Materials-and-Equipment

Topic Index

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 0-9


Koh Young Opens Japan Sales, Service Division

Wed, 3 Mar 2008
(March 12, 2008) Seoul, South Korea — 3D inspection technology company Koh Young announces the establishment and opening of a sales and service division in Chiba, Japan, called Japan Koh Young Company Ltd. The branch has been established to better serve the evolving needs of the company's Japanese customers.

BTU Receives $3M Order for Pyramax Products from Leading SATS Company

Tue, 3 Mar 2008
(March 11, 2008) North Billerica, MA — BTU International, a supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, today announced the receipt of a $3M multiple-machine order, the largest single Pyramax order in company history, from a leading semiconductor assembly and test subcontractor (SATS).

Europractice IC Service Expands to MEMS Prototyping

Tue, 3 Mar 2008
(March 11, 2008) CROLLES, France, and LEUVEN, Belgium — Tronics Microsystems SA and IMEC, representing Europractice IC Service, announced today their collaboration to enable Europractice IC Service to add MEMS to its Multi-Project Wafer (MPW) programs. Tronics, a manufacturer of custom MEMS components, is the first technology provider selected by IMEC to support Europractice IC Service's extension of its production portfolio to MEMS.

Fujitsu Achieves Self-organizing Carbon Nanotube Composite with Graphene

Mon, 3 Mar 2008
(March 3, 2008) Atsugi, Japan — Fujitsu Laboratories Ltd. today announced the successful formation of a new nano-scale carbon composite featuring a self-organizing structure by combining carbon nanotubes and graphene, which are both nano-scale carbon structures. The newly-discovered composite structure is synthesized at a temperature of 510°C.

ASE Inc. Enters Syndicated Loan Agreement for the Proposed Acquisition of ASE Test Ltd.

Mon, 3 Mar 2008
(March 3, 2008) Taipei, Taiwan — Advanced Semiconductor Engineering Inc. has announced that it has entered into a syndicated loan agreement with a banking syndicate led by Citibank, N.A., Taipei Branch, for a NT$24,750 million term loan facility.

Wire Bonder

Mon, 2 Feb 2008
The Wire Bonder 3200's new air bearing technology and rotary axis enable it to attain 22 wires/sec with very thin wires (for diameters down to 35 µm, or 35 thousandths of a millimeter). The wire bonder makes the electrical connections between the semiconductor and the terminals on the substrate. The control pulses generated in the chip reach the surrounding area via a gold wire that is thinner than a human hair.

New system automates thermal measurements

Mon, 4 Apr 2002
Netzsch Instruments introduced a new line of flash diffusivity instruments for measurement of thermal properties, such as specific heat and thermal conductivity

The back-end process: Step 6 - Wire bonding

Sat, 6 Jun 2002
Ongoing demands for higher I/O counts while minimizing board real estate are driving high-density connections between chips and the packages

A new approach to X-ray

Sat, 6 Jun 2002
Contract manufacturers and printed circuit board (PCB) assemblers are realizing that an X-ray system is a required tool rather than a "nice to have" system in their arsenal of inspection tools

C-MAC Launches Integrated Opto Module Program

Thu, 8 Aug 2002
C-MAC MicroTechnology filled out its optoelectronic manufacturing technology portfolio and now offers an integrated assembly and test program for those applications

Reliability of BGA solder bumps

Mon, 7 Jul 2002
Moiré interferometry evaluates shock and vibration performance

Ribbon Wedge Bonding

Tue, 7 Jul 2003
With the recent growth of optoelectronics assembly, the use of ribbon wire for interconnects has become more widely used. This article explores the basics of the ribbon bonding machine configuration and some of the finer points of ribbon wedge tools and wire.

New materials highlighted at SEMI-THERM

Sat, 6 Jun 2002
Many new materials and technologies for addressing thermal management challenges were presented at IEEE's 18th annual Semiconductor Thermal Measurement and Management Symposium and Exhibition

N2 Inerting for Reflow of Lead-free Solders

Sat, 11 Nov 2003
Due to environmental and health concerns about lead contamination, there is increasing pressure in legislation and a growing market demand to eliminate toxic materials. Lead-free soldering for the electronics industry is becoming a global trend, and several alloy systems alternatives have been recommended.

Intel reveals heat sink approach

Wed, 5 May 2002
The importance of thermal management to Intel's microprocessors was demonstrated by the prominence given to a recent announcement about heat sink technology

10th Anniversary Insights
The wire-bonding tyranny of "or"

Fri, 2 Feb 2002
Many industry luminaries today debate what will be the interconnect technology of choice for semiconductor devices in the future

Cool Chips 2002 conference lineup

Fri, 2 Feb 2002
Portland, MAINE - Intertech has set the agenda for its conference, "Cool Chips 2002 - Developing New Market, Material and Design Strategies for Thermal and Power Management," which will be held April 3-4 in Monterey, California

STATS licenses ITRI Technology, introduces new PBGA

Mon, 7 Jul 2002
ST Assembly and Test Services (STATS) has licensed a heat dissipation technology developed and patented by the Industrial Technology Research Institute (ITRI)

Shake-up in probe card suppliers

Mon, 7 Jul 2002
There was significant motion in the ranking of probe card suppliers in 2001, according to a report from VLSI Research Inc

Indium Changes Product Support Staff

Tue, 1 Jan 2007
(January 9, 2007) CLINTON, NY — Indium Corporation appointed Tim Jensen product manager for advanced assembly materials, and promoted Jordan Ross to product specialist for thermal applications. Both Jensen and Ross will continue to operate out of Indium headquarters in Clinton.

Ceramic Package Tests Well for Loss

Thu, 1 Jan 2007
(January 4, 2007) SAN DIEGO — StratEdge released the SMX series of surface mount ceramic packages for test-and-measurement, VSAT, point-to-point, point-to-multipoint, and WiMax applications. The packages, tested by JDS Uniphase (Bloomfield, CT), are designed with thermal management functions incorporated.

Thermal Gap Fillers

Fri, 3 Mar 2007
THERM-A-GAP 569 and 579 thermal gap-filler materials offer high conformability in pre-formed thicknesses of 0.02

Trans-climate Lead-free Paste for QFP, CSP

Fri, 3 Mar 2007
(March 23, 2007) IRVINE, CA — Designed for manufacturability and flexibility in various regional climatic conditions, the Multicore LF600 lead-free solder paste from the electronics group of Henkel provides humidity resistance, 24-hour open times, and low voiding.

Nanocomp Celebrates CNT Textiles

Wed, 5 May 2007
(May 16, 2007) CONCORD, NH — It looks like cotton candy as its being synthesized, but has the strength of carbon steel. It is as electrically conductive as copper at 50MHz and is thermally conductive. It has application possibilities across military, aerospace, and semiconductor markets. Is it any wonder that Nanocomp Technologies, the company that manufactures this carbon nanotube (CNT) textile, received the New Hampshire High Tech Council's "Product of the Year" in 2006?

LED Lab Optimizes Operating Parameters

Thu, 5 May 2007
(May 10, 2007) NEW YORK — TT electronics OPTEK Technology opened an in-house visible LED laboratory with resources to assess LED packages on junction temperature variation, optical performance, and other parameters. The lab aids in design, manufacturing, and test.

Apple Influences Chip Manufacturing, iSuppli Reports

Thu, 8 Aug 2007
(August 16, 2007) EL SEGUNDO, CA — Apple Inc.'s iPhone release bumped up the company's influence on semiconductor design in the first half of 2007, analyst firm iSuppli Corp. reports. Its regional design influence tool (RDIT) shows Apple's design activity to have a significant impact on the global electronics supply chain.

MEMS/Nano Software Suite

Mon, 6 Jun 2007
Targeting the MEMS and nanotechnology industries, the IntelliSuite v8.2 software tool for MEMS/nano-device development includes nanostructure design tools to enable carbon nanotube (CNT) and nano-structure use in computing, display, medical, sensor, and related devices.

IEEE Devises Nano Roadmap

Tue, 5 May 2007
(May 1, 2007) PISCATAWAY, N.J. — The IEEE's "Nanoelectronics Standards Roadmap (NESR)" suggests five standards for 2007, involving conductive interconnect nanomaterials, organic sensors, and nano-scale devices. With industry approval, the group plans to complete seven nanomaterial and five nanodevice standards for 2008.

Skip Fehr Joins Mirror's Board

Wed, 4 Apr 2007
(April 25, 2007) SAN JOSE, CA — Gerald K. "Skip" Fehr, Ph.D., joined Mirror Semiconductor's technical advisory board (TAB), to develop the company's wire-bonding designs, named Mirrored Pinout. Fehr, an industry consultant in San Jose, has served at Fairchild Semiconductor, Intel, LSI Logic, and Texas Instruments (TI).

$7M Raised for High-power LED Engines

Wed, 4 Apr 2007
(April 25, 2007) WESTHAMPTON, NJ — In series D funding, Lamina Ceramics, Inc., raised $7 million to fund expansion of its high-brightness, high-power LED business. Easton Capital Investment Group (New York and Florida) led the round.

MCP Built with 20 Stacked Die

Mon, 4 Apr 2007
(April 23, 2007) AKITA, Japan — Akita Elpida Memory, Inc., developed a 1.4-mm-thick multi-chip package (MCP) encompassing 20 thinned and stacked die. The company plans to incorporate processes used on this 20-die package to improve performance and manufacturability of more widely used 5- to 7-die-stack 3D packages.

Samsung Develops DRAM Stack with TSVs

Mon, 4 Apr 2007
(April 23, 2007) SEOUL, South Korea — Samsung Electronics Co., Ltd., has developed an all-DRAM stacked-memory package using through-silicon vias (TSVs) housed in aluminum pads to avoid performance slow-downs caused by the redistribution layer. The company applied a proprietary wafer-thinning technique to eliminate warped die in the low-profile package.

March Book-to-Bill Even

Fri, 4 Apr 2007
(April 20, 2007) SAN JOSE, CA — North America-based semiconductor equipment manufacturers posted $1.42B in orders and billings in March, generating an even book-to-bill of 1.00, according to SEMI's monthly book-to-bill report. Bookings improved slightly while billings remained at February levels. The book-to-bill had dropped slightly below parity in February at 0.98.

SEMI Lowers Early 2007 Book-to-Bill Estimates

Wed, 4 Apr 2007
(April 18, 2007) SAN JOSE, CA — SEMI released corrections to its January and February book-to-bill estimates for the North America semiconductor equipment manufacturing industry, lowering the ratios to 1.00 and 0.98, respectively. SEMI blames a data-input error for the incorrect averages initially reported.

Tessera Interconnect Platform Targets Limitations

Tue, 4 Apr 2007
By Françoise von Trapp, managing editor

Tessera Technologies, Inc., launched an interconnection platform intended to address technical limitations of current-generation packaging technologies, such as pitch, profile, performance, reliability, and test capacity. The company expects this technology to become a fundamental building block of next-generation mobile, computing, and consumer electronic products.

Thermal-focused Packages Debut

Tue, 4 Apr 2007
(April 18, 2007) SAN DIEGO — StratEdge released "Power Packages," a package series that incorporates beryllium oxide (BeO) ceramic and a copper-composite base to provide thermal management for high-frequency, high-power chips. Package construction directly affects chip performance, said Jerry Carter, senior applications engineer, adding that the series is constructed for design engineers considering performance and reliability of their chips.

IP Piracy

Tue, 4 Apr 2007
By Meredith Courtemanche, assistant editor

Central to the outsourcing debate is the issue of protection for intellectual property (IP). The U.S. plans to bring copyright and IP violation charges against China to the WTO, highlighting the struggle between industry groups and the outsourcing strategies that maintain the electronics industry.

Book-to-Bill Steady in May

Wed, 6 Jun 2007
(June 21, 2007) SAN JOSE, CA — North America-based semiconductor equipment manufacturers posted $1.67 billion in bookings and billings in May, based on a three-month average, bringing the book-to-bill to 1.00 for the month, according to SEMI's report. Values in both segments are up from May of 2006 and from April 2007.

Database Targets MEMS Manufacturability

Tue, 6 Jun 2007
(June 19, 2007) MATERIALS PARK, OH — ASM International released its MEMS Materials Database: Packaging Module, a licensed database containing mechanical, physical, processing, and component data for materials selection in MEMS packaging. The database targets improvements to time-to-market, reliability, and design and manufacturing of MEMS devices.

Dense CNTs Viable 3D Interconnects

Thu, 6 Jun 2007
(June 14, 2007) TROY, NY — As part of research designed to manufacture carbon nanotubes (CNTs) as viable replacements for copper in 3D die-stacking applications, researchers at Rensselaer Polytechnic Institute have implemented a method for compacting CNTs into bundles, enabling better thermal and electrical conductivity. Densification occurs post-growth, allowing scientists to use a known, conventional CNT growth process. CNT density was increased 5–25× in the experiments.

Untangling CNT Interconnect Issues

Tue, 6 Jun 2007
(June 5, 2007) SAN DIEGO — Since carbon nanotubes (CNTs) tend to grow with erratic kinks and bends in the tube structure, a group of engineers from Stanford University has devised circuit-simulation algorithms that eliminate bad connections caused by errant CNTs. The work, which involves fine grids rather that direct interconnects, is being presented at the Design Automation Conference (DAC), June 4–8 in San Diego.

Nextreme Names Business Development VP

Mon, 6 Jun 2007
(June 4, 2007) RESEARCH TRIANGLE PARK, N.C. — Nextreme appointed Paul A. Magill, Ph.D., as VP of marketing and business development, citing his entrepreneurial experience and background in electronics packaging and thermal management. Magill has founded several companies, such as Unitive and Avo Photonics.

Fiber-based Laser Platform

Tue, 5 May 2007
The fiber-based picosecond UV laser, developed with proprietary diode laser technology, fiber coupling, and frequency conversions, produces 12-W output power at a 355-nm wavelength. It enables scribing and other processing steps on dielectric, glass, and semiconductor materials.

Adhesive for Flip Chip BGAs

Tue, 5 May 2007
The DA-6534 one-part, high-performance thermal adhesive uses silver filler with a silicone-based chemistry to offer flexibility, reliability, and thermal conductivity. It targets thermal management packaging for flip chip BGAs and other advanced components.

High-k Technology Shrinks Transistor Size

Mon, 1 Jan 2007
(January 29, 2007) YORKTOWN, HEIGHTS, NY — IBM is in the development stage with 45-nm transistor technology that uses high-k gate dielectric and a proprietary metal composite for the transistor gate electrode. Constructing the transistor with conventional methods, such as high-temperature annealing, is a familiar process that gives engineers more control and reduces the possibility of error, said Ghavam Shahidi, director of silicon technology.

Nextreme Appoints Senior Technical Fellow

Tue, 1 Jan 2007
(January 23, 2007) RESEARCH TRIANGLE PARK, NC — Nextreme Thermal Solutions named Phil Deane, Ph.D., senior technology fellow, appointed to address thermal management and thermoelectric packaging issues, and to define product and packaging strategies for customers with the company's thermoelectric coolers. Thin-film thermoelectric technology represents an advancement in in-package cooling, said Deane.

Book-to-Bill Hits 1.05 in December

Fri, 1 Jan 2007
(January 19, 2007) SAN JOSE, CA — After a brief period below parity, the North American semiconductor equipment book-to-bill ratio reached 1.05 in December 2006, according to a SEMI report. The positive ratio suggests near-term growth for semiconductor-equipment manufacturing.

Electronics Largest Nanomaterial Market Near-term

Fri, 9 Sep 2007
(September 7, 2007) CLEVELAND — Nanomaterials have established a $1B market, primarily for use in electronics production, according to "World Nanomaterials," from the Freedonia Group, Inc. The report suggests that more conventional uses — wafer-polishing slurries or reinforced plastic composites — still consume the volume of nanomaterials, but novel materials — nanotubes and dendrimers — will grow in popularity over the coming 10–20 years.

Cohu Selects CFO

Tue, 9 Sep 2007
(September 4, 2007) POWAY, CA — Cohu Inc. named Jeffrey D. Jones as VP of finance and chief financial officer (CFO), succeeding John H. Allen. Allen will retire in November. Jones previously served with Delta Design, Inc., wholly owned subsidiary of Cohu.

AlSiC Heat Spreader for SiP

Tue, 7 Jul 2007
RoHS compliant, aluminum silicon carbide (AlSiC) metal-matrix composite lids target system-in-package (SiP) applications. The heat spreaders are said to reduce bowing and flexing with a low coefficient of thermal expansion (CTE) between die and packaging.

Heated Chuck

Tue, 7 Jul 2007
The HPR-90 heated work holder suits photoresist, epoxy resin, and adhesives annealing; manual wire bonding; device heating; and other packaging processes. It offers a 90-mm heated area and 360° rotation. The heated area can be changed without moving the equipment.

Thermal Material

Tue, 7 Jul 2007
Burn-in material, a reusable thermal interface material (TIM), provides repeatable thermal performance over thousands of cycles, and offers an alternative to greases, phase change materials (PCMs), and gap pads in thermal module test applications.

Active Heat Spreaders

Mon, 7 Jul 2007
The CL-1000 series of heat spreaders offer a large, flat, and thin surface area to connect components and thermal interface materials (TIMs), or serve as a heat pipe or heatsink. The products are reportedly 44% lighter than pure copper and 10–15× more thermally conductive.

SUSS Device Bonders Bought Out

Fri, 7 Jul 2007
(July 27, 2007) SAINT-JEOIRE, France — SUSS MicroTec France's president, Gaël Schmidt, used a management buy out (MBO) agreement to acquire SUSS MicroTec's device bonder division. He will rename the company Smart Equipment Technology (S.E.T.); S.E.T. will operate as a simplified joint stock company with about €40,000 ($55,000) capital.

Book-to-Bill Falls in June

Thu, 7 Jul 2007
(July 26, 2007) SAN JOSE, CA — The North American semiconductor equipment manufacturing book-to-bill ratio fell to 0.94 in June 2007, which the indicator hasn't approached since an October 2006 ratio of 0.95. The dip belies the fact that booking and billing amounts are trending up slightly, and hitting highs for the year, said Stanley T. Myers, president and CEO, SEMI.

Handbook Focuses on Nanoscale Measurements

Fri, 4 Apr 2007
(April 6, 2007) CLEVELAND — The "Nanotechnology Measurement Handbook," published by Keithley Instruments, provide guides for electrical measurements on nanoscale applications, such as carbon nanotubes (CNT), and references when testing new phenomena in R&D. Practical assistance aids in measuring low-level DC and pulses on nanomaterials and devices, while theoretical and practical considerations are listed for measuring currents, resistances, and voltages typical of nanomaterials.

Equipment Sales Climb 23% in 2006

Mon, 4 Apr 2007
(April 4, 2007) SAN JOSE, CA — Worldwide sales of semiconductor manufacturing equipment totaled $40.47 billion in 2006, up 23.1% over 2005. Assembly and packaging sectors grew a total of 14%; test equipment sales increased by 21% over the prior year, according to SEMI's "Worldwide Semiconductor Equipment Market Statistics (SEMS) Report."

Andigilog Completes Series B

Thu, 2 Feb 2007
(February 22, 2007) TEMPE, AZ — Andigilog received $18 million in a series B financing round, with four new investors and three returning venture capital companies. The thermal management solutions company will use this funding to penetrate for desktop, notebook, and cooling fan markets; and to extend its product portfolio.

Honeywell to Expand Packaging Materials R&D

Thu, 2 Feb 2007
(February 15, 2007) TEMPE, AZ — Honeywell Electronic Materials will expand its Spokane, WA, R&D center for advanced packaging materials, investing more than $1 million and adding about 85 pieces of equipment. The company plans to develop thermal management, electrical interconnect, and burn-in materials. The construction project is expected to finish by the end of 2007.

Nextreme Names Packaging-focused CTO

Fri, 2 Feb 2007
(February 9, 2007) RESEARCH TRIANGLE PARK, NC — Nextreme Thermal Solutions appointed Seri Lee, Ph.D., as chief technology officer. Bringing Lee to Nextreme is part of a corporate plan to focus on electronic and optoelectronic packaging, and thermal management, said Jesko von Windheim, CEO, adding that Lee will also advance the company's efforts in thermoelectric power generation.

High-tensile TIM

Mon, 8 Aug 2007
Targeting long-term use and reworkable assemblies, the Keratherm 86/82 high-tensile-strength thermal interface material (TIM) is thermally conductive and electrically isolating, comprising silicone film with a fiberglass layer.

Green Materials for Flex Circuits

Mon, 8 Aug 2007
A halogen-free, RoHS-compliant transparent epoxy polyimide laminate product line, R/flex JADE A targets flexible circuit needs in portable electronics, computing, packages, and other applications.

Rohm and Haas Receives SMIC Excellent Supplier Award

Tue, 8 Aug 2007
(August 28, 2007) PHEONIX, AZ — Semiconductor Manufacturing International Corporation honored Rohm and Haas Electronic Materials, CMP Technologies with the company's 2007 Excellent Supplier Award, recognizing the efforts of the four Rohm and Haas business units that support SMIC: CMP Technologies, Microelectronic Technologies, Packaging and Finishing Technologies and Ion Exchange Resins.

Discera Qualifies MEMS Oscillators

Mon, 8 Aug 2007
(August 27, 2007) SAN JOSE, CA — Discera, Inc., qualified its MEMS-based oscillators with a series of frequency-stability and standard semiconductor qualification and reliability tests, comparing the silicon-based MEMS resonators to quartz for timing devices. Discera tested three separate manufacturing lots to prove process consistency in high-volume production, said Venkat Bahle, VP of marketing, Discera.

RF Integration — A Paradigm Shift

Fri, 8 Aug 2007
By Per Vicklund, Mentor Graphics

The character of RF design has changed quite dramatically in the past few years. It's quite rare that RF designs are isolated pieces of circuitry, but rather part of a much bigger context. RF designs today typically are much larger and much more complex. They are multi-technology designs consisting of multiple RF modules integrated with high-speed digital, analog, power, and bias networks, all on the same dense circuit board.

Nano Micro Facility Installs Vistec VB6

Wed, 8 Aug 2007
(August 22, 2007) WATERVLIET, NY — The Forschungszentrum Karlsruhe independent science and research institute (Germany) began running applications on a Vistec VB6 electron beam lithography system in its Karlsruhe Nano Micro Facility. The system will allow researchers to develop new applications in nanotechnology and microsystems technologies.

ICI Adds AAA to Electronic Materials Group

Mon, 8 Aug 2007
(August 20, 2007) RANCHO DOMINGUEZ, CA — ICI acquired Advanced Applied Adhesives (AAA — San Diego, CA) to expand its electronic materials (EM) group. AAA and sister company Designer Molecules, Inc. (DMI), offer die-attach adhesives for power applications and other packaging materials. Terms of the transaction were not disclosed.

DEK Puts Local Imprint on Website

Mon, 8 Aug 2007
(August 20, 2007) FLEMINGTON, NJ — DEK introduced a regional-content feature to its website, enabling visitors to view product, process, and company information in local languages and tailored to the production parameters of a region. Users select Asia, Europe, or U.S. content when entering the site.

Education and collaboration beyond borders

Thu, 11 Nov 2001
"As a young engineer, I learned as much from traveling as I did while a student in a classroom."

Meeting wrap-up

Thu, 11 Nov 2001
Third lead-free summit offers new data

Packaging for microwave and millimeter wave components

Wed, 8 Aug 2001
Packaging for high-frequency components has never received much attention. Historically, high-speed millimeter wave integrated circuit (MMIC) devices were developed primarily as a resource for the United States military

Movers and shakers

Sun, 7 Jul 2001
Novellus Systems Inc. (San Jose, Calif.) has promoted Peter R. Hanley to company president. Hanley will also join chairman of the board and chief executive officer Richard S. Hill in a newly created office of the chief executive officer

Heat pipe simulation

Sat, 12 Dec 2001
A simplified technique for modeling heat pipe assisted heat sinks

Texas Instruments launches another logic family

Sat, 12 Dec 2001
Texas Instruments (TI) has recently introduced a new logic family, the advanced ultra-low voltage CMOS (AUC); the products in this family are optimized at 1.8 V but are operational to sub-1-V levels

ASE introduces multi-package BGA

Sat, 12 Dec 2001
Advanced Semiconductor Engineering Inc. (ASE) has launched its new multi-package ball grid array technology (MPBGA), a member of the multi-chip module (MCM) package family

The Year of Living Dangerously

Sun, 12 Dec 2002
Here we are at the end of 2002, at pretty much the same point we were at the end of 2001?having survived a very difficult year and assuming/hoping that business would be better by about the middle of the following year.

Ceramic Packaging's Long Road

Fri, 11 Nov 2002
Packaging markets have come full circle over the past 40 years. In the 1960s, thick- and thin-film hybrid technology addressed, in part, limitations of integrated circuit (IC) technology.

Small-volume dispensing

Thu, 2 Feb 2001
Micro-valve dispensing can minimize setup between PCB runs and reduce material costs

Movers and shakers

Mon, 1 Jan 2001
Ferro Electronic Materials, a division of Ferro Corp., Vista, Calif., appointed Robert S. Hodder, Jr. as North American sales manager, East region

Movers and Shakers

Fri, 6 Jun 2001
Palomar Technologies Inc. (Vista, Calif.) has named Kevin Conlon chief operating officer

Save the whales ... not the lead!

Fri, 6 Jun 2001
During the first week of November each year, Japanese whaling vessels leave the ports of Hiroshima and Yamaguchi in western Japan bound for the Antarctic to catch another haul of Minke whales

The back-end process: Step 6 - Lead forming step by step

Fri, 6 Jun 2001
The integrated circuit (IC) packaging industry currently seems to be concentrating on the development of non-leaded packages (such as chip scale ball grid arrays [CSBGAs] and QFNs), but leaded products

CSP devices on printed wiring boards

Mon, 1 Jan 2001
Second-level reliability characterization using temperature cycling

Chip/package co-design

Fri, 6 Jun 2001
Because of deep sub-micron technology, chips now contain more functionality and are being driven to higher performance levels than ever before. At the same time, manufacturing technology is undergoing rapid change, and mixed analog/digital logic can now be placed on the same die

Packaging of liquid crystal on silicon microdisplays

Tue, 5 May 2001
LCoS manufacturing incorporates both traditional and novel packaging methods

Computer simulations of solder joint reliability tests

Tue, 5 May 2001
In the microelectronics industry, reliability of a package is usually assessed by the integrity of its solder joints. Tin-lead eutectic and near-eutectic solder alloys are the most commonly used bonding materials in electronic packaging, providing electrical and thermal interconnection, as well as mechanical support

The Boxes for Birthday Presents

Thu, 2 Feb 2001
Tom, the older brother, made a rectangular box in which to pack his father's birthday present. The box was one foot in height, with a base diagonal of 37 inches

Briefly speaking

Thu, 2 Feb 2001
Advanced Semiconductor Engineering Inc. (ASE) has opened its Chungli Intelligent Industrial Park, which combines the services of a group of ASE companies

Lead-free packaging

Sun, 4 Apr 2001
Investigating pure tin as an alternative finish

New products

Sun, 4 Apr 2001
A new line of thermoelectric/solid state air conditioners provides a broad range of thermoelectric cooling and heating protection in laser-based systems, scientific instruments and computer control packages for industrial and military applications

WEB WATCH

Sun, 4 Apr 2001
Lytron Inc. has announced an updated version of its Thermal Reference Guide at www.lytron.com. The online guide provides specifications, performance data and selection guidelines for the company's full line of thermal management products

Automated ribbon bonding

Sun, 7 Jul 2001
The extent of the commercial marketplace for high-frequency devices requires high-quality, high-volume ribbon bonding. The ability to automatically bond ribbon wire with consistency is important for producing the required electrical and mechanical performance

New Products

Thu, 11 Nov 2001
Abletherm 3100 is a new family of advanced thermal interface materials for high-performance, flip chip BGA packages

Hang around - the fun is just beginning

Thu, 11 Nov 2001
If you want to see the future of packaging, check out "Brain-Implantable Biomimetic Electronics as the Next Era in Neural Prosthetics" in the July 2001 issue of Proceedings of the IEEE

ASE Introduces Three-tier Fine-pitch Wire Bonding

Tue, 10 Oct 2002
SANTA CLARA, CALIF. — Advanced Semiconductor Engineering Inc. (ASE) announced a new wire bonding technology with three tiers of fine-pitch wire bonds.

Multitest vertical contact test probe technology eschews barrels

Fri, 10 Oct 2011

Multitest debuted the Quad Tech concept, next-generation vertical contact technology with a barrel-less architecture.


TSV fab tool combines stress-free CMP with thermal flow etch

Fri, 10 Oct 2011

ACM Research Shanghai, Ltd., introduced the integrated Ultra iSFP stress-free polishing (SFP) semiconductor manufacturing tool for 65-45nm copper (Cu) interconnects, improving through silicon vias (TSV) with better heat dissipation.


EVG launches ZoneBond-capable modules

Thu, 10 Oct 2011

EV Group (EVG) launched a suite of temporary bonding and debonding equipment modules that support ZoneBOND technology.


Brewer Science, EVG commercialize temporary wafer bonding with zoning laws

Thu, 10 Oct 2011

Brewer Science Inc. and EV Group (EVG) will both commercialize ZoneBOND technology for temporary wafer bonding, thin wafer processing, and debonding applications.


Nantong Fujitsu Microelectronics installs NEXX tool for copper pillar, RDL packaging

Wed, 10 Oct 2011

NEXX Systems shipped a Stratus electrochemical deposition tool to Nantong Fujitsu Microelectronics Co. Ltd. (NFME), based in Jiangsu province, China. NFME will use the Stratus for copper pillar and RDL advanced packaging applications.


MVTS expands in California, Malaysia, and Taiwan

Tue, 10 Oct 2011

MVTS Technologies opened new offices in San Jose, CA; Penang, Malaysia; and Hsinchu, Taiwan to support growing demand for test, assembly, and other IC production equipment and services among semiconductor manufacturers.


Air-cooled wafer probe chuck debuts in modular format

Mon, 10 Oct 2011

ERS uncrated the ERS AirCool 3 wafer thermal test system with modular options and easy integration into all major wafer prober systems.


IMAPS: Markovich takes reins, Jones given Lifetime Achievement Award

Fri, 10 Oct 2011

At the IMAPS 44th International Symposium on Microelectronics in Long Beach, CA, Voya Markovich, well-known industry PCB and packaging expert, took over the reins as the organization

IMAPS semiconductor packaging award bestowed on Nordson Asymtek's Adamson

Fri, 10 Oct 2011

Steven J. Adamson, marketing specialist with Nordson ASYMTEK, received the Daniel C. Hughes, Jr., Memorial Award, for the greatest contribution to IMAPS and the microelectronics packaging industry.


Fraunhofer, EVG develop temporary wafer bonding for thicker die

Tue, 10 Oct 2011

EV Group (EVG) will work with Fraunhofer IZM's ASSID research center to develop temporary bonding/debonding technologies for thicker die structures, some as large as 600

CSCD probe head accurately tests high-frequency devices on small pads

Tue, 10 Oct 2011

Cascade Microtech Inc. debuted InfinityQuad, a multi-contact probe head capable of automatically probing aluminum (Al), copper (cu), or gold (Au) pads as small as 30 x 50

Fraunhofer IZM's packaging center installs Altatech CVD

Tue, 10 Oct 2011

All Silicon System Integration Dresden (ASSID) installed an Altatech 300mm CVD tool for dielectric film deposition on advanced through silicon vias (TSV), with diameters as small as 10

DuPont LTCC material suits 50GHz+ electronics

Fri, 10 Oct 2011

DuPont Microcircuit Materials, part of DuPont Electronics & Communications, uncrated its DuPont GreenTape 9K5 low temperature co-fired ceramic (LTCC) packaging material, offering good dielectric constant properties for higher speed, frequency, and reliability applications.


Multitest wins gravity test handler order for leaded and leadless package test

Thu, 10 Oct 2011

Test equipment provider Multitest installed a MT9928 XM Gravity Test Handler at a semiconductor production facility after a 1-year+ benchmarking against two major competitors.


Tamar Technology debuts TSV metrology tool WaferScan

Tue, 10 Oct 2011

Tamar Technology shipped its first fully automated WaferScan system to a major semiconductor fab. The system performs TSV etch depth, deep trench depth, wafer thickness, photo-resist thickness, and hole diameter metrology.


IMAPS 2011 preview

Mon, 10 Oct 2011

IMAPS 2011, the 44th International Symposium on Microelectronics, will take place in less than one week at the Long Beach Convention Center. Ahead of the show, here are some of the highlights for attendees.


Epson inkjet semiconductor marking system prevents die damage

Tue, 9 Sep 2011

Seiko Epson Corporation introduced the IP-2000 inkjet semiconductor marking system to print identification data on the surface of a semiconductor package without the danger of damage from laser cutting


CSCD completes test socket biz sale, authorizes stock repurchase

Tue, 9 Sep 2011

Cascade Microtech (NASDAQ:CSCD) completed the sale of its test socket manufacturing business for $550,000 to R&D Interconnect Solutions. Cascade's board of directors also authorized a stock repurchase program under which up to $2,000,000 of its common stock may be repurchased.


Ziptronix low-temp direct oxide bonding scales pixels to 0.7

Tue, 9 Sep 2011

In a podcast interview with ElectroIQ.com, Ziptronix president & CEO, Daniel Donabedian, and company CTO, Paul Enquist, discussed both the Ziptronix wafer bonding technology and their partnership with Sony.


Stress-free Epoxy
Cotronics, Corp.

Mon, 11 Nov 2008
Duralco 125 stress-free epoxy from Cotronics Corp. forms a flexible, electrically conductive bond for continuous use to 400°F. It reportedly provides outstanding electrical conductivity, high bond strength, thermal and mechanical shock resistance, adhesion to dissimilar substrates, and chemical resistance.

Oerlikon Esec and M

Wed, 11 Nov 2008
(November 26, 2008) CHAM, Switzerland and RODING, Germany, — Oerlikon Esec, semiconductor equipment manufacturer, and M

IMAPS International 2008 In Review

Mon, 11 Nov 2008
By Gail Flower, Editor-in-Chief
This year's IMAPS International Symposium had great international participation, good attendance and excellent presentations from keynoters to the technologically cutting-edge educational papers. It was election day when the IMAPS conference began, and by the second day of the conference, a new president entered the picture. Therefore, the first day proceeded without a rush of attendees as expected, but the second perked up with lively conversation.

Advisory Board

Mon, 11 Nov 2008

By R. Wayne Johnson, Ph.D., Auburn University

While $4/gal.gasoline prices have dropped, it is inevitable they will rise again. So what does this have to do with advanced packaging? A lot! While we hear discussions of alternate energy, we will continue to use oil for the foreseeable future. Electronics (and advanced packaging) are important for measurements during well drilling and for production management over the life of the well.


K&S CEO Scott Kulicke Offers Industry Insight

Thu, 7 Jul 2008
(July 16, 2008) SAN FRANCISCO — In a round table discussion over lunch, Scott Kulicke, CEO, Kulicke & Soffa, responded with candor to questions posed by analysts from Prismark Partners, VLSI Research, and TechInternational; and editors from a variety of industry publications. Topics ranged from the success of the company's recent tool launch, last year's acquisition of Alphasem, the transition to copper wire bonding from gold wire, and the state of the industry

High-speed, Fully Automatic Wedge Bonder for Wire and Ribbon

Wed, 7 Jul 2008
The BONDJET BJ820, from Hesse & Knipps, is a high-speed, fully automatic wedge bonder for both high-speed round wire and deep access ribbon and wire bonding. It handles all challenging fine pitch wire bonding applications in a single platform - including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive - using aluminum or gold wire or ribbon. It reportedly offers bond speeds up to 7 wires-per-second.

SMT/Hybrid/Packaging 2008: Exhibitor Offerings Span Electronics Supply Chain

Fri, 6 Jun 2008
Nuremberg, Germany — Bigger and more international than ever, exhibitors at SMT/Hybrid Packaging, June 2-4, Nuremberg, Germany, focused their product showcases around the theme of automotive electronics, or used the venue for the European launch of new products.

Replisaurus Acquires S.E.T.

Thu, 6 Jun 2008
(June 5, 2008) Kista, SWEDEN— Replisaurus Technologies, Inc., pioneer in nanoscale electrodeposition of metal patterns, has acquired S.E.T. SAS to establish a production site for its integrated and fully automated high-volume manufacturing tools for its proprietary ElectroChemical Pattern Replication (ECPR) technology.

Non-silcone Thermal Die Attatch Lid

Tue, 6 Jun 2008
MT-431, from Lord Corporation, is a non-silicone thermal die lid attach (TDLA) adhesive that was reportedly developed to replace two material processes, with a single effective solution. The material is formulated with thermal and adhesion properties that perform well enough to replace both typical thermal interface materials (TIMS) and lid attach adhesive.

Henkel Launches Research and Failure Analysis Center with Shanghai University

Tue, 7 Jul 2008
(July 1, 2008) IRVINE, CA. — To promote electronics material advancement in the burgeoning China region, Henkel and Shanghai University, in conjunction with several leading research universities, entered into an agreement to form a Shanghai Region Joint Electronics Research and Failure Analysis Center. The official signing ceremony marking the commencement of the partnership took place on June 10, 2008 at Henkel Asia-Pacific and China headquarters in Shanghai, China.

LORD Corp. Expands Labs, R&D Center

Thu, 6 Jun 2008
(June 26, 2008) CARY, NC — LORD Corporation, supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics industry, will embark on a $2.5 million renovation to its electronic materials labs in Cary, N.C. The expansion is intended to allow the company to add capabilities for technology development, such as individual package device reliability testing, said John Hill, technology manager for LORD's electronic boards and components industry group.

Online Intervew: Paul Magill Recaps Nextreme's Cool Year

Wed, 10 Oct 2008
(October 29, 2008) DURHAM, NC —Time flies when you're having fun, or when you're getting a start-up off the ground. From the introduction of an enabling technology, through several rounds of funding, award of a grant, four product launches incorporating said technology, the construction and grand opening of a manufacturing facility, RoHS compliance, and ongoing plans for more, the past year has been peppered with notable events for Nextreme Thermal Solutions.

Cooling 3D Packages with Thin-film Thermoelectrics

Mon, 10 Oct 2008
By Paul A. Magill, Ph.D., Nextreme Thermal Solutions, Inc.
The electronics industry is moving to 3D packaging structures which will shorten the electrical path length, thereby allowing for higher transmission speeds. As this clears the way for faster processors, it also means that thermal management solutions for these 3D structures will need to be developed.

Plasma Etching/Cleaning System

Mon, 8 Aug 2008
The PE-200-RIE Convertible, from Plasma Etch, is a convertible RIE configuration of the companies PE-200 plasma etching/cleaning system. Designed for anisotropic etching of nitrides, oxides, and polyimide, the system features a 13

Wafer Backside Coating

Mon, 8 Aug 2008
Using stencil, screen printing, and spin coating techniques, Henkel's Ablestik 8000 series, wafer backside coating (WBC) reportedly enables the deposition of die-attach materials to the wafer backside down to a thickness of 20 µm on wafers as thin as 100 20 µm and up to 300 mm in diameter. Unlike conventional dispensing methods, printing or spin coating materials onto the wafer is said to deliver a tightly controlled, high UPH for high-volume die attach adhesive deposition.

Solder-free Connectors Using Buckled Pillars

Fri, 9 Sep 2008
By Peter Salmon, Salmon Technologies
A particularly versatile form of wafer bumping is stud bumping, using either gold or copper wire. The equipment required is an adaptation of a traditional wire bonder. A ball bond is made at a first contact pad using heat and ultrasonic energy. The wire is extended in a precise direction and a flying lead is created by terminating the wire, for example using electronic flame-off (EFO).

X-Ray Inspection Identifies Flip Chip Detects

Tue, 9 Sep 2008
Using 2D and 3D X-ray techniques to find and confirm manufacturing defects in flip-chip devices
By Evstatin Krastev, Ph.D. Dage Precision Industries, a Nordson Company
While flip chip design eliminates excessive packaging, high-density flip chip devices place a greater burden upon device inspection. The combination of 2D x-ray and CT analysis offers powerful analytical capabilities need for the complete inspection of flip-chip devices and stacked packages.

High Resolution SEM

Tue, 7 Jul 2008
With the Magellan XHR SEM, FEI Company has launched a class of instruments called extreme high-resolution scanning electron microscopes that allow scientists and engineers to view 3D surface images at different angles and at resolutions below one nanometer. The Magellan XHR SEM images samples at very low beam energies, avoiding distortions otherwise caused by the beam penetrating into the material below.

Henkel Names New Electronics Executive Team

Fri, 7 Jul 2008
(July 25, 2008) IRVINE, CA — Following its acquisition of the Adhesives and Electronics Materials businesses from National Starch and Chemical Company, Henkel has announced its executive team to take the company forward. Under the direction of Alan Syzdek, corporate senior V.P. the electronics group of Henkel will be organized on a global basis by industry sector.

Evaluating a TIM for Flip Chip Packages

Mon, 10 Oct 2008
By V. Gektin, M. Stern, Sun Microsystems; L. Larson, D. Bhagwagar, J. Marin, Dow Corning Corp. K.Nakayoshi , Dow Corning Toray Co., Ltd.
As power levels and heat generation increase in high-performance CPUs and other semiconductor devices, the thermal performance of commonly used packaging components is becoming a limiting factor. A silver-filled silicone material specifically for TIM 1 applications (the die/lid interface) was designed to meet this challenge.

Oerlikon hands off Esec packaging biz to Be Semi

Tue, 1 Jan 2009
Seeing no more synergies with its now-core technical and strategic areas, Germany's Oerlikon says it has sold its Esec die attach/bonder business to Dutch firm BE Semiconductor.

Replisaurus/S.E.T. to Collaborate with IMEC on 3D Integration

Tue, 1 Jan 2009
(January 13, 2009) SAINT JEOIRE, France — Smart Equipment Technology (S.E.T.), a wholly-owned subsidiary of Replisaurus Technologies, announced a collaboration with IMEC to develop die pick-and-place and bonding processes for 3D chip integration using S.E.T.'s flip chip bonder equipment. As part of the collaboration, S.E.T. will join IMEC's Industrial Affiliation Program (IIAP) on 3D integration.

Semiconductor Materials Post Record Revenues

Tue, 4 Apr 2008
(April 1, 2008) SAN JOSE, CA — The global semiconductor materials market grew 14% in 2007 and is forecasted to grow over 11% in 2008 according to the latest materials forecast from SEMI. While the semiconductor industry grew 3% in 2007 to reach the $256B published by the Semiconductor Industry Association (SIA), the global semiconductor materials market grew 14% in 2007 to reach a record $42 billion.

DuPont Microcircuit Materials Highlights Developments at Printed Electronics Europe

Tue, 4 Apr 2008
(April 1, 2008) BRISTOL, U.K. — As part of DuPont Microcircuit Materials' (MCM) participation at IDTechEx Printed Electronics Europe, which focuses on thin film and organic electronics, Kerry Adams, Ph.D, market development lead, DuPont, will discuss the company's developments in inks and imaging for printed electronics. The event will be held at Maritim Hotel and Congress Centre in Dresden, Germany on April 8

Antenna-grade High-frequency Circuit Materials

Wed, 9 Sep 2008
RO3000 and RO4000 laminates, from Roger's Corp. are antenna-grade materials that feature low passive intermodulation (PIM), low loss, and are suited for use in antennas for 3G, WiMAX and LTE cellular base stations, satellite earth stations, GPS systems, and RFID readers.

International Wafer-Level Packaging Conference (IWLPC) Finalized

Wed, 7 Jul 2009
(July 22, 2009) MINNEAPOLIS — The 6th Annual International Wafer-Level Packaging Conference (IWLPC), October 27-30, 2009, Santa Clara, CA includes tutorials, expert panel discussions, Dr. Rao Tummala keynoting, and 18 tech sessions.

3D integration: A status report

Tue, 7 Jul 2009
3D IC technology, an alternative approach to wire-bonded chip stacking utilizing interconnets with through-silicon vias (TSVs) fabricated with front-end-like processes, is a hot topic at SEMICON West, and the focus of an on-line virtual forum hosted by public relations firm MCA.

VLSI Forecast for Semiconductor Equipment

Thu, 7 Jul 2009
Semiconductor equipment manufacturers posted a book-to-bill ratio of 1.01 in June, according to VLSI Research. It was the first increase above parity since July 2008. Although bookings and billings remain well below normal levels, business activity is beginning to improve. Back-end suppliers are seeing a considerable pick up in business activity amid soaring utilization rates at the subcontractors.

Package-on-package (PoP) track at SMTAI

Wed, 8 Aug 2011

The SMTA will host conference events with Amkor, Research in Motion, and TechLead Corporation on package-on-package (PoP) 3D stacking at SMTA International (SMTAI), October 16-20 in Fort Worth, TX.


Assembleon launches packaging toolset with low impact force

Tue, 8 Aug 2011

Assembl

Multitest test contactor wins out in IDM yield comparison

Thu, 8 Aug 2011

An IDM recently performed side-by-side comparisons of a Multitest Mercury test contactor and an "established contactor of an incumbent Asian competitor" during high-volume production package testing.


Inside the Known Good Die conference

Wed, 8 Aug 2011

The annual Known Good Die (KGD) conference, taking place Nov. 10 in Santa Clara, CA, will address semiconductor die testing, assembly, manufacturing, and business challenges, with the tagline "KGD in an Era of Multi-Die Packaging and 3D Integration."


MEMS, 3D packaging major factors in iNEMI roadmap

Tue, 8 Aug 2011

The 2011 iNEMI Roadmap, published by the International Electronics Manufacturing Initiative (iNEMI), includes a new chapter on MEMS and sensors, and an expanded chapter on packaging to include substrates discussions.


Plasma treatment research lab launched in China

Thu, 8 Aug 2011

Nordson MARCH and Science College of Donghua University, Shanghai, China launched a joint laboratory for plasma research and education. The college and supplier will share equipment, research projects, personnel resources, and additional resources as needed.


Microbonds wins University of Waterloo support

Wed, 8 Aug 2011

The University of Waterloo, Ontario, through the Applied Research and Commercialization Initiative, is supporting several companies researching and developing new products. One company receiving aid from the school is Microbonds, maker of semiconductor bonding wire.


Multitest intros 16-site package test handler

Wed, 8 Aug 2011

Multitest launched a 16-site tri-temp pick-and-place handler, the MT9510 x16. The platform can be kitted to test a range of semiconductor packages.


Analyst: Gold price surge helping Cu wire shipments

Mon, 8 Aug 2011

Industry efforts to transition from gold to copper wire are accelerating as prices for gold continue to spike to near record levels, notes TechSearch International in a new report.


Nomura divests semiconductor packaging substrate maker shares

Sun, 8 Aug 2011

Nomura Principal Finance Co. Ltd., a wholly owned subsidiary of Nomura Holdings Inc., transferred all the shares it owns in Eastern Co. Ltd. to Eastern.


Data I/O's next-gen pre-placement programmer prevents operator errors

Tue, 8 Aug 2011

Data I/O Corporation (NASDAQ: DAIO) debuted the RoadRunner3 in-line programming system, a just-prior-to-placement programming tool with modules to automate processes and eliminate operator interventions.


EVG expands HQ, hiring 100

Wed, 7 Jul 2011

EV Group (EVG), wafer bonding and lithography equipment supplier, began a manufacturing capacity expansion at its Austrian headquarters, adding floorspace, equipment, worker comforts, and a state-of-the-art visitor area. EVG will hire about 100 new staff members as part of the expansion.


NSMAT licenses Pd-coated Cu bonding wire to competitor

Fri, 7 Jul 2011

Nippon Micrometal Corporation (NMC) licensed their single-layer-palladium (Pd) coated copper (Cu) bonding wire for LSI packaging to Tanaka Denshi Kogyo K.K., bonding wire manufacturer and traditionally a competitor.


Gold tin process from Stellar Industries improves wettability in die bonding

Mon, 2 Feb 2011

The new gold/tin (AuSn) process from Stellar Industries is ideally matched to Stellar’s proprietary CPU copper on aluminum nitride (AlN) submounts with its sharp guillotine edge for precise edge alignments.The new gold/tin (AuSn) process from Stellar Industries is ideally matched to Stellar’s proprietary CPU copper on AlN submounts with its sharp guillotine edge for precise edge alignments.


Multitest wins InCarrier test handling system order

Thu, 2 Feb 2011

Multitest test handling systemMultitest received its fifth full purchase order for its InCarrier device transfer system with InStrip test handling system adapted to metal frame-based carriers.


K&S high volume fine pitch Cu wire bonding

Wed, 2 Feb 2011

Figure. Copper transition and roadmap planning. SOURCE: Kulicke & SoffaAs gold becomes more expensive, copper wire bonding becomes more appealing for chip packaging. Reverse bonding, fine-pitch bonding, looping, second bonds, and other technologies are ramping on roadmaps, according to Kulicke & Soffa (K&S).


300mm bonder will demo chip to wafer direct metallic bonding tech developed at Leti

Tue, 2 Feb 2011

CEA-Leti, in a multi-partner project with SET, STMicroelectronics, ALES and CNRS-CEMES, will demonstrate high-alignment-accuracy chip-to-wafer structures made by direct metallic bonding. Such structures are required for high-performance 3D ICs, and possibly microelectronics, optoelectronics, or MEMS.


Advanced transmission lines replacement for TSVs

Fri, 2 Feb 2011

Jamal Izadian, co-founder & president of RFCONNEXT, makes the case for shaped membrane transmission lines (SMTL) for use in high-speed 3D packaging applications. SMTL supports and improves flip-chip, micro-bumping, wafer thinning, system-in-package (SiP), package-on-package (PoP), and other packaging processes by extending the bandwidth and high-speed limits of these technologies.


Camtek logs CMOS image sensor inspection unit orders

Tue, 2 Feb 2011

Camtek Ltd. (Nasdaq:CAMT; TASE:CAMT) received an order for multiple wafer inspection systems from one of the world's largest manufacturers of CMOS image sensors (CIS).


Palomar discusses high volume HB LED assembly at Strategies in Light

Fri, 2 Feb 2011

Palomar Technologies, precision microelectronics and optoelectronic packaging systems provider, will hold meetings at Stategies in Light to discuss its recent upgrades to high-brightness LED (HB-LED) assembly.


Hitachi Chemical claims die bonding film patent violation

Thu, 1 Jan 2012

Hitachi Chemical filed a lawsuit against INNOX in Taiwan, alleging infringement on Hitachi Chemical's Taiwanese patent related to die bonding film used in semiconductor packaging processes.


Optomec expands aerosol jet lab for 3D semiconductor packaging, PV, other device formation

Thu, 1 Jan 2012

Optomec opened its new and expanded Advanced Applications Lab and Product Development Facility in St. Paul, MN. The facility will help Optomec grow its Aerosol Jet additive manufacturing technology for advanced printed electronics applications.


Anti-counterfeiting program uses DNA to uniquely code computer chips

Wed, 1 Jan 2012

The College of Nanoscale Science and Engineering (CNSE) and Applied DNA Sciences (APDN) are partnering to prevent the counterfeiting of computer chips.


Hesse & Knipps discusses wedge bonding for RF and microwave devices at workshop

Wed, 1 Jan 2012

Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Wedge Bonding for RF and Microwave Devices" at the Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging


MHI room-temp wafer bonder line grows with 300mm tool

Mon, 1 Jan 2012

Mitsubishi Heavy Industries launched a fully automated 12" (300mm) wafer bonding tool, Bond Meister MWB-12-ST, capable of producing 3D LSI circuits at room temperature. The 300mm bonder targets production of memory chips and MPUs.


Zymet PoP underfill offers lower viscosity, CTE for finer pitches

Wed, 1 Jan 2012

Zymet introduced the CN-1736 reworkable underfill encapsulant for 0.4mm-pitch package-on-package (PoP) assemblies.


Upcoming SMTA events: IWLPC keynote named, SMTAI seeks presenters

Tue, 1 Jan 2012

The SMTA released its call for presenters for SMTA International (SMTAI) 2012, October 14-18 in Orlando, FL. The association, along with Chip Scale Review magazine, also announced the keynote for the International Wafer-level Packaging Conference (IWLPC), held November 5-8, San Jose, CA.


UltraFlat wafer-level semiconductor test process creates permanent PCB flatness

Mon, 1 Jan 2012

Multitest qualified its UltraFlat process for high parallel vertical probe card tests. UltraFlat provides permanent overall PCB flatness for better wafer-level test.


Hesse & Knipps heavy wire bonder handles power semis

Fri, 1 Jan 2012

Hesse & Knipps Inc. introduced its next-generation BONDJET BJ93X heavy wire bonder for back-end semiconductor assembly, targeting manufacturers of power semiconductors and automotive electronics.


Advantest to expand beyond semiconductor test

Thu, 1 Jan 2012

Haruo Matsuno, president and CEO of Advantest Corporation (TSE:6857, NYSE:ATE) shares the company's major goals, including expansion into new measurement applications, utilization of cloud computing, and more.


PTI buys NEXX deposition tool for RDL and Cu pillar fab

Tue, 1 Jan 2012

NEXX Systems sold a 300mm Stratus electrochemical deposition (ECD) system to Powertech Technology for copper pillar bumps and re-distribution layers (RDL) fab, and possibly to make TSVs.


FormFactor probe card tests SoCs

Thu, 6 Jun 2012

FormFactor Inc. (NASDAQ: FORM) introduced TrueScale Matrix probe cards for 200mm and 300mm Full Wafer Contact system-on-chip (SoC) test applications.


@ The ConFab: Supply chain or supply web for 3D packaging?

Wed, 6 Jun 2012

With many advanced packaging processes taking place on the semiconductor wafer, the traditional supply chain of front-end fab at the foundry and back-end fab at the packaging and test house is falling apart. The ConFab session,

3D and 2.5D semiconductor packaging technologies @ The ConFab

Wed, 6 Jun 2012

As packaging has played a larger and larger role in chip performance, form factor, and capabilities, The ConFab has increased its focus on back-end processes. Cue

Flash memory maker orders additional Aehr full-wafer test tool

Tue, 6 Jun 2012

Aehr Test Systems (Nasdaq:AEHR) will install an additional FOX-1 full-wafer test system at a leading flash memory manufacturer.


APDN extends DNA products to microelectronics counterfeit prevention with S3IP

Mon, 6 Jun 2012

The New York State Center of Excellence in Small Scale Systems Integration and Packaging at Binghamton University (S3IP), and Applied DNA Sciences will develop new ways to embed and authenticate DNA on various substrates. This may involve marking semiconductor packaging, and exploring rapid-reading technologies to screen chips.


New Japan Radio implements Cu wire bonding for power semiconductors

Wed, 5 May 2012

New Japan Radio Co. Ltd. adopted Tanaka Denshi Kogyo KK

Semiconductor packaging house orders 14 Rudolph Technologies inspection tools

Tue, 5 May 2012

Rudolph Technologies Inc. will deliver 14 NSX Series 320 inspection systems to a large outsourced semiconductor assembly and test (OSAT) provider.


Top suppliers of semiconductor assembly and test equipment: VLSIresearch survey

Fri, 5 May 2012

THE BEST rankings from VLSIresearch identify the highest-rated suppliers of wafer processing, assembly, and test equipment. The top 2 test equipment suppliers were just fractions apart in the rankings.


APNT's new thermal interface materials meet power semiconductors' reqs

Wed, 5 May 2012

Applied Nanotech Holdings Inc. uncrated the THERCOBOND family of highly thermally conductive bonding and printed materials for power electronics and photonics packaging.


Indium expands electronics materials manufacturing with new facility in NY

Wed, 5 May 2012

Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.


Dow Electronic Materials promotes Muni to direct advanced packaging products

Mon, 5 May 2012

Bhavesh Muni took the helm as global business director for the Advanced Packaging Technologies business of Dow Electronic Materials, covering Dow's semiconductor packaging materials product portfolio and its manufacturing capabilities.


IC packaging substrates heading for $8.67B in 2012

Fri, 5 May 2012

In 2012, the global IC substrate market will reach a value of USD8.67 billion, according to Research in China

Wire bonder debuts with Cu wire optimization, automatic rethreading from ASM Pacific Technology

Wed, 5 May 2012

The ASM iHawk Xpress Opto Wire Bonder from backend semiconductor assembly equipment supplier ASM Pacific Technology offers new innovations in transport, copper-wire bonding, and automatic rethreading.


Kulicke & Soffa expands Singapore HQ, bolsters bonder tool R&D and manufacturing

Wed, 5 May 2012

Kulicke & Soffa broke ground on its Singapore global headquarters expansion, near the current leased headquarters location. A state-of-the-art facility in Serangoon will bolster the company

DRIE expands from MEMS to advanced packaging and more applications

Tue, 5 May 2012


Heraeus Al-clad Cu bonding wire avoids metallization changes in power semiconductors

Mon, 5 May 2012

Heraeus introduced its high-reliability composite aluminum/copper (CucorAl) semiconductor bonding wire, which offers strong mechanical and electrical bonds to semiconductor pads, with good thermal properties.


Hitachi Chemical Henkel die attach film license

Sun, 2 Feb 2011

Hitachi Chemical has granted Henkel a worldwide license for the manufacture and sales of certain dicing die attach film.


3D integration comes in many flavors for semiconductor industry, says CEA Leti chief scientist

Wed, 2 Feb 2011

All the major semiconductor players are embracing 3D integration, says Simon Deleonibus. The CEA-Leti scientist and IEEE Fellow wants to see TSV mature and new technologies develop based on wafer bonding. He speaks with Debra Vogler.


Conductive pressure sensitive tapes films introduced by Creative Materials

Tue, 2 Feb 2011

Creative Materials Inc. announced a new series of pressure-sensitive tapes that suit use in the fabrication of solar cells and modules; to replace solder and/or conductive adhesive connections; or as bus bar materials for a wide variety of printed electronics applications, including touch panels, LCDs, electro-chromatic displays, and electro-luminescent displays.


Brush Engineered Materials changes name to Materion

Thu, 1 Jan 2011

Brush Engineered Materials Inc. (NYSE:BW) will change its name to Materion Corporation (NYSE:MTRN) and unify all of its businesses under the new name effective March 8, 2011.


Chipscale packaging tech garners SEMI award

Mon, 1 Jan 2011

SEMI named Thomas DiStefano, John W. Smith Jr., and Michael Warner as recipients of the 2010 SEMI Award for North America for contributions to the development and commercialization of Micro Ball Grid Array (μBGA) technology.


RoHS, device shrinks will continue to drive packaging technology

Tue, 1 Jan 2011

Environmental legislation in combination with device miniaturization will continue to drive packaging development efforts throughout 2011 and beyond, writes Doug Dixon from Henkel. And the paradigm of "smaller, thinner, more powerful" is challenging traditional design and assembly rules.


Nautic_acquires Aavid Thermalloy for thermal management products

Tue, 1 Jan 2011

Nautic Partners has partnered with management to acquire Aavid Thermalloy LLC. Aavid designs and manufactures high-performance thermal management products used in a wide range of electronics systems and energy supplies.


CoorsTek acquires Saint Gobain Advanced Ceramics

Tue, 1 Jan 2011

CoorsTek Inc., technical ceramics manufacturer, completed its purchase of the advanced ceramics business of Saint-Gobain. CoorsTek adds manufacturing facilities and product lines such as silicon carbide for semiconductors.


22nm: The era of wafer bonding

Tue, 1 Jan 2011

The migration to the 22nm node is about more than just scaling down, it's also about scaling up with thinner devices stacked into a single package -- and these require new manufacturing considerations with wafer bonding playing a central role, writes Bioh Kim from EV Group.


Thermal nano tape for semiconductor packaging

Mon, 1 Jan 2011

SRC and researchers from Stanford University have developed a combination of elements that yields a unique nanostructure material for packaging. This advance should allow longer life for semiconductor devices while costing less than current state-of-the-art materials.


IMAPS: 3D IC toolset readiness, Cu bonding, interposer failings

Tue, 3 Mar 2011

Dr. Phil Garrou reports on several talks and trends of note from the recent IMAPS meeting and Device Packaging Conference: the readiness of 3D IC toolsets, what's holding back Cu bonding; and rumors of interposers failing thermal tests.


Samsung licenses Tessera OptiML zoom tech

Thu, 3 Mar 2011

The System LSI Division of Samsung Electronics Co. Ltd. has licensed the OptiML Zoom image enhancement solution from Tessera Technologies Inc. (NASDAQ:TSRA).


GE thermal material substrate conducts heat better than copper

Wed, 3 Mar 2011

Figure. A diagram of GE's advanced thermal material system. Leveraging unique surface engineered coatings that both repel and attract water, GE's system achieves twice the heat conducting properties of copper and can function under extreme forces of gravity.GE's prototype thermal interface material, developed with nanotechnologies, suits high-heat, high-reliability applications in mobile devices, aviation electronics, and other systems.


Japan quake hampering package substrate supplies

Wed, 3 Mar 2011

Amid questions about the impact of the Japan earthquake on electronics and semiconductor production, there's one angle that could directly affect the semiconductor packaging sector: BT resin shortages.


Hynix Semiconductor joins SEMATECH 3D Interconnect Program at UAlbany NanoCollege

Wed, 3 Mar 2011

Hynix Semiconductor Inc., DRAM and flash memory supplier, joined SEMATECH's 3D Interconnect program at CNSE's Albany NanoTech Complex to address industry infrastructure and technology gaps in materials, equipment, integration and product-related issues for high-volume adoption of through silicon vias (TSV).


Thermal modeling software aids 3D IC, SoC, SiP designs

Thu, 3 Mar 2012

Docea Power, power and thermal analysis software supplier, released AceThermalModeler for generating compact thermal models of SoCs, 3D ICs, SiP devices, and complete boards.


Package and test provider orders new Verigy Smart Scale technology

Thu, 3 Mar 2012

LED packaging report reveals costs, reliability impact of package

Fri, 2 Feb 2012

With thermal issues accounting for half of all lighting failures, and costs prohibitive to widespread adoption, assembly and packaging are keys to improving LEDs. TechSearch International tracks LED packaging materials and methods, as well as reliability and package efficiency.


NEXX Systems bolsters employee skills with new grant

Thu, 2 Feb 2012

Present at ESTC 2012 in Amsterdam

Tue, 2 Feb 2012

Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.


Join iNEMI's electronics manufacturing supply chain workshop at IPC APEX

Fri, 2 Feb 2012

iNEMI will hold the industry kick-off for its 2013 Roadmap in an open workshop immediately following IPC APEX EXPO in San Diego, CA, March 1-2.


Universities: Enter to win a Finetech die bonder

Wed, 2 Feb 2012

Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges.


Hesse & Knipps opens wedge bonder demo lab on West Coast

Wed, 2 Feb 2012

Backend packaging equipment supplier Hesse & Knipps Inc. opened a West Coast Demo and Applications Laboratory at its manufacturer rep Chalman Technologies.


LEDs, power semiconductors packaged with high-thermal-conductivity die attach adhesives

Wed, 2 Feb 2012

Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for LEDs and small power semiconductor die packaging.


Synova Laser MicroJet wafer dicing tools to be made by Makino

Thu, 2 Feb 2012

Synova SA formed an OEM agreement with its partner Makino Milling Machine Co. Ltd., wherein Makino will manufacture Laser MicroJet (LMJ) tools based on Synova technology.


SATS providers order BTU reflow ovens in Asia

Wed, 2 Feb 2012

BTU International Inc. won multiple orders for PYRAMAX solder reflow ovens from semiconductor assembly and test subcontractors (SATS) in Asia.


Rudolph sells metrology tool for back-end wafer packaging processes

Mon, 2 Feb 2012

Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.


SUSS wafer bonder/debonder features up to 6 modules in new generation

Mon, 2 Feb 2012

SUSS MicroTec launched the XBC300 Gen2 high-volume 3D wafer processing tool for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers.


3M debuts high-capacitance ECM for IC packaging, RF, other apps

Thu, 2 Feb 2012

3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI).


Multitest launches MT9510 x16 test tool with Asian sale

Wed, 2 Feb 2012

Multitest launched its tri-temp 16-site pick-and-place platform, MT9510 x16, with an installation at a high-volume chip test site in Asia.


Tanaka establishes copper bonding wire production in Taiwan

Tue, 1 Jan 2012

Tanaka Denshi Kogyo K.K., of Tanaka Precious Metals, will establish a production subsidiary for manufacturing copper bonding wire in Taiwan, with manufacturing ramp on February 1.


Keithley Instruments upgrades semiconductor test software suite

Thu, 1 Jan 2012

Keithley Instruments Inc. upgraded the capabilities of its Automated Characterization Suite Test Environment to ACS Version 4.4. The software is used with several Keithley instrument and system configurations for automated device characterization and reliability analysis.


3D MID sensor fabricated with Ticona laser-activated LCP circuits

Wed, 1 Jan 2012

2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic circuits. The Vectra E840i forms circuits on 3D injection moldings produced with an LDS process.


Presto Engineering semiconductor service hub opens in Israel

Tue, 1 Jan 2012

Presto Engineering, integrated semiconductor test and product engineering services provider, opened its newest Hub to serve the semiconductor design community, in Israel.


WLCSP QFN ELP Semiconductor packaging for consumer applications

Wed, 1 Jan 2011

Semiconductor packaging for consumer products. Source: UnisemThere are a few key attributes in new consumer electronics: a reduced footprint and/or profile, high electrical performance, fine-pitch design, custom features, and a low cost. Multi-row, wafer-level, flip-chip, and multi-chip packaging can meet these needs, say Unisem writers Rico San Antonio and Chris Stai. They compare the value of each packaging type.


QFN leadframes without plating etching waste or bulk EoPlex

Mon, 1 Jan 2011

EoPlex model showing different materials (colors) and different metastructures (patterns).Arthur Chait, president and CEO of EoPlex, describes the company’s high-volume print forming technology -- a lead carrier product called xLC-- and how it enables a cost-effective replacement for conventional quad flat pack no-lead (QFN) leadframes.


Low shrinkage adhesive for optical assembly

Thu, 1 Jan 2011

DYMAX OP-67-LS opto-mechanical adhesiveA fast-cure, low-shrinkage adhesive for optics and optical assembly, DYMAX OP-67-LS opto-mechanical adhesive cures in seconds for bonding of optical components. The product's low-shrink nature virtually eliminates movement during curing and subsequent thermal cycling.


Lifting the veil on silicon interposer pricing

Mon, 12 Dec 2012

Are we closer than we think to our needed mass production costs for silicon interposers? Phil Garrou gleans some insights from the year-ending RTI Architectures for Semiconductor Integration and Packaging conference.


Singapore IME launches 2.5D silicon interposer MPW

Wed, 12 Dec 2012

Singapore's Institute of Microelectronics (IME) has launched a new multiproject wafer service for 2.5D through-silicon interposers, to provide a cost-effective platform for R&D prototyping and proof-of-concept in the technology.


Tezzaron licenses Ziptronix's bonding tech for 3D memory

Mon, 12 Dec 2012

Tezzaron Semiconductor has licensed patents regarding Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), for use in 3D memory.


Will the $2 interposer be silicon or glass?

Tue, 11 Nov 2012

Dr. Phil Garrou reports from the 2nd annual Georgia Tech 2.5D Interposer Conference: what's the market projection for silicon and glass interposers, what's preventing high-volume manufacturing, and is there a crossover with flat-panel display glass manufacturing?


Alchimer pursuing partners with new CEO, CTO

Tue, 11 Nov 2012

Alchimer SA says it is seeking partnerships with various semiconductor equipment and materials companies as it welcomes two top execs: Bruno Morel is the company's CEO since May of this year, and product development director Fr

Deca tips new M-Series chip-scale packaging offering

Wed, 11 Nov 2012

Deca Technologies has introduced a new chip-scale packaging (CSP) product line for applications where its existing wafer-level CSP option isn't a good fit. Details and analysis to come.


Teradyne tester boasts high throughput of consumer digital chips

Tue, 3 Mar 2012

Teradyne uncrated its Magnum semiconductor test system with a proprietary scalable chassis design and tester-per-board architecture for high compound parallel test efficiency on consumer digital devices.


New LTXC semiconductor test tools suit ASSP, RF test

Mon, 3 Mar 2012

LTX-Credence Corporation (Nasdaq:LTXC) released the Diamondx test platform for ASSP and the DragonRF for RF device test. In addition, LTX-Credence launched a SerDes test instrument and new testing software.


TEL acquires advanced packaging tool supplier NEXX

Fri, 3 Mar 2012

TEL will acquire semiconductor packaging equipment supplier NEXX Systems. NEXX makes advanced deposition equipment, including ECD and PVD tools, for wafer-level packaging (WLP).


Presto installs LTX-Credence semiconductor test platform for RF wireless devices

Thu, 3 Mar 2012

Presto Engineering selected an LTX-Credence Corporation (Nasdaq:LTXC) X-Series platform for testing wireless communications, automotive and industrial customer devices.


AMEC debuts TSV etch tool with Chinese installations

Wed, 3 Mar 2012

Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.


Shin-Etsu Chemical joins EVG wafer bonding supply chain

Wed, 3 Mar 2012

EV Group (EVG) welcomed Shin-Etsu Chemical  into its open platform for temporary bonding/debonding materials supporting 3D semiconductor packaging.


ULVAC cuts gold from package-level solder deposition process with sputtering methods

Tue, 3 Mar 2012

ULVAC Inc. developed solder deposition processes for silicon device manufacturing, including power devices, that sputters solder to deposit it rather than printing or evaporating the materials. The 2 processes eliminate gold, or gold and nickel, from the step.


Interposer supply/ecosystem examined at IMAPS Device Packaging

Mon, 3 Mar 2012

Dr. Phil Garrou, a contributing editor and regular blogger on Solid State Technology, shares the highlights of an Evolving 2.5D/3D Infrastructure panel he hosted at IMAPS Device Packaging. On the table: where TSVs and interposers are made, a TSV/interposer timeline and cost analysis, and the requirements of mobile electronics.


KLIC wire bonder debuts for low-pin-count, discrete packaging

Fri, 3 Mar 2012

Kulicke & Soffa Industries Inc. (K&S, NASDAQ:KLIC) introduced its ConnX Plus high-speed ball bonder for low-pin-count semiconductor packaging.


K&S capillary specifically suits LED wire bonding

Fri, 3 Mar 2012

Kulicke & Soffa launched the LUMOS Capillary for LED die wire bonding. The capillary can bond with gold or gold-alloy wires and uses a new TG ceramic material for better workability.


Kulicke & Soffa semiconductor wafer dicing blades tuned for discretes

Fri, 3 Mar 2012

Kulicke & Soffa Industries Inc. (K&S, NASDAQ:KLIC) launched its AccuPlus Hub Blades product line, customizable blades for discrete wafer dicing. 


Micro glass drilling enables 0.1mm semiconductor interposers

Thu, 3 Mar 2012

AGC (Asahi Glass Co. Ltd.) developed ultra-high-speed processing technology for micro hole drilling of 0.1mm-thin glass, targeting leading-edge applications such as 3D semiconductor packages.


SMIC releases Cu-BEOL manufacturing platform library

Thu, 3 Mar 2012

Surrey NanoSystems commercializing advanced packaging innovations with $7M new funding

Wed, 3 Mar 2012

Surrey NanoSystems raised third-round funding of

Henkel underfill boasts high Tg for WLCSP and PoP devices

Tue, 3 Mar 2012

Henkel developed LOCTITE UF3810 underfill for high reliability and ease of rework when applied to next-generation wafer-level chipscale packages (WLCSP) and package-on-package (PoP) devices.


Package and micro-mechanical test equipment installed at DfR Solutions

Tue, 3 Mar 2012

DfR Solutions installed micro testing tools from XYZTEC for JEDEC qualification, dynamic bend testing, copper wire bond pull and shear testing, and material characterization of lead-free solders.


Multitest test contactor suits large-array, high-pin-count digital chip test

Fri, 3 Mar 2012

Multitest launched a new Quad Tech contactor, the Triton contactor, for high-end digital test applications such as server, computer, mobile smartphone, digital TV, and graphics chips.


WACKER opens silicone R&D center for Korean electronics makers

Fri, 3 Mar 2012

WACKER expanded and relocated its South Korea technical laboratories and offices, bringing together R&D operations, applications technology, and basic and advanced training in silicones and polymers applications.


Lockheed Martin develops new Cu solder

Mon, 10 Oct 2012

Lockheed Martin scientists have developed a new "nanotechnology" copper-based solder that it says will produce joints with up to 10

ICECool puts 3D thermal issues back in focus

Mon, 10 Oct 2012

With the approach of full commercial production of 3DIC products, Dr. Phil Garrou shifts his attention to thermal performance questions and proposed thermal solutions for the future.


SPTS Technologies, Fraunhofer IZM researching lower-temp films for TSVs

Thu, 10 Oct 2012

Fraunhofer IZM's All Silicon System Integration Dresden (ASSID) center will add SPTS' etch and PECVD process capabilities to investigate low-temperature dielectric films for through-silicon vias (TSV) in 3D IC packaging.


Why SATS consolidation needs to happen

Fri, 10 Oct 2012

The advent of leading-edge semiconductor packaging technologies dictates efficient use of capital, and only the top-tier semiconductor assembly and test services (SATS) companies will have the financial wherewithal to develop required expertise and capacity, says one analyst.


Tessera to CEO: Spin off a business by 2015, vest $7.5M shares

Fri, 10 Oct 2012

Tessera Technologies is giving CEO Robert A. Young a big financial incentive to spin off one of its two businesses by March 2015, one of the company's key long-term strategic goals.


SPTS unveils low-temp PECVD cluster tool for 3D ICs

Wed, 9 Sep 2012

SPTS' Delta fxP cluster system achieves low-temperature deposition of TEOS oxides and nitrides for via-reveal passivation in 3D IC packaging, solving two key problems of low temperatures and bonding adhesive outgassing.


EVG updates modular coater/developer with OmniSpray, NanoSpray coating options

Mon, 9 Sep 2012

EV Group's updated modular EVG150 high-volume coater/developer adds new modules for conformal coating of high topography surfaces, and coating surfaces with vertical sidewall angles, such as through-silicon vias (TSV).


Ultra Tec adds endpoint detection module for chip package sampling

Tue, 9 Sep 2012

Ultra Tec Manufacturing has released a new endpoint detection module for its ASAP-1 IPS selected area preparation system, for improving electronic package decapsulation and sample preparation.


FormFactor to acquire Microprobe, creates top probe card supplier

Tue, 9 Sep 2012

Wafer probe card maker FormFactor has agreed to acquire fellow probe card supplier MicroProbe, with a combined entity rivaling top-seller Micronics in the high-growth probe card market.


Conflict mineral -- Au, Ta, Sn, W -- legislation passes in the US

Fri, 8 Aug 2012

The US SEC adopted a rule that requires companies to publicly disclose their use of conflict minerals -- including tantalum, tin, gold, and tungsten -- that originated in the Democratic Republic of the Congo (DRC) or an adjoining country.


Super QFN goal of EoPlex xLC lead carrier substrate

Fri, 4 Apr 2011

EoPlex Technologies Inc. is promoting the xLC substrate for quad flat pack no lead (QFN) semiconductor packages. The substrate enables QFNs with hundreds of leads and multiple rows at a lower cost than conventional packages.


Questar wedge and ball wire bonders target small lots, high variation

Wed, 4 Apr 2011

Questar's Q7000 series of fine-pitch, fine-wire (17-75μm), aluminum/gold (Al/Au) automatic wedge and ball bonders Questar Products International released the Q7000 series of fine-pitch, fine-wire (17-75μm), aluminum/gold (Al/Au) automatic wedge and ball bonders to better meet smaller lot size, multiple product variation, frequent set-up change styles of package production.


Reworkable edgebond adhesive improves CBGA and BGA thermal cycle performance

Thu, 4 Apr 2011

After removal of underfilled BGA, underfill residues must be removed.Zymet Inc. introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. The adhesive can prevent pad damage during BGA rework, particularly with fine-pitch BGAs.


Cu wire bonding joins MagnaChip Semiconductor offerings

Tue, 4 Apr 2011

MagnaChip Semiconductor now offers cost-competitive and state-of-the-art copper wire bonding technology, which can create a packaging cost savings of about 20% to 30%. MagnaChip worked with the major packaging companies to develop a bonding process that protects wafers under bond pads.


Thinfilm PARC bring printed electronics commercialization engagement forward

Mon, 4 Apr 2011

Thin Film Electronics ASA (Thinfilm) and PARC, a Xerox company, entered the next phase of their co-innovation engagement for printed memory devices. This next phase extends the engagement to prototyping the product for manufacturing readiness.


HB LED packaging materials pros and cons

Fri, 4 Apr 2011

LEDDaniel Duffy, research scientist in Henkel's Advanced Technology Group, notes pros and cons of epoxy and silicone encapsulants for high-brightness LED (HB-LED) manufacturing, and what HB-LED manufacturers need from die attach materials. He also considers quantum dots.


Rogers names president and CEO from specialty materials industry

Thu, 9 Sep 2011

Rogers Corporation's (NYSE:ROG) Board of Directors elected Bruce D. Hoechner as the materials company's new president and CEO, effective October 3, 2011. Hoechner's past positions were with Rohm and Haas and Dow Chemical.


Open microfocus X-ray tubes gain automatic venting

Thu, 9 Sep 2011

X-RAY WorX GmbH introduced electronically controlled venting valves for open X-ray tubes. This avoids the manual venting typically performed during X-ray tool maintenance.


IRphotonics installs thermal camera for IR cure R&D

Wed, 9 Sep 2011

IRphotonics added a high-resolution FLIR thermal imaging camera to its application engineering lab. The camera will be used to analyze heat distribution during iCure use.


EVG enhances fusion wafer bonder throughput, accuracy

Wed, 9 Sep 2011

EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20WPH with enhanced automation capabilities and low-temperature processing.


3M, IBM to make 3D chip adhesives

Wed, 9 Sep 2011

Forget "3D stacking" -- the two companies say a special electronic "glue" applied to the wafer will help stack dozens of chips into a "silicon skyscraper" that will be much faster and more efficient than current chip technology.


Alchimer TSV barrier-layer film shows 100% deposition coverage

Tue, 9 Sep 2011

Alchimer's AquiVia film-deposition technology promises to cut fill deposition times and cost even with complex through-silicon via (TSV) 3D packaging structures. The product targets TSV ramp-up at production levels, according to the company.


Multitest position detection system prevents jams in test handlers

Thu, 9 Sep 2011

The PDC concept on the Multitest MT2168 uses sensor-based alignment in the standard pick-and-place processes to reduce small package misplacements and test system jams.


Report examines fan-out wafer-level packaging momentum, assembly pricing trends

Wed, 11 Nov 2011

Fan-out wafer-level packaging (FO-WLP) is gaining momentum as an option for devices with large numbers of I/Os, vs. going finer-pitch to keep using conventional fan-in technology, says TechSearch International in an updated report.


Microsemi taps Amkor for SoC package test

Mon, 11 Nov 2011

Microsemi SoC Products Group will use outsourced semiconductor assembly and test (OSAT) provider Amkor Philippines (ATP) for final electrical package test on nearly all its products.


Fujikura, FlipChip International improve embedded die packages

Fri, 11 Nov 2011

Fujikura Ltd. and FlipChip International LLC (FCI) released ChipletT and ChipsetT embedded die packages for single die or multi-die semiconductor packaging applications.


LED maker shrinks heatsinks with air holes

Thu, 11 Nov 2011

LED lighting maker Gem Hsin Electronics reduced the size of heatsinks in its LED products by drilling miniscule holes beneath LEDs. The holes allow heated air to escape the LED package.


3D Direct Write technology for microelectronics packaging

Tue, 11 Nov 2011

Invenios developed a 3D Direct Write laser patterning technology for microelectronics packaging that integrates optical, mechatronic, and housing functionalities into the package substrate.


PVA debuts coating and dispensing workcell with updated design

Tue, 11 Nov 2011

PVA is introducing the PVA6000 flexible coating and dispensing tool with new features based on customer feedback to improve accessibility for maintenance and improve ease of use.


Thailand flood update from key semiconductor assembly and test companies

Fri, 11 Nov 2011
Numerous global semiconductor suppliers maintain assembly and test operations in Thailand. Many of these facilities have been affected by the disaster. IHS iSuppli pulled together a list of those affected, and those that have thus-far escaped damage.

Amkor transitions PBGA packaging to pin-gate molding

Fri, 11 Nov 2011

Amkor will convert all of its 19mm through 31mm body size plastic ball grid array (PBGA) packages to pin-gate molding (PGM) over the next few years.


Steve Adamson passes; Nordson plans memorial scholarship

Fri, 11 Nov 2011

Nordson Corporation will honor the life of Steven J. Adamson, former Nordson ASYMTEK marketing specialist and electronics industry mentor, by funding a $3,000 annual scholarship in Adamson's name with the IMAPS Educational Foundation.


Multitest passes BGA test evaluation at IDM

Fri, 11 Nov 2011

Multitest's Mercury contactor passed a "thorough BGA test evaluation," landing on the qualified contactors list for all business units of an international IDM.


Amkor awards top suppliers in 2011

Thu, 11 Nov 2011

Amkor Technology Inc. (NASDAQ:AMKR) honored 7 companies with its 2011 Supplier Award, for substrates, materials, and equipment.


Halogen-free underfill uncrated at Henkel

Wed, 11 Nov 2011

Henkel will launch several new electronics assembly materials at Productronica, November 15-18 in Munich, Germany.  The new HYSOL underfill is a halogen free, reworkable epoxy capillary underfill with a high Tg.


Henkel debuts automotive sensor packaging adhesive

Wed, 11 Nov 2011

Henkel will launch several new electronics assembly materials at Productronica. The ABLESTIK ICP-4000 has been qualified to bond components to metal leadframes in plastic housings.


STATS ChipPAC invests in copper wire bonding for 45nm, low-k

Wed, 5 May 2011

STATS ChipPAC Ltd. (SGX-ST: STATSChP), semiconductor test and advanced packaging service provider, has shipped over 300 million semiconductor packages with copper wire-bond interconnects. The SATS provider is investing in Cu wire bonding for finer silicon nodes (45/40nm) and low-k/extra low-k.


Semiconductor materials group prez joins JSR Corp's Officers Committee

Thu, 4 Apr 2011

Tokyo-based JSR Corporation named the first non-Japanese Officer to its Officers Committee. Eric R. Johnson, the current president of the company's US semiconductor materials operations, JSR Micro, has been named as an Officer.


Laird phase change material enables stencil applied TIM

Sat, 4 Apr 2011

Laird Technologies released the Tpcm 580SP Series phase change material, a high-performance, screen-printable or stencilable thermal interface material with a thermal conductivity of 4.0W/mK that provides an alternative to thermal grease.


SATS provider Sigurd chooses Multitest MT2168

Thu, 3 Mar 2011

Multitest MT2168 semiconductor test handlerSigurd Microelectronics Corporation (Sigurd) will be the first adopter of Multitest's MT2168 pick-and-place test handler in volume production in Taiwan. The SATS provider will use it to test various QFN packages.


3D CT X ray imaging fills inspection gaps says Xradia

Tue, 3 Mar 2011

Xradia microscope.Xradia has unveiled its latest micro computed tomography (CT) 3D X-ray imaging system, the VersaXRM. Kevin Fahey, PhD, VP of marketing at Xradia, discusses how the new platform uses geometrical magnification in tandem with an X-ray microscope.


Henkel conductive die attach film for thin die advanced packages

Mon, 3 Mar 2011

Henkel Electronics released 2 formulations of Ablestik C100 die attach film for leadframe packages.Henkel Electronics released 2 formulations of Ablestik C100 conductive die attach film for leadframe packages, including QFNs. It eliminates die tilt, processes thin wafer die, and enables bondline control.


TSV probe partnership Cascade Microtech imec collaborate for kgd

Thu, 3 Mar 2011

Cascade Microtech Inc. (NASDAQ: CSCD) and imec entered into a collaborative research partnership for testing and characterization of 3D integrated circuit (IC) test structures. Imec will work closely with Cascade Microtech to develop test methods and methodologies for emerging 3D through silicon via (TSV) structures, and to develop global standards.


NuPGA becomes MonolithIC 3D, expands IP in monolithic 3D semiconductor space

Thu, 3 Mar 2011

As it developed an improved FPGA technology, the NuPGA team discovered a path for practical monolithic 3D ICs. MonolithIC 3D changed its strategy to focus on monolithic 3D IC technology as a pure IP innovator organization.


Nordson ASYMTEK targets side view LED manufacturing with jet dispenser

Thu, 3 Mar 2011

Nordson ASYMTEK introduced jet dispensing for manufacturing of side-view LEDs, which it says is better than needle-based systems. The Spectrum S-920N fluid dispenser jets 0.1 to 0.2mm dots through windows as small as 0.4mm into LED cavities.


Silver diamond composite to efficiently cool semiconductor devices

Wed, 3 Mar 2011

The silver-diamond composite is being aimed at cooling wide-bandgap semiconductors planned for next-generation phased-array radars.A solid composite heat-conducting material created by scientists at the Georgia Tech Research Institute has a thermal conductivity that is higher than any metal and takes advantage of the properties of diamond. The silver-diamond composite is being aimed at cooling wide-bandgap semiconductors planned for next-generation phased-array radars.


MX's RDL, copper wire bonding processes take aim at packaging costs

Mon, 12 Dec 2011

MagnaChip Semiconductor Corporation now offers a redistribution layer (RDL) metal process for wafer bumping and an I/O structure and process that is fully compatible with copper wire bonding, reducing packaging costs.


Thai flood update: On Semi closing, STATS ChipPAC delayed, iSuppli's PC downgrade

Fri, 12 Dec 2011

STATS ChipPAC says its Thai operation hit by flooding will remain offline through January, longer than anticipated. And one analyst puts a number to the total disaster's industrywide impact: 3.8 million fewer PC units in the pipeline for 1Q11.


KLIC appoints Director from telecom industry

Fri, 12 Dec 2011

Kulicke & Soffa Industries Inc. (NASDAQ:KLIC or K&S) named Chin Hu Lim to its Board of Directors, also serving on KLIC's Management Development & Compensation Committee.


TEL's 3D packaging tool suite unveiled

Tue, 12 Dec 2011

Tokyo Electron Limited (TEL) launched a suite of 3D packaging tools: the Tactras FAVIAS TSV deep-silicon etch system; the TELINDY PLUS VDP film deposition tool; and the wafer bonder/debonder Synapse Series.


TEL power chip dynamicing occurs at the wafer level

Tue, 12 Dec 2011

Tokyo Electron Limited (TEL) has successfully demonstrated dynamicing -- device switching/dynamic characteristic (AC) -- of a power device at the wafer level.


Technic gold-reduction packaging technology unleashed

Mon, 12 Dec 2011

Technic Inc. is entering the last development phase on technologies to reduce gold consumption in electronics packaging and connector applications, a product group it will call "Goldeneye."


SUSS Microtec launches high-volume temporary wafer bonder with 1st install

Mon, 12 Dec 2011

SUSS MicroTec launched the XBS300 temporary bonder for high-volume wafer manufacturing. The Bond Cluster is configured to temporarily bond 200mm and 300mm wafers for 3D integration applications as well as other processes that require thin wafer handling.


SUSS Microtech adds Brewer Science ZoneBond to wafer bonders

Mon, 12 Dec 2011

Brewer Science Inc. will offer the ZoneBOND process on equipment supplier SUSS MicroTec's XBC300 and XBS300 wafer bonding platforms.


IR orders NEXX metallization systems for IGBT fab

Thu, 12 Dec 2011

International Rectifier (IR) purchased multiple Apollo physical vapor deposition (PVD) systems from packaging equipment maker NEXX Systems for its Newport, Wales fab.


Dainippon Screen develops maskless direct imaging exposure system

Tue, 11 Nov 2011

Dainippon Screen Mfg. Co. Ltd. developed the DW-3000 direct imaging exposure system for next-generation semiconductor packaging, exposing complex 3D multilayer substrates while adjusting for warping and distortion of individual wafers.


NeoPhotonics doubles PIC production capacity

Wed, 11 Nov 2011

Citing rising demand and a potential industry shortage, NeoPhotonics is in the process of more than doubling its production capacity of narrow linewidth tunable lasers with minimal expected additional capital expenditures.


Gold group reiterates industry "concerns" about Cu bonding

Fri, 4 Apr 2010

A seminar held at last month's Semicon China reiterated points made earlier in the year by an industry group that there are still questions about using copper bonding wire vs. gold in semiconductor packaging applications.


Future implications of IC packaging for the PCB

Tue, 4 Apr 2010

Vage Oganesian of Tessera and Vern Solberg, Tessera consultant, discuss the advanced packaging options available with 3D contact features on substrate interposers for complex, high-pin-count flip chip applications.


22nm requires foundry-to-packaging-house cooperation

Fri, 12 Dec 2011

At the 22nm node, die fragility and challenging interconnect materials will necessitate foundry collaborations with packaging houses, co-designing silicon and package, asserts E. Jan Vardaman, TechSearch International.


Newport to buy photonics test tool maker

Wed, 12 Dec 2011

Newport Corporation (NASDAQ:NEWP) will acquire ILX Lightwave Corporation, which makes high-performance test and measurement products for laser diodes and other photonics components. Newport will pay $9.3 million in cash.


High-temp area-array package test sockets suit military, geophysical apps

Tue, 12 Dec 2011

Aries Electronics debuted AR4HT Series chipscale package (CSP) test sockets that accept any area-array device for testing up to 200

AVX eliminates conflict tantalum

Wed, 12 Dec 2011

AVX Corporation has ensured that all its tantalum powder and wire suppliers are fully compliant with the independently audited Conflict-Free Smelter Program (CFS).


Copper wire bonding offered from Quik-Pak

Fri, 12 Dec 2011

Quik-Pak, a division of Delphon Industries, is performing copper wire bonding on a Kulicke & Soffa (K&S) Maxum Ultra wire bonder. Available wires include bare copper and palladium-coated copper.


Bond shear inspection and 300mm wafer handling integration enables Class-2 cleanliness

Thu, 12 Dec 2011

CHAD Industries integrated its WaferMate300-1 automated wafer handling workcell with Nordson DAGE's 4300 Bond Shear inspection tool, allowing for hands-off 300mm handling and bond shear inspection.


Underfill, wafer-level dielectrics, Cu-compatible resins among packaging material winners

Wed, 12 Dec 2011

Semiconductor packaging materials will be a $22.8 billion market this year, and should grow to $25.7 billion by 2015, says SEMI and TechSearch International.


ST eliminates wafer probes for on-wafer die test

Wed, 12 Dec 2011

inTEST to acquire Thermonics division of Test Enterprises

Tue, 12 Dec 2011

inTEST will acquire the assets and certain liabilities of Thermonics from Test Enerprises. inTEST's Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.


Mentor Graphics integrates T3Ster and FloTHERM for power device thermal management

Mon, 12 Dec 2011

Mentor Graphics Corporation (NASDAQ:MENT) has combined technologies for thermal characterization and simulation with T3Ster hardware test products and its FloTHERM software, enabling better heat management in power semiconductor packages, such as LEDs.


LORD underfill encapsulant designed for lower cost

Wed, 6 Jun 2011

LORD ME-555 LORD Corporation launched the ME-555 underfill encapsulant for semiconductor packaging and assembly. LORD ME-555 is a high-purity, semiconductor-grade epoxy underfill for encapsulating flip chips.


Honeycomb heatsink cools BGAs in thin-profile devices

Tue, 6 Jun 2011

JaroThermal's Honeycomb heatsink JaroThermal's Honeycomb heatsink directs heat towards the outside of the device, while producing a steady flow of cool air inside the heatsink. Honeycomb heatsinks can be used with either plastic or metal/ceramic BGA packages.


Temporary wafer bonding market: More than 10 approaches today

Thu, 6 Jun 2011

Figure. Temporary bonding tools used during a temporary bonding step. The figures in red show the order of the steps. Source: Yole, Thin Wafer Manufacturing Equipment & Materials Markets Report, June 2011. Yole Développement forecasts the temporary wafer bonding process growth and worth through 2016, and explains why there are so many process options, and who is working on them.


New power MOSFET package from IRF minimizes form factor

Mon, 6 Jun 2011

ternational Rectifier, (IR, NYSE:IRF), power management technology provider, introduced a PQFN 2 x 2mm with <1mm profile package featuring its latest HEXFET MOSFET silicon. The new package is ultra-compact, high density and efficient for lower-power applications.


FEI plasma FIB tool targets packaging apps

Mon, 6 Jun 2011

High-speed sectioning of TSVs with plasma FIB. The device was located, cross-sectioned, polished, and imaged with PFIB. SOURCE: FEI FEI's new Vion plasma focused ion beam (PFIB) system based on inductively-coupled plasma (ICP) source technology using a xenon ion beam generates more than a micro-amp of beam current and can remove material faster than liquid metal ion sources, says product marketing manager Peter Carleson.


Power semiconductor packaging drops wire bonding for sintered foil

Wed, 6 Jun 2011

SKiN Technology uses flexible foil and sintered connections rather than bond wires, solders and thermal paste for electronics packaging.Semikron developed a power semiconductor packaging technology, SKiN, which uses flexible foil and sintered interconnects instead of bonding wires, solders, or thermal paste.


Asian foundry inspects micro bumps with Camtek systems

Thu, 5 May 2011

Camtek Ltd. (NASDAQ and TASE: CAMT) received repeat automatic optical inspection (AOI) orders from an Asia-based foundry doing advanced micro bump inspection and metrology. Challenges arise in measuring such small bumps used in advanced packages, including efficiently handling huge amounts of data.


Wafer bonding: Many options for many devices

Tue, 5 May 2011

Wafer bonding. SOURCE: Yole May 2011. Wafer bonding is a complex process, used on 2" to 12" wafers for MEMS, image sensors, advanced packaging, LEDs, and other chips. Yole Développement published a technology study and market research report, "Permanent wafer bonding," to derive trends in the market and technology through 2016.


LCP packaging tech from RJR Polymers competes with ceramics for QFN, RF power packages

Tue, 5 May 2011

RJR Polymers debuted liquid crystal polymer (LCP) semiconductor packaging technology for RF and microwave system designers that is competitive with ceramic ACPs, improving thermal management and offering design flexibility based on the company’s epoxy range.


Carsem expands MLP/QFN capacity in Suzhou

Tue, 5 May 2011

Artist's rendition of the expanded MLF/QFN production and test area at Carsem.Carsem will grow its Suzhou, China factory by an additional 430,000 square feet, increasing their Suzhou micro leadframe package (MLP) capacity to over 20 million per day, with a focus on copper wire bonding.


Alchimer wet deposition debut targets RDL, other 3D IC processes

Wed, 5 May 2011

Alchimer's wet-deposition process, AquiVantage, grows interconnect layers for interposer redistribution layers (RDLs) and significantly enhances via-last backside wafer interconnects. The process eliminates 2 costly photolithography steps.


CoolChip's thermal management tech brings in MIT prize

Wed, 5 May 2011

CoolChip Technologies won the MIT Clean Energy Prize for their technology that reduces data center cooling needs with air-based CPU cooling.


RFaxis' pure-CMOS on-die coexistence filter reduces package size, current consumption

Tue, 5 May 2011

RFaxis released its patent-pending On-Die Coexistence Filter technology, designed to replace "bulky and expensive" stand-alone coexistence filters for cellular, mobile, and other devices.


Nanotech, novel design help bring about stacked sensors: Research update

Mon, 5 May 2011

Figure. Single sensor modules can be stacked to create a sensor system via standardized interfaces.The research project "MANOS" combines innovative surface coatings based on nanoparticles and the latest adhesive procedures for new embedding technologies and novel circuit-board-based modular fasten and release technology used to stack sensor systems.


Help define semiconductor packaging equipment requirements

Fri, 8 Aug 2012

iNEMI is starting a new convergence project on semiconductor packaging equipment requirements, and is seeking input from the industry.


Assembleon adds wafer handling to its flip-chip bonder

Mon, 8 Aug 2012

Assembl

See 3mil wire bonding at IMAPS with Hesse & Knipps

Thu, 8 Aug 2012

Hesse & Knipps Inc. will demo a new 3mil wire bonding capability on its BJ935 automatic heavy wire bonder for back-end semiconductor packaging at IMAPS in San Diego.


Kulicke & Soffa drives semiconductor packaging tool quality with new CQO

Wed, 8 Aug 2012

Kulicke & Soffa Industries, Inc. (K&S, NASDAQ:KLIC) appointed Irene Lee to the role of chief quality officer. Lee will oversee quality assurance functions across Kulicke & Soffa

Fabless Monolithic Power Systems implements yieldWerx test and yield management

Tue, 8 Aug 2012

Monolithic Power Systems (MPS) implemented yieldWerx Semiconductor Test and Yield Management tools. MPS required a robust and centralized system for effective storage, analysis, and sharing of testing and product data received from multiple foundries, assembly, and testing facilities in the US and Asia.


ASE tests NCKU lower-cost packaging solder as better than SAC

Thu, 8 Aug 2012

Researchers at National Cheng Kung University (NCKU) in southern Taiwan developed a tin/zinc/silver/aluminum/gallium solder alloy for semiconductor packaging, which was tested by ASE.


Multitest test handler adds 2D code reader option for traceability

Wed, 8 Aug 2012

Multitest, semiconductor test equipment supplier, added a 2D code reader option to its MT2168 pick-and-place test handler, for package test customers that require 100% device traceability and lot integrity.


Henkel underfill reduces warpage for thinner flip chip packages

Wed, 8 Aug 2012

Henkel Electronic Materials developed a new underfill system designed to reduce flip chip package stress by controlling die and substrate warpage, LOCTITE ECCOBOND UF 8840.


Agilent

Tue, 8 Aug 2012

Agilent debuted its compliance test application, Agilent N6462A DDR4, for systems using DDR4 memory.


Zuken improves FPGA/ASIC co-design with PCBs in CR-5000

Fri, 8 Aug 2012

Zuken updated its CR-5000 design software to version 14, with greater collaboration in FPGA development and targeting high-speed design. Many enhancements have also been included in CR-5000 Lightning, Zuken

PKE halts Nelco circuit materials ops in Zhuhai, China: Will serve Asia from Singapore

Wed, 8 Aug 2012

Park Electrochemical plans to cease operations at its Nelco Technology (Zhuhai FTZ) Ltd. facility in Zhuhai, China. Nelco products include microwave and RF component substrates, printed circuit materials, and advanced substrates such as BT.


Mesuro secures funding to expand semiconductor test offering

Tue, 7 Jul 2012

Mesuro, semiconductor testing and services provider, raised

Cascade Microtech modular wafer probe system offers 6 measurement packages

Tue, 7 Jul 2012

Cascade Microtech introduced the modular MPS150 manual wafer probe station with six application-specific test packages for RF, mmW, and I-V/C-V measurement; failure analysis; and high-power device characterization.


Henkel Electronic Materials pre-cuts die attach film for 150mm, 200mm wafers

Mon, 7 Jul 2012

Henkel Electronic Materials added LOCTITE ABLESTIK CDF 200P to its conductive die attach film offering. The pre-cut film is available in 150mm and 200mm diameter sizes for easy wafer-form matching. The film is both a dicing tape and die attach tape.


Cascade Microtech touts wafer-level test innovators at inaugural Innovation Awards

Fri, 7 Jul 2012

Cascade Microtech Inc. (NASDAQ:CSCD), supplier of wafer-level measurement instruments for ICs, held its first Innovation Awards Ceremony to honor inventors, authors and other innovators at the company.


ASM Pacific Technology delivers 100 x 300mm leadframe packaging set up

Thu, 7 Jul 2012

ASM Pacific Technology Limited noted in its H1 2012 results a record level of orders for leadframes in Q2. It also delivered what it calls the largest leadframe packaging set up to date.


Kyocera room-temp epoxy molding compound competes with frozen semiconductor package encapsulants

Wed, 7 Jul 2012

Kyocera Industrial Ceramics Corporation, Chemical Sales Division introduced the environmentally friendly XKE-G5633 Epoxy Molding Compound (EMC) for BGA and LGA package encapsulation.


STATS ChipPAC rewards top suppliers of 2011

Wed, 7 Jul 2012

STATS ChipPAC presented its annual Supplier Awards to its top supplier partners for their excellent performance and outstanding support in 2011. Supplies are scored on technology, quality, delivery, responsiveness, service, and cost competiveness criteria.


Semiconductor test terminology guide aims to clarify docking and handling ops

Tue, 7 Jul 2012

SEMI's Collaborative Alliance for Semiconductor Test released a Docking and Mounting Generic Terminology Guideline document that can be used to improve the

Ziptronix wafer bonding technology adopted for high-volume cellphone component

Tue, 7 Jul 2012

Ziptronix Inc., which develops direct bonding technology for advanced semiconductor applications, has licensed its technology for a high-volume cellular handset application.


Sonoscan software enables acoustic imaging of 3D IC and die stacks

Mon, 7 Jul 2012

Sonoscan introduced a simulator software, SonoSimulator, that enables stacked die makers to check nondestructively for delaminations between layers. SonoSimulator software is now a standard feature on the Gen6 C-SAM acoustic microscope.


Notes from SEMICON West: Detecting solder joint fractures

Mon, 7 Jul 2012

Jennifer Wrigley and Robert Bellinger, Olympus, share insights on SEMICON West

Nordson MARCH plasma treatment system handles sensitive semiconductor packaging substrates

Fri, 7 Jul 2012

Nordson MARCH uncrated the FasTRAK Plasma System at SEMICON West. The automated, high-throughput vacuum plasma treatment system processes leadframe strips, laminate substrates, and other strip-type microelectronic components.


2012 ITRS update: Back-end packaging and MEMS

Fri, 7 Jul 2012

At SEMICON West, the working groups of the International Technology Roadmap for Semiconductors (ITRS) outlined 2012 updates to the roadmap. Check out the back-end process info here.


Off-chip computing advances by SRC, Georgia Tech are air-tight, Cu-enabled

Fri, 8 Aug 2010

SRC and researchers from Georgia Tech made two advancements to meet key challenges facing off-chip interconnect solutions. The results address both the urgent need for greater off-chip bandwidth and reduced power per bit, and promise to enable continued improvements for system performance.


Take the survey on PoP assembly

Fri, 7 Jul 2010

Package on package (PoP) stacking makes use of the vertical space available on electronics printed circuit boards (PCBs). It increases density, fitting more silicon into the same footprint. However, package stacking can be difficult, as fine pitches require placement accuracy, and taller stacks generally face reliability issues, especially if the stack is reflowed improperly. So where should PoP stacking take place?


Teledyne completes Intelek acquisition

Thu, 7 Jul 2010

Teledyne completed the acquisition of Intelek plc. Teledyne was the beneficial owner of, or had received valid acceptances in respect of approximately 93% of Intelek's ordinary shares. The aggregate value for the transaction will be approximately £35 million.


Viscom introduces measurement tools for wire bond inspection

Tue, 1 Jan 2010

Wire bond inspection system maker Viscom introduced software tools for its very high resolution (VHR) camera module, which has the ability to provide exact measurements of balls and wedges. With this technology, 25-µm gold thin-wire wedge sizes can be measured with a standard deviation of 1 µm. In addition to inspecting qualitative characteristics of wire bonds, balls and wedges statistical evaluation and trend analysis of critical geometric dimensions can also be performed in the production process.


SEMI forms 3D stacked IC standards group, seeks volunteers

Tue, 12 Dec 2010

SEMI International is forming a standards committee to evaluate and create specifications and practices for 3D stacked ICs (3DS-IC), with initial efforts targeting three areas: bonded wafers, inspection/metrology, and thin wafer handling.


AT&S-launches-SiP-substrate-technology

Sat, 12 Dec 2010

AT&S debuted a new technology to enable system-in-package (SiP) devices. AT&S’s embedded component packaging technology ECP is used to enable further miniaturiztion of electronic devices while enhancing their performance.


Cohu-names-prez-of-Semiconductor-Equipment-Group

Wed, 12 Dec 2010

Cohu Inc. (NASDAQ:COHU) appointed Luis A. Müller president of its newly formed Semiconductor Equipment Group, which encompasses Cohu subsidiaries Delta Design and Rasco GmbH.


ROGERS teams RO4460 prepreg with RO4360 laminate for multilayer HF circuits

Tue, 7 Jul 2010

Rogers Corporation has developed a match for the RO4360 laminate: RO4460 prepreg. Both materials feature dielectric constant (Dk) of 6.15 ±0.15 and low dielectric loss of 0.003 at 2.5GHz. Together, they form an ideal system for fabricating compact, cost-sensitive multilayer high-frequency (HF) circuits in limited space.


EVG discusses the latest wafer bonding system study results

Thu, 7 Jul 2010

In this video from SEMICON West 2010, Marcus Wimplinger, EV Group, summarizes the results of SEMATECH work using EVG's 300mm bonding systems that enables submicron alignment. Highly accruate wafer bonding is used for Cu-to-Cu bonding and other packaging applications.


Interplex intros solder and flux bearing lead component

Fri, 7 Jul 2010

Interplex NAS, supplier of precision components and assemblies and a division of Interplex Industries, Inc., added to its line of solder and flux-bearing lead products. The new surface mount pin, a short-current path lead, offers advantages in the circuit assembly process.


Soft-pad silicone thermal management material from Shin-Etsu

Fri, 7 Jul 2010

Shin-Etsu Silicones of America Inc., U.S. subsidiary of Shin-Etsu Chemical Co. Ltd., Japan, launched the TC-CA Series, comprised of Shin-Etsu’s advanced polymer and thermally conductive filler composite material technologies. The low-hardness silicone soft pad series of products have both high thermal conductivity and excellent electrical insulation properties.


Nextreme expands engineering consulting on thermal and power management issues

Tue, 7 Jul 2010

Nextreme Thermal Solutions will now include materials evaluation and characterization services in its consulting portfolio. With recent advances in materials sciences and nanotechnology, new materials are being developed that exhibit thermoelectric properties.


Military electronics cooling and thermal management issues press for new materials development, potential move away from COTS

Thu, 7 Jul 2010

Electronics experts developing technology for aerospace and defense applications confront few issues as daunting as the heat generated from their designs. Engineers are under constant pressure to develop ever-smaller and more powerful electronics, yet the cost of doing so creates ever-larger amounts of heat, and ever-larger electronics thermal management problems.


Henkel releases NCP for copper pillar interconnect

Mon, 7 Jul 2010

Henkel’s Hysol FP5201 NCP offers the underfill protection required for Cu Pillar technology, effectively mitigating the stress between the substrate and the die.


Multitest intros contactors for ICs with differential signals

Wed, 7 Jul 2010

Multitest designed differential contactors that are customized for each semiconductor test application. The selection of the contactor materials and probes are optimized for the desired impedance.


Multitest expands spare parts center for pogo pin test contactors

Wed, 7 Jul 2010

Multitest expanded the portfolio of its Singapore spare parts distribution center for pogo pin-based test contactors. With this step, all major spare parts for semiconductor package test handlers and contactors are now available for fast delivery to Asian package test sites.


Advanced packaging technologies: Imbedding components for increased reliability

Tue, 4 Apr 2010

Imbedded component/die technology is a method of imbedding active and passives into cavities within a multi-layer PCB to decrease the surface area required to implement the circuit design and increase the robustness of the overall assembly. Casey H. Cooper, STI, discusses the design methodology, packaging processes, and test data gathered during imbedded die/component packaging implementation in a mixed-signal prototype. The prototype was subjected to reliability testing and demonstrated in a test flight.


SATS providers join top 20, says Gartner

Fri, 9 Sep 2010

Gartner VP of semiconductor manufacturing research, Jim Walker, notes that, for the first time, 2 SATS companies joined the top 20 capital spenders in 2010. He also predicts solid growth for advanced packaging tooling with memory ATE and copper wire bonders being the top performers. Walker says the conversion to copper wire from gold is a wise move.


MICROELECTRONICS PROCESSING: 'Zero-overlap' laser system speeds ultrathin wafer dicing

Wed, 9 Sep 2010

Laser-based wafer thinning for 3D semiconductor packaging.Solid-state, fiber-based, and ultrafast lasers continue to make inroads in microelectronics processing applications, specifically for silicon wafer dicing. While most of these laser-based cutting methods rely on linear movement of the laser beam along a substrate, ESI developed a laser-based "zero-overlap" technique for dicing ultrathin (less than 50 μm thick) Si wafers.  


Palomar intros ultra flexible die bonder

Fri, 9 Sep 2010

Palomar Technologies introduced the fully automated 3800 Ultra Flexible Die Bonder for eutectic die attach, laser diode packaging and high-power LED packaging.


Reinforced thermal interface material integrates nylon mesh layer

Fri, 9 Sep 2010

Fujipoly released Sarcon 100GR-FL, a low resistance, durable thermal interface gap filler pad. The gel-like material is manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations.


Thermal gap filler provides electrical isolation with high tolerance stack-up

Tue, 9 Sep 2010

Laird Technologies released the Tflex XS400 Series thermal gap filler, a compliant elastomer gap filler for moderate thermal performance with a thermal conductivity of 2.0W/mK. This soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts.


Semiconductor packaging substrates future wiring density needs: Join the discussion

Thu, 9 Sep 2010

Meeting these future needs will require radical improvements and innovations in all aspects of organic packaging substrate technology. A pre-competitive iNEMI R&D project plan, currently under development, will identify approaches capable of meeting wiring density needs for future generations of organic semiconductor packaging substrates. Meeting these future needs will require radical improvements and innovations in all aspects of organic packaging substrate technology.


Next-gen bond tester software launch from Nordson DAGE

Tue, 9 Sep 2010

Nordson DAGE, a subsidiary of Nordson Corporation (NASDAQ: NDSN) and provider of bond testing technology, introduced Paragon intelligent bond testing software for semiconductor packaging.


Advanced packaging industry today: TSV weak vs FOWLCSP, package-to-PCB assembly a concern for small pitch packages, and more analysis

Thu, 9 Sep 2010

Research in China put out this new report chronicling the advanced semiconductor packaging industry happenings and key companies from 2009 to 2010. The study mainly focuses on CSP and BGA packaging. Technology adoption and costs are analyzed, from eWLB to TSV. Packaging tech usage examples are included here, along with assessments of tech adoption and industry player rankings.


LCP QFN packaging tech supports finer pitch, thinner leadframes

Thu, 9 Sep 2010

LCP based QFN semiconductor packages.RJR Polymers debuted a new-generation LCP quad flat-pack no-lead (QFN), air-cavity package that will support finer lead pitches, thinner leadframes and shorter wire bond lengths in a near hermetic, ROHS-compliant solution.


Dow-Electronic-Materials-opening-TMG-facility-in-Korea

Fri, 11 Nov 2010

Dow Electronic Materials has broken ground for a new metalorganic precursor manufacturing plant in Cheonan, Korea. Dow is expanding TrimethylGallium (TMG) production capacity to meet the surging global demand for the material in the LED and related electronics markets.


Smart textile large-area manufacturability at heart of PASTA project

Wed, 11 Nov 2010

imec PASTA smart textile project aimsBare die in yarn, comfortable electronics, stretchable interposers, washable photovoltaic clothes, and other elements will be on the table for the PASTA project to bring smart textiles from the lab to industrial manufacturability. Imec leads the program.


IBM-fine-pitch-substrate-bumping-skips-solder-paste-beyond-C4NP

Tue, 11 Nov 2010

IBM IMS process for substrate bumpingJae-Woong Nah, researcher at IBM's Thomas J. Watson Research Center, briefed ElectroIQ on his IMAPS conference paper: "Mask and mask-less injection molded solder (IMS) technology for fine-pitch substrate bumping." IMS is a variation of C4NP for solder deposition on fine-pitch laminates. Nah explains how the researchers injected 100% pure molten solder instead of solder paste with a reusable film mask for forming high-volume solder on fine-pitch substrates.


Packaging-providers-growing-faster-than-semiconductor-market-Gartner-forecast

Fri, 11 Nov 2010

Packaging providers outgrowing semiconductor fab market: Gartner forecastJim Walker, research VP at Gartner, told attendees at the Gartner Semiconductor Briefing (11/4/10, San Jose, CA) that, after declining 14.7% in 2009, the outsourced semiconductor assembly and test services (OSATS) market will expand by 37% this year, and by 6.2% in 2011.


Bond-align-mask-align-SUSS-MicroTec-Fraunhofer-collab

Thu, 11 Nov 2010

SUSS MicroTec and Fraunhofer for Surface Engineering and Thin Films IST launched SELECT, a technology for bond aligners and mask aligners that selectively activates parts of wafer surfaces through plasma.


Kulicke-Soffa-pushes-copper-wire-bonding-transition with IConnPS ProCu

Tue, 11 Nov 2010

Kulicke & Soffa Industries Inc. (Nasdaq: KLIC) introduced the IConnPS ProCu wire bonder optimized for copper wire bonding. The K&S IConnPS ProCu offers a significant and new level of capability for packaging lines transitioning from gold to copper wire bonding.


ADA-to-improve-thermal-interface-materials-with-CNTs

Tue, 11 Nov 2010

ADA Technologies, Inc. received a $100,000 contract from the U.S. Air Force for Phase I research into the development of improved thermal interface materials (TIM) for use in microchips.


Momentive-thermal-management-materials-LEDs

Mon, 11 Nov 2010

To increase the performance and service life of LEDs and LED assemblies, Momentive Performance Materials introduced a line of thermally conductive silicones to be considered for use in LED manufacturing and assembly.


Copper-based-ink-printed-electronics enables screen-print process

Mon, 11 Nov 2010

NovaCentrix announced that Metalon ICI-020, a new copper-based screen ink, will be featured at Printed Electronics USA 2010 in Santa Clara, CA, November 30-December 2, 2010. Pre-printed samples of Metalon ICI-020 screen ink on card stock will be distributed with the registration packs by IDTechEx staff, and attendees may bring their samples to the NovaCentrix exhibit area to cure the ink with NovaCentrix’s PulseForge process tool.


Copper-wire-bonding-consortium-Freescale-GLOBALFOUNDRIES-UNISEM-and-more

Tue, 11 Nov 2010

The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) in Singapore, launched the Copper Wire (Cu-Wire) Bonding Consortium. The consortium will tackle existing Cu-Wire bonding issues of quality and reliability, and improve existing measurement systems.


New EI LCP laminates meet harsh environment SiP reqs

Tue, 11 Nov 2010

EI added LCP Laminates to its family of microelectronics packaging product offerings. Custom-designed LCP Laminates are suitable for semiconductor packages as LCP coreless designs for up to 6 layers as well as in combination with other rigid materials as hybrid circuits. Development and testing of Z-interconnect cross-sections for >8 layer offerings are also underway.  


Optoelectronics project initiated by packaging group

Mon, 8 Aug 2010

The HDP User Group's Optical Interconnect project aims to alleviate intra-cabinet interconnect bottlenecks envisaged in Tbps systems by connecting electronic devices with optical paths. The project is developing optical interconnect architectures that can respond to capacity and energy efficiency needs of future high-speed systems.


Assembleon intros back-end package assembly robot

Thu, 8 Aug 2010

Assembleon intros back-end package assembly robotAssembléon’s recently released Twin Placement Robot (TPR) will reportedly reduce costs for semiconductor backend manufacturing. The TPR fits on Assembléon’s A-Series pick & place equipment for packaging and IC placement. Plans are in the works for the TPR to do semiconductor manufacturing tasks as well.


Interfacial properties of Cu-Cu direct bonds for TSV integration

Sun, 8 Aug 2010
With varying process conditions, the quantitative analysis of the interfacial adhesion energy of Cu-Cu thermo-compression bonds was performed. Bioh Kim, et al, EV Group, Inc., Tempe, AZ USA; Eun-Jung Jang, et al, Andong National University, Andong, Korea

Wire-bonding/AOI, chip mounting areas linked: Case study from IPTE

Tue, 8 Aug 2010

Continental Corporation applied economic conveyor and handling modules from IPTE’s EasyLine product portfolio to link its gold and aluminum wire bonding, mounting, and AOI areas. Continental Corporation applied economic conveyor and handling modules from IPTE’s EasyLine product portfolio to link its gold and aluminum wire bonding, mounting, and AOI areas.


Market research: Thermal interface materials and fillers

Mon, 8 Aug 2010

Japan Marketing Survey Co. Ltd. (JMS) will publish "Outlook of thermal interface material market 2010) this week, with data on the semiconductor package thermal management market size by application, thermal interface material types' market shares, and more.


TSV wafer measurement tool selected by 2 semiconductor equipment makers

Thu, 9 Sep 2010

Tamar Technology received orders from major semiconductor equipment manufacturers for its TSV measurement technology. Tamar’s proprietary Wafer Thickness Sensor can measure etch depth for TSVs as well as wafer thickness for single or bonded wafers.


DEK-VectorGuard-3D-stencils-for-chip-on-board

Fri, 12 Dec 2010

DEK stencil for chip on boardVectorGuard 3D stencils are designed for specialist applications requiring multiple level printing. Facilitating printing on different levels with upward or downward steps, VectorGuard 3D enables a uniform stencil thickness.


Ultrathin chip fab process ready to ramp: IEDM presentation

Wed, 12 Dec 2010

ieee iedm chipfilm techJoachim Burghartz, IMS CHIPS, presented an improved version of the group's Chipfilm technology introduced at IEDM 4 years ago. The researchers now have a manufacturable process technology.


Fluid dynamics analysis tunes up IC package design

Tue, 2 Feb 2010

Instead of time-consuming hardware tests for thermal analysis, package designers are increasingly turning to software-based device modeling and CFD analysis, which eliminates fabrication of trial components, thermal dice, and other fixturing to preview the impact of design decisions and changes, explains Robin Bornoff from Mentor Graphics.


Double layer stencil debuts from Dek

Tue, 2 Feb 2010

The VectorGuard stencil portfolio from DEK now includes the double layer Platinum stencil, a stencil technology that is said to offer performance benefits over conventional screens. VectorGuard Double Layer Platinum stencils suit semiconductor applications and component manufacture, solar cell manufacture, low-temperature co-fired ceramic (LTCC) manufacture, as well as other production challenges requiring fine line or mixed feature sizes.


CFD thermal analysis drives a packaging decision at IDT

Tue, 2 Feb 2010

This case study, a partner piece to Robin Bornoff/Mentor Graphics' discussion of fluid dynamics analysis for IC package design, examines how IDT used CFD thermal analysis in a packaging decision for a recent product launch.


SMTA webcasts on package on package (PoP), STACK assembly, rework, and inspection

Fri, 1 Jan 2010

The Surface Mount Technology Association (SMTA) will host two 90-minute online sessions with Bob Willis, ASKbobwillis.com, on package-on-package (PoP) applications and implementation. The Webtorials will take place February 4 and February 11, 2010 from 1:00 to 2:30 pm EST.


World Gold Council, SEMI survey packaging industry on wire bonding material choices

Tue, 1 Jan 2010

On behalf of the World Gold Council (WGC), SEMI conducted a survey titled “Semiconductor Industry Opinions Concerning the Selection of Bonding Wire Material.” The survey was intended to gauge the semiconductor industry’s use of copper bonding wire versus gold for packaging applications. The WGC is a commercially driven organization focused on creating demand for gold. While 41% of semiconductor companies surveyed use copper bonding wire, none use it in the majority of their products. However, the majority of respondents will consider copper bonding wire in their new products.


EVG's wafer bonder passes SEMATECH/ISMI 3D integration tool assessment

Wed, 7 Jul 2012

SEMATECH qualified EVG's GEMINI automated wafer bonding system through its Equipment Maturity Assessment implemented within SEMATECH's 3D Interconnect program and ISMI's EMA team.


MicroProbe enhances wafer probe card reliability with CCC improvement

Wed, 7 Jul 2012

MicroProbe introduced current-carrying capability of >1A/probe in 90

Contemporary semiconductor packaging experts open up on cost

Tue, 7 Jul 2012

The bulk of packaging falls under the

Ultratech named advanced packaging tool supplier of choice by top-tier packaging houses

Tue, 7 Jul 2012

Ultratech formed 'exclusive supplier' and 'preferred tool vendor' agreements with several top-tier advanced packaging companies around the world.


Multitest releases 3D packaging test combination for sensitive bare die

Mon, 7 Jul 2012

Multitest installed the first Multitest Plug & Yield integrated hardware set up for testing 3D semiconductor packages at a customer. The Plug & Yield design enables highly parallel electrical in-process test of stacked dies during the assembly process of 3D packages.


2.5/3D interposers fabbed at 30% lower COO with USHIO

Mon, 7 Jul 2012

USHIO Inc. is introducing the large-field stepper lithography tool

EVG temporary wafer bonding platform doubles throughput for 3D packaging

Wed, 7 Jul 2012

EVG introduced the EVG 850TB/DB automated temporary bonding and debonding system built on the company's new XT Frame platform, which has been optimized to support thin-wafer processing for high-volume 3D IC and TSV manufacturing.


MLCC manufacturers order ESI high-throughput test system

Tue, 7 Jul 2012

Electro Scientific Industries Inc. (ESI, NASDAQ:ESIO) received multiple-unit orders for its model 3510 test system from leading Japanese and Korean MLCC manufacturers.


Epson launches high-throughput IC test handler for volume test

Mon, 7 Jul 2012

Seiko Epson launched the NX1032XS pick-and-place IC test handler, boasting high throughput for transferring, inspecting, and sorting semiconductors.


Ultratech acquires IBM patents for semiconductor packaging processes

Fri, 6 Jun 2012

Ultratech acquired IBM patents on semiconductor packaging technologies, including C4 bumping, ball grid array (BGA) methods, lead-free solders, and 3D packaging.


Dow Corning teams with SUSS on TSV bonding process

Mon, 6 Jun 2012

Dow Corning will collaborate with SUSS MicroTec on a temporary bonding process (materials and equipment) for through-silicon vias (TSV) in high-volume advanced semiconductor packaging.


SEMICON West 2012 exhibits preview: Semiconductor packaging products

Fri, 6 Jun 2012

SEMICON West is taking place July 10-12 in San Francisco, CA. Following are new products for semiconductor packaging and test that will be at the show, from wafer bonders to LED die attach materials.


Fast-curing conductive chip-attach adhesive meets RFID packaging needs

Wed, 6 Jun 2012

DELO introduced the DELOMONOPOX AD268 epoxy resin to meet the low-cost, reliable-attach needs of RFID device makers. The anisotropic, electrically conductive adhesive provides fast cure at chip attach, and is designed for flip-chip RFID packaging, as well as other packaging applications.


Wafer-level RF testing bottleneck resolved with Advantest, Hua Hong NEC methodology

Wed, 6 Jun 2012

Pure-play foundry Shanghai Hua Hong NEC and test equipment supplier Advantest co-developed a wafer-level, multi-site parallel test scheme for RFID semiconductor devices that meets industry-standard ISO 14443 guidelines.


Signetics bolsters mobile chip packaging capacity with large tool buy

Tue, 6 Jun 2012

Signetics Corporation approved plans to purchase additional semiconductor assembly process equipment -- wafer grinders, wafer saws, die attach tools, and wire bonders -- to grow its packaging capacity for mobile chips.


STATS ChipPAC ships 1 billionth package using copper wire bonds

Mon, 6 Jun 2012

STATS ChipPAC Ltd. (SGX-ST: STATSChP) marked the milestone of 1 billion copper wirebonded semiconductor units shipped.


Anritsu plans on-wafer high-frequency test demo at IMS

Fri, 6 Jun 2012

Anritsu will demonstrate its broadband Vector Network Analyzer (VNA), which conducts single sweeps from 70kHz to 140GHz during wafer probe test, at IMS, showcasing a new 0.8mm connector.


Kulicke & Soffa (KLIC) appoints treasurer with Asia experience

Tue, 6 Jun 2012

Semiconductor assembly tool maker Kulicke & Soffa (KLIC) named Pui Yee Lee as VP and corporate treasurer, reporting to SVP and CFO Jonathan Chou.


Advantest tackles 3D package test with new product line

Fri, 6 Jun 2012

Advantest is developing a line of fully automated and integrated test and handling solutions for TSV-based 2.5D and 3D packages. The concept model test cell, DIMENSION, integrates a high parallel test cluster along with singulated die and 3D die stack automated handling capabilities.


Multitest test loader/unloader offered in various configurations

Fri, 6 Jun 2012

Multitest has made its InCarrier Loader/Unloader available in a variety of configurations, e.g. for loading from tube, bowl, tray and for unloading into tube, bulk or metal mag in any combination.


Henkel develops die attach film for leadframe packages

Wed, 7 Jul 2011

Henkel worked with STMicroelectronics (STM) to qualify Henkel's Ablestik C100 conductive die attach film materials for scalable, adaptable leadframe packaging.


Canon enters back-end packaging market with lithography tool debut

Fri, 7 Jul 2011

Canon Inc. made its first foray into the semiconductor back-end packaging equipment market with the new FPA-5510iV for through silicon via (TSV) and bump lithography.


Robotic die bonder upgrades SET packaging platform

Fri, 7 Jul 2011

The FC300R performs chip-to-substrate bonding, chip-to-wafer assembly, and chip-to-chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes, with a robotic handling system for fragile and diverse substrates/wafers.


Elpida begins sampling 8Gb DDR3 SDRAM

Tue, 7 Jul 2011

Elpida Memory is now sampling a new 8Gb TSV DRAM consisting of four 2Gb layers based on TSV stacking technology.


IDM records lower cost of test with Multitest DuraKelvin

Mon, 7 Jul 2011

Multiest released data from an international IDM's high-volume production site, tracking its DuraKelvin test contactor's FPY and cleaning downtime.


Korean IDM orders NEXX tools for WLP metallization

Tue, 6 Jun 2011

NEXX Systems installed 2 300mm Stratus deposition at a Korean IDM for high-volume wafer-level packaging processes.


OSAT places $3m order for Camtek wafer inspection systems

Wed, 10 Oct 2010

Camtek Ltd. (NASDAQ and TASE: CAMT) received an order for multiple wafer inspection systems from a major outsourced semiconductor assembly and test (OSAT) company in southeast Asia.


Paste print tool uses embedded electronics for finer pitches

Fri, 10 Oct 2010

DEK has launched ProActiv process technology to enable electronics manufacturers to print pastes with high-density heterogeneous PCBs and ultra fine pitch assemblies such as advanced package assembly. DEK has launched ProActiv process technology to enable electronics manufacturers to print pastes with high-density heterogeneous PCBs and ultra fine pitch assemblies such as advanced package assembly.


Nanoplas targets 200mm MEMS and 3D TSV packaging with dry processing tool

Tue, 10 Oct 2010

Nanoplas toolNanoplas introduced a fully automatic dry-processing batch system for high-volume 200mm production. The DSB 9000A is based on Nanoplas’s High Density Radical Flux (HDRF) technology.


Heatsink Assembly for BGAs

Tue, 5 May 2009
The superGRIP heatsink assembly from Advanced Thermal Solutions, Inc. features a heatsink, phase-change interface material, and unique attachment system for mounting onto a wide range of hot -running BGA components. The novel design is said to require minimal space on a PCB and eliminates the need for thru holes in the board.

Harman Receives IEEE Award for Wire Bonding Improvements

Wed, 5 May 2009
(May 13, 2009) PISCATAWAY, NJ — George G. Harman, a researcher at NIST, contributed enormously to wire bonding technology and helped transform a labor-intensive, manual procedure into the present automated, reliable process capable of producing hundreds of billions of packaged semiconductor devices/year. The IEEE honors him with the 2009 IEEE Components, Packaging, and Manufacturing Technology Award.

TI introduces ultra-thin ESD/EMI embeddable package

Thu, 5 May 2009
By Fran

Next-gen Enclosed Print Head

Tue, 5 May 2009
DEK International has introduced ProFlow Evolution, it's next-generation ProFlow enclosed print head solution, to expand the system's capabilities to apply to a variety of applications including traditional solder paste printing, flux deposition, adhesives and encapsulant printing, solder spheres, thermal interface materials, and more.

Plasma Cleaning and Surface Modification for Microelectronics

Mon, 4 Apr 2009
By Gene Dunn, Panasonic Factory Solutions of America
Plasma technology offers a dry cleaning process that uses ionized gasses in vacuum chambers to remove contaminants for improved yields in gold bonding processes. Additionally, Auger electron spectroscopy (AES) is a useful analytical technique for determining the elemental surface characteristics and the effectiveness of plasma treatment to remove contaminants. This article discussed both.

Galaxy Thin Wafer System from DEK

Wed, 8 Aug 2009
Building on its Galaxy imaging platform, DEK has used the foundation of the technology's supreme accuracy and precision to develop a system specifically for processing thinned silicon wafers.

Wafer-to-wafer Bonding: Using Pressure-indicating Film for Eutectic/Thermocompression Bonds

Fri, 8 Aug 2009

Kwan-yu Lai, Micralyne, and Jeffrey G. Stark, Sensor Products, describe the use of color-coded pressure-indicating film to ensure uniform, correct pressure during wafer bonding. Wafers are bonded by applying precise combinations of physical pressure, temperature, and/or voltage. Pressure is measured as an average, assuming perfectly flat pressure plates.


Non-silicone Thermal Grease

Fri, 8 Aug 2009
Fujipoly America released two non-silicone thermally conductive grease compounds. The polysynthetic-based thermal interface material (TIM) suits thin bond line applications that are also adverse to silicone contamination.

DirEKt Microsphere Ball Placement

Fri, 8 Aug 2009

Extending its capabilities for placing solder spheres at high speed, DEK's DirEKt Ball Placement process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm.


Die-attach Paste Offers Self-filleting, KGD Bonding

Fri, 8 Aug 2009

Debbie Forray and Ilya Furman, Henkel Corp., compare a self-filleting die attach paste to film-based adhesives. Semiconductor companies are seeking lower-cost die attach material solutions to replace the higher-cost, film-based adhesive materials used for certain applications. One such material is self-filleting die attach paste. 


Asys plucks DynTest for LED singulation tech

Mon, 5 May 2010

The Asys Group say it has acquired the IP and patents of fellow German firm DynTest Technologies, seeking to apply the company's wafer singulation technology to high-brightness LEDs.


Samsung tips better heat-dissipating display IC package

Mon, 5 May 2010

Samsung Electronics says it has developed a new heat dissipating packaging technology for display drivers ICs in high-end TVs.


Multitest MT9928 bowl feed module meets small package test handling requirements

Wed, 5 May 2010

The Multitest next-generation MT9928 bowl feed module, which passed the strict QA and production approval requirements of an international IDM, is a gravity feed handler with a variety of loading and unloading options. With a throughput of up to 14,500 uph, the bowl feed loading module is the loading option of choice for small package sizes during semiconductor test.


Gartner: Worldwide semiconductor capital equipment spending to grow 76% in 2010

Mon, 3 Mar 2010

Worldwide semiconductor capital equipment spending is projected to surpass $29.4 billion in 2010, a 76.1% increase from 2009 spending of $16.7 billion, according to Gartner Inc. Gartner cites a dramatic recovery in semiconductor orders for the equipment order surge.


Die attach equipment and ESD

Wed, 3 Mar 2010

Substantial amounts of electrostatic discharge (ESD) damage are not only possible, but probable in semiconductor die attach operations, leading to substantial yield losses. Roger Peirce and Brad Williford from Simco illustrate seven distinct mechanisms in typical die attach operations that cause electrostatic discharge (ESD) damage to chips being handled.


Lithography and wafer bonding solutions for 3D integration

Mon, 3 Mar 2010

Given the advantages and technical feasibility of through-silicon vias (TSV), the major focus now is on the manufacturability and integration of all the different building blocks for TSVs and 3D interconnects. EV Group's Thorsten Matthias et al. review advances in lithography, thin wafer processing, and wafer bonding, and the integration of all these process steps.


Thermal management material for mobile electronics packages

Mon, 3 Mar 2010

Honeywell (NYSE: HON) Electronic Materials debuted a printable thermal management material designed to help manage the high heat produced by increasingly powerful semiconductors in portable computing devices such as laptops and netbooks.


Mentor Graphics unveils IC package thermal characterization and design tool

Tue, 3 Mar 2010

Ian Clark from Mentor Graphics explains how the company's new FloTherm Web-based software helps reduce the time spent on thermal characterization and design, illustrated by examples for both moving air and ambient thermal resistance.


Advanced packaging materials conference scheduled for Cambridge University

Thu, 12 Dec 2009

The IMAPS-UK MicroTech-2010 and IEEE-CPMT Advanced Packaging Materials (APM), Feb. 28 to March 2 at Cambridge University, will be the major Spring 2010 event on electronics packaging, interconnection and integration conference in Europe.


Hitachi unit improves microhole-drilling processes for PCBs

Thu, 11 Nov 2009

Hitachi Via Mechanics says it has developed new processes for microhole drilling cast polyimide wafers and multilayered materials used in high density electronics packaging, that can produce ≤100μm-dia. holes in high-volume manufacturing.


Allvia buys old ETEC site for manufacturing ramp

Thu, 10 Oct 2009

Specialty TSV foundry Allvia is expanding its manufacturing capabilities away from high-cost Silicon Valley to a newly-purchased facility in Oregon, a site with its own chip-equipment pedigree.


Thin Wafer Processing

Tue, 3 Mar 2009
By Hans Hirsher, Ph.D. and Hans Auer, Oerlikon Systems The demand for thin and ultrathin semiconductor devices grows continuously. Discrete and bipolar IC's as well as devices for stacking or thin packages require thinner and thinner wafers. The challenge is to find a reliable processing method.

Lead-free Thermal Management Material

Mon, 3 Mar 2009
Honeywell Pb-free Die Attach Solder is a lead-free thermal interface material that is said to effectively manage heat produced by semiconductor chips to improve chip reliability. It is designed to dissipate the heat by filling the gap between the semiconductor and heat spreader.

3D architectures for semiconductor integration and packaging: Conference preview

Thu, 10 Oct 2010

The International Conference "3-D ARCHITECTURES FOR SEMICONDUCTOR INTEGRATION AND PACKAGING" will take place December 8-10, 2010 at the Hyatt Regency San Francisco Airport Hotel. Check out the planned keynotes and topics of the conference.


Suss MicroTec banks on ATM in its new 3D probe station

Mon, 9 Sep 2009

Süss MicroTec's Stojan Kanev tells SST/AP about the company's new addition to its toolset for 3D integration: a probe station targeting 300mm wafer-level 3D stacked structures.


Indium Corporation Acquires Assets of Reactive NanoTechnologies

Tue, 9 Sep 2009

Indium Corporation acquired the processes, equipment, and know-how of Reactive NanoTechnologies Inc. (RNT), developer and manufacturer of NanoFoil. NanoFoil delivers precise, instantaneous heat energy for advanced joining applications. RNT developed the NanoBond joining process to simplify manufacturing and ensure the benefits of NanoFoil are maximized.


siXis partners with SVTC to commercialize silicon circuit boards

Mon, 8 Aug 2009
August 24, 2009 -- SVTC Technologies was chosen by technology startup siXis, Inc. to supply silicon manufacturing services for their compact, high-speed embedded computing modules that bridge the gap between programmable devices and costly, customized semiconductors.

Fed Invests $6M For Anti-tampering Chips from Endicott Interconnect Technologies

Tue, 8 Aug 2009
(August 18, 2009) ENDICOTT, NY — Congressman Maurice Hinchey (D-NY) joined Endicott Interconnect Technologies (EI) officials to announce that he's secured a $6 million federal investment for the company to develop state-of-the-art microelectronic chips for the U.S. military that will safeguard against foreign tampering of weapons.

IBM Advances DNA "Origami" Structures

Wed, 8 Aug 2009
August 19 -- IBM researchers and collaborator Paul W.K. Rothemund, of the California Institute of Technology (CalTech), have made an advancement in combining lithographic patterning with self assembly

Nature Nanotechnology: DNA Shapes on Lithographically Patterned Surfaces Increase Semiconductor Density

Mon, 8 Aug 2009
Scientists at IBM Research and the California Institute of Technology announced a method for structuring DNA shapes to help build miniaturized computer chips well beyond 22-nm processes. The research claims that chips will be more energy efficient and suited to mass production.

Device bonding improved by new SET oxide removal chamber

Mon, 10 Oct 2010

SET unveiled a patented system enabling a thorough removal of oxides before or during the semiconductor packaging bonding sequence. SET unveiled a patented system enabling a thorough removal of oxides before or during the semiconductor packaging bonding sequence. Addressing the challenges of the oxidation of metal surfaces in device bonding, this machine system encompasses a substrate chuck and a bond head with a non-contact localized confinement chamber that operates safely with reducing gases such as forming gas or formic acid vapor.


SABIC Valox ENH resins launched for green FR PBT materials

Thu, 10 Oct 2010

SABIC Innovative Plastics launched three new sustainable additions to its Valox* ENH resin series that deliver advanced flame retardance (FR) with desirable mechanical and electrical performance. These innovative materials help customers comply with global environmental regulations.


EoPlex QFN packaging with thin green leadframe

Fri, 10 Oct 2010

EoPlex Inc. debuted a high-performance, clean-tech lead carrier for semiconductor packaging. EoPlex xLC is reportedly a cost-effective replacement for the leadframes currently used in quad flat pack no-lead (QFN) packages.


Thermal Gap Fillers from MH&W International

Wed, 6 Jun 2010

New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials.


A Novel ACA for 3D Chip Stacking and Lead-free PCB Packaging

Fri, 6 Jun 2010

In a SiP chip stack, space constraints can lead to large parasitic inductances in the packaging. Planarity, processing, high-temperature exposure, and other factors also present challenges. A new anisotropic conductive adhesive technology could enable low-cost flexible packaging via a multi-layer particle structure. S. Manian Ramkumar, Ph.D., RIT, reviews the adhesives benefits to various levels of electronics interconnect.


Getting costs out, standards in for high-volume TSS

Thu, 5 May 2010

High-density through-silicon stacking (TSS) shows promise for very high-volume applications, but work still needs to be done to "tame" key issues in manufacturing, improve costs, and smooth out the supply-chain, said Matt Nowak, director of engineering in Qualcomm's VLSI technology group, in a presentation at The ConFab in Las Vegas.


Semiconductor packaging and electronics consortium formed for all-electric aircraft

Wed, 5 May 2010

The CREAM Project addresses the thematic “Aeronautics and Air Transport (AAT)” through the objective of developing an “Innovative Technological platform for Compact & Reliable Electronic integrated in Actuator and Motor” destined for several applications of the All Electric Aircraft such as fuel pumps, landing gear or brake actuators, flight control actuators, etc.


New Products

Thu, 3 Mar 2007

Embedded Thermoelectric Coolers for High-performance ICs: Taking the Edge off Hot Spots

Thu, 3 Mar 2007
anufacturers and OEMs need a package-level cooling solution that provides cooling in close proximity to the chip, to cool hot spots and smooth out non-uniform power dissipation.

Localized Cooling for Data Centers

Thu, 1 Jan 2009
For the past 50 years, the thermal management industry has offered only heatsinks, fans, and thermal grease as methods for electronics thermal management.

imec, PVA Tepla demo 3D TSV void detection

Thu, 1 Jan 2013

Imec and PVA Tepla say they have achieved void detection in through-silicon vias at wafer level, after TSV copper plating, thanks to a nondestructive high-frequency scanning acoustic microscopy (SAM) technique.


The Thermal Management Equation

Thu, 3 Mar 2007
Theories on thermal management rival, in number and variety, strategies for winning the Super Bowl or baking the perfect loaf of bread.

Achtung Baby!

Thu, 3 Mar 2007

Engineers' Sports Day

Sun, 10 Oct 2000
At this year's sports day, each of the three divisions - Mechanical, Electrical and Civil - won 16 medals of gold, silver and bronze

Sockets Meet Future Technology Challenges: Part II

Tue, 5 May 2007
In the March 2007 cover story, we asked the industry about the demands that new packages placed on sockets, lead-free issues, standards, cost control, fine pitch, and the overall consensus on the Burn-in & Test Sockets Workshop (BiTS) where users talk to suppliers.

Optimizing the Wire Bond Process

Sun, 7 Jul 2007
Demands for continuously smaller IC packages with increased I/O capability are requiring tighter wire-bond loop tolerances.

Taking the Heat: Transforming Thermal Management through Phase Change Materials

Thu, 3 Mar 2007
When it comes to electronic products, the more power, speed, and functionality jammed into a smaller package, the better.

Cool Your Heels

Thu, 3 Mar 2007
Have you ever taken a Latin dance class? At first glance, everyone comes off as shy, and then the movement heats up.

Advanced Ceramic Heaters

Sun, 4 Apr 2007
Two common processes used to attach die to the pad or cavity of the package’s support structure are adhesive and eutectic die attach.

Thermal Management Goes Nano with CNT Fabrics

Sun, 7 Jul 2007
Concepts from the textile industry may soon infiltrate thermal management in advanced packaging, in the form of manufactured spun threads and felted mats composed of single-wall carbon nanotubes (CNTs).

The Heat Is On

Mon, 1 Jan 2007
Playing golf has taught me a bit about work under pressure. I wouldn’t say that my golf game is bad, but if I grew tomatoes, they would probably come up sliced.

Step 12: The back-end process: Packing & shipping step by step

Wed, 11 Nov 2000
The advent of semiconductor materials being converted into electronic functions set off a revolution in electronic systems design

Particle Atomic Layer Deposition

Mon, 1 Jan 2007
Increasing miniaturization and circuit density is an ongoing trend in electronics.

Proposed Consortium Seeks to Improve TIMs

Mon, 1 Jan 2007
BINGHAMTON, NY and ATLANTA - The Packaging Research Center (PRC) at the Georgia Institute of Technology (Georgia Tech) in Atlanta is partnering with Binghamton University, NY, to develop and promote a possible industry consortium addressing thermal interface materials (TIMs).

Eaton Semiconductor Equipment Operations, Beverly, Mass., completed its expansion of an 80,000 sq. ft. clean manufacturing facility.

Sat, 1 Jan 2000

Thermal interface materials for high-power BGAs

Sat, 4 Apr 2000
High-power ball grid arrays (BGAs) present one of the greatest challenges for thermal interface materials, primarily because they generate much heat in a small area. Phase change materials have largely replaced grease in this application area because they are cleaner to use and provide much greater resistance to the liquid state being pumped out of the interface. But a complex series of tradeoffs must be considered to optimize the application of these devices. For example, low phase change tempe

Solventless Epoxies

Sat, 4 Apr 2000
Epoxies thinned with solvents may weaken performance, separating into a liquid phase during curing, in turn leaving bubbles that weaken the bond or downgrade electronic and thermal performance. Metech has announced new epoxies that are solventless. They are compounded with reactive diluents incorporated into the film during the curing process. PCD 40073 is a fast-cure, thermally conductive, insulating epoxy for application on a wide range of substrates, including ceramics, glass, phenolic, epoxy

Thermally Conductive Epoxy

Sat, 4 Apr 2000
Loctite 3861 is a low-viscosity, thermally conductive epoxy potting compound for electronic casting and encapsulating applications that require thermal conductivity and chemical resistance. This heat-curable potting material offers low thermal expansion, good wetting and flow capabilities, good thermal shock resistance, high heat transfer capabilities and good electrical properties. When fully cured, the product is resistant to weather, water, gases and vapors, petroleum lubricants, and mild aci

Epoxy

Sat, 4 Apr 2000
The Emcast 1790 family of delayed-action UV-curable epoxy products is designed to allow two opaque parts to be glued together using a UV adhesive. These products can be used for small-assembly projects and laminations. The adhesive is applied and irradiated with longwave UV light (325 to 380 nm), then, depending on formulation, UV intensity and duration, the surface-skin cure is delayed by seconds or minutes. A short heat post-cure after the parts are mated reportedly will hasten the final cure.

Thermal Management Product Roundup

Tue, 8 Aug 2000
s packages become smaller and more powerful, the need for effective thermal management becomes paramount. A package that effectively dissipates heat stays cooler, functions better and is ultimately more reliable

Power dissipation: Milliwatts to kilowatts

Tue, 8 Aug 2000
In this column I will briefly review some of the common techniques used to cool electronic modules in vehicles and some specific requirements that currently limit their use

Multi-use Bonder

Tue, 2 Feb 2000
The Model 860 Omni bonder can be configured to bond flip chips, laser diodes and eutectic bonded die. The joystick-controlled system aligns and attaches die sizes from 0.006≤ square to 1≤ square at throughput rates of up to 200 placements per hour with placement accuracy of ± 5 microns. Standard features include an extend-retract cube beam splitter viewing system with illuminators and precision servo motor-driven Z motion with closed loop temperature control. A rapid heat-up sta

Column grid array High-reliability option for packaging

Tue, 8 Aug 2000
An enhancement of BGA technology meets the challenges of long life, extreme thermal and mechanical conditions, the use of large components, and the need for ultra-high reliability

Controlling the parameters that affect heat dissipation during burn-in

Thu, 6 Jun 2000
Considerations, calculations and cautions regarding heat sinks and thermal interfaces.

History repeats itself in the form of matte tin

Sun, 7 Jul 2001
Perhaps the trendiest topic in the electronics industry is how we're going to reinvent the "smaller, faster, cheaper" paradigm to incorporate "environmentally responsible."

Step 5:Underfill and encapsulation

Mon, 5 May 2000
Detailed processes are involved in underfilling flip-chip assemblies, and a variety of fluid formulations and dispensing alternatives are available to today's flip-chip process engineer.

Clean ESD-safe dispensing

Mon, 5 May 2000
The use of inherently dissipative polymer alloys is the first step to reduce ESD in fluid dispensing.

Isotropic conductive adhesive joints

Sat, 9 Sep 2001
Improving mechanical properties by adding carbon fibers

The forgotten contaminant: Body-borne static

Tue, 2 Feb 2000
A "total system approach" to clean-room garments protects against contaminants and electrostatic discharge.

New die attach adhesives that stick

Tue, 2 Feb 2000
A new generation of materials offers low modulus and low moisture absorption, and reduces warpage, cracking and delamination.

NEPCON West offers new TAC line

Tue, 2 Feb 2000
NORWALK, CONN. - An all-new Technology Advancement Center (TAC) line, an expanded technical conference and many special events are among the highlights of NEPCON West 2000, which will be held at the Convention Center in Anaheim, Calif. More than 700 companies will exhibit, representing all sectors of electronics manufacturing from design through test.

ASAT offers thermal addition to IC package design software

Tue, 2 Feb 2000
Fremont, Calif.-based ASAT will assist Fluent Inc. in building integrated circuit macros in Fluent`s thermal management Icepak software. The tool enables designers to define the characteristics of the package so that it can be represented in a computer model. A variety of IC package thermal models using JEDEC standards will be used to guide the development of the macros at Fluent.

IN THE NEWS

Sat, 9 Sep 2007

ASMPT integrates European business with SIPLACE organization

Mon, 5 May 2012

Asia-based ASM Pacific Technology (ASMPT) Group, a supplier of semiconductor assembly, bonding, and packaging equipment, will integrate with the SIPLACE organization in Europe.


FormFactor knocked off semiconductor probe card podium

Mon, 5 May 2012

Sales of semiconductor probe cards grew 17% in 2011, reaching $1.17 billion, VLSIresearch reports. While short of a record, 2011 was one of the probe card sector

Nitto Denko transfers semiconductor encapsulant business to Hitachi Chemical

Thu, 5 May 2012

Nitto Denko Corporation approved a transfer of its semiconductor encapsulating materials business to Hitachi Chemical Co. Ltd.


High-power semiconductor test contactor hits 500 Amperes

Thu, 5 May 2012

Multitest introduced the ecoAmp Kelvin contactor for high-power device test of 500+ Amperes. It meets the needs of high voltage/high current test with high thermal and mechanical stability.


Top OSATS raise 2012 capex with semiconductor test focus

Tue, 5 May 2012

The top three outsourced semiconductor assembly and test services (OSATS) providers raised 2012 capex during their earnings reports, from initial plans announced in January, report analysts at Citi.


One-piece jetting cartridge for semiconductor packaging inspired by ink jet designs

Wed, 4 Apr 2012

Nordson ASYMTEK uncrated the NexJet System for jetting, with a newly designed jet cartridge and new software control for semiconductor packaging applications.


Aeroflex brings test line-up to Qualcomm customers

Mon, 4 Apr 2012

Aeroflex will supply manufacturing test technology for radio frequency (RF) devices at Qualcomm customers, under a new licensing agreement with Qualcomm.


Ultratech brings former member back to Board

Thu, 4 Apr 2012

Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech

Burn-in and test system offers device-by-device temperature control

Mon, 4 Apr 2012

Micro Control Company uncrated the HPB-5C High-Power Burn-In System, with variable airflow control for active thermal control of each device under test. The HPB-5C provides individual temperature control to each device under test.


DARPA funds GaN-on-diamond device development at Raytheon

Thu, 4 Apr 2012

DARPA gave Raytheon an 18-month, $1.8 million contract to develop next-generation GaN devices on diamond substrates, named Thermally Enhanced Gallium Nitride (TEGaN). The diamond packaging boosts GaN power handling capability by at least 3x.


Die attach adhesive suits temperature-sensitive electronics

Thu, 4 Apr 2012

DELO introduced DELOMONOPOX die attach adhesives, promising strong mechanical/environmental protection, low-temperature cure, and compatibility with various substrates.


Agilent nanomechanical materials tester makes 100 indents in 100 seconds

Wed, 4 Apr 2012

Agilent launched Express Test for ultra-fast, high-precision nanomechanical testing on thin films, low-k materials, composites, and more. It allows 100 indents on 100 surface sites in 100 seconds.


ALD enables 3D capacitors for CEA-Leti and IPDiA

Tue, 4 Apr 2012

CEA-Leti and passive component maker IPDiA developed an atomic layer deposition (ALD) process to apply medium-k dielectric layers on a metal-insulator-metal capacitor architecture, enabling 3D capacitors.


Rogers restructures to better serve power electronics, PCB, foam customers

Mon, 4 Apr 2012

Rogers Corporation (NYSE: ROG) shared an update on its restructuring and streamlining initiatives, which are expected to save about $13 million (annualized savings) by Q4.


Henkel surface mount adhesive validated for non-contact dispensing

Wed, 4 Apr 2012

Henkel

Mereco silver adhesive suits chip and leadframe bonding in heat-sensitive components

Wed, 4 Apr 2012

Mereco Technologies' METADUCT 1202 is an electrically conductive silver epoxy adhesive for lead attachment cold soldering, chip bonding, and leadframe bonding applications.


Ferro expands LTCC offering with cost-sensitive materials set

Tue, 4 Apr 2012

Ferro Electronic Materials expanded its LTCC portfolio, adding a line of cost-effective matched materials. The L8 LTCC system claims better performance over a greater range of frequencies and easier manufacturability.


Bruker bolsters CT imaging line with SkyScan buy

Mon, 4 Apr 2012

Bruker Corporation acquired all of the shares of SkyScan NV, a scientific instruments company serving materials science and life sciences/pre-clinical imaging needs.


Yamaichi enables embedded module test and programming with new test adapter

Fri, 3 Mar 2012

Yamaichi developed a test adapter with the European Design Centre, suitable for test and programming of embedded modules such as Qseven or MXM.


SUSS buys Tamarack for lithography, laser structuring lines

Fri, 3 Mar 2012

SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.


OSAT provider orders wafer inspection tools from Camtek

Mon, 3 Mar 2012

Camtek Ltd. sold $3.5 million of Falcon inspection tools to a global outsourced semiconductor assembly and test (OSAT) provider, for various applications in the backend assembly process.


Keithley power semiconductor tester uses 3000V source

Fri, 3 Mar 2012

Keithley Instruments introduced the Model 2657A High Power System SourceMeter instrument, adding high voltage test to its line of high-speed, precision source measurement units for power semiconductors.


Semiconductor makers spend record amount on materials for second straight year

Tue, 4 Apr 2012

The global semiconductor materials -- wafer fabrication and packaging materials -- market increased 7% in 2011 compared to 2010, with record revenues of $47.86 billion, said SEMI.


SEMICON West heralds 22nm, EUVL, 450mm, mobile electronics speakers

Mon, 4 Apr 2012

Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.


Field Report: Sensors in Design 2012

Thu, 3 Mar 2012

Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.


High voltage SourceMeter introduced

Tue, 3 Mar 2012

Glass-coated bonding wire targets copper, small diameter market

Tue, 3 Mar 2012

RED Micro Wire (RWM), a subsidiary of RED Equipment, announced a new high-quality copper wire featuring glass insulation for use in semiconductor wire bonding.


Applied Materials analyst day preview

Mon, 3 Mar 2012

Applied Materials will host its annual Analyst meeting this week (March 28). Barclays Capital shares its expectations for AMAT's update and the wafer fab equipment (WFE) outlook in general.


SUSS combines resist coat and develop platforms

Mon, 3 Mar 2012

SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.


CVD Equipment doubles manufacturing space with new NY facility

Mon, 3 Mar 2012

CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.


Silicon Genesis wafering tool designed for solar, LED, packaging sectors

Mon, 3 Mar 2012

SiGen developed its second-generation production system for fabricating thin-silicon solar wafers, as well as HB-LED, and 3D semiconductor packaging wafers. The system tailored for silicon, GaAs, germanium, SiC, GaN and sapphire materials.


Samsung, IBM and GlobalFoundries look to the future: A report from the Common Platform Technology Forum

Thu, 3 Mar 2012

Execs from Samsung, IBM, GlobalFoundries and ARM looked to the future at The Common Technology Platform Forum in Santa Clara. They focused on the innovation pipeline for 20nm and 14nm technology nodes, and the role that EUV, FinFETs, TSVs, CNTs and DSA will play.


Semiconductor manufacturing equipment sales rose 9% in 2011

Tue, 3 Mar 2012

Worldwide sales of semiconductor manufacturing equipment totaled $43.53 billion in 2011, representing a year-over-year increase of 9%, shows SEMI. North America surpassed Taiwan as the region with the highest amount of spending.


Attend joint sessions at VLSI Technology and Circuits

Tue, 4 Apr 2012

The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.


Semiconductor wafer fab equipment trends: Test

Tue, 4 Apr 2012

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse looks at the growth areas for test.


CWS upgrades on-wafer accelerated reliability line for Agilent testers

Tue, 1 Jan 2012

Core Wafer Systems, subsidiary of Action Products International, upgraded its PDQ-WLR on-wafer accelerated reliability product line to version 7.0, designed specifically for Agilent Technologies' Parametric Testers.


Theta Delta's burn-in & long-term semiconductor testers gain Core Wafer Systems technologies

Thu, 2 Feb 2012

Theta Delta will incorporate Core Wafer Systems technologies into its burn-in test and long-term reliability test systems for semiconductors. Core Wafer Systems provides parallel measurement schema for semiconductor test.


Camtek launches TEM for advanced semiconductor makers

Mon, 1 Jan 2012

Camtek launched Xact200, a transmission electron microscope (TEM) sample preparation system for the semiconductor industry. Camtek calls the system an alternative to FIB analysis.


BSE Group achieves milestones in semiconductor equipment financing biz

Thu, 1 Jan 2012

Test Advantage Capital Group, a business of BSE Group, surpassed $150M in its portfolio of semiconductor manufacturing equipment under management. Boston Semi Equipment's fab equipment leasing business also received a $100M annual commitment from its financial backer, Wafra Capital Partners.


Metrology tool offers economical price point with high accuracy

Mon, 4 Apr 2012

Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.


Texas Instruments (TI, TXN) names top suppliers

Thu, 4 Apr 2012

Texas Instruments awarded 15 of its 12,000 suppliers with Supplier Excellence Awards for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality.


Conference Report: MRS Spring 2012, Day 5

Mon, 4 Apr 2012

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: electronic skin, energy storage with nanowires, printable inks, gas sensing, inkjet printing, semiconductor polymers for organic devices, CNTs, OFETs, touch screen fabrics, and the coffee breaks.


Intel awards 9 elite suppliers in 2011

Fri, 4 Apr 2012

Intel Corporation announced 9 winners of the company's Supplier Continuous Quality Improvement (SCQI) award for outstanding commitment to quality and performance excellence.


Intel’s top suppliers in 2011

Thu, 4 Apr 2012

Intel Corporation announced its 2011 Intel Preferred Quality Supplier (PQS) awards, selecting 19 of its thousands of suppliers. Two suppliers received Intel’s Achievement Award.


Shin-Etsu Chemical releases low-RI LED encapsulants

Fri, 2 Feb 2012

Shin-Etsu Chemical Co. Ltd.'s new KER-7000 Series silicone encapsulating materials offer a low (1.38) refractive index (RI) for HB-LED packaging with lower gas permeability and higher transparency.


Camtek ships semiconductor inspection tools to leading US IDM

Mon, 5 May 2012

A leading, US-based IDM ordered about $5 million of front- and back-end semiconductor automatic optical inspection (AOI) tools from Camtek Ltd.


David McCann of GLOBALFOUNDRIES to speak at The ConFab 2012

Thu, 5 May 2012

Solid State Technology is proud to announce that David McCann will speak at The ConFab 2012. David, the Senior Director for Packaging R&D at GLOBALFOUNDRIES in Malta, New York, will speak on the evolution toward silicon-based interconnect and packaging, which is having profound impact on how we think about technology development and the supply chain.


Elpida begins reorganization in Tokyo court: Analysts weigh in

Fri, 3 Mar 2012

Elpida Memory Inc. (Tokyo: 6665) resolved to file a petition for the commencement of corporate reorganization proceedings, and filed the same with the Tokyo District Court. Akita Elpida Memory Inc. also saw the commencement of corporate reorganization proceedings


HB-LED grade aluminum nitride meets thermal needs of today's LEDs

Fri, 2 Feb 2012

In this series, CMC Laboratories describes a new LED-grade AlN and what it accomplishes as a ceramic substrate. The AlN offers better heat dissipation for LED packages than alumina, at a lower cost than previous formulations.


Chip substrate factory begins producing thermal-control substrates in Russia

Wed, 2 Feb 2012

MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.


HB-LED grade aluminum nitride (AlN) sintering

Fri, 3 Mar 2012

Part 2 of this series covers furnace considerations for a new HB-LED-grade AlN, as well as furnace throughput. Jonathan Harris, CMC Laboratories, covers the role of the oxide sintering phase in AlN in defining the materials microstructure and thus determining key properties such as thermal conductivity and mechanical strength.


DuPont sells CMP JV interests to Air Products

Thu, 3 Mar 2012

Air Products will acquire all of DuPont's interest in DuPont Air Products NanoMaterials LLC (DA NanoMaterials), a 50-50 JV that the companies set up for the semiconductor and wafer polishing industries.


MEMS Symposium Report: Chasing 1 Trillion

Thu, 5 May 2012

The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.”


DOW opens semiconductor/display R&D center in Seoul with OLED focus

Thu, 3 Mar 2012

The Dow Chemical Company (NYSE: DOW) inaugurated its Dow Seoul Technology Center, a global R&D center with focus on technological advances in display and semiconductor applications.


Semiconductor capex to fall 11.6% in 2012, says Gartner

Wed, 3 Mar 2012

Worldwide semiconductor manufacturing equipment spending is projected to total $38.9 billion in 2012, an 11.6% decline from 2011 spending of $44 billion, according to Gartner Inc.


Semi equipment demand still sinking

Mon, 10 Oct 2012

In case anyone needed a reminder or a wake-up, new data from SEMI reiterates chip tool sales are slumping badly in the latter part of this year.


SEMI adds session, extends abstract deadline for China chip conference

Tue, 10 Oct 2012

SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.


Process Watch: Cycle time’s paradoxical relationship to inspection

Tue, 12 Dec 2012

In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.


IEDM keynote: It tastes like chicken

Tue, 12 Dec 2012

Attendees at this year’s International Electron Devices Meeting (IEDM) were delighted and perhaps somewhat horrified when the plenary speaker popped some electronics gear in his mouth and proclaimed, “It tastes like chicken!”


SEMI: Chip equipment slump extending into 2013, across-the-board rebound in 2014

Thu, 12 Dec 2012

Semiconductor equipment demand is persistently sluggish as the industry takes a break from a "multiyear expansion period" to digest recent investments and wrestle with a broader economic slowdown, acknowledges SEMI in its updated year-end forecast. But make no mistake: leading-edge technology investments are still happening, and growth will return in the typical cyclical pattern.


Advantest will introduce three tools at Semicon Japan

Thu, 11 Nov 2012

In prep for Semicon Japan in December, Advantest announces three new tools: 2 SEMs and a litho system.


Smartphone demand pushes Soitec to expand bonded SoS wafer output

Tue, 11 Nov 2012

Soitec says it has more than doubled production of bonded silicon-on-sapphire (BSoS) substrates to meet increased demand from partner Peregrine Semiconductor, which has surged its own production capacity for RF switches used in cellular handsets, including the newest iPhone 5.


ICPT 2012: Five themes summarizing CMP work and progress

Mon, 11 Nov 2012

This year's International Conference on Planarization/CMP Technology (ICPT) encompassed five themes describing use of CMP: new device structures, equipment and methods, Cu interconnects, consumables, and new CMP methods and processes.


EV Group completes cleanroom expansion, opens new R&D labs

Wed, 11 Nov 2012

EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.


Electronic gases slowing to modest growth in 2012, 2013

Wed, 11 Nov 2012

Sales of electronic gases are seen growing a modest 3.2% growth overall in 2012, following a 15% increase in 2011 to $3.1B, according to an updated report from Techcet Group.


STATS ChipPAC to expand in South Korea

Mon, 11 Nov 2012

STATS ChipPAC Ltd. plans to expand its semiconductor assembly and test operation in South Korea.


Semiconductor equipment demand: Shades of 2009?

Fri, 11 Nov 2012

The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.


Brewer Science introduces CNT inks for printed electronics

Thu, 11 Nov 2012

Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.


ATMI introduces a safe domestic solution for handling electronic waste components

Thu, 11 Nov 2012

ATMI Inc. has introduced the eVOLV process and system that represents a sustainable solution for recycling electronic waste (e-waste).


Semi execs see a bright 2013, says survey

Fri, 12 Dec 2012

Industry watchers have been lowering their outlooks for 2013 over the past few weeks, but there's one set of opinions that still see optimism for an industry rebound in 2013 -- chip industry executives themselves.


Gartner: Fab equipment still getting softer, next upcycle starts in 2014

Thu, 12 Dec 2012

Global spending on wafer fab equipment (WFE) is now on pace to finish 2012 with a -17% annual decline, and 2013 now looks like it'll only be slightly better at a -10% dropoff, before the next cyclical spending upturn begins in 2014, according to an updated forecast from Gartner.


Samsung reaffirms plans for $4B investment in Austin fab: What it means

Mon, 12 Dec 2012

Samsung's reaffirmation of its planned $4B investments in its Austin, TX facilities don't offer much extra info, but do serve as a message to the market about its future plans -- with or without Apple.


Rudolph enters back-end lithography market

Thu, 12 Dec 2012

Rudolph Technologies, Inc. (Nasdaq: RTEC) has entered the back-end advanced packaging lithography market, with the acquisition of Azores Corp., and the introduction of a new 2X reduction stepper called the JetStep.


The ConFab 2012: A retrospective

Thu, 8 Aug 2012

The ConFab, Solid State Technology’s invitation-only event for the semiconductor industry, took place in June, with presenters from top companies and analyst firms. If you couldn’t be there, check out all the coverage from the event -- reports, presentations, video interviews and more.


LED encapsulants grow with increased LED adoption

Tue, 7 Jul 2012

LED encapsulants are closely related to the LED’s lifespan and light transmittance. With high-power and high-brightness LEDs emerging, the encapsulant’s role is becoming more important, says Displaybank.


CGI Americas brings C Sun ovens to North American fabs

Mon, 7 Jul 2012

CGI Americas is introducing the QMO Series inert gas and vacuum ovens and MOL Series Class 100 cleanroom ovens, based on the SMO Series precision ovens from C Sun, to the North American market.


2012 “Best of West” award finalists announced

Thu, 6 Jun 2012

Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain.


SEMICON West preview: Metrology, inspection, and process control products

Thu, 6 Jun 2012

Following are some of the process control, device inspection, defect detection, and other metrology and test products that will be on display at SEMICON West 2012, July 10-12 in San Francisco, CA.


JPSA picosecond laser micromachining platform reduces debris and thermal damage

Tue, 6 Jun 2012

JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.


Major semiconductor players increase capex in 2012, total capex falls 3%

Wed, 7 Jul 2012

IC Insights’ latest survey and ranking of the major semiconductor capital spenders shows that only 6 of the 35 major semiconductor suppliers -- Intel, Samsung, Hynix, TSMC, UMC, and Rohm -- with significant capital expenditure budgets are expected to spend more in 2012 than they did in 2011.


Semiconductor fab tool capex trends gleaned @ SEMICON West

Thu, 7 Jul 2012

After meeting with various semiconductor manufacturing tool suppliers -- Applied Materials, KLA-Tencor, Lam Research, Tokyo Electron, Teradyne and Cymer -- at SEMICON West, Citi analysts share impressions on foundry spending plans and tool choices.


ECTC: Focus on 3D integration and TSVs

Fri, 6 Jun 2012

A main focus of this year’s Electronic Components and Technology Conference (ECTC), held this week in San Diego, is 3D integration and through silicon vias (TSVs).


Process Watch: The dangerous disappearing defect

Tue, 5 May 2012

In this first installment of a series called "Process Watch,” experts from KLA-Tencor explain why a defect might be classified as “Not Found” or “SEM Non-visual (SNV),” and how a SNV count can disguise or hide real problems.


Conference Report: International Interconnect Technology Conference, IITC

Tue, 6 Jun 2012

The 15th IITC (International Interconnect Technology Conference) opened Monday, June 4 at the Doubletree Hotel in San Jose, CA. Recurring themes this year were variations on 3D and TSV, novel systems and packaging, and back end memory. Mike Fury reports.


Semiconductor equipment spending to contract 2.6% in 2012, grow in 2013

Tue, 7 Jul 2012

Semiconductor equipment sales will reach $42.4 billion in 2012, according to the mid-year edition of the SEMI Capital Equipment Forecast, released at SEMICON West 2012.


More SEMICON West exhibit previews

Sun, 7 Jul 2012

Following are some of the new and flagship products that will appear this week at SEMICON West, July 10-12 in the Moscone Center of San Francisco, CA.


Printed electronics standards initiative starts with substrate materials

Fri, 7 Jul 2012

IPC and JPCA released their first operational-level standard for the printed electronics industry, defining terms and establishes basic requirements for substrate materials used in printed electronics: ceramic, organic, metal, glass and other.


North American semiconductor fab tool book-to-bill drops below parity in June

Fri, 7 Jul 2012

"Following seven months of increases, the three-month average bookings declined in June and likely reflects some slowing in investment plans attributed to weaknesses in the broader economy," said Denny McGuirk, SEMI.  "While order activity may slow, equipment spending this year will continue to be directed towards advanced technologies in wafer processing and packaging assembly."


Rudolph buys NanoPhotonics to bolster advanced packaging inspection offering

Thu, 6 Jun 2012

Rudolph Technologies Inc. (NASDAQ:RTEC) acquired the assets of NanoPhotonics GmbH, adding inspection technology and an intellectual property (IP) portfolio to serve its advanced package inspection tool customers.


AMAT’s Varian integration continues with Dickerson named president

Wed, 6 Jun 2012

In mid-2011, semiconductor manufacturing and assembly equipment supplier Applied Materials (NASDAQ:AMAT) acquired Varian Semiconductor Equipment Associates Inc. Now, the company is adding Varian’s former CEO Gary Dickerson as president.


Luminus Devices cuts LEDs’ thermal resistance 30% with new packaging

Thu, 6 Jun 2012

Luminus Devices Inc. is reducing thermal resistance in its Big Chip LED devices by 30% with new packaging technology.


Metrology merger: MicroSense acquires SigmaTech

Wed, 6 Jun 2012

MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.


A*STAR and Hitachi to collaborate on 3D ICs

Fri, 9 Sep 2012

Singapore’s A*STAR’s Institute of Microelectronics (IME), and Hitachi Chemical Co., will be collaborating on a joint research program to develop high performance material technologies for thin wafer processing for 3D IC packaging.


Bruker lands order for multiple 3D optical microscopes

Fri, 8 Aug 2012

Bruker said that a leading semiconductor supplier purchased multiple ContourGT-X 3D optical microscope systems for its packaging factories in Asia and North America to support copper wire bond inspection and process control needs. 


K&S launches manual wire bonder series

Fri, 8 Aug 2012

Kulicke & Soffa Industries, Inc. launched its next generation manual wire bonder series, the iBond5000.  The series, which is based on the company’s 4500 line, includes ball, wedge and dual-capability bonding options.


Laser nanofabrication for mass production at the nanoscale

Fri, 8 Aug 2012

Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.


From fuzzy to focused: Phase I in project development

Fri, 10 Oct 2012

Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.


Europe to unite research efforts in Silicon Europe cluster alliance

Mon, 10 Oct 2012

Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”


Hesse & Knipps introduces new heavy wire bondhead

Tue, 8 Aug 2012

Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders.


Bonding and cleaving at low temperatures

Tue, 8 Aug 2012

Brian Cronquist, MonolithIC 3D Inc.'s VP of Technology and IP reports on recent progress on low temperature (less than 400°C) bonding and cleaving processes.


Applied Materials cutting 1300 jobs, reallocating funds to "key growth initiatives"

Thu, 10 Oct 2012

Applied Materials says it will reduce its work force by between 6% and 9% (900-1300 positions) amid a global realignment deemed necessary to achieve certain strategic objectives, freeing up to $190M annually "to fund key growth initiatives."


Analyst: Fab spending softness 2012 extending into 2013

Thu, 10 Oct 2012

Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.


Japan's semiconductor industry: Fabs, equipment, and materials

Wed, 10 Oct 2012

Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy,  the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.


IBM demos high-performance CMOS on flexible plastic substrates

Tue, 9 Sep 2012

At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.


IEDM unveils 2012 program highlights

Mon, 9 Sep 2012

The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.


EV Group sells first ZoneBOND tech for compound semi work

Wed, 9 Sep 2012

EV Group says it has received an order for its EVG850 temporary bonding/debonding systems from a leading maker of compound semiconductor-based components, what it says is the first use of its ZoneBOND technology in this area.


Chip demand still sliding, hopes for soft 3Q landing and recovery

Fri, 9 Sep 2012

Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.


TSMC keynoter suggests WLSI at IITC

Fri, 6 Jun 2013

In a keynote at the IEEE International Interconnect Technology Conference (IITC), Douglas Yu from TSMC talked about Moore’s Law scaling becoming increasingly difficult.


CEA-Leti wins Avantex Innovation Prize for E-Thread technology

Mon, 6 Jun 2013

CEA-Leti announced today that researchers Dominique Vicard and Jean Brun received the Avantex Innovation Prize for the use of the E-Thread technology in textiles.


GLOBALFOUNDRIES introduces certified design flows for multi-die integration using 2.5D IC technology

Fri, 5 May 2013

The foundry plans to unveil a comprehensive set of certified design flows to support 2.5D IC product development with its most advanced manufacturing processes at next week’s 50th Design Automation Conference (DAC) in Austin, Texas.


Fab equipment spending: 23% growth for 2014

Tue, 6 Jun 2013

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.


Signetics announces plans to increase their flip chip package assembly capacity

Tue, 5 May 2013

Signetics Corporation today announced that it has again approved capex plans that will further expand their capacity for flip chip package assembly at their factory in Paju, South Korea.


New power management IC helps reduce thermal stress on processors in phones and tablets

Tue, 5 May 2013

ams AG, a provider of high performance analog ICs and sensors, today introduced the AS3721, a power management IC (PMIC) with an innovative remote-feedback circuit that helps reduce the thermal stress of applications processors in smartphones and tablets.


Dow Corning and SÜSS MicroTec report new temporary bonding solution for 2.5D and 3D IC packaging

Wed, 5 May 2013

The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at ECTC 2013, with the report of an advanced new temporary bonding solution for 3D TSV semiconductor packaging.


Yole Developpement conducts 2.5D, 3DIC and TSV interconnect patent investigation

Wed, 5 May 2013

Yole Développement announced its 2.5D, 3DIC and TSV Interconnect Patent Investigation report. For this analysis of 3D packaging technology patents, more than 1800 patent families have been screened.


MOSIS collaborates with imec, Tyndall and ePIXfab on silicon photonics

Thu, 5 May 2013

MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with imec, Ireland's Tyndall National Institute and ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs.


Amkor Technology appoints Steve Kelley president and CEO

Wed, 5 May 2013

Amkor Technology, Inc. today announced that Stephen D. Kelley has been appointed to serve as president and chief executive officer and as a director of the company, effective May 8, 2013.


Invensas demos new high bandwidth packaging solution for mobile devices at 2013 ECTC

Wed, 5 May 2013

Invensas Corporation, a subsidiary of Tessera Technologies, Inc., will showcase its latest mobility solution, an ultra-high bandwidth Bond Via Array (BVATM) Package-on-Package (PoP) product, at the upcoming IEEE Electronic Components & Technology Conference (ECTC) in Las Vegas, NV on May 28 - 31, 2013.


North American semiconductor equipment industry posts April 2013 book-to-bill ratio of 1.08

Wed, 5 May 2013

North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08.


Alliance Memory introduces new high-speed CMOS synchronous DRAMs

Tue, 4 Apr 2013

Alliance Memory today extended its 128M and 256M lines of high-speed CMOS synchronous DRAMs (SDRAM) with new devices in a 54-ball 8 mm by 8mm by 1.2mm TFBGA package.


Global semiconductor sales outpace last year through Q1 of 2013

Tue, 5 May 2013

Sales in March 2013 were up slightly compared to February 2013 and March 2012.


Silex joins ENIAC project to develop new solutions for TSV and wafer bonding

Mon, 5 May 2013

Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced that it has joined an international European Union-funded program aimed at developing a new MEMS manufacturing platform based on advanced inkjet-based printing technologies.


SEMI reports March book-to-bill ratio of 1.14

Fri, 4 Apr 2013

North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.


More than one-third of companies completely unprepared for US Conflict-Materials rules

Thu, 4 Apr 2013

With time running out until U.S. component manufacturers are legally required to disclose their usage of conflict minerals to the federal government, many companies are woefully unprepared for the new regulations, with more than one-third of firms indicating they haven’t even commenced compliance planning, according to a survey from information and analytics provider IHS.


Painting with catalysts: Nano-engineered materials for detoxifying water

Fri, 2 Feb 2013

Only light, aerial oxygen, and a catalyst are needed to remove pollutants from water. Ruhr-Universitat Bochum researchers led by Professor Radim Beránek are collaborating with colleagues from seven different countries in order to develop a photocatalyst that is efficient enough to be profitable.


UNL research moving closer to cracking silicon barrier

Fri, 2 Feb 2013

The ability to improve silicon transistors is reaching its fundamental limit, so researchers are searching for new ways to keep making electronic devices faster and more powerful. University of Nebraska-Lincoln physicists and colleagues have taken a major step toward breaking that silicon barrier.


RRAM: Understanding reliability issues

Thu, 2 Feb 2013

Tim Turner, the Reliability Center Business Development Manager at the College of Nanoscale Science and Engineering (CNSE), Albany, NY, blogs about the potential of resistive memory and the reliability challenges the must be overcome.


Leti to coordinate European supply chain in silicon photonics

Wed, 2 Feb 2013

CEA-Leti today announced that it will coordinate a four-year project aimed at building a European-based supply chain in silicon photonics and speeding industrialization of the technology.


Poongsan to partner with SEMATECH

Wed, 2 Feb 2013

Joint effort to explore novel process techniques to improve device performance and reliability in semiconductor manufacturing for sub 20nm technology node.


STMicroelectronics 28nm FD-SOI technology hits 3GHz operating speed

Wed, 2 Feb 2013

STMicroelectronics announced today another milestone in its testing of its 28nm FD-SOI Technology Platform.


2013: Outlook for secondary equipment

Thu, 1 Jan 2013

The multibillion-dollar secondary or used semiconductor equipment market has gone through significant changes over the past five years and has become increasingly sophisticated in its approach.


2013: Continued strength in 200mm

Thu, 1 Jan 2013

80 percent of the devices used for portable and mobile applications are currently manufactured on 200mm or smaller wafers. How this plays out going forward could change who the dominant players will be.


2013: Advanced packaging requirements are more complex, require new solutions

Wed, 1 Jan 2013

Advanced packaging requirements are driving the evolution of back end manufacturing to become more similar to the front end.


2013: Thriving in the transition to 450mm

Wed, 1 Jan 2013

The development of innovative technologies that solve the critical issues for the transition and adoption of 450-mm manufacturing will be the defining factor for whether a company merely survives or thrives.


2013: Fab Equipment Spending Shrinks Back to Flat

Wed, 1 Jan 2013

The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.


Global market for MEMS microphone to more than double in five years

Wed, 2 Feb 2013

The global market for MEMS microphones has reached approximately $422 million in 2012. The market is predicted to increase to $865 million in 2017.


Solid state thin film batteries market worth $6 Billion by 2019

Tue, 2 Feb 2013

Markets for solid state thin-film batteries at $65.9 million in 2012 are anticipated to reach $5.95 billion by 2019, according to a new report released by ReportsnReports.com.


ISSCC 2013: Imagers, MEMS, medical and displays

Mon, 2 Feb 2013

Roland Thomas, subcommittee chair of ISSCC, writes of the substantial growth and future in key areas of technology.


ISSCC 2013: Large-area flexible electronics

Mon, 2 Feb 2013

Hoi-Jun Yoo, subcommittee chair of ISSCC 2013, writes on the focus of technology directions in the field of large-area and low-temperature electronics.


SEMI China releases Top Ten list of packaging and assembling facilities

Thu, 2 Feb 2013

Although many are small companies manufacturing low-pin count devices, all of the world’s “Top 10” OSAT, Outsourced Semiconductor Assembly and Test, players have one or more assembly and testing facilities in China.


Econometric Forecast: Regional developments to affect growth of semiconductor industry

Thu, 2 Feb 2013

In the first of two installments, we examine the global issues facing the semiconductor industry, as released by Linx Consulting in The Econometric Semiconductor Forecast.


Econometric forecasting service predicts 6% growth in semiconductor wafers in 2013

Thu, 2 Feb 2013

A new econometric semiconductor industry forecast predicts semiconductor wafer area production to grow slightly less than 6% in 2013, according to Linx Consulting.


Dow Corning and IBM scientists develop new materials for board-level photonics

Tue, 2 Feb 2013

Dow Corning and IBM scientists unveiled a major step in photonics yesterday at the Photonics West conference, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers.


Semiconductor R&D spending rises 7% despite weak market

Tue, 2 Feb 2013

Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion.


BGA guideline features expanded focus on mechanical reliability

Wed, 1 Jan 2013

IPC recently released the C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.


STATS ChipPAC and UMC unveil 3D IC developed under open ecosystem

Wed, 1 Jan 2013

STATS ChipPAC and UMC announced the world's first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration.


Renesas and J-Devices sign MoU on transfer of back-end facilities

Wed, 1 Jan 2013

Renesas and J-Devices signed a memorandum of understanding regarding the transfer of the semiconductor back-end production business of three facilities operated by Renesas’ wholly owned manufacturing subsidiaries


Engineers at University of Buffalo develop hyperbolic metamaterial waveguide

Thu, 2 Feb 2013

By creating a material that slows light, engineers open new possibilities in solar energy, military technology and other fields of research.


Smartphones and tablets drive continued double-digit growth in MEMS motion sensor market

Thu, 2 Feb 2013

Smartphones and media tablets continue to the prime movers of technology industries, with the two mobile platforms spurring a double-digit increase in the market for microelectromechanical system (MEMS) motion sensors this year.


GlobalFoundries adding R&D facility to NY fab campus

Fri, 1 Jan 2013

GlobalFoundries says it plans to build a $2 billion "Technology Development Center" R&D facility at its Fab 8 campus in Saratoga County, NY, for semiconductor technology development and manufacturing:  EUV lithography photomasks to new interconnect and packaging technologies enabling 3D chip stacking, "and everything in between."


Five IC suppliers to hold one-third of 300mm wafer capacity in 2013

Wed, 2 Feb 2013

Samsung tops list; IC foundries expected to show biggest capacity gains through 2017.


Production process doubles speed and efficiency of flexible electronics

Wed, 2 Feb 2013

Stretched-out clothing might not be a great practice for laundry day, but in the case of microprocessor manufacture, stretching out the atomic structure of the silicon in the critical components of a device can be a good way to increase a processor's performance.


300-millimeter thin-wafer products by Infineon now being shipped worldwide

Tue, 2 Feb 2013

In February, Infineon received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at their site in Villach, Austria.


New Product: Engineered Material Systems introduces die attach for temperature-sensitive applications

Tue, 2 Feb 2013

Engineered Material Systems, a global supplier of electronic materials for circuit assembly applications, debuts its DB-1568-1 low-temperature cure die attach adhesive for attaching semiconductor die in temperature-sensitive devices.


Rise of smartphones reshapes competitive order in the cellphone chip market

Mon, 2 Feb 2013

The competitive landscape of the cellphone core integrated circuit (IC) business has completely transformed over the past five years, with Qualcomm Inc. and Samsung capitalizing on the rise of smartphones and 4G.


Scientists develop multicolor LEDs without heavy metals

Mon, 2 Feb 2013

Silicon nanocrystals have a size of a few nanometers and possess a high luminous potential. Scientists of Karlsruhe Institute of Technology (KIT) and the University of Toronto/Canada have now succeeded in manufacturing silicon-based light-emitting diodes (SiLEDs). They are free of heavy metals and can emit light in various colors.


Fab Spending Forecast: Equipment spending is expected to remain flat in 2013

Wed, 3 Mar 2013

Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.


Signetics introduces an alternative to standard plastic ball grid array packages

Tue, 3 Mar 2013

Signetics Corporation today introduced their new MapBGA package to the industry. This alternative to standard PBGA packaging has improved reliability and design flexibility due to its unique assembly process.


India's efforts to appeal to semiconductor manufacturers

Thu, 2 Feb 2013

This week, India’s Finance Minister P Chidambaram offered incentives to chip makers to set up headquarters in India, in an effort to encourage local electronics manufacturing. However, the response from the industry has been less than positive. Many believe that is it is a good start, but far from sufficient.


Brooks Instrument to launch new mass flow controller at SEMICON China

Thu, 2 Feb 2013

Brooks Instrument, a provider of flow measurement and control instrumentation to the microelectronics industry, will launch the GF135 pressure transient insensitive (PTI) mass flow controller at SEMICON China, March 19-21 at Shanghai New International Expo Center.


AGC and nMode launch subsidiary to develop advanced packaging technology

Tue, 3 Mar 2013

Tokyo-based Asahi Glass Co., Ltd. and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co-found a subsidiary business, Triton Micro Technologies , to develop via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.


Silex and BroadPak partnership produces 2.5D IC packaging capabilities

Tue, 4 Apr 2013

Silex Microsystems and BroadPak today announced the immediate availability of their jointly developed silicon interposer solution in high-volume manufacturing.


PCB growth rate to slow to 2.7% in 2013

Fri, 3 Mar 2013

In 2012, global PCB industry saw a jump in terms of output value, benefitting in a large part from the rapid growth in the shipment of Apple and Samsung. However, there is no such possibility of a huge jump in 2013, as the report states the expected growth rate will slow down to 2.7%.


LED-industry-LED-manufacturing-tech-report due out from Yole, EPIC

Wed, 10 Oct 2010

The packaged LED market is experiencing tremendous growth with an expected CAGR of 28.2% between 2009 and 2015. Yole and EPIC will publish their new market & technological studies dedicated to LED market and manufacturing technologies in November.


September slide: Welcome to the semicap equipment downturn?

Fri, 10 Oct 2010

SEMI's August numbers indicated the possible beginnings of a peak in equipment demand -- and the September numbers sure like a pullback, with orders declining -11% in a quarter-closing month.


ISMI packs up, heads to UAlbany NanoCollege

Fri, 10 Oct 2010

The International SEMATECH Manufacturing Initiative Inc. (ISMI) will relocate its headquarters and operations to CNSE's Albany NanoTech Complex beginning in January 2011. It is expected to create more than 100 jobs in NY.


OEM-level offsite outsourcing: a new paradigm

Mon, 11 Nov 2010
Robert de Neve, E Systems Technology, Mountain View, CA USA

SEMI tool demand surging; B:B highest in years

Tue, 2 Feb 2010

Demand for semiconductor manufacturing equipment continues to surge as the industry emerges from its slumber, with some measurements showing strength not seen in several years, according to the latest monthly data from SEMI and SEAJ.


SEMI/SEAJ May numbers: Slowing at a peak?

Mon, 6 Jun 2010

The latest monthly sales & order data for US-based and Japanese semiconductor manufacturing equipment shows growth slowing down -- and possibly because except for some pockets, it may be time for things to pull back a little bit.


Analysts' take: Samsung incites "foundry wars" with 32nm HKMG volley

Mon, 6 Jun 2010

Samsung's announcement that it has completed testing of its 32nm high-k/metal gate architecture, ramping to volume possibly by year's end -- and following quickly with a 28nm version -- has the industry buzzing about a possible reshaping of leading-edge semiconductor foundry manufacturing.


How strain can protect devices from ESD: IEDM Preview

Thu, 11 Nov 2010

The use of strain engineering can have a positive impact on a device's robustness to electrostatic discharge (ESD). At the upcoming IEDM event, researchers from the US and Europe will discuss the impact of strain on different ESD protection devices in bulk silicon and SOI.


TSMC chooses gate-last on 28nm CMOS

Fri, 11 Nov 2010

Transistor architecture beyond HK+MG. SOURCE: TSMCFive factors drove TSMC's decision to select the gate-last approach: speed, power, reliability, manufacturability, and scalability. Di Ma, VP, field technical support at TSMC, speaks with ElectroIQ about TSMC’s efforts with respect to transistor architecture beyond HK+MG.


SEMI: "Seasonal softening" now controls chip tool demand

Fri, 11 Nov 2010

Good news: September numbers for semiconductor equipment demand were a little bit better than originally thought. Bad news: October numbers are worse, and it's even more clear that we're on the downslope of a summertime demand peak.


Chip tool firms keep "March"-ing along

Fri, 4 Apr 2010

Semiconductor equipment suppliers reported continued moderate growth that's increasingly back in line with pre-downturn levels, according to the latest monthly data from SEMI.


Chip tool demand still climbing through end of '09

Mon, 1 Jan 2010

Demand for semiconductor capital equipment continued to increase in the final month of 2009, and with the key book-to-bill ratio now six straight months above parity suggests growth still lies ahead, according to the latest industry data.


Mattson Suprema photoresist strip systems ordered for FEOL and BEOL logic fab

Wed, 10 Oct 2010

Mattson Suprema photoresist strip systems ordered for FEOL and BEOL logic fabMattson Technology Inc. (NASDAQ: MTSN), advanced wafer fab process equipment supplier, received orders for multiple Suprema photoresist strip systems from a new Asian customer. The Supremas will be used in both front-end-of-line (FEOL) and back-end-of-line (BEOL) applications for advanced logic device production.


MRS Day 5: Flexible electronics, Ge-Si integration, CNTs, OPV, and PCBs

Tue, 4 Apr 2010

Techcet's Michael A. Fury closes out his series of observations from this year's MRS Spring meeting in San Francisco. From Day 5: Ge-Si integration, carbon nanotubes in organic photovoltaics, energy storage using paper, printable GaN semiconductors, and stretchable circuit boards and conductors.


MRS Day 2: CVD for Cu, low-k etch stop, future FETs, graphene "atom hopping"

Wed, 4 Apr 2010

Techcet's Michael A. Fury continues his series of observations from this year's MRS Spring meeting in San Francisco. From Day 2: CVD for Cu interconnects, controlling low-k etch-stop layers, materials challenges for future FETs, "atom hopping" in graphene, and oxide nanoelectronics on demand.


Tokyo-Electron-Tanaka-Kikinzoku-Kogyo-recycle-discarded-CVD-ruthenium-precursors

Wed, 11 Nov 2010

Tokyo Electron Limited and Tanaka Kikinzoku Kogyo K.K. have developed a sucessful recycling process for ruthenium precursors (CVD-ruthenium material) used in next-generation semiconductor miniaturization technology.


Ion-implant-debut-VSEA-sub30nm-semiconductor-fab

Fri, 10 Oct 2010

The VIISta Trident high-current ion implanter from Varian Semiconductor Equipment Associates Inc. (NASDAQ: VSEA) enables high-performance, low-leakage devices while improving productivity at the sub30nm wafer fab node.


Smart strategic outsourcing of product development: Ask the right questions

Fri, 10 Oct 2010

Mark Danna, Owens Design, discusses the key questions that should be asked when selecting a strategic outsource partner particularly in the area semiconductor and solar manufacturing equipment development.


SAFC Hitech expands HB-LED operations in Taiwan

Thu, 12 Dec 2010

SAFC Hitech announced plans to build a new, dedicated facility in Kaohsiung, Taiwan for transfilling, technical service and production of chemical precursors used for high brightness LED and silicon semiconductor manufacturing.


EUV litho gets boost from ASML Brion software

Tue, 9 Sep 2010

Brion Technologies, a division of ASML, debuted the Tachyon NXE software to optimize predictive modeling for ASML EUV scanners. EUV scanners enable smaller, faster, cheaper and more energy-efficient semiconductors. This article includes a podcast interview on the technology.


Technical debt in semiconductor equipment: it's time to pay it down

Thu, 7 Jul 2010
This is a good time to take stock of your development readiness and how well legacy software assets will support the product roadmap. Dan O

The next harbinger of consolidation?

Mon, 3 Mar 2010

Barclays analyst CJ Muse looks at the numbers for semiconductor equipment companies, and says there's a combination brewing that could create "the catalyst, finally, for consolidation in the equipment space."


SEMI/SEAJ: Feb. tool demand keeps chugging along

Fri, 3 Mar 2010

The chip industry keeps chugging along the recovery road, with another "dramatic" month compared to the depths of a year ago -- and one key statistic is at an eye-popping seven-year high, according to the latest monthly figures from SEMI.


SEMI: Recovery in tools, materials in 2H09

Fri, 3 Mar 2010

No surprise that 2H09 was a comeback period for semiconductor equipment and materials suppliers, but new "final" numbers from SEMI suggest some late-season changes in behavior in some regions, and ultimately sets the stage for a better 2010.


In a challenging year, 26 suppliers earn Intel kudos

Wed, 3 Mar 2010

Intel has given its nod to two dozen key partners from its roster of thousands of supply-chain contributors as the 2009 winners of its annual supply chain awards -- and within the listings is a interesting nugget about the chipmaker's lithography strategy.


Fire-safe materials debut for semiconductor clean room environments

Thu, 8 Aug 2010

Fire-safe materials debut for semiconductor clean room environmentsFlametec fire-safe materials are formulated to exceed fire compliances for polymers in semiconductor, clean room, and other applications. Flametec is used for a variety of applications including tools, wet benches, cabinetry and furniture. 


SEMI: June data hits milestone, but what's next?

Thu, 7 Jul 2010

SEMI's June numbers for semiconductor equipment demand hit a milestone, officially surpassing pre-meltown levels, but numbers are somewhat mixed -- and the future's as blurry as ever.


SEMICON West wrap with JC Kim

Fri, 7 Jul 2010

SEMICON West 2010 wrapped this week in San Francisco. This article includes JC Kim, SEMI Board of Directors Chair, discussing the show and the semiconductor industry future. We also have POVs from the show floor by the ElectroIQ.com bloggers.


IBM's Meyerson: Finding where (our) innovation matters

Tue, 7 Jul 2010

 Innovation drives everything -- and innovation spawned from the semiconductor and related industries is poised to do nothing less than change the world, or at least help everyone adapt better to it, as related by SEMICON West kickoff keynoter Bernie Meyerson of IBM.


SEMI: Materials bounce back to records, but slowing in 2010

Tue, 7 Jul 2010

Unit shipments of key semiconductor materials are already back to record levels just a year after the most punishing period in the industry's history, but the growth will slow in 2011 for several reasons, according to the latest forecast data presented at SEMICON West.


2011 semiconductor sales may be slower, Semico IPI dip indicates

Wed, 8 Aug 2010

Semico IPI August 2010 semiconductor sales forecastIn August 2010, the Semico IPI index experienced its first drop since December 2009. The Semico IPI Index signals changes in the direction of semiconductor sales growth one year in advance.


SEMICON Taiwan welcomes French wafer fab equipment suppliers, research orgs

Fri, 9 Sep 2010

SEMICON Taiwan will say "bienvenue" to 10 companies from France, including research group CEA-Leti, international development agency UBI France, and suppliers like Satin Technologies and IBS.


S-P-Equity-semiconductor-predictions-2011

Mon, 12 Dec 2010

S&P Equity Research semiconductor and semiconductor equipment analysts Clyde Montevirgen and Angelo Zino have issued their 2011 forecasts for the industry, covering sales/revenues, capacity utilization, back-end equipment, solar crossover, and more.


Semiconductor-equipment-Nov-book-to-bill-hits-0.96

Wed, 12 Dec 2010

North America-based manufacturers of semiconductor equipment posted $1.51 billion in orders in November 2010 and a book-to-bill ratio of 0.96, according to the November 2010 Book-to-Bill Report published by SEMI.


Euro consortium targets telecom energy reductions via semiconductor material efficiencies

Mon, 8 Aug 2010

The BIANCHO project (BIsmide And Nitride Components for High temperature Operation) will develop new semiconductor materials to allow lasers and other photonic components to become more energy efficient and also more tolerant of high operating temperatures.


SEMI's updated forecast: 2010 stronger, 2011 weaker, 2012 mixed

Tue, 12 Dec 2010

As 2010 shapes up as a record year for semiconductor equipment spending, so the following two years will be a slow fall back to Earth with low single-digit overall growth, according to SEMI's updated forecasts -- though there are some interesting trends within the numbers.


Five stars: Assembly firms pack best chip tool rankings

Mon, 12 Dec 2010

Eleven semiconductor equipment manufacturers earned VLSI Research's five-star rating this year, earning top marks in various metrics adding up to "exceptional customer satisfaction."


Semiconductor-equipment-demand-slows-VLSI

Wed, 12 Dec 2010

The recent difficulties in semiconductor sales and the unusually rapidly declining IC price/performance index are slowing semiconductor equipment demand. Essentially, 2010 has been a 2-for-1 deal for both chips and equipment with two years of growth in one year, resulting in overcapacity and declining chip prices, says VLSI.


Researchers: SiOx just fine for sub-10nm memory switch

Fri, 9 Sep 2010

Researchers at Rice U. say they've figured out that new switching memory they built with electrically manipulated 10nm graphite strips doesn't actually need the graphite -- good ol' reliable silicon oxide will do just fine.


Low-k dielectric family introduced by SBA Materials

Tue, 9 Sep 2010

The IC community has been searching for a manufacturable low-k dielectric which could scale to below K = 2.0, says Dr. Phil Garrou. Microindent photos of uLK 124, released by SBA Materials show a clean ductile indent. SBA reports that their uLK materials can be integrated into existing fab lines using equipment and process flows already in place.The IC community has been searching for a manufacturable low-k dielectric which could scale to below K = 2.0, says Dr. Phil Garrou. Microindent photos of uLK 124, released by SBA Materials show a clean ductile indent. SBA reports that their uLK materials can be integrated into existing fab lines using equipment and process flows already in place.


Simple wet cleaning improvements can meet new silicon surface preparation criteria

Tue, 9 Sep 2010

Robert Pagliaro, RP Innovative Engineering Solutions, demonstrates that simple but effective enhancements to wet clean steps can help achieve more stringent surface preparation and reduce complexity, cost of ownership (COO), and environmental concerns associated with existing methods. Contamination left or caused by cleaning and drying steps can adversely affect wafer yields.Robert Pagliaro, RP Innovative Engineering Solutions, demonstrates that simple but effective enhancements to wet clean steps can help achieve more stringent surface preparation and reduce complexity, cost of ownership (COO), and environmental concerns associated with existing methods. Contamination left or caused by cleaning and drying steps can adversely affect wafer yields.


Nanoimprint collaboration from AMO and SUSS MicroTec leads to UV-SCIL breakthroughs

Wed, 10 Oct 2010

SCIL Suss Amo nanoimprint silicon master.AMO GmbH and SUSS MicroTec AG are developing applications for substrate conformal imprint lithography (SCIL) with UV curing material. Due to unique sequential contacting and separation technology, a distortion-free replication of a stamp at high throughput is now possible with UV-SCIL.


Dopant-solutions-target-cost-effective-semiconductor-miniaturization-SRC-and-Waseda-U-at-IEDM

Mon, 12 Dec 2010

SRCAt IEDM, Semiconductor Research Corporation and researchers from Waseda University announced process and materials development  for precisely controlling both the amount and the position of channel dopants. The researchers say this advance should help extend the manufacturability of semiconductors beyond conventional doped-channel device technologies. The result is projected to enable near atomic-scale devices and single-dopant devices.


GLOBALFOUNDRIES 28nm analog/mixed-signal production design flow kit out soon

Wed, 9 Sep 2010

GLOBALFOUNDRIES teamed with Cadence Design Systems to create an open-access 28nm Analog/Mixed-Signal (AMS) production design flow development kit.


SEMI: 2010 still rocking, but numbers show a peak

Fri, 9 Sep 2010

The latest data from SEMI and SEAJ tracking semiconductor equipment demand confirms that things are still slowing down, but the sector remains at record levels -- for now.


Wafer fab equipment: Who's spending in 2011-2012, who's not

Mon, 9 Sep 2010

It's déjà vu all over again for semiconductor wafer fab equipment spending, says Barclay's CJ Muse, as the industry seems to be repeating the 2004-2006 cycle of two strong years sandwiching a flat one.


sp3: Diamond as a potential SOI layer for high-power apps

Fri, 8 Aug 2011

sp3 Diamond Technologies' Dwain Aidala explains how the move to Cu CMP and caustic slurries are driving interest in diamond pad conditioners, and also as a potential SOI layer for high-power applications. He also addresses a shift in how R&D funding has changed as external capital has become scarce.


Nujira opens IC design center in Scotland

Wed, 8 Aug 2011

Nujira opened an IC Design Centre in Edinburgh, Scotland, with the help of

Samsung adds Grandis Inc. for memory R&D

Tue, 8 Aug 2011

IC maker Samsung Electronics Co. Ltd. acquired Grandis Inc., a Silicon Valley maker of spin transfer torque random access memory (STT-RAM).


Sapphire Materials Company readies sapphire fab

Fri, 7 Jul 2011

Sapphire Materials Company (SMC), a subsidiary of Silicon Chemical Corporation (SCC), completed Phase I of its sapphire manufacturing business. Initial shipments of sapphire product will begin this November.


Optimize productivity before you automate

Thu, 7 Jul 2011

How can we become more productive? Provide more of our goods or services for the same or less cost? The typical answer is automation. However, automation is not the panacea today's businesses need to cure lack of competitive products or services.


Imec ITF: Reduce LEDs costs 10x, says Philips Lumileds

Tue, 5 May 2011

In an exclusive series of blogs, imec reports from its International Technology Forum (ITF) last week in Brussels. Els Parton, science editor, imec, shares Jy Bhardwaj's (Philips Lumileds) points about LEDs costs improvements.


Imec ITF: 2011 is "the year for EUV to prove its readiness"

Wed, 5 May 2011

In an SST-exclusive series of blogs, imec reports from its International Technology Forum this week in Brussels. Geert Vandenberghe talks about how EUV lithography is at a readiness crossroads, but he feels "fairly secure" about its current capabilities.


Combinatorial method can do for wafer processing tools what it has done for semiconductor materials

Tue, 5 May 2011

Mike Besnard, ATMI, speaks about evolving the high-productivity combinatorial research method to vet wafer processing tools for the ramp to high-volume, not just to screen semiconductor materials. He caught up with ElectroIQ.com at The ConFab.


KLAC joins SEMATECH EUV efforts

Tue, 6 Jun 2011

KLA-Tencor will join SEMATECH-led efforts to identify and eliminate defects in EUV lithography, including mask metrology infrastructure and metrology source development.


Metryx joins semiconductor equipment assessment group SEAL

Tue, 6 Jun 2011

Metryx will work with IMEC and Intel via the joint European Semiconductor Equipment Assessment Leveraging Innovation (SEAL) project to assess high-resolution mass metrology viability at 20nm and smaller nodes.


FSI wins wafer clean tooling orders from FEOL and BEOL customers

Tue, 6 Jun 2011

FSI International Inc. (Nasdaq:FSII), surface conditioning equipment supplier, won orders for multiple ORION single wafer cleaning systems. A memory maker will use the ORION in wet photoresist strip and etch and a foundry will use it for backend-of-line (BEOL) processes, like cleaning film stacks.


Plasma tool from Nordson MARCH handles 5 wafer sizes

Thu, 7 Jul 2011

Nordson MARCH introduced the FlexTRAK-WF low-cost, cassette-based automated plasma treatment system that handles five wafer sizes with minimal hardware change-over.


Avantor, SACHEM selective etch chemisty doubles as wafer cleaner

Wed, 7 Jul 2011

Avantor Performance Materials will launch the first in its new J.T.Baker SLCT Series of selective etch surface treatment chemistries, SLCT 128 sigma etchant, at SEMICON West. The product results from a partnership with etch specialist SACHEM.


Novel organic semiconductors from SmartKem best amorphous silicon

Tue, 7 Jul 2011

SmartKem Limited tested its advanced semiconductor materials against amorphous silicon at the National Printable Electronics Technology Centre, where it achieved better thin-film transistor (TFT) mobility rating.


AVS-ALD, Day 2: Manufacturability takes center stage

Wed, 6 Jun 2011

At this week's AVS/ALD Conference, Intermolecular's Chi-I Lang reports on Day 2 highlights: faster and more flexible approaches to ALD processing, integration challenges with platinum ALD, a peek behind the curtain of equipment development, and the unique challenge of vendor support for high-volume manufacturing.


Nordson opens China demo center

Thu, 6 Jun 2011

Nordson leaders celebrate the opening of the company's newest facility in China. From left to right: Leyu Louis, Sales & Business Development Manager (Bondtester Division) Nordson DAGE; Greg Wood, Vice President, Nordson Advanced Technology Group, Asia; and Frank Wang, General Manager, Greater China Nordson ASYMTEKNordson Corporation (NASDAQ:NDSN) opened a demo center in Dongguan, China for customers of its Advanced Technology Systems operating segment: Nordson ASYMTEK, Nordson DAGE, and Nordson YESTECH brands.


AVS-ALD, Day 1: Interface engineering, rabbit ears and Roy Gordon

Tue, 6 Jun 2011

Intermolecular's Chi-I Lang reviews highlights from the opening day of this week's AVS/ALD Conference, with key themes in interface engineering, the need for better control, and monitoring interface quality using in-situ STEM.


Heidelburg Instruments options circuit-shrinking lithography tech

Fri, 6 Jun 2011

Heidelberg Instruments optioned University of Colorado Boulder's technique for shrinking copper circuits by zapping a substrate with two separate colors of light beams.


SUSS EUV lithography mask management system debuts with imec install

Wed, 7 Jul 2011

SUSS MicroTec unveiled MaskTrack Pro InSync, a holistic in-fab EUVL mask management product that synchronizes mask cleaning, handling, inspection, and storage.


No clear trend in June fab tool numbers

Wed, 7 Jul 2011

North America-based manufacturers of semiconductor equipment posted $1.55 billion in orders in June 2011 (three-month average basis) and a book-to-bill ratio of 0.94, according to the June Book-to-Bill Report published by SEMI.


IEST cleanroom apparel doc update includes measurement guide

Thu, 12 Dec 2011

The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.


Semiconductor fab equipment spending forecast, 2011 wrap-up

Tue, 12 Dec 2011

SEMI projects that worldwide sales of new semiconductor manufacturing equipment will reach $41.8  billion in 2011, decline in 2012, and rebound again in 2013. Front-end equipment experienced an increase in sales this year, while back-end tools saw a decrease.


EVG doubles process module space in XT Frame platform

Mon, 12 Dec 2011

EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool functionality. The platform will be used for all high-volume manufacturing tool offerings.


Applied Materials' Onyx treatment restores lost carbon, strengthens film structure

Tue, 11 Nov 2011

Applied Materials released a new film treatment, Applied Producer Onyx, that reduces the power consumption in semiconductor chips while increasing mechanical strength. The product targets the challenges associated with 3D packaging applications and technologies.


ICPT 2011: Familiar CMP themes expand to new apps, interactions

Tue, 11 Nov 2011

Paul Feeney, director of process technology at Axus and ITRS co-leader for planarization topics, reports from the International Conference on Planarization/CMP Technology in Korea. Technical themes continue to address main areas (STI, ULK) but also explore new applications (e.g. TSVs), non-uniformity, and interaction between all the CMP process components.


SEMI: Tool demand inches up in April

Mon, 5 May 2011

Demand for semiconductor manufacturing equipment continues to inch up, with demand staying relatively steady as prior sales flush out the supply chain, according to data from SEMI.


Random yield loss during wafer cleaning

Fri, 4 Apr 2011
The Cleaning studies of silicon wafers in DI water in both conventional wet-bath and a single-wafer cleaning tool clearly show that pumping methods have a strong influence on process performance. R. Prasanna Venkatesh, Jung-Soo Lim, Jin-Goo Part, Hanyany University, Ansan, Korea

Day 2, 3 talks on process integration, reliability, 3Di

Wed, 5 May 2011

John Iacoponi, IITC 2011 co-chair, reviews Day 2-3 discussions at IITC/MAM, including interconnect reliability, BEOL memory, 3D integration, process integration, ultralow-k, and future-looking talks on graphene and carbon nanotubes.


Nano and advanced materials R&D at Clarkson U

Mon, 5 May 2011

Clarkson researchers videosPeter Singer recently toured the Center for Advanced Materials Processing (CAMP) at Clarkson University. The following video interviews with researchers and professors cover particle transport, chemical-mechanical planarization (CMP), cleanroom technologies, and bright nano particles, among other topics.


TSVs, beyond-CMOS top IITC-MAM "must see" lists for conference chairs

Wed, 5 May 2011

Cross-sectional TEM images of metal caps on 66nm wide Cu lines for three different processes: a) process A with 5nm-thick and full coverage; b) process B with <3nm-thick and partial coverage; c) process C with 8nm-thick and partial coverage; and d) a dark-field image along with the line direction with the metal cap "A."Three chairs of IITC-MAM, opening next week in Germany, share details on papers attendees won't want to miss. Among the hot-button technologies are through silicon via (TSV) integration, RC performance, carbon interconnects, and pushing traditional technologies farther (think lithography).


AMAT buying VSEA, extends WFE, solar inroads

Mon, 8 Aug 2011

Applied Materials said it will acquire Varian Semi in a $4.9B deal. VSEA stockholders have now approved the buy.


MRS Day 5: Opto, interconnects, organics, Borg?

Tue, 5 May 2011

Michael A. Fury concludes his series of reports from this year's MRS Spring meeting. Highlights from Day 5: lots of papers targeting optoelectronics and interconnects with graphene and nanotubes, lots of work in organic materials and devices, and several pathways for technologies in life science applications.


Chip tool demand up, billings down: March book-to-bill pushes toward parity

Sat, 4 Apr 2011

North America-based manufacturers of semiconductor equipment posted $1.70 billion in orders in March 2011 and a book-to-bill ratio of 0.95, according to the March Book-to-Bill Report published by SEMI.


MRS Day 4: Outside CMOS fabrication, but respecting boundaries

Fri, 4 Apr 2011

Michael A. Fury continues reporting from this year's MRS Spring meeting. Highlights from Day 4: NEMS and MEMS devices, organic electronics, deposition (ALD, CVD, and ED), and measuring stresses in Cu TSV.


SEMI's Stan Myers will retire in 2011

Thu, 4 Apr 2011

President and CEO Stanley T. Myers has informed the SEMI International Board of Directors of his intention to step back from executive leadership of SEMI this year. An executive search team will immediately begin looking for his successor.


Update from Japan: TEPCO's nuclear recovery roadmap, semiconductor materials shortage concerns

Mon, 4 Apr 2011

Longtime semiconductor exec Takeshi Hattori continues his reporting on the aftermath of the massive Japanese earthquake and tsunami: Updates on efforts to control the nuclear crisis, efforts to shift to "summertime" schedules to manage energy usage, and evidence of shortages in key materials for semiconductor manufacturing (H2O2 and silicon).


"Green" ITO replacement suits flex displays, EMI shielding

Fri, 4 Apr 2011

4-point conductivity measurement of the new transparent conducting film developed by Prof. Cor Koning (left) and prof. Paul van der Schoot (right). The black pot contains a dispersion of carbon nanotubes in water, and the white pot contains the conducting latex. Photo: Bart van Overbeeke.Researchers at Eindhoven University of Technology have developed a replacement for indium tin oxide (ITO). This transparent, conducting film is produced in water, and based on electrically conducting carbon nanotubes (CNT) and plastic nanoparticles. The film currently provides a factor 100 lower conductivity than ITO, but this could rapidly change.


Secondary semiconductor equipment market is complex, and growing

Wed, 4 Apr 2011

At 13% of the total equipment spending for semiconductor manufacturing, secondary equipment and services are gaining importance at both 300 and 200mm fabs. SEMI and Semico announce results of their Secondary Semiconductor Equipment Market Study.


Semiconductor capex not slowing down in 2011, say analysts

Mon, 4 Apr 2011

Two analyst reports review just how prosperous 2010 was for most (but not all) semiconductor capital companies, and how 2011 is shaping up to be even better -- even with ramifications from Japan's earthquake/tsunami disaster.


Graphene transistors cool off at the nano level

Tue, 4 Apr 2011

Image: An atomic force microscope tip scans the surface of a graphene-metal contact to measure temperature with spatial resolution of about 10nm and temperature resolution of about 250 mK.  Color represents temperature data. Alex Jerez, Beckman Institute Imaging Technology Group.University of Illinois researchers found that graphene transistors have a nanoscale thermoelectric cooling effect that can be stronger at graphene contacts than resistive heating, lowering the temperature of the transistor.


Imec CNT research: IITC preview

Mon, 4 Apr 2011

after barrier deposition and Cu fillImec researchers will present "Carbon nanotube interconnects: electrical characterization of 150nm CNT contacts with Cu damascene top contact" at IITC 2011. Dr. Marleen van der Veen, senior research scientist at imec discussed the research results and their significance.


Tool demand still high, amid a backend-frontend breakup

Mon, 4 Apr 2011

As SEMI's numbers for semiconductor manufacturing equipment climbed again in March, one slice of the data suggests that the backend-as-leading-cyclical-indicator wisdom we've been taught to follow may not be valid this time around.


Intel honors 28 top suppliers, "achievers"

Wed, 4 Apr 2011

Twenty-eight companies get the nod from Intel's latest supplier awards, including four "Achievement" award winners.


BSE acquires secondary semiconductor equipment assets

Wed, 4 Apr 2011

Boston Semi Equipment acquired the assets of Asia Tech Corporation, launching BSE Tech LLC. BSE Tech will deliver pre-owned front end semiconductor manufacturing equipment and spare parts, technical capabilities and financial solutions from a larger facility, with added cleanroom space.


Potential $45B power device market looks to new substrates, packaging, process flows

Tue, 5 May 2011

SEMICON West preview: Alternative energy applications are poised to help drive the power semiconductor market over the next few years, and devicemakers are taking a close look at key issues to meet those market needs.


SMC 2011: Trends in materials, markets, and the supply chain

Mon, 1 Jan 2011

Michael A. Fury reports from Day 2 of SEMI's Strategic Materials Conference (SMC), where discussions focused on material and technology trends, application in nontraditional areas including medical electronics and LEDs, and discussion of materials-specific supply-chain challenges.


Flat 2011 wafer fab equipment capex, but look to 193i stepper to step out

Wed, 1 Jan 2011

Semiconductor capital equipment, 4Q10: strength through 2013, then retrenchment. Source: Gartner.Wafer fab capex in 2011 is expected to stick around 2010 levels. But don't despair of growth, says Dean Freeman of Gartner. For one thing, cutting-edge wafer fab equipment will be hot. On top of that, 2011 will be a brief respite, with a strong 2012/2013 waiting in the wings.


Enabling lithography for the 22nm node

Tue, 1 Jan 2011

Single-exposure patterning schemes are unable to meet 22nm specifications, which leads fabs to use double-patterning like LELE. However, below 22nm, a simple multiplication of double-patterning is exceedingly difficult. Alternative processes like tone reversal, EUV, and resist freezing are under development, says Nick Pugliano, Dow Electronic Materials. This is an online exclusive essay in SST's Forecast for 2011: Back to Reality series.


SmartKem wins Welsh grant for flexible semiconductor materials

Wed, 1 Jan 2011

SmartKem Ltd, developer of novel printable semiconductor materials for flexible electronics, announced that the Welsh Assembly Government has awarded the company £335,000 in funding to further develop its flexible printed electronics solutions.


SEMI: Chip demand slips heading out of 2010

Mon, 1 Jan 2011

Appropriate for this blustery ski season, the clear view of semiconductor equipment demand appears to be heading down a slope, according to data from semiconductor manufacturing equipment makers.


Steed-buys-ATSI-adds-gas-abatement-to-semiconductor-LED-solar-fab-equipment

Wed, 1 Jan 2011

Steed Technology, thermal processing equipment provider for semiconductor, LED, and solar cell manufacturers, acquired all of the outstanding stock of Applied Technology Specialists, Inc. (ATSI), an advanced engineering firm that specializes in developing advanced pollution control equipment and technology. The merger will enable equipment integration and additional "green" consulting expertise at Steed.


DNA origami fuses lithography with self-assembly

Thu, 2 Feb 2011

Arizona State University's Hongbin Yu and Hao Yan are exploring how to use top-down lithography combined with modified bottom-up self-assembling nanostructures to guide the placement of nanostructures on silicon wafers.


Dow-Corning-joins-imec-GaN-Affiliation-Program

Thu, 1 Jan 2011

GaN-on-Si wafer processed at imec with Au-free MOSHEMT flowThe imec multi-partner industrial R&D program on GaN semiconductor materials and device technologies focuses next-generation GaN power device and LED development. The collaboration between Dow Corning and imec will concentrate on bringing the GaN epi-technology on silicon wafers to a manufacturing scale.


22nm Challenges Abound for 2011

Sat, 1 Jan 2011
Pete Singer Editor-in-Chief

FEI-CEA-Leti-address-22nm-IC-materials-in-new-JV

Thu, 2 Feb 2011

FEI (Nasdaq:FEIC) and CEA-Leti entered into a three year agreement to characterize advanced semiconductor materials for the 22nm technology node and beyond. The companies will measure strain changes in semiconductor structures.


Sapphire wafer carriers debut from Meller Optics

Thu, 2 Feb 2011

Meller Optics sapphire wafer carriers.Custom fabricated sapphire wafer carriers that are uniform, parallel, and impervious to solvents and etchants for thinning semiconductor materials are available from Meller Optics Inc.


Chip tool demand slowing again, says SEMI

Wed, 2 Feb 2011

More evidence for a slowing market: SEMI's January data is back on a downward trend for demand in semiconductor equipment, though the group is "encouraged" by recent capex announcements.


3D-CT-X-ray-imaging-fills-inspection-gaps-says-Xradia

Tue, 3 Mar 2011

Xradia microscope.Xradia has unveiled its latest micro computed tomography (CT) 3D X-ray imaging system, the VersaXRM. Kevin Fahey, PhD, VP of marketing at Xradia, discusses how the new platform uses geometrical magnification in tandem with an X-ray microscope.


SEMI: Chip materials topped records in 2010

Tue, 3 Mar 2011

Sales of semiconductor materials rose 25% in 2010 to a new record $43.55B thanks to surging device shipments, according to final tallies from SEMI.


Nanotechnology-for-semiconductors

Thu, 3 Mar 2011

While semiconductor fab has always created nanoscale dimensions, a new class of nanomaterials -- graphene, carbon nanotubes (CNTs), nano-metal alloys, quantum dots -- behave radically differently than current materials. Nanotechnology promises higher-performance memory capacity and transistors in future semiconductors, says Giles Humpston, Tessera.


Japan March 11 earthquake: Semiconductor production update

Wed, 3 Mar 2011

There are over 100 production semiconductor fab lines in 53 locations in Japan, say analyst groups IHS iSuppli and Semico. Over a week after the crippling earthquake and tsunami hit northeastern Japan, analysts consider the next business step, with power outages and aftershocks still disrupting production in areas not directly hit by the crisis.


SOI Consortium unveils FDSOI results

Mon, 2 Feb 2011

FDSOI, Horacio MendezHoracio Mendez, executive director of the SOI Industry Consortium, discusses how planar FD-SOI technology enables substantial improvements in performance and power consumption. The SOI Industry Consortium recently announced results of an assessment and characterization of FDSOI, based on the ARM Cortex processor as a prototyping vehicle.


CyberOptics updates WaferSense airborne particle sensor

Wed, 2 Feb 2011

CyberOptics Semiconductor WaferSense APSAfter beta testing and product analysis, CyberOptics Semiconductor has released the WaferSense Airborne Particle Sensor for wafer processing equipment. The sensor identifies particle sources in tools, moving through semiconductor process equipment and automation material handing systems to monitor airborne particles. It reports information in real-time on wafer contamination.


SEMI: Chip tool demand inches back up

Mon, 3 Mar 2011

Among the snapshot trends taken from SEMI's February semiconductor equipment demand numbers: tool sales are on a three-month roll, but orders coming in appear to be plateauing.


Former-AMAT-director-tasked-with-expanding-NexPlanar-CMP-pad-products

Fri, 3 Mar 2011

NexPlanar tasked its recently hired CTO, Dr. Rajeev Bajaj, with expanding on the core capabilities of their chemical mechanical planarization (CMP) product platform to add new materials and microstructures, enabling customers to implement advanced processes.


Ceradyne-acquires-interest-in-Japan-based-Yamanaka

Fri, 3 Mar 2011

Ceramic materials provider Ceradyne took a minority interest in Yamanaka, which supplies advanced materials for solar, semiconductor, optical fiber, and other industrial and energy sectors.


SPIE 2011: An ASML review of EUV

Tue, 3 Mar 2011

Ron Kool from ASML reports on updates in EUV and other next-generation lithography technologies at this year's SPIE Advanced Lithography symposium.


Applied Materials' 2011 supplier awards

Tue, 11 Nov 2011

Applied Materials Inc. (Nasdaq:AMAT) presented five companies with awards for helping Applied meet its strategic business goals in 2011.


Leading-edge semiconductor materials research at TECHCON 2011

Fri, 9 Sep 2011

In video blogs from this week's TECHCON 2011, students share their current research projects from lead-free solder to graphene for new transistors, and members of industry giants like IBM share how SRC-supported research benefits the industry.


Negative 2011 semiconductor industry growth is possible, warns Gartner

Thu, 9 Sep 2011

Jim Walker, VP, Research of Semiconductor Manufacturing and Emerging Technologies, at Gartner, speaks with Solid State Technology about revising Gartner

Camtek wins patent appeal against Rudolph

Tue, 8 Aug 2011

The U.S. Court of Appeals for the Federal Circuit issued an opinion yesterday vacating the adverse judgment against Camtek in a patent infringement case brought against it by August Technology Corp., now Rudolph Technologies Inc.


SIS lithography eliminates hard mask for deep patterns at Argonne Labs

Fri, 8 Aug 2011

Argonne Lab researchers have created an e-beam lithography process that boosts resist layers to eliminate the hard mask application. It results in more precise features and deeper etch for semiconductor, solar energy, and other products.


Semiconductor fab tools take an orders hit in July

Fri, 8 Aug 2011

North America-based manufacturers of semiconductor equipment posted $1.30 billion in orders in July 2011 and a book-to-bill ratio of 0.86, according to SEMI. The book-to-bill for the Japanese chipmaking equipment sector dropped to 0.84 in July, the Semiconductor Equipment Association of Japan reported.


Analyst: $10B more semi capex thanks to tablets, smartphones

Fri, 8 Aug 2011

How will heavy demand for tablets and smartphones translate into chipmaking capacity investments over the next few years? Citi's Tim Arcuri runs some numbers to come up with the answer: $10B annually.


Gartner: 2011 capex softer, 2012 messy

Fri, 9 Sep 2011

Semiconductor equipment spending in 2011 looks to be slightly weaker than anticipated, and is looking a lot softer in 2012 across the board, according to Gartner's new semiconductor capex forecasts.


Is PC softness dragging down Intel's 22nm plans?

Wed, 8 Aug 2011

With PC demand waning, reports indicate Intel is rethinking part of its 22nm investment plans, which would dent industrywide capex forecasts for 2012.


SEMI hands the reins to Denny McGuirk

Mon, 8 Aug 2011

SEMI appointed Dennis P. McGuirk as president and CEO. He replaces Stanley T. Myers, who is retiring. McGuirk comes to SEMI from IPC -- Association Connecting Electronics Industries, where he led a globalization effort.


Nonvisual semiconductor defect metrology today, at 22nm, and below

Tue, 8 Aug 2011

Syn: Robert Newcomb from Qcept Technologies discusses non-visual defects in today's wafer fab processes, at 22nm, and in the advanced nodes below 22nm. As nodes shrink, more defects will escape optical metrology, he predicts.


Asian foundry selects Mattson RTP tool

Wed, 10 Oct 2011

Mattson Technology Inc. (NASDAQ: MTSN) won acceptance for its Helios XP rapid thermal processing (RTP) system for process of record from a major Asian foundry.


SEMI honors industry leaders at SEMICON Europa

Thu, 10 Oct 2011

SEMI honored Dr. Tibor Pavelka (Semilab) with the European SEMI Award; Heinz Kundert (SEMI Europe) with the IC Industry Award for Excellence; and Christian Prischmann (UIbrich) with the SEMI Europe Standards Leadership Award.


ATMI pays $95M to bring SDS gas system manufacturing and sales in-house

Tue, 11 Nov 2011

ATMI has taken control of, and responsibility for, worldwide distribution of its proprietary Safe Delivery Source (SDS), gas storage and delivery system and related technologies from Matheson Tri-Gas.


SEMI: Tool sales step back in April (not March!)

Wed, 5 May 2008
May 21, 2008 - SEMI touched up its March figures for chip equipment demand, resulting in a little better picture for that month -- but the view on April figures is weak.

SEMI: Wafer shipments flat in 1Q08

Wed, 5 May 2008
May 7, 2008 - Worldwide silicon wafer area shipments were roughly the same in 1Q as they were in 4Q, reflecting the industry's overall conservative environment, according to data from SEMI.

Analyst: Automation tools to slump 34% in 2008

Mon, 6 Jun 2008
June 9, 2008 - Semiconductor equipment sales in general are expected to slump in 2008, and the automation segment is no exception, though there is some motion in the sector among suppliers, according to a brief analysis by The Information Network.

Startups hit the fast track at UK event

Fri, 5 May 2008
by Fran

Redefining fab productivity from a waste perspective

Tue, 5 May 2008
by Pete Singer, Editor-in-Chief, Solid State Technology
May 20, 2008 - Taking a page out of the Toyota playbook, AMAT CTO/CMO Iddo Hadar challenged the audience at his Confab presentation to focus not on improving productivity but eliminating waste, including what he called "redistributed" waste across many semiconductor processes.

Fab facility design: When a slowdown is good

Tue, 5 May 2008
by Debra Vogler, senior technical editor, Solid State Technology
May 20, 2008 - Among the fab design trends noted by ConFab presenter Rick Whitney, COO of US operations at M+W Zander: The rapid rise in the cost of advanced processing equipment has outpaced the cost of building fabs in the last few years, though increasing facility costs are now in line with the consumer price index. And advances in cleanliness and footprints are allowing fab design rules to be a bit less stringent.

UCSD: Nanowires can boost solar cell efficiency

Fri, 5 May 2008
May 23, 2008 - Researchers at the U. of California/San Diego say they have created solar cells "spiked" with nanowires in a proof-of-concept experiment that could show the way to improved efficiency in thin-flim solar cells.

CNT-asbestos links point to need for more research, say experts

Thu, 5 May 2008
by James Montgomery, News Editor, Solid State Technology
May 22, 2008 - A new report published in the journal Nature Nanotechnologies is raising alarms about apparent health risks associated with carbon nanotubes (CNT), similar to those seen with asbestos. But efforts are already underway to look more closely at potential issues, according to Walt Trybula, former SEMATECH immersion lithography guru and now at Texas State U., in an email exchange with WaferNEWS.

Princeton tips way to "melt" chip features

Mon, 5 May 2008
May 5, 2008 - A new technique to literally melt away defects in etching microchip structures, and significantly reduce line-edge roughness (LER), has been revealed by scientists at Princeton U.

SEMI: Taiwan, Korea drove 2007 chip equipment sales

Tue, 3 Mar 2008
Mar. 25, 2008 - Worldwide sales of semiconductor manufacturing equipment increased about 5.7% in 2007, almost entirely due to a spending splurge by Taiwan firms and to a lesser extent Korea, and underpinned by extensive memory investments and the continued ramp of 300mm wafer manufacturing, according to the latest data from SEMI.

Dye-sensitized cells: A different kind of solar

Tue, 2 Feb 2008
by Katherine Derbyshire, Contributing Editor, Solid State Technology
The vast majority of solar cells depend on p-n junctions in inorganic semiconductors, but their limitations have inspired investigation of a variety of alternate means for harnessing the sun's energy. One of the most successful alternative designs is dye-sensitized solar cells

Rohm & Haas, IBM eye Cu CMP for 32nm-22nm

Wed, 2 Feb 2008
Feb. 27, 2008 - Rohm & Haas Electronic Materials/CMP Technologies and IBM are adding to their collaborative plate, with a pact to develop CMP processes for integrating copper and low-k dielectrics, in order to create copper CMP consumables for 32nm and 22nm device manufacturing.

SPIE NEWS: Rohm&Haas, IBM to make 32nm implant materials

Tue, 2 Feb 2008
Feb. 26, 2008 - Rohm and Haas Electronic Materials and IBM have agreed to jointly develop patterning materials and processes to enable implant at and below the 32nm node.

NEC fabricates CNT transistors using coating process

Fri, 2 Feb 2008
Feb. 15, 2008 - NEC says it has developed a carbon nanotube (CNT) transistor using a new channel-coating process, achieving "extremely high mobility" despite performance variation. Results of the research are being presented at this week's nano tech 2008 International Nanotechnology Exhibition & Conference in Tokyo.

Backend resist clean firm seeks China patent

Fri, 2 Feb 2008
Feb. 8, 2008 - Legacy Holding, a provider of wafer cleaning/strip technologies, says it has submitted a patent application for its proprietary "Organostrip" photoresist removal technology used in backend semiconductor manufacturing processes, saying that opportunities in China's IC industry make it a sweet spot for business.

SST On the Scene: Lars Liebmann on DFM, scaling

Fri, 2 Feb 2008
Feb, 29, 2008 - In this exclusive video interview, IBM's Lars Liebmann talks about his papers presented at this week's SPIE, including persistent misconceptions about restricted design rules, and the need for designers to react to systematic and stable effects with broad, coarse layout adjustments vs. minor movements based on a specific moment. He also discusses the opportunities at 22nm with "soft" and "hard" DFM, and how these concepts will be required to keep the scaling path profitable.

Elpida, UMC pair up for foundry services

Tue, 3 Mar 2008
Mar. 18, 2008 - Elpida Memory and Taiwan's United Microelectronics Corp. (UMC) are expanding their partnership to target Japanese foundry customers, combining Elpida's 300mm fab capacity with UMC's IP and logic technologies. The deal gives UMC inroads into Japanese foundry customers, while Elpida gets to utilize excess DRAM production capacity.

Who's behind AMAT's $1.9B mystery solar sale?

Tue, 3 Mar 2008
Mar. 4, 2008 - In a regulatory filing, Applied Materials says it has signed a $1.9B contract to supply thin-film photovoltaic equipment and services to an unnamed privately held foreign customer. Few details are available, but here's some thoughts about the deal's significance, and who the mystery customer might be.

Cost, performance challenge both established and advanced lithography

Wed, 3 Mar 2008
by Katherine Derbyshire, Contributing Editor, Solid State Technology
Conferences like the recent SPIE focus on the leading edge (e.g., EUV, double patterning, immersion lithography), yet process technologies remain commercially important long after the leading edge has moved on. Case in point: KrF-based litho, currently used in >30% of 65nm DRAMs and poised to increase substantially. Here's what resist suppliers like Fujifilm Electronic Materials are doing to support this trend.

Report: Indium-tin-oxide replacements eye application entry points

Tue, 3 Mar 2008
Mar. 18, 2008 - The market for transparent semiconductors used in display, photovoltaics, and lighting markets will surge to ~$9.4B by 2015, according to a study from analysis firm NanoMarkets. And a key element in the devices, indium tin oxide (ITO), will continue to be in heavy demand despite surging prices and other limitations.

Fujitsu touts lower-temp CNT-graphene composite

Tue, 3 Mar 2008
Mar. 4, 2008 - Fujitsu Labs says it has successfully created a nanoscale carbon composite with a self-organizing structure by combining carbon nanotubes and graphene, combining CNTs' high thermal conductivity and high-current density tolerance with graphene's high electron mobility. The composite is synthesized at 510°C, cooler than temperatures for conventional graphene that are too high for electronic device applications.

Double development offers simpler double patterning

Mon, 3 Mar 2008
by Katherine Derbyshire, Contributing Editor, Solid State Technology
Traditionally, achieving high resolution with negative imaging has been difficult. Research presented by Fujifilm Electronic Materials at this year's SPIE Advanced Lithography conference showed how to tune the resist imaging threshold to clear "dark" and "bright" regions, and ultimately double the pitch frequency and thus the density of lines and spaces.

SEAJ: Chip tool demand slips in January

Wed, 2 Feb 2008
Feb. 20, 2008 - New data from SEMI and the Semiconductor Equipment Association of Japan (SEAJ) fuels continued concerns of a soft investment climate among global chipmakers.

IITC shows the way to 3D

Tue, 6 Jun 2008
by Ed Korczynski, senior technical editor, Solid State Technology
The 11th International Interconnect Technology Conference (IITC) is now underway in Burlingame, CA, presenting the leading-edge of on-chip interconnect technology developments with details on new materials, processes, and structures. 3D interconnects and through-silicon vias are being discussed in serious detail, while work continues on air-gap dielectrics and carbon nanotubes along with new copper barrier materials.

Gartner trims capex outlook again; 2009 now in doubt

Wed, 10 Oct 2008
Semiconductor capital equipment spending had been expected to be lousy through 2008, but the upswing would start sometime in 2009. No longer -- Gartner now expects capex to slide even further this year and will drop another 13% in 2009, thanks to a full-on collapse in memory investments and economic pressures on consumer spending habits.

Secondary equipment gets a new lease with SEMI, SEC/N pairing

Wed, 10 Oct 2008
SEMI's Rich Salsman talks with SST about the just-announced acquisition of nonprofit trade association Surplus Equipment Consortium Network (SEC/N), and their common goasl to address needs in the secondary semiconductor equipment markets, such as new standards for liability and support.

From bad to worse: Crunching SEMI's latest B:B numbers

Wed, 8 Aug 2008
Chipmakers' pullback in capital investments that has dented tool orders for the better part of a year has finally caught up to the sales side of the equation. The latest updated monthly data from SEMI shows declines in both bookings and billings that haven't been seen since the last cyclical slump in 2003 -- and even the industry's 2001 dark age.

Chip EDA down 9% in 1Q08

Thu, 7 Jul 2008
July 3, 2008 - The overall market for electronic design automation (EDA) declined 1.2% in 1Q08 to about $1.35B from a year ago but was up 5.9% sequentially, and the IC physical design/verification sector showed mix results, according to data from the EDA Consortium.

Behind closed doors: Updating ISMI's 450mm, NGF progress

Thu, 7 Jul 2008
ISMI provided SST with tidbits from its closed-door meeting on Wednesday where discussions continued between its members and equipment suppliers about key programs and topics including the next-generation fab (NGF) targeting 300mm improvements and the 450mm transition, including updates on the interoperability test bed for 450mm wafer automation and handling.

SEMI: Wafer shipments back on track in 2Q08

Mon, 8 Aug 2008
Worldwide silicon wafer demand area shipments had been sluggish in previous quarters, but picked back up in 2Q08 to typical seasonal levels, according to data from SEMI's Silicon Manufacturers Group (SMG).

Dow Corning compound eyes Intel's multi-chip apps

Thu, 8 Aug 2008
SST's Debra Vogler gets some inside technical details about Dow Corning's new thermally conductive compound, and why it's being pitched for multi-chip packaging applications.

Report: Ferrotec seeking solar cell inroads to break "chip rut"

Sat, 6 Jun 2008
June 20, 2008 - Chip equipment firm Ferrotec is one of many companies seeking to diversify into new growth opportunities, and its move into solar cells seems to have met with applause from investors and market players, notes the Nikkei daily.

SEMI: Monthly tool demand slips to three-year lows

Fri, 6 Jun 2008
June 20, 2008 - Offering more evidence for chipmakers' belt-tightening this year, semiconductor equipment demand has slumped to three-year lows, to levels not seen since mid-2005, according to the latest monthly data from SEMI.

SEMI: 1Q08 demand soft, but some regions doing ok

Tue, 6 Jun 2008
June 17, 2008 - Worldwide demand for semiconductor manufacturing was notably soft in 1Q08, with bookings down >20% from a year ago, but some regions are clearly working through the downturn better than others, according to the latest data from SEMI.

Report: Japan chip tool firms' foreign ownership on the rise

Tue, 6 Jun 2008
June 16, 2008 - Foreign ownership of Japanese frontend process semiconductor equipment firms rose in the fiscal year ended in March, while the opposite was true for domestic firms serving the backend of the manufacturing line, noted the Nikkei daily.

FEI tips extreme SEM, transition help to STEM

Tue, 7 Jul 2008
FEI Co. is debuting a new line of SEM tools designed to give researchers a sharper picture of sub-nanometer surface detail than with a SEM. It also is rebundling its technologies to smooth a SEM-to-STEM transition .

What materials firms can learn from Yogi Berra

Wed, 7 Jul 2008
Where to turn for inspiration in a tough year 2008 for semiconductor suppliers? Try Yankee baseball great Yogi Berra and famously underappreciated comic Rodney Dangerfield, according to analyst John Housley of Techcet, in a Wednesday talk about materials forecasts at SEMICON West.

SEMI: March tool demand takes a step back

Fri, 4 Apr 2008
Apr. 18, 2008 - Even the quarterly-ending month couldn't muster enough strength to give the industry a positive boost, as demand continues to show softness in the semiconductor equipment sector, according to the latest data from SEMI.

Japan news: TEL, Elpida anticipate losses

Fri, 4 Apr 2008
Apr. 11, 2008 - Elpida memory expects a ¥20B (US $197.7M) group operating loss for the just-ended fiscal year, the company's first such loss since its market listing in late 2004. Meanwhile, TEL chip equipment orders during fiscal 4Q08 were at their lowest level in nearly three years.

SEMI: North American chip tool firms get Xmas present

Fri, 1 Jan 2008
Jan. 18, 2007 - December results for semiconductor equipment demand show a nice close to what was otherwise a lousy 2007 -- actual positive growth in tool orders, according to the latest data from SEMI.

AMAT laying off 7% of workers -- who saw it coming?

Tue, 1 Jan 2008
Jan. 15, 2008 - Applied Materials says it is reducing its global workforce by about 7% (1000 workers) through a combination of job elimination and attrition, primarily affecting its semiconductor equipment and services/support businesses.

Cutting back: Nanometrics laying off 7%

Thu, 1 Jan 2008
Jan. 10, 2008 - Coming off a year in which it significantly changed its focus and carved out multiple businesses, Nanometrics is starting the new year where it left off.

SEMI B:B inches up, but demand still soft

Wed, 1 Jan 2008
Jan. 2, 2008 - Global demand for semiconductor equipment made by North American-based manufacturers didn't improve much in November, according to recent data from SEMI.

SEMI targets IP protection to insure industry innovation, survival

Wed, 4 Apr 2008
by Debra Vogler, Senior Technical Editor, Solid State Technology
April 23, 2008 - SEMI is set to release results of a yearlong study detailing real-world challenges that its member companies have experienced protecting their IP. WaferNEWS talks with SEMI's Vicki Hadfield to sift through the report's findings -- including why customers (i.e., chipmakers) and the North America region are high on the list for IP concerns.

Latest 32nm CMOS, memory beyond flash, plus novel devices detailed at 2008 IEDM

Tue, 12 Dec 2008
New memory concepts and the latest 32nm CMOS with metal gates and high-k dielectrics were highlights of the 2008 International Electron Devices Meeting (IEDM) in San Francisco, Dec. 15-17. A wide range of innovative device technology, including 3D wafer-level integration and a nanowire battery were also presented.

IEDM Day 1: Dense data on 22nm

Mon, 12 Dec 2008
In an exclusive daily blog for SST, Chipworks' Dick James soaks in the first day of IEDM with dense presentations of 22nm CMOS presentations.

IEDM: SEMATECH optimizing advanced gate stack for 22nm low-power apps

Mon, 12 Dec 2008
Results of a study slated to be discussed by SEMATECH researchers at this week's IEDM highlight the importance of the process sequence on performance, variability, scaling, interface quality, and reliability for LaOx capped HfSiON/metal gate structures.

IMEC, U.Albany combining EUV efforts

Mon, 1 Jan 2008
Jan. 21, 2008 - The two leading R&D centers for EUV lithography, IMEC in Europe and the U. of Albany's College of Nanoscale Science and Engineering (CSNE), say they will jointly perform experiments for EUV in order to "demonstrate the practical feasibility of EUVL and build confidence in the technology for the 32nm half-pitch device node and below."

Fujifilm materials biz buys ArF immersion tool to monitor photoresists

Mon, 1 Jan 2008
Jan. 21, 2008 - Fujifilm says its electronics materials subsidiary has purchased an advanced argon fluoride (ArF) immersion scanner to help accelerate the push to bring its new family of ArF immersion photoresists to high-volume manufacturing.

SEMI: Wafer shipments step back in 3Q

Fri, 11 Nov 2008
Worldwide silicon wafer shipments slowed nearly 3% in 3Q08, their biggest quarterly dip in nearly six years, following what had been a nice recovery in the second quarter, before the macroeconomic climate soured, according to new data from SEMI's Silicon Manufacturers Group (SMG).

Process tool metrics, access to parameters key elements for NGF

Thu, 11 Nov 2008
Next-Generation Factory (NGF) concepts under the International SEMATECH Manufacturing Initiative (ISMI) call for new standards and more accessible tool operating data so that chipmakers and tool suppliers can collaborate on improving tool utilization and productivity. Many presentations at the recent ISMI Symposium on Manufacturing Effectiveness probed different aspects of this emerging collaboration.

Updated: AMAT plans 12% layoffs as industry environment sours

Thu, 11 Nov 2008
Despite beating analysts' expectations for its fiscal year-end quarter, semiconductor equipment bellwether Applied Materials says it will cut costs with 1800 layoffs (12% of its workforce) in the coming fiscal year. Added: Comments from top exec Mike Splinter about consolidation and solar biz, and takeaways from two industry analysts who called during the teleconference Q&A.

Oxford Instruments buys TDI, expands HB-LED biz

Fri, 4 Apr 2008
Apr. 11, 2008 - UK-based Oxford Instruments says it has acquired Silver Spring, MD-based Technologies and Devices International, a developer of hydride vapor phase epitaxy (HVPE) technology and processes, in a bid to expand its offerings for makers of high-brightness LEDs.

Response surface methods for peak process performance

Thu, 11 Nov 2008
Response surface methods (RSM) provide statistically validated predictive models that can be manipulated for finding optimal process configurations that exhibit minimal variability. This article introduces two RSM enhancements that focus on achieving robust operating conditions.

Germany takes a bow as PV market leader

Fri, 9 Sep 2008
At DisplayBank's 3rd annual San Jose Conference, Invest in Germany director Claus Habermeier showed why Germany's PV market is so formidable, thanks to proactive legislation. And Signet Solar's Keshav Prasad told SST how the company intends to improve on Applied Material's base technology.

Ray of hope in SEMI's ugly B:B numbers?

Thu, 9 Sep 2008
The semiconductor equipment sector has been sputtering along at three- and five-year lows in terms of demand. And in case you've missed it, SEMI has new data to remind us.

Sunovia, EPIR tout IR tech for multijunction solar cells

Wed, 4 Apr 2008
Apr. 9, 2008 - Sunovia Energy Technologies and EPIR Technologies say their R&D efforts have achieved "breakthroughs" in infrared sensors that will enable multijunction solar cells with high efficiencies and lower costs, through using less expensive IR system materials and manufacturing processes.

Qcept, CEA-Leti to explore leading-edge characterization, yield

Wed, 5 May 2008
May 28, 2008 - Qcept Technologies and European R&D organization CEA-Leti have inked a deal to investigate techniques for characterizing leading-edge semiconductor materials and processes, including high-/low-k dielectrics, atomic layer deposition (ALD), fully silicided (FUSI) metal gates, and advanced cleaning technologies.

Mentor Graphics + Ponte: "End of the DFM dream"

Thu, 5 May 2008
by James Montgomery, News Editor, Solid State Technology
May 15, 2008 - The acquisition of Ponte Solutions by Mentor Graphics not only takes one of the last pure DFM companies off the table, it also answers the question about what side of the chipmaking wall DFM belongs, and terminates an inflection point that might not be seen again for a decade or more.

Global Solar scaling CIGS heights

Fri, 7 Jul 2008
Unlike its flashier competitors, Global Solar has quietly achieved fully commercialized solar products involving depositing CIGS films and solar cells for modules designed for crystalline silicon. Tim Teich, VP for sales and marketing, tells SST more about the company and its seemingly low profile in Tuscon, AZ, and where he sees the most promising growth ahead.

siXis partners with SVTC to commercialize silicon circuit boards

Mon, 8 Aug 2009
August 24, 2009 -- SVTC was chosen by technology startup siXis, Inc. to supply silicon manufacturing services for their compact, high-speed embedded computing modules that bridge the gap between programmable devices and costly, customized semiconductors.

B:B parity achieved...are we recovered yet?

Thu, 8 Aug 2009
The good news: semiconductor equipment sales, and especially orders, soared in July to re-achieve parity for the first time in two and a half years. The bad news: the balanced levels are still a third of what they were then.

IBM: DNA "scaffolding" builds tiny circuit boards

Mon, 8 Aug 2009
Researchers at IBM and the California Institute of Technology say they have come up with a solution to problems looming for future semiconductor manufacturing beyond the 22nm node: a combination of lithographic patterning and self-assembly that arranges DNA structures on surfaces compatible with current manufacturing equipment.

ECS Days 4-5: Emerging dielectrics, SOI, graphene, batteries

Mon, 6 Jun 2009
Day 4 of the ECS Spring 2009 Meeting saw the continuation of symposia on flexible electronics, emerging dielectrics, SOI, and graphene, reports Techcet's Michael A. Fury in his exclusive daily blog for SST. And discussions of battery/energy and SOI device technology indicated the global breadth of research interest and funding in these fields.

SRC, IMEC pair for "green" chipmaking

Wed, 2 Feb 2009
University research consortium Semiconductor Research Corp. has brought onboard European nanoelectronics R&D consortium IMEC to join work in creating "environmentally friendly" processes and materials for advanced semiconductor manufacturing.

News from Japan: Mirai out-sims Monte Carlo

Wed, 2 Feb 2009
Scanning headlines from Japan this week: the Mirai project's blazing SRAM simulations, Toshiba and Fujitsu's HDD handoff, Renesas' rebellious union, and what might be the next fullerene.

EDA emerging from worst year in recent history

Tue, 2 Feb 2009
After its worst year in recent memory (due largely to one company's missteps), the EDA industry isn't yet on the cusp of an upturn. Laurie Balch from Gary Smith EDA explains what to expect in 2009-2011, and what areas of the industry will lead the return to growth.

IBM's Farrell: Computational litho, scaling to 16nm

Wed, 2 Feb 2009
Tim Farrell, distinguished engineer at IBM's semiconductor R&D center, provides an update on efforts to implement comprehensive computational scaling computational scaling to 22nm, and discusses the possibilities at 16nm.

SEMI maps PV standards effort

Thu, 2 Feb 2009
SEMI has released a "guidance document" for a photovoltaic standards roadmap that lists dozens of standards and guidelines it says are applicable to PV manufacturing to save costs and spark innovation.

First 4Q results point to length, not depth, of downturn

Tue, 2 Feb 2009
Initial industry financial results from the December quarter are ugly as expected, but what's got analysts more concerned isn't the depth of the downturn, but how long it'll last -- 2H09 should be better, but real recovery might take much longer.

Collaboration, manufacturing innovation vital for next-generation foundries

Fri, 6 Jun 2009
Samsung engineers discuss advancements in manufacturing using the company's S1 fab, a state-of-the-art 300mm foundry line, as an example in the areas of patterning and closed loop variation control systems.

Changes at Applied Materials: New SSG head, SunFab moves to EES

Mon, 9 Sep 2009

Shifts among executive and organizational ranks at Applied Materials suggest new streamlining efforts, but also leave unanswered questions as to why. Here's the skinny on the two major moves out of the lot.


Tool demand improving slowly, surely?

Mon, 9 Sep 2009

The latest numbers on North American and Japanese semiconductor equipment demand suggest continued growth and recovery, though analysts see a long climb back to normalcy.


EHS considerations in PV manufacturing equipment installations

Wed, 6 Jun 2009
A business risk management approach to PV equipment installation that incorporates environmental, health, and safety (EHS) considerations from the planning process through start-up can help reduce costs, minimize liability, and minimize timeframes.

SEMI: More optimism fodder in May tool demand

Mon, 6 Jun 2009
The semiconductor equipment industry still looks awful, but yet another sign of a possible bottom and rebound: May bookings saw the second-biggest M/M spike in the past five and a half years, according to data from SEMI.

ECS Day 2: "Tantalizing" ZnO; cost-effective microfluidics; "Fox News flu"

Thu, 5 May 2009
Techcet's Michael A. Fury reports exclusively for SST from this week's spring meeting of the Electrochemical Society. On tap for Day 2: "Tantalizing" advancements in ZnO as a future semiconductor material, cost-effective 2D microfluidics, triple-junction solar cells, a supersensitive toxin-detecting HEMT device, and feeling the effects of "Fox News flu."

IMEC's "noble" efforts to integrate nanophotonics with hi-speed CMOS

Wed, 5 May 2009
IMEC researcher Pol Van Dorpe gives SST a look at the physics and structure behind a new method to integrate high-speed CMOS electronics and nanophotonic circuitry based on plasmonic effects, which has promise in applications from biosensing to thin-film solar cells.

Intel gives nod to 40 top suppliers

Wed, 3 Mar 2009
Intel has handed out its annual Preferred Quality Supplier (PQS) and Supplier Continuous Quality Improvement (SCQI) awards to more than three dozen of its key suppliers from its roster of thousands of supply-chain partners, ranging from capital equipment manufacturers to materials, components, and service providers.

Status report: 1X mask infrastructure

Sun, 3 Mar 2009
Mark Melliar-Smith, CEO of Molecular Imprints, discusses the company's work to develop a 1X mask infrastructure.

A universal platform for 450mm manufacturing

Mon, 12 Dec 2009

A flexible, forward-thinking platform will be vital to meet cost and productivity challenges of 450mm and beyond. John Klawender and Terry Bluck from Intevac describe the concept and capabilities of a universal platform, with test and system modeling results.


Turnkey manufacturing finally adjusting to solar industry needs

Wed, 3 Mar 2009
Eager equipment suppliers have found it difficult to shift the photovoltaics manufacturing paradigm from machine-by-machine crystalline silicon to lower-cost thin-film turnkey lines. Their philosophy hasn't failed, but lessons are being learned about adapting to PV manufacturing's driving forces of cost, price, efficiency, and customization.

SEMI: PV pushed Si shipments in 4Q

Wed, 3 Mar 2009
Global shipments of polysilicon surged 41% from the start of 2008 to year's end, thanks to new capacity coming online -- and even the late-year meltdown across the semiconductor industry and beyond didn't curtail growth, according to data from SEMI.

Chip tool demand slows, but still rebounding

Mon, 12 Dec 2009

Semiconductor manufacturing equipment demand slowed a bit in November but still kept up a pace of growth, lending more weight to the outlook for improved fab spending heading into 2010, according to the latest data from SEMI and SEAJ.


Gartner: Chip capex recovery marches on

Mon, 12 Dec 2009

The latest semiconductor capital spending forecast from Gartner solidifies the 2009 outlook with another positive bump-up, and the firm sees the climate significantly improving for almost all sectors well into the future. Gartner research VP Dean Freeman helps SST break down some of the numbers.


10 firms named top TSMC suppliers

Mon, 12 Dec 2009

Ten equipment and materials suppliers have received top nods from top foundry Taiwan Semiconductor Manufacturing Co. (TSMC) for contributions over the past year.


SEMI: Capex bounceback in 2010, 2011...but will chipmakers be ready?

Fri, 12 Dec 2009

After shrinking over the past two years to the lowest levels in two decades, global semiconductor equipment sales will surge mightily in 2010 and 2011 -- but with no real capacity upgrades, and that could spell trouble if chip demand is as robust as some believe, notes SEMI.


Wafer supplier IQE buys GaN materials firm

Wed, 10 Oct 2009

IQE plc has agreed to acquire UK compatriot NanoGaN, which offers processes and IP related to gallium nitride (GaN) materials and devices, in a deal worth up to £3.6M.


Good news in chip tool demand -- with a caveat

Fri, 11 Nov 2009

The good news continues to shine in semiconductor equipment demand for suppliers in North America and Japan, according to the latest monthly data from SEMI and the SEAJ, though some softness may warrant some attention heading into the holiday season.


Study compares SOI vs. bulk for finFETs

Fri, 10 Oct 2009

Cost and performance between silicon-on-insulator (SOI) and bulk finFETs are "for all practical purposes equivalent," but finFETs are more challenging to manufacture due to increased process variability, according to results from a study from the SOI Industry Consortium.


Chip demand finally emerges from deep hole

Wed, 10 Oct 2009

Semiconductor tool orders in North America showed year-on-year growth for the first time in nearly two-and-a-half years, and demand continues to ramp in Japan -- more evidence that the industry is climbing out of the deep hole in which it's been mired.


Mentor buys PCB software firm Valor

Tue, 10 Oct 2009

EDA vendor Mentor Graphics has acquired Israeli firm Valor Computerized Systems, a maker of PCB design software, in an $82M cash-and-stock deal planned to close in early 2010.


High-capacity cryopump for critical semiconductor process applications

Tue, 10 Oct 2009

Brooks Automation's S.E. Syssoev et. al. summarize development of a new cryopump design for type II gases that prevents wafer contamination by uncontrolled intermittent pressure bursts inside the chamber, and also increases capacity by 50%.


Analysts see bottom for chips...but not tools

Tue, 1 Jan 2009
Ahead of keenly anticipated 4Q08 results that will set the stage for how long the industry's dark winter will be, two analysts are casting their vote for chips and equipment, suggesting the former will touch bottom in 1H09, while the other thinks bad times will persist longer than feared.

Using soluble gap-fill materials in VFTL integration

Wed, 8 Aug 2009
Cu wiring based on dual damascene is beginning to hit fundamental limits of current via-first, trench-last (VFTL) integration, but thicknesses of films in the lithography stack for trench patterning can't scale as rapidly. This article outlines a novel approach for eliminating these variations using existing processes and equipment.

SAFC's materials roadmap: More HK/UHK, MG, Cu

Fri, 7 Jul 2009
At SEMICON West, SAFC Hitech unveiled details of its six-year-out (through 2014) materials roadmap for metalorganic chemical vapor deposition (MOCVD) and atomic layer deposition (ALD) processes on silicon semiconductor substrates, outlining development paths for advanced memory and logic including barrier layers, interconnects, dielectrics and metals.

Abound Solar opens its first CdTe PV production facility

Thu, 4 Apr 2009
Top exec Pascal Noronha tells PVWorld's Debra Vogler about Abound Solar's (nee AVA Solar) new production facility and its continuous in-line manufacturing process which generates a solar panel from glass in <2hrs, and how it all translates into <$1 manufacturing costs vs. sales.

This is not your father's semiconductor cycle

Thu, 1 Jan 2009
Some industry observers may be under the impression that the cause of the current semiconductor and equipment slowdown is the traditional one -- chipmaking overcapacity. However, while there is overcapacity in the memory sector, the primary cause of this slowdown is simply reduced consumer demand. This is not just a semiconductor industry-specific slowdown; most other business sectors are in a growing crisis worldwide, resulting in consumer confidence dropping to an all-time low.

Fab spending still a "wild ride" in 2009

Thu, 1 Jan 2009
Spending on equipping of frontend semiconductor fabs is expected to plummet 31% in 2008 to $26 billion, and recent announcements suggest another 30%-40% decline in 2009, resulting in the lowest spending level over the past 10 years. This article tracks the changing landscape of semiconductor fab spending, and what the future holds for 2009 and beyond.

Oerlikon sloughs off chip biz

Tue, 1 Jan 2009
Seeing no more synergies with its now-core technical and strategic areas, Germany's Oerlikon says it has sold its Esec unit to Dutch firm BE Semiconductor, and expects a management buyout of its etch business.

Searching for the bottom: Half the equation fulfilled?

Mon, 4 Apr 2009
The market for chip tools is still awful, but a slowing in declines in tool orders may offer some hope, and what may be the first step in a long road back to an industry turnaround.

CMP consumables market reaches middle age

Tue, 4 Apr 2009
Mike Fury of Techcet Group explains how the "industry darling" CMP consumables sector has evolved with a stable supplier base and growth rates aligned to other materials supply chains -- and how this helps fabs and suppliers focus on the business of optimizing process performance and cost.

VLSI: Chip industry finally above parity

Mon, 7 Jul 2009
After nearly a year in the red, semiconductor equipment manufacturers finally broke back above the "parity" mark for bookings vs. billings an indicator of future business stability and growth.

Making the case for 3D, one at a time

Wed, 7 Jul 2009
Jan Vardaman discusses alternatives to 3D/TSV technologies for cost-sensitive applications, and makes the case for additional work to develop design guidelines and software, and test methodologies for 3D/TSV technologies.

A reliability engineer's dream comes along

Tue, 1 Jan 2009
SST's Debra Vogler examines Crossing Automation's new family of modular automation components for vacuum wafer handling systems, and sees the realization of long-recommended reliability practices for semiconductor equipment -- during the challenging business times that they're most needed.

SEMI's PV standard driven by industry demand

Mon, 7 Jul 2009
Matthias Meier, manufacturing engineering & automation at the Fraunhofer Institute, discusses his role as "coach" of the PV Equipment Standards task force in an interview at SEMICON West. SEMI's newly released PV2-0709 standard, which focuses on data acquisition and access, is expected to be widely adopted.

Supply-demand dynamics call 'time' on legacy cell production technology

Thu, 7 Jul 2009
Changes in market supply-demand dynamics, coupled with less favorable financing conditions brought on by the current credit crunch climate, are together redefining the type of c-Si production equipment required by cell manufacturers over the next few years, explains Coherent's Finlay Colville.

SOI group eyes 3D, green benefits

Mon, 7 Jul 2009
Horacio Mendez, executive director of the SOI Industry Consortium, gave SST previews a new study that compares the manufacturability, performance, and cost of 3D transistors using silicon-on-insulator (SOI) vs. bulk. He also discusses the group's new "Simply Green" initiative to help emphasize SOI's power benefits vs. bulk Si.

3D integration: A status report

Tue, 7 Jul 2009
3D IC technology, an alternative approach to wire-bonded chip stacking utilizing interconnets with through-silicon vias (TSVs) fabricated with front-end-like processes, is a hot topic at SEMICON West, and the focus of an on-line virtual forum hosted by public relations firm MCA.

Analyst: Watch Intel's 32nm POTR carefully

Fri, 1 Jan 2009
The chip giant's outlook for the current quarter is unnervingly cloudy, but the message from the chip industry giant is of continued investment in leading-edge technology, and one analyst says decisions about 32nm process tools are imminent.

Moving from DFM to MFD

Thu, 1 Jan 2009
As the global economic tide starts to recede, it exposes many high technology manufacturing challenges that were otherwise hidden. In the semiconductor industry, these challenges are often opportunities for innovation -- and the situation we face in lithography today is an excellent example.

Gartner trims equipment capex outlook for 2006, improves 2007

Tue, 10 Oct 2006
New figures from Gartner Inc. point to slightly lower-than-expected growth in semiconductor capital spending and equipment purchases, particularly for some backend segments, but the outlook for 2007 has improved somewhat as well. Spending on new facility construction is on the rise, and even though memory makers continue to pour investments into the sector, but supplies and demand still appear to be balancing out.

DFM: Are we there yet?

Tue, 10 Oct 2006
The special Friday session of BACUS '06, organized by Bob Naber of Cadence, addressed the question of industry progress and readiness for DFM, and discussed the remaining challenges as well as proposed solutions. Mark Mason of Texas Instruments pointed out that "DFM is a journey, not a destination," and worried that management did not yet understand how hard it was going to be.

VLSI: June temps rise for equipment, ICs; July lull on deck

Fri, 7 Jul 2006
Demand for semiconductor equipment and ICs turned out a little bit better than expected in June, with a return to a brief seasonal lull expected over the next several weeks, according to data from VLSI Research Inc.

Report: AMAT, Unaxis eyeing BOC unit sale

Mon, 7 Jul 2006
July 24, 2006 - Following the agreed-upon acquisition of BOC by German gas company Linde announced earlier this year, Applied Materials and Unaxis, as well as investor firm Texas Pacific Group, are positioning themselves to snap up portions of the business that may be carved out of the combined entity, according to a local newspaper report.

SEMI: North American tool demand soaring to 2001 levels

Fri, 7 Jul 2006
July 21, 2006 - North American-based manufacturers of semiconductor equipment continue to see brisk demand for tools this year, tacking on another 5%-7% sequential growth in sales and orders, according to the latest data from SEMI.

IQE buys Emcore's materials unit

Fri, 7 Jul 2006
July 21, 2006 - Emcore Corp., a provider of compound semiconductor-based components and subsystems, has agreed to sell its electronic materials and device division to IQE plc, a Cardiff, Wales-based provider of compound and epitaxial semiconductor wafers and substrates, for $16 million.

Novellus, SEMATECH ATDF forge ahead with ULK test wafers

Mon, 7 Jul 2006
July 10, 2006 - SEMATECH's Advanced Technology Development Facility (ATDF) and Novellus Systems Inc. are readying next-generation porous low-k test wafers for equipment makers and materials suppliers to evaluate their products with leading-edge ultralow-k (ULK) materials, eyeing the 2007 production target set down by the ITRS.

Cookson, Microbonds combine insulated wire bonding, mold compounds

Thu, 7 Jul 2006
July 6, 2006 - Cookson Electronics Semiconductor Products and Microbonds Inc. have formed a codevelopment project to combine Microbonds' X-Wire insulated wire bonding technology with Cookson's Plaskon family of mold compounds.

Panelists debate cost-sharing future materials R&D

Tue, 8 Aug 2006
During SEMICON West 2006, a group of the industry's top senior technologists came together to discuss the limits and possibilities for semiconductor material development. Dealing with the atomic limits of semiconductors materials engineering, and delivering very small amounts of material, may also require fundamental changes in business models. How can suppliers support themselves under a paid-per-gram materials model, when critical amounts delivered are now sub-gram?

Panelists debate impact, challenges of "atomic" progression

Tue, 8 Aug 2006
During SEMICON West 2006, a group of the industry's top senior technologists came together to discuss the limits and possibilities for semiconductor material development. One of the main themes of the technical seminar and panel discussion, sponsored by DuPont Semiconductor Materials, involved the ramifications of a clear shift toward dealing with individual countable atoms, and what kind of endgame it leads to in terms of materials development.

Harvard scientists use nanowires to connect neurons

Fri, 8 Aug 2006
August 25, 2006 - As part of ongoing work to improve electrophysiological measurements of brain activity -- not to mention demonstrate the potential of hybrid bioelectronics -- researchers at Harvard U. have linked a solid-state device (a nanowire transistor) to neuronal projections that interconnect and carry information in the brain.

Scientists prototype new chip cooling device

Thu, 8 Aug 2006
August 24, 2006 - Researchers at the U. of Washington have built a prototype of a cooling device that uses an ion pump to create a cooling air jet directly on a chip's surface. Trial runs of the device, which uses an electrical field to accelerate air to speeds comparable to those from traditional blowers, show "significantly cooling" on just 0.6W of power.

Fujitsu, Tokyo U. tout 65nm FeRAM material

Mon, 8 Aug 2006
August 7, 2006 - Fujitsu Microelectronics America Inc. and the Tokyo Institute of Technology say they have developed a new material for use with non-volatile ferroelectric random access memory (FeRAM) targeting 65nm manufacturing processes, enabling up to 5x greater data storage capacity than materials currently used in FeRAM production.

SEMI taps Hermes-Epitek CEO as next chair, shuffles board seats

Thu, 7 Jul 2006
July 13, 2006 - Archie Hwang, chairman and CEO of Hermes-Epitek, has been elected chairman of SEMI's International Board of Directors, succeeding Metron senior advisor Ed Segal who held the position for the past year. Other new additions to SEMI's board include Wasuke Nakano, VP and GM of Hitachi High-Technologies' semiconductor equipment business group, and Richard Wallace, CEO of KLA-Tencor Corp.

Honeywell hikes titanium mill output

Wed, 7 Jul 2006
July 12, 2006 - Honeywell Electronic Materials said it has increased production of high-purity titanium mill by 45% this year, to meet rising demand from the semiconductor industry for use in equipment such as physical vapor deposition (PVD) products.

SEMI hikes 2006 equipment forecast, but 2007 now seen flat

Tue, 7 Jul 2006
July 11, 2006 - Semiconductor growth has been very strong in 2006 so far, with "tremendous" demand for tools, particularly in North America, according to SEMI's Stanley Myers, discussing the group's midyear outlook for semiconductor equipment and materials during a lunch panel presentation during the first day of SEMICON West on Monday, July 10.

MEMC changes partners in 10-yr, $6B solar wafer pact

Thu, 7 Jul 2006
July 6, 2006 - Three months after tentatively agreeing to an eight-year, $1.6 billion deal to supply wafers to Taiwanese solar cell producer Motech Industries Inc., MEMC Electronic Materials Inc. has found greener pastures in a new 10-yr, $6B deal with Beijing-based Suntech Power Holdings Ltd.

Bede, IMEC eyeing X-ray metrology for 45nm node

Fri, 8 Aug 2006
August 25, 2006 - Bede X-ray Metrology and European research consortium IMEC have entered into a collaboration to investigate the use of X-ray metrology for process control and characterization of new semiconductor materials used at the 45nm node and below.

Dongbu, Cadence develop design kit for high-voltage chips

Wed, 8 Aug 2006
August 9, 2006 - South Korean specialty foundry Dongbu Electronics and Cadence Design Systems Inc. have developed a high-voltage BCDMOS (bipolar, CMOS, DMOS) process design kit for processing 60V chip designs using 0.35-micron process technologies.

Open test platform group adds Infineon to roster

Thu, 8 Aug 2006
August 7, 2006 - Infineon Technologies AG has joined the Semiconductor Test Consortium (STC), a group promoting adoption of the Open Semiconductor Test Architecture (OPENSTAR) standard.

Rohm & Haas invests in Nanophase to continue CMP work

Mon, 8 Aug 2006
August 28, 2006 - Nanophase Technologies Corp. and Rohm and Haas Electronic Materials' CMP technologies unit have extended a partnership for use of new nanomaterials and nanomaterial dispersions for CMP applications through 2019. Rohm & Haas also has purchased $5 million worth of Nanophase stock.

Compound semi firm opens new production site

Fri, 8 Aug 2006
August 25, 2006 - SemiSouth Laboratories, Starkville, MI, a privately held company formed in 2000 to commercialize silicon carbide (SiC) electronic materials and device technologies developed at Mississippi State U., has officially opened a new multimillion-dollar silicon carbide manufacturing facility, and completed "a large portion" of equipment installation.

BASF spending "double-digit millions" to boost semi materials output

Fri, 8 Aug 2006
August 25, 2006 - BASF says it is investing a "double-digit million euro" sum in a new plant for producing process chemicals used in the semiconductor industry. The new Electronic Material Center in Ludwigshafen is scheduled to open by the end of 2007.

Surface analysis firm adds AML's spectrometry assets

Thu, 8 Aug 2006
August 24, 2006 - Evans Analytical Group LLC, Sunnyvale, CA, a provider of microanalytical surface analysis and materials characterization services, has acquired the operations and assets of Applied Microanalysis Labs Inc. (AML), an independent lab specializing in static and dynamic secondary ion mass spectrometry (SIMS) techniques, for an undisclosed amount.

NSF survey: US gearing for nanomanufacturing

Wed, 7 Jul 2006
Results of a major new National Science Foundation (NSF) survey, reported in late June at the New England International Nanomanufacturing Workshop at Boston's Northeastern U., reveal a surprising level of involvement in nanotechnology R&D and preparedness for nanomanufacturing among US organizations. Despite the optimistic outlook, however, there was widespread consensus among respondents that significant challenges must be resolved to stimulate commercialization of the technology.

Auto-fix for hot-spots in nanometer node designs

Wed, 7 Jul 2006
DFM start-up Takumi Technologies, building on its mask-data preparation (MDP) work for NEC and other customers, is now promoting its ability to automatically detect, classify, and repair yield-limiting design "hot spots" -- areas of a design layout which, due to process or geometric conditions, fall outside of process windows, resulting in potential catastrophic or parametric failure.

FOUNDRY WATCH: TSMC, UMC post growth in 2Q, but eye inventory concerns

Wed, 8 Aug 2006
2Q06 was a solid quarter for Taiwan's top two foundries, although each raised some concerns about inventory levels among customers and some cloudy outlooks for the quarters ahead.

SST's Haavind wins Gold at ASBPE awards

Fri, 8 Aug 2006
August 4, 2006 - Solid State Technology editorial director Bob Haavind has won a gold national award from the American Society of Business Publication Editors (ASBPE), for two of his editorials in SST's September and November 2005 issues, addressing topics in education and government.

Ponte names EDA vet Hogan as chairman

Thu, 9 Sep 2006
September 14, 2006 - Ponte Solutions Inc., Mountain View, CA, has appointed James Hogan as chairman of its board of directors, to provide strategic advice on strategy, fundraising, and personnel issues.

Brewer takes on Dow's dielectric coating line

Thu, 9 Sep 2006
September 7, 2006 - The Dow Chemical Co. is transferring development, manufacturing, and sales and marketing for spin-on silicon containing its "Ensemble" dielectric coatings to Brewer Science, Rolla, MO, as part of efforts to focus on its core business of dielectric materials for wafer-level chip-scale packaging, integrated passives, and SiLK dielectric materials.

Nova puts litho metrology patents up for bids

Wed, 9 Sep 2006
September 6, 2006 - Nova Measuring Instruments, Rehovoth, Israel, is soliciting bids from approximately 100 companies to license six of its patents relating to use of a lithography tool with integrated metrology, and will even accept bids for outright ownership of the technology.

SEMICON West: Bulls and bears divided over 2007

Mon, 7 Jul 2006
When leading analysts faced off to debate the prospects for industry growth at the annual "Bulls and Bears" session at SEMICON West, all agreed that 2006 was shaping up to be a very good year, but were widely split in their forecasts for 2007.

Analyst: Copper conversion driving CMP growth

Mon, 10 Oct 2006
October 23, 2006 - Memory chipmakers' conversion to copper damascene interconnect materials will drive 26% growth in demand for copper slurry for CMP, according to new data from market research firm The Information Network.

KLA-Tencor hires former VP, TEL exec as CTO

Fri, 10 Oct 2006
October 13, 2006 - KLA-Tencor Corp. has hired one of its own back as its chief technology officer -- Ben Tsai, who will move from SVP of technology at Tokyo Electron Ltd. to return to KLA-Tencor, where he previously was group VP and CTO of systems, and before that GM for the company's wafer inspection division.

Kulicke & Soffa snaps up die bonder supplier Alphasem

Thu, 10 Oct 2006
October 12, 2006 - Kulicke & Soffa Industries Inc. says it is entering the die bonder market with an agreed-upon $30 million acquisition of equipment supplier Alphasem, a subsidiary of Dover Technologies International Inc.

US designers still top influence on electronic design

Fri, 9 Sep 2006
September 29, 2006 - The US is still driving the most semiconductor purchases and thus wields the most influence in electronic equipment design, but emerging markets are catching up fast, according to a new report from iSuppli Corp.

Electroglas drops strip test tool, antes up for 300mm prober market

Tue, 9 Sep 2006
September 26, 2006 - Electroglas Inc. has suspended its efforts in the strip test market, and is putting its hopes for future growth in its EG6000 300mm prober.

Taiwan seeks slice of global PV pie

Mon, 9 Sep 2006
September 25, 2006 - In an effort to address two related problems -- declining energy supplies, and increasing CO2 emissions -- the Taiwan government has proposed a plan to infuse its photovoltaic industry with more than $6 billion over the next ten years.

EDA report: IC design up 19% in 2Q

Mon, 10 Oct 2006
October 2, 2006

Nova putting litho metrology patent licenses up for bids

Wed, 9 Sep 2006
September 6, 2006 - Nova Measuring Instruments, Rehovoth, Israel, is soliciting bids from approximately 100 companies to license six of its patents relating to use of a lithography tool with integrated metrology, and will even accept bids for outright ownership of the technology.

IEDM PREVIEW: Exploring the future of bioelectronics

Tue, 9 Sep 2006
One common thread among research being presented at the 52nd annual International Electron Devices Meeting (IEDM, Dec. 11-13, in San Francisco) will be the intersection of biology and electronics. Among the work being touted: fabricating nanoelectronic devices using self-assembling protein molecules; building carbon nanotube-based, high-frequency FET devices; and synthetic DNA used as programmable building blocks for patterning on metal and semiconductor nanoparticles.

Nano-engineered materials take a "BiTe" out of high-end CPU hot-spots

Mon, 9 Sep 2006
Hot-spots resulting from nonuniform power dissipation over a chip are the bane of manufacturers of high-performance ICs such as CPUs, graphics chips, and DSPs. And these hot-spots will only become more pronounced, as CMOS devices continue to scale -- the ITRS projects high-end CPUs dissipating 200W five years from now. Nextreme Thermal Solutions is readying its nanoengineered films for embedded thermoelectric coolers to help the industry address meet these challenges.

DuPont, Honeywell tout low-cost titanium powder

Wed, 9 Sep 2006
September 27, 2006 - DuPont and Honeywell Electronic Materials says they have used their metals creation knowledge for semiconductors to create a new process for making high-purity titanium metal powder, with "virtually the same strength and weight characteristics" as solid titanium but resulting in less machining and waste.

Motorola, AZ scientists make CNT-based sensors

Thu, 9 Sep 2006
September 14, 2006 - Researchers at Arizona State U. and Motorola Labs have developed a method for applying peptides to single-walled carbon nanotubes in field-effect transistors, creating sensors that can identify the presence of specific metals in water or air.

AZ Electronic Materials investing $63M for new capacity

Wed, 9 Sep 2006
September 13, 2006 - Specialty chemicals firm AZ Electronic Materials says it will invest over 50 million euros (US $63.4 million) over the next 15 months to increase production capacity.

Cadence debuts "litho-aware" flow for Brion, Clear Shape tools

Mon, 10 Oct 2006
October 2, 2006 - Cadence Design Systems Inc. has announced what it calls a "lithography-aware" design flow that links resolution-enhancement technologies (RET) with physical design and verification.

MEMC to supply wafers to Taiwan solar firm

Thu, 10 Oct 2006
October 26, 2006 - MEMC Electronic Materials Inc. said it has signed a deal to supply solar-grade solar wafers to Taiwan's Gintech Energy Corp. over a 10-year period beginning in 2H07. With this deal, MEMC has agreements to supply solar wafers worth roughly $7-$9 billion in revenue over the next decade.

Analyst: Start thinking about "end of the party" for chip industry

Tue, 5 May 2006
May 23, 2006 - Several industry metrics such as tight capacity levels and trough-to-peak growth are now similar to levels just before downturns in previous cycles, suggesting history may soon repeat itself in the semiconductor industry, according to a new report from Advanced Forecasting.

IBM's Meyerson: "Scaling is dead," long live collaborative innovation

Mon, 5 May 2006
The semiconductor industry needs to usher in a new era of "collaborative innovation" to push beyond the limits of classical scaling and achieve new advances in information technology price performance. That idea, proposed by The ConFab opening keynote speaker Bernard Meyerson, IBM fellow, VP strategic alliances, and chief technologist at IBM's Systems and Technology Group, set the tone for three days of top-level executive discussions on a range of issues facing chipmakers and suppliers alike.

IBM/Chartered alliance keeping partners happy, suppliers anxious

Mon, 5 May 2006
While the common 90nm-65nm platform announced by IBM, Chartered, and Samsung on Sept. 22 aims to offer users the clear benefit of multiple manufacturing sources for a single design, and help fabless design houses better match the IDMs in designing for manufacturability, it's less clear how much of an impact such cooperative partnerships of big chip manufacturers will actually have on suppliers.

SEMI: NA equipment orders spike in April

Fri, 5 May 2006
May 19, 2006 - Demand for semiconductor manufacturing equipment from North American suppliers continued to ramp up in April, as the industry enjoys its strongest growth period in nearly two years, according to new data from SEMI.

Japan chip equipment industry manages slight loss in '05

Mon, 5 May 2006
May 1, 2006 - Japanese manufacturers of semiconductor production equipment suffered their first slowdown in three years during fiscal 2H05 (ended in March 2006), but a surge in demand in the second half of the year kept the losses to a minimum, according to new data from the Semiconductor Equipment Association of Japan (SEAJ).

Cadence updates PCB design platform

Wed, 4 Apr 2006
April 26, 2006 - Cadence Design Systems Inc., San Jose, CA, is extending its "segmented" product strategy to its system interconnect design platform, used for simplifying and streamlining designs for printed circuit boards.

CMP pads, slurries market tracking 15% CAGR

Mon, 4 Apr 2006
April 24, 2006 - The market for chemical-mechanical planarization (CMP) products is expected to see strong growth as chipmakers continue to switch to copper interconnects, according to a new report from Linx Consulting, Boston, MA.

UMC ships SONOS memory

Fri, 4 Apr 2006
April 21, 2006 - Taiwanese fabless IC design house Solid State System Co. has received pilot devices of a new type of SONOS dielectric storage memory from UMC.

Analyst: Equipment segments to level off in 2H06

Tue, 5 May 2006
May 16, 2006 - Advanced Forecasting sees a 33% jump in sales of etch equipment in 1H06, leading to a plateau in 3Q and a potential decline in 4Q.

AMAT, DNS forming track biz

Mon, 5 May 2006
May 15, 2006 - Applied Materials Inc., Santa Clara, CA, and Japan's Dainippon Screen Mfg. Co. Ltd. (DNS) are forming a joint venture to offer track technologies for semiconductor manufacturing.

Varian, Nissin Ion settle patent spat

Fri, 5 May 2006
May 12, 2006 - Varian Semiconductor Equipment Associates Inc., Gloucester, MA, and Japan's Nissin Ion Equipment Co. Ltd. have quietly settled patent litigation in a Texas court.

Report: Formosa Komatsu ramping 300mm output by Nov.

Wed, 5 May 2006
May 3, 2006 - Formosa Komatsu Silicon Corp., a silicon-wafer making venture between Taiwan's Formosa Plastics Group and Japan's Komatsu Electronic Materials Co. Ltd., reportedly will start pilot production at its first 300mm wafer fab in November.

Mitsubishi unveils organic FPD material

Thu, 5 May 2006
May 18, 2006 - Researchers at Mitsubishi Chemical Corp.'s Science and Technology Research Center (MCRC) and Japan's Ehime U. and Kyushu U. have developed a new organic semiconductor material, processed by low-cost wet coating methods, for use with new large flat-panel displays (FPD).

UCLA scientists interconnect nanoscale devices with "spin-wave buses"

Fri, 5 May 2006
May 5, 2006 - Researchers at UCLA's Henry Samueli School of Engineering and Applied Science say they have created three new nanoscale computational architectures using spin waves as the mechanism for multiple interconnections, to achieve low-power device performance and improved scalability.

Nanotube "Velcro" aids in chip cooling, say researchers

Thu, 5 May 2006
May 4, 2006 - A new type of "thermal Velcro" placed between silicon chips and metal heat sinks could be the answer to enhancing heat transfer in future high-powered microchips to keep them from overheating, according to researchers at Purdue U.

Report from IITC: Future interconnects could include low-k air-gaps, carbon nanotubes

Tue, 6 Jun 2006
The 9th annual International Interconnect Technology Conference again brought together hundreds of the world's leading semiconductor manufacturers, equipment and materials suppliers, and research centers for three days of comparing notes and competing for bragging rights. Among the highlights: detailed information on likely 45nm dual-damascene Cu/porous-low-k integration, and using dielectric "air-gap" large structured pores as a comparable and perhaps less expensive manufacturing alternative.

Report from The ConFab: Here comes the solar market

Mon, 6 Jun 2006
Over the past 30 years, photovoltaics technology has made its share of false starts, and has earned a reputation as being impractical without government subsidies. However, recent advances and conditions are converging to create what this time promises to be a sustainable market -- and a significant business opportunity market for the semiconductor industry.

SPT, Microbonds align wire bonding strategies

Thu, 6 Jun 2006
June 29, 2006 - Small Precision Tools and Microbonds Inc. plan to align their technology roadmaps to combine SPT's advanced wire bonding capillaries with Microbonds' X-Wire insulated wire bonding technology.

Nantero, ON Semi continue nanotube-CMOS work

Fri, 5 May 2006
May 26, 2006 - Nantero Inc., Phoenix, AZ, and ON Semiconductor will pick up where Nantero and LSI Logic left off with work to integrate carbon nanotubes into CMOS fabrication. ON Semi acquired LSI Logic's facility in Gresham, OR, earlier this year, where the technology was being developed.

Analysts: litho market to "soften" in 2008

Fri, 5 May 2006
May 26, 2006 - Analysis from two firms predicts a soft market for lithography equipment in 2008, after leading-edge chipmakers are through placing initial orders for next-generation lithography tools.

Disconnect marks 450mm wafer debate

Wed, 5 May 2006
A ConFab session on 450mm wafers provided a multifaceted look at a sharp split that has developed in the industry. Peter Silverman, Intel Fellow, stated the need for a 30% cost/cm2 reduction every 10 years to follow Moore's Law," while a SEMATECH exec said that would fall short even with a 450mm transition by the ITRS goal of 2012. And don't expect equipment suppliers to pay for the 450mm tool R&D, warned Applied Materials' Mark Pinto.

ASML: Immersion ramp pushing tool demand in 2Q

Tue, 5 May 2006
May 23, 2006 - ASML Holding NV says it's seeing stronger than anticipated demand for its lithography equipment in 2Q06, as customers place orders for immersion lithography tools used in an anticipated production ramp-up in 4Q06-1Q07.

JEOL doubling e-beam tool output

Mon, 6 Jun 2006
June 5, 2006 - JEOL Ltd. reportedly is investing 1.8 billion yen (about US $16 million) to build a new facility that will double its production of electron-beam lithography equipment.

Toshiba building $450M 200mm fab for power chips

Thu, 6 Jun 2006
June 1, 2006 - Toshiba Corp. said it will build a new 200mm fab in northern Japan to make power semiconductors, in answer to demand for devices incorporated in consumer electronics such as flat-panel TVs, mobile phones, notebook PCs, and gaming consoles.

Nantero touts success with 22nm memory switch

Wed, 4 Apr 2006
April 12, 2006 - Nantero Inc. says it has successfully demonstrated scalability of its nonvolatile random access memory (NRAM) technology, with fabrication and testing of a 22nm NRAM memory switch.

Entegris fires back vs. Pall filter suit

Thu, 4 Apr 2006
April 6, 2006 - Materials systems supplier Entegris Inc. has filed a lawsuit against Pall Corp. alleging known misuse of patented technology in certain filtration separation products.

Millisecond annealing for USJ dopant activation

Tue, 4 Apr 2006
By Debra Vogler, Senior Technical Editor

At a seminar at San Francisco's Moscone Hall, a leading technologist surmised that millisecond annealing for USJ dopant activation will be pushed out to the 45nm node, but flash/RTA (rapid thermal annealing) or laser annealing will be needed at the 65nm node for poly depletion improvements.

Nano firm touts printable semiconductors

Wed, 6 Jun 2006
June 14, 2006 - Researchers at Advance Nanotech Inc. and the Center for Advanced Photonics and Electronics (CAPE) at the U. of Cambridge, UK, say they have developed novel composites made from organic polymers and nanostructured materials that provide "printable" semiconductors for low-cost inkjet print manufacturing.

Brion, Crolles2 partners extend OPC work to 45nm

Tue, 6 Jun 2006
June 6, 2006 - Brion Technologies and Crolles2 Alliance partners STMicroelectronics, Philips Semiconductors, and Freescale Semiconductor, have incorporated Brion's Tachyon LMC lithography manufacturability verification technology into production on a fully automated 65nm process flow, and agreed to continue working to develop optical-proximity correction (OPC) technology for 45nm device fabrication.

UK researchers gain funding for PECVD nanotube growth

Mon, 6 Jun 2006
June 5, 2006 - The Advanced Technology Institute at the U. of Surrey, UK, and plasma processing company CEVP Ltd., have received funding of GBP 215,000 (about US $404,000) to support efforts to commercialize their plasma-enhanced chemical vapor deposition (PECVD) method for mass-producing nanoscale materials, such as nanotubes.

June 2006 Exclusive Feature: METROLOGY/PACKAGING

Analyzing a wire bond problem with x-ray microanalysis tools

Thu, 6 Jun 2006
By Minoru Suzuki, Thermo Electron, Yokohama, Japan; David Rohde, Dennis Masaki, Thermo Electron, Madison, Wisconsin

EXECUTIVE OVERVIEW One area of device reliability is the physical and electrical connection of the die to the lead frame through the bond wire. Even with the emergence of new techniques for the connection of die to circuit board, the wire bond is still a mainstay of the semiconductor industry....

Flash memory firm expanding work with Intel, Micron

Fri, 6 Jun 2006
June 30, 2006 - Nanosys Inc., Palo Alto, CA, says it has expanded its technology collaboration with Intel Corp. to include flash memory partner Micron Technology Inc., targeting development of nanostructures for high-density NAND flash memory for consumer electronics and portable storage applications.

Top backend, materials vendors emphasize tool performance, notes analyst survey

Wed, 6 Jun 2006
June 29, 2006 - Accretech-Tokyo Seimitsu, Nextest Systems, and S

VLSI: Industry slows slightly before June ramp

Tue, 6 Jun 2006
June 27, 2006 - Demand for worldwide semiconductor manufacturing equipment slipped in May after a very strong two-month period, but demand for chip tools continues to be well ahead of last year's pace heading into the seasonally strong summer months, according to data from VLSI Research Inc.

Asyst buying out Shinko JV

Mon, 6 Jun 2006
June 26, 2006 - Asyst Technologies Inc. has agreed to purchase 44.1% of outstanding shares its Japanese JV with Shinko Electric, essentially buying out its minority partner in the three-year-old venture which develops automated material handling systems for 300mm wafer production.

Analyst: Fast LCD ramp-up causing sluggish tool market in 2006

Thu, 6 Jun 2006
June 22, 2006 - Aggressive capacity expansion for new 5G-7G LCD facilities in the past two years have resulted in an oversupply situation in 2006, causing sales of TFT-LCD array processing equipment to drop 10% this year, according to The Information Network.

BITLINES: New spin for stock options prying; Seeding growth of nanoscientists

Tue, 11 Nov 2006
Congrats to Richard Dyck, president of TCS-Japan and the next recipient of SEMI's annual Bob Graham Award for outstanding contributions in semiconductor equipment and materials marketing... And kudos also goes out to Roger Grace, Northeastern U. grad who is sponsoring funding at his alma mater to support nanomanufacturing education for future scientists...

Fujitsu added as customer for Belgium firm's ESD tech

Fri, 11 Nov 2006
November 17, 2006 - Sarnoff Europe says it has licensed its "TakeCharge" portfolio of on-chip electrostatic discharge protection technology to Fujitsu, for protecting the chipmaker's 65nm CMOS IC products.

November 2006 Asian Exclusive Feature 1:

Fujitsu reports progress towards carbon nanotube interconnects for 32nm

Wed, 11 Nov 2006
Development of carbon nanotube (CNT) interconnects for the 32nm node is starting to make major strides. Although CNTs could potentially carry the high current densities required for next generation interconnects, it has proved difficult to grow them at low enough temperatures with the right properties. Now, Fujitsu Laboratories Ltd. has demonstrated CNT interconnects approaching the target of matching the resistance of copper at CMOS-compatible growth temperatures of 400 degrees C.

VLSI gives "best of best" nod to 14 suppliers

Tue, 11 Nov 2006
November 28, 2006 - A new slice 'n' dice of supplier survey data from VLSI Research Inc., based across many categories of equipment performance and customer support, identifies the cream of the crop among large and small semiconductor equipment suppliers.

Ibis promotes McKenna to CEO

Tue, 11 Nov 2006
November 21, 2006 - Ibis Technology Corp., a developer/provider of SIMOX-SOI implantation equipment, has promoted Charles McKenna, EVP and COO, to the position of president/CEO effectively immediately, replacing Martin Reid who assumes the role of executive chairman and will continue day-to-day duties in areas of market development and business strategy.

Report: MEMC selling out Taiwan silicon subcons

Mon, 11 Nov 2006
November 20, 2006 - Flush with new business from solar-cell customers in Asia, MEMC Electronic Materials Inc. has anxiously approached two Taiwanese manufacturers to help grow and slice the silicon ingots, according to the Taiwan Economic News.

Tool demand slips in Oct. as customers digest capacity

Fri, 11 Nov 2006
November 17, 2006 - Orders received by North American-based manufacturers of semiconductor equipment continued to slide from their peak in June (now 16% lower in just four months), as customers absorb capacity brought on with recent investments, according to new data from SEMI.

Intel gives nod to top suppliers

Wed, 3 Mar 2006
March 22, 2006 - Intel Corp. has handed out its annual awards to more than three dozen suppliers from its roster of thousands of supply-chain partners, ranging from capital equipment manufacturers to materials, components, and service providers.

Korea spending soars, Taiwan/China pull back in 2005

Tue, 3 Mar 2006
March 21, 2006 - Worldwide sales of semiconductor manufacturing equipment dipped 11% in 2005 following significant expansion in 2004, but it was still the third-strongest year in history for suppliers overall, according to new data from SEMI.

SEMI: NA chip demand holding steady into 2006

Fri, 2 Feb 2006
February 24, 2006 - Demand for semiconductor equipment from North American-based manufacturers still hovers below the parity mark, balancing incoming orders with outgoing sales, according to SEMI.

Report: Thin-film electronics to top $15B in five years

Thu, 2 Feb 2006
February 23, 2006 - Applications for thin-film electronics applications will generate $15.5 billion in revenue in the year 2011, more than half of which will be used for emerging markets, according to a new report from NanoMarkets.

Former SEMI leader, industry vet mourned

Thu, 2 Feb 2006
February 15, 2006 - James Gallagher, former SEMI chairman and founder of wafer stepper supplier GCA Corp., passed away Feb. 7 at the age of 85. He was an early pioneer in the semiconductor equipment industry

Cadence, PDF to link DFM technologies

Wed, 4 Apr 2006
April 26, 2006 -Cadence Design Systems Inc. and PDF Solutions Inc. say they will work together to develop design-for-manufacturability (DFM) technology aiming to improve IC manufacturability, yield, and reliability.

Chartered expands deals with IBM, Microsoft for SOI-based chips

Fri, 4 Apr 2006
April 21, 2006 - Singapore-based foundry Chartered Semiconductor Manufacturing is migrating production of CPUs for Microsoft's Xbox gaming console using silicon-on-insulator (SOI) to 65nm process technologies, and is expanding its license of IBM's 90nm-based SOI for use with its own customer base.

Cymer profits, sales soar

Thu, 4 Apr 2006
April 20, 2006 - Cymer Inc., San Diego, CA, posted a profit of $20.6 million in 1Q06, a whopping 283% increase over a year ago, on 50% higher sales of $127.1 million.

Cimetrix launches Interface A services business

Tue, 4 Apr 2006
April 18, 2006 - Cimetrix Inc., Salt Lake City, UT, is adding a services unit to its software-sales business to help provide yield and manufacturing data management services for fabs and fabless semiconductor companies.

Applied starts work on China site

Tue, 4 Apr 2006
April 11, 2006 - Applied Materials Inc. has begun groundbreaking for a new global development center in Xi'an, China, to provide engineering and software support services to global customers across several time zones.

Hitachi Chemical eyes China PCB film output

Mon, 4 Apr 2006
April 10, 2006 - Hitachi Chemical Co. plans to build a new facility in Suzhou, China, to begin making photosensitive dry films used in fabricating printed circuit boards.

E-beam litho firm adds NA presence

Fri, 4 Apr 2006
April 7, 2006 - Elionix Co. Ltd., a Japanese manufacturer of electron-beam lithography equipment, has signed a deal with SEMTech Solutions to sell its sub-10nm 3-beam systems in the North American market.

Gartner: Capex outlook improving, if memory holds up

Fri, 4 Apr 2006
April 7, 2006 - Worldwide semiconductor equipment spending will return to double-digit growth in 2006, but concerns linger about a possible oversupply in the memory segment, according to preliminary market data from Gartner Dataquest.

Report: Japan leads modest EDA growth in 2005

Thu, 4 Apr 2006
April 6, 2006 - Revenues for companies offering IC physical design and verification totaled $1.21 billion in 2005, a 4% increase over 2004, according to data from the EDA Consortium.

Japan chip tool sales down 9% in 2005

Wed, 2 Feb 2006
February 1, 2006 - Global sales of Japanese-made semiconductor manufacturing equipment decreased 9.2% in 2005 to 1.47 trillion yen (US $12.51 billion), the first decline in three years, but improving demand late in the year bodes well for a comeback in 2006, according to the Semiconductor Equipment Industry of Japan (SEAJ).

Japan's equipment industry still gaining strength

Thu, 3 Mar 2006
March 9, 2006 - Demand for Japanese semiconductor manufacturing equipment continues to gain momentum, with consecutive months of orders that were much stronger than a year ago, according to new data from the Semiconductor Equipment Association of Japan (SEAJ).

BOC agrees to Linde takeover, creating gas giant

Tue, 3 Mar 2006
March 7, 2006 - The BOC Group has agreed to be acquired by the German gas company for about $14.4 billion (GBP 8.2 billion), surpassing Air Liquide to become the world's largest gas supplier.

NEC touts new optical nanoprobe

Wed, 2 Feb 2006
February 22, 2006 - NEC Corp. has developed what it claims is the world's smallest fiber-optic electric field probe, to be used for evaluating electrical characteristics inside high-density LSI packages.

Nanozone progress means focus and tough choices

Tue, 1 Jan 2006
By Bob Haavind, Group Editorial Director

While exotic properties of materials in the nanozone (1-100nm) promise a host of new devices and applications, success in the marketplace will depend on making tough choices and focusing on developing products offering sustainable profits.

Lower-cost displays, memories driving near-term nanotech growth

Tue, 1 Jan 2006
By Paula Doe, Contributing Editor

Nanotechnology may have a revolutionary impact on leading-edge semiconductor process technology beyond 32nm when traditional scaling reaches the fundamental limits of physics, but for at least the next five years or so the significant nanotechnology applications in electronics will likely be lower-cost displays and memories, according to SEMI's new Global Nanotechnology Markets and Opportunities study.

SEMI: NA chip equipment demand inches up

Mon, 1 Jan 2006
January 23, 2006 - Demand for semiconductor equipment from North American-based manufacturers rose slightly in December from the previous month, and a solid increase in orders since the fall suggests growing strength in the market, according to SEMI.

SEMATECH 3D project seeks interconnect answers

Thu, 2 Feb 2006
February 9, 2006 - SEMATECH has launched a new project to explore the feasibility of three-dimensional (3D) interconnect technology for the semiconductor industry.

IEEE standardizing nanotube electrical tests

Tue, 2 Feb 2006
February 7, 2006 - The IEEE has approved a standard to establish a common metrics foundation for electrical properties in carbon nanotubes, in an effort to pave the way toward commercialization of the technology's adoption in devices ranging from displays to ICs and sensors.

SEMICON Japan News roundup: Lots of action in materials and inspection sectors

Tue, 2 Feb 2006
By Paula Doe, Contributing Editor, WaferNews

Big players introduced tools for 45nm production at SEMICON Japan, but much of the activity was in improved materials that could at least be hyped as nanotechnology, and of course in more new types of metrology tools, with wafer-edge inspection a particularly hot niche for new product introductions. The other major theme: diversification into new markets for all sorts of players.

Alliance trio lines up DFM support for 65nm process

Thu, 3 Mar 2006
March 30, 2006 - Chartered Semiconductor Manufacturing Ltd., IBM Corp., and Samsung Electronics Co. Ltd. have announced availability of design-for-manufacturing (DFM) technology, models, design kits, and data files for their common 65nm process technology platform.

Microbonds, Tanaka ink bonder deal

Wed, 3 Mar 2006
March 28, 2006 - Privately held Canadian interconnect developer Microbonds Inc. has licensed its "X-Wire" gold wire bonding technology for use in Tanaka Denshi Kogyo's line of gold bonding wire products.

IBM touts milestone with single nanotube-based IC

Fri, 3 Mar 2006
March 24, 2006 - IBM Corp. has built the first complete electronic IC around a single carbon nanotube molecule using standard semiconductor processes, an achievement that could simplify future manufacturing and consistency of such devices.

Honeywell debuts flexible phase-change material

Fri, 3 Mar 2006
March 17, 2006 - Honeywell Electronic Materials has developed a new screen printable phase-change material to give chipmakers more flexibility in applying the heat-conducting materials during the semiconductor packaging process.

DFM SERIES PART I: Clear Shape takes a stab at changing the shape of the DFM turf

Tue, 2 Feb 2007
The proliferation of DFM start-ups has set the stage for a plethora of announcements in the months leading up to the SPIE Microlithography Conference. In this three-part series, WaferNEWS interviews companies that are trying to make their mark on the DFM landscape. This week we look at a company with technology that predicts, during the design phase, how ideal GDS shapes will print as contours in silicon: Clear Shape Technologies.

FSA preps "risk assessment" tools for fabless IP

Fri, 2 Feb 2007
February 16, 2007 - The Fabless Semiconductor Association (FSA) has released the first tool in a planned "ecosystem" of IP deliverables that aims to address pain points of IP integration by enabling more effective communication between IP vendors, fabless companies, IDMs, and foundries.

Scientists tout telescoping nanotube switches for memory devices

Fri, 2 Feb 2007
February 16, 2007 - Researchers at the U. of California-Riverside have designed the building blocks for a memory device that uses telescoping binary or three-stage carbon nanotubes as high-speed, low-power microswitches.

Aviza awarded patent for low-k films, seeks licensees

Fri, 4 Apr 2007
April 13, 2007 - Aviza Technology Inc. is touting its suite of low-k patents, including a new one for making low-k dielectric SiOC films, and is "pursuing active licensing programs," the company said today in a statement.

NEC develops new bioplastic with high heat conductivity

Tue, 4 Apr 2007
April 10, 2007 - NEC Corp. has developed a completely new kind of bioplastic composed of plant-based material and carbon fiber, which realizes heat conductivity higher than that of stainless steel, according to the Japan Electronic News. The innovative bioplastic is expected to make electronic products more environmentally sound, while solving conventional heat release issues.

Rebuffed FSII investor group seeks new owners, execs

Wed, 4 Apr 2007
April 4, 2007 - A group claiming to represent 6.5% ownership in wafer processing equipment firm in FSI International is pushing for new leadership and possibly new ownership of the company, laying out in surprisingly candid detail its efforts to discuss its concerns with the company's top management.

Report: TSMC expanding Shanghai ops with NXP's used tools

Tue, 2 Feb 2007
February 27, 2007 - Taiwan Semiconductor Manufacturing Co. (TSMC), recent beneficiary of relaxed government regulations regarding transfer of process technologies to mainland China, will likely utilize used equipment from NXP Semiconductor in order to triple the output from its 200mm, 30,000 WPM capacity site in Shanghai, according to the Taiwan Economic News.

Air Products, Babcock & Brown ink tool refurbish deal

Mon, 2 Feb 2007
February 26, 2007 - Air Products has agreed to refurbish semiconductor equipment owned by or consigned to Babcock & Brown Electronics Management, an equipment leasing firm, out of Air Products' Chandler, AZ facility. Repair and refurbishment will be performed prior to resale, adjusted to meet customers' requirements for reliability and refurbishment "to the most recent configuration possible," and in some cases involving the tool OEM.

Elpida sells 200mm tools to China chipmakers

Fri, 2 Feb 2007
February 23, 2007 - Japanese DRAM firm Elpida Memory Inc. said it has agreed to sell 200mm wafer processing equipment from its Hiroshima facility to Cension Semiconductor Manufacturing Corp. in order to narrow its focus to 300mm chipmaking operations.

Honeywell expanding packaging center

Fri, 2 Feb 2007
February 16, 2007 - Honeywell Electronic Materials, Tempe, AZ, says it will invest >$1 million to expand its advanced packaging materials R&D center in Spokane, WA.

Analyst: LCD equipment market still plummeting, no recovery until 2008

Fri, 2 Feb 2007
February 9, 2007 - Significant overcapacity problems for flat-panels contributed to a double-digit decline in sales of manufacturing equipment for TFT-LCDs in 2006 -- and the situation will only get worse this year, according to data from The Information Network.

SEMI: NA tool demand flat M-M in March

Fri, 4 Apr 2007
April 20, 2007 - Semiconductor equipment demand was essentially flat in March vs. the previous month, and year-on-year sales and orders of chipmaking tools rose very little, according to data from SEMI.

Rohm & Haas buys Kodak light films biz

Fri, 4 Apr 2007
April 20, 2007 - Rohm and Haas Co. has agreed to acquire Kodak's light management films business, which produces films to improve brightness and efficiency of LCDs, as first step in a wide-ranging plan to identify and invest in growth opportunities.

SEMI: Jan, Feb. equipment numbers worse than thought

Mon, 4 Apr 2007
April 16, 2007 - Data for semiconductor equipment demand seemed to be holding steady in January and February, according to initial data from SEMI -- but apparently equipment demand was really in line with other slowing trends in the industry, as the group now admits its tool sales & orders data were incorrectly too high.

Semitool lowers fiscal 2Q, FY07 outlook

Fri, 4 Apr 2007
April 13, 2007 - Wafer processing equipment supplier Semitool Inc. says its fiscal 2Q07 revenues will be down about 7% below prior expectations to a range of $51-$53 million, representing a 22%-25% decline from fiscal 1Q07 ended in December.

KLA-Tencor, Lam climb equipment ranks in '06

Fri, 4 Apr 2007
April 6, 2007 - "Uneven" investment patterns favoring memory devicemakers over IDM/foundry capacity shook up the final rankings of top semiconductor equipment vendors in 2006, according to Gartner Dataquest, which also gave WaferNEWS its latest take on the sustainability of memory spending.

"Two-photon absorption" technique shows promise for 3D microstructures

Mon, 4 Apr 2007
Georgia Tech researchers say they've developed a "3D multiphoton" technique, a process involving two-photon absorbing molecules that are sensitive to laser light at short wavelengths, that could be applied to simplify and cut costs for patterning 65nm devices.

MRS meeting specs the future

Tue, 4 Apr 2007
The Materials Research Society's (MRS) spring meeting in San Francisco last week informed a record number of attendees on near- and far-term possibilities for process technology, showcasing research results in electronic materials development: CMOS high-k gate dielectrics, nano-imprint lithography, organic semiconductors, quantum dots, and nano-tubes -- and wilder technologies like neuro-prosthetic interfaces and designs based on structures created by Mother Nature.

Rite Track, TEL extend 200mm track pact

Tue, 1 Jan 2007
January 16, 2007 - Rite Track, West Chester, OH, and Japan's Tokyo Electron Ltd. have extended their existing partnership, adding the TEL Clean Track ACT 8 to the family of TEL Clean Track Mark 200mm track systems sold and serviced by Rite Track.

AZ Electronic Materials expanding Taiwan photoresist site

Mon, 1 Jan 2007
January 15, 2007 - AZ Electronic Materials plans to invest about $7.8 million to "significantly expand" its photoresist facility and production in Hsinchu, to produce semi-finished products and eliminate the need for using bulk production in Japan.

PACKAGING BEAT: SEMICON West Preview: More assembly and test than ever

Tue, 7 Jul 2007
As usual, the challenge for SEMICON West attendees is prioritizing among the many options to make the best use of your time. SEMICON West seems to have more "extras" than ever, and this year many of them are focused on assembly and test.

Quantum effect found in silicon nanocrystals

Fri, 7 Jul 2007
July 27, 2007 -- Researchers at the U.S. Department of Energy's National Renewable Energy Laboratory (NREL), collaborating with Innovalight, Inc., say they have shown that a new and important effect called Multiple Exciton Generation (MEG) occurs efficiently in silicon nanocrystals. MEG results in the formation of more than one electron per absorbed photon.

CEA-Leti, Keithley to pursue nanotech, chip materials R&D

Thu, 7 Jul 2007
July 18, 2007 - Keithley Instruments Inc. and European R&D institute CEA-Leti have agreed to jointly research methods for characterizing advanced semiconductor materials and devices that support DC, high frequency, and RF-level signals on both micro- and nano-level structures.

To FUSI or not FUSI? That's the question

Thu, 7 Jul 2007
At SEMICON West, SEMATECH is discussing many of the themes from papers it presented at the VLSI Symposium, including its gate first/high-k metal-inserted poly stack (MIPS) electrode approach instead of FUSI or replacement gates. "We chose a path that was more manufacturable and fits in more easily with existing technologies in terms of scalability, contamination prevention, and integration," said Raj Jammy, director of frontend processes, in a pre-show interview with WaferNEWS.

SEMICON WEST REPORT: Interconnect symposium heralds exciting year

Wed, 7 Jul 2007
Participants in Tuesday's Interconnect Symposium hosted by Kulicke & Soffa and Advanced Packaging magazine, examined a list of trends, challenges, and opportunities in advanced packaging (e.g., wire-bonding and flip-chips) that are being thrust into the semiconductor manufacturing spotlight. "If you're an advanced packaging engineer, you're finally getting the recognition you deserve," noted TechSearch International president E. Jan Vardemann.

Making solar cells: This *is* your father's fab

Tue, 7 Jul 2007
What's the difference between semiconductor equipment and solar equipment? "A factor of ten, squared," said T.J. Rodgers, chairman of SunPower Corp. and president and CEO of Cypress Semiconductor, during his Wednesday (July 18) keynote address at SEMICON West. "If you want to sell a solar fab some equipment, it has to be 10x cheaper" -- e.g., $400,000 instead of $4 million -- "and it has to be 10x faster, say, 800 wafers/hr, not 80 wafers/hr."

NEWS FROM JAPAN: Firms find ways to better profits in slow environment

Mon, 7 Jul 2007
July 30, 2007 - A roundup of the past week's headlines from Japan center largely on April-June financial results, with Toshiba and NEC improving their profits (though largely due to restructuring and asset sales), while Fujitsu takes a hit for finance missteps.

SEC lawsuits target former Brooks, KLA-Tencor execs

Thu, 7 Jul 2007
July 26, 2007 - The US Securities and Exchange Commission has come down hard on former top execs of two semiconductor equipment suppliers for their participation in the wide-ranging practice of stock options backdating in recent years.

SEMI: June sales typical 2Q end; bookings still soft

Mon, 7 Jul 2007
July 23, 2007 - The latest monthly data from SEMI indicates soft demand at the midpoint of 2007, days after the group joined the growing chorus of industry watchers in expressing pessimism that the equipment industry will se anything above a few percentage points of growth this year.

DuPont's Coder named new SEMI chairman

Thu, 7 Jul 2007
July 18, 2007 - Jerry Coder, president emeritus of Dupont Electronic Technologies' semiconductor materials business, has been appointed as the new chairman of SEMI's board of directors, succeeding Hermes-Epitek CEM Archie Hwang.

UMC, ATDF to explore new chip techs

Thu, 7 Jul 2007
July 12, 2007 - Taiwan foundry United Microelectronics Corp. (UMC) and SEMATECH's Advanced Technology Development Facility (ATDF) are extending their year-long collaboration to evaluate "emerging technology products," focusing on specialty technologies such as nanotech and memory designs.

SEMI: Tool sales surged in December

Fri, 1 Jan 2007
January 19, 2007 - New demand for new semiconductor manufacturing equipment continued to slow in December, but sales surged during what was the final fiscal month for most North American companies, according to the latest data from SEMI.

Taiwan officials confirm new ASML R&D site

Thu, 1 Jan 2007
January 4, 2007 - Taiwan government officials say ASML has chosen to establish a new $150 million facility in Taiwan as its R&D headquarters for the region, according to the Taiwan Economic News.

Ceramics component firms combine forces

Thu, 1 Jan 2007
January 4, 2007 - CoorsTek Inc., a manufacturer of ceramics and electronics components, has acquired Ventura, CA-based Gaiser Tool Co., a ceramics precision tooling firm, for an undisclosed amount.

Taiwan's ITRI investing in flexible electronics R&D

Wed, 1 Jan 2007
January 3, 2007 - Taiwan's government-funded Industrial Technology Research Institute (ITRI) has set an aggressive budget over the next two years to support research and development of flexible electronic technologies and products, according to the Taiwan Economic News.

ASMI ramps production with AIT's SiP

Mon, 1 Jan 2007
January 29, 2007 - AMI Semiconductor is in full production mode with Advanced Interconnect Technologies' (AIT) stacked-die quad flat package no leads (QFN) modules, which AMI will incorporate into several consumer electronics applications, the companies said today.

Rensselaer: New hybrid nanowires could fix interconnect problems

Mon, 1 Jan 2007
January 15, 2007 - Researchers at Rensselaer Polytechnic Institute say they've developed new hybrid structures that combine the best properties of carbon nanotubes and metal nanowires, to overcome some of the key hurdles for using carbon nanotubes as a building block for future chips.

Stanford Magnetic Technology workshop not just about memories

Tue, 1 Jan 2007
A Dec. 8 workshop at Stanford U.'s Center for Magnetic Nanotechnology on the patterning and imaging of magnetic nanostructures offered many looks at the future of data storage, including unique fabrication technology used to make heads with state-of-the art sensors, and the challenges of "bit patterned media." Several interesting presentations also delved into medical and biotech applications of magnetic nanoparticles.

Show them the money: K&S, ASML, Brooks making moves with stocks, notes

Thu, 5 May 2007
May 31, 2007 - A trio of semiconductor equipment firms have made a range of moves to shore up their balance sheets, boost capital and return profits to shareholders, through several transactions involving shares and convertible notes.

SEMI: Heavy 1Q capex pushes up April tool sales

Thu, 5 May 2007
May 23, 2007 - Heavier capex in 1Q from several large IDMs helped push up sales as well as orders for semiconductor manufacturing equipment from North America-based suppliers, according to the latest monthly data from SEMI.

The case for leasing equipment

Wed, 5 May 2007
A ConFab session on "Capital Equipment: Alternative Financing Models" was kicked off by Craig Ignaszewski, director of capital equipment procurement, IBM, with discussion of the rationale for leasing vs. buying equipment. Meanwhile, Zvi Lando, VP at Applied Materials' Israel operation, suggested that upgrades might be capable of carrying leased metrology and inspection equipment through an extra process node.

Stanford, U-Cal algorithm helps design more reliable CNT circuits

Fri, 6 Jun 2007
Engineers from Stanford and the U. of Southern California have devised a method to design circuits containing carbon nanotubes (CNTs) that should work even when many of the nanotubes are twisted and misaligned.

Trio to collaborate on e-beam tech for sub-10nm devices

Mon, 6 Jun 2007
June 4, 2007 - GenISys GmbH, JEOL Ltd., and Cornell U. are partnering to develop advanced technologies for direct-write e-beam data preparation and electron process correction technologies for nanometer-range structures.

June 2007 Exclusive Feature 1
FAB MANAGEMENT:
A revolution is needed to tackle the commoditization of equipment design

Fri, 6 Jun 2007
By Mark Danna, Owens Design, Fremont, California, USA

Much has been written recently about the escalating cost of R&D funding required by semiconductor equipment OEMs in order to stay on the IC development trajectory required by the ITRS and Moore's Law. The gap in what is required and what can be supplied, based on the current OEM business model, has shown that this deficit could be as high as $9.3 billion by the year 2010 [1].

MEMC buying back $500M in stock

Thu, 5 May 2007
May 17, 2008 - MEMC Electronic Materials Inc. says it has authorized a share repurchase program for up to $500 million of its shares. Specific timing and amounts were not disclosed; the company said they would vary depending on market conditions and other factors.

Japanese valve maker expands Korean production, eyes US market

Thu, 5 May 2007
May 17, 2007 - Vtex Corp., a unit of Hitachi Zosen that makes specialty valves for semiconductor equipment, will spend 100 million yen (~US $831,000) to tool up a five-year-old maintenance location in Seoul, South Korea, in order to take aim on new business in the US

Mentor buys place-and-route firm Sierra Design

Mon, 6 Jun 2007
June 11, 2007 - Mentor Graphics has acquired Sierra Design Automation for $90 million in a half-and-half cash/stock deal, bolstering its design offerings. Mentor says the deal will be "slightly accretive" for FY07 (ending Jan.31 2008), and shave about $0.02 off of its anticipated FY08 earnings.

BASF, IBM to make 32nm IC materials

Mon, 6 Jun 2007
June 25, 2007 - BASF and IBM have signed a joint development agreement for electronic materials to be used in 32nm IC manufacturing by 2010, leveraging IBM's semiconductor process development and BASF's expertise in chemicals and nanotechnology.

NXP's Manocha on manufacturing: Time for new alliances to share risks and rewards

Mon, 5 May 2007
While the semiconductor industry continues to promise ever higher rewards (with high-single-digit CAGRs for many years to come), few companies will be able to survive the increasing risks of competing in the market unless they form novel heterogeneous manufacturing alliances, similar to the research partnerships that have proven successful in managing escalating R&D costs, according to Ajit Manocha, EVP and CMO of NXP, keynote speaker kicking off this year's ConFab event.

Intel: No more lead in future microprocessors

Tue, 5 May 2007
May 22, 2007 - Intel Corp. says that its future processors, starting with its 45nm line utilizing high-k dielectrics and metal gates (HK+MG), will incorporate 100% lead-free packaging designs, including pin grid array, ball grid array and land grid array. Next year the company plans to transition its 65nm chipsets also to 100% lead-free technology.

Japan News: CNTs in antistatic rubber make cleaner cleanrooms

Thu, 5 May 2007
May 17, 2007 - A Japanese firm says that adding carbon nanotubes to antistatic rubber, used to make test benches and transport trays, can improve the strength of the base material and prevent particles from scattering around the cleanroom, notes the Nikkei Business Daily.

Analyst: Intel pushing out more chip orders

Fri, 6 Jun 2007
June 8, 2007 - Intel Corp. appears to be pushing out all orders and shipments for equipment relating to the upgrade of its fab in New Mexico from 200mm to 300mm-compatible, just three months after announcing it would make that facility into its fourth 45nm production site, according to an analyst report.

Rohm & Haas, Harvard ink ALD partnership

Tue, 3 Mar 2007
March 27, 2007 - Rohm and Haas Electronic Materials has agreed to license technology from Harvard University's Office of Technology Development for manufacturing and marketing new metal amidinate compounds used in atomic-layer deposition (ALD) of thin films of metal and metal compounds for 45nm and below semiconductor processes.

SEMATECH uses Bede x-ray metrology system for materials evaluation

Fri, 3 Mar 2007
March 16, 2007 - Bede X-ray Metrology has announced that SEMATECH will use a Bede x-ray metrology system to evaluate novel semiconductor materials needed for the 45nm and 32nm technology nodes and beyond.

Researchers go into the deep for new electronic device inspiration

Thu, 3 Mar 2007
March 15, 2007 - According to research reported by the Georgia Institute of Technology, the 3D shells of tiny ocean creatures known as diatoms could provide the foundation for novel electronic devices.

TSMC and NEXX Systems form JDP for Cu plating

Wed, 3 Mar 2007
March 14, 2007 - Packaging equipment developer NEXX Systems has entered into an ongoing joint development program (JDP) with Taiwan Semiconductor Manufacturing Company Ltd. (TSMC). The JDP represents a collaborative effort to assess, develop, optimize, manufacture, and/or market electrodeposition processes using NEXX's Stratus system, including through silicon vias (TSV), wafer-level chip-scale packaging, and redistribution layers.

Nanometrics tabs Imago's Stultz to reverse integration "challenges"

Mon, 8 Aug 2007
August 6, 2007 - Nanometrics Inc. has appointed Timothy Stultz, former president/CEO of Imago Scientific Instruments, as its new CEO, taking over for Bruce Rhine who held the spot since March and move to the position of chairman, in a culmination of moves in what the company admits has been a year of "challenges."

Nanometrics shuttering Soluris facility, consolidating production in Asia

Wed, 3 Mar 2007
March 21, 2007 - Nearly one year to the day after acquiring overlay metrology firm Soluris Inc., metrology equipment supplier Nanometrics Inc. says it is closing the firm's Concord, MA facility and consolidating all of its overlay metrology production at a facility in Asia.

DISCO, Ultratech leaders named SEMI emeritus directors

Wed, 3 Mar 2007
March 21, 2007 - Kenici Sekiya, former president/CEO/chairman of DISCO Corp., and Arthur Zafiropoulo, chairman/CEO of Ultratech Inc., have been appointed emeritus members of the SEMI board of directors, in recognition of their service to SEMI and the semiconductor industry.

SEMI reports 2006 global semiconductor equipment sales of $40.47B

Mon, 3 Mar 2007
March 19, 2007 - SEMI today reported that worldwide sales of semiconductor manufacturing equipment totaled $40.47 billion in 2006, compared to $32.88 billion in 2005, representing a year-over-year increase of 23 percent.

SEMI: Equipment demand remains steady

Fri, 3 Mar 2007
March 16, 2007 - North American-based manufacturers of semiconductor equipment posted $1.65 billion in orders in February 2007 (three-month average basis) and a book-to-bill ratio of 1.05 according to SEMI. The bookings figure is about one percent under the final January 2007 level of $1.67 billion and about 28 percent above the $1.29 billion in orders posted in February 2006.

BOC trims tool cleaning/refurbish businesses

Tue, 8 Aug 2007
August 28, 2007 - Edwards (nee BOC Edwards) has sold "the majority" of its "Kachina" semiconductor equipment parts cleaning/refurbishment business to Applied Materials for an undisclosed sum, and its stake in another part of the business in Taiwan, in order to focus on "profitable growth" in its core vacuum and abatement areas.

K&S hikes sales outlook on orders influx

Wed, 9 Sep 2007
September 5, 2007 - Kulicke & Soffa Industries Inc. says revenues for its September quarter will be about 6.6% higher than initially thought, to $226 million, primarily due to more orders for its wire bonding equipment from large subcons.

MEMC cuts 3Q outlook due to TX site outage

Tue, 9 Sep 2007
September 4, 2007 - "Abrupt" shutdowns and delays caused by a "construction incident" at its Pasadena, TX facility has caused MEMC Electronic Materials to reduce its 3Q07 sales by about 5% below its $500 million target, though the company says it will likely recover those sales in 4Q.

Outsourcing spreads for process development and manufacturing

Tue, 8 Aug 2007
Chipmakers are turning to collaborations and partnerships to help manage escalating costs, as well as compressed cycle times and margins brought by "consumerization." Part of their strategy involves expanding their use of outsourcing, especially for process development. Speakers at a SEMICON West panel discussed this increased interest in outsourcing, citing the benefits of flexible capacity, better IP management, and assurances that outsourcing is viable even in an industry slowdown.

SEMI: 2Q tool sales eke single-digit growth, thanks to Taiwan and China

Wed, 8 Aug 2007
August 15, 2007 - Worldwide sales of semiconductor manufacturing equipment rose 3% in 2Q07 vs. the prior quarter, but that small growth was entirely on the backs of heavy investments in Taiwan and China mainly for memory operations, according to the latest data from SEMI and the Semiconductor Equipment Association of Japan (SEAJ).

Qimonda expands backend facility in China

Mon, 3 Mar 2007
March 12, 2007 - Qimonda AG, the former memory unit of Infineon, has announced the planned expansion of its existing facility for the assembly and testing of memory ICs (backend) in China's Suzhou Industrial Park.

CCMP agrees to acquire BOC Edwards' vacuum and semi equipment biz

Mon, 3 Mar 2007
March 12, 2007 - Private equity firm CCMP Capital has reached agreement with The Linde Group, the global gases company, to acquire BOC Edwards, a leading manufacturer of vacuum equipment. The deal is valued at just over US$900M.

Varian hikes stock buyback plan

Fri, 3 Mar 2007
March 2, 2007 - Varian Semiconductor Equipment Associates Inc. says it has increased the amount of funds to expend in its stock repurchase program from $300 million to $400 million, about half of which remains available for purchases.

Nanometrics ties off more asset sales

Mon, 8 Aug 2007
August 27, 2007 - Nanometrics says it has completed the sale of facilities in Narita, Japan, related to the flat-panel display business that it sold in 2005 and "had sat unutilized" ever since. Also sold was a residential condo near the company's headquarters in Milpitas, CA. Together the sales will add about $2 million in cash and both reduce debt and add income of approximately $1.2 million in 3Q07.

AlGaN firm touts UV sensor for chips

Fri, 8 Aug 2007
August 31, 2007 - Algan KK, a spinoff from Japan's Doshisha U. building devices with aluminum gallium nitride (AlGaN) semiconductor materials, reportedly has developed a highly-sensitive and tunable sensor for UV radiation that's twice as reliable as a silicon-based device, with anticipated application in the semiconductor industry

Hynix picks ISi's ZRAM for DRAMs

Mon, 8 Aug 2007
August 13, 2007 - Hynix Semiconductor Inc. will use Innovative Silicon Inc.'s (ISi) ZRAM high-density memory IP for its ZRAM chips, the first company to license the technology for DRAMs (AMD is using it for microprocessors).

Report: Taiwan packaging houses expanding bonder capacity

Fri, 9 Sep 2007
September 21, 2007 - Taiwan-based packaging houses are ramping up orders for wire bonders to meet demand from networking, consumer, and PC segments, according to a Digitimes report citing "industry and company sources."

SEMI: Tool demand still mired in slump

Thu, 9 Sep 2007
September 20, 2007 - After sliding to an eight-month low in July, semiconductor equipment orders slid even further in August to their lowest levels in a year and a half, and the B:B demand indicator is even more sluggish, according to data from SEMI.

Fujifilm buys Air Product's photoresist biz

Sat, 9 Sep 2007
September 14, 2007 - Fujifilm Corp. says its electronic materials division has acquired Air Products' OptiYield positive photoresist developer line. Terms of the deal were not disclosed.

Analyst: Chip tool market to rise modestly after 3Q trough

Thu, 10 Oct 2007
October 25, 2007 - After touching a trough in 3Q07, semiconductor equipment sales should head back up with small positive growth over the next several quarters, according to market analysis firm The Information Network.

TI's Stork jumps ship, lands at AMAT

Thu, 10 Oct 2007
October 25, 2007 - Hans Stork, formerly CTO and SVP of silicon technology development at Texas Instruments, has left his position to take on the role of CTO and group VP of Applied Materials' silicon systems group, responsible for the company's development of semiconductor equipment technologies.

IBM uncrates single-chip technology for mobile devices

Wed, 9 Sep 2007
September 12, 2007 - IBM says it has developed a new semiconductor technology that enables single-chip radio frequency (RF), integrating RF/analog functions including multimode/multiband RF switches, complex switch biasing networks, and power controllers.

