Palomar Technologies, precision microelectronics and optoelectronic packaging systems provider, will hold meetings at Stategies in Light to discuss its recent upgrades to high-brightness LED (HB-LED) assembly.
The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."
Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.
An LED manufacturing joint venture is the “final due diligence” Viper Networks Inc. will execute with its targeted acquisition: a profitable LED manufacturing company in the US.
Barclays Capital finds that LED manufacturing and materials patents will soon run out, potentially draining value from material/chip/package suppliers and turning LEDs into commodities.
Kopin Corporation achieved record 1290cm2/V.s electron mobility and 240ohms/square sheet resistance results from GaN-based high electron mobility transistor (HEMT) materials.
LED replacement lamps for legacy lighting sources will see 30% unit growth 2012-2016, says Strategies Unlimited. But ASPs will fall 14%/year in that time.
LED revenues are slowing down in 2012, after two years of remarkable growth, according to Strategy Analytics. LED fab equipment spending and epitaxial substrate demand in the LED sector will decline in 2012.
Raja Parvez, president and CEO of Rubicon Technology (RBCN) will speak about the "Move to Larger Diameter Sapphire Substrates" at the Strategies in Light today during the LED Manufacturing track.
Cree Inc. (Nasdaq:CREE) reports doubling the lumens/dollar of light emitting diodes (LEDs) with its new silicon carbide (SiC) LED substrate technology.
The global HB-LED market grew from $11.3 billion in 2010 to $12.5 billion in 2011, surging 9.8%, according to Strategies Unlimited. 10 companies accounted for more than 68% of the global LED supply.
JP Sercel Associates, Inc. (JPSA) expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques.
The 2012 Strategies in Light conference kicked off today at the Santa Clara Convention Center with a series of five workshops, two tutorials and one all-day investor forum.
Chung Hoon Lee, CEO of LED manufacturer Seoul Semiconductor keynoted at Strategies in Light today. Lee’s keynote, "A View from Seoul," marked the first time a Korean LED maker has spoken at the conference. Following are highlights from his talk.
Plessey has acquired CamGaN, a University of Cambridge spin-out with novel GaN technology for HB-LEDs on large-area silicon substrates. Plessey will bring the technology into its 6" wafer processing facility in the U.K.
EVG uncrated the EVG620HBL Gen II fully automated mask alignment system for volume LED manufacturing. The second generation tool offers 55% higher wafer output per square meter of cleanroom space occupied, EVG reports.
Veeco Instruments (Nasdaq:VECO) reported 3 wins for its TurboDisc K465i GaN MOCVD tool : the same systems will be used for high-volume LED fab, GaN-on-Si research, and Si-based LED development.
Eastman Kodak and Heraeus Precious Metals will demonstrate a 3.5" touchscreen panel for cell phone applications using Kodak HCF-225 Film/ESTAR Base as the transparent conductive component at Flexible Electronics & Displays 2012.
The SIA shows 2011 worldwide semiconductor sales hit $299.5 billion, a 0.4% year-on-year increase and new record. Semico Research's forecast for 2012 shows a 10.11% growth in semiconductors revenues over 2011. Barclays Capital and Strategy Analytics also weigh in.
"Opportunities for Power Components in LED Lighting" from IMS Research reveals that rapid uptake of LED lighting, driven by legislation and rising costs of electricity, will result in a potential market of 4 billion power supply units by 2016, worth $10 billion.
Rice University studied the fluorescence of single-walled carbon nanotubes (SWCNT) in new research, finding that the lengths and imperfections of individual nanotubes affect their fluorescence.
SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.
CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.
SiGen developed its second-generation production system for fabricating thin-silicon solar wafers, as well as HB-LED, and 3D semiconductor packaging wafers. The system tailored for silicon, GaAs, germanium, SiC, GaN and sapphire materials.
AIXTRON SE sold 5 multi-wafer MOCVD systems to a new customer, Huaian Aucksun Optoelectronics Technology Ltd., China. The tools will grow materials for HB-LEDs.
AIXTRON's training and demonstration center in Suzhou, China, will focus on improving MOCVD in advanced semiconductor and LED manufacturing operations around China, as well as on employee and environmental safety in electronics production environments.
SAFC Hitech opened a multi-million dollar 270000sq.ft. expansion at its facility in Kaohsiung, Taiwan, increasing capacity for high-quality LED precursor production.
MATHESON debuted the Lasso System, a customer-centric supply chain and inventory management system that can monitor the location and operating status of gas products and other assets in the REAL-Time Gas and Asset Management System.
Twin Creeks Technologies, semiconductor and solar cell manufacturing equipment supplier, debuted its first commercial silicon wafer production system that reduces solar module and semiconductor device wafers by up to 90%.
Intematix, phosphor and phosphor component maker for high-quality LEDs, received $16.2 million in funding from Draper Fisher Jurvetson and Crosslink Capital, as well as a new financial investor.
Edwards Limited uncrated the STP-iXR1606 series magnetically-levitated turbo-molecular pumps (TMP) with fully integrated onboard controllers. Its new rotary design improves throughput by about 40% at high gas flow rates; nearly 90% percent in maximum gas flow.
Power electronics will grow to $15 billion in sales of discrete components in 2020, says Lux Research. New materials -- SiC and GaN -- are taking a 22% market share for $3.3B in sales. Expect this year to set a record for funding to power electronics companies.
Seoul Semiconductor Co. Ltd. has applied, registered, and secured more than 10,000 patents for light emitting diodes (LEDs) globally. The company invests 10-20% of its annual revenue in R&D.
USCi will develop next-generation silicon carbide (SiC) devices with AIXTRON SE's VP2400 hot-wall CVD tool. USCi plans to install the CVD system in Q3 2012.
Hine Automation shipped its Star SL-300 single-substrate vacuum transfer system to Annealsys, which will integrate the wafer transfer system onto its MC-200 MOCVD tool for R&D and pilot environments.
SEMI presented its annual SEMI Award for North America to QD Vision. QD Vision team members made significant progress on the integration and manufacturing processes essential to the commercialization of quantum dot (QD) technology.
36% of semiconductor fabs are in high-risk zones, finds Semico, noting the industry disruptions caused by the Japan earthquake and tsunami and Thai flooding and the challenges these presented to chip makers in the regions.
The gallium nitride (GaN) LED market declined in 2011, but 2012 marks the beginning of a growth curve, with double-digit growth in 2013 and 2014, says IMS Research. Lighting revenues will overtake TV revenues for GaN LEDs a year earlier than expected.
Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.
GT Crystal Systems will supply 500,000 TIE 6" C-plane sapphire cores to Silian, which produces high-quality sapphire substrates for HB-LED manufacturing.
Jefferies' and Barclays' analysts attended the Strategy in Light conference in Long Beach, CA, and report on a challenging LED market with near-term positive boosts.
Day 3 of the 2012 Strategies in Light conference continued the LED Manufacturing session. Presenters covered LED manufacture, advanced packaging, metrology and testing, high-performance materials, and other topics, such as dimming. Blogger Michael A. Fury, Techcet Group, reports.
The manufacturing conference at Strategies in Light focused on methods for reducing cost through the manufacturing supply chain. Presenters discussed various methods of reducing manufacturing costs, from improved automation and standards implementation, automation to new packaging technologies. Laura Peters, LEDs Magazine, reports.
Rubicon Technology, Inc. (RBCN) entered into a new contract with its largest customer for large-diameter sapphire wafers. Shipments will total at minimum $20 million.
Minsheng Financial Leasing (MSFL), China's main non-banking financial institution, formed a strategic alliance with AIXTRON, making fab tool leasing options available to AIXTRON's customers in China.
Blogger Michael A. Fury, Techcet Group, reports from Day 2 of Strategies in Light: immersing himself in the LEDs manufacturing track of the conference.
Taiwan's LED chip and package manufacturers failed to reproduce the booming revenue growth of H1 2011 in H2, according to LEDinside. Given inventory pressure, many LED makers are actively seeking joint ventures and improving product quality to create greater product differentiation.
For the first time, Apple Inc. has publicly published a list of over 150 companies that the electronics giant says represent 97% of its procurement expenditures for materials, manufacturing, and assembly of products worldwide.
OSRAM Opto Semiconductors manufactured high-performance LED prototypes, growing the light-emitting gallium-nitride (GaN) layers on 150mm silicon (Si) wafers rather than sapphire substrates.
Worldwide LED manufacturing capacity will reach 2M wafers in 2012, up 27%. More wafers do not neccessarily mean more LED fab equipment, however. Global LED manufacturing equipment spending will fall 18%, shows SEMI.
Philips Lumileds appointed Pierre Yves Lesaicherre as CEO, succeeding the company's first CEO Michael C. Holt. Lesaicherre spent 2 decades in the semiconductor and components industry.
EV Group signed a joint-development and licensing agreement with Eulitha AG, integrating Eulitha's PHABLE mask-based UV photolithography technology with EVG's automated mask aligner platform.
Materion Microelectronics & Services added 50% more space in its PVD parts cleaning and surface treatment facility, with an automated robotic twin wire arc spray, increased precious metal refining capacity, new cleaning processes, and a Class 10,000-certified cleanroom.
Barclays Capital forecasts 2012 as a "subdued year" for the light-emitting diode (LED) industry, but there will be opportunities for MOCVD sales in the LED and power semiconductor sectors, as well as MOCVD upgrades.
Nocilis Materials opened its silicon foundry service globally. Nocilis Materials AB provides epitaxy service of advanced Si-Ge-Sn-C alloys for electronic and photonic applications.
AIXTRON SE (NASDAQ:AIXG) delivered multiple AIX G5 HT MOCVD reactors to existing customer Nantong Tongfang in China, fueling the company's HB-LED production expansion.
Soitec (Euronext Paris) completed its acquisition of all of the outstanding shares of Altatech Semiconductor S.A. The final purchase price was EUR15 million.
Requirements for LED processing equipment are changing from cost driven to more technology driven decisions, a clear trend to more complex and more efficient manufacturing, according to Thomas Uhrmann and Thorsten Matthias of EV Group.
Umicore will consolidate production of its germanium-based optics products in the US, citing a majority market in the country. Umicore will phase out optics production in Olen, Belgium.
Soitec (Euronext) and Sumitomo Electric Industries Ltd. demonstrated 4" and 6" engineered gallium nitride (GaN) substrates, and launched pilot production lines to enable wider market adoption.
Luminus Devices Inc. unveiled its round LED architecture, meeting the circular aperture designs of many optical devices.
Everlight Electronics Co. Ltd. filed a patent infringement lawsuit against Nichia Corp., seeking enforcement of a patent covering LED metallization technology, and asked that 2 Nichia patents on LED phosphor technology be rendered invalid.
The corresponding combined revenue opportunity for MBE and MOCVD is estimated to be around US $6.1 billion for the 2012-2020 periods, shows Yole Développement.
Boosted by LEDs, semiconducting (SC) GaAs substrates will lead growth of the GaAs market. In 2011, semi-inductive (SI) GaAs substrates held ~56% (M$) of the overall GaAs substrate market (SC GaAs held ~44%), a trend that is likely to reverse in the short term.
EPIC, the European Photonics Industry Consortium, announced at its annual general meeting that Carlos Lee has been appointed as director general, succeeding Thomas Pearsall, who has led the association since its founding in 2003.
Veeco Instruments Inc. recently participated in an investment signing ceremony at the 2012 Korea Investment Forum in New York City to commemorate the Company’s substantial investment in a new R&D facility in Seoul, Korea to advance high brightness light emitting diode (LED) technology.
Positives for LED makers -- improved utilization rates in Taiwan, growing LED lighting demand -- will not immediately equal more orders for MOCVD tool suppliers, reports Barclays Capital. The analysts expect 525 MOCVD tool orders in 2012, most in the second half of the year.
Veeco Instruments Inc. debuted the SPECTOR-HT ion beam deposition tool for thin-film deposition in optical products, such as lasers, telecommunications chips, and more.
LED-IT Fusion Technology Research Center of Korea tapped Veeco for a TurboDisc K465i GaN MOCVD system for research and development of LEDs, including green LEDs and UV versions.
Cree Inc. (Nasdaq:CREE) achieved 254 lumen/watt on a white-light, power LED in research. The correlated color temperature is 4408 K.
Verticle began mass production of its hexagonal-shaped LED chip Honeycomb, developed with a proprietary copper substrate and chemical chip separation technology.
Samsung Electronics' Board of Directors approved a merger with Samsung LED, Ltd. The BOD also decided to request Samsung Mobile Display to pay infrastructure construction costs.
Strategies in Light Europe, September in Munich, is accepting presentation abstracts through February 29. Submit a paper on LED technology, LED manufacturing and the supply chain, markets, LED applications, or a related topic.
LED supply exceeded demand by 30% in 2011, thanks to poor LED TV sales and slow growth in lighting. Look for the industry to start close this gap in 2012, shows NPD DisplaySearch.
Iljin Materials Co. Ltd., a developer and producer of elecfoils for use in the electronic components, has signed a statutory merger agreement with LED manufacturer ILJIN Semiconductor Co. Ltd.
In light of “challenging industry conditions” in the LED and PV manufacturing sectors, Applied Materials (AMAT) decided to restructure its Energy and Environmental Solutions (EES) segment.
SunSun Lighting, a provider of high-performance, energy-efficient and low-cost LED lighting technologies, received $30 million in Series B financing from GSR Ventures and Oak Investment Partners and additional commitments from its original angel investors. Allan Kwan, a China-based advisor for Oak, is joining the board of SunSun.
SEMI’s Paula Doe covers the “commodity market” of LEDs, including capacity utilization at LED fabs, automation in manufacturing that could improve yields, LEDs fabbed on silicon and GaN instead of sapphire wafers, and more.
University of Warsaw, Poland, researchers will grow GaN materials on a new AIXTRON SE Close Coupled Showerhead MOCVD reactor in a 3 x 2” wafer configuration.
AIXTRON SE’s long-time customer Formosa Epitaxy Inc. (FOREPI) ordered several MOCVD systems: 4 CRIUS II-XL systems in a 19 x 4” wafer configuration and 2 G5 HT reactors in a 14 x 4” wafer configuration.
Sapphire wafers grown using ARC Energy’s Controlled Heat Extraction System furnaces for Trinity Material was certified for high-quality LED chip production at two leading LED chip companies.
China has designated LEDs as one of the 7th emerging industries to be fostered in the Twelfth Five-year Plan. China is accelerating standardization plans, encouraging local production, and subsidizing purchases of LED lighting, Displaybank reports.
Barclays Capital’s Asia IT analyst Jones Ku shares details of China's State Council’s subsidy program for household electrical appliances. The program sets aside RMB2.2 billion to promote consumption of LEDs and “other energy-saving light bulbs.”
After a surge in 2010 and oversupply in 2011 that suppressed 2012 fab, LED makers will see a leveling out of supply and demand into better equilibrium, according to NPD DisplaySearch. Demand will shift from LCD-backlit LEDs to LEDs for lighting.
LEDs are typically manufactured on sapphire substrates, about 90% of the blue LEDs currently in production. SiC substrates are used for virtually all the remaining 10% of blue LEDs. To improve efficiency and brightness, as well as cost, LED makers are looking to other substrates, such as Si and ZnO.
Barclays Capital analysts attended Lightfair International and gleaned several trends in LEDs and OLEDs for lighting, including an interesting phenomenon around MOCVD utilization rates and new orders.
A team of scientists at Los Alamos National Laboratory has developed a process for creating glass-based, inorganic LEDs that produce light in the UV range.
SEMICON China takes place March 20-22 in Shanghai. Check out the special pavillions and events, and keynote speakers scheduled.
coolingZONE LED, May 29-31 in Berlin, is soliciting technical presentations on LED energy consumption, LED packaging, heat and air-flow simulations of LED products, and related topics.
MIT researchers used gases to precisely control nanowires' width and composition as they grow, which could yield complex structures optimally designed for particular applications, like LED substrates or solar panels.
The National Physical Laboratory in the UK is leading a new EMRP project on thin film manufacturing metrology for industries such as opto electronics, plastic and printed electronics, displays and lighting, memories and solar cells.
Epistar installed its first AIXTRON SE CRIUS II-XL system in a 19 x 4" wafer configuration to mass produce ultra-high-brightness (UHB) blue and white LEDs.
The formal announcement of China's light emitting diode (LED) subsidy program, likely in the first half of March, may drive tool utilization expansions for LED chip makers, reports Barclays Capital.
Cleantech Solutions International has delivered two units of sample sapphire chambers and one unit of a solar furnace to an international customer.
“LED is now the dominant force in lighting for the foreseeable future,” reports Ted Konnerth of Egret Consulting Group, after LightFair 2012. What does that mean for traditional lighting products, applications, distribution channels, and talent?
EpiGaN NV opened its GaN epitaxial material production site, on the Research Campus Hasselt in Belgium. EpiGaN’s GaN-on-Si material is used in next-generation power electronics.
Quantum dots will grow to a $7480.25 million market by 2022, at a ten-year CAGR of 55.2%, according to Electronics.ca Publications.
LED manufacturers must choose the appropriate materials and processes to fight low yields, writes Thomas Uhrmann of EV Group (EVG).
342 MOCVD tools for LED manufacture will ship in 2012, compared to 654 last year, IMS Research reports in its most recent GaN LED Quarterly Supply and Demand report. Without China, the market would be nearly still.
SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.
Linde LienHwa (LLH) China will be the exclusive gas supplier to Kaistar, delivering bulk gases and high-purity ammonia (NH3) to Kaistar’s new LED production facility in Xiamen, China.
Showa Denko KK will transfer 70% of its gallium-nitride (GaN)-based blue light emitting diode (LED) chip business into a new company, TS Opto Co. Ltd, with Toyoda Gosei Co. Ltd.
SEMI presented US Congressman Dave Camp (R-MI) with its 2012 North American Government Leadership Award for his leadership and support of the US microelectronics and photovoltaic manufacturing value chain.
Lumichip Limited, an LED manufacturer, expanded its commercial operations in Finland and opened a new development center in Espoo, Finland.
MEI uses Vycom Flametec PVC-C for chemical rinse tanks and other wafer-contacting elements of its process tools, reducing tool-based contamination and protecting fab workers. Bill McGinty, MEI operations manager, discusses the benefits the new-generation plastic for semiconductor fab tools.
OEM Group began shipping a multi-tool order to a major LED manufacturer, including Spray Ozone Tool and Spray Acid Tool semi-automated batch surface preparation systems.
Media tablets, experiencing "remarkably rapid ascension," will become the 4th largest application for semiconductors by 2014, up from 35th in 2010, according to IHS.
AIXTRON received a new MOCVD systems order from existing customer Quantum Wafer Inc., China. The 3 additional MOCVD units will process HB-LED wafers based on GaN materials.
