Metrology

Topic Index

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Plated leadframe metrology

Mon, 4 Apr 2002
Optical collimation improves capabilities for Au/Pd/Ni films

Microsoft, SanDisk Enter Joint Venture

Mon, 5 May 2007
(May 14, 2007) REDMOND, WA and MILPITAS, CA — To develop a next-generation hardware and software solution for USB flash drives, Microsoft and SanDisk Corporation will collaborate and open an entity for licensing compatible hardware designs and intellectual property (IP). Revenues from the joint venture will be shared. Microsoft is discussing licensing software with third-party hardware vendors.

MEMS Metrology System

Mon, 6 Jun 2007
The DSM200 automated metrology system performs cassette-to-cassette front-to-back alignment for front- to back-side alignment applications, such as MEMS, power semiconductor, and optoelectronics assembly.

Flip Chip Metrology
Veeco

Tue, 9 Sep 2007
The Wyko SP9900 surface-profiling optical metrology tool monitors height, yield, roughness, and other parameters of multilayer organic panels for pin grid array (FC-PGA) and ball grid array (FC-BGA) flip chip packaging. It offers faster measurement, increased sample access, and up to 600 × 600 mm panel measurement within the SP equipment footprint.

Air-cooled wafer probe chuck debuts in modular format

Mon, 10 Oct 2011

ERS uncrated the ERS AirCool 3 wafer thermal test system with modular options and easy integration into all major wafer prober systems.


Tamar Technology debuts TSV metrology tool WaferScan

Tue, 10 Oct 2011

Tamar Technology shipped its first fully automated WaferScan system to a major semiconductor fab. The system performs TSV etch depth, deep trench depth, wafer thickness, photo-resist thickness, and hole diameter metrology.


Wafer Scanner for Bump Metrology

Tue, 6 Jun 2008
The WS 3840, Rudolph Technologies' latest addition to the Wafer Scanner product family for inspection and metrology, integrates the company's laser triangulation technology for 3D bump metrology and sensitive 2D image-based macro defect inspection on the same wafer handler platform that is used by all of its advanced inspection and metrology tools. Laser triangulation reportedly allows for fast and accurate measurement of bump height and coplanarity.

Advanced Probe Card Analysis Improves Yields, Speeds Product Development and Reduces Test Costs

Tue, 7 Jul 2008
By Darren James, Rudolph Technologies, Inc.
With the cost of some advanced packages reaching several times the cost of the die they contain, the value contributed by functional testing, which allows manufacturers to avoid the cost of packaging defective die, has grown dramatically. Of course, testing has its own costs in both money and time.

June Names in the News

Mon, 6 Jun 2008
(June 30, 2008) It was a month for names in the news as acquisitions and evolving business strategies inspired executive appointments and reorganization; industry organizations added members and directors, and books got published. Company announcements came in from JP Sercel Associates, TRUMPF, Dage Precision Industries, ECD, Jordan Valley, Rogers Corp., Formfactor, Unisem Group, Mentor Graphics, and Alchimer.

Technologists Investigate Challenges for 3D Interconnect Metrology

Wed, 7 Jul 2009
July 1, 2009 -- To gain a better understanding of how new and existing wafer metrology technologies can be used, modified, or enhanced to measure and improve 3D interconnect processes, SEMATECH will host a workshop dedicated to 3D interconnect metrology on July 15 in conjunction with SEMICON West in San Francisco, CA.

Nanometrics WLP bonding metrology tool launches with logic order

Thu, 2 Feb 2011

The Unifire 7900IR provides 3D inspection of wafer-scale packaging features as well as registration for wafer-to-wafer bonding applications for use in advanced wafer scale packaging process control.


Semiconductor packaging house orders 14 Rudolph Technologies inspection tools

Tue, 5 May 2012

Rudolph Technologies Inc. will deliver 14 NSX Series 320 inspection systems to a large outsourced semiconductor assembly and test (OSAT) provider.


KLAC packaged IC inspector ICOS CI T620

Tue, 3 Mar 2011

KLAC's ICOS CI-T620, a high-performance component inspector system for tape and reel.KLA-Tencor Corporation (Nasdaq: KLAC) introduced the ICOS CI-T620, a high-performance component inspector system for tape and reel. The CI-T620 system has dual tapers working sequentially with minimal operator intervention to increase units per hour.


Rudolph sells metrology tool for back-end wafer packaging processes

Mon, 2 Feb 2012

Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.


New LTXC semiconductor test tools suit ASSP, RF test

Mon, 3 Mar 2012

LTX-Credence Corporation (Nasdaq:LTXC) released the Diamondx test platform for ASSP and the DragonRF for RF device test. In addition, LTX-Credence launched a SerDes test instrument and new testing software.


Rudolph wins order for advanced packaging metrology systems

Thu, 9 Sep 2012

An unidentified "premier global industry research center in Asia" will use Rudolph Technologies' MetaPulse G metrology system in its advanced packaging process development activities.


Beyond ball shear test Microprobing chip/package stress at Stanford

Wed, 4 Apr 2011

IITC paper, Stanford UniversityNew work from Stanford goes beyond simple bump shear testing to allow simulation of stresses exerted on chips during semiconductor packaging. The researchers are able to explore how the stresses affect back-end structures. Alex Hsing, a PhD student in Professor Reinhold Dauskardt's Group at Stanford University, summarizes the group's approach.


NXP metrology labs tap Tektronix for test/measurement equip calibration and repair

Thu, 5 May 2011

NXP named Tektronix Service Solutions to provide calibration and repair services for all test and measurement instruments at NXP's production and development sites in the Netherlands.


Asian foundry inspects micro bumps with Camtek systems

Thu, 5 May 2011

Camtek Ltd. (NASDAQ and TASE: CAMT) received repeat automatic optical inspection (AOI) orders from an Asia-based foundry doing advanced micro bump inspection and metrology. Challenges arise in measuring such small bumps used in advanced packages, including efficiently handling huge amounts of data.


Agilent

Tue, 8 Aug 2012

Agilent debuted its compliance test application, Agilent N6462A DDR4, for systems using DDR4 memory.


Semiconductor test terminology guide aims to clarify docking and handling ops

Tue, 7 Jul 2012

SEMI's Collaborative Alliance for Semiconductor Test released a Docking and Mounting Generic Terminology Guideline document that can be used to improve the

Lasertec joins SEMATECH 3D packaging research, installs 300mm TSV IR etch metrology tool

Thu, 7 Jul 2010

Lasertec joined SEMATECH’s 3D Interconnect program to develop robust, cost-effective process metrology technology solutions for readying high-volume via-mid through silicon via (TSV) manufacturing. This article includes a video interview with SEMATECH about the partnership.


Foundry-orders-Nanometrics-TSV-metrology-system

Fri, 12 Dec 2010

Nanometrics Incorporated (Nasdaq: NANO) announced that a leading semiconductor foundry has ordered a UniFire 7900 metrology system for advanced 3D wafer-scale packaging process control.


SEMATECH, SIA, SRC pursuing 3D standards

Tue, 12 Dec 2010

SEMATECH, the SIA, and SRC have established a new 3D Enablement program targeting standards in inspection, metrology, microbumping, bonding, and thin wafer and die handling.


GE-intros-CT-system-for-3D-metrology-and-analysis

Mon, 11 Nov 2010

tsv ctThe phoenix nanotom m, from GE´s Inspection Technologies business, has been developed for high resolution and high precision X-ray computed tomography (CT) in non-destructive 3D analysis and 3D metrology.


Rudolph-Asia-OSAT-collab-on-2D-defect-inspection-3D-solder-bump-TSV-depth-metrology-for-stacked-die

Tue, 11 Nov 2010

Rudolph’s NSX Series Macro Defect Inspection Systems Rudolph Technologies Inc. (RTEC) is partnering with a major outsourced semiconductor assembly and test (OSAT) services manufacturer to provide its inspection and metrology capability in the development of stacked packaging processes. The process uses silicon interposer technology, sometimes referred to as 2.5D IC, as an intermediate step toward full blown 3D ICs.


EuroPIC: European manufacturing consortium for photonic integrated circuits

Thu, 1 Jan 2010

The EuroPIC project aims to facilitate access by small companies to cost-effective photonic integrated circuit (PIC) manufacture in Europe. It also will encourage research on manufacturing methods to develop an open-access industrial generic foundry production capability for Europe. EuroPIC is a collaborative project formed by a consortium of experts, consisting of a mix of small- to medium-sized enterprises (SMEs), industry, and academic partners in the fields of component manufacturing, PIC design and applications, photonic CAD, and packaging.


ams offers foundry customers KGD with enhanced IC test

Mon, 6 Jun 2012

The Full Service Foundry business unit of ams extended its dedicated test solutions for foundry customers, offering known good die (KGD), with customers' complex analog/mixed-signal ICs 100% electrically tested according to their own test specification.


TSV moves to "real engineering," but reliability data needed

Mon, 7 Jul 2011

Jan Vardaman, president and founder of TechSearch International, summarizes highlights from her SEMICON West presentation on TSVs, speaking to RDL development, LED packaging, and TSV-alternative PoP.


Olympus inspects bonded wafers with IR microscopy

Tue, 7 Jul 2011

Greg Baker, Olympus Integrated Technologies America, discusses why the company chose to focus its efforts on IR metrology for defect inspection of bonded wafers. Olympus-ITA launched the latest 3DIR Metrology and Defect Review System at SEMICON West 2011, booth 1524.


Thin-wafer bond/debond metrology from EVG opens process control, supply chain possibilities

Tue, 6 Jun 2011

EV Group (EVG) added an in-line metrology module for its EVG850TB/DB automated temporary bonding and debonding systems.


Micronic Laser Systems Moves to Acquire MYDATA

Tue, 4 Apr 2009
(April 21, 2009) TÄBY, Sweden — Micronic Laser Systems AB intends to acquire MYDATA automation AB. In the proposed transaction, Micronic would acquire MYDATA from Skanditek Industriförvaltning and the minority shareholders against payment in the form of newly issued shares in Micronic. Combining Micronic and MYDATA will create large potential within the market for electronic packaging using Micronic's and MYDATA's complementary imaging and deposition technologies.

SEMICON West Exhibitor's Products

Mon, 6 Jun 2009
(July 15, 2009) — Following are some of the booth highlights from companies exhibiting at SEMICON West, July 14–16, 2009 in San Francisco, CA. Booth demonstrations include cleaning products for flip chips, bonded wafer inspection systems, airborne particle sensor/monitors, die-attach systems, and more for semiconductor manufacturing, packaging, and test.

Step 8: Package Inspection

Fri, 9 Sep 2000
With the trend toward smaller packages and tighter tolerances, the role of total package inspection is becoming more vital to the assurance of final product quality. At the same time, the drive for cost reduction and flexibility dictates that all inspection requirements be satisfied by a single, integrated, high-throughput inspection platform.

Surface Height Mapper

Sat, 4 Apr 2000
The NanoMapper metrology tool provides whole wafer topology data for 200-mm and 300-mm wafer sizes using non-contact optical measurement to quantify nanometer scale surface height variations. It responds to process development needs for leading-edge semiconductor devices down to 0.1 micron. Tracking the phase of the optical signal using proprietary interferometric technology results in the sub-nanometer resolution of the measurement.

Bruker bolsters CT imaging line with SkyScan buy

Mon, 4 Apr 2012

Bruker Corporation acquired all of the shares of SkyScan NV, a scientific instruments company serving materials science and life sciences/pre-clinical imaging needs.


High voltage SourceMeter introduced

Tue, 3 Mar 2012

ARM’s Segars sees changing requirements for electronics driven by mobile

Mon, 3 Mar 2012

At the recent Common Platform Technology Forum -- produced by Global Foundries, Samsung and IBM -- Simon Segars, executive vice president and general manager of the physical IP division at ARM, spoke about the impact of the internet of things and mobile computing on the way electronics are designed and used.


2011 ITRS: DRAM, 3D Flash, MEMS, nano scaling steal the show

Wed, 2 Feb 2012

The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.


Semiconductors to use most ultrapure water in 2012

Tue, 2 Feb 2012

The electronics industry will edge out coal-fired boilers as the biggest purchaser of ultrapure water systems and consumables in 2012, according to the McIlvaine report: Ultrapure Water World Markets.


Silicon wafer revenues increased, shipments tapered in 2011

Tue, 2 Feb 2012

Worldwide silicon wafer revenues improved 2% YOY, shows the SEMI Silicon Manufacturers Group. Worldwide silicon wafer area shipments, however, decreased 3%, indicating a loss of momentum in H2 2011, said Kazuyo Heinink, SEMI SMG.


AMAT loses top spot in VLSIresearch semiconductor equipment supplier rankings

Fri, 3 Mar 2012

VLSIresearch released its 2011 Top Semiconductor Equipment suppliers rankings, noting important acquisitions and strong spending in lithography tools in 2011. Semiconductor equipment spending was driven by aggressive capacity expansion in the foundry and logic sectors.


Samsung, IBM and GlobalFoundries look to the future: A report from the Common Platform Technology Forum

Thu, 3 Mar 2012

Execs from Samsung, IBM, GlobalFoundries and ARM looked to the future at The Common Technology Platform Forum in Santa Clara. They focused on the innovation pipeline for 20nm and 14nm technology nodes, and the role that EUV, FinFETs, TSVs, CNTs and DSA will play.


imec studies molecular beam epitaxy for advanced CMOS on high-mobility compound semiconductors

Tue, 3 Mar 2012

Riber, MBE tool supplier will work with imec on epitaxy process technologies for next-generation III-V semiconductor CMOS devices.


Semiconductor manufacturing equipment sales rose 9% in 2011

Tue, 3 Mar 2012

Worldwide sales of semiconductor manufacturing equipment totaled $43.53 billion in 2011, representing a year-over-year increase of 9%, shows SEMI. North America surpassed Taiwan as the region with the highest amount of spending.


Semiconductor wafer fab equipment trends

Tue, 4 Apr 2012

Barclays Capital compiled its 2011 analysis of semiconductor wafer fab equipment (WFE) spending, with a look at the top players and underlying trends by process step.


Semiconductor wafer fab equipment trends: Test

Tue, 4 Apr 2012

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse looks at the growth areas for test.


Semiconductor wafer fab equipment trends: Process control/Metrology

Tue, 4 Apr 2012

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse considers the rebound in process control due to weak yields at smaller chip nodes.


Wafer fab equipment leaders in 2011 and expectations for 2012

Mon, 4 Apr 2012

Barclays Capital looks at wafer fab equipment trends in 2011, based on Gartner data. Top 5 takeaways? The top 5 vendors continue to gain market share, Intel is a key customer, segment-leading vendors strengthened their holds, intensity edged higher, and changes are in store in 2012.


Semiconductor foundry integrates Nova metrology for CMP at various nodes

Wed, 4 Apr 2012

Metrology tool supplier Nova Measuring Instruments Ltd. (NASDAQ:NVMI) will provide the production tools of record performing CMP metrology at a leading foundry.


CWS upgrades on-wafer accelerated reliability line for Agilent testers

Tue, 1 Jan 2012

Core Wafer Systems, subsidiary of Action Products International, upgraded its PDQ-WLR on-wafer accelerated reliability product line to version 7.0, designed specifically for Agilent Technologies' Parametric Testers.


North American semiconductor equipment ends 2011 with another book-to-bill climb

Mon, 1 Jan 2012

North America-based manufacturers of semiconductor equipment posted $1.16 billion in orders in December 2011, $1.32 billion in billings, and a book-to-bill ratio of 0.88, according to SEMI. The book-to-bill ratio has been climbing since September 2011. In December, bookings climbed back above the $1 billion mark.


Intel, Samsung, TSMC semiconductor capex in 2012 signal market dominance

Mon, 1 Jan 2012

Intel plans $12.5 billion semiconductor capital expeditures in 2012; Samsung plans $12.2 billion. Watch for wide and growing separation between these two companies and their competition, says IC Insights.


KLA-Tencor uncrates metrology line-up for leading-edge semiconductor wafers

Fri, 1 Jan 2012

KLA-Tencor Corporation launched 3 semiconductor wafer defect inspection systems: the 2900, Puma 9650, and eS800 series. The suite is tailored to detect defects arising from new materials, device structures, and design rules.


ISS draws to a close with innovation on the mind

Wed, 1 Jan 2012

Michael A. Fury, Ph.D., Techcet Group, reports from SEMI’s International Semiconductor Strategy meeting, with a closing day focused on innovation and new applications.


Fabs in high-risk zones, 450mm, 3D IC themes of Semico's Semiconductor Fab Database

Wed, 1 Jan 2012

36% of semiconductor fabs are in high-risk zones, finds Semico, noting the industry disruptions caused by the Japan earthquake and tsunami and Thai flooding and the challenges these presented to chip makers in the regions. 


Techcet reveals CMP metrology, supply, and process trends

Tue, 2 Feb 2012

Lita Shon-Roy and Michael Fury, PhD, Techcet will present "CMP Market Outlook & New Technology - Dynamic Slurry Metrology," a free webinar at 2 times on February 22.


New RAVE division offers semiconductor makers custom lithography defect study

Mon, 2 Feb 2012

RAVE N.P. Inc. established a new division, Advanced Technical Instruments or ATI, comprising SEM, AFM, and other analysis tools, as well as custom semiconductor and photomask services such as haze generation systems.


Tektronix donates oscilloscopes, other semiconductor metrology equipment to WSU Vancouver

Mon, 2 Feb 2012

Tektronix donated semiconductor test and measurement equipment to Washington State University Vancouver: arbitrary/function generations, a real-time spectrum analyzer, digital phosphor and mixed signal oscilloscopes, Keithley's semiconductor parameter analyzers, and Fluke's True-rms multimeters.


Semiconductor yield at 450mm: Solid State Technology March 2012 issue preview

Fri, 2 Feb 2012

The March 2012 issue of Solid State Technology will feature "450mm wafer transition" from Dr. Brian Trafas, chief marketing officer at KLA-Tencor. The following is a sneak preview of Dr. Trafas' article.


Semiconductor metrology beyond 22nm: FinFET metrology

Thu, 2 Feb 2012

SEMATECH authors discuss semiconductor metrology solutions currently being investigated to address the challenges of future nodes. FinFETs raise new metrology complexities, as the entire 3D structure becomes critical for process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts.


Theta Delta's burn-in & long-term semiconductor testers gain Core Wafer Systems technologies

Thu, 2 Feb 2012

Theta Delta will incorporate Core Wafer Systems technologies into its burn-in test and long-term reliability test systems for semiconductors. Core Wafer Systems provides parallel measurement schema for semiconductor test.


ISS kicks off with IC industry reality talks

Tue, 1 Jan 2012

The Industry Strategy Symposium (ISS) kicked off today in Half Moon Bay, CA under blustery skies with choppy seas, an apt metaphor for the information about to be shared inside, says blogger Michael A. Fury, Techcet.


New installed wafer capacity leader: Taiwan took over in 2011

Mon, 1 Jan 2012

Taiwan became the region with the largest share of installed wafer capacity in 2011, according to IC Insights' Global Wafer Capacity 2011-12 report. This is the first time Taiwan has led the global wafer capacity rankings, with 21% of total in mid-2011.


Semiconductor inventory correction balancing out early in 2012

Thu, 1 Jan 2012

Semiconductor sales were weaker than expected in Q3 2011, and Q4 shows weak guidance, prompting chip makers to reduce production. Gartner expects this inventory correction to work out in early 2012.


SEMI names Stanley Myers a director emeritus

Wed, 1 Jan 2012

Former SEMI president and CEO Stanley T. Myers was named a director emeritus of the association by itsl Board of Directors. Myers led SEMI for 15 years, was a board member for 24, and has been part of the semiconductor industry for more than 50.


Semiconductor fab capex forecast for 2012

Tue, 1 Jan 2012

Key points from SEMI's 2012 semiconductor fab equipment spending forecast include a predicted decline of 11% to $35 billion, steady growth in 300mm installs, and an H1 dip/H2 surge format.


Camtek launches TEM for advanced semiconductor makers

Mon, 1 Jan 2012

Camtek launched Xact200, a transmission electron microscope (TEM) sample preparation system for the semiconductor industry. Camtek calls the system an alternative to FIB analysis.


22nm node semiconductors: Technical forecasts

Tue, 1 Jan 2012

Solid State Technology asked top analysts and technologists to provide insights on the transition to 22nm semiconductor devices. Read through the whole 10-forecast series, or check out the individual articles as you have time to see perspectives on lithography, device architecture, and more.


Semiconductor industry revenue targets $323.2B in 2012

Tue, 1 Jan 2012

The global semiconductor market will see a slow 2012, reports IHS, with economic uncertainty and semiconductor inventory not moving enough to stimulate new production. Expect negative growth in Q1 2012, a nascent rebound in Q2, and strong growth in Q3 2012, IHS reports.


TI closes semiconductor fabs in TX and Japan

Fri, 1 Jan 2012

Texas Instruments (TI, NASDAQ:TXN) will close 2 older semiconductor manufacturing facilities in Hiji, Japan and Houston, TX over the course of the next 18 months. Production from these analog chip sites will be moved to more advanced TI facilities.


President Obama's Intel visit: Fab 42 update, American manufacturing themes

Fri, 1 Jan 2012

President Barack Obama visited the Intel Ocotillo campus in Chandler, AZ. The President spoke about Intel's technological innovation, and manufacturing jobs in America.


SEM tweak enables crystal study of particles as small as 10nm

Thu, 1 Jan 2012

NIST materials scientists modified a standard SEM for a roughly 10-fold improvement in measuring the crystal structure of nanoparticles and extremely thin films. It enables crystal structure study of particles as small as 10nm.


ABB intros Cleanroom ISO 5 version of multipurpose 6-axis robot

Thu, 1 Jan 2012

ABB Robotics introduced an ISO 5 (Class 100) Cleanroom version of the IRB 120, its smallest multipurpose 6-axis robot. Any source materials in the IRB 120 prone to particle generation were modified to eliminate contamination potential in the manufacturing area.


Soitec joins SEMATECH metrology work on SOI wafers

Thu, 1 Jan 2012

Soitec joined SEMATECH's Front End Processes and Advanced Metrology Programs, bringing SOI wafers and other advanced engineered wafers into the group to work on new processes and technologies enabling high-performance, low-power IC applications.


Major semiconductor makers order EUV lithography metrology tool from Carl Zeiss

Wed, 4 Apr 2012

Carl Zeiss won orders for its EUVL actinic aerial image metrology system, AIMS EUV, from 2 of the 4 members of SEMATECH’s EMI partnership. The tool allows chip makers to review defects in advanced masks needed for EUVL.


KLA-Tencor wafer defect/metrology cluster tool monitors all wafer surfaces in parallel

Mon, 4 Apr 2012

KLA-Tencor Corporation (NASDAQ:KLAC) debuted the CIRCL suite high-throughput defect inspection/metrology/review system for implementation at lithography, outgoing quality control (OQC) and other process modules in semiconductor manufacturing lines.


Metrology tool offers economical price point with high accuracy

Mon, 4 Apr 2012

Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.


Semiconductor subsystems see record revenues thanks to 32nm and below

Mon, 4 Apr 2012

Strong lithography spending, as well as several acquisitions and divestures in the space, brought changes to the critical subsystems of semiconductor/related markets sector, says VLSIresearch. 


North American semiconductor fab tool makers see March book-to-bill hike

Fri, 4 Apr 2012

With a book-to-bill ratio of 1.13, North America-based manufacturers of semiconductor equipment saw a sixth climb in the ratio, which has steadily improved since it hit 0.71 in September 2011, shows SEMI.


ASMC will focus on productivity and technology challenges

Wed, 4 Apr 2012

The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “Competing for R&D Dollars,” moderated by Solid State Technology Editor-in-Chief Pete Singer.


Intel’s top suppliers in 2011

Thu, 4 Apr 2012

Intel Corporation announced its 2011 Intel Preferred Quality Supplier (PQS) awards, selecting 19 of its thousands of suppliers. Two suppliers received Intel’s Achievement Award.


Semiconductor metrology beyond 22nm: 3D memory metrology

Thu, 2 Feb 2012

The 22nm node marks the beginning of a major transition from conventional scaling of planar memory devices to complex 3D architectures. SEMATECH authors examine the metrology needs of 3D memory device architectures in Part 2 of this three-part series.


49 semiconductor wafer fabs close 2009-2011

Wed, 2 Feb 2012

IC manufacturers closed 49 wafer fabs between 2009 and 2011, according to IC Insights. Smaller wafer fabs (≤200mm) suffered the most closures, and Japan and North America led the way.


ISMI convenes 200mm semiconductor fab tool obsolescence forum

Wed, 2 Feb 2012

Tool obsolescence is increasingly important to semiconductor manufacturers running 200mm wafer fab lines, reports ISMI, which has chartered an Equipment Obsolescence Forum for alternative sourcing.


UNL taps SEMI-GAS for semiconductor metrology lab’s gas needs

Tue, 5 May 2012

SEMI-GAS Systems, ultra-high-purity gas source and distribution system maker, will outfit the University of Nebraska - Lincoln’s new Nanoscience Metrology Facility. Applied Energy Systems will provide field services.


President Obama speaks at Albany Nano-Tech Complex today

Tue, 5 May 2012

President Barack Obama toured the SUNY - Albany Nano-Tech Complex today, speaking about the economy and education in the CNSE NanoFab Extension Building.


Camtek ships semiconductor inspection tools to leading US IDM

Mon, 5 May 2012

A leading, US-based IDM ordered about $5 million of front- and back-end semiconductor automatic optical inspection (AOI) tools from Camtek Ltd.


SUSS MicroTec takes over SUSS MicroOptics

Tue, 5 May 2012

SÜSS MicroTec AG has increased its shareholding in SUSS MicroOptics S.A. to 100%. SUSS MicroOptics is a leading company for high-quality refractive and diffractive micro-optics.


Advantest DRAM test system clocks 8Gbps test speed on every pin

Mon, 5 May 2012

Advantest Corporation uncrated the next-generation high-speed DRAM test system, T5511, offering 8Gbps test speed. It can be deployed from R&D through to volume production.


North American chip fab tool makers report 4th month of orders growth in January

Fri, 2 Feb 2012

North America-based manufacturers of semiconductor equipment posted $1.18 billion in orders, $1.24 billion in billings, and a book-to-bill of 0.95 in January 2012, according to SEMI.


Semiconductor metrology beyond 22nm: Defect inspection and review

Thu, 2 Feb 2012

As semis are manufactured at the 2X and 1Xnm nodes, new metrology technologies must evolve to fill the gaps. In Part 3 of this 3-part metrology series, SEMATECH discusses the inspection/metrology options for advanced semiconductors.


450mm wafers at SEMI ISS Europe

Thu, 2 Feb 2012

SEMI’s International Strategy Symposium (ISS) meets for its Europe session February 26-28 in Munich, Germany. Following are some of the 450mm wafer presentations scheduled to take place.


IRPS set for April in Anaheim

Tue, 2 Feb 2012

The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 – April 19, 2012, in Anaheim, CA.


Metrology project launches in Europe for thin films

Fri, 3 Mar 2012

The National Physical Laboratory in the UK is leading a new EMRP project on thin film manufacturing metrology for industries such as opto electronics, plastic and printed electronics, displays and lighting, memories and solar cells.


GLOBALFOUNDRIES hires procurement exec to manage capex expansions

Wed, 2 Feb 2012

GLOBALFOUNDRIES appointed Magnus Matthiasson, formerly of Philips Lumileds, as chief procurement officer (CPO), reporting to CFO Dan Durn.


North American semiconductor tool makers see higher bookings in April

Wed, 5 May 2012

North America-based manufacturers of semiconductor fab equipment posted $1.60 billion in orders and $1.45 billion in billings in April 2012 for a book-to-bill ratio of 1.10, according to SEMI.


Semiconductor capex to fall 11.6% in 2012, says Gartner

Wed, 3 Mar 2012

Worldwide semiconductor manufacturing equipment spending is projected to total $38.9 billion in 2012, an 11.6% decline from 2011 spending of $44 billion, according to Gartner Inc.


High-volume semiconductor fab reduces particle contamination test time

Wed, 3 Mar 2012

A high-volume semiconductor fab using particle monitor wafers to test for contamination in wafer fab tools looked to reduce its labor and test time. The fab switched to wireless wafer-like airborne particle sensors. Allyn Jackson, CyberOptics Semiconductor, shares the case study.


CEA-Leti unveils wide-reaching silicon research scope

Wed, 5 May 2012

CEA-Leti has introduced the “LETI-3S” concept, for “Silicon Specialty Solutions.” The research is oriented to start-ups, component integrators, fabless or fablite chip companies, and equipment/consumable suppliers.


Become the Best of West at SEMICON West

Tue, 5 May 2012

Solid State Technology and SEMI will present the 2012 Best of West product awards at SEMICON West 2012, July 10-12 in San Francisco. Best of West recognizes important product and technology developments in the microelectronics industries.


Semiconductor foundries order Nova metrology tools for 2Xnm node

Mon, 3 Mar 2012

Nova Measuring Instruments Ltd. (NASDAQ:NVMI) received $12 million in orders from leading semiconductor foundries for metrology on 2Xnm manufacturing ramp ups.


Confovis taps Digital Surf for metrology tool imaging software

Fri, 3 Mar 2012

Confovis will begin providing MountainsMap imaging and surface analysis software from Digital Surf with its ConfoCAM LED grid-confocal measuring systems for inspection and research.


Semiconductor fab equipment spending to hit a record in 2013

Tue, 3 Mar 2012

Semiconductor fab equipment spending will remain flat in 2012, says SEMI. But look for a record spend from semiconductor makers in 2013, jumping from $38.85 billion spent in 2012 to $45 billion in 2013.


TSMC, Samsung foundries reconsidering 2012 capex on stronger 28nm demand

Mon, 3 Mar 2012

After only 2 months, semiconductor foundries are already considering raising their 2012 capex budgets, says Terence Whalen, Semiconductor Equipment analyst for North America at Citi.


EU partners clarify EUV optics improvements

Thu, 11 Nov 2012

A group of partners in Europe summarize results from their completed project to deliver the first EUV lithography optics, with progress in several optics components and in mask handling, cleaning, and repair.


Semi equipment demand still sinking

Mon, 10 Oct 2012

In case anyone needed a reminder or a wake-up, new data from SEMI reiterates chip tool sales are slumping badly in the latter part of this year.


Process Watch: A clean, well-lighted reticle

Fri, 10 Oct 2012

In the fifth installment in a series called Process Watch, the authors discuss the need for proper reticle cleaning and inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.


European consortia, ASML, supplier network plan for 450mm transition

Thu, 10 Oct 2012

At SEMICON Europa, European government representatives, consortia, and suppliers discussed programs to support and participate in the 450mm wafer-size transition -- including a comprehensive presentation from ASML about its roadmap for 450mm EUV platforms.


Intel offers muted optimism in 3Q12 results, but cutting capex

Wed, 10 Oct 2012

Intel spoke of caution in end markets when discussing its 3Q12 results, but a big dip in capex and lack of 2013 visibility will likely cause concern in the semiconductor manufacturing ecosystem.


SEMI adds session, extends abstract deadline for China chip conference

Tue, 10 Oct 2012

SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.


Process Watch: Cycle time’s paradoxical relationship to inspection

Tue, 12 Dec 2012

In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.


IEDM 2012: Late papers on silicon photonics, large TFTs, III-V devices

Tue, 12 Dec 2012

With this week's IEEE International Electron Devices Meeting (IEDM 2012) now underway, here are four of the papers that were accepted late: on 90nm integrated silicon photonics, ZnNO for next-gen displays, and III-V TFETs for the 7nm node.


SEMI: Chip equipment slump extending into 2013, across-the-board rebound in 2014

Thu, 12 Dec 2012

Semiconductor equipment demand is persistently sluggish as the industry takes a break from a "multiyear expansion period" to digest recent investments and wrestle with a broader economic slowdown, acknowledges SEMI in its updated year-end forecast. But make no mistake: leading-edge technology investments are still happening, and growth will return in the typical cyclical pattern.


Advantest will introduce three tools at Semicon Japan

Thu, 11 Nov 2012

In prep for Semicon Japan in December, Advantest announces three new tools: 2 SEMs and a litho system.


Actinic EUV source firm Adlyte details expansion plans

Wed, 11 Nov 2012

Swiss firm Adlyte, a developer of high-brightness laser-produced plasma (LPP) EUV light source for actinic mask inspection, is outlining its current expansion efforts, which includes appointing a longtime industry exec to its strategic advisory board.


Process Watch: Breaking parametric correlation

Tue, 11 Nov 2012

In the sixth installment in a series called Process Watch, the authors discuss the ins and outs of parametric correlation when using measurements based on reflectometry, ellipsometry, or a combination of the two. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.


FEI introduces Helios NanoLab 450 F1 DualBeam for failure analysis

Mon, 11 Nov 2012

FEI, Hillsboro, OR, has introduced its new Helios NanoLab 450 F1 DualBeam system designed to provide faster, better images of their most advanced device architectures.


Quartz Imaging releases new FA-LIMS system at ISTFA

Mon, 11 Nov 2012

Quartz Imaging Corp., Vancouver, BC, Canada, will be showing its newest FA-LIMS system (failure analysis laboratory information system) at the International Symposium for Testing & Failure Analysis.


ICPT 2012: Five themes summarizing CMP work and progress

Mon, 11 Nov 2012

This year's International Conference on Planarization/CMP Technology (ICPT) encompassed five themes describing use of CMP: new device structures, equipment and methods, Cu interconnects, consumables, and new CMP methods and processes.


GSA, IC Insights team on 5th edition of IC Foundry Almanac

Wed, 11 Nov 2012

A reference book from the Global Semiconductor Alliance (GSA) and IC Insights puts foundry information at the fingertips of those who need it the most.


Semiconductor equipment demand: Shades of 2009?

Fri, 11 Nov 2012

The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.


Semi execs see a bright 2013, says survey

Fri, 12 Dec 2012

Industry watchers have been lowering their outlooks for 2013 over the past few weeks, but there's one set of opinions that still see optimism for an industry rebound in 2013 -- chip industry executives themselves.


FlexTech Alliance, 4D Technology developing R2R surface metrology system

Fri, 12 Dec 2012

The FlexTech Alliance has awarded 4D Technology (Tucson, AZ) a contract to develop an optical system that addresses a shortcoming in roll-to-roll (R2R) electronics manufacturing: in situ, high-resolution mapping of surface topography and defects on a moving, flexible web.


Gartner: Fab equipment still getting softer, next upcycle starts in 2014

Thu, 12 Dec 2012

Global spending on wafer fab equipment (WFE) is now on pace to finish 2012 with a -17% annual decline, and 2013 now looks like it'll only be slightly better at a -10% dropoff, before the next cyclical spending upturn begins in 2014, according to an updated forecast from Gartner.


Asylum Research acquired by Oxford Instruments

Wed, 12 Dec 2012

Abingdon, England--Oxford Instrumentshas acquired Asylum Research, a maker of scanning probe microscopes (SPM) with subsidiaries in the UK, Germany, and Taiwan. Its products are used by academic and industrial customers across the world for a wide range of materials and bioscience applications.


Samsung reaffirms plans for $4B investment in Austin fab: What it means

Mon, 12 Dec 2012

Samsung's reaffirmation of its planned $4B investments in its Austin, TX facilities don't offer much extra info, but do serve as a message to the market about its future plans -- with or without Apple.


Qcept sells NVD inspection tool for semiconductor process development and integration

Mon, 8 Aug 2012

A “leading semiconductor technology innovator” ordered Qcept Technologies Inc.’s ChemetriQ 5000 NVD inspection system for unit process development and process integration activities for advanced nodes, including 2Xnm and 1Xnm logic nodes for both front-end-of-line and back-end-of-line processes.


Rubicon orders Zeta 300 optical profilers for sapphire LED substrates

Mon, 8 Aug 2012

Zeta Instruments will install multiple optical profilers for micron-scale surface analysis at sapphire substrate maker Rubicon Technology, for metrology and inspection on sapphire substrates and wafer production aimed at the HB-LED market.


Process Watch: Bigger and better wafers

Thu, 8 Aug 2012

In the third installment in a series called Process Watch, the authors discuss some of the challenges of 450mm wafers. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.


The ConFab 2012: A retrospective

Thu, 8 Aug 2012

The ConFab, Solid State Technology’s invitation-only event for the semiconductor industry, took place in June, with presenters from top companies and analyst firms. If you couldn’t be there, check out all the coverage from the event -- reports, presentations, video interviews and more.


EDAX debuts SDD series for faster electron microscopy without lost data

Tue, 7 Jul 2012

EDAX Inc. introduced the Octane Series silicon drift detectors (SDD) for its TEAM EDS Analysis Systems on electron microscopes.


FEI’s extreme-high-resolution SEM enables metrology on semiconductors <22nm

Mon, 7 Jul 2012

FEI (NASDAQ:FEIC) launched the Verios XHR SEM for metrology on beam-sensitive and sub-nanometer-scale materials in advanced semiconductors.


2012 “Best of West” award finalists announced

Thu, 6 Jun 2012

Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain.


SEMICON West preview: Metrology, inspection, and process control products

Thu, 6 Jun 2012

Following are some of the process control, device inspection, defect detection, and other metrology and test products that will be on display at SEMICON West 2012, July 10-12 in San Francisco, CA.


DFMSim wins 1st metrology integration for its lithography software

Thu, 6 Jun 2012

DFMSim announced a distribution agreement with a leading US process control OEM that involves the integration of DFMSim’s SMARTlitho manufacturing software into new tools for advanced metrology.


Lercel to lead SEMATECH's metrology work, new Nanodefect Center

Mon, 6 Jun 2012

SEMATECH added Michael Lercel as senior director for nanodefectivity and metrology, taking the helm on SEMATECH’s ongoing semiconductor wafer metrology program and the new Nanodefect Center in NY.


Electron backscatter diffraction arrives at EAG for crystalline material characterization

Sun, 6 Jun 2012

Evans Analytical Group Inc. (EAG) added electron backscatter diffraction (EBSD) to its analytical and testing services.


Semiconductor makers focus on flow control and treatment at leading edge; H20 reuse rises

Fri, 6 Jun 2012

Semiconductor manufacturers will spend $2.3 billion in 2012 for flow control and treatment products, shows McIlvaine Company. Even more pure water is required as the line sizes on chips are decreasing. This aspect, coupled with the opportunity for water reuse, is creating new opportunities.


North American semiconductor fab tool makers see 4th month of positive book-to-bill ratio

Fri, 6 Jun 2012

North-America-based manufacturers of semiconductor fab equipment posted $1.61 billion in orders worldwide in May 2012, $1.54 billion in billings, and a 1.05 book-to-bill ratio, shows SEMI.


SIA recognizes semiconductor researchers, policy supporters

Wed, 7 Jul 2012

The Semiconductor Industry Association (SIA) presented its 2012 University Researcher Awards to Stanford University professors Krishna Saraswat and Bruce Wooley as well as its 2012 Congressional Leadership Awards to Sen. Carl Levin, Sen. John McCain, Rep. Kevin Brady and Rep. Wally Herger.


450mm semiconductor metrology tool to integrate IDE active vibration isolation

Fri, 6 Jun 2012

The IDE Group developed the STC series of Active Vibration Isolation Systems supporting OEMs in the production of 450mm wafer equipment.


Maxim plans major upgrades to US semiconductor fabs

Fri, 6 Jun 2012

Maxim is spending $200 million to upgrade and expand its US semiconductor manufacturing facilities in San Antonio and Dallas, TX; Beaverton, OR; and San Jose, CA. Maxim manufactures about 50% of its products in the US.


Productivity challenges identified during ISMI Manufacturing Week

Thu, 6 Jun 2012

Semiconductor manufacturers identified key factory productivity challenges that need to be addressed and shared effective solutions they will need to stay leading-edge and competitive amid turbulent industry transitions during the recent ISMI Manufacturing Week.


C-SAM acoustic micro imaging system meets budget-conscious lab inspection needs

Tue, 7 Jul 2012

Sonoscan unveiled its Lab Model 9600 C-SAM acoustic micro imaging system to serve laboratory/failure analysis applications and for use in low-volume semiconductor production inspection.


SEMICON West takeaways: Seasonality over cyclicality, lithography and test trends

Mon, 7 Jul 2012

SEMICON West kicked off with a surprise announcement regarding Intel's investment in ASML, but generally the event highlighted trends “as expected” in the fab supply chain, say Barclays analysts.


Bruker metrology suite debuts for 450mm semiconductor fab

Fri, 7 Jul 2012

Bruker introduced three 450mm X-ray and AFM semiconductor metrology tools -- the InSight-450 3DAFM, the D8 FABLINE X-ray system, and the S8 FABLINE-T X-ray system -- during SEMICON West.


2012 ITRS stabilized for front-end, but changes loom for 2013

Fri, 7 Jul 2012

The overriding message for 2012 is that the roadmap has been largely stabilized with the significant changes that were input last year in the 2012 publication,” said Intel’s Alan Allan, speaking at Semicon West.


Newport introduces 450mm air bearing stages

Thu, 7 Jul 2012

Newport Corporation introduced a line of high-performance air bearing stages specifically designed for the 450mm semiconductor wafer initiative.


Q3 semiconductor tool capex pull-back: Seasonal, expect Q4 uptick

Thu, 7 Jul 2012

Barclays Capital is seeing various reasons for a Q3 2012 semiconductor fab order/shipment pull-back, following meetings around SEMICON West 2012. The analysts expect strong orders in Q4.


Semiconductor fab tool capex trends gleaned @ SEMICON West

Thu, 7 Jul 2012

After meeting with various semiconductor manufacturing tool suppliers -- Applied Materials, KLA-Tencor, Lam Research, Tokyo Electron, Teradyne and Cymer -- at SEMICON West, Citi analysts share impressions on foundry spending plans and tool choices.


How to cope with semiconductor fab tool obsolescence: ConFab preview

Thu, 5 May 2012

Sanjay Rajguru, director of ISMI, will present “Tool Obsolescence and the Impact on 200mm Manufacturing” at The ConFab 2012’s final session, Maximizing the Longevity of Investments.


Metrology needs double as semiconductors move from 90nm to 32nm node

Tue, 5 May 2012

KLA-Tencor Corporation (NASDAQ:KLAC) measures a 70% increase in fab process steps from 90nm to 32nm semiconductor nodes. This doubles the critical inspection steps required, report Citi analysts.


Process Watch: The dangerous disappearing defect

Tue, 5 May 2012

In this first installment of a series called "Process Watch,” experts from KLA-Tencor explain why a defect might be classified as “Not Found” or “SEM Non-visual (SNV),” and how a SNV count can disguise or hide real problems.


Conference Report: IITC, Day 2

Wed, 6 Jun 2012

Mike Fury reports on Day 2 of the 15th IITC (International Interconnect Technology Conference), from San Jose, CA.


Conference Report: International Interconnect Technology Conference, IITC

Tue, 6 Jun 2012

The 15th IITC (International Interconnect Technology Conference) opened Monday, June 4 at the Doubletree Hotel in San Jose, CA. Recurring themes this year were variations on 3D and TSV, novel systems and packaging, and back end memory. Mike Fury reports.


@ The ConFab: How to prevail over silicon cycles

Mon, 6 Jun 2012

At The ConFab’s opening session, “The Economic Outlook for the Semiconductor Industry,” capex was a major point of interest. Jackie Sturm of Intel, Dan Hutcheson of VLSIresearch, and Jim Feldhan of Semico all touched on it, with Hutcheson expanding on the idea of capex trends to present an entire ecosystem of semiconductor business management.


Metrology method measures <50nm particles in semiconductor processes to eliminate contaminants down to 12nm

Tue, 6 Jun 2012

W. L. Gore & Associates and CT Associates developed a method for measuring <50nm particles in ultra-pure water (UPW) used in semiconductor processes, and removing particles as small as 12nm, through a combination of ultrafiltration and microfiltration.


Argonne Labs to characterize diamond microelectronic material with AKHAN

Mon, 6 Jun 2012

AKHAN Technologies will collaborate with the Center for Nanoscale Materials at Argonne National Laboratory to fully characterize Miraj Diamond devices and materials, which are made by doping n-type diamond and can be used in the semiconductor industry.


Argonne Labs to characterize diamond microelectronic material with AKHAN

Mon, 6 Jun 2012

AKHAN Technologies will collaborate with the Center for Nanoscale Materials at Argonne National Laboratory to fully characterize Miraj Diamond devices and materials, which are made by doping n-type diamond and can be used in the semiconductor industry.


Field report: CMP users group

Fri, 5 May 2012

Michael A. Fury reports on the NCCAVS CMP Users Group meeting, held on May 16th.


ITF: The technology knobs for system scaling

Fri, 5 May 2012

At imec's International Technology Forum, An Steegen, Senior Vice President Process Technology at imec, discusses the three technology knobs that are key for a further system scaling.


ITF: Life has changed

Fri, 5 May 2012

At imec's International Technology Forum, the research consortium's CEO, Lec van den Hove, draws attention to the need for the industry to solve the world's health problems.


Top suppliers of wafer processing equipment: VLSIresearch survey

Fri, 5 May 2012

THE BEST rankings from VLSIresearch identify the highest-rated suppliers of wafer processing, assembly, and test equipment. Check out the top-rated suppliers of wafer processing equipment, by company size and customer ranking.


Best semiconductor fab tool suppliers: VLSIresearch survey results

Fri, 5 May 2012

VLSIresearch polled semiconductor manufacturers about their tool suppliers, asking chipmakers to rank equipment providers on customer satisfaction. This year’s results show renewed focus on fab needs.


Rudolph launches noncontact metal film metrology for FPD panels

Wed, 7 Jul 2012

Rudolph Technologies launched the MetaPULSE FP thin film metrology system with an initial sale to a major manufacturer of flat panel displays (FPD) for handheld mobile devices.


Jordan Valley Semiconductor's 450mm defect detection tool wins Best of West

Wed, 7 Jul 2012

Solid State Technology and SEMI announced the Best of West Award winner -- Jordan Valley Semiconductor -- during SEMICON West today. Jordan Valley Semiconductor’s QC-TT defect inspection system predicts breakage in 450mm wafers, which are subject to more handling steps and more thermal stresses due to their larger size.


Semiconductor equipment spending to contract 2.6% in 2012, grow in 2013

Tue, 7 Jul 2012

Semiconductor equipment sales will reach $42.4 billion in 2012, according to the mid-year edition of the SEMI Capital Equipment Forecast, released at SEMICON West 2012.


Semicon West 2012 opens with semiconductor revenue forecasts, high-level perspectives

Tue, 7 Jul 2012

Michael A. Fury, Ph.D., reports from the pre-opening day (July 9) of SEMICON West at the Moscone Center in San Francisco, CA. The first day hosts SEMI’s press conference on semiconductor revenues and the SEMI/Gartner Market Symposium.


More SEMICON West exhibit previews

Sun, 7 Jul 2012

Following are some of the new and flagship products that will appear this week at SEMICON West, July 10-12 in the Moscone Center of San Francisco, CA.


Top conference reports from H1 2012

Fri, 7 Jul 2012

We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.


USHIO UV irradiance meter offers thin form factor for optical film process control

Mon, 7 Jul 2012

Ushio launched its thinnest UV irradiance meter 'UIT-q365." The meter is 4.9mm thick, used to keep major UV processes within spec. It can be used during optical film manufacturing for flexible electronics, as well as during adhesion of precision optical parts.


Process Watch: Skewing the defect pareto

Mon, 6 Jun 2012

In the second installment in a series called Process Watch, the author provides tips on how to make sure you’re reviewing the yield killing defects and not wasting time reviewing nuisance events. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions for chip manufacturing at the leading edge.


ConFab interview: G450 Consortium's Tom Jefferson on 450mm timeline

Wed, 6 Jun 2012

Tom Jefferson, G450 Consortium, shares an update on 450mm wafers for semiconductor manufacturing. The consortium is adding staff and ramping its silicon supply, and getting ready for equipment selection.


Record semiconductor fab spending on tap for 2013

Wed, 6 Jun 2012

Fab equipment spending has improved in 2012, breaking the barrier into positive growth for the year, shows SEMI. Semiconductor makers will invest $39.5 billion in fabs, up 2% from 2011 spending. Fab capex will hit a record in 2013, $46.3 billion or 17% above 2012.


Majority of semiconductor manufacturing suppliers experience IP challenges

Tue, 7 Jul 2012

SEMI recently conducted a survey of semiconductor fab equipment and materials suppliers, finding that 60+% of respondents say that IP challenges have had an adverse impact on their companies.


Real-time monitoring slashes water and energy usage in semiconductor manufacturing on 300mm and 450mm wafers

Mon, 7 Jul 2012

SRC-sponsored researchers developed new sensor-based metrology technology that can significantly reduce water and related energy usage during semiconductor manufacturing.


Secondary semiconductor equipment: Turnkey services offer a fab-centric approach

Mon, 7 Jul 2012

RED Equipment’s Carl McMahon suggests a different model for handling secondary semiconductor equipment for greater efficiency, cost reduction and quality control: full turnkey services engineered to the fab’s needs without the expense of customization.


Rudolph buys NanoPhotonics to bolster advanced packaging inspection offering

Thu, 6 Jun 2012

Rudolph Technologies Inc. (NASDAQ:RTEC) acquired the assets of NanoPhotonics GmbH, adding inspection technology and an intellectual property (IP) portfolio to serve its advanced package inspection tool customers.


STT-MRAM scale up boosts magnetic metrology orders at MicroSense

Thu, 6 Jun 2012

MicroSense reports an increase in orders for its MRAM magnetic metrology systems. The metrology tools characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM.


Chipmakers and equipment OEMs adopt Qcept NVD inspection services

Wed, 6 Jun 2012

Qcept Technologies Inc. has received more than 30 orders from 8 customers for its new ChemetriQ Inspection Services (Q-Services), which enable semiconductor manufacturers and equipment vendors to begin implementing non-visual defect (NVD) inspection programs tailored to their needs prior to purchasing a Qcept ChemetriQ NVD inspection system.


June 27th webcast on 3D integration

Wed, 6 Jun 2012

In a webcast scheduled for June 27th at 1:00 Eastern, 11:00 Pacific, David McCann of GLOBALFOUNDRIES will provide a status report on advanced packaging and 3D integration. McCann is responsible for Packaging R&D and back-end strategy and implementation at GLOBALFOUNDRIES.


Mitutoyo debuts portable surface roughness tester

Wed, 6 Jun 2012

Mitutoyo America Corporation launched the Surftest SJ-411/412 portable surface roughness tester, conforming to roughness standards JIS-B0601-2001, JIS-B0601-1994, JIS-B0601-1982, VDA, ISO-1997 and ANSI.


Legacy semiconductor fab issues @ The ConFab 2012

Wed, 6 Jun 2012

Older production facilities face equipment obsolescence; skills obsolescence; scarce availability of parts, software, and support; and equipment capability extension and tool re-use. At the ConFab 2012 Executive Roundtable, representatives from Sematech/ISMI, IDMs, OEMs, equipment dealers, and industry consultants gathered to have an open discussion on concerns, roadblocks, and possible solutions.


Metrology merger: MicroSense acquires SigmaTech

Wed, 6 Jun 2012

MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.


Semiconductor fab tool makers see sequential increase in Q1

Wed, 6 Jun 2012

Semiconductor manufacturing equipment billings and bookings were virtually tied in Q1 2012, reports SEMI, with $10.61 billion in billings and $10.07 in bookings. This is a 13-14% improvement sequentially, and 9% below the same quarter last year.


iPhone 5: Which semiconductor suppliers are the big winners?

Fri, 9 Sep 2012

As the dust settles after the launch of the iPhone 5, analysts tally which suppliers in the semiconductor ecosphere are most likely to gain the most.


NIST tips "hybrid" metrology method to test chips

Thu, 9 Sep 2012

The National Institute of Standards and Technology (NIST) says it's combined scanning techniques and statistical data to both more precisely and less expensively measure features on a chip -- and two big chip firms are already on board.


Chip tool demand slumps in 2Q12, though Taiwan shines

Wed, 9 Sep 2012

Global demand for semiconductor manufacturing equipment slipped -4% in 2Q12 with softness in just about every region -- except Taiwan which stepped on the pedal during the quarter, according to updated data from SEMI and SEAJ.


Waiting for the next "golden year"

Fri, 9 Sep 2012

While various industry segments appear to be tapping the brakes, others are revving their engines, observes SEMI's Christian Gregor Dieseldorff -- and a 2012 stall could pave the way for a record-breaking 2013.


EUV Symposium takeaways: Slow and steady progress, much improvement expected in early 2013

Tue, 10 Oct 2012

EUV Symposium host imec and a pair of industry analysts gauge the pace of improvements in EUV lithography and its long march toward production readiness.


Europe to unite research efforts in Silicon Europe cluster alliance

Mon, 10 Oct 2012

Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”


Dynamic changes impacting advanced electronic materials industry

Wed, 8 Aug 2012

Learn about the changes in semiconductor manufacturing as well as related markets -- photovoltaics, displays, LEDs, etc -- at the 2012 Strategic Materials Conference (SMC), to be held on October 23-24 in San Jose, CA. SEMI reports.


Present on semiconductor metrology and more at ASMC 2013

Wed, 8 Aug 2012

ASMC 2013, the leading international technical conference for exploring solutions to improve collective microelectronics manufacturing expertise, has issued a call for papers.


FEI, Hitachi High-Tech settle focused ion beam patent dispute

Tue, 8 Aug 2012

FEI will pay $15M to settle the dispute over focused ion beam systems, in exchange for dropping litigation and cross-licensing FIB technologies.


DoD mandates DNA-based component counterfeiting protection measures

Mon, 8 Aug 2012

Applied DNA Sciences, a provider of DNA-based anti-counterfeiting and security solutions, was named by the DoD Defense Logistics Agency as the provider of authentication services for microcircuits supplied by defense contractors.


North American semiconductor fab tool orders tracked flat Y/Y in July

Fri, 8 Aug 2012

"Bookings and billings for North American semiconductor equipment in July are close to values reported exactly one year ago," said Denny McGuirk, SEMI, noting seasonally slow investment activity.


SRC to host TECHCON conference in September

Wed, 8 Aug 2012

Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, is poised to celebrate its 30th anniversary at its annual TECHCON conference Sept. 10-11.


FEI Launches Helios TEM sample prep platform

Tue, 8 Aug 2012

FEI announced two new Helios NanoLab systems, the 450HP and 1200HP DualBeam systems, which include new capability that meets the critical requirements for semiconductor process development at the 28nmdevice geometry node and below.


Brooks Automation updates vacuum monitoring equipment

Tue, 8 Aug 2012

Two extensions to Brooks Automation's vacuum quality monitoring (VQM) components make it easier to measure gases and conditions inside a vacuum chamber.


SEMI builds portal for 450mm info

Mon, 8 Aug 2012

SEMI's new "450 Central" information portal offers news and perspectives about the 450mm wafer-size transition.


Bruker improves AFMs for semiconductor metrology with KPFM mode

Tue, 8 Aug 2012

Bruker released the PeakForce Kelvin Probe Force Microscopy mode for its AFMs. PeakForce KPFM improves quantitative surface potential data for semiconductor metrology and materials research.


Analyst: Fab spending softness 2012 extending into 2013

Thu, 10 Oct 2012

Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.


Molybdenum sulfide: the new graphene?

Thu, 9 Sep 2012

Researchers have begun to investigate a new 2D material—molybdenum sulfide (MoS)—which has similar characteristics but offers something graphene doesn’t: a wide energy bandgap, enabling transistors and circuits to be built from it directly.


On-board heaters can self-heal flash memories

Thu, 9 Sep 2012

At the upcoming International Electron Device Meeting, Macronix researchers will describe how they built flash memories that could heal themselves by means of tiny onboard heaters that provide thermal annealing just at the spots where it is needed.


Everspin to unveil highest-density ST-MRAM

Thu, 9 Sep 2012

In an invited paper at the International Electron Devices Meeting, researchers from Everspin Technologies will describe how they built the largest functional ST-MRAM circuit ever built, a 64-Mb device with good electrical characteristics.


Better than FinFETs: Hybrid-Channel SOI

Thu, 9 Sep 2012

At the International Electron Devices Meeting (IEDM) in December, a team led by IBM will report on the world’s first high-performance hybrid-channel ETSOI CMOS device.The researchers built a ring oscillator circuit to benchmark performance that worked even better than FinFETs.


Process Watch: Taming the overlay beast

Tue, 9 Sep 2012

In the fourth installment in a series called Process Watch, the authors discuss overlay registration and new capabilities to align to buried layers. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.


NanoYield: new design for yield software released

Thu, 9 Sep 2012

ProPlus Design Solutions, Inc. unveiled NanoYield, yield prediction and optimization software for memory, logic, analog and digital circuit design.


TSMC's schedule for 450mm mass production -- and lithography is the key

Wed, 9 Sep 2012

During sessions at this month's SEMICON Taiwan, execs from TEL, Lam Research, Applied Materials and KLA-Tencor revealed the latest developments in 450mm technology.


Chip demand still sliding, hopes for soft 3Q landing and recovery

Fri, 9 Sep 2012

Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.


TSMC integrates Ge on Si in p-type FinFETs

Thu, 9 Sep 2012

At this year’s International Electron Devices Meeting (IEDM), foundry TSMC will describe a heterogeneous epitaxial growth process which for the first time enables Ge to be directly grown on Si.


Horizontal channels key to ultra-small 3D NAND

Thu, 9 Sep 2012

The first working 3D NAND flash memory at sub-40nm feature sizes will be described by Macronix researchers at this year’s International Electron Devices Meeting (IEDM).


North American semiconductor equipment industry posts May 2013 book-to-bill ratio

Fri, 6 Jun 2013

A book-to-bill of 1.08 means that $108 worth of orders were received for every $100 of product billed for the month.


Global semiconductor manufacturing equipment spending to decline in 2013, says Gartner

Thu, 6 Jun 2013

Outlook for semiconductor equipment market improves, but remains soft in the short term.


SEMATECH to address critical supply chain challenges and more at SEMICON West 2013

Mon, 6 Jun 2013

Through a series of lectures and workshops, SEMATECH will address R&D challenges and closing key infrastructure technology gaps from July 8–12 at SEMICON West in San Francisco, CA.


SEMATECH names William R. Rozich chairman of the board

Mon, 6 Jun 2013

Rozich, who previously was a member of the company’s board, succeeds Michael R. Polcari, who served as chairman since November 2009.


Semiconductor inventory falls in Q1 as outlook for electronics demand rises

Thu, 6 Jun 2013

Total inventory held by semiconductor suppliers declined significantly in the first quarter as excess stockpiles created during the global economic malaise of 2012 were cleared away, done in anticipation of a resurgence in consumer demand for electronic products expected by the second half of 2013.


UMC joins IBM chip alliance for 10nm process development

Thu, 6 Jun 2013

IBM and United Microelectronics Corporation, a global semiconductor foundry, today announced that UMC will join the IBM Technology Development Alliances as a participant in the group's development of 10nm CMOS process technology.


GLOBALFOUNDRIES unveils plans to accelerate adoption of 20nm-LPM and 14nm-XM FinFET processes

Fri, 5 May 2013

At next week's 50th Design Automation Conference in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support its most advanced manufacturing processes.


Precision is key to scaling below 14nm

Mon, 6 Jun 2013

In advance of the 2013 SEMICON West TechXPOTs on lithography and nonplanar transistors beyond 20nm, SEMI asked some of the speakers and industry experts to comment on the challenges they wanted to highlight. Many of the inputs focused on the need for precision in the processes used to form transistors, as well as how EDA can contribute to mitigating variability.


Fab equipment spending: 23% growth for 2014

Tue, 6 Jun 2013

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.


Learning the secrets of design for yield

Tue, 6 Jun 2013

Dr. Zhihong Liu, Executive Chairman of ProPlus Design Solutions, Inc., says that design-for-yield (DFY) considerations are more important than ever. And yet, we as an industry may not fully understand device modeling and its impact on DFY results.


Critical updates on EUV, 3D transistors and 450mm manufacturing at SEMICON West 2013

Tue, 4 Apr 2013

The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing.