New "e-jet" process targets lower-cost printed electronics

Fri, 9 Sep 2007
September 7, 2007 - Researchers at the U. of Illinois say they have devices an electrohydrodynamic jet ("e-jet") printing process that can produce patterns and functional devices with better resolution "significantly exceeding" other inkjet technologies, with potential application in large-area circuits, displays, and phototovoltaic modules.

Electron transport via quantum tunneling in metal insulator diodes

Tue, 9 Sep 2007
The humble diode is the focal point of what Phiar Corp. hopes will be the beginning of a future that includes non-semiconductor materials for junction transport via quantum tunneling -- and the first credible alternative to semiconductors since the vacuum tube era.

Pyxis banks on single-pass manufacturability and yield optimization

Tue, 9 Sep 2007
Building on its relationships with partners PDF Solutions, Ponte Solutions, and Brion Technologies, Pyxis Technology launched its Nexus Solution Suite on Sept. 25, having matured the product through implementation on 60 different designs, and working with a number of IC manufacturers including AMD and Chartered Semiconductor Manufacturing.

IBM enables single chip cell phones sans GaAs

Thu, 9 Sep 2007
As cell phone demand surges in emerging markets, IBM says it's seizing the last significant opportunity to reduce cell phones' cost and size by developing a low cost, integrated solution with multiple RF/analog functions on a single chip. IBM technologists explain to SST how this is being accomplished by replacing GaAs with SOI.

IMEC, GaTech seeking help for 32nm packaging interconnect work

Tue, 10 Oct 2007
October 15, 2007 - IMEC and Georgia Tech's Microsystems Packaging Research Center (PRC) say they want more help to research next-generation flip-chip and substrates to address "IC-to-package-to-board" packaging interconnect issues for ICs at the 32nm node and beyond.

BASF joins IMEC partners for 32nm IC cleaning

Mon, 10 Oct 2007
October 8, 2007 - BASF says it has joined IMEC's Industrial Affiliation Program to research and develop IC cleaning solutions and advanced interconnects, with an eye toward commercialization for the 32nm in 2010.

AmberWave, UCSB working on mesoporous materials

Fri, 10 Oct 2007
October 5, 2007 - AmberWave Systems and the U. of California/Santa Barbara (UCSB) have agreed to collaborate on and fund materials science research targeting mesoporous materials, in a move to open non-semiconductor business doors for the company.

Photovoltaic metallization paste materials, system

Thu, 10 Oct 2007
A new series of screen printable thick film materials from DuPont Microcircuit Materials, Bristol, UK, enables solar cell manufacturers to reduce their cost per watt by reportedly achieving higher cell efficiencies, higher production yields, and lower material consumption.

IBM creates method for measuring CNT performance

Tue, 10 Oct 2007
October 16, 2007 - A team of scientists at IBM's T.J. Watson Research Center say they have used Raman spectroscopy to measured the electron density in <2nm-dia. carbon nanotubes (CNT) by examining the interactions between electrons and phonons. The work will help better gauge how the CNTs release heat and impede electrical flow, thus measuring their suitability for use in future semiconductors.

SEMI: Tool demand slowing down significantly

Fri, 10 Oct 2007
October 19, 2007 - The latest monthly figures are in for semiconductor equipment demand, and the data is ugly just about any way you slice it. Bookings are -25% since a peak in May, with Y-Y % declines at a two-year low -- and the M-M drop in billings is the worst in nearly five years.

Mattson prez/COO retiring, CEO Dutton taking back reins

Thu, 11 Nov 2007
November 15, 2007 - Robert MacKnight, president of Mattson Technology since mid-2005 and COO since 2002, will retire at the end of March 2008, staying on for a transitional period as VP, the company announced. CEO David Dutton will take on the role of president, having held both roles from 2001-2005.

Report: TSMC, Hon Hai partnering in LEDs

Tue, 11 Nov 2007
November 6, 2007 - TSMC and Hon Hai Group are reportedly teaming up in the LED industry, via a business deal involving two partners.

Varian's wind project gets local nod

Tue, 11 Nov 2007
November 6, 2007 - After nearly three years of work and lobbying, Varian Semiconductor Equipment Associates Inc. says it has received approval from the Gloucester (MA) City Council to build two wind turbines, in a bid to dent one of its larger operating costs: the electric bill.

SOLAR NEWS: Taiwan, Japan firms placing solar bets

Tue, 10 Oct 2007
October 9, 2007 - A scan of recent headlines nets several stories of interest to the solar/photovoltaics sector, including growth plans by Japanese firms and Taiwan automation tool suppliers, and a US firm's expansion efforts through M&A in Europe.

Aixtron eyes CNT play through Nanoinstruments buy

Mon, 10 Oct 2007
October 8, 2007 - Germany's Aixtron AG has agreed to acquire UK-based startup Nanoinstruments, a manufacturer of chemical vapor deposition (CVD) and plasma enhanced CVD research systems for nanomaterials including carbon nanotubes, to extend its portfolio "in the mid- and long term within the nanotechnology application space."

Chip capex in the red next year, says Gartner

Wed, 10 Oct 2007
October 3, 2007 - Memory firms' investments have continued longer than expected, but the ride's about to get bumpy, with tool sales grinding to flat growth and capex backing into negative territory over the next year, according to new forecasts by Gartner Inc.

ATMI, IBM to work on next-gen resist strips

Wed, 12 Dec 2007
December 5, 2007 - ATMI and IBM have agreed to jointly develop and demonstrate advanced chemical formulations for highly implanted photoresist strip applications targeting 45nm, 32nm, and 22nm chipmaking processes.

Etch+clean: Lam Research widening scope with SEZ buy

Tue, 12 Dec 2007
December 11, 2007 - In a move that combines two of the most frequent semiconductor process steps (etch and clean), Lam Research has agreed to acquire Austrian firm SEZ Group for $568M in cash.

Report: Formosa eyeing 40% margins from solar cell packaging films

Tue, 12 Dec 2007
December 10, 2007 - The Formosa Plastics Group is spending about $4.6M on R&D of ethylene vinyl acetate (EVA) film, a packaging material for solar cell modules, in a bid to develop a high-margin business in a high-growth domestic sector, notes the Taiwan Economic News.

SEMI sees equipment slide in '08, high single-digit rebound in '09-10

Wed, 12 Dec 2007
December 5, 2007 - Semiconductor equipment sales this year are turning out slightly better than expected, according to SEMI's year-end forecast update, but the outlook for 2008 now indicates the equipment sector's first year in the red since 2005.

Rohm & Haas, SKC launch display films JV

Mon, 12 Dec 2007
December 3, 2007 - Rohm and Haas and SKC Co. Ltd. have officially opened their joint venture to make advanced optical and functional films for flat-panel displays, three months after announcing their partnership. Meoung-Han Kim will lead the business, having most recently served as managing director of SKC's display division.

PV solar: Looking for reality among the forecasts

Wed, 11 Nov 2007
What makes the photovoltaic solar cell industry so interesting and exciting is that the potential for growth is enormous, but realizing this opportunity is not straightforward. This is a competition between technologies, both within the PV alternatives and also from non-PV options. The way forward is also clouded by the significant involvement of politics, vested interests, and environmental lobby groups, where the "facts" may not always be what they seem.

Report from IMAPS: Biomedical devices present unique challenges, opportunities

Tue, 11 Nov 2007
The Body Worlds exhibit at The Tech Innovation Museum, where real cadavers are preserved to expose the makeup of the human body, provided a fitting backdrop to a half-day session on "Biomedical Materials, Devices, and Packaging" at IMAPS 2007, the International Microelectronics And Packaging Society's 40th annual international symposium on microelectronics.

IEDM news: NEC's low-k Cu-interconnect structure, and "channel-engineering" designs

Mon, 12 Dec 2007
December 16, 2007 - At this year's IEDM, NEC and NEC Electronics unveiled new design technology to optimize ultrashallow-junction channel structures in 32nm-and beyond LSIs, as well as a new composite film to enable a "full low-k" Cu interconnect structure with k reduced nearly a third compared to conventional barrier dielectrics.

JSR, IBM to work on new materials, self-assembly

Mon, 12 Dec 2007
December 10, 2007 - IBM and JSR Micro say they will worth together to explore new technologies for emerging semiconductor materials and processes, targeting next-generation lithography as well as self-assembly applications.

Japanese firm says new additive limits tin whiskers

Thu, 12 Dec 2007
December 5, 2007 - C. Uyemura & Co., an Osaka-based supplier of metal plating chemicals, has developed an additive that prevents formation of "tin whiskers" on circuit boards and other electronic components, according to the Nikkei Business Daily.

December 2007 Exclusive Feature #1: "In-the-trenches" roundup of ISMI

Fri, 11 Nov 2007
By Debra Vogler, Senior Technical Editor

The tradition of the ISMI Manufacturing Symposium as an "in the trenches" conference, by and for the people doing the actual day-to-day work in the fabs, continued Oct. 24-25 in Austin, TX. Particular attention was given to topics on yield improvement/productivity methodologies, ESH, and sustainability. Specific talks included how to fix litho "hot spots," cleaning wafer chucks without DI water or solvents...

2007 IEDM: Darts hit elements all over the period table

Tue, 12 Dec 2007
Over 1600 technologists are gathered in Washington, DC, to explore a wide range of innovative ideas at the 2007 International Electron Devices Meeting (IEDM). While current mainstream CMOS approaches, using strain engineering and metal/high-k dielectric gates, are covered extensively, a wide range of further out alternatives suggests that darts have been tossed at periodic table charts all over the world.

Intel at IEDM: 45nm HK+MG, variation mitigation, Moore's Law beyond 2015

Mon, 12 Dec 2007
Intel execs revealed highlights from select papers the company will be presenting at IEDM, including some details about its 45nm HK+MG transistors that incorporate a redistribution layer as part of a 9-layer copper interconnect. Also featured is the company's success in mitigating process variation to the extent that results in variation at 45nm is comparable to that achieved at 130nm. Additionally, quantum well FETs may be ready at ~2015 to extend Moore's Law scaling.

Interview: Chinese tool firm AMEC tips equipment, strategy

Tue, 12 Dec 2007
Gerald Yin, CEO and co-founder of equipment startup Advanced Micro-Fabrication Equipment Inc. (AMEC), discusses his company's foray into thin-film deposition and etch tools for leading-edge IC manufacturing, and the business strategy behind forming as a global semiconductor OEM based in China.

Reports: TSMC prepping AMD chips for 1H08

Mon, 11 Nov 2007
November 26, 2007 - A pair of reports from Wall Street analysts suggest Taiwan foundry TSMC will begin production for some AMD microprocessors as soon as 1H08.

Report: Intel's 45nm line causing overseas substrate spike

Tue, 11 Nov 2007
November 19, 2007 - The launch of Intel's new 45nm-based Penryn processors means more business from IC substrate makers with small volume production of new flip-chip substrate makers, reportedly causing several Asian firms to project a spike in business that isn't reflected in their capacity expansion plans.

China Sunergy ramps output, inks Canadian supply deal

Tue, 11 Nov 2007
November 19, 2007 - China Sunergy Co. Ltd. says it has as ramped to mass production of selective emitter cells, and entered into various agreements to supply up to 25MW of solar cells to Canadian Solar in 2008.

SEMI: Equipment demand still in doldrums

Sat, 11 Nov 2007
November 16, 2007 - A month after semiconductor equipment demand slid to some significant lows in several areas, data for the most recent month shows things haven't gotten any better, and in fact may be a little worse.

Nikon, Dainippon Screen to expand chipmaking tech alliance

Fri, 11 Nov 2004
November 5, 2004 - Dainippon Screen Mfg. Co. and Nikon Corp. have said they will expand the scope of their joint study on advanced semiconductor manufacturing systems, according to Jiji Press Ltd.

NA semi industry posts September b-to-b of 0.96

Tue, 10 Oct 2004
October 19, 2004 - North American-based manufacturers of semiconductor equipment posted $1.36 billion in orders in September 2004 (three-month average basis) and a book-to-bill ratio of 0.96, according to SEMI. A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.

MEMC and Solid State Technology to host Silicon Workshop in Boston area

Tue, 10 Oct 2004
October 5, 2004 - MEMC Electronic Materials Inc. has announced it will again co-sponsor the Understanding Silicon Materials Technical Workshop with Solid State Technology magazine on Oct. 19 in Boston, MA, which will detail the latest developments and advances in silicon wafers to all levels of semiconductor fab engineers and management.

Weak demand in China, Taiwan hurts Japan tool orders

Mon, 10 Oct 2004
October 4, 2004 - Worldwide orders for Japanese semiconductor manufacturing equipment in August fell 22.6% to 118.50 billion yen ($1.08 billion), the lowest level in six months, due to declines in demand from Taiwan and China.

Japanese equipment demand slides, but still clinging to Y-Y growth

Wed, 12 Dec 2004
December 8, 2004 - Demand for Japanese semiconductor manufacturing equipment continues to slide as the market sinks further into a lull entering the end of the calendar year, according to data from the Semiconductor Equipment Association of Japan (SEAJ).

NA semi equipment industry posts November B-to-B ratio of 1.00

Fri, 12 Dec 2004
December 17, 2004 - North American-based manufacturers of semiconductor equipment posted $1.35 billion in orders in November (three-month average basis) and a book-to-bill ratio of 1.00 according to the SEMI's November 2004 Book-to-Bill Report.

B-to-b for Japanese chipmaking equipment manufacturers 0.91 in October

Tue, 11 Nov 2004
November 23, 2004 - The book-to-bill ratio for Japanese chipmaking equipment manufacturers came in at 0.91 in October, below the key 1.00-mark, according to the Semiconductor Equipment Association of Japan (SEAJ), reported the Nihon Keizai Shimbun America.

NA semi equipment industry posts 0.96 October b-to-b

Tue, 11 Nov 2004
November 23, 2004 - North American-based manufacturers of semiconductor equipment posted $1.39 billion in orders in October 2004 (three-month average basis) and a book-to-bill ratio of 0.96, according to SEMI.

Global chipmaking gear sales up 50% in Sept.

Mon, 11 Nov 2004
November 15, 2004 - Global sales of chipmaking equipment in September rose 50% from a year before to $3596 million, a 14th straight year-on-year increase, as demand in Taiwan and South Korea grew sharply, a SEMI-SEAJ industry survey showed, said Jiji Press Ltd.

Feds launch nano classification project

Wed, 11 Nov 2004
November 3, 2004 - The US Patent and Trademark Office (USPTO) has created its own registration category for nanotechnology, covering applied research and technology development requiring 100nm or below and at least one dimension.

Robotic Vision Systems files Chapter 11 bankruptcy petition

Mon, 11 Nov 2004
November 22, 2004 - Citing a need to reorganize and raise cash while divesting itself of its Semiconductor Equipment Group, Robotic Vision Systems Inc. (RVSI) has announced that it has filed a voluntary petition under Chapter 11 of the US Bankruptcy Code. The company intends to continue operating its business as a "debtor in possession."

Honeywell acquires Mitsubishi's stake in GEM Microelectronic Materials

Tue, 11 Nov 2004
November 16, 2004 - Honeywell has acquired Mitsubishi Chemical America's 40% stake in GEM Microelectronics Materials, said Honeywell, giving the company sole ownership of the venture, which manufactures chemicals for the semiconductor industry. Financial terms of the deal were not disclosed.

UMC enhances 90nm manufacturability using Synopsys technology

Tue, 12 Dec 2004
December 21, 2004 - Synopsys Inc. and UMC have announced that UMC is using Synopsys' alternating aperture phase-shift mask (AA-PSM) technology to enhance manufacturability for its 90nm process.

Ex-Im Bank backs sale of US equipment to build Singapore plant

Tue, 11 Nov 2004
November 16, 2004 - The Export-Import Bank of the US (Ex-Im Bank) has approved a $652 million loan guarantee to support the export of US equipment and services to build a new silicon wafer fabrication facility in Singapore specializing in ASICs.

SEAJ: Orders of Japanese equipment are weakening

Mon, 11 Nov 2004
November 1, 2004 - Orders of Japanese semiconductor manufacturing equipment marked their first year-on-year decline in September after 16 months of consistent growth greater than 50%, according to data from the Semiconductor Equipment Association of Japan (SEAJ).

SEMI SMG reports record quarter for silicon wafer area shipments

Thu, 11 Nov 2004
November 4, 2004 - Worldwide silicon wafer area shipments in 3Q04 increased 1% sequentially and 25% from the 3Q03, according to SEMI's Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Orders for Japanese chipmaking equipment down 3%

Wed, 10 Oct 2004
October 20, 2004 - Orders for chipmaking devices manufactured in Japan in September, including those for export, declined 3% to about 110.7 billion yen ($1.02 billion), marking their first drop in 16 months, according to data released Tuesday by the Semiconductor Equipment Association of Japan, said the Nihon Keizai Shimbun.

SEMI sees NA equipment demand eroding, but sticks to its guns

Tue, 9 Sep 2004
September 21, 2004 - Demand for semiconductor equipment has slowed, but SEMI said its forecast for strong full-year growth won't change, and may in fact be too conservative.

Chipmakers' waning equipment appetite only temporary, says VLSI

Wed, 9 Sep 2004
September 22, 2004 - Worldwide semiconductor equipment sales have overshot orders for the first time in a year, and IC orders are falling back as well -- but VLSI Research claims the market simply is taking a pause after a big meal earlier in the year, and not pushing back from the dinner table.

Isonics receives funding

Mon, 2 Feb 2004
February 9, 2004 - Isonics Corp., Golden, CO, a developer of isotopically-engineered semiconductor materials, has closed a $2.2 million private placement to fund its radioisotope product line.

SEMI: North American equipment orders top $1B in December

Tue, 1 Jan 2004
January 27, 2004 - Semiconductor equipment orders in December 2003 surpassed $1.1 billion for the first time since August 2002, with overall figures continuing to indicate a healthy recovery is underway, according to Semiconductor Equipment and Materials International (SEMI).

IPC: Parity reigns for PCB market

Wed, 1 Jan 2004
January 28, 2004 - Electronics trade association IPC, Northbrook, IL, said the book-to-bill for North American interconnect manufacturing services (IMS) and printed circuit board (PCB) companies was 1.11 in December 2003, with orders up 12.2% and sales up 2.9% from a year ago.

Kulicke & Soffa, Nanometrics upgrade forecasts

Mon, 1 Jan 2004
January 9, 2004 - Kulicke & Soffa, Willow Grove, PA, Nanometrics, Milpitas, CA, joined a collection of semiconductor equipment companies who have said their latest quarterly performance will be better than expected.

MEMC signs licensing deals for strained-Si, SOI

Wed, 1 Jan 2004
January 21, 2004 - MEMC Electronic Materials, St. Peters, MO, has agreed to license strained silicon technology from European consortium IMEC, and bonded-SOI wafer transfer technology from Silicon Genesis Corp.

Equipment alliance becomes incorporated

Fri, 1 Jan 2004
January 16, 2004 - CapOneSource, a shared services alliance of 26 semiconductor equipment companies, has been incorporated as a limited liability company.

Veeco's Braun receives SEMI award

Mon, 1 Jan 2004
January 12, 2004 - Veeco chairman and CEO Edward Braun has been named as the recipient of Semiconductor Equipment and Materials International's (SEMI) annual Bob Graham award.

MEMC to buy out Taisil

Tue, 1 Jan 2004
January 27, 2004 - MEMC Electronic Materials Inc., St. Peters, MO, plans to acquire the remaining 55% of shares it does not own in Taisil Electronic Materials Corp., a Taiwanese manufacturer of polished and epitaxial silicon wafers.

Sumitomo to open wire bonding firm

Tue, 1 Jan 2004
January 27, 2004 - Sumitomo Metal Mining Co. Ltd. plans to create a new company in Shanghai to produce bonding wire for domestic chip assembly plants.

SEAJ: May delivered a mixed bag to chip equipment firms

Tue, 7 Jul 2004
June 6, 2004 - Japanese manufacturers of semiconductor equipment saw mixed results in May 2004, as slowing domestic demand was countered by a pickup overseas, according to the Semiconductor Equipment Association of Japan (SEAJ).

Amtech completes acquisition of Kokusai's BTI horizontal diffusion furnace operations

Wed, 7 Jul 2004
July 7, 2004 - Amtech Systems Inc. today announced that it has completed the previously announced acquisition of Japanese-owned Kokusai Semiconductor Equipment Corp.'s BTI semiconductor horizontal diffusion furnace operations and assets in the US and Europe.

Lam drops CMP, placing bets on etch

Thu, 7 Jul 2004
July 22, 2004 - Lam Research Corp., Fremont, CA, said it has ceased investment and development of its CMP systems. The company will continue to support its CMP installed base but is redeploying CMP resources, including R&D and workers, to its etch business.

TSMC rebrands offerings

Tue, 4 Apr 2004
April 13, 2004 - TSMC has realigned its process technologies into two classes of "technology platforms" in order to add other features and services, and claims to have produced the industry's first fully-functional 65nm SRAM module.

Global equipment demand tails off, says VLSI

Wed, 3 Mar 2004
March 17, 2004 - Worldwide orders and sales of semiconductor equipment exceeded expectations in February 2004 but were below January's levels, according to VLSI Research.

SEAJ: Backend leads Japan equipment, frontend showing life?

Tue, 3 Mar 2004
March 2, 2004 - Demand for Japanese-made semiconductor equipment continues to be led by backend operations, but signs of a shift may be starting to appear, according to the latest figures from the Semiconductor Equipment Association of Japan (SEAJ).

ASMI setting up Singapore wafer plant

Thu, 8 Aug 2004
August 19, 2004 - ASM International, Bilthoven, The Netherlands, plans to invest more than $29 million to set up Singapore's first wafer processing facility.

Clariant agrees to sell AZ Electronic Materials to Carlyle

Mon, 7 Jul 2004
July 26, 2004 - Clariant has agreed to sell its AZ Electronic Materials unit to The Carlyle Group for a total transaction value of CHF 518 million (US$409 million). The acquisition is expected to close in Autumn 2004, and is subject to approval by the relevant competition authorities.

Global equipment demand not slowing down, says VLSI

Tue, 7 Jul 2004
July 20, 2004 - The latest snapshot of worldwide semiconductor equipment demand from VLSI comes with some new changes, but the story remains the same: sunny skies, and no clouds visible on the horizon.

SEMI to Wall Street naysayers: Equipment growth's not done yet

Tue, 7 Jul 2004
June 20, 2004 - Wagging its finger at Wall Street, Semiconductor Equipment and Materials International (SEMI) says growth marches on in the semiconductor equipment sector, and SEMI is presenting data to prove it.

PennWell announces new semiconductor industry event

Wed, 7 Jul 2004
PennWell Corp., publisher of Solid State Technology, recently announced a new semiconductor industry event, The ConFab, to be held at the Venetian Hotel in Las Vegas on May 15-18, 2005.

SEMICON West: Frontend and backend together again?

Mon, 5 May 2004
May 24, 2004 - Semiconductor Equipment and Materials International (SEMI) officials are looking at numerous ways to add value to the SEMICON shows, including the possibility of re-unifying SEMICON West under one roof, according to an exclusive WaferNews report.

April chip equipment demand: Keeping the faith alive

Fri, 5 May 2004
May 21, 2004 -- A strong influx of orders from Applied Materials helped boost North American demand for semiconductor manufacturing equipment in April, a sign that the market isn't quite ready to apply the brakes, according to Semiconductor Equipment and Materials International (SEMI).

Cree and Sumitomo sign contract for $160 million of LED chips

Tue, 5 May 2004
May 18, 2004 -- Sumitomo Corp. has agreed to purchase $160 million of Cree Inc.'s light emitting diode products during Cree's fiscal year ending June 2005, subject to end customer demand and other terms and conditions.

Japanese equipment makers' sales tip the scales

Wed, 5 May 2004
May 19, 2004 -- Orders and sales of Japanese-made semiconductor equipment topped three-year highs in March 2004, pushing the book-to-bill ratio below the parity level for the first time since last summer.

VLSI: Industry overheated in 2H03

Thu, 3 Mar 2004
March 18, 2004 - The semiconductor equipment industry "clearly outpaced" the chip sector in 2H03, with nearly 2x the bookings and 3%-4% better revenue growth, according to VLSI.

SIA adds research program

Wed, 3 Mar 2004
March 17, 2004 - A fifth research center has been added to the $20 million Focus Center Research Program (FCRP), a collaborative effort including the SIA, 30 universities, semiconductor equipment and materials firms, and the federal government.

MEMC updates 300mm plans

Tue, 3 Mar 2004
March 30, 2004 - MEMC Electronic Materials Inc., St. Peters, MO, said it achieved 300mm capacity of 50,000 wafers/month in 1Q04, and expects to match that output in 2Q04.

North American equipment firms open strong in 2004, says SEMI

Wed, 2 Feb 2004
February 25, 2004 - Semiconductor equipment orders and sales continued to show strength in January 2004, with both topping $1 billion for the first time in nearly three years, according to Semiconductor Equipment and Materials International (SEMI).

VLSI: Global equipment orders show an Asian flavor

Tue, 2 Feb 2004
February 25, 2004 - Worldwide manufacturers of semiconductor equipment followed up their banner year in 2003 right where they left off, showing "surprisingly strong" sales in the typically slow January period, according to VLSI Research.

Chipmakers tout Black Diamond, Applied describes new lowk technology

Wed, 2 Feb 2004
February 11, 2004 - Eight chipmakers were on hand recently in San Francisco, presenting their end products manufactured at the 90nm node using Applied Materials' Black Diamond lowk dielectric film on the company's Producer SE platform.

VLSI: Orders down, sales up, capacity still tight

Wed, 6 Jun 2004
June 16, 2004 - Demand fell for the second consecutive month in May, but an increase in shipments kept alive a nine-month streak of parity levels, according to the latest data from VLSI Research.

SEMI reports 1Q04 semi equipment billings increase to $9.14B

Wed, 6 Jun 2004
June 16, 2004 - SEMI has reported that worldwide semiconductor manufacturing equipment billings reached US$9.14B in the first quarter of 2004. The figure is 65 percent above the same quarter a year ago and 42 percent above the billings figure for the fourth quarter of 2003.

Nantero teaming with LSI Logic on carbon nanotube project

Mon, 6 Jun 2004
June 7, 2004 -- Nantero Inc., Woburn, MA, says that it is teaming with LSI Logic Corp., Milpitas, CA, to develop semiconductor process technology, expediting the effective utilization of carbon nanotubes in CMOS fabrication.

Japan's equipment makers continue momentum into new fiscal year

Thu, 6 Jun 2004
June 2, 2004 - Japanese chipmaking equipment firms closed their fiscal 2004 books with a bang in March, but business didn't slow down in the first month of the new business year, according to the Semiconductor Equipment Association of Japan (SEAJ).

Novellus to acquire Germany's Peter Wolters AG

Thu, 6 Jun 2004
June 2, 2004 -- Novellus Systems Inc. has signed an agreement to acquire Peter Wolters AG, a privately held manufacturer of high-precision machine manufacturing tools headquartered in Rendsburg, Germany

Renesas purchases two Tokyo fabs from Hitachi

Tue, 6 Jun 2004
May 31, 2004 -- Renesas Technology Corp. has purchased two semiconductor plants located in the Tokyo suburb of Ome from Hitachi Ltd. for 1.2 billion yen, the Nihon Keizai Shimbun recently reported, citing sources familiar with the matter.

IEEE, SEMI sit at MEMS table

Mon, 6 Jun 2004
June 7, 2004 - SEMI and IEEE have signed an agreement to support each other's efforts in creating nanotechnology and microelectromechanical systems (MEMS) standards, the first standards collaboration between the two organizations.

EV Group opens second center in Japan

Tue, 8 Aug 2004
August 31, 2004 - EV Group (EVG), a supplier of wafer-bonding and lithography equipment, has opened a second customer-support center in Japan with a significant increase in engineering staff to better serve its growing customer base in that country.

SEMI: July equipment demand slows, but stable growth bodes well

Wed, 8 Aug 2004
August 25, 2004 - Demand for semiconductor manufacturing equipment remains strong, although clearly it's slowing down -- but don't reach for the panic button just yet, according to SEMI.

SEMI reports another record quarter for silicon shipments

Tue, 8 Aug 2004
August 24, 2004 - Worldwide silicon wafer area shipments increased 6% sequentially in the 2Q04 and 27% from the 2Q03, according to the SEMI Silicon Manufacturers Group in its quarterly analysis of the silicon wafer industry.

Luxxon awards gas delivery system contract to Praxair Chemax

Mon, 8 Aug 2004
August 23, 2004 - Praxair Chemax Semiconductor Materials Co. Ltd., a joint venture between Praxair Inc. and China Petrochemical Development Corp., has been awarded a contract by LED manufacturer, Luxxon Technology Corp.

VLSI: Slowdown taking hold, keeping downturn at bay

Thu, 8 Aug 2004
August 19, 2004 - The unusually strong post-holiday performance earlier this year is being felt all the way through midsummer, and the semiconductor equipment industry may end up holding off a downturn for at least another year, according to the latest data from VLSI Research.

SEAJ: Summer heating up Japanese equipment sales

Mon, 8 Aug 2004
August 2, 2004 - Cries of an impending slowdown in equipment demand weren't enough to dampen the Japanese equipment industry, which flared back to life in June by posting the most order value in three and a half years.

Isonics to acquire EnCompass Materials Group

Tue, 4 Apr 2004
April 27, 2004 - Isonics Corp. has signed a letter of intent to acquire the silicon-wafer-manufacturing business and related assets from EnCompass Materials Group Ltd., Vancouver, WA, reports Health & Medicine Week.

Euro firms combine for MEMS packaging

Tue, 4 Apr 2004
April 20, 2004 - Alphasem AG, a Swiss supplier of die attach equipment, has acquired Sister Semiconductor Equipment GmbH (SSE), Singen, Germany, in an effort to expand into both upstream and downstream processes.

NA semi equipment industry posts August B-to-B ratio of 1.00

Fri, 9 Sep 2004
September 17, 2004 - North American-based manufacturers of semiconductor equipment posted $1.52 billion in orders in August (three-month average basis) and a book-to-bill ratio of 1.00 according to SEMI. A book-to-bill of 1.00 means that $100 worth of orders were received for every $100 of product billed for the month.

Japan figures show slowing growth, but demand still strong

Thu, 9 Sep 2004
September 9, 2004 - The latest monthly data from the Semiconductor Equipment Association of Japan (SEAJ) provide more evidence of strong, yet slowing, demand for semiconductor manufacturing equipment.

Hitachi, Matsushita, Toshiba announce LCD panel alliance

Wed, 9 Sep 2004
September 1, 2004 - Hitachi Ltd., Matsushita Electric Industrial Co., and Toshiba Corp. said that they will jointly produce LCD panels for flat-panel TVs, according to the Nihon Keizai Shimbun America Inc. This joint venture will build a plant at Hitachi Displays Ltd.'s site in Mobara, Chiba Prefecture, at an estimated cost of around 110 billion yen.

ASML, Zeiss to pay Nikon $145 million

Wed, 9 Sep 2004
September 29, 2004 - ASML and Nikon have finalized details of their patent settlement, announced in early September, regarding lithography equipment.

IMEC sees nano in industry's post-CMOS future

Thu, 9 Sep 2004
September 30, 2004 - The Interuniversities Microelectronics Center (IMEC) has launched a new program to find ways nanotechnology can replace and/or extend the life of advanced CMOS manufacturing technologies.

SEAJ: Japan equipment industry ends year with a bang

Wed, 5 May 2005
May 4, 2005 - Japanese semiconductor equipment manufacturers closed out their fiscal year on an up note, after what largely was a slumping year for their industry.

New antistatic plastic stays clear when bent

Wed, 5 May 2005
May 25, 2005 - Plastics processor Takiron Co. announced yesterday that it has begun marketing a newly developed plastic sheet that has antistatic properties and remains transparent even when bent into shapes like trays, reports the Nihon Keizai Shimbun.

Axcelis CEO Mary Puma elected chairman of the board

Mon, 5 May 2005
May 23, 2005 - Axcelis Technologies Inc. has announced that the company's board of directors has elected president and CEO Mary Puma, 47, to the position of chairman of the board. Puma, whose new title is chairman and CEO, succeeds Stephen Hardis, who has been named Axcelis' lead director.

CVD signs pact to purchase assets of First Nano

Tue, 5 May 2005
May 16, 2005 - CVD Equipment Corp. has signed a contract with First Nano Inc., of Carpinteria, CA, to purchase certain assets of its nanotechnology process development and equipment business. First Nano develops solutions for single and multiwall nanotube and nanowire synthesis and manufactures CVD process equipment suitable for the synthesis of a variety of carbon nanotubes, 1-D nanostructures, and nanomaterials.

Unaxis slashes costs, workforce

Thu, 5 May 2005
May 12, 2005 - Swiss chip equipment manufacturer Unaxis Corp. has announced "extensive restructuring" within its Leybold Vacuum business, with cutbacks in staff and development expected to cost more than $33 million in one-time charges.

Raymor begins production of carbon nanotubes

Tue, 5 May 2005
May 10, 2005 - Raymor Industries Inc. has announced that commercial production of single-walled carbon nanotubes (C-SWNT) has begun at its industrial facility in Montreal.

SEMI: 2004 equipment sales raced to #2 all-time

Fri, 3 Mar 2005
March 11, 2005 - The worldwide market for semiconductor manufacturing equipment expanded by nearly two-thirds in 2004, its second-highest performance ever behind the historic year 2000, according to Semiconductor Equipment and Materials International (SEMI).

Year-to-year global sales of Japan-made chipmaking gear decline

Thu, 3 Mar 2005
March 31, 2005 - Global sales of Japanese-made chipmaking equipment in February slid 5.2% from a year before to 113.5 billion yen (US$1.05 billion), the first decline in 17 months, said the Semiconductor Equipment Association of Japan (SEAJ), Jiji Press Ltd reported.

NA semi equipment industry posts Feb. 0.78 b-to-b ratio

Fri, 3 Mar 2005
March 18, 2005 - North American-based manufacturers of semiconductor equipment posted $1.03 billion in orders in February (three-month average basis) and a book-to-bill ratio of 0.78, according to the February 2005 Book-to-Bill Report published today by SEMI.

SEMI reports $37.1B in 2004 global semi equipment sales

Fri, 3 Mar 2005
March 11, 2005 -- Worldwide sales of semiconductor manufacturing equipment totaled $37.08 billion in 2004, representing a year-over-year increase of 67.1%, said SEMI in its Worldwide Semiconductor Equipment Market Statistics (SEMS) Report.

SEMI says 20 new fabs to be built in China by 2008

Fri, 6 Jun 2005
June 10, 2005 -- A new report indicates that 20 new fabs are expected to be built in China between 2005 and 2008, with many of the projects to be equipped with used and refurbished equipment. SEMI's China Capital Equipment and Electronic Materials Market Outlook also says that in 2004, new semiconductor equipment sales in mainland China reached US$2.73 billion, with used/refurbished equipment sales estimated at US$180 million.

IBM, Chartered, Samsung extend common design platform for 65nm processes

Wed, 6 Jun 2005
June 8, 2005 - IBM, Chartered Semiconductor Manufacturing, and Samsung Electronics Co. Ltd. are jointly developing design kits for the 65nm base and low-power processes. Specifically, the three companies will offer 65nm designers common design kits that consist of physical verification (design rule checking (DRC) and layout versus schematic (LVS) matching) and parasitic extraction (RCX) technology files.

New device removes nanoparticles from waste liquids

Wed, 6 Jun 2005
June 8, 2005 - KN Platz Inc., a member of the Sumitomo Metal Industries Ltd. group of companies, has developed a device that can remove solids as small as 10nm dia. from waste liquids with high efficiency, according to Nikkei English News.

Applied Materials files to establish holding company in China

Thu, 6 Jun 2005
June 2, 2005 - Applied Materials Inc. has announced its intention to form a holding company in China and to enhance its operations and capabilities in the country. The application for Applied Materials (China) Holdings Ltd. is pending approval by Chinese government agencies.

NEC unveils tiny photoelectric converter that fits between chips

Wed, 6 Jun 2005
June 1, 2005 - NEC Corp. has developed a photoelectric converter that is smaller than a 1 yen coin, enabling it to be integrated on the circuit boards used in routers and servers, which makes it possible to interconnect the chips on these boards with optical fibers instead of copper wires, according to Nikkei English News.

NA semi equipment industry posts April 05 b-to-b of 0.8

Fri, 5 May 2005
May 20, 2005 - North American-based manufacturers of semiconductor equipment posted $1 billion in orders in April 2005 (three-month average basis) and a book-to-bill ratio of 0.80, according to SEMI. A book-to-bill of 0.80 means that $80 worth of orders were received for every $100 of product billed for the month.

SEMI reports 1Q05 worldwide billings of $9.35B

Wed, 5 May 2005
May 11, 2005 - SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$9.35 billion in the 1Q05. The figure is 2.3% above the same quarter a year ago and 6.5% more than the billings figure for the 4Q04.

NASA looks to carbon to lighten spacecraft

Mon, 5 May 2005
May 2, 2005 - NASA is teaming up with Rice University to develop power cables out of carbon nanotubes to lighten the load in spacecraft. Under an $11 million research grant, Rice will try to come up with a way to produce specialized types of nanotubes that will measure about a meter and conduct electricity 10 times more efficiently than metal. Prototypes of the nanotubes are due in 2009.

SPIE REPORT: Will market demand catch up to fast immersion developments?

Mon, 4 Apr 2005
TSMC preps 193nm immersion 'risk' production; others still see no technical showstoppers

By J. Robert Lineback

The first wave of production-worthy 193nm immersion scanners now appears to be a shoo-in for at least part of the 65nm process generation and probably the entire 45nm node at decade's end, but industry managers and researchers speaking at the annual SPIE International Symposium on Microlithography attempted to rein in some of the unbridled enthusiasm with...

Study finds nanotech patent 'gold rush'

Mon, 4 Apr 2005
April 25, 2005 - More than 3800 US nanotechnology patents have been issued as of late March and another 1777 patents applications are pending, according to a study released April 21 that concludes a "gold-rush mentality" grips nanotechnology research.

Japan March chip equipment orders down 14.1% year-to-year

Wed, 4 Apr 2005
April 20, 2005 - Global orders for Japanese semiconductor manufacturing equipment fell 14.1% in March from a year earlier to Y115.38 billion, according to preliminary data released Tuesday by SEAJ, said the Nihon Keizai Shimbun.

NA semi equipment industry posts March b-to-b of 0.81

Wed, 4 Apr 2005
April 20, 2005 - North American-based manufacturers of semiconductor equipment posted $1.02 billion in orders in March 2005 (three-month average basis) and a book-to-bill ratio of 0.81, according to SEMI's March 2005 Book-to-Bill Report.

Si2 and SEMI announce partnership on DFM of ICs

Mon, 4 Apr 2005
April 18, 2005 - The Silicon Integration Initiative (Si2) and SEMI today announced a partnership agreement to address the increasing cost and complexities associated with design for manufacturability (DFM) of ICs. A number of both near-term and ongoing-term collaboration efforts are planned.

Global chipmaking gear sales down 2.5% in Feb.

Thu, 4 Apr 2005
April 14, 2005 - Global sales of chipmaking equipment in February fell 2.5% from a year earlier to 2,429.91 million dollars, an industry survey showed Wednesday, according to Jiji Press Ltd. It was the first year-on-year drop in 19 months, according to data compiled by the Semiconductor Equipment Association of Japan and Semiconductor Equipment and Materials International.

NA semi equipment industry posts May 05 b-to-b of 0.85

Fri, 6 Jun 2005
June 16, 2005 - North American-based manufacturers of semiconductor equipment posted $1.03 billion in orders in May 2005 (three-month average basis) and a book-to-bill ratio of 0.85, according to SEMI.

K&S co-founder passes away

Mon, 4 Apr 2005
April 11, 2005 - Albert Soffa, 84, co-founder of semi equipment supplier Kulicke & Soffa Industries (K&S), died Sunday, April 10.

ProMOS selects Varian's VIISta ion implanter

Fri, 4 Apr 2005
April 22, 2005 - Varian Semiconductor Equipment Associates Inc. has announced that it has won multiple orders for its single wafer VIISta HC high-current ion implanter from ProMOS Technologies Inc. ProMOS ordered the tools to support the expansion of its 300mm memory fab in Taichung, Taiwan.

Korean scientists peel away nanotube size limits

Mon, 10 Oct 2005
October 24, 2005 - Researchers at South Korea's Pohang U. of Science and Technology have developed what they call the world's first subnanometer carbon nanotube with a diameter of 0.4nm.

SEMI awards 2005 honors

Fri, 10 Oct 2005
October 21, 2005 - Semiconductor Equipment and Materials International (SEMI) has announced the recipients of its 2005 SEMI North America and Lifetime Achievement awards. Bob Shillman, Bill Silver, and Marilyn Matz, the founders of Cognex Corp., received the North America honors in recognition of their contributions in machine-vision inspection for the semiconductor industry; and James S. (Jim) Koford will receive the Lifetime Achievement award ...

November 2005 Exclusive Feature: WAFER LEVEL TEST

Reliability testing using a highly parallel source-measure method

Mon, 10 Oct 2005
Pete Hulbert, Keithley Instruments Inc., Cleveland, Ohio

New semiconductor materials and shrinking device dimensions have made reliability testing increasingly important because the gate dielectric behavior of modern devices isn't well understood, requiring the development of new device lifetime models. However, traditional test methods are time consuming and not suitable for new materials and shorter development cycles. A new approach...

Intel to invest $650 million in NM fab

Tue, 10 Oct 2005
October 25, 2005 - Intel Corp. has announced plans to invest $650 million to increase the capacity of its 300mm wafer Fab 11X in Rio Rancho, NM. Construction and new tool installations are scheduled to continue through 2006, with production operations set to begin through the new expansion in early 2007. This investment will create more than 300 new manufacturing jobs.

SEMI reports B:B of 1.02 for September

Wed, 10 Oct 2005
October 19, 2005 - Semiconductor Equipment and Materials International (SEMI) has reported that North American-based semiconductor equipment manufacturers posted $1.09 billion in orders in September 2005 (a three-month average basis) and a book-to-bill ratio of 1.02. A B:B of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

MEMC keeps European silicon patent

Tue, 10 Oct 2005
October 18, 2005 - MEMC Electronic Materials Inc., St. Peters, MO, has received a favorable ruling from the Opposition Division of the European Patent Office regarding the manufacture and use of semiconductor-grade, single-crystal, defect-free silicon wafers having a diameter of 200mm or greater.

NA semi equipment posts January b-to-b of 0.80

Fri, 2 Feb 2005
February 18, 2005 -- North American-based manufacturers of semiconductor equipment posted $1.01 billion in orders in January 2005 (three-month average basis) and a book-to-bill ratio of 0.80, according to the January 2005 Book-to-Bill Report published today by SEMI. A book-to-bill of 0.80 means that $80 worth of orders were received for every $100 of product billed for the month.

Fujitsu to sell chip, LCD production equipment business to ULVAC

Tue, 2 Feb 2005
February 8, 2005 - Fujitsu Ltd. said Monday it has agreed to sell its wholly-owned subsidiary Fujitsu VLSI's semiconductor and liquid crystal display production equipment business to ULVAC Inc. on April 1, according to Kyodo News International.

Kyocera Chemical to sell automotive semiconductor encapsulant

Fri, 2 Feb 2005
February 4, 2005 - Kyocera Chemical Corp. is entering the automotive semiconductor materials business with an impact- and heat-resistant encapsulant for semiconductor chips mounted in automobiles. The company altered the molecular structure of the epoxy and phenol resins that are the primary components, adjusting the ratio of the resins used and adding nonflammable silica, according to the Nihon Keizai Shimbun.

February 2005 Exclusive Feature #2:
WASTE/EFFLUENT TREATMENT

Factoring the environment into wafer fab conversions

Wed, 1 Jan 2005
By Tom Cooper, Tim Higgs, John Harland, Terrence J. McManus*, Intel Corp., Chandler, Arizona

Increasingly, semiconductor manufacturing hurdles are being addressed with new materials and wafer processing techniques that present ever changing environmental challenges. However, process changes and the introduction of larger 300mm wafers also open up the opportunity ...

SEMATECH partners with Rohm and Haas to achieve 2.5 k effective system

Thu, 9 Sep 2005
September 29, 2005 - SEMATECH researchers have identified a dual damascene method for interconnect integration that could achieve an aggressive industry target for ultra low-k dielectric materials in semiconductor manufacturing. The two-level metal, dual damascene process uses two Zirkon interlayer dielectric (ILD) films from Rohm and Haas Electronic Materials to demonstrate a copper/ultra low-k (ULK) integration with a k-effective (keff) value of 2.5.

Leica's Semiconductor Equipment Division sold

Tue, 9 Sep 2005
September 27, 2005 - Golden Gate Capital has acquired the Semiconductor Equipment Division (SED) of Leica Microsystems AG. Terms were not disclosed. Leica Microsystems SED will continue to be led by the current management team and have a global customer base with manufacturing operations in Germany and the UK. A new name for the company will soon be established.

SEMI: Semiconductor equipment companies expect sales of US$32.95B in 2005

Thu, 12 Dec 2005
December 8, 2005 - The leading manufacturers of semiconductor equipment project 2005 sales to reach $32.95 billion, according to the just-released, year-end edition of the SEMI Capital Equipment Consensus Forecast.

Nano suppliers to double sales by 2010

Fri, 11 Nov 2005
November 18, 2005 - The markets for materials, tools, and equipment supporting development of nanoelectronics will more than double to $4.23 billion by 2010, led by development activities in five key areas of the electronics industry, including semiconductors and MEMS/NEMS, according to a new report from SEMI.

IEDM Conference news

Tue, 12 Dec 2005
December 6, 2005 - At the International Electron Devices meeting this week in Washington, DC, news includes: 1) Limited and Fujitsu Laboratories Ltd. have developed carbon nanotube-based heatsinks for semiconductor chips. 2) Freescale Semiconductor has demonstrated a transistor that overcomes many of the challenges associated with vertical multigate devices. 3) STMicrolectronics unvei