The 2011 iNEMI Roadmap, published by the International Electronics Manufacturing Initiative (iNEMI), includes a new chapter on MEMS and sensors, and an expanded chapter on packaging to include substrates discussions.
The SMTA released its call for presenters for SMTA International (SMTAI) 2012, October 14-18 in Orlando, FL. The association, along with Chip Scale Review magazine, also announced the keynote for the International Wafer-level Packaging Conference (IWLPC), held November 5-8, San Jose, CA.
Tessera appointed Rick Neely, Jr. as EVP and CFO, responsible for the company
Global Semiconductor Alliance (GSA) recently named Jay Esfandyari, STMicroelectronics, as its MEMS Working Group chairman and Ken Potts, Cadence Design Systems, as the 3D IC Working Group chairman.
Day 3 of the 15th IITC (International Interconnect Technology Conference) opened in San Jose, CA under clear sunny skies and a pleasant breeze. The herd thinned a bit, down to ~150 hearty souls from the original 230 the prior two days.
SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.
Karen Lightman, the Managing Director of the MEMS Industry Group, blogs from the MEMS Executive Congress Europe, which was held March 20th, in Zurich, Switzerland.
Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.
Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.
The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.
JP Sercel Associates, Inc. (JPSA) expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques.
Tokyo Electron Ltd. (TEL) restructured its organization, with a new "Organic EL Division" established under GM Takeshi Okubo, as well as other new and consolidating subsidiaries in the semiconductor and liquid crystal production segments.
SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.
CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.
MATHESON debuted the Lasso System, a customer-centric supply chain and inventory management system that can monitor the location and operating status of gas products and other assets in the REAL-Time Gas and Asset Management System.
Edwards Limited uncrated the STP-iXR1606 series magnetically-levitated turbo-molecular pumps (TMP) with fully integrated onboard controllers. Its new rotary design improves throughput by about 40% at high gas flow rates; nearly 90% percent in maximum gas flow.
The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.
Researchers at INCDTIM in Romania will use NanoInk's NanoFabrication Systems Division's DPN 5000 system for supramolecular structure fabrication, molecular recognition and self-assembling process applications.
36% of semiconductor fabs are in high-risk zones, finds Semico, noting the industry disruptions caused by the Japan earthquake and tsunami and Thai flooding and the challenges these presented to chip makers in the regions.
Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.
Texas Instruments awarded 15 of its 12,000 suppliers with Supplier Excellence Awards for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality.
The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “Competing for R&D Dollars,” moderated by Solid State Technology Editor-in-Chief Pete Singer.
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: electronic skin, energy storage with nanowires, printable inks, gas sensing, inkjet printing, semiconductor polymers for organic devices, CNTs, OFETs, touch screen fabrics, and the coffee breaks.
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.
At International Solid-State Circuits Conference (ISSCC), imec and Holst Centre are presenting 14 papers on low-power design for wireless communication and wireless sensor networks, and organic electronics.
MIT researchers used gases to precisely control nanowires' width and composition as they grow, which could yield complex structures optimally designed for particular applications, like LED substrates or solar panels.
The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 – April 19, 2012, in Anaheim, CA.
The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.”
IEEE International Electron Devices Meeting (IEDM) is seeking original presentations on microelectronics research and development, with a focus on silicon and non-silicon device and process technology, circuit/device interactions; energy-harvesting, biomedical, and power electronics; magnetics and spintronics; and other topics.
SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.
Contributing editor Steve Groothuis reviews a book titled “Energy Harvesting for Autonomous Systems (Smart Materials, Structures, and Systems).” The book highlights the progression from the basic principles behind energy harvesting to the comprehensive systems that control the sensing, actuation, and transmission of those devices.
MEI uses Vycom Flametec PVC-C for chemical rinse tanks and other wafer-contacting elements of its process tools, reducing tool-based contamination and protecting fab workers. Bill McGinty, MEI operations manager, discusses the benefits the new-generation plastic for semiconductor fab tools.
Researchers from North Carolina State University have developed the first functional oxide thin films that can be used efficiently in electronics, opening the door to an array of new high-power devices and smart sensors.
In case anyone needed a reminder or a wake-up, new data from SEMI reiterates chip tool sales are slumping badly in the latter part of this year.
SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.
The Global Semiconductor Alliance (GSA) says it has formed a Technology Steering Committee to help address key business and technology areas of interest to its members, and "encourage the advancement and adoption of leading technology and practices."
In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
With this week's IEEE International Electron Devices Meeting (IEDM 2012) now underway, here are four of the papers that were accepted late: on 90nm integrated silicon photonics, ZnNO for next-gen displays, and III-V TFETs for the 7nm node.
STMicroelectronics has a new strategic plan that will focus on five product areas (MEMS/sensors, smart power, automotive products, microcontrollers, and application processors), and also exit its mobile chip JV with communications giant Ericsson.
Semiconductor equipment demand is persistently sluggish as the industry takes a break from a "multiyear expansion period" to digest recent investments and wrestle with a broader economic slowdown, acknowledges SEMI in its updated year-end forecast. But make no mistake: leading-edge technology investments are still happening, and growth will return in the typical cyclical pattern.
KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.
MIPI Alliance has formed an open "Birds of a Feather" (BoF) group that will investigate the requirements related to integrating sensors into mobile systems. The group will address challenges facing the sensor and wireless markets.
EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.
The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.
Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.
We've scanned the entire conference program for next week's 58th annual IEEE International Electron Devices Meeting (IEDM), to present a quick sampling of some of the more intriguing papers.
Nikon and the Singapore A*STAR IME are jointly setting up a R&D lab to develop optical ArF lithography technology for semiconductor manufacturing to and below the 20nm device node.
Global spending on wafer fab equipment (WFE) is now on pace to finish 2012 with a -17% annual decline, and 2013 now looks like it'll only be slightly better at a -10% dropoff, before the next cyclical spending upturn begins in 2014, according to an updated forecast from Gartner.
Canon U.S.A., Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors.
Edwards (NASDAQ:EVAC) introduced the new iXH645H dry pump, optimized for metal-organic chemical vapor deposition, a key step in LED and compound semiconductor manufacturing.
JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.
Terry Brewer, one of the newest members of SEMI's North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution.
The first MEMS Business Forum, sponsored by MEMS Journal and MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 24 at the Santa Clara Biltmore Hotel. Ten speakers presented on topics ranging from near- and mid-term business opportunities to roles of MEMS in broad visions for the future.
At imec's International Technology Forum, Denis Wirtz, co-director of the John Hopkins Institute for NanoBio Technology, described the latest efforts to fight cancer.
At imec's International Technology Forum, Roel Baets, director of the Centre for Nano- and Biophotonics Ghent University, Belgium, said silicon photonics will drastically change the way bio research is conducted.
At imec’s International Technology Forum, Peter Peumans, department director bio-nano electronics of imec, described promising examples of : technologies that connect biology and Microsystems: Biotechnology: bioreactors, neuroprobes, high speed cell inspection, and high-throughput molecular analysis.
We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.
In mid-2011, semiconductor manufacturing and assembly equipment supplier Applied Materials (NASDAQ:AMAT) acquired Varian Semiconductor Equipment Associates Inc. Now, the company is adding Varian’s former CEO Gary Dickerson as president.
Singapore's Institute of Microelectronics (IME) and MOSIS have signed a memorandum of understanding (MOU) to offer a multiple-project wafer service targeting silicon integrated photonics.
Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.
Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.
Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”
Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.
Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.
Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy, the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.
At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.
The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.
Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.
Market demand for new sensors will lead to a $6.4B market by 2018.
For the first time ever, no clear winner has emerged to claim top honors in the MEMS business for 2012, with Bosch of Germany and French-Italian STMicroelectronics ending up evenly splitting the title of No. 1 supplier for the year.
In an industry where finer features are driving market needs, current deposition processes are no longer sufficient to address challenges like interconnect dimensions below 16/14nm or high aspect ratio TSVs (>8) without experiencing defects, voids, or low reliability.
In the development of new MEMS products, the team is the most important factor.
Since the start of production in 1995, Bosch has manufactured well in excess of three billion MEMS sensors.
Fab equipment spending will grow two percent year-over-year (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.
CEA-Leti will host a workshop for industrial companies to present its latest advances in MEMS and an overview of the success of its recent MEMS startup, Wavelens, during Transducers’ 2013 and Eurosensors XXVII in Barcelona, Spain.
MEMS Industry Group (MIG), a global industry organization with more than 140 member-companies and partners, will welcome micro-electromechanical systems (MEMS), medical industry and academic experts to Cambridge, Mass. for Member-to-Member (M2M) Forum 2013, a conference on the MEMS connection to advancements in healthcare, medical and biomedical applications.
MEMS pressure sensors will achieve accelerated growth this year and become the leading type of MEMS device, driven by increasing use in automotive and the fast-growing handset space, according to insights from the IHS iSuppli MEMS & Sensors Service from information and analytics provider IHS.
Once again demonstrating Apple’s power to ordain winners in the electronics supply chain, the top suppliers last year of microelectromechanical systems microphones were those that provided devices for iPhones and iPads.
IMT, the largest pure-play MEMS foundry in the US, announced today the appointment of MEMS industry pioneer and technology visionary Dr. Kurt Petersen to the IMT board of directors.
Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.
From smart wristwatches that record heart rates, to intelligent armbands that track physical activities, wearable electronics and fitness monitoring devices are attracting increased attention from health-conscious consumers, causing shipments of MEMS sensors used in these products to more than quadruple in just five years.
Combo MEMS sensors for automotive applications are off to another exhilarating ride this year as revenue continues to climb, spurred by rapidly accelerating use in car safety systems.
The fast growing market for sensors for smart phones is re-shuffling the ranks of MEMS suppliers. For the first time, suppliers of inertial sensors have surpassed the major makers of micro mirrors and inkjet heads that have long dominated the industry on Yole Développement’s annual ranking of the Top 30 MEMS companies.
The gyroscope market is driven by mobile applications, where until recently only two players, STMicroelectronics (ST) and InvenSense, were competing.
TESEC Corporation today announced the development and sales of the ULTRA MEMS Handler, targeting Inertial (Accelerometer, Gyroscope and Magnetometer) MEMS devices.
Sensors and optoelectronics will continue to grow faster than the mainstream semiconductor market. We currently expect 9%-13% growth in these sectors in 2013, accompanied by rapid changes in technology and market structures.
While the consumer market continues to evolve and the demand for better, faster, smaller increases even further, MEMS should continue to grow and find success as they are designed into more and more devices.
The multibillion-dollar secondary or used semiconductor equipment market has gone through significant changes over the past five years and has become increasingly sophisticated in its approach.
It is becoming increasingly clear that new MEMS and 3D high-volume, low-cost manufacturing technologies will accelerate a radical change to society’s cyber skyline.
The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.
The global market for MEMS microphones has reached approximately $422 million in 2012. The market is predicted to increase to $865 million in 2017.
Microelectromechanical (MEMS) devices are shaping the competitive landscape in the global medical device industry.
Tronics kicks-off the industrialization of a unique piezoresistive nanowire MEMS technology that can take 9 DOF motion sensors to a new level of competitiveness.
In the second article of the MEMS new product development blog, the importance of the first prototype will be discussed.
STMicroelectronics and the University of Amsterdam Faculty of Science have announced that a sophisticated bird-tracking system developed by the university is using advanced MEMS sensing technology from ST.
A strong uptake in consumer and mobile devices will power the market for microelectromechanical systems (MEMS) to solid revenue growth in 2013, with breakthroughs in new sensor applications also expected this year, according to insights from the IHS iSuppli MEMS service at information and analytics provider IHS.
A*STAR’s Institute of Microelectronics, or IME, and Stanford University will collaborate to advance innovations in nano-electromechanical systems (NEMS) switch technology for ultra-low power digital systems.
Smartphones and media tablets continue to the prime movers of technology industries, with the two mobile platforms spurring a double-digit increase in the market for microelectromechanical system (MEMS) motion sensors this year.
memsstar Limited announced two etch system order wins from new MEMS customers in Asia
MEMS Industry Group (MIG) will host its second annual MEMS Executive Congress® Europe, March 12, 2013 in Amsterdam.
DARPA researchers have recently demonstrated the most complex 2-D optical phased array ever. The array, which has dimensions of only 576µm x 576µm is composed of 4,096 (64 x 64) nanoantennas integrated onto a silicon chip.
In its new report MEMS Front-End Manufacturing Trends, Yole Développement goes further in the equipment and materials market forecasts and in the manufacturing trends for MEMS. The report gives detailed analyses about MEMS device technology process flow, manufacturing trends and manufacturing cost breakdown.
JEDEC Solid State Technology Association, a developer of standards for the microelectronics industry, announced today that its Board of Directors has appointed two new members: Mr. Jong H. Oh, Vice President, SK hynix and Mr. Hung Vuong, Qualcomm.
InvenSense, Inc. and Avnet Memec this week announced the formation of a pan-European distribution agreement. With the new partnership, Avnet Memec is chartered with sales and support for InvenSense’s MotionTracking devices throughout Europe and Israel.
Shipments of MEMS microphones in 2012 amounted to 2.05 billion units, up 57% from 1.30 billion in 2011, according to IHS iSuppli. Shipments will climb by another 30% to 2.66 billion units in 2013, to be followed by at least three more years of notable double-digit-rate increases.
Yole Développement’s research has credited STMicroelectronics for capitalizing on the booming demand for MEMS in mobile devices by shipping 58% more MEMS units in 2012, to become the first company to reach $1 billion in MEMS sales.
Integrated Device Technology, Inc. yesterday announced the industry’s first differential MEMS oscillators with 100 femtosecond (fs) typical phase jitter performance and integrated frequency margining capability.
Roger Grace to present MEMS Commercialization Report Card at annual international technical forum.
Global electronic components distributor Digi-Key Corporation today announced the signing of a global distribution agreement with MEMSIC, a provider of MEMS sensor components, sophisticated inertial systems, and leading-edge wireless sensor networks.
How the semiconductor industry can create the next generations of nanoscale computing technology will be one of the themes of the 2013 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics, to be held at the National Institute of Standards and Technology (NIST), March 25-28, 2013, at its campus in Gaithersburg, Md.
Latest offerings enhance power efficiency and miniaturization for smart meters, industrial machinery and medical devices.
Shipments this year are expected to double to 162 million units, as presented in the attached figure, primarily due to Samsung’s usage of pressure sensors in the Galaxy S4 and other smartphone models.
STMicroelectronics has introduced the world's smallest TVS diode for protecting sensitive electronics in consumer products and handhelds.
STMicroelectronics has begun working with research partners to develop a pilot line for next-generation MEMS devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging. The project was launched by the European Nanoelectronics Initiative Advisory Council (ENIAC) Joint Undertaking (JU), a public-private partnership in nanoelectronics.
Brewer Science, a developer of lithography enhancement materials for semiconductor manufacturing, announces the installation of a scale-up reactor to increase production of its CNTRENE C100 family of electronics-grade CNT materials by tenfold.
China-based manufacturers of cellphones and tablets in 2012 more than doubled their share of purchases of MEMS motion sensors, reflecting the rising prominence of the companies in the global market, according to an IHS iSuppli MEMS Topical Report from information and analytics provider IHS.
SiTime Corporation, one of the fastest growing semiconductor companies, today introduced the SiT15xx family of 32 kHz MEMS oscillators that are intended to replace legacy quartz crystal resonators.
MEMS pressure sensor is one of the very first MEMS components appearing in the microsystem world. The technologies are quite mature and the market is big and expected to grow from $1.9B in 2012 to $3B in 2018.
Analog Devices ADMP801 MEMS microphone delivers 27 dBA EIN, consumes only 17 µA at 1 V supply, and is available in a 7.3 mm³ package.
The high-value microelectromechanical system (MEMS) market experienced soft growth last year, mainly due to weakness in the mainstay medical electronics and industrial sectors, according to an IHS iSuppli MEMS High-Value MEMS Market Tracker Report from information and analytics provider IHS.
A year ago, the microtechnology, nanotechnology, and advanced materials industry looked out on the year 2012 with quite positive expectations. As it turned out, the unstable economic situation has left its mark on these industries, too. For 2013, at least, the companies expect a slight upwards trend.
United Microelectronics Corporation (UMC) launched the A+ technology platform, a specialized 0.11
The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.
ULVAC Inc. developed the ENTRONTM-EX2 W300 CVD-Ni/CVD-Co system for CVD-Ni and CVD-Co silicidation of 3D semiconductor gates and MEMS. The system is a response to a semiconductor industry transition from PVD to CVD in advanced 3D gate structure film step coverage, ULVAC reports.
SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.
imec is presenting a record number of 17 papers at the IEEE International Electron Device Meeting (IEDM), ending today in Washington, DC.
SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.
While the market has currently softened, early-2011 momentum will carry the year's semiconductor silicon sales to a higher total than 2010, said Stanley T. Myers, president and CEO of SEMI, noting the figures are an industry record. Growth will continue at "modest levels" through 2013.
DALSA Semiconductor VP/GM Claude Jean talks with SST about the new $218M microelectronics center being formed in Quebec, and how the company will contribute to its focus on MEMS and 3D wafer-level packaging and vice-versa.
Among a spate of presentations at IMEC's annual Technology Forum this week, the European R&D consortium trotted out a new program for foundries and fabless companies, an "incubation" pact with TSMC, and developments in multithreading and radio chips.
Processing and characterization of a positive thick photoresist
OVERVIEW There is increasing interest in the thick, positive, epoxy-based photoresist made of the material AZ P4620 because of its wide applications in micro-fluidic devices and micro-electromechanical systems (MEMS). The optimization of polymerization for this material under near ultraviolet (UV) lithography...
A crowd of Japanese suppliers are gambling that rising demand for MEMS devices for high volume products is about to spur a real volume market for production tools and services. There are now 20 Japanese companies offering microelectromechanical foundry services and 12 supplying MEMS etching equipment, according to a recent report from PennWell partner Nikkei Microdevices.
Yole Développement shares highlights from its latest "Status of the MEMS Industry" report, noting changes in the MEMS supply chain as companies add foundries or go fab-lite, and multi-chip MEMS packages create new relationships between companies.
Commercializing MEMS can take years and millions of dollars. While the MEMS industry shares some aspects with the larger semiconductor industry, the comparison is not fair in product development. Karen Lightman, MEMS Industry Group and Alissa M. Fitzgerald of A.M. Fitzgerald & Associates explain what makes developing new MEMS devices so hard.
Both graphene and carbon nanotubes (CNT) suit applications from flexible displays to silicon-replacing transistors. In a relatively short time, graphene has emerged as a low-cost, tunable material for all kinds of electronics. Will graphene overtake CNTs as the nanomaterial of future devices?
NIST developed a method to etch diamond crystals, exploiting the cubic nature of diamond crystals. These diamond-etched features could lead to better micro electro mechanical system (MEMS) devices.
Lemoptix and Hamamatsu Photonics signed a long-term collaboration agreement to develop, industrialize and commercialize micro optical electro mechanical system (MOEMS) laser scanning and microprojection devices.
MIT named Vladimir Bulović as director of MIT's Microsystems Technology Laboratories (MTL). Bulović has experience in a range of advanced electronics technologies, from photovoltaics to MEMS.
The maturing MEMS market and increased adoption of secondary equipment for semiconductor manufacturing have led deposition and etch tool supplier memsstar Limited to expand in Livingston, Scotland. memsstar added new positions in logistics, administration, and skilled and semi-skilled engineering to its jobs roster in conjunction with the expansion.
Submit an abstract now to present at a group of co-located micro/nano manufacturing conferences. MM Live USA 2012 will co-locate with MEMS Live USA and NANO Live USA in Rosemont, IL, March 7-8.
Boston Micromachines Corporation will use a NASA contract to develop better microfabrication processes for deformable mirrors, which will be used in exoplanet imaging research.
Yole studies the evolution of inertial MEMS and magnetometers and provides reverse costing analysis of the MEMS devices in "Technology Trends for Inertial MEMS." The report considers 23 MEMS devices.
Tegal sold over 30 patents from the NLD portfolio, Lots 1-3, covering pulsed-chemical vapor deposition (CVD), plasma-enhanced atomic-layer deposition (PEALD) and NLD.
Imec says it has developed a fT/fMAX 245GHz/450GHz SiGe:C heterojunction bipolar transistor (HBT) device, useful for future high-volume millimeter-wave circuits in various applications.
Wafer supplier IQE released a customizable range of silicon on insulator (SOI) products that IQE reports afford improved thickness and doping control.
EQT III will sell VTI Technologies, leading independent designer and manufacturer of high-performance MEMS sensors, to the publicly listed Japanese electronic components company Murata Manufacturing.
X-FAB Silicon Foundries Group and Senodia Technologies (Shanghai) Co., Ltd today announced they have concluded development and are ramping production of microelectromechanical system (MEMS) gyroscopes for high-volume consumer applications.
mPhase Technologies was granted access to the technical facilities at the Center for Nanoscale Materials, Argonne National Labs, for work on its MEMS Smart silicon membrane, a key component of the mPhase Smart NanoBattery.
MIT researchers developed a glass-stamp-based technique that helps fabricate lab-on-chip sensors at a lower cost than e-beam lithography and in a more reproducible manner than nanoimprint lithography.
Researchers from NIST and University of Colorado Boulder developed a low-power microchip combining microfluidics and magnetic switches to trap and transport magnetic beads.
Helsinki-based ScanNano,a private Finnish R&D firm that specializes in MEMS technology at the nanoscale, has partnered with STMicroelectronics with the goal of combining RF MEMS and CMOS.
Innovative Solutions Bulgaria Ltd. acquired Bulgaria’s largest MEMS fab, built north of Sofia in 2004. This new facility provides space to expand production capacity of AFM products.
STMicroelectronics (NYSE:STM), MEMS maker, named a winner in its 2011 iNEMO Campus Design Contest in China: Sky Worker Team 1 from Tsinghua University. ST operates the open competition in China and Taiwan, and the US.
A multi-institution team has produced a cobalt/iron alloy that could be the basis for a new class of sensors and micromechanical devices controlled by magnetism. The alloy does not use rare-earth elements to achieve its properties.
Applied Materials Inc. (AMAT) launched the Applied Producer Optiva chemical vapor deposition (CVD) system for back-side-illuminated (BSI) image sensor manufacturing. It deposits low-temperature conformal films that boost the low-light performance of the sensor while improving its durability.
Semiconductor Research Corporation (SRC), university-research consortium for semiconductors and related technologies, is working with Cornell University researchers to develop on-chip silicon technologies for mobile devices. The aim is a micro-mechanical resonator for RF MEMS.
Imec and Holst Centre micromachined a vibration-energy harvester with 489µW output power, using piezoelectric material in a MEMS cantilever. The team presented results at IEEE's International Electron Devices Meeting (IEDM) this week in Washington DC.
DelfMEMS SA named Tronics as its micro electro mechanical systems (MEMS) foundry partner. Tronics will manufacture RF MEMS switches for DelfMEMS, with high-capacity runs starting in 2012.
Micrel Inc. (Nasdaq:MCRL) has begun manufacturing MEMS at its San Jose, CA wafer foundry operations, offering 6" wafer fab and tools to produce advanced MEMS devices.
Huntsman Corporation (NYSE:HUN) Advanced Materials division sold its stereolithography resin and Digitalis MEMS manufacturing machine businesses to 3D Systems Corporation (NYSE:DDD) for $41 million in cash.
Micronit opened its MEMS division, specializing in the design, prototyping and manufacturing of MEMS devices and wafers based on glass and silicon.
Sand 9, a MEMS oscillator developer, reports that it has raised $3,095,262 of its 6,190,528 equity funding round, in a recent SEC filing.
The Ontario Centres of Excellence gave the Martin Walmsley Fellowship for Technological Entrepreneurship award, totalling $50,000, to Innovative Processing Technologies Inc.
Measurement Specialties Inc. (NASDAQ:MEAS), sensor designer and manufacturer, entered into an amendment to its senior secured credit facility dated June 1, 2010, among JPMorgan Chase Bank N.A. and certain other parties.
Auburn University chemical engineering researchers William R. Ashurst and Virginia A. Davis were awarded a National Science Foundation grant to investigate cellulose nanocrystals in MEMS.
Optex Systems entered into an MoU with Bridge Semiconductor Corporation to develop and sell thermal systems for a range of military applications. The thin-film ferroelectric technology aims to displace microbolometers for uncooled thermal sensing applications.
Precision Mechatronics Pty Ltd acquired Surfx Technologies, which specializes in high-speed atmospheric plasma technology for MEMS, microfluidics, semiconductors, solar cells, medical devices, and other manufacturing.
Microelectronics experts at Aurrion Inc. are seeking to develop military microelectronics technology for optoelectronic microsystems, under terms of a $13.9 million DARPA contract.
Specialty foundry TowerJazz signed a non-exclusive memorandum of understanding (MOU) with a European entity to transfer processes and projects to India and Brazil, including semiconductor and MEMS devices.
System Plus Consulting releases MEMS CoSim+ V3.0, a comprehensive simulation tool for the non-standard manufacturing process of MEMS sensors.
University of Wisconsin-Madison engineers and physicists have integrated highly piezoelectric single-crystal material onto silicon to fabricate a low-voltage MEMS for communications, energy harvesting, sensing, actuators and other applications.
MEMS foundry Tronics upgraded its Grenoble headquarters and manufacturing facilities, making a more than half a million euro investment, along with new equipment capital expenditures.
Sanmina-SCI Corporation (Nasdaq:SANM) will produce a family of optical components based on Kaiam's MEMS hybrid integration technology.
Aerotech ANT95-R and ANT130-R direct-drive rotary stages offer in-position stability of 0.005 arc sec and incremental motion of 0.01 arc sec using the company's direct-drive technology. They suit disk-drive and MEMS manufacture and test, fiber-optic device alignment, as well as laboratory R&D applications.
Researchers at imec -- Danae Delbeke and Francesco Pessolano -- discuss announcements made in conjunction with Photonics West regarding the research consortium's NVISION program (for advanced imaging solutions) and silicon. Imec's silicon photonics platform allows for the miniaturization of complex photonic functions on a single chip.
USHIO America will start marketing the nano-imprint vacuum ultra violet (VUV) ashing system "CHIPs (Compact HiPower System)" in the US. Incorporated into nano-imprint lithography (NIL) equipment, the CHIPs allows non-contact and damage-free cleaning, surface improvement, and ashing of templates and workpieces.
A two-day seminar later this month in San Jose will offer insights into testing of MEMS inertial sensors and a "strategic plan" to decrease cost and increase efficiency of MEMS device testing.
Yale's Jan Schroers and his team are using a new processing technique to fabricate miniature resonators for microelectromechanical systems (MEMS) as well as gyroscopes and other resonator applications from bulk metallic glasses (BMGs) twice as strong as steel.
Engineers at Oregon State University have invented a new way to use surface-mount adhesives (SMAs) in the production of low-temperature, microchannel heat exchangers. University officials are now seeking a commercial partner in private industry to continue development and marketing of the technology.
Ferroelectric materials were considered exotic semiconductor materials in the past. Thanks to better knowledge and industrialization of these materials, they are increasingly used in many new applications, especially in the MEMS field, says Yole Développement.
Coventor Inc. announced availability of SEMulator3D 2011, the latest version of its virtual fabrication software for semiconductor and MEMS process development organizations. It includes the debut of SEMulator3D Reader.
Using lithography-compatible nano self-assembly, plasma etching, and sacrificial etch release, University of Minnesota researchers created carbon nanotube (CNT) based thin film MEMS/NEMS structures.
To significantly reduce size and power consumption and increase performance of micromirror devices, Lemoptix used semiconductor-like equipment to build micromirrors with actuation based on magnetic and heat-dissipating principles instead of gearings.
SolMateS received investments for the final development of the PiezoFlare 1200 piezoelectric thin film deposition machine. PiezoFlare 1200 is an automated deposition system for PZT thin films on 6" or 8" wafers, based on pulsed laser deposition.
Optics Balzers is offering a portfolio of patterning technologies for producing high-grade optical components. Depending on the application, patterning techniques such as photolithography, laser ablation, or masked coatings are available.
Newport Corporation, lasers and photonics technology provider, introduced the Laser µFAB tabletop laser microfabrication workstation for researchers. Equipped with submicron resolution and a large stage, the tool can perform polymerization and ablation for MEMS, microelectronics, and other applications.
The MEMS Industry Group welcomed Frauhofer Institute for Silicon Technology to its membership. The research facility focuses on microelectronics and microsystems technology. Siconnex, which builds diverse MEMS fab equipment, also joined the association.
poLight will work with SVTC Technologies to optimize its TLens production process for large volumes.
SPTS Technologies received an order for an Omega deep reactive ion etch (DRIE) process module from an Asian MEMS foundry. This marks SPTS' 900th DRIE tool sold.
The Entrepreneurship Innovation Center at Lorain County Community College in Ohio hosted a groundbreaking ceremony today for its Richard Desich SMART Commercialization Center for Microsystems.
Based on COMSOL Multiphysics simulation software, the new COMSOL Inc. Microfluidics Module enables users to study microfluidic devices and rarefied gas flows. The module is designed for microfluidics and vacuum researchers and engineers.
As smartphones usher in a host of new high-volume MEMS applications, semiconductor and electronics roadmaps are paying serious attention to the manufacturing and costs gaps in MEMS production. NIST's Michael Gaitan and the MEMS Industry Group are helping shape iNEMI, ITRS roadmaps with MEMS in the spotlight.
SEMICON West preview: Rapid growth in mainstream consumer markets is changing the structure of the MEMS industry from an artisanal to a volume manufacturing business -- creating a new set of challenges and opportunities to companies to find better ways to speed the production ramp, find better ways to integrate multiple die and software, and to find the right business models.
Oxford Instruments debuted the PlasmaPro Estrelas100 deep silicon etch technology for the MEMS R&D and fabrication market. The tool is designed to be flexible, accomodating multiple processes without changing chamber hardware, and multiple wafer sizes for R&D-to-production ramp.
Fraunhofer Institute for Microelectronic Circuits and Systems IMS developed a gas-based etch step that allow MEMS designers to use a wider range of materials for the functional layer, while preventing device damage during etch.
NanoInk's NanoFabrication Systems Division is launching a force sensor and levelling devices at the Nanotech Conference and Expo, part of TechConnect World. NanoInk will also be presenting on Dip Pen Nanolithography (DPN) advances.
FEI's new Vion plasma focused ion beam (PFIB) system based on inductively-coupled plasma (ICP) source technology using a xenon ion beam generates more than a micro-amp of beam current and can remove material faster than liquid metal ion sources, says product marketing manager Peter Carleson.
X-FAB Silicon Foundries released ready-to-use design IP blocks for MEMS accelerometers, as part of its MEMS foundry service offerings. The IP blocks can be used in gyroscopes and accelerometers spec'd up to 100 G-force, shortening NPI and HVM ramp.
Jay Esfandyari, Roberto De Nuccio, Gang Xu, STMicroelectronics, introduce how MEMS gyroscopes work and their applications, the main parameters of a MEMS gyroscope with analog or digital outputs, practical MEMS gyroscope calibration techniques, and how to test the MEMS gyroscope performance in terms of angular displacement.
Steven Walsh, U of NM Albert Franklin Black Professor of Entrepreneurship, recently spoke about the lessons learned from 25 years of MEMS technology, educating attendees of the MEMS Technology Summit. Walsh discusses MEMS with ElectroIQ editor Debra Vogler.
ANT95-R and ANT130-R direct-drive rotary stages, part of Aerotech's nano Motion Technology product line, offer in-position stability (0.005 arc sec) and incremental motion (0.01 arc sec) using the company's direct-drive technology.
Affinity Biosensors and IMT entered into a strategic foundry partnership today for volume production of SMR MEMS devices enabling particle measurement in fluidic solutions with femtogram resolution. The SMR MEMS devices are the chips that drive Affinity Biosensors' ARCHIMEDES Particle Measurement System.
Venture capitalists say e-commerce crash has created attractive values in optical, biomed startups.
An IC foundry has made it into the ranks of the Top 20 MEMS foundries for the first time, as TSMC’s roughly $10 million in MEMS foundry revenues put it into 14th place on Yole Developpement’s 2009 listing. STMicro improved slightly, continuing to dominate the MEMS foundry arena. TI slipped, holding onto #2; Dalsa gained, and grabbed the #3 slot.
Yole Développement released details of its upcoming report, MEMS Manufacturing & Packaging. This report analyzes the main MEMS manufacturing evolution. MEMS drivers include size, cost, and performance, though in different ways than ICs. New MEMS manufacturing and packaging technologies and specific materials are necessary.
GigOptix (GGOX) named Innovative Micro Technology (IMT) as its optical chip fabrication partner. GGOX is now in the process of transferring production of its Thin Film Polymer on Silicon (TFPS) optical modulator chips to IMT in expectation of volume production ramping in 2011.
EV Group (EVG) developed a micro-lens molding process that can enable volume production of very-high-resolution (up to 8MP and higher) wafer-level optics for use in smart phones, pico projectors and myriad other applications.
Tegal Corporation (Nasdaq: TGAL) is launching a new member of its ProNova family of high-density inductively coupled plasma (ICP) reactors for the company’s DRIE series wafer processing products. The ProNova2 is targeted for fast-growing 200mm MEMS and 3D IC applications.
At this week's IEDM, IMEC and Panasonic reveal a new MEMS resonator with the industry's highest-recorded quality factor, thanks to two key process and manufacturing steps.
Techcet's Michael A. Fury reports in-depth from sessions at IEDM 2010, looking at paper 18.3, "Prospects for MEM Logic Switch Technology," on a reverse trend from electronic switching back to mechanical switching in the form of MEMS devices.
