Multitest debuted the Quad Tech concept, next-generation vertical contact technology with a barrel-less architecture.
ACM Research Shanghai, Ltd., introduced the integrated Ultra iSFP stress-free polishing (SFP) semiconductor manufacturing tool for 65-45nm copper (Cu) interconnects, improving through silicon vias (TSV) with better heat dissipation.
EV Group (EVG) launched a suite of temporary bonding and debonding equipment modules that support ZoneBOND technology.
Brewer Science Inc. and EV Group (EVG) will both commercialize ZoneBOND technology for temporary wafer bonding, thin wafer processing, and debonding applications.
NEXX Systems shipped a Stratus electrochemical deposition tool to Nantong Fujitsu Microelectronics Co. Ltd. (NFME), based in Jiangsu province, China. NFME will use the Stratus for copper pillar and RDL advanced packaging applications.
MVTS Technologies opened new offices in San Jose, CA; Penang, Malaysia; and Hsinchu, Taiwan to support growing demand for test, assembly, and other IC production equipment and services among semiconductor manufacturers.
ERS uncrated the ERS AirCool 3 wafer thermal test system with modular options and easy integration into all major wafer prober systems.
At the IMAPS 44th International Symposium on Microelectronics in Long Beach, CA, Voya Markovich, well-known industry PCB and packaging expert, took over the reins as the organization
Steven J. Adamson, marketing specialist with Nordson ASYMTEK, received the Daniel C. Hughes, Jr., Memorial Award, for the greatest contribution to IMAPS and the microelectronics packaging industry.
EV Group (EVG) will work with Fraunhofer IZM's ASSID research center to develop temporary bonding/debonding technologies for thicker die structures, some as large as 600
Cascade Microtech Inc. debuted InfinityQuad, a multi-contact probe head capable of automatically probing aluminum (Al), copper (cu), or gold (Au) pads as small as 30 x 50
All Silicon System Integration Dresden (ASSID) installed an Altatech 300mm CVD tool for dielectric film deposition on advanced through silicon vias (TSV), with diameters as small as 10
DuPont Microcircuit Materials, part of DuPont Electronics & Communications, uncrated its DuPont GreenTape 9K5 low temperature co-fired ceramic (LTCC) packaging material, offering good dielectric constant properties for higher speed, frequency, and reliability applications.
Test equipment provider Multitest installed a MT9928 XM Gravity Test Handler at a semiconductor production facility after a 1-year+ benchmarking against two major competitors.
Tamar Technology shipped its first fully automated WaferScan system to a major semiconductor fab. The system performs TSV etch depth, deep trench depth, wafer thickness, photo-resist thickness, and hole diameter metrology.
IMAPS 2011, the 44th International Symposium on Microelectronics, will take place in less than one week at the Long Beach Convention Center. Ahead of the show, here are some of the highlights for attendees.
Seiko Epson Corporation introduced the IP-2000 inkjet semiconductor marking system to print identification data on the surface of a semiconductor package without the danger of damage from laser cutting
Cascade Microtech (NASDAQ:CSCD) completed the sale of its test socket manufacturing business for $550,000 to R&D Interconnect Solutions. Cascade's board of directors also authorized a stock repurchase program under which up to $2,000,000 of its common stock may be repurchased.
In a podcast interview with ElectroIQ.com, Ziptronix president & CEO, Daniel Donabedian, and company CTO, Paul Enquist, discussed both the Ziptronix wafer bonding technology and their partnership with Sony.
By R. Wayne Johnson, Ph.D., Auburn UniversityWhile $4/gal.gasoline prices have dropped, it is inevitable they will rise again. So what does this have to do with advanced packaging? A lot! While we hear discussions of alternate energy, we will continue to use oil for the foreseeable future. Electronics (and advanced packaging) are important for measurements during well drilling and for production management over the life of the well.
The SMTA will host conference events with Amkor, Research in Motion, and TechLead Corporation on package-on-package (PoP) 3D stacking at SMTA International (SMTAI), October 16-20 in Fort Worth, TX.
An IDM recently performed side-by-side comparisons of a Multitest Mercury test contactor and an "established contactor of an incumbent Asian competitor" during high-volume production package testing.
The annual Known Good Die (KGD) conference, taking place Nov. 10 in Santa Clara, CA, will address semiconductor die testing, assembly, manufacturing, and business challenges, with the tagline "KGD in an Era of Multi-Die Packaging and 3D Integration."
The 2011 iNEMI Roadmap, published by the International Electronics Manufacturing Initiative (iNEMI), includes a new chapter on MEMS and sensors, and an expanded chapter on packaging to include substrates discussions.
Nordson MARCH and Science College of Donghua University, Shanghai, China launched a joint laboratory for plasma research and education. The college and supplier will share equipment, research projects, personnel resources, and additional resources as needed.
The University of Waterloo, Ontario, through the Applied Research and Commercialization Initiative, is supporting several companies researching and developing new products. One company receiving aid from the school is Microbonds, maker of semiconductor bonding wire.
Multitest launched a 16-site tri-temp pick-and-place handler, the MT9510 x16. The platform can be kitted to test a range of semiconductor packages.
Industry efforts to transition from gold to copper wire are accelerating as prices for gold continue to spike to near record levels, notes TechSearch International in a new report.
Nomura Principal Finance Co. Ltd., a wholly owned subsidiary of Nomura Holdings Inc., transferred all the shares it owns in Eastern Co. Ltd. to Eastern.
Data I/O Corporation (NASDAQ: DAIO) debuted the RoadRunner3 in-line programming system, a just-prior-to-placement programming tool with modules to automate processes and eliminate operator interventions.
EV Group (EVG), wafer bonding and lithography equipment supplier, began a manufacturing capacity expansion at its Austrian headquarters, adding floorspace, equipment, worker comforts, and a state-of-the-art visitor area. EVG will hire about 100 new staff members as part of the expansion.
Nippon Micrometal Corporation (NMC) licensed their single-layer-palladium (Pd) coated copper (Cu) bonding wire for LSI packaging to Tanaka Denshi Kogyo K.K., bonding wire manufacturer and traditionally a competitor.
The new gold/tin (AuSn) process from Stellar Industries is ideally matched to Stellar’s proprietary CPU copper on AlN submounts with its sharp guillotine edge for precise edge alignments.
Multitest received its fifth full purchase order for its InCarrier device transfer system with InStrip test handling system adapted to metal frame-based carriers.
As gold becomes more expensive, copper wire bonding becomes more appealing for chip packaging. Reverse bonding, fine-pitch bonding, looping, second bonds, and other technologies are ramping on roadmaps, according to Kulicke & Soffa (K&S).
CEA-Leti, in a multi-partner project with SET, STMicroelectronics, ALES and CNRS-CEMES, will demonstrate high-alignment-accuracy chip-to-wafer structures made by direct metallic bonding. Such structures are required for high-performance 3D ICs, and possibly microelectronics, optoelectronics, or MEMS.
Jamal Izadian, co-founder & president of RFCONNEXT, makes the case for shaped membrane transmission lines (SMTL) for use in high-speed 3D packaging applications. SMTL supports and improves flip-chip, micro-bumping, wafer thinning, system-in-package (SiP), package-on-package (PoP), and other packaging processes by extending the bandwidth and high-speed limits of these technologies.
Camtek Ltd. (Nasdaq:CAMT; TASE:CAMT) received an order for multiple wafer inspection systems from one of the world's largest manufacturers of CMOS image sensors (CIS).
Palomar Technologies, precision microelectronics and optoelectronic packaging systems provider, will hold meetings at Stategies in Light to discuss its recent upgrades to high-brightness LED (HB-LED) assembly.
Hitachi Chemical filed a lawsuit against INNOX in Taiwan, alleging infringement on Hitachi Chemical's Taiwanese patent related to die bonding film used in semiconductor packaging processes.
Optomec opened its new and expanded Advanced Applications Lab and Product Development Facility in St. Paul, MN. The facility will help Optomec grow its Aerosol Jet additive manufacturing technology for advanced printed electronics applications.
The College of Nanoscale Science and Engineering (CNSE) and Applied DNA Sciences (APDN) are partnering to prevent the counterfeiting of computer chips.
Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Wedge Bonding for RF and Microwave Devices" at the Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging
Mitsubishi Heavy Industries launched a fully automated 12" (300mm) wafer bonding tool, Bond Meister MWB-12-ST, capable of producing 3D LSI circuits at room temperature. The 300mm bonder targets production of memory chips and MPUs.
Zymet introduced the CN-1736 reworkable underfill encapsulant for 0.4mm-pitch package-on-package (PoP) assemblies.
The SMTA released its call for presenters for SMTA International (SMTAI) 2012, October 14-18 in Orlando, FL. The association, along with Chip Scale Review magazine, also announced the keynote for the International Wafer-level Packaging Conference (IWLPC), held November 5-8, San Jose, CA.
Multitest qualified its UltraFlat process for high parallel vertical probe card tests. UltraFlat provides permanent overall PCB flatness for better wafer-level test.
Hesse & Knipps Inc. introduced its next-generation BONDJET BJ93X heavy wire bonder for back-end semiconductor assembly, targeting manufacturers of power semiconductors and automotive electronics.
Haruo Matsuno, president and CEO of Advantest Corporation (TSE:6857, NYSE:ATE) shares the company's major goals, including expansion into new measurement applications, utilization of cloud computing, and more.
NEXX Systems sold a 300mm Stratus electrochemical deposition (ECD) system to Powertech Technology for copper pillar bumps and re-distribution layers (RDL) fab, and possibly to make TSVs.
FormFactor Inc. (NASDAQ: FORM) introduced TrueScale Matrix probe cards for 200mm and 300mm Full Wafer Contact system-on-chip (SoC) test applications.
With many advanced packaging processes taking place on the semiconductor wafer, the traditional supply chain of front-end fab at the foundry and back-end fab at the packaging and test house is falling apart. The ConFab session,
As packaging has played a larger and larger role in chip performance, form factor, and capabilities, The ConFab has increased its focus on back-end processes. Cue
Aehr Test Systems (Nasdaq:AEHR) will install an additional FOX-1 full-wafer test system at a leading flash memory manufacturer.
The New York State Center of Excellence in Small Scale Systems Integration and Packaging at Binghamton University (S3IP), and Applied DNA Sciences will develop new ways to embed and authenticate DNA on various substrates. This may involve marking semiconductor packaging, and exploring rapid-reading technologies to screen chips.
New Japan Radio Co. Ltd. adopted Tanaka Denshi Kogyo KK
Rudolph Technologies Inc. will deliver 14 NSX Series 320 inspection systems to a large outsourced semiconductor assembly and test (OSAT) provider.
THE BEST rankings from VLSIresearch identify the highest-rated suppliers of wafer processing, assembly, and test equipment. The top 2 test equipment suppliers were just fractions apart in the rankings.
Applied Nanotech Holdings Inc. uncrated the THERCOBOND family of highly thermally conductive bonding and printed materials for power electronics and photonics packaging.
Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.
Bhavesh Muni took the helm as global business director for the Advanced Packaging Technologies business of Dow Electronic Materials, covering Dow's semiconductor packaging materials product portfolio and its manufacturing capabilities.
In 2012, the global IC substrate market will reach a value of USD8.67 billion, according to Research in China
The ASM iHawk Xpress Opto Wire Bonder from backend semiconductor assembly equipment supplier ASM Pacific Technology offers new innovations in transport, copper-wire bonding, and automatic rethreading.
Kulicke & Soffa broke ground on its Singapore global headquarters expansion, near the current leased headquarters location. A state-of-the-art facility in Serangoon will bolster the company
Heraeus introduced its high-reliability composite aluminum/copper (CucorAl) semiconductor bonding wire, which offers strong mechanical and electrical bonds to semiconductor pads, with good thermal properties.
Hitachi Chemical has granted Henkel a worldwide license for the manufacture and sales of certain dicing die attach film.
All the major semiconductor players are embracing 3D integration, says Simon Deleonibus. The CEA-Leti scientist and IEEE Fellow wants to see TSV mature and new technologies develop based on wafer bonding. He speaks with Debra Vogler.
Creative Materials Inc. announced a new series of pressure-sensitive tapes that suit use in the fabrication of solar cells and modules; to replace solder and/or conductive adhesive connections; or as bus bar materials for a wide variety of printed electronics applications, including touch panels, LCDs, electro-chromatic displays, and electro-luminescent displays.
Brush Engineered Materials Inc. (NYSE:BW) will change its name to Materion Corporation (NYSE:MTRN) and unify all of its businesses under the new name effective March 8, 2011.
SEMI named Thomas DiStefano, John W. Smith Jr., and Michael Warner as recipients of the 2010 SEMI Award for North America for contributions to the development and commercialization of Micro Ball Grid Array (μBGA) technology.
Environmental legislation in combination with device miniaturization will continue to drive packaging development efforts throughout 2011 and beyond, writes Doug Dixon from Henkel. And the paradigm of "smaller, thinner, more powerful" is challenging traditional design and assembly rules.
Nautic Partners has partnered with management to acquire Aavid Thermalloy LLC. Aavid designs and manufactures high-performance thermal management products used in a wide range of electronics systems and energy supplies.
CoorsTek Inc., technical ceramics manufacturer, completed its purchase of the advanced ceramics business of Saint-Gobain. CoorsTek adds manufacturing facilities and product lines such as silicon carbide for semiconductors.
The migration to the 22nm node is about more than just scaling down, it's also about scaling up with thinner devices stacked into a single package -- and these require new manufacturing considerations with wafer bonding playing a central role, writes Bioh Kim from EV Group.
SRC and researchers from Stanford University have developed a combination of elements that yields a unique nanostructure material for packaging. This advance should allow longer life for semiconductor devices while costing less than current state-of-the-art materials.
Dr. Phil Garrou reports on several talks and trends of note from the recent IMAPS meeting and Device Packaging Conference: the readiness of 3D IC toolsets, what's holding back Cu bonding; and rumors of interposers failing thermal tests.
The System LSI Division of Samsung Electronics Co. Ltd. has licensed the OptiML Zoom image enhancement solution from Tessera Technologies Inc. (NASDAQ:TSRA).
GE's prototype thermal interface material, developed with nanotechnologies, suits high-heat, high-reliability applications in mobile devices, aviation electronics, and other systems.
Amid questions about the impact of the Japan earthquake on electronics and semiconductor production, there's one angle that could directly affect the semiconductor packaging sector: BT resin shortages.
Hynix Semiconductor Inc., DRAM and flash memory supplier, joined SEMATECH's 3D Interconnect program at CNSE's Albany NanoTech Complex to address industry infrastructure and technology gaps in materials, equipment, integration and product-related issues for high-volume adoption of through silicon vias (TSV).
Docea Power, power and thermal analysis software supplier, released AceThermalModeler for generating compact thermal models of SoCs, 3D ICs, SiP devices, and complete boards.
With thermal issues accounting for half of all lighting failures, and costs prohibitive to widespread adoption, assembly and packaging are keys to improving LEDs. TechSearch International tracks LED packaging materials and methods, as well as reliability and package efficiency.
Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.
iNEMI will hold the industry kick-off for its 2013 Roadmap in an open workshop immediately following IPC APEX EXPO in San Diego, CA, March 1-2.
Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges.
Backend packaging equipment supplier Hesse & Knipps Inc. opened a West Coast Demo and Applications Laboratory at its manufacturer rep Chalman Technologies.
Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for LEDs and small power semiconductor die packaging.
Synova SA formed an OEM agreement with its partner Makino Milling Machine Co. Ltd., wherein Makino will manufacture Laser MicroJet (LMJ) tools based on Synova technology.
BTU International Inc. won multiple orders for PYRAMAX solder reflow ovens from semiconductor assembly and test subcontractors (SATS) in Asia.
Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.
SUSS MicroTec launched the XBC300 Gen2 high-volume 3D wafer processing tool for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers.
3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI).
Multitest launched its tri-temp 16-site pick-and-place platform, MT9510 x16, with an installation at a high-volume chip test site in Asia.
Tanaka Denshi Kogyo K.K., of Tanaka Precious Metals, will establish a production subsidiary for manufacturing copper bonding wire in Taiwan, with manufacturing ramp on February 1.
Keithley Instruments Inc. upgraded the capabilities of its Automated Characterization Suite Test Environment to ACS Version 4.4. The software is used with several Keithley instrument and system configurations for automated device characterization and reliability analysis.
2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic circuits. The Vectra E840i forms circuits on 3D injection moldings produced with an LDS process.
Presto Engineering, integrated semiconductor test and product engineering services provider, opened its newest Hub to serve the semiconductor design community, in Israel.
There are a few key attributes in new consumer electronics: a reduced footprint and/or profile, high electrical performance, fine-pitch design, custom features, and a low cost. Multi-row, wafer-level, flip-chip, and multi-chip packaging can meet these needs, say Unisem writers Rico San Antonio and Chris Stai. They compare the value of each packaging type.
Arthur Chait, president and CEO of EoPlex, describes the company’s high-volume print forming technology -- a lead carrier product called xLC-- and how it enables a cost-effective replacement for conventional quad flat pack no-lead (QFN) leadframes.
A fast-cure, low-shrinkage adhesive for optics and optical assembly, DYMAX OP-67-LS opto-mechanical adhesive cures in seconds for bonding of optical components. The product's low-shrink nature virtually eliminates movement during curing and subsequent thermal cycling.
Are we closer than we think to our needed mass production costs for silicon interposers? Phil Garrou gleans some insights from the year-ending RTI Architectures for Semiconductor Integration and Packaging conference.
Singapore's Institute of Microelectronics (IME) has launched a new multiproject wafer service for 2.5D through-silicon interposers, to provide a cost-effective platform for R&D prototyping and proof-of-concept in the technology.
Tezzaron Semiconductor has licensed patents regarding Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), for use in 3D memory.
Dr. Phil Garrou reports from the 2nd annual Georgia Tech 2.5D Interposer Conference: what's the market projection for silicon and glass interposers, what's preventing high-volume manufacturing, and is there a crossover with flat-panel display glass manufacturing?
Alchimer SA says it is seeking partnerships with various semiconductor equipment and materials companies as it welcomes two top execs: Bruno Morel is the company's CEO since May of this year, and product development director Fr
Deca Technologies has introduced a new chip-scale packaging (CSP) product line for applications where its existing wafer-level CSP option isn't a good fit. Details and analysis to come.
Teradyne uncrated its Magnum semiconductor test system with a proprietary scalable chassis design and tester-per-board architecture for high compound parallel test efficiency on consumer digital devices.
LTX-Credence Corporation (Nasdaq:LTXC) released the Diamondx test platform for ASSP and the DragonRF for RF device test. In addition, LTX-Credence launched a SerDes test instrument and new testing software.
TEL will acquire semiconductor packaging equipment supplier NEXX Systems. NEXX makes advanced deposition equipment, including ECD and PVD tools, for wafer-level packaging (WLP).
Presto Engineering selected an LTX-Credence Corporation (Nasdaq:LTXC) X-Series platform for testing wireless communications, automotive and industrial customer devices.
Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.
EV Group (EVG) welcomed Shin-Etsu Chemical into its open platform for temporary bonding/debonding materials supporting 3D semiconductor packaging.
ULVAC Inc. developed solder deposition processes for silicon device manufacturing, including power devices, that sputters solder to deposit it rather than printing or evaporating the materials. The 2 processes eliminate gold, or gold and nickel, from the step.
Dr. Phil Garrou, a contributing editor and regular blogger on Solid State Technology, shares the highlights of an Evolving 2.5D/3D Infrastructure panel he hosted at IMAPS Device Packaging. On the table: where TSVs and interposers are made, a TSV/interposer timeline and cost analysis, and the requirements of mobile electronics.
Kulicke & Soffa Industries Inc. (K&S, NASDAQ:KLIC) introduced its ConnX Plus high-speed ball bonder for low-pin-count semiconductor packaging.
Kulicke & Soffa launched the LUMOS Capillary for LED die wire bonding. The capillary can bond with gold or gold-alloy wires and uses a new TG ceramic material for better workability.
Kulicke & Soffa Industries Inc. (K&S, NASDAQ:KLIC) launched its AccuPlus Hub Blades product line, customizable blades for discrete wafer dicing.
AGC (Asahi Glass Co. Ltd.) developed ultra-high-speed processing technology for micro hole drilling of 0.1mm-thin glass, targeting leading-edge applications such as 3D semiconductor packages.
Surrey NanoSystems raised third-round funding of
Henkel developed LOCTITE UF3810 underfill for high reliability and ease of rework when applied to next-generation wafer-level chipscale packages (WLCSP) and package-on-package (PoP) devices.
DfR Solutions installed micro testing tools from XYZTEC for JEDEC qualification, dynamic bend testing, copper wire bond pull and shear testing, and material characterization of lead-free solders.
Multitest launched a new Quad Tech contactor, the Triton contactor, for high-end digital test applications such as server, computer, mobile smartphone, digital TV, and graphics chips.
WACKER expanded and relocated its South Korea technical laboratories and offices, bringing together R&D operations, applications technology, and basic and advanced training in silicones and polymers applications.
Lockheed Martin scientists have developed a new "nanotechnology" copper-based solder that it says will produce joints with up to 10
With the approach of full commercial production of 3DIC products, Dr. Phil Garrou shifts his attention to thermal performance questions and proposed thermal solutions for the future.
Fraunhofer IZM's All Silicon System Integration Dresden (ASSID) center will add SPTS' etch and PECVD process capabilities to investigate low-temperature dielectric films for through-silicon vias (TSV) in 3D IC packaging.
The advent of leading-edge semiconductor packaging technologies dictates efficient use of capital, and only the top-tier semiconductor assembly and test services (SATS) companies will have the financial wherewithal to develop required expertise and capacity, says one analyst.
Tessera Technologies is giving CEO Robert A. Young a big financial incentive to spin off one of its two businesses by March 2015, one of the company's key long-term strategic goals.
SPTS' Delta fxP cluster system achieves low-temperature deposition of TEOS oxides and nitrides for via-reveal passivation in 3D IC packaging, solving two key problems of low temperatures and bonding adhesive outgassing.
EV Group's updated modular EVG150 high-volume coater/developer adds new modules for conformal coating of high topography surfaces, and coating surfaces with vertical sidewall angles, such as through-silicon vias (TSV).
Ultra Tec Manufacturing has released a new endpoint detection module for its ASAP-1 IPS selected area preparation system, for improving electronic package decapsulation and sample preparation.
Wafer probe card maker FormFactor has agreed to acquire fellow probe card supplier MicroProbe, with a combined entity rivaling top-seller Micronics in the high-growth probe card market.
The US SEC adopted a rule that requires companies to publicly disclose their use of conflict minerals -- including tantalum, tin, gold, and tungsten -- that originated in the Democratic Republic of the Congo (DRC) or an adjoining country.
EoPlex Technologies Inc. is promoting the xLC substrate for quad flat pack no lead (QFN) semiconductor packages. The substrate enables QFNs with hundreds of leads and multiple rows at a lower cost than conventional packages.
Questar Products International released the Q7000 series of fine-pitch, fine-wire (17-75μm), aluminum/gold (Al/Au) automatic wedge and ball bonders to better meet smaller lot size, multiple product variation, frequent set-up change styles of package production.
Zymet Inc. introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. The adhesive can prevent pad damage during BGA rework, particularly with fine-pitch BGAs.
MagnaChip Semiconductor now offers cost-competitive and state-of-the-art copper wire bonding technology, which can create a packaging cost savings of about 20% to 30%. MagnaChip worked with the major packaging companies to develop a bonding process that protects wafers under bond pads.
Thin Film Electronics ASA (Thinfilm) and PARC, a Xerox company, entered the next phase of their co-innovation engagement for printed memory devices. This next phase extends the engagement to prototyping the product for manufacturing readiness.
Daniel Duffy, research scientist in Henkel's Advanced Technology Group, notes pros and cons of epoxy and silicone encapsulants for high-brightness LED (HB-LED) manufacturing, and what HB-LED manufacturers need from die attach materials. He also considers quantum dots.
Rogers Corporation's (NYSE:ROG) Board of Directors elected Bruce D. Hoechner as the materials company's new president and CEO, effective October 3, 2011. Hoechner's past positions were with Rohm and Haas and Dow Chemical.
X-RAY WorX GmbH introduced electronically controlled venting valves for open X-ray tubes. This avoids the manual venting typically performed during X-ray tool maintenance.
IRphotonics added a high-resolution FLIR thermal imaging camera to its application engineering lab. The camera will be used to analyze heat distribution during iCure use.
EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20WPH with enhanced automation capabilities and low-temperature processing.
Forget "3D stacking" -- the two companies say a special electronic "glue" applied to the wafer will help stack dozens of chips into a "silicon skyscraper" that will be much faster and more efficient than current chip technology.
Alchimer's AquiVia film-deposition technology promises to cut fill deposition times and cost even with complex through-silicon via (TSV) 3D packaging structures. The product targets TSV ramp-up at production levels, according to the company.
The PDC concept on the Multitest MT2168 uses sensor-based alignment in the standard pick-and-place processes to reduce small package misplacements and test system jams.
Fan-out wafer-level packaging (FO-WLP) is gaining momentum as an option for devices with large numbers of I/Os, vs. going finer-pitch to keep using conventional fan-in technology, says TechSearch International in an updated report.
Microsemi SoC Products Group will use outsourced semiconductor assembly and test (OSAT) provider Amkor Philippines (ATP) for final electrical package test on nearly all its products.
Fujikura Ltd. and FlipChip International LLC (FCI) released ChipletT and ChipsetT embedded die packages for single die or multi-die semiconductor packaging applications.
LED lighting maker Gem Hsin Electronics reduced the size of heatsinks in its LED products by drilling miniscule holes beneath LEDs. The holes allow heated air to escape the LED package.
Invenios developed a 3D Direct Write laser patterning technology for microelectronics packaging that integrates optical, mechatronic, and housing functionalities into the package substrate.
PVA is introducing the PVA6000 flexible coating and dispensing tool with new features based on customer feedback to improve accessibility for maintenance and improve ease of use.
Amkor will convert all of its 19mm through 31mm body size plastic ball grid array (PBGA) packages to pin-gate molding (PGM) over the next few years.
Nordson Corporation will honor the life of Steven J. Adamson, former Nordson ASYMTEK marketing specialist and electronics industry mentor, by funding a $3,000 annual scholarship in Adamson's name with the IMAPS Educational Foundation.
Multitest's Mercury contactor passed a "thorough BGA test evaluation," landing on the qualified contactors list for all business units of an international IDM.
Amkor Technology Inc. (NASDAQ:AMKR) honored 7 companies with its 2011 Supplier Award, for substrates, materials, and equipment.
Henkel will launch several new electronics assembly materials at Productronica, November 15-18 in Munich, Germany. The new HYSOL underfill is a halogen free, reworkable epoxy capillary underfill with a high Tg.
Henkel will launch several new electronics assembly materials at Productronica. The ABLESTIK ICP-4000 has been qualified to bond components to metal leadframes in plastic housings.
STATS ChipPAC Ltd. (SGX-ST: STATSChP), semiconductor test and advanced packaging service provider, has shipped over 300 million semiconductor packages with copper wire-bond interconnects. The SATS provider is investing in Cu wire bonding for finer silicon nodes (45/40nm) and low-k/extra low-k.
Tokyo-based JSR Corporation named the first non-Japanese Officer to its Officers Committee. Eric R. Johnson, the current president of the company's US semiconductor materials operations, JSR Micro, has been named as an Officer.
Laird Technologies released the Tpcm 580SP Series phase change material, a high-performance, screen-printable or stencilable thermal interface material with a thermal conductivity of 4.0W/mK that provides an alternative to thermal grease.
Sigurd Microelectronics Corporation (Sigurd) will be the first adopter of Multitest's MT2168 pick-and-place test handler in volume production in Taiwan. The SATS provider will use it to test various QFN packages.
Xradia has unveiled its latest micro computed tomography (CT) 3D X-ray imaging system, the VersaXRM. Kevin Fahey, PhD, VP of marketing at Xradia, discusses how the new platform uses geometrical magnification in tandem with an X-ray microscope.
Henkel Electronics released 2 formulations of Ablestik C100 conductive die attach film for leadframe packages, including QFNs. It eliminates die tilt, processes thin wafer die, and enables bondline control.
Cascade Microtech Inc. (NASDAQ: CSCD) and imec entered into a collaborative research partnership for testing and characterization of 3D integrated circuit (IC) test structures. Imec will work closely with Cascade Microtech to develop test methods and methodologies for emerging 3D through silicon via (TSV) structures, and to develop global standards.
As it developed an improved FPGA technology, the NuPGA team discovered a path for practical monolithic 3D ICs. MonolithIC 3D changed its strategy to focus on monolithic 3D IC technology as a pure IP innovator organization.
Nordson ASYMTEK introduced jet dispensing for manufacturing of side-view LEDs, which it says is better than needle-based systems. The Spectrum S-920N fluid dispenser jets 0.1 to 0.2mm dots through windows as small as 0.4mm into LED cavities.
A solid composite heat-conducting material created by scientists at the Georgia Tech Research Institute has a thermal conductivity that is higher than any metal and takes advantage of the properties of diamond. The silver-diamond composite is being aimed at cooling wide-bandgap semiconductors planned for next-generation phased-array radars.
MagnaChip Semiconductor Corporation now offers a redistribution layer (RDL) metal process for wafer bumping and an I/O structure and process that is fully compatible with copper wire bonding, reducing packaging costs.
STATS ChipPAC says its Thai operation hit by flooding will remain offline through January, longer than anticipated. And one analyst puts a number to the total disaster's industrywide impact: 3.8 million fewer PC units in the pipeline for 1Q11.
Kulicke & Soffa Industries Inc. (NASDAQ:KLIC or K&S) named Chin Hu Lim to its Board of Directors, also serving on KLIC's Management Development & Compensation Committee.
Tokyo Electron Limited (TEL) launched a suite of 3D packaging tools: the Tactras FAVIAS TSV deep-silicon etch system; the TELINDY PLUS VDP film deposition tool; and the wafer bonder/debonder Synapse Series.
Tokyo Electron Limited (TEL) has successfully demonstrated dynamicing -- device switching/dynamic characteristic (AC) -- of a power device at the wafer level.
Technic Inc. is entering the last development phase on technologies to reduce gold consumption in electronics packaging and connector applications, a product group it will call "Goldeneye."
SUSS MicroTec launched the XBS300 temporary bonder for high-volume wafer manufacturing. The Bond Cluster is configured to temporarily bond 200mm and 300mm wafers for 3D integration applications as well as other processes that require thin wafer handling.
Brewer Science Inc. will offer the ZoneBOND process on equipment supplier SUSS MicroTec's XBC300 and XBS300 wafer bonding platforms.
International Rectifier (IR) purchased multiple Apollo physical vapor deposition (PVD) systems from packaging equipment maker NEXX Systems for its Newport, Wales fab.
Dainippon Screen Mfg. Co. Ltd. developed the DW-3000 direct imaging exposure system for next-generation semiconductor packaging, exposing complex 3D multilayer substrates while adjusting for warping and distortion of individual wafers.
Citing rising demand and a potential industry shortage, NeoPhotonics is in the process of more than doubling its production capacity of narrow linewidth tunable lasers with minimal expected additional capital expenditures.
A seminar held at last month's Semicon China reiterated points made earlier in the year by an industry group that there are still questions about using copper bonding wire vs. gold in semiconductor packaging applications.
Vage Oganesian of Tessera and Vern Solberg, Tessera consultant, discuss the advanced packaging options available with 3D contact features on substrate interposers for complex, high-pin-count flip chip applications.
At the 22nm node, die fragility and challenging interconnect materials will necessitate foundry collaborations with packaging houses, co-designing silicon and package, asserts E. Jan Vardaman, TechSearch International.
Newport Corporation (NASDAQ:NEWP) will acquire ILX Lightwave Corporation, which makes high-performance test and measurement products for laser diodes and other photonics components. Newport will pay $9.3 million in cash.
Aries Electronics debuted AR4HT Series chipscale package (CSP) test sockets that accept any area-array device for testing up to 200
AVX Corporation has ensured that all its tantalum powder and wire suppliers are fully compliant with the independently audited Conflict-Free Smelter Program (CFS).
Quik-Pak, a division of Delphon Industries, is performing copper wire bonding on a Kulicke & Soffa (K&S) Maxum Ultra wire bonder. Available wires include bare copper and palladium-coated copper.
CHAD Industries integrated its WaferMate300-1 automated wafer handling workcell with Nordson DAGE's 4300 Bond Shear inspection tool, allowing for hands-off 300mm handling and bond shear inspection.
Semiconductor packaging materials will be a $22.8 billion market this year, and should grow to $25.7 billion by 2015, says SEMI and TechSearch International.
inTEST will acquire the assets and certain liabilities of Thermonics from Test Enerprises. inTEST's Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.
Mentor Graphics Corporation (NASDAQ:MENT) has combined technologies for thermal characterization and simulation with T3Ster hardware test products and its FloTHERM software, enabling better heat management in power semiconductor packages, such as LEDs.
LORD Corporation launched the ME-555 underfill encapsulant for semiconductor packaging and assembly. LORD ME-555 is a high-purity, semiconductor-grade epoxy underfill for encapsulating flip chips.
JaroThermal's Honeycomb heatsink directs heat towards the outside of the device, while producing a steady flow of cool air inside the heatsink. Honeycomb heatsinks can be used with either plastic or metal/ceramic BGA packages.
Yole Développement forecasts the temporary wafer bonding process growth and worth through 2016, and explains why there are so many process options, and who is working on them.
ternational Rectifier, (IR, NYSE:IRF), power management technology provider, introduced a PQFN 2 x 2mm with <1mm profile package featuring its latest HEXFET MOSFET silicon. The new package is ultra-compact, high density and efficient for lower-power applications.
FEI's new Vion plasma focused ion beam (PFIB) system based on inductively-coupled plasma (ICP) source technology using a xenon ion beam generates more than a micro-amp of beam current and can remove material faster than liquid metal ion sources, says product marketing manager Peter Carleson.
Semikron developed a power semiconductor packaging technology, SKiN, which uses flexible foil and sintered interconnects instead of bonding wires, solders, or thermal paste.
Camtek Ltd. (NASDAQ and TASE: CAMT) received repeat automatic optical inspection (AOI) orders from an Asia-based foundry doing advanced micro bump inspection and metrology. Challenges arise in measuring such small bumps used in advanced packages, including efficiently handling huge amounts of data.
Wafer bonding is a complex process, used on 2" to 12" wafers for MEMS, image sensors, advanced packaging, LEDs, and other chips. Yole Développement published a technology study and market research report, "Permanent wafer bonding," to derive trends in the market and technology through 2016.
RJR Polymers debuted liquid crystal polymer (LCP) semiconductor packaging technology for RF and microwave system designers that is competitive with ceramic ACPs, improving thermal management and offering design flexibility based on the company’s epoxy range.
Carsem will grow its Suzhou, China factory by an additional 430,000 square feet, increasing their Suzhou micro leadframe package (MLP) capacity to over 20 million per day, with a focus on copper wire bonding.
Alchimer's wet-deposition process, AquiVantage, grows interconnect layers for interposer redistribution layers (RDLs) and significantly enhances via-last backside wafer interconnects. The process eliminates 2 costly photolithography steps.
CoolChip Technologies won the MIT Clean Energy Prize for their technology that reduces data center cooling needs with air-based CPU cooling.
RFaxis released its patent-pending On-Die Coexistence Filter technology, designed to replace "bulky and expensive" stand-alone coexistence filters for cellular, mobile, and other devices.
The research project "MANOS" combines innovative surface coatings based on nanoparticles and the latest adhesive procedures for new embedding technologies and novel circuit-board-based modular fasten and release technology used to stack sensor systems.
iNEMI is starting a new convergence project on semiconductor packaging equipment requirements, and is seeking input from the industry.
Hesse & Knipps Inc. will demo a new 3mil wire bonding capability on its BJ935 automatic heavy wire bonder for back-end semiconductor packaging at IMAPS in San Diego.
Kulicke & Soffa Industries, Inc. (K&S, NASDAQ:KLIC) appointed Irene Lee to the role of chief quality officer. Lee will oversee quality assurance functions across Kulicke & Soffa
Monolithic Power Systems (MPS) implemented yieldWerx Semiconductor Test and Yield Management tools. MPS required a robust and centralized system for effective storage, analysis, and sharing of testing and product data received from multiple foundries, assembly, and testing facilities in the US and Asia.
Researchers at National Cheng Kung University (NCKU) in southern Taiwan developed a tin/zinc/silver/aluminum/gallium solder alloy for semiconductor packaging, which was tested by ASE.
Multitest, semiconductor test equipment supplier, added a 2D code reader option to its MT2168 pick-and-place test handler, for package test customers that require 100% device traceability and lot integrity.
Henkel Electronic Materials developed a new underfill system designed to reduce flip chip package stress by controlling die and substrate warpage, LOCTITE ECCOBOND UF 8840.
Agilent debuted its compliance test application, Agilent N6462A DDR4, for systems using DDR4 memory.
Zuken updated its CR-5000 design software to version 14, with greater collaboration in FPGA development and targeting high-speed design. Many enhancements have also been included in CR-5000 Lightning, Zuken
Park Electrochemical plans to cease operations at its Nelco Technology (Zhuhai FTZ) Ltd. facility in Zhuhai, China. Nelco products include microwave and RF component substrates, printed circuit materials, and advanced substrates such as BT.
Mesuro, semiconductor testing and services provider, raised
Cascade Microtech introduced the modular MPS150 manual wafer probe station with six application-specific test packages for RF, mmW, and I-V/C-V measurement; failure analysis; and high-power device characterization.
Henkel Electronic Materials added LOCTITE ABLESTIK CDF 200P to its conductive die attach film offering. The pre-cut film is available in 150mm and 200mm diameter sizes for easy wafer-form matching. The film is both a dicing tape and die attach tape.
Cascade Microtech Inc. (NASDAQ:CSCD), supplier of wafer-level measurement instruments for ICs, held its first Innovation Awards Ceremony to honor inventors, authors and other innovators at the company.
ASM Pacific Technology Limited noted in its H1 2012 results a record level of orders for leadframes in Q2. It also delivered what it calls the largest leadframe packaging set up to date.
Kyocera Industrial Ceramics Corporation, Chemical Sales Division introduced the environmentally friendly XKE-G5633 Epoxy Molding Compound (EMC) for BGA and LGA package encapsulation.
STATS ChipPAC presented its annual Supplier Awards to its top supplier partners for their excellent performance and outstanding support in 2011. Supplies are scored on technology, quality, delivery, responsiveness, service, and cost competiveness criteria.
SEMI's Collaborative Alliance for Semiconductor Test released a Docking and Mounting Generic Terminology Guideline document that can be used to improve the
Ziptronix Inc., which develops direct bonding technology for advanced semiconductor applications, has licensed its technology for a high-volume cellular handset application.
Sonoscan introduced a simulator software, SonoSimulator, that enables stacked die makers to check nondestructively for delaminations between layers. SonoSimulator software is now a standard feature on the Gen6 C-SAM acoustic microscope.
Jennifer Wrigley and Robert Bellinger, Olympus, share insights on SEMICON West
Nordson MARCH uncrated the FasTRAK Plasma System at SEMICON West. The automated, high-throughput vacuum plasma treatment system processes leadframe strips, laminate substrates, and other strip-type microelectronic components.
At SEMICON West, the working groups of the International Technology Roadmap for Semiconductors (ITRS) outlined 2012 updates to the roadmap. Check out the back-end process info here.
SRC and researchers from Georgia Tech made two advancements to meet key challenges facing off-chip interconnect solutions. The results address both the urgent need for greater off-chip bandwidth and reduced power per bit, and promise to enable continued improvements for system performance.
Package on package (PoP) stacking makes use of the vertical space available on electronics printed circuit boards (PCBs). It increases density, fitting more silicon into the same footprint. However, package stacking can be difficult, as fine pitches require placement accuracy, and taller stacks generally face reliability issues, especially if the stack is reflowed improperly. So where should PoP stacking take place?
Teledyne completed the acquisition of Intelek plc. Teledyne was the beneficial owner of, or had received valid acceptances in respect of approximately 93% of Intelek's ordinary shares. The aggregate value for the transaction will be approximately £35 million.
Wire bond inspection system maker Viscom introduced software tools for its very high resolution (VHR) camera module, which has the ability to provide exact measurements of balls and wedges. With this technology, 25-µm gold thin-wire wedge sizes can be measured with a standard deviation of 1 µm. In addition to inspecting qualitative characteristics of wire bonds, balls and wedges statistical evaluation and trend analysis of critical geometric dimensions can also be performed in the production process.
SEMI International is forming a standards committee to evaluate and create specifications and practices for 3D stacked ICs (3DS-IC), with initial efforts targeting three areas: bonded wafers, inspection/metrology, and thin wafer handling.
AT&S debuted a new technology to enable system-in-package (SiP) devices. AT&S’s embedded component packaging technology ECP is used to enable further miniaturiztion of electronic devices while enhancing their performance.
Cohu Inc. (NASDAQ:COHU) appointed Luis A. Müller president of its newly formed Semiconductor Equipment Group, which encompasses Cohu subsidiaries Delta Design and Rasco GmbH.
Rogers Corporation has developed a match for the RO4360 laminate: RO4460 prepreg. Both materials feature dielectric constant (Dk) of 6.15 ±0.15 and low dielectric loss of 0.003 at 2.5GHz. Together, they form an ideal system for fabricating compact, cost-sensitive multilayer high-frequency (HF) circuits in limited space.
In this video from SEMICON West 2010, Marcus Wimplinger, EV Group, summarizes the results of SEMATECH work using EVG's 300mm bonding systems that enables submicron alignment. Highly accruate wafer bonding is used for Cu-to-Cu bonding and other packaging applications.
Interplex NAS, supplier of precision components and assemblies and a division of Interplex Industries, Inc., added to its line of solder and flux-bearing lead products. The new surface mount pin, a short-current path lead, offers advantages in the circuit assembly process.
Shin-Etsu Silicones of America Inc., U.S. subsidiary of Shin-Etsu Chemical Co. Ltd., Japan, launched the TC-CA Series, comprised of Shin-Etsu’s advanced polymer and thermally conductive filler composite material technologies. The low-hardness silicone soft pad series of products have both high thermal conductivity and excellent electrical insulation properties.
Nextreme Thermal Solutions will now include materials evaluation and characterization services in its consulting portfolio. With recent advances in materials sciences and nanotechnology, new materials are being developed that exhibit thermoelectric properties.
Electronics experts developing technology for aerospace and defense applications confront few issues as daunting as the heat generated from their designs. Engineers are under constant pressure to develop ever-smaller and more powerful electronics, yet the cost of doing so creates ever-larger amounts of heat, and ever-larger electronics thermal management problems.
Henkel’s Hysol FP5201 NCP offers the underfill protection required for Cu Pillar technology, effectively mitigating the stress between the substrate and the die.
Multitest designed differential contactors that are customized for each semiconductor test application. The selection of the contactor materials and probes are optimized for the desired impedance.
Multitest expanded the portfolio of its Singapore spare parts distribution center for pogo pin-based test contactors. With this step, all major spare parts for semiconductor package test handlers and contactors are now available for fast delivery to Asian package test sites.
Imbedded component/die technology is a method of imbedding active and passives into cavities within a multi-layer PCB to decrease the surface area required to implement the circuit design and increase the robustness of the overall assembly. Casey H. Cooper, STI, discusses the design methodology, packaging processes, and test data gathered during imbedded die/component packaging implementation in a mixed-signal prototype. The prototype was subjected to reliability testing and demonstrated in a test flight.
Gartner VP of semiconductor manufacturing research, Jim Walker, notes that, for the first time, 2 SATS companies joined the top 20 capital spenders in 2010. He also predicts solid growth for advanced packaging tooling with memory ATE and copper wire bonders being the top performers. Walker says the conversion to copper wire from gold is a wise move.
Solid-state, fiber-based, and ultrafast lasers continue to make inroads in microelectronics processing applications, specifically for silicon wafer dicing. While most of these laser-based cutting methods rely on linear movement of the laser beam along a substrate, ESI developed a laser-based "zero-overlap" technique for dicing ultrathin (less than 50 μm thick) Si wafers.
Palomar Technologies introduced the fully automated 3800 Ultra Flexible Die Bonder for eutectic die attach, laser diode packaging and high-power LED packaging.
Fujipoly released Sarcon 100GR-FL, a low resistance, durable thermal interface gap filler pad. The gel-like material is manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations.
Laird Technologies released the Tflex XS400 Series thermal gap filler, a compliant elastomer gap filler for moderate thermal performance with a thermal conductivity of 2.0W/mK. This soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts.
A pre-competitive iNEMI R&D project plan, currently under development, will identify approaches capable of meeting wiring density needs for future generations of organic semiconductor packaging substrates. Meeting these future needs will require radical improvements and innovations in all aspects of organic packaging substrate technology.
Nordson DAGE, a subsidiary of Nordson Corporation (NASDAQ: NDSN) and provider of bond testing technology, introduced Paragon intelligent bond testing software for semiconductor packaging.
Research in China put out this new report chronicling the advanced semiconductor packaging industry happenings and key companies from 2009 to 2010. The study mainly focuses on CSP and BGA packaging. Technology adoption and costs are analyzed, from eWLB to TSV. Packaging tech usage examples are included here, along with assessments of tech adoption and industry player rankings.
RJR Polymers debuted a new-generation LCP quad flat-pack no-lead (QFN), air-cavity package that will support finer lead pitches, thinner leadframes and shorter wire bond lengths in a near hermetic, ROHS-compliant solution.
Dow Electronic Materials has broken ground for a new metalorganic precursor manufacturing plant in Cheonan, Korea. Dow is expanding TrimethylGallium (TMG) production capacity to meet the surging global demand for the material in the LED and related electronics markets.
Bare die in yarn, comfortable electronics, stretchable interposers, washable photovoltaic clothes, and other elements will be on the table for the PASTA project to bring smart textiles from the lab to industrial manufacturability. Imec leads the program.
Jae-Woong Nah, researcher at IBM's Thomas J. Watson Research Center, briefed ElectroIQ on his IMAPS conference paper: "Mask and mask-less injection molded solder (IMS) technology for fine-pitch substrate bumping." IMS is a variation of C4NP for solder deposition on fine-pitch laminates. Nah explains how the researchers injected 100% pure molten solder instead of solder paste with a reusable film mask for forming high-volume solder on fine-pitch substrates.
Jim Walker, research VP at Gartner, told attendees at the Gartner Semiconductor Briefing (11/4/10, San Jose, CA) that, after declining 14.7% in 2009, the outsourced semiconductor assembly and test services (OSATS) market will expand by 37% this year, and by 6.2% in 2011.
SUSS MicroTec and Fraunhofer for Surface Engineering and Thin Films IST launched SELECT, a technology for bond aligners and mask aligners that selectively activates parts of wafer surfaces through plasma.
Kulicke & Soffa Industries Inc. (Nasdaq: KLIC) introduced the IConnPS ProCu wire bonder optimized for copper wire bonding. The K&S IConnPS ProCu offers a significant and new level of capability for packaging lines transitioning from gold to copper wire bonding.
ADA Technologies, Inc. received a $100,000 contract from the U.S. Air Force for Phase I research into the development of improved thermal interface materials (TIM) for use in microchips.
To increase the performance and service life of LEDs and LED assemblies, Momentive Performance Materials introduced a line of thermally conductive silicones to be considered for use in LED manufacturing and assembly.
NovaCentrix announced that Metalon ICI-020, a new copper-based screen ink, will be featured at Printed Electronics USA 2010 in Santa Clara, CA, November 30-December 2, 2010. Pre-printed samples of Metalon ICI-020 screen ink on card stock will be distributed with the registration packs by IDTechEx staff, and attendees may bring their samples to the NovaCentrix exhibit area to cure the ink with NovaCentrix’s PulseForge process tool.
The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) in Singapore, launched the Copper Wire (Cu-Wire) Bonding Consortium. The consortium will tackle existing Cu-Wire bonding issues of quality and reliability, and improve existing measurement systems.
EI added LCP Laminates to its family of microelectronics packaging product offerings. Custom-designed LCP Laminates are suitable for semiconductor packages as LCP coreless designs for up to 6 layers as well as in combination with other rigid materials as hybrid circuits. Development and testing of Z-interconnect cross-sections for >8 layer offerings are also underway.
The HDP User Group's Optical Interconnect project aims to alleviate intra-cabinet interconnect bottlenecks envisaged in Tbps systems by connecting electronic devices with optical paths. The project is developing optical interconnect architectures that can respond to capacity and energy efficiency needs of future high-speed systems.
Assembléon’s recently released Twin Placement Robot (TPR) will reportedly reduce costs for semiconductor backend manufacturing. The TPR fits on Assembléon’s A-Series pick & place equipment for packaging and IC placement. Plans are in the works for the TPR to do semiconductor manufacturing tasks as well.
Continental Corporation applied economic conveyor and handling modules from IPTE’s EasyLine product portfolio to link its gold and aluminum wire bonding, mounting, and AOI areas.
Japan Marketing Survey Co. Ltd. (JMS) will publish "Outlook of thermal interface material market 2010) this week, with data on the semiconductor package thermal management market size by application, thermal interface material types' market shares, and more.
Tamar Technology received orders from major semiconductor equipment manufacturers for its TSV measurement technology. Tamar’s proprietary Wafer Thickness Sensor can measure etch depth for TSVs as well as wafer thickness for single or bonded wafers.
VectorGuard 3D stencils are designed for specialist applications requiring multiple level printing. Facilitating printing on different levels with upward or downward steps, VectorGuard 3D enables a uniform stencil thickness.
Joachim Burghartz, IMS CHIPS, presented an improved version of the group's Chipfilm technology introduced at IEDM 4 years ago. The researchers now have a manufacturable process technology.
Instead of time-consuming hardware tests for thermal analysis, package designers are increasingly turning to software-based device modeling and CFD analysis, which eliminates fabrication of trial components, thermal dice, and other fixturing to preview the impact of design decisions and changes, explains Robin Bornoff from Mentor Graphics.
The VectorGuard stencil portfolio from DEK now includes the double layer Platinum stencil, a stencil technology that is said to offer performance benefits over conventional screens. VectorGuard Double Layer Platinum stencils suit semiconductor applications and component manufacture, solar cell manufacture, low-temperature co-fired ceramic (LTCC) manufacture, as well as other production challenges requiring fine line or mixed feature sizes.
This case study, a partner piece to Robin Bornoff/Mentor Graphics' discussion of fluid dynamics analysis for IC package design, examines how IDT used CFD thermal analysis in a packaging decision for a recent product launch.
The Surface Mount Technology Association (SMTA) will host two 90-minute online sessions with Bob Willis, ASKbobwillis.com, on package-on-package (PoP) applications and implementation. The Webtorials will take place February 4 and February 11, 2010 from 1:00 to 2:30 pm EST.
On behalf of the World Gold Council (WGC), SEMI conducted a survey titled “Semiconductor Industry Opinions Concerning the Selection of Bonding Wire Material.” The survey was intended to gauge the semiconductor industry’s use of copper bonding wire versus gold for packaging applications. The WGC is a commercially driven organization focused on creating demand for gold. While 41% of semiconductor companies surveyed use copper bonding wire, none use it in the majority of their products. However, the majority of respondents will consider copper bonding wire in their new products.
SEMATECH qualified EVG's GEMINI automated wafer bonding system through its Equipment Maturity Assessment implemented within SEMATECH's 3D Interconnect program and ISMI's EMA team.
MicroProbe introduced current-carrying capability of >1A/probe in 90
The bulk of packaging falls under the
Ultratech formed 'exclusive supplier' and 'preferred tool vendor' agreements with several top-tier advanced packaging companies around the world.
Multitest installed the first Multitest Plug & Yield integrated hardware set up for testing 3D semiconductor packages at a customer. The Plug & Yield design enables highly parallel electrical in-process test of stacked dies during the assembly process of 3D packages.
USHIO Inc. is introducing the large-field stepper lithography tool
EVG introduced the EVG 850TB/DB automated temporary bonding and debonding system built on the company's new XT Frame platform, which has been optimized to support thin-wafer processing for high-volume 3D IC and TSV manufacturing.
Electro Scientific Industries Inc. (ESI, NASDAQ:ESIO) received multiple-unit orders for its model 3510 test system from leading Japanese and Korean MLCC manufacturers.
Seiko Epson launched the NX1032XS pick-and-place IC test handler, boasting high throughput for transferring, inspecting, and sorting semiconductors.
Ultratech acquired IBM patents on semiconductor packaging technologies, including C4 bumping, ball grid array (BGA) methods, lead-free solders, and 3D packaging.
Dow Corning will collaborate with SUSS MicroTec on a temporary bonding process (materials and equipment) for through-silicon vias (TSV) in high-volume advanced semiconductor packaging.
SEMICON West is taking place July 10-12 in San Francisco, CA. Following are new products for semiconductor packaging and test that will be at the show, from wafer bonders to LED die attach materials.
DELO introduced the DELOMONOPOX AD268 epoxy resin to meet the low-cost, reliable-attach needs of RFID device makers. The anisotropic, electrically conductive adhesive provides fast cure at chip attach, and is designed for flip-chip RFID packaging, as well as other packaging applications.
Pure-play foundry Shanghai Hua Hong NEC and test equipment supplier Advantest co-developed a wafer-level, multi-site parallel test scheme for RFID semiconductor devices that meets industry-standard ISO 14443 guidelines.
Signetics Corporation approved plans to purchase additional semiconductor assembly process equipment -- wafer grinders, wafer saws, die attach tools, and wire bonders -- to grow its packaging capacity for mobile chips.
STATS ChipPAC Ltd. (SGX-ST: STATSChP) marked the milestone of 1 billion copper wirebonded semiconductor units shipped.
Anritsu will demonstrate its broadband Vector Network Analyzer (VNA), which conducts single sweeps from 70kHz to 140GHz during wafer probe test, at IMS, showcasing a new 0.8mm connector.
Semiconductor assembly tool maker Kulicke & Soffa (KLIC) named Pui Yee Lee as VP and corporate treasurer, reporting to SVP and CFO Jonathan Chou.
Advantest is developing a line of fully automated and integrated test and handling solutions for TSV-based 2.5D and 3D packages. The concept model test cell, DIMENSION, integrates a high parallel test cluster along with singulated die and 3D die stack automated handling capabilities.
Multitest has made its InCarrier Loader/Unloader available in a variety of configurations, e.g. for loading from tube, bowl, tray and for unloading into tube, bulk or metal mag in any combination.
Henkel worked with STMicroelectronics (STM) to qualify Henkel's Ablestik C100 conductive die attach film materials for scalable, adaptable leadframe packaging.
Canon Inc. made its first foray into the semiconductor back-end packaging equipment market with the new FPA-5510iV for through silicon via (TSV) and bump lithography.
The FC300R performs chip-to-substrate bonding, chip-to-wafer assembly, and chip-to-chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes, with a robotic handling system for fragile and diverse substrates/wafers.
Elpida Memory is now sampling a new 8Gb TSV DRAM consisting of four 2Gb layers based on TSV stacking technology.
Multiest released data from an international IDM's high-volume production site, tracking its DuraKelvin test contactor's FPY and cleaning downtime.
NEXX Systems installed 2 300mm Stratus deposition at a Korean IDM for high-volume wafer-level packaging processes.
Camtek Ltd. (NASDAQ and TASE: CAMT) received an order for multiple wafer inspection systems from a major outsourced semiconductor assembly and test (OSAT) company in southeast Asia.
DEK has launched ProActiv process technology to enable electronics manufacturers to print pastes with high-density heterogeneous PCBs and ultra fine pitch assemblies such as advanced package assembly.
Nanoplas introduced a fully automatic dry-processing batch system for high-volume 200mm production. The DSB 9000A is based on Nanoplas’s High Density Radical Flux (HDRF) technology.
Kwan-yu Lai, Micralyne, and Jeffrey G. Stark, Sensor Products, describe the use of color-coded pressure-indicating film to ensure uniform, correct pressure during wafer bonding. Wafers are bonded by applying precise combinations of physical pressure, temperature, and/or voltage. Pressure is measured as an average, assuming perfectly flat pressure plates.
Extending its capabilities for placing solder spheres at high speed, DEK's DirEKt Ball Placement process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm.
Debbie Forray and Ilya Furman, Henkel Corp., compare a self-filleting die attach paste to film-based adhesives. Semiconductor companies are seeking lower-cost die attach material solutions to replace the higher-cost, film-based adhesive materials used for certain applications. One such material is self-filleting die attach paste.
The Asys Group say it has acquired the IP and patents of fellow German firm DynTest Technologies, seeking to apply the company's wafer singulation technology to high-brightness LEDs.
Samsung Electronics says it has developed a new heat dissipating packaging technology for display drivers ICs in high-end TVs.
The Multitest next-generation MT9928 bowl feed module, which passed the strict QA and production approval requirements of an international IDM, is a gravity feed handler with a variety of loading and unloading options. With a throughput of up to 14,500 uph, the bowl feed loading module is the loading option of choice for small package sizes during semiconductor test.
Worldwide semiconductor capital equipment spending is projected to surpass $29.4 billion in 2010, a 76.1% increase from 2009 spending of $16.7 billion, according to Gartner Inc. Gartner cites a dramatic recovery in semiconductor orders for the equipment order surge.
Substantial amounts of electrostatic discharge (ESD) damage are not only possible, but probable in semiconductor die attach operations, leading to substantial yield losses. Roger Peirce and Brad Williford from Simco illustrate seven distinct mechanisms in typical die attach operations that cause electrostatic discharge (ESD) damage to chips being handled.
Given the advantages and technical feasibility of through-silicon vias (TSV), the major focus now is on the manufacturability and integration of all the different building blocks for TSVs and 3D interconnects. EV Group's Thorsten Matthias et al. review advances in lithography, thin wafer processing, and wafer bonding, and the integration of all these process steps.
Honeywell (NYSE: HON) Electronic Materials debuted a printable thermal management material designed to help manage the high heat produced by increasingly powerful semiconductors in portable computing devices such as laptops and netbooks.
Ian Clark from Mentor Graphics explains how the company's new FloTherm Web-based software helps reduce the time spent on thermal characterization and design, illustrated by examples for both moving air and ambient thermal resistance.
The IMAPS-UK MicroTech-2010 and IEEE-CPMT Advanced Packaging Materials (APM), Feb. 28 to March 2 at Cambridge University, will be the major Spring 2010 event on electronics packaging, interconnection and integration conference in Europe.
Hitachi Via Mechanics says it has developed new processes for microhole drilling cast polyimide wafers and multilayered materials used in high density electronics packaging, that can produce ≤100μm-dia. holes in high-volume manufacturing.
Specialty TSV foundry Allvia is expanding its manufacturing capabilities away from high-cost Silicon Valley to a newly-purchased facility in Oregon, a site with its own chip-equipment pedigree.
The International Conference "3-D ARCHITECTURES FOR SEMICONDUCTOR INTEGRATION AND PACKAGING" will take place December 8-10, 2010 at the Hyatt Regency San Francisco Airport Hotel. Check out the planned keynotes and topics of the conference.
Süss MicroTec's Stojan Kanev tells SST/AP about the company's new addition to its toolset for 3D integration: a probe station targeting 300mm wafer-level 3D stacked structures.
Indium Corporation acquired the processes, equipment, and know-how of Reactive NanoTechnologies Inc. (RNT), developer and manufacturer of NanoFoil. NanoFoil delivers precise, instantaneous heat energy for advanced joining applications. RNT developed the NanoBond joining process to simplify manufacturing and ensure the benefits of NanoFoil are maximized.
SET unveiled a patented system enabling a thorough removal of oxides before or during the semiconductor packaging bonding sequence. Addressing the challenges of the oxidation of metal surfaces in device bonding, this machine system encompasses a substrate chuck and a bond head with a non-contact localized confinement chamber that operates safely with reducing gases such as forming gas or formic acid vapor.
SABIC Innovative Plastics launched three new sustainable additions to its Valox* ENH resin series that deliver advanced flame retardance (FR) with desirable mechanical and electrical performance. These innovative materials help customers comply with global environmental regulations.
EoPlex Inc. debuted a high-performance, clean-tech lead carrier for semiconductor packaging. EoPlex xLC is reportedly a cost-effective replacement for the leadframes currently used in quad flat pack no-lead (QFN) packages.
New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials.
In a SiP chip stack, space constraints can lead to large parasitic inductances in the packaging. Planarity, processing, high-temperature exposure, and other factors also present challenges. A new anisotropic conductive adhesive technology could enable low-cost flexible packaging via a multi-layer particle structure. S. Manian Ramkumar, Ph.D., RIT, reviews the adhesives benefits to various levels of electronics interconnect.
High-density through-silicon stacking (TSS) shows promise for very high-volume applications, but work still needs to be done to "tame" key issues in manufacturing, improve costs, and smooth out the supply-chain, said Matt Nowak, director of engineering in Qualcomm's VLSI technology group, in a presentation at The ConFab in Las Vegas.
The CREAM Project addresses the thematic “Aeronautics and Air Transport (AAT)” through the objective of developing an “Innovative Technological platform for Compact & Reliable Electronic integrated in Actuator and Motor” destined for several applications of the All Electric Aircraft such as fuel pumps, landing gear or brake actuators, flight control actuators, etc.
Imec and PVA Tepla say they have achieved void detection in through-silicon vias at wafer level, after TSV copper plating, thanks to a nondestructive high-frequency scanning acoustic microscopy (SAM) technique.
Asia-based ASM Pacific Technology (ASMPT) Group, a supplier of semiconductor assembly, bonding, and packaging equipment, will integrate with the SIPLACE organization in Europe.
Sales of semiconductor probe cards grew 17% in 2011, reaching $1.17 billion, VLSIresearch reports. While short of a record, 2011 was one of the probe card sector
Nitto Denko Corporation approved a transfer of its semiconductor encapsulating materials business to Hitachi Chemical Co. Ltd.
Multitest introduced the ecoAmp Kelvin contactor for high-power device test of 500+ Amperes. It meets the needs of high voltage/high current test with high thermal and mechanical stability.
The top three outsourced semiconductor assembly and test services (OSATS) providers raised 2012 capex during their earnings reports, from initial plans announced in January, report analysts at Citi.
Nordson ASYMTEK uncrated the NexJet System for jetting, with a newly designed jet cartridge and new software control for semiconductor packaging applications.
Aeroflex will supply manufacturing test technology for radio frequency (RF) devices at Qualcomm customers, under a new licensing agreement with Qualcomm.
Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech
Micro Control Company uncrated the HPB-5C High-Power Burn-In System, with variable airflow control for active thermal control of each device under test. The HPB-5C provides individual temperature control to each device under test.
DARPA gave Raytheon an 18-month, $1.8 million contract to develop next-generation GaN devices on diamond substrates, named Thermally Enhanced Gallium Nitride (TEGaN). The diamond packaging boosts GaN power handling capability by at least 3x.
DELO introduced DELOMONOPOX die attach adhesives, promising strong mechanical/environmental protection, low-temperature cure, and compatibility with various substrates.
Agilent launched Express Test for ultra-fast, high-precision nanomechanical testing on thin films, low-k materials, composites, and more. It allows 100 indents on 100 surface sites in 100 seconds.
CEA-Leti and passive component maker IPDiA developed an atomic layer deposition (ALD) process to apply medium-k dielectric layers on a metal-insulator-metal capacitor architecture, enabling 3D capacitors.
Rogers Corporation (NYSE: ROG) shared an update on its restructuring and streamlining initiatives, which are expected to save about $13 million (annualized savings) by Q4.
Mereco Technologies' METADUCT 1202 is an electrically conductive silver epoxy adhesive for lead attachment cold soldering, chip bonding, and leadframe bonding applications.
Ferro Electronic Materials expanded its LTCC portfolio, adding a line of cost-effective matched materials. The L8 LTCC system claims better performance over a greater range of frequencies and easier manufacturability.
Bruker Corporation acquired all of the shares of SkyScan NV, a scientific instruments company serving materials science and life sciences/pre-clinical imaging needs.
Yamaichi developed a test adapter with the European Design Centre, suitable for test and programming of embedded modules such as Qseven or MXM.
SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.
Camtek Ltd. sold $3.5 million of Falcon inspection tools to a global outsourced semiconductor assembly and test (OSAT) provider, for various applications in the backend assembly process.
Keithley Instruments introduced the Model 2657A High Power System SourceMeter instrument, adding high voltage test to its line of high-speed, precision source measurement units for power semiconductors.
The global semiconductor materials -- wafer fabrication and packaging materials -- market increased 7% in 2011 compared to 2010, with record revenues of $47.86 billion, said SEMI.
Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.
Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.
RED Micro Wire (RWM), a subsidiary of RED Equipment, announced a new high-quality copper wire featuring glass insulation for use in semiconductor wire bonding.
Applied Materials will host its annual Analyst meeting this week (March 28). Barclays Capital shares its expectations for AMAT's update and the wafer fab equipment (WFE) outlook in general.
SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.
CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.
SiGen developed its second-generation production system for fabricating thin-silicon solar wafers, as well as HB-LED, and 3D semiconductor packaging wafers. The system tailored for silicon, GaAs, germanium, SiC, GaN and sapphire materials.
Execs from Samsung, IBM, GlobalFoundries and ARM looked to the future at The Common Technology Platform Forum in Santa Clara. They focused on the innovation pipeline for 20nm and 14nm technology nodes, and the role that EUV, FinFETs, TSVs, CNTs and DSA will play.
Worldwide sales of semiconductor manufacturing equipment totaled $43.53 billion in 2011, representing a year-over-year increase of 9%, shows SEMI. North America surpassed Taiwan as the region with the highest amount of spending.
The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.
Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse looks at the growth areas for test.
Core Wafer Systems, subsidiary of Action Products International, upgraded its PDQ-WLR on-wafer accelerated reliability product line to version 7.0, designed specifically for Agilent Technologies' Parametric Testers.
Theta Delta will incorporate Core Wafer Systems technologies into its burn-in test and long-term reliability test systems for semiconductors. Core Wafer Systems provides parallel measurement schema for semiconductor test.
Camtek launched Xact200, a transmission electron microscope (TEM) sample preparation system for the semiconductor industry. Camtek calls the system an alternative to FIB analysis.
Test Advantage Capital Group, a business of BSE Group, surpassed $150M in its portfolio of semiconductor manufacturing equipment under management. Boston Semi Equipment's fab equipment leasing business also received a $100M annual commitment from its financial backer, Wafra Capital Partners.
Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.
Texas Instruments awarded 15 of its 12,000 suppliers with Supplier Excellence Awards for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality.
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: electronic skin, energy storage with nanowires, printable inks, gas sensing, inkjet printing, semiconductor polymers for organic devices, CNTs, OFETs, touch screen fabrics, and the coffee breaks.
Intel Corporation announced 9 winners of the company's Supplier Continuous Quality Improvement (SCQI) award for outstanding commitment to quality and performance excellence.
Intel Corporation announced its 2011 Intel Preferred Quality Supplier (PQS) awards, selecting 19 of its thousands of suppliers. Two suppliers received Intel’s Achievement Award.
Shin-Etsu Chemical Co. Ltd.'s new KER-7000 Series silicone encapsulating materials offer a low (1.38) refractive index (RI) for HB-LED packaging with lower gas permeability and higher transparency.
A leading, US-based IDM ordered about $5 million of front- and back-end semiconductor automatic optical inspection (AOI) tools from Camtek Ltd.
Solid State Technology is proud to announce that David McCann will speak at The ConFab 2012. David, the Senior Director for Packaging R&D at GLOBALFOUNDRIES in Malta, New York, will speak on the evolution toward silicon-based interconnect and packaging, which is having profound impact on how we think about technology development and the supply chain.
Elpida Memory Inc. (Tokyo: 6665) resolved to file a petition for the commencement of corporate reorganization proceedings, and filed the same with the Tokyo District Court. Akita Elpida Memory Inc. also saw the commencement of corporate reorganization proceedings
In this series, CMC Laboratories describes a new LED-grade AlN and what it accomplishes as a ceramic substrate. The AlN offers better heat dissipation for LED packages than alumina, at a lower cost than previous formulations.
MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.
Part 2 of this series covers furnace considerations for a new HB-LED-grade AlN, as well as furnace throughput. Jonathan Harris, CMC Laboratories, covers the role of the oxide sintering phase in AlN in defining the materials microstructure and thus determining key properties such as thermal conductivity and mechanical strength.
Air Products will acquire all of DuPont's interest in DuPont Air Products NanoMaterials LLC (DA NanoMaterials), a 50-50 JV that the companies set up for the semiconductor and wafer polishing industries.
The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.”
The Dow Chemical Company (NYSE: DOW) inaugurated its Dow Seoul Technology Center, a global R&D center with focus on technological advances in display and semiconductor applications.
Worldwide semiconductor manufacturing equipment spending is projected to total $38.9 billion in 2012, an 11.6% decline from 2011 spending of $44 billion, according to Gartner Inc.
In case anyone needed a reminder or a wake-up, new data from SEMI reiterates chip tool sales are slumping badly in the latter part of this year.
SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.
In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
Attendees at this year’s International Electron Devices Meeting (IEDM) were delighted and perhaps somewhat horrified when the plenary speaker popped some electronics gear in his mouth and proclaimed, “It tastes like chicken!”
Semiconductor equipment demand is persistently sluggish as the industry takes a break from a "multiyear expansion period" to digest recent investments and wrestle with a broader economic slowdown, acknowledges SEMI in its updated year-end forecast. But make no mistake: leading-edge technology investments are still happening, and growth will return in the typical cyclical pattern.
In prep for Semicon Japan in December, Advantest announces three new tools: 2 SEMs and a litho system.
Soitec says it has more than doubled production of bonded silicon-on-sapphire (BSoS) substrates to meet increased demand from partner Peregrine Semiconductor, which has surged its own production capacity for RF switches used in cellular handsets, including the newest iPhone 5.
This year's International Conference on Planarization/CMP Technology (ICPT) encompassed five themes describing use of CMP: new device structures, equipment and methods, Cu interconnects, consumables, and new CMP methods and processes.
EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.
Sales of electronic gases are seen growing a modest 3.2% growth overall in 2012, following a 15% increase in 2011 to $3.1B, according to an updated report from Techcet Group.
STATS ChipPAC Ltd. plans to expand its semiconductor assembly and test operation in South Korea.
The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.
Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.
ATMI Inc. has introduced the eVOLV process and system that represents a sustainable solution for recycling electronic waste (e-waste).
