LED-Packaging-and-Testing

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LED Lab Optimizes Operating Parameters

Thu, 5 May 2007
(May 10, 2007) NEW YORK — TT electronics OPTEK Technology opened an in-house visible LED laboratory with resources to assess LED packages on junction temperature variation, optical performance, and other parameters. The lab aids in design, manufacturing, and test.

Intel Capital Invests in Phoenix Micro

Thu, 5 May 2007
(May 10, 2007) CARLSBAD, CA — Intel Capital, the venture capital branch of Intel Corporation, invested in six new companies, totaling $31 million. In the semiconductor space, Intel invested in China-based Phoenix Microelectronics.

Thin wafers win majority in electronics by 2016

Thu, 10 Oct 2011

Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole D

LED packaging equipment for better throughput, quality, and yields

Thu, 8 Aug 2011

In these 2 video interviews from SEMICON West 2011, ESI technologists John Sabol and Vernon Cooke discuss what LED chips require on the back-end manufacturing line, starting at wafer scribing and moving on through test.


K&S high volume fine pitch Cu wire bonding

Wed, 2 Feb 2011

Figure. Copper transition and roadmap planning. SOURCE: Kulicke & SoffaAs gold becomes more expensive, copper wire bonding becomes more appealing for chip packaging. Reverse bonding, fine-pitch bonding, looping, second bonds, and other technologies are ramping on roadmaps, according to Kulicke & Soffa (K&S).


LED package sales to increase but revenues will stay flat until 2014

Mon, 6 Jun 2012

Displaybank published a 2009-2014 analysis of LED packages, the finished LED components used in various applications. While LED package units will grow steadily through the forecast period, revenues will remain mostly flat from 2010 to 2013.


Indium expands electronics materials manufacturing with new facility in NY

Wed, 5 May 2012

Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.


Kulicke & Soffa expands Singapore HQ, bolsters bonder tool R&D and manufacturing

Wed, 5 May 2012

Kulicke & Soffa broke ground on its Singapore global headquarters expansion, near the current leased headquarters location. A state-of-the-art facility in Serangoon will bolster the company

LED packaging report reveals costs, reliability impact of package

Fri, 2 Feb 2012

With thermal issues accounting for half of all lighting failures, and costs prohibitive to widespread adoption, assembly and packaging are keys to improving LEDs. TechSearch International tracks LED packaging materials and methods, as well as reliability and package efficiency.


Present at ESTC 2012 in Amsterdam

Tue, 2 Feb 2012

Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.


LEDs, power semiconductors packaged with high-thermal-conductivity die attach adhesives

Wed, 2 Feb 2012

Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for LEDs and small power semiconductor die packaging.


AMEC debuts TSV etch tool with Chinese installations

Wed, 3 Mar 2012

Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.


K&S capillary specifically suits LED wire bonding

Fri, 3 Mar 2012

Kulicke & Soffa launched the LUMOS Capillary for LED die wire bonding. The capillary can bond with gold or gold-alloy wires and uses a new TG ceramic material for better workability.


HB LED packaging materials pros and cons

Fri, 4 Apr 2011

LEDDaniel Duffy, research scientist in Henkel's Advanced Technology Group, notes pros and cons of epoxy and silicone encapsulants for high-brightness LED (HB-LED) manufacturing, and what HB-LED manufacturers need from die attach materials. He also considers quantum dots.


LED maker shrinks heatsinks with air holes

Thu, 11 Nov 2011

LED lighting maker Gem Hsin Electronics reduced the size of heatsinks in its LED products by drilling miniscule holes beneath LEDs. The holes allow heated air to escape the LED package.


Thin-film chip boosts LED optical output without changing footprint

Thu, 11 Nov 2011

OSRAM Opto Semiconductors increased its IR Power Topled with lens optical output by 80% over the standard version by integrating a thin-film chip. The IR LED maintains the same surface area and drive current.


KLIC appoints Director from telecom industry

Fri, 12 Dec 2011

Kulicke & Soffa Industries Inc. (NASDAQ:KLIC or K&S) named Chin Hu Lim to its Board of Directors, also serving on KLIC's Management Development & Compensation Committee.


OSRAM envelops LED chip in reflective package

Tue, 11 Nov 2011

OSRAM Opto Semiconductors introduced the Oslon Square LED for lighting applications, packaged enclosed in a reflective layer to boost light output.


Cree LED simulation and testing options speed time-to-market

Wed, 12 Dec 2011

Cree Inc. added 2 Cree TEMPO offerings to its design and evaluation services: TEMPO (Thermal Electrical Mechanical Photometric Optical) thermal simulation and photometric testing.


inTEST to acquire Thermonics division of Test Enterprises

Tue, 12 Dec 2011

inTEST will acquire the assets and certain liabilities of Thermonics from Test Enerprises. inTEST's Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.


Mentor Graphics integrates T3Ster and FloTHERM for power device thermal management

Mon, 12 Dec 2011

Mentor Graphics Corporation (NASDAQ:MENT) has combined technologies for thermal characterization and simulation with T3Ster hardware test products and its FloTHERM software, enabling better heat management in power semiconductor packages, such as LEDs.


Kulicke & Soffa drives semiconductor packaging tool quality with new CQO

Wed, 8 Aug 2012

Kulicke & Soffa Industries, Inc. (K&S, NASDAQ:KLIC) appointed Irene Lee to the role of chief quality officer. Lee will oversee quality assurance functions across Kulicke & Soffa

Palomar intros ultra flexible die bonder

Fri, 9 Sep 2010

Palomar Technologies introduced the fully automated 3800 Ultra Flexible Die Bonder for eutectic die attach, laser diode packaging and high-power LED packaging.


ECTC

Fri, 6 Jun 2012

Attendance was high at this year's Electronic Component Technology Conference (ECTC) in San Diego. Sandra Winkler is senior industry analyst at New Venture Research and IEEE/CPMT Luncheon Program Chair, shares the key trends in ECTC's sessions, like WLP, 2.5D, LED packaging, and more.


LED packaging equipment debuts at ESI booth: Via drilling and wafer scribing tools

Thu, 7 Jul 2011

ESI uncrated the Model 5390 micromachining system for advanced LED via drilling and the AccuScribe 2600 HB-LED wafer scribing system at SEMICON West.


LED manufacturers need dedicated toolset and cost savings

Mon, 6 Jun 2011

Until now, LED makers used retrofitted IC equipment and materials. Yole predicts that the market has enough sway now to attract dedicated toolsets for LED fab and packaging. LED growth will not be boring, however, as a few mini down-/up-turn cycles will occur through 2016.


The Riley Report

Tue, 5 May 2009
Flip Chips and Flashlights by George A. Riley, Contributing Editor
With the industry's attention riveted on the next-generation of TSV- enhanced stacked - everything 3D marvels, we sometimes forget how microelectronics are changing everyday products in our world.

SATS provider Carsem begins LED packaging and test

Fri, 5 May 2012

Semiconductor packaging and test services provider Carsem will assemble and test LED packages, partnering with a key customer and applying semiconductor packaging technologies for better LEDs.


Ultratech brings former member back to Board

Thu, 4 Apr 2012

Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech

SUSS buys Tamarack for lithography, laser structuring lines

Fri, 3 Mar 2012

SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.


As LED patents run out, supply chain value will shift downstream

Fri, 3 Mar 2012

Barclays Capital finds that LED manufacturing and materials patents will soon run out, potentially draining value from material/chip/package suppliers and turning LEDs into commodities.


High voltage SourceMeter introduced

Tue, 3 Mar 2012

Phosphor trends for LED manufacturing

Tue, 3 Mar 2012

Barclays Capital shares some take-aways from the Intertech Pira Phosphor Summit, a conference on phosphors being used in the LED industry. The analysts touch on color mixing, remote phosphors, silicone encapsulants, and more


Top 10 LED manufacturers in 2011, and shifting regional dominance

Wed, 2 Feb 2012

The global HB-LED market grew from $11.3 billion in 2010 to $12.5 billion in 2011, surging 9.8%, according to Strategies Unlimited. 10 companies accounted for more than 68% of the global LED supply.


Strategies in Light: Day 1, LED Lighting Report, New Start-ups

Wed, 2 Feb 2012

The 2012 Strategies in Light conference kicked off today at the Santa Clara Convention Center with a series of five workshops, two tutorials and one all-day investor forum.


Seoul Semiconductor keynote at Strategies in Light: Highlights

Wed, 2 Feb 2012

Chung Hoon Lee, CEO of LED manufacturer Seoul Semiconductor keynoted at Strategies in Light today. Lee’s keynote, "A View from Seoul," marked the first time a Korean LED maker has spoken at the conference. Following are highlights from his talk.


LED lighting increases power electronics complexity, drives new power supply market

Fri, 2 Feb 2012

"Opportunities for Power Components in LED Lighting" from IMS Research reveals that rapid uptake of LED lighting, driven by legislation and rising costs of electricity, will result in a potential market of 4 billion power supply units by 2016, worth $10 billion.


Hanwha moves to manufacture ElectriPlast moldable conductive plastic

Fri, 2 Feb 2012

Hanwha L&C of Korea signed a letter of intent to obtain manufacturing and distribution rights to ElectriPlast from Integral Technologies Inc, hybrid conductive plastics maker. The LOI is applicable for various parts of Asia.


LED lighting to illuminate power semiconductor sector

Fri, 3 Mar 2012

The global market for power semiconductors used in LED lighting is forecast to reach over $3 billion in 2016. LED lighting systems require complex electronics, IMS Research notes.


SABIC LED resins offer improved color under heat exposure

Wed, 4 Apr 2012

SABIC’s Innovative Plastics business released 3 Lexan LUX resin grades for LED applications such as light guides and lenses. They are transparent and use a new formulation to improve initial color, color stability, and light transmission during heat aging.


Seoul Semiconductor LED patents top 10K mark

Fri, 1 Jan 2012

Seoul Semiconductor Co. Ltd. has applied, registered, and secured more than 10,000 patents for light emitting diodes (LEDs) globally. The company invests 10-20% of its annual revenue in R&D.


Cheaper LED backlights require LED, plate materials changes

Wed, 1 Jan 2012

Consumers are adopting LED-backlit LCD TVs more slowly than expected, prompting TV makers to design lower-power, lower-cost LED backlights using fewer LEDs per TV set, shows the NPD DisplaySearch Quarterly LED Backlight Report.


GaN LED market growth starts in 2012

Tue, 1 Jan 2012

The gallium nitride (GaN) LED market declined in 2011, but 2012 marks the beginning of a growth curve, with double-digit growth in 2013 and 2014, says IMS Research. Lighting revenues will overtake TV revenues for GaN LEDs a year earlier than expected.


Lithography, direct-attach LEDs, packaging trends at Strategies in Light Day 3

Fri, 2 Feb 2012

Day 3 of the 2012 Strategies in Light conference continued the LED Manufacturing session. Presenters covered LED manufacture, advanced packaging, metrology and testing, high-performance materials, and other topics, such as dimming. Blogger Michael A. Fury, Techcet Group, reports.


LED cost reduction to come from manufacturing: Strategies in Light

Fri, 2 Feb 2012

The manufacturing conference at Strategies in Light focused on methods for reducing cost through the manufacturing supply chain. Presenters discussed various methods of reducing manufacturing costs, from improved automation and standards implementation, automation to new packaging technologies. Laura Peters, LEDs Magazine, reports.


LED manufacturing highlights from Strategies in Light Day 2

Thu, 2 Feb 2012

Blogger Michael A. Fury, Techcet Group, reports from Day 2 of Strategies in Light: immersing himself in the LEDs manufacturing track of the conference.


Taiwan's LED makers' and packagers' 2011 results

Fri, 1 Jan 2012

Taiwan's LED chip and package manufacturers failed to reproduce the booming revenue growth of H1 2011 in H2, according to LEDinside. Given inventory pressure, many LED makers are actively seeking joint ventures and improving product quality to create greater product differentiation.


LED makers to spend less on MOCVD in 2012, more on other LED fab tools

Wed, 1 Jan 2012

Worldwide LED manufacturing capacity will reach 2M wafers in 2012, up 27%. More wafers do not neccessarily mean more LED fab equipment, however. Global LED manufacturing equipment spending will fall 18%, shows SEMI.


Philips Lumileds names CEO from semi sector

Tue, 1 Jan 2012

Philips Lumileds appointed Pierre Yves Lesaicherre as CEO, succeeding the company's first CEO Michael C. Holt. Lesaicherre spent 2 decades in the semiconductor and components industry.


Heraeus thick film division renames insulated aluminum materials system Celcion

Tue, 1 Jan 2012

The Thick Film Division of Heraeus announced a new name, Celcion, for its Insulated Aluminum Materials System. Celcion allows LED circuits to run cooler than MCPCBs.


Gamma Scientific uncrates LED tester

Mon, 1 Jan 2012

Gamma Scientific introduced a low-cost spectrometer for quick and accurate testing for LEDs. The RadOMA Lite linear CCD array spectrometer tests LED intensity and total flux. 


MOCVD cools down, LED downstream processing heats up

Mon, 1 Jan 2012

Requirements for LED processing equipment are changing from cost driven to more technology driven decisions, a clear trend to more complex and more efficient manufacturing, according to Thomas Uhrmann and Thorsten Matthias of EV Group.


Intematix remote phosphor targets high-lumen small-size LED lights

Mon, 4 Apr 2012

Intematix released ChromaLit XT remote phosphor technology for high-lumen LEDs in small form factors, enabling blue LED packages instead of binned white LEDs.


Cree LED achieves 254 lumen/watt on SiC, optimized chip/packaging tech

Fri, 4 Apr 2012

Cree Inc. (Nasdaq:CREE) achieved 254 lumen/watt on a white-light, power LED in research. The correlated color temperature is 4408 K.


Verticle takes hexagonal LED chips to mass production

Mon, 2 Feb 2012

Verticle began mass production of its hexagonal-shaped LED chip Honeycomb, developed with a proprietary copper substrate and chemical chip separation technology.


Present at Strategies in Light Europe

Mon, 2 Feb 2012

Strategies in Light Europe, September in Munich, is accepting presentation abstracts through February 29. Submit a paper on LED technology, LED manufacturing and the supply chain, markets, LED applications, or a related topic.


Shin-Etsu Chemical releases low-RI LED encapsulants

Fri, 2 Feb 2012

Shin-Etsu Chemical Co. Ltd.'s new KER-7000 Series silicone encapsulating materials offer a low (1.38) refractive index (RI) for HB-LED packaging with lower gas permeability and higher transparency.


GE integrates LED thermal management for 100W bulb within A-19 form factor

Wed, 5 May 2012

GE’s 27-watt Energy Smart LED bulb is in a standard “A-19” bulb shape, manufactured with a proprietary synthetic jet technology enabled by Nuventix’ collaboration.


LED efficiency boosted by quantum dot and formic acid combo

Wed, 5 May 2012

Vanderbilt University researchers have used formic acid to develop white-light quantum dots' fluorescent efficiency to 45%, enabling UV LED efficiency of 40 lumens/watt.


LED maker SunSun Lighting raises $30M from investors

Wed, 5 May 2012

SunSun Lighting, a provider of high-performance, energy-efficient and low-cost LED lighting technologies, received $30 million in Series B financing from GSR Ventures and Oak Investment Partners and additional commitments from its original angel investors. Allan Kwan, a China-based advisor for Oak, is joining the board of SunSun.


HB-LED makers drive economic improvement with alternative substrates, automation, and yield

Tue, 5 May 2012

SEMI’s Paula Doe covers the “commodity market” of LEDs, including capacity utilization at LED fabs, automation in manufacturing that could improve yields, LEDs fabbed on silicon and GaN instead of sapphire wafers, and more.


Lower-cost LED backlights darken CCFL's future

Mon, 5 May 2012

Low-cost direct LED-backlit LCD TVs were introduced in March 2011, targeting share in the entry/mainstream LCD TV market currently dominated by CCFL-backlit TVs. They will eliminate CCFLs by 2014, says DisplaySearch.


Dow acquires LED phosphor technology IP in Lightscape Materials buy

Wed, 5 May 2012

Lightscape Materials offers IP in specialty phosphor technology, which Dow will add to its LED technologies portfolio. Lightscape co-founders Gerard Frederickson and Yongchi Tian will join Dow’s LED Technologies team.


The low utilization/MOCVD uptick phenomenon, LED efficacy and price, more from Lightfair

Mon, 5 May 2012

Barclays Capital analysts attended Lightfair International and gleaned several trends in LEDs and OLEDs for lighting, including an interesting phenomenon around MOCVD utilization rates and new orders.


HB-LED grade aluminum nitride meets thermal needs of today's LEDs

Fri, 2 Feb 2012

In this series, CMC Laboratories describes a new LED-grade AlN and what it accomplishes as a ceramic substrate. The AlN offers better heat dissipation for LED packages than alumina, at a lower cost than previous formulations.


Present at coolingZONE LED 2012 in Berlin

Thu, 2 Feb 2012

coolingZONE LED, May 29-31 in Berlin, is soliciting technical presentations on LED energy consumption, LED packaging, heat and air-flow simulations of LED products, and related topics.


Chip substrate factory begins producing thermal-control substrates in Russia

Wed, 2 Feb 2012

MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.


IRPS set for April in Anaheim

Tue, 2 Feb 2012

The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 – April 19, 2012, in Anaheim, CA.


HB-LED grade aluminum nitride (AlN) sintering

Fri, 3 Mar 2012

Part 2 of this series covers furnace considerations for a new HB-LED-grade AlN, as well as furnace throughput. Jonathan Harris, CMC Laboratories, covers the role of the oxide sintering phase in AlN in defining the materials microstructure and thus determining key properties such as thermal conductivity and mechanical strength.


OSRAM optimizes LED for improved efficiency with stable luminous flux

Thu, 3 Mar 2012

OSRAM Opto Semiconductors released the Oslon SSL LED, using optimized LED chips and packaging technologies to boost light output, with a 25% efficiency increase over previous-generation LEDs.


Spectroradiometer measures LED phosphors

Wed, 2 Feb 2012

Gamma Scientific developed the Bi-Spectral Fluorescence Spectroradiometer to quickly obtain detailed fluorescence data for LED phosphors and other fluorescent or reflective materials.


UL authorized for LED testing to Zhaga standards

Mon, 2 Feb 2012

UL has been named a Zhaga-authorized LED testing center. Zhaga standards cover the physical dimensions, as well as the photometric, electrical and thermal behavior of LED light engines.


JEDEC creates LED test standards series

Wed, 5 May 2012

JEDEC Solid State Technology Association created a series of standards, JESD51-5x, for component-level testing of high-brightness/power LEDs.


LED maker Luminus Devices accredited to LM-80 test standard

Fri, 3 Mar 2012

Luminus Devices received accreditation to test its LEDs to the LM-80 standard, the approved method for measuring LED light sources under ISO/IEC 17025:2005.


Intematix remote phosphor enables 100W-equivalent LED bulbs

Thu, 5 May 2012

Intematix debuted ChromaLit Contour remote phosphor architecture. ChromaLit Contour is shaped to enable internal and external convection airflow, cooling LEDs in 60, 75 and 100W-equivalent omni-directional lights.


Cree LED test suite TEMPO 24 incorporates IES LM-79

Tue, 5 May 2012

Cree Inc. added TEMPO 24 tests to its Cree Services for LED luminaires. TEMPO 24 combines the IES LM-79-08 photometric test with nearly a dozen other LED performance tests.


LED manufacturer Lumichip expands in Finland, opens development center

Fri, 4 Apr 2012

Lumichip Limited, an LED manufacturer, expanded its commercial operations in Finland and opened a new development center in Espoo, Finland.


MoCu LED material optimizes thermal management

Fri, 3 Mar 2012

PLANSEE developed Mo-Cu R670, a new molybdenum-copper composite material for optimizing heat dissipation in light-emitting diodes (LEDs).


ProTek offering unpackaged die for LEDs

Tue, 10 Oct 2012

ProTek Devices says it is now offering individual unpackaged die for LEDs in wafer form, available as unidirectional and bidirectional electrostatic discharge (ESD) protection diodes.


Roll-to-roll plasma etch equipment project completed

Wed, 10 Oct 2012

FlexTech Alliance announced the completion of a development project with Etched in Time, Inc. (EITI), for a plasma etch system that is compatible with a wide array of roll-to-roll equipment.


KLA-Tencor's updated LED wafer inspection tool boosts throughput, efficiency

Thu, 12 Dec 2012

KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.


As LED growth switches from backlights to home lamps, phosphors gain importance

Tue, 7 Jul 2012

NanoMarkets issued a new white paper on LED phosphors, "LED Lighting Driving Demand for New Phosphors," that covers the shifting use of phosphors, which modulate the light emitted by LEDs, from LCD backlighting to solid-state lighting.


LED encapsulants grow with increased LED adoption

Tue, 7 Jul 2012

LED encapsulants are closely related to the LED’s lifespan and light transmittance. With high-power and high-brightness LEDs emerging, the encapsulant’s role is becoming more important, says Displaybank.


Guide to LED and OLED programs at SEMICON West

Thu, 6 Jun 2012

SEMICON West 2012 will take place July 10-12 at the Moscone Center in San Francisco, CA. Following is a preview of the LED and OLED events taking place during SEMICON West, from contributor Paula Doe, SEMI Emerging Markets.


Vertical LED + metal alloy substrate = higher thermal endurance

Mon, 7 Jul 2012

SemiLEDs Corporation (NASDAQ:LEDS) combined its vertical LED chip architecture with a proprietary metal alloy substrate to create the Enhanced Vertical (EV) LED product line.


Osram devises LED solder pad concept for easier second sourcing

Thu, 7 Jul 2012

Osram Opto Semiconductors developed a concept for uniform solder pads based on the Oslon LED component family. This enables second sourcing by Osram’s LED customers without an additional soldering board, potentially reduces the costs of storage and process modification.


Avnet opens US light lab for LED measurement and testing

Tue, 7 Jul 2012

Avnet Electronics Marketing Americas, part of Avnet Inc. (NYSE:AVT) opened a lighting lab in Chandler, AZ, to measure LED properties for various applications.


LED phosphor supplier Intematix plans IPO

Tue, 7 Jul 2012

Intematix Corporation, phosphor and phosphor component developer for LEDs, plans to conduct a registered initial public offering (IPO) of its common stock.


LED balance of system trends: Patents in the remote phosphor technology space

Mon, 7 Jul 2012

Lily Li, patent strategist at IP Checkups, examines remote phosphors for LED bulbs, in "Patents compete for priority in the remote-phosphor LED technology space," LEDs Magazine, July/August issue.


LED bulb cost halved by 2020

Mon, 7 Jul 2012

The price of a LED bulb will fall by about half by 2020, hitting $11.06, according to Lux Research. With the LED chip package seeing 70%+ cost reduction, technology innovation will shift to the surrounding elements: thermal management, drivers and optics.


Osram plans LED packaging facility in Wuxi

Fri, 6 Jun 2012

OSRAM AG will build a new LED assembly plant in Wuxi, Jiangsu, China, packaging LED chips fabbed at its Regensburg, Germany and Penang, Malaysia wafer processing facilities.


Phosphor market expands as LEDs move into lighting applications

Wed, 5 May 2012

Phosphors used in LED lighting applications will see a market increase to over $1.6 billion by 2019, says NanoMarkets. Phosphors help control LED luminous efficacy and color to bring the technology on a level with traditional lighting.


Cree opens LED technical eval centers in China

Wed, 6 Jun 2012

Cree Inc. (Nasdaq:CREE) is opening new technology centers in Shenzhen and Shanghai, China, expanding Cree TEMPO (Thermal, Electrical, Mechanical, Photometric, Optical) Services for LED lighting manufacturers evaluating LED luminaires.


High Tech Lights "reshores" LED manufacturing and R&D jobs

Tue, 6 Jun 2012

High Tech Lights is participating in a “Reshoring Initiative” by bringing job positions from China to the US for LED and laser diode scientists, manufacturing and assembly workers, and R&D staff.


LUXeXceL, LTI Optics enable "digitization" of lighting optics

Wed, 6 Jun 2012

LTI Optics’ Photopia Parametric Optical Design Tools module enables creation of optical designs to achieve a prescribed distribution of light. LUXeXcel introduced its one-step 3D Printoptical printing process for plastic optics for lighting fixtures, which can create custom optics from the LTI Optics' CAD model at prices competitive with injection molding.


Silicon chip-on-board LED substrate enables best thermal dissipation

Mon, 6 Jun 2012

Daewon Innost achieved what it says is the LED industry’s best thermal dissipation performance on its Glaxum LED Array family, based on the proprietary Nano-Pore Silicon Substrate (NPSS) technology.


Luminus Devices cuts LEDs’ thermal resistance 30% with new packaging

Thu, 6 Jun 2012

Luminus Devices Inc. is reducing thermal resistance in its Big Chip LED devices by 30% with new packaging technology.


Metrology merger: MicroSense acquires SigmaTech

Wed, 6 Jun 2012

MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.


LED industry will change significantly as lighting takes off

Wed, 8 Aug 2012

The LED industry is entering its third growth cycle, general lighting, according to Yole and EPIC’s report, “Status of the LED Industry.” However, the cost of a packaged LED still needs to be reduced by a factor x10 to enable massive adoption. New business models are mandatory to capture added value of LED lighting.


Measuring inside an active OLED

Mon, 10 Oct 2012

Researchers at the National Institute of Advanced Industrial Science say they have devised a way to selectively and nondestructively evaluate molecules within a sealed organic light-emitting diode (OLED) in operation, in hopes to further understand and eventually minimize performance degradation.


Solvay unveils high-performance polyester material for LED TV components

Mon, 10 Oct 2012

Solvay Specialty Polymers USA LLC has extended its line of high-performance polyester compounds with a new version targeting light-emitting diode (LED) TVs with higher heat and light stability.


OSRAM lays foundation for LED plant in China

Mon, 8 Aug 2012

OSRAM AG, LED manufacturer, laid the foundation for its Wuxi, China, plant, in a ceremony attended by high-ranking representatives of the Jiangsu province.


ON Semiconductor joins imec’s GaN-on-Si research program

Fri, 10 Oct 2012

ON Semiconductor has joined imec to collaborate on the development of next-generation GaN-on-Si power devices. ON Semiconductor is presently building a GaN processing line in its Oudenaarde facility in Belgium Oudenaarde, and it is expected to employ GaN-on-Si technology.


Report forecasts that LED luminaire business will reach $516M market by 2016

Wed, 6 Jun 2013

Road and street lighting is a key driver for LED technology in general lighting.


CEA-Leti wins Avantex Innovation Prize for E-Thread technology

Mon, 6 Jun 2013

CEA-Leti announced today that researchers Dominique Vicard and Jean Brun received the Avantex Innovation Prize for the use of the E-Thread technology in textiles.


Samsung introduces new, high efficacy chip on board LED packages

Mon, 4 Apr 2013

Samsung Electronics Co., Ltd. announced today that it is introducing a new 129lm/W high efficiency, chip-on-board (COB) family of LED packages, LC013/26/40B, which features a compact light emitting surface (LES), designed for use in high performance indoor and outdoor lighting, and ideally suited for spotlight applications.


LED ingot market to reach $325M by 2015

Tue, 5 May 2013

The LED industry gained a foothold for growth in the parts and materials industry after LED technology was applied to the TV backlight unit (BLU).


UPDATED: Worldwide LED component market grows 9% with lighting

Wed, 2 Feb 2013

Strategies Unlimited has issued new figures since the first edition of this article. Solid State Technology now brings you updated figures and additional information on the worldwide LED market.


InfiniLED MicroLEDs achieve ultra-high light intensity

Wed, 2 Feb 2013

InfiniLED’s latest MicroLEDs, or µLEDs, have produced record optical beam intensity


Mitsubishi develops SiC ingot slicing technology

Fri, 2 Feb 2013

Mitsubishi Electric Corporation announced this week that is has developed a prototype to improve productivity of SiC slice processing for semiconductor wafers.


LED technology and market challenges addressed in Taiwan

Thu, 2 Feb 2013

To help the Taiwan LED industry tackle the increasing challenges, an in-depth analysis of LED global market opportunities and technology breakthroughs were recently provided at the 2013 LED Market and Outlook seminar held by SEMI Taiwan.


Patent analysis: Flexible roll-to-roll processing

Tue, 2 Feb 2013

A new report from IHS Displaybank examined a total of 483 patents on roll-to-roll processing technologies, focusing on 32 that were flexible, OLED-related.


Soraa announces next generation of GaN on GaN LEDs

Thu, 2 Feb 2013

Soraa announced yesterday the next generation of its high external quantum efficiency GaN on GaN LEDs.


New type of LED produced with simple, low cost process

Mon, 1 Jan 2013

Professor Yue Kuo at Texas A&M University has fabricated a new type of LED, based on light emission from an ultra-thin amorphous dielectric layer.     


FOREPI signs multiple order for AIXTRON production system

Tue, 2 Feb 2013

AIXTRON SE today announced that, in the third quarter of 2012, long-term customer Formosa Epitaxy Inc. (FOREPI), Taiwan, placed a new order for multiple CRIUS II-L MOCVD production systems in a 69x2-inch configuration. All systems will be used for the manufacturing of ultra-high brightness (UHB) GaN-based blue and white LEDs.


Lux Research names top firms in LEDS and power electronics

Tue, 2 Feb 2013

As power electronics grow to $15 billion and LEDs to $100 billion, Lux Research identifies the leading technology companies addressing these markets.


GT Advanced Technologies to produce low-cost GaN template substrates with Soitec

Mon, 2 Feb 2013

HVPE system expected to lower the cost of LED production and accelerate adoption in commercial and residential lighting.


Scientists develop multicolor LEDs without heavy metals

Mon, 2 Feb 2013

Silicon nanocrystals have a size of a few nanometers and possess a high luminous potential. Scientists of Karlsruhe Institute of Technology (KIT) and the University of Toronto/Canada have now succeeded in manufacturing silicon-based light-emitting diodes (SiLEDs). They are free of heavy metals and can emit light in various colors.


Fab Spending Forecast: Equipment spending is expected to remain flat in 2013

Wed, 3 Mar 2013

Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.


Displaybank releases forecast and analysis of the OLED lighting market

Tue, 3 Mar 2013

Recently, as the importance of environmental protection grows, the method of saving energy of products and using eco-friendly materials is on the rise. Of these, since lighting accounts for about 20% of the overall power consumption, the efforts to replace with high-efficiency and eco-friendly products are being made actively.


ams introduces intelligent flash LED driver

Tue, 3 Mar 2013

LED driver matches flash LED input current with safe output capability of battery – in real time.


Cree announces volume production of second generation SiC MOSFET

Wed, 3 Mar 2013

Cree, Inc. announces the release of its second generation SiC MOSFET, enabling systems to have higher efficiency and smaller size at cost parity with silicon-based solutions. These new 1200V MOSFETs deliver power density and switching efficiency at half the cost per amp of Cree’s previous generation MOSFETs.


LED-based street lighting market forecasted to surpass $2 billion in 2020

Thu, 2 Feb 2013

Dramatically falling costs and improvements in efficiency are driving increased sales of light emitting diode (LED) lamps for street lighting. Costs have fallen as much as 50% over the past two years and are expected to continue falling. By 2015, LEDs will become the second-leading type of lamp for street lights in terms of sales, behind only high pressure sodium lamps, according to a new report from Pike Research, a part of Navigant’s Energy Practice. By 2020, the study concludes, LED lamps for street lights will generate more than $2 billion in annual revenue.


NEWLED aims to revolutionize the way the world is lit

Tue, 2 Feb 2013

The way the world is lit up could be revolutionized by a new European-wide research project being led by the University of Dundee.


Crystal IS announces record performance from a single chip UVC LED

Thu, 3 Mar 2013

Higher performance UVC LEDs help to realize ever more increasing range of customer applications including scientific instrumentation and water disinfection.


The UV LED market is booming

Mon, 3 Mar 2013

Yole Développement announced today its new report “UV LEDs: Technology & Application Trends” which presents UV LED new applications and associated market metrics for the period 2012-2020, and a deep analysis of UV LED technology and UV LED lighting industry.


Student develops brighter, smarter and more efficient LEDs

Fri, 3 Mar 2013

Rensselaer Polytechnic Institute student Ming Ma has developed a new method to manufacture light-emitting diodes (LEDs) that are brighter, more energy efficient and have superior technical properties than those on the market today.


New packaging system broadens array performance while reducing the cost of LED lighting

Thu, 3 Mar 2013

Bridgelux, a developer and manufacturer of LED lighting technologies and solutions, today unveiled the Vero LED array, a new lighting platform that simplifies design integration and manufacturing and gives designers a more flexible LED lighting solution.


Modern power design challenges to be discussed at APEC 2013

Wed, 3 Mar 2013

ON Semiconductor will demonstrate new digital AC-DC PWM controllers, motor drivers and IGBTs at industry’s premier power electronics show.


Plessey is first to release GaN on silicon LEDs

Mon, 4 Apr 2013

Plessey today announced that samples of its Gallium Nitride (GaN) on silicon LED products are today available. These entry level products are the first LEDs manufactured on 6-inch GaN on silicon substrates to be commercially available anywhere in the world.


University of Cambridge researchers seek to further reduce cost and improve efficiency with GaN LEDs

Fri, 4 Apr 2013

A new £1million (or US$1,530,700) growth facility will allow University of Cambridge researchers to further reduce the cost and improve the efficiency of LEDs, with potentially huge cost-saving implications.


Samsung launches Zhaga-compliant LED linear modules with 145lm/W efficacy

Thu, 4 Apr 2013

Samsung Electronics Co Ltd of Seoul, South Korea has introduced a new lineup of Zhaga-compliant LED H-Series linear modules with high efficacy and light quality, as well as color consistency for use in a wide range of LED lighting applications including ambient lighting and linear fixtures.


Oxford Instruments’ newest tool streamlines batch production for HBLED

Mon, 3 Mar 2013

Oxford Instruments Plasma Technology has just announced an evolution in batch etch technology with the launch of the PlasmaPro 1000 Astrea etch system, a large batch etch solution for PSS, GaN and AlGaInP that will offer HBLED production manufacturers high throughput.


Global LED lighting market will be worth $25.4 billion in 2013

Wed, 3 Mar 2013

The global LED lighting market will be worth $25.4 billion in 2013, representing 54% growth on the 2012 figure of $16.5, while the LED lighting penetration rate will also rise to 18.6%, according to a new DIGITIMES Research Special Report titled "Global high-brightness LED market forecast."


Aledia makes its first LEDS on 8-inch silicon wafers using microwire technology

Wed, 3 Mar 2013

Aledia, a developer of LEDs-based on disruptive microwire GaN-on-Silicon technology, announced today that it has made its first LEDs on 8-inch (200mm) silicon wafers.


Veeco MOCVD chosen for CEA-Leti and Aledia’s new nano-LED venture

Wed, 4 Apr 2013
p>Veeco Instruments Inc. announced today that CEA-Leti, a research lab based in Grenoble, France, has selected Veeco’s TurboDisc K465i Metal Organic Chemical Vapor Deposition (MOCVD) system for its program with Aledia, its nanowire-LED partner.


LED cooling tech attracts investors to Nuventix

Tue, 7 Jul 2011

Nuventix, LED cooling technology developer, received capital from GE (NYSE:GE) and other investors. GE will also license Nuventix's patent portfolio.


Present at Strategies in Light Europe 2012

Mon, 12 Dec 2011

Strategies in Light Europe 2012, September 18-20 in Munich, Germany, is accepting abstracts through February 17. Strategies in Light Europe covers the rapidly growing LED lighting industry.


LED-test-standards-talk-with-Poppe-MENT

Wed, 3 Mar 2011

Comprehensive LED testing. SOURCE: Mentor GraphicsAndrás Poppe, PhD, marketing manager in Mentor Graphics' MicReD division, discusses LED testing challenges, such as neglected power flux, LED cooling, and the gap between lab and real operating conditions.


SEMICON Taiwan preview: Forums span key technology, markets

Tue, 8 Aug 2011

SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.


March 2008 SST Exclusive Feature:
Special Report Series: ISS and SMC

Mon, 3 Mar 2008
By SST Editorial Staff

The SST Editorial Staff recaps SEMI's recent Industry Strategy Symposium (ISS), and the Strategic Materials Conference (SMC) that followed, with this special report series available only on our website.

SMC highlights PV, LED, packaging materials

Wed, 1 Jan 2008
Last week hundreds of microelectronics industry executives gathered at ISS and SMC, absorbing the conventional forecasts for semiconductor manufacturing equipment and materials. But on the technology side, SMC showed truly amazing perspective on new electronic materials markets of gigantic scales like photovoltaics, high-efficiency lighting, and advanced 3D and WLP packages.

US, EU, Asia officials squash MCP tariffs

Thu, 11 Nov 2005
November 4, 2005 - Officials from the US, Europe, Japan, South Korea, and Taiwan have agreed to eliminate duties on multichip packages (MCP) beginning in January 2006, praised by industry associations as a gesture of support for fast-growing technology areas.

Amtech Systems Announces $8.9M in Solar Orders

Mon, 12 Dec 2007
(December 17, 2007) TEMPE, AZ —Amtech Systems Inc., a global supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and silicon wafers, today announced that its subsidiary, Tempress Systems Inc., has received an additional $8.9 million in orders for diffusion processing systems from the solar cell industry.

Early MEMS Accelerometer Adopters See Profits Roll In

Thu, 11 Nov 2007
(November 15, 2007) SCOTTSDALE, AZ — Accelerometers — devices that sense motion — have been with us for a long time, but only recently have they have been miniaturized as silicon-based devices. Consumer electronics makers who saw their hidden potential and built new products such as Nintendo's Wii, Apple's iPhone, and Activision's "Guitar Hero" game around them have achieved huge market success by revolutionizing the user-interface.

The Latest in LED Packaging

Thu, 11 Nov 2007
(November 15, 2007) SAN JOSE, CA and SANTA CLARA, CA — Two companies have recently launched new LED packaging products. Philips Lumileds has launched its new cool-white LUXEON K2 with TFFC LED that is designed, binned and tested for standard operation at 1000 mA and can be driven at 1500 mA. In addition, LedEngin Inc. has announced its 10W, multiwavelength RGBA emitter, the LZ4-00MA10, which contains individually addressable dies in an 7mm square power LED package.

Quantitative cathodoluminescence microscope debuts from Attolight

Thu, 8 Aug 2011

Attolight AG is launching a quantitative cathodoluminescence system with nanoscale resolution and picosecond timing for research and product development in semiconductor, ceramics, advanced materials, geological, solar panel, and LED sectors.


UTEK Corp. sells LED technology to Cyberlux

Mon, 11 Nov 2006
UTEK Corp., a specialty finance company focused on technology transfer, and Cyberlux Corp., a provider of LED lighting solutions, announced that Cyberlux has acquired SPE Technologies Inc., a wholly owned subsidiary of UTEK Corp., in a restricted stock transaction.

Emergence of low price LED solutions are pushing technology adoption toward general lighting

Wed, 9 Sep 2013
Growth of the LED industry has come initially from the small display application and has been driven forward by the LCD display application.

Cree introduces industry’s first $99 LED street light

Tue, 8 Aug 2013

Cree, Inc. today announced a technology breakthrough for the LED street lighting market.


New multi-chip-LEDs provide a broad bright blue color range

Tue, 8 Aug 2013

Colors are playing an increasingly important role in the automotive sector. Consumers can not only choose the exterior color of the vehicle, you can also tailor the interior lighting to the customer’s individual taste.


LED oversupply likely to continue as suppliers add production capacity

Fri, 8 Aug 2013

Despite a major surplus in the light-emitting diode (LED) market, top suppliers are increasing their capital spending and production because of government incentives and in order to cash in on an expected boom in the lighting business.


Demand for key raw material set to double as LED market booms

Wed, 8 Aug 2013

Global demand for precursor, a material used in manufacturing of light-emitting diodes (LEDs), is set to more than double from 2012 to 2016, as the market for LED lighting booms.


Device for capturing signatures uses tiny LEDs created with piezo-phototronic effect

Mon, 8 Aug 2013

Researchers at the Georgia Institute of Technology want to put your signature up in lights – tiny lights, that is. Using thousands of nanometer-scale wires, the researchers have developed a sensor device that converts mechanical pressure – from a signature or a fingerprint – directly into light signals that can be captured and processed optically.


Cost competitiveness of 6-inch LED chips outstrip that of 4-inch by 2015

Fri, 8 Aug 2013

Displaybank's recent market report on the cost competiveness of LED chips. This report conducts a thorough analysis on the supply price history, trends and forecast of main materials that compose packaged LEDs across the entire LED value chain.


Smart lighting market to grow 37% between 2013 and 2018

Wed, 7 Jul 2013

At present, Europe has the largest market for smart lighting especially in commercial industrial buildings, outdoor lighting, and automobiles applications.


Epi-wafer market to grow to $4 billion in 2020 as LED lighting zooms to $80 billion

Thu, 7 Jul 2013

GaN-on-Sapphire remain the entrenched incumbent; leading challenger GaN-on-silicon will gain only a 10 percent market share, Lux Research says.


Annual revenue for networked lighting controls will surpass $5.3B by 2020

Fri, 8 Aug 2013
The market for lighting controls in commercial buildings has entered a period of dramatic transformation, as the demand for both local controls rises.

New kind of ultraviolet LED could lead to portable, low-cost devices

Tue, 9 Sep 2013
Commercial uses for ultraviolet (UV) light are growing, and now a new kind of LED under development at The Ohio State University could lead to more portable and low-cost uses of the technology.

The US lighting control systems industry: A market in transition

Thu, 11 Nov 2013
The lighting control systems marketplace has been in a state of transition in recent years. Changing energy efficiency codes, new construction project increases, wireless technology benefits, increases in LED lighting adoption and conservation initiatives have been the key factors driving the growth of the lighting control systems market in the US.

LED applications to be key drivers for bulk GaN market

Thu, 10 Oct 2013
In either a cautious or a more aggressive scenario, LED applications will certainly be the key drivers for the bulk GaN market, according to Yole Développement.

QEOS announces advanced LED lighting system

Mon, 11 Nov 2013
Quantum Electro Opto Systems Sdn. Bhd. (QEOS), a leading innovator in LED technology, announced today that it is entering the LED lighting and LED lighting systems business

SemiLEDs introduces 10W integrated RGBW LED

Mon, 11 Nov 2013
SemiLEDs Corporation today announced the introduction and release of the 10-Watt M63 RGBW integrated 6363 LED.

Seoul Semiconductor introduces next generation of high power LEDs

Mon, 11 Nov 2013
The improved efficacy helps lighting manufacturers use fewer LEDs in their system designs which translate to lower system costs.

Dow Corning newest moldable optical silicone expands options for more reliable LEDs

Tue, 11 Nov 2013
Dow Corning introduced new Dow Corning MS-2002 Moldable White Reflector Silicone here at Strategies in Light Europe 2013.

Rubicon Technology appoints Warren Stewart as Senior VP of Sales and Marketing

Thu, 11 Nov 2013
Rubicon Technology, Inc. today announced that Warren S. Stewart III has joined the Company as Senior Vice President of Sales and Marketing, effective immediately.

Nikkiso initiates shipments of deep ultraviolet LEDs

Thu, 12 Dec 2013
NIKKISO CO. has announced that it has initiated shipments of commercial LED product samples emitting at a range of wavelengths in the UVB and UVC spectral regimes for industrial, biomedical, and environmental applications.

GaN-on-silicon LEDs forecast to increase market share to 40% by 2020

Thu, 12 Dec 2013
The penetration of gallium nitride-on-silicon (GaN-on-Si) wafers into the light-emitting diode (LED) market is forecast to increase at a compound annual growth rate (CAGR) of 69 percent from 2013 to 2020, by which time they will account for 40 percent of all GaN LEDs manufactured.

Xicato expands and brings manufacturing to San Jose, California

Thu, 1 Jan 2014
Company more than doubles its space to accommodate new LED light module manufacturing line in Silicon Valley.

Universal Lighting Technologies announces corporate headquarters office relocation

Fri, 1 Jan 2014
Universal Lighting Technologies, Inc. is starting the year on a high note with the announcement of its new corporate headquarters at 51 Century Blvd., Suite 230 in Nashville, Tennessee.

Global LED chip market and forecast 2014

Fri, 1 Jan 2014
Research and Markets has announced the addition of the "Global LED Chip Market & Forecasts Report, 2016" report to their offering.

Soraa launches high color rendering, line voltage GU10 230V LEDs

Wed, 1 Jan 2014
Soraa, a provider of in GaN on GaN LED technology, launched today the first line of high color and white rendering, high light output LED GU10 230V dimmable lamps.

NIKKISO establishes new production facility for deep ultraviolet LEDs

Thu, 1 Jan 2014
The company will initiate production operations in mid 2014 and install an annual capacity in excess of 1 million units for its UVB and UVC LED illumination sources.

MCA appoints Brian Fisher as General Manager

Wed, 2 Feb 2014
MCA Public Relations announced it has launched a new solid-state lighting (SSL) practice specifically designed to target companies from the multiple segments of the SSL ecosystem to create unique branding and communications campaigns for each.

Soraa develops the world's most efficient LEDs

Mon, 2 Feb 2014
Soraa announced today the world’s most efficient LED, which it will integrate into the market’s first full-visible-spectrum, large form factor lamps.

EVG and Brisbane Materials introduce novel anti-reflective coating solution for LED lighting applications

Tue, 2 Feb 2014
The jointly developed manufacturing solution enables lumen output increases of up to eight percent.

Cree introduces the industry's most powerful SiC Schottky diodes

Wed, 3 Mar 2014
Cree today introduced the new CPW5 Z-Rec high-power silicon-carbide (SiC) Schottky diodes, the industry’s first commercially available family of 50 Amp SiC rectifiers.

Double digit growth for China LED production in 2014

Mon, 3 Mar 2014
Following the boom in expansion of the Chinese LED market in 2011, many industry insiders and analysts speculated on whether the Chinese would be able to sustain the growth, or if many companies simply ordered an excessive amount of MOCVD reactors just to benefit from government subsidies.

GaN-on-Si enables GaN power electronics, will LED transition as well?

Wed, 3 Mar 2014
Today, GaN on Sapphire is the main stream technology for LED manufacturing. GaN-on-Si technology appeared naturally as an alternative to sapphire to reduce cost.

New technique makes LEDs brighter, more resilient

Fri, 3 Mar 2014
Researchers from North Carolina State University have developed a new processing technique that makes light emitting diodes (LEDs) brighter and more resilient by coating the semiconductor material gallium nitride (GaN) with a layer of phosphorus-derived acid.

Samsung introduces new flip chip LED packages

Thu, 3 Mar 2014
Samsung today introduced a new lineup of flip chip LED packages and modules offering enhanced design flexibility and a high degree of reliability.

Leti to demonstrate wireless high data rate Li-Fi prototype

Thu, 3 Mar 2014
CEA-Leti will demonstrate its new prototype for wireless high data rate Li-Fi (light fidelity) transmission at Light + Building 2014 in Frankfurt, Germany, March 30-April 4. The technology employs the high-frequency modulation capabilities of light-emitting diode (LED) engines used in commercial lighting.

Dow Corning moves to defend Chinese patent for LED optical silicone encapsulants

Thu, 4 Apr 2014
Dow Corning filed a complaint through its Chinese subsidiary and licensee with the Shanghai First Intermediate Court.