Research and Markets added the "Invensense IDG 600/650 MEMS gyro 2-axes Reverse Costing" report to their offering. The report offers reverse costing & engineering process analysis of the Dual-Axis MEMS Gyroscope IDG-600/650 supplied by InvenSense and integrated in Wii motion accessory, including physical analysis, reconstruction of the process flow, and estimates on manufacturing and selling prices.
MEMS Industry Group (MIG) inducted 3 members into its MIG Hall of Fame, from EV Group (EVG), Acuity Inc. and Analog Devices Inc. (ADI).
SEMICON West is less than 2 months away, July 10-12 in San Francisco, CA. Plan your attendee schedule now with highlights from the Extreme Electronics “show within a show;” 4 strong keynotes; sessions on device architecture and node shrink, lithography, 450mm wafers and more.
InvenSense Inc. (NYSE:INVN) says STMicroelectronics (ST, NYSE:STM) filed a complaint in the Northern District of California, alleging that InvenSense infringes 9 of ST’s patents. InvenSense contests these claims.
sp3 Diamond Technologies Inc. shipped its Model 655D series hot-filament CVD diamond reactor system to the University of California, Berkeley Marvell Nanofabrication Laboratory.
VTI Technologies, a leading manufacturer of 3D MEMS sensors that has formed part of Murata since January 2012, is now Murata Electronics Oy.
Ricoh Company developed an ink-jet printing technique that can produce lead zirconate titanate piezoelectric material in a voluntary pattern shape at 2µm film thickness. Ricoh simultaneously developed a lead-free piezoelectric material, bearing the same deformation properties as the PZT material on a silicon substrate.
CrossFiber Inc. has been certified to ISO 9001:2008 standards by registrar PJR. CrossFiber provides all-optical photonic switching solutions for data centers and fiber optic telco networks.
X-FAB Silicon Foundries completed its dedicated noble metal facility for MEMS and post-CMOS processing in Erfurt. The company also marked a milestone, shipping its 1 billionth MEMS device.
MicroGen Systems Inc. chose X-FAB Semiconductor Foundries to produce MicroGen’s first MEMS energy harvesters.
Tohoku University of Sendai, Japan and imec signed a collaboration agreement during the Belgian economic mission to Japan, expanding their R&D into areas such as MRAM and 3D semiconductor packaging.
Plasma etch and deposition processing system maker Oxford Instruments Plasma Technology won an order for its recently launched PlasmaPro Estrelas100 deep silicon etch tool from the University of Toronto.
Driven by the volume consumer business, the maturing MEMS sector starts to look at ways to reduce costs and speed time to market by coming together on things like easing integration, common test methods, and tool replacement parts, reports Paula Doe, SEMI. Fast-moving high-volume markets may also drive MEMS makers toward paring down the vast diversity of processes and packages used, and into more collaboration on a mature ecosystem.
SPTS Technologies joined the MEMS Consortium, led by the Institute of Microelectronics (IME), a member of the Agency for Science, Technology and Research (A*STAR) in Singapore.
Karen Lightman, MEMS Industry Group (MIG), reports on the group's pre-Sensors Expo symposium on MEMS. The coordination of equipment vendors, materials suppliers, foundries, device manufacturers, end-users, and OEMs is "music to her ears."
Canon Inc. launched the FPA-3030i5+ i-line stepper for manufacturing MEMS and energy-efficient “green” devices such as power semiconductors in solar and wind applications and LEDs.
Paula Doe, SEMI Emerging Markets, covers developments at Applied Materials, Coventor, and other members of the MEMS equipment supply chain that will make MEMS less expensive, smaller, and easier to manufacture.
Microstaq, a developer of silicon MEMS-based fluid control technology, has qualified its Ventilum MEMS-based chip at Semiconductor Manufacturing International Corp (SMIC), billed as both an advancement in electronic valve technology and a new facet to the Chinese foundry's MEMS capabilities.
X-Fab Silicon Foundries says it has become the majority shareholder in German MEMS Foundry Itzehoe GmbH (MFI), the latest in a series of recent moves to raise its profile as a top MEMS foundry.
Demand for microelectromechanical systems (MEMS) devices, particularly pressure sensors for harsh environments, will grow 20% in 2012 on the way to a 9% CAGR for the next several years.
Researchers in Japan have devised a MEMS fabrication technology using lower-cost production methods of printing and injection molding, enabling MEMS devices to be applied for fields such as lighting -- and producable by firms outside the semiconductor sector.
MEMS Executive Congress 2012 in Scottsdale, AZ, will host keynotes from Ajith Amerasekera, TI Fellow, IEEE Fellow, in Texas Instruments’ Kilby Labs, who will discuss how immersive intelligent systems will change the management of our cities, buildings, personal life, health, transportation, safety and security; and Robert Brunner, founder, creative director and partner, Ammunition, who will explore the critical connection between brand identity and connection to consumers.
SEMICON Taiwan 2012, held September 5-7, will feature both Taiwan MEMS suppliers and global MEMS elites -- including Asia Pacific Microsystems, Freescale, InvenSense, and STMicroelectronics -- who will discuss innovation in MEMS design, manufacture, packaging, testing and equipment.
The second annual SensorsCon 2013, the conference for Sensors Technology, Design and Applications, March 6, 2013, Techmart Center, Santa Clara, CA, is accepting applications for exhibitors, sponsors and speakers.
Heptagon, wafer-level optics maker, ordered an advanced DWL 2000 maskless lithography system from Heidelberg Instruments. The tool has sophisticated Gray Scale Exposure capability.
The MEMS & NANO free 2-day conference, presented by JEMI, Nanotechnology KTN, and MANCEF, will cover advances in MEMS and nanoscale processes for electronics, industrial and biomedical applications.
CrossFiber, a San Diego, CA maker of photonic switches that incorporate MEMS technology, says it has completed the final tranche of a Series D round of funding, which closes totaling $13.4 million.
X-Fab Silicon Foundries has debuted an open-platform MEMS 3D inertial sensor process, what it claims is the first to be made available directly from a high-volume pure-play foundry.
X-Fab Silicon Foundries says it will invest more than $50M over the next three years in its microelectromechanical systems (MEMS) operations, aiming to grow the business to become among the top MEMS foundries worldwide.
A device that measures very thin quantities of liquid, such as the synovial fluid in knee joints, and a device that measures change in mass when a microdevice adsorbs small amounts of material, earned top honors in Sandia National Labs' annual student MEMS design contest.
Sand 9 is partnering with GlobalFoundries for high-volume manufacturing of its microelectromechanical systems (MEMS) timing technology, which incorporates silicon-on-insulator (SOI) and through-silicon vias (TSV).
HP execs David Erickson and Grant Pease give Small Times the skinny on the company's new MEMS sensor technology they say is 1000× more sensitive than current products -- and why applications like bridge monitoring are particularly ripe for implementation.
MIT researchers say new maskless patterning and other MEMS-targeted fab techniques, and improved CAD tools, would break through limitations on MEMS adoption.
