Semiconductors

SEMICONDUCTORS ARTICLES



Diamonds closer to becoming ideal semiconductors

05/24/2016  Researchers find new method for doping single crystals of diamond.

Imec and Holst Centre present multi-standard low-power wide-area radio chip

05/24/2016  The nanoelectronics research centers imec and Holst Centre (set up by imec and TNO), presented a low-power wide-area (LPWA) multi-standard radio chip today at imec's annual technology forum in Brussels (ITF Brussels 2016).

Soitec announces with withdrawal of Silicon Genesis' patent lawsuit

05/23/2016  Silicon Genesis Corporation (SiGen) filed a motion to terminate the investigation by the U.S. International Trade Commission (ITC) in its entirety on the basis of the withdrawal of its complaint directed to silicon-on-insulator (SOI) wafers sold and imported into the United States by Soitec.

First Strategic Materials Conference in Korea: A success

05/23/2016  SEMI announced today that the first SEMI Strategic Materials Conference (SMC) was held in Korea COEX in Seoul on May 18.

Mike Noonen joins Silego Technology

05/23/2016  Silego Technology, the Configurable Mixed-signal Integrated Circuit (CMIC) pioneer, today announced the appointment of Mike Noonen to lead sales and business development.

GLOBALFOUNDRIES releases performance-enhanced 130nm SiGe RF technology

05/23/2016  GLOBALFOUNDRIES today announced a next-generation radio-frequency (RF) silicon solution for its Silicon Germanium (SiGe) high-performance technology portfolio.

Solid State Watch: May 13-19, 2016

05/23/2016  IBM scientists achieve storage memory breakthrough; Kateeva closes its Series E funding round with $88 million in new financing; Worldwide silicon wafer area shipments increased during the first quarter 2016 when compared to fourth quarter 2015 area shipments; New type of graphene-based transistor will increase the clock speed of processors

Fujitsu boosts efficiency of manufacturing processes at Shimane Fujitsu through IoT collaboration with Intel

05/19/2016  Fujitsu Limited today announced that it has with Intel Corporation carried out a field trial to visualize manufacturing processes at Shimane Fujitsu Limited.

IBM scientists achieve storage memory breakthrough

05/18/2016  For the first time, scientists at IBM Research have demonstrated reliably storing 3 bits of data per cell using a relatively new memory technology known as phase-change memory (PCM).

Imec expands its silicon platform for quantum computing applications

05/18/2016  At the Quantum Europe conference, taking place in Amsterdam, Belgian's nanoelectronincs research center imec announced today that it is ramping-up its R&D activities focused on quantum computing.

IBM keynoter outlines disruptive "Economy of Things" at SEMI’s ASMC 2016

05/18/2016  The 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2016), opened today (May 17) in Saratoga Springs, New York.

IQE joins imec's GaN-on-Si Industrial Affiliation Program

05/17/2016  Nanoelectronics research center imec today announced a strategic partnership on GaN-on-Si (Gallium Nitride-on-Silicon) technology with IQE, a designer and manufacturer of advanced semiconductor wafer products and services.

Ultratech Cambridge Nanotech forms research collaboration with Northeastern University

05/17/2016  Ultratech, Inc. announced the formation of a research collaboration with Professor Thomas J. Webster, Ph.D. at Northeastern University, to study the use of nano-materials produced via ALD for medical applications.

POET Technologies to acquire BB Photonics

05/17/2016  POET Technologies Inc., a developer of opto-electronics fabrication processes for the semiconductor industry, today announced that it has signed a definitive agreement to acquire all the shares of BB Photonics Inc.

First quarter 2016 silicon wafer shipments increase quarter-over-quarter

05/17/2016  Worldwide silicon wafer area shipments increased during the first quarter 2016 when compared to fourth quarter 2015 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

EUVL: Taking it down to 5nm

05/17/2016  The semiconductor industry is nothing if not persistent — it’s been working away at developing extreme ultraviolet lithography (EUVL) for many years.

Dan Squiller appointed as executive chairman of TriLumina’s Board of Directors

05/16/2016  Dan joins TriLumina with a wealth of experience having served in various senior executive and C-level positions at Scientific Atlanta, St. Bernard Software, Invensys plc, PowerGenix, GT Advanced Technologies, and Verengo Solar

STMicroelectronics reveals advanced silicon-carbide power devices

05/16/2016  STMicroelectronics announced advanced high-efficiency power semiconductors for Hybrid and Electric Vehicles (EVs) with a timetable for qualification to the automotive quality standard AEC-Q101.

New technique could make large, flexible solar panels more feasible

05/16/2016  A new, high-pressure technique may allow the production of huge sheets of thin-film silicon semiconductors at low temperatures in simple reactors at a fraction of the size and cost of current technology.

Seven Top-20 semiconductor suppliers show double-digit declines

05/12/2016  Qualcomm, Micron, and SK Hynix registered ≥25% drops, with total top-20 sales off by 6%.




TWITTER


WEBCASTS



Interconnection Technologies

June 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS