Packaging

Topic Index

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Pure-play foundries spending big on capital equipment

Wed, 10 Oct 2013
Semiconductor capital spending has increased significantly among pure-play foundries as more IDMs shift to a fabless/fab-lite business model and as new foundry participants intensify competition among the old guard.

NXP NextPowerS3 MOSFETs offer super-fast switching with soft recovery

Fri, 9 Sep 2013
Industry’s first MOSFET platform to deliver integrated Schottky performance with low leakage current.

Mobility now driving the industry

Wed, 9 Sep 2013
It’s apparent that the world’s appetite for electronics has never been greater. That has increasingly taken the form of mobile electronics, including smartphones, tablets and tablets and the new “phablets.” People want to watch movies and live sports on their phones.

Package level integration: challenges and opportunities

Wed, 9 Sep 2013
A wide array of package level integration technologies now available to chip and system designers are reviewed.

Silicon Labs launches the world’s most energy-friendly MCUs

Wed, 10 Oct 2013
Silicon Labs, a developer of high-performance, analog-intensive, mixed-signal ICs, today introduced the industry’s most energy-friendly 32-bit microcontrollers (MCUs) based on the ARM Cortex-M0+ processor.

Applied Materials to merge with Tokyo Electron

Tue, 9 Sep 2013
Applied Materials Inc. and Tokyo Electron Limited today announced Applied Materials agreed to merge with Tokyo Electron.

STMicroelectronics reveals new micro-packaged device product family

Tue, 9 Sep 2013
Next-generation integrated devices for matching, filtering and protection help shrink circuit size and boost end-product performance.

MACOM releases industry’s first surface mount L-Band 90W GaN power module

Tue, 9 Sep 2013
MACOM Technology Solutions Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced the newest entry in its portfolio of GaN in Plastic packaged power products.

Micron ships first samples of Hybrid Memory Cube

Wed, 9 Sep 2013
Micron Technology, Inc. announced today that it is shipping 2GB Hybrid Memory Cube (HMC) engineering samples.

Inside the Hybrid Memory Cube

Wed, 9 Sep 2013
The HMC provides a breakthrough solution that delivers unmatched performance with the utmost reliability.

High temperature reverse bias reliability testing of high power devices

Wed, 9 Sep 2013
Power device characterization and reliability testing require instrumentation capable of sourcing higher voltages and more sensitive current measurements than ever before.

SEMI book-to-bill ratio indicates bookings decline

Thu, 9 Sep 2013
North America-based manufacturers of semiconductor equipment posted $1.06 billion in orders worldwide in August 2013 (three-month average basis) and a book-to-bill ratio of 0.98, according to the August EMDS Book-to-Bill Report published today by SEMI.

Micron Technology appoints Thomas Snodgrass as VP of System Solutions

Tue, 10 Oct 2013
Micron Technology, Inc. today announced that the company has named Tom Snodgrass, vice president, System Solutions.

Stanford and UT Austin professors to be honored at annual SRC TECHCON

Thu, 9 Sep 2013
Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, will honor professors from Stanford University and University of Texas at Austin with awards for chip-related research and education at SRC’s annual TECHCON conference Sept. 9-10.

Alpha and Omega Semiconductor launches new DrMOS-IIIS power modules

Mon, 9 Sep 2013
Alpha and Omega Semiconductor, a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today launched the AOZ5019, a third-generation high efficiency power module with an EZPair package.

World record solar cell with 44.7% efficiency

Mon, 9 Sep 2013
The Fraunhofer Institute for Solar Energy Systems ISE, Soitec, CEA-Leti and the Helmholtz Center Berlin jointly announced this week having achieved a new world record for the conversion of sunlight into electricity using a new solar cell structure with four solar subcells.

GE acquires Imbera

Thu, 9 Sep 2013
GE Healthcare Finland Oy, in partnership with GE Idea Works, announced today that it has completed the acquisition of Imbera Electronics Oy.

Global semiconductor sales increase for sixth straight month in August

Fri, 10 Oct 2013
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $25.87 billion for the month of August 2013, an increase of 6.4 percent compared to August 2012, marking the industry's largest year-over-year growth since March 2011.

CU, MIT breakthrough in photonics could lead to faster electronics

Wed, 10 Oct 2013
A pair of breakthroughs in the field of silicon photonics by researchers at the University of Colorado Boulder, the Massachusetts Institute of Technology and Micron Technology Inc. could allow for the trajectory of exponential improvement in microprocessors that began nearly half a century ago—known as Moore's Law—to continue well into the future, allowing for increasingly faster electronics, from supercomputers to laptops to smartphones.

Intermolecular and Russian nanocenter sign joint development agreement

Fri, 10 Oct 2013
Intermolecular, Inc. and RUSNANO, the Fund for Infrastructure and Educational Programs, today announced the signing of a joint development agreement between Intermolecular and Ulnanotech, the leading Russian Federation nanocenter based in Ulyanovsk.

3D-IC: Two for one

Wed, 9 Sep 2013
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about upcoming events related to 3D ICs.

A new photoresist technology for organic semiconductors enabling submicron patterns

Thu, 9 Sep 2013
Fujifilm and imec have developed a new photoresist technology for organic semiconductors that enables the realization of submicron patterns.

Americas region remains largest market for pure-play foundry sales

Wed, 10 Oct 2013
Emphasis on fabless and fab-lite models in U.S. contributes to 62% marketshare.

The Internet of Things is poised to change everything, says IDC

Fri, 10 Oct 2013
The Internet of Things represents a new construct in the information and communications technology world that is occupying the minds of IT vendors, service providers, and systems integrators as it represents huge potential for new streams of revenue and new customers.

PC outlook lowered again

Fri, 8 Aug 2013
Worldwide PC shipments are now expected to fall by -9.7 percent in 2013, further deepening what is already the longest market contraction on record.

Moore's Law Dead By 2022: Crying Wolf?

Fri, 8 Aug 2013
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about recent predictions regarding the demise of continued scaling.

Dow Corning and EV Group to collaborate on temporary bonding materials for 3D-IC

Tue, 9 Sep 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG's LowTemp platform for room-temperature wafer bonding and debonding processes.

Advancing graphene for post-silicon computer logic

Tue, 9 Sep 2013
Team of UC Riverside researchers pioneer new approach for graphene logic circuits.

EV Group unveils new via-filling process to improve reliability of 3D-IC/TSV packaging

Wed, 9 Sep 2013
EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new polymer via-filling process for 3D-IC/through-silicon-via semiconductor packaging applications.

Electronics advance moves closer to a world beyond silicon

Wed, 9 Sep 2013
Researchers in the College of Engineering at Oregon State University have made a significant advance in the function of metal-insulator-metal, or MIM diodes, a technology premised on the assumption that the speed of electrons moving through silicon is simply too slow.

Will 2014 be the next Golden Year?

Thu, 9 Sep 2013
Some unexpected underdogs spur spending spree.

Collaboration needed on 3D-IC

Thu, 9 Sep 2013
The history of semiconductors has been a history of collaboration. Today, a similar industry-wide collaborative approach to 3D stacked ICs is needed to reach widespread 3D-IC adoption and continue the amazing progress our industry has historically achieved.

Chip carrier packaging grows on widespread adoption of QFN package

Fri, 9 Sep 2013
Advanced packaging of semiconductor chips has emerged as a key enabler in many of today’s electronic system products.

Fab equipment spending up 25% in 2014

Mon, 9 Sep 2013
Semiconductor revenue has improved in 2013 compared to 2012 and early forecasts for 2014 project revenue growth averaging about eight percent.

New Intel CEO, president talk product plans and future of computing

Tue, 9 Sep 2013
From data centers to ultra-mobile devices such as tablets, phones and wearables, computing segments are undergoing exciting and even game-changing transitions, said new Intel CEO Brian Krzanich during today’s opening session of the Intel Developer Forum.

SUNY CNSE to develop center for 450mm computer chip manufacturing

Thu, 9 Sep 2013
Building on Governor Cuomo’s CNSE G450C initiative and expanded partnership between NanoCollege and the Mohawk Valley EDGE continues New York’s investment strategy.

The advantages of a hybrid scan test solution

Thu, 9 Sep 2013
Scan testing is the standard practice for test of integrated circuits. The vast majority of IC production test is based on automatic test pattern generation (ATPG) using the scan logic.

Brooks Automation appoints Lindon G. Robertson as CFO

Fri, 9 Sep 2013
Brooks Automation, Inc. today announced the appointment of Lindon G. Robertson as executive vice president and chief financial officer, effective October 1, 2013.

Pitching for IC packages

Fri, 9 Sep 2013
Itty bitty computers, smart phones, ipods, and more – these “must have” small electronic devices that Apple Computer and other companies have popularized, are forcing the hand of IC package designers to shrink the package to fit within these little hand-held gadgets.

Brewer Science’s new carbon nanotube materials are qualified for NRAM manufacturing

Fri, 9 Sep 2013
Brewer Science announced today that the next generation of carbon nanotube materials, the CNTRENE 1020 material series, is officially qualified for NRAM nanotube random access memory device manufacturing by Nantero Inc.

Worldwide total semiconductor market to grow 3% in 2013; consolidation still rife

Fri, 9 Sep 2013
The worldwide semiconductor market is expected to grow three percent from 2012 to 2013. There has been sequential market growth from 1Q13 to 2Q13 and the vast majority of the top 20 vendors are expecting 3Q13 to grow revenues again.

Spansion licenses ARM processor technology to power embedded systems

Mon, 9 Sep 2013
Spansion Inc. today announced it has licensed a wide range of ARM processors for its current and future product lineup aimed at embedded applications in the automotive, industrial and consumer markets.

Asia-Pac soars, Japan drops in regional semiconductor capex spending

Tue, 9 Sep 2013
Capex marketshare flips in Asia-Pac and Japan; Europe's share erodes while North America gains.

Leading-edge technology to be responsible for 2013 increase in pure-play foundry sales

Tue, 9 Sep 2013
TSMC forecast to sell $6.33 billion worth of ≤28nm devices this year, a 3x increase over 2012.

Packaging at The ConFab

Wed, 9 Sep 2013
At The ConFab conference in Las Vegas in June, Mike Ma, VP of Corporate R&D at Siliconware (SPIL), announced a new business model for interposer based SiP’s, namely the “turnkey OSAT model.” In his presentation “The expanding Role of OSATS in the Era of System Integration,” Ma looked at the obstacles to 2.5/3D implementation and came up with the conclusion that cost is still a significant deterrent to all segments.

Dow introduces new SOLDERON tin-silver plating chemistry for lead-free bump plating

Wed, 10 Oct 2013
Next-gen SnAg offers industry-leading plating rates and process flexibility for flipchip packages and interconnects

Blog Review October 14 2013

Mon, 10 Oct 2013
Recent blogs address semiconductors in healthcare (blood cell sorters), FinFETs and logic roadmaps, 450mm progress, panel level embedded tech, materials innovation, options to reduce mask write time, SOI and EUV.

ASMC 2014 offers opportunity for presenters

Thu, 11 Nov 2013
SEMI announced today that the deadline for presenters to submit an abstract for the 25th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 28.

Spansion launches family of flexible microcontrollers for the industrial "Internet of Things"

Mon, 11 Nov 2013
Designed for stringent industrial requirements, Spansion FM Family offers a range of high performance and low power solutions.

Rising demand for array IC packaging

Tue, 10 Oct 2013
Small form factor, high speed and performance, and high bandwidth capability with low battery consumption are desired traits for many packaging solutions for integrated circuits (ICs).

Power management, industrial analog units post strong gains

Fri, 10 Oct 2013
Total shipments of analog devices forecast to jump 14% in 2013.

Alpha and Omega Semiconductor introduces a new family of high performance common-drain MOSFETs

Mon, 10 Oct 2013
Alpha and Omega Semiconductor Limited this week released a new dual MOSFET family in the common-drain configuration in both DFN 5x6 and Micro-DFN 3.2x2 packages.

Scaling makes monolithic 3D IC practical

Mon, 10 Oct 2013
In the 1960s, James Early of Bell Labs proposed three-dimensional structures as a natural evolution for integrated circuits. Since then many attempts have been made to develop such a technology.

UK photonics industry must connect higher in the value chain

Wed, 10 Oct 2013
Carlos Lee, Director General of the European Photonics Industry Consortium (EPIC), moderated a discussion with executives from the UK photonics industry and filed this report.

EU project to industrialize world record high-density capacitors

Wed, 10 Oct 2013
CEA-Leti, Fraunhofer IPMS-CNT and three European companies have launched a two-year project to industrialize 3D integrated capacitors with world-record density using atomic layer deposition.

Memory materials revolution highlighted at SMC

Wed, 10 Oct 2013
While the number of materials used in semiconductor logic will increase approximately 50 percent in the transition from 32nm to 22nm production, the materials revolution in memory will be even more pronounced, challenging developers, manufacturers, equipment, and materials suppliers, according to experts speaking at the SEMI Strategic Materials Conference 2013, held in Santa Clara on October 16-17.

Micron appoints Brian Angell as VP of Advanced Controller Development

Thu, 10 Oct 2013
Micron Technology, Inc. today announced that the company has named Brian Angell, vice president, Advanced Controller Development.

MEMS devices for biomedical applications

Mon, 10 Oct 2013
Dr. Ramesh Ramadoss, Senior Manager in the MicroProbe Product Group of FormFactor Inc., provides an overview of MEMS and highlights a variety of applications in the biomedical area, including pressure sensors, inertial sensors, transducers for hearing aids, microfluidics for diagnostics and drug delivery, micromachined needles and microsurgical tools.

Managing legacy fabs and the role of secondary equipment

Wed, 10 Oct 2013
The choice between buying new systems from OEMs or fully capable refurbished gear from qualified used equipment vendors is examined.

Semiconductor industry leaders to examine the future of 3D NAND at Dec 10 event

Mon, 12 Dec 2013
Manufacturing 3D NAND designs requires overcoming formidable technical challenges to create extremely complex high-aspect-ratio structures.

Triton Microtechnologies receives funding to ramp up manufacturing of glass interposers

Tue, 10 Oct 2013
Start-up Triton Microtechnologies, a designer and manufacturer of ultra-thin glass interposers that enable advanced semiconductor-packaging solutions, has met six-month production milestones that have triggered an additional $3.2 million in funding.

Will 2014 be the Next Golden Year?

Wed, 10 Oct 2013
Some unexpected underdogs spur spending spree.

How to verify incident implant angles on medium current implants

Wed, 10 Oct 2013
Results can depend on the properties of the wafers used, the conditions of the implant, the conditions of the anneal process, and even the measurement technique.

Silicon interposers, CoWoS and microbumps

Wed, 10 Oct 2013
At the recent ECTC conference, various presentations addressed silicon interposers for 2.5D (Shinko), CoWoS reliability (TSMC) and microbumping (imec).

Toshiba launches new embedded NAND flash memory using 19nm process technology

Thu, 10 Oct 2013
Toshiba Corporation today announced the launch of new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology.

Are we using Moore's name in vain?

Tue, 11 Nov 2013
Clearly Moore's law is about cost, and Gordon Moore’s observation was that the optimum number of components (nowadays - transistors) to achieve minimum cost will double every year.

DecaWave launches industry's most precise indoor location, communication CMOS chip

Thu, 11 Nov 2013
Fabless semiconductor company DecaWave announced today its first single chip of the ScenSor wireless technology family, DW1000, which makes indoor location and communications more accurate, cost-effective and power-efficient than ever before.

SRC, Northeastern University research to increase tumble frequency range of next-generation mobile devices

Thu, 11 Nov 2013
Development of voltage-tunable radio frequency inductors boosts semiconductor and defense industry applications.

Plastic Electronics Conference to rotate between Dresden and Grenoble beginning in 2014

Thu, 11 Nov 2013
SEMI, the global trade organization representing the nano- and micro-electronic manufacturing supply chains, today announced that next year’s Plastic Electronics Conference (PE2014) will be held in Grenoble, France and alternate with Dresden, Germany in future years to better address pan-European opportunities and challenges in Plastic Electronics.

STMicroelectronics, Memoir Systems combine breakthrough memory, semiconductor process technologies

Thu, 11 Nov 2013
Efforts make embedded memory faster, cooler and simpler.

Toshiba starts shipments of CMOS image sensor for automotive view cameras

Mon, 11 Nov 2013
Toshiba Corporation today announced that started sample shipments of a VGA, 1/4 inch CMOS image sensor, “TCM5126GBA,” for automotive view cameras.

Xilinx ships industry's first 20nm all programmable product

Mon, 11 Nov 2013
Xilinx today announced first customer shipment of the semiconductor industry's first 20nm product manufactured by TSMC, and the PLD industry's first 20nm All Programmable device.

SIA awards Mike Splinter the Robert N. Noyce award

Mon, 11 Nov 2013
The Semiconductor Industry Association (SIA) today announced that Mike Splinter, former CEO and current executive chairman of the board of directors at Applied Materials, has been named the 2013 recipient of SIA's highest honor, the Robert N. Noyce Award.

FlipChip International acquires Millennium Microtech Shanghai

Tue, 11 Nov 2013
FlipChip International announced today the 100% acquisition of Millennium Microtech (Shanghai) - (MMS), a provider of fully integrated semiconductor packaging and testing services situated in the Zhang Jiang Hi- Tech Park, Pudong New Area, Shanghai, China.

STMicroelectronics teams with Yogitech to develop safety package for microcontrollers

Mon, 11 Nov 2013
STMicroelectronics and Yogitech, a provider of functional safety solutions, have signed an agreement to create a comprehensive package that will simplify the development and certification of safety-critical applications based on STM32 microcontrollers.

U.S. government awards AMD contract to research interconnect architectures

Tue, 11 Nov 2013
The DesignForward award supports the research of the interconnect architectures and technologies needed to support the data transfer capabilities in extreme-scale computing environments.

Above parity: SEMI releases October book-to-bill ratio

Wed, 11 Nov 2013
A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

SUSS MicroTec installs excimer laser stepper at Fraunhofer IZM Berlin

Wed, 11 Nov 2013
SUSS MicroTec has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.

GLOBALFOUNDRIES demonstrates model for next-generation chip packaging technologies

Thu, 11 Nov 2013
Foundry 2.0 partnership with Open-Silicon and Amkor Technology yields successful 2.5D test vehicle project.

Can Intel beat TSMC?

Mon, 11 Nov 2013
It would seem that if Intel could scale transistor cost as they have done in the last 40 years then they could win these super high volume consumer-oriented designs where cost is extremely important. And TSMC is clearly taking this seriously.

Open-Silicon and GLOBALFOUNDRIES demonstrate custom 28nm SoC using 2.5D technology

Thu, 11 Nov 2013
Open-Silicon, Inc., and GLOBALFOUNDRIES today announced the industry’s first demonstration of a functional system-on-chip (SoC) solution featuring two 28nm logic chips, with embedded ARM processors, connected across a 2.5D silicon interposer.

Unraveling the mind-body connection with power-efficient IC chip

Fri, 11 Nov 2013
Despite the advances in neuroscience research, the human brain remains a complex puzzle with questions unanswered on how it controls human behaviour, cognitive functions and movements.

Dongbu HiTek starts volume production of 5 megapixel CMOS image sensor chips

Mon, 11 Nov 2013
Dongbu HiTek today announced that it has begun volume production of 5.0 Megapixel (5M) CMOS Image Sensor (CIS) devices for Superpix Micro Technology Co., Ltd., a fabless customer based in Beijing.

2013 semiconductor equipment sales forecast $32B; strong growth forecast for 2014

Tue, 12 Dec 2013
SEMI projects that worldwide sales of new semiconductor manufacturing equipment will contract 13.3 percent to $32.0 billion in 2013.

Sankalp Semiconductor appoints Dan Clein into its management team

Tue, 12 Dec 2013
Sankalp Semiconductor Private Limited, a leading Analog Mixed-Signal services and solutions company from India, announced today the appointment of Mr. Dan Clein into its management team. Dan will be based out of the North America region.

Soitec announces high-volume manufacturing of new eSI substrates

Wed, 12 Dec 2013
Soitec, a manufacturer semiconductor materials for the electronics and energy industries, today announced it has reached high-volume manufacturing of its new Enhanced Signal Integrity (eSI) substrates, enabling cost-effective and high-performance radio-frequency (RF) devices.

Lab school brings manufacturing technologies to middle-school classrooms

Tue, 12 Dec 2013
A partnership among the University of Virginia's (UVa) Schools of Education and Engineering and the Charlottesville Public Schools has led to the launch of Buford Engineering Design Academy, a laboratory school for advanced manufacturing.

Cellphones pass PCs as biggest systems market and IC user

Tue, 12 Dec 2013
Tablets and wireless networks are expected to show highest growth rates through 2017.

Micron Technology appoints Rajan Rajgopal as VP of Quality

Wed, 12 Dec 2013
Micron Technology, Inc. today announced that the company has named Rajan Rajgopal, vice president of Quality.

Worldwide semiconductor revenue grew 5.2 percent in 2013

Wed, 12 Dec 2013
Worldwide semiconductor revenue totaled $315.4 billion in 2013, a 5.2 percent increase from 2012 revenue of $299.9 billion, according to preliminary results by Gartner, Inc.

Equipment spending down 2013; expect 33% growth in 2014

Fri, 12 Dec 2013
Fab construction projects boom in 2013 but slow in 2014.

CEA-Leti signs agreement with Qualcomm to assess sequential 3D technology

Mon, 12 Dec 2013
CEA-Leti today announced an agreement with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to assess the feasibility and the value of Leti’s sequential 3D technology.

STMicroelectronics launches new advanced energy-harvesting IC

Tue, 12 Dec 2013
STMicroelectronics is opening new avenues for energy-harvesting applications with its latest IC integrating all the functions needed to power electronic circuits and recharge batteries using either a solar cell or Thermo-Electric Generator (TEG).

Singapore-MIT Alliance for Research Technology orders EV Group automated production bonding system

Tue, 12 Dec 2013
SMART, which is a leading research center established by the Massachusetts Institute of Technology (MIT) in partnership with the National Research Foundation of Singapore, will utilize the EVG850LT system to support its advanced substrate development efforts.

SEMICON West “Call for Papers” for New Semiconductor Technology Symposium, Science Park and TechXPOTs

Tue, 12 Dec 2013
SEMI today announced a “Call for Papers” for the new Semiconductor Technology Symposium, the popular TechXPOT programs, and a new Science Park program featuring university research and advanced R&D subjects at SEMICON West, North America’s premier microelectronics event, to be held July 8-10 at the Moscone Center in San Francisco, Calif.

Micron's high-density 45nm serial NOR Flash doubles programming speed for embedded applications

Tue, 12 Dec 2013
Micron Technology, Inc. today announced the availability of 45nm Serial NOR Flash memory samples in 512Mb, 1Gb, and 2Gb densities with a standard SPI interface.

#5: Nanofluidic Channels for Lab-on-Chip

Tue, 12 Dec 2012

#10: Visualizing CBRAM Filaments

Tue, 12 Dec 2012

#1: Triangular MOSFETs with InGaAs Channels

Tue, 12 Dec 2012

#2: Thermally Stable Magnetic Tunnel Junction Memory

Tue, 12 Dec 2012

#3: TSMC’s Integrated 16nm FinFET Technology Platform

Tue, 12 Dec 2012

#4: Monolithic 3D Chip

Tue, 12 Dec 2012

#6: Novel Nanopore Sensor for DNA Sequencing

Tue, 12 Dec 2012

#7: Hybrid Nanowire/CMOS Biosensor

Tue, 12 Dec 2012

#8: 300mm wafer-scale Ge FinFET

Tue, 12 Dec 2012

#9: Record Silicon Nanowire MOSFETs

Tue, 12 Dec 2012

#11: Fastest Ge p-MOSFET

Tue, 12 Dec 2012

Slideshow: IEDM 2013 Highlights

Wed, 12 Dec 2013
This week, industry leaders and experts have gathered in Washington D.C. at the 59th annual IEEE International Electron Device Meeting (IEDM) conference.

Power modules get their own upside-down C-SAM system

Thu, 12 Dec 2013
Sonoscan has shipped the first of its new D9600Z C-SAM systems. This new model is designed expressly to facilitate the imaging of IGBT (Insulated Gate Bipolar Transistor) power modules.

Celebrating 20 years of BSIM3v3 SPICE models

Thu, 12 Dec 2013
Zhihong Liu of ProPlus Designs reflects on the history of the MOSFET SPICE model called BSIM3.

AMD and Hynix announce joint development of HBM memory stacks

Mon, 12 Dec 2013
3DIC memory, and therefore all of 2.5/3D technology, took one step closer to full commercialization last week with the HBM joint development announcement from AMD and Hynix at the RTI 3D ASIP meeting in Burlingame CA.

Micron collaborates with Broadcom to solve DRAM timing challenge

Tue, 12 Dec 2013
Micron Technology, Inc., a providers of advanced semiconductor solutions, today announced its collaboration with Broadcom Corporation to develop the industry's first solution designed for customers challenged by an intrinsic DDR3 timing parameter called tFAW, or four activate window.

MACOM successfully completes tender offer for Mindspeed Technologies

Wed, 12 Dec 2013
M/A-COM Technology Solutions Holdings, Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced that it has successfully completed its previously announced tender offer to purchase all outstanding shares of common stock of Mindspeed Technologies, Inc. for $5.05 per share in cash.

Spansion dual-quad serial flash delivers performance for graphic-rich applications

Wed, 12 Dec 2013
Universal footprint enables common pinout with current and future high-speed memory.

Intel ends 2013 with a bang

Wed, 12 Dec 2013
ABI Research verified that Intel has a leading position in the mobile processor technology race; launching the first 22nm mobile application processor.

Mentor Graphics announces president and managing director for Japan

Fri, 12 Dec 2013
Mentor Graphics Corporation yesterday announced Greg Helton as president and managing director for Mentor Graphics Japan.

Micron revenue surges after Elpida deal officially closes

Mon, 12 Dec 2013
Micron Technology surged 130 percent in revenue during the third quarter as it finally closed its acquisition of bankrupt Elpida Memory of Japan, a vigorous ascent that also propelled the total market for dynamic random access memory (DRAM) to its best performance yet in 11 quarters.

Samsung releases 8Gb mobile DRAM

Fri, 1 Jan 2014
Samsung announced today that it has developed the industry’s first eight gigabit, low power double data rate 4, mobile DRAM.

Architecture from STMicroelectronics leads industry transition to 64-bit computing

Mon, 1 Jan 2014
STMicroelectronics has released details of its STi8K architecture addressing future Systems-on-Chips (SoCs).

Toshiba announces "Bright Mode" for CMOS image sensors

Tue, 1 Jan 2014
Toshiba Corporation today announced the development of “Bright Mode,” a CMOS image sensor technology that allows smartphones and tablets to record full HD video at 240 frames per second (fps), the industry’s highest frame rate. “Bright Mode” realizes high quality slow motion playback.

TOWA launches new Packaging Development Center

Thu, 1 Jan 2014
The TOWA Corporation of Japan, a supplier of packaging equipment for semiconductor, electronics and LED industries, has decided to expand their activities in Europe with an Innovation Center for Packaging Development and announced the launch of TOWA Europe B.V.

TSMC, Samsung and Micron top list of IC industry capacity leaders

Thu, 1 Jan 2014
The top 10 companies now hold 67% of worldwide IC industry capacity, up from 54% in 2009.

"Crisis? What Crisis?": New paradigm adjustments for capacity and equipment spending

Thu, 1 Jan 2014
Worldwide, the semiconductor industry growth rate back in 1973 was about 30 percent and slipped into 1975 with negative sales growth rates.

6) ZAGG Inc introduces new range of portable batteries and power products

Sun, 1 Jan 2010

9) Conexant’s new voice input processor for Smart TVs provides smarter audio experience

Sun, 1 Jan 2010

Slideshow: CES 2014 Highlights

Fri, 1 Jan 2014
This week in Las Vegas, the 2014 International Consumer Electronics Show focused on the Internet of Things, displaying many connected gadgets and services.

3) Invensas shows new xFD-based customer products with Etron Technology

Sun, 1 Jan 2010

Imec, AlixPartners to develop model for lowering costs of advanced semiconductor tech

Mon, 1 Jan 2014
Patterning options for N10/N7 nodes, advanced packaging solutions and 3D NAND memory to be targeted.

Progress on 450mm at G450C

Thu, 1 Jan 2014
At Semicon Europa, Paul Farrar, general manager of G450C, provided an update on the consortium’s progress in demonstrating 450mm process capability. He said 25 tools will be installed in the Albany cleanroom by the end of 2013, progress has been made on notchless wafers with a 1.5mm edge exclusion zone, they have seen significant progress in wafer quality, and automation and wafer carriers are working.

EV Group ships temporary bonding/debonding system to Fraunhofer ISIT

Tue, 1 Jan 2014
EV Group today announced that the Fraunhofer Institute for Silicon Technology (ISIT) has purchased an EVG 850TB/DB fully automated bonding/debonding equipment solution.

Imec celebrates 30 years

Tue, 1 Jan 2014
Nanotechnology research and development center imec, today announced the celebration of its 30th anniversary.

Economic recovery and pervasive computing to propel semiconductor manufacturing supply chain

Tue, 1 Jan 2014
Macroeconomic and microelectronic industry growth opportunities and innovation challenges underscored diverse perspectives from analysts, economists, technologists, semiconductor manufacturers and supply chain executives speaking at the SEMI Industry Strategy Symposium (ISS) that opened yesterday.

Microprocessor sales growth will strengthen slightly in 2014

Tue, 1 Jan 2014
A modest recovery in personal computers this year is expected to slightly strengthen overall sales growth in microprocessors, which is forecast to rise 9 percent in 2014 to a record-high $66.7 billion compared to $61.0 billion in 2013.

Xilinx and University of Florida honored with SEMI Award for advancements in interposers and CMOS fab process

Wed, 1 Jan 2014
SEMI today announced that two teams — from the University of Florida and Xilinx — are recipients of the 2013 SEMI Award for North America.

Semiconductor plastic packaging materials market to approach $21B by 2017

Wed, 1 Jan 2014
The market for semiconductor packaging materials, including thermal interface materials, is expected to maintain its $20 billion value through 2017, despite shifts away from the use of precious metals such as gold in wire bonding.

ARM and UMC extend 28nm partnership

Thu, 1 Jan 2014
ARM and global semiconductor foundry UMC this week announced an agreement to offer the ARM Artisan physical IP platform along with POP IP for UMC’s 28nm high-performance low-power (HLP) process technology.

3DIC market to reach $7.52B by 2019

Thu, 1 Jan 2014
The market for 3DICs globally is forecast to reach USD 7.52 billion by 2019, according to a new market report published by transparency market research.

Intel vs. TSMC: An Update

Tue, 1 Jan 2014
On January 14, 2014, we read on the Investors.com headlines page - Intel Seen Gaining Huge Pricing Advantage Over TSMC. Just three days later comes the responding headline: TSMC: We're "Far Superior" to Intel and Samsung as a Partner Fab.

Besi and Imec collaborate on thermocompression technology

Tue, 1 Jan 2014
Today, at the SEMI European 3D TSV Summit, nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput.

Natural 3D counterpart to graphene discovered

Tue, 1 Jan 2014
The discovery of what is essentially a 3D version of graphene promises exciting new things to come for the high-tech industry, including much faster transistors and far more compact hard drives.

Optical Interconnects Conference 2014 to be held in Coronado, CA

Tue, 1 Jan 2014
The 2014 Optical Interconnects Conference, sponsored by the IEEE Photonics Society, announces a Call for Papers for the 25th anniversary of this premier conference, dedicated to bringing advanced interconnect technologies from research labs to commercial realization.

Green manufacturing: What you need to know

Thu, 1 Jan 2014
Green is the color for the decade and future decades as each country is developing its own standards for energy consumption and implementing its green initiatives.

A bilayer temporary bonding solution for 3D-IC TSV fabrication

Thu, 1 Jan 2014
New technology eliminates the need for specialized equipment for wafer pre- or post-treatment.

Substrate impact on 2.5/3D IC costs

Thu, 1 Jan 2014
At the recent Georgia Tech Global Interposer Technology (GIT) Workshop in Atlanta, the pervasive theme appeared to be whether a change in substrate is required to lower overall costs and help drive HVM (high volume manufacturing) applications.

FinFET evolution for the 7nm and 5nm CMOS technology nodes

Thu, 1 Jan 2014
In addition to extending the fin-based design investments, augmenting the FinFET for improved performance allows an evolution of the process infrastructure for a few more nodes.

Synthetic diamond’s role in thermal management

Thu, 1 Jan 2014
Synthetic diamond is ideally suited for thermal management of semiconductor packaging, as it combines exceptionally high thermal conductivity with electrical isolation.

Keys to success: Testing in the New Mobile World

Thu, 1 Jan 2013
The semiconductor industry is moving from a PC-centric, digital era to a communication and mobile world.

2014 Outlook: An era of unprecedented change

Fri, 1 Jan 2014
We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.

Cyclical upturn continues in 2014: Positive yet cautious expectations persist

Thu, 1 Jan 2013
In 2013, the IC industry emerged from a difficult 5-year period of minimal growth and started on its next cyclical upturn, a welcome piece of news.

Outlook for semiconductors and the value chain in 2014

Thu, 1 Jan 2013
We approach 2014 with a combination of positive policy, financial, and economic forces that will push world growth up to a +3% range.

Coming year promises increased capital spending and continued need for effective industry collaboration

Thu, 1 Jan 2013
For most of the past 15 years, the industry has displayed a fairly predictable pattern of fab equipment spending, characterized generally by two years of decline followed by two years of positive growth.

The shift to materials-enabled 3D

Thu, 1 Jan 2013
Innovations in mobile computing and communications will continue to be a driving factor for the semiconductor equipment industry.

Innovation and collaboration key in 2014

Thu, 1 Jan 2013
As far as the outlook goes for 2014-2015, investments coming from the semiconductor and microelectronics industries are going to be pretty robust.

Can we keep on benefiting from Moore’s Law?

Thu, 1 Jan 2013
For almost five decades, performance improvements and cost reduction of ICs have been cornerstones of the growth of the semiconductor industry.

Key market and technology trends in the sub-20nm era

Thu, 1 Jan 2013
Keeping up with Moore’s Law has always required significant investment and ingenuity, and this era brings additional challenges in device structures, materials and methodologies.

Challenges and innovations on front-end and 3D TSV

Thu, 1 Jan 2013
Looking at 2014, we see challenges and innovations in both the front-end semiconductor and 3D TSV markets.

Book-to-bill ratio continues to improve

Fri, 1 Jan 2014
The December three-month average bookings were at the highest level since June 2012 — a positive sign for the 2014 spending outlook.

Apple and Samsung are top OEMs, again, in semiconductor spending for 2013

Mon, 1 Jan 2014
Apple and Samsung remained the world’s largest buyers of semiconductor chips in 2013, but the intensifying battle between the two for the hearts and minds of consumers in their product offerings could presage another mighty showdown this year for the top ranking, according to a new report from IHS Technology.

Mobile PCs, smartphones will be top revenue opportunities for IC suppliers in high-speed wireless device market

Mon, 1 Jan 2014
Mobile PCs and smartphones will represent the top revenue opportunities for high-speed wireless integrated circuit (IC) suppliers by 2018, as these devices are projected to be the highest-volume applications in this market over the next five years.

Cooling microprocessors with carbon nanotubes

Tue, 1 Jan 2014
Researchers with the U.S. Department of Energy (DOE)’s Lawrence Berkeley National Laboratory (Berkeley Lab) have developed a “process friendly” technique that would enable the cooling of microprocessor chips through carbon nanotubes.

Slimpin promoted to director in SwRI’s Applied Physics Division

Tue, 1 Jan 2014
David G. Slimpin has been promoted to director of the Electronics Systems and Robotics Department in the Applied Physics Division at Southwest Research Institute (SwRI). He was previously a program manager in the department.

Crocus licences MLU technology to ARM

Wed, 1 Jan 2014
Crocus Technology today announces it has licensed its Magnetic Logic Unit technology to ARM.

New "photodetector" nanotechnology allows photos in near darkness

Wed, 1 Jan 2014
Dark and blurry low light photos could soon be a thing of the past, thanks to the development of game-changing ultrathin “nanosheets,” which could dramatically improve imaging technology used in everything from cell phone cameras, video cameras, solar cells, and even medical imaging equipment such as MRI machines.

Novoset, LLC and Lonza introduce new, ultra-low dielectric loss and high temperature materials

Thu, 1 Jan 2014
Novoset, LLC and Lonza are pleased to announce the introduction of Primaset ULL-950 and Primaset HTL-300 ultra-low loss and high temperature thermoset materials for the telecommunication and advanced semiconductor packaging industries.

2014 capital spending up in Korea; SEMICON Korea to address mobile innovation

Fri, 1 Jan 2014
With Korea expected to be the second largest region for fab construction spending in 2014, industry leaders will convene at SEMICON Korea 2014 in Seoul on February 12-14 to discuss the latest trends and technologies shaping the future of microelectronics manufacturing.

Global wafer-level packaging equipment market to grow at a CAGR of 2.9

Wed, 2 Feb 2014
Analysts at ReportsNReports.com forecast the global wafer-level packaging equipment market to grow at a CAGR of 2.9 percent over the period 2013-2018.

The 2014 European 2.5/3DIC Summit

Thu, 2 Feb 2014
SEMI’s second annual European 3D TSV Summit was held in Grenoble in late January. Three hundred and twenty attendees met to discuss the status of 2.5/3DIC and other advanced packaging technologies.

Silicon reclaim wafer market increased 14% in 2013

Thu, 2 Feb 2014
The worldwide reclaim wafer market is estimated at $460 million in 2013 and is forecasted to reach $493 million by 2015, according to SEMI.

Executives debate innovation drivers and cost reduction in microelectronics supply chain

Thu, 2 Feb 2014
The closing Executive Panel discussion at the SEMI Industry Strategy Symposium on January 15 provoked diverse views on the drivers and future of innovation in the microelectronics manufacturing supply chain.

EV Group unveils high-volume manufacturing photoresist processing system

Tue, 2 Feb 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing.

SPTS Technologies opens new office in Korea

Thu, 2 Feb 2014
SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets today announced the opening of a new office in Korea.

Honeywell releases new RadLo low alpha plating anodes for semiconductor packaging applicatons

Fri, 2 Feb 2014
Honeywell announced today that it has introduced new RadLo low alpha plating anodes based on proprietary technology to help reduce alpha particle radiation that can lead to data errors in semiconductors.

Renesas Electronics develops industry's first 28nm embedded flash memory tech for microcontrollers

Tue, 2 Feb 2014
Renesas Electronics Corporation today announced that it has developed the industry's first 28nm flash memory intellectual property (IP) for microcontrollers (MCUs) using a 28nm process technology.

Breakthrough development in 1D-1R memory cell array

Tue, 2 Feb 2014
Dr. Tae-Wook Kim at KIST announced their successful development of a 64-bit memory array using flexible and twistable carbon nano material and organo-polymer compound, which can accurately store and delete data.

World's first 79 GHz radar transmitter in 28nm CMOS

Tue, 2 Feb 2014
Imec, in collaboration with Vrije Universiteit Brussel, Brussels, Belgium, presents the world’s first 79 GHz radar transmitter implemented in plain digital 28nm CMOS.

The most expensive SRAM in the world - 2.0

Thu, 2 Feb 2014
Embedded SRAM scaling is broken and, with it, Moore's Law.

Semiconductor industry posts record sales in 2013

Thu, 2 Feb 2014
The Semiconductor Industry Association announced that worldwide semiconductor sales for 2013 reached $305.6 billion, the industry’s highest-ever annual total and an increase of 4.8 percent from the 2012 total of $291.6 billion.

Epoxy Technology and John P. Kummer Group announce a new specialty adhesive packaging company

Thu, 2 Feb 2014
Epoxy Technology, Inc. and John P. Kummer Group announce the formation of a new specialty adhesive packaging company, Epoxy Technology Europe Ltd (ETEL).

Samsung and UCSF partner to accelerate new innovations in preventive health technology

Fri, 2 Feb 2014
Samsung Electronics Co., Ltd., and the University of California, San Francisco (UCSF) announced a partnership to accelerate validation and commercialization of promising new sensors, algorithms, and digital health technologies for preventive health solutions.

SMIC and JCET establish joint venture for 12 inch bumping and testing

Fri, 2 Feb 2014
Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, and Jiangsu Changjiang Electronics Technology Co., Ltd., the largest packaging service provider in China, jointly announced today a joint venture for 12" bumping and related testing.

North American semiconductor equipment industry posts January 2014 book-to-bill ratio of 1.04

Fri, 2 Feb 2014
A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

Call for Papers open for SEMICON Europa 2014, Plastics Electronics Conference

Mon, 2 Feb 2014
SEMI announced the “Call for Papers” for technical sessions and presentations for SEMICON Europa 2014 which takes place October 7-9 in Grenoble, France.

Moore's Law has stopped at 28nm

Wed, 3 Mar 2014
While many have recently predicted the imminent demise of Moore’s Law, we need to recognize that this actually has happened at 28nm.

Global failure analysis equipment market to grow at CAGR of 8.8% from 2013 to 2019

Wed, 3 Mar 2014
Rapid growth in nanotechnology coupled with growth in medical applications in the Asia Pacific region has fueled the growth of failure analysis equipment market.

Samsung expands its 28nm technology offerings

Thu, 3 Mar 2014
Samsung Electronics, Co., Ltd. today announced that it has expanded its 28nm technology offerings with the addition of RF capabilities.

New research could help make "roll-up" digital screens a reality for all

Thu, 3 Mar 2014
Researchers from the University of Surrey worked together with scientists from Philips to further develop the 'Source-Gated-Transistor' (SGT) - a simple circuit component invented jointly by the teams.

Micron appoints Darren Thomas as VP of Storage Business Unit

Thu, 3 Mar 2014
Micron Technology, Inc. this week announced that Darren Thomas has been named as vice president of Micron's Storage business unit.

Weaker yen impact on the 2013 material and equipment market size

Thu, 3 Mar 2014
Semiconductor industry revenues reported by the World Semiconductor Trade Statistics (WSTS) reached a record high in 2013 with global revenues totaling over $305 million.

MACOM introduces new addition to GaN in Plastic series

Fri, 3 Mar 2014
M/A-COM Technology Solutions Inc. (MACOM), a supplier of high performance RF, microwave, and millimeter wave products, introduced today its newest addition to the GaN in Plastic series.

Plug-and-play test strategy for 3D ICs

Tue, 3 Mar 2014
Three-dimensional (3D) ICs, chips assembled from multiple vertically stacked die, are coming. They offer better performance, reduced power, and improved yield.

Samsung now mass producing the most advanced 4Gb DDR3 using 20nm process technology

Tue, 3 Mar 2014
Samsung Electronics today announced that it is mass producing the most advanced DDR3 memory, based on a new 20nm process technology, for use in a wide range of computing applications.

STATS ChipPAC introduces breakthrough manufacturing method for wafer level packaging

Wed, 3 Mar 2014
STATS ChipPAC, a provider of advanced semiconductor packaging and test services, has designed and implemented an innovative new manufacturing method that is a significant paradigm shift from conventional wafer level manufacturing.

Advancing the Russian microelectronics industry — SEMICON Russia 2014

Wed, 3 Mar 2014
On May 13-15, the key industry players, science institutes and innovation business representatives will gather in Moscow at SEMICON Russia — the premier Russian semiconductor exhibition and conference.

Imec achieves record 8.4 percent conversion efficiency in fullerene-free organic solar cell

Wed, 3 Mar 2014
In this week’s Nature Communications, imec presents the development of fullerene-free organic photovoltaic (OPV) multilayer stacks achieving a record conversion efficiency of 8.4 percent.

SanDisk files lawsuit against SK Hynix for theft of trade secrets

Thu, 3 Mar 2014
These actions relate to the theft of trade secrets related to NAND flash technology by a former engineer of SanDisk who left the company in 2008 to work for SK Hynix.

Silicon Innovation Forum to expand in 2014

Thu, 3 Mar 2014
Coordinated by SEMI, the Silicon Innovation Forum is organized by leading strategic investment groups in the global semiconductor industry including: Applied Ventures, Dow Ventures, Intel Capital, Micron Ventures, TEL Venture Capital, BASF Ventures, and Samsung Ventures.

Toshiba brings civil suit against SK Hynix

Fri, 3 Mar 2014
Toshiba Corporation announced that it has brought a civil suit against Korea’s SK Hynix Inc. at the Tokyo District Court, under Japan’s Unfair Competition Prevention Act.

Mega Fluid Systems and Entrepix join forces to offer complete CMP system

Mon, 3 Mar 2014
Mega Fluid Systems Inc., a supplier of chemical and slurry delivery equipment, and Entrepix Inc., a provider of chemical mechanical polishing (CMP) equipment and process services, today announced a partnership agreement.

EV Group establishes China headquarters in Shanghai

Tue, 3 Mar 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has opened a new, wholly owned subsidiary in Shanghai, called EV Group China Ltd.

MKS to acquire Granville-Phillips division of Brooks Automation

Tue, 3 Mar 2014
MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, today announced it has agreed to purchase the assets of Granville-Phillips, a division of Brooks Automation, Inc., for $87 million in cash.

SRC, UC Berkeley research promises to revolutionize electronic circuit design

Wed, 3 Mar 2014
Research from University of California, Berkeley scientists sponsored by Semiconductor Research Corporation (SRC) promises to revolutionize portable radio frequency (RF) electronics and communication systems via advancements in on-chip inductors by leveraging embedded nanomagnets.

M+W Group and Siemens to collaborate on process control technology solution for battery production

Wed, 3 Mar 2014
Siemens Industry Automation Division and M+W Group have joined forces with the aim to advance the development of production technology for battery manufacturing and develop a complete control technology solution for the mass production of large-size batteries.

MediaTek to deploy Synopsys IC Compiler for hierarchical design implementation

Wed, 3 Mar 2014
Synopsys, Inc. today announced that MediaTek Inc., a fabless semiconductor company for wireless communications and digital multimedia solutions, has initiated deployment of Synopsys' IC Compiler place and route solution for hierarchical design implementation.

Applied Materials honored as a 2014 World's Most Ethical Company

Thu, 3 Mar 2014
Applied Materials, Inc. today announced that it was named a 2014 World's Most Ethical Company by the Ethisphere Institute, an independent center of research promoting best practices in corporate ethics and governance.

Mentor Graphics acquires Berkeley Design Automation

Fri, 3 Mar 2014
Mentor Graphics Corp. today announced that it has acquired Berkeley Design Automation, Inc. BDA addresses nanometer circuit design challenges via its Analog FastSPICE unified verification platform and exceptional vertical-application expertise.

Enabling mobility for IoT with advanced semiconductor technology - at SEMICON Singapore 2014

Thu, 3 Mar 2014
SEMICON Singapore will focus on the advanced technology developments to enable mobility for the Internet of Things (IoT).

Highlights from the IMAPS Device Packaging Conference

Mon, 3 Mar 2014
The annual IMAPS Device Packaging Conference in Ft McDowell AZ is always a source for the latest packaging information.

Altera and Intel extend manufacturing partnership to include development of multi-die devices

Wed, 3 Mar 2014
Collaboration will optimize integration of 14nm Tri-Gate Stratix 10 FPGAs with heterogeneous technologies into a single system-in-a-package.

eInfochips opens new design services specializing in 16nm geometry

Wed, 3 Mar 2014
eInfochips, a semiconductor and product engineering company, today launched design services for chips based on 16nm geometry.

Heat-conducting polymer cools hot electronic devices at 200 degrees C

Mon, 3 Mar 2014
Polymer materials are usually thermal insulators. But by harnessing an electropolymerization process to produce aligned arrays of polymer nanofibers, researchers have developed a thermal interface material able to conduct heat 20 times better than the original polymer. The modified material can reliably operate at temperatures of up to 200 degrees Celsius.

SEMATECH announces leadership changes

Mon, 3 Mar 2014
SEMATECH, the global consortium of semiconductor manufacturers, announced today that Ronald Goldblatt, vice president of Technical Strategy and Operations, has been appointed by the board of directors as acting president and chief executive officer, effective immediately.

Researchers improve performance of III-V nanowire solar cells on graphene

Tue, 4 Apr 2014
Researchers at the University of Illinois at Urbana-Champaign have achieved new levels of performance for seed-free and substrate-free arrays of nanowires from class of materials called III-V (three-five) directly on graphene

MACOM announces IP licensing program for GaN-on-Si technology

Tue, 4 Apr 2014
M/A-COM Technology Solutions Inc. this week announced an IP licensing program for Gallium Nitride (GaN) on Silicon technology.

SureCore's 28nm silicon tests confirm world leading power efficiency

Tue, 4 Apr 2014
SureCore Ltd has today announced that early testing of its innovative low power SRAM design confirms its simulations that deliver in excess of 50 percent power savings over other SRAM technologies.

ON Semiconductor to acquire Trusense Imaging, Inc.

Thu, 4 Apr 2014
ON Semiconductor today signed a definitive agreement to acquire Truesense Imaging, Inc., a provider of high-performance image sensor devices addressing a wide range of industrial end-markets including machine vision, surveillance, traffic monitoring, medical and scientific imaging, and photography.

The sustainable manufacturing imperative

Thu, 4 Apr 2014
While sometimes seen as a social, legal and regulatory obligation, sustainability is increasingly considered a differentiating factor in global competitiveness relative to the technologies and products being provided.

2013: A year in review

Fri, 4 Apr 2014
2013 was a record year in terms of semiconductor device revenues; the industry finally exceeded the long elusive $300 billion mark, registering almost 5 percent growth according to the SIA.

ROHM Semiconductor and imec join forces for ultra-low power radio R&D

Mon, 4 Apr 2014
Nanoelectronics research center imec and ROHM Semiconductor Co. Ltd., a world-leading supplier of electronic components, announced today that they have entered into a strategic partnership for research collaboration on ultra-low power (ULP) radio technology for small battery-operated wireless devices.

SEMI reports 2013 global semiconductor materials sales of $43.5B USD

Mon, 4 Apr 2014
The global semiconductor materials market decreased 3 percent in 2013 compared to 2012 while worldwide semiconductor revenues increased 5 percent.

Global Semiconductor Alliance celebrates 20 years of industry collaboration

Tue, 4 Apr 2014
The Global Semiconductor Alliance (GSA) is celebrating 20 years of industry collaboration this year.

February semiconductor sales up 11.4 percent compared to last year

Wed, 4 Apr 2014
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $25.87 billion for the month of February 2014, an increase of 11.4 percent from February 2013 when sales were $23.23 billion.

SEMI announces Innovation Village at SEMICON Europa 2014

Wed, 4 Apr 2014
After the successful premier of a program to connect early-stage companies with strategic investors and venture capitalists (VCs) in the U.S., SEMI is expanding the program to Europe as part of SEMICON Europa 2014 in Grenoble, France (October 7-9).

Dynaloy scientists to highlight time- and money-saving benefits of new single wafer cleaning technology

Wed, 4 Apr 2014
Scientists from Dynaloy, LLC and EV Group will explain a new, one-step cleaning process for removing negative dry film and negative spin-on film photoresist on April 24, 2014 at the SEMATECH Surface Preparation and Cleaning Conference in Austin, Texas.

Deca Technologies ships 100-millionth wafer-level packaged component

Wed, 4 Apr 2014
Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth component.

In the permanent bonding market, EV Group is leading, Applied Materials and Tokyo Electron are merging

Fri, 4 Apr 2014
Permanent bonding technology is a key process for a wide range of applications in the semiconductor industry such as MEMS, advanced packaging, LED devices, and SOI substrate applications.

SEMI announces 2nd Vietnam Semiconductor Strategy Summit

Fri, 4 Apr 2014
Following the successful inaugural event in 2013, the 2nd annual SEMI Vietnam Semiconductor Strategy Summit will be held September 16-17, 2014 at the InterContinental Asiana Saigon Hotel in Ho Chi Minh City.

Altera and TSMC collaborate to bring advanced packaging technology to Arria 10 FPGAs and SoCs

Mon, 4 Apr 2014
Altera Corporation and TSMC today announced the two companies have worked together to bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20 nm Arria 10 FPGAs and SoCs.

Cadence to acquire Jasper Design Automation

Mon, 4 Apr 2014
Cadence Design Systems, Inc. today announced plans to acquire Jasper Design Automation, Inc., a provider of formal analysis solutions, for approximately $170 million in cash.

New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

Tue, 4 Apr 2014
The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format.

STS Semiconductor and Invensas to partner on high volume bond via array mobile solutions

Tue, 4 Apr 2014
Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas' Bond Via Array (BVATM) technology for next generation smartphone and tablet customers.

Contour Semiconductor names former Intel exec as new CEO

Tue, 4 Apr 2014
Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.