Coventor launched SEMulator3D 2012, featuring improved predictive process modeling tools with increased capacity, speed, and automation for leading-edge process technology nodes.
Research and Markets released the "ST L3G3250A 3-axis MEMS Gyroscope Reverse Costing Analysis" report, providing a teardown of STMicroelectronics’ MEMS gyroscope in an LGA package.
Micrel Inc. (NASDAQ:MCRL) received a 98% performance rating for its services and materials to a top-20 global MEMS designer and manufacturer in in a report covering Q4 2011.
The new laser lithography tool from Nanoscribe GmbH produces complex 3D submicron structures up to 1mm with 150nm widths, boasting full automation and precise repeatability. It is based on a 3-axis piezo nano-positioning stage from PI (Physik Instrumente).
Silex Microsystems named Fredrik Jönsson, CEO of Beijer Electronics, to its Board of Directors. Beijer Electronics provides industrial automation and data communications solutions.
Silex Microsystems, a pure-play MEMS foundry, will develop ferromagnetic materials for next-generation MEMS devices, under a new VINNOVA research grant worth nearly 3 million Swedish Kronor.
The College of Nanoscale Science and Engineering's (CNSE) Smart System Technology and Commercialization Center of Excellence (STC), Canandaigua, NY, was designated as a Trusted Foundry by the US Department of Defense's Defense Microelectronics Agency.
Dolomite and LioniX BV formed a partnership covering the design, development, fabrication, and distribution of microfluidic devices and systems.
Hanking Industrial Group Co., Ltd., broke ground on a micro electro mechanical system (MEMS) manufacturing campus in Fushun City, China, outside of Shenyang.
Western Michigan University developed a device combining a laser and diamond cutting system, enabling users to process hard, brittle materials that are difficult to machine. Initial applications include MEMS manufacturing, and other fabrication on semiconductor materials.
memsstar Limited, deposition and etch equipment supplier to the MEMS and semiconductor industries, named Mike Thompson as CEO.
Baolab Microsystems will modify the structures of its 3D NanoCompass to build a range of other motion sensors, with the end-goal of low-cost, smart, reconfigurable inertial measurement units (IMUs).
The top 3 MEMS manufacturers by revenue -- Texas Instruments, Hewlett Packard, and Bosch -- fought for market share in 2011, but #4, STMicroelectronics, experienced the biggest revenue jump year-to-year.
MEPTEC will host its 10th Annual MEMS Technology Symposium in San Jose, CA. Keynotes cover “sensory swarms” and motion interfaces, and sessions will cover MEMS roadmaps; design, manufacturing, and test of MEMS; MEMS architectures and uses, and more.
Paula Doe, SEMI Emerging Markets, shares the annual guide for navigating the MEMS events at SEMICON West, July 10-12 at Moscone Center in San Francisco, CA.
STMicroelectronics (NYSE:STM) partnered with China’s Harbin Institute of Technology (HIT) to open a joint laboratory researching electronics.
MEMS will continue to see steady, sustainable, double-digit growth for the next 6 years, with 20% compound average annual growth in units and 13% growth in revenues, to become a $21 billion market by 2017, according to Yole.
SUSS MicroTec uncrated the third generation of the ACS200 Coating and Developing Platform, developed from the company’s ACS200Plus and Gamma platforms for a compact, highly precise MEMS, LED, and related fab tool.
The MiQro Innovation Collaborative Centre (C2MI) is improving its state-of-the-art MEMS facility with Eyelit Manufacturing software to support R&D and the commercial activities of sponsor companies. C2MI is also installing a suite of new wafer processing tools from SPTS Technologies.
Oxford Instruments launched the PlasmaPro 100 etch and deposition tool for manufacturing MEMS, HB-LED, semiconductors, and other applications.
Kionix Inc., maker of MEMS accelerometers, added Paul Bryan as EVP of product management and strategy, and promoted Drake Margiotta in sales.
Purdue researchers have demonstrated self-calibrating MEMS, which enable higher accuracy for existing and new MEMS applications and could eliminate 30% of manufacturing costs by skipping test processes.
Goodrich Corporation (NYSE: GR) added 46,00sq.ft. to its high-tech manufacturing facility in Burnsville, MN, with advanced production, design and development areas for MEMS.
Yole updated its MEMS industry database, World MEMS Players 2012. The product includes contact information for MEMS players, geographical breakdown of the industry, and various MEMS device categories.
President Obama bestowed the Presidential Early Career Awards for Scientists and Engineers upon 96 researchers. It is the highest honor from the US government for science and engineering professionals in the early stages of their independent research careers.
Vectron International and Knowles Electronics entered into a strategic partnership with SiTime Corporation, aiming to grow MEMS timing components in the frequency control products market.
Standardized testing and measurement methods, NIST argues, will enable MEMS lab-on-chip manufacturers to accurately determine important physical characteristics of LOC devices such as dimensions, electrical surface properties, and fluid flow rates and temperatures. These must be calculable at all stages of production, from processing of raw materials to final rollout of products.
Enpirion, Inc. entered into a strategic partnership agreement with JiangyinChangdian Advanced Packaging Co., Ltd. (JCAP) for the manufacturing of silicon-based magnetics utilizing Enpirion's proprietary micro electronic magnetic silicon (MEMS) technology.
Embedded features and sensor integration will determine the future applications of MEMS sensors. Jay Esfandyari et al, STMicroelectronics, share an overview of future trends of sensor integration -- sensor fusion -- and some of the features available today in digital MEMS inertial sensors.
Sensors in Design 2012 takes place March 28-29 in San Jose, CA. With speakers from Texas Instruments and Intel, InvenSense, Analog Devices, and more, the event is designed for attendees to better understand sensor technologies and their applications.
MM, MEMS & NANO Live UK 2012 will take place at NEC Birmingham, UK, September 25-26, co-located with TCT Live, Mediplas, and Sensing Technology 2012.. Submit an abstract by February 28.
Silex Microsystems joined Energy-efficient Piezo-MEMS Tunable RF Front-End Antenna Systems for Mobile Devices to develop TSVs, PZT thin films, and other technologies for high-performance RF systems targeting mobile devices.
Si-Ware Systems debuted the SiMOST platform to fab and package single-chip optical systems with validated MEMS components. Multiple MOEMS structures can be patterned and etched on SOI wafers using DRIE. The structures are then wafer-level packaged and diced.
Heidelberg Instruments launched the µPG 501 table-top direct-write lithography system for prototyping MEMS, integrated optics, microfluidic/lab-on-a-chip, and other devices as well as mask production.
Straight outta Purdue University, a miniaturized implantable medical micro electro mechanical (MEMS) pressure sensor chip can be recharged with the block-rockin beats -- acoustic waves -- of rap music.
The CNSE STC, which performs micro electromechanical system (MEMS) and nanotechnology-enabled manufacturing and packaging, successfully completed ISO 9001:2008 registration.
AEPI and CEA-Leti will co-host a site visit to CEA-Leti and other facilities on the MINATEC campus, Grenoble, following MEMS Executive Congress Europe on March 23.
Researchers at the University of Massachusetts Amherst have developed a new tool for manufacturing three-dimensional shapes easily and cheaply, to aid advances in biomedicine, robotics and tunable micro-optics.
Image Sensors 2012, March 20-22 in London, will highlight the emergence of CMOS image sensors against those based on TFTs, applications possibilities for 3D cameras and non-visual spectrum cameras, and more.
Qualtré appointed Mark Laich as VP of sales and business development, responsible for customer and partner development as Qualtré launches its latest iteration of inertial sensing technologies.
The Great East Japan Earthquake, March 11, 2011 off Sendai, was "a Darwinian event" for the MEMS market. The MEMS supply chain came out of the disaster much richer, more diverse, and better positioned for growth, shows the IHS iSuppli MEMS & Sensors Service.
SPTS Technologies delivered its first VHF etch system in China, installing a Primaxx Monarch 3 at the Shanghai Institute of Microsystem and Information Technology for a MEMS accelerometer development project.
The market for MEMS grew 17% to $10.2 billion in 2011, according to Yole Développement. The top 2 suppliers -- Texas Instruments (TXN, TI) and STMicroelectronics (STM, ST) -- neared $1 billion in sales each.
Micronova Nanofabrication Centre selected a Vistec Lithography e-beam litho system for its nanotechnology laboratory in Finland. The litho tool will be used for nanoelectronics, nanofabrication, microelectronics, nanophotonics and microfabrication research in a multi-user environment.
MEMS company InvenSense Inc. (NYSE:INVN) announced dual-source capability for its CMOS-MEMS supply from semiconductor foundries TSMC and GLOBALFOUNDRIES.
Akustica, known for its monolithic single-chip digital MEMS devices, introduced its first analog 2-chip MEMS microphone for mobile handsets, the AKU340.
Pure-play MEMS foundry Innovative Micro Technology (IMT) named Craig Ensley its president and CEO, joining the company with 30+ years of semiconductor and entrepreneurial experience.
Coventor Inc.'s CoventorWare 2012 MEMS design software offers full 64-bit support, a new hex-dominant extrude meshing capability, a new Python scripting interface for its enhanced suite of MEMS field solvers, and a new intuitive user interface.
Tessera Technologies Inc. (NASDAQ:TSRA) expects a mobile phone design win for its MEMS optical imaging technology in H1 2012, reported Robert A. Young, president and CEO.
Qualtré, silicon MEMS inertial sensors developer, appointed Dr. Ijaz Jafri as VP of engineering, responsible for all aspects of product development and commercialization. Jafri has 16+ years of experience in MEMS and semiconductors.
Si-Ware Systems (SWS) launched a US subsidiary, Si-Ware Systems Inc. Scott Smyser, a new EVP for worldwide marketing and business development, will manage the US business.
MEMS maker Colibrys SA will relocate locally, to the Y-Parc at Yverdon-les-Bains, Canton Vaud, Switzerland. The new location will enable Colibrys to branch out into new application sectors.
MagnaChip Semiconductor Corporation (NYSE:MX) began ramping its 0.35µm mixed-signal foundry service process for MEMS accelerometers.
Picosun Oy announced record particle levels -- 1-2 added particles (>70nm) per wafer -- with its PICOSUN P-300B ALD batch tool installed at Fraunhofer IPMS.
At MM/MEMS/NANO Live USA, Professor Yogesh Gianchandani, University of Michigan Wireless Integrated Microsystems and Sensors Center, will keynote the MEMS Commercialization: From Lab to Fab to the Market session.
CEA-Leti unveiled a 40Gbit/s optical modulator in silicon with a record extinction ratio of 10dB, developed by the HELIOS Project members.
poLight collaborated with Texas Instruments to produce the optical MEMS component of poLight's TLens, aiming for faster focus time and lower power consumption in high volumes.
STMicroelectronics (STM) is implementing shape memory alloys (SMA) in its optical image stabilization (OIS) motion sensor designs. Actuators made of SMAs contract upon heating.
STMicroelectronics has shipped 2 billion MEMS sensors to date, after hitting 1 billion only 15 months ago. The company recently increased its MEMS production capacity to 3 million+ sensors a day.
Luxtera closed $21.7 million in Round C financing, with participation from NEA, August Capital, Sevin Rosen, Funds, and Lux Capital, as well as new investor Tokyo Electron (TEL), and personal investment from an industry titan.
MIT researchers have come up with a new approach to MEMS design that enables engineers to design 3D configurations using existing fabrication processes. They built a MEMS device that enables 3D sensing on a single chip.
After reporting Q4 2011 results, MEMS supplier MEMSIC Inc. (NasdaqGM: MEMS) discussed its 2 main goals for 2012.
Tessera Technologies Inc. (NASDAQ:TSRA), through its wholly owned subsidiary, DigitalOptics Corporation (DOC) will acquire certain assets of Vista Point Technologies, a Tier-One-qualified camera module manufacturing business of Flextronics.
CrossFiber, a San Diego, CA maker of photonic switches that incorporate microelectromechanical system (MEMS) technology, has acquired substantially all the assets of 2D MEMS switch firm OMM.
Researchers from Rice U. say they have developed a micron-scale spatial light modulator (SLM) built on SOI that runs orders-of-magnitude faster than its siblings used in sensing and imaging devices.
In 2012, the IC industry saw a two percent decline, but Yole Développement's research reveals the MEMS sector managed another 10 percent growth to become an $11B business.
InvenSense, Inc., a provider of MotionTracking system on chip devices, is relocating its headquarters to 1745 Technology Drive, San Jose, California.
Infinite Graphics Inc. (IGI), a supplier of service and software products for the Medium Area Mask (MAM) market, has added new capability in the form of new and upgraded equipment.
Capacity for 200mm wafers forecast to slip more than 10 points during same period.
DAS Environmental Expert GmbH of Dresden, Germany, has developed SALIX, a point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications.
Companies announce alliance to bring high-performance sensors to market.
Light and proximity sensors in mobile handsets and tablets are set for expansive double-digit growth within a five-year period, thanks to increasing usage by electronic giants Samsung and Apple.
Product validation is an essential part of all successful MEMS new product developments. It is the process of testing products under various environmental, mechanical or electrical conditions to simulate life in an accelerated manner.
Researchers from the National Institute of Standards and Technology (NIST) and the University of North Carolina have demonstrated a new design for an instrument, a "instrumented nanoscale indenter," that makes sensitive measurements of the mechanical properties of thin films -- ranging from auto body coatings to microelectronic devices -- and biomaterials.
MediaTek Inc., a fabless semiconductor company for wireless communications and digital multimedia solutions, today announced its breakthrough MT8135 system-on-chip (SoC) for high-end tablets.