Packaging

Topic Index

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Pure-play foundries spending big on capital equipment

Wed, 10 Oct 2013
Semiconductor capital spending has increased significantly among pure-play foundries as more IDMs shift to a fabless/fab-lite business model and as new foundry participants intensify competition among the old guard.

NXP NextPowerS3 MOSFETs offer super-fast switching with soft recovery

Fri, 9 Sep 2013
Industry’s first MOSFET platform to deliver integrated Schottky performance with low leakage current.

Mobility now driving the industry

Wed, 9 Sep 2013
It’s apparent that the world’s appetite for electronics has never been greater. That has increasingly taken the form of mobile electronics, including smartphones, tablets and tablets and the new “phablets.” People want to watch movies and live sports on their phones.

Package level integration: challenges and opportunities

Wed, 9 Sep 2013
A wide array of package level integration technologies now available to chip and system designers are reviewed.

Silicon Labs launches the world’s most energy-friendly MCUs

Wed, 10 Oct 2013
Silicon Labs, a developer of high-performance, analog-intensive, mixed-signal ICs, today introduced the industry’s most energy-friendly 32-bit microcontrollers (MCUs) based on the ARM Cortex-M0+ processor.

Applied Materials to merge with Tokyo Electron

Tue, 9 Sep 2013
Applied Materials Inc. and Tokyo Electron Limited today announced Applied Materials agreed to merge with Tokyo Electron.

STMicroelectronics reveals new micro-packaged device product family

Tue, 9 Sep 2013
Next-generation integrated devices for matching, filtering and protection help shrink circuit size and boost end-product performance.

MACOM releases industry’s first surface mount L-Band 90W GaN power module

Tue, 9 Sep 2013
MACOM Technology Solutions Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced the newest entry in its portfolio of GaN in Plastic packaged power products.

Micron ships first samples of Hybrid Memory Cube

Wed, 9 Sep 2013
Micron Technology, Inc. announced today that it is shipping 2GB Hybrid Memory Cube (HMC) engineering samples.

Inside the Hybrid Memory Cube

Wed, 9 Sep 2013
The HMC provides a breakthrough solution that delivers unmatched performance with the utmost reliability.

High temperature reverse bias reliability testing of high power devices

Wed, 9 Sep 2013
Power device characterization and reliability testing require instrumentation capable of sourcing higher voltages and more sensitive current measurements than ever before.

SEMI book-to-bill ratio indicates bookings decline

Thu, 9 Sep 2013
North America-based manufacturers of semiconductor equipment posted $1.06 billion in orders worldwide in August 2013 (three-month average basis) and a book-to-bill ratio of 0.98, according to the August EMDS Book-to-Bill Report published today by SEMI.

Micron Technology appoints Thomas Snodgrass as VP of System Solutions

Tue, 10 Oct 2013
Micron Technology, Inc. today announced that the company has named Tom Snodgrass, vice president, System Solutions.

Stanford and UT Austin professors to be honored at annual SRC TECHCON

Thu, 9 Sep 2013
Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, will honor professors from Stanford University and University of Texas at Austin with awards for chip-related research and education at SRC’s annual TECHCON conference Sept. 9-10.

Alpha and Omega Semiconductor launches new DrMOS-IIIS power modules

Mon, 9 Sep 2013
Alpha and Omega Semiconductor, a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today launched the AOZ5019, a third-generation high efficiency power module with an EZPair package.

World record solar cell with 44.7% efficiency

Mon, 9 Sep 2013
The Fraunhofer Institute for Solar Energy Systems ISE, Soitec, CEA-Leti and the Helmholtz Center Berlin jointly announced this week having achieved a new world record for the conversion of sunlight into electricity using a new solar cell structure with four solar subcells.

GE acquires Imbera

Thu, 9 Sep 2013
GE Healthcare Finland Oy, in partnership with GE Idea Works, announced today that it has completed the acquisition of Imbera Electronics Oy.

Global semiconductor sales increase for sixth straight month in August

Fri, 10 Oct 2013
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $25.87 billion for the month of August 2013, an increase of 6.4 percent compared to August 2012, marking the industry's largest year-over-year growth since March 2011.

CU, MIT breakthrough in photonics could lead to faster electronics

Wed, 10 Oct 2013
A pair of breakthroughs in the field of silicon photonics by researchers at the University of Colorado Boulder, the Massachusetts Institute of Technology and Micron Technology Inc. could allow for the trajectory of exponential improvement in microprocessors that began nearly half a century ago—known as Moore's Law—to continue well into the future, allowing for increasingly faster electronics, from supercomputers to laptops to smartphones.

Intermolecular and Russian nanocenter sign joint development agreement

Fri, 10 Oct 2013
Intermolecular, Inc. and RUSNANO, the Fund for Infrastructure and Educational Programs, today announced the signing of a joint development agreement between Intermolecular and Ulnanotech, the leading Russian Federation nanocenter based in Ulyanovsk.

3D-IC: Two for one

Wed, 9 Sep 2013
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about upcoming events related to 3D ICs.

A new photoresist technology for organic semiconductors enabling submicron patterns

Thu, 9 Sep 2013
Fujifilm and imec have developed a new photoresist technology for organic semiconductors that enables the realization of submicron patterns.

Americas region remains largest market for pure-play foundry sales

Wed, 10 Oct 2013
Emphasis on fabless and fab-lite models in U.S. contributes to 62% marketshare.

The Internet of Things is poised to change everything, says IDC

Fri, 10 Oct 2013
The Internet of Things represents a new construct in the information and communications technology world that is occupying the minds of IT vendors, service providers, and systems integrators as it represents huge potential for new streams of revenue and new customers.

PC outlook lowered again

Fri, 8 Aug 2013
Worldwide PC shipments are now expected to fall by -9.7 percent in 2013, further deepening what is already the longest market contraction on record.

Moore's Law Dead By 2022: Crying Wolf?

Fri, 8 Aug 2013
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about recent predictions regarding the demise of continued scaling.

Dow Corning and EV Group to collaborate on temporary bonding materials for 3D-IC

Tue, 9 Sep 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG's LowTemp platform for room-temperature wafer bonding and debonding processes.

Advancing graphene for post-silicon computer logic

Tue, 9 Sep 2013
Team of UC Riverside researchers pioneer new approach for graphene logic circuits.

EV Group unveils new via-filling process to improve reliability of 3D-IC/TSV packaging

Wed, 9 Sep 2013
EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new polymer via-filling process for 3D-IC/through-silicon-via semiconductor packaging applications.

Electronics advance moves closer to a world beyond silicon

Wed, 9 Sep 2013
Researchers in the College of Engineering at Oregon State University have made a significant advance in the function of metal-insulator-metal, or MIM diodes, a technology premised on the assumption that the speed of electrons moving through silicon is simply too slow.

Will 2014 be the next Golden Year?

Thu, 9 Sep 2013
Some unexpected underdogs spur spending spree.

Collaboration needed on 3D-IC

Thu, 9 Sep 2013
The history of semiconductors has been a history of collaboration. Today, a similar industry-wide collaborative approach to 3D stacked ICs is needed to reach widespread 3D-IC adoption and continue the amazing progress our industry has historically achieved.

Chip carrier packaging grows on widespread adoption of QFN package

Fri, 9 Sep 2013
Advanced packaging of semiconductor chips has emerged as a key enabler in many of today’s electronic system products.

Fab equipment spending up 25% in 2014

Mon, 9 Sep 2013
Semiconductor revenue has improved in 2013 compared to 2012 and early forecasts for 2014 project revenue growth averaging about eight percent.

New Intel CEO, president talk product plans and future of computing

Tue, 9 Sep 2013
From data centers to ultra-mobile devices such as tablets, phones and wearables, computing segments are undergoing exciting and even game-changing transitions, said new Intel CEO Brian Krzanich during today’s opening session of the Intel Developer Forum.

SUNY CNSE to develop center for 450mm computer chip manufacturing

Thu, 9 Sep 2013
Building on Governor Cuomo’s CNSE G450C initiative and expanded partnership between NanoCollege and the Mohawk Valley EDGE continues New York’s investment strategy.

The advantages of a hybrid scan test solution

Thu, 9 Sep 2013
Scan testing is the standard practice for test of integrated circuits. The vast majority of IC production test is based on automatic test pattern generation (ATPG) using the scan logic.

Brooks Automation appoints Lindon G. Robertson as CFO

Fri, 9 Sep 2013
Brooks Automation, Inc. today announced the appointment of Lindon G. Robertson as executive vice president and chief financial officer, effective October 1, 2013.

Pitching for IC packages

Fri, 9 Sep 2013
Itty bitty computers, smart phones, ipods, and more – these “must have” small electronic devices that Apple Computer and other companies have popularized, are forcing the hand of IC package designers to shrink the package to fit within these little hand-held gadgets.

Brewer Science’s new carbon nanotube materials are qualified for NRAM manufacturing

Fri, 9 Sep 2013
Brewer Science announced today that the next generation of carbon nanotube materials, the CNTRENE 1020 material series, is officially qualified for NRAM nanotube random access memory device manufacturing by Nantero Inc.

Worldwide total semiconductor market to grow 3% in 2013; consolidation still rife

Fri, 9 Sep 2013
The worldwide semiconductor market is expected to grow three percent from 2012 to 2013. There has been sequential market growth from 1Q13 to 2Q13 and the vast majority of the top 20 vendors are expecting 3Q13 to grow revenues again.

Spansion licenses ARM processor technology to power embedded systems

Mon, 9 Sep 2013
Spansion Inc. today announced it has licensed a wide range of ARM processors for its current and future product lineup aimed at embedded applications in the automotive, industrial and consumer markets.

Asia-Pac soars, Japan drops in regional semiconductor capex spending

Tue, 9 Sep 2013
Capex marketshare flips in Asia-Pac and Japan; Europe's share erodes while North America gains.

Leading-edge technology to be responsible for 2013 increase in pure-play foundry sales

Tue, 9 Sep 2013
TSMC forecast to sell $6.33 billion worth of ≤28nm devices this year, a 3x increase over 2012.

Packaging at The ConFab

Wed, 9 Sep 2013
At The ConFab conference in Las Vegas in June, Mike Ma, VP of Corporate R&D at Siliconware (SPIL), announced a new business model for interposer based SiP’s, namely the “turnkey OSAT model.” In his presentation “The expanding Role of OSATS in the Era of System Integration,” Ma looked at the obstacles to 2.5/3D implementation and came up with the conclusion that cost is still a significant deterrent to all segments.

Dow introduces new SOLDERON tin-silver plating chemistry for lead-free bump plating

Wed, 10 Oct 2013
Next-gen SnAg offers industry-leading plating rates and process flexibility for flipchip packages and interconnects

Blog Review October 14 2013

Mon, 10 Oct 2013
Recent blogs address semiconductors in healthcare (blood cell sorters), FinFETs and logic roadmaps, 450mm progress, panel level embedded tech, materials innovation, options to reduce mask write time, SOI and EUV.

ASMC 2014 offers opportunity for presenters

Thu, 11 Nov 2013
SEMI announced today that the deadline for presenters to submit an abstract for the 25th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 28.

Spansion launches family of flexible microcontrollers for the industrial "Internet of Things"

Mon, 11 Nov 2013
Designed for stringent industrial requirements, Spansion FM Family offers a range of high performance and low power solutions.

Rising demand for array IC packaging

Tue, 10 Oct 2013
Small form factor, high speed and performance, and high bandwidth capability with low battery consumption are desired traits for many packaging solutions for integrated circuits (ICs).

Power management, industrial analog units post strong gains

Fri, 10 Oct 2013
Total shipments of analog devices forecast to jump 14% in 2013.

Alpha and Omega Semiconductor introduces a new family of high performance common-drain MOSFETs

Mon, 10 Oct 2013
Alpha and Omega Semiconductor Limited this week released a new dual MOSFET family in the common-drain configuration in both DFN 5x6 and Micro-DFN 3.2x2 packages.

Scaling makes monolithic 3D IC practical

Mon, 10 Oct 2013
In the 1960s, James Early of Bell Labs proposed three-dimensional structures as a natural evolution for integrated circuits. Since then many attempts have been made to develop such a technology.

UK photonics industry must connect higher in the value chain

Wed, 10 Oct 2013
Carlos Lee, Director General of the European Photonics Industry Consortium (EPIC), moderated a discussion with executives from the UK photonics industry and filed this report.

EU project to industrialize world record high-density capacitors

Wed, 10 Oct 2013
CEA-Leti, Fraunhofer IPMS-CNT and three European companies have launched a two-year project to industrialize 3D integrated capacitors with world-record density using atomic layer deposition.

Memory materials revolution highlighted at SMC

Wed, 10 Oct 2013
While the number of materials used in semiconductor logic will increase approximately 50 percent in the transition from 32nm to 22nm production, the materials revolution in memory will be even more pronounced, challenging developers, manufacturers, equipment, and materials suppliers, according to experts speaking at the SEMI Strategic Materials Conference 2013, held in Santa Clara on October 16-17.

Micron appoints Brian Angell as VP of Advanced Controller Development

Thu, 10 Oct 2013
Micron Technology, Inc. today announced that the company has named Brian Angell, vice president, Advanced Controller Development.

MEMS devices for biomedical applications

Mon, 10 Oct 2013
Dr. Ramesh Ramadoss, Senior Manager in the MicroProbe Product Group of FormFactor Inc., provides an overview of MEMS and highlights a variety of applications in the biomedical area, including pressure sensors, inertial sensors, transducers for hearing aids, microfluidics for diagnostics and drug delivery, micromachined needles and microsurgical tools.

Managing legacy fabs and the role of secondary equipment

Wed, 10 Oct 2013
The choice between buying new systems from OEMs or fully capable refurbished gear from qualified used equipment vendors is examined.

Semiconductor industry leaders to examine the future of 3D NAND at Dec 10 event

Mon, 12 Dec 2013
Manufacturing 3D NAND designs requires overcoming formidable technical challenges to create extremely complex high-aspect-ratio structures.

Triton Microtechnologies receives funding to ramp up manufacturing of glass interposers

Tue, 10 Oct 2013
Start-up Triton Microtechnologies, a designer and manufacturer of ultra-thin glass interposers that enable advanced semiconductor-packaging solutions, has met six-month production milestones that have triggered an additional $3.2 million in funding.

Will 2014 be the Next Golden Year?

Wed, 10 Oct 2013
Some unexpected underdogs spur spending spree.

How to verify incident implant angles on medium current implants

Wed, 10 Oct 2013
Results can depend on the properties of the wafers used, the conditions of the implant, the conditions of the anneal process, and even the measurement technique.

Silicon interposers, CoWoS and microbumps

Wed, 10 Oct 2013
At the recent ECTC conference, various presentations addressed silicon interposers for 2.5D (Shinko), CoWoS reliability (TSMC) and microbumping (imec).

Toshiba launches new embedded NAND flash memory using 19nm process technology

Thu, 10 Oct 2013
Toshiba Corporation today announced the launch of new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology.

Are we using Moore's name in vain?

Tue, 11 Nov 2013
Clearly Moore's law is about cost, and Gordon Moore’s observation was that the optimum number of components (nowadays - transistors) to achieve minimum cost will double every year.

DecaWave launches industry's most precise indoor location, communication CMOS chip

Thu, 11 Nov 2013
Fabless semiconductor company DecaWave announced today its first single chip of the ScenSor wireless technology family, DW1000, which makes indoor location and communications more accurate, cost-effective and power-efficient than ever before.

SRC, Northeastern University research to increase tumble frequency range of next-generation mobile devices

Thu, 11 Nov 2013
Development of voltage-tunable radio frequency inductors boosts semiconductor and defense industry applications.

Plastic Electronics Conference to rotate between Dresden and Grenoble beginning in 2014

Thu, 11 Nov 2013
SEMI, the global trade organization representing the nano- and micro-electronic manufacturing supply chains, today announced that next year’s Plastic Electronics Conference (PE2014) will be held in Grenoble, France and alternate with Dresden, Germany in future years to better address pan-European opportunities and challenges in Plastic Electronics.

STMicroelectronics, Memoir Systems combine breakthrough memory, semiconductor process technologies

Thu, 11 Nov 2013
Efforts make embedded memory faster, cooler and simpler.

Toshiba starts shipments of CMOS image sensor for automotive view cameras

Mon, 11 Nov 2013
Toshiba Corporation today announced that started sample shipments of a VGA, 1/4 inch CMOS image sensor, “TCM5126GBA,” for automotive view cameras.

Xilinx ships industry's first 20nm all programmable product

Mon, 11 Nov 2013
Xilinx today announced first customer shipment of the semiconductor industry's first 20nm product manufactured by TSMC, and the PLD industry's first 20nm All Programmable device.

SIA awards Mike Splinter the Robert N. Noyce award

Mon, 11 Nov 2013
The Semiconductor Industry Association (SIA) today announced that Mike Splinter, former CEO and current executive chairman of the board of directors at Applied Materials, has been named the 2013 recipient of SIA's highest honor, the Robert N. Noyce Award.

FlipChip International acquires Millennium Microtech Shanghai

Tue, 11 Nov 2013
FlipChip International announced today the 100% acquisition of Millennium Microtech (Shanghai) - (MMS), a provider of fully integrated semiconductor packaging and testing services situated in the Zhang Jiang Hi- Tech Park, Pudong New Area, Shanghai, China.

STMicroelectronics teams with Yogitech to develop safety package for microcontrollers

Mon, 11 Nov 2013
STMicroelectronics and Yogitech, a provider of functional safety solutions, have signed an agreement to create a comprehensive package that will simplify the development and certification of safety-critical applications based on STM32 microcontrollers.

U.S. government awards AMD contract to research interconnect architectures

Tue, 11 Nov 2013
The DesignForward award supports the research of the interconnect architectures and technologies needed to support the data transfer capabilities in extreme-scale computing environments.

Above parity: SEMI releases October book-to-bill ratio

Wed, 11 Nov 2013
A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

SUSS MicroTec installs excimer laser stepper at Fraunhofer IZM Berlin

Wed, 11 Nov 2013
SUSS MicroTec has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.

GLOBALFOUNDRIES demonstrates model for next-generation chip packaging technologies

Thu, 11 Nov 2013
Foundry 2.0 partnership with Open-Silicon and Amkor Technology yields successful 2.5D test vehicle project.

Can Intel beat TSMC?

Mon, 11 Nov 2013
It would seem that if Intel could scale transistor cost as they have done in the last 40 years then they could win these super high volume consumer-oriented designs where cost is extremely important. And TSMC is clearly taking this seriously.

Open-Silicon and GLOBALFOUNDRIES demonstrate custom 28nm SoC using 2.5D technology

Thu, 11 Nov 2013
Open-Silicon, Inc., and GLOBALFOUNDRIES today announced the industry’s first demonstration of a functional system-on-chip (SoC) solution featuring two 28nm logic chips, with embedded ARM processors, connected across a 2.5D silicon interposer.

Unraveling the mind-body connection with power-efficient IC chip

Fri, 11 Nov 2013
Despite the advances in neuroscience research, the human brain remains a complex puzzle with questions unanswered on how it controls human behaviour, cognitive functions and movements.

Dongbu HiTek starts volume production of 5 megapixel CMOS image sensor chips

Mon, 11 Nov 2013
Dongbu HiTek today announced that it has begun volume production of 5.0 Megapixel (5M) CMOS Image Sensor (CIS) devices for Superpix Micro Technology Co., Ltd., a fabless customer based in Beijing.

2013 semiconductor equipment sales forecast $32B; strong growth forecast for 2014

Tue, 12 Dec 2013
SEMI projects that worldwide sales of new semiconductor manufacturing equipment will contract 13.3 percent to $32.0 billion in 2013.

Sankalp Semiconductor appoints Dan Clein into its management team

Tue, 12 Dec 2013
Sankalp Semiconductor Private Limited, a leading Analog Mixed-Signal services and solutions company from India, announced today the appointment of Mr. Dan Clein into its management team. Dan will be based out of the North America region.

Soitec announces high-volume manufacturing of new eSI substrates

Wed, 12 Dec 2013
Soitec, a manufacturer semiconductor materials for the electronics and energy industries, today announced it has reached high-volume manufacturing of its new Enhanced Signal Integrity (eSI) substrates, enabling cost-effective and high-performance radio-frequency (RF) devices.

Lab school brings manufacturing technologies to middle-school classrooms

Tue, 12 Dec 2013
A partnership among the University of Virginia's (UVa) Schools of Education and Engineering and the Charlottesville Public Schools has led to the launch of Buford Engineering Design Academy, a laboratory school for advanced manufacturing.

Cellphones pass PCs as biggest systems market and IC user

Tue, 12 Dec 2013
Tablets and wireless networks are expected to show highest growth rates through 2017.

Micron Technology appoints Rajan Rajgopal as VP of Quality

Wed, 12 Dec 2013
Micron Technology, Inc. today announced that the company has named Rajan Rajgopal, vice president of Quality.

Worldwide semiconductor revenue grew 5.2 percent in 2013

Wed, 12 Dec 2013
Worldwide semiconductor revenue totaled $315.4 billion in 2013, a 5.2 percent increase from 2012 revenue of $299.9 billion, according to preliminary results by Gartner, Inc.

Equipment spending down 2013; expect 33% growth in 2014

Fri, 12 Dec 2013
Fab construction projects boom in 2013 but slow in 2014.

CEA-Leti signs agreement with Qualcomm to assess sequential 3D technology

Mon, 12 Dec 2013
CEA-Leti today announced an agreement with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to assess the feasibility and the value of Leti’s sequential 3D technology.

STMicroelectronics launches new advanced energy-harvesting IC

Tue, 12 Dec 2013
STMicroelectronics is opening new avenues for energy-harvesting applications with its latest IC integrating all the functions needed to power electronic circuits and recharge batteries using either a solar cell or Thermo-Electric Generator (TEG).

Singapore-MIT Alliance for Research Technology orders EV Group automated production bonding system

Tue, 12 Dec 2013
SMART, which is a leading research center established by the Massachusetts Institute of Technology (MIT) in partnership with the National Research Foundation of Singapore, will utilize the EVG850LT system to support its advanced substrate development efforts.

SEMICON West “Call for Papers” for New Semiconductor Technology Symposium, Science Park and TechXPOTs

Tue, 12 Dec 2013
SEMI today announced a “Call for Papers” for the new Semiconductor Technology Symposium, the popular TechXPOT programs, and a new Science Park program featuring university research and advanced R&D subjects at SEMICON West, North America’s premier microelectronics event, to be held July 8-10 at the Moscone Center in San Francisco, Calif.

Micron's high-density 45nm serial NOR Flash doubles programming speed for embedded applications

Tue, 12 Dec 2013
Micron Technology, Inc. today announced the availability of 45nm Serial NOR Flash memory samples in 512Mb, 1Gb, and 2Gb densities with a standard SPI interface.

#5: Nanofluidic Channels for Lab-on-Chip

Tue, 12 Dec 2012

#10: Visualizing CBRAM Filaments

Tue, 12 Dec 2012

#1: Triangular MOSFETs with InGaAs Channels

Tue, 12 Dec 2012

#2: Thermally Stable Magnetic Tunnel Junction Memory

Tue, 12 Dec 2012

#3: TSMC’s Integrated 16nm FinFET Technology Platform

Tue, 12 Dec 2012

#4: Monolithic 3D Chip

Tue, 12 Dec 2012

#6: Novel Nanopore Sensor for DNA Sequencing

Tue, 12 Dec 2012

#7: Hybrid Nanowire/CMOS Biosensor

Tue, 12 Dec 2012

#8: 300mm wafer-scale Ge FinFET

Tue, 12 Dec 2012

#9: Record Silicon Nanowire MOSFETs

Tue, 12 Dec 2012

#11: Fastest Ge p-MOSFET

Tue, 12 Dec 2012

Slideshow: IEDM 2013 Highlights

Wed, 12 Dec 2013
This week, industry leaders and experts have gathered in Washington D.C. at the 59th annual IEEE International Electron Device Meeting (IEDM) conference.

Power modules get their own upside-down C-SAM system

Thu, 12 Dec 2013
Sonoscan has shipped the first of its new D9600Z C-SAM systems. This new model is designed expressly to facilitate the imaging of IGBT (Insulated Gate Bipolar Transistor) power modules.

Celebrating 20 years of BSIM3v3 SPICE models

Thu, 12 Dec 2013
Zhihong Liu of ProPlus Designs reflects on the history of the MOSFET SPICE model called BSIM3.

AMD and Hynix announce joint development of HBM memory stacks

Mon, 12 Dec 2013
3DIC memory, and therefore all of 2.5/3D technology, took one step closer to full commercialization last week with the HBM joint development announcement from AMD and Hynix at the RTI 3D ASIP meeting in Burlingame CA.

Micron collaborates with Broadcom to solve DRAM timing challenge

Tue, 12 Dec 2013
Micron Technology, Inc., a providers of advanced semiconductor solutions, today announced its collaboration with Broadcom Corporation to develop the industry's first solution designed for customers challenged by an intrinsic DDR3 timing parameter called tFAW, or four activate window.

MACOM successfully completes tender offer for Mindspeed Technologies

Wed, 12 Dec 2013
M/A-COM Technology Solutions Holdings, Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced that it has successfully completed its previously announced tender offer to purchase all outstanding shares of common stock of Mindspeed Technologies, Inc. for $5.05 per share in cash.

Spansion dual-quad serial flash delivers performance for graphic-rich applications

Wed, 12 Dec 2013
Universal footprint enables common pinout with current and future high-speed memory.

Intel ends 2013 with a bang

Wed, 12 Dec 2013
ABI Research verified that Intel has a leading position in the mobile processor technology race; launching the first 22nm mobile application processor.

Mentor Graphics announces president and managing director for Japan

Fri, 12 Dec 2013
Mentor Graphics Corporation yesterday announced Greg Helton as president and managing director for Mentor Graphics Japan.

Micron revenue surges after Elpida deal officially closes

Mon, 12 Dec 2013
Micron Technology surged 130 percent in revenue during the third quarter as it finally closed its acquisition of bankrupt Elpida Memory of Japan, a vigorous ascent that also propelled the total market for dynamic random access memory (DRAM) to its best performance yet in 11 quarters.

Samsung releases 8Gb mobile DRAM

Fri, 1 Jan 2014
Samsung announced today that it has developed the industry’s first eight gigabit, low power double data rate 4, mobile DRAM.

Architecture from STMicroelectronics leads industry transition to 64-bit computing

Mon, 1 Jan 2014
STMicroelectronics has released details of its STi8K architecture addressing future Systems-on-Chips (SoCs).

Toshiba announces "Bright Mode" for CMOS image sensors

Tue, 1 Jan 2014
Toshiba Corporation today announced the development of “Bright Mode,” a CMOS image sensor technology that allows smartphones and tablets to record full HD video at 240 frames per second (fps), the industry’s highest frame rate. “Bright Mode” realizes high quality slow motion playback.

TOWA launches new Packaging Development Center

Thu, 1 Jan 2014
The TOWA Corporation of Japan, a supplier of packaging equipment for semiconductor, electronics and LED industries, has decided to expand their activities in Europe with an Innovation Center for Packaging Development and announced the launch of TOWA Europe B.V.

TSMC, Samsung and Micron top list of IC industry capacity leaders

Thu, 1 Jan 2014
The top 10 companies now hold 67% of worldwide IC industry capacity, up from 54% in 2009.

"Crisis? What Crisis?": New paradigm adjustments for capacity and equipment spending

Thu, 1 Jan 2014
Worldwide, the semiconductor industry growth rate back in 1973 was about 30 percent and slipped into 1975 with negative sales growth rates.

6) ZAGG Inc introduces new range of portable batteries and power products

Sun, 1 Jan 2010

9) Conexant’s new voice input processor for Smart TVs provides smarter audio experience

Sun, 1 Jan 2010

Slideshow: CES 2014 Highlights

Fri, 1 Jan 2014
This week in Las Vegas, the 2014 International Consumer Electronics Show focused on the Internet of Things, displaying many connected gadgets and services.

3) Invensas shows new xFD-based customer products with Etron Technology

Sun, 1 Jan 2010

Imec, AlixPartners to develop model for lowering costs of advanced semiconductor tech

Mon, 1 Jan 2014
Patterning options for N10/N7 nodes, advanced packaging solutions and 3D NAND memory to be targeted.

Progress on 450mm at G450C

Thu, 1 Jan 2014
At Semicon Europa, Paul Farrar, general manager of G450C, provided an update on the consortium’s progress in demonstrating 450mm process capability. He said 25 tools will be installed in the Albany cleanroom by the end of 2013, progress has been made on notchless wafers with a 1.5mm edge exclusion zone, they have seen significant progress in wafer quality, and automation and wafer carriers are working.

EV Group ships temporary bonding/debonding system to Fraunhofer ISIT

Tue, 1 Jan 2014
EV Group today announced that the Fraunhofer Institute for Silicon Technology (ISIT) has purchased an EVG 850TB/DB fully automated bonding/debonding equipment solution.

Imec celebrates 30 years

Tue, 1 Jan 2014
Nanotechnology research and development center imec, today announced the celebration of its 30th anniversary.

Economic recovery and pervasive computing to propel semiconductor manufacturing supply chain

Tue, 1 Jan 2014
Macroeconomic and microelectronic industry growth opportunities and innovation challenges underscored diverse perspectives from analysts, economists, technologists, semiconductor manufacturers and supply chain executives speaking at the SEMI Industry Strategy Symposium (ISS) that opened yesterday.

Microprocessor sales growth will strengthen slightly in 2014

Tue, 1 Jan 2014
A modest recovery in personal computers this year is expected to slightly strengthen overall sales growth in microprocessors, which is forecast to rise 9 percent in 2014 to a record-high $66.7 billion compared to $61.0 billion in 2013.

Xilinx and University of Florida honored with SEMI Award for advancements in interposers and CMOS fab process

Wed, 1 Jan 2014
SEMI today announced that two teams — from the University of Florida and Xilinx — are recipients of the 2013 SEMI Award for North America.

Semiconductor plastic packaging materials market to approach $21B by 2017

Wed, 1 Jan 2014
The market for semiconductor packaging materials, including thermal interface materials, is expected to maintain its $20 billion value through 2017, despite shifts away from the use of precious metals such as gold in wire bonding.

ARM and UMC extend 28nm partnership

Thu, 1 Jan 2014
ARM and global semiconductor foundry UMC this week announced an agreement to offer the ARM Artisan physical IP platform along with POP IP for UMC’s 28nm high-performance low-power (HLP) process technology.

3DIC market to reach $7.52B by 2019

Thu, 1 Jan 2014
The market for 3DICs globally is forecast to reach USD 7.52 billion by 2019, according to a new market report published by transparency market research.

Intel vs. TSMC: An Update

Tue, 1 Jan 2014
On January 14, 2014, we read on the Investors.com headlines page - Intel Seen Gaining Huge Pricing Advantage Over TSMC. Just three days later comes the responding headline: TSMC: We're "Far Superior" to Intel and Samsung as a Partner Fab.

Besi and Imec collaborate on thermocompression technology

Tue, 1 Jan 2014
Today, at the SEMI European 3D TSV Summit, nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput.

Natural 3D counterpart to graphene discovered

Tue, 1 Jan 2014
The discovery of what is essentially a 3D version of graphene promises exciting new things to come for the high-tech industry, including much faster transistors and far more compact hard drives.

Optical Interconnects Conference 2014 to be held in Coronado, CA

Tue, 1 Jan 2014
The 2014 Optical Interconnects Conference, sponsored by the IEEE Photonics Society, announces a Call for Papers for the 25th anniversary of this premier conference, dedicated to bringing advanced interconnect technologies from research labs to commercial realization.

Green manufacturing: What you need to know

Thu, 1 Jan 2014
Green is the color for the decade and future decades as each country is developing its own standards for energy consumption and implementing its green initiatives.

A bilayer temporary bonding solution for 3D-IC TSV fabrication

Thu, 1 Jan 2014
New technology eliminates the need for specialized equipment for wafer pre- or post-treatment.

Substrate impact on 2.5/3D IC costs

Thu, 1 Jan 2014
At the recent Georgia Tech Global Interposer Technology (GIT) Workshop in Atlanta, the pervasive theme appeared to be whether a change in substrate is required to lower overall costs and help drive HVM (high volume manufacturing) applications.

FinFET evolution for the 7nm and 5nm CMOS technology nodes

Thu, 1 Jan 2014
In addition to extending the fin-based design investments, augmenting the FinFET for improved performance allows an evolution of the process infrastructure for a few more nodes.

Synthetic diamond’s role in thermal management

Thu, 1 Jan 2014
Synthetic diamond is ideally suited for thermal management of semiconductor packaging, as it combines exceptionally high thermal conductivity with electrical isolation.

Keys to success: Testing in the New Mobile World

Thu, 1 Jan 2013
The semiconductor industry is moving from a PC-centric, digital era to a communication and mobile world.

2014 Outlook: An era of unprecedented change

Fri, 1 Jan 2014
We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.

Cyclical upturn continues in 2014: Positive yet cautious expectations persist

Thu, 1 Jan 2013
In 2013, the IC industry emerged from a difficult 5-year period of minimal growth and started on its next cyclical upturn, a welcome piece of news.

Outlook for semiconductors and the value chain in 2014

Thu, 1 Jan 2013
We approach 2014 with a combination of positive policy, financial, and economic forces that will push world growth up to a +3% range.

Coming year promises increased capital spending and continued need for effective industry collaboration

Thu, 1 Jan 2013
For most of the past 15 years, the industry has displayed a fairly predictable pattern of fab equipment spending, characterized generally by two years of decline followed by two years of positive growth.

The shift to materials-enabled 3D

Thu, 1 Jan 2013
Innovations in mobile computing and communications will continue to be a driving factor for the semiconductor equipment industry.

Innovation and collaboration key in 2014

Thu, 1 Jan 2013
As far as the outlook goes for 2014-2015, investments coming from the semiconductor and microelectronics industries are going to be pretty robust.

Can we keep on benefiting from Moore’s Law?

Thu, 1 Jan 2013
For almost five decades, performance improvements and cost reduction of ICs have been cornerstones of the growth of the semiconductor industry.

Key market and technology trends in the sub-20nm era

Thu, 1 Jan 2013
Keeping up with Moore’s Law has always required significant investment and ingenuity, and this era brings additional challenges in device structures, materials and methodologies.

Challenges and innovations on front-end and 3D TSV

Thu, 1 Jan 2013
Looking at 2014, we see challenges and innovations in both the front-end semiconductor and 3D TSV markets.

Book-to-bill ratio continues to improve

Fri, 1 Jan 2014
The December three-month average bookings were at the highest level since June 2012 — a positive sign for the 2014 spending outlook.

Apple and Samsung are top OEMs, again, in semiconductor spending for 2013

Mon, 1 Jan 2014
Apple and Samsung remained the world’s largest buyers of semiconductor chips in 2013, but the intensifying battle between the two for the hearts and minds of consumers in their product offerings could presage another mighty showdown this year for the top ranking, according to a new report from IHS Technology.

Mobile PCs, smartphones will be top revenue opportunities for IC suppliers in high-speed wireless device market

Mon, 1 Jan 2014
Mobile PCs and smartphones will represent the top revenue opportunities for high-speed wireless integrated circuit (IC) suppliers by 2018, as these devices are projected to be the highest-volume applications in this market over the next five years.

Cooling microprocessors with carbon nanotubes

Tue, 1 Jan 2014
Researchers with the U.S. Department of Energy (DOE)’s Lawrence Berkeley National Laboratory (Berkeley Lab) have developed a “process friendly” technique that would enable the cooling of microprocessor chips through carbon nanotubes.

Slimpin promoted to director in SwRI’s Applied Physics Division

Tue, 1 Jan 2014
David G. Slimpin has been promoted to director of the Electronics Systems and Robotics Department in the Applied Physics Division at Southwest Research Institute (SwRI). He was previously a program manager in the department.

Crocus licences MLU technology to ARM

Wed, 1 Jan 2014
Crocus Technology today announces it has licensed its Magnetic Logic Unit technology to ARM.

New "photodetector" nanotechnology allows photos in near darkness

Wed, 1 Jan 2014
Dark and blurry low light photos could soon be a thing of the past, thanks to the development of game-changing ultrathin “nanosheets,” which could dramatically improve imaging technology used in everything from cell phone cameras, video cameras, solar cells, and even medical imaging equipment such as MRI machines.

Novoset, LLC and Lonza introduce new, ultra-low dielectric loss and high temperature materials

Thu, 1 Jan 2014
Novoset, LLC and Lonza are pleased to announce the introduction of Primaset ULL-950 and Primaset HTL-300 ultra-low loss and high temperature thermoset materials for the telecommunication and advanced semiconductor packaging industries.

2014 capital spending up in Korea; SEMICON Korea to address mobile innovation

Fri, 1 Jan 2014
With Korea expected to be the second largest region for fab construction spending in 2014, industry leaders will convene at SEMICON Korea 2014 in Seoul on February 12-14 to discuss the latest trends and technologies shaping the future of microelectronics manufacturing.

Global wafer-level packaging equipment market to grow at a CAGR of 2.9

Wed, 2 Feb 2014
Analysts at ReportsNReports.com forecast the global wafer-level packaging equipment market to grow at a CAGR of 2.9 percent over the period 2013-2018.

The 2014 European 2.5/3DIC Summit

Thu, 2 Feb 2014
SEMI’s second annual European 3D TSV Summit was held in Grenoble in late January. Three hundred and twenty attendees met to discuss the status of 2.5/3DIC and other advanced packaging technologies.

Silicon reclaim wafer market increased 14% in 2013

Thu, 2 Feb 2014
The worldwide reclaim wafer market is estimated at $460 million in 2013 and is forecasted to reach $493 million by 2015, according to SEMI.

Executives debate innovation drivers and cost reduction in microelectronics supply chain

Thu, 2 Feb 2014
The closing Executive Panel discussion at the SEMI Industry Strategy Symposium on January 15 provoked diverse views on the drivers and future of innovation in the microelectronics manufacturing supply chain.

EV Group unveils high-volume manufacturing photoresist processing system

Tue, 2 Feb 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing.

SPTS Technologies opens new office in Korea

Thu, 2 Feb 2014
SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets today announced the opening of a new office in Korea.

Honeywell releases new RadLo low alpha plating anodes for semiconductor packaging applicatons

Fri, 2 Feb 2014
Honeywell announced today that it has introduced new RadLo low alpha plating anodes based on proprietary technology to help reduce alpha particle radiation that can lead to data errors in semiconductors.

Renesas Electronics develops industry's first 28nm embedded flash memory tech for microcontrollers

Tue, 2 Feb 2014
Renesas Electronics Corporation today announced that it has developed the industry's first 28nm flash memory intellectual property (IP) for microcontrollers (MCUs) using a 28nm process technology.

Breakthrough development in 1D-1R memory cell array

Tue, 2 Feb 2014
Dr. Tae-Wook Kim at KIST announced their successful development of a 64-bit memory array using flexible and twistable carbon nano material and organo-polymer compound, which can accurately store and delete data.

World's first 79 GHz radar transmitter in 28nm CMOS

Tue, 2 Feb 2014
Imec, in collaboration with Vrije Universiteit Brussel, Brussels, Belgium, presents the world’s first 79 GHz radar transmitter implemented in plain digital 28nm CMOS.

The most expensive SRAM in the world - 2.0

Thu, 2 Feb 2014
Embedded SRAM scaling is broken and, with it, Moore's Law.

Semiconductor industry posts record sales in 2013

Thu, 2 Feb 2014
The Semiconductor Industry Association announced that worldwide semiconductor sales for 2013 reached $305.6 billion, the industry’s highest-ever annual total and an increase of 4.8 percent from the 2012 total of $291.6 billion.

Epoxy Technology and John P. Kummer Group announce a new specialty adhesive packaging company

Thu, 2 Feb 2014
Epoxy Technology, Inc. and John P. Kummer Group announce the formation of a new specialty adhesive packaging company, Epoxy Technology Europe Ltd (ETEL).

Samsung and UCSF partner to accelerate new innovations in preventive health technology

Fri, 2 Feb 2014
Samsung Electronics Co., Ltd., and the University of California, San Francisco (UCSF) announced a partnership to accelerate validation and commercialization of promising new sensors, algorithms, and digital health technologies for preventive health solutions.

SMIC and JCET establish joint venture for 12 inch bumping and testing

Fri, 2 Feb 2014
Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, and Jiangsu Changjiang Electronics Technology Co., Ltd., the largest packaging service provider in China, jointly announced today a joint venture for 12" bumping and related testing.

North American semiconductor equipment industry posts January 2014 book-to-bill ratio of 1.04

Fri, 2 Feb 2014
A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

Call for Papers open for SEMICON Europa 2014, Plastics Electronics Conference

Mon, 2 Feb 2014
SEMI announced the “Call for Papers” for technical sessions and presentations for SEMICON Europa 2014 which takes place October 7-9 in Grenoble, France.

Moore's Law has stopped at 28nm

Wed, 3 Mar 2014
While many have recently predicted the imminent demise of Moore’s Law, we need to recognize that this actually has happened at 28nm.

Global failure analysis equipment market to grow at CAGR of 8.8% from 2013 to 2019

Wed, 3 Mar 2014
Rapid growth in nanotechnology coupled with growth in medical applications in the Asia Pacific region has fueled the growth of failure analysis equipment market.

Samsung expands its 28nm technology offerings

Thu, 3 Mar 2014
Samsung Electronics, Co., Ltd. today announced that it has expanded its 28nm technology offerings with the addition of RF capabilities.

New research could help make "roll-up" digital screens a reality for all

Thu, 3 Mar 2014
Researchers from the University of Surrey worked together with scientists from Philips to further develop the 'Source-Gated-Transistor' (SGT) - a simple circuit component invented jointly by the teams.

Micron appoints Darren Thomas as VP of Storage Business Unit

Thu, 3 Mar 2014
Micron Technology, Inc. this week announced that Darren Thomas has been named as vice president of Micron's Storage business unit.

Weaker yen impact on the 2013 material and equipment market size

Thu, 3 Mar 2014
Semiconductor industry revenues reported by the World Semiconductor Trade Statistics (WSTS) reached a record high in 2013 with global revenues totaling over $305 million.

MACOM introduces new addition to GaN in Plastic series

Fri, 3 Mar 2014
M/A-COM Technology Solutions Inc. (MACOM), a supplier of high performance RF, microwave, and millimeter wave products, introduced today its newest addition to the GaN in Plastic series.

Plug-and-play test strategy for 3D ICs

Tue, 3 Mar 2014
Three-dimensional (3D) ICs, chips assembled from multiple vertically stacked die, are coming. They offer better performance, reduced power, and improved yield.

Samsung now mass producing the most advanced 4Gb DDR3 using 20nm process technology

Tue, 3 Mar 2014
Samsung Electronics today announced that it is mass producing the most advanced DDR3 memory, based on a new 20nm process technology, for use in a wide range of computing applications.

STATS ChipPAC introduces breakthrough manufacturing method for wafer level packaging

Wed, 3 Mar 2014
STATS ChipPAC, a provider of advanced semiconductor packaging and test services, has designed and implemented an innovative new manufacturing method that is a significant paradigm shift from conventional wafer level manufacturing.

Advancing the Russian microelectronics industry — SEMICON Russia 2014

Wed, 3 Mar 2014
On May 13-15, the key industry players, science institutes and innovation business representatives will gather in Moscow at SEMICON Russia — the premier Russian semiconductor exhibition and conference.

Imec achieves record 8.4 percent conversion efficiency in fullerene-free organic solar cell

Wed, 3 Mar 2014
In this week’s Nature Communications, imec presents the development of fullerene-free organic photovoltaic (OPV) multilayer stacks achieving a record conversion efficiency of 8.4 percent.

SanDisk files lawsuit against SK Hynix for theft of trade secrets

Thu, 3 Mar 2014
These actions relate to the theft of trade secrets related to NAND flash technology by a former engineer of SanDisk who left the company in 2008 to work for SK Hynix.

Silicon Innovation Forum to expand in 2014

Thu, 3 Mar 2014
Coordinated by SEMI, the Silicon Innovation Forum is organized by leading strategic investment groups in the global semiconductor industry including: Applied Ventures, Dow Ventures, Intel Capital, Micron Ventures, TEL Venture Capital, BASF Ventures, and Samsung Ventures.

Toshiba brings civil suit against SK Hynix

Fri, 3 Mar 2014
Toshiba Corporation announced that it has brought a civil suit against Korea’s SK Hynix Inc. at the Tokyo District Court, under Japan’s Unfair Competition Prevention Act.

Mega Fluid Systems and Entrepix join forces to offer complete CMP system

Mon, 3 Mar 2014
Mega Fluid Systems Inc., a supplier of chemical and slurry delivery equipment, and Entrepix Inc., a provider of chemical mechanical polishing (CMP) equipment and process services, today announced a partnership agreement.

EV Group establishes China headquarters in Shanghai

Tue, 3 Mar 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has opened a new, wholly owned subsidiary in Shanghai, called EV Group China Ltd.

MKS to acquire Granville-Phillips division of Brooks Automation

Tue, 3 Mar 2014
MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, today announced it has agreed to purchase the assets of Granville-Phillips, a division of Brooks Automation, Inc., for $87 million in cash.

SRC, UC Berkeley research promises to revolutionize electronic circuit design

Wed, 3 Mar 2014
Research from University of California, Berkeley scientists sponsored by Semiconductor Research Corporation (SRC) promises to revolutionize portable radio frequency (RF) electronics and communication systems via advancements in on-chip inductors by leveraging embedded nanomagnets.

M+W Group and Siemens to collaborate on process control technology solution for battery production

Wed, 3 Mar 2014
Siemens Industry Automation Division and M+W Group have joined forces with the aim to advance the development of production technology for battery manufacturing and develop a complete control technology solution for the mass production of large-size batteries.

MediaTek to deploy Synopsys IC Compiler for hierarchical design implementation

Wed, 3 Mar 2014
Synopsys, Inc. today announced that MediaTek Inc., a fabless semiconductor company for wireless communications and digital multimedia solutions, has initiated deployment of Synopsys' IC Compiler place and route solution for hierarchical design implementation.

Applied Materials honored as a 2014 World's Most Ethical Company

Thu, 3 Mar 2014
Applied Materials, Inc. today announced that it was named a 2014 World's Most Ethical Company by the Ethisphere Institute, an independent center of research promoting best practices in corporate ethics and governance.

Mentor Graphics acquires Berkeley Design Automation

Fri, 3 Mar 2014
Mentor Graphics Corp. today announced that it has acquired Berkeley Design Automation, Inc. BDA addresses nanometer circuit design challenges via its Analog FastSPICE unified verification platform and exceptional vertical-application expertise.

Enabling mobility for IoT with advanced semiconductor technology - at SEMICON Singapore 2014

Thu, 3 Mar 2014
SEMICON Singapore will focus on the advanced technology developments to enable mobility for the Internet of Things (IoT).

Highlights from the IMAPS Device Packaging Conference

Mon, 3 Mar 2014
The annual IMAPS Device Packaging Conference in Ft McDowell AZ is always a source for the latest packaging information.

Altera and Intel extend manufacturing partnership to include development of multi-die devices

Wed, 3 Mar 2014
Collaboration will optimize integration of 14nm Tri-Gate Stratix 10 FPGAs with heterogeneous technologies into a single system-in-a-package.

eInfochips opens new design services specializing in 16nm geometry

Wed, 3 Mar 2014
eInfochips, a semiconductor and product engineering company, today launched design services for chips based on 16nm geometry.

Heat-conducting polymer cools hot electronic devices at 200 degrees C

Mon, 3 Mar 2014
Polymer materials are usually thermal insulators. But by harnessing an electropolymerization process to produce aligned arrays of polymer nanofibers, researchers have developed a thermal interface material able to conduct heat 20 times better than the original polymer. The modified material can reliably operate at temperatures of up to 200 degrees Celsius.

SEMATECH announces leadership changes

Mon, 3 Mar 2014
SEMATECH, the global consortium of semiconductor manufacturers, announced today that Ronald Goldblatt, vice president of Technical Strategy and Operations, has been appointed by the board of directors as acting president and chief executive officer, effective immediately.

Researchers improve performance of III-V nanowire solar cells on graphene

Tue, 4 Apr 2014
Researchers at the University of Illinois at Urbana-Champaign have achieved new levels of performance for seed-free and substrate-free arrays of nanowires from class of materials called III-V (three-five) directly on graphene

MACOM announces IP licensing program for GaN-on-Si technology

Tue, 4 Apr 2014
M/A-COM Technology Solutions Inc. this week announced an IP licensing program for Gallium Nitride (GaN) on Silicon technology.

SureCore's 28nm silicon tests confirm world leading power efficiency

Tue, 4 Apr 2014
SureCore Ltd has today announced that early testing of its innovative low power SRAM design confirms its simulations that deliver in excess of 50 percent power savings over other SRAM technologies.

ON Semiconductor to acquire Trusense Imaging, Inc.

Thu, 4 Apr 2014
ON Semiconductor today signed a definitive agreement to acquire Truesense Imaging, Inc., a provider of high-performance image sensor devices addressing a wide range of industrial end-markets including machine vision, surveillance, traffic monitoring, medical and scientific imaging, and photography.

The sustainable manufacturing imperative

Thu, 4 Apr 2014
While sometimes seen as a social, legal and regulatory obligation, sustainability is increasingly considered a differentiating factor in global competitiveness relative to the technologies and products being provided.

2013: A year in review

Fri, 4 Apr 2014
2013 was a record year in terms of semiconductor device revenues; the industry finally exceeded the long elusive $300 billion mark, registering almost 5 percent growth according to the SIA.

ROHM Semiconductor and imec join forces for ultra-low power radio R&D

Mon, 4 Apr 2014
Nanoelectronics research center imec and ROHM Semiconductor Co. Ltd., a world-leading supplier of electronic components, announced today that they have entered into a strategic partnership for research collaboration on ultra-low power (ULP) radio technology for small battery-operated wireless devices.

SEMI reports 2013 global semiconductor materials sales of $43.5B USD

Mon, 4 Apr 2014
The global semiconductor materials market decreased 3 percent in 2013 compared to 2012 while worldwide semiconductor revenues increased 5 percent.

Global Semiconductor Alliance celebrates 20 years of industry collaboration

Tue, 4 Apr 2014
The Global Semiconductor Alliance (GSA) is celebrating 20 years of industry collaboration this year.

February semiconductor sales up 11.4 percent compared to last year

Wed, 4 Apr 2014
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $25.87 billion for the month of February 2014, an increase of 11.4 percent from February 2013 when sales were $23.23 billion.

SEMI announces Innovation Village at SEMICON Europa 2014

Wed, 4 Apr 2014
After the successful premier of a program to connect early-stage companies with strategic investors and venture capitalists (VCs) in the U.S., SEMI is expanding the program to Europe as part of SEMICON Europa 2014 in Grenoble, France (October 7-9).

Dynaloy scientists to highlight time- and money-saving benefits of new single wafer cleaning technology

Wed, 4 Apr 2014
Scientists from Dynaloy, LLC and EV Group will explain a new, one-step cleaning process for removing negative dry film and negative spin-on film photoresist on April 24, 2014 at the SEMATECH Surface Preparation and Cleaning Conference in Austin, Texas.

Deca Technologies ships 100-millionth wafer-level packaged component

Wed, 4 Apr 2014
Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth component.

In the permanent bonding market, EV Group is leading, Applied Materials and Tokyo Electron are merging

Fri, 4 Apr 2014
Permanent bonding technology is a key process for a wide range of applications in the semiconductor industry such as MEMS, advanced packaging, LED devices, and SOI substrate applications.

SEMI announces 2nd Vietnam Semiconductor Strategy Summit

Fri, 4 Apr 2014
Following the successful inaugural event in 2013, the 2nd annual SEMI Vietnam Semiconductor Strategy Summit will be held September 16-17, 2014 at the InterContinental Asiana Saigon Hotel in Ho Chi Minh City.

Altera and TSMC collaborate to bring advanced packaging technology to Arria 10 FPGAs and SoCs

Mon, 4 Apr 2014
Altera Corporation and TSMC today announced the two companies have worked together to bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20 nm Arria 10 FPGAs and SoCs.

Cadence to acquire Jasper Design Automation

Mon, 4 Apr 2014
Cadence Design Systems, Inc. today announced plans to acquire Jasper Design Automation, Inc., a provider of formal analysis solutions, for approximately $170 million in cash.

New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

Tue, 4 Apr 2014
The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format.

STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

Tue, 4 Apr 2014
Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas' Bond Via Array (BVATM) technology for next generation smartphone and tablet customers.

Contour Semiconductor names former Intel exec as new CEO

Tue, 4 Apr 2014
Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.

Spansion adds to flash memory portfolio

Thu, 4 Apr 2014
Spansion is adding three new Serial NOR and three new NAND memory densities specifically qualified to meet the extended temperature ranges and stringent quality requirements of the automotive industry.

SEMICON Southeast Asia to be launched in 2015

Fri, 4 Apr 2014
Recognizing the changing dynamics of the microelectronics industry in Southeast Asia, SEMI today announced the expanded scope of its industry-leading SEMICON regional exposition which will now rotate between Singapore and other locations within Southeast Asia.

MACOM launches new 55 W GaN on SiC pulsed power transistor

Mon, 4 Apr 2014
M/A-COM Technology Solutions Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced a new GaN on SiC HEMT Pulsed Power Transistor for civilian and military radar pulsed applications.

Scaling to 5nm: A plethora of paths

Mon, 4 Apr 2014
Previous semiconductor technology generations developed more clearly defined “winners” in terms of process technologies and materials choices.

Graphene is only as strong as weakest link

Tue, 4 Apr 2014
There is no disputing graphene is strong. But new research by Rice University and the Georgia Institute of Technology should prompt manufacturers to look a little deeper as they consider the miracle material for applications.

Micron releases new SATA solid state drive

Tue, 4 Apr 2014
Micron Technology, Inc. this week announced a new enterprise-class solid state drive (SSD) designed specifically for data center storage platforms.

FinFET on SOI: Potential becomes reality

Fri, 2 Feb 2014
We report here empirical results demonstrating the electrical benefits of SOI-based FinFETs. There are benefits inherent in the elimination of dopant as the means to establish the effective device dimensions.

3D NAND: To 10nm and beyond

Fri, 2 Feb 2014
In launching the iPod music player, Apple bumped consumption of NAND flash – a type of non-volatile storage device – driving down cost and paving the way for the growth of the memory technology into what is now a multibillion dollar market, supplying cost-effective storage for smart phones, tablets and other consumer electronic gadgets that do not have high density requirements.

Entegris completes acquisition of ATMI

Wed, 4 Apr 2014
Entegris, Inc. today announced that it has completed its acquisition of ATMI, Inc., creating a supplier of products and materials for semiconductor and other advanced manufacturing.

Samsung's 14nm finFET process technology ecosystem solidly in place for mobile consumer and SoC applications

Mon, 6 Jun 2014
Samsung today announced that the IP and design enablement ecosystem for its foundry’s 14nm FinFET process technology is firmly in place as customers begin their early design work.

Ziptronix licenses ZiBond to IO Semiconductor for RF applications

Wed, 4 Apr 2014
Ziptronix Inc., a provider of patented, low-temperature direct bonding technology for 3D integration, today announced a limited exclusive patent licensing agreement with IO Semiconductor (IOsemi) for application of its ZiBond technology for use in RF front-end devices for consumer mobile products.

Qualcomm elects Harish Manwani to board of directors

Mon, 5 May 2014
Qualcomm today announced the election of Harish Manwani to its Board of Directors. Manwani brings more than 35 years of consumer product and global management experience, and currently serves as the Chief Operating Officer at Unilever PLC.

Intel architecture fuels new wave of Chrome devices

Tue, 5 May 2014
Intel Corporation and other companies today introduced a new lineup of Chrome devices, including the first designs using Intel Celeron processors based on the Bay Trail-M system-on-chip (SoC).

Intel hires Steven Fund as new chief marketing officer

Mon, 5 May 2014
Intel Corporation today announced it has named Steven Fund, a senior industry executive with extensive brand and marketing experience, to the post of corporate vice president and Chief Marketing Officer reporting directly to Intel CEO Brian Krzanich.

Peregrine Semiconductor ships first UltraCMOS 10 production units

Tue, 5 May 2014
With partner GLOBALFOUNDRIES, the company also announces the completion of product and process qualification for the advanced RF SOI technology.

Microchip introduces 64-Mbit parallel Flash memory device on advanced process technology

Tue, 5 May 2014
Microchip Technology Inc., a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today introduced a new parallel Flash memory device.

Avago completes acquisition of LSI

Tue, 5 May 2014
Avago Technologies Limited and LSI Corporation today announced Avago has completed its acquisition of LSI Corporation for $11.15 per share in an all-cash transaction valued at approximately $6.6 billion.

Jordan Valley Semiconductors wins more market share in advanced wafer level packaging

Thu, 7 Jul 2014
Jordan Valley Semiconductors Ltd., a supplier of X-ray based metrology tools for advanced semiconductor manufacturing lines, today announced that its micro-spot X-ray Fluorescence (µXRF) metrology tool has been qualified for production monitoring of advanced Wafer Level Packaging (WLP) processes, by another memory player.

GlobalFoundries introduces 55nm automotive-specific advanced semiconductor manufacturing platform

Wed, 5 May 2014
GLOBALFOUNDRIES today introduced an optimized semiconductor manufacturing platform aimed specifically at meeting the stringent and evolving needs of the automotive industry.

SRC and UC Berkeley pursue more cost-effective approach to 3D chip integration

Wed, 5 May 2014
University of California, Berkeley researchers sponsored by Semiconductor Research Corporation (SRC) are pursuing a novel approach to 3D device integration that promises to lead to advanced mobile devices and wearable electronics featuring increased functionality in more low-profile packages.

First quarter semiconductor trends and update

Thu, 5 May 2014
Given the slow economic growth in the U.S. during the first quarter, coupled with challenging geo-political developments around the world,uncertainty once again permeates the industry outlook for the year.

Taking the lead out of a promising solar cell

Fri, 5 May 2014
Environmentally friendly solar cell pushes forward the "next big thing in photovoltaics."

Applied Materials introduces the biggest materials change to interconnect technology in 15 years

Tue, 5 May 2014
Applied Materials, Inc. today announced its Applied Endura Volta CVD Cobalt system, the only tool capable of encapsulating copper interconnects in logic chips beyond the 28nm node by depositing precise, thin cobalt films.

Mentor Graphics launches MicReD industrial power tester for power cycle testing of electronic components

Tue, 5 May 2014
Mentor Graphics Corporation today announced the new MicReD Industrial Power Tester 1500A for power cycling and thermal testing of electronics components to simulate and measure lifetime performance.

New policy helps combat counterfeit semiconductors

Wed, 5 May 2014
A newly finalized Department of Defense (DoD) rule reduces the risk of counterfeit semiconductor products being used by our military by implementing needed safeguards in the procurement of semiconductors and other electronic parts.

Improving financial predictability – is it chasing a mirage?

Thu, 5 May 2014
There is continued evidence that despite spending several millions on IT transformations, improving internal planning processes, maturing supply chains, and streamlining product development processes- several companies still struggle with predicting their financial and operational performance.

Memory design challenges require giga-scale SPICE simulation

Thu, 5 May 2014
Embedded memory is now consuming most of the area on an SoC chip. Complexity and circuit size are only growing, which means smaller process geometries, larger designs, and tighter design margins.

New materials and processes for advanced interconnects

Fri, 5 May 2014
Although on-chip interconnects have not been scaling at the same speed as other parts of the chip, new capabilities enabled by graphene and CNTs, among other materials, could soon change that.

Towards all solid-state 3D thin-film batteries for durable and fast storage

Fri, 5 May 2014
One way to make Li-ion batteries more durable, safer, smaller and in particularly faster, is a transition towards all solid-state 3D thin-film Li-ion batteries.

GLOBALFOUNDRIES and Samsung join forces on 14nm finFETs

Thu, 4 Apr 2014
Fabless companies could skip the 20nm node and move straight to 14nm FinFETs. That is the hope of GLOBALFOUNDRIES and Samsung who are announcing a joint program that offers a single process design kit (PDK) and manufacturing at four different fabs with identical processes.

3D EDA brings together proven 2D solutions

Fri, 3 Mar 2014
With anticipated economic limits to the continuation of Moore’s Law now on the horizon, it seems that moving into the 3rd dimension (3D) by stacking multiple layers of integrated circuits (IC) will be the ultimate expression of CMOS technology.

Domestic outsourcing: A key component in successful reshoring

Fri, 5 May 2014
After nearly a quarter of a century, the off-shoring manufacturing trend that decimated the U.S. manufacturing sector and played a significant role in the slow pace of the current economic recovery seems to be ending.

Brewer Science unveils Apogee temporary wafer bonder

Mon, 5 May 2014
Brewer Science, Inc., a supplier of thin-wafer handling technology, materials, and equipment to the microelectronics industry, today unveiled the Brewer Science Apogee bonder for temporary wafer bonding applications.

SMIC and other groups collaborate to setup the "IC Advanced Technology Research Institute"

Mon, 5 May 2014
China's, largest and most advanced semiconductor foundry, today announced that SMIC, Wuhan Xinxin, Tsinghua University, Beijing University, Fudan University and the Chinese Academy of Sciences and Microelectronics have collaborated to setup the "IC Advanced Technology Research Institute" to create the most advanced IC technology research and development institution in China.

MediaTek, SK Hynix, AMD, and Micron sales surge in first quarter

Mon, 5 May 2014
Top 20 ranking shows that semiconductor industry company consolidation continues to accelerate.

What is interconnect and why is it so important?

Mon, 5 May 2013

Graphene Experimentally Demonstrated to have Lower Resistivity than Copper

Mon, 5 May 2013

Mean Free Path for Vertical Carbon Nanotube Interconnects Approaches Copper

Mon, 5 May 2013

Experimental Demonstration of Monolithic 3D-IC Technology

Mon, 5 May 2013

Process Integration of 3D Capacitors into 22nm Interconnect Stacks

Mon, 5 May 2013

Cobalt and Silicon Nitride Barrier Cap Films for Copper Low k Interconnects

Mon, 5 May 2013

Slideshow: What to look for at IITC 2014

Tue, 5 May 2014
The 17th annual IITC will be held May 21 – 23, 2014 in conjunction with the 31st AMC at the Doubletree Hotel in San Jose, California.

Near-Zero Keep-Out Zone for Through Silicon Via Technology

Mon, 5 May 2013

ON Semiconductor introduces new family of low voltage power MOSFETs

Tue, 5 May 2014
ON Semiconductor has introduced a new family of six N-channel MOSFETS that have been designed and optimized to deliver efficiency.

Mentor Graphics acquires Nimbic

Tue, 5 May 2014
Mentor Graphics Corp. today announced that it has acquired Nimbic, Inc., a provider of Maxwell-accurate, 3D full-wave electromagnetic (EM) simulation solutions.

DAC panels tackle giga-scale design challenges, semiconductor market in China

Wed, 5 May 2014
The ProPlus blog here on Solid State Technology has looked at giga-scale design challenges and, this year, so will the Design Automation Conference (DAC).

SPTS Technologies announces the Omega Rapier XE System for 300mm wafer silicon etch processing

Thu, 5 May 2014
SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the launch of its Rapier XE system for 300mm wafer silicon etching.

Microchip Technology to acquire ISSC Technologies

Thu, 5 May 2014
Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and ISSC Technologies Corporation (ISSC) today announced that Microchip has signed a definitive agreement to acquire ISSC.

Ziptronix and EV Group demonstrate submicron accuracies for wafer-to-wafer hybrid bonding

Tue, 5 May 2014
­ Ziptronix Inc. and EV Group today announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers.

Synopsys and TSMC collaborate to validate DesignWare IP in TSMC 16nm FinFET process

Tue, 5 May 2014
Synopsys, Inc. today announced the validation of DesignWare IP in the TSMC 16nm FinFET process technology, demonstrating the ongoing collaboration between Synopsys and TSMC to provide designers with proven IP for their advanced system-on-chip (SoC) designs.

STATS ChipPAC introduces robust encapsulated wafer level packaging technology

Wed, 5 May 2014
STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, today introduced encapsulated Wafer Level Chip Scale Package, a packaging technology that raises the industry standard of durability for Wafer Level Chip Scale Packaging (WLCSP).

Amkor and Carsem announce patent infringement settlement

Wed, 5 May 2014
Amkor Technology, Inc. and Carsem today jointly announced the settlement of the litigation initiated by Amkor against Carsem alleging infringement of Amkor's MicroLeadFrame (MLF) patents.

Applied Materials enables cost-effective vertical integration of 3D chips

Wed, 5 May 2014
Applied Materials, Inc. today introduced the Endura Ventura PVD system that helps customers reduce the cost of fabricating smaller, lower power, high-performance integrated 3D chips.

Global semiconductor leaders develop plan to promote worldwide industry growth

Wed, 5 May 2014
The Semiconductor Industry Association (SIA) today announced that global semiconductor industry leaders reached an agreement at the 18th annual meeting of the World Semiconductor Council (WSC) last week on a series of policy proposals to strengthen the industry through international cooperation.

Critical test issues up for debate at Test Vision 2020

Mon, 6 Jun 2014
Test professionals who want to learn, forecast and debate the future of semiconductor test will attend the 7th annual IEEE Test Vision 2020 Workshop, held in conjunction with SEMICON West 2014 (July 8-10) in San Francisco.

Osamu Nakamura named President of SEMI Japan

Tue, 6 Jun 2014
Nakamura will succeed Yoichi Nakagawa, who is retiring from SEMI.

Synopsys and Intel collaborate on 14nm Tri-Gate design platform

Tue, 6 Jun 2014
Synopsys, Inc. and Intel Corporation today announced broad SoC design enablement for Intel's 14nm Tri-Gate process technology for use by customers of Intel Custom Foundry.

First automotive MCU manufactured using GlobalFoundries' 55nm automotive-specific platform

Wed, 6 Jun 2014
Scaleo chip, the fabless semiconductor company in automotive electronics for powertrain, body control and driver-information, has used the GLOBALFOUNDRIES 55nm eFlash NVM Platform to develop a new family of microcontrollers.

Synopsys, STMicroelectronics and Samsung to collaborate on adoption of 28nm FD-SOI technology

Wed, 6 Jun 2014
Synopsys, Inc. today announced it has extended its collaboration with STMicroelectronics to include Samsung Electronics, enabling broader market adoption of ST's 28nm FD-SOI technology for SoC design.

Strengthening recovery: Fab equipment spending - 24% increase in 2014, possible record in 2015

Wed, 6 Jun 2014
After two years of decline, fab equipment spending is expected to increase 24 percent in 2014 and about 11 percent (US$39.5 billion).

Global semiconductor sales increase in April; Sustained growth projected for 2014 and 2015

Thu, 6 Jun 2014
The Semiconductor Industry Association (SIA) yesterday announced that worldwide sales of semiconductors reached $26.34 billion for the month of April 2014.

IEEE Packaging Awards handed out at 2014 ECTC

Thu, 6 Jun 2014
The 2014 Electronic Component Technology Conference (ECTC) took place last week in Orlando Florida.

TowerJazz and Genoray develop CMOS image sensor for medical diagnostic equipment

Fri, 6 Jun 2014
TowerJazz, a global specialty foundry, and Genoray Co. Ltd., a manufacturer of digital X-ray devices, today announced collaboration on the successful development of a CMOS image sensor (CIS) for medical diagnostic devices such as X-ray equipment, fluoroscopy and radiography.

On the road to recovery: Semiconductor growth expected for the next two years

Mon, 6 Jun 2014
According to the IMF and predictions by many other market research firms, 2014 and 2015 are expected to be growth years, comparable to or even better than the past few years.

ON Semiconductor to acquire Aptina Imaging

Mon, 6 Jun 2014
ON Semiconductor today signed a definitive agreement to acquire Aptina Imaging, a provider of high-performance CMOS image sensors for automotive and industrial markets.

ANSYS and Intel collaborate on reference flow for power, EM and reliability sign-off

Wed, 6 Jun 2014
ANSYS, Inc., and Intel Corporation announced the availability of a production-proven reference flow for power, EM and reliability sign-off using ANSYS simulation solutions for Intel's 14nm Tri-Gate process, showcasing it at last week's Design Automation Conference.

Industry sustainability efforts mount with III-Vs and other advanced technologies

Thu, 6 Jun 2014
The introduction of new materials, such as III-Vs, into high-volume manufacturing of semiconductors, likely will occur sometime around the 7nm and/or 5nm nodes.

200mm equipment market gaining new lease on life

Mon, 6 Jun 2014
In 2004/2005, shipments of 300mm wafer fab equipment (WFE) began to outpace that of 200mm platforms.

Cadence completes acquisition of Jasper Design Automation

Tue, 6 Jun 2014
Cadence Design Systems, Inc. today announced that it has completed the acquisition of Jasper Design Automation, Inc.

Boston Semi Equipment acquires MVTS Technologies

Tue, 6 Jun 2014
Boston Semi Equipment LLC (BSE) today announced it has completed the acquisition of MVTS Technologies (MVTS).

SEMI releases first quarter 2014 worldwide PV equipment market report

Wed, 6 Jun 2014
Bookings recover for second consecutive quarter; above parity for first time since 2011

Wafer-level packaging of ICs for mobile systems of the future

Sat, 5 May 2013
The most functionality at the least cost is the promise of wafer-level packaging (WLP) when dealing with complex integrated circuits (IC) with a high number of input/output connections to the outside world.

SEMI's 3DIC standards activities

Sat, 5 May 2013
I have said many times that it will be impossible for a complicated technology like 3DIC to ever become commercial without standardization.

Entegris opens new facility in Bedford, MA

Thu, 6 Jun 2014
Entegris Inc., a Billerica-based materials and solutions provider to the microelectronics industries, today inaugurated its new i2M Center for Advanced Materials Science ("The i2M Center") in Bedford, Massachusetts.

GS Nanotech pioneers 3D packaging technology in Russia

Thu, 6 Jun 2014
GS Nanotech, microelectronics products development and manufacture center, plans to launch mass assembly of 3D stacked TSV (through-silicon via) microcircuits in next few years.

450mm transition toward sustainability: Facility and infrastructure requirements

Thu, 6 Jun 2014
Design and construction professionals are showing unprecedented levels of collaboration through the G450C.

Subatmospheric gas storage and delivery: Past, present and future

Thu, 6 Jun 2014
Storing gas on a sorbent provides an innovative, yet simple and lasting solution.

Flexible glass firms branch into new applications

Sun, 6 Jun 2014
Ultrathin glass is well suited for use as interposers in semiconductor packaging applications.

Noise cancellation: The new failure and yield analysis superpower

Sun, 6 Jun 2014
Root cause deconvolution is a quick and cost effective way to determine the underlying root causes represented in a population of failing devices from test data alone.

Micron collaborates with Intel on on-package memory solution, leveraging 3D memory technology

Mon, 6 Jun 2014
Micron Technology, Inc., a provider of advanced semiconductor solutions, today announced an ongoing collaboration with Intel to deliver an on-package memory solution for Intel's next-generation Xeon Phi processor, codenamed Knights Landing.

At The ConFab 2014: Do we still need Moore’s Law?

Mon, 6 Jun 2014
Many questions were in the air on the first day of the 10th annual ConFab 2014, and certainly chief among them was raised during Dr. Roawen Chen of Qualcomm’s keynote “What’s On Our Mind” on Monday morning when he asked, “Should we pursue Moore's Law unconditionally?"

SPTS and CEA-Leti/Nanoelec collaborate on 3D-TSV

Tue, 6 Jun 2014
SPTS Technologies, a manufacturer of etch, deposition and thermal processing equipment for the semiconductor industry, today announced that it has signed an agreement with CEA-Leti in Grenoble, France, to develop 3D-TSV technologies.

SMIC establishes the first 12 in CIS supply chain in China

Tue, 6 Jun 2014
Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, today announced that the first 12" color filter and micro lens array production line in mainland China has been completed and put into production by Toppan SMIC Electronics of Shanghai

ConFab panelists discuss optimizing R&D in the changing semi landscape

Tue, 6 Jun 2014
Overheard @The ConFab: “I feel the best I’ve felt about semi since 2009.” –Mike Noonen, Silicon Catalyst

Gopal Rao at The ConFab: Scaling isn’t enough anymore

Wed, 6 Jun 2014
The core element of the semiconductor industry’s roadmap has been scaling – but Gopal Rao believes that isn’t enough anymore.

Breakthrough research in the semiconductor industry

Mon, 6 Jun 2014
Research forms the DNA of the semiconductor industry — few other industries invest as much as a percentage of revenue.

EVG clears key barriers to 3DIC/TSV HVM with fusion wafer bonding solution

Mon, 6 Jun 2014
EV Group today unveiled the GEMINI FB XT—its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs).

IoT will transform transportation

Thu, 7 Jul 2014
Cars that can get along without drivers are coming, down the road, but they are a small part of the changes that the global transportation industries will undertake as microelectronics and the Internet of Things prompt major changes in infrastructure and logistics, as well as all type of vehicles.

Alpha and Omega Semiconductor rolls out new family of MOSFETS

Thu, 7 Jul 2014
Alpha and Omega Semiconductor Limited, a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today announced the release of six new 25V and 30V MOSFETs.

Internet of Things: big numbers, many opportunities

Thu, 7 Jul 2014
Whatever forecast one uses for the future of the Internet of Things in terms of connected objects or business opportunities, the IoT will be big.

Monolithic 3DIC: Overcoming silicon defects

Mon, 7 Jul 2014
As dimensional scaling has reached the diminishing return era there is a buildup of interest in monolithic 3D as an alternative path forward.

Permanent bonding: A key technology for MEMS, advanced packaging, LEDs and SOI

Mon, 7 Jul 2014
Yole Développement has released a new report, Permanent Wafer Bonding, detailing permanent bonding technologies and the microelectronic applications that use permanent bonding such as MEMS, Advanced Packaging, LEDs and SOI substrates.

SEMI and Solid State Technology announce the 2014 “Best of West” Award finalists

Tue, 7 Jul 2014
Each year at SEMICON West, the largest and most influential microelectronics exposition in North America, the “Best of West” awards are presented by Solid State Technology and SEMI. The award was established to recognize contributors moving the industry forward with their technological developments in the microelectronics supply chain.

SEMI forecasts double-digit business growth in 2014, 2015

Wed, 7 Jul 2014
The worldwide semiconductor capital equipment market is forecast to increase 20.8 percent this year to $38.44 billion, compared with 2013’s $31.82 billion, and another 10.8 percent in 2015 to $42.6 billion, according to Semiconductor Equipment and Materials International.

2014 iTherm

Thu, 7 Jul 2014
iTherm is the Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. The 2014 iTherm was held concurrently with the ECTC in Orlando, FL. This year’s General Chair was Mehdi Basheghi of Stanford and program chair was Madhusudan of Google. Attendance this year was up 50% to ~ 400.

IBM announces $3B research initiative

Tue, 7 Jul 2014
IBM announced it is investing $3 billion over the next 5 years in two broad research and early stage development programs to push the limits of chip technology needed to meet the emerging demands of cloud computing and Big Data systems.

TriQuint achieves GaN defense production milestones as part of the Defense Production Act Title III Program

Wed, 7 Jul 2014
TriQuint Semiconductor, Inc., an RF solutions supplier and technology innovator, announced that it has reached a defense production milestone, successfully completing the Defense Production Act Title III Gallium Nitride on Silicon Carbide Production Capacity program.

Imaging without limits: Phones lead growth but innovative applications expanding the market

Fri, 7 Jul 2014
To address the rising demands of imaging systems in mobile, medical, automotive and other technology applications, the Imaging Without Limits Conference (7-8 October) will be introduced at SEMICON Europa 2014 this year to address this surging market.

Edwards honored at SEMICON West 2014

Fri, 7 Jul 2014
Edwards Limited is pleased to announce that Mike Czerniak, Product Marketing Manager Exhaust Gas Management, was honored with SEMI’s Merit Award during SEMICON West last week.

CEA-Leti: Monolithic 3D is the solution for further scaling

Mon, 7 Jul 2014
Hughes Metras, Leti’s VP of Strategic Partnerships North America, introduced the lead talk at their SemiconWest 2014 Leti Day about monolithic 3D technology as the "solution for scaling."

Solid State Equipment wins 2014 3D InCites Award for WaferEtch TSV Revealer

Tue, 7 Jul 2014
Solid State Equipment LLC (SSEC), a provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment.

Dongbu HiTek unveils low-voltage BCDMOS process for efficient power management

Tue, 7 Jul 2014
Dongbu HiTek today announced the immediate availability of a Low Voltage BCDMOS Process (BD130LV) at the 0.13-micron node that is ideally suited for implementing the main Power Management IC (PMIC) for smart phones and tablet computers.

SEMI announces new South America Semiconductor Strategy Summit

Tue, 7 Jul 2014
SEMI today announced the launch of the association's first-ever event in Latin America.

Compact vibration harvester power supply with highest efficiency opens door to “Fix-and-Forget” sensor nodes

Wed, 7 Jul 2014
OMRON and Holst Centre/imec have unveiled a prototype of an extremely compact vibrational energy harvesting DC power supply with worlds’ highest efficiency.

A new multi-bit 'spin' for MRAM storage

Wed, 7 Jul 2014
Interest in magnetic random access memory (MRAM) is escalating, thanks to demand for fast, low-cost, nonvolatile, low-consumption, secure memory devices. MRAM, which relies on manipulating the magnetization of materials for data storage rather than electronic charges, boasts all of these advantages as an emerging technology, but so far it hasn't been able to match flash memory in terms of storage density.

Micron 16nm NAND flash memory awarded Most Innovative Memory Device and Semiconductor of the Year

Wed, 7 Jul 2014
Micron Technology, Inc. and TechInsights today announced that Micron has been honored with both the Most Innovative Memory Device and Semiconductor of the Year awards for their 16nm NAND Flash memory technology in TechInsights' 11th Annual Insight Awards.

VCs still investing in semiconductor technology, but need strategic partners and capital efficiency

Thu, 7 Jul 2014
Investors are still looking for differentiated technologies that solve high-value problems in semiconductor manufacturing, or that bring semiconductor technology to disruptive applications in other fields, particularly in the medical and environmental sectors

A*STAR and industry partners form S$200M semiconductor R&D joint labs

Thu, 7 Jul 2014
Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners.

Fusion bonding for next-generation 3D-ICs

Thu, 7 Jul 2014
Recent developments in wafer bonding technology have demonstrated the ability to achieve improved bond alignment accuracy.

Can lean innovation bring growth and profits back to semiconductors?

Fri, 7 Jul 2014
New approaches to start-ups can unlock mega-trend opportunities.

3D memory for future nanoelectronic systems

Sun, 7 Jul 2013
Bit-growth slows while specialized stacking accelerates innovation in future memory solutions for communications, energy, and health-care.

Harnessing big data

Mon, 7 Jul 2014
Addressing the analytics challenges in supply chain management.

A call to provide advanced equipment to growth companies

Mon, 7 Jul 2014
Historically, the major semiconductor capital equipment manufacturers have focused on supporting the bigger semiconductor companies at the expense of the smaller ones.

Silicon Image appoints new Chief Financial Officer

Wed, 7 Jul 2014
Silicon Image, a provider of multimedia connectivity solutions and services, today announced the appointment of Raymond Cook as Chief Financial Officer effective July 28, 2014.

Materials matter — Enabling the future of IC fabrication and packaging

Thu, 7 Jul 2014
The SEMI Strategic Materials Conference, held September 30–October 1 in Santa Clara, Calif., will examine the drivers for new materials and how they impact material suppliers and the value chain they serve.

SMIC and JCET establish a joint venture

Fri, 8 Aug 2014
Semiconductor Manufacturing International Corporation and Jiangsu Changjiang Electronics Technology Co., Ltd. announced today the formation of a joint venture for 12-inch bumping and related testing, from the previously signed joint venture agreement, which will be established in Jiangyin National High-Tech Industrial Development Zone (JOIND), in Jiangsu Province, China.

Micron Technology appoints Stephen Pawlowski as Vice President of Advanced Computing Solutions

Mon, 8 Aug 2014
Micron Technology, Inc. today announced that Stephen Pawlowski has been named as vice president of Advanced Computing Solutions.

Global semiconductor industry on pace for record sales through first half of 2014

Tue, 8 Aug 2014
Sales up across every region and nearly all product categories compared to last year; Americas region shows strongest growth.

Taking great ideas from the lab to the fab

Tue, 8 Aug 2014
NSF and Intel support the development of domain-specific hardware to address health care needs.

Pfeiffer Vacuum joins the Facilities 450mm Consortium

Wed, 8 Aug 2014
The Facilities 450mm Consortium (F450C), a partnership of leading nanoelectronics facility companies guiding the effort to design and build the next-generation 450mm computer chip fabrication facilities, today announced it has again increased in size, naming Pfeiffer Vacuum as the twelfth member company to join the consortium.

SEMICON Taiwan 2014 to capitalize on growing market opportunities in Taiwan

Wed, 8 Aug 2014
Taiwan is forecast to have the largest regional semiconductor manufacturing equipment and materials capital expenditures in both 2014 and 2015.

STATS ChipPAC’s fcCuBE technology surpasses 100 million unit milestone

Wed, 8 Aug 2014
STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped over 100 million semiconductor packages with the company’s fcCuBE technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes.

Nordson completes acquisition of Avalon Laboratories

Mon, 8 Aug 2014
Nordson Corporation today announced it has completed the acquisition of Los Angeles, California based Avalon Laboratories Holding Corp.

SRC, UC Davis explore new materials and device structures to develop next-generation “Race Track Memory” technologies

Tue, 8 Aug 2014
University of California, Davis researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, are exploring new materials and device structures to develop next-generation memory technologies.

Si2 announces new director of 3DIC programs

Thu, 8 Aug 2014
The Silicon Integration Initiative (Si2), a global semiconductor standards consortium, announced today that Herb Reiter is joining the team of professionals in the role of Director, 3D IC Programs.

MEMSIC introduces the world's first monolithic and wafer level packaged 3D-axis accelerometer

Fri, 8 Aug 2014
MEMSIC, Inc., a MEMS sensing solution provider, announced today the availability of its MXC400xXC, the world's first monolithic 3D accelerometer, and also the first 3D accelerometer to utilize WLP technology.

Riding the embedded software wave

Mon, 8 Aug 2014
Software that controls and powers embedded devices is playing a key role in making possible the highly integrated, multi-functional ‘smart’ devices we take for granted in our daily lives – from the ubiquitous smart phones/tablet to ‘smart’ home appliances and wearable electronics.

SmartPlay to offer design services for customers of Intel Custom Foundry

Tue, 8 Aug 2014
SmartPlay Inc., a design services company with expertise in digital, analog, wireless software and system design, announced that it is ready to offer design services to customers of Intel Custom Foundry that require expertise, know-how and unique IP in critical embedded applications.

Intersil announces single-chip display power and LED driver for smartphones

Tue, 8 Aug 2014
Intersil Corporation, a provider of power management and precision analog solutions, today announced the ISL98611 display power and LED driver for smartphones.

Alpha and Omega Semiconductor announces promotion of Yifan Liang to CFO

Tue, 8 Aug 2014
Alpha and Omega Semiconductor Limited, a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today announced that the Board of Directors of AOS has promoted Mr. Yifan Liang, the Interim Chief Financial Officer, to serve as the Chief Financial Officer of AOS, effective immediately.

Promising ferroelectric materials suffer from unexpected electric polarizations

Tue, 8 Aug 2014
Electronic devices with unprecedented efficiency and data storage may someday run on ferroelectrics—remarkable materials that use built-in electric polarizations to read and write digital information, outperforming the magnets inside most popular data-driven technology.

Renesas Electronics expands portfolio of Simple Power Supply ICs

Wed, 8 Aug 2014
Renesas Electronics America, a leading supplier of advanced semiconductor solutions, today expands its portfolio of Simple Power Supply ICs, with innovative 16V input capable synchronous buck regulators that deliver up to 3A continuous current to loads at voltages as low as 0.8V.

MediaTek launches R&D center in Bengaluru

Wed, 8 Aug 2014
MediaTek today announced the establishment of a new research and development facility in Bengaluru, India.

Amkor Technology names David Watson to Board of Directors

Thu, 8 Aug 2014
Amkor Technology, Inc. today announced that David Watson has been appointed as a new member of the Company’s Board of Directors.

Order activity for semiconductor equipment holds steady in July

Thu, 8 Aug 2014
North America-based manufacturers of semiconductor equipment posted $1.41 billion in orders worldwide in July 2014 (three-month average basis) and a book-to-bill ratio of 1.07, according to the July EMDS Book-to-Bill Report published today by SEMI.

New ClassOne electroplater a "sellout" at SEMICON West

Mon, 8 Aug 2014
When ClassOne Technology introduced its new Solstice electroplating systems at SEMICON West last month they didn’t expect to actually sell their first production unit off the show floor, but that’s what happened.

S2C opens Korean office and appoints country manager

Tue, 8 Aug 2014
S2C, Inc. announced today the opening of a direct sales and support office in Seoul, Korea, appointing Suk-Ha Lee (SH Lee) as country manager.

Renasas introduces new package for safety systems for industrial equipment

Tue, 8 Aug 2014
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced that it has obtained IEC 61508 (Functional Safety) certification for the RX631, RX63N Safety Package.

Plastic electronics: Opportunity on the edge of commercialization

Wed, 8 Aug 2014
The Plastics Electronics Conference and Exposition will co-locate with SEMICON Europa. Plastic Electronics 2014 (PE 2014) is themed “Enabling Applications beyond Limits in Electronics” and will be held at Alpexpo in Grenoble on 7-9 October.

Lean strategies and decentralized value chains fuel RFID uptake in manufacturing

Wed, 8 Aug 2014
New analysis from Frost & Sullivan, Analysis of the Global RFID in Manufacturing Market, finds that the market earned revenues of $1.29 billion in 2013 and estimates this to nearly quadruple to $4.99 billion in 2020.

Intel releases new packaging, test technologies for 14nm foundries

Wed, 8 Aug 2014
Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies.

Vietnam Semiconductor Strategy Summit —keynotes and highlights announced

Thu, 8 Aug 2014
SEMI today announced the keynotes for the 2nd Vietnam Semiconductor Strategy Summit(September 16-17), an executive conference focused on Vietnam’'s growing role in the global semiconductor industry.

TowerJazz and Triune Systems announce Neo-Iso Products ramping to mass production

Tue, 9 Sep 2014
TowerJazz, the global specialty foundry, and Triune Systems LLC, a mixed signal and power management IC provider, today announced that Triune has developed a proprietary isolated power and data technology using the TowerJazz TS18PM process on its 0.18um based power management platform.

IDC lowers tablet projections for 2014 as demand in mature markets levels off

Tue, 9 Sep 2014
Following a second consecutive quarter of softer than expected demand, International Data Corporation (IDC) has lowered its worldwide tablet plus 2-in-1 forecast for 2014 to 233.1 million units.

Breakthrough in light sources for new quantum technology

Tue, 9 Sep 2014
Electronic circuits are based on electrons, but one of the most promising technologies for future quantum circuits are photonic circuits, i.e. circuits based on light (photons) instead of electrons.

SEMICON Taiwan 2014 opens today with spotlight on 3D-IC, sustainable manufacturing, and MEMS

Wed, 9 Sep 2014
Taiwanese chipmakers, LED manufacturers, and Outsourced Semiconductor Assembly and Test (OSAT) firms will spend firm nearly $24 billion in the next two years on equipment and materials, powering excitement for SEMICON Taiwan 2014, which opened today in Taipei.

Samsung adopts ProPlus Designs' 14nm finFET process

Wed, 9 Sep 2014
ProPlus Design Solutions, Inc. today announced Samsung Electronics has extended its partnership with ProPlus through the deployment of ProPlus' BSIMProPlus modeling platform for its 14-nanometer (nm) FinFET SPICE modeling.

Shinichi Machida named President and CEO of Fujitsu Semiconductor America

Thu, 9 Sep 2014
Fujitsu Semiconductor America (FSA) today announced that Shinichi "James" Machida, who led the company from late 2008 until spring of 2011, has been named as the new president and CEO of FSA.

Contour Semiconductor awarded three new U.S. patents

Thu, 9 Sep 2014
Contour Semiconductor, Inc., a developer of non-volatile memory technologies, today announced it has been awarded three new patents to back its Diode Transistor Memory (DTM) technology, the world's lowest production-cost, non-volatile memory technology.

UCSB researchers develop ultra sensitive biosensor from molybdenite semiconductor

Thu, 9 Sep 2014
Move over, graphene. An atomically thin, two-dimensional, ultrasensitive semiconductor material for biosensing developed by researchers at UC Santa Barbara promises to push the boundaries of biosensing technology in many fields, from health care to environmental protection to forensic industries.

GLOBALFOUNDRIES and SRC announce new scholarship for undergraduate engineering students

Tue, 9 Sep 2014
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced the “GLOBALFOUNDRIES Undergraduate Research Scholarship,” a new scholarship recognizing and rewarding aspiring, leadership-oriented engineering students interested in careers in the semiconductor industry.

RFMD shareholders approve merger with TriQuint Semiconductor

Fri, 9 Sep 2014
RF Micro Devices, Inc. today announced the preliminary results of its special meeting of shareholders held earlier this morning to approve its agreement and plan of merger and reorganization with TriQuint Semiconductor, Inc.

NVIDIA files complaints against Samsung and Qualcomm

Fri, 9 Sep 2014
NVIDIA today announced that it has filed complaints against Samsung and Qualcomm at the International Trade Commission and in the U.S. District Court in Delaware, alleging that the companies are both infringing NVIDIA GPU patents covering technology including programmable shading, unified shaders and multithreaded parallel processing.

10nm success depends on concurrent design and development

Mon, 9 Sep 2014
The Prophets of Doom greet every new process node with a chorus of dire warnings about the end of scaling, catastrophic thermal effects, parasitics run amok and . . . you know the rest.

Second quarter 2014 semi equipment billings 28% higher than 2013 second quarter

Tue, 9 Sep 2014
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 9.62 billion in the second quarter of 2014.

Fermilab implements Ziptronix's DBI hybrid bonding in high-end 3D image sensors

Tue, 9 Sep 2014
Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.

Rigorously tuned compact models: Extending predictive models to full-chip

Tue, 9 Sep 2014
Fast and predictive 3D resist compact models are needed for OPC applications. A methodology to build such models is described, starting from a 3D bulk image, and including resist interface effects such as diffusion.

A fundamental truth of process control

Tue, 9 Sep 2014
You can’t fix what you can’t find. You can’t control what you can’t measure.

Global shutter image sensors

Tue, 9 Sep 2014
Different GS pixel architectures and technologies are presented and performances compared.

Equipment spending shows strong growth for 2014 and 2015

Wed, 9 Sep 2014
Front End fab equipment spending is projected to increase up to another 20 percent in 2015 to US$ 42 billion.

The semiconductor industry: Out in front, but lagging behind

Wed, 9 Sep 2014
Capital equipment suppliers must provide advanced analytical systems that leverage data generated by their tools to help their fab customers address the challenges of Big Data and advanced analytics.

Controlling warpage in advanced packaging

Mon, 9 Sep 2014
As we continue to miniaturize, warpage remains the main problem encountered in all areas of advanced packaging.

Outlook: Healthy equipment spending into 2015

Wed, 9 Sep 2014
The general consensus for the semiconductor industry is for this year’s positive trend to continue into 2015 as both revenue growth and unit shipment growth are expected to be in the mid- to high- single digit range.

Sapphire display covers featured in Apple smart watches but not in iPhone 6

Thu, 9 Sep 2014
The long wait is finally over. From a sapphire industry standpoint, Apple killed the suspense within the first 10 minutes by announcing that its new 4.7” and 5.5” iPhone 6 and iPhone 6 plus will both feature a traditional ion-exchange strengthened glass display cover.

NSF and SRC announce research awards to 10 universities

Tue, 9 Sep 2014
The National Science Foundation (NSF) and Semiconductor Research Corporation (SRC) today announced nine research awards to 10 universities totaling nearly $4 million under a joint program focused on Secure, Trustworthy, Assured and Resilient Semiconductors and Systems (STARSS).

SEMI releases second quarter 2014 worldwide PV equipment market statistics report

Thu, 9 Sep 2014
Worldwide billings increased to $319 million in Q2 2014, an increase of 33 percent from the prior quarter but 11 percent below the same quarter a year ago.

Rudolph introduces new acoustic metrology and defect inspection technology

Thu, 9 Sep 2014
Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).

Smartphone connectivity presents both opportunities and challenges for automotive processor chip suppliers

Mon, 9 Sep 2014
The use of smartphones in motor vehicles—already a near-ubiquitous phenomenon—is the most disruptive trend in the automotive infotainment business today, presenting both challenges and opportunities for automakers and their processor semiconductor suppliers.

Samsung now mass producing industry’s first 20nm 6Gb LPDDR3 mobile DRAM

Thu, 9 Sep 2014
The new mobile memory chip will enable longer battery run-time and faster application loading on large screen mobile devices with higher resolution.

European 3D TSV Summit: “Smarter system integration” theme to focus on both business and technology

Tue, 9 Sep 2014
On January 19-21, 2015, SEMI will hold its 3rd edition of the European 3D TSV Summit in Grenoble, France.

For electronics beyond silicon, a new contender emerges

Thu, 9 Sep 2014
Silicon has few serious competitors as the material of choice in the electronics industry. Yet transistors, the switchable valves that control the flow of electrons in a circuit, cannot simply keep shrinking to meet the needs of powerful, compact devices; physical limitations like energy consumption and heat dissipation are too significant.

EMCORE Corporation announces CEO transition plan

Thu, 9 Sep 2014
EMCORE Corporation, a provider of compound semiconductor-based components and subsystems for the fiber optic and space solar power industries, today announced a transition plan of its Chief Executive Officer position in connection with the announced sale of its Space Photovoltaics business.

ProPlus Design Solutions expands sales operations to Europe

Thu, 9 Sep 2014
ProPlus Design Solutions, Inc. announced today it expanded its sales operations to Europe.

North American semiconductor equipment industry posts August 2014 book-to-bill ratio of 1.04

Thu, 9 Sep 2014
A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

Physicists heat freestanding graphene to control curvature of ripples

Mon, 9 Sep 2014
An international team of physicists, led by a research group at the University of Arkansas, has discovered that heating can be used to control the curvature of ripples in freestanding graphene.

NANIUM launches the industry’s largest WLCSP in volume production

Tue, 9 Sep 2014
NANIUM today announced it has successfully launched the industry’s largest Wafer-Level Chip Scale Package (WLCSP) in volume.

Future flexible electronics based on carbon nanotubes

Wed, 9 Sep 2014
Study in Applied Physics Letters show how to improve nanotube transistor and circuit performance with fluoropolymers

Honeywell advanced materials help mobile devices dissipate heat

Thu, 9 Sep 2014
Honeywell Electronic Materials announced today that its advanced materials are being integrated into the production of tablets and smartphones, helping them stay cool and perform better.

Silicon Motion elects Han-Ping Shieh to Board of Directors

Fri, 9 Sep 2014
Mr. Shieh will replace Mr. Kenneth Kuan-Min Lin, who had chosen not to stand for reelection to the Board of Directors in order to focus more on his venture capital and other activities.

Printed, flexible, and organic electronics will account for 18% of wearable athletics sensors in 2024

Fri, 9 Sep 2014
Printed, flexible and organic electronic (PFOE) sensors can offer flexible form factors, larger area, lower cost, lower power, and better disposability compared to conventional sensors, key attributes for wearable applications.

TSMC delivers first fully functional 16 finFET networking processor

Mon, 9 Sep 2014
TSMC today announced that its has successfully produced the foundry segment's first fully functional ARM-based networking processor with FinFET technology, through its collaboration with HiSilicon Technologies Co, Ltd.

Tessera Technologies names Craig Mitchell as CTO and president of Invensas

Mon, 9 Sep 2014
Tessera Technologies, Inc. today announced it has named Craig Mitchell as chief technology officer for Tessera and president of Invensas Corporation, effective immediately.

A new dimension for integrated circuits: 3D nanomagnetic logic

Tue, 9 Sep 2014
Electrical engineers at the Technische Universität München (TUM) have demonstrated a new kind of building block for digital integrated circuits.

New technology may lead to prolonged power in mobile devices

Tue, 9 Sep 2014
Researchers from The University of Texas at Dallas have created technology that could be the first step toward wearable computers with self-contained power sources or, more immediately, a smartphone that doesn’t die after a few hours of heavy use.

SEMICON Japan features "World of IoT"

Wed, 10 Oct 2014
Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs.

Boston Semi Equipment creates industry's largest independent ATE organization

Wed, 10 Oct 2014
Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name.

FlipChip International creates 250 multi-product wafer bump designs

Wed, 10 Oct 2014
FlipChip International (FCI), the global technology leader in flip chip bumping and advanced wafer level packaging, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013.

ARM and TSMC unveil roadmap for 64-bit ARM-based processors on 10FinFET process technology

Thu, 10 Oct 2014
ARM and TSMC today announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10FinFET process technology.

Silicon Cloud International launches semiconductor collaborative platform in Singapore

Fri, 10 Oct 2014
Silicon Cloud International (SCI), a provider of secure and private cloud computing infrastructure, announced today successful pilot program launch of its semiconductor workflow platform in Singapore.

Europe: Strong growth in chip equipment spending in 2015

Mon, 10 Oct 2014
Global capital spending on semiconductor equipment is projected to grow 21.1 percent in 2014 and 21.0 percent in 2015.

Adoption of SiC & GaN to directly impact the power electronics industry

Mon, 10 Oct 2014
Emergence of new wide bandgap (WBG) technologies such as SiC and GaN materials will definitely reshape part of the established power electronics industry, according to Yole Développement (Yole).

Global semiconductor sales continue to climb in August

Mon, 10 Oct 2014
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $28.4 billion for the month of August 2014.

SEMI announces rising annual silicon wafer shipment forecast

Tue, 10 Oct 2014
SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2014-–2016.

Samsung to invest $14.7B in new semiconductor fab

Tue, 10 Oct 2014
Samsung Electronics announced plans on Monday to invest $14.7 billion (15.6 trillion Korean won) in a new semiconductor fabrication facility in Pyeongtaek, South Korea.

Albert Theuwissen of Harvest Imaging honored with European SEMI Award 2014

Wed, 10 Oct 2014
Albert Theuwissen, CEO of Harvest Imaging and professor at Delft University of Technology, is the recipient of the European SEMI Award 2014.

Semiconductor market in India is expected to reach US$ 52.58B by 2020

Tue, 10 Oct 2014
India has a very large industry base of electronics items, but there is little manufacturing base for semiconductors.

Mentor Graphics wins $36M in patent infringement suit

Mon, 10 Oct 2014
A Portland, Oregon jury today delivered a verdict in favor of Mentor Graphics in a patent infringement trial against Synopsys, Inc., awarding Mentor Graphics $35 million in damages and royalties.

Threshold voltage tuning for 10nm and beyond CMOS integration

Mon, 10 Oct 2014
A novel metal gate integration scheme to achieve precise threshold voltage (VT) control for multiple VTs is described.

Texas Instruments announces 22B copper wire bond technology units shipped

Tue, 10 Oct 2014
Texas Instruments today announced it has shipped more than 22 billion units of copper wire bonding technology from its internal assembly sites and is now in production for major high reliability applications including automotive and industrial.

IRLYNX and CEA-Leti to streamline new CMOS-based infrared sensing modules

Wed, 10 Oct 2014
IRLYNX and CEA-Leti today announced they have launched a technology-development partnership for a new CMOS-based infrared technology that will allow a new type of smart and connected detectors in buildings and cities.

The mystery of reed relays: Understanding specifications

Wed, 10 Oct 2014
Specifications of reed relays, which are used for current switching in ATE and other applications are explained, including carry current, lifetime, minimum switch capacity, hot switching, operating speed and thermoelectric switching.

Element Six introduces new thermal grade of CVD diamond

Wed, 10 Oct 2014
Element Six this week announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD), DIAFILM TM130.

Qualcomm to acquire CSR

Thu, 10 Oct 2014
Qualcomm today announced that it has reached agreement with CSR regarding the terms of a recommended cash acquisition of CSR will be acquired by Qualcomm Global Trading Pte. Ltd.

Intel and IBM to lay out 14nm FinFET strategies on competing substrates at IEDM 2014

Thu, 10 Oct 2014
The development of increasingly sophisticated and energy-efficient CMOS technology for mobile, client and cloud computing depends on a continuing stream of advances in the process technologies with which the complex integrated circuits are built.

Intermolecular appoints Dr. Bruce McWilliams as President and CEO

Thu, 10 Oct 2014
Intermolecular, Inc. announced this week that Dr. Bruce McWilliams has been appointed president and chief executive officer.

Growing momentum in semiconductor manufacturing in Vietnam

Fri, 10 Oct 2014
The 2nd annual SEMI Vietnam Semiconductor Strategy Summit, co-organized with the Saigon Hi-Tech Park and with FabMax as the premier sponsor, was held September 16-17, 2014 in Ho Chi Minh City.

Canadian semiconductor manufacturing industry revenue expected to decline 8% in 2014

Fri, 10 Oct 2014
Industry manufacturers, which are typically small- to mid-sized enterprises, will find it difficult to match the research and development (R&D) spending of multinational competitors.

IBM to pay GlobalFoundries $1.5B to take over chip fabs

Mon, 10 Oct 2014
IBM and GLOBALFOUNDRIES today announced that GLOBALFOUNDRIES will acquire IBM's global commercial semiconductor technology business.

Semiconductor equipment book-to-bill declines in September

Tue, 10 Oct 2014
While order activity moderated, equipment spending this year is expected to be robust and remain on pace for double-digit year-over-year growth.