Semiconductors

SEMICONDUCTORS ARTICLES



GaN Systems' investors receive Venture Capital Awards

04/17/2017  Investor of the Year, Chrysalix Venture Capital selected over 11,000 nominees Cycle Capital Management named Canada's 2nd most active VC in 2016.

Gartner: Worldwide semiconductor revenue forecast to increase 12.3% in 2017

04/14/2017  Worldwide semiconductor revenue is forecast to total $386 billion in 2017, an increase of 12.3 percent from 2016, according to Gartner, Inc.

Axcelis announces multiple Purion orders from several leading chip makers in Asia Pacific

04/14/2017  Axcelis Technologies, Inc. announced today that it has received multiple orders for the Purion H high current, Purion XE high energy, and Purion EXE extended high energy system from several leading chip manufacturers in the Asia Pacific region.

New switching process in non-volatile spintronics devices

04/14/2017  Physicists achieved a robust and reliable magnetization switching process by domain wall displacement without any applied fields. The effect is observed in tiny asymmetric permalloy rings and may pave the way to extremely efficient new memory devices.

DDR4 set to account for largest share of DRAM market by architecture

04/14/2017  DDR4 and DDR3 forecast to represent 97% of sizzling 2017 DRAM market.

Kulicke & Soffa opens latest process and applications laboratory

04/13/2017  Kulicke & Soffa Industries, Inc. announced today the opening of its latest Process and Applications laboratory at the K&S Netherlands facility.

PolyU develops novel semiconductor nanofiber with superb charge conductivity

04/13/2017  The Department of Mechanical Engineering of The Hong Kong Polytechnic University (PolyU) has developed a novel technology of embedding highly conductive nanostructure into semiconductor nanofiber.

Method improves semiconductor fiber optics, paves way for developing devices

04/13/2017  A new method to improve semiconductor fiber optics may lead to a material structure that might one day revolutionize the global transmission of data, according to an interdisciplinary team of researchers.

Art of paper-cutting inspires self-charging paper device

04/12/2017  Despite the many advances in portable electronic devices, one thing remains constant: the need to plug them into a wall socket to recharge. Now researchers, reporting in the journal ACS Nano, have developed a light-weight, paper-based device inspired by the Chinese and Japanese arts of paper-cutting that can harvest and store energy from body movements.

Silicon-on-insulator market worth 1,859.3M USD by 2022

04/12/2017  The factors that are driving the growth of this market include the growth in the consumer electronics market, low wafer and gate cost, low operating voltage, and miniaturization of semiconductor devices.

Microprocessors based on a layer of just 3 atoms

04/12/2017  Microprocessors based on atomically thin materials hold the promise of the evolution of traditional processors as well as new applications in the field of flexible electronics.

Si2 contributes advanced IC power modeling technology to IEEE

04/11/2017  Silicon Integration Initiative, Inc. (Si2), a integrated circuit research and development joint venture, has contributed new power modeling technology to the IEEE P2416 System Level Power Model Working Group.

USC Viterbi researchers develop new class of optoelectronic materials

04/11/2017  New class of semiconductor materials can be used as light absorber in solar cells.

NXP announces new 65 V LDMOS technology that speeds RF power design

04/10/2017  NXP Semiconductors N.V. today announced a new laterally diffused metal oxide semiconductor (LDMOS) technology for RF power transistors designed for operation up to 65 volts (V).

ON Semiconductor extends leading image sensor portfolio for sub-lux imaging applications

04/10/2017  New IT-EMCCD image sensors combine improved low-light and NIR sensitivity with simplified integration for camera manufacturers.

MagnaChip to host its annual Foundry Technology Symposium in Santa Clara, California

04/10/2017  MagnaChip Semiconductor Corporation announced today that it will host its Annual U.S. Foundry Technology Symposium at Hilton Santa Clara, California, on June 7th, 2017.

Putting a spin on logic gates

04/10/2017  A research collaboration in Germany develops a prototype for a spin-wave majority logic gate that uses wave interference for information processing.

SEMI reports 2016 semiconductor photomask sales of $3.3B

04/10/2017  SEMI today announced that the worldwide semiconductor photomask market was $3.32 billion in 2016 and is forecasted to reach $3.57 billion in 2018.

Shanhai Capital completes acquisition of Analogix Semiconductor

04/07/2017  Analogix Semiconductor, Inc. and Beijing Shanhai Capital Management Co, Ltd. today jointly announced the completion of the approximately $500 million acquisition of Analogix Semiconductor.

2016 marks year of recovery for global semiconductor market

04/07/2017  In 2016, the market posted a year-end growth rate of 2 percent with chip growth seen across multiple market segments. Global revenue came in at $352.4 billion, up from $345.6 billion in 2015.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

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Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

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MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

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TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

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