Meaglow Ltd., MOCVD and epitaxy supplier, launched a range of nitrogen-rich indium nitride (InN) wafers for research and industry development around the compound semiconductor material.
The gallium nitride (GaN) power elec market is currently small, but new entrants are ramping to production, silicon-based electronics suppliers developing GaN, and LED makers diversifying capacity to make power semis.
Owens Design Inc. released multiple customized film frame automated handlers to customers in the semiconductor and LED manufacturing tool industries.
The market volume for HB-LEDs reached $12 billion in 2011, a 4.3% growth over 2010, reports EPIC, The European Photonics Industry Consortium.
Fujitsu Semiconductor says it has built a server power-supply unit with 2.5kW of output power using gallium nitride (GaN)-based power devices, and will ramp volume production of the power devices in late 2013.
There's a new battleground slowly emerging for OLEDs in lighting applications where the technology could offer some advantages in design and efficiency -- if panel makers are willing to make some sacrifices.
FlexTech Alliance announced the completion of a development project with Etched in Time, Inc. (EITI), for a plasma etch system that is compatible with a wide array of roll-to-roll equipment.
Taiwan makers of light-emitting diode (LED) products are unlikely to support a recovery in 2013 LED equipment spending due to an alarming cash crunch individually and sector-wide, warns one industry analyst.
In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.
Wide bandgap semiconductor materials can significantly outperform traditional silicon-based devices in power electronics and light-emitting diodes (LEDs), but they're vastly more expensive. So where's the midpoint where GaN's capabilities and extra costs align to make it the preferred technology for each application?
EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.
Technology improvements and supportive legislation are gathering momentum to help push LED adoption for residential buildings -- the largest lighting application sector.
Growth in the industrial electronics semiconductor market is set to fall short of previous expectations in 2012 as the business is buffeted by weakening global economic conditions, with the LED market the sole bright spot, says IHS iSuppli.
The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.
Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.
Canon U.S.A., Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors.
Zeta Instruments will install multiple optical profilers for micron-scale surface analysis at sapphire substrate maker Rubicon Technology, for metrology and inspection on sapphire substrates and wafer production aimed at the HB-LED market.
Siemens will publicly list OSRAM via a spinoff to Siemens shareholders, rather than an IPO. Spinning off OSRAM will make the public listing more independent of capital market conditions.
Toshiba will start mass production of white LEDs on a new 200mm wafer production line in its Kaga Toshiba Electronics Corporation fab in northern Japan.
Plessey Semiconductors is installing a multi-million pound HB-LED production line at its Plymouth, UK facility, including a new AIXTRON reactor.
SEMICON West 2012 will take place July 10-12 at the Moscone Center in San Francisco, CA. Following is a preview of the LED and OLED events taking place during SEMICON West, from contributor Paula Doe, SEMI Emerging Markets.
Edwards (NASDAQ:EVAC) introduced the new iXH645H dry pump, optimized for metal-organic chemical vapor deposition, a key step in LED and compound semiconductor manufacturing.
JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.
LED makers Cree Inc. (NASDAQ:CREE) and SemiLEDs Corporation (NASDAQ:LEDS) have agreed to end their respective patent infringement litigation against each other.
Silicon carbide (SiC) semiconductors will see 38% CAGR through 2022 thanks to power and efficiency advantages over silicon devices, according to MarketResearch.com.
Cambridge NanoTech entered a licensing agreement with Ghent University in Belgium to commercialize an ALD particle coating technology that uses thermal and plasma processes.
LED prices are declining, as revenues are growing through 2016, according to a report from Strategies Unlimited. Trends include multi-chip packaging and different LED power levels for different applications.
The price of a LED bulb will fall by about half by 2020, hitting $11.06, according to Lux Research. With the LED chip package seeing 70%+ cost reduction, technology innovation will shift to the surrounding elements: thermal management, drivers and optics.
Terry Brewer, one of the newest members of SEMI's North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution.
SEMICON West confirmed for Barclays that Q2 2012 orders for MOCVD tools remained flattish with the trough-like Q1 numbers, and LED makers are expected to order more tools in H2 2012.
LED specialist Marl will install the DEK Horizon 03iX print platform to adapt to new circuit board size requirements, and will use the VectorGuard stencil system and Nano-ProTek.
A*STAR Institute of Microelectronics and NXP Semiconductors (NASDAQ:NXPI) will collaborate on 200mm GaN-on-Si process and technology development for high-voltage power devices.
Kyma Technologies demonstrated a 10" AlN on sapphire template, manufactured on its plasma vapor deposition on nanocolumns technology. The 10” sapphire substrate was provided by Monocrystal.
Intel's Jackie Sturm will bring to light some of the emerging, growth markets for semiconductors, and what they mean for chipmakers and the fab suppliers in the first session of The ConFab, “The Economic Outlook for the Semiconductor Industry.”
Citi analysts surveyed the LED manufacturing market and LED demand at SEMICON West in San Francisco, CA, including a slight uptick in MOCVD orders, and some backlash against Cree's downstream ambitions.
Soitec partnered with Silian to jointly develop GaN template wafers using hydride vapor phase epitaxy (HVPE). The resulting GaN template wafers will reduce the cost of manufacturing LEDs.
We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.
Sapphire grown in ARC Energy’s proprietary CHES yields 5% brighter LEDs than the industry standard, according to the company’s study.
Lattice Power Corporation started volume production of its new-generation gallium nitride (GaN) high-power LEDs on silicon substrates.
High Tech Lights is participating in a “Reshoring Initiative” by bringing job positions from China to the US for LED and laser diode scientists, manufacturing and assembly workers, and R&D staff.
A balance of LED demand and supply in 2012 is based on the downward-stabilized price of sapphire wafers. More ingot suppliers are coming online, with new entrants in Korea and China, providing a broader supplier base for LED makers, shows Displaybank.
Veeco Instruments added 3 new models of its TurboDisc MOCVD systems for HB-LED production: TurboDisc MaxBright M and MHP, and TurboDisc K465i HP.
AIXTRON SE introduced a 5 x 200mm gallium nitride on silicon (GaN-on-Si) reactor design for its G5 Planetary Reactor MOCVD platform. AIX G5+ comprises special reactor hardware and process design, developed with customers in AIXTRON’s R&D lab.
SiC is a niche material for semiconductor, power electronics, and LED manufacturing. Yole analyzed patents related to SiC growth and wafer manufacturing to glean trends in production, R&D, top companies, barriers to entry, and more.
