Semiconductors

SEMICONDUCTORS ARTICLES



Chipmakers seek solution to neon gas supply shortage

03/30/2016  Finding a short term solution to the neon gas shortage problem will be challenging.

Impact of triboelectric charging from DI water on transistor gate damage

03/30/2016  Optimized settings for DI water pressure at CMP and careful analysis of interconnect layout are used to improve quality on a complex analog design.

New magnet discovered

03/30/2016  A group of researchers from Osaka University and The University of Tokyo discovered a new magnet capable of controlling Dirac fermions with zero mass.

Mixed signal and IoT driving ASIC design starts growth, says Semico Research

03/29/2016  Steady demand in existing end markets and growth from new end applications are pushing ASIC design activity to new levels.

ACM demonstrates damage-free cleaning technology on 1Xnm patterned wafer

03/28/2016  ACM Research (Shanghai), Inc. has announced that it has solved the problem of patterned wafer cleaning.

TSMC and Nanjing sign 12-inch fab investment agreement

03/28/2016  TSMC today announced that the Company and the municipal government of Nanjing, China have signed an investment agreement.

How finFETs ended the service contract of silicide process

03/25/2016  A look into how the silicide process has evolved over the years, trying to cope with the progress in scaling technology and why it could no longer be of service to finFET devices.

Trace metal contamination: Choosing elastomer materials for critical operations

03/25/2016  An exploration of where trace metals come from, the impact they have on the industry and what can be done to reduce the risks.

The GaN RF market enjoyed a healthy increase in 2015

03/25/2016  GaN RF devices market will double over the next five years, led by GaN’s adoption across various market segments.

Amkor announces shipment of 700M RF and advanced SiP modules

03/25/2016  Amkor Technology Inc. announced it has shipped 700 million RF and front-end advanced system-in-package (SiP) modules for mobile device applications.

Graphene nanoribbons: It's all about the edges

03/24/2016  As electronic components are becoming ever smaller, the industry is gradually approaching the limits of what is achievable using the traditional approach with silicon as a semiconductor material.

Bath semiconductor research boosted by new nano-scale patterning equipment

03/24/2016  The University of Bath is the only university in the UK to have installed a unique Nano-Lithography printing system, enabling Bath to lead the way in the development of advanced manufacturing techniques for nano-engineered semiconductors.

Pivotal Critical Materials Conference for semiconductor fabs to take place May 5-6, 2016

03/23/2016  The Critical Materials Conference, a pivotal, 2-day event organized by TECHCET with the support of the Critical Materials Council, will be held this year in Hillsboro, Oregon on May 5th and 6th, directly following the Council Meeting.

The United States leads growing global industrial semiconductor market

03/22/2016  The industrial semiconductor market will post an 8 percent compound annual growth rate (CAGR), as revenue rises from $43.5 billion in 2014 to $59.5 billion in 2019.

New way to control particle motions on 2-D materials

03/21/2016  Researchers at MIT and other institutions have found a new phenomenon in the behavior of a kind of quasiparticles called plasmons as they move along tiny ribbons of two-dimensional materials such as graphene and TMDs

Imec enhances its silicon photonics platform to support 50Gb/s non-return-to-zero optical lane rates

03/21/2016  Nanoelectronics research center imec presents at OFC 2016, the international event for both the science and business of optical communications held March 20-24, performance improvements of various key building blocks of its wafer-scale integrated silicon photonics platform (iSiPP).

3D Chips, New Packaging Challenge Metrology and Inspection Gear

03/21/2016  Metrology and inspection technology is growing more complicated as device dimensions continue to shrink. Discussing crucial trends in the field are Lior Engel, vice president of the Imaging and Process Control Group at Applied Materials, and Rudolph Technologies.

Molecular Modeling of Materials Defects for Yield Recovery

03/21/2016  New materials are being integrated into High Volume Manufacturing (HVM) of semiconductor ICs, while old materials are being extended with more stringent specifications.

IRT Nanoelec project integrates laser directly on silicon with a modulator

03/18/2016  IRT Nanoelec today announced the first co-integration of a III-V/silicon laser and silicon Mach Zehnder modulator demonstrating 25 Gbps transmission on a single channel.

3D NAND and 10nm investments drive equipment spending, book-to-bill data indicates

03/18/2016  A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.




TWITTER


WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Trends in MEMS

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Fan-Out Wafer Level Packaging

May 2016 (Date and time TBD) / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS