Semicon-West-2013

Topic Index

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Multitest VP to discuss quality in 3D assembly at SEMICON West

Tue, 6 Jun 2013

Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA.


SEMI releases report on first quarter 2013 manufacturing equipment billings

Tue, 6 Jun 2013

SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013.


"Generation Mobile": Advanced Packaging Technology at SEMICON West

Thu, 6 Jun 2013

Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.


450mm – It’s bigger than you think

Thu, 6 Jun 2013

Much has been said of the 450mm transition.  But the description of this inflection is something of a misnomer.


Test Vision 2020 at SEMICON West to address emerging test strategies, technologies and challenges

Fri, 5 May 2013

Critical trends and developments in the technologies, methodologies, and applications challenges in semiconductor test will be presented at the 6th annual IEEE Test Vision 2020 Workshop held in conjunction with SEMICON West 2013, on July 10-11 at the San Francisco Marriot Marquis Hotel.


Semiconductor R&D: A state of transition

Thu, 4 Apr 2013

Several years ago when the challenges to 450mm wafer processing, EUV development and novel transistor designs were first being discussed, SEMI commissioned a study that predicted the industry could face an R&D funding gap that could exceed $9 billion if current technology and economic trends continue.


SEMICON West 2013 to address industry R&D challenges and opportunities

Tue, 3 Mar 2013

Dynamic changes to R&D processes, tools, technical challenges, and funding/business models will be highlighted at SEMICON West 2013, along with product displays of the latest semiconductor manufacturing technology, components and subsystems.


Monolithic 3D is now on the roadmap for 2019

Thu, 8 Aug 2013

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about the appearance of 3D integration on several roadmaps.


F450C hosts panel during SEMICON West to address 450mm facility infrastructure

Wed, 7 Jul 2013

Following last week’s formal announcement from Governor Cuomo of the formation of the Facility 450 Consortium (F450C), ten leading nanoelectronics facility companies from around the world will collaborate at CNSE to lead the global effort to design and build the next-generation 450mm computer chip fabrication facilities.


SEMI recognizes GLOBALFOUNDRIES CEO

Tue, 7 Jul 2013

SEMI today announced that Ajit Manocha, CEO of GLOBALFOUNDRIES, has been selected to receive the “SEMI Outstanding EHS Achievement Award — Inspired by Akira Inoue.”


Options for adding memory and logic to printed or flexible electronics

Tue, 7 Jul 2013

Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.


Getting ready for 10/100/20 – Europe’s manufacturing initiative is underway

Tue, 7 Jul 2013

Europe’s recently launched industrial strategy to reinforce micro- and nanoelectronics manufacturing is more than just a vision — it’s a major opportunity for equipment and material suppliers to participate to large-scale investment projects, increase their holding in key technologies and reach out to new customers and markets.


Hybrid Memory Cube nears engineering sample milestone

Wed, 7 Jul 2013

Engineering samples of The Hybrid Memory Cube (HMC) are expected this summer, with high volume manufacturing coming next year. It will be one of the first high volume devices employing 3D integration and through silicon vias (TSVs), employing a bottom logic layer and 4-8 stacked DRAM layers.


Scrubber developed for POU abatement of wet bench gases

Thu, 7 Jul 2013

DAS Environmental Expert GmbH of Dresden, Germany, has developed SALIX, a point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications.


ASML at Semicon West 2013: SRAM scaling has stopped!

Thu, 7 Jul 2013

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about an ASML presentation from Semicon West. This is a follow up to a previous post: "Dimensional Scaling and the SRAM Bit-Cell."


EUV vs TSV: Which one will become production ready first?

Wed, 7 Jul 2013

Israel Beinglass, CTO of MonolithIC 3D Inc., blogs about roadmap misses and the relationship between two seemingly unrelated technologies. 


EV Group establishes nanoimprint lithography competence center for photonic applications

Mon, 12 Dec 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has established the NILPhotonics Competence Center.