Strategies in Light 2013 will take place February 12-14 in Santa Clara, CA, hosted by PennWell Co.’s Strategies Unlimited and LEDs Magazine. The event’s theme is “Exploring the Growth Opportunities in the LED and Lighting Markets.”
Maxim Group analyzed MOCVD utilization and revenues at LED makers in Taiwan, finding that MOCVD orders are placed just to maintain capacity, not add, and high utilization rates are only at the top LED makers.
Veeco hosted more than 150 LED manufacturers and customers of its MOCVD products recently during its MOCVD User Meeting in Taiwan. The talks largely focused on reducing LED cost through manufacturing, as well as using silicon as an LED substrate.
To support the next cycle of LED manufacturing, tools such as MOCVD, plasma etch, lithography, and others must undergo cost efficiency and yield improvements, says Yole Développement. Trends include migrating to larger wafers, silicon substrates, and tools developed specifically for LED fab, rather than retooled from semiconductor manufacturing specs.
PLANSEE has developed a pressed-sintered tungsten crucible with an ultra-smooth surface to avoid sapphire ingot or crucible damage in the Kyropoulos method.
Guangzhou (China) Lightfair Conference is the biggest lighting fair in Asia. Citi analyst Timothy Arcuri notes trends in LED manufacturing and pricing ahead of China’s subsidy program going into effect.
DAS Environmental Expert says it has a new system that offers a more environmentally friendly way to clean waste process gases produced in LED manufacturing.
Researchers at the Norwegian University of Science and Technology in Trondheim (NTNU) have patented and are commercializing GaAs nanowires grown on graphene.
Stakeholders in LED manufacturing have met with US Department of Energy officials to plead their case for increased support in solid-state lighting (SSL) R&D and manufacturing, asserting that the technology's energy conservation benefits and ROI surpasses those of renewable energy technologies that get much more backing.
GaAs epitaxial substrate production rose just 3% in 2011 as handset power amplifiers offset a shift away from GaAs for handset switches, but inside that slowing slope are two key market drivers, according to Strategy Analytics.
Three leaders in their respective fields have formed a technology alliance to bring a new glass cutting technology to market. InnoLas Systems GmbH licensed process technology developed by FiLaser LLC and will use ultra-short pulse lasers produced exclusively for InnoLas by LUMERA LASER GmbH.
In 2011, LEDs were expected to grab market share from CCFLs in the display backlighting segment. However, prices for CCFL-backlight TVs fell alongside prices for LED-backlit TVs. Now, CCFL raw materials costs have exploded, setting the stage for market share grabs by LEDs, albeit later than expected, reports Jimmy Kim, DisplaySearch.
Albemarle will expand its facility in Yeosu, Korea, with additional manufacturing capacity for PureGrowth products for MOCVD processes.
Cree saw 8% quarter-to-quarter growth in FY2012 Q4, but only 2% growth in its LED component business. Reasons could include customer pushback from Cree's move into their space, lower average selling prices for LED chips, and more efficient LED modules that use fewer chips.
The LED industry is entering its third growth cycle, general lighting, according to Yole and EPIC’s report, “Status of the LED Industry.” However, the cost of a packaged LED still needs to be reduced by a factor x10 to enable massive adoption. New business models are mandatory to capture added value of LED lighting.
Researchers at the National Institute of Advanced Industrial Science say they have devised a way to selectively and nondestructively evaluate molecules within a sealed organic light-emitting diode (OLED) in operation, in hopes to further understand and eventually minimize performance degradation.
Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.
Soitec and Shin-Etsu Handotai (SEH) have extended their cooperation in Soitec's Smart Cut technology with an extended 10-year licensing agreement, including a new level of joint technology cooperation, to facilitate development and wafer supply of silicon-on-insulator (SOI) wafers.
Azzurro and Epistar say they have achieved GaN-on-Si based high-brightness LEDs on 150mm GaN-on-Si substrates, billed as "one step further towards implementation in mass production."
Solvay Specialty Polymers USA LLC has extended its line of high-performance polyester compounds with a new version targeting light-emitting diode (LED) TVs with higher heat and light stability.
H2 2011 saw slow growth for gallium arsenide (GaAs) substrates in semiconductor and related devices, as well as a shift away from GaAs as a handset switch technology. However, the March 2011 earthquake and tsunami in Japan disrupted the supply chain, driving up substrate pricing and overall revenue to nearly $230 million.
JP Sercel Associates' new IX-6100-MD can scribe and dice a variety of metal layers and alloys used in LED manufacturing.
Learn about the changes in semiconductor manufacturing as well as related markets -- photovoltaics, displays, LEDs, etc -- at the 2012 Strategic Materials Conference (SMC), to be held on October 23-24 in San Jose, CA. SEMI reports.
OSRAM AG and Samsung Electronics Co., Ltd. have reached an agreement to settle all patent suits between them worldwide. The parties have reached license agreements for their respective LED patent portfolios.
Jilin University China has installed an AIXTRON CCS MOCVD 3 x 2” wafer configuration system for GaN UV and white LED research.
Cree announced the availability of high quality, low micropipe 150mm 4H n-type silicon carbide (SiC) epitaxial wafers. 150mm epitaxial wafers with highly uniform epitaxial layers as thick as 100µm are available for immediate purchase
MIT researchers are building various electronic components out of a 2D form of molybdenum disulfide (MoS2). This is the start of a “new realm” of research into 2D materials for electronic materials and devices, according to one researcher.
Optoelectronics researchers at the Ferdinand-Braun-Institut ordered an Optofab3000 for Laser Bar Facet Coating from Oxford Instruments Plasma Technology.
Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.
LED maker Epistar will completely take over its subsidiary Huga Optotech, which produces LED wafers and chips, through a share swap.
ON Semiconductor has joined imec to collaborate on the development of next-generation GaN-on-Si power devices. ON Semiconductor is presently building a GaN processing line in its Oudenaarde facility in Belgium Oudenaarde, and it is expected to employ GaN-on-Si technology.
Responding to consumer demand, TV suppliers are expanding their lineups of low-brightness LED backlight TVs with technology options that actually compete against each other more than traditional CCFL, according to DisplaySearch.
Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy, the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.
Driven by market demand, the semiconductor industry is progressing toward consensus on building-block standards for automating LED production on 6-in wafers, explains Paula Doe in an article for SST sister magazine LEDs Magazine.
