Wed, 12 Dec 2012
Abingdon, England--Oxford Instrumentshas acquired Asylum Research, a maker of scanning probe microscopes (SPM) with subsidiaries in the UK, Germany, and Taiwan. Its products are used by academic and industrial customers across the world for a wide range of materials and bioscience applications.
Wed, 10 Oct 2013
3D atomic force microscopes can measure critical dimensions, line edge roughness and sidewall roughness in a way that is highly accurate, non-destructive and cost-effective.
Fri, 11 Nov 2013
Columbia Engineers develop new device architecture for 2D materials, making electrical contact from the 1D edge.
Tue, 11 Nov 2013
‘Ecosystem for Nanotechnology, Entrepreneurship and Law’ (eNTEL) will provide unmatched student experience as launch pad for development of startup companies and attraction of business investment.
Tue, 2 Feb 2014
A new microscopy method could enable scientists to generate snapshots of dozens of different biomolecules at once in a single human cell, a team from the Wyss Institute of Biologically Inspired Engineering at Harvard University reported Sunday in Nature Methods.
Fri, 2 Feb 2014
Honeywell announced today that it has introduced new RadLo low alpha plating anodes based on proprietary technology to help reduce alpha particle radiation that can lead to data errors in semiconductors.
Thu, 3 Mar 2014
Semiconductor industry revenues reported by the World Semiconductor Trade Statistics (WSTS) reached a record high in 2013 with global revenues totaling over $305 million.
Thu, 4 Apr 2014
ON Semiconductor today signed a definitive agreement to acquire Truesense Imaging, Inc., a provider of high-performance image sensor devices addressing a wide range of industrial end-markets including machine vision, surveillance, traffic monitoring, medical and scientific imaging, and photography.
Thu, 4 Apr 2014
The IEEE Photonics Conference 2014 (IPC-2014) has announced a Call for Papers seeking original technical presentations in lasers, optoelectronics, optical fiber networks and related topics for the industrys premier fall photonics conference.
Thu, 9 Sep 2014
Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).