Semiconductors

SEMICONDUCTORS ARTICLES



Mega Fluid Systems and Entrepix join forces to offer complete CMP system

03/17/2014  Mega Fluid Systems Inc., a supplier of chemical and slurry delivery equipment, and Entrepix Inc., a provider of chemical mechanical polishing (CMP) equipment and process services, today announced a partnership agreement.

Creating a graphene-metal sandwich to improve electronics

03/14/2014  Researchers have discovered that creating a graphene-copper-graphene “sandwich” strongly enhances the heat conducting properties of copper, a discovery that could further help in the downscaling of electronics.

Surface characteristics influence cellular growth on semiconductor material

03/14/2014  Changing the texture and surface characteristics of a semiconductor material at the nanoscale can influence the way that neural cells grow on the material.

Toshiba brings civil suit against SK Hynix

03/14/2014  Toshiba Corporation announced that it has brought a civil suit against Korea’s SK Hynix Inc. at the Tokyo District Court, under Japan’s Unfair Competition Prevention Act.

3D EDA brings together proven 2D solutions

03/14/2014  Design methodologies and technologies for 2D multi-chip systems are extended into 3D using proprietary tools based on industry standards.

Silicon Innovation Forum to expand in 2014

03/13/2014  Coordinated by SEMI, the Silicon Innovation Forum is organized by leading strategic investment groups in the global semiconductor industry including: Applied Ventures, Dow Ventures, Intel Capital, Micron Ventures, TEL Venture Capital, BASF Ventures, and Samsung Ventures.

SanDisk files lawsuit against SK Hynix for theft of trade secrets

03/13/2014  These actions relate to the theft of trade secrets related to NAND flash technology by a former engineer of SanDisk who left the company in 2008 to work for SK Hynix.

Imec achieves record 8.4 percent conversion efficiency in fullerene-free organic solar cell

03/12/2014  In this week’s Nature Communications, imec presents the development of fullerene-free organic photovoltaic (OPV) multilayer stacks achieving a record conversion efficiency of 8.4 percent.

Fab productivity and process technologies addressed at upcoming semiconductor manufacturing conference

03/12/2014  The 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) will be held May 19-21 in Saratoga Springs, New York.

Advancing the Russian microelectronics industry — SEMICON Russia 2014

03/12/2014  On May 13-15, the key industry players, science institutes and innovation business representatives will gather in Moscow at SEMICON Russia — the premier Russian semiconductor exhibition and conference.

EV Group boosts 2.5D and 3D IC/TSV performance with new NanoSpray application

03/12/2014  EV Group today announced that its patented NanoSpray conformal coating technology is now available on its newly introduced EVG150XT resist coating and developing system for high-volume manufacturing (HVM) semiconductor applications.

STATS ChipPAC introduces breakthrough manufacturing method for wafer level packaging

03/12/2014  STATS ChipPAC, a provider of advanced semiconductor packaging and test services, has designed and implemented an innovative new manufacturing method that is a significant paradigm shift from conventional wafer level manufacturing.

SEMI reports 2013 global semiconductor equipment sales of $31.6 billion

03/12/2014  SEMI, the global industry association for companies that supply manufacturing technology and materials to the world’s chip makers, today reported that worldwide sales of semiconductor manufacturing equipment totaled $31.58 billion in 2013.

Bending light with a tiny chip

03/11/2014  The Caltech chip eliminates the need for bulky and expensive lenses and bulbs and instead uses a so-called integrated optical phased array (OPA) to project the image electronically with only a single laser diode as light source and no mechanically moving parts.

Samsung now mass producing the most advanced 4Gb DDR3 using 20nm process technology

03/11/2014  Samsung Electronics today announced that it is mass producing the most advanced DDR3 memory, based on a new 20nm process technology, for use in a wide range of computing applications.

Leti demonstrates ultra-scaled self-aligned split-gate memory cell with 16nm gate length

03/11/2014  CEA-Leti announced today it has fabricated ultra-scaled split-gate memories with gate length of 16nm, and demonstrated their functionality, showing good writing and erasing performances with memory windows over 6V.

Cadence PVS certified for GlobalFoundries' 65nm to 14nm processes

03/11/2014  Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES certified the Cadence Physical Verification System (PVS) for custom/analog, digital and mixed-signal design physical signoff for 65nm to 14nm FinFET process technologies.

Plug-and-play test strategy for 3D ICs

03/11/2014  Three-dimensional (3D) ICs, chips assembled from multiple vertically stacked die, are coming. They offer better performance, reduced power, and improved yield.

DSA, EUV, nanopatterning are top themes at SPIE Advanced Lithography

03/10/2014  Progress through collaborative efforts in directed self-assembly (DSA), the state of the art in nanoimprint technology, 3D approaches to scaling, and the latest on extreme ultraviolet (EUV) lithography research were hot topics at the recent SPIE Advanced Lithography symposium in San Jose.

Big sell: IP Trends and Strategies

03/10/2014  Experts from Semico Research, Cadence, Uniquify and Sonics challenge growth trends for semiconductor intellectual property (SIP) with FinFETs, the IoT and more.




FINANCIALS



TECHNOLOGY PAPERS



Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014