Industry watchers have been lowering their outlooks for 2013 over the past few weeks, but there's one set of opinions that still see optimism for an industry rebound in 2013 -- chip industry executives themselves.
Global spending on wafer fab equipment (WFE) is now on pace to finish 2012 with a -17% annual decline, and 2013 now looks like it'll only be slightly better at a -10% dropoff, before the next cyclical spending upturn begins in 2014, according to an updated forecast from Gartner.
Samsung's reaffirmation of its planned $4B investments in its Austin, TX facilities don't offer much extra info, but do serve as a message to the market about its future plans -- with or without Apple.
Rudolph Technologies, Inc. (Nasdaq: RTEC) has entered the back-end advanced packaging lithography market, with the acquisition of Azores Corp., and the introduction of a new 2X reduction stepper called the JetStep.
The ConFab, Solid State Technology’s invitation-only event for the semiconductor industry, took place in June, with presenters from top companies and analyst firms. If you couldn’t be there, check out all the coverage from the event -- reports, presentations, video interviews and more.
LED encapsulants are closely related to the LED’s lifespan and light transmittance. With high-power and high-brightness LEDs emerging, the encapsulant’s role is becoming more important, says Displaybank.
CGI Americas is introducing the QMO Series inert gas and vacuum ovens and MOL Series Class 100 cleanroom ovens, based on the SMO Series precision ovens from C Sun, to the North American market.
Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain.
Following are some of the process control, device inspection, defect detection, and other metrology and test products that will be on display at SEMICON West 2012, July 10-12 in San Francisco, CA.
JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.
IC Insights’ latest survey and ranking of the major semiconductor capital spenders shows that only 6 of the 35 major semiconductor suppliers -- Intel, Samsung, Hynix, TSMC, UMC, and Rohm -- with significant capital expenditure budgets are expected to spend more in 2012 than they did in 2011.
After meeting with various semiconductor manufacturing tool suppliers -- Applied Materials, KLA-Tencor, Lam Research, Tokyo Electron, Teradyne and Cymer -- at SEMICON West, Citi analysts share impressions on foundry spending plans and tool choices.
A main focus of this year’s Electronic Components and Technology Conference (ECTC), held this week in San Diego, is 3D integration and through silicon vias (TSVs).
In this first installment of a series called "Process Watch,” experts from KLA-Tencor explain why a defect might be classified as “Not Found” or “SEM Non-visual (SNV),” and how a SNV count can disguise or hide real problems.
The 15th IITC (International Interconnect Technology Conference) opened Monday, June 4 at the Doubletree Hotel in San Jose, CA. Recurring themes this year were variations on 3D and TSV, novel systems and packaging, and back end memory. Mike Fury reports.
Semiconductor equipment sales will reach $42.4 billion in 2012, according to the mid-year edition of the SEMI Capital Equipment Forecast, released at SEMICON West 2012.
Following are some of the new and flagship products that will appear this week at SEMICON West, July 10-12 in the Moscone Center of San Francisco, CA.
IPC and JPCA released their first operational-level standard for the printed electronics industry, defining terms and establishes basic requirements for substrate materials used in printed electronics: ceramic, organic, metal, glass and other.
"Following seven months of increases, the three-month average bookings declined in June and likely reflects some slowing in investment plans attributed to weaknesses in the broader economy," said Denny McGuirk, SEMI. "While order activity may slow, equipment spending this year will continue to be directed towards advanced technologies in wafer processing and packaging assembly."
Rudolph Technologies Inc. (NASDAQ:RTEC) acquired the assets of NanoPhotonics GmbH, adding inspection technology and an intellectual property (IP) portfolio to serve its advanced package inspection tool customers.
In mid-2011, semiconductor manufacturing and assembly equipment supplier Applied Materials (NASDAQ:AMAT) acquired Varian Semiconductor Equipment Associates Inc. Now, the company is adding Varian’s former CEO Gary Dickerson as president.
Luminus Devices Inc. is reducing thermal resistance in its Big Chip LED devices by 30% with new packaging technology.
MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.
Singapore’s A*STAR’s Institute of Microelectronics (IME), and Hitachi Chemical Co., will be collaborating on a joint research program to develop high performance material technologies for thin wafer processing for 3D IC packaging.
Bruker said that a leading semiconductor supplier purchased multiple ContourGT-X 3D optical microscope systems for its packaging factories in Asia and North America to support copper wire bond inspection and process control needs.
Kulicke & Soffa Industries, Inc. launched its next generation manual wire bonder series, the iBond5000. The series, which is based on the company’s 4500 line, includes ball, wedge and dual-capability bonding options.
Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.
Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.
Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders.
Brian Cronquist, MonolithIC 3D Inc.'s VP of Technology and IP reports on recent progress on low temperature (less than 400°C) bonding and cleaving processes.
Applied Materials says it will reduce its work force by between 6% and 9% (900-1300 positions) amid a global realignment deemed necessary to achieve certain strategic objectives, freeing up to $190M annually "to fund key growth initiatives."
Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.
Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy, the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.
At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.
The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.
EV Group says it has received an order for its EVG850 temporary bonding/debonding systems from a leading maker of compound semiconductor-based components, what it says is the first use of its ZoneBOND technology in this area.
Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.
In a keynote at the IEEE International Interconnect Technology Conference (IITC), Douglas Yu from TSMC talked about Moore’s Law scaling becoming increasingly difficult.
CEA-Leti announced today that researchers Dominique Vicard and Jean Brun received the Avantex Innovation Prize for the use of the E-Thread technology in textiles.
The foundry plans to unveil a comprehensive set of certified design flows to support 2.5D IC product development with its most advanced manufacturing processes at next week’s 50th Design Automation Conference (DAC) in Austin, Texas.
Fab equipment spending will grow two percent year-over-year (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.
Signetics Corporation today announced that it has again approved capex plans that will further expand their capacity for flip chip package assembly at their factory in Paju, South Korea.
ams AG, a provider of high performance analog ICs and sensors, today introduced the AS3721, a power management IC (PMIC) with an innovative remote-feedback circuit that helps reduce the thermal stress of applications processors in smartphones and tablets.
The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at ECTC 2013, with the report of an advanced new temporary bonding solution for 3D TSV semiconductor packaging.
Yole Développement announced its 2.5D, 3DIC and TSV Interconnect Patent Investigation report. For this analysis of 3D packaging technology patents, more than 1800 patent families have been screened.
MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with imec, Ireland's Tyndall National Institute and ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs.
Amkor Technology, Inc. today announced that Stephen D. Kelley has been appointed to serve as president and chief executive officer and as a director of the company, effective May 8, 2013.
Invensas Corporation, a subsidiary of Tessera Technologies, Inc., will showcase its latest mobility solution, an ultra-high bandwidth Bond Via Array (BVATM) Package-on-Package (PoP) product, at the upcoming IEEE Electronic Components & Technology Conference (ECTC) in Las Vegas, NV on May 28 - 31, 2013.
North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08.
Alliance Memory today extended its 128M and 256M lines of high-speed CMOS synchronous DRAMs (SDRAM) with new devices in a 54-ball 8 mm by 8mm by 1.2mm TFBGA package.
Sales in March 2013 were up slightly compared to February 2013 and March 2012.
Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced that it has joined an international European Union-funded program aimed at developing a new MEMS manufacturing platform based on advanced inkjet-based printing technologies.
North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.
With time running out until U.S. component manufacturers are legally required to disclose their usage of conflict minerals to the federal government, many companies are woefully unprepared for the new regulations, with more than one-third of firms indicating they haven’t even commenced compliance planning, according to a survey from information and analytics provider IHS.
Only light, aerial oxygen, and a catalyst are needed to remove pollutants from water. Ruhr-Universitat Bochum researchers led by Professor Radim Beránek are collaborating with colleagues from seven different countries in order to develop a photocatalyst that is efficient enough to be profitable.
The ability to improve silicon transistors is reaching its fundamental limit, so researchers are searching for new ways to keep making electronic devices faster and more powerful. University of Nebraska-Lincoln physicists and colleagues have taken a major step toward breaking that silicon barrier.
Tim Turner, the Reliability Center Business Development Manager at the College of Nanoscale Science and Engineering (CNSE), Albany, NY, blogs about the potential of resistive memory and the reliability challenges the must be overcome.
CEA-Leti today announced that it will coordinate a four-year project aimed at building a European-based supply chain in silicon photonics and speeding industrialization of the technology.
Joint effort to explore novel process techniques to improve device performance and reliability in semiconductor manufacturing for sub 20nm technology node.
STMicroelectronics announced today another milestone in its testing of its 28nm FD-SOI Technology Platform.
The multibillion-dollar secondary or used semiconductor equipment market has gone through significant changes over the past five years and has become increasingly sophisticated in its approach.
80 percent of the devices used for portable and mobile applications are currently manufactured on 200mm or smaller wafers. How this plays out going forward could change who the dominant players will be.
Advanced packaging requirements are driving the evolution of back end manufacturing to become more similar to the front end.
The development of innovative technologies that solve the critical issues for the transition and adoption of 450-mm manufacturing will be the defining factor for whether a company merely survives or thrives.
The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.
The global market for MEMS microphones has reached approximately $422 million in 2012. The market is predicted to increase to $865 million in 2017.
Markets for solid state thin-film batteries at $65.9 million in 2012 are anticipated to reach $5.95 billion by 2019, according to a new report released by ReportsnReports.com.
Roland Thomas, subcommittee chair of ISSCC, writes of the substantial growth and future in key areas of technology.
Hoi-Jun Yoo, subcommittee chair of ISSCC 2013, writes on the focus of technology directions in the field of large-area and low-temperature electronics.
Although many are small companies manufacturing low-pin count devices, all of the world’s “Top 10” OSAT, Outsourced Semiconductor Assembly and Test, players have one or more assembly and testing facilities in China.
In the first of two installments, we examine the global issues facing the semiconductor industry, as released by Linx Consulting in The Econometric Semiconductor Forecast.
A new econometric semiconductor industry forecast predicts semiconductor wafer area production to grow slightly less than 6% in 2013, according to Linx Consulting.
Dow Corning and IBM scientists unveiled a major step in photonics yesterday at the Photonics West conference, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers.
Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion.
IPC recently released the C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
STATS ChipPAC and UMC announced the world's first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration.
Renesas and J-Devices signed a memorandum of understanding regarding the transfer of the semiconductor back-end production business of three facilities operated by Renesas’ wholly owned manufacturing subsidiaries
By creating a material that slows light, engineers open new possibilities in solar energy, military technology and other fields of research.
Smartphones and media tablets continue to the prime movers of technology industries, with the two mobile platforms spurring a double-digit increase in the market for microelectromechanical system (MEMS) motion sensors this year.
GlobalFoundries says it plans to build a $2 billion "Technology Development Center" R&D facility at its Fab 8 campus in Saratoga County, NY, for semiconductor technology development and manufacturing: EUV lithography photomasks to new interconnect and packaging technologies enabling 3D chip stacking, "and everything in between."
Samsung tops list; IC foundries expected to show biggest capacity gains through 2017.
Stretched-out clothing might not be a great practice for laundry day, but in the case of microprocessor manufacture, stretching out the atomic structure of the silicon in the critical components of a device can be a good way to increase a processor's performance.
In February, Infineon received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at their site in Villach, Austria.
Engineered Material Systems, a global supplier of electronic materials for circuit assembly applications, debuts its DB-1568-1 low-temperature cure die attach adhesive for attaching semiconductor die in temperature-sensitive devices.
The competitive landscape of the cellphone core integrated circuit (IC) business has completely transformed over the past five years, with Qualcomm Inc. and Samsung capitalizing on the rise of smartphones and 4G.
Silicon nanocrystals have a size of a few nanometers and possess a high luminous potential. Scientists of Karlsruhe Institute of Technology (KIT) and the University of Toronto/Canada have now succeeded in manufacturing silicon-based light-emitting diodes (SiLEDs). They are free of heavy metals and can emit light in various colors.
Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.
Signetics Corporation today introduced their new MapBGA package to the industry. This alternative to standard PBGA packaging has improved reliability and design flexibility due to its unique assembly process.
This week, India’s Finance Minister P Chidambaram offered incentives to chip makers to set up headquarters in India, in an effort to encourage local electronics manufacturing. However, the response from the industry has been less than positive. Many believe that is it is a good start, but far from sufficient.
Brooks Instrument, a provider of flow measurement and control instrumentation to the microelectronics industry, will launch the GF135 pressure transient insensitive (PTI) mass flow controller at SEMICON China, March 19-21 at Shanghai New International Expo Center.
Tokyo-based Asahi Glass Co., Ltd. and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co-found a subsidiary business, Triton Micro Technologies , to develop via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.
Silex Microsystems and BroadPak today announced the immediate availability of their jointly developed silicon interposer solution in high-volume manufacturing.
In 2012, global PCB industry saw a jump in terms of output value, benefitting in a large part from the rapid growth in the shipment of Apple and Samsung. However, there is no such possibility of a huge jump in 2013, as the report states the expected growth rate will slow down to 2.7%.
The packaged LED market is experiencing tremendous growth with an expected CAGR of 28.2% between 2009 and 2015. Yole and EPIC will publish their new market & technological studies dedicated to LED market and manufacturing technologies in November.
SEMI's August numbers indicated the possible beginnings of a peak in equipment demand -- and the September numbers sure like a pullback, with orders declining -11% in a quarter-closing month.
The International SEMATECH Manufacturing Initiative Inc. (ISMI) will relocate its headquarters and operations to CNSE's Albany NanoTech Complex beginning in January 2011. It is expected to create more than 100 jobs in NY.
Demand for semiconductor manufacturing equipment continues to surge as the industry emerges from its slumber, with some measurements showing strength not seen in several years, according to the latest monthly data from SEMI and SEAJ.
The latest monthly sales & order data for US-based and Japanese semiconductor manufacturing equipment shows growth slowing down -- and possibly because except for some pockets, it may be time for things to pull back a little bit.
Samsung's announcement that it has completed testing of its 32nm high-k/metal gate architecture, ramping to volume possibly by year's end -- and following quickly with a 28nm version -- has the industry buzzing about a possible reshaping of leading-edge semiconductor foundry manufacturing.
The use of strain engineering can have a positive impact on a device's robustness to electrostatic discharge (ESD). At the upcoming IEDM event, researchers from the US and Europe will discuss the impact of strain on different ESD protection devices in bulk silicon and SOI.
Five factors drove TSMC's decision to select the gate-last approach: speed, power, reliability, manufacturability, and scalability. Di Ma, VP, field technical support at TSMC, speaks with ElectroIQ about TSMC’s efforts with respect to transistor architecture beyond HK+MG.
Good news: September numbers for semiconductor equipment demand were a little bit better than originally thought. Bad news: October numbers are worse, and it's even more clear that we're on the downslope of a summertime demand peak.
Semiconductor equipment suppliers reported continued moderate growth that's increasingly back in line with pre-downturn levels, according to the latest monthly data from SEMI.
Demand for semiconductor capital equipment continued to increase in the final month of 2009, and with the key book-to-bill ratio now six straight months above parity suggests growth still lies ahead, according to the latest industry data.
Mattson Technology Inc. (NASDAQ: MTSN), advanced wafer fab process equipment supplier, received orders for multiple Suprema photoresist strip systems from a new Asian customer. The Supremas will be used in both front-end-of-line (FEOL) and back-end-of-line (BEOL) applications for advanced logic device production.
Techcet's Michael A. Fury closes out his series of observations from this year's MRS Spring meeting in San Francisco. From Day 5: Ge-Si integration, carbon nanotubes in organic photovoltaics, energy storage using paper, printable GaN semiconductors, and stretchable circuit boards and conductors.
Techcet's Michael A. Fury continues his series of observations from this year's MRS Spring meeting in San Francisco. From Day 2: CVD for Cu interconnects, controlling low-k etch-stop layers, materials challenges for future FETs, "atom hopping" in graphene, and oxide nanoelectronics on demand.
Tokyo Electron Limited and Tanaka Kikinzoku Kogyo K.K. have developed a sucessful recycling process for ruthenium precursors (CVD-ruthenium material) used in next-generation semiconductor miniaturization technology.
The VIISta Trident high-current ion implanter from Varian Semiconductor Equipment Associates Inc. (NASDAQ: VSEA) enables high-performance, low-leakage devices while improving productivity at the sub30nm wafer fab node.
Mark Danna, Owens Design, discusses the key questions that should be asked when selecting a strategic outsource partner particularly in the area semiconductor and solar manufacturing equipment development.
SAFC Hitech announced plans to build a new, dedicated facility in Kaohsiung, Taiwan for transfilling, technical service and production of chemical precursors used for high brightness LED and silicon semiconductor manufacturing.
Brion Technologies, a division of ASML, debuted the Tachyon NXE software to optimize predictive modeling for ASML EUV scanners. EUV scanners enable smaller, faster, cheaper and more energy-efficient semiconductors. This article includes a podcast interview on the technology.
Barclays analyst CJ Muse looks at the numbers for semiconductor equipment companies, and says there's a combination brewing that could create "the catalyst, finally, for consolidation in the equipment space."
The chip industry keeps chugging along the recovery road, with another "dramatic" month compared to the depths of a year ago -- and one key statistic is at an eye-popping seven-year high, according to the latest monthly figures from SEMI.
No surprise that 2H09 was a comeback period for semiconductor equipment and materials suppliers, but new "final" numbers from SEMI suggest some late-season changes in behavior in some regions, and ultimately sets the stage for a better 2010.
Intel has given its nod to two dozen key partners from its roster of thousands of supply-chain contributors as the 2009 winners of its annual supply chain awards -- and within the listings is a interesting nugget about the chipmaker's lithography strategy.
Flametec fire-safe materials are formulated to exceed fire compliances for polymers in semiconductor, clean room, and other applications. Flametec is used for a variety of applications including tools, wet benches, cabinetry and furniture.
SEMI's June numbers for semiconductor equipment demand hit a milestone, officially surpassing pre-meltown levels, but numbers are somewhat mixed -- and the future's as blurry as ever.
SEMICON West 2010 wrapped this week in San Francisco. This article includes JC Kim, SEMI Board of Directors Chair, discussing the show and the semiconductor industry future. We also have POVs from the show floor by the ElectroIQ.com bloggers.
Innovation drives everything -- and innovation spawned from the semiconductor and related industries is poised to do nothing less than change the world, or at least help everyone adapt better to it, as related by SEMICON West kickoff keynoter Bernie Meyerson of IBM.
Unit shipments of key semiconductor materials are already back to record levels just a year after the most punishing period in the industry's history, but the growth will slow in 2011 for several reasons, according to the latest forecast data presented at SEMICON West.
In August 2010, the Semico IPI index experienced its first drop since December 2009. The Semico IPI Index signals changes in the direction of semiconductor sales growth one year in advance.
SEMICON Taiwan will say "bienvenue" to 10 companies from France, including research group CEA-Leti, international development agency UBI France, and suppliers like Satin Technologies and IBS.
S&P Equity Research semiconductor and semiconductor equipment analysts Clyde Montevirgen and Angelo Zino have issued their 2011 forecasts for the industry, covering sales/revenues, capacity utilization, back-end equipment, solar crossover, and more.
North America-based manufacturers of semiconductor equipment posted $1.51 billion in orders in November 2010 and a book-to-bill ratio of 0.96, according to the November 2010 Book-to-Bill Report published by SEMI.
The BIANCHO project (BIsmide And Nitride Components for High temperature Operation) will develop new semiconductor materials to allow lasers and other photonic components to become more energy efficient and also more tolerant of high operating temperatures.
As 2010 shapes up as a record year for semiconductor equipment spending, so the following two years will be a slow fall back to Earth with low single-digit overall growth, according to SEMI's updated forecasts -- though there are some interesting trends within the numbers.
Eleven semiconductor equipment manufacturers earned VLSI Research's five-star rating this year, earning top marks in various metrics adding up to "exceptional customer satisfaction."
The recent difficulties in semiconductor sales and the unusually rapidly declining IC price/performance index are slowing semiconductor equipment demand. Essentially, 2010 has been a 2-for-1 deal for both chips and equipment with two years of growth in one year, resulting in overcapacity and declining chip prices, says VLSI.
Researchers at Rice U. say they've figured out that new switching memory they built with electrically manipulated 10nm graphite strips doesn't actually need the graphite -- good ol' reliable silicon oxide will do just fine.
The IC community has been searching for a manufacturable low-k dielectric which could scale to below K = 2.0, says Dr. Phil Garrou. Microindent photos of uLK 124, released by SBA Materials show a clean ductile indent. SBA reports that their uLK materials can be integrated into existing fab lines using equipment and process flows already in place.
Robert Pagliaro, RP Innovative Engineering Solutions, demonstrates that simple but effective enhancements to wet clean steps can help achieve more stringent surface preparation and reduce complexity, cost of ownership (COO), and environmental concerns associated with existing methods. Contamination left or caused by cleaning and drying steps can adversely affect wafer yields.
AMO GmbH and SUSS MicroTec AG are developing applications for substrate conformal imprint lithography (SCIL) with UV curing material. Due to unique sequential contacting and separation technology, a distortion-free replication of a stamp at high throughput is now possible with UV-SCIL.
At IEDM, Semiconductor Research Corporation and researchers from Waseda University announced process and materials development for precisely controlling both the amount and the position of channel dopants. The researchers say this advance should help extend the manufacturability of semiconductors beyond conventional doped-channel device technologies. The result is projected to enable near atomic-scale devices and single-dopant devices.
GLOBALFOUNDRIES teamed with Cadence Design Systems to create an open-access 28nm Analog/Mixed-Signal (AMS) production design flow development kit.
The latest data from SEMI and SEAJ tracking semiconductor equipment demand confirms that things are still slowing down, but the sector remains at record levels -- for now.
It's déjà vu all over again for semiconductor wafer fab equipment spending, says Barclay's CJ Muse, as the industry seems to be repeating the 2004-2006 cycle of two strong years sandwiching a flat one.
sp3 Diamond Technologies' Dwain Aidala explains how the move to Cu CMP and caustic slurries are driving interest in diamond pad conditioners, and also as a potential SOI layer for high-power applications. He also addresses a shift in how R&D funding has changed as external capital has become scarce.
Nujira opened an IC Design Centre in Edinburgh, Scotland, with the help of
IC maker Samsung Electronics Co. Ltd. acquired Grandis Inc., a Silicon Valley maker of spin transfer torque random access memory (STT-RAM).
Sapphire Materials Company (SMC), a subsidiary of Silicon Chemical Corporation (SCC), completed Phase I of its sapphire manufacturing business. Initial shipments of sapphire product will begin this November.
How can we become more productive? Provide more of our goods or services for the same or less cost? The typical answer is automation. However, automation is not the panacea today's businesses need to cure lack of competitive products or services.
In an exclusive series of blogs, imec reports from its International Technology Forum (ITF) last week in Brussels. Els Parton, science editor, imec, shares Jy Bhardwaj's (Philips Lumileds) points about LEDs costs improvements.
In an SST-exclusive series of blogs, imec reports from its International Technology Forum this week in Brussels. Geert Vandenberghe talks about how EUV lithography is at a readiness crossroads, but he feels "fairly secure" about its current capabilities.
Mike Besnard, ATMI, speaks about evolving the high-productivity combinatorial research method to vet wafer processing tools for the ramp to high-volume, not just to screen semiconductor materials. He caught up with ElectroIQ.com at The ConFab.
KLA-Tencor will join SEMATECH-led efforts to identify and eliminate defects in EUV lithography, including mask metrology infrastructure and metrology source development.
Metryx will work with IMEC and Intel via the joint European Semiconductor Equipment Assessment Leveraging Innovation (SEAL) project to assess high-resolution mass metrology viability at 20nm and smaller nodes.
FSI International Inc. (Nasdaq:FSII), surface conditioning equipment supplier, won orders for multiple ORION single wafer cleaning systems. A memory maker will use the ORION in wet photoresist strip and etch and a foundry will use it for backend-of-line (BEOL) processes, like cleaning film stacks.
Nordson MARCH introduced the FlexTRAK-WF low-cost, cassette-based automated plasma treatment system that handles five wafer sizes with minimal hardware change-over.
Avantor Performance Materials will launch the first in its new J.T.Baker SLCT Series of selective etch surface treatment chemistries, SLCT 128 sigma etchant, at SEMICON West. The product results from a partnership with etch specialist SACHEM.
SmartKem Limited tested its advanced semiconductor materials against amorphous silicon at the National Printable Electronics Technology Centre, where it achieved better thin-film transistor (TFT) mobility rating.
At this week's AVS/ALD Conference, Intermolecular's Chi-I Lang reports on Day 2 highlights: faster and more flexible approaches to ALD processing, integration challenges with platinum ALD, a peek behind the curtain of equipment development, and the unique challenge of vendor support for high-volume manufacturing.
Nordson Corporation (NASDAQ:NDSN) opened a demo center in Dongguan, China for customers of its Advanced Technology Systems operating segment: Nordson ASYMTEK, Nordson DAGE, and Nordson YESTECH brands.
Intermolecular's Chi-I Lang reviews highlights from the opening day of this week's AVS/ALD Conference, with key themes in interface engineering, the need for better control, and monitoring interface quality using in-situ STEM.
Heidelberg Instruments optioned University of Colorado Boulder's technique for shrinking copper circuits by zapping a substrate with two separate colors of light beams.
SUSS MicroTec unveiled MaskTrack Pro InSync, a holistic in-fab EUVL mask management product that synchronizes mask cleaning, handling, inspection, and storage.
North America-based manufacturers of semiconductor equipment posted $1.55 billion in orders in June 2011 (three-month average basis) and a book-to-bill ratio of 0.94, according to the June Book-to-Bill Report published by SEMI.
The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.
SEMI projects that worldwide sales of new semiconductor manufacturing equipment will reach $41.8 billion in 2011, decline in 2012, and rebound again in 2013. Front-end equipment experienced an increase in sales this year, while back-end tools saw a decrease.
EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool functionality. The platform will be used for all high-volume manufacturing tool offerings.
Applied Materials released a new film treatment, Applied Producer Onyx, that reduces the power consumption in semiconductor chips while increasing mechanical strength. The product targets the challenges associated with 3D packaging applications and technologies.
Paul Feeney, director of process technology at Axus and ITRS co-leader for planarization topics, reports from the International Conference on Planarization/CMP Technology in Korea. Technical themes continue to address main areas (STI, ULK) but also explore new applications (e.g. TSVs), non-uniformity, and interaction between all the CMP process components.
Demand for semiconductor manufacturing equipment continues to inch up, with demand staying relatively steady as prior sales flush out the supply chain, according to data from SEMI.
John Iacoponi, IITC 2011 co-chair, reviews Day 2-3 discussions at IITC/MAM, including interconnect reliability, BEOL memory, 3D integration, process integration, ultralow-k, and future-looking talks on graphene and carbon nanotubes.
Peter Singer recently toured the Center for Advanced Materials Processing (CAMP) at Clarkson University. The following video interviews with researchers and professors cover particle transport, chemical-mechanical planarization (CMP), cleanroom technologies, and bright nano particles, among other topics.
Three chairs of IITC-MAM, opening next week in Germany, share details on papers attendees won't want to miss. Among the hot-button technologies are through silicon via (TSV) integration, RC performance, carbon interconnects, and pushing traditional technologies farther (think lithography).
Applied Materials said it will acquire Varian Semi in a $4.9B deal. VSEA stockholders have now approved the buy.
Michael A. Fury concludes his series of reports from this year's MRS Spring meeting. Highlights from Day 5: lots of papers targeting optoelectronics and interconnects with graphene and nanotubes, lots of work in organic materials and devices, and several pathways for technologies in life science applications.
North America-based manufacturers of semiconductor equipment posted $1.70 billion in orders in March 2011 and a book-to-bill ratio of 0.95, according to the March Book-to-Bill Report published by SEMI.
Michael A. Fury continues reporting from this year's MRS Spring meeting. Highlights from Day 4: NEMS and MEMS devices, organic electronics, deposition (ALD, CVD, and ED), and measuring stresses in Cu TSV.
President and CEO Stanley T. Myers has informed the SEMI International Board of Directors of his intention to step back from executive leadership of SEMI this year. An executive search team will immediately begin looking for his successor.
Longtime semiconductor exec Takeshi Hattori continues his reporting on the aftermath of the massive Japanese earthquake and tsunami: Updates on efforts to control the nuclear crisis, efforts to shift to "summertime" schedules to manage energy usage, and evidence of shortages in key materials for semiconductor manufacturing (H2O2 and silicon).
Researchers at Eindhoven University of Technology have developed a replacement for indium tin oxide (ITO). This transparent, conducting film is produced in water, and based on electrically conducting carbon nanotubes (CNT) and plastic nanoparticles. The film currently provides a factor 100 lower conductivity than ITO, but this could rapidly change.
At 13% of the total equipment spending for semiconductor manufacturing, secondary equipment and services are gaining importance at both 300 and 200mm fabs. SEMI and Semico announce results of their Secondary Semiconductor Equipment Market Study.
Two analyst reports review just how prosperous 2010 was for most (but not all) semiconductor capital companies, and how 2011 is shaping up to be even better -- even with ramifications from Japan's earthquake/tsunami disaster.
University of Illinois researchers found that graphene transistors have a nanoscale thermoelectric cooling effect that can be stronger at graphene contacts than resistive heating, lowering the temperature of the transistor.
Imec researchers will present "Carbon nanotube interconnects: electrical characterization of 150nm CNT contacts with Cu damascene top contact" at IITC 2011. Dr. Marleen van der Veen, senior research scientist at imec discussed the research results and their significance.
As SEMI's numbers for semiconductor manufacturing equipment climbed again in March, one slice of the data suggests that the backend-as-leading-cyclical-indicator wisdom we've been taught to follow may not be valid this time around.
Twenty-eight companies get the nod from Intel's latest supplier awards, including four "Achievement" award winners.
Boston Semi Equipment acquired the assets of Asia Tech Corporation, launching BSE Tech LLC. BSE Tech will deliver pre-owned front end semiconductor manufacturing equipment and spare parts, technical capabilities and financial solutions from a larger facility, with added cleanroom space.
SEMICON West preview: Alternative energy applications are poised to help drive the power semiconductor market over the next few years, and devicemakers are taking a close look at key issues to meet those market needs.
Michael A. Fury reports from Day 2 of SEMI's Strategic Materials Conference (SMC), where discussions focused on material and technology trends, application in nontraditional areas including medical electronics and LEDs, and discussion of materials-specific supply-chain challenges.
Wafer fab capex in 2011 is expected to stick around 2010 levels. But don't despair of growth, says Dean Freeman of Gartner. For one thing, cutting-edge wafer fab equipment will be hot. On top of that, 2011 will be a brief respite, with a strong 2012/2013 waiting in the wings.
Single-exposure patterning schemes are unable to meet 22nm specifications, which leads fabs to use double-patterning like LELE. However, below 22nm, a simple multiplication of double-patterning is exceedingly difficult. Alternative processes like tone reversal, EUV, and resist freezing are under development, says Nick Pugliano, Dow Electronic Materials. This is an online exclusive essay in SST's Forecast for 2011: Back to Reality series.
SmartKem Ltd, developer of novel printable semiconductor materials for flexible electronics, announced that the Welsh Assembly Government has awarded the company £335,000 in funding to further develop its flexible printed electronics solutions.
Appropriate for this blustery ski season, the clear view of semiconductor equipment demand appears to be heading down a slope, according to data from semiconductor manufacturing equipment makers.
Steed Technology, thermal processing equipment provider for semiconductor, LED, and solar cell manufacturers, acquired all of the outstanding stock of Applied Technology Specialists, Inc. (ATSI), an advanced engineering firm that specializes in developing advanced pollution control equipment and technology. The merger will enable equipment integration and additional "green" consulting expertise at Steed.
Arizona State University's Hongbin Yu and Hao Yan are exploring how to use top-down lithography combined with modified bottom-up self-assembling nanostructures to guide the placement of nanostructures on silicon wafers.
The imec multi-partner industrial R&D program on GaN semiconductor materials and device technologies focuses next-generation GaN power device and LED development. The collaboration between Dow Corning and imec will concentrate on bringing the GaN epi-technology on silicon wafers to a manufacturing scale.
FEI (Nasdaq:FEIC) and CEA-Leti entered into a three year agreement to characterize advanced semiconductor materials for the 22nm technology node and beyond. The companies will measure strain changes in semiconductor structures.
Custom fabricated sapphire wafer carriers that are uniform, parallel, and impervious to solvents and etchants for thinning semiconductor materials are available from Meller Optics Inc.
More evidence for a slowing market: SEMI's January data is back on a downward trend for demand in semiconductor equipment, though the group is "encouraged" by recent capex announcements.
Sales of semiconductor materials rose 25% in 2010 to a new record $43.55B thanks to surging device shipments, according to final tallies from SEMI.
While semiconductor fab has always created nanoscale dimensions, a new class of nanomaterials -- graphene, carbon nanotubes (CNTs), nano-metal alloys, quantum dots -- behave radically differently than current materials. Nanotechnology promises higher-performance memory capacity and transistors in future semiconductors, says Giles Humpston, Tessera.
There are over 100 production semiconductor fab lines in 53 locations in Japan, say analyst groups IHS iSuppli and Semico. Over a week after the crippling earthquake and tsunami hit northeastern Japan, analysts consider the next business step, with power outages and aftershocks still disrupting production in areas not directly hit by the crisis.
Horacio Mendez, executive director of the SOI Industry Consortium, discusses how planar FD-SOI technology enables substantial improvements in performance and power consumption. The SOI Industry Consortium recently announced results of an assessment and characterization of FDSOI, based on the ARM Cortex processor as a prototyping vehicle.
After beta testing and product analysis, CyberOptics Semiconductor has released the WaferSense Airborne Particle Sensor for wafer processing equipment. The sensor identifies particle sources in tools, moving through semiconductor process equipment and automation material handing systems to monitor airborne particles. It reports information in real-time on wafer contamination.
Among the snapshot trends taken from SEMI's February semiconductor equipment demand numbers: tool sales are on a three-month roll, but orders coming in appear to be plateauing.
NexPlanar tasked its recently hired CTO, Dr. Rajeev Bajaj, with expanding on the core capabilities of their chemical mechanical planarization (CMP) product platform to add new materials and microstructures, enabling customers to implement advanced processes.
Ceramic materials provider Ceradyne took a minority interest in Yamanaka, which supplies advanced materials for solar, semiconductor, optical fiber, and other industrial and energy sectors.
Ron Kool from ASML reports on updates in EUV and other next-generation lithography technologies at this year's SPIE Advanced Lithography symposium.
Applied Materials Inc. (Nasdaq:AMAT) presented five companies with awards for helping Applied meet its strategic business goals in 2011.
In video blogs from this week's TECHCON 2011, students share their current research projects from lead-free solder to graphene for new transistors, and members of industry giants like IBM share how SRC-supported research benefits the industry.
Jim Walker, VP, Research of Semiconductor Manufacturing and Emerging Technologies, at Gartner, speaks with Solid State Technology about revising Gartner
The U.S. Court of Appeals for the Federal Circuit issued an opinion yesterday vacating the adverse judgment against Camtek in a patent infringement case brought against it by August Technology Corp., now Rudolph Technologies Inc.
Argonne Lab researchers have created an e-beam lithography process that boosts resist layers to eliminate the hard mask application. It results in more precise features and deeper etch for semiconductor, solar energy, and other products.
North America-based manufacturers of semiconductor equipment posted $1.30 billion in orders in July 2011 and a book-to-bill ratio of 0.86, according to SEMI. The book-to-bill for the Japanese chipmaking equipment sector dropped to 0.84 in July, the Semiconductor Equipment Association of Japan reported.
How will heavy demand for tablets and smartphones translate into chipmaking capacity investments over the next few years? Citi's Tim Arcuri runs some numbers to come up with the answer: $10B annually.
Semiconductor equipment spending in 2011 looks to be slightly weaker than anticipated, and is looking a lot softer in 2012 across the board, according to Gartner's new semiconductor capex forecasts.
With PC demand waning, reports indicate Intel is rethinking part of its 22nm investment plans, which would dent industrywide capex forecasts for 2012.
SEMI appointed Dennis P. McGuirk as president and CEO. He replaces Stanley T. Myers, who is retiring. McGuirk comes to SEMI from IPC -- Association Connecting Electronics Industries, where he led a globalization effort.
Syn: Robert Newcomb from Qcept Technologies discusses non-visual defects in today's wafer fab processes, at 22nm, and in the advanced nodes below 22nm. As nodes shrink, more defects will escape optical metrology, he predicts.
Mattson Technology Inc. (NASDAQ: MTSN) won acceptance for its Helios XP rapid thermal processing (RTP) system for process of record from a major Asian foundry.
SEMI honored Dr. Tibor Pavelka (Semilab) with the European SEMI Award; Heinz Kundert (SEMI Europe) with the IC Industry Award for Excellence; and Christian Prischmann (UIbrich) with the SEMI Europe Standards Leadership Award.
ATMI has taken control of, and responsibility for, worldwide distribution of its proprietary Safe Delivery Source (SDS), gas storage and delivery system and related technologies from Matheson Tri-Gas.
Shifts among executive and organizational ranks at Applied Materials suggest new streamlining efforts, but also leave unanswered questions as to why. Here's the skinny on the two major moves out of the lot.
The latest numbers on North American and Japanese semiconductor equipment demand suggest continued growth and recovery, though analysts see a long climb back to normalcy.
A flexible, forward-thinking platform will be vital to meet cost and productivity challenges of 450mm and beyond. John Klawender and Terry Bluck from Intevac describe the concept and capabilities of a universal platform, with test and system modeling results.
Semiconductor manufacturing equipment demand slowed a bit in November but still kept up a pace of growth, lending more weight to the outlook for improved fab spending heading into 2010, according to the latest data from SEMI and SEAJ.
The latest semiconductor capital spending forecast from Gartner solidifies the 2009 outlook with another positive bump-up, and the firm sees the climate significantly improving for almost all sectors well into the future. Gartner research VP Dean Freeman helps SST break down some of the numbers.
Ten equipment and materials suppliers have received top nods from top foundry Taiwan Semiconductor Manufacturing Co. (TSMC) for contributions over the past year.
After shrinking over the past two years to the lowest levels in two decades, global semiconductor equipment sales will surge mightily in 2010 and 2011 -- but with no real capacity upgrades, and that could spell trouble if chip demand is as robust as some believe, notes SEMI.
IQE plc has agreed to acquire UK compatriot NanoGaN, which offers processes and IP related to gallium nitride (GaN) materials and devices, in a deal worth up to £3.6M.
The good news continues to shine in semiconductor equipment demand for suppliers in North America and Japan, according to the latest monthly data from SEMI and the SEAJ, though some softness may warrant some attention heading into the holiday season.
Cost and performance between silicon-on-insulator (SOI) and bulk finFETs are "for all practical purposes equivalent," but finFETs are more challenging to manufacture due to increased process variability, according to results from a study from the SOI Industry Consortium.
Semiconductor tool orders in North America showed year-on-year growth for the first time in nearly two-and-a-half years, and demand continues to ramp in Japan -- more evidence that the industry is climbing out of the deep hole in which it's been mired.
EDA vendor Mentor Graphics has acquired Israeli firm Valor Computerized Systems, a maker of PCB design software, in an $82M cash-and-stock deal planned to close in early 2010.
Brooks Automation's S.E. Syssoev et. al. summarize development of a new cryopump design for type II gases that prevents wafer contamination by uncontrolled intermittent pressure bursts inside the chamber, and also increases capacity by 50%.
At a seminar at San Francisco's Moscone Hall, a leading technologist surmised that millisecond annealing for USJ dopant activation will be pushed out to the 45nm node, but flash/RTA (rapid thermal annealing) or laser annealing will be needed at the 65nm node for poly depletion improvements.
Analyzing a wire bond problem with x-ray microanalysis tools
EXECUTIVE OVERVIEW One area of device reliability is the physical and electrical connection of the die to the lead frame through the bond wire. Even with the emergence of new techniques for the connection of die to circuit board, the wire bond is still a mainstay of the semiconductor industry....
Fujitsu reports progress towards carbon nanotube interconnects for 32nm
While exotic properties of materials in the nanozone (1-100nm) promise a host of new devices and applications, success in the marketplace will depend on making tough choices and focusing on developing products offering sustainable profits.
Nanotechnology may have a revolutionary impact on leading-edge semiconductor process technology beyond 32nm when traditional scaling reaches the fundamental limits of physics, but for at least the next five years or so the significant nanotechnology applications in electronics will likely be lower-cost displays and memories, according to SEMI's new Global Nanotechnology Markets and Opportunities study.
Big players introduced tools for 45nm production at SEMICON Japan, but much of the activity was in improved materials that could at least be hyped as nanotechnology, and of course in more new types of metrology tools, with wafer-edge inspection a particularly hot niche for new product introductions. The other major theme: diversification into new markets for all sorts of players.
Much has been written recently about the escalating cost of R&D funding required by semiconductor equipment OEMs in order to stay on the IC development trajectory required by the ITRS and Moore's Law. The gap in what is required and what can be supplied, based on the current OEM business model, has shown that this deficit could be as high as $9.3 billion by the year 2010 .
The tradition of the ISMI Manufacturing Symposium as an "in the trenches" conference, by and for the people doing the actual day-to-day work in the fabs, continued Oct. 24-25 in Austin, TX. Particular attention was given to topics on yield improvement/productivity methodologies, ESH, and sustainability. Specific talks included how to fix litho "hot spots," cleaning wafer chucks without DI water or solvents...
By J. Robert Lineback
The first wave of production-worthy 193nm immersion scanners now appears to be a shoo-in for at least part of the 65nm process generation and probably the entire 45nm node at decade's end, but industry managers and researchers speaking at the annual SPIE International Symposium on Microlithography attempted to rein in some of the unbridled enthusiasm with...
Reliability testing using a highly parallel source-measure method
New semiconductor materials and shrinking device dimensions have made reliability testing increasingly important because the gate dielectric behavior of modern devices isn't well understood, requiring the development of new device lifetime models. However, traditional test methods are time consuming and not suitable for new materials and shorter development cycles. A new approach...
Factoring the environment into wafer fab conversions
Increasingly, semiconductor manufacturing hurdles are being addressed with new materials and wafer processing techniques that present ever changing environmental challenges. However, process changes and the introduction of larger 300mm wafers also open up the opportunity ...