Packaging-and-Testing

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ISSYS Receives NSF Grant to Develop Wafer-level, Hermetic, Hybrid Integration of MEMS and Electronics

Thu, 10 Oct 2007
(October 4, 2007) YPSILANTI, MI— Integrated Sensing Systems, Inc. (ISSYS) was awarded a Phase II Small Business Innovation Research contract from the National Science Foundation (NSF). The 2-year project, "Wafer-Scale, Hermetic, Packaging of MEMS-Based Systems," is aimed towards development of a novel packaging method to simplify the packaging of MEMS and their associated electronics.

Lasers package ultrathin semiconductors at low cost, high volume

Wed, 10 Oct 2011

North Dakota State University, Fargo, researchers have developed a packaging technology using Thermo-Mechanical Selective Laser Assisted Die Transfer (tmSLADT) to reduce the size and cost of microelectronics packages.


TSV electroplating dev team unites SVTC, Amerimade Technology, Shanghai Sinyang Semiconductor Materials

Wed, 10 Oct 2011

Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will collaborate on electroplating processes for TSV that are production-ready for advanced packages and MEMS.


Thin wafers win majority in electronics by 2016

Thu, 10 Oct 2011

Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole D

Hesse & Knipps discusses wedge bonding for RF and microwave devices at workshop

Wed, 1 Jan 2012

Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Wedge Bonding for RF and Microwave Devices" at the Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging


Present at ESTC 2012 in Amsterdam

Tue, 2 Feb 2012

Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.


X-FAB Silicon Foundries adopts SFT software

Fri, 2 Feb 2012

X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18

3M debuts high-capacitance ECM for IC packaging, RF, other apps

Thu, 2 Feb 2012

3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI).


3D MID sensor fabricated with Ticona laser-activated LCP circuits

Wed, 1 Jan 2012

2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic circuits. The Vectra E840i forms circuits on 3D injection moldings produced with an LDS process.


AMEC debuts TSV etch tool with Chinese installations

Wed, 3 Mar 2012

Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.


EVG enhances fusion wafer bonder throughput, accuracy

Wed, 9 Sep 2011

EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20WPH with enhanced automation capabilities and low-temperature processing.


SUSS MicroTec sends equipment to SVTC in MEMS, 3D IC dev partnership

Tue, 11 Nov 2011

Nanotechnology accelerator SVTC Technologies partnered with SUSS MicroTec on wafer-level packaging for MEMS, and 3D IC bonding technology development.


SEMATECH creates 3D packaging standards development forum

Mon, 11 Nov 2011

SEMATECH has created an online 3D Standards Dashboard, allowing 3D semiconductor and MEMS interconnect professionals to exchange standards activity information.


Silicon interposer partnership sets roadmap

Tue, 12 Dec 2011

Singapore's A*STAR IME and 3D IC developer Tezzaron Semiconductor signed a research collaboration agreement to develop and exploit advanced through silicon interposer (TSI) technology.


inTEST to acquire Thermonics division of Test Enterprises

Tue, 12 Dec 2011

inTEST will acquire the assets and certain liabilities of Thermonics from Test Enerprises. inTEST's Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.


2012 ITRS update: Back-end packaging and MEMS

Fri, 7 Jul 2012

At SEMICON West, the working groups of the International Technology Roadmap for Semiconductors (ITRS) outlined 2012 updates to the roadmap. Check out the back-end process info here.


SemiSouth-sends-SiC-die-to-Micross-for-hermetic-packaging-aimed-at-mil-aero-drilling-apps

Tue, 12 Dec 2010

Micross Components, Inc. and SemiSouth Laboratories, Inc. announced a collaborative effort to expand SemiSouth's line of Silicon Carbide (SiC) Power JFETs and Schottky Diodes. SemiSouth will provide select JFET and diode die to Micross for packaging and test in metal hermetic packages


Gyroscope integrates MEMS/ASIC in custom package

Mon, 8 Aug 2010

Sensonor Technologies is developing SAR500, a novel high-precision, low-noise, high-stability, calibrated and compensated digital oscillatory gyroscope with SPI interface housed in a custom-made ceramic package.


Roadmapping More than Moore: When the application matters

Fri, 7 Jul 2012

At the ITRS 2012 update, back-end technologies session, at SEMICON West, roadmapping for More than Moore was addressed as both a philosophical and technical matter.


Tessera: Adding Vista Point Technologies, losing Powertech Technology?

Mon, 7 Jul 2012

Tessera received notice from Powertech Technology Inc. (PTI) that it will terminate its license agreement with the semiconductor packaging and optics technology company. Tessera also completed phase 1 of its acquisition of camera module technologies from Flextronics.


Mold packaging meets metal TSV for 5-10x density of conventional substrates

Thu, 4 Apr 2012

Silex Microsystems brought its Met-Via full-wafer-thickness TSV technology into Chip Architectures by Joint Associated Labs for European Diagnostics, where it is being used to create cost-effective molded chip-level packaging with through metal vias.


Conference Report: MEMS Executive Congress Europe

Mon, 4 Apr 2012

Karen Lightman, the Managing Director of the MEMS Industry Group, blogs from the MEMS Executive Congress Europe, which was held March 20th, in Zurich, Switzerland.

 


Field Report: Sensors in Design 2012

Thu, 3 Mar 2012

Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.


2011 ITRS: DRAM, 3D Flash, MEMS, nano scaling steal the show

Wed, 2 Feb 2012

The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.


Metrology tool offers economical price point with high accuracy

Mon, 4 Apr 2012

Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.


Conference Report: MRS Spring 2012, Day 4

Fri, 4 Apr 2012

Blogger Michael A. Fury, Techcet Group, reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: nanowire FETs, laminate MEMS, nanoparticles in security printing, graphene nanoribbons, Ta2O5 memristors, redox flow batteries, graphene, and more.


Conference Report: MRS Spring 2012, Day 3

Thu, 4 Apr 2012

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.


Chip substrate factory begins producing thermal-control substrates in Russia

Wed, 2 Feb 2012

MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.


MEMS Symposium Report: Chasing 1 Trillion

Thu, 5 May 2012

The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.”


SST Book Review: Energy Harvesting for Autonomous Systems

Mon, 4 Apr 2012

Contributing editor Steve Groothuis reviews a book titled “Energy Harvesting for Autonomous Systems (Smart Materials, Structures, and Systems).” The book highlights the progression from the basic principles behind energy harvesting to the comprehensive systems that control the sensing, actuation, and transmission of those devices. 


Confovis taps Digital Surf for metrology tool imaging software

Fri, 3 Mar 2012

Confovis will begin providing MountainsMap imaging and surface analysis software from Digital Surf with its ConfoCAM LED grid-confocal measuring systems for inspection and research.


SEMI adds session, extends abstract deadline for China chip conference

Tue, 10 Oct 2012

SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.


KLA-Tencor's updated LED wafer inspection tool boosts throughput, efficiency

Thu, 12 Dec 2012

KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.


MIPI Alliance forms group to study sensor integration in mobile systems

Mon, 11 Nov 2012

MIPI Alliance has formed an open "Birds of a Feather" (BoF) group that will investigate the requirements related to integrating sensors into mobile systems. The group will address challenges facing the sensor and wireless markets.


Conference report: MEMS Business Forum

Fri, 5 May 2012

The first MEMS Business Forum, sponsored by MEMS Journal and MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 24 at the Santa Clara Biltmore Hotel. Ten speakers presented on topics ranging from near- and mid-term business opportunities to roles of MEMS in broad visions for the future.


ITF: New approaches in the battle against cancer

Fri, 5 May 2012

At imec's International Technology Forum, Denis Wirtz, co-director of the John Hopkins Institute for NanoBio Technology, described the latest efforts to fight cancer.


ITF: Healthcare applications of silicon photonics

Fri, 5 May 2012

At imec's International Technology Forum, Roel Baets, director of the Centre for Nano- and Biophotonics Ghent University, Belgium, said silicon photonics will drastically change the way bio research is conducted.


ITF: Connecting biology with microsystems

Fri, 5 May 2012

At imec’s International Technology Forum, Peter Peumans, department director bio-nano electronics of imec, described promising examples of : technologies that connect biology and Microsystems: Biotechnology: bioreactors, neuroprobes, high speed cell inspection, and high-throughput molecular analysis.


Metrology merger: MicroSense acquires SigmaTech

Wed, 6 Jun 2012

MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.


Europe to unite research efforts in Silicon Europe cluster alliance

Mon, 10 Oct 2012

Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”


IEDM unveils 2012 program highlights

Mon, 9 Sep 2012

The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.


MEMS for mobile industry will reach $6.4B by 2018

Thu, 6 Jun 2013

Market demand for new sensors will lead to a $6.4B market by 2018.


Necessary attributes of a MEMS engineer for new product development

Mon, 6 Jun 2013

In the development of new MEMS products, the team is the most important factor.


Bosch reaches 3 billion sensor milestone

Tue, 6 Jun 2013

Since the start of production in 1995, Bosch has manufactured well in excess of three billion MEMS sensors.


Leti Innovation Days to present preview of future developments in nanotechnologies

Thu, 6 Jun 2013

CEA-Leti will present recent advances and a preview of future developments in micro- and nanotechnologies, followed by workshops on key technical fields, during Leti Innovation Days, June 25-28, on the MINATEC campus.


Fab equipment spending: 23% growth for 2014

Tue, 6 Jun 2013

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.


Leti to present latest R&D results in MEMS at Transducers’ 2013 in Barcelona

Wed, 5 May 2013

CEA-Leti will host a workshop for industrial companies to present its latest advances in MEMS and an overview of the success of its recent MEMS startup, Wavelens, during Transducers’ 2013 and Eurosensors XXVII in Barcelona, Spain.


OMRON develops MEMS non-contact thermal sensor utilizing wafer-level vacuum packaging

Wed, 5 May 2013

OMRON Corporation today announced that they have finished development work on the world's first infrared sensor manufactured with wafer-level vacuum packaging technology to create a 16x16 element MEMS non-contact infrared thermal sensor capable of highly precise 90-degree area detection.


M2M Forum 2013 explores MEMS and the future of medical devices

Tue, 4 Apr 2013

MEMS Industry Group (MIG), a global industry organization with more than 140 member-companies and partners, will welcome micro-electromechanical systems (MEMS), medical industry and academic experts to Cambridge, Mass. for Member-to-Member (M2M) Forum 2013, a conference on the MEMS connection to advancements in healthcare, medical and biomedical applications.


Leading MEMS microphone suppliers ride Apple’s gravy train to the top

Wed, 5 May 2013

Once again demonstrating Apple’s power to ordain winners in the electronics supply chain, the top suppliers last year of microelectromechanical systems microphones were those that provided devices for iPhones and iPads.


Kurt Petersen, MEMS industry pioneer and technology vision, joins IMT board of directors

Tue, 4 Apr 2013

IMT, the largest pure-play MEMS foundry in the US, announced today the appointment of MEMS industry pioneer and technology visionary Dr. Kurt Petersen to the IMT board of directors.


TSMC

Fri, 4 Apr 2013

TSMC

Health awareness spurs quadrupling in MEMS sensor market for wearable electronics

Tue, 4 Apr 2013

From smart wristwatches that record heart rates, to intelligent armbands that track physical activities, wearable electronics and fitness monitoring devices are attracting increased attention from health-conscious consumers, causing shipments of MEMS sensors used in these products to more than quadruple in just five years.


Combo MEMS inertial sensors report brisk growth in automotive market

Mon, 5 May 2013

Combo MEMS sensors for automotive applications are off to another exhilarating ride this year as revenue continues to climb, spurred by rapidly accelerating use in car safety systems.


Top 30 MEMS companies of 2012

Fri, 4 Apr 2013

The fast growing market for sensors for smart phones is re-shuffling the ranks of MEMS suppliers. For the first time, suppliers of inertial sensors have surpassed the major makers of micro mirrors and inkjet heads that have long dominated the industry on Yole Développement’s annual ranking of the Top 30 MEMS companies.


Examining the MEMS gyroscope patent landscape

Wed, 4 Apr 2013

The gyroscope market is driven by mobile applications, where until recently only two players, STMicroelectronics (ST) and InvenSense, were competing.


Corporate partnership produces next generation MEMS handler

Fri, 2 Feb 2013

TESEC Corporation today announced the development and sales of the ULTRA MEMS Handler, targeting Inertial (Accelerometer, Gyroscope and Magnetometer) MEMS devices.


Report delivers latest analysis on nanobiotechnology applications, markets and companies

Thu, 2 Feb 2013

Nanobiotechnology, an integration of physical sciences, molecular engineering, biology, chemistry and biotechnology holds considerable promise of advances in pharmaceuticals and healthcare.


2013: Beyond CMOS, steady growth and accelerating change across non-mainstream chip markets

Thu, 1 Jan 2013

Sensors and optoelectronics will continue to grow faster than the mainstream semiconductor market. We currently expect 9%-13% growth in these sectors in 2013, accompanied by rapid changes in technology and  market structures.


Global market for MEMS microphone to more than double in five years

Wed, 2 Feb 2013

The global market for MEMS microphones has reached approximately $422 million in 2012. The market is predicted to increase to $865 million in 2017.


MEMS devices shape medical industry, microsystem devices to reach $6.6 billion in 2018

Wed, 2 Feb 2013

Microelectromechanical (MEMS) devices are shaping the competitive landscape in the global medical device industry.


Tronics to produce submicron MEMS technology of CEA-LETI

Mon, 2 Feb 2013

Tronics kicks-off the industrialization of a unique piezoresistive nanowire MEMS technology that can take 9 DOF motion sensors to a new level of competitiveness.


Opinion: MEMS new product development: The first prototype

Mon, 2 Feb 2013

In the second article of the MEMS new product development blog, the importance of the first prototype will be discussed.


STMicroelectronics and University of Amsterdam Faculty of Science use advanced MEMS to soar with birds

Thu, 2 Feb 2013

STMicroelectronics and the University of Amsterdam Faculty of Science have announced that a sophisticated bird-tracking system developed by the university is using advanced MEMS sensing technology from ST.


MEMS revenue to climb a healthy 8 percent this year

Thu, 2 Feb 2013

A strong uptake in consumer and mobile devices will power the market for microelectromechanical systems (MEMS) to solid revenue growth in 2013, with breakthroughs in new sensor applications also expected this year, according to insights from the IHS iSuppli MEMS service at information and analytics provider IHS.


Institute of Microelectronics and Stanford University to develop switch technology for efficiency in mobile devices

Fri, 2 Feb 2013

A*STAR’s Institute of Microelectronics, or IME, and Stanford University will collaborate to advance innovations in nano-electromechanical systems (NEMS) switch technology for ultra-low power digital systems.


APIX Technology introduces gas chromatography device based on silicon nano-scale components

Thu, 2 Feb 2013

GCAP targets a range of industrial applications as well as research labs, advanced gas analysis and biomedical screening.


Smartphones and tablets drive continued double-digit growth in MEMS motion sensor market

Thu, 2 Feb 2013

Smartphones and media tablets continue to the prime movers of technology industries, with the two mobile platforms spurring a double-digit increase in the market for microelectromechanical system (MEMS) motion sensors this year.


MEMS Industry Group announces MEMS Executive Congress Europe 2013

Mon, 1 Jan 2013

MEMS Industry Group (MIG) will host its second annual MEMS Executive Congress® Europe, March 12, 2013 in Amsterdam.


Researchers create semiconductor 'nano-shish-kebabs' with potential for 3-D technologies

Wed, 2 Feb 2013

Researchers at North Carolina State University have developed a new type of nanoscale structure that resembles a “nano-shish-kebab,” consisting of multiple two-dimensional nanosheets that appear to be impaled upon a one-dimensional nanowire.


Manufacturing innovations to drive MEMS equipment market to a >5% CAGR over 2012-2018

Tue, 2 Feb 2013

In its new report MEMS Front-End Manufacturing Trends, Yole Développement goes further in the equipment and materials market forecasts and in the manufacturing trends for MEMS. The report gives detailed analyses about MEMS device technology process flow, manufacturing trends and manufacturing cost breakdown.


UCLA researchers refine 'NanoVelcro' device to grab single cancer cells from blood

Mon, 2 Feb 2013

Improvement in nanotechnology enables 'liquid biopsies' for metastatic melanoma.


JEDEC elects two new members to its Board of Directors

Mon, 2 Feb 2013

JEDEC Solid State Technology Association, a developer of standards for the microelectronics industry, announced today that its Board of Directors has appointed two new members: Mr. Jong H. Oh, Vice President, SK hynix and Mr. Hung Vuong, Qualcomm. 


NIST quantum refrigerator offers extreme cooling and convenience

Wed, 3 Mar 2013

Researchers at the National Institute of Standards and Technology (NIST) have demonstrated a solid-state refrigerator that uses quantum physics in micro- and nanostructures to cool a much larger object to extremely low temperatures.


Fab Spending Forecast: Equipment spending is expected to remain flat in 2013

Wed, 3 Mar 2013

Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.


Smart new sensor fusion chip enables mobile devices to operate multiple sensors

Tue, 3 Mar 2013

PNI Sensor Corporation and EM Microelectronic -Marin SA announce the introduction of the Sentral sensor fusion hub: a new, highly effective way to integrate complex motion sensors on mobile devices.


EV Group to develop equipment to enable covalent bonds at room temperature

Tue, 3 Mar 2013

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature.


Avnet Memec signs agreement with MEMS sensor line

Fri, 3 Mar 2013

InvenSense, Inc. and Avnet Memec this week announced the formation of a pan-European distribution agreement. With the new partnership, Avnet Memec is chartered with sales and support for InvenSense’s MotionTracking devices throughout Europe and Israel.


Avago MEMS Filter: The highest volume production MEMS using TSV

Wed, 3 Mar 2013

System Plus Consulting analyzed a BAW MEMS Filter manufactured by Avago Technologies, assessing its manufacturing process, costing results and breakdown. With more than 1 billion units produced per year and a market share of 65%, System Plus Consulting found that Avago Technologies clearly dominates the BAW filter market. Avago BAW filters are all-silicon MEMS devices manufactured with Avago's FBAR and Microcap technologies.


MEMS microphone shipments to climb 30% this year

Thu, 2 Feb 2013

Shipments of MEMS microphones in 2012 amounted to 2.05 billion units, up 57% from 1.30 billion in 2011, according to IHS iSuppli. Shipments will climb by another 30% to 2.66 billion units in 2013, to be followed by at least three more years of notable double-digit-rate increases.


STMicroelectronics is first $1 billion MEMS company

Wed, 2 Feb 2013

Yole Développement’s research has credited STMicroelectronics for capitalizing on the booming demand for MEMS in mobile devices by shipping 58% more MEMS units in 2012, to become the first company to reach $1 billion in MEMS sales.


IDT announces world’s lowest jitter MEMS oscillators with integrated frequency margining capability

Tue, 3 Mar 2013

Integrated Device Technology, Inc. yesterday announced the industry’s first differential MEMS oscillators with 100 femtosecond (fs) typical phase jitter performance and integrated frequency margining capability.


“State of the MEMS Industry” market study to be presented at Smart Systems Integration Conference

Mon, 3 Mar 2013

Roger Grace to present MEMS Commercialization Report Card at annual international technical forum.


Nanoelectronics Conference will focus on semiconductor industry’s future

Fri, 3 Mar 2013

How the semiconductor industry can create the next generations of nanoscale computing technology will be one of the themes of the 2013 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics, to be held at the National Institute of Standards and Technology (NIST), March 25-28, 2013, at its campus in Gaithersburg, Md.


MEMS pressure sensors in cellphones set to rise to 681M units in 2016

Wed, 3 Mar 2013

Shipments this year are expected to double to 162 million units, as presented in the attached figure, primarily due to Samsung’s usage of pressure sensors in the Galaxy S4 and other smartphone models.


STMicroelectronics and CMP’s MEMS manufacturing process available for prototyping

Tue, 3 Mar 2013

STMicroelectronics and CMP today announced that ST's THELMA MEMS manufacturing process, the process ST uses for its industry-leading accelerometers and gyroscopes, which have shipped in billions of units, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.


New miniaturization record by STMicroelectronics makes more room for mobile functionality

Mon, 4 Apr 2013

STMicroelectronics has introduced the world's smallest TVS diode for protecting sensitive electronics in consumer products and handhelds.


STMicroelectronics heads European research team in advanced MEMS devices development

Thu, 4 Apr 2013

STMicroelectronics has begun working with research partners to develop a pilot line for next-generation MEMS devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging. The project was launched by the European Nanoelectronics Initiative Advisory Council (ENIAC) Joint Undertaking (JU), a public-private partnership in nanoelectronics.


Brewer Science installs scale-up reactor to support electronics-grade carbon nanotube materials

Mon, 3 Mar 2013

Brewer Science, a developer of lithography enhancement materials for semiconductor manufacturing, announces the installation of a scale-up reactor to increase production of its CNTRENE C100 family of electronics-grade CNT materials by tenfold.


Freescale Semiconductor installs Advantest's production platform for testing MEMS-based sensors

Thu, 3 Mar 2013

Semiconductor test equipment supplier Advantest Corporation entered the high-growth market for testing MEMS-based sensors by installing V93000 Smart Scale systems at several of Freescale Semiconductor's facilities around the world.


Chinese cellphone and tablet makers gain share in MEMS sensor purchasing in 2012

Thu, 3 Mar 2013

China-based manufacturers of cellphones and tablets in 2012 more than doubled their share of purchases of MEMS motion sensors, reflecting the rising prominence of the companies in the global market, according to an IHS iSuppli MEMS Topical Report from information and analytics provider IHS.


SiTime enters smartphone market with first MEMS oscillator

Wed, 3 Mar 2013

SiTime Corporation, one of the fastest growing semiconductor companies, today introduced the SiT15xx family of 32 kHz MEMS oscillators that are intended to replace legacy quartz crystal resonators.


New energy-efficient interface IC to provide voltage regulation for piezoelectric energy harvesters

Tue, 3 Mar 2013

Holst Centre and imec have developed an integrated piezoelectric energy interface IC with zero bias rectifier circuit and energy-aware supply regulator.


Emerging consumer applications are boosting the growth of the MEMS pressure sensor market

Tue, 3 Mar 2013

MEMS pressure sensor is one of the very first MEMS components appearing in the microsystem world. The technologies are quite mature and the market is big and expected to grow from $1.9B in 2012 to $3B in 2018.


Smallest MEMS microphone designed for hearing aid applications features low EIN and power consumption

Tue, 3 Mar 2013

Analog Devices ADMP801 MEMS microphone delivers 27 dBA EIN, consumes only 17 µA at 1 V supply, and is available in a 7.3 mm³ package.


SUNY’s CNSE undergrad to receive the nation’s most prestigious award for science and engineering

Tue, 4 Apr 2013

Zachary Olmsted, a junior Nanoscale Engineering major at SUNY’s College of Nanoscale Science and Engineering (CNSE), has been chosen to receive the prestigious Barry M. Goldwater Scholarship, the second consecutive year that a CNSE student has been honored with the nation’s premier undergraduate award designed to foster and encourage outstanding students to pursue careers in the fields of mathematics, the natural sciences, and engineering.


High-value MEMS market growth slows due to weak medical electronics and industrial sectors

Tue, 4 Apr 2013

The high-value microelectromechanical system (MEMS) market experienced soft growth last year, mainly due to weakness in the mainstay medical electronics and industrial sectors, according to an IHS iSuppli MEMS High-Value MEMS Market Tracker Report from information and analytics provider IHS.


Unsettled economic situation leaves mark on microtechnology industry

Tue, 4 Apr 2013

A year ago, the microtechnology, nanotechnology, and advanced materials industry looked out on the year 2012 with quite positive expectations. As it turned out, the unstable economic situation has left its mark on these industries, too. For 2013, at least, the companies expect a slight upwards trend.


Imec IEDM presentations to cover More than Moore, ITRS

Thu, 8 Aug 2010

16 papers with imec authors were accepted for IEEE International Electron Devices Meeting (IEDM), December 6-8, 2010, in San Francisco. Both ITRS-related as well as More-than-Moore-related research papers have been accepted, rewarding imec’s multidisciplinary R&D platform (featuring two state-of-the-art R&D fabs).


SEMICON Taiwan preview: Forums span key technology, markets

Tue, 8 Aug 2011

SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.


Analyst: MEMS test equipment priorities: low-cost, standardized

Fri, 3 Mar 2008
Mar. 28, 2008 - In a sector dominated by expensive customized products, the best opportunities in the MEMS test equipment market are to develop cost-effective standardized technologies, according to a new report from Frost & Sullivan.

MEMS, packaging groups to support others' efforts

Mon, 11 Nov 2007
November 19, 2007 - The MEMS Industry Group, a trade association representing MEMS and microstructure industries, and the MicroElectronics Packaging and Test Engineering Council (MEPTEC) have formed a strategic alliance to support each other's goals and industry events, through a variety of marketing programs.

AlSiC Metal Matrix Composite Assemblies

Mon, 12 Dec 2008
AlSiC hermetic packaging assemblies from CPS Technologies offer an alternative to traditional thermal management hermetic packaging materials such as CuMo and CuW. The combinations of lightweight, high thermal conductivity, CTE matching, and low cost make it appropriate for applications in which thermal management and/or weight are important.

Lee to Deliver Keynote at MEPTEC MEMS Packaging Symposium

Fri, 4 Apr 2008
(April 18, 2008) Medicine Park, OK — Luke P. Lee, Ph.D., from the Department of Bioengineering at UC Berkeley has been selected as keynote speaker for MEPTEC's 6th Annual MEMS Packaging symposium titled "MEMS Market Evolution: From Technology Push to Market Pull" on May 22, 2008. This one-day event will take place at the Wyndham Hotel, San Jose, CA.

New Analysis Estimates MEMS Market to Reach $120.2M in 2014

Thu, 3 Mar 2008
(March 27, 2008) PALO ALTO, CA — If the MEMS test equipment market is to match the pace of the overall MEMS market, it has to develop cost-effective, standardized solutions. This is especially pertinent in a market where expensive customized products vastly outnumber off-the-shelf products. New analysis from Frost & Sullivan "World MEMS Test Equipment Markets," finds that the market earned revenues of $56.5M in 2007 and estimates this to reach $120.2M in 2014.

MEMUNITY Announces 8th Workshop on Wafer-Level MEMS Testing

Fri, 2 Feb 2008
(February 1, 2008) Dresden, GERMANY — Following a successful series of events held in Europe, MEMUNITY has announced its eighth workshop under the title "Critical Success Factors for Commercialization: Production Test of MEMS at Wafer Level". The workshop will be held on March 13 at the Institute for Microelectronic and Micromechanical Systems (IMMS) in Ilmenau, Germany.

IIT Bombay Selects EV Group Bonders for Micro-Fabricated Sensor R&D Project

Tue, 2 Feb 2008
(February 5, 2008) St Florian, Austria — EV Group (EVG) has announced it has received an order from the Indian Institute of Technology (IIT), Bombay, for two of EVG's MEMS-focused systems. The systems will be for a new Indian government-supported automotive MEMS R&D project and are slated for installation this month in IIT Bombay's Mumbai facility.

Another Word on Nano

Tue, 6 Jun 2006
The day after I wrote my last editorial entitled Nano-inspiration, I attended the MEMS and Nanotechnology session at the IMAPS New England Symposium, May 16, in Boxborough, MA. There was so much discussion about nano-hype, multiple definitions of nano, how nanomaterials are made, and what you can do with them that I wished the session had occurred a few days earlier.

SEMI Holds Meeting on MEMS Packaging Standards

Tue, 6 Jun 2006
(June 6, 2006) SAN JOSE, CA — If you're like most people who responded to SEMI's survey on MEMS packaging standards, you're not aware that SEMI has published three MEMS-related standards. Existing standards cover microscale fluidic systems, terminology, and wafer bonding. SEMI's MEMS technical committee has identified MEMS packaging as a task force area, and standardization efforts are just beginning.

SEMI Announces Competition

Wed, 12 Dec 2006
(December 13, 2006) SAN JOSE, CA — SEMI put out a call for innovations for the fifth annual Technology Innovation Showcase (TIS) to be held in conjunction with SEMICON West 2007, July 17 – 19, 2007, in San Francisco. Nanotechnology, MEMS, test, assembly, packaging, and wafer processing submissions are sought by February 2, 2007.

MEMS drive supply chain changes with new applications

Thu, 9 Sep 2011

Yole Développement shares highlights from its latest "Status of the MEMS Industry" report, noting changes in the MEMS supply chain as companies add foundries or go fab-lite, and multi-chip MEMS packages create new relationships between companies.


MEMS die size grows, test evolves, and other trends

Mon, 12 Dec 2011

Yole studies the evolution of inertial MEMS and magnetometers and provides reverse costing analysis of the MEMS devices in "Technology Trends for Inertial MEMS." The report considers 23 MEMS devices.


STMicroelectronics uses TSV in high-volume MEMS devices

Tue, 10 Oct 2011

STMicroelectronics (NYSE:STM) has implemented through-silicon vias (TSV) in high-volume micro electro mechanical system (MEMS) devices. ST is using TSV in its smart sensors and multi-axis inertial modules.


Imec wafer-level MEMS packaging relies on nanoporous alumina membrane

Fri, 10 Oct 2011

Imec engineers have simplified the thin-film wafer-level MEMS packaging process with nanopores that prevent leaks into the package and a low-temperature processing approach.


SUSS MicroTec partners for health research

Fri, 11 Nov 2011

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announces the cooperation with Swansea University´s Centre for NanoHealth (CNH).


IDT MEMS oscillator commercializes piezoelectric resonators

Wed, 11 Nov 2011

Integrated Device Technology, Inc. (IDT, NASDAQ:IDTI) developed and demonstrated commercially available oscillators incorporating piezoelectric micro electro mechanical system (pMEMS) resonators.


Cornell, SRC develop RF MEMS technologies

Wed, 12 Dec 2011

Semiconductor Research Corporation (SRC), university-research consortium for semiconductors and related technologies, is working with Cornell University researchers to develop on-chip silicon technologies for mobile devices. The aim is a micro-mechanical resonator for RF MEMS.


AFM images MEMS structures with quantitative measurements

Thu, 12 Dec 2011

JPK Instruments introduced QI, or quantitative imaging mode, for the recently launched NanoWizard3 AFM analytical system. QI enables full control of tip-sample force at every pixel.


imec presents MEMS energy harvester at IEDM

Thu, 12 Dec 2011

Imec and Holst Centre micromachined a vibration-energy harvester with 489µW output power, using piezoelectric material in a MEMS cantilever. The team presented results at IEEE's International Electron Devices Meeting (IEDM) this week in Washington DC.


Tronics wins MEMS fab contract from DelfMEMS

Tue, 12 Dec 2011

DelfMEMS SA named Tronics as its micro electro mechanical systems (MEMS) foundry partner. Tronics will manufacture RF MEMS switches for DelfMEMS, with high-capacity runs starting in 2012.


AFM attachment uses rare-earth magnets for conductive and magnetic microscopy

Tue, 11 Nov 2011

Asylum Research introduced the Variable Field Module2 (VFM2) for the MFP-3D AFM. It allows researchers to apply magnetic fields in conductive AFM experiments, magnetic force microscopy, and other applications.


Silex MEMS TSV tech licensed to Nanoshift

Wed, 11 Nov 2011

Silex Microsystems licensed its Silex Sil-Via through-silicon-via (TSV) packaging platform to Nanoshift for use in early development of complex MEMS products.


BSI image sensors avoid distortion with Ziptronix bonding process

Thu, 11 Nov 2011

Ziptronix ZiBond direct bonding process contribute minimum distortion in backside illuminated (BSI) image sensors because of its low-temperature processing and high bond strength, the company reports.


Sensor fusion opens MEMS supply chain to sensor management players

Fri, 11 Nov 2011

Yole Développement's new report, "Inertial Combo Sensors for Consumer & Automotive" shows that supply chains need to adapt to the "very large market opportunity" for inertial combo sensors.


Silex, AMFitzgerald accelerate MEMS ramp with DfM

Mon, 11 Nov 2011

MEMS foundry Silex Microsystems and MEMS development firm A.M. Fitzgerald & Associates completed a multi-year collaboration on medical and biotech MEMS development, halving device development time.


Micralyne brings MEMS design, prototyping partner into foundry model

Mon, 11 Nov 2011

MEMS foundry Micralyne Inc. brought Nanoshift LLC, a product development firm specializing in emerging technologies, on board for design, process development, fabrication and packaging partnerships.


MEMS packaging and test project aims for space

Tue, 11 Nov 2011

The Heterogeneous Technology Alliance in Europe is developing new packaging and test methods for MEMS targeting space missions.


EVG moves Chinese SOI bonder customer to full automation

Thu, 11 Nov 2011

Shanghai Simgui Technology Co. Ltd., a Chinese wafer manufacturer, placed a follow-on order for an EVG850 automated production bonding system for SOI wafer bonding. Simgui is moving from EVG's semi-automated wafer bonder to advance high-volume SOI production.


Multitest launches MEMS microphone tester with European order

Thu, 9 Sep 2011

The InPhone microphone test system can be combined with the Multitest InStrip test handler for highly parallel MEMS test and the calibration of MEMS microphones.


MEMS oscillator maker taps Multitest for test handling

Wed, 9 Sep 2011

A MEMS oscillator maker chose the MT9928 xm tri-temp test handler from Multitest for a novel oscillator application. The MEMS device required extremely accurate temperature calibration.


Agilent NanoSuite software improves nano indentation, tensile testing

Thu, 4 Apr 2011

NanoSuite 6.0 promises speed, flexibility, ease of use and new application methods for nanomechanical properties measurements involving polymers, composites, thin film materials, MEMS, surface topology, stiffness mapping, and scratch testing.


Optical systems capture microfluidic experiment data

Wed, 4 Apr 2011

Optical systems that capture high-quality still and moving images of microfluidic experiments from DolomiteDolomite launched a range of optical systems that capture high-quality still and moving images of microfluidic experiments. Applications include testing various microfluidic chips for droplet generation and particle imaging, etc.


Helios Crew SemiLEDs intros LED packaged with MEMS

Wed, 2 Feb 2011

MEMS packaged LED from HCCHelios Crew Corporation (HCC) Taiwan released its LED product S35, a packaged component LED that integrates MEMS with semiconductor processing to produce a unique silicon packaging technology.


Dolomite chip holder allows microfluidic temperature control

Mon, 2 Feb 2011

Dolomite's Hotplate Adaptor - Chip Holder HDolomite, microfluidic designer and manufacturer, expanded its range of temperature control systems with the Hotplate Adaptor - Chip Holder H, which allows control over internal temperatures of microfluidic chips without any disruptions to the fluid flow.


Hermetic wafer-level packaging lowers cost with IMT Au-Au bond

Tue, 3 Mar 2011

IMT introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding for wafer-level packaging (WLP). In development for nearly a year, this bond is being actively used in production.


MEMS wafers characterized by Zebraoptical integrated metrology tool

Tue, 5 May 2011

Zebraoptical Integrated Metrology Tool (ZIMT)Sunrise Optical LLC debuted the Zebraoptical low coherence fiber optic interferometer with microscope attachment. The Zebraoptical Integrated Metrology Tool (ZIMT) provides metrology readings on micro electromechanical system (MEMS) wafers.


Wafer bonding: Many options for many devices

Tue, 5 May 2011

Wafer bonding. SOURCE: Yole May 2011. Wafer bonding is a complex process, used on 2" to 12" wafers for MEMS, image sensors, advanced packaging, LEDs, and other chips. Yole Développement published a technology study and market research report, "Permanent wafer bonding," to derive trends in the market and technology through 2016.


MEMS packaging conference planned for 2011

Tue, 12 Dec 2010

The University of Michigan College of Engineering will present Packaging for MEMS March 31 to April 1, 2011, in Boston, MA. MEMS packaging is a significant part of product cost. This program highlights what to consider in developing application-specific packaging that will meet your goals for product performance, durability, and total cost.


From the 2004 archives: Michigan researchers, companies continue to engineer growth

Fri, 2 Feb 2005
Each year, Small Times ranks the U.S. states for their research, development and commercialization proficiency in the areas of nanotechnology, MEMS and microsystems. Last year, Michigan ranked eighth. Its 2004 report card follows.

Apogee begins testing MEMS medical device

Fri, 3 Mar 2005

ASM service to facilitate successful MEMS packaging

Thu, 6 Jun 2007
Recognizing that packaging and manufacturing are among the most crucial challenges facing MEMS engineers, ASM International has announced its MEMS Materials Database: Packaging Module to facilitate materials selection for MEMS packages.

Micralyne signs MEMS manufacturing deal

Mon, 2 Feb 2004
Micralyne Inc., an Edmonton, Alberta, based MEMS manufacturer, has signed a contract worth more than $2 million to make components for chemical analysis instrumentation, according to a news release.

Rainier adds MEMS PR practice

Tue, 6 Jun 2003
Rainier Corp., a Princeton, Mass.-based public relations and advertising agency, has launched a MEMS practice, according to a news release.

For MEMS, the key to lowering cost is all in the packaging

Thu, 11 Nov 2002
Carsten Bahle of Wicht Technologie Consulting doesn’t mince words when it comes to the need to rethink MEMS packaging. “The biggest stumbling block to commercial success is the lack of general, simple and effective packaging techniques,” he said. The reason is simple: cost. Although these microsystems are getting smaller all the time, that doesn’t mean packaging costs are shrinking as well.

IEDM Preview: CMOS imager works from light to night

Fri, 10 Oct 2010

At the upcoming IEDM conference in December, researchers from NoblePeak Vision will explain how they achieved the first large-scale integration of a single-crystal germanium photodiode into a silicon imager, creating a CMOS sensor that offers high-resolution night imaging under moonless conditions.


COMPANY PROFILE: OMM INC.
LEADER IN 2-D MEMS TECHNOLOGY
WAITS FOR MARKET TO CATCH UP

Mon, 4 Apr 2002

Measurement Specialties delays report, sells fab

Mon, 7 Jul 2002

MICHIGAN FOCUS ON WIRELESS MEMS A FIRST FOR NSF PROGRAM

Tue, 5 May 2001

Engineering Research Center is developing a large-scale treatment for deafness.

Cellucci named Zyvex COO

Mon, 1 Jan 2003
Thomas Cellucci has been promoted to chief operating officer at Zyvex Corp.

Wafer level packaging of image sensors

Sat, 1 Jan 2011
Wafer-level packages that use a glass cover over the package cavity and through-silicon vias to interconnect the die bond pads satisfy the packaging requirements for CMOS image sensors: compact, reliable, low cost, and accommodate both front- and back-illuminated image sensors with no external changes. Giles Humpston, Tessera Inc., San Jose, California, USA

3D MEMS profiler from E M Optomechanical

Mon, 1 Jan 2011

E M Optomechanical Inc. (EMOpto) developed a new low-cost version of its OPTOPro line of 3D MEMS Optical Profilers for use in testing and characterizing MEMS devices. The OPTOPro Model 622-Xe enables capital equipment purchase at less than $20K.


MEMS packaging conference planned for 2011

Tue, 12 Dec 2010

The University of Michigan College of Engineering will present Packaging for MEMS March 31 to April 1, 2011, in Boston, MA. MEMS packaging is a significant part of product cost. This program highlights what to consider in developing application-specific packaging that will meet your goals for product performance, durability, and total cost.


Palomar unveils MEMS packaging system

Thu, 8 Aug 2002
Palomar Technologies, a California-based maker of precision assembly equipment, said it has launched an automated MEMS packaging system.

EPCOS's tiny sensor comes with MEMS packaging

Sat, 2 Feb 2009
February 20, 2009: EPCOS AG is introducing what the Munich-based company is calling the world's most compact packaged sensors for barometric pressure measurement, and it comes with the firm's chip-sized MEMS packaging.

New book covers MEMS reliability

Mon, 1 Jan 2008
Research and Markets has announced the availability of a new book, Reliability of MEMS.

ISSYS gets grant for MEMS, electronics integration

Thu, 10 Oct 2007
Integrated Sensing Systems Inc. (ISSYS) has received a Phase II Small Business Innovation Research contract from the National Science Foundation. The two-year project, Wafer-Scale, Hermetic Packaging of MEMS-Based Systems," is aimed toward development of a novel packaging method that will greatly simplify the packaging of MEMS and their associated electronics

Quantum Leap's "industry breakthrough" in hermetic packaging targets MEMS

Mon, 3 Mar 2007
Quantum Leap boasts "industry breakthrough" in hermetic packaging

Toshiba develops cost-reducing MEMS packaging

Wed, 6 Jun 2008
June 3, 2008 -- Toshiba has optimized for MEMS two packaging technologies that promise significant cost reductions. The company says it will further develop them for practical use.

Centipede tool to streamline SMI's MEMS testing

Wed, 9 Sep 2008
September 10, 2008: Centipede Systems, an emerging supplier of advanced connectors for electronics, announced that Silicon Microstructures Inc. (SMI), has ordered a Centipede Systems tester to speed micro-electromechanical systems (MEMS) and improve quality at its Milpitas, CA fabrication facility.

MEMS packaging lab augments Infotonics' design and fabrication services

Wed, 2 Feb 2008
With the recent investment of $5 million in MEMS packaging capabilities, Infotonics Technology Center (ITC) is positioning itself as a full-service partner for customers seeking to create new MEMS-based devices and microsystems.

Bosch Sensortec debuts 6DoF MEMS IMU with sensor fusion software

Thu, 5 May 2012

Bosch Sensortec has integrated two triaxial MEMS sensors in 1 package, claiming the smallest IMU to date. Solid State Technology spoke with Leopold Beer at Bosch about MEMS integration and the sensor fusion software element of sensing.


ST packages MEMS in plastic for reliability and form factor upgrade

Tue, 6 Jun 2012

Tohoku University and imec partner to advance research

Mon, 6 Jun 2012

Tohoku University of Sendai, Japan and imec signed a collaboration agreement during the Belgian economic mission to Japan, expanding their R&D into areas such as MRAM and 3D semiconductor packaging.


SEMICON West preview: Maturing MEMS sector looks at ways to work together

Tue, 6 Jun 2012

Driven by the volume consumer business, the maturing MEMS sector starts to look at ways to reduce costs and speed time to market by coming together on things like easing integration, common test methods, and tool replacement parts, reports Paula Doe, SEMI. Fast-moving high-volume markets may also drive MEMS makers toward paring down the vast diversity of processes and packages used, and into more collaboration on a mature ecosystem.


High-volume MEMS manufacturer adds FOGALE metrology tool

Wed, 6 Jun 2012

A major high-volume MEMS maker has purchased a FOGALE nanotech T-MAP DUAL 3D 200A for its US manufacturing facility. The tool will be equipped with 2 load ports and will be fully automated.


SPTS Technologies joins MEMS consortium

Thu, 6 Jun 2012

SPTS Technologies joined the MEMS Consortium, led by the Institute of Microelectronics (IME), a member of the Agency for Science, Technology and Research (A*STAR) in Singapore.


SEMICON West preview: MEMS manufacturing changes with HV consumer apps

Wed, 6 Jun 2012

Paula Doe, SEMI Emerging Markets, covers developments at Applied Materials, Coventor, and other members of the MEMS equipment supply chain that will make MEMS less expensive, smaller, and easier to manufacture.


X-Fab takes majority stake in MFI, widens MEMS portfolio to support growth push

Thu, 11 Nov 2012

X-Fab Silicon Foundries says it has become the majority shareholder in German MEMS Foundry Itzehoe GmbH (MFI), the latest in a series of recent moves to raise its profile as a top MEMS foundry.


MEMS seeing strong growth in military sector

Mon, 12 Dec 2012

Demand for microelectromechanical systems (MEMS) devices, particularly pressure sensors for harsh environments, will grow 20% in 2012 on the way to a 9% CAGR for the next several years.


Attend MEMS Executive Congress: Keynotes on MEMS in our world

Mon, 8 Aug 2012

MEMS Executive Congress 2012 in Scottsdale, AZ, will host keynotes from Ajith Amerasekera, TI Fellow, IEEE Fellow, in Texas Instruments’ Kilby Labs, who will discuss how immersive intelligent systems will change the management of our cities, buildings, personal life, health, transportation, safety and security; and Robert Brunner, founder, creative director and partner, Ammunition, who will explore the critical connection between brand identity and connection to consumers.


MEMS Industry Group plans webinars on fab challenges, applications, more

Wed, 8 Aug 2012

The MEMS Industry Group (MIG) is planning webinars on micro electro mechanical systems (MEMS) from packaging challenges to how MEMS can benefit healthcare.


Focus on MEMS at SEMICON Taiwan

Mon, 8 Aug 2012

SEMICON Taiwan 2012, held September 5-7, will feature both Taiwan MEMS suppliers and global MEMS elites -- including Asia Pacific Microsystems, Freescale, InvenSense, and STMicroelectronics -- who will discuss innovation in MEMS design, manufacture, packaging, testing and equipment.


How to participate in SensorsCon 2013

Mon, 8 Aug 2012

The second annual SensorsCon 2013, the conference for Sensors Technology, Design and Applications, March 6, 2013, Techmart Center, Santa Clara, CA, is accepting applications for exhibitors, sponsors and speakers.


Wafer-level optics maker orders Heidelberg Instruments lithography tool

Tue, 8 Aug 2012

Heptagon, wafer-level optics maker, ordered an advanced DWL 2000 maskless lithography system from Heidelberg Instruments. The tool has sophisticated Gray Scale Exposure capability.


Micro-rheometer, microdevice adsorbtion get nods in Sandia student MEMS design contest

Thu, 9 Sep 2012

A device that measures very thin quantities of liquid, such as the synovial fluid in knee joints, and a device that measures change in mass when a microdevice adsorbs small amounts of material, earned top honors in Sandia National Labs' annual student MEMS design contest.


GlobalFoundries to fab Sand 9's MEMS timing products

Tue, 10 Oct 2012

Sand 9 is partnering with GlobalFoundries for high-volume manufacturing of its microelectromechanical systems (MEMS) timing technology, which incorporates silicon-on-insulator (SOI) and through-silicon vias (TSV).


Sensirion debuting tiniest humidity/temperature sensor

Mon, 10 Oct 2012

Sensirion AG says it will debut at Electronica 2012 (Nov. 13-16, Munich, Germany) what it says is the world's smallest humidity and temperature sensor: a 2mm × 2mm × 0.8mm in size, based on its CMOSens technology that combines the sensor and signal processing on a single chip.


Smallest 3-axis MEMS gyroscope: Teardown report released

Wed, 4 Apr 2012

Research and Markets released the "ST L3G3250A 3-axis MEMS Gyroscope Reverse Costing Analysis" report, providing a teardown of STMicroelectronics’ MEMS gyroscope in an LGA package.


MEMS and microelectronics undergo contactless delamination tests at Georgia Tech

Fri, 4 Apr 2012

CNSE STC designated trusted foundry for DOD Defense Microelectronics Agency

Thu, 4 Apr 2012

The College of Nanoscale Science and Engineering's (CNSE) Smart System Technology and Commercialization Center of Excellence (STC), Canandaigua, NY, was designated as a Trusted Foundry by the US Department of Defense's Defense Microelectronics Agency.


Audio Precision uncrates PDM interface for MEMS microphone test

Wed, 5 May 2012

Audio Precision released a pulse density modulation (PDM) audio interface option on its APx500 for direct I/O, modulation, and decimation on MEMS microphones and other PDM devices.


SWS Inertial Sensor Development Platform evaluates MEMS behavior, performance

Tue, 5 May 2012

Si-Ware Systems (SWS) launched its Inertial Sensor Development Platform, the SWS61111, a tool that can be used to evaluate an inertial sensor, such as a gyroscope or accelerometer, to understand sensor behavior and performance with complete interface electronics.


Sensory Swarms and MEMS roadmaps on docket at MEPTEC MEMS Technology Symposium

Thu, 5 May 2012

MEPTEC will host its 10th Annual MEMS Technology Symposium in San Jose, CA. Keynotes cover “sensory swarms” and motion interfaces, and sessions will cover MEMS roadmaps; design, manufacturing, and test of MEMS; MEMS architectures and uses, and more.


Guide to MEMS at SEMICON West 2012

Thu, 6 Jun 2012

Paula Doe, SEMI Emerging Markets, shares the annual guide for navigating the MEMS events at SEMICON West, July 10-12 at Moscone Center in San Francisco, CA.


InvenSense claims smallest 6-axis MEMS combo sensor

Tue, 7 Jul 2012

InvenSense (NYSE: INVN), MEMS-based sensor maker, introduced its second-generation MPU-6500 6-axis MotionTracking device for smartphones, tablets, wearable sensors, and other consumer markets.


Spirent MEMS sensor simulator tests sensor fusion algorithms

Tue, 7 Jul 2012

Spirent Communications launched its new SimSENSOR sensor simulation software, enabling R&D technicians to test sensor fusion algorithms in navigation systems that include MEMS inertial sensors and multi-GNSS.


Self-calibrating MEMS override manufacturing variations

Wed, 7 Jul 2012

Purdue researchers have demonstrated self-calibrating MEMS, which enable higher accuracy for existing and new MEMS applications and could eliminate 30% of manufacturing costs by skipping test processes.


MEMS characterization with optical measurement: Polytec presents characterization studies

Fri, 7 Jul 2012

MEMS must be characterized during device development. Polytec asserts that advanced optical measurement techniques are necessary for characterization, as electrical tests can check functionality, but not all physical properties.


Aerotech launches sensor fusion data acquisition device

Fri, 7 Jul 2012

Aerotech’s Sensor Fusion is a 3U data acquisition device integrated with the company’s A3200 motion controller to provide precise time alignment of motion and data acquisition functions.


Yole updates World MEMS Players database for 2012

Tue, 7 Jul 2012

Yole updated its MEMS industry database, World MEMS Players 2012. The product includes contact information for MEMS players, geographical breakdown of the industry, and various MEMS device categories.


Intel Capital increases MEMS focus, leads Movea funding round

Thu, 8 Aug 2012

Movea, motion processing and data fusion technology developer, raised EUR6.5m in a funding round led by Intel Capital, with existing investors iSource and GIMV. We are increasing our involvement in the MEMS sector in general, said Erik Jorgensen, Intel Capital.


NIST promotes lab-on-chip testing standard dev

Wed, 8 Aug 2012

Standardized testing and measurement methods, NIST argues, will enable MEMS lab-on-chip manufacturers to accurately determine important physical characteristics of LOC devices such as dimensions, electrical surface properties, and fluid flow rates and temperatures. These must be calculable at all stages of production, from processing of raw materials to final rollout of products.


JCAP, Enpirion partner on MEMS manufacturing

Tue, 1 Jan 2012

Enpirion, Inc. entered into a strategic partnership agreement with JiangyinChangdian Advanced Packaging Co., Ltd. (JCAP) for the manufacturing of silicon-based magnetics utilizing Enpirion's proprietary micro electronic magnetic silicon (MEMS) technology.


MEMS sensors in integrated smart systems

Wed, 1 Jan 2012

Embedded features and sensor integration will determine the future applications of MEMS sensors. Jay Esfandyari et al, STMicroelectronics, share an overview of future trends of sensor integration -- sensor fusion -- and some of the features available today in digital MEMS inertial sensors.


Fraunhofer micro-scanner MEMS eval kit now configurable online

Fri, 1 Jan 2012

Fraunhofer Institute for Photonic Microsystems IPMS has placed its Light Deflection Cube evaluation kit custom-configuration and ordering on the Internet. The LDC is used to evaluate single-axis MEMS scanning mirrors.


NXP MEMS frequency synthesizer debuts at CES

Tue, 1 Jan 2012

NXP Semiconductors unveiled an ultra-compact, high-precision MEMS-based frequency synthesizer, which challenges quartz-crystal-based devices for the timing market. The die is packaged with IC components in a standard, low-cost plastic package.


Multitest ships first MEMS MT9510 test tool to US IDM

Thu, 1 Jan 2012

Multitest shipped the first Multitest MEMS equipment for the MT9510 pick-and-place test handler to an IDM in the US. The IDM will perform MEMS gyroscope test on the newly installed tool.


Baolab intros eval kits for CMOS-integrated MEMS tech

Mon, 1 Jan 2012

Baolab Microsystems is launching evaluation kits of its 3D CMOS MEMS NanoCompass technology. Baolab's NanoEMS technology creates nanoscale MEMS within the standard metal structure of a high-volume-manufactured CMOS wafer.


Norcada microporous silicon nitride sample holders suit thin film study

Tue, 1 Jan 2012

Norcada launched 2 microporous silicon nitride TEM sample holders, suiting ALD analysis, thin film growth, and other applications under TEM, SEM, or STXM tools.


MEMS panel, tablet teardown, smart grid talk highlights of upcoming Sensors in Design

Thu, 1 Jan 2012

Sensors in Design 2012 takes place March 28-29 in San Jose, CA. With speakers from Texas Instruments and Intel, InvenSense, Analog Devices, and more, the event is designed for attendees to better understand sensor technologies and their applications.


Present at MEMS and nano manufacturing conferences in the UK

Fri, 1 Jan 2012

MM, MEMS & NANO Live UK 2012 will take place at NEC Birmingham, UK, September 25-26, co-located with TCT Live, Mediplas, and Sensing Technology 2012.. Submit an abstract by February 28.


Silex devs wafer-level MEMS fab technologies for mobile devices

Mon, 1 Jan 2012

Silex Microsystems joined Energy-efficient Piezo-MEMS Tunable RF Front-End Antenna Systems for Mobile Devices to develop TSVs, PZT thin films, and other technologies for high-performance RF systems targeting mobile devices.


Si-Ware platform creates MOEMS on-wafer with lithographic alignment

Tue, 1 Jan 2012

Si-Ware Systems debuted the SiMOST platform to fab and package single-chip optical systems with validated MEMS components. Multiple MOEMS structures can be patterned and etched on SOI wafers using DRIE. The structures are then wafer-level packaged and diced.


SCHOTT launches MEMS-wafer borosilicate glass as thin as 0.1mm

Wed, 1 Jan 2012

SCHOTT North America Inc. introduced MEMpax borosilicate glass for use in MEMS manufacturing, available in thicknesses from 1.1 to 0.1mm and with a CTE corresponding to Si.


CNSE MEMS center earns ISO 9001:2008 registration

Mon, 3 Mar 2012

The CNSE STC, which performs micro electromechanical system (MEMS) and nanotechnology-enabled manufacturing and packaging, successfully completed ISO 9001:2008 registration.


Multitest delivers MEMS testing for pick-and-place set ups

Mon, 3 Mar 2012

Multitest expanded its MEMS portfolio to pick-and-place test applications with the introduction of its test and calibration cart for the MT9510.


MEMS at heart of new iNEMI efforts, starting with test/reliability

Tue, 3 Mar 2012

iNEMI began 2 collaborative efforts related to micro electro mechanical system (MEMS) technology, specifically reliability and test, and will host a workshop on MEMS in May.


ACUTRONIC MEMS testers enable economical test at the fab

Mon, 3 Mar 2012

ACUTRONIC released standard, off-the-shelf 2-axis rate tables to test several MEMS devices simultaneously. The 21-series is primarily made for MEMS manufacturers.


Bosch's Akustica enters analog MEMS sector with 2-chip offering

Wed, 3 Mar 2012

Akustica, known for its monolithic single-chip digital MEMS devices, introduced its first analog 2-chip MEMS microphone for mobile handsets, the AKU340.


Microfluidic surface coating agent improves droplet performance

Thu, 3 Mar 2012

Microfluidic systems designer and maker Dolomite released Pico-Glide, a surface coating agent that facilitates advanced droplet microfluidics developed by Sphere Fluidics.


MEMS packaging growth, trends, and special requirements

Tue, 4 Apr 2012

The MEMS packaging sector is growing 2x faster (~20% CAGR) by unit shipments than the larger IC packaging industry, shows Yole Développement in its report “MEMS Packaging.”


Audio Precision launches digital MEMS microphone test option

Tue, 1 Jan 2012

Audio test tool supplier Audio Precision launched the PDM I/O option for its APx500 series audio analyzers, used to test digital micro electro mechanical system (MEMS) microphones.


Inertial MEMS sensor maker Qualtre names engineering leader

Thu, 2 Feb 2012

Qualtré, silicon MEMS inertial sensors developer, appointed Dr. Ijaz Jafri as VP of engineering, responsible for all aspects of product development and commercialization. Jafri has 16+ years of experience in MEMS and semiconductors.


Nextreme brings thin-film on-par with bulk thermoelectrics

Mon, 2 Feb 2012

Nextreme Thermal Solutions announced that its thin-film thermoelectric technology has achieved a 60.1°C temperature difference between its cold and hot sides at an ambient temperature of 24.7°C, bringing it on par with the performance of bulk thermoelectric technology.


MEMS supplier Si-Ware Systems launches US subsidiary

Wed, 2 Feb 2012

Si-Ware Systems (SWS) launched a US subsidiary, Si-Ware Systems Inc. Scott Smyser, a new EVP for worldwide marketing and business development, will manage the US business.


Colibrys relocates to new premises with $10M investment

Thu, 2 Feb 2012

MEMS maker Colibrys SA will relocate locally, to the Y-Parc at Yverdon-les-Bains, Canton Vaud, Switzerland. The new location will enable Colibrys to branch out into new application sectors.


Attend "MEMS Commercialization" at MM/MEMS/NANO Live USA

Fri, 2 Feb 2012

At MM/MEMS/NANO Live USA, Professor Yogesh Gianchandani, University of Michigan Wireless Integrated Microsystems and Sensors Center, will keynote the MEMS Commercialization: From Lab to Fab to the Market session.


Nanolab Technologies doubles space for IC analysis services

Wed, 2 Feb 2012

Nanolab Technologies Incorporated inaugurated its 47,000sq.ft. state-of-the-art facility in Milpitas, CA, more than doubling Nanolab Technologies' space.


MEMSIC (MEMS) shares 2012 goals

Thu, 3 Mar 2012

After reporting Q4 2011 results, MEMS supplier MEMSIC Inc. (NasdaqGM: MEMS) discussed its 2 main goals for 2012.


3D-IC: Two for one

Wed, 9 Sep 2013
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about upcoming events related to 3D ICs.

All ST’s front-end manufacturing sites achieves ISO 50001 energy-management certification

Tue, 10 Oct 2013
STMicroelectronics this week has announced that all six of its front-end manufacturing sites have achieved certification to the latest, most stringent ISO 50001 energy-management standard.

From smart cars to smart cities: Shaping the future of microelectronics at ITPC 2013

Wed, 10 Oct 2013
Experts in aerospace, automotive, mobile communications, Smart Cities and more join semiconductor leaders to shape the future of microelectronics at the International Technology Partners Conference (ITPC), to be held in Maui, Hawaii, on November 10-13.

STMicroelectronics receives Innovation Management Award for chip manufacturing tech

Wed, 10 Oct 2013
STMicroelectronics announced on Tuesday it has won a prestigious BearingPoint Innovation Management Award for its FD-SOI technology in the "Innovation Ecosystem" category.

InvenSense opens Korean design center

Wed, 10 Oct 2013
InvenSense, Inc., the provider of MotionTracking system on chip devices, announced the opening of a new design center in Seoul, Korea.

MEMS is still on a dynamic growth path, targeting USD 22.5 billion in 2018

Tue, 8 Aug 2013

In 2012, the IC industry saw a two percent decline, but Yole Développement's research reveals the MEMS sector managed another 10 percent growth to become an $11B business.


InvenSense announces headquarters relocation

Fri, 8 Aug 2013

InvenSense, Inc., a provider of MotionTracking system on chip devices, is relocating its headquarters to 1745 Technology Drive, San Jose, California.


Sono-Tek expands in-house laboratory testing facilities

Tue, 8 Aug 2013

Sono-Tek Corporation, a global ultrasonic spray technology company, announces a just completed expansion of their laboratory testing facility, located at their corporate headquarters in Milton, NY.


Micralyne and Adament to develop MEMS-based fiber-optic subsystems

Wed, 7 Jul 2013

Companies announce alliance to bring high-performance sensors to market.


EU FP7 continues to support Europractice IC services

Thu, 7 Jul 2013

Together with its partners STFC and Fraunhofer IIS, imec announced today that the European Commission has pledged to continue funding the Europractice IC services for another three years under the Seventh Framework Programme (FP7).


Driven by Apple and Samsung, light sensors achieve double-digit revenue growth

Tue, 7 Jul 2013

Light and proximity sensors in mobile handsets and tablets are set for expansive double-digit growth within a five-year period, thanks to increasing usage by electronic giants Samsung and Apple.


MEMS New Product Development: The importance of product validation

Wed, 7 Jul 2013

Product validation is an essential part of all successful MEMS new product developments. It is the process of testing products under various environmental, mechanical or electrical conditions to simulate life in an accelerated manner.


New NIST nanoscale indenter takes novel approach to measuring surface properties

Thu, 7 Jul 2013

Researchers from the National Institute of Standards and Technology (NIST) and the University of North Carolina have demonstrated a new design for an instrument, a "instrumented nanoscale indenter," that makes sensitive measurements of the mechanical properties of thin films -- ranging from auto body coatings to microelectronic devices -- and biomaterials.


MediaTek introduces tablet SoC

Mon, 7 Jul 2013

MediaTek Inc., a  fabless semiconductor company for wireless communications and digital multimedia solutions, today announced its breakthrough MT8135 system-on-chip (SoC) for high-end tablets.


Advancing graphene for post-silicon computer logic

Tue, 9 Sep 2013
Team of UC Riverside researchers pioneer new approach for graphene logic circuits.

Sand 9 launches new MEMS timing products

Tue, 9 Sep 2013
Sand 9, Inc. today announced the first MEMS timing products specifically designed to meet the stringent performance, cost, size and reliability requirements of high-volume mobile applications

Next level of MEMS industry development to be examined at SEMICON Europa

Thu, 9 Sep 2013
Driven by value-creating applications in mobile phones, automotive, displays and other systems, the global MEMS industry has grown to over $11 billion in 2012, a 10 percent compound annual average growth rate since 2008.

Tailored gyroscopes from STMicroelectronics target shake-free images on mobiles and cameras

Tue, 9 Sep 2013
STMicroelectronics has introduced a new family of gyroscopes specifically optimized for optical image stabilization in smartphones and digital still cameras.

The advantages of a hybrid scan test solution

Thu, 9 Sep 2013
Scan testing is the standard practice for test of integrated circuits. The vast majority of IC production test is based on automatic test pattern generation (ATPG) using the scan logic.

STMicroelectronics chip controls Pebble Smartwatch

Wed, 9 Sep 2013
STMicroelectronics announced this week that its STM32 microcontroller is the brain controlling the innovative Pebble Smartwatch for iPhone and Android.

EU project to industrialize world record high-density capacitors

Wed, 10 Oct 2013
CEA-Leti, Fraunhofer IPMS-CNT and three European companies have launched a two-year project to industrialize 3D integrated capacitors with world-record density using atomic layer deposition.

MIG honors STMicroelectronics with three different awards

Mon, 11 Nov 2013
STMicroelectronics has been selected by MEMS Industry Group and affiliated voters as the Company of the Year for its continuing success in growing its MEMS business, expanding its product line, and demonstrating industry leadership and vision.

Annual MEMS Executive Conference shows why MEMS is growing 2x faster than semiconductors

Fri, 11 Nov 2013
MEMS Industry Group (MIG)'s MEMS Executive Congress -- held November 7-8, 2013 in Napa, CA -- showed why the MEMS industry is outpacing the semiconductor industry, in both growth and innovation.

Will MEMS applications be the driver for future growth of thin film PZT?

Thu, 11 Nov 2013
In September 2013, EPSON announced its next generation inkjet technology, PrecisionCore, introducing for the first time MEMS inkjet heads manufactured with thin film PZT technology. This announcement has been highly publicized: first, thin film PZT MEMS applications are now on the market, proving the reliability and maturity of this technology. Second, more inkjet head players will soon follow.

STMicroelectronics boosts safety, reliability and efficiency of industrial-automation systems

Thu, 11 Nov 2013
STMicroelectronics announced that it is launching its new ISO8200B, an innovative isolated power switch that enables smaller, more robust and energy-efficient controllers for industrial automation equipment.

Leti announces MEMS research collaboration with OMRON

Wed, 11 Nov 2013
CEA-Leti today announced a development agreement that will utilize Leti’s deep MEMS expertise and leading-edge infrastructure with OMRON, a global leader in factory automation and control solutions for the transportation, healthcare and consumer-goods industries.

STMicroelectronics reveals advanced MEMS accelerometers

Tue, 12 Dec 2013
Innovative design boosts the sensor's thermal and mechanical stability to deliver robust high performance in ultra space-saving footprint.

STMicroelectronics imaging technology helps visually impaired

Wed, 12 Dec 2013
STMicroelectronics announced that its 5.1 mega-pixel camera module and low-power digital image processor are being used in the revolutionary OrCam camera, a small device that clips on to eyeglasses and dramatically improves the mobility and ability of visually-impaired people to "read" signs, packaging and publications.

SPTS named Supplier of the Year at the Annual MEMS Executive Congress

Mon, 12 Dec 2013
SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, was named MEMS Supplier of the Year at the MEMS Executive Congress U.S. 2013 held in Napa last month

STMicroelectronics reveals 9-axis movement/position sensor

Tue, 1 Jan 2014
STMicroelectronics has revealed its most advanced module for 9-axis movement and position sensing in next-generation mobiles and tiny wearable devices.

Oxford Instruments shares expertise with nanotechnology researchers in India

Tue, 1 Jan 2014
Oxford Instruments has just completed its second series of successful and well attended seminars in India following its first in Bangalore in 2012.

Yole Développement addresses MEMS sensor challenges at January technology seminar

Thu, 1 Jan 2014
Yole Développement will host a MEMS & Imaging Technology Seminar in Korea on January 16, 2014.

7) MEMSIC announces wearable connected watch kit

Sun, 1 Jan 2010

8) Entropic and NAGRA to integrate SoC for set-top boxes

Sun, 1 Jan 2010

2014 Outlook: An era of unprecedented change

Fri, 1 Jan 2014
We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.

2014 outlook: MEMS on the rise

Thu, 1 Jan 2013
Looking at the global MEMS market, industry experts are predicting double-digit device growth in the next three to five years.

MEMS Industry Group explores the “MEMS-enabled Life” at MEMS Executive Congress Europe 2014

Tue, 1 Jan 2014
MEMS Industry Group (MIG) will host its third annual MEMS Executive Congress® Europe, 11 March, 2014 in Munich, Germany.

Presto and DelfMEMS collaborate to design ultra fast RF MEMS test solution

Thu, 1 Jan 2014
Presto Engineering, Inc. and DelfMEMS announced today that they have worked together to design, from specification to integration, the first full PXI-based test system for ultra-fast characterization testing of radio frequency (RF) micro-electro-mechanical-systems (MEMS).

"MEMS and NEMS processing advances" discussed at IEMN, Lille, France workshop on 8th April 2014

Mon, 2 Feb 2014
"Nanoscale Processing for NEMS and MEMS" is the topic for the next Oxford Instruments technical workshop, being hosted in conjunction with the Institute of Electronics Micro-electronics and Nanotechnology (IEMN) in Lille, France on 8th April 2014.

Samsung and UCSF partner to accelerate new innovations in preventive health technology

Fri, 2 Feb 2014
Samsung Electronics Co., Ltd., and the University of California, San Francisco (UCSF) announced a partnership to accelerate validation and commercialization of promising new sensors, algorithms, and digital health technologies for preventive health solutions.

Multitest ships fully integrated test cell for pressure sensor application

Wed, 3 Mar 2014
Early this year, Multitest shipped the first fully integrated test cell for a pressure sensor application consisting of handling systems, ATE and contactors including the pressure unit.

Global failure analysis equipment market to grow at CAGR of 8.8% from 2013 to 2019

Wed, 3 Mar 2014
Rapid growth in nanotechnology coupled with growth in medical applications in the Asia Pacific region has fueled the growth of failure analysis equipment market.

Akustica's newest MEMS microphone targets smartphones and wearables

Tue, 3 Mar 2014
Akustica, Inc., a Bosch Group company and provider of MEMS microphones, has added four new high-performance analog microphones to its high definition (HD) voice product line, including the AKU346, the industry’'s smallest MEMS microphone to achieve 64dB SNR.

Eveon and Leti mark milestone in fabrication of smart bolus-type micro-pump for drug delivery

Thu, 3 Mar 2014
Eveon and CEA-Leti today announced the demonstration of liquid-pumping for smart drug delivery in the bolus mode using a silicon-based micro-pump fabricated with a standard MEMS process.

MEMS microphones broadcast strong growth

Fri, 4 Apr 2014
Global revenue for MEMS microphones is forecast to reach $1.04 billion this year, up a robust 24 percent from $836.9 million in 2013.

Memory design challenges require giga-scale SPICE simulation

Thu, 5 May 2014
Embedded memory is now consuming most of the area on an SoC chip. Complexity and circuit size are only growing, which means smaller process geometries, larger designs, and tighter design margins.

ANSYS and Intel collaborate on reference flow for power, EM and reliability sign-off

Wed, 6 Jun 2014
ANSYS, Inc., and Intel Corporation announced the availability of a production-proven reference flow for power, EM and reliability sign-off using ANSYS simulation solutions for Intel's 14nm Tri-Gate process, showcasing it at last week's Design Automation Conference.

Imaging without limits: Phones lead growth but innovative applications expanding the market

Fri, 7 Jul 2014
To address the rising demands of imaging systems in mobile, medical, automotive and other technology applications, the Imaging Without Limits Conference (7-8 October) will be introduced at SEMICON Europa 2014 this year to address this surging market.

Solid State Equipment wins 2014 3D InCites Award for WaferEtch TSV Revealer

Tue, 7 Jul 2014
Solid State Equipment LLC (SSEC), a provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment.

Materials matter — Enabling the future of IC fabrication and packaging

Thu, 7 Jul 2014
The SEMI Strategic Materials Conference, held September 30–October 1 in Santa Clara, Calif., will examine the drivers for new materials and how they impact material suppliers and the value chain they serve.

NJR and UMC extend collaboration on MEMS microphone manufacturing

Thu, 8 Aug 2014
New Japan Radio Co., Ltd. and United Microelectronics Corporation, a global semiconductor foundry, today announced that the two companies have successfully collaborated to achieve high-volume manufacturing for NJR's MEMS microphone products.

SRC, UC Davis explore new materials and device structures to develop next-generation “Race Track Memory” technologies

Tue, 8 Aug 2014
University of California, Davis researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, are exploring new materials and device structures to develop next-generation memory technologies.

MEMSIC introduces the world's first monolithic and wafer level packaged 3D-axis accelerometer

Fri, 8 Aug 2014
MEMSIC, Inc., a MEMS sensing solution provider, announced today the availability of its MXC400xXC, the world's first monolithic 3D accelerometer, and also the first 3D accelerometer to utilize WLP technology.

S2C opens Korean office and appoints country manager

Tue, 8 Aug 2014
S2C, Inc. announced today the opening of a direct sales and support office in Seoul, Korea, appointing Suk-Ha Lee (SH Lee) as country manager.

Intel releases new packaging, test technologies for 14nm foundries

Wed, 8 Aug 2014
Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies.

MEMS Industry Group hosts 10th annual MEMS Executive Congress US

Thu, 8 Aug 2014
MEMS Industry Group (MIG) will host MEMS Executive Congress US 2014, an annual business conference and networking event for the MEMS and sensors industry, November 5-7, 2014 in Scottsdale, AZ.

SEMICON Taiwan 2014 opens today with spotlight on 3D-IC, sustainable manufacturing, and MEMS

Wed, 9 Sep 2014
Taiwanese chipmakers, LED manufacturers, and Outsourced Semiconductor Assembly and Test (OSAT) firms will spend firm nearly $24 billion in the next two years on equipment and materials, powering excitement for SEMICON Taiwan 2014, which opened today in Taipei.

Oxford Instruments launches 3rd annual Indian nanotechnology seminars in Kolkata and Delhi

Thu, 9 Sep 2014
Oxford Instruments is hosting its third series of annual seminars for the nanotechnology industry in India in November.

Rudolph introduces new acoustic metrology and defect inspection technology

Thu, 9 Sep 2014
Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).