Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole D
In these 2 video interviews from SEMICON West 2011, ESI technologists John Sabol and Vernon Cooke discuss what LED chips require on the back-end manufacturing line, starting at wafer scribing and moving on through test.
As gold becomes more expensive, copper wire bonding becomes more appealing for chip packaging. Reverse bonding, fine-pitch bonding, looping, second bonds, and other technologies are ramping on roadmaps, according to Kulicke & Soffa (K&S).
Displaybank published a 2009-2014 analysis of LED packages, the finished LED components used in various applications. While LED package units will grow steadily through the forecast period, revenues will remain mostly flat from 2010 to 2013.
Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.
Kulicke & Soffa broke ground on its Singapore global headquarters expansion, near the current leased headquarters location. A state-of-the-art facility in Serangoon will bolster the company
With thermal issues accounting for half of all lighting failures, and costs prohibitive to widespread adoption, assembly and packaging are keys to improving LEDs. TechSearch International tracks LED packaging materials and methods, as well as reliability and package efficiency.
Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.
Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for LEDs and small power semiconductor die packaging.
Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.
Kulicke & Soffa launched the LUMOS Capillary for LED die wire bonding. The capillary can bond with gold or gold-alloy wires and uses a new TG ceramic material for better workability.
Daniel Duffy, research scientist in Henkel's Advanced Technology Group, notes pros and cons of epoxy and silicone encapsulants for high-brightness LED (HB-LED) manufacturing, and what HB-LED manufacturers need from die attach materials. He also considers quantum dots.
LED lighting maker Gem Hsin Electronics reduced the size of heatsinks in its LED products by drilling miniscule holes beneath LEDs. The holes allow heated air to escape the LED package.
OSRAM Opto Semiconductors increased its IR Power Topled with lens optical output by 80% over the standard version by integrating a thin-film chip. The IR LED maintains the same surface area and drive current.
Kulicke & Soffa Industries Inc. (NASDAQ:KLIC or K&S) named Chin Hu Lim to its Board of Directors, also serving on KLIC's Management Development & Compensation Committee.
OSRAM Opto Semiconductors introduced the Oslon Square LED for lighting applications, packaged enclosed in a reflective layer to boost light output.
Cree Inc. added 2 Cree TEMPO offerings to its design and evaluation services: TEMPO (Thermal Electrical Mechanical Photometric Optical) thermal simulation and photometric testing.
inTEST will acquire the assets and certain liabilities of Thermonics from Test Enerprises. inTEST's Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.
Mentor Graphics Corporation (NASDAQ:MENT) has combined technologies for thermal characterization and simulation with T3Ster hardware test products and its FloTHERM software, enabling better heat management in power semiconductor packages, such as LEDs.
Kulicke & Soffa Industries, Inc. (K&S, NASDAQ:KLIC) appointed Irene Lee to the role of chief quality officer. Lee will oversee quality assurance functions across Kulicke & Soffa
Palomar Technologies introduced the fully automated 3800 Ultra Flexible Die Bonder for eutectic die attach, laser diode packaging and high-power LED packaging.
Attendance was high at this year's Electronic Component Technology Conference (ECTC) in San Diego. Sandra Winkler is senior industry analyst at New Venture Research and IEEE/CPMT Luncheon Program Chair, shares the key trends in ECTC's sessions, like WLP, 2.5D, LED packaging, and more.
ESI uncrated the Model 5390 micromachining system for advanced LED via drilling and the AccuScribe 2600 HB-LED wafer scribing system at SEMICON West.
Until now, LED makers used retrofitted IC equipment and materials. Yole predicts that the market has enough sway now to attract dedicated toolsets for LED fab and packaging. LED growth will not be boring, however, as a few mini down-/up-turn cycles will occur through 2016.
Semiconductor packaging and test services provider Carsem will assemble and test LED packages, partnering with a key customer and applying semiconductor packaging technologies for better LEDs.
Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech
SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.
Barclays Capital finds that LED manufacturing and materials patents will soon run out, potentially draining value from material/chip/package suppliers and turning LEDs into commodities.
Barclays Capital shares some take-aways from the Intertech Pira Phosphor Summit, a conference on phosphors being used in the LED industry. The analysts touch on color mixing, remote phosphors, silicone encapsulants, and more
The global HB-LED market grew from $11.3 billion in 2010 to $12.5 billion in 2011, surging 9.8%, according to Strategies Unlimited. 10 companies accounted for more than 68% of the global LED supply.
The 2012 Strategies in Light conference kicked off today at the Santa Clara Convention Center with a series of five workshops, two tutorials and one all-day investor forum.
Chung Hoon Lee, CEO of LED manufacturer Seoul Semiconductor keynoted at Strategies in Light today. Lee’s keynote, "A View from Seoul," marked the first time a Korean LED maker has spoken at the conference. Following are highlights from his talk.
"Opportunities for Power Components in LED Lighting" from IMS Research reveals that rapid uptake of LED lighting, driven by legislation and rising costs of electricity, will result in a potential market of 4 billion power supply units by 2016, worth $10 billion.
Hanwha L&C of Korea signed a letter of intent to obtain manufacturing and distribution rights to ElectriPlast from Integral Technologies Inc, hybrid conductive plastics maker. The LOI is applicable for various parts of Asia.
The global market for power semiconductors used in LED lighting is forecast to reach over $3 billion in 2016. LED lighting systems require complex electronics, IMS Research notes.
SABIC’s Innovative Plastics business released 3 Lexan LUX resin grades for LED applications such as light guides and lenses. They are transparent and use a new formulation to improve initial color, color stability, and light transmission during heat aging.
Seoul Semiconductor Co. Ltd. has applied, registered, and secured more than 10,000 patents for light emitting diodes (LEDs) globally. The company invests 10-20% of its annual revenue in R&D.
Consumers are adopting LED-backlit LCD TVs more slowly than expected, prompting TV makers to design lower-power, lower-cost LED backlights using fewer LEDs per TV set, shows the NPD DisplaySearch Quarterly LED Backlight Report.
The gallium nitride (GaN) LED market declined in 2011, but 2012 marks the beginning of a growth curve, with double-digit growth in 2013 and 2014, says IMS Research. Lighting revenues will overtake TV revenues for GaN LEDs a year earlier than expected.
Day 3 of the 2012 Strategies in Light conference continued the LED Manufacturing session. Presenters covered LED manufacture, advanced packaging, metrology and testing, high-performance materials, and other topics, such as dimming. Blogger Michael A. Fury, Techcet Group, reports.
The manufacturing conference at Strategies in Light focused on methods for reducing cost through the manufacturing supply chain. Presenters discussed various methods of reducing manufacturing costs, from improved automation and standards implementation, automation to new packaging technologies. Laura Peters, LEDs Magazine, reports.
Blogger Michael A. Fury, Techcet Group, reports from Day 2 of Strategies in Light: immersing himself in the LEDs manufacturing track of the conference.
Taiwan's LED chip and package manufacturers failed to reproduce the booming revenue growth of H1 2011 in H2, according to LEDinside. Given inventory pressure, many LED makers are actively seeking joint ventures and improving product quality to create greater product differentiation.
Worldwide LED manufacturing capacity will reach 2M wafers in 2012, up 27%. More wafers do not neccessarily mean more LED fab equipment, however. Global LED manufacturing equipment spending will fall 18%, shows SEMI.
Philips Lumileds appointed Pierre Yves Lesaicherre as CEO, succeeding the company's first CEO Michael C. Holt. Lesaicherre spent 2 decades in the semiconductor and components industry.
The Thick Film Division of Heraeus announced a new name, Celcion, for its Insulated Aluminum Materials System. Celcion allows LED circuits to run cooler than MCPCBs.
Gamma Scientific introduced a low-cost spectrometer for quick and accurate testing for LEDs. The RadOMA Lite linear CCD array spectrometer tests LED intensity and total flux.
Requirements for LED processing equipment are changing from cost driven to more technology driven decisions, a clear trend to more complex and more efficient manufacturing, according to Thomas Uhrmann and Thorsten Matthias of EV Group.
Intematix released ChromaLit XT remote phosphor technology for high-lumen LEDs in small form factors, enabling blue LED packages instead of binned white LEDs.
Cree Inc. (Nasdaq:CREE) achieved 254 lumen/watt on a white-light, power LED in research. The correlated color temperature is 4408 K.
Verticle began mass production of its hexagonal-shaped LED chip Honeycomb, developed with a proprietary copper substrate and chemical chip separation technology.
Strategies in Light Europe, September in Munich, is accepting presentation abstracts through February 29. Submit a paper on LED technology, LED manufacturing and the supply chain, markets, LED applications, or a related topic.
Shin-Etsu Chemical Co. Ltd.'s new KER-7000 Series silicone encapsulating materials offer a low (1.38) refractive index (RI) for HB-LED packaging with lower gas permeability and higher transparency.
GE’s 27-watt Energy Smart LED bulb is in a standard “A-19” bulb shape, manufactured with a proprietary synthetic jet technology enabled by Nuventix’ collaboration.
Vanderbilt University researchers have used formic acid to develop white-light quantum dots' fluorescent efficiency to 45%, enabling UV LED efficiency of 40 lumens/watt.
SunSun Lighting, a provider of high-performance, energy-efficient and low-cost LED lighting technologies, received $30 million in Series B financing from GSR Ventures and Oak Investment Partners and additional commitments from its original angel investors. Allan Kwan, a China-based advisor for Oak, is joining the board of SunSun.
SEMI’s Paula Doe covers the “commodity market” of LEDs, including capacity utilization at LED fabs, automation in manufacturing that could improve yields, LEDs fabbed on silicon and GaN instead of sapphire wafers, and more.
Low-cost direct LED-backlit LCD TVs were introduced in March 2011, targeting share in the entry/mainstream LCD TV market currently dominated by CCFL-backlit TVs. They will eliminate CCFLs by 2014, says DisplaySearch.
Lightscape Materials offers IP in specialty phosphor technology, which Dow will add to its LED technologies portfolio. Lightscape co-founders Gerard Frederickson and Yongchi Tian will join Dow’s LED Technologies team.
Barclays Capital analysts attended Lightfair International and gleaned several trends in LEDs and OLEDs for lighting, including an interesting phenomenon around MOCVD utilization rates and new orders.
In this series, CMC Laboratories describes a new LED-grade AlN and what it accomplishes as a ceramic substrate. The AlN offers better heat dissipation for LED packages than alumina, at a lower cost than previous formulations.
coolingZONE LED, May 29-31 in Berlin, is soliciting technical presentations on LED energy consumption, LED packaging, heat and air-flow simulations of LED products, and related topics.
MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.
The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 – April 19, 2012, in Anaheim, CA.
Part 2 of this series covers furnace considerations for a new HB-LED-grade AlN, as well as furnace throughput. Jonathan Harris, CMC Laboratories, covers the role of the oxide sintering phase in AlN in defining the materials microstructure and thus determining key properties such as thermal conductivity and mechanical strength.
OSRAM Opto Semiconductors released the Oslon SSL LED, using optimized LED chips and packaging technologies to boost light output, with a 25% efficiency increase over previous-generation LEDs.
Gamma Scientific developed the Bi-Spectral Fluorescence Spectroradiometer to quickly obtain detailed fluorescence data for LED phosphors and other fluorescent or reflective materials.
UL has been named a Zhaga-authorized LED testing center. Zhaga standards cover the physical dimensions, as well as the photometric, electrical and thermal behavior of LED light engines.
JEDEC Solid State Technology Association created a series of standards, JESD51-5x, for component-level testing of high-brightness/power LEDs.
Luminus Devices received accreditation to test its LEDs to the LM-80 standard, the approved method for measuring LED light sources under ISO/IEC 17025:2005.
Intematix debuted ChromaLit Contour remote phosphor architecture. ChromaLit Contour is shaped to enable internal and external convection airflow, cooling LEDs in 60, 75 and 100W-equivalent omni-directional lights.
Cree Inc. added TEMPO 24 tests to its Cree Services for LED luminaires. TEMPO 24 combines the IES LM-79-08 photometric test with nearly a dozen other LED performance tests.
Lumichip Limited, an LED manufacturer, expanded its commercial operations in Finland and opened a new development center in Espoo, Finland.
PLANSEE developed Mo-Cu R670, a new molybdenum-copper composite material for optimizing heat dissipation in light-emitting diodes (LEDs).
ProTek Devices says it is now offering individual unpackaged die for LEDs in wafer form, available as unidirectional and bidirectional electrostatic discharge (ESD) protection diodes.
FlexTech Alliance announced the completion of a development project with Etched in Time, Inc. (EITI), for a plasma etch system that is compatible with a wide array of roll-to-roll equipment.
KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.
NanoMarkets issued a new white paper on LED phosphors, "LED Lighting Driving Demand for New Phosphors," that covers the shifting use of phosphors, which modulate the light emitted by LEDs, from LCD backlighting to solid-state lighting.
LED encapsulants are closely related to the LED’s lifespan and light transmittance. With high-power and high-brightness LEDs emerging, the encapsulant’s role is becoming more important, says Displaybank.
SEMICON West 2012 will take place July 10-12 at the Moscone Center in San Francisco, CA. Following is a preview of the LED and OLED events taking place during SEMICON West, from contributor Paula Doe, SEMI Emerging Markets.
SemiLEDs Corporation (NASDAQ:LEDS) combined its vertical LED chip architecture with a proprietary metal alloy substrate to create the Enhanced Vertical (EV) LED product line.
Osram Opto Semiconductors developed a concept for uniform solder pads based on the Oslon LED component family. This enables second sourcing by Osram’s LED customers without an additional soldering board, potentially reduces the costs of storage and process modification.
Avnet Electronics Marketing Americas, part of Avnet Inc. (NYSE:AVT) opened a lighting lab in Chandler, AZ, to measure LED properties for various applications.
Intematix Corporation, phosphor and phosphor component developer for LEDs, plans to conduct a registered initial public offering (IPO) of its common stock.
Lily Li, patent strategist at IP Checkups, examines remote phosphors for LED bulbs, in "Patents compete for priority in the remote-phosphor LED technology space," LEDs Magazine, July/August issue.
The price of a LED bulb will fall by about half by 2020, hitting $11.06, according to Lux Research. With the LED chip package seeing 70%+ cost reduction, technology innovation will shift to the surrounding elements: thermal management, drivers and optics.
OSRAM AG will build a new LED assembly plant in Wuxi, Jiangsu, China, packaging LED chips fabbed at its Regensburg, Germany and Penang, Malaysia wafer processing facilities.
Phosphors used in LED lighting applications will see a market increase to over $1.6 billion by 2019, says NanoMarkets. Phosphors help control LED luminous efficacy and color to bring the technology on a level with traditional lighting.
Cree Inc. (Nasdaq:CREE) is opening new technology centers in Shenzhen and Shanghai, China, expanding Cree TEMPO (Thermal, Electrical, Mechanical, Photometric, Optical) Services for LED lighting manufacturers evaluating LED luminaires.
High Tech Lights is participating in a “Reshoring Initiative” by bringing job positions from China to the US for LED and laser diode scientists, manufacturing and assembly workers, and R&D staff.
LTI Optics’ Photopia Parametric Optical Design Tools module enables creation of optical designs to achieve a prescribed distribution of light. LUXeXcel introduced its one-step 3D Printoptical printing process for plastic optics for lighting fixtures, which can create custom optics from the LTI Optics' CAD model at prices competitive with injection molding.
Daewon Innost achieved what it says is the LED industry’s best thermal dissipation performance on its Glaxum LED Array family, based on the proprietary Nano-Pore Silicon Substrate (NPSS) technology.
Luminus Devices Inc. is reducing thermal resistance in its Big Chip LED devices by 30% with new packaging technology.
MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.
The LED industry is entering its third growth cycle, general lighting, according to Yole and EPIC’s report, “Status of the LED Industry.” However, the cost of a packaged LED still needs to be reduced by a factor x10 to enable massive adoption. New business models are mandatory to capture added value of LED lighting.
Researchers at the National Institute of Advanced Industrial Science say they have devised a way to selectively and nondestructively evaluate molecules within a sealed organic light-emitting diode (OLED) in operation, in hopes to further understand and eventually minimize performance degradation.
Solvay Specialty Polymers USA LLC has extended its line of high-performance polyester compounds with a new version targeting light-emitting diode (LED) TVs with higher heat and light stability.
