Semiconductors

SEMICONDUCTORS ARTICLES



Second quarter 2016 silicon wafer shipments increase quarter-over-quarter; sets a new record

07/27/2016  Worldwide silicon wafer area shipments increased during the second quarter 2016 when compared to first quarter 2016 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Chemical etching method helps transistors stand tall

07/26/2016  University of Illinois researchers have developed a way to etch very tall, narrow finFETs, a type of transistor that forms a tall semiconductor "fin" for the current to travel over. The etching technique addresses many problems in trying to create 3-D devices, typically done now by stacking layers or carving out structures from a thicker semiconductor wafer.

Peregrine Semiconductor announces new VP General Manager

07/26/2016  Peregrine Semiconductor Corp. today announced the promotion of Takaki Murata to vice president and general manager of the high performance analog (HPA) business unit.

Worldwide semiconductor capital spending to decline 0.7% in 2016, Gartner reports

07/22/2016  Worldwide semiconductor capital spending is projected to decline 0.7 percent in 2016, to $64.3 billion, according to Gartner, Inc. This is up from the estimated 2 percent decline in Gartner's previous quarterly forecast.

Registration open with new exhibition features at SEMICON Europa

07/22/2016  Today SEMI announced registration opened for Europe's largest electronics manufacturing exhibition, SEMICON Europa (25-26 October) in Grenoble.

North American semiconductor equipment industry posts June 2016 book-to-bill ratio of 1.00

07/22/2016  Billings activity for equipment companies based in North America are at their highest level since February 2011.

2016 IEEE IEDM to showcase the latest tech developments in micro/nanoelectronics

07/21/2016  Paper-submission deadline is August 10 this year; Supplier exhibition to be held in conjunction with technical program.

International Technology Roadmap for Semiconductors examines next 15 years of chip innovation

07/21/2016  Final installment of biannual report outlines short-term and long-term challenges and opportunities facing semiconductor technology.

Scientists glimpse inner workings of atomically thin transistors

07/19/2016  With an eye to the next generation of tech gadgetry, a team of physicists at The University of Texas at Austin has had the first-ever glimpse into what happens inside an atomically thin semiconductor device.

The danger that lurks below

07/19/2016  The semiconductor industry is moving quickly to adopt a variety of new materials in an effort to increase chip performance.

Three-in-one tool speeds bump inspection

07/19/2016  Last year, Rudolph Technologies, Inc. announced the widespread adoption and success of its newest macro defect inspection tool, the NSX 330 Series.

Silicon Valley-based foundry Noel Technologies marks 20th Anniversary

07/18/2016  Silicon Valley specialty semiconductor foundry Noel Technologies, a provider of process development and substrate fabrication for a variety of high-technology industries, celebrates its 20th anniversary this month.

Light-trapping 3D solar cells undergo space testing

07/18/2016  A novel three-dimensional solar cell design developed at Georgia Tech will soon get its first testing in space aboard the International Space Station.

Toshiba and Western Digital celebrate opening of new Fab 2 semiconductor fabrication facility in Japan

07/15/2016  Toshiba Corporation and Western Digital Corporation today celebrated the opening of the New Fab 2 semiconductor fabrication facility located in Yokkaichi, Mie Prefecture, Japan.

Easier, faster, cheaper: A full-filling approach to making nanotubes of consistent quality

07/15/2016  Approach opens a straightforward route for engineering the properties of single-wall carbon nanotubes.

Novel advancements in radiation tolerance of HEMTs

07/15/2016  Compared to similar aluminum gallium arsenide/gallium arsenide HEMTs, the gallium nitride-based HEMTs are ten times more tolerant of radiation-induced displacement damage.

Researchers develop faster, precise silica coating process for quantum dot nanorods

07/15/2016  Materials researchers at North Carolina State University have fine-tuned a technique that enables them to apply precisely controlled silica coatings to quantum dot nanorods in a day - up to 21 times faster than previous methods.

Infineon to acquire Wolfspeed, power and RF division of Cree, Inc.

07/14/2016  Infineon Technologies AG and Cree, Inc. announced today that Infineon has entered into a definitive agreement to acquire the Wolfspeed Power and RF division of Cree.

Cellular handset IC market CAGR forecast at 6.7% through 2019

07/14/2016  Cellphone IC market CAGR to exceed total IC market CAGR by 3.0 points through forecast.

New materials need new handling approaches

07/13/2016  Wenge Yang of Entegris spoke with the Show Daily about major trends in High Volume Manufacturing (HVM), and about the topics that will be discussed in the Entegris Yield Breakfast Forum “Yield Enhancement Challenges in Today’s Memory IC Production” happening Thursday morning, July 14.




TWITTER


WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

Date and time TBD / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
Interconnection Technologies

August 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

More Technology Papers

EVENTS



European MEMS Summit 2016
Stuttgart, Germany
http://www.semi.org/eu/node/8871
September 15, 2016 - September 16, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS