Semiconductors

SEMICONDUCTORS ARTICLES



TowerJazz and Tacoma announce a partnership for a new 8-inch fabrication facility in Nanjing, China

08/21/2017  TowerJazz to gain up to 50% of the planned fab loading capacity.

SEMI Foundation celebrates New York State United Teachers, Recognizes Applied Materials & KLA-Tencor Volunteers of the Year

08/21/2017  The SEMI Foundation today announced that it will be celebrating its 10th anniversary of partnership with New York State United Teachers (NYSUT) on August 22-23 in Latham, New York at the NYSUT headquarters.

Global GaAs wafers market to grow at a CAGR of 11.9% by 2021

08/21/2017  The global gallium arsenide wafer market to decline at a CAGR of 11.9% during the period 2017-2021.

PC DRAM contract price rose by over 10% sequentially and global DRAM revenue increase by 16.9% sequentially Q2

08/18/2017  Global DRAM revenue reached a new historical high in the second quarter of 2017, according to DRAMeXchange.

Lam Research takes uniformity control to the edge

08/16/2017  Chipmakers want every part of the wafer to yield good die. Advances in process technologies have just about made this a reality, even as feature dimensions continue to shrink and devices grow more complex.

Rice University materials scientists create 2-faced 2-D material

08/16/2017  The Rice laboratory of materials scientist Jun Lou has made a semiconducting transition-metal dichalcogenide (TMD) that starts as a monolayer of molybdenum diselenide. They then strip the top layer of the lattice and replace precisely half the selenium atoms with sulfur.

New ultrathin semiconductor materials exceed some of silicon's "secret" powers

08/16/2017  Electrical engineers at Stanford have identified two semiconductors that share or even exceed some of silicon’s desirable traits, starting with the fact that all three materials can "rust."

SIA statement regarding Trump Administration action to protect U.S. intellectual property in foreign markets

08/16/2017  The Semiconductor Industry Association (SIA) released a statement in response to the Trump Administration's decision to set in motion a process led by the United States Trade Representative to investigate China's unfair trade practices.

DRAM, NAND flash, automotive analog/logic among bestgrowing ICs

08/15/2017  Topping the chart of fastest-growing products is DRAM, which comes as no surprise given the strong rise of average selling prices in this segment throughout the first half of 2017.

Large wafers, complex IC designs among advanced packaging trends

08/15/2017  The global semiconductor advanced packaging market is expected to grow at a CAGR of 8.45% during the period 2017-2021, according to Research and Markets.

Vacuum subsystems: largest and fastest growing market segment

08/14/2017  The increase in vacuum process intensity of the semiconductor industry means that by 2022, the market for vacuum subsystems could be up to 62 percent higher than today’s value of $1.9 billion.

Industry upswing: End of cycles?

08/14/2017  Semiconductor-related companies are trading at all-time highs, and record device shipments and revenues as well as equipment revenues are expected.

Everspin Announces 1-Gigabit MRAM

08/10/2017  Everspin Technologies, Inc. has begun sampling its new 1-Gigabit Spin Torque Magnetoresistive Random Access Memory (ST-MRAM) with lead customers.

Global Memory Card Market to Exceed $9 billion by 2021

08/10/2017  The market for memory cards will reach $9.025 billion by 2021. That’s up from $8.83 billion in 2016, a CAGR of approximately 0.45%.

Samsung introduces far-reaching V-NAND memory solutions to tackle data processing and storage challenges

08/09/2017  Samsung Electronics Co., Ltd. has announced new V-NAND (Vertical NAND) memory solutions and technology that will address the pressing requirements of next-generation data processing and storage systems.

NanoString and Lam Research announce strategic development collaboration

08/09/2017  NanoString Technologies, Inc. and Lam Research Corporation today announced a strategic collaboration to develop NanoString's proprietary Hyb & Seq next-generation sequencing platform.

GLOBALFOUNDRIES demonstrates 2.5D high-bandwidth memory solution

08/09/2017  GLOBALFOUNDRIES today announced that it has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14 integrated design system for application-specific integrated circuits (ASICs).

IntelliProp announces Gen-Z persistent memory controller combining DRAM and NAND

08/08/2017  This controller combines DRAM and NAND and sits on the Gen-Z fabric, not the memory bus.

Microsemi collaboration enables Mellanox and other industry leaders to deliver NVMe-oF architectures

08/08/2017  Microsemi's peer-to-peer memory technology facilitates large data streams to transfer between NVMe-oF applications with better throughput, latency and quality of service.

Rinchem announces expansion of infrastructure in South Korea

08/07/2017  Rinchem recently announced the expansion of its chemical distribution center in Pyeongtaek, South Korea.




TWITTER


WEBCASTS



3D NAND: Trends in Processes, Circuits

October 3, 2017 at 1 p.m. ET

Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

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EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS