Semiconductors

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Ultraviolet light to the extreme

Wed, 10 Oct 2013
For the first time, researchers have mapped this EUV emission and developed a theoretical model that explains how the emission depends on the three-dimensional shape of the plasma.

Pure-play foundries spending big on capital equipment

Wed, 10 Oct 2013
Semiconductor capital spending has increased significantly among pure-play foundries as more IDMs shift to a fabless/fab-lite business model and as new foundry participants intensify competition among the old guard.

Promising new alloy for resistive switching memory

Fri, 9 Sep 2013
Tiny nanoscale filaments could be breakthrough for smaller, denser memory devices.

Logic gates in graphene technology

Wed, 9 Sep 2013
Serial production of a QCA graphene cell could be possible. Simple, well-defined process steps are identified.

Densest array of carbon nanotubes grown to date

Fri, 9 Sep 2013
New technique could one day help improve the performance of microelectronics in devices ranging from batteries to spacecraft.

High temperature reverse bias reliability testing of high power devices

Wed, 9 Sep 2013
Power device characterization and reliability testing require instrumentation capable of sourcing higher voltages and more sensitive current measurements than ever before.

Graphene Frontiers awarded $745k NSF grant for ‘roll-to-roll’ graphene production

Thu, 9 Sep 2013
Graphene Frontiers, a Philadelphia-based advanced materials and nanotechnology company, has been awarded a $744,600 grant from the National Science Foundation. The funds will be used to develop roll-to-roll production of graphene.

Mentor Graphics and TSMC collaborate on reference flow for 16nm FinFet process technology

Fri, 9 Sep 2013
Mentor Graphics Corp. today announced that it has completed enhancements to its digital tool set for TSMC’s 16nm FinFET manufacturing processes.

Silicon Labs launches the world’s most energy-friendly MCUs

Wed, 10 Oct 2013
Silicon Labs, a developer of high-performance, analog-intensive, mixed-signal ICs, today introduced the industry’s most energy-friendly 32-bit microcontrollers (MCUs) based on the ARM Cortex-M0+ processor.

ASML and imec launch advanced patterning center

Mon, 10 Oct 2013
New Center will offer the global semiconductor ecosystem crucial patterning knowledge for sub-10nm technologies.

Applied Materials to merge with Tokyo Electron

Tue, 9 Sep 2013
Applied Materials Inc. and Tokyo Electron Limited today announced Applied Materials agreed to merge with Tokyo Electron.

Stanford scientists publish theory, formula to improve 'plastic' semiconductors

Tue, 9 Sep 2013
A better understanding of the conductive properties of flexible semiconductors will aid in the development of bendable electronics.

Micron and imec extend research collaboration

Tue, 9 Sep 2013
Imec and Micron Technology, Inc. announced today a three-year extension of their strategic research collaboration on advanced CMOS scaling and expanded on additional joint research efforts.

MACOM releases industry’s first surface mount L-Band 90W GaN power module

Tue, 9 Sep 2013
MACOM Technology Solutions Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced the newest entry in its portfolio of GaN in Plastic packaged power products.

Imec demonstrates 25Gb/s silicon photonics devices on single platform

Tue, 10 Oct 2013
Imec today announced the release of its fully integrated silicon photonics platform (iSiPP25G) for high-performance optical transceivers (25Gb/s and beyond).

Reducing mask write-time—which strategy is best?

Tue, 10 Oct 2013
An upcoming challenge of advanced-node design is the expected mask write time increase associated with the continued use of 193nm wavelength lithography.

EV Group introduces roll-to-roll nanoimprint lithography system

Tue, 10 Oct 2013
EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 570R2R—the industry's first roll-to-roll thermal nanoimprint lithography (NIL) tool.

Micron ships first samples of Hybrid Memory Cube

Wed, 9 Sep 2013
Micron Technology, Inc. announced today that it is shipping 2GB Hybrid Memory Cube (HMC) engineering samples.

SEMI book-to-bill ratio indicates bookings decline

Thu, 9 Sep 2013
North America-based manufacturers of semiconductor equipment posted $1.06 billion in orders worldwide in August 2013 (three-month average basis) and a book-to-bill ratio of 0.98, according to the August EMDS Book-to-Bill Report published today by SEMI.

Semtech named to Fortune’s list of 100 Fastest Growing Companies

Tue, 9 Sep 2013
Semtech Corporation, a supplier of analog and mixed-signal semiconductors, today announced that it has moved up four points on the Fortune Magazine list of the 100 Fastest Growing Companies that was published in the magazine’s September 16, 2013 issue.

A new training methodology needed

Wed, 9 Sep 2013
We have an interesting dynamic in the world of semiconductor training that has been in play since the financial crisis in 2008-2009.

Inside the Hybrid Memory Cube

Wed, 9 Sep 2013
The HMC provides a breakthrough solution that delivers unmatched performance with the utmost reliability.

Mobility now driving the industry

Wed, 9 Sep 2013
It’s apparent that the world’s appetite for electronics has never been greater. That has increasingly taken the form of mobile electronics, including smartphones, tablets and tablets and the new “phablets.” People want to watch movies and live sports on their phones.

Major leap towards graphene for solar cells

Wed, 10 Oct 2013
Surprising result: Graphene retains its properties even when coated with silicon.

Micron Technology appoints Thomas Snodgrass as VP of System Solutions

Tue, 10 Oct 2013
Micron Technology, Inc. today announced that the company has named Tom Snodgrass, vice president, System Solutions.

Alpha and Omega Semiconductor announces resignation of its CFO

Tue, 10 Oct 2013
Alpha and Omega Semiconductor today reported that Mary L. Dotz, its Chief Financial Officer, has announced her resignation in order to pursue other interests.

NXP NextPowerS3 MOSFETs offer super-fast switching with soft recovery

Fri, 9 Sep 2013
Industry’s first MOSFET platform to deliver integrated Schottky performance with low leakage current.

Imec and SPTS partner on advanced nanotechnology applications in BioMEMS

Tue, 10 Oct 2013
SPTS Technologies and imec announced a joint partnership to further advance micro- and nanosized components for BioMEMS.

Stanford and UT Austin professors to be honored at annual SRC TECHCON

Thu, 9 Sep 2013
Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, will honor professors from Stanford University and University of Texas at Austin with awards for chip-related research and education at SRC’s annual TECHCON conference Sept. 9-10.

SEMI and Solid State Technology announce the 2015 “Best of West” Award finalists

Tue, 6 Jun 2015
The award was established to recognize new products moving the industry forward with technological developments in the microelectronics supply chain.

Process Watch: The most expensive defect - Part 2

Thu, 7 Jul 2015
The December 2014 edition of Process Watch suggested that the most expensive defect is the one that goes undetected until the end of line. Indeed, undetected excursions typically result in the scrap of millions of dollars per year of defective semiconductor chips.

Fairchild Semiconductor appoints Chris Allexandre VP of worldwide sales

Tue, 10 Oct 2013
Fairchild Semiconductor, a global supplier of high performance power and mobile semiconductor solutions, has appointed Chris Allexandre to the position of Senior Vice President of Worldwide Sales.

Wyle wins $14.9 million award to conduct technical evaluations for U.S. Air Force

Fri, 10 Oct 2013
Wyle has been awarded a task order valued at $14.9 million to provide analyses of military and commercial developmental semiconductor devices and components for the U.S. Air Force Research Laboratory at Wright-Patterson Air Force Base in Dayton, Ohio.

Alpha and Omega Semiconductor launches new DrMOS-IIIS power modules

Mon, 9 Sep 2013
Alpha and Omega Semiconductor, a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today launched the AOZ5019, a third-generation high efficiency power module with an EZPair package.

Noel Technologies now providing 450mm wafer services

Tue, 10 Oct 2013
Semiconductor wet processes, etches and cleans, resist spin coatings and films the first services available

With carbon nanotubes, a path to flexible, low-cost sensors

Wed, 9 Sep 2013
Researchers at the Technische Universitaet Muenchen (TUM) are showing the way toward low-cost, industrial-scale manufacturing of a new family of electronic devices.

A new photoresist technology for organic semiconductors enabling submicron patterns

Thu, 9 Sep 2013
Fujifilm and imec have developed a new photoresist technology for organic semiconductors that enables the realization of submicron patterns.

Gigaphoton develops CO2 drive laser for high output EUV light sources

Mon, 9 Sep 2013
Gigaphoton Inc. announced today that the company has jointly developed a high power CO2 drive laser for Extreme Ultraviolet (EUV) light sources with Mitsubishi Electric Corporation. Likewise, an average output level of 15W was achieved on a development EUV system – representing another step forward in realizing production level EUV light sources.

Global semiconductor sales increase for sixth straight month in August

Fri, 10 Oct 2013
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $25.87 billion for the month of August 2013, an increase of 6.4 percent compared to August 2012, marking the industry's largest year-over-year growth since March 2011.

IBM breaks record with silicon nanowire MOSFET

Fri, 10 Oct 2013
IBM devices with a 90nm gate pitch demonstrated the highest performance ever reported for a SiNW device at a gate pitch below 100 nm.

STMicroelectronics receives Innovation Management Award for chip manufacturing tech

Wed, 10 Oct 2013
STMicroelectronics announced on Tuesday it has won a prestigious BearingPoint Innovation Management Award for its FD-SOI technology in the "Innovation Ecosystem" category.

CU, MIT breakthrough in photonics could lead to faster electronics

Wed, 10 Oct 2013
A pair of breakthroughs in the field of silicon photonics by researchers at the University of Colorado Boulder, the Massachusetts Institute of Technology and Micron Technology Inc. could allow for the trajectory of exponential improvement in microprocessors that began nearly half a century ago—known as Moore's Law—to continue well into the future, allowing for increasingly faster electronics, from supercomputers to laptops to smartphones.

Intermolecular and Russian nanocenter sign joint development agreement

Fri, 10 Oct 2013
Intermolecular, Inc. and RUSNANO, the Fund for Infrastructure and Educational Programs, today announced the signing of a joint development agreement between Intermolecular and Ulnanotech, the leading Russian Federation nanocenter based in Ulyanovsk.

InvenSense opens Korean design center

Wed, 10 Oct 2013
InvenSense, Inc., the provider of MotionTracking system on chip devices, announced the opening of a new design center in Seoul, Korea.

TSMC to unveil 16nm FinFET platform at IEDM

Fri, 10 Oct 2013
At the International Electron Devices Meeting (IEDM) in December, TSMC researchers will unveil a 16nm FinFET process that by many measures is one of the world’s most advanced semiconductor technologies.

AppliedMicro appoints Doug Ahrens as Chief Financial Officer

Wed, 10 Oct 2013
Applied Micro Circuits Corporation, also known as AppliedMicro, today announced it has appointed semiconductor veteran Douglas T. Ahrens to serve as Vice President and Chief Financial Officer.

Intermolecular names Rick Neely CFO

Wed, 10 Oct 2013
Intermolecular, Inc. today announced that it has named C. Richard Neely, Jr. as the company's chief financial officer (CFO) and senior vice president.

Nordic Semiconductor launches world’s first concurrent ANT+ and Bluetooth low energy combo chip

Wed, 10 Oct 2013
Ultra low power (ULP) RF specialist Nordic Semiconductor ASA today announces the release of the world's first multi-protocol SoC solution offering concurrent ANT+ and Bluetooth low energy wireless communication natively in a single chip.

Americas region remains largest market for pure-play foundry sales

Wed, 10 Oct 2013
Emphasis on fabless and fab-lite models in U.S. contributes to 62% marketshare.

The Internet of Things is poised to change everything, says IDC

Fri, 10 Oct 2013
The Internet of Things represents a new construct in the information and communications technology world that is occupying the minds of IT vendors, service providers, and systems integrators as it represents huge potential for new streams of revenue and new customers.

World record solar cell with 44.7% efficiency

Mon, 9 Sep 2013
The Fraunhofer Institute for Solar Energy Systems ISE, Soitec, CEA-Leti and the Helmholtz Center Berlin jointly announced this week having achieved a new world record for the conversion of sunlight into electricity using a new solar cell structure with four solar subcells.

Monolithic 3D chip fabricated without TSVs

Fri, 10 Oct 2013
Researchers from Taiwan’s National Nano Device Laboratories avoided the use of TSVs by fabricating a monolithic sub-50nm 3D using a novel CMP technique.

TowerJazz announces the creation and accreditation of Jazz Semiconductor Trusted Foundry

Wed, 8 Aug 2013

Expands support for the US Aerospace and Defense market in its Newport Beach, CA facility


PC outlook lowered again

Fri, 8 Aug 2013
Worldwide PC shipments are now expected to fall by -9.7 percent in 2013, further deepening what is already the longest market contraction on record.

Moore's Law Dead By 2022: Crying Wolf?

Fri, 8 Aug 2013
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about recent predictions regarding the demise of continued scaling.

Dow Corning and EV Group to collaborate on temporary bonding materials for 3D-IC

Tue, 9 Sep 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG's LowTemp platform for room-temperature wafer bonding and debonding processes.

Imec and Veeco to collaborate on GaN-on-Si devices for LEDs and power electronics

Tue, 9 Sep 2013
Nanoelectronics research center imec of Belgium and Veeco Instruments Inc. are collaborating on a project aimed at lowering the cost of producing gallium nitride on silicon-based power devices and LEDs.

Advancing graphene for post-silicon computer logic

Tue, 9 Sep 2013
Team of UC Riverside researchers pioneer new approach for graphene logic circuits.

Analysis of South Korea’s CVD precursor industry

Wed, 9 Sep 2013
Chemical vapor deposition is a process used to deposit diverse thin films of crystalline or amorphous metal, inter-metallic compounds, oxides, nitrides, carbides, and inorganic polymer.

Electronics advance moves closer to a world beyond silicon

Wed, 9 Sep 2013
Researchers in the College of Engineering at Oregon State University have made a significant advance in the function of metal-insulator-metal, or MIM diodes, a technology premised on the assumption that the speed of electrons moving through silicon is simply too slow.

Collaboration needed on 3D-IC

Thu, 9 Sep 2013
The history of semiconductors has been a history of collaboration. Today, a similar industry-wide collaborative approach to 3D stacked ICs is needed to reach widespread 3D-IC adoption and continue the amazing progress our industry has historically achieved.

Will 2014 be the next Golden Year?

Thu, 9 Sep 2013
Some unexpected underdogs spur spending spree.

SPTS announces new Sigma PVD for 300mm power device manufacturing

Fri, 9 Sep 2013
SPTS Technologies this week announced the launch of its Sigma fxP physical vapor deposition (PVD) system for 300mm power device manufacturing.

Stanford scientists use DNA to assemble a transistor from graphene

Fri, 9 Sep 2013
DNA is the blueprint for life. Could it also become the template for making a new generation of computer chips based not on silicon, but on an experimental material known as graphene?

Growing thin films of germanium

Fri, 9 Sep 2013
A new method to grow germanium crystals at low temperatures may lead to next-generation large-scale integrated circuits and future flexible electronics.

Fab equipment spending up 25% in 2014

Mon, 9 Sep 2013
Semiconductor revenue has improved in 2013 compared to 2012 and early forecasts for 2014 project revenue growth averaging about eight percent.

Multibeam technology predicted for use in advanced photomask production by 2016, says survey

Mon, 9 Sep 2013
The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced the completion of the second annual eBeam Initiative survey.

Accidental nanoparticle discovery could hail revolution in manufacturing

Tue, 9 Sep 2013
A nanoparticle shaped like a spiky ball, with magnetic properties, has been uncovered in a new method of synthesising carbon nanotubes by physicists at Queen Mary University of London and the University of Kent.

SMTA Intermountain Chapter to hold annual technical symposium

Tue, 9 Sep 2013
The Surface Mount Technology Association (SMTA)’s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.

Saws made of carbon

Tue, 9 Sep 2013
More material could be saved when manufacturing wafers in future. Ultra-thin saws made of carbon nanotubes and diamond would be able to cut through silicon wafers with minimum kerf loss. A new method makes it possible to manufacture the saw wires.

New magnetic semiconductor material holds promise for 'spintronics'

Tue, 9 Sep 2013
Researchers at North Carolina State University have created a new compound that can be integrated into silicon chips and is a dilute magnetic semiconductor – meaning that it could be used to make "spintronic" devices, which rely on magnetic force to operate, rather than electrical currents.

SEMI: Second quarter semiconductor equipment billings US$ 7.55B

Tue, 9 Sep 2013
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.55 billion in the second quarter of 2013

New Intel CEO, president talk product plans and future of computing

Tue, 9 Sep 2013
From data centers to ultra-mobile devices such as tablets, phones and wearables, computing segments are undergoing exciting and even game-changing transitions, said new Intel CEO Brian Krzanich during today’s opening session of the Intel Developer Forum.

Shining a little light changes metal into semiconductor

Tue, 9 Sep 2013
By blending their expertise, two materials science engineers at Washington University in St. Louis changed the electronic properties of new class of materials — just by exposing it to light.

SUNY CNSE to develop center for 450mm computer chip manufacturing

Thu, 9 Sep 2013
Building on Governor Cuomo’s CNSE G450C initiative and expanded partnership between NanoCollege and the Mohawk Valley EDGE continues New York’s investment strategy.

The advantages of a hybrid scan test solution

Thu, 9 Sep 2013
Scan testing is the standard practice for test of integrated circuits. The vast majority of IC production test is based on automatic test pattern generation (ATPG) using the scan logic.

Bruker announces acquisition of Prairie Technologies

Fri, 9 Sep 2013
Bruker Corporation today announced that it has acquired Prairie Technologies, Inc. (Prairie), a provider of life science fluorescence microscopy products.

Brooks Automation appoints Lindon G. Robertson as CFO

Fri, 9 Sep 2013
Brooks Automation, Inc. today announced the appointment of Lindon G. Robertson as executive vice president and chief financial officer, effective October 1, 2013.

Brewer Science’s new carbon nanotube materials are qualified for NRAM manufacturing

Fri, 9 Sep 2013
Brewer Science announced today that the next generation of carbon nanotube materials, the CNTRENE 1020 material series, is officially qualified for NRAM nanotube random access memory device manufacturing by Nantero Inc.

Worldwide total semiconductor market to grow 3% in 2013; consolidation still rife

Fri, 9 Sep 2013
The worldwide semiconductor market is expected to grow three percent from 2012 to 2013. There has been sequential market growth from 1Q13 to 2Q13 and the vast majority of the top 20 vendors are expecting 3Q13 to grow revenues again.

MediaTek and Imagination expand partnership

Fri, 9 Sep 2013
Imagination Technologies has signed a further license agreement with MediaTek Inc., a fabless semiconductor company for wireless communications and digital multimedia solutions.

Entegris to partner with SEMATECH on surface conditioning and wafer cleaning technology

Mon, 9 Sep 2013
Entegris, Inc. and SEMATECH announced they have partnered to move forward the development of advanced nanoscale particle removal processes and cleaning technologies for next-generation wafers and devices.

Spansion licenses ARM processor technology to power embedded systems

Mon, 9 Sep 2013
Spansion Inc. today announced it has licensed a wide range of ARM processors for its current and future product lineup aimed at embedded applications in the automotive, industrial and consumer markets.

Graphene photodetector integrated into a computer chip

Mon, 9 Sep 2013
Both academia and the industry have high hopes for graphene. The material, which consists of a single layer of hexagonally arranged carbon atoms, has extraordinary properties.

Asia-Pac soars, Japan drops in regional semiconductor capex spending

Tue, 9 Sep 2013
Capex marketshare flips in Asia-Pac and Japan; Europe's share erodes while North America gains.

Imec, KULeuven and AIST pave the way toward increased mobility of beyond 10nm MOS devices

Tue, 9 Sep 2013
Tensile-strained GeSn MOSFET devices on Si developed using solid phase epitaxy.

Leading-edge technology to be responsible for 2013 increase in pure-play foundry sales

Tue, 9 Sep 2013
TSMC forecast to sell $6.33 billion worth of ≤28nm devices this year, a 3x increase over 2012.

Megasonic Cleaning without Damage?

Wed, 9 Sep 2013
Megasonics has been used considered and used for many years to meet many of the cleaning challenges, but it has been shown to cause damage to nanoscale device structures such as polysilicon lines.

RFMD introduces world’s first 6-inch GaN-on-SiC wafers for RF power transistors

Thu, 9 Sep 2013
RFMD today introduced the world's first 6-inch GaN-on-Silicon Carbide (SiC) wafers for manufacturing RF power transistors for both military and commercial use.

Worldwide semiconductor manufacturing equipment spending to decline 8.5 percent in 2013

Thu, 9 Sep 2013
Worldwide semiconductor manufacturing equipment spending is projected to total $34.6 billion in 2013, an 8.5 percent decline from 2012 spending of $37.8 billion, according to Gartner, Inc.

Dow introduces new SOLDERON tin-silver plating chemistry for lead-free bump plating

Wed, 10 Oct 2013
Next-gen SnAg offers industry-leading plating rates and process flexibility for flipchip packages and interconnects

Semiconductor materials market to approach $50 billion in 2014

Thu, 10 Oct 2013
SEMI believes that the semiconductor materials market will trend with the device market, resulting in an increase of one percent this year and a seven percent increase in 2014, resulting in a materials market approaching $50 billion in 2014.

ASMC 2014 offers opportunity for presenters

Thu, 11 Nov 2013
SEMI announced today that the deadline for presenters to submit an abstract for the 25th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 28.

Intersil appoints Roger Wendelken as senior VP of worldwide sales

Tue, 10 Oct 2013
Intersil Corporation, a provider of innovative power management and precision analog solutions, today announced the appointment of Roger Wendelken as senior vice president of worldwide sales effective immediately.

Model-based hints: GPS for LFD success

Wed, 10 Oct 2013
For several technology nodes now, designers have been required to run lithography-friendly design (LFD) checks prior to tape out and acceptance by the foundry. Due to resolution enhancement technology (RET) limitations at advanced nodes, we are seeing significantly more manufacturing issues, even in DRC-clean designs.

Laser thermal anneal to boost performance of 3D memory devices

Wed, 10 Oct 2013
Nanoelectronics research center imec and Excico have successfully demonstrated the application of laser thermal anneal (LTA) to boost the current in vertical polysilicon channel devices for 3D memory.

Argument for not cleaning up process water is wafer thin

Thu, 10 Oct 2013
When facilities management and water treatment company MSS Group was called in to clean up the process water in a globally renowned manufacturer of semiconductor wafers, the company was presented with an untreated water system suffering from significant corrosion.

Jury finds Qualcomm guilty of patent infringement

Thu, 10 Oct 2013
ParkerVision, Inc., a developer and marketer of semiconductor technology solutions for wireless applications, today announced that a jury in the U.S. District Court for the Middle District of Florida found Qualcomm Incorporated guilty of direct and indirect infringement of ParkerVision patents.

Power management, industrial analog units post strong gains

Fri, 10 Oct 2013
Total shipments of analog devices forecast to jump 14% in 2013.

Size matters in the giant magnetoresistance effect in semiconductors

Mon, 10 Oct 2013
In a paper appearing in Nature's Scientific Reports, Dr. Ramesh Mani, professor of physics and astronomy at Georgia State University, reports that a giant magnetoresistance effect depends on the physical size of the device in the GaAs/AlGaAs semiconductor system.

TV semiconductor market growing despite decline in TV shipments

Fri, 10 Oct 2013
Wireless video, network interfaces, multi-format decoders, LED backlighting boost average semiconductor content per TV.

Alpha and Omega Semiconductor introduces a new family of high performance common-drain MOSFETs

Mon, 10 Oct 2013
Alpha and Omega Semiconductor Limited this week released a new dual MOSFET family in the common-drain configuration in both DFN 5x6 and Micro-DFN 3.2x2 packages.

Scaling makes monolithic 3D IC practical

Mon, 10 Oct 2013
In the 1960s, James Early of Bell Labs proposed three-dimensional structures as a natural evolution for integrated circuits. Since then many attempts have been made to develop such a technology.

Monte Carlo analysis has become a gamble

Mon, 10 Oct 2013
Dr. Bruce McGaughy, CTO and SVP of Engineering at ProPlus Design Solutions, Inc. blogs about the wisdom of Monte Carlo analysis when high sigma methods are perhaps better suited to today’s designs.

Zygo Corp appoints Gary Willis as interim CEO

Mon, 10 Oct 2013
Zygo Corporation today announced that Dr. Chris L. Koliopoulos is stepping down as the Chairman of the Board, President and Chief Executive Officer effective immediately, following the mutual decision of Dr. Koliopoulos and Zygo's board of directors.

Book-to-bill ratio reflects seasonal softening

Tue, 10 Oct 2013
North America-based manufacturers of semiconductor equipment posted $975.3 million in orders worldwide in September 2013 (three-month average basis) and a book-to-bill ratio of 0.97, according to the September EMDS Book-to-Bill Report published today by SEMI.

UK photonics industry must connect higher in the value chain

Wed, 10 Oct 2013
Carlos Lee, Director General of the European Photonics Industry Consortium (EPIC), moderated a discussion with executives from the UK photonics industry and filed this report.

EU project to industrialize world record high-density capacitors

Wed, 10 Oct 2013
CEA-Leti, Fraunhofer IPMS-CNT and three European companies have launched a two-year project to industrialize 3D integrated capacitors with world-record density using atomic layer deposition.

Memory materials revolution highlighted at SMC

Wed, 10 Oct 2013
While the number of materials used in semiconductor logic will increase approximately 50 percent in the transition from 32nm to 22nm production, the materials revolution in memory will be even more pronounced, challenging developers, manufacturers, equipment, and materials suppliers, according to experts speaking at the SEMI Strategic Materials Conference 2013, held in Santa Clara on October 16-17.

SRC launches synthetic biology research for novel semiconductor applications

Wed, 10 Oct 2013
Research at six universities including MIT, University of Massachusetts at Amherst, Yale, Georgia Tech, Brigham Young and Washington

Imec and John Hopkins University team to expand healthcare applications for silicon nanotech

Thu, 10 Oct 2013
Researchers and physicians at Johns Hopkins University will collaborate with the nanoelectronics R&D center imec to advance silicon applications in healthcare, beginning with development of a device to enable a broad range of clinical tests.

Micron appoints Brian Angell as VP of Advanced Controller Development

Thu, 10 Oct 2013
Micron Technology, Inc. today announced that the company has named Brian Angell, vice president, Advanced Controller Development.

LED applications to be key drivers for bulk GaN market

Thu, 10 Oct 2013
In either a cautious or a more aggressive scenario, LED applications will certainly be the key drivers for the bulk GaN market, according to Yole Développement.

450mm higher gas flows pose opportunities

Wed, 10 Oct 2013
The move to 4500mm wafers will likely result in gas flow increased on process vacuum and abatement equipment.

Gallium nitride to drive growth of pulsed RF power semiconductor device markets to exceed $250M by 2018

Fri, 10 Oct 2013
Markets for pulsed RF power devices up to 18 GHz are expected to show continued solid growth over the next five years despite the current economic turmoil and cuts in defense spending. While the volatility of many global electronics markets is fueled by their association with consumer spending, markets for pulsed RF power devices are supported by quite different priorities.

MEMS devices for biomedical applications

Mon, 10 Oct 2013
Dr. Ramesh Ramadoss, Senior Manager in the MicroProbe Product Group of FormFactor Inc., provides an overview of MEMS and highlights a variety of applications in the biomedical area, including pressure sensors, inertial sensors, transducers for hearing aids, microfluidics for diagnostics and drug delivery, micromachined needles and microsurgical tools.

Researchers advance scheme to design seamless integrated circuits etched on graphene

Tue, 10 Oct 2013
Researchers in electrical and computer engineering at UC Santa Barbara have introduced and modeled an integrated circuit design scheme in which transistors and interconnects are monolithically patterned seamlessly on a sheet of graphene, a 2-dimensional plane of carbon atoms. The demonstration offers possibilities for ultra energy-efficient, flexible, and transparent electronics.

ASU, Georgia Tech create breakthrough for solar cell efficiency

Tue, 10 Oct 2013
New atomic layer-by-layer InGaN technology offers perfect crystal.

Advanced light source provides a new look at vanadium dioxide

Tue, 10 Oct 2013
Vanadium dioxide is one of the few known materials that acts like an insulator at low temperatures but like a metal at warmer temperatures starting around 67 degrees Celsius.

Global semiconductor leaders encourage China to support expansion of Key Trade Agreement

Wed, 10 Oct 2013
Senior executives from Semiconductor Industry Association (SIA) member companies and other multi-national semiconductor companies around the globe sent a letter to Chinese Vice Premiers Wang Yang and Ma Kai on October 16, encouraging China to support duty-free coverage for semiconductor products in an expanded Information Technology Agreement (ITA).

Will 2014 be the Next Golden Year?

Wed, 10 Oct 2013
Some unexpected underdogs spur spending spree.

Managing legacy fabs and the role of secondary equipment

Wed, 10 Oct 2013
The choice between buying new systems from OEMs or fully capable refurbished gear from qualified used equipment vendors is examined.

Three-dimensional atomic force microscopy

Wed, 10 Oct 2013
3D atomic force microscopes can measure critical dimensions, line edge roughness and sidewall roughness in a way that is highly accurate, non-destructive and cost-effective.

Defect-free mask blanks next EUV challenge

Wed, 10 Oct 2013
The next major roadblock to progress in the ongoing push to develop EUV lithography for volume production is the availability of defect-free mask blanks.

How to verify incident implant angles on medium current implants

Wed, 10 Oct 2013
Results can depend on the properties of the wafers used, the conditions of the implant, the conditions of the anneal process, and even the measurement technique.

Toshiba launches new embedded NAND flash memory using 19nm process technology

Thu, 10 Oct 2013
Toshiba Corporation today announced the launch of new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology.

Peregrine and GLOBALFOUNDRIES to collaborate

Fri, 11 Nov 2013
Peregrine Semiconductor and GLOBALFOUNDRIES, a leading provider of semiconductor manufacturing technology, are sampling the first RF Switches built on Peregrine’s new UltraCMOS 10 RF SOI technologies.

Revival in semiconductor industry drives growth in the surface mount technology equipment market

Fri, 11 Nov 2013
SMT equipment market continues to derive demand from major downstream industry segments including telecommunications, computing and consumer appliances, which are the most prolific users of PCBs, according to a new report from Global Industry Analysts, Inc.

Defective nanotubes turned into light emitters

Fri, 11 Nov 2013
UPV/EHU-University of the Basque Country researchers have developed and patented a new source of light emitter based on boron nitride nanotubes and suitable for developing high-efficiency optoelectronic devices.

New techniques produce cleanest graphene yet

Fri, 11 Nov 2013
Columbia Engineers develop new device architecture for 2D materials, making electrical contact from the 1D edge.

Rubicon launches first commercial line of large diameter patterned sapphire substrates

Fri, 11 Nov 2013
Rubicon Technology announced the launch of the first commercial line of large diameter patterned sapphire substrates (PSS) in four-inch through eight-inch diameters.

Imec demonstrates world's first III-V FinFET devices monolithically integrated on 300mm silicon wafers

Tue, 11 Nov 2013
Technology achievement marks significant step towards monolithic heterogeneous integration and non-silicon devices.

Are we using Moore's name in vain?

Tue, 11 Nov 2013
Clearly Moore's law is about cost, and Gordon Moore’s observation was that the optimum number of components (nowadays - transistors) to achieve minimum cost will double every year.

Expect big changes to 2013 Top 20 Semi Supplier ranking

Thu, 11 Nov 2013
SK Hynix, MediaTek, Micron, and Qualcomm each forecast to show ≥30% year-over-year growth.

DecaWave launches industry's most precise indoor location, communication CMOS chip

Thu, 11 Nov 2013
Fabless semiconductor company DecaWave announced today its first single chip of the ScenSor wireless technology family, DW1000, which makes indoor location and communications more accurate, cost-effective and power-efficient than ever before.

SRC, Northeastern University research to increase tumble frequency range of next-generation mobile devices

Thu, 11 Nov 2013
Development of voltage-tunable radio frequency inductors boosts semiconductor and defense industry applications.

Plastic Electronics Conference to rotate between Dresden and Grenoble beginning in 2014

Thu, 11 Nov 2013
SEMI, the global trade organization representing the nano- and micro-electronic manufacturing supply chains, today announced that next year’s Plastic Electronics Conference (PE2014) will be held in Grenoble, France and alternate with Dresden, Germany in future years to better address pan-European opportunities and challenges in Plastic Electronics.

OEM Group celebrates grand opening of expanded facility in Japan

Thu, 11 Nov 2013
Global semiconductor capital equipment manufacturer OEM Group, Inc. announced the opening of its new Sales and Service Center in Yokohama, Japan.

STMicroelectronics, Memoir Systems combine breakthrough memory, semiconductor process technologies

Thu, 11 Nov 2013
Efforts make embedded memory faster, cooler and simpler.

Toshiba starts shipments of CMOS image sensor for automotive view cameras

Mon, 11 Nov 2013
Toshiba Corporation today announced that started sample shipments of a VGA, 1/4 inch CMOS image sensor, “TCM5126GBA,” for automotive view cameras.

Xilinx ships industry's first 20nm all programmable product

Mon, 11 Nov 2013
Xilinx today announced first customer shipment of the semiconductor industry's first 20nm product manufactured by TSMC, and the PLD industry's first 20nm All Programmable device.

SIA awards Mike Splinter the Robert N. Noyce award

Mon, 11 Nov 2013
The Semiconductor Industry Association (SIA) today announced that Mike Splinter, former CEO and current executive chairman of the board of directors at Applied Materials, has been named the 2013 recipient of SIA's highest honor, the Robert N. Noyce Award.

Tosoh Corp. to expand Ohio PVD facility to meet needs of 450mm transition

Mon, 11 Nov 2013
Tosoh Corporation announced today that Tosoh Group company Tosoh SMD, Inc., will implement a major expansion at its Grove City, Ohio, operations to develop, produce, and support physical vapor deposition (PVD) sputtering targets for the new 450mm wafer semiconductor market.

Update on 450mm SEMI Standards

Wed, 11 Nov 2013
SEMI Standards task forces are working on encouraging the industry to collaborate on key issues like the technical parameters for 450mm silicon wafers, physical interfaces, carriers, assembly and packaging. To date, SEMI has 13 task forces working on 450mm and has published nineteen (19) 450mm standards with 14 more in the pipeline.

New way to dissolve semiconductors holds promise for electronics industry

Fri, 11 Nov 2013
Semiconductors, the foundation of modern electronics used in flat-screen TVs and fighter jets, could become even more versatile as researchers make headway on a novel, inexpensive way to turn them into thin films.

Taking a new look at carbon nanotubes

Fri, 11 Nov 2013
Despite their almost incomprehensibly small size – a diameter about one ten-thousandth the thickness of a human hair – single-walled carbon nanotubes come in a plethora of different “species,” each with its own structure and unique combination of electronic and optical properties.

Spansion launches family of flexible microcontrollers for the industrial "Internet of Things"

Mon, 11 Nov 2013
Designed for stringent industrial requirements, Spansion FM Family offers a range of high performance and low power solutions.

Micron announces development of new parallel processing architecture

Mon, 11 Nov 2013
Micron Technology, Inc. today announced the development of a fundamentally new computing architecture capable of performing high-speed, comprehensive search and analysis of complex, unstructured data streams.

Imagination unveils industry's most scalable image signal processing architecture

Mon, 11 Nov 2013
Imagination Technologies announces a ground-breaking new camera Image Signal Processing (ISP) architecture codenamed 'Raptor.'

EV Group introduces non-contact lithography system

Tue, 11 Nov 2013
Leveraging EVG's expertise in photolithography, the EVG PHABLE system incorporates a unique contactless lithography mask-based approach that enables full-field, high-resolution and cost-efficient micro- and nanopatterning of passive and active photonic components, such as patterned structures on light emitting diode (LED) wafers, in high-throughput production environments.

U.S. government awards AMD contract to research interconnect architectures

Tue, 11 Nov 2013
The DesignForward award supports the research of the interconnect architectures and technologies needed to support the data transfer capabilities in extreme-scale computing environments.

Above parity: SEMI releases October book-to-bill ratio

Wed, 11 Nov 2013
A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

SUSS MicroTec installs excimer laser stepper at Fraunhofer IZM Berlin

Wed, 11 Nov 2013
SUSS MicroTec has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.

Rubicon Technology appoints Warren Stewart as Senior VP of Sales and Marketing

Thu, 11 Nov 2013
Rubicon Technology, Inc. today announced that Warren S. Stewart III has joined the Company as Senior Vice President of Sales and Marketing, effective immediately.

Can Intel beat TSMC?

Mon, 11 Nov 2013
It would seem that if Intel could scale transistor cost as they have done in the last 40 years then they could win these super high volume consumer-oriented designs where cost is extremely important. And TSMC is clearly taking this seriously.

What can happen when graphene meets a semiconductor

Mon, 11 Nov 2013
For all the promise of graphene as a material for next-generation electronics and quantum computing, scientists still don't know enough about this high-performance conductor to effectively control an electric current.

Nanotubes can solder themselves, markedly improving device performance

Tue, 11 Nov 2013
University of Illinois researchers have developed a way to heal gaps in wires too small for even the world’s tiniest soldering iron.

Soitec and SunEdison enter into patent license agreement

Tue, 11 Nov 2013
Soitec and SunEdison, Inc. announced today that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products.

Semiconductor Industry Association begins leadership transition

Wed, 11 Nov 2013
Semiconductor Industry Association (SIA) president and CEO Brian Toohey has announced his plans to leave the association in 2014 to join New Hampshire-based DEKA Research & Development Corporation as executive vice president.

Semiconductor industry leaders to examine the future of 3D NAND at Dec 10 event

Mon, 12 Dec 2013
Manufacturing 3D NAND designs requires overcoming formidable technical challenges to create extremely complex high-aspect-ratio structures.

2013 semiconductor equipment sales forecast $32B; strong growth forecast for 2014

Tue, 12 Dec 2013
SEMI projects that worldwide sales of new semiconductor manufacturing equipment will contract 13.3 percent to $32.0 billion in 2013.

EV Group introduces full-field UV nanoimprint lithography system

Tue, 12 Dec 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 720 automated UV nanoimprint lithography (UV-NIL) system.

Sankalp Semiconductor appoints Dan Clein into its management team

Tue, 12 Dec 2013
Sankalp Semiconductor Private Limited, a leading Analog Mixed-Signal services and solutions company from India, announced today the appointment of Mr. Dan Clein into its management team. Dan will be based out of the North America region.

Lab school brings manufacturing technologies to middle-school classrooms

Tue, 12 Dec 2013
A partnership among the University of Virginia's (UVa) Schools of Education and Engineering and the Charlottesville Public Schools has led to the launch of Buford Engineering Design Academy, a laboratory school for advanced manufacturing.

Imec simplifies i-PERC solar cell processing by implementing laser doping from ALD-Al2O3

Tue, 12 Dec 2013
The cells achieved average conversion efficiencies of 20.2%.

Cellphones pass PCs as biggest systems market and IC user

Tue, 12 Dec 2013
Tablets and wireless networks are expected to show highest growth rates through 2017.

Soitec announces high-volume manufacturing of new eSI substrates

Wed, 12 Dec 2013
Soitec, a manufacturer semiconductor materials for the electronics and energy industries, today announced it has reached high-volume manufacturing of its new Enhanced Signal Integrity (eSI) substrates, enabling cost-effective and high-performance radio-frequency (RF) devices.

Micron Technology appoints Rajan Rajgopal as VP of Quality

Wed, 12 Dec 2013
Micron Technology, Inc. today announced that the company has named Rajan Rajgopal, vice president of Quality.

Worldwide semiconductor revenue grew 5.2 percent in 2013

Wed, 12 Dec 2013
Worldwide semiconductor revenue totaled $315.4 billion in 2013, a 5.2 percent increase from 2012 revenue of $299.9 billion, according to preliminary results by Gartner, Inc.

Laser light at useful wavelengths from semiconductor nanowires

Thu, 12 Dec 2013
Nanowire lasers could work with silicon chips, optical fibers, even living cells.

Industry on track for highest-ever annual sales in 2013

Thu, 12 Dec 2013
Worldwide sales increase for eighth straight month and top $27 billion for first time ever in October; WSTS forecast projects growth of 4.4 percent in 2013 and 4.1 percent in 2014.

Nikkiso initiates shipments of deep ultraviolet LEDs

Thu, 12 Dec 2013
NIKKISO CO. has announced that it has initiated shipments of commercial LED product samples emitting at a range of wavelengths in the UVB and UVC spectral regimes for industrial, biomedical, and environmental applications.

Brewer Science commercializes thermal slide debonder

Fri, 12 Dec 2013
Brewer Science, a supplier of thin-wafer-handling materials, processes, and equipment to the microelectronics industry, announced today the first commercial placement of its Cee 1300CSX thermal slide debonder.

Equipment spending down 2013; expect 33% growth in 2014

Fri, 12 Dec 2013
Fab construction projects boom in 2013 but slow in 2014.

Growing interest in the physics of nanostructures to drive demand for thin films

Fri, 12 Dec 2013
GIA invites senior industry executives, domain experts, technologists and market strategists to participate in a comprehensive global research initiative studying the “Thin Films” markets.

Graphene: Growing giants

Fri, 12 Dec 2013
While searching for an ideal growth platform for the material, investigators developed a promising new recipe for a graphene substrate: a thin film of copper with massive crystalline grains.

CEA-Leti signs agreement with Qualcomm to assess sequential 3D technology

Mon, 12 Dec 2013
CEA-Leti today announced an agreement with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to assess the feasibility and the value of Leti’s sequential 3D technology.

STMicroelectronics launches new advanced energy-harvesting IC

Tue, 12 Dec 2013
STMicroelectronics is opening new avenues for energy-harvesting applications with its latest IC integrating all the functions needed to power electronic circuits and recharge batteries using either a solar cell or Thermo-Electric Generator (TEG).

Singapore-MIT Alliance for Research Technology orders EV Group automated production bonding system

Tue, 12 Dec 2013
SMART, which is a leading research center established by the Massachusetts Institute of Technology (MIT) in partnership with the National Research Foundation of Singapore, will utilize the EVG850LT system to support its advanced substrate development efforts.

SEMICON West “Call for Papers” for New Semiconductor Technology Symposium, Science Park and TechXPOTs

Tue, 12 Dec 2013
SEMI today announced a “Call for Papers” for the new Semiconductor Technology Symposium, the popular TechXPOT programs, and a new Science Park program featuring university research and advanced R&D subjects at SEMICON West, North America’s premier microelectronics event, to be held July 8-10 at the Moscone Center in San Francisco, Calif.

Soitec announces confirmation of the strategic benefits of the Guépard program

Wed, 12 Dec 2013
Soitec announced this week that the European Commission has approved the financing for the Guépard program, coordinated by Soitec.

#1: Triangular MOSFETs with InGaAs Channels

Tue, 12 Dec 2012

#2: Thermally Stable Magnetic Tunnel Junction Memory

Tue, 12 Dec 2012

#3: TSMC’s Integrated 16nm FinFET Technology Platform

Tue, 12 Dec 2012

#4: Monolithic 3D Chip

Tue, 12 Dec 2012

#5: Nanofluidic Channels for Lab-on-Chip

Tue, 12 Dec 2012

#6: Novel Nanopore Sensor for DNA Sequencing

Tue, 12 Dec 2012

#7: Hybrid Nanowire/CMOS Biosensor

Tue, 12 Dec 2012

#8: 300mm wafer-scale Ge FinFET

Tue, 12 Dec 2012

#9: Record Silicon Nanowire MOSFETs

Tue, 12 Dec 2012

#10: Visualizing CBRAM Filaments

Tue, 12 Dec 2012

#11: Fastest Ge p-MOSFET

Tue, 12 Dec 2012

Slideshow: IEDM 2013 Highlights

Wed, 12 Dec 2013
This week, industry leaders and experts have gathered in Washington D.C. at the 59th annual IEEE International Electron Device Meeting (IEDM) conference.

Celebrating 20 years of BSIM3v3 SPICE models

Thu, 12 Dec 2013
Zhihong Liu of ProPlus Designs reflects on the history of the MOSFET SPICE model called BSIM3.

Synthesis of superconducting solid picene

Thu, 12 Dec 2013
Research by Professor Yoshihiro Kubozono at Okayama University has potential for innovative applications of solid picene and organic superconductors, graphene and other functional materials.

Soitec and IntelliEPI to collaborate on GaAs semiconductor materials

Thu, 12 Dec 2013
The agreement includes a technology license granted by Soitec to IntelliEPI, which may be extended to address future business opportunities in the GaAs market, including equipment transfer.

Graphene-based nano-antennas may enable networks of tiny machines

Thu, 12 Dec 2013
Networks of nanometer-scale machines offer exciting potential applications in medicine, industry, environmental protection and defense, but until now there's been one very small problem: the limited capability of nanoscale antennas fabricated from traditional metallic components.

Low-power tunneling transistor for high-performance devices at low voltage

Thu, 12 Dec 2013
A new type of transistor that could make possible fast and low-power computing devices for energy-constrained applications such as smart sensor networks, implantable medical electronics and ultra-mobile computing is feasible, according to Penn State researchers.

TSI Semiconductors appoints Deborah Harvey as Executive Vice President of Worldwide Foundry Sales

Fri, 12 Dec 2013
TSI Semiconductors, LLC, a specialty foundry services company offering flexible technology development and high-quality manufacturing solutions, today announced that Deborah Harvey has joined the company in the newly created position of executive vice president of Worldwide Foundry Sales.

Samsung announces Gregory Lee as President and CEO of Samsung Electronics North America headquarters

Mon, 12 Dec 2013
Samsung Electronics Co., Ltd. announced the appointment of Gregory Lee as President of the North America Headquarters in addition to his role as President of Samsung Telecommunications America (STA) effective immediately.

Avago Technologies to acquire LSI Corporation

Mon, 12 Dec 2013
Avago Technologies Limited and LSI Corporation today announced that they have entered into a definitive agreement under which Avago will acquire LSI for $11.15 per share in an all-cash transaction valued at $6.6 billion.

Mindspeed announces agreement to sell assets to Intel

Mon, 12 Dec 2013
Mindspeed Technologies, Inc., a supplier of semiconductor solutions for network infrastructure, today announced that it has signed a definitive agreement to sell the assets of its wireless infrastructure business unit to Intel Corporation.

Crystal film growth: nanosheets extend epitaxial growth applications

Tue, 12 Dec 2013
Molecularly thin two-dimensional crystals can alleviate the lattice matching restrictions of epitaxial crystalline thin film growth, as reported by researchers in Japan.

Micron collaborates with Broadcom to solve DRAM timing challenge

Tue, 12 Dec 2013
Micron Technology, Inc., a providers of advanced semiconductor solutions, today announced its collaboration with Broadcom Corporation to develop the industry's first solution designed for customers challenged by an intrinsic DDR3 timing parameter called tFAW, or four activate window.

IDT appoints Gregory Waters as President and CEO

Tue, 12 Dec 2013
Integrated Device Technology, Inc. today announced the appointment of Greg Waters, 53, as President, Chief Executive Officer and board member, effective January 6, 2014. Jeff McCreary, who served as interim CEO since August 2013, will remain a member of the IDT board of directors.

MACOM successfully completes tender offer for Mindspeed Technologies

Wed, 12 Dec 2013
M/A-COM Technology Solutions Holdings, Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced that it has successfully completed its previously announced tender offer to purchase all outstanding shares of common stock of Mindspeed Technologies, Inc. for $5.05 per share in cash.

Spansion dual-quad serial flash delivers performance for graphic-rich applications

Wed, 12 Dec 2013
Universal footprint enables common pinout with current and future high-speed memory.

Intel ends 2013 with a bang

Wed, 12 Dec 2013
ABI Research verified that Intel has a leading position in the mobile processor technology race; launching the first 22nm mobile application processor.

Soitec and CEA sign a five-year R&D partnership

Wed, 12 Dec 2013
This new contract aims to support Soitec's strategy for the electronics, solar energy and lighting markets.

STMicroelectronics joins ARM mbed Project

Thu, 12 Dec 2013
ARM, a semiconductor supplier, and STMicroelectronics today announced that ST has joined the ARM mbed Project.

Book-to-bill: Year-end activity substantially stronger compared to last year

Fri, 12 Dec 2013
North America-based manufacturers of semiconductor equipment posted $1.24 billion in orders worldwide in November 2013 (three-month average basis) and a book-to-bill ratio of 1.11.

TowerJazz and Panasonic sign agreement

Fri, 12 Dec 2013
TowerJazz, a global specialty foundry, and Panasonic Corporation today announced the signing of a definitive agreement to create a joint venture (JV) to manufacture Panasonic’s products, using Panasonic's three semiconductor manufacturing facilities in Japan

Mentor Graphics announces president and managing director for Japan

Fri, 12 Dec 2013
Mentor Graphics Corporation yesterday announced Greg Helton as president and managing director for Mentor Graphics Japan.

Micron revenue surges after Elpida deal officially closes

Mon, 12 Dec 2013
Micron Technology surged 130 percent in revenue during the third quarter as it finally closed its acquisition of bankrupt Elpida Memory of Japan, a vigorous ascent that also propelled the total market for dynamic random access memory (DRAM) to its best performance yet in 11 quarters.

Samsung releases 8Gb mobile DRAM

Fri, 1 Jan 2014
Samsung announced today that it has developed the industry’s first eight gigabit, low power double data rate 4, mobile DRAM.

Toppan Photomasks mourns the death of David Murray, president and CEO

Fri, 1 Jan 2014
Toppan Photomasks, Inc. (TPI) is saddened to announce the death of President and CEO David Murray after a long battle with cancer. Mr. Murray was 55 years old.

Architecture from STMicroelectronics leads industry transition to 64-bit computing

Mon, 1 Jan 2014
STMicroelectronics has released details of its STi8K architecture addressing future Systems-on-Chips (SoCs).

TOWA launches new Packaging Development Center

Thu, 1 Jan 2014
The TOWA Corporation of Japan, a supplier of packaging equipment for semiconductor, electronics and LED industries, has decided to expand their activities in Europe with an Innovation Center for Packaging Development and announced the launch of TOWA Europe B.V.

TSMC, Samsung and Micron top list of IC industry capacity leaders

Thu, 1 Jan 2014
The top 10 companies now hold 67% of worldwide IC industry capacity, up from 54% in 2009.

"Crisis? What Crisis?": New paradigm adjustments for capacity and equipment spending

Thu, 1 Jan 2014
Worldwide, the semiconductor industry growth rate back in 1973 was about 30 percent and slipped into 1975 with negative sales growth rates.

Slideshow: CES 2014 Highlights

Fri, 1 Jan 2014
This week in Las Vegas, the 2014 International Consumer Electronics Show focused on the Internet of Things, displaying many connected gadgets and services.

3) Invensas shows new xFD-based customer products with Etron Technology

Sun, 1 Jan 2010

Imec, AlixPartners to develop model for lowering costs of advanced semiconductor tech

Mon, 1 Jan 2014
Patterning options for N10/N7 nodes, advanced packaging solutions and 3D NAND memory to be targeted.

Imec celebrates 30 years

Tue, 1 Jan 2014
Nanotechnology research and development center imec, today announced the celebration of its 30th anniversary.

Economic recovery and pervasive computing to propel semiconductor manufacturing supply chain

Tue, 1 Jan 2014
Macroeconomic and microelectronic industry growth opportunities and innovation challenges underscored diverse perspectives from analysts, economists, technologists, semiconductor manufacturers and supply chain executives speaking at the SEMI Industry Strategy Symposium (ISS) that opened yesterday.

Microprocessor sales growth will strengthen slightly in 2014

Tue, 1 Jan 2014
A modest recovery in personal computers this year is expected to slightly strengthen overall sales growth in microprocessors, which is forecast to rise 9 percent in 2014 to a record-high $66.7 billion compared to $61.0 billion in 2013.

Xilinx and University of Florida honored with SEMI Award for advancements in interposers and CMOS fab process

Wed, 1 Jan 2014
SEMI today announced that two teams — from the University of Florida and Xilinx — are recipients of the 2013 SEMI Award for North America.

Semiconductor plastic packaging materials market to approach $21B by 2017

Wed, 1 Jan 2014
The market for semiconductor packaging materials, including thermal interface materials, is expected to maintain its $20 billion value through 2017, despite shifts away from the use of precious metals such as gold in wire bonding.

SRC launches industry consortium

Wed, 1 Jan 2014
Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, has launched a significant new initiative on Trustworthy and Secure Semiconductors and Systems (T3S).

ARM and UMC extend 28nm partnership

Thu, 1 Jan 2014
ARM and global semiconductor foundry UMC this week announced an agreement to offer the ARM Artisan physical IP platform along with POP IP for UMC’s 28nm high-performance low-power (HLP) process technology.

3DIC market to reach $7.52B by 2019

Thu, 1 Jan 2014
The market for 3DICs globally is forecast to reach USD 7.52 billion by 2019, according to a new market report published by transparency market research.

Intel vs. TSMC: An Update

Tue, 1 Jan 2014
On January 14, 2014, we read on the Investors.com headlines page - Intel Seen Gaining Huge Pricing Advantage Over TSMC. Just three days later comes the responding headline: TSMC: We're "Far Superior" to Intel and Samsung as a Partner Fab.

Besi and Imec collaborate on thermocompression technology

Tue, 1 Jan 2014
Today, at the SEMI European 3D TSV Summit, nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput.

Natural 3D counterpart to graphene discovered

Tue, 1 Jan 2014
The discovery of what is essentially a 3D version of graphene promises exciting new things to come for the high-tech industry, including much faster transistors and far more compact hard drives.

Researchers develop new technique for probing subsurface electronic structure

Tue, 1 Jan 2014
A new technique from an international team of researchers working at Berkeley Lab’s Advanced Light Source (ALS) promises to deliver the goods.

Optical Interconnects Conference 2014 to be held in Coronado, CA

Tue, 1 Jan 2014
The 2014 Optical Interconnects Conference, sponsored by the IEEE Photonics Society, announces a Call for Papers for the 25th anniversary of this premier conference, dedicated to bringing advanced interconnect technologies from research labs to commercial realization.

Semiconductors that detect cancer

Thu, 1 Jan 2014
As exciting as it is to watch the semiconductor industry push to sub-10nm dimensions, 450mm wafers, finFETs, 3D ICs and the like, what’s even cooler is the potential of semiconductor technology to make a real difference in medicine.

Progress on 450mm at G450C

Thu, 1 Jan 2014
At Semicon Europa, Paul Farrar, general manager of G450C, provided an update on the consortium’s progress in demonstrating 450mm process capability. He said 25 tools will be installed in the Albany cleanroom by the end of 2013, progress has been made on notchless wafers with a 1.5mm edge exclusion zone, they have seen significant progress in wafer quality, and automation and wafer carriers are working.

Design for yield trends

Thu, 1 Jan 2014
Should foundries establish and share best practices to manage sub-nanometer effects to improve yield and also manufacturability?

A bilayer temporary bonding solution for 3D-IC TSV fabrication

Thu, 1 Jan 2014
New technology eliminates the need for specialized equipment for wafer pre- or post-treatment.

Substrate impact on 2.5/3D IC costs

Thu, 1 Jan 2014
At the recent Georgia Tech Global Interposer Technology (GIT) Workshop in Atlanta, the pervasive theme appeared to be whether a change in substrate is required to lower overall costs and help drive HVM (high volume manufacturing) applications.

Advances in back-side via etching of SiC for GaN

Thu, 1 Jan 2014
The development of an 85µm diameter, 100µm deep SiC back-side via etch process for production is described.

FinFET evolution for the 7nm and 5nm CMOS technology nodes

Thu, 1 Jan 2014
In addition to extending the fin-based design investments, augmenting the FinFET for improved performance allows an evolution of the process infrastructure for a few more nodes.

Moving atomic layer etch from lab to fab

Thu, 1 Jan 2014
A new plasma-enhanced atomic layer etch method delivers atomic-level etch precision with process times that are practical for use in a manufacturing environment.

Applying leading-edge non-visual defect inspection to a mainstream 200mm fab

Thu, 1 Jan 2014
Improving economic competitiveness through cost reduction, cycle time improvement and more eco-friendly processing.

Synthetic diamond’s role in thermal management

Thu, 1 Jan 2014
Synthetic diamond is ideally suited for thermal management of semiconductor packaging, as it combines exceptionally high thermal conductivity with electrical isolation.

2014 Outlook: An era of unprecedented change

Fri, 1 Jan 2014
We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.

Cyclical upturn continues in 2014: Positive yet cautious expectations persist

Thu, 1 Jan 2013
In 2013, the IC industry emerged from a difficult 5-year period of minimal growth and started on its next cyclical upturn, a welcome piece of news.

Outlook for semiconductors and the value chain in 2014

Thu, 1 Jan 2013
We approach 2014 with a combination of positive policy, financial, and economic forces that will push world growth up to a +3% range.

Coming year promises increased capital spending and continued need for effective industry collaboration

Thu, 1 Jan 2013
For most of the past 15 years, the industry has displayed a fairly predictable pattern of fab equipment spending, characterized generally by two years of decline followed by two years of positive growth.

The shift to materials-enabled 3D

Thu, 1 Jan 2013
Innovations in mobile computing and communications will continue to be a driving factor for the semiconductor equipment industry.

Innovation and collaboration key in 2014

Thu, 1 Jan 2013
As far as the outlook goes for 2014-2015, investments coming from the semiconductor and microelectronics industries are going to be pretty robust.

Can we keep on benefiting from Moore’s Law?

Thu, 1 Jan 2013
For almost five decades, performance improvements and cost reduction of ICs have been cornerstones of the growth of the semiconductor industry.

Key market and technology trends in the sub-20nm era

Thu, 1 Jan 2013
Keeping up with Moore’s Law has always required significant investment and ingenuity, and this era brings additional challenges in device structures, materials and methodologies.

Keys to success: Testing in the New Mobile World

Thu, 1 Jan 2013
The semiconductor industry is moving from a PC-centric, digital era to a communication and mobile world.

Book-to-bill ratio continues to improve

Fri, 1 Jan 2014
The December three-month average bookings were at the highest level since June 2012 — a positive sign for the 2014 spending outlook.

Europe leaders to examine EC’s ambitious goal

Mon, 1 Jan 2014
At the SEMI Industry Strategy Symposium Europe (ISS Europe 2014) on February 23-25 in Salzburg, semiconductor industry executives will examine the conditions required to achieve the EU’s 10/100/20 strategy.

SMIC unveils 28nm readiness

Mon, 1 Jan 2014
Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, announced today that its 28nm technology has been process frozen and the company has successfully entered Multi Project Wafer stage to support customer's requirements on both 28nm PolySiON (PS) and 28nm high-k dielectrics metal gate processes.

Apple and Samsung are top OEMs, again, in semiconductor spending for 2013

Mon, 1 Jan 2014
Apple and Samsung remained the world’s largest buyers of semiconductor chips in 2013, but the intensifying battle between the two for the hearts and minds of consumers in their product offerings could presage another mighty showdown this year for the top ranking, according to a new report from IHS Technology.

Mobile PCs, smartphones will be top revenue opportunities for IC suppliers in high-speed wireless device market

Mon, 1 Jan 2014
Mobile PCs and smartphones will represent the top revenue opportunities for high-speed wireless integrated circuit (IC) suppliers by 2018, as these devices are projected to be the highest-volume applications in this market over the next five years.

Slimpin promoted to director in SwRI’s Applied Physics Division

Tue, 1 Jan 2014
David G. Slimpin has been promoted to director of the Electronics Systems and Robotics Department in the Applied Physics Division at Southwest Research Institute (SwRI). He was previously a program manager in the department.

Cooling microprocessors with carbon nanotubes

Tue, 1 Jan 2014
Researchers with the U.S. Department of Energy (DOE)’s Lawrence Berkeley National Laboratory (Berkeley Lab) have developed a “process friendly” technique that would enable the cooling of microprocessor chips through carbon nanotubes.

Crocus licences MLU technology to ARM

Wed, 1 Jan 2014
Crocus Technology today announces it has licensed its Magnetic Logic Unit technology to ARM.

North Carolina State University to lead research consortium on power electronics

Thu, 1 Jan 2014
Called the Next Generation Power Electronics Institute, the new consortium will provide shared facilities, equipment and testing to companies from the power electronics industry, focusing and small and medium-sized companies.

University of Strathclyde demonstrates world’s first continuously operating diamond Raman laser

Fri, 1 Jan 2014
Achievements prove diamond’s viability as a material for solid-state laser engineering, even in the most demanding intracavity applications.

2014 capital spending up in Korea; SEMICON Korea to address mobile innovation

Fri, 1 Jan 2014
With Korea expected to be the second largest region for fab construction spending in 2014, industry leaders will convene at SEMICON Korea 2014 in Seoul on February 12-14 to discuss the latest trends and technologies shaping the future of microelectronics manufacturing.

Long live FinFET

Mon, 2 Feb 2014
Zhihong Liu, Executive Chairman, ProPlus Design Solutions, Inc., San Jose, Calif. blogs on how the industry's move to FinFETs is impacting design.

Element Six's synthetic diamond proven as viable material for sophisticated optical components

Mon, 2 Feb 2014
Element Six, a developer of synthetic diamond supermaterials and member of the De Beers Group of Companies, today presented new data and announced that its high purity single crystal chemical vapor deposition (CVD) diamond material has been proven for use in intracavity cooling of disc lasers and in development of the first ever tunable diamond Raman laser system.

Entegris to acquire ATMI

Tue, 2 Feb 2014
Entegris, Inc. and ATMI today announced Entegris will acquire ATMI for approximately $1.15 billion, or approximately $850 million net of cash acquired, including the net cash proceeds from the sale of ATMI’s LifeSciences business of $170 million.

Diamond defects boosts quantum technology

Tue, 2 Feb 2014
New research shows that a remarkable defect in synthetic diamond produced by chemical vapor deposition allows researchers to measure, witness, and potentially manipulate electrons in a manner that could lead to new "quantum technology" for information processing.

New theory may lead to more efficient solar cells

Tue, 2 Feb 2014
A new theoretical model developed by professors at the University of Houston (UH) and Université de Montréal may hold the key to methods for developing better materials for solar cells.

Ballistic transport in graphene suggests new type of electronic device

Thu, 2 Feb 2014
Using electrons more like photons could provide the foundation for a new type of electronic device that would capitalize on the ability of graphene to carry electrons with almost no resistance even at room temperature – a property known as ballistic transport.

Intel elects five new corporate vice presidents

Thu, 2 Feb 2014
Intel Corporation today announced that its board of directors elected five new corporate vice presidents.

Silicon reclaim wafer market increased 14% in 2013

Thu, 2 Feb 2014
The worldwide reclaim wafer market is estimated at $460 million in 2013 and is forecasted to reach $493 million by 2015, according to SEMI.

Executives debate innovation drivers and cost reduction in microelectronics supply chain

Thu, 2 Feb 2014
The closing Executive Panel discussion at the SEMI Industry Strategy Symposium on January 15 provoked diverse views on the drivers and future of innovation in the microelectronics manufacturing supply chain.

The impact on OPC and SRAF caused by EUV shadowing effect

Fri, 2 Feb 2014
EUV’s off-axis mask illumination introduces a special problem in EUV OPC – the shadowing effect.

A square peg in a round hole: The economics of panel-based lithography for advanced packaging

Fri, 2 Feb 2014
Moving from round wafers to rectangular panels saves corner space, delivering a roughly 10% improvement in surface utilization.

IBM continues to evolve: Semiconductor business up for sale; moving into the cloud

Fri, 2 Feb 2014
The Financial Times (FT) is reporting that IBM Corp is exploring the sale of its semiconductor business and has hired Goldman Sachs to find potential buyers.

EV Group unveils high-volume manufacturing photoresist processing system

Tue, 2 Feb 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing.

Silicon wafer revenues decline in 2013

Tue, 2 Feb 2014
Worldwide silicon wafer revenues declined by 13 percent in 2013 compared to 2012 according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

Chips that listen to bacteria

Tue, 2 Feb 2014
A research team led by Ken Shepard, professor of electrical engineering and biomedical engineering at Columbia Engineering, and Lars Dietrich, assistant professor of biological sciences at Columbia University, has demonstrated that integrated circuit technology, the basis of modern computers and communications devices, can be used for a most unusual application—the study of signaling in bacterial colonies.

Rudolph announces shipments for 3D metrology of TSVs

Tue, 2 Feb 2014
Rudolph Technologies, Inc. announced today the sale of its first NSX 320 TSV Metrology System to CEA-Leti, a research organization based in Grenoble, France.

Intermolecular and Guardian Industries expand collaboration

Tue, 2 Feb 2014
Intermolecular, Inc. and Guardian Industries announced today the expansion and extension of their collaborative development program and strategic IP licensing agreement.

Fujitsu Labs and imec develop wireless transceiver technology for medical devices

Wed, 2 Feb 2014
Fujitsu Laboratories Ltd. and imec Holst Centre today announced that they have developed a wireless transceiver circuit for use in body area networks (BAN) for medical applications that adheres to the 400 MHz-band international standard.

ROHM Semiconductor's operational amplifiers for sensor signal amplification

Thu, 2 Feb 2014
ROHM Semiconductor today introduced the development of the BD5291G and the BD5291FVE low voltage, low offset operational amplifiers (opamp) designed to amplify signals from motion sensors such as accelerometers and gyroscopes.

SPTS Technologies opens new office in Korea

Thu, 2 Feb 2014
SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets today announced the opening of a new office in Korea.

How to make the wonder material graphene superconducting

Thu, 2 Feb 2014
Whenever a new material is discovered, scientists are eager to find out whether or not it can be superconducting. This applies particularly to the wonder material graphene.

Advanced Energy highlights enabling pulsing tech for 2X/1Xnm at SEMICON Korea 2014

Thu, 2 Feb 2014
Advanced Energy Industries, Inc. today will highlight its advanced pulsing technology at SEMICON Korea 2014.

Honeywell introduces new copper manganese sputtering targets

Fri, 2 Feb 2014
Honeywell announced today that it has introduced new copper manganese (CuMn) sputtering targets for semiconductor manufacturing based on patented technology offering customers higher strength, longer life, and better performance.

Dow Electronic Materials launches CMP polishing pads

Fri, 2 Feb 2014
Dow Electronic Materials, a business unit of The Dow Chemical Company, today introduced the IKONIC 4000 series of chemical mechanical planarization (CMP) polishing pads.

Renesas Electronics develops industry's first 28nm embedded flash memory tech for microcontrollers

Tue, 2 Feb 2014
Renesas Electronics Corporation today announced that it has developed the industry's first 28nm flash memory intellectual property (IP) for microcontrollers (MCUs) using a 28nm process technology.

MACOM acquires Nitronex

Tue, 2 Feb 2014
M/A-COM Technology Solutions Inc., a supplier of high performance analog, RF, microwave and millimeter wave products, last week announced that it has acquired Nitronex, LLC.

GaN Systems appoints Tony Astley as Director of European Operations

Tue, 2 Feb 2014
GaN Systems Inc, a developer of gallium nitride power switching semiconductors, has announced the appointment of Tony Astley as Director of European Operations.

SiC & GaN power semiconductors leads power discrete market by 2018

Tue, 2 Feb 2014
Analysts at ReportsNReports forecast the Global Power Discrete market to grow at a CAGR of 8.43% over the period 2013-2018.

Breakthrough development in 1D-1R memory cell array

Tue, 2 Feb 2014
Dr. Tae-Wook Kim at KIST announced their successful development of a 64-bit memory array using flexible and twistable carbon nano material and organo-polymer compound, which can accurately store and delete data.

World's first 79 GHz radar transmitter in 28nm CMOS

Tue, 2 Feb 2014
Imec, in collaboration with Vrije Universiteit Brussel, Brussels, Belgium, presents the world’s first 79 GHz radar transmitter implemented in plain digital 28nm CMOS.

Silicon-germanium chip sets new speed record

Tue, 2 Feb 2014
A research collaboration consisting of IHP-Innovations for High Performance Microelectronics in Germany and the Georgia Institute of Technology has demonstrated the world's fastest silicon-based device to date.

Avantor Performance Materials names Jean-Paul Mangeolle to Board of Directors

Wed, 2 Feb 2014
Avantor Performance Materials, a global manufacturer and supplier of high-performance chemistries, announces the appointment of Jean-Paul Mangeolle to its Board of Directors.

The most expensive SRAM in the world - 2.0

Thu, 2 Feb 2014
Embedded SRAM scaling is broken and, with it, Moore's Law.

Samsung, Intel Capital and Applied Materials fund Inpria to develop advanced semiconductor materials

Thu, 2 Feb 2014
Inpria Corporation announced today that it has received $4.7M of a committed $7.3M financing. The round was led by Samsung Venture Investment Corporation, the global investment arm of the Samsung Group, along with significant participation from Intel Capital, Intel’s global investment and M&A organization.

Plasma-Therm signs cross-licensing agreement with ON Semiconductor

Thu, 2 Feb 2014
Plasma-Therm announced today that it has entered into a new cross licensing agreement with ON Semiconductor to enable wafer singulation processes.

Using holograms to improve electronic devices

Thu, 2 Feb 2014
A team of researchers from the University of California, Riverside Bourns College of Engineering and Russian Academy of Science have demonstrated a new type of holographic memory device that could provide unprecedented data storage capacity and data processing capabilities in electronic devices.

2014 SPIE Startup Challenge winners announced

Thu, 2 Feb 2014
A microscope in a needle, a handheld device that prescribes corrective eyeglasses, and a device for heart attack diagnosis are winning projects in the 2014 SPIE Startup Challenge.

Semiconductor industry posts record sales in 2013

Thu, 2 Feb 2014
The Semiconductor Industry Association announced that worldwide semiconductor sales for 2013 reached $305.6 billion, the industry’s highest-ever annual total and an increase of 4.8 percent from the 2012 total of $291.6 billion.

Single chip device to provide real-time 3-D images from inside the heart and blood vessels

Thu, 2 Feb 2014
Researchers have developed the technology for a catheter-based device that would provide forward-looking, real-time, three-dimensional imaging from inside the heart, coronary arteries and peripheral blood vessels.

Frost & Sullivan recognize RFaxis with Award for Technology Innovation Leadership

Fri, 2 Feb 2014
Based on its recent analysis of the market for radio frequency front-end module (RF FEM) solution for wireless communication, Frost & Sullivan recognizes RFaxis, Inc. with the 2014 North American Frost & Sullivan Award for Technology Innovation Leadership.

North American semiconductor equipment industry posts January 2014 book-to-bill ratio of 1.04

Fri, 2 Feb 2014
A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

Europe launches PLACYD, a large consortium to address DSA lithography

Mon, 2 Feb 2014
PLACYD, an EU funded consortium of industrial and academic collaborators and led by Arkema will establish a dedicated material manufacturing facility that allows the production of block copolymers meeting the rigorous standards required for their use in industry as nanolithographic templates.

International Rectifier opens ultra-thin wafer processing facility in Singapore

Mon, 2 Feb 2014
International Rectifier, IR, today announced that the company has commenced initial production at its new ultra-thin wafer processing facility in Singapore (IRSG).

Call for Papers open for SEMICON Europa 2014, Plastics Electronics Conference

Mon, 2 Feb 2014
SEMI announced the “Call for Papers” for technical sessions and presentations for SEMICON Europa 2014 which takes place October 7-9 in Grenoble, France.

Movidius joins the Global Semiconductor Alliance

Mon, 2 Feb 2014
Movidius today announced that it has joined the Global Semiconductor Alliance (GSA).

SRC and MIT extend high resolution lithography capabilities

Wed, 2 Feb 2014
MIT researchers sponsored by Semiconductor Research Corporation have introduced new directed self-assembly (DSA) techniques that promise to help semiconductor manufacturers develop more advanced and less expensive components.

JILA physicists discover "quantum droplet" in semiconductor

Wed, 2 Feb 2014
JILA physicists used an ultrafast laser and help from German theorists to discover a new semiconductor quasiparticle—a handful of smaller particles that briefly condense into a liquid-like droplet.

eBeam Initiative announces key educational themes for 2014

Wed, 2 Feb 2014
The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced the top educational themes that it will highlight in 2014.

GlobalFoundries and Fraunhofer IIS to collaborate on EUROPRACTICE, Europe's MPW wafer shuttle program

Wed, 2 Feb 2014
GLOBALFOUNDRIES and Fraunhofer Institute for Integrated Circuits IIS today announced the extension of their long-term collaboration, focusing on 40nm and 28nm processes. GLOBALFOUNDRIES will also join the European Multi Product Wafer (MPW) Program EUROPRACTICE.

Intermolecular announces agreement with SanDisk and Toshiba

Fri, 2 Feb 2014
Intermolecular, Inc. today announced that the development activity related to the Collaborative Development Program agreement with SanDisk and Toshiba has reached its successful conclusion.

New SEMICON Europa in Grenoble to emphasize innovation and applications

Mon, 3 Mar 2014
SEMICON Europa, the region’s largest event for the microelectronics manufacturing and innovation supply chain, will be held 7-9 October 2014 in Grenoble.