OSRAM AG, LED manufacturer, laid the foundation for its Wuxi, China, plant, in a ceremony attended by high-ranking representatives of the Jiangsu province.
ON Semiconductor has joined imec to collaborate on the development of next-generation GaN-on-Si power devices. ON Semiconductor is presently building a GaN processing line in its Oudenaarde facility in Belgium Oudenaarde, and it is expected to employ GaN-on-Si technology.
Road and street lighting is a key driver for LED technology in general lighting.
CEA-Leti announced today that researchers Dominique Vicard and Jean Brun received the Avantex Innovation Prize for the use of the E-Thread technology in textiles.
Samsung Electronics Co., Ltd. announced today that it is introducing a new 129lm/W high efficiency, chip-on-board (COB) family of LED packages, LC013/26/40B, which features a compact light emitting surface (LES), designed for use in high performance indoor and outdoor lighting, and ideally suited for spotlight applications.
The LED industry gained a foothold for growth in the parts and materials industry after LED technology was applied to the TV backlight unit (BLU).
Strategies Unlimited has issued new figures since the first edition of this article. Solid State Technology now brings you updated figures and additional information on the worldwide LED market.
InfiniLED’s latest MicroLEDs, or µLEDs, have produced record optical beam intensity
Mitsubishi Electric Corporation announced this week that is has developed a prototype to improve productivity of SiC slice processing for semiconductor wafers.
To help the Taiwan LED industry tackle the increasing challenges, an in-depth analysis of LED global market opportunities and technology breakthroughs were recently provided at the 2013 LED Market and Outlook seminar held by SEMI Taiwan.
A new report from IHS Displaybank examined a total of 483 patents on roll-to-roll processing technologies, focusing on 32 that were flexible, OLED-related.
Soraa announced yesterday the next generation of its high external quantum efficiency GaN on GaN LEDs.
Professor Yue Kuo at Texas A&M University has fabricated a new type of LED, based on light emission from an ultra-thin amorphous dielectric layer.
AIXTRON SE today announced that, in the third quarter of 2012, long-term customer Formosa Epitaxy Inc. (FOREPI), Taiwan, placed a new order for multiple CRIUS II-L MOCVD production systems in a 69x2-inch configuration. All systems will be used for the manufacturing of ultra-high brightness (UHB) GaN-based blue and white LEDs.
As power electronics grow to $15 billion and LEDs to $100 billion, Lux Research identifies the leading technology companies addressing these markets.
HVPE system expected to lower the cost of LED production and accelerate adoption in commercial and residential lighting.
Silicon nanocrystals have a size of a few nanometers and possess a high luminous potential. Scientists of Karlsruhe Institute of Technology (KIT) and the University of Toronto/Canada have now succeeded in manufacturing silicon-based light-emitting diodes (SiLEDs). They are free of heavy metals and can emit light in various colors.
Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.
Recently, as the importance of environmental protection grows, the method of saving energy of products and using eco-friendly materials is on the rise. Of these, since lighting accounts for about 20% of the overall power consumption, the efforts to replace with high-efficiency and eco-friendly products are being made actively.
LED driver matches flash LED input current with safe output capability of battery – in real time.
Cree, Inc. announces the release of its second generation SiC MOSFET, enabling systems to have higher efficiency and smaller size at cost parity with silicon-based solutions. These new 1200V MOSFETs deliver power density and switching efficiency at half the cost per amp of Cree’s previous generation MOSFETs.
Dramatically falling costs and improvements in efficiency are driving increased sales of light emitting diode (LED) lamps for street lighting. Costs have fallen as much as 50% over the past two years and are expected to continue falling. By 2015, LEDs will become the second-leading type of lamp for street lights in terms of sales, behind only high pressure sodium lamps, according to a new report from Pike Research, a part of Navigant’s Energy Practice. By 2020, the study concludes, LED lamps for street lights will generate more than $2 billion in annual revenue.
The way the world is lit up could be revolutionized by a new European-wide research project being led by the University of Dundee.
Higher performance UVC LEDs help to realize ever more increasing range of customer applications including scientific instrumentation and water disinfection.