Sumitomo Chemical has joined the Holst Center's shared research program on printed organic lighting and signage, to contribute to research into multilayer solution processes for high-efficiency organic light-emitting diodes (OLEDs).
Road and street lighting is a key driver for LED technology in general lighting.
Fab equipment spending will grow two percent year-over-year (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.
GT Advanced Technologies today announced that it has acquired substantially all of the business of Thermal Technology LLC for purchase consideration.
Management expects demand for MOCVD production equipment to potentially improve as demand for LEDs increases later in the current year.
The LED industry gained a foothold for growth in the parts and materials industry after LED technology was applied to the TV backlight unit (BLU).
Aledia today announced that solid-state lighting (SSL) industry veteran Dr. Bernhard Stapp has joined its board of directors.
Engineered Material Systems debuted its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.
Hitachi Cable, Ltd. announced today that it has developed a new mass-production technology for GaN-templates, in which a high-quality gallium nitride (GaN) single-crystal thin film is grown on a sapphire substrate.
Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.
The multibillion-dollar secondary or used semiconductor equipment market has gone through significant changes over the past five years and has become increasingly sophisticated in its approach.
The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.
CoorsTek, one of the largest technical ceramics manufacturers, today announced introduction of aluminum nitride substrates.
Strategies Unlimited has issued new figures since the first edition of this article. Solid State Technology now brings you updated figures and additional information on the worldwide LED market.
InfiniLED’s latest MicroLEDs, or µLEDs, have produced record optical beam intensity
Mitsubishi Electric Corporation announced this week that is has developed a prototype to improve productivity of SiC slice processing for semiconductor wafers.
To help the Taiwan LED industry tackle the increasing challenges, an in-depth analysis of LED global market opportunities and technology breakthroughs were recently provided at the 2013 LED Market and Outlook seminar held by SEMI Taiwan.
A new report from IHS Displaybank examined a total of 483 patents on roll-to-roll processing technologies, focusing on 32 that were flexible, OLED-related.
Soraa announced yesterday the next generation of its high external quantum efficiency GaN on GaN LEDs.
SEMI's HB-LED Standards Committee has approved its first standard, specifying sapphire wafers used in making high-brightness light-emitting diode (HB-LED) devices.
Is it time for high-brightness LED manufacturing to get serious about process control? If so, what lessons can be learned from traditional, silicon-based integrated circuit manufacturing?
Professor Yue Kuo at Texas A&M University has fabricated a new type of LED, based on light emission from an ultra-thin amorphous dielectric layer.
Spending on LED fab manufacturing equipment will decline 9.2% in 2013 as the industry faces weak long-term demand and consolidates manufacturing capacity.
CRS Electronics Inc., a developer and manufacturer of LED lighting, today announced the appointment of Mr. Travis Jones to the position of Chief Executive Officer. Mr. Scott Riesebosch, founder and former CEO will assume the role of Chief Technology Officer.
AIXTRON SE today announced that, in the third quarter of 2012, long-term customer Formosa Epitaxy Inc. (FOREPI), Taiwan, placed a new order for multiple CRIUS II-L MOCVD production systems in a 69x2-inch configuration. All systems will be used for the manufacturing of ultra-high brightness (UHB) GaN-based blue and white LEDs.
As power electronics grow to $15 billion and LEDs to $100 billion, Lux Research identifies the leading technology companies addressing these markets.
HVPE system expected to lower the cost of LED production and accelerate adoption in commercial and residential lighting.
Silicon nanocrystals have a size of a few nanometers and possess a high luminous potential. Scientists of Karlsruhe Institute of Technology (KIT) and the University of Toronto/Canada have now succeeded in manufacturing silicon-based light-emitting diodes (SiLEDs). They are free of heavy metals and can emit light in various colors.
Recently, as the importance of environmental protection grows, the method of saving energy of products and using eco-friendly materials is on the rise. Of these, since lighting accounts for about 20% of the overall power consumption, the efforts to replace with high-efficiency and eco-friendly products are being made actively.
LED driver matches flash LED input current with safe output capability of battery – in real time.
Cree, Inc. announces the release of its second generation SiC MOSFET, enabling systems to have higher efficiency and smaller size at cost parity with silicon-based solutions. These new 1200V MOSFETs deliver power density and switching efficiency at half the cost per amp of Cree’s previous generation MOSFETs.
Dramatically falling costs and improvements in efficiency are driving increased sales of light emitting diode (LED) lamps for street lighting. Costs have fallen as much as 50% over the past two years and are expected to continue falling. By 2015, LEDs will become the second-leading type of lamp for street lights in terms of sales, behind only high pressure sodium lamps, according to a new report from Pike Research, a part of Navigant’s Energy Practice. By 2020, the study concludes, LED lamps for street lights will generate more than $2 billion in annual revenue.
The way the world is lit up could be revolutionized by a new European-wide research project being led by the University of Dundee.
Higher performance UVC LEDs help to realize ever more increasing range of customer applications including scientific instrumentation and water disinfection.
Yole Développement announced today its new report “UV LEDs: Technology & Application Trends” which presents UV LED new applications and associated market metrics for the period 2012-2020, and a deep analysis of UV LED technology and UV LED lighting industry.
Rensselaer Polytechnic Institute student Ming Ma has developed a new method to manufacture light-emitting diodes (LEDs) that are brighter, more energy efficient and have superior technical properties than those on the market today.
LED makers climb in the overall list of top suppliers of optoelectronics, sensors/actuators, and discretes, says 2013 O-S-D Report.
Plessey today announced that samples of its Gallium Nitride (GaN) on silicon LED products are today available. These entry level products are the first LEDs manufactured on 6-inch GaN on silicon substrates to be commercially available anywhere in the world.
A new £1million (or US$1,530,700) growth facility will allow University of Cambridge researchers to further reduce the cost and improve the efficiency of LEDs, with potentially huge cost-saving implications.
Samsung Electronics Co Ltd of Seoul, South Korea has introduced a new lineup of Zhaga-compliant LED H-Series linear modules with high efficacy and light quality, as well as color consistency for use in a wide range of LED lighting applications including ambient lighting and linear fixtures.
Oxford Instruments Plasma Technology has just announced an evolution in batch etch technology with the launch of the PlasmaPro 1000 Astrea etch system, a large batch etch solution for PSS, GaN and AlGaInP that will offer HBLED production manufacturers high throughput.