Strategic approach to R&D is goal at National Photonics Initiative Event

Thu, 3 Mar 2013

More than 100 representatives from government and the photonics industry convened in Washington, D.C., on February 28 to identify focus areas for a national photonics initiative (NPI), engaging academia, industry, and government in a collaboration to address barriers to continued U.S. leadership in photonics.


'Key' EUV milestone, DSA progress, more reported at SPIE Advanced Lithography

Thu, 3 Mar 2013

Over 2,000 industry professionals attended last week’s SPIE Advanced Lithography, where important progress reports were revealed on extreme ultraviolet (EUV), lithography, directed self-assembly (DSA), metrology, and related topics. The event ran February 24-28 in San Jose, California.


Car infotainment semiconductor market hits speed bump in 2013

Wed, 3 Mar 2013

Following a healthy expansion in 2012, the growth of the global automotive semiconductor market will decelerate slightly this year because of a slowdown in the aftermarket and portable navigation device (PND) segments.


North American Semiconductor Industry: Continuing with high levels of investments

Thu, 5 May 2013

While investments and capital spending in Asia-Pacific garner much of the attention regarding semiconductor manufacturing, spending on equipment and materials in North America has totaled more than $100 billion over the past decade as leading device manufacturers expand capacity and invest in new facilities.


Second phase of Nanoelectronics Research Initiative to focus on post-CMOS electronics

Wed, 5 May 2013

SRC and NIST will provide a combined $5 million in annual funding for three multi-university research centers tasked with demonstrating non-conventional, low-energy technologies that outperform current technologies on critical applications in 10 years and beyond.


Eleven companies move up in Q1’13 top 20 semi supplier ranking

Tue, 5 May 2013

Qualcomm, TSMC, and SK Hynix each register greater than 20 percent year-over-year growth.


Semiconductor industry to recognize Philip Yeo and Lee Kok Choy at SEMICON Singapore 2013

Mon, 4 Apr 2013

SEMI today announced that Philip Yeo, chairman of SPRING Singapore, and Lee Kok Choy, country manager of Micron Technology Inc. Singapore, have been voted by the SEMI Singapore Regional Advisory Board as recipients of two prestigious awards recognizing their contributions to the development and success of the Southeast Asian semiconductor industry.


Rudolph purchases assets from Tamar Technology

Mon, 4 Apr 2013

Rudolph Technologies, Inc. announced today that it has purchased selected assets, including a patent portfolio, relating to metrology capability from Tamar Technology, Newbury Park, Calif.


Cadence and GLOBALFOUNDRIES to improve DFM signoff for 20 and 14nm nodes

Mon, 4 Apr 2013

Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES has collaborated with Cadence to provide pattern classification data for manufacturing processes of 20 and 14 nanometers.


Morgan Advanced Materials joins SEMATECH to develop process solutions

Mon, 4 Apr 2013

Morgan Advanced Materials has joined SEMATECH’s International SEMATECH Manufacturing Initiative (ISMI), a program designed to improve semiconductor equipment manufacturing productivity, yield, and cost.


Infineon and GLOBALFOUNDRIES announce collaboration for 40nm embedded flash process

Mon, 4 Apr 2013

Infineon Technologies and GLOBALFOUNDRIES Inc. today announced a joint technology development and production agreement for 40nm embedded flash (eFlash) process technology.


Global semiconductor industry to witness a CAGR of 4.3% over next five years

Fri, 4 Apr 2013

Global macroeconomic developments and technological advances, personal computers, and memory markets are expected to drive demand over the forecast period, Research and Markets predicts in their report, “Global Semiconductor Industry 2012-2017: Trend, Profit and Forecast Analysis.”


Global semiconductor sales outpace last year through Q1 of 2013

Tue, 5 May 2013

Sales in March 2013 were up slightly compared to February 2013 and March 2012.


Reinventing Intel

Fri, 4 Apr 2013

The semiconductor chip giant revealed plans to branch out beyond PCs. Will it work?


SEMI reports March book-to-bill ratio of 1.14

Fri, 4 Apr 2013

North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.


IRPS 2013: New insight into erratic bits

Tue, 4 Apr 2013

Error correction code and redundant addresses are both techniques well-known in memories as a way of optimizing yield. But new data from the University of Ferrara shows that these common techniques may be overused. By classifying erratic bits more carefully, it’s possible to use less ECC and up to 35 percent less redundancy.


IRPS 2013: Oxygen interstitials can impact RRAM retention time

Tue, 4 Apr 2013

The ability of a resistive RAM device to maintain its resistance state, otherwise known as retention time, can be impacted by the electrode materials used.


IRPS 2013: Discrete trapping and detrapping seen in flash memories

Tue, 4 Apr 2013

New flash memory chips are replacing the floating gate with thin layers of material that "trap the charge." The charge trap is a sandwich of materials such as silicon-oxide-nitride-oxide-silicon (SONOS), metal-oxide-nitride-oxide-silicon (MONOS) and tantalum-aluminum oxide-nitride-oxide-silicon (TANOS), all of which are substantially smaller than the floating gate.


IRPS 2013: Breakdown voltage dependent on polarity

Tue, 4 Apr 2013

At the International Reliability Physics Symposium (IRPS), being held April 14-18, 2013 at the Hyatt Regency Monterey Resort & Spa in Monterey, CA, imec will present new research focused on the stress induced breakdown between the tungsten trench local interconnects (M1, M2) and metal gate in a 28nm CMOS technology. Imec’s Thomas Kauerauf will present a paper titled “Reliability of MOL local interconnects.”


IRPS 2013: High-k oxides pose new reliability challenges

Tue, 4 Apr 2013

New finFETs feature high-k dielectrics, which are better than conventional silicon nitride dielectrics in that they can be thinner, yet still enable good control of the transistor’s channel region from the gate.


IRPS 2013: Self-heating to accelerate aging in FinFETs

Tue, 4 Apr 2013

It’s well-known that transistors generate heat when they’re operating, and that can have a significant impact on the chip’s reliability and longterm longevity. A small increase of 10°C–15°C in the junction temperature may result in ∼ 2× reduction in the lifespan of the device.


IRPS 2013: NBTI worsens with FinFET scaling

Tue, 4 Apr 2013

FinFETs offer several advantages compared to traditional planar transistors, but it’s not yet clear what kind of new reliability problems might arise as FinFETs are scaled to smaller dimensions.


Semiconductor R&D: A state of transition

Thu, 4 Apr 2013

Several years ago when the challenges to 450mm wafer processing, EUV development and novel transistor designs were first being discussed, SEMI commissioned a study that predicted the industry could face an R&D funding gap that could exceed $9 billion if current technology and economic trends continue.


2013: 450mm is the next big opportunity

Thu, 1 Jan 2013

In semiconductor manufacturing, 450mm is the next big opportunity. Issues of economic scale and complexity will force fab designers, OEMs and process integrators to investigate all open avenues in the search for solutions to the huge challenges that accompany 450mm.


2013: Accelerating R&D and decreasing time to yield

Thu, 1 Jan 2013

In order to maintain profitability manufacturers must increase the productivity and return from their R&D investments.


2013: Building the internet of things with MEMS and 3D advances

Wed, 1 Jan 2013

It is becoming increasingly clear that new MEMS and 3D high-volume, low-cost manufacturing technologies will accelerate a radical change to society’s cyber skyline.


2013: Fab Equipment Spending Shrinks Back to Flat

Wed, 1 Jan 2013

The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.


Silicon wafer revenues decline in 2012

Tue, 2 Feb 2013

Worldwide silicon wafer revenues declined by 12 percent in 2012 compared to 2011, according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.


Econometric Forecast: Semiconductor growth should recover by 2014

Fri, 2 Feb 2013

In the second of two installments, Linx Consulting reports a steady growth in semiconductor production, as released in The Econometric Semiconductor Forecast.


Econometric Forecast: Regional developments to affect growth of semiconductor industry

Thu, 2 Feb 2013

In the first of two installments, we examine the global issues facing the semiconductor industry, as released by Linx Consulting in The Econometric Semiconductor Forecast.


Econometric forecasting service predicts 6% growth in semiconductor wafers in 2013

Thu, 2 Feb 2013

A new econometric semiconductor industry forecast predicts semiconductor wafer area production to grow slightly less than 6% in 2013, according to Linx Consulting.


Looking for an integrated post-tapeout flow

Wed, 2 Feb 2013

Dr. Steffen Schulz discusses the role of a flexible platform for computational lithography in a successful business strategy.


Semiconductor R&D spending rises 7% despite weak market

Tue, 2 Feb 2013

Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion.


KLA-Tencor announces new e-beam inspection system

Wed, 1 Jan 2013

KLA-Tencor Corporation (NASDAQ: KLAC) announced the eS805, a new electron-beam inspection system capable of detecting very small defects, and defects that cause electrical problems.


GlobalFoundries adding R&D facility to NY fab campus

Fri, 1 Jan 2013

GlobalFoundries says it plans to build a $2 billion "Technology Development Center" R&D facility at its Fab 8 campus in Saratoga County, NY, for semiconductor technology development and manufacturing:  EUV lithography photomasks to new interconnect and packaging technologies enabling 3D chip stacking, "and everything in between."


SEMI approves first HB-LED standards

Wed, 1 Jan 2013

SEMI's HB-LED Standards Committee has approved its first standard, specifying sapphire wafers used in making high-brightness light-emitting diode (HB-LED) devices.


2013: Advanced chemistry moves center stage

Fri, 1 Jan 2013

We are in an age where chemistry is center stage in the race to advance Moore’s Law and More Than Moore.


IDC: Semiconductor revenues will grow 4.9% in 2013

Fri, 1 Jan 2013

The International Data Corporation is forecasting that semiconductor revenues worldwide will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% from 2011-2016.


2013: Healthy revenue growth, but capex likely flat

Fri, 1 Jan 2013

Based on current indications, capital spending would seem to be flat in 2013.  However, Semico predicts healthy revenue growth this year, which may encourage more spending, particularly in the second half of the year.  This may bring total capex for 2013 into the positive range.


2013: An economic outlook for the global IC market

Thu, 1 Jan 2013

Predictions for 2013 show several notable trends: overall silicon area growth for 2013 should average approximately 6%; the first quarter and the second half are likely to show slower growth than the second quarter; and the modest growth forecast for 2013 is predominantly demand driven.


1/f noise measurement system unveiled

Tue, 1 Jan 2013

ProPlus Design Solutions announced it is shipping a new wafer-level, 1/f noise measurement system. Increasingly, circuit designers are interested in 1/f noise data at higher frequencies.


Process Watch: Exploring the dark side

Fri, 1 Jan 2013

A particle as small as three microns in diameter, attached to the back side of the wafer—the dark side, if you will—can cause yield-limiting defects on the front side of the wafer during patterning of a critical layer.


IBM team wins Feynman Prize for scanning probe microscopy

Thu, 1 Jan 2013

IBM Researchers won the prestigious Feynman prize given by the Foresight Group. The team was the first to produce images detailed enough to identify the structure of individual molecules, as well as metal-molecule complexes.


SPIE Advanced Lithography will bring industry focus to next-generation tools and systems

Tue, 2 Feb 2013

SPIE Advanced Lithography, the annual forum for discussions on state-of-the-art lithographic tools, resists, metrology, materials characterization, and design and process integration, will bring the community together in San Jose, California, next week to address those challenges.


SEMATECH to demonstrate advances and technical breakthroughs at SPIE 2013

Tue, 2 Feb 2013

Papers showcase EUV extendibility and metrology techniques for defect inspection and 3D TSVs.


New Product: KLA-Tencor announces two new litho/etch process control tools

Tue, 2 Feb 2013

New metrology and inspection products facilitate advanced patterning techniques for manufacturing sub-20nm memory and microprocessor chips.


SEMATECH’s Bryan Rice named 2013 SPIE Fellow

Tue, 2 Feb 2013
SEMATECH announced today that Dr. Bryan J. Rice, on assignment from Intel Corporation as SEMATECH’s director of Strategic Initiatives, was inducted as a 2013 Fellow by SPIE, the international society for optics and photonics, during its annual SPIE Advanced Lithography conferences in San Francisco, CA.


DNP and Luminescent Technologies achieve milestone in development of metrology and inspection program

Mon, 2 Feb 2013

Luminescent Technologies Inc., a provider of computational metrology and inspection solutions for the global semiconductor manufacturing industry, and Dai Nippon Printing Company, Ltd. announced today the successful completion of the first phase of a three-year joint development program for computational metrology and inspection using Luminescent’s Automated Image Processing Hub (LAIPH) platform.


Semiconductor sales rose in January

Mon, 3 Mar 2013

Worldwide sales of semiconductors were $24.05 billion the month of January, up 3.8% from January 2012 and down 2.8% from December 2012, according to the Semiconductor Industry Association (SIA).


Intel leads unexpectedly large decline in semiconductor market inventory

Wed, 3 Mar 2013

After reaching a worrisome high in the third quarter of 2012, global semiconductor inventories held by chip suppliers fell at a surprisingly fast rate in the fourth quarter, led by dramatic reductions for market leader Intel Corp.


A single European semiconductor strategy is on its way

Thu, 2 Feb 2013

STM, Imec, CEA-LETI, ASML, Soitec and EU representatives discussed directions at ISS Europe 2013 in Italy.


Demand for exports will allow semiconductor industry to maintain modest revenue growth

Fri, 3 Mar 2013

Over the past five years, revenue dipped and spiked from the impact of the global recession; in the five years to come, increased offshoring will detract from the growth in global demand from an improved economy.


SRC, UCLA and ERC utilize atomic layer etch analysis to accelerate development of green chemistries

Thu, 3 Mar 2013

Researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, today announced development of a modeling process designed to simulate atomic-level etching with chemicals that are effective alternatives to widely used perfluorocarbon (PFC) gases.


Design for reliability of multi-layer thin film stretchable interconnects to be presented at ECTC

Thu, 3 Mar 2013

Most electronic systems that power our digital life are inflexible and flat. Rigid electronic designs work for our computers and phones but not for our bodies. Humans are soft and curved. Electronic systems capable of bending, twisting, and stretching have great potential for applications in which conventional, stiff semiconductor microelectronics would not suffice.


PI miCos releases 2-axis precision linear translation stage for surface metrology

Wed, 3 Mar 2013

PI miCos announced the release of a new 2-axis precision linear translation stage. The new MCS XY precision linear stage was designed for industrial precision motion control and surface metrology applications and combines robustness and high accuracy.


Critical process technologies and fab productivity addressed at ASMC 2013

Wed, 3 Mar 2013

Semiconductor manufacturers, suppliers and academia to collaborate on real-world issues at SEMI event.


Mentor Graphics User Conference 2013 to feature former TSMC CTO

Fri, 3 Mar 2013

Mentor Graphics User Conference 2013 speaker line-up boasts a host of industry bigwigs, including former foundry CTO, Dr. Chenming Hu.  Hu will give the keynote address on April 25 in San Jose, California, addressing the future of FinFET.


SEMATECH executive joins Intermolecular to head semiconductor group

Mon, 4 Apr 2013

Intermolecular, Inc. today announced that Dr. Raj Jammy has joined the company as senior vice president and general manager of the semiconductor group.


"Veeco MOCVD chosen for CEA-Leti"

Tue, 4 Apr 2013

ARM and TSMC today announced the first tape-out of an ARM Cortex-A57 processor on FinFET process technology.  The Cortex-A57 processor is ARM's highest performing processor, designed to further extend the capabilities of future mobile and enterprise computing, including compute intensive applications such as high-end computer, tablet and server products.


Global semiconductor sales remain ahead of 2012 pace in February

Mon, 4 Apr 2013

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $23.25 billion for the month of February 2013, an increase of 1.4 percent from February 2012 when sales were $22.93 billion. Effective government policies needed to spur stronger growth.


CMP-R-and-D-enhanced-with-Araca-Entrepix-partnership

Mon, 11 Nov 2010

Targeting CMP consumables suppliers, commercial device manufacturers, and academic R&D organizations, the agreement enables customers to leverage the combined strengths of both companies with in-depth analysis and fundamental research for virtually any aspect of CMP on any material.


Rigaku-EUV-lithography-optical-components-push

Wed, 11 Nov 2010

Rigaku Innovative Technologies announced further expansion into the optics market for extreme ultraviolet (EUV) lithography. RIT plans to continue supporting the industry by supplying Osmic Coatings, a line of multilayer coated optics that are essential to EUVL.


Carl-Zeiss-Synopsys-collaborate-in-die-registration-metrology-photomask manufacturing

Thu, 10 Oct 2010

carl zeiss proveCarl Zeiss SMS and Synopsys will collaborate to support in–die metrology solutions for the 32nm technology node and below. Using CATS as a data preparation engine, mask engineers using PROVE can benefit from improved efficiency and usability of a registration metrology system that meets stringent overlay accuracy requirements.


SPIE Preview: EUV vs. optical battle, "alternatives" get attention

Mon, 2 Feb 2010

The SPIE Advanced Lithography Conference is where experts come to tell their advances in lithography, resists, metrology and design, and this week it appears to be heating up as a battle between optical and surging EUV, with other litho technologies offering a "sanity check," writes Griff Resor.


CD-SEM-metrology-tool-from-Advantest debuts for next-gen photomasks

Fri, 11 Nov 2010

Advantest Corporation released a SEM-based critical dimension (CD) measurement system for next-generation photomasks and patterned media. The E3630 is fully compatible with Advantest’s existing E3610/E3620 CD-SEM measurement systems and software, and boasts 30% improved linewidth repeatability.


Production metrology of advanced metallization structures using XRR and WA-XRD

Fri, 10 Oct 2010
A new interconnect metrology technique enables the monitoring of the thickness and the density of the copper and barrier layers while also obtaining valuable microstructure information in terms of phase, grain-size, and texture. Asaf Kay, Alex Tokar, Jordan Valley Semiconductors, Ltd., Migdal Ha'Emek, Israel; Matthew Wormington, Jordan Valley Semiconductors, Ltd., Austin, TX USA

Accurate EUV lithography simulation enabled by calibrated physical resist models

Mon, 9 Sep 2010

Authors from Synopsys and IMEC assess the readiness of rigorous physical resist model calibration for accurate EUV lithography simulation. They discuss pattern selection for calibration, illustrate the speed and robustness of model building, and examine model validation results. Predictability of the resist model is demonstrated across various flare levels, pitches and critical-dimension ranges.Authors from Synopsys and IMEC assess the readiness of rigorous physical resist model calibration for accurate EUV lithography simulation. They discuss pattern selection for calibration, illustrate the speed and robustness of model building, and examine model validation results. Predictability of the resist model is demonstrated across various flare levels, pitches and critical-dimension ranges.


Yield metrology looking at systematic failure mechanisms: Synopsis

Thu, 7 Jul 2010

In this video from SEMICON West 2010, Sagar Kekare, Synopsis, presents ideas from his paper on rapid root cause analysis and process change validation using design-centric volume diagnostics.


Technical debt in semiconductor equipment: it's time to pay it down

Thu, 7 Jul 2010
This is a good time to take stock of your development readiness and how well legacy software assets will support the product roadmap. Dan O

SEMICON West, Day 1: CMP, slurries, metrology, thermal, zombies, observations

Wed, 7 Jul 2010

Techcet's Michael Fury reports from Day 1 of SEMICON West, from keynotes to CMP to thermal characterization, and the continued use of “zombie” semiconductor manufacturing technologies.


Gary Smith EDA market statistics 2010: Summary

Thu, 7 Jul 2010

The biggest change in 2009 was Mentor passing Cadence to become number two in product sales in EDA. This is an indication of the market shift caused by the move into the ESL Methodology. Synopsys remains a strong number one.


Faster scatterometry metrology: GlobalFoundries

Thu, 7 Jul 2010

Alok Vaid of GlobalFoundries, explains the technology in his paper on time-to-solution for scatterometry metrology. Scatterometry takes a long time, but Vaid proposes a new approach with more automation.


US IDM orders CAPRES metrology system for production wafers

Thu, 9 Sep 2010

US IDM orders CAPRES 300mm microRSP-A300 metrology system for production wafersWith the development and production release of the microRSP-A300, CAPRES has addressed the challenges associated with in-line measurement on production wafers, reducing reliance on data extrapolation and monitor wafers to validate doping levels.


SEMICON Europa plans more than 40 programs/events: Peruse the semiconductor track

Fri, 9 Sep 2010

The Semiconductor front-end track of SEMICON Europa includes the 14th Fab Managers Forum; and sessions on lithography, automation and process control, metrology, new materials, secondary equipment/services, and a progress review of 450mm.


Foundry-orders-Nanometrics-TSV-metrology-system

Fri, 12 Dec 2010

Nanometrics Incorporated (Nasdaq: NANO) announced that a leading semiconductor foundry has ordered a UniFire 7900 metrology system for advanced 3D wafer-scale packaging process control.


Fab metrology tool for non-critical layers enables future-proofing: Podcast with KLA-Tencor

Thu, 8 Aug 2010

Tom Gubiotti, product marketing manager at KLA-Tencor, discusses the design decisions that drove the company’s new film metrology tool -- the Aleris 8330 -- targeted for non-critical films at 32nm and below. Among the drivers -- especially for memory manufacturers -- is the need for high-throughput, low cost-of-ownership tools that are capable of recipe sharing around the fab, so-called, “future proofing.”Tom Gubiotti, product marketing manager at KLA-Tencor, discusses the design decisions that drove the company’s new film metrology tool -- the Aleris 8330 -- targeted for non-critical films at 32nm and below. Among the drivers -- especially for memory manufacturers -- is the need for high-throughput, low cost-of-ownership tools that are capable of recipe sharing around the fab, so-called, “future proofing.”


AMAT findings on virtual metrology

Mon, 8 Aug 2010

James Moyne, Applied Materials, highlights a new technology: virtual metrology. Virtual metrology, on which Moyne presented at ASMC/SEMICON, enables tighter semi fab control using line data analysis. The summarized data is synched with real metrology data. Virtual metrology is now adaptive.


LED, WLP, SiGe metrology challenges of today

Thu, 8 Aug 2011

LEDs, SiGe semiconductors, and WLP bumps each present their own challenges to metrology systems, says Alon Kapel, Jordan Valley Semiconductor.


SigmaTech TSV metrology wins Best of West

Fri, 7 Jul 2011

SigmaTech's UltraMap-TSV system won Best of West at SEMICON West, presented by industry association SEMI and Solid State Technology.


KLAC joins SEMATECH EUV efforts

Tue, 6 Jun 2011

KLA-Tencor will join SEMATECH-led efforts to identify and eliminate defects in EUV lithography, including mask metrology infrastructure and metrology source development.


Cosense ultrasonic liquid level detectors best mechanical float switches

Tue, 6 Jun 2011

Cosense launched the SL 900 Series of Ultrasonic Liquid Level Detectors that detect and micro-measure ultrapure chemical fluids for semiconductor chip manufacturing.


Metryx joins semiconductor equipment assessment group SEAL

Tue, 6 Jun 2011

Metryx will work with IMEC and Intel via the joint European Semiconductor Equipment Assessment Leveraging Innovation (SEAL) project to assess high-resolution mass metrology viability at 20nm and smaller nodes.


Metrology of epitaxial thin-films by advanced HRXRD and XRR

Wed, 6 Jun 2011
Using complementary metrology techniques, the authors determined the thickness, composition and relaxation of SiGe and Si:C layers. Paul Ryan, et al., Jordan Valley Semiconductors, Durham, UK

450mm wafer transition needs collaboration and standards

Wed, 6 Jun 2011
As the global supply chain deals with wafer size transition, pre-competitive collaboration will continue to be the best path towards economic efficiency and industry rationality, and Standards play a major role. Jonathan Davis, SEMI, San Jose, CA.

CMP metrics improved by undiluted slurry data

Thu, 6 Jun 2011

Figure 3. Ceria delivery monitor >120hrs. (SlurryScope data of undiluted extended run measurements of slurry LPC). SOURCE: Vantage TechnologyThe requirement for CMP slurry to perform consistently during the wafer polishing process has resulted in a push on the part of IC manufacturers to improve slurry metrics. Marty Mason, Vantage Technology Corp., explains how on-wafer slurry conditions can differ from slurry measurements, and new advances to rectify measurements.


EVG tool bonds 450mm SOI semiconductor wafers

Mon, 7 Jul 2011

EV Group (EVG) released a wafer bonding system for 450mm silicon-on-insulator (SOI) wafers: EVG850SOI/450-mm. EVG's Paul Lindner discusses the tool, and challenges of 450mm and SOI.


Top semiconductor metrology challenges from SEMATECH POV

Wed, 7 Jul 2011

At SEMICON West 2011, Phil Bryson, SEMATECH, covers the top challenges in semiconductor metrology at advanced nodes.


ASML tweaks immersion tool to improve imaging, overlay

Wed, 7 Jul 2011

ASML has added three extensions to its Twinscan NXT 1950i tool, to improve imaging, overlay, and system throughput.


IEST cleanroom apparel doc update includes measurement guide

Thu, 12 Dec 2011

The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.


AMAT debuts SEM for automatic 20nm defect inspection

Mon, 12 Dec 2011

Applied Materials, Inc. debuted its defect review scanning electron microscope (DR-SEM) Applied SEMVision G5 system to image and analyze 20nm yield-limiting defects in a production environment without manual intervention.


GLOBALFOUNDRIES names CFO from ATIC

Wed, 11 Nov 2011

Under new CEO Ajit Monocha's realignment plan, GLOBALFOUNDRIES named new CFO, CTO, and customer engineering and quality leaders. The CTO position is a new one at the semiconductor foundry. The moves are meant to separate technology strategy from technology development.


Nvidia's ConFab keynote will portray "the virtual IDM"

Tue, 11 Nov 2011

Dr. John Chen, VP of technology and foundry operations at Nvidia, and Thomas Jefferson, ISMI's 450mm project manager, are among the updated speaking roster of ConFab 2012, which will address the economics of semiconductor manufacturing and associated industries (LEDs, MEMS, displays).


Chip fab tool book-to-bill holds steady for North American makers

Fri, 11 Nov 2011

"The recent period

Intermolecular (IMI) prices IPO

Fri, 11 Nov 2011

Intermolecular Inc. (Nasdaq:IMI) priced its initial public offering of 9,650,000 shares of common stock at a public offering price of $10.00 per share.


North American chip fab tool book-to-bill up in November

Fri, 12 Dec 2011

North America-based manufacturers of semiconductor equipment posted $973.3 million in orders in November 2011, $1.17 billion in billings, and a book-to-bill ratio of 0.83, according to the November Book-to-Bill Report from SEMI.


LED inspection unit launches Altatech Semiconductor's LEDs line

Wed, 12 Dec 2011

Altatech Semiconductor S.A. launched its first LED inspection system, the non-contact AltaSight LEDMax, for detecting, classifying and characterizing defects on wafers used in manufacturing LEDs.


Worldwide semiconductor equipment bookings decline in Q3

Tue, 12 Dec 2011

SEMI reports worldwide semiconductor manufacturing equipment bookings fell 38% year-over-year in Q3 2011; billings dropped 5% for the same quarter.


KLA-Tencor enlarges monitor-wafer suite

Wed, 12 Dec 2011

KLA-Tencor Corporation (NASDAQ: KLAC) added to its SensArray portfolio of advanced wireless temperature monitoring wafers. The products use time-based, in-situ temperature monitoring to register process-environment effects on production wafers.


Nanometrics-launches-overlay-metrology-system-wins-Asia-order

Tue, 3 Mar 2011

Nanometrics Incorporated (Nasdaq:NANO), advanced process control metrology provider, launched the Mosaic II turnkey image-based overlay metrology solution for advanced high-volume IC manufacturing. NANO reports an initial delivery to a leading Asian memory customer.


Cymer-focus-drilling-for-immersion-light-sources-improves-depth-of-focus-by-2x

Wed, 3 Mar 2011

Cymer Inc. (Nasdaq: CYMI) introduced a focus drilling technology for its immersion light sources including the XLR 600ix, XLR500i, XLA 400 and XLA 300. Focus drilling provides up to a 2X improvement in the depth of focus on the wafer.


Carl-Zeiss-photomask-registration-correction-system-RegC-debuts

Wed, 3 Mar 2011

Carl Zeiss RegCCarl Zeiss introduced a new production tool aimed to improve registration and overlay of advanced photomasks. RegC is based on ZEISS femtosecond-laser technology. RegC enables correction on high-end photomasks for remaining registration errors after the pattern generation process. Current results show registration improvements over 50% in advanced lithography.


Tunable laser replaces monochromatic light beam for thin film metrology

Thu, 4 Apr 2011

Figure 2. Faraday rotation vs wavelength.Magneto-optical (MO) effects can be used for a wide range of applications, from data storage and processing to thin films characterizations or even remote magnetic field sensors. Gabriel Monette, Université de Montréal and Marc Verhaegen, Photon etc., performed measurements of spectral dependence of the Faraday MO effect in the visible part of the electromagnetic spectrum along with temperature dependence measurements on a semiconductor 2µm epilayer (GaP) grown with embedded metallic ferromagnetic nanoclusters (MnP).


Tighter chip densities tease out litho, metrology weaknesses, says Intel

Thu, 5 May 2011

Janice Golda, Intel, co-led a session at The ConFab 2011 on continued device scaling. EUV infrastructure will be a major topic, as well as transistor challenges. While lithography difficulties exist at tighter device densities, Golda reminds us that metrology obstacles must also be tackled.


Metrology tool debuts for B-SiGe HKMG from CAMECA

Thu, 1 Jan 2011

e EX-300 is a versatile metrology tool based on LEXES (Low-energy Electron induced X-ray Emission Spectrometry) technologyCAMECA unveiled the latest addition to its line of high-end metrology systems: the EX-300 metrology tool targeted for front-end process control of 22 nm technology nodes and beyond. e EX-300 is a versatile metrology tool based on LEXES (Low-energy Electron induced X-ray Emission Spectrometry) technology.


CAPRES-wins-repeat-metrology-order-from-Asia-foundry

Mon, 3 Mar 2011

CAPRES A/S, semiconductor metrology systems maker for the direct nano- and micro-scale electrical characterization of materials, announced a repeat order for its fully automated 300mm microRSP-A300 from an industry-leading foundry in Asia.


SoftJin-enhances-defect-analysis-software

Fri, 2 Feb 2011

SoftJin NxDAT defect analysis softwareSoftJin Technologies, a provider of customized automation software for electronic design and manufacturing, enhanced NxDAT, its defect analysis software. The enhanced version of NxDAT is optimized for better speed and memory performance.


Si-wafer-double-side-lapping-system-upgrades-Novellus-Peter-Wolters

Thu, 2 Feb 2011

Peter Wolters lapping systemNovellus Systems subsidiary Peter Wolters GmbH introduced a new version of its microLine double side lapping system for prime silicon wafers. The AC-2100L system features independently driven inner and outer pin rings, automatic force calibration, and in-situ wafer thickness metrology.


Avantor plans Taiwan materials lab with wafer fab, metrology tools in 100 cleanroom

Fri, 2 Feb 2011

Avantor Performance Materials, Inc. (formerly Mallinckrodt Baker, Inc.) plans to open an electronics applications laboratory in Taiwan in 2Q11, to conduct customer demos, perform process-of-record (POR) development, and support the company's global electronics technologies development.


High-k metal gate characterization using picosecond ultrasonic technology

Tue, 3 Mar 2011
Picosecond ultrasonic technology can be used during various stages of process development, integration, and volume manufacturing for monitoring the HKMG stack; this information can be used to characterize the process, and optimize deposition and CMP processes. J. Dai, P. Mukundhan, J. Chen, J. Tan, Rudolph Technologies, Flanders, NJ USA; D.B. Hsieh, T.C. Tsai, 1-United Microelectronics Corp., Tainan, Taiwan

16nm-hp-EUV-blanks-inspected-with-KLAC-Teron

Fri, 3 Mar 2011

Lithography defect inspection. SOURCE: KLA-Tencor (KLAC)Among the topics covered at KLA-Tencor’s annual Lithography Users Forum was extension of KLAC's Teron 600 platform for inspection of EUV blanks at the 16nm hp node. Here, Brian Trafas speaks with Debra Vogler about process control in advanced lithography.


Circuit edit at 22nm: DCG Systems debuts OPTIFIB Viper

Thu, 11 Nov 2011

DCG Systems introduced the OPTIFIB Viper system for circuit edit at the 22nm node. It uses a new coaxial photon-ion column to provide spot sizes 50% smaller than those of the flagship OptiFIB-IV.


Semiconductor yield improvement with scan diagnosis

Fri, 11 Nov 2011

ICs manufactured at 65nm nodes and smaller introduce new design-specific and feature-sensitive failure mechanisms, with systematic yield issues even more challenging to diagnose and overcome. SMIC and Mentor Graphics cover how to use scan diagnosis for better semiconductor yields.


ULVAC spectroscopic ellipsometer debuts for 300mm wafers

Mon, 9 Sep 2011

ULVAC Inc. uncrated the UNECS-3000A spectroscopic ellipsometer, which can measure the thinness of a thin film and optical constant. The noncontact film measurement tool targets semiconductor and liquid crystal display (LCD) manufacturing control.


KLAC debuts 20nm-node defect inspection system

Tue, 8 Aug 2011

KLA-Tencor Corporation (NASDAQ:KLAC) launched the eDR-7000 electron-beam (e-beam) wafer defect review system for chip manufacturing at the 20nm device nodes and below.


Cymer wafer-level light source metrology targets advanced lithography control

Thu, 10 Oct 2011

Light source supplier Cymer Inc. (Nasdaq:CYMI) launched SmartPulse, which monitors light source parameters at the wafer, collecting data for a suite of reporting and analysis tools.


SEMATECH's Bryan Rice: Why it's time for a "refresh"

Tue, 10 Oct 2011

Bryan Rice, SEMATECH's newly appointed director of strategic initiatives, tells SST what his new job entails: what he sees as his biggest challenges, which areas will keep SEMATECH's main attention (hint: the "once and future king" of resources), and what new areas are being explored.


Making EUV work, with a subsystem ear: Interview with SEMATECH's Stefan Wurm

Fri, 9 Sep 2011

Dr. Stefan Wurm, newly appointed director of SEMATECH's lithography program, tells SST what areas continue to be top-priority to SEMATECH, where progress is being made, and how SEMATECH's pursuits are changing along with its membership base.


Gartner: 2011 capex softer, 2012 messy

Fri, 9 Sep 2011

Semiconductor equipment spending in 2011 looks to be slightly weaker than anticipated, and is looking a lot softer in 2012 across the board, according to Gartner's new semiconductor capex forecasts.


Nonvisual semiconductor defect metrology today, at 22nm, and below

Tue, 8 Aug 2011

Syn: Robert Newcomb from Qcept Technologies discusses non-visual defects in today's wafer fab processes, at 22nm, and in the advanced nodes below 22nm. As nodes shrink, more defects will escape optical metrology, he predicts.


Synopsys enhances automation on volume diagnostic products

Wed, 9 Sep 2011

Synopsys enhanced its TetraMAX ATPG and Yield Explorer to improve volume diagnostics flow and speed up yield ramp for IC manufacturing. Flow in TetraMAX ATPG and Yield Explorer is automated with a new direct connection between the two products.


Entegris' Taiwan lab, manufacturing facility serves advanced semiconductor manufacturers

Thu, 10 Oct 2011

Entegris, Inc. (Nasdaq:ENTG) opened a manufacturing and research facility in Hsinchu City, Taiwan, for advanced filtration and materials handling components for the semiconductor industry and other high-tech industries.


SEMI honors industry leaders at SEMICON Europa

Thu, 10 Oct 2011

SEMI honored Dr. Tibor Pavelka (Semilab) with the European SEMI Award; Heinz Kundert (SEMI Europe) with the IC Industry Award for Excellence; and Christian Prischmann (UIbrich) with the SEMI Europe Standards Leadership Award.


Imec, ASML extend litho work, debut EUV sensors

Mon, 10 Oct 2011

Imec and tool vendor ASML have signed a new 5-year deal to continue collaboration on lithography technologies, both immersion and EUV, as well as associated components -- including new sensors to help calibrate lens alignment and dose.


Improved post-etch metal and oxide residue removal yields

Thu, 11 Nov 2011

Avantor Performance Materials and SSMC Inc. compare the use of a semi-aqueous post-etch ash residue remover with an industry-standard HA-based residue removal chemistry. The semi-aqueous-based product was shown to reduce COO for manufacturing of low- and high-voltage logic devices, and increase yields.


Freescale Semiconductor CEO takes SIA lead

Thu, 11 Nov 2011

The Semiconductor Industry Association (SIA) elected Freescale Semiconductor CEO Rich Beyer as its 2012 chairman. This will be the SIA's 35th year.


Liquid-borne sub-micrometer particle counting recommendation dispels common miconception

Wed, 11 Nov 2011

IEST-RP-CC042.1: Sizing and Counting of Submicrometer Liquid-Borne Particles Using Optical Discrete-Particle Counters, is now available from the Institute of Environmental Sciences and Technology. It dispels a common misconception among semiconductor, FPD, and data storage manufacturing users.


KLA Tencor announces Archer 200 overlay metrology system

Thu, 6 Jun 2008
by M. David Levenson, Editor-in-Chief, Microlithography World
June 5, 2008 - Overlay specifications have narrowed dramatically as the semiconductor industry advances toward the 32nm node, requiring control of high-order grid and field distortions, as noted by the ITRS. Seeking to meet these new requirements is KLA-Tencor's new Archer 200, the latest version of the company's imaging overlay measurement tool.

SPIE NEWS: SEMATECH, Carl Zeiss finalize design for DP photomask metrology system

Tue, 2 Feb 2008
Feb. 26, 2008 - Carl Zeiss and SEMATECH say they have completed final design for a next-generation photomask registration and overlay metrology system, dubbed "Prove," that will enable production of advanced photomasks "with substantially improved image placement accuracy," eyeing in particular the tighter placement control required for double-patterning technology.

Rudolph, SEMATECH, Albany forge process characterization pact

Wed, 2 Feb 2008
Feb. 20, 2008 - Rudolph Technologies and SEMATECH are establishing an international process characterization program to develop process, analysis, and characterization technology targeting 32nm and beyond semiconductor manufacturing. Work will be headquartered at the U. of Albany's College of Nanoscale Science and Engineering (CNSE). Rudolph says it is the first semiconductor equipment supplier to join SEMATECH's metrology program at Albany.

Double patterning will challenge litho, metrology, push feedback, computation

Tue, 2 Feb 2008
by Bob Haavind, Editorial Director, Solid State Technology
Feb. 26, 2008 - Plenary talks at this week's SPIE Advanced Lithography Conference reviewed the road ahead for lithography, from how far 193nm immersion can be pushed (probably 32nm, helped double patterning, new lens materials/fluids, and 3D) to the projected readiness of an EUV infrastructure (maybe by 2010-2012), and the progress and stalls in ongoing work to achieve success in both areas.

There is no more noise, only signal

Thu, 3 Mar 2008
by Ed Korczynski, Senior Technical Editor, Solid State Technology
In controlling the manufacturing processes used for advanced nanoscale IC, the aspects of metrology once ignored as "just noise" are now essential signals that must be controlled. Where to draw the line, and just how close is "close," are some of the challenges in ensuring that data streams become productive information for fabs, as discussed in sessions and interviews around this year's SPIE.

SPIE report: Cleverness, and a computational arms race

Wed, 3 Mar 2008
by M. David Levenson, Editor-in-Chief, Microlithography World
Avoiding unprintable structures will be essential for manufacturing 45nm and smaller circuits, and that was reflected in a series of papers on design for manufacturing and design rule restrictions, some of them quite aggressive. (Fourth in a four-part series)

Zygo buys Solvision for backend inspection play

Fri, 2 Feb 2008
Feb. 29, 2008 - Zygo says it has acquired the assets of Solvision, a Canadian provider of visual inspection equipment, for an undisclosed amount.

Bede: Buyout offer on, then off the table

Tue, 2 Feb 2008
Feb. 26, 2008 - In the span of a week, UK-based Bede, a provider of X-ray metrology tools, said that it had finally received an offer from a suitor after being first approached last summer, but that the offer was below current market value, and now the deal's off.

ANALYSIS: KLAC-ICOS makes sense, pending typical M&A quirks

Tue, 2 Feb 2008
by James Montgomery, News Editor, Solid State Technology
Feb. 26, 2008 - The proposed combination of KLA-Tencor and ICOS Vision Systems makes sense for both sides, both financially and in market positioning, though as always some questions need to be answered about just how smooth any such M&A will be.

KLA-Tencor scoops up ICOS for backend, LCD/solar play

Thu, 2 Feb 2008
Feb. 21, 2008 - The latest move in metrology industry consolidation has occurred with KLA-Tencor's proposed "friendly" acquisition of Belgium firm ICOS Vision Systems in a proposed €316.9M (US $465.8M) cash transaction.

Process integration drives the IC industry

Fri, 6 Jun 2008
by Ed Korczynski, Senior Technical Editor, Solid State Technology
The next 10 years will witness more changes in mainstream IC manufacturing technology than in the last 40 years combined. With rapidly escalating costs projected for ≤32nm-node digital CMOS manufacturing, IC companies are turning to analog, packaging, and heterogeneous integration to add greater value for lower cost and risk. In short: unique process integration challenges at each fab will drive everything.

WCJTG speakers summarize 32nm USJ progress

Tue, 7 Jul 2008
John O. Borland, organizer of the West Coast Junction Technology Group Meeting (WCJTG) held the final morning of SEMICON West, talks on camera to discuss the group's latest research, and other presenters provide summaries of their talks.

Analysts: KLAC+Vistec is a mask metrology play

Thu, 7 Jul 2008
Gartner and VLSI Research analysts tell SST what's the driving interest behind KLA-Tencor's proposed acquisition of Vistec Semiconductor Systems' inspection business, and where areas of overlap might be leveraged to take on other sector competitors.

Cutting back: Nanometrics laying off 7%

Thu, 1 Jan 2008
Jan. 10, 2008 - Coming off a year in which it significantly changed its focus and carved out multiple businesses, Nanometrics is starting the new year where it left off.

Metryx, IMEC team for sub-32nm metrology

Mon, 1 Jan 2008
Jan. 7, 2008 - Metrology equipment supplier Metryx Ltd. and IMEC have formed a joint development program centering on evaluating and developing mass metrology at both the application and tool level for sub-32nm process manufacturing.

45nm node registration metrology for EUV reticles

Wed, 11 Nov 2008
Tighter registration tolerances for the 45nm node and beyond require a next-generation registration metrology tool with capability to measure EUV masks with diverse substrate materials that might be used in 32nm and 22nm chip production.

E-beam, nanoimprint, and novel lithographies approach semiconductor mainstream

Tue, 4 Apr 2008
by Tom Cheyney, Senior Contributing Editor, Small Times
Electron-beam direct write, nanoimprint lithography (NIL), and other potentially disruptive semiconductor nanopatterning technologies drew strong attendance and elicited spirited discussion during the SPIE Advanced Lithography conference, as Small Times' Tom Cheyney reports.

Overlay control goes to high-order

Wed, 12 Dec 2008
More challenging overlay requirements are driving a trend to use high-order control knobs for production set-up of scanners. This article explores the overlay requirements that are driving this trend, the challenges involved with implementing in production, and the cost-of-ownership trade-offs between different high-order control strategies.

New SRP metrology system eyes small/mid-tier sweetspot

Sat, 8 Aug 2009
Semilab SSM president Chris Moore tells SST how the company's new manual system, the SRP Express 170, hits the spot for small- and mid-tier semiconductor and solar cell manufacturers with density and resistivity depth profiling of electrically active dopants.

Semilab adds materials analysis to metrology scheme

Tue, 6 Jun 2009
Chris Moore, leader of Semilab's new USA division, talks to SST about the company's latest acquisition of materials analysis firm SDI, its assembled roster of metrology technologies, and a possible consequence of stalled 450mm discussions: equipment leasing.

ISMI launches ESH center for green tech work

Tue, 2 Feb 2009

International SEMATECH Manufacturing Initiative (ISMI), the global consortium of major semiconductor manufacturers, today announced the launch of its new Environment, Safety & Health (ESH) Technology Center in Austin, Texas. The Center will be dedicated to providing green technology solutions that lead to reduced energy consumption, lower costs, and greater productivity in semiconductor manufacturing.


SPIE/BACUS: Patterned media is fertile ground for mastering, replication, metrology developments

Thu, 9 Sep 2009

Several papers presented at last week's SPIE/BACUS Symposium described the mastering, replication and metrology challenges of patterned media, writes Toppan Photomasks' Franklin Kalk, reporting exclusively for SST.


Metrology firm gears up during downturn

Tue, 3 Mar 2009
Budapest, Hungary-based Semilab is staking its claim in the metrology sector with a pair of new acquisitions to broaden its portfolio and cement a foothold in Tier 1 fabs. Chris Moore, president/CEO of Semilab AMS, tells SST how the company has built up a portfolio of technologies to address critical applications. Also on his mind: the need for suppliers to build critical mass, what Tier 1 fabs are receptive to right now, and the state of 450mm tool development.

SPIE tracks the tightening litho horse race

Mon, 3 Mar 2009
How much longer can the industry stay on an 'optics forever' path? EUV is gaining momentum and closing the gap, with most infrastructure in place (but one missing piece could be a "showstopper"). This year's SPIE's Advanced Lithography Conference in San Jose, CA, provided a detailed update on this tightening horse race.

Rudolph focuses on increasing average cell efficiency

Mon, 1 Jan 2009
Rudolph Technologies has uncrated a software package targeting the still-troublesome area of photovoltaic cell efficiency, hoping to bring solar cells closer to grid parity through reduced costs and inefficiencies.

SEMATECH's 450mm progress, next steps

Thu, 7 Jul 2009
ISMI provided SST with tidbits from its closed-door discussions on Wednesday centered on the 450mm transition: some supplier selections are complete and >60 are engaged for test wafers, which are slated to distribute in 3Q09.

NCCAVS preview: Msec-only anneal at 22nm?

Thu, 7 Jul 2009
The main theme at this year's NCCAVS Junction Technology Group meeting will be 22nm junction, which many believe this will be the first node to use msec-only annealing (i.e. diffusionless), according to meeting chair John Borland, of J.O.B. Technologies. He also gives a quick recap of what's ahead at 16nm.

Inside Owens Design's turnkey metrology automation platform

Tue, 7 Jul 2009
SST's Debra Vogler visited Owens Design before SEMICON West to see its newest platform, the Element and discuss the company's design process, with which OEMs can deploy a semiconductor "fab-ready" metrology tool.

ASML fulfills "holistic litho" plan with two tools, custom packages

Wed, 7 Jul 2009
Citing the embodiment of its concept of "holistic lithography," ASML has unwrapped two hardware/software components to help chipmakers improve lithography process windows while avoiding costly and timely steps and maintenance downtime.

Magma launches yield enhancement software for solar fabs

Wed, 7 Jul 2009
Magma Design Automation is making its splash into the world of solar photovoltaics with a new software package to help solar cell manufacturers identify and correct causes of yield loss and thus improve energy conversion.

DFM: Are we there yet?

Tue, 10 Oct 2006
The special Friday session of BACUS '06, organized by Bob Naber of Cadence, addressed the question of industry progress and readiness for DFM, and discussed the remaining challenges as well as proposed solutions. Mark Mason of Texas Instruments pointed out that "DFM is a journey, not a destination," and worried that management did not yet understand how hard it was going to be.

ICOS, IMEC to develop 3D packaging metrology

Thu, 7 Jul 2006
July 27, 2006 - ICOS Vision Systems Corp. NV and European R&D center IMEC have agreed to collaborate on development of metrology methods targeting 3D packaging processes for ICs, including wafer-level packaging, flip-chip, systems-in-package, and microelectromechanical systems (MEMS).

OnWafer extends plasma process control offerings with AE unit deal

Mon, 7 Jul 2006
July 10, 2006 - OnWafer Technologies, Pleasanton, CA, has acquired the plasma management division of Advanced Energy Industries Inc., including IP and technology-related assets, in a move to extend its position in plasma process control and diagnostics wireless metrology technology. Terms of the deal were not disclosed.

Ultratech paves metrology inroads with Oraxion buy

Mon, 7 Jul 2006
July 3, 2006 - Ultratech Inc., San Jose, CA, a supplier of lithography and laser-processing systems, has entered into a nonbinding letter of intent to purchase the assets of Oraxion Inc., a startup developer of wafer stress metrology tools. Financial terms of the deal, which is subject to "the negotiation of definitive agreements and other standard conditions," were not disclosed.

Bede, IMEC eyeing X-ray metrology for 45nm node

Fri, 8 Aug 2006
August 25, 2006 - Bede X-ray Metrology and European research consortium IMEC have entered into a collaboration to investigate the use of X-ray metrology for process control and characterization of new semiconductor materials used at the 45nm node and below.

Analyst: Metrology tools the first casualty in chipmaker capex cuts

Wed, 8 Aug 2006
August 30, 2006 - Semiconductor manufacturers are increasingly trying to cut expenses and spending, and the first casualty appears to be metrology equipment investments, according to a new report from The Information Network.

Ultratech completes Oraxion buyout, adds metrology to base offering

Tue, 8 Aug 2006
August 15, 2006 - Ultratech Inc., San Jose, CA, has officially acquired certain assets of Oraxion Inc., a maker of surface-metrology and stress-analysis equipment for semiconductor and related industries, finalizing a nonbinding letter of intent signed in early July.

Modular metrology, strain engineering, and managing waste

Tue, 7 Jul 2006
Spanning the SEMICON West show floor, SST Senior Ed Korczynski reports on equipment providers' merger progress, market strategies, and new and improved technology offerings ranging from metrology to wafer cleaning to liquid waste abatement.

SEMICON West preview: Applying beer technology to slurry, and rethinking thin film metrology

Wed, 7 Jul 2006
Among this year's crop of companies in the spotlight at this year's SEMICON West Technology Innovation Showcase include a Swiss company controlling the beer flow at the World Cup stadium, thinking controlling slurry flow will be less demanding; a trio of metrology startups pushing radical new approaches to thin-film metrology; and a familiar face touting a new tungsten slurry for better yields at 45nm.

Nova top execs step down

Fri, 8 Aug 2006
August 10, 2006 - Nova Measuring Instruments Ltd., Rehovoth, Israel, said that its two cofounders and top execs have stepped down, amid a transition into a new phase of growth.

Brion adds marketing, bizdev, sales execs

Fri, 8 Aug 2006
August 4, 2006 - Brion Technologies says it is expanding its management roster following "considerable" growth over the past year, to help support work with partners spanning design to manufacturing and wafer metrology.

Nova puts litho metrology patents up for bids

Wed, 9 Sep 2006
September 6, 2006 - Nova Measuring Instruments, Rehovoth, Israel, is soliciting bids from approximately 100 companies to license six of its patents relating to use of a lithography tool with integrated metrology, and will even accept bids for outright ownership of the technology.

Therma-Wave extends $15M credit line

Tue, 8 Aug 2006
August 1, 2006 - Therma-Wave Inc., Fremont, CA, said it has tacked on a year to its $15 million line of credit from SVB Silicon Valley Bank, which is now available to finance working capital needs through June 2008.

Philips-AMS buyout provides glimpse into industry trends

Tue, 10 Oct 2006
Chris Moore, CEO of metrology equipment supplier Philips AMS (now known simply as AMS -- Advanced Metrology Systems) talks with WaferNEWS about the decision to break free from former parent Royal Philips, the new reality of semiconductor market cycles, and where the company is pushing new inroads for its trench-measurement technology.

Nova putting litho metrology patent licenses up for bids

Wed, 9 Sep 2006
September 6, 2006 - Nova Measuring Instruments, Rehovoth, Israel, is soliciting bids from approximately 100 companies to license six of its patents relating to use of a lithography tool with integrated metrology, and will even accept bids for outright ownership of the technology.

ASML, SEMATECH qualifying RET for sub-45nm designs

Tue, 9 Sep 2006
September 19, 2006 - SEMATECH and its manufacturing-oriented subsidiary, the International SEMATECH Manufacturing Initiative (ISMI), have signed an agreement to incorporate ASML Holding NV's resolution enhancement techniques (RET) in order to qualify imaging performance of advanced logic patterns, metrology structures, and defect designs for the 45nm, 32nm, and 22nm technology nodes.

ASML takes first EUV preproduction tool order

Tue, 10 Oct 2006
October 17, 2006 - ASML Holding NV says it has received the first order from an unidentified customer for a pre-production EUV system, following shipments of two alpha tools earlier this year to IMEC and Albany Nanotech.

Nanometrics, ASML tie up for litho metrology

Thu, 10 Oct 2006
October 26, 2005 - Nanometrics Inc. and ASML Holding NV have entered into a cross-licensing agreement to incorporate Nanometrics' overlay and critical-dimension control metrology technology into ASML's lithography systems.

EU-backed metrology R&D group expands

Fri, 4 Apr 2006
April 7, 2006 - The "Metrology Using X-Ray Technology" (MUXT) consortium, a project funded by the European Commission and carried out by Crolles2 partners ST Microelectronics, Philips Semiconductors, and CEA-LETI to evaluate and assess prototype equipment for next-generation semiconductor technologies, has added Jordan Valley Semiconductors Inc. to its roster.

AOI unveils scatterometry add-on

Wed, 4 Apr 2006
April 5, 2006 - Accent Optical Technologies has developed a new scatterometry acceleration tool to provide advanced critical dimension (CD) metrology for 65nm device manufacturing.

CMP outsourcing firm beefs up service lineup

Mon, 6 Jun 2006
June 19, 2006 - Entrepix Inc., Tempe, AZ, a provider of chemical mechanical polishing services for foundries and equipment providers, has launched a new suite of services and technologies targeting the "fab-light" manufacturing model.

Therma-Wave resounds "going concern" alarm

Mon, 6 Jun 2006
June 19, 2006 - Therma-Wave Inc., Fremont, CA, a provider of process control metrology systems, says its independent accounting firm has cited the company as a "going concern" in its recent financial reports for the fiscal year ended in March, due to recurring net losses and negative cash flows. The company received a similar "going concern" warning a year ago.

Cabot buys polishing firm, seeks optics inroads

Fri, 6 Jun 2006
June 16, 2006 - Cabot Microelectronics Corp. Aurora, IL, a developer of chemical mechanical planarization (CMP) polishing slurries, has agreed to purchase all the assets of QED Technologies Inc., a developer of polishing and metrology systems for high precision optics, in an effort to expand its "engineered surface finishes" lines outside the semiconductor market.

Brion, Hitachi linking DFM technologies in new platform

Tue, 11 Nov 2006
November 28, 2006 - Brion Technologies and Hitachi High-Technologies are collaborating on a DFM platform that will enable chipmakers to detect, measure, and monitor optical proximity correction (OPC) defects during volume production of advanced semiconductors. Brion and Hitachi say the combined technologies in one interface will "vastly reduce the amount of time and number of operations required to generate a several-hundred point CD-SEM recipe for OPC evaluation."

Nova tips 8% worker layoffs in biz balancing act

Tue, 11 Nov 2006
November 21, 2006 - Days after a business unit reorg and executive shuffle, Nova Measuring Instruments Ltd. has announced layoffs of about 8% of its workforce in all parts of the organization, but mainly in R&D and operations and including management positions. The company will take a $300K charge in 4Q06 to cover termination expenses and other costs, but foresees saving $2 million in 2007.

KLA, ADE propose $488M tie-up

Fri, 2 Feb 2006
February 24, 2006 - In the latest episode of an evolving story of consolidation in the metrology sector, KLA-Tencor Corp. has agreed to acquire inspection systems provider ADE Corp. for $488 million in stock.

Nova buys ex-ATMI x-ray metrology biz

Tue, 4 Apr 2006
April 25, 2006 - Nova Measuring Instruments Ltd., Rehovoth, Israel, has agreed to acquire former ATMI subsidiary HyperNex, a developer of x-ray diffraction metrology systems, for approximately $4.5 million.

Nanometrics buys Soluris for overlay metrology

Thu, 3 Mar 2006
March 16, 2006 - Barely a month after it acquired scatterometry pioneer Accent Optical Technologies Inc. for roughly $80 million, Nanometrics Inc., Milpitas, CA, is back at it again, snapping up overlay metrology firm Soluris Inc. for $7.0 million in cash.

KLA-Tencor tool analyzes CD metrology data

Wed, 2 Feb 2006
February 22, 2006 - KLA-Tencor has added a new feature spanning its lineup of overlay, CD SEM, and optical CD metrology tools to provide automated real-time analysis of overlay and critical dimension (CD) metrology data during 65nm and below IC manufacturing processes.

Nanometrics beefing process control with Accent buy

Thu, 1 Jan 2006
January 26, 2006 - Nanometrics Inc., Milpitas, CA, is acquiring Accent Optical Technologies Inc., Bend, OR, in a stock deal worth approximately $80.9 million in a deal that combines Nanometrics' and Accent's process control and metrology technologies.

Nanometrics CFO latest to exit

Thu, 4 Apr 2007
April 25, 2007 - Just a month after its CEO left the company, Nanometrics says CFO Dave McCutcheon has followed him out the door "to pursue other opportunities," the company said in a statement. Quentin Wright, currently chief accounting officer, will take over as interim CFO until a permanent successor is found.

Metrology firm tabs FEI exec as CEO

Mon, 1 Jan 2007
January 15, 2007 - Metrosol Inc., Austin-TX, a developer of optical reflectometry systems, has appointed Kevin Fahey as president and CEO, formerly VP and GM of FEI Co.'s fab market division.

AMS uncrates metrology systems for 3D, Cu/low-k stacks

Fri, 7 Jul 2007
July 19, 2007 - Advanced Metrology Systems (AMS, formerly Philips AMS) has released three new metrology tools this week, offering model-based infrared (MBIR) metrology for 3D DRAM structures, and a surface wave system for multilayer measurements of copper/low-k films stacks.

AMAT releases oxide spacer system at SEMICON West

Wed, 7 Jul 2007
July 18, 2007 - Applied Materials Inc. today released its Applied Producer ACE SACVD system, which helps extend 193nm lithography using self-aligned double patterning (SADP) schemes. The ACE system reportedly delivers a highly conformal oxide spacer film with greater than 95% step coverage, <5% pattern loading and <1% nonuniformity for critical dimension control.

SST ON THE SCENE: R&D effectiveness needs collaboration; unresolved 45nm/32nm metrology issues

Tue, 7 Jul 2007
In video interviews at SEMICON West, Dave Gross of AMD pleads AMD's case for collaboration to maximize the effectiveness of R&D dollars. Alain Diebold (U. at Albany) summarizes unresolved metrology issues at 45nm and discusses the future at 32nm. And John Allgair (ISMI assignee from AMD) outlines the group's current plans as it gears up for a larger presence in Albany and expand its metrology program -- look for intentional defect array wafers to be ready for mass production in 2-3 months.

VUV metrology sees ultra-thin films

Tue, 7 Jul 2007
Spectroscopic reflectometers (SR) and ellipsometers (SE) provide thickness and composition information for thin dielectric films. As the industry has moved to ever thinner films, there is less material to refract light and SE signals drop off. Metrosol, one of last year's SEMICON West Technology Innovation Showcase winners, is ready to make a splash, providing vacuum-ultraviolet (VUV) SR tools that can resolve information from extremely thin films.

SURFmonitor breaking waves of defects

Mon, 7 Jul 2007
KLA-Tencor's Surfscan SP2XP, released earlier this year, was initially release to inspect defects on bare wafers. Now the SURFmonitor haze analysis capability has added new image processing algorithms to allow for applications in IC manufacturing. SURFmonitor is an add-on option to either a SP2 or SP2XP darkfield/brightfield laser scattering surface inspection system.

Rudolph uncrates metrology tools, software

Mon, 7 Jul 2007
July 16, 2007 - Rudolph Technologies Inc. is unveiling two metrology tools at SEMICON West, targeting DRAM, multi-surface macroinspection, as well as data analysis system to capture and analyze process performance information.

SEMICON WEST: HK+MG metrology technology takes center stage

Tue, 7 Jul 2007
With High-k (HK) dielectrics and metal-gates (MG) now being ramped into CMOS production at Intel and IBM, much of the excitement at this year's SEMICON West centered around manufacturing technologies needed for these new materials. Much of the discussions in equipment supplier-sponsored seminars and panels centered on the challenges of working with these new materials -- particularly the tricky setup of affordable in-line metrology for these new ultra-thin materials.

KLA-Tencor snaps up Therma-Wave for $75M

Mon, 1 Jan 2007
January 8, 2006 - Months after being rescued by a new credit line following a "going concern" warning, Therma-Wave Inc. has found a new savior -- KLA-Tencor Corp., which has agreed to acquire the process control metrology system provider for $75 million in cash.

The case for leasing equipment

Wed, 5 May 2007
A ConFab session on "Capital Equipment: Alternative Financing Models" was kicked off by Craig Ignaszewski, director of capital equipment procurement, IBM, with discussion of the rationale for leasing vs. buying equipment. Meanwhile, Zvi Lando, VP at Applied Materials' Israel operation, suggested that upgrades might be capable of carrying leased metrology and inspection equipment through an extra process node.

Manufacturing alliances: An expanded role for equipment suppliers

Mon, 5 May 2007
In the new consumer-driven electronics industry, where beating your competition to market with innovative technology is the surest route to success, process control equipment suppliers have an expanded role in manufacturing alliances to help dramatically shorten product-development and production-ramp times, and thus significantly improve yield and profitability, according to Brian Trafas, chief marketing officer at KLA-Tencor, in his talk at the Confab in Las Vegas.

Multiple strategies for a bifurcated industry

Mon, 5 May 2007
Some industry observers figure that the industry will probably have only a handful of major players in the form of IDMs, alliances, top foundries, and some fab-lite companies. Tokyo Electron America's president, Harvey Frye, on the other hand, thinks there is probably room for at least 10 companies globally that could remain IDMs in some form, and listed likely candidates and working strategies in a Monday morning panel discussion at the ConFab.

KLA-Tencor snaps up DFM metrology startup FabSolve

Fri, 6 Jun 2007
June 29, 2007 - KLA-Tencor Corp. apparently has quietly acquired FabSolve LLC, a US firm with "design-based metrology" software, based on its Vietnam parent group's digital mapping/GIS technology, that can be used for in-line metrology in semiconductor manufacturing.

Substrate metrology, coating players join forces

Thu, 5 May 2007
May 16, 2007 - A pair of Texas-based substrate equipment providers, NexTech Solutions (inspection/handling) and FAS Technologies LLC (coating), have agreed to merge into a single legal entity.

SEMATECH shifting HQ to Albany

Thu, 5 May 2007
May 10, 1007 - International SEMATECH is moving its headquarters from Austin, TX, to its operations located at the U. of Albany, and will launch a significant expansion there, matching $300 million in state investments for facility upgrades.

Survey: HK+MG, 193nm immersion likely by 2010; EUV, 450mm on the outs

Thu, 6 Jun 2007
June 21, 2007 - A new study by Wright Williams & Kelly Inc. and Strategic Marketing Associates sheds light on what people in the industry think will be most likely to hit production process lines in the next 2-5 years, and which ones may take longer than expected to be adopted into manufacturing lines, if ever.

Infineon exec: Progress "too slow" for mugFET metrology

Tue, 6 Jun 2007
June 19, 2007 - Klaus Schruefer, chief scientist for Infineon's multigate FET technology project, tells WaferNEWS why mugFETs are being pushed out beyond 32nm, and what's highest on the to-do list to get the technology ready for chip manufacturing, even by the 22nm node.

AMS: Life under the PE umbrella, and the secret progress of finFETs

Tue, 7 Jul 2007
Days before Semicon West, WaferNEWS caught up with Christopher Moore, president/CEO of Advanced Metrology Systems (AMS), nee Philips AMS, to chat about how life is different nine months after taking the private equity route.

Process control firm Tevet tacks on new funding

Fri, 7 Jul 2007
July 13, 2007 - Days after appointing a new CEO and president, Israeli metrology firm Tevet Process Control Technologies Ltd. says it has received $2.75 million in new financing, including support from the VC arm of customer Intel Corp.

Tevet founder fills vacant CEO slot

Mon, 7 Jul 2007
July 9, 2007 - Ofer Du-Nour, founder of Israeli metrology firm Tevet Process Control Technologies Ltd., has been named as CEO of the company, following the sudden resignation of Yuval Wasserman "to pursue other interests." Peter Gillespie, VP of marketing and sales, also has been promoted to president of the firm.

Nanometrics trims product lines, eyes core metrology market growth

Fri, 6 Jun 2007
June 8, 2007 - Yet another move in a busy spring has left Nanometrics Inc. feeling better about its positioning in the market with a core group of metrology technologies, after the recent sale of two tangential product lines, the company says.

Analyst: Metrology market bouncing back in 2007

Tue, 6 Jun 2007
June 5, 2007 - The market segment for semiconductor metrology and inspection tools will recover "modestly" this year after "a dismal 2006" in which the segment grew just half the rate of the rest of the frontend equipment market, according to a report from The Information Network.

SEMATECH uses Bede x-ray metrology system for materials evaluation

Fri, 3 Mar 2007
March 16, 2007 - Bede X-ray Metrology has announced that SEMATECH will use a Bede x-ray metrology system to evaluate novel semiconductor materials needed for the 45nm and 32nm technology nodes and beyond.

Nanometrics tabs Imago's Stultz to reverse integration "challenges"

Mon, 8 Aug 2007
August 6, 2007 - Nanometrics Inc. has appointed Timothy Stultz, former president/CEO of Imago Scientific Instruments, as its new CEO, taking over for Bruce Rhine who held the spot since March and move to the position of chairman, in a culmination of moves in what the company admits has been a year of "challenges."

REPORT FROM SPIE: Double double, toil and trouble!

Tue, 3 Mar 2007
Progress in water immersion exposure technology since last year's SPIE Advanced Lithography Symposium has been so convincing that its insertion into manufacturing at the 55nm and 45nm generations (as reported by Toshiba, STMicro, and others) is not likely to be interrupted. However, the consensus today is that some evolutionary step has to be taken to extend immersion technology and keep up with Moore's law -- and double patterning technology seems to be the step that will take us to 32nm.

Nanometrics shuttering Soluris facility, consolidating production in Asia

Wed, 3 Mar 2007
March 21, 2007 - Nearly one year to the day after acquiring overlay metrology firm Soluris Inc., metrology equipment supplier Nanometrics Inc. says it is closing the firm's Concord, MA facility and consolidating all of its overlay metrology production at a facility in Asia.

August 2007 Exclusive Feature #1: METROLOGY
Separating systematic from random defects in inspection

Mon, 8 Aug 2007
By Allen Park, KLA-Tencor Corp., Milpitas, CA, United States

EXECUTIVE OVERVIEW A powerful new method can identify systematic defects within a large defect sample, prior to SEM review. By integrating design data with defect data, this method enables accurate binning of randomly distributed structural systematic defects. Instead of relying on inefficient random review sampling to identify defects of interest (DOI), this technique applies a pattern search engine...

Heaton out as Nanometrics CEO, AOI's Rhine stepping in

Tue, 3 Mar 2007
March 27, 2007 - Days after consolidating some of its manufacturing operations in Korea, Nanometrics Inc. has undergone another shift -- this time in the CEO's office. John Heaton has left the company (no details were provided by the company), with chief strategy officer Bruce Rhine taking the reins on an interim basis while a search is conducted for a permanent CEO.

Nanometrics cutbacks continue with Milpitas closure

Thu, 8 Aug 2007
August 16, 2007 - Following months of trimmings and reorganizations, Nanometrics Inc. is further shrinking its corporate footprint with the closure of its machine shop and plating facility in Milpitas, CA.

Nova solicits $5M from investors

Fri, 3 Mar 2007
March 2, 2007 - Israel metrology equipment provider Nova Measuring Instruments Ltd. says it has agreed to a $5 million private placement of nearly 2 million shares by a group of several investors.

Micron in, Freescale out of SEMATECH flock

Thu, 3 Mar 2007
February 28, 2007 - SEMATECH has named Micron Technology Inc. to its International SEMATECH Manufacturing Initiative (ISMI) roster, while reportedly saying goodbye to member Freescale Semiconductor.

Nanometrics ties off more asset sales

Mon, 8 Aug 2007
August 27, 2007 - Nanometrics says it has completed the sale of facilities in Narita, Japan, related to the flat-panel display business that it sold in 2005 and "had sat unutilized" ever since. Also sold was a residential condo near the company's headquarters in Milpitas, CA. Together the sales will add about $2 million in cash and both reduce debt and add income of approximately $1.2 million in 3Q07.

Ion sources get a new lease on life with in situ chemical cleaning

Tue, 8 Aug 2007
Buildup of chemical residues inside an ion implanter limits the tool's overall utilization efficiency. WaferNEWS talks with Atmel Corp. about the results from its evaluation of a new in situ chemical cleaning technology from ATMI that reduces such deposits and achieves greater predictability for source change-outs.

Nova gains license deal from patent auction

Wed, 8 Aug 2007
August 8, 2007 - Nearly a year after putting some of its lithography metrology patents up for auction, Nova Measuring Instruments says it has signed a >$1 million deal with an unnamed "top-10 semiconductor manufacturer" for a license covering use of its technologies for integrated metrology and integrated process control before and during the photolithography manufacturing step.

Cadence, Stratosphere eye 45nm yield improvements

Tue, 9 Sep 2007
September 11, 2007 - Cadence Design Systems and Stratosphere Solutions are collaborating to increase 45nm semiconductor device yields by targeting manufacturing variability, combining their technologies to offer improved process modeling, analysis, and implementation flows.

Jordan Valley nails $11M funding from Intel

Tue, 10 Oct 2007
October 16, 2007 - Intel Capital, the chipmaking giant's global VC arm, has invested $11 million in Jordan Valley Semiconductors to obtain what the companies describe as "a significant stake" in the provider of x-ray-based thin-film metrology tools.

Aquest offers a new way to address fab capacity

Tue, 10 Oct 2007
As a number of presenters made clear at last week's ISSM conference (Oct. 15-17, Santa Clara, CA), there is a movement in the industry that favors the ability to utilize small-lot (<25 wafers) manufacturing as a way to provide fab agility and drive down cycle times. Aquest Systems believes its vehicle-free transport technology, FabEX Transporter, can change the way existing or new fabs implement automation, enabling not only small lots but also a possible wafer size transition.

Interview with Oerlikon CEO: PV fab strategies to minimize risk

Mon, 10 Oct 2007
In an exclusive interview with WaferNEWS, Jeannine Sargent, recently appointed CEO of Oerlikon, discusses the future of solar energy, her company's plans beyond current amorphous/micromorph-tandem silicon thin-film on glass technology, and how to bring photovoltaic (PV) technology to the promised land of "grid parity" -- the point at which the cost to generate electricity is no more than the cost to buy it from the distribution grid.

SEMATECH tweaks, updates "next-generation" fab programs

Wed, 12 Dec 2007
December 5, 2007 - SEMATECH has laid out general info about its 300mm "next generation factory" program, describing new and updated projects within its efforts to help the industry find ways to lower costs and reduce cycle times for 300mm wafer manufacturing, and establish a "proving ground" for concepts relevant to 450mm wafer-size manufacturing.

Rudolph buys Applied Precision's semiconductor biz

Wed, 12 Dec 2007
December 19, 2007 - In a bid to extend into wafer probing, Rudolph Technologies has acquired the semiconductor business assets of Applied Precision LLC, a provider of wafer probe card metrology systems and wafer probe process management technologies.

Test tool supplier Verigy buying time-to-yield firm Inovys

Thu, 12 Dec 2007
December 6, 2007 - Verigy, a provider of memory and SoC test systems, has agreed to acquire privately held Inovys, which develops design, failure analysis, and yield software, for an undisclosed amount, a deal that enables the companies to better target "the crossroads of design, manufacturing and yield metrology."

KLA-Tencor's WaferSight2 sees wafer nano-topo

Mon, 12 Dec 2007
With lithography depth-of-focus specs pushing on other areas of technology, one area that has taken up the slack is the starting silicon wafer's planarity. Another area of concern is minimizing a nanometer scale surface change seen within the outer 5mm of a wafer, termed edge roll-off. Enter KLA-Tencor's upgraded WaferSight2 system, which the company says combines flatness and "nanotopography" in a single integrated tool to enable higher resolution, matching, and precision.

KLA-Tencor, Nikon collab to corral "mix-and-match" litho setups

Tue, 12 Dec 2007
December 10, 2007 - KLA-Tencor and Nikon say they have developed a set of fully automated system tools for correcting overlay errors in "mix and match" lithography setups that encompass tools of varying capabilities and from different suppliers.

Semilab buying US probe firm SSM

Thu, 11 Nov 2007
November 15, 2007 - Semilab Co. Ltd., a Budapest, Hungary-based supplier of noncontact wafer mapping metrology systems, has agreed to acquire Pittsburgh, PA-based SSM Inc. for an undisclosed cash amount, and reorg the business as a new division for developing and selling electrical metrology systems for semiconductor manufacturing.

Matsushita to join International SEMATECH manufacturing initiative

Wed, 10 Oct 2004
October 6, 2004 - The Semiconductor Company of Matsushita Electric Industrial Co., Ltd. has joined the International SEMATECH Manufacturing Initiative (ISMI) effective Oct. 1, becoming the newest member of a global alliance of semiconductor companies focused exclusively on manufacturing effectiveness, officials of SEMATECH announced today.

KLA-Tencor acquires Candela Instruments

Mon, 10 Oct 2004
October 4, 2004 - KLA-Tencor Corp. announced today that it has signed a definitive agreement to acquire Candela Instruments, Fremont, CA, a supplier of laser-based surface inspection systems optimized for the data storage industry.

Veeco, Dow joint program receives NIST/ATP award

Fri, 10 Oct 2004
October 1, 2004 - Veeco Instruments Inc. and The Dow Chemical Co. have received $6.6 million in funding from the US Commerce Department's National Institute of Standards and Technology Advanced Technology Program for a three-year project to develop a quantitative nano-mechanical measurement instrument.

Semilab completes acquisition of SemiTest

Mon, 10 Oct 2004
October 18, 2004 - Materials metrology supplier Semilab R.T., Budapest, Hungary, has completed its acquisition of SemiTest Inc., Billerica, MA, the companies said Friday.

IMEC, KLA-Tencor set sights on sub-65nm metrology

Thu, 10 Oct 2004
October 7, 2004 - KLA-Tencor Corp., San Jose, CA, and Belgium-based research center IMEC have begun a joint development project to accelerate adoption of optical critical-dimension (CD) metrology technology for sub-65nm semiconductor applications.

Nanometrics, Lam ink metrology deal

Tue, 2 Feb 2004
February 17, 2004 - Nanometrics Inc., Milpitas, CA, has signed a deal to integrate its NanoOCD/DUV 9101b film thickness mapping module into Lam's CMP tool.

Nanometrics, Hitachi High-Tech sign supplier deal

Wed, 1 Jan 2004
January 21, 2004 - Nanometrics, Milpitas, CA, has signed a deal to supply metrology units to be integrated into Tokyo-based Hitachi High-Technologies' (HHT) semiconductor inspection products.

Nanometrics, Ebara forge deal

Thu, 1 Jan 2004
January 15, 2004 - Nanometrics Inc., Milpitas, CA, has signed a deal to supply integrated metrology units to Japan's Ebara Corp. for use with its CMP products.

August Technology revs Taiwan operations

Wed, 1 Jan 2004
January 21, 2004 - August Technology, Bloomington, MN, a provider of automated inspection and metrology equipment, is expanding its service and applications operations in Hsinchu, Taiwan.

Sopra taps IMEC's thin-film technology

Wed, 6 Jun 2004
June 16, 2004 - Sopra, a French supplier of metrology tools for thin films, has licensed ellipsometric porosimetry (EP) patents from European research center IMEC for a metrology tool it's unveiling later this year.

Oraxion Diagnostics appoints new CEO, COO

Tue, 5 May 2005
May 24, 2005 - Oraxion Diagnostics, a provider of advanced metrology systems, has named industry veterans Bang C. Nguyen as CEO and director and Jonathan M. Sabol as COO.

Nikon integrates industrial metrology and semiconductor inspection units

Mon, 4 Apr 2005
April 4, 2005 - Nikon Instruments Inc. has announced the integration of two high precision industrial metrology business units, Semiconductor Inspection, and Nexiv Vision Measuring Systems, under the SITECH Division located in Tempe, AZ. Two new departments have been established within the division: Vision Systems and Semiconductor Inspection.

Sematech identifies top technical challenges for 2006; adds transistor scaling

Tue, 4 Apr 2005
April 19, 2005 - Sematech has announced its top technical challenges for 2006, continuing to underscore advanced gate stack, 193nm immersion and EUV lithography, mask infrastructure, and low-k dielectrics with process compatibility. Consortium leaders also placed planar bulk transistor scaling on the list for the first time.

Rudolph and August sign definitive merger agreement

Wed, 6 Jun 2005
June 29, 2005 - Rudolph Technologies Inc. has signed a definitive merger agreement with August Technology Corp. The transaction has been unanimously approved by the board of directors of both companies, is subject to customary regulatory approvals and shareholder vote of each company, and is expected to close in the 4Q05.

View Engineering acquires Micro-Metric

Fri, 10 Oct 2005
October 21, 2005 - Micro-Metric, San Jose, CA, a provider of noncontact measurement and assembly systems, has announced that View Engineering, a Simi Valley, CA-based vision measurement systems provider, has acquired its assets.

Recent equipment orders

Wed, 2 Feb 2005
February 2, 2005 - Recent equipment orders include:
-- Axcelis Technologies Inc. has announced that a leading European chipmaker has selected its new 300mm single-wafer ion implantation platform.
-- Mattson Technology Inc. has announced that Samsung has placed orders for Mattson's rapid RTP and CVD systems.
-- Philips Advanced Metrology Systems Inc. has received a multi-unit order for its series 3300 copper metrology tool from AMD Saxony LLC & Co. KG, Dresden, Germany.

Nanometrics and August Technology to merge

Mon, 1 Jan 2005
January 24, 2005 - Nanometrics Inc. and August Technology Corp. have entered into a merger agreement to create a combined company providing inspection, measurement and analysis systems. The combined company will be named August Nanometrics Inc., and the companies said they expect to close the transaction during the 2Q05.

Straatum opens new Silicon Valley office

Mon, 9 Sep 2005
September 26, 2005 - Straatum Processware Ltd., a Dublin, Ireland-based supplier of real-time fault detection and classification (FDC) software for semiconductor manufacturing, has opened a global sales office in San Jose, CA.

IEEE eyes nanotube standards

Fri, 12 Dec 2005
December 2, 2005 - The IEEE has begun work on a new standard to define methods for testing carbon nanotubes used as additives in bulk materials, and how to report data about the materials' performance.

Therma-Wave wins multimillion dollar order for metrology solutions

Thu, 3 Mar 2005
March 17, 2005 - Therma-Wave Inc. has announced that a leading Taiwanese DRAM semiconductor manufacturer has selected multiple Therma-Wave metrology solutions for use in its 300mm factory. The multimillion dollar order includes multiple Opti-Probe 7341 thin film metrology tools with real-time, critical-dimension capability for use in 90nm technology node production, extendible to 65nm development work. The order also includes a Therma-Probe 630XP tool for ion implant metrology.

July 2005 Exclusive Feature: METROLOGY

Detecting profile excursions using spectroscopic ellipsometry

Tue, 7 Jul 2005
By M. Yeh, S.-P. Fang, B.-J. Tsau, C.C. Huang, B. Lin, United Microelectronic Corp.; S. Fu, J. Chen, R. Freed, T. Dziura, M. Slessor, KLA-Tencor Corp.

This work evaluates the capability of a spectroscopic ellipsometry-based profile technology as a new metrology tool to monitor polysilicon gate processes at 130nm and 90nm nodes. This study proves that this method can consistently flag different profile excursions of polysilicon gate.

Soluris, CEA-Leti form JDP on sub-45nm logic technologies

Wed, 7 Jul 2005
July 6, 2005 - Soluris and CEA-Leti have announced that they have engaged a joint development program (JDP) involving Soluris' Yosemite SP-1000 CD-SEM to help characterize the sub-45nm logic technologies at CEA-Leti's new Minatec research facility in Grenoble, France.

AMRC developing nanometrology to probe chip structures at atomic level

Wed, 8 Aug 2005
August 17, 2005 - Engineers at Sematech's Advanced Materials Research Center (AMRC), Austin, TX, are investigating a nanoscale approach to metrology that will allow them to examine new semiconductor structures at the atomic level, and so prepare the way for next-generation electronics.

Diagnosing Asia's fabs: Copper, 300mm, lithography drive metrology

Mon, 6 Jun 2002
Asia's big chipmakers have been embracing metrology systems as technology changes come on stream, devices grow in complexity, and time-to-market pressures escalate.

No roadmap without buildings first

Mon, 6 Jun 2002
Perhaps under emphasized relative to the red brick wall associated with scaling CMOS, as early as 2004 "manufacturable solutions are not known" looms for many 2001 ITRS facets of factory ramps, equipment lead time, factory cycle time, throughput, maintenance, material handling, and the intertwining importance of factory information and control hardware and software.

Nanometrics introduces 300mm stage technology

Thu, 7 Jul 2002
July 11, 2002 - Milpitas, CA - Nanometrics Inc., a supplier of integrated and standalone metrology equipment, has introduced its next-generation stage technology platform.

Rudolph Technologies enters defect market; Acquires ISOA

Tue, 7 Jul 2002
July 23, 2002 - Flanders, NJ - Rudolph Technologies Inc., a provider of process control metrology systems, has entered into a definitive agreement to acquire privately held ISOA, a defect control company based in Richardson, TX.

Veeco Metrology forms TAB

Tue, 7 Jul 2002
July 23, 2002 - Woodbury, NY - Veeco Instruments Inc.'s metrology group has created a technical advisory board (TAB).

Metrology: Quick and dirty Tevet style

Tue, 7 Jul 2002
In the expensive and complicated world of integrated metrology, a different approach could get customers interested in a concept that may work better - while also being cheaper, simpler, and less intimidating.

FEI joins Novellus, Lam, and SpeedFam-IPEC in Damascus Alliance

Tue, 6 Jun 2002
Hillsboro, OR - FEI Co. has joined equipment suppliers Novellus Systems, Lam Research Corp., and SpeedFam-IPEC in the Damascus Alliance industry consortium, founded in 1998 to tackle the technology transition to copper dual damascene manufacturing.

Boxer Cross counter sues Therma-Wave

Thu, 6 Jun 2002
June 13, 2002 - Menlo Park, CA - Boxer Cross Inc. has filed a counter-suit for patent infringement, trade secret misappropriation, and unfair competition against Therma-Wave Inc.

SEZ America launches 300mm lab in US

Tue, 4 Apr 2002
April 30, 2002 - Phoenix, AZ - The SEZ Group is opening its first 300mm applications lab in the US. Located in Phoenix, AZ, the 3,000 square foot lab will be a resource for SEZ and its customers and partners worldwide to test 300mm wafer cleaning processes.

Therma-Wave opens office in China

Thu, 8 Aug 2002
Aug. 15, 2002 - Fremont, CA - Therma-Wave Inc., a supplier of metrology equipment, has opened a new sales and service office in Shanghai, China.

Bulky mask data sets create storage problems

Wed, 9 Sep 2002
As mask data sets become more complex and data-intensive, maskmakers face the challenge of how to manage large amounts of data that must be moved from design to mask.

ATMI, Metara sign JD agreement

Thu, 9 Sep 2002
Sept. 12, 2002 - Danbury, CT - ATMI Inc., a provider of specialty materials and services to the semiconductor industry, and Metara Inc., a supplier of automated metrology systems, have signed a joint development and manufacturing agreement.

Veeco to buy FEI in $1 billion stock deal

Fri, 7 Jul 2002
WOODBURY, NY, and HILLSBORO, OR, - Veeco Instruments Inc. and FEI Co. have penned a definitive merger agreement to combine the companies into one provider of 3-D metrology and process equipment.

Veeco signs distribution agreement with Epion

Thu, 3 Mar 2002
March 7, 2002 - Woodbury, NY - Veeco Instruments Inc. has entered a distribution agreement with Epion Corp., a JDS Uniphase company, to distribute Epion's gas cluster ion beam (GCIB) product to the data storage, MRAM, MEMs, photomask, and wireless telecommunications markets.

KLA-Tencor announces new CD analysis systems

Mon, 3 Mar 2002
KLA-Tencor has unveiled a new set of automated tools for process window construction and analysis. The Process Window Monitor series automates the construction of process windows based on focus exposure matrices analyzed using KLA-Tencor CD or optical CD metrology tools.

Nanometrics 9300ocd enables integrated metrology

Thu, 3 Mar 2002
Nanometrics, a company with a long history in film metrology, has introduced an optical CD metrology tool for the sub-130nm market that has made libraries of templates superfluous.

Downturn? What downturn? Some companies see improvement, 4Q00 to 4Q01

Tue, 3 Mar 2002
For the most part, 4Q was a painful quarter to cap off what's largely been a painful year. Several companies, however, stood out for one simple fact: Their revenue actually increased from 4Q00 to 4Q01. FEI Co., PDF Solutions Inc., and Numerical Technologies Inc. all saw increases in revenue. Brewer Science doesn't release statements, but the firm said numbers released for the last quarter show overall sales revenue increased by 38% in 2001.

Therma-Wave completes acquisition of Sensys Instruments Corp.

Thu, 1 Jan 2002
Jan. 17, 2002 - Fremont, CA - Therma-Wave Inc., a worldwide developer and manufacturer of process control metrology systems, has completed its acquisition of Sensys Instruments Corp.

Nanometrics' laser profiler for copper CMP

Wed, 11 Nov 2002
Nov. 6, 2002 - Milpitas, CA - Nanometrics Inc., which supplies the semiconductor industry with integrated and standalone metrology tools, has announced the introduction of its newest metrology system, designed to control the copper CMP process.

Exclusive Feature: LITHOGRAPHY

Automated micro-defect monitoring for 300mm lithography

Mon, 2 Feb 2003
By: Kay Lederer, Infineon Technologies SC300, Dresden, Germany
Barry Saville, Ingrid Peterson, KLA-Tencor, San Jose, CA

As the semiconductor industry continues to push toward the 90nm node, controlling defect density in the lithography cell becomes ever more critical to the success of the overall manufacturing process. MORE

Shipley opens new Advanced Technology Center

Wed, 2 Feb 2003
Feb. 5, 2003 - Marlborough, MA - Shipley Company LLC, has opened its Advanced Technology Center (ATC), a facility dedicated to the development of lithography, interconnect, low-k dielectric and other critical materials.

IMEC begins construction of 300mm research fab

Tue, 1 Jan 2003
Jan. 28, 2003 - Leuven, Belgium - IMEC's board of directors has announced the construction of a new 300mm cleanroom.

Veeco, FEI mutually terminate merger agreement

Thu, 1 Jan 2003
Jan. 9, 2003 - Woodbury, NY and Hillsboro, OR - Veeco Instruments Inc. and FEI Co. have mutually terminated the merger agreement that they entered into on July 11, 2002.

Sematech forms manufacturing group

Thu, 12 Dec 2003
November 28, 2003 - International Sematech, Austin, TX, plans to form a new consortium of fabs and chipmakers to focus on manufacturing infrastructure, methods, standards, and productivity.

PANalytical reveals wafer analysis progress

Tue, 12 Dec 2003
December 16, 2003 - Dutch firm PANalytical, a supplier of analytical devices for x-ray diffraction and x-ray fluorescence (XRF) spectrometry, says it has developed a method that doubles the detection capability of XRF wafer analysis of boron concentrations for thin-film semiconductor wafers.

IMEC, Sematech, TI join high-k club

Wed, 12 Dec 2003
December 10, 2003 - The past week has been busy for high-k materials, with three separate announcements from companies and organizations detailing the progress of their research.

Micronic unveils mask metrology system

Fri, 10 Oct 2003
October 23, 2003 - Micronic Laser Systems AB, Taby, Sweden, has introduced a new registration measurement system for TFT-LCD photomasks.

Rudolph unveils automated metrology tool

Mon, 10 Oct 2003
October 17, 2003 - Rudolph technologies, Flanders, NJ, has introduced a wafer-bow/stress metrology tool for measuring stress that develops during thin film deposition.

AMAT steps into SEM metrology

Thu, 9 Sep 2003
September 9, 2003 - Applied Materials, Santa Clara, CA, has unveiled a new tool for 65nm-generation mask metrology, adding to its line of pattern generation, etch, and inspection tools.

Nanometrics unveils metrology tools

Fri, 9 Sep 2003
Nanometrics, Milpitas, CA, has introduced a pair of integrated metrology tools combining optical critical dimension spectroscopic ellipsometry with deep UV spectroscopic reflectometry.

AmberWave, ADE partner for strained silicon metrology

Fri, 7 Jul 2003
AmberWave Systems, Salem, NH, and ADE Corp., Westwood, MA, are joining forces to qualify ADE's line of inspection and metrology tools to measure strained silicon wafers.

Camtek releases wafer tool

Tue, 8 Aug 2003
August 5, 2003 - Camtek, Migdal Haemek, Israel, a developer of optical inspection systems, has unveiled its Falcon system for inspecting wafers in the final manufacturing stages. The tool, which offers surface inspection and 3D metrology for wafers up to 300mm, is aimed at wafer-level in-line inspection processes at end-of-line, bumping, and packaging facilities. Camtek says it will install the first Falcon systems by the end of 2003.

Nikon debuts metrology tool

Mon, 8 Aug 2003
August 4, 2003 - Nikon Semiconductor Inspection Technologies Group (SITECH) has unveiled a metrology tool designed for the 90nm node and below. The NRM-3100 is designd to measure lithographic exposure with enough bandwidth to accommodate the 70nm node, and boasts throughput of over 150 wafers per hour. Additional options include a focus mark measurement and stepper and angle management systems.

FASL, GES source Japan fab equipment

Mon, 8 Aug 2003
August 18, 2003 - FASL Japan Ltd., the Japanese arm of a joint venture between AMD and Fujitsu, and GE Global Electronic Solutions have completed a $100 million sale and leaseback of equipment, including machines for lithography, metrology, deposition and tech, and furnace equipment.

Ultratech adds metrology to nanotechnology offerings

Thu, 6 Jun 2003
June 18, 2003 - San Jose, CA - Ultratech (formerly Ultratech Stepper) has added a new metrology system to its nanotechnology initiative.

Schlumberger sells verification assets

Thu, 9 Sep 2003
September 9, 2003 - Schlumberger Technologies, Inc. has transferred its verification systems unit, which develops metrology capital equipment, to Soluris, Concord, MA, a new company formed by the division's management team.

Therma-Wave Says Orders Pass Record Levels

Thu, 9 Sep 2000
FREMONT, Calif. - Sept. 7, 2000 - Therma-Wave, Inc., a manufacturer of process control metrology systems used in the manufacture of semiconductors, today reported that orders for the first two months of the second quarter of fiscal year 2001 have already exceeded the record $61.9 million mark of the first quarter ended June 30, 2000.

300mm automation interface compliance looms,Therma-Wave opts for GW package

Mon, 12 Dec 2000
With the first production 300mm fabs scheduled for ramp up next year, chipmakers want tools to arrive at the fab site automation-friendly, though full supplier compliance to new 300mm software standards is unclear, say participants of a recent workshop on 300mm software requirements for automated manufacturing in Austin, TX.

In deal with NanoPhotonics, ASMI adds integrated metrology to base

Wed, 1 Jan 2000
In a move that will allow it to bolster offerings with integrated metrology capabilities, ASM International N.V., Bilthoven, The Netherlands, has purchased a 24% interest in NanoPhotonics AG, a Mainz, Germany, maker of precision thin film metrology tooling. The firm also plans to deliver its first 300mm vertical furnace equipped with integrated metrology early this year.

OBH to buy Plasma-Therm; deal adds to semiconductor tool base

Tue, 1 Jan 2000
Following the sale of its real estate and shoe division, Oerlikon-Buhrle Holding AG (OBH) is focused on cutting a path for itself in the semiconductor industry and hopes that its newest acquisition of Plasma-Therm, Inc., St. Petersburg, FL, will lead the way.

Film Thickness Metrology Tool, PDM Solution Announced by Karl Suss

Wed, 6 Jun 2000
MUNICH, Germany and SOUTHBOROUGH, Mass.--June 28, 2000--Karl Suss has announced a new tool capable of measuring thick and thin films used in a wide range of applications.

Nanometrics Announces Standalone 300mm Film Metrology System

Wed, 6 Jun 2000
SUNNYVALE, CA--June 27, 2000--An automated 300-mm film metrology system designed for measuring next-generation materials and processes has been introduced by Nanometrics.

Applied Material's Metrology and Inspection Systems Increase Fab Efficiency

Thu, 6 Jun 2000
SANTA CLARA, Calif.--June 21, 2000--Applied has positioned two new metrology systems, Compass and Excite, as products that increase fab production efficiency.

Nanometrics Announces Film Metrology for Windows NT

Wed, 6 Jun 2000
SUNNYVALE, Calif.--June 14, 2000--Nanometrics Inc. has developed a Windows NT based software for the film metrology equipment market that takes advantage of the operating systems support of multi-tasking functions.

SEMATECH to Evaluate Metrology Tools

Fri, 8 Aug 2000
AUSTIN, Texas--Aug. 18, 2000--Research consortium International SEMATECH today announced the launch of a Metrology/Yield Management Tool Initiative to develop and evaluate new measurement technologies for advanced semiconductor manufacturing processes.

Therma-Wave Introduces New Metrology Products

Wed, 8 Aug 2000
FREMONT, Calif.--August 1, 2000--Designed to expand its process control metrology systems business, Therma-Wave unveiled new products for use in metrology for metal films, critical dimension metrology, and a line of integrated metrology systems.

Applied to Add Therma-Wave Metrology Systems

Thu, 7 Jul 2000
FREMONT, Calif.--July 25, 2000--Therma-Wave Inc. will develop and supply advanced metrology solutions that integrate with Applied Materials' process systems and modules.

Semitool to Include Royal Phillips Metrology In Deposition Products

Mon, 7 Jul 2000
SEMICON West '00--July 14,2000--Semitool's Paragon line of electrochemical deposition tools will include Royal Phillips Electronics new integrated metal-film metrology system, say the companies.

Teradyne Debuts VLSI Test System

Wed, 7 Jul 2000
SEMICON West '00--July 12, 2000--In San Jose, Cal., today, Teradyne Inc. introduced a VLSI test system that the company says will allow a full range of test capability without requiring hardware changes or system upgrades.

Boxer Cross Unveils Interconnect Measurement System

Wed, 7 Jul 2000
SEMICON West '00--July 12, 2000--Boxer Cross unveiled a new metrology solution today in San Francisco, Calif. at the company's private exhibit at Zeum, the new art and technology center.

Schlumberger Debuts Sub-Micron Metrology Tool

Mon, 7 Jul 2000
SEMICON West '00.--July 10, 2000--In San Francisco, Calif. Schlumberger Semiconductor Solutions today introduced the next evolution of its sub-micron metrology tool, the IVS 135.

Nanometrics Debuts NanoSpec 9100 Automated Film Metrology System

Fri, 7 Jul 2000
Sunnyvale, CA--July 7, 2000--Nanometrics Inc. has introduced the NanoSpec 9100, an automated, non-contact film metrology system designed to measure films on substrates used in wireless, optical telecommunication IC manufacturing and other semiconductor devices.

ST and Nortel to Develop Optical Network Support Technologies

Fri, 7 Jul 2000
GENEVA, Swizerland--July 8, 2000--STMicroelectronics has announced that it will team with Nortel to develop optical network technology.

New Offerings From KLA-Tencor's Tackle Metrology Needs for 0.13-Micron, 300-mm Production

Fri, 6 Jun 2000
SAN JOSE, Calif.--June 30, 2000--KLA-Tencor Corp. has introduced a new generation of in-line CD scanning electron microscopes (SEMs) for next-generation lithography and etch applications. The tools are designed for use as a fab transitions to 0.13-?m node and 300-mm manufacturing.

Rudolph Technologies and Therma-Wave reach settlement

Fri, 9 Sep 2001
September 28, 2001 - Flanders, NJ - Rudolph Technologies and Therma-Wave, Inc., today announced that they have reached a settlement in their Patent Interference proceeding.

New Japanese government research project to make its own tools

Thu, 8 Aug 2001
Japan's latest government-funded industry research initiative for 50nm generation technology plans to start by designing and developing its own new semiconductor production tools. Japanese press reports said Intel researchers would also participate, but Intel sources could not confirm this before press time.

Analog Devices uses Applied Materials' epi systems to build silicon and SiGe bipolar chips

Thu, 11 Nov 2001
November 15, 2001 - Santa Clara, CA - Applied Materials, a provider of epitaxial (epi) deposition technology to the semiconductor industry, has installed its Epi Centura systems at Analog Devices' fabs in MA, and CA, where they are being used for next-generation bipolar device production using silicon (Si) and silicon germanium (SiGe) technologies.

APC is evolving: Etch to CMP to litho

Wed, 11 Nov 2001
What can the semiconductor industry learn from the petrochemical folks? A lot, when it comes to the evolution of advanced process control (APC). In the early days of APC in the petrochem industry, process and instrumentation technologies were considered totally unrelated issues by operating companies.

Brooks Automation acquires Zygo Corp.'s automation systems group

Fri, 12 Dec 2001
Dec. 14, 2001 - Chelmsford, MA - Brooks Automation Inc., a supplier of tool and factory hardware and software automation solutions, has completed the purchase of the automation systems group of Zygo Corp.

Therma-Wave to acquire Sensys Instruments

Wed, 12 Dec 2001
Dec. 19, 2001 - Fremont, CA - Therma-Wave Inc. has signed a definitive agreement to acquire Sensys Instruments Corp.

Corning buys Tropel

Tue, 1 Jan 2001
Corning, New York--Corning Inc. announced today that it has reached an agreement to acquire 100% of the stock of Tropel Corp., a Fairport, NY-based world leader in precision optics and metrology instruments for the semiconductor industry, in a transaction valued at approximately $190 million, based on the closing price of Corning common stock on January 22, 2001.

KLA-Tencor makes addition to its suite of optical metrology overlay tools

Thu, 2 Feb 2001
February 22, 2001--San Jose, California--KLA-Tencor Corp. today introduced the Archer 10, the latest in its suite of optical metrology overlay tools. Incorporating several significant improvements in automation, throughput, productivity, and precision over previous generation systems, the Archer 10 is one of the industry's most competitive cost-of-ownership overlay solutions for 300mm manufacturing at the sub-0.13-micron node.

Boin, TePla sign OEM agreement

Tue, 2 Feb 2001
February 12, 2001--Tomerdingen, Germany--Boin GmbH, a metrology software manufacturer for the semiconductor industry, has entered into an OEM agreement with TePla AG, a manufacturer of metrology tools and low pressure plasma systems. TePla will use Boin's WAFERMAP metrology software on its TWIN SC measurement tool to support the visualization and interpretation of measurement results.

Photronics broadens 130-nm node production capabilities

Mon, 2 Feb 2001
FEB. 12 Jupiter, Florida--Photronics, Inc., a leading photomask supplier, announced today that it has signed a multi-system purchase agreement with Toshiba Machine Co., Ltd. for its EBM-3500 vector scanning electron beam photomask lithography system.

KLA-Tencor unveils 'Precice'

Wed, 3 Mar 2001
March 7, 2001--San Jose, California--KLA-Tencor Corp. has introduced Precice, a production-worthy in-situ film thickness and end-point control system for copper CMP.

Boin GmbH releases software development kit for metrology equipment

Thu, 3 Mar 2001
March 1, 2001--Tomerdingen, Germany--Boin GmbH, a metrology software manufacturer for the semiconductor industry, has released a new software development kit for metrology equipment manufacturers.

KLA-Tencor to buy Phase Metrics

Fri, 4 Apr 2001
April 13, 2001 - San Jose, CA - KLA-Tencor Corp. has signed an agreement to purchase Phase Metrics, a top supplier of inspection/certification technologies to the data storage industry.

Photronics breaks ground to expand Connecticut facility

Thu, 8 Aug 2001
August 9, 2001 - Brookfield, CT - Photronics Inc. is breaking ground for a 13,000-square-foot addition to its existing 40,000-square-foot manufacturing operation in Brookfield, Connecticut.

Nanometrics opens its doors in Korea

Thu, 5 May 2001
May 31, 2001 - Milpitas, CA - Nanometrics Korea, a subsidiary of Nanometrics Inc., supplier of advanced integrated and standalone metrology equipment, announced the opening of its new support and manufacturing facility in Pyungtaek City, Korea.

Thomas West increases capacity, expands manufacturing space

Wed, 3 Mar 2001
March 14, 2001--Sunnyvale, California--Thomas West Inc. (TWI) today announced a major capital expansion and upgrade of its applications lab and manufacturing facilities as part of an ongoing investment to provide its customers with the most advanced CMP materials and technology for semiconductor manufacturing. The increased capacity and expansion is in direct response to increased customer demand for the company's advanced CMP pads.

Process control advances critical for 300mm wafers

Tue, 11 Nov 1999
The economics of 300mm wafer processing will demand more effective process control of equipment and tools, according to William Rozich, IBM's director of equipment technology. Improved overall equipment efficiency (OEE) will be essential to cover the higher cost of wafers and the tools needed for 300mm production. Rozich points out that the area of a 300mm wafer is 2.25 times larger than that of a 200mm wafer, but the raw material is expected to cost three times as much.

METROLOGY / TEST: The emerging role for data mining

Mon, 11 Nov 1999
The complexity of semiconductor manufacturing and its wealth of data provide an ideal environment for the application of data mining to discover patterns of behavior leading to knowledge.

Jordan Valley Acquires Assets of Semiconductor Equipment Supplier Bede

Wed, 4 Apr 2008
(April 16, 2008) Migdal Ha'Emek, ISRAEL — Jordan Valley Semiconductors LTD, a provider of semiconductor metrology solutions, has acquired the business of Bede, effective Monday April 14th. Bede is a supplier of high-resolution XRD (HRXRD) metrology for the semiconductor and compound industries with revenues of $11.6M in 2007. Bede entered into the UK's Administration phase, their equivalent of Chapter 11, on March 31.

Metris Acquires X-Tek Group

Fri, 2 Feb 2008
(February 15, 2008) Leuven, Belgium — The X-Tek Group, specialists in microfocus and CT X-ray systems, signed an agreement with Metris for the sale of 100% of the X-Tek stock at the end of 2007. The acquisition will enable Metris to expand X-Tek's CT capabilities into various applications within the metrology industry.

Universities, Researchers Team to Develop Smaller, Faster Nanochips

Wed, 2 Feb 2008
(February 20, 2008) Research Triangle Park, NC — Semiconductor Research Corp. (SRC), a university-research consortium for semiconductors and related technologies, has announced that the College of Nanoscale Science and Engineering (CNSE) of the U. at Albany will serve as headquarters for a research effort aimed at enabling nanoelectronics advances that are critical for the development of smaller, faster and cheaper computer nanochips.

Rudolph Joins Leading Chipmakers in SEMATECH's Metrology Program

Thu, 2 Feb 2008
(February 21, 2008) Flanders, NJ and Albany, NY — Rudolph Technologies Inc. and SEMATECH, have announced that Rudolph has become the first semiconductor equipment supplier company to join SEMATECH's Metrology Program headquartered at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.

Lights-out MEMS Manufacturing

Fri, 9 Sep 2006
It is well-known in semiconductor manufacturing that fast process feedback leads to better process control, which results in higher yield.

Quality Control in Microelectronics

Wed, 3 Mar 2006
METROLOGY TOOLS PROVIDE SOLUTIONS

Strain Analysis of PQFP Packages

Sat, 5 May 2004
Digital image correlation metrology technology

New Products

Wed, 10 Oct 2003

n&k Technology Inc. Announces Metrology Tool for Characterizing Ultra-thick Photoresists

Thu, 8 Aug 2002
Rapid, non-destructive analyzer ideal for materials used in bump bonding and flip chip assembly

Polymer Vision Participates in Holst Centre Open-Innovation Program

Tue, 12 Dec 2007
(December 18, 2007) EINDHOVEN, The Netherlands — The Dutch rollable display company Polymer Vision has joined the Holst Centre, an initiative of the Flemish and Dutch research centers IMEC and TNO. During the partnership, Polymer Vision will research and develop organic transistor technology and patterning processes in the open-innovation setting of Holst Centre, collaborating with other researchers from other companies joining the program.

STMicroelectronics Lays First Stone for China Back-End Plant

Tue, 11 Nov 2007
(November 6, 2007) GENEVA, Switzerland — STMicroelectronics has laid the first stone at the site of its future chip packaging and test facility in Longgang, Guangdong Province, China, in the presence of senior officials of the Shenzhen Municipal government.

Intel Capital Invests in Jordan Valley

Fri, 10 Oct 2007
(October 19, 2007) AUSTIN, TX— Intel Capital, Intel's global investment organization, became the sole investor in a US $11 million round of funding into Jordan Valley Semiconductors Ltd in return for a significant stake in the Israeli company. Jordan Valley develops tools for semiconductor metrology based on X-ray technology.

Jordan Valley Named One of Fastest Growing Israeli Technology Companies

Mon, 10 Oct 2007
(October 29, 2007) MIGDAL HA'EMEK, Israel — Jordan Valley Semiconductors Inc. has been named to the 2007 Deloitte Technology Fast 50 as one of the fastest-growing technology companies in Israel. A manufacturer of next-generation x-ray based semiconductor metrology, Jordan Valley provides patented x-ray technology to semiconductor fabs worldwide.

Toshiba Orders Metrology Systems from Camtek

Fri, 6 Jun 2006
(June 16, 2006) MIGDAL HA'EMEK, Israel — Camtek Ltd. announced they have received an order from Toshiba Corp. for multiple Falcon 830 bumped-wafer metrology systems. Toshiba will use the systems in their Oita, Japan, manufacturing plant for in-line bump inspection of 300-mm wafers.

Two-year Metrology Research Program Initiated

Fri, 7 Jul 2006
(July 28, 2006) LEUVEN, Belgium — ICOS Vision Systems Corporation NV and IMEC, an independent research center for nanoelectronics and nanotechnology, will undertake a two-year joint exploration and development program (JEDP) into 3-D packaging inspection and metrology. The inspection solution supplier will provide technology and equipment for the research, which will be performed at IMEC's laboratories.

DuPont Expands in Taiwan

Mon, 8 Aug 2006
(August 7, 2006) WILMINGTON, DE — DuPont Electronic Technologies established a Semiconductor Materials Technical Center in Taiwan's Hsinchu Science Park, as part of its long-term growth plan. The Semiconductor Materials Technical Center is DuPont Taiwan Technical Center's (DTTC's) third Taiwan facility. The facility includes single wafer processing capability, analytical and metrology tools, and a semiconductor process technology research staff.

Camtek Rolls Out Three AOI Systems at SEMICON Taiwan

Tue, 9 Sep 2005
Migdal Ha'emek, Israel — Camtek Ltd. is introducing three new Falcon wafer AOI system models at SEMICON Taiwan, currently happening from September 12–14 in Taipei. The new models include Falcon 800 for 3-D metrology of gold- and solder-bumped wafers, Falcon 500PD for post-dicing wafer inspection, and Falcon 500 for general wafer inspection before or after test. The Falcon 800 model employs CTS, Camtek's own triangulation height measurement technology — key to its 3-D performance.

Distinctive Part Numbers for RoHS-compliant Parts Desired

Thu, 4 Apr 2005
(April 28, 2005) Herndon, Va. — The International Electronics Manufacturing Initiative (iNEMI) announces that most of its OEM and EMS members strongly support unique part-number use for RoHS-compliant components, including Alcatel, Celestica, Cray Inc., Dell, Delphi, HP, Intel Corp., Jabil Circuit, Lucent Technologies, Microsoft, Plexus Corp., Sanmina-SCI Corp., Solectron Corp., StorageTek, and Sun Microsystems.

New PI Facility Complete

Mon, 12 Dec 2001
December 10, 2001 -- PALM-BACH, Germany -- NanoAutomation/MicroPositioning company PI (Physik Instrumente), Germany has built a new 140,000 square foot factory to meet an increased demand for its ultra-precision products in industries such as bio-technology, fiber optics, semiconductors, data storage and aerospace engineering.

The 'quietest' lab: Achieving vibration control and balanced design at NIST

Tue, 3 Mar 2005
Engineers, lab planners and scientists developed unique lab layouts with groundbreaking temperature and vibration controls

Semiconductor measurements come clean

Fri, 4 Apr 2005
When measuring semiconductor features, recent industry developments illustrate that the linkage between metrology and contamination control is getting tighter as features shrink.

An update on ISO Technical Committee 209

Fri, 12 Dec 2006
In 1993, ISO Technical Committee 209, Cleanrooms and associated controlled environments, was formally established and had its first meeting in Chicago, Illinois.

IEST carries contamination-control technology firmly into 2006

Sun, 1 Jan 2006
Since its founding in 1953, the Institute of Environmental Sciences & Technology (IEST) has played a critical role in identifying and establishing standards for effective contamination-control practices, processes and environments.

Relating statistics to particle counting measurements and standards

Mon, 1 Jan 2007
Statistics are the essence of cleanroom air cleanliness classification, yet the reasons behind this are often not well understood or appreciated.

U.S.-based memory provider standardizes on Rudolph inspection tools for manufacturing operations worldwide

Wed, 9 Sep 2006
September 7, 2006 -- Flanders, New Jersey -- Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader of high-performance process control metrology, defect inspection, and data analysis systems for semiconductor manufacturing, today announced significant new orders received in July and August 2006 for advanced all-surface macro defect inspection tools from a major U.S.-based memory manufacturer.

Zygo Corporation receives multi-million dollar commitment for front end semiconductor process metrology tools

Thu, 9 Sep 2006
September 12, 2006 -- /MARKET WIRE/ -- MIDDLEFIELD, CT -- (Zygo Corporation (NASDAQ: ZIGO), a leading worldwide optical metrology supplier, today announced that it has received a follow-on order from a leading North American semiconductor manufacturer as part of a multi-million-dollar commitment to use ZYGO's Z3D 7000(tm) metrology tool for high volume manufacturing process control.

IES Progresses on ISO Cleanroom Standards

Thu, 6 Jun 1995
Anaheim, CA--Three of seven ISO Technical Committee Working Groups met in Anaheim, CA last month during the IES`s annual technical meeting and exhibition to continue work on a package of international standards for "Cleanrooms and Associated Controlled Environments" (ISO/TC209). The IES was appointed in 1993 as the ISO Secretariat organization responsible for this activity by the American National Standards Institute (ANSI). According to Richard Matthews of Filtration Technology, Inc. and Chairm

August Technology expands Taiwan operations

Fri, 1 Jan 2004
JAN. 23--MINNEAPOLIS--August Technology Corp., a supplier of inspection and metrology solutions for the microelectronic industries, announced the expansion of their Taiwan operations in Hsinchu to better serve the growing number of customers in this region.

Rudolph Technologies merger with August Technology completed

Fri, 2 Feb 2006
February 15, 2006 -- Flanders, NJ -- Rudolph Technologies, Inc. (Nasdaq: RTEC), a leading provider of process control equipment for thin film measurement and macro defect inspection, announced today that its merger with August Technology Corporation has been completed.

Nova opens new metrology application development center in Taiwan

Sun, 11 Nov 2007
November 14, 2007 -- /PRNewswire/ -- REHOVOT, ISRAEL -- Nova Measuring Instruments Ltd. announced earlier this week the opening of a new development and demonstration center in Taiwan, to serve its customers in Taiwan, Korea, China, and Singapore.

Nova's integrated metrology system chosen for largest memory fab in Taiwan

Thu, 11 Nov 2007
October 24, 2007 -- /PRNewswire/ -- REHOVOT, ISRAEL -- Nova Measuring Instruments Ltd. announced a major integrated metrology win for its CMP process control products at a leading memory manufacturer in Taiwan.

APC: Critical definitions for an advancing manufacturing community

Thu, 5 May 2003
There's a buzz surrounding the topic of advanced process controls (APC) in the semiconductor manufacturing community; and like many freshly evolving, technologically-based concepts, the terms and applications are almost constantly being re-engineered.

Training video

Sat, 2 Feb 1997
A new videocassette from Texwipe demonstrates the proper use of cleanroom wipers in the semiconductor, disk drive, pharmaceutical and medical device manufacturing industries. "The Systematic Approach to Cleaning" is a 12-minute instructional video, written and produced by Texwipe. This video is an employee training tool for those who work in cleanrooms. Viewers are alerted to the high-cost of contamination in the various industries and how minute amounts of contamination such as fibers, particle

ISO Enters Last Lap in Formalizing New Cleanroom Classifications

Sat, 2 Feb 1997
Geneva, Switzerland -- Headquarters for the International Organization for Standardization (ISO) has just released its new Draft International Standard (DIS) for cleanrooms and associated controlled environments. ISO/DIS 14644-1, "Cleanrooms and associated controlled environments, Part 1: Classification of airborne particulate cleanliness for cleanrooms and clean zones" establishes three new classes of cleanliness. It also prescribes the standard method of testing, and includes a procedure for d

Texwipe offers training video on how to clean the cleanroom

Wed, 1 Jan 1997
Upper Saddle River, NJ--The Texwipe Company announced the availability fo a videocassette, "A Systematic Approach to Cleaning," which demonstrates the proper use of cleanroom wipers in the semiconductor, disk drive, pharmaceutical and medical device manufacturing industries. The 12-minute instructional video is designed to be used as an employee training tool for thsoe who work in cleanrooms and their managers. Viewers are alerted to the high cost of contamination in the various industries and h

Bob Mielke was the Institutes technical vice president of the Contamination Control Division,

Mon, 9 Sep 1997
Bob Mielke was the Institute`s technical vice president of the Contamination Control Division, completing a two-year term just ended on July 1. A senior metrology engineer for Abbot Laboratories, he`s been involved in the Institute`s standards and practices program since its inception in 1982. He was the chairman of Standards and Practices for the Contamination Control Division from 1987 to 1995 and is also the secretary for ISO TC209, the International Organization for Standardization`s Technic

ISO standards come into view

Sat, 4 Apr 2000
WOBURN, MA— ONE DOWN, 10 TO go.
That's one way to sum up the draft process for new cleanroom standards that are being hammered out by Technical Committee 209 of the International Organization for Standardization's (ISO; Geneva).

Getting on the same page

Sat, 12 Dec 2001
No one ever thought writing a set of global standards for cleanrooms or controlled environments would be easy or fast. In fact, as we stand on the brink of 2002, it has been more than eight years since contamination-control professionals from varied industries and from around the world first convened to draw up ISO standards 14644 and 14698. And it could still be another six months or more until the last of the 10 separate standards are released.

Design, balance and certify a successful minienvironement integration design

Sat, 12 Dec 2001
Before entering into the critical minienvironement integration strategies, let's first take a look at the basics.

SEM monitor workstation

Sun, 6 Jun 1997
Spectel announces the availability of the SEM Monitor, a diagnostic tool known as "Sharpness Analysis," integrated into a turnkey workstation to meet the semiconductor industry`s need for analysis of production metrology scanning electron microscopes (SEMs). The tool`s analysis capability was developed for use as an on-line instrument diagnostic and for tool-matching in a production environment. It provides a quantitative framework based on fourier transform feedback for monitoring SEM resolutio

ISO/DIS 14644-1 now available

Thu, 5 May 1997
The Institute of Environmental Sciences, Secretariat for ISO/TC 209 has announced the availability of ISO/DIS 14644-1, Cleanrooms and associated controlled environments -- Part 1: Classification of airborne particulates. The document is the first Draft International Standard (DIS) produced by ISO Technical Committee 209, Cleanrooms and Associated Controlled Environments. Descriptors of this DIS include cleanrooms, air pollution, particulate air pollutant, and classification. This first ISO clea

AFM attachment uses rare-earth magnets for conductive and magnetic microscopy

Tue, 11 Nov 2011

Asylum Research introduced the Variable Field Module2 (VFM2) for the MFP-3D AFM. It allows researchers to apply magnetic fields in conductive AFM experiments, magnetic force microscopy, and other applications.


Carl Zeiss combines light and electron microscopy divisions

Fri, 11 Nov 2011

Citing a change in the microscope customer market over the past decade, Carl Zeiss launchEd Carl Zeiss Microscopy. 2,500 employees of MicroImaging und Nano Technology Systems now form the new business group in the Carl Zeiss Group.


Electron microscope project SALVE enters Phase 2

Wed, 8 Aug 2011

Carl Zeiss Nano Technology Systems, CEOS GmbH, and the University of Ulm have completed 2 years of evaluation and are starting the second phase of the Sub Angstrom Low Voltage Electron Microscope (SALVE) project.


Leica surface imaging metrology software industrial microscopy

Tue, 2 Feb 2011

Leica MapLeica Microsystems and Digital Surf announced an agreement whereby Leica Map surface imaging and metrology software, based on Digital Surf's Mountains Technology, will be used with the Leica Application Suite (LAS) for Leica industrial microscopes.


MEMS wafers characterized by Zebraoptical integrated metrology tool

Tue, 5 May 2011

Zebraoptical Integrated Metrology Tool (ZIMT)Sunrise Optical LLC debuted the Zebraoptical low coherence fiber optic interferometer with microscope attachment. The Zebraoptical Integrated Metrology Tool (ZIMT) provides metrology readings on micro electromechanical system (MEMS) wafers.


Bruker adds nano-indenting, tribology with CETR buy

Tue, 9 Sep 2011

Bruker Corporation will acquire Center for Tribology Inc. (CETR) for an undisclosed sum. CETR will become a separate Tribology and Indenting business in the Bruker Nano Surfaces division, joining the atomic force microscope (AFM) and stylus and optical metrology (SOM) businesses.


Tool maker, research center launch development project

Mon, 2 Feb 2005

Accent launches new tool

Mon, 2 Feb 2005

Veeco introduces new optical profiler

Fri, 1 Jan 2005

FEI announces order from Japanese steel firm

Wed, 9 Sep 2006
FEI of Hillsboro, Ore., announced that Japan's JFE Steel Corp. has ordered a Titan 80-300 for its research center in Kawasaki. JFE Steel, a leading global supplier of steel products, is the first Japanese customer to order the Titan S/TEM.

August Technology, Nanometrics end merger agreement

Tue, 6 Jun 2005

Veeco introduces new Dimension AFP

Wed, 12 Dec 2005

Nano toolmaker's CEO steps down

Tue, 4 Apr 2006
FEI Co., a Hillsboro, Ore., maker of focused ion- and electron-beam tools for nanoscale characterization and research, announced late Monday that Vahe Sarkissian has stepped down as the company's chairman, president and chief executive officer and will be leaving the company. Sarkissian, who joined the company in 1998, would also resign as a director prior to the company's annual shareholder meeting on May 11.

Atom probe maker acquires competitor

Wed, 4 Apr 2006
Imago Scientific Instruments Corp., a Madison, Wis., maker of atom probe tomography tools, announced on Tuesday that it has acquired Oxford nanoScience Ltd., a UK-based competitor, from Polaron plc. The deal, which was for a total of $4.35 million, includes $2.25 million in cash and the issue of $2.1 million in preferred stock.

KLA-Tencor unveils magnetic metrology system

Fri, 5 May 2006

Nanometrics acquires Soluris

Thu, 3 Mar 2006

Nanometrics, ASML to cross license advanced overlay, control systems

Thu, 10 Oct 2006
Nanometrics Inc., a Milpitas, Calif., supplier of advanced integrated and standalone metrology equipment to the semiconductor industry, announced it has entered into a cross-licensing agreement with ASML, the provider of lithography systems for the semiconductor industry based in Veldhoven, the Netherlands.

Ambios releases Isochamber

Wed, 8 Aug 2006
Ambios Technology, a Santa Cruz, Calif.-based maker of high performance, low cost bench top metrology and measurement equipment, announced its Isochamber, an environmental isolation system designed to optimize the performance of AFMs and other surface imaging tools.

Steinmeyer's new XY stage is compact

Wed, 12 Dec 2007
Steinmeyer, Inc. has announced a new high precision XY linear stage model KT 310 - 210 - DC. Manufactured from high strength anodized aluminum, the standard table promises travel of 200 mm in both axes with positioning accuracy of 5 µm (micrometer), straightness/flatness of 3 µm and repeatability of +/- 1µm.

PI's XYZ nanopositioning stage scans promises speed, accuracy

Fri, 8 Aug 2007
PI's (Physik Instrumente) new high-resolution, 3-axis nanopositioning / scanning stage features parallel-kinematics design for fast operation. It is designed for nanomanipulation, imaging, and materials research.

Veeco's new offerings to enable CIGS thin film solar production

Tue, 8 Aug 2007
Veeco Instruments has introduced a line of production-scale PV-Series Thermal Deposition Sources, which promise to help copper indium gallium selenide (CIGS) thin film solar manufacturers more quickly transition from pilot to full-scale solar-cell production.

Nanometrics names former Imago chief Stultz as CEO

Tue, 8 Aug 2007
Nanometrics Inc., supplier of advanced metrology equipment to the semiconductor industry, says that Timothy J. Stultz, Ph.D. will join the company as its president and chief executive officer (CEO), succeeding Bruce C. Rhine, who will become chairman of the Board of Directors.

NSTI panel examines challenges, advances in nanomanufacturing

Thu, 5 May 2007
Small Times' Tom Cheyney reports on a particularly compelling discussion among panelists from industry and academia at the recent NSTI Nanotech 2007 conference. The panel examined technical barriers to -- and recent advancements in -- nanomanufacturing.

SEMATECH will locate HQ at UAlbany NanoCollege

Tue, 5 May 2007
International SEMATECH, the consortium of nanoelectronics manufacturers, will expand its existing R&D program at the Center of Excellence in Nanoelectronics and Nanotechnology at the University at Albany in New York. The expansion is the largest in the history of the consortium.

SUSS targets MEMS production with double-sided alignment tool

Wed, 5 May 2007
SUSS MicroTec's new DSM200 is an automated metrology system for double-sided (front-to-back) alignment and exposure applications. The tool serves applications in the manufacture of MEMS devices, power semiconductors, and optoelectronics.

Hyphenated Systems and KARMA release hybrid AFM for semiconductor manufacturing

Wed, 5 May 2007
Hyphenated Systems has announced a new advanced confocal/atomic force microscope (ACM/AFM), developed jointly with KARMA Technology, that is geared for 3D metrology applications in semiconductor manufacturing and lab environments.

Nanotech develops faster with funding for education

Fri, 1 Jan 2004
A new model for collaboration is one that involves industry more directly in education. State governments are competing to attract high-tech activities and this means building upon research universities. And industry is becoming more heavily involved at educational institutions. These are signs that the U.S. educational system is evolving to meet these new challenges.

Polychromix bucks offshoring trend, unveils new Mass. plant

Tue, 3 Mar 2004
Put yourself in Polychromix’s shoes. You endured the telecom shakeout. You raised some venture money. You recently rolled out a product and have some orders. It would appear to be time to set up offshore manufacturing. Instead, the 25-person optical equipment startup is expected to unveil a new manufacturing facility in Wilmington, Mass., today.

Korean nano center orders Accent metrology tools

Wed, 9 Sep 2005

Nanometrics names Ronald Beeson corporate controller

Tue, 10 Oct 2005

Nanometrics names exec finance VP, CFO

Fri, 9 Sep 2005

New insights for Foresight:
A Small Times Q&A with Scott Mize

Mon, 9 Sep 2005
The Foresight Nanotech Institute, a public interest think tank with a 20-year history at the forefront of nanotechnology theory, wants to become involved in its more immediate uses as well. Scott Mize was brought on as president a year ago to help execute that transition.

The Small Print: Book publishers are following the nano buzz

Tue, 3 Mar 2004
The day after HP's "n is for nanotechnology" commercial ran during the U.S. Open tennis tournament in September 2003, Fred Filler's phone started ringing. The marketing manager with book publisher Wiley & Sons had long been telling colleagues that nanotechnology was a subject they'd be hearing more about. Today, Wiley is one of several publishers with a growing focus on small tech titles.

Veeco slashes Q4 loss

Fri, 2 Feb 2004

Nanometrics to acquire Accent Optical

Thu, 1 Jan 2006
The combination of Nanometrics and Accent would create one of the largest metrology and process control companies in the semiconductor capital equipment industry. Based on the closing price of Nanometrics common stock on Wednesday, the transaction values Accent at $80.9 million.

Albany opening new lithography center

Mon, 1 Jan 2006

Ultratech to buy Oraxion

Thu, 7 Jul 2006

Logical succession: Kania brings Veeco experience to FEI

Tue, 7 Jul 2006
FEI Co. of Hillsboro, Ore., announced on Monday that Don Kania has been named president, chief executive officer and a board member. He is expected to start at FEI Co., which makes tools for nanoscale characterization and research, in mid August. The appointment marks the end of a search that began with the stepping down of previous CEO Vahe Sarkissian, who left FEI in April.

Veeco introduces new scanning probe microscope

Mon, 7 Jul 2006

Veeco announces new PVD order, record automated AFM orders

Tue, 7 Jul 2006
Veeco Instruments Inc. announced that it received an order during the second quarter of 2006 for its new NEXUS Physical Vapor Deposition (PVD) Multi-Target Sensor tool from a leading manufacturer of thin film magnetic heads. The system is used to deposit high-quality, extremely uniform, thin film multi-layer stacks and will be used by the customer to manufacture high areal density Tunneling Magneto-Resistive heads.

UK government publishes progress report on nanoparticle risk

Fri, 10 Oct 2006
The UK government has published a progress report which provides an update on the government's direction and details of progress made on research into possible risks posed by engineered nanoparticles to human health and the environment.

Metryx expands global infrastructure for nanotech mass metrology

Wed, 4 Apr 2007
Bristol, England-based Metryx, Limited, a semiconductor equipment manufacturer specializing in nanotechnology mass measurement techniques, says it has hired two new directors of business development to help the company meet a growing demand for mass metrology.

Demand for used micro/nano equipment prompts ClassOne's expansion

Thu, 4 Apr 2007
ClassOne Equipment, Inc. has opened a new facility, significantly expanding the company's ability to supply refurbished semiconductor and nanotechnology equipment.

Veeco introduces automated optical profiler for dynamic MEMS measurements

Thu, 6 Jun 2006

Hyphenated Systems unveils new automated NanoScale optical profiler

Wed, 11 Nov 2006
Nov. 29, 2006 -- Hyphenated Systems, a Burlingame, Calif., provider of hybrid microscopy solutions for three-dimensional imaging and metrology in micro and nanotechnology, announced the release of its new HS200A NanoScale Optical Profiler.

Veeco introduces next-gen Dektak surface profiler

Thu, 11 Nov 2006
Veeco Instruments Inc., a supplier of instrumentation to the nanoscience community, announced the launch of the new Dektak 150 Surface Profiler for high-performance research and industrial metrology applications.

Report: Spending on nanotech tools to increase

Wed, 10 Oct 2003
More than 90 percent of nanotech researchers expect spending on nanotechnology tools and other capital equipment to stay the same or increase in the first half of next year, compared to the second of this year, according to a new report.

Nanoelectronics starts unfolding a long and winding road map

Wed, 11 Nov 2003
Carbon nanotubes are a hundred times stronger than steel, right? That factoid has been reported so often that few realize that such superstrength is predicted by calculations, not by any direct measurement. Now, the National Institute of Standards and Technology is working on developing standards and road maps for nanoelectronics.

Veeco sues Asylum Research

Fri, 9 Sep 2003
Sept. 19, 2003 – Veeco Instruments Inc., a Woodbury, N.Y., provider of metrology products and process equipment tools, filed a lawsuit against Asylum Research Inc. of Santa Barbara, Calif., according to a Veeco news release.

Veeco posts narrow Q2 loss

Tue, 7 Jul 2003
July 29, 2003 – Veeco Instruments Inc., a Woodbury, N.Y.-based provider of metrology tools and process equipment, reported a $1.1 million net loss for the second quarter, or 4 cents per share, versus a $1.6 million net loss for the second quarter of 2002.

New Fraunhofer nano center purchases Veeco AFM

Thu, 8 Aug 2005

Oregon stays on course despite talk of layoffs at HP

Wed, 4 Apr 2005
Oregon's nanotechnology initiative appears to be holding steady even if one of its leading industrial supporters has faced a bumpy start this year. Oregon Nanoscience and Microtechnologies Institute (ONAMI), one of the state's signature research centers, is on the docket for more state and federal funding, and continues to win the support of its business and political leaders.

Veeco Instruments promotes pair of key execs

Fri, 11 Nov 2005

Nano wind blows into Chicago

Tue, 11 Nov 2005
The NanoCommerce trade show and SEMI NanoForum begin today in Chicago. The events, which run through Thursday, are designed to cover both business and technology issues.

Hitachi releases FE-SEM model S-5500

Wed, 5 May 2005

Tool companies collaborate on AFM tip development

Tue, 5 May 2005
Veeco, a developer of atomic force microscopy (AFM) products, announced last week that it signed a joint development program with CEA Leti, an applied research electronics laboratory in Europe, and Team Nanotec, a fabricator of AFM probe tips.

Nanometrics names new chief accounting officer

Fri, 4 Apr 2005

Nanometrics names Weber VP of engineering

Tue, 4 Apr 2005

Xradia names Diamond CEO

Wed, 3 Mar 2005

Veeco nets AFM order from disk maker

Fri, 3 Mar 2005
Veeco Instruments Inc. announced that it received an order for its Dimension X3D automated atomic force microscope from a leading global hard disk drive manufacturer.

Equipment maker adjusts to lower demand from semi market

Tue, 7 Jul 2005
Providers of nanotechnology equipment are retooling their plans in the face of lower demand from semiconductor companies.

TI, Swiss institute envision hybrid chip

Wed, 12 Dec 2003
Texas Instruments Inc. is working with the Swiss Federal Institute of Technology at Lausanne on a chip combining standard semiconductor and single-electron transistors (SET) that could shrink the size and power consumption of computing devices, according to a news release.

Nano expert and D.C. insider will knit together various tiny threads

Fri, 6 Jun 2003
It wasn’t a headline that the scientist liked much: “Clayton Teague Thinks Small,” blared the Georgia Tech University student newspaper. That was 1968, and Teague was a graduate student at the time. Now, he’s the first full-time director of the federal National Nanotechnology Coordination Office (NNCO), and he’s thinking even more infinitesimally.

Nano tool market is no small change

Tue, 8 Aug 2003
Gerd Binnig still recalls what it felt like in 1981 when he tested his technical innovations and saw atomic structures for the first time. “It was like a dream to discover all this,” said Binnig, a fellow at IBM Zurich Research Laboratory who shared a Nobel Prize in physics for designing the scanning tunneling microscope (STM) and helped create the atomic force microscope (ATM). “It was like being for the first time on the moon.”

MEMS companies don’t need foundries, they need partners

Fri, 8 Aug 2003
Guest Column: The MEMS industry has seen mixed success over the last decade. Today, there are only a few high-volume MEMS products available. Despite a major infusion of funds, efforts have not yet produced working MEMS in high volumes. The customer-foundry relationship is a significant factor. The “foundry” must be more than just a foundry; it must be a true manufacturing partner.

Equipment suppliers and researchers can benefit from exchange

Thu, 8 Aug 2003
Sensitive electrical measurements provide the underpinning for many nanotechnology discoveries, particularly in the areas of materials and nanoelectronics. They help academic and industrial scientists and engineers fully understand the electrical properties of new materials, and the electrical performance of new nanoelectronic devices and components.

Veeco came, saw, acquired
majority of the AFM market

Tue, 10 Oct 2002
When Veeco was founded in 1945, the name was an acronym for Vacuum Electronic Equipment Company. Today, it might stand for Very Enormous Electronics Company. Recently, its acquisitions have revealed a move toward nanotechnology and MEMS. Most notable are Veeco’s purchases of three companies that manufacture atomic force microscopes.

Veeco, FEI merger delayed

Wed, 12 Dec 2002
Veeco Instruments Inc. and FEI Co. said they won't merge as planned by year's end, citing delays in obtaining regulatory and shareholder approvals.

Veeco sells Metrology Business to Bruker Corporation

Tue, 8 Aug 2010

Veeco agreed to sell its Metrology business to Bruker, for $229 million in cash. The transaction has been approved by the Board of Directors of both companies and is expected to close in the fourth quarter of 2010.


U.S. agency tackles nano's
next challenge: measurement

Fri, 6 Jun 2002
The National Institute of Standards and Technology, the federal agency dedicated to the science of measurement, made it clear during an open house Thursday that it’s serious about measuring material on the nanoscale.

Tool companies Veeco, FEI to merge

Fri, 7 Jul 2002

Nanometrics releases second quarter results

Thu, 7 Jul 2002

Veeco reports Q2 results

Mon, 7 Jul 2002

FEI reports earnings, announces R&D center

Tue, 7 Jul 2002

Veeco forms nano advisory board

Mon, 7 Jul 2002

U.S. envoy for nano at home, abroad

Wed, 3 Mar 2006
Last fall, Clayton Teague sat under fire as members of Congress peppered him with questions about nanotechnology’s potential for a big oops: nano-based materials or products that could harm people or the environment.

Ardesta invests in Angstrovision

Fri, 1 Jan 2003
Ardesta LLC, an Ann Arbor, Mich., small tech investment firm and company builder, has invested in San Francisco-based Angstrovision Inc., according to a news release. The amount of the investment is not being released, an Ardesta spokeswoman said.

FEI posts $3.5 million Q4 loss

Wed, 1 Jan 2003
FEI Co., a Hillsboro, Ore., provider of nanoscale metrology and fabrication tools, reported a fourth quarter loss of $3.5 million, or 11 cents per share, versus earnings of 24 cents per share for the fourth quarter of 2001.

Veeco and FEI cancel merger

Fri, 1 Jan 2003
Veeco Instruments and FEI Co. said Thursday they won't merge as planned, citing continued poor economic and market conditions.

Bad timing tore apart marriage of Veeco and FEI, analysts say

Fri, 1 Jan 2003
Two small tech equipment makers had hoped that by merging they could offer researchers a package of tools. But as Veeco Instruments and FEI Co. blamed last week's breakup on bad economic timing, one nanotech analyst said such a marriage just wasn't meant to be.

It's tool time for nanotech, and nPoint is on the cutting edge

Mon, 1 Jan 2003
A small Wisconsin company is gearing up to become a big supplier of microscopic components for nanotech research and design. Its CEO estimates the market at $74 million per year, with an additional $35-million-per-year market in semiconductor chip lithography. Newer markets in nanotechnology for life sciences and defense hold additional promise.

Applied Materials lays off, consolidates

Thu, 3 Mar 2003
Applied Materials Inc. announced it will lay off 14 percent of its work force this year as part of an overall cost-cutting plan.

Veeco opens Shanghai office

Wed, 3 Mar 2003
Veeco Instruments Inc., a Woodbury, N.Y., provider of metrology tools and process equipment, said it has opened an office in Shanghai, China, to support recent orders in the country.

FEI announces new scanning electron microscope

Wed, 3 Mar 2003
FEI Co., a Hillsboro, Ore., developer of metrology products, announced release of a new scanning electron microscope.

Metrology provider appoints new chairman

Fri, 3 Mar 2003
Therma-Wave Inc., a Fremont, Calif., manufacturer of process control metrology systems, appointed Papken Der Torossian as chairman, according to a company news release.

Seeing the invisible: Non-destructive subsurface nanoscale metrology with scanning near-field ultrasound holography

Wed, 7 Jul 2009
Countless benefits can be gained for dozens of industries with the ability to observe invisible elements, especially contaminants, at the nanoscale.

Bruker intros AcuityXR to improve optical surface profiling <130nm

Mon, 12 Dec 2010

Bruker Corporation (NASDAQ: BRKR) debuted the AcuityXR optical surface profiler mode that combines patent-pending Bruker hardware and software technology to enable select ContourGT non-contact, 3D optical surface profilers to break the optical diffraction limit and deliver better lateral resolutions.


Arradiance-ships-benchtop-atomic-layer-deposition-ALD-system to Oregon State U

Fri, 11 Nov 2010

With its capability to process up to 6" wafers using up to 8 precursors, GEMStar has the flexibility to deposit atomically thin layers of material on virtually any substrate and was designed with the most challenging high aspect ratio and through-pore deposition applications in mind.


Bruker intros AcuityXR to improve optical surface profiling <130nm

Mon, 12 Dec 2010

Bruker Corporation (NASDAQ: BRKR) debuted the AcuityXR optical surface profiler mode that combines patent-pending Bruker hardware and software technology to enable select ContourGT non-contact, 3D optical surface profilers to break the optical diffraction limit and deliver better lateral resolutions.


Bush administration OKs report
making nano a terror war priority

Thu, 8 Aug 2002
The White House has signed off on a report detailing the full scope of the National Nanotechnology Initiative, which includes a heightened commitment to using nanotechnology to fight weapons of mass destruction. The report concludes that while the NNI has fundamental research as its focus, “its ancestral programs have already made enormous impact in commercial markets."

Michelson Diagnostics diversifies into non-medical markets

Fri, 10 Oct 2008
October 3, 2008: Michelson Diagnostics Ltd. (MDL) says it is broadening the commercial application of its 'multibeam' optical coherence tomography (OCT) technology into markets outside its core target of cancer diagnosis, such as industrial metrology, product inspection, tissue engineering, and developmental biology.

Ambios introduces Q-View White Light Interferometer

Fri, 10 Oct 2008
October 23, 2008 Ambios Technology, Inc. introduced its new Q-View White Light Interferometer/SPM system at the 23rd Annual Meeting of the American Society for Precision Engineering in Portland, OR. This new system combines the capability of white light interferometry and SPM technology.

Park's new AFMs enable nanoscale testing for semiconductor manufacturing

Tue, 7 Jul 2008
July 15, 2008 -- Park Systems' new line of fully automated atomic force microscopes (AFMs) is designed to help increase production yields by providing critical angle measurements. The series is being demonstrated this week at Semicon West. "Until now the data storage and semiconductor industries have had a very limited choice of industrial-grade in-line inspection tools," said General Manager Dr. Sung Park.

Nano-positioner may have atomic-scale precision

Thu, 8 Aug 2008
August 21, 2008: Engineers at Purdue U. have created a tiny motorized positioning device that has twice the dexterity of similar devices being developed for applications that include biological sensors and more compact, powerful computer hard drives. The device, called a monolithic comb drive, could be used as a "nanoscale manipulator" that precisely moves or senses movement and forces.

AMD, Carl Zeiss, and Qimonda partner on semiconductor nanoanalysis

Wed, 11 Nov 2007
AMD, Carl Zeiss SMT, and Qimonda are working together on new analytical and characterization methods required for the development of next-generation microchips. The work is being conducted within the framework of the Nanoanalysis Project, which the German Federal Ministry of Education and Research has backed with 12 million Euros.

FOGALE nanotech of France launches North American initiative

Tue, 9 Sep 2007
FOGALE nanotech, developer of dimensional metrology devices, has opened its first North American office in Los Angeles to forge partnerships with North American universities to develop ideas for innovative sensors, and to improve sales service for the company's North American clients. Arnauld Dumont is CEO of the new operation.

New Oerlikon Solar tech promises >10% efficiency; CEO promises leadership

Thu, 9 Sep 2007
Oerlikon Solar has introduced micromorph tandem technology for conversion efficiencies of 10% and higher, and has named industry veteran Jeannine Sargent to its newly created CEO position.

Seashell Technology achieves kilogram-scale manufacture of silver nanowires

Tue, 6 Jun 2008
June 17, 2008 -- Seashell Technology, a nanotechnology development company, has successfully scaled manufacturing processes for silver nanorod and nanowire production to kilogram scale quantities.

Ontario breaks ground on $160 million nanotech research center

Mon, 6 Jun 2008
June 16, 2008 -- The University of Waterloo, in Ontario, Canada, has broken ground on the $160-million Mike and Ophelia Lazaridis Quantum-Nano Centre designed to propel the university and the country to the forefront of the nanotechnology research.

Francois Blateyron of Digital Surf awarded French national metrology prize

Fri, 6 Jun 2008
June 27, 2008 -- François Blateyron, R&D director at Digital Surf, received a 2008 Normalisation Trophy 2008 from the UNM, the French union for normalisation in the domain of mechanical engineering, for his work on surface metrology on French and ISO standards committees.

Equipment supplier Rudolph joins chipmakers in Sematech nanoelectronics program

Tue, 2 Feb 2008
Rudolph Technologies Inc. has become the first semiconductor equipment supplier company to join Sematech's Metrology Program headquartered at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany in New York.

ACAMP appoints Yallup as CTO

Wed, 9 Sep 2008
September 23, 2008: ACAMP, the Alberta Centre for Advanced Microsystems and Nanotechnology (MNT) products has appointed Dr. Kevin Yallup as chief technology officer, to lead the center's product development efforts to build a world-class capability in Alberta for the packaging and assembly of micro- and nano-scale technology devices, turning them into market-ready commercial or industrial products and applications.

Nanometrics searching for new CFO

Tue, 9 Sep 2008
September 8, 2008: Nanometrics Inc., a supplier of advanced process control metrology equipment, has launched a search for a new chief financial officer following the resignation of Gary Schaefer to pursue other interests, effective immediately.

Steinmeyer's new manipulator stage targets nano, micro

Mon, 2 Feb 2008
Steinmeyer Inc.'s new high precision micro manipulator stage, MT 130-50-DC is geared to nanotechnology, metrology, biomedical, and robotics applications.

Veeco says its new InSight 3D AFM is "a true fab tool"

Mon, 1 Jan 2008
Veeco says its InSight 3D automated atomic force microscope (AFM) is "the only metrology system available with the accuracy and precision required for non-destructive, high resolution three-dimensional measurements of critical 45nm and 32nm semiconductor features, with the speed to qualify as a true fab tool."

High-volume MEMS manufacturer adds FOGALE metrology tool

Wed, 6 Jun 2012

A major high-volume MEMS maker has purchased a FOGALE nanotech T-MAP DUAL 3D 200A for its US manufacturing facility. The tool will be equipped with 2 load ports and will be fully automated.


SEMATECH takes Veeco AFM for EUV work

Mon, 7 Jul 2009
July 6, 2009: SEMATECH has accepted a Veeco Insight 3D atomic force microscope (AFM) to be put to use for non-destructive reference metrology for critical dimension (CD), overlay and contour, and 3D characterization of resist features in extreme-ultraviolet (EUV) lithography.

SRC spin-off develops nanoscale subsurface defect analysis

Wed, 3 Mar 2009
March 25, 2009: A spinoff from the Semiconductor Research Corp. (SRC) and Northwestern University has come up with a unique ultrasound holography approach that combines scanning-probe microscopy with ultrasound and holography to provide glimpses into the tiniest of buried structures.

FEI joins SEMATECH metrology R&D program

Mon, 7 Jul 2009
July 13, 2009: FEI has joined SEMATECH's advanced metrology development program at the U. of Albany's College of Nanoscale Science and Engineering (CNSE) to expand efforts to develop novel technologies to improve process control and yield for 45nm node and below manufacturing.

MEMS and microelectronics undergo contactless delamination tests at Georgia Tech

Fri, 4 Apr 2012

Norcada microporous silicon nitride sample holders suit thin film study

Tue, 1 Jan 2012

Norcada launched 2 microporous silicon nitride TEM sample holders, suiting ALD analysis, thin film growth, and other applications under TEM, SEM, or STXM tools.


Advantest manufactures piezoelectric MEMS for semiconductor testing

Mon, 3 Mar 2012

Advantest Corporation began producing MEMS relays for semiconductor testing equipment, high-speed communications devices, HF wave measurement equipment and their components.


Nanolab Technologies doubles space for IC analysis services

Wed, 2 Feb 2012

Nanolab Technologies Incorporated inaugurated its 47,000sq.ft. state-of-the-art facility in Milpitas, CA, more than doubling Nanolab Technologies' space.


George Washington University establishes new Institute for Nanotechnology

Fri, 11 Nov 2008
November 28, 2008: The George Washington University has announced the establishment of the GW Institute for Nanotechnology.

E-beam, nanoimprint, and novel lithographies approach semiconductor mainstream

Fri, 3 Mar 2008
Electron-beam direct write, nanoimprint lithography (NIL), and other potentially disruptive semiconductor nanopatterning technologies made waves during the SPIE Advanced Lithography conference, as Small Times' Tom Cheyney explains.

Avo Photonics to produce Luna Technologies' Phoenix 1000

Thu, 11 Nov 2008
November 20, 2008: Optical packaging specialist Avo Photonics has been selected as the manufacturing facility for Luna Technologies' PHOENIX 1000, a MEMS-based external cavity laser which offers low noise and precise tuning capability over the C-band.

Carl Zeiss touts microscopy mark using scanning helium ions

Mon, 11 Nov 2008
November 24, 2008: Carl Zeiss SMT says it has set a new record resolution benchmark for scanning electron and ion microscopy -- a surface resolution of 2.4Å (0.24nm) has repeatedly been achieved (25%-75% edge-rise criterion) on various samples, 3× better than the most sophisticated scanning electron microscopes are able to achieve today with the same surface sensitivity.

Piezosystem jena intros nanopositioner, distributes SIOS nanomeasurement tools

Fri, 5 May 2008
May 2, 2008 -- Piezosystem jena announces two developments intended to serve those needing nano-scale precision: The company has expanded its TRITOR line of field-tested nanopositioning tools, and has become the exclusive U.S. distributor for SIOS, the German manufacturer of nanoprecision measurement systems.

Aerotech introduces SolarScribe photovoltaic panel scribing system

Tue, 5 May 2008
May 6, 2008 -- Aerotech calls its SolarScribe automation series the most comprehensive photovoltaic (PV) panel scribing system available.

Agilent promises "unprecedented flexibility" in fluorescence microscopy for micro/nano

Thu, 5 May 2008
May 8, 2008 -- Agilent Technologies has released its Multi-wavelength Laser Combiner for microscopy applications in micro and nano R&D -- a modular unit that gives new fluorescence microscopy options to OEMs and end users.

Pure-play foundries spending big on capital equipment

Wed, 10 Oct 2013
Semiconductor capital spending has increased significantly among pure-play foundries as more IDMs shift to a fabless/fab-lite business model and as new foundry participants intensify competition among the old guard.

Applied Materials to merge with Tokyo Electron

Tue, 9 Sep 2013
Applied Materials Inc. and Tokyo Electron Limited today announced Applied Materials agreed to merge with Tokyo Electron.

Semiconductor wet chemicals fall short of 2008 levels

Sat, 6 Jun 2014
Techcet forecasts $1B electronic chemicals business by 2015.

Global semiconductor sales increase for sixth straight month in August

Fri, 10 Oct 2013
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $25.87 billion for the month of August 2013, an increase of 6.4 percent compared to August 2012, marking the industry's largest year-over-year growth since March 2011.

Americas region remains largest market for pure-play foundry sales

Wed, 10 Oct 2013
Emphasis on fabless and fab-lite models in U.S. contributes to 62% marketshare.

ASML and imec launch advanced patterning center

Mon, 10 Oct 2013
New Center will offer the global semiconductor ecosystem crucial patterning knowledge for sub-10nm technologies.

SK Hynix reports significant process control improvement with new metrology platform

Mon, 8 Aug 2013

Nanometrics Incorporated, a provider of advanced process control metrology and inspection systems, today announced that SK Hynix has reported significant process control improvement by deploying the Atlas II platform for optical critical dimension (OCD) metrology across its memory device production.


Maxim Integrated Products to acquire Volterra Semiconductor Corp.

Thu, 8 Aug 2013

Maxim Integrated Products, Inc. announced it has entered into a definitive agreement to acquire Volterra Semiconductor Corp. for $23 per share, which represents a 55 percent premium to Volterra Semiconductor's closing share price on August 14, 2013.


Applied Materials names Gary E. Dickerson as CEO

Thu, 8 Aug 2013

Michael R. Splinter will serve as executive chairman.


Harold Hughes joins View Inc. board of directors

Thu, 8 Aug 2013

View Inc. today announced Harold Hughes, a semiconductor industry veteran, is joining the company's board of directors.


Boston Semi Equipment announces expansion of front and back end equipment business

Thu, 7 Jul 2013

At SEMICON West 2013, Boston Semi Equipment (BSE), LLC announced the expansion of its semiconductor front end and back end equipment businesses in Tempe, Ariz. into a new and larger facility.


cyberTECHNOLOGIES introduces Interferometric accuracy on suite of Surface Metrology Systems

Thu, 7 Jul 2013

cyberTECHNOLOGIES GmbH announced the addition of White-Light Interferometry (WLI) to its suite of production-proven CT SERIES non-contact surface metrology systems at SEMICON West 2013.


New methods to reduce time and cost of R&D

Wed, 7 Jul 2013

SEMICON West 2013 included a robust set of technical and marketing presentations on the general theme of developing new semiconductor devices in the session “Lab to Fab: From R&D to High Volume Manufacturing” held 1:30-3:30PM on July 9.


Semiconductor roadmapping update: Front-end technologies Part 1

Mon, 7 Jul 2013

In the afternoon of the last day of SEMICON/West 2013, a session was devoted to updates from the International Technology Roadmap for Semiconductors (ITRS) Front End of Line Technologies.


Semiconductor roadmapping update: Front-end technologies – Part 2

Mon, 7 Jul 2013

SEMATECH's Mark Neisser provided a sobering overview of the challenges associated with extending Lithography technology to pattern device structures below a half-pitch of 20nm.


SRC and Environmental Research Center create new cyclic purge technique

Tue, 7 Jul 2013

Researchers sponsored by Semiconductor Research Corporation (SRC), the world's leading university-research consortium for semiconductors and related technologies, today announced that they have developed a more efficient purge technique that reduces the consumption of ultra-high purity (UHP) purge gases by more than 20 percent during the production of semiconductors.


Toshiba to expand semiconductor fabrication facility

Wed, 7 Jul 2013

Fab 5 second phase construction will start at the end of August this year and be completed in summer next year. Decisions on equipment investment and production will reflect market trends.


OEM chip spending returns to growth in 2013

Mon, 7 Jul 2013

After a flat year in 2012, global purchasing of semiconductors by the world’s top electronic brands is set to return to growth in 2013, as Apple Inc. and Samsung Electronics contend to claim the title of biggest spender.


Book-to-bill ratio: Six consecutive months above parity

Fri, 7 Jul 2013

North America-based manufacturers of semiconductor equipment posted $1.33 billion in orders worldwide in June 2013 (three-month average basis) and a book-to-bill ratio of 1.10.


Rudolph announces new metrology suite for advanced packaging

Wed, 7 Jul 2013

Rudolph Technologies, Inc., a provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations of its industry-leading NSX 320 Automated Macro Defect Inspection System.


Dialog Semiconductor announces Richard Beyer as new chairman of the board

Tue, 7 Jul 2013

Dialog Semiconductor plc, a provider of highly integrated power management, audio, AC/DC and short-range wireless technologies today announced that Richard Beyer, appointed to the board in February this year, as an independent non-executive director, will succeed Gregorio Reyes as chairman of the board. Greg will continue to serve as a board member.


IDC forecasts worldwide semiconductor revenue will grow 6.9% in 2013

Tue, 7 Jul 2013

Semiconductor revenue worldwide will see improved growth this year of 6.9 percent and reaching $320 billion according to the mid-year 2013 update of the Semiconductor Applications Forecaster (SAF) from International Data Corporation (IDC).


SEMI: Second quarter semiconductor equipment billings US$ 7.55B

Tue, 9 Sep 2013
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.55 billion in the second quarter of 2013

Worldwide total semiconductor market to grow 3% in 2013; consolidation still rife

Fri, 9 Sep 2013
The worldwide semiconductor market is expected to grow three percent from 2012 to 2013. There has been sequential market growth from 1Q13 to 2Q13 and the vast majority of the top 20 vendors are expecting 3Q13 to grow revenues again.

Entegris to partner with SEMATECH on surface conditioning and wafer cleaning technology

Mon, 9 Sep 2013
Entegris, Inc. and SEMATECH announced they have partnered to move forward the development of advanced nanoscale particle removal processes and cleaning technologies for next-generation wafers and devices.

Worldwide semiconductor manufacturing equipment spending to decline 8.5 percent in 2013

Thu, 9 Sep 2013
Worldwide semiconductor manufacturing equipment spending is projected to total $34.6 billion in 2013, an 8.5 percent decline from 2012 spending of $37.8 billion, according to Gartner, Inc.

Dow introduces new SOLDERON tin-silver plating chemistry for lead-free bump plating

Wed, 10 Oct 2013
Next-gen SnAg offers industry-leading plating rates and process flexibility for flipchip packages and interconnects

Jordan Valley lands order for FEOL tool

Tue, 10 Oct 2013
Jordan Valley Semiconductors Ltd. received another order for its recently introduced JVX7300LMI scanning X-ray in-line metrology tool for patterned and blanket wafers

Zygo Corp appoints Gary Willis as interim CEO

Mon, 10 Oct 2013
Zygo Corporation today announced that Dr. Chris L. Koliopoulos is stepping down as the Chairman of the Board, President and Chief Executive Officer effective immediately, following the mutual decision of Dr. Koliopoulos and Zygo's board of directors.

Book-to-bill ratio reflects seasonal softening

Tue, 10 Oct 2013
North America-based manufacturers of semiconductor equipment posted $975.3 million in orders worldwide in September 2013 (three-month average basis) and a book-to-bill ratio of 0.97, according to the September EMDS Book-to-Bill Report published today by SEMI.

Three-dimensional atomic force microscopy

Wed, 10 Oct 2013
3D atomic force microscopes can measure critical dimensions, line edge roughness and sidewall roughness in a way that is highly accurate, non-destructive and cost-effective.

Global semiconductor leaders encourage China to support expansion of Key Trade Agreement

Wed, 10 Oct 2013
Senior executives from Semiconductor Industry Association (SIA) member companies and other multi-national semiconductor companies around the globe sent a letter to Chinese Vice Premiers Wang Yang and Ma Kai on October 16, encouraging China to support duty-free coverage for semiconductor products in an expanded Information Technology Agreement (ITA).

Rubicon launches first commercial line of large diameter patterned sapphire substrates

Fri, 11 Nov 2013
Rubicon Technology announced the launch of the first commercial line of large diameter patterned sapphire substrates (PSS) in four-inch through eight-inch diameters.

Expect big changes to 2013 Top 20 Semi Supplier ranking

Thu, 11 Nov 2013
SK Hynix, MediaTek, Micron, and Qualcomm each forecast to show ≥30% year-over-year growth.

Plastic Electronics Conference to rotate between Dresden and Grenoble beginning in 2014

Thu, 11 Nov 2013
SEMI, the global trade organization representing the nano- and micro-electronic manufacturing supply chains, today announced that next year’s Plastic Electronics Conference (PE2014) will be held in Grenoble, France and alternate with Dresden, Germany in future years to better address pan-European opportunities and challenges in Plastic Electronics.

SIA awards Mike Splinter the Robert N. Noyce award

Mon, 11 Nov 2013
The Semiconductor Industry Association (SIA) today announced that Mike Splinter, former CEO and current executive chairman of the board of directors at Applied Materials, has been named the 2013 recipient of SIA's highest honor, the Robert N. Noyce Award.

Update on 450mm SEMI Standards

Wed, 11 Nov 2013
SEMI Standards task forces are working on encouraging the industry to collaborate on key issues like the technical parameters for 450mm silicon wafers, physical interfaces, carriers, assembly and packaging. To date, SEMI has 13 task forces working on 450mm and has published nineteen (19) 450mm standards with 14 more in the pipeline.

Above parity: SEMI releases October book-to-bill ratio

Wed, 11 Nov 2013
A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

Semiconductor Industry Association begins leadership transition

Wed, 11 Nov 2013
Semiconductor Industry Association (SIA) president and CEO Brian Toohey has announced his plans to leave the association in 2014 to join New Hampshire-based DEKA Research & Development Corporation as executive vice president.

2013 semiconductor equipment sales forecast $32B; strong growth forecast for 2014

Tue, 12 Dec 2013
SEMI projects that worldwide sales of new semiconductor manufacturing equipment will contract 13.3 percent to $32.0 billion in 2013.

Worldwide semiconductor revenue grew 5.2 percent in 2013

Wed, 12 Dec 2013
Worldwide semiconductor revenue totaled $315.4 billion in 2013, a 5.2 percent increase from 2012 revenue of $299.9 billion, according to preliminary results by Gartner, Inc.

Industry on track for highest-ever annual sales in 2013

Thu, 12 Dec 2013
Worldwide sales increase for eighth straight month and top $27 billion for first time ever in October; WSTS forecast projects growth of 4.4 percent in 2013 and 4.1 percent in 2014.

Equipment spending down 2013; expect 33% growth in 2014

Fri, 12 Dec 2013
Fab construction projects boom in 2013 but slow in 2014.

TSI Semiconductors appoints Deborah Harvey as Executive Vice President of Worldwide Foundry Sales

Fri, 12 Dec 2013
TSI Semiconductors, LLC, a specialty foundry services company offering flexible technology development and high-quality manufacturing solutions, today announced that Deborah Harvey has joined the company in the newly created position of executive vice president of Worldwide Foundry Sales.

Mindspeed announces agreement to sell assets to Intel

Mon, 12 Dec 2013
Mindspeed Technologies, Inc., a supplier of semiconductor solutions for network infrastructure, today announced that it has signed a definitive agreement to sell the assets of its wireless infrastructure business unit to Intel Corporation.

Intel ends 2013 with a bang

Wed, 12 Dec 2013
ABI Research verified that Intel has a leading position in the mobile processor technology race; launching the first 22nm mobile application processor.

Book-to-bill: Year-end activity substantially stronger compared to last year

Fri, 12 Dec 2013
North America-based manufacturers of semiconductor equipment posted $1.24 billion in orders worldwide in November 2013 (three-month average basis) and a book-to-bill ratio of 1.11.

"Crisis? What Crisis?": New paradigm adjustments for capacity and equipment spending

Thu, 1 Jan 2014
Worldwide, the semiconductor industry growth rate back in 1973 was about 30 percent and slipped into 1975 with negative sales growth rates.

Advances in back-side via etching of SiC for GaN

Thu, 1 Jan 2014
The development of an 85µm diameter, 100µm deep SiC back-side via etch process for production is described.

Economic recovery and pervasive computing to propel semiconductor manufacturing supply chain

Tue, 1 Jan 2014
Macroeconomic and microelectronic industry growth opportunities and innovation challenges underscored diverse perspectives from analysts, economists, technologists, semiconductor manufacturers and supply chain executives speaking at the SEMI Industry Strategy Symposium (ISS) that opened yesterday.

SRC launches industry consortium

Wed, 1 Jan 2014
Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, has launched a significant new initiative on Trustworthy and Secure Semiconductors and Systems (T3S).

Design for yield trends

Thu, 1 Jan 2014
Should foundries establish and share best practices to manage sub-nanometer effects to improve yield and also manufacturability?

Moving atomic layer etch from lab to fab

Thu, 1 Jan 2014
A new plasma-enhanced atomic layer etch method delivers atomic-level etch precision with process times that are practical for use in a manufacturing environment.

2014 Outlook: An era of unprecedented change

Fri, 1 Jan 2014
We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.

Book-to-bill ratio continues to improve

Fri, 1 Jan 2014
The December three-month average bookings were at the highest level since June 2012 — a positive sign for the 2014 spending outlook.

Europe leaders to examine EC’s ambitious goal

Mon, 1 Jan 2014
At the SEMI Industry Strategy Symposium Europe (ISS Europe 2014) on February 23-25 in Salzburg, semiconductor industry executives will examine the conditions required to achieve the EU’s 10/100/20 strategy.

SMIC unveils 28nm readiness

Mon, 1 Jan 2014
Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, announced today that its 28nm technology has been process frozen and the company has successfully entered Multi Project Wafer stage to support customer's requirements on both 28nm PolySiON (PS) and 28nm high-k dielectrics metal gate processes.

Apple and Samsung are top OEMs, again, in semiconductor spending for 2013

Mon, 1 Jan 2014
Apple and Samsung remained the world’s largest buyers of semiconductor chips in 2013, but the intensifying battle between the two for the hearts and minds of consumers in their product offerings could presage another mighty showdown this year for the top ranking, according to a new report from IHS Technology.

2014 capital spending up in Korea; SEMICON Korea to address mobile innovation

Fri, 1 Jan 2014
With Korea expected to be the second largest region for fab construction spending in 2014, industry leaders will convene at SEMICON Korea 2014 in Seoul on February 12-14 to discuss the latest trends and technologies shaping the future of microelectronics manufacturing.

Entegris to acquire ATMI

Tue, 2 Feb 2014
Entegris, Inc. and ATMI today announced Entegris will acquire ATMI for approximately $1.15 billion, or approximately $850 million net of cash acquired, including the net cash proceeds from the sale of ATMI’s LifeSciences business of $170 million.

Silicon reclaim wafer market increased 14% in 2013

Thu, 2 Feb 2014
The worldwide reclaim wafer market is estimated at $460 million in 2013 and is forecasted to reach $493 million by 2015, according to SEMI.

A square peg in a round hole: The economics of panel-based lithography for advanced packaging

Fri, 2 Feb 2014
Moving from round wafers to rectangular panels saves corner space, delivering a roughly 10% improvement in surface utilization.

IBM continues to evolve: Semiconductor business up for sale; moving into the cloud

Fri, 2 Feb 2014
The Financial Times (FT) is reporting that IBM Corp is exploring the sale of its semiconductor business and has hired Goldman Sachs to find potential buyers.

Silicon wafer revenues decline in 2013

Tue, 2 Feb 2014
Worldwide silicon wafer revenues declined by 13 percent in 2013 compared to 2012 according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

Rudolph announces shipments for 3D metrology of TSVs

Tue, 2 Feb 2014
Rudolph Technologies, Inc. announced today the sale of its first NSX 320 TSV Metrology System to CEA-Leti, a research organization based in Grenoble, France.

Honeywell introduces new copper manganese sputtering targets

Fri, 2 Feb 2014
Honeywell announced today that it has introduced new copper manganese (CuMn) sputtering targets for semiconductor manufacturing based on patented technology offering customers higher strength, longer life, and better performance.

The most expensive SRAM in the world - 2.0

Thu, 2 Feb 2014
Embedded SRAM scaling is broken and, with it, Moore's Law.

Semiconductor industry posts record sales in 2013

Thu, 2 Feb 2014
The Semiconductor Industry Association announced that worldwide semiconductor sales for 2013 reached $305.6 billion, the industry’s highest-ever annual total and an increase of 4.8 percent from the 2012 total of $291.6 billion.

North American semiconductor equipment industry posts January 2014 book-to-bill ratio of 1.04

Fri, 2 Feb 2014
A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

GlobalFoundries and Fraunhofer IIS to collaborate on EUROPRACTICE, Europe's MPW wafer shuttle program

Wed, 2 Feb 2014
GLOBALFOUNDRIES and Fraunhofer Institute for Integrated Circuits IIS today announced the extension of their long-term collaboration, focusing on 40nm and 28nm processes. GLOBALFOUNDRIES will also join the European Multi Product Wafer (MPW) Program EUROPRACTICE.

New SEMICON Europa in Grenoble to emphasize innovation and applications

Mon, 3 Mar 2014
SEMICON Europa, the region’s largest event for the microelectronics manufacturing and innovation supply chain, will be held 7-9 October 2014 in Grenoble.

Global semiconductor industry posts highest-ever January sales

Mon, 3 Mar 2014
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $26.28 billion for the month of January 2014, an increase of 8.8 percent from January 2013 when sales were $24.15 billion, marking the industry's highest-ever January sales total and the largest year-to-year increase in nearly three years.

Busch Vacuum Pumps and Systems joins F450C Consortium

Tue, 3 Mar 2014
The Facilities 450mm Consortium (F450C), a partnership of nanoelectronics facility companies guiding the effort to design and build the next-generation 450mm computer chip fabrication facilities, today announced Busch Vacuum Pumps and Systems as the eleventh member company to join the consortium.

Moore's Law has stopped at 28nm

Wed, 3 Mar 2014
While many have recently predicted the imminent demise of Moore’s Law, we need to recognize that this actually has happened at 28nm.

University of Minnesota professor recognized for excellence in semiconductor research

Thu, 3 Mar 2014
The Semiconductor Industry Association this week presented its University Research Award – in consultation with Semiconductor Research Corporation (SRC) – to University of Minnesota professor Sachin Sapatnekar in recognition of his outstanding contributions to semiconductor research.

Samsung expands its 28nm technology offerings

Thu, 3 Mar 2014
Samsung Electronics, Co., Ltd. today announced that it has expanded its 28nm technology offerings with the addition of RF capabilities.

Fab equipment spending to increase 20-30% in 2014

Thu, 3 Mar 2014
The release today of the SEMI World Fab Forecast update reveals a 20 to 30 percent projected increase in semiconductor fab equipment spending in 2014.

Semtech Corporation announces the appointment of new Executive VP

Fri, 3 Mar 2014
Semtech Corporation, a supplier of analog and mixed-signal semiconductors, today announced the appointment of Charles B. Ammann as Executive Vice President, General Counsel and Corporate Secretary.

Cadence PVS certified for GlobalFoundries' 65nm to 14nm processes

Tue, 3 Mar 2014
Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES certified the Cadence Physical Verification System (PVS) for custom/analog, digital and mixed-signal design physical signoff for 65nm to 14nm FinFET process technologies.

SEMI reports 2013 global semiconductor equipment sales of $31.6 billion

Wed, 3 Mar 2014
SEMI, the global industry association for companies that supply manufacturing technology and materials to the world’s chip makers, today reported that worldwide sales of semiconductor manufacturing equipment totaled $31.58 billion in 2013.

Fab productivity and process technologies addressed at upcoming semiconductor manufacturing conference

Wed, 3 Mar 2014
The 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) will be held May 19-21 in Saratoga Springs, New York.

First methodology to analyze nanometer line pattern images

Tue, 3 Mar 2014
To meet the increasing demand for smaller, faster, and more powerful devices, a continued decrease in the dimensions of active parts of devices is required. The new methodology is a unique tool developed to address the gap existent in the metrology of sub-10nm line patterns.

SMIC CEO is awarded SEMI Outstanding EHS Achievement Award

Wed, 3 Mar 2014
Dr. Tzu-Yin Chiu, Chief Executive Officer & Executive Director of SMIC presented the SEMICON China 2014 opening keynote yesterday and was given a SEMI Outstanding EHS Achievement Award.

Equipment bookings and billings continue along a steady trend

Thu, 3 Mar 2014
North America-based manufacturers of semiconductor equipment posted $1.29 billion in orders worldwide in February 2014 (three-month average basis) and a book-to-bill ratio of 1.00.

Mentor Graphics acquires Berkeley Design Automation

Fri, 3 Mar 2014
Mentor Graphics Corp. today announced that it has acquired Berkeley Design Automation, Inc. BDA addresses nanometer circuit design challenges via its Analog FastSPICE unified verification platform and exceptional vertical-application expertise.

Particle Measuring Systems joins SEMATECH

Wed, 3 Mar 2014
This collaboration will address many of the profound changes taking place in the semiconductor industry that are impacting fundamental aspects of process and equipment design, including integration of new materials and process technology for sub-20nm node manufacturing, next-generation lithography requirements.

Jordan Valley Semiconductors wins more market share in advanced wafer level packaging

Thu, 7 Jul 2014
Jordan Valley Semiconductors Ltd., a supplier of X-ray based metrology tools for advanced semiconductor manufacturing lines, today announced that its micro-spot X-ray Fluorescence (µXRF) metrology tool has been qualified for production monitoring of advanced Wafer Level Packaging (WLP) processes, by another memory player.

Silicon Valley specialty foundry Noel Technologies names Joe Medeiros Director of Reclaim

Thu, 3 Mar 2014
Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, has added semiconductor industry veteran Joe Medeiros to its growing management staff.

SEMATECH announces leadership changes

Mon, 3 Mar 2014
SEMATECH, the global consortium of semiconductor manufacturers, announced today that Ronald Goldblatt, vice president of Technical Strategy and Operations, has been appointed by the board of directors as acting president and chief executive officer, effective immediately.

ON Semiconductor to acquire Trusense Imaging, Inc.

Thu, 4 Apr 2014
ON Semiconductor today signed a definitive agreement to acquire Truesense Imaging, Inc., a provider of high-performance image sensor devices addressing a wide range of industrial end-markets including machine vision, surveillance, traffic monitoring, medical and scientific imaging, and photography.

SEMI reports 2013 global semiconductor materials sales of $43.5B USD

Mon, 4 Apr 2014
The global semiconductor materials market decreased 3 percent in 2013 compared to 2012 while worldwide semiconductor revenues increased 5 percent.

Global Semiconductor Alliance celebrates 20 years of industry collaboration

Tue, 4 Apr 2014
The Global Semiconductor Alliance (GSA) is celebrating 20 years of industry collaboration this year.

February semiconductor sales up 11.4 percent compared to last year

Wed, 4 Apr 2014
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $25.87 billion for the month of February 2014, an increase of 11.4 percent from February 2013 when sales were $23.23 billion.

KLA-Tencor Corporation receives Intel’s Preferred Quality Supplier Award

Fri, 4 Apr 2014
KLA-Tencor Corporation has been recognized as one of 18 companies receiving Intel Corporation’s Preferred Quality Supplier (PQS) award for their performance in 2013.

New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

Tue, 4 Apr 2014
The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format.

Will interconnect manufacturing requirements cramp Moore's Law's style?

Fri, 4 Apr 2014
The recent years have seen considerable contention in the semiconductor industry on whether Moore’s Law is alive and well.

SEMATECH appoints IBM veteran to direct strategic growth initiatives

Mon, 4 Apr 2014
Dr. Barth will join SEMATECH’s executive management team and will be responsible for cultivating effective alliance relationships and driving key strategic partnerships that align with the company’s core business objectives and long-term value creation and growth.

Scaling to 5nm: A plethora of paths

Mon, 4 Apr 2014
Previous semiconductor technology generations developed more clearly defined “winners” in terms of process technologies and materials choices.

Global semiconductor industry posts highest-ever first quarter sales

Mon, 5 May 2014
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $78.47 billion during the first quarter of 2014, marking the industry's highest-ever first quarter sales.

SEMATECH appoints Satyavolu Papa Rao to lead process technology

Tue, 5 May 2014
In this key role, Papa Rao will serve as the operational lead, overseeing the strategic development of SEMATECH’s manufacturing, process, materials and ESH-related activities.

In-line high-K/metal gate monitoring using picosecond ultrasonics

Fri, 5 May 2014
Only a direct measurement of SRAM structures can represent true variations of metal gate height due to CMP process and is strongly affected by the design and layout of pattern, including pattern density, dummy design, and spacing.

Sales of semiconductor equipment in North America continue to demonstrate strong growth

Fri, 5 May 2014
A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

KLA-Tencor announces new Teron SL650 reticle inspection system

Fri, 5 May 2014
Today, KLA-Tencor Corporation announced the Teron SL650, a new reticle quality control solution for IC fabs that supports 20nm design nodes and beyond.

Down to 5nm: Scaling with the usual suspects - performance, cost

Thu, 5 May 2014
The semiconductor industry never lacks for challenges and/or controversy as it forges ahead from one technology node to the next.

Critical test issues up for debate at Test Vision 2020

Mon, 6 Jun 2014
Test professionals who want to learn, forecast and debate the future of semiconductor test will attend the 7th annual IEEE Test Vision 2020 Workshop, held in conjunction with SEMICON West 2014 (July 8-10) in San Francisco.

Plasma-Therm ranked first in customer satisfaction

Tue, 6 Jun 2014
Plasma-Therm, a global provider of semiconductor equipment, has again been ranked number one in an independent survey of customers, the company announced today.

Global semiconductor sales increase in April; Sustained growth projected for 2014 and 2015

Thu, 6 Jun 2014
The Semiconductor Industry Association (SIA) yesterday announced that worldwide sales of semiconductors reached $26.34 billion for the month of April 2014.

Entropic to close and consolidate several global facilities

Mon, 6 Jun 2014
Entropic announced plans today to close and consolidate several global facilities, a move that would impact approximately 23 percent of Entropic's headcount.

SEMI's 3DIC standards activities

Sat, 5 May 2013
I have said many times that it will be impossible for a complicated technology like 3DIC to ever become commercial without standardization.

Scouting report for materials at end of the road: 2013 ITRS

Thu, 4 Apr 2013
The IC fabrication industry is approaching the end of the road for device miniaturization, with both atomic and economic limits looming on the horizon.

450mm transition toward sustainability: Facility and infrastructure requirements

Thu, 6 Jun 2014
Design and construction professionals are showing unprecedented levels of collaboration through the G450C.

Bookings and billings maintain a consistent pace in May 2014

Fri, 6 Jun 2014
North American semiconductor equipment industry posts May 2014 book-to-bill ratio of 1.00.

Applied Materials and Tokyo Electron unveil new company name

Tue, 7 Jul 2014
Applied Materials, Inc. and Tokyo Electron Limited today unveiled the new name and logo of their combined company which will be used once the merger closes.

SEMATECH and CNSE/SUNYIT launch CMP Center

Tue, 7 Jul 2014
The Center aims to accelerate the development of next generation CMP technology, and to drive improvement in the yield and cost of ownership of CMP processes.

Applied Materials unveils CVD and CMP systems

Tue, 7 Jul 2014
On Monday, Applied Materials announced two new systems, a Reflexion LK Prime CMP system and a Producer XP Precision CVD system, both aimed at complex devices with 3D architectures.

SEMI forecasts double-digit business growth in 2014, 2015

Wed, 7 Jul 2014
The worldwide semiconductor capital equipment market is forecast to increase 20.8 percent this year to $38.44 billion, compared with 2013’s $31.82 billion, and another 10.8 percent in 2015 to $42.6 billion, according to Semiconductor Equipment and Materials International.

Paradigm shift in semi equipment - Confirmed

Tue, 7 Jul 2014
Technology node transitions slowing below 32nm.

IBM announces $3B research initiative

Tue, 7 Jul 2014
IBM announced it is investing $3 billion over the next 5 years in two broad research and early stage development programs to push the limits of chip technology needed to meet the emerging demands of cloud computing and Big Data systems.

Process Watch: The 10 fundamental truths of process control for the semiconductor IC industry

Tue, 7 Jul 2014
This is the first in a series of 10 installments which will discuss fundamental truths about process control - inspection and metrology - for the semiconductor industry.

CEA-Leti: Monolithic 3D is the solution for further scaling

Mon, 7 Jul 2014
Hughes Metras, Leti’s VP of Strategic Partnerships North America, introduced the lead talk at their SemiconWest 2014 Leti Day about monolithic 3D technology as the "solution for scaling."

SEMI: June 2014 equipment bookings at the highest level since May 2012

Tue, 7 Jul 2014
North America-based manufacturers of semiconductor equipment posted $1.47 billion in orders worldwide in June 2014 (three-month average basis) and a book-to-bill ratio of 1.09, according to the June EMDS Book-to-Bill Report published today by SEMI.

VCs still investing in semiconductor technology, but need strategic partners and capital efficiency

Thu, 7 Jul 2014
Investors are still looking for differentiated technologies that solve high-value problems in semiconductor manufacturing, or that bring semiconductor technology to disruptive applications in other fields, particularly in the medical and environmental sectors

A*STAR and industry partners form S$200M semiconductor R&D joint labs

Thu, 7 Jul 2014
Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners.

Superfast stress inspection for overlay control

Mon, 7 Jul 2014
Tighter overlay requirements are motivating device manufacturers to explore new ways to characterize and manage overlay to improve yield.

A call to provide advanced equipment to growth companies

Mon, 7 Jul 2014
Historically, the major semiconductor capital equipment manufacturers have focused on supporting the bigger semiconductor companies at the expense of the smaller ones.

SEMICON Taiwan 2014 to capitalize on growing market opportunities in Taiwan

Wed, 8 Aug 2014
Taiwan is forecast to have the largest regional semiconductor manufacturing equipment and materials capital expenditures in both 2014 and 2015.

SEMATECH and CNSE/SUNY launch new patterning center

Thu, 8 Aug 2014
SEMATECH and the newly merged SUNY College of Nanoscale Science and Engineering (CNSE) / SUNY Institute of Technology (SUNYIT) announced today they have launched their joint Patterning Center of Excellence.

Strong growth in second quarter 2014 silicon wafer shipments

Tue, 8 Aug 2014
Worldwide silicon wafer area shipments increased during the second quarter 2014 when compared to first quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

The growing semiconductor market in India

Thu, 8 Aug 2014
The semiconductor industry in India is estimated to grow from $10.02 billion in 2013 to $52.58 billion in 2020 at CAGR of 26.72%, according to Research and Markets new report the "Semiconductor Market in India 2014 - 2020."

Order activity for semiconductor equipment holds steady in July

Thu, 8 Aug 2014
North America-based manufacturers of semiconductor equipment posted $1.41 billion in orders worldwide in July 2014 (three-month average basis) and a book-to-bill ratio of 1.07, according to the July EMDS Book-to-Bill Report published today by SEMI.

SRC TECHCON 2014 Conference to feature speakers from GLOBALFOUNDRIES, LinkedIn, High Point University

Mon, 8 Aug 2014
The TECHCON 2014 conference hosted by Semiconductor Research Corporation (SRC), the university-research consortium for semiconductors and related technologies, will feature immediate past GLOBALFOUNDRIES CEO Ajit Manocha among the list of executive speakers at the Sept. 7-9 annual event.

GLOBALFOUNDRIES adds Louis Lupin as Chief Legal Officer

Thu, 9 Sep 2014
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, announced today that Louis “Lou” Lupin has joined the company as senior vice president and chief legal officer.

Gas applications in lithography

Mon, 9 Sep 2014
Lithography is a key enabling process with very demanding requirements. Shrinking feature sizes will raise the bar even further.

SEMI wins request for etch equipment export control review

Tue, 9 Sep 2014
Major milestone in longstanding push to remove etch equipment from U.S. export control list.

SEMI advocates for the industry in Washington

Wed, 9 Sep 2014
With changes coming in Washington, SEMI has important work ahead supporting the innovators and job creators of this country.

Rudolph introduces new acoustic metrology and defect inspection technology

Thu, 9 Sep 2014
Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).

Kurita, SEMATECH partner on wafer surface contamination and cleaning technology in semiconductor processing

Tue, 9 Sep 2014
SEMATECH, the global consortium of chipmakers, announced today that Kurita Water Industries Limited has partnered with SEMATECH to develop innovative technologies for low defectivity ultrapure water (UPW) applications used in semiconductor manufacturing.

Boston Semi Equipment creates industry's largest independent ATE organization

Wed, 10 Oct 2014
Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name.

Semiconductor market in India is expected to reach US$ 52.58B by 2020

Tue, 10 Oct 2014
India has a very large industry base of electronics items, but there is little manufacturing base for semiconductors.

Altera CEO John Daane to receive Robert N. Noyce Award

Wed, 10 Oct 2014
The Semiconductor Industry Association announced that John P. Daane, President, CEO, and Chairman of the Board of Altera, has been named the 2014 recipient of SIA's highest honor, the Robert N. Noyce Award.

Intel and IBM to lay out 14nm FinFET strategies on competing substrates at IEDM 2014

Thu, 10 Oct 2014
The development of increasingly sophisticated and energy-efficient CMOS technology for mobile, client and cloud computing depends on a continuing stream of advances in the process technologies with which the complex integrated circuits are built.

Growing momentum in semiconductor manufacturing in Vietnam

Fri, 10 Oct 2014
The 2nd annual SEMI Vietnam Semiconductor Strategy Summit, co-organized with the Saigon Hi-Tech Park and with FabMax as the premier sponsor, was held September 16-17, 2014 in Ho Chi Minh City.

IBM to pay GlobalFoundries $1.5B to take over chip fabs

Mon, 10 Oct 2014
IBM and GLOBALFOUNDRIES today announced that GLOBALFOUNDRIES will acquire IBM's global commercial semiconductor technology business.