New 3D measuring system offers auto brightness and high-speed stitching.
Building on its extensive microscope lineup, KEYENCE Corporation has released a new multipurpose microscope.
COMSOL Inc., a multiphysics simulator software developer, recently announced the release of major new additions to the COMSOL simulation platform.
MoSys, a provider of semiconductor solutions, today announced that Macnica Americas, a provider of semiconductor distribution and design services, will support the GigaChip Interface in its distribution and technology innovation business.
It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device.
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision micromachining applications.
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive application at a European based IDM.
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG120 automated resist processing system.
3M announced today it is in the final stages of scale-up for its new 3M Quantum Dot Enhancement Film (QDEF). The new film allows up to 50 percent more color than current levels in liquid crystal display (LCD) devices.
Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter, the second tool in its expanding family of Purion ion implanters.
Engineered Material Systems debuted its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.
Picosun Oy, an Atomic Layer Deposition (ALD) equipment manufacturer, reports that its PICOPLATFORM 300 ALD cluster tool has been selected by a key customer in Asia for new memory applications.
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that the new Access+ contact unit holder (CUH) for the MT9510 significantly shortens the downtime of the test cell.
The Hiden IG20 high-brightness gas ion gun is further enhanced by the introduction of a new beam optic and ion source configuration to enable both increased beam brightness and beam contrast, together with a significant reduction in ultimate spot size.
Imec demonstrated a low-power (20µW), intra-cardiac signal processing chip for the detection of ventricular fibrillation at this week’s International Solid State Circuits Conference (ISSCC 2013) in San Francisco with Olympus.
New advancement enables the development of low-power, low-cost, high-data rate solutions for true mobile devices.
CoorsTek, one of the largest technical ceramics manufacturers, today announced introduction of aluminum nitride substrates.
Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, announced an expansion of its SPI Flash memory portfolio yesterday.
KLA-Tencor Corporation (NASDAQ: KLAC) announced the eS805, a new electron-beam inspection system capable of detecting very small defects, and defects that cause electrical problems.
STMicroelectronics unveils calculator to maintain accurate fuel gauging with battery age and usage
GCAP targets a range of industrial applications as well as research labs, advanced gas analysis and biomedical screening.
MOCON, Inc., a manufacturer of package integrity instrumentation, is launching a new system to measure the water vapor transmission rate, or WVTR, of ultra-high barrier films with greater sensitivity than ever before possible.
Newport Corporation introduced long-lived deep ultraviolet (UV) excimer laser mirrors with projected lifetimes greater than 30 billion pulses.
Cadence Design Systems, Inc. announced the availability of Virtuoso® Advanced Node, a new set of custom/analog capabilities designed for the advanced technology nodes of 20nm and below.
ProPlus Design Solutions announced it is shipping a new wafer-level, 1/f noise measurement system. Increasingly, circuit designers are interested in 1/f noise data at higher frequencies.
Engineered Material Systems, a global supplier of electronic materials for circuit assembly applications, debuts its DB-1568-1 low-temperature cure die attach adhesive for attaching semiconductor die in temperature-sensitive devices.
New metrology and inspection products facilitate advanced patterning techniques for manufacturing sub-20nm memory and microprocessor chips.
Toshiba Corporation announced the development of a CMOS image sensor with a small area and low power pixel readout circuits. A sample sensor embedded with the readout circuits shows double the performance of a conventional one. Toshiba presented this development at ISSCC 2013 in San Francisco, CA on Feb. 20.
-27% active power reduction and 85% standby power reduction is confirmed at International Solid-State Circuits Conference 2013.
PNI Sensor Corporation and EM Microelectronic -Marin SA announce the introduction of the Sentral sensor fusion hub: a new, highly effective way to integrate complex motion sensors on mobile devices.
Toshiba Corporation today announced that it has developed an intelligent vital signs sensor module: Smart healthcare Intelligent Monitor Engine and Ecosystem with Silmee, that simultaneously senses information on key vital signs, Electric Cardio Gram, pulse, body temperature and movements, and that can deliver the data to smartphones and tablet PCs with wireless technology.
Cree, Inc. introduces a game-changing series of LED bulbs, with bulbs starting at a new low price of $9.97 for a 40-watt bulb. The new bulbs shine as brightly as comparable incandescents, while saving 84% of the energy compared to traditional bulbs.
LED driver matches flash LED input current with safe output capability of battery – in real time.
New 200 mm diameter wafer enhances photolithography capability.
Coherent, Inc. has expanded its family of industrial ultrafast lasers with the new Talisker 1000 series. This new series of high power picosecond lasers is designed for high-throughput, precision materials processing applications in the semiconductor, solar (photovoltaics), medical devices, consumer electronics and automotive industries.
Hiden announced this week the integration of on-board timers for real-time pulsed plasma measurement, the fast gating fully controllable within the MASsoft operating program. Two timers provide “gate open/close” and “gate increment” periodicity with sub-microsecond gating resolution to just 100 nanoseconds, phasing data acquisition precisely with each individual plasma pulse.
Signetics Corporation today introduced their new MapBGA package to the industry. This alternative to standard PBGA packaging has improved reliability and design flexibility due to its unique assembly process.
Mentor Graphics Corp. today announced availability of the Kronos Cell Characterization and Analysis platform. The Kronos platform quickly produces accurate performance models for standard cells, I/Os, and complex cells within an advanced, integrated environment.
Heraeus will present numerous product highlights with regard to bonding wires, assembly materials and sputtering targets at this year's Semicon China, taking place on March 19-21, 2013 in Shanghai.
PI miCos announced the release of a new 2-axis precision linear translation stage. The new MCS XY precision linear stage was designed for industrial precision motion control and surface metrology applications and combines robustness and high accuracy.
Bruker announced today the release of the Dimension Icon SSRM-HR, a new atomic force microscope (AFM) configuration including the Scanning Spreading Resistance Microscopy (SSRM) module, designed specifically for high-resolution (HR) semiconductor characterization.
The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam metallization system for lift-off compound semiconductor applications.
Brooks Instrument, a provider of advanced flow, pressure, vacuum and level solutions, has expanded its GF 40/80 Series portfolio of thermal mass flow controllers. Broader capabilities, including increased flow rates up to 50 slpm and a “normally open” valve for non-hazardous gas applications, are ideal upgrades for users of Aera (Hitachi), Celerity, Tylan, Mykrolis, Millipore and Unit mass flow controllers, as well as other competitive devices.
Oxford Instruments Plasma Technology has just announced an evolution in batch etch technology with the launch of the PlasmaPro 1000 Astrea etch system, a large batch etch solution for PSS, GaN and AlGaInP that will offer HBLED production manufacturers high throughput.
Nanoplas, a global supplier of plasma processing equipment to the semiconductor industry, today announced a new dry-etch process offering virtually unlimited etch selectivity for removing dielectric films on microprocessors and memories at high throughput.
The newest AVIA micromachining laser from Coherent, Inc. (Santa Clara, CA) delivers the highest power commercially available at its wavelength and repetition rate.
ProPlus Design Solutions, Inc. yesterday launched NanoSpice, the next-generation high-capacity, high-performance parallel SPICE simulator for giga-scale circuit simulation.
PI (Physik Instrumente) presents the E-482, a new high-power amplifier providing 6 kW peak power with an energy saving power recovery design.
PI (Physik Instrumente) L.P., a manufacturer of nanopositioning equipment — offers the LPS-45 series of piezo positioning stages manufactured by PI subsidiary PI miCos.
Transistors in ultra-high definition displays (UHD) possess particularly fine structures. Only extremely pure sputtering targets are suitable for use as the input materials for the fine conductor paths.
New technology allows process even more difficult than glass-to-glass welding, expanding the ways in which industries can take advantage of the versatile and popular sapphire.
The new laser wafer processing system Waferlase 200/300/450, is a fully automated modular platform comprising a market-leading handling system for (ultra) thin semiconductor wafers and a choice of laser processing modules, depending on the type of application.
DAS Environmental Expert GmbH of Dresden, Germany, has developed SALIX, a point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications.