Semiconductors

SEMICONDUCTORS ARTICLES



Imec reports breakthrough work that advances path for nanoscale spin-wave majority gates

10/31/2016  At the Annual Conference on Magnetism and Magnetic Materials, imec presented breakthrough results supporting the building of technology-relevant majority gates based on spin waves.

van der Pauw and Hall voltage measurements with a parameter analyzer

10/31/2016  van der Pauw measurements with a parameter analyzer are examined followed by a look at Hall effects measurements.

ON Semiconductor selects DSI to improve stock accuracy with Digital Supply Chain Platform

10/31/2016  DSI announced today that ON Semiconductor has selected DSI’s Digital Supply Chain Platform (DSCP) to increase stock accuracy and improve worker productivity in its inventory processes across the global supply chain.

Managing particle flows in process exhaust for safety and profitability

10/28/2016  Solid particles in the abatement exhaust must be properly managed, and in some cases, substantially reduced from the gas stream before it is released into the environment.

Analog Devices acquires Innovasic

10/27/2016  Analog Devices, Inc. today announced the acquisition of Innovasic Inc., a provider of Deterministic Ethernet semiconductor and software solutions.

Power electronics powered by Picosun's batch aluminum nitride

10/27/2016  Picosun Oy, a supplier of advanced industrial ALD (Atomic Layer Deposition) technology, now provides its customers production-scale aluminum nitride batch process with superior film thickness uniformity and fast speed.

Cadence CEO to be awarded Dr. Morris Chang Exemplary Leadership Award

10/27/2016  He will be presented with this achievement award during the GSA Awards Dinner Celebration on Thursday, December 8, 2016, at the Santa Clara Convention Center in Santa Clara, Calif.

Qualcomm to acquire NXP

10/27/2016  Qualcomm Incorporated and NXP Semiconductors N.V. today announced a definitive agreement, unanimously approved by the boards of directors of both companies, under which Qualcomm will acquire NXP.

SMIC standardizes on Synopsys StarRC for signoff parasitic extraction

10/26/2016  Semiconductor Manufacturing International Corporation and Synopsys, Inc. today announced that it has adopted Synopsys' StarRC product as the standard solution for signoff parasitic extraction for its 28nm process technology.

Semiconductor IP market to exceed $8B by 2020, according to Semico Research

10/26/2016  One of the mainstays of the System-on-a-Chip (SoC) market is the continued growth of the 3rd Party Semiconductor Intellectual Property (SIP) market.

Aura Semiconductor raises Series A funding

10/25/2016  Aura Semiconductor, a provider of high performance analog mixed signal solutions, today announced that it has completed Series A round of equity investment from Bay Area based WRV Capital.

Cadence reference flow with digital and signoff tools certified on Samsung's 10nm process technology

10/25/2016  Reference flow enables system and semiconductor companies to accelerate delivery of designs on Samsung's second-generation 10nm process (10LPP).

Synopsys Custom Compiler certified for Samsung's 10nm process technology

10/25/2016  Synopsys, Inc. today announced that its Custom Compiler tool has been certified by Samsung Electronics Co., Ltd. to support their 10-nanometer (nm) LPP (Low Power Plus) process.

SEMICON Europa opens tomorrow in Grenoble, France

10/24/2016  SEMICON Europa will open its doors tomorrow, showcasing the latest product, tools, and technologies for advanced microelectronics manufacturing.

ams schedules 2017 multi-project wafer starts for analog foundry customers

10/24/2016  180nm CMOS and HV-CMOS MPW runs are now manufactured in ams' 200mm fabrication facility in Austria.

Messe München and SEMI Europe announce new alliance

10/24/2016  SEMICON Europa co-locating with productronica and electronica, expanding electronics focus.

Ultralow power transistors could function for years without a battery

10/21/2016  A new design for transistors which operate on 'scavenged' energy from their environment could form the basis for devices which function for months or years without a battery, and could be used for wearable or implantable electronics.

New perovskite solar cell design could outperform existing commercial technologies

10/21/2016  Stanford, Oxford team creates high-efficiency tandem cells.

Researchers find way to tune thermal conductivity of 2-D materials

10/21/2016  Researchers have found an unexpected way to control the thermal conductivity of two-dimensional (2-D) materials, which will allow electronics designers to dissipate heat in electronic devices that use these materials.

Semiconductor equipment bookings continue to outpace equipment billings in new book-to-bill report

10/21/2016  A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.




TWITTER


WEBCASTS



Smartphone Market Driving 7nm & 5nm Node 3-D Transistors and Stacked Devices

December 15, 2016 at 1 p.m. ET / Sponsored by Versum Materials

The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.

Sponsored By:
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TECHNOLOGY PAPERS



Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



Industry Strategy Symposium 2017
Half Moon Bay, CA
http://www.semi.org/en/en/node/71404
January 08, 2017 - January 11, 2017
European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017

VIDEOS