Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA.
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013.
Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.
Much has been said of the 450mm transition. But the description of this inflection is something of a misnomer.
Critical trends and developments in the technologies, methodologies, and applications challenges in semiconductor test will be presented at the 6th annual IEEE Test Vision 2020 Workshop held in conjunction with SEMICON West 2013, on July 10-11 at the San Francisco Marriot Marquis Hotel.
Several years ago when the challenges to 450mm wafer processing, EUV development and novel transistor designs were first being discussed, SEMI commissioned a study that predicted the industry could face an R&D funding gap that could exceed $9 billion if current technology and economic trends continue.
Dynamic changes to R&D processes, tools, technical challenges, and funding/business models will be highlighted at SEMICON West 2013, along with product displays of the latest semiconductor manufacturing technology, components and subsystems.
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about the appearance of 3D integration on several roadmaps.
Following last week’s formal announcement from Governor Cuomo of the formation of the Facility 450 Consortium (F450C), ten leading nanoelectronics facility companies from around the world will collaborate at CNSE to lead the global effort to design and build the next-generation 450mm computer chip fabrication facilities.
SEMI today announced that Ajit Manocha, CEO of GLOBALFOUNDRIES, has been selected to receive the “SEMI Outstanding EHS Achievement Award — Inspired by Akira Inoue.”
Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.
Europe’s recently launched industrial strategy to reinforce micro- and nanoelectronics manufacturing is more than just a vision — it’s a major opportunity for equipment and material suppliers to participate to large-scale investment projects, increase their holding in key technologies and reach out to new customers and markets.
Engineering samples of The Hybrid Memory Cube (HMC) are expected this summer, with high volume manufacturing coming next year. It will be one of the first high volume devices employing 3D integration and through silicon vias (TSVs), employing a bottom logic layer and 4-8 stacked DRAM layers.
DAS Environmental Expert GmbH of Dresden, Germany, has developed SALIX, a point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications.
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about an ASML presentation from Semicon West. This is a follow up to a previous post: "Dimensional Scaling and the SRAM Bit-Cell."
Israel Beinglass, CTO of MonolithIC 3D Inc., blogs about roadmap misses and the relationship between two seemingly unrelated technologies.