Semiconductors

SEMICONDUCTORS ARTICLES



Breakthrough opportunities at SEMICON West for an industry in transition

06/28/2016  With disruptive changes occurring in the electronics supply chain, 26,000 professionals will converge on SEMICON West 2016 (July 12-14) at Moscone Center in San Francisco to hear insider perspectives on what the future holds for the industry.

FormFactor completes acquisition of Cascade Microtech

06/28/2016  FormFactor, Inc. today announced that it has completed the acquisition of Beaverton, Oregon-based Cascade Microtech, Inc.

Digital redefines supply chain: Big change and big opportunity

06/28/2016  With many disruptive changes occurring in the electronics supply chain, the one with the biggest impact may come from smart manufacturing and the emergence of the digital supply chain.

Synopsys and Lattice Semiconductor extend multi-year OEM agreement for FPGA design software

06/27/2016  Synopsys, Inc. today announced a multi-year extension of its OEM agreement with Lattice Semiconductor Corporation for Synopsys' Synplify Pro FPGA synthesis tools.

Presto Engineering signs agreement with NAGRA for secure product production

06/27/2016  Presto will provide supply chain management and production services for several of NAGRA’s key products in the Pay TV market.

SMIC acquires LFoundry

06/27/2016  Semiconductor Manufacturing International Corporation jointly announces with LFoundry Europe GmbH and Marsica Innovation S.p.A., the signing of an agreement on June 24, 2016 to purchase a 70% stake of LFoundry for a consideration of 49 million EUR.

Qualcomm files complaint against Meizu in China

06/24/2016  Qualcomm Incorporated announced that it has filed a complaint against Meizu in the Beijing Intellectual Property Court.

Photovoltaic cells replicate rose petals

06/24/2016  With a surface resembling that of plants, solar cells improve light-harvesting and thus generate more power.

Process Watch: Process control and production cycle time

06/24/2016  In the early stages of development, having more process control can help reduce both the number and duration of cycles-of-learning (the iterations required to solve a particular problem).

Increased use of semiconductors in auto industry to boost global semiconductor capital equipment until 2020

06/23/2016  According to the latest market research report by Technavio, the global semiconductor capital equipment market is expected to reach $47.34 billion mark by 2020.

SMIC begins mass production of Qualcomm Snapdragon 425 processor in Beijing

06/23/2016  The successful production of 28nm Snapdragon products in Beijing represents an important step for SMIC's 28nm technology.

MagnaChip selects Mentor Graphics Analog FastSPICE platform

06/23/2016  The AFS Platform provides the world's fastest circuit verification for nanometer analog, RF, mixed-signal, memory, and custom digital circuits.

WPG Americas Inc. awarded Fastest Growing Revenue award from Micron

06/23/2016  WPG Americas, Inc. (WPGA), a subsidiary of WPG Holdings, Asia's number one electronics distributor, was recently awarded the Fastest Growing Revenue Recognition Award by Micron Technology, Inc.

POET Technologies announces closing of acquisition of BB Photonics

06/23/2016  POET completes the transaction owning 100% of BB Photonics and its assets, including intellectual property and technologies.

Power transistors to see less volatility in second half of this decade

06/22/2016  Greater demand for energy efficiency in systems, cars, portable electronics, and new connections to the Internet of Things will steadily drive power transistor sales to new record-high levels in the next three years.

Automotive semiconductor market grows slightly in 2015 while ranks shift

06/22/2016  Despite slower growth for the automotive industry and exchange rate fluctuations, the automotive semiconductor market grew at a modest 0.2 percent year over year, reaching $29 billion in 2015, according to IHS.

Ultratech receives follow-on order from major Asian foundry for laser spike annealing system

06/21/2016  The LSA101 tool will be used to support the foundry's 28nm and 40nm production efforts, and Ultratech expects to ship the system in the third quarter of 2016.

EV Group scores fourth consecutive triple crown win in annual VLSIresearch customer satisfaction survey

06/21/2016  EV Group (EVG) today announced that, for the fourth successive year, it has earned all three awards resulting from VLSIresearch Inc.'s annual Customer Satisfaction Survey.

Solar cells for greener and safer energies

06/21/2016  ICFO researchers report on low-temperature, solution-processed, environmentally friendly inorganic solar cells made with Earth-abundant materials capable of operating with a power conversion of 6.3 percent.

Samco boosts shipment capacity with second production center

06/21/2016  Samco, a Japan-based semiconductor processing equipment manufacturer, held a completion ceremony for its second production center on June 17.




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Flawless Execution at Fairchild: How Change to Modern MES Enables Agility, Quality and Productivity

August 9, 2016 at 1 PM ET / Sponsored by Epicor and Siemens

In this high-pressure environment, leading semiconductor companies are swapping out older manufacturing executions systems (MES) for modern MES. Surprised? True, the perceived risk of changing out MES in a semiconductor facility is high. Yet companies have done it with great success and enormous business benefits. Fairchild Semiconductor’s positive experiences as it strives for quality, on-time delivery, new product introduction success, improved productivity and quality are indicative. In just one year, Fairchild switched out aging systems for a new MES at a plant in China – and the following month, they got it up at a second plant. Learn what they did to ensure the change happened quickly and without a hitch. In addition to this case study, you’ll hear from a leading industry analyst who has interviewed dozens of people from semiconductor companies that have succeeded with the move to modern MES.

Sponsored By:
Interconnection Technologies

August 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

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