Yole Développement announced today its new report “UV LEDs: Technology & Application Trends” which presents UV LED new applications and associated market metrics for the period 2012-2020, and a deep analysis of UV LED technology and UV LED lighting industry.
Rensselaer Polytechnic Institute student Ming Ma has developed a new method to manufacture light-emitting diodes (LEDs) that are brighter, more energy efficient and have superior technical properties than those on the market today.
Bridgelux, a developer and manufacturer of LED lighting technologies and solutions, today unveiled the Vero LED array, a new lighting platform that simplifies design integration and manufacturing and gives designers a more flexible LED lighting solution.
ON Semiconductor will demonstrate new digital AC-DC PWM controllers, motor drivers and IGBTs at industry’s premier power electronics show.
Plessey today announced that samples of its Gallium Nitride (GaN) on silicon LED products are today available. These entry level products are the first LEDs manufactured on 6-inch GaN on silicon substrates to be commercially available anywhere in the world.
A new £1million (or US$1,530,700) growth facility will allow University of Cambridge researchers to further reduce the cost and improve the efficiency of LEDs, with potentially huge cost-saving implications.
Samsung Electronics Co Ltd of Seoul, South Korea has introduced a new lineup of Zhaga-compliant LED H-Series linear modules with high efficacy and light quality, as well as color consistency for use in a wide range of LED lighting applications including ambient lighting and linear fixtures.
Oxford Instruments Plasma Technology has just announced an evolution in batch etch technology with the launch of the PlasmaPro 1000 Astrea etch system, a large batch etch solution for PSS, GaN and AlGaInP that will offer HBLED production manufacturers high throughput.
The global LED lighting market will be worth $25.4 billion in 2013, representing 54% growth on the 2012 figure of $16.5, while the LED lighting penetration rate will also rise to 18.6%, according to a new DIGITIMES Research Special Report titled "Global high-brightness LED market forecast."
Aledia, a developer of LEDs-based on disruptive microwire GaN-on-Silicon technology, announced today that it has made its first LEDs on 8-inch (200mm) silicon wafers.
Nuventix, LED cooling technology developer, received capital from GE (NYSE:GE) and other investors. GE will also license Nuventix's patent portfolio.
Strategies in Light Europe 2012, September 18-20 in Munich, Germany, is accepting abstracts through February 17. Strategies in Light Europe covers the rapidly growing LED lighting industry.
András Poppe, PhD, marketing manager in Mentor Graphics' MicReD division, discusses LED testing challenges, such as neglected power flux, LED cooling, and the gap between lab and real operating conditions.
SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.
The SST Editorial Staff recaps SEMI's recent Industry Strategy Symposium (ISS), and the Strategic Materials Conference (SMC) that followed, with this special report series available only on our website.
Attolight AG is launching a quantitative cathodoluminescence system with nanoscale resolution and picosecond timing for research and product development in semiconductor, ceramics, advanced materials, geological, solar panel, and LED sectors.
Cree, Inc. today announced a technology breakthrough for the LED street lighting market.
Colors are playing an increasingly important role in the automotive sector. Consumers can not only choose the exterior color of the vehicle, you can also tailor the interior lighting to the customer’s individual taste.
Despite a major surplus in the light-emitting diode (LED) market, top suppliers are increasing their capital spending and production because of government incentives and in order to cash in on an expected boom in the lighting business.
Global demand for precursor, a material used in manufacturing of light-emitting diodes (LEDs), is set to more than double from 2012 to 2016, as the market for LED lighting booms.
Researchers at the Georgia Institute of Technology want to put your signature up in lights – tiny lights, that is. Using thousands of nanometer-scale wires, the researchers have developed a sensor device that converts mechanical pressure – from a signature or a fingerprint – directly into light signals that can be captured and processed optically.
Displaybank's recent market report on the cost competiveness of LED chips. This report conducts a thorough analysis on the supply price history, trends and forecast of main materials that compose packaged LEDs across the entire LED value chain.
At present, Europe has the largest market for smart lighting especially in commercial industrial buildings, outdoor lighting, and automobiles applications.
GaN-on-Sapphire remain the entrenched incumbent; leading challenger GaN-on-silicon will gain only a 10 percent market share, Lux Research says.