic devices has been taken with the realization of a two-dimensional excitonic laser.

North American semiconductor equipment industry posts September 2015 book-to-bill ratio of 1.07

10/23/2015  North America-based manufacturers of semiconductor equipment posted $1.60 billion in orders worldwide in September 2015 (three-month average basis) and a book-to-bill ratio of 1.07.

SEMI announces continued annual growth for silicon shipment volumes

10/22/2015  Total wafer shipments this year are expected to exceed the market high set in 2014 and are forecast to continue shipping at record levels in 2016 and 2017.

IC Insights lowers its worldwide 2015 IC market forecast

10/22/2015  IC Insights recently released its October Update to The McClean Report, which examined the effects of slowing worldwide GDP growth and a stronger U.S. dollar on the 2015 IC market forecast.

Successful industrialization of high-density 3D integrated silicon capacitors for ultra-miniaturized electronic components

10/22/2015  Two years after the launch of the PICS project , three European SMEs, IPDiA, Picosun, and SENTECH Instruments along with CEA-Leti and Fraunhofer IPMS-CNT announce the major technological results achieved.

New NSF-SRC report on energy efficient computing

10/22/2015  A report that resulted from a workshop funded by Semiconductor Research Corporation and National Science Foundation outlines key factors limiting progress in computing and novel device and architecture research that can overcome these barriers.

MOSFETs automatically balance supercapacitors in industrial applications

10/21/2015  Advanced Linear Devices, Inc. (ALD) announced a family of Supercapacitor Auto Balancing (SAB) Metal Oxide Semiconductor Field Effect Transistors (MOSFET) designed for industrial applications.

Lam Research, KLA-Tencor to Combine in $10.6 Billion Deal

10/21/2015  Lam Research has agreed to acquire KLA-Tencor for $10.6 billion in cash and stock. The two giant suppliers of semiconductor capital equipment expect to close the transaction in mid-2016, subject to regulatory and shareholder approval.

Lam Research to acquire KLA-Tencor

10/21/2015  Lam Research Corporation (LRCX) and KLA-Tencor Corporation (KLAC) announced that they have entered into a definitive agreement for Lam Research to acquire all outstanding KLA-Tencor shares in a cash and stock transaction.

Western Digital announces acquisition of SanDisk

10/21/2015  Western Digital Corporation and SanDisk Corporation today announced that they have entered into a definitive agreement where Western Digital will purchase SanDisk.

Slideshow: 2015 IEDM Preview

10/20/2015  An advance look at some of the most newsworthy topics and papers that will be presented at this year's IEEE International Electron Devices Meeting.

Sitri launches in Silicon Valley to accelerate innovation in “More than Moore” and IoT technologies

10/20/2015  SITRI announced the opening of SITRI Innovations in Belmont, California during a recent event attended by many of Silicon Valley's leading investors, technologists, entrepreneurs, and incubators.

Historic era of consolidation for chip makers

10/19/2015  We are in a historic era for consolidation among semiconductor manufacturers, and the reasons are surprising.

Mentor Graphics Veloce VirtuaLAB Adds Next-Generation Protocols for Leading-edge Networking Designs

10/19/2015  Mentor Graphics Corp. today announced the Veloce® VirtuaLAB Ethernet environment with support for 25G, 50G and 100G Ethernet. This support enables highly efficient, emulation-based verification for the massive Ethernet-based designs being created today.

Siborg Systems introduces educational version of MicroTec semiconductor process and device simulator

10/19/2015  Siborg has recently made a new MicroTec version available particularly targeting educational use of the software.

Microsemi announces proposal to acquire PMC-Sierra, Inc.

10/19/2015  Microsemi Corporation announced that it submitted an offer to acquire PMC-Sierra, Inc in a cash and stock transaction.




Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

More Technology Papers


3D NAND Challenges and Opportunities

December 16, 2015 at 12:00 p.m. ET

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation will discuss this (r)evolution as well as its major scaling limitations.

Sponsored By:
IoT Device Trends and Challenges

January 2016 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015