Semiconductors

SEMICONDUCTORS ARTICLES



The Critical Materials Council to be managed by TECHCET in 2016

01/07/2016  The Critical Materials Council for Semiconductor Fabricators, originally established by ISMI/SEMATECH in the early 1990’s, will be managed by TECHCET CA LLC starting January 01, 2016.

A wild ride in 2015 - and two steps forward in 2016

01/07/2016  “In like a lion, out like a lamb” is just half the story for 2015. While initial expectations forecasted a double-digit growth year, the world economy faded and dragged our industry down to nearly flat 2015/2014 results.

Fairchild expects revised unsolicited proposal to result in "superior proposal"

01/06/2016  On December 28, Fairchild received an unsolicited offer from China Resources Microelectronics Limited and Hua Capital Management Co., Ltd. to acquire the company for $21.70 per share in cash.

EUV, multiple patterning, integrated circuits among topics for SPIE Advanced Lithography 2016

01/06/2016  EUV lithography is on the threshold of becoming a mainstream patterning technology for sub-10nm chips, featured speaker Anthony Yen of Taiwan Semiconductor Manufacturing Co. (TSMC) will tell fellow attendees at SPIE Advanced Lithography 2016.

Nanoworld 'snow blowers' carve straight channels in semiconductor surfaces

01/06/2016  The surprising trenching capability, reported by scientists from the National Institute of Standards and Technology (NIST) and IBM, is an important addition to the toolkit of nature-supplied 'self-assembly' methods that researchers aim to harness for making useful devices.

Global semiconductor sales dip slightly in November

01/05/2016  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $28.9 billion for the month of November 2015.

Promising new approach for controlled fabrication of carbon nanostructures

01/05/2016  An international team of researchers including Professor Federico Rosei and members of his group at INRS has developed a new strategy for fabricating atomically controlled carbon nanostructures used in molecular carbon-based electronics.

Belle Wei appointed to SEMI Foundation board of trustees

01/05/2016  The SEMI Foundation today announced that Belle W. Y. Wei, Ph.D., was elected as a new director to the SEMI Foundation Board of Trustees in accordance with the association's by-laws.

Choreographing the dance of electrons

01/04/2016  NUS scientists have discovered how to manipulate electrons in thin semiconductors by encapsulating them in atomically thin materials and changing the electric field.

A Year in Review: A look back at the top stories from 2015

01/04/2016  2015 was a year of unprecedented consolidation in the semiconductor industry, as well as a technological crossroads in Moore’s Law. Below is a round-up, based on reader popularity, of the most read stories on Solid State Technology from 2015.

Micron announces resignation of President Mark Adams

01/04/2016  Micron Technology, Inc. today announced that President Mark Adams will resign for personal health reasons.

Strong semiconductor growth forecast for electric vehicle DC fast-charging stations

12/23/2015  The global market for semiconductors used in electric vehicle (EV) charging stations for plug-in hybrid (PH) and battery electric vehicles (BEV) will continue to expand in the coming years, providing significant growth opportunities to semiconductor manufacturers.

TowerJazz signs agreement with Semiconductor Laboratory

12/22/2015  TowerJazz, the global specialty foundry, announced the signing of a definitive agreement with Semiconductor Laboratory, an Asian Governmental Agency.

New device uses carbon nanotubes to snag molecules

12/22/2015  Engineers at MIT have devised a new technique for trapping hard-to-detect molecules, using forests of carbon nanotubes.

Startup Works on Ultralow-k Materials for Chips, Displays

12/21/2015  The very last presentation at the 12th annual 3D Advanced Semiconductor Integration and Packaging conference was given by Hash Pakbaz, president and chief executive officer of SBA Materials, a developer of nanoporous and mesoporous materials for semiconductor manufacturing and other applications.

SAMCO launches ALD system for electronic devices and next-generation power devices

12/18/2015  SAMCO has developed and launched a new Atomic Layer Deposition (ALD) system focusing on gate oxide formation of Silicon Carbide (SiC) and Gallium Nitride (GaN) power devices, which are key for energy-saving devices or “green electronics.”

3D ASIP Conference Hears from EDA, IC Gear Companies

12/18/2015  John Ferguson of Mentor Graphics provided the electronic design automation perspective on packaging technology at the 12th annual 3D ASIP conference in Redwood City, Calif.

SEMI applauds congressional action to make R&D tax credit permanent; extend solar tax credit

12/18/2015  SEMI has been working to make the popular tax incentive a permanent part of the tax code since the R&D credit was first established in 1981.

North American semiconductor equipment industry posts November 2015 book-to-bill ratio of 0.96

12/18/2015  North America-based manufacturers of semiconductor equipment posted $1.24 billion in orders worldwide in November 2015 (three-month average basis) and a book-to-bill ratio of 0.96.

Packaging Conference Addresses Challenges, Opportunities in New Technologies

12/18/2015  On the second day of the 12th annual 3D ASIP conference, the heavy hitters came out to talk. Attendees heard presentations from executives of Amkor Technology, the Defense Advanced Research Projects Agency (DARPA), Northrop Grumman, Taiwan Semiconductor Manufacturing, Teledyne Scientific & Imaging, and Xilinx, among other companies.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016