The global LED lighting market will be worth $25.4 billion in 2013, representing 54% growth on the 2012 figure of $16.5, while the LED lighting penetration rate will also rise to 18.6%, according to a new DIGITIMES Research Special Report titled "Global high-brightness LED market forecast."
Aledia, a developer of LEDs-based on disruptive microwire GaN-on-Silicon technology, announced today that it has made its first LEDs on 8-inch (200mm) silicon wafers.
The Extreme Ultraviolet Lithography System Development Association (EUVA) says it has surpassed 100W output at intermediate focus for an EUV light source, another big step to address a big hurdle facing EUV lithography as a production-viable candidate for next-generation semiconductor manufacturing.
LEDs, SiGe semiconductors, and WLP bumps each present their own challenges to metrology systems, says Alon Kapel, Jordan Valley Semiconductor.
Sapphire Materials Company (SMC), a subsidiary of Silicon Chemical Corporation (SCC), completed Phase I of its sapphire manufacturing business. Initial shipments of sapphire product will begin this November.
SEMICON West preview: With device efficacy approaching limits and end-costs still too high for mass-market adoption, LED manufacturers are looking to trim costs by improving key manufacturing steps: measuring process conditions, preparing and handling substrates, and wafer-level testing.
As LED adoption continues to grow, LED driver ICs face pressure from increased IC integration, driver-less AC-LEDs and other technologies, and falling prices. However, the driver IC unit can bring performance and power enhancements that consumers want for LED lighting adoption.
ATMI's SVP/CTO, Larry Dubois shares the 3 guidelines ATMI keeps in mind when designing eco materials for semiconductor wafer fab, and gives an update on the materials supplier's LED fab products.
Strategies in Light 2012 will take place in February in Santa Clara, CA. The Strategies in Light Advisory Board seeks abstracts for the conference, which is themed "The Booming LED Market."
The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.
Maxim Group, in its equity research on LED sector companies, finds that competition and demand strategies will push LED prices lower in the near future, and the capital expenditures surge of 2010-2011 is giving way to a tool spending downturn.
Cree Inc. (Nasdaq:CREE) granted 5 LED lighting manufacturers licenses to select Cree patents through its remote phosphor licensing program. Cree's licensing program facilitates the development of LED lights combining remote phosphor optical elements with blue LEDs.
Strategies in Light Europe 2012, September 18-20 in Munich, Germany, is accepting abstracts through February 17. Strategies in Light Europe covers the rapidly growing LED lighting industry.
MicroTech has developed a wet process station to etch patterned sapphire substrate (PSS) wafers in a way that increases LEDs' light output and efficiency while increasing manufacturing throughput.
Altatech Semiconductor S.A. launched its first LED inspection system, the non-contact AltaSight LEDMax, for detecting, classifying and characterizing defects on wafers used in manufacturing LEDs.
SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.
Researchers at the Samsung Advanced Institute of Technology and Seoul National University have demonstrated the first LEDs to be fabricated on amorphous glass substrates.
Applied Materials said it will acquire Varian Semi in a $4.9B deal. VSEA stockholders have now approved the buy.
Michael A. Fury looks at papers from the opening day of this year's MRS Spring meeting, including various takes on light-emitting devices, nanotubes for optoelectronic devices, and switching behavior of ultrathin films.
BluGlass (ASX:BLG) has commissioned the foundry services of Rainbow Optoelectronics Materials Shanghai to provide device fabrication and processing services for the purposes of creating a nitride solar cell prototype designed by BluGlass.
Speaking at SEMI’s Industry Strategy Symposium, Christian Dieseldorff, SEMI senior analyst, provided an in-depth look at fab construction, capacity, and capex in 2011 and 2012. In this podcast, Dieseldorff walks listeners through fab construction projects by region and device type (LED, non-memory, memory, etc.)
Veeco Instruments' new TurboDisc MaxBright GaN MOCVD multi-reactor system is poised to take advantage of what the company believes is an accelerated rate of LED TV penetration. The new system targets manufacturing of HB-LEDs and is capable of single- or multi-chamber layer growth.
The Optogan Group placed a multi-system order for Oxford Instruments' etch and deposition systems. These include PlasmaPro System133 ICP and PlasmaPro 800Plus RIE etch systems, and a PlasmaPro 800Plus deposition system.
Applied Materials Inc. (Nasdaq:AMAT) presented five companies with awards for helping Applied meet its strategic business goals in 2011.
Philips Lumileds, solid state lighting (LED) maker, deployed Camstar Systems Inc.'s Manufacturing Execution System (MES) at all global sites in less than 12 months.
Scanning the latest reports from a quartet of Wall Street analysts, a number of key themes emerge explaining what's driving a MOCVD slump in 2011-2012 (and maybe beyond), and how and when the situation might improve.
China lays out its five-year plan to phase out old bulbs and spur LED demand; and Taiwan leaders invoke painful memories of DRAM and LCD market squeezes to urge more support for their own LED industry.
AIXTRON SE received an order from Jiangsu CANYANG Optoelectronics LTD. for four CRIUS II metal-organic chemical vapor deposition systems in a 55 x 2" configuration. All systems will be dedicated to the growth of high brightness blue LEDs.
Rubicon Technology (RBCN) completed company-wide enhancements to its proprietary crystal growth furnaces, upgrading to Rubicon Furnace Version ES2-XLG3.0, which produces large-diameter sapphire material with greater automation and higher yields.
A rising LED surplus, slowed LED adoption, tighter credit in China, and other factors are converging to stall out MOCVD equipment installs in 2011. Once the LED oversupply is drained off, LED manufacturers will kickstart capacity expansions, likely in 2012, according to IMS Research.
Translucent launched its Si wafer templates commerically for GaN growth, and Bridgelux set a new Lumens/W record for Gan-on-Si LEDs.
SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.
The IEEE Photonics Conference 2011, previously known as the IEEE LEOS Annual Meeting, will offer more than 550 technical presentations by the world
Tom Hausken, Strategies Unlimited, shares insights on LED growth, the gap between MOCVD purchasing and utilization, and the global distribution of LED manufacturing.
China has develped government support infrastructure for LED manufacturing and consumption. LED production investments have rapidly escalated in China, and the country is the world's leading consumer of solid state lighting.
The US DOE is accepting funding applications through December 15, 2011, for developers of solid-state lighting such as LEDs and OLEDs. Up to $10 million is available to research lower-cost manufacturing methods.
Strategies in Light, an annual tradeshow on high-brightness LEDs and lighting hosted by Strategies Unlimited and PennWell Corporation, will take place February 7-9, 2012 in Santa Clara, CA. New this year, the conference will include a full parallel track on LED manufacturing.
Bridgelux closed an additional $15 million in financing to accelerate R&D and scaling of Bridgelux's gallium nitride on silicon (GaN-on-Si) LED chip technologies.
Rubicon Technology Inc. (NASDAQ:RBCN) will transition to on-premise aluminum oxide processing to better control the quality of its sapphire wafers, and reduce manufacturing expenses while ensuring a steady supply of raw materials for large-diameter wafers.
Optogan opened its LED production site in Landshut, Germany, planning to produce 1 billion chips/year initially.
While the market has currently softened, early-2011 momentum will carry the year's semiconductor silicon sales to a higher total than 2010, said Stanley T. Myers, president and CEO of SEMI, noting the figures are an industry record. Growth will continue at "modest levels" through 2013.
Revenues for HB-LEDs grew 108% to $11.2 billion in 2010, driven by applications in TV backlight units, according to Strategies Unlimited. The party is quieting down though, as expanding supply and a slowdown in overall TV demand in 2011 pushed LED prices drastically lower and squeezing out weaker makers.
Georgia Tech researchers have found that GaN LEDs get a significant efficiency boost from zinc oxide microwires. The piezo-phototronic effect charges LEDs' ability to convert electricity to UV light, which GA Tech believes is a first for the LED industry.
Pixelligent LLC, nanocrystal additive maker, closed $5.1 million in funding. The round was 6 times over-subscribed, requiring the company board to significantly upsize the round.
Researchers from the Samsung Advanced Institute of Technology (SAIT) and the University of Cambridge created a full-color high-resolution 4" quantum dot light emitting diode (QD-LED) display using transfer printing.
Scientists from A*STAR and the National University of Singapore heated buckyballs on a ruthenium substrate until the carbon masses fell apart into graphene-based quantum dots. The technique could be tuneable.
Rice University researchers combined single-layer graphene with a fine aluminum nanowire mesh to create a transparent, flexible, conductive material to rival the more expensive indium tin oxide (ITO) in LEDs, displays, and solar cells.
Nanowires tend to grow in unruly tangles, but a new structured substrate from the Weizmann Institute of Science is producing long, straight, aligned semiconductor nanowires for LEDs, photovoltaics, lasers, transistors, storage media, and other applications.
Cintelliq research shows the fastest growth in OLED patents 2008-2010 came from the materials sector. During the 2-year period, the total number of OLED patents published grew by 56% from 1,767 to 2,760, with no signs of slowing. The largest group of OLED patents went to traditional lighting companies.
QD Vision Inc. relocated to a new, high-volume production facility in Lexington, MA, gearing up for new product launches in 2012.
Using a microreactor and control software, Quantum Materials Corporation (QMC) and the Access2Flow Consortium of the Netherlands achieved a continuous flow process to mass produce quantum dots.
Bridgelux and Toshiba reported a 1.1mm2 LED chip fabricated on an 8" GaN-on-Si wafer, emitting 614mW, <3.1V @ 350mA. The companies will collaborate on commercializing GaN-on-Si LEDs, and Toshiba has invested in Bridgelux.
SEMICON West is less than 2 months away, July 10-12 in San Francisco, CA. Plan your attendee schedule now with highlights from the Extreme Electronics “show within a show;” 4 strong keynotes; sessions on device architecture and node shrink, lithography, 450mm wafers and more.
Intel will invest more than $40 million over the next 5 years in a worldwide network of university research centers called "Intel Collaborative Research Institutes." Academia -- in hub and spoke universities -- will collaborate with industry on technology R&D.
Barclays Capital’s analysts say that the LED industry remains in oversupply, and 90%+ utilization rates being reported in Taiwan’s LED fabs are a short-lived event.
Canon Inc. launched the FPA-3030i5+ i-line stepper for manufacturing MEMS and energy-efficient “green” devices such as power semiconductors in solar and wind applications and LEDs.
Researchers in Japan have devised a MEMS fabrication technology using lower-cost production methods of printing and injection molding, enabling MEMS devices to be applied for fields such as lighting -- and producable by firms outside the semiconductor sector.
SUSS MicroTec uncrated the third generation of the ACS200 Coating and Developing Platform, developed from the company’s ACS200Plus and Gamma platforms for a compact, highly precise MEMS, LED, and related fab tool.
Oxford Instruments launched the PlasmaPro 100 etch and deposition tool for manufacturing MEMS, HB-LED, semiconductors, and other applications.
Strong demand for MEMS sensors, CMOS image sensors, LEDs, fiber-optic laser transmitters, and power transistors enabled the OSD semiconductors market to grow by 8% in 2011, hitting a new record revenue and beating out the overall IC market, according to IC Insights.
Researchers from Rice U. say they have developed a micron-scale spatial light modulator (SLM) built on SOI that runs orders-of-magnitude faster than its siblings used in sensing and imaging devices.
Cree, Inc. today announced a technology breakthrough for the LED street lighting market.
Colors are playing an increasingly important role in the automotive sector. Consumers can not only choose the exterior color of the vehicle, you can also tailor the interior lighting to the customer’s individual taste.
Despite a major surplus in the light-emitting diode (LED) market, top suppliers are increasing their capital spending and production because of government incentives and in order to cash in on an expected boom in the lighting business.
Global demand for precursor, a material used in manufacturing of light-emitting diodes (LEDs), is set to more than double from 2012 to 2016, as the market for LED lighting booms.
Researchers at the Georgia Institute of Technology want to put your signature up in lights – tiny lights, that is. Using thousands of nanometer-scale wires, the researchers have developed a sensor device that converts mechanical pressure – from a signature or a fingerprint – directly into light signals that can be captured and processed optically.
Displaybank's recent market report on the cost competiveness of LED chips. This report conducts a thorough analysis on the supply price history, trends and forecast of main materials that compose packaged LEDs across the entire LED value chain.
O2Micro(R) International Limited today introduced the patent pending OZ2083 3-Way LED Bulb Driver Controller with Power Factor Correction.
DAS Environmental Expert GmbH of Dresden, Germany, has developed SALIX, a point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications.
GaN-on-Sapphire remain the entrenched incumbent; leading challenger GaN-on-silicon will gain only a 10 percent market share, Lux Research says.