Global semiconductor industry posts highest-ever January sales

Mon, 3 Mar 2014
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $26.28 billion for the month of January 2014, an increase of 8.8 percent from January 2013 when sales were $24.15 billion, marking the industry's highest-ever January sales total and the largest year-to-year increase in nearly three years.

Busch Vacuum Pumps and Systems joins F450C Consortium

Tue, 3 Mar 2014
The Facilities 450mm Consortium (F450C), a partnership of nanoelectronics facility companies guiding the effort to design and build the next-generation 450mm computer chip fabrication facilities, today announced Busch Vacuum Pumps and Systems as the eleventh member company to join the consortium.

Failure analysis and the innovative pinpoint conductive AFM

Tue, 3 Mar 2014
One of the most challenging issues in the semiconductor industry is the failure analysis (FA) investigation of devices with enduringly shrinking geometries down to single digit nanometer trench widths.

Silicon Labs acquires low-power analog IC products

Tue, 3 Mar 2014
Silicon Labs today announced the purchase of the full product portfolio and intellectual property of California-based Touchstone Semiconductor Inc.

How 19th century physics could change the future of nanotechnology

Tue, 3 Mar 2014
A new twist on a very old physics technique could have a profound impact on one of the most buzzed-about aspects of nanoscience.

Researchers at UC study zero-dimensional quantum dots

Tue, 3 Mar 2014
Zero-dimensional quantum dots identified by University of Cincinnati researchers could someday have a big effect on a variety of technologies, such as solar energy, lasers and medical diagnostics.

Moore's Law has stopped at 28nm

Wed, 3 Mar 2014
While many have recently predicted the imminent demise of Moore’s Law, we need to recognize that this actually has happened at 28nm.

Global failure analysis equipment market to grow at CAGR of 8.8% from 2013 to 2019

Wed, 3 Mar 2014
Rapid growth in nanotechnology coupled with growth in medical applications in the Asia Pacific region has fueled the growth of failure analysis equipment market.

University of Minnesota professor recognized for excellence in semiconductor research

Thu, 3 Mar 2014
The Semiconductor Industry Association this week presented its University Research Award – in consultation with Semiconductor Research Corporation (SRC) – to University of Minnesota professor Sachin Sapatnekar in recognition of his outstanding contributions to semiconductor research.

Samsung expands its 28nm technology offerings

Thu, 3 Mar 2014
Samsung Electronics, Co., Ltd. today announced that it has expanded its 28nm technology offerings with the addition of RF capabilities.

Fab equipment spending to increase 20-30% in 2014

Thu, 3 Mar 2014
The release today of the SEMI World Fab Forecast update reveals a 20 to 30 percent projected increase in semiconductor fab equipment spending in 2014.

Micron appoints Darren Thomas as VP of Storage Business Unit

Thu, 3 Mar 2014
Micron Technology, Inc. this week announced that Darren Thomas has been named as vice president of Micron's Storage business unit.

Weaker yen impact on the 2013 material and equipment market size

Thu, 3 Mar 2014
Semiconductor industry revenues reported by the World Semiconductor Trade Statistics (WSTS) reached a record high in 2013 with global revenues totaling over $305 million.

Semtech Corporation announces the appointment of new Executive VP

Fri, 3 Mar 2014
Semtech Corporation, a supplier of analog and mixed-signal semiconductors, today announced the appointment of Charles B. Ammann as Executive Vice President, General Counsel and Corporate Secretary.

MACOM introduces new addition to GaN in Plastic series

Fri, 3 Mar 2014
M/A-COM Technology Solutions Inc. (MACOM), a supplier of high performance RF, microwave, and millimeter wave products, introduced today its newest addition to the GaN in Plastic series.

Promising news for solar fuels from Berkeley Lab researchers at JCAP

Fri, 3 Mar 2014
A JCAP study shows that nearly 90-percent of the electrons generated by a semiconductor/cobaloxime hybrid catalyst designed to store solar energy in hydrogen are being stored in their intended target molecules.

DSA, EUV, nanopatterning are top themes at SPIE Advanced Lithography

Mon, 3 Mar 2014
Progress through collaborative efforts in directed self-assembly (DSA), the state of the art in nanoimprint technology, 3D approaches to scaling, and the latest on extreme ultraviolet (EUV) lithography research were hot topics at the recent SPIE Advanced Lithography symposium in San Jose.

Cadence PVS certified for GlobalFoundries' 65nm to 14nm processes

Tue, 3 Mar 2014
Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES certified the Cadence Physical Verification System (PVS) for custom/analog, digital and mixed-signal design physical signoff for 65nm to 14nm FinFET process technologies.

Leti demonstrates ultra-scaled self-aligned split-gate memory cell with 16nm gate length

Tue, 3 Mar 2014
CEA-Leti announced today it has fabricated ultra-scaled split-gate memories with gate length of 16nm, and demonstrated their functionality, showing good writing and erasing performances with memory windows over 6V.

Bending light with a tiny chip

Tue, 3 Mar 2014
The Caltech chip eliminates the need for bulky and expensive lenses and bulbs and instead uses a so-called integrated optical phased array (OPA) to project the image electronically with only a single laser diode as light source and no mechanically moving parts.

STATS ChipPAC introduces breakthrough manufacturing method for wafer level packaging

Wed, 3 Mar 2014
STATS ChipPAC, a provider of advanced semiconductor packaging and test services, has designed and implemented an innovative new manufacturing method that is a significant paradigm shift from conventional wafer level manufacturing.

SEMI reports 2013 global semiconductor equipment sales of $31.6 billion

Wed, 3 Mar 2014
SEMI, the global industry association for companies that supply manufacturing technology and materials to the world’s chip makers, today reported that worldwide sales of semiconductor manufacturing equipment totaled $31.58 billion in 2013.

EV Group boosts 2.5D and 3D IC/TSV performance with new NanoSpray application

Wed, 3 Mar 2014
EV Group today announced that its patented NanoSpray conformal coating technology is now available on its newly introduced EVG150XT resist coating and developing system for high-volume manufacturing (HVM) semiconductor applications.

Advancing the Russian microelectronics industry — SEMICON Russia 2014

Wed, 3 Mar 2014
On May 13-15, the key industry players, science institutes and innovation business representatives will gather in Moscow at SEMICON Russia — the premier Russian semiconductor exhibition and conference.

Fab productivity and process technologies addressed at upcoming semiconductor manufacturing conference

Wed, 3 Mar 2014
The 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) will be held May 19-21 in Saratoga Springs, New York.

Imec achieves record 8.4 percent conversion efficiency in fullerene-free organic solar cell

Wed, 3 Mar 2014
In this week’s Nature Communications, imec presents the development of fullerene-free organic photovoltaic (OPV) multilayer stacks achieving a record conversion efficiency of 8.4 percent.

SanDisk files lawsuit against SK Hynix for theft of trade secrets

Thu, 3 Mar 2014
These actions relate to the theft of trade secrets related to NAND flash technology by a former engineer of SanDisk who left the company in 2008 to work for SK Hynix.

Silicon Innovation Forum to expand in 2014

Thu, 3 Mar 2014
Coordinated by SEMI, the Silicon Innovation Forum is organized by leading strategic investment groups in the global semiconductor industry including: Applied Ventures, Dow Ventures, Intel Capital, Micron Ventures, TEL Venture Capital, BASF Ventures, and Samsung Ventures.

Toshiba brings civil suit against SK Hynix

Fri, 3 Mar 2014
Toshiba Corporation announced that it has brought a civil suit against Korea’s SK Hynix Inc. at the Tokyo District Court, under Japan’s Unfair Competition Prevention Act.

Surface characteristics influence cellular growth on semiconductor material

Fri, 3 Mar 2014
Changing the texture and surface characteristics of a semiconductor material at the nanoscale can influence the way that neural cells grow on the material.

Creating a graphene-metal sandwich to improve electronics

Fri, 3 Mar 2014
Researchers have discovered that creating a graphene-copper-graphene “sandwich” strongly enhances the heat conducting properties of copper, a discovery that could further help in the downscaling of electronics.

Mega Fluid Systems and Entrepix join forces to offer complete CMP system

Mon, 3 Mar 2014
Mega Fluid Systems Inc., a supplier of chemical and slurry delivery equipment, and Entrepix Inc., a provider of chemical mechanical polishing (CMP) equipment and process services, today announced a partnership agreement.

GaN Systems appoints Jim Witham as CEO

Mon, 3 Mar 2014
GaN Systems, a developer of gallium nitride power switching semiconductors, today announced the appointment of Jim Witham as CEO of the corporation.

EV Group establishes China headquarters in Shanghai

Tue, 3 Mar 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has opened a new, wholly owned subsidiary in Shanghai, called EV Group China Ltd.

MKS to acquire Granville-Phillips division of Brooks Automation

Tue, 3 Mar 2014
MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, today announced it has agreed to purchase the assets of Granville-Phillips, a division of Brooks Automation, Inc., for $87 million in cash.

First methodology to analyze nanometer line pattern images

Tue, 3 Mar 2014
To meet the increasing demand for smaller, faster, and more powerful devices, a continued decrease in the dimensions of active parts of devices is required. The new methodology is a unique tool developed to address the gap existent in the metrology of sub-10nm line patterns.

SRC, UC Berkeley research promises to revolutionize electronic circuit design

Wed, 3 Mar 2014
Research from University of California, Berkeley scientists sponsored by Semiconductor Research Corporation (SRC) promises to revolutionize portable radio frequency (RF) electronics and communication systems via advancements in on-chip inductors by leveraging embedded nanomagnets.

SMIC CEO is awarded SEMI Outstanding EHS Achievement Award

Wed, 3 Mar 2014
Dr. Tzu-Yin Chiu, Chief Executive Officer & Executive Director of SMIC presented the SEMICON China 2014 opening keynote yesterday and was given a SEMI Outstanding EHS Achievement Award.

MediaTek to deploy Synopsys IC Compiler for hierarchical design implementation

Wed, 3 Mar 2014
Synopsys, Inc. today announced that MediaTek Inc., a fabless semiconductor company for wireless communications and digital multimedia solutions, has initiated deployment of Synopsys' IC Compiler place and route solution for hierarchical design implementation.

Applied Materials honored as a 2014 World's Most Ethical Company

Thu, 3 Mar 2014
Applied Materials, Inc. today announced that it was named a 2014 World's Most Ethical Company by the Ethisphere Institute, an independent center of research promoting best practices in corporate ethics and governance.

Equipment bookings and billings continue along a steady trend

Thu, 3 Mar 2014
North America-based manufacturers of semiconductor equipment posted $1.29 billion in orders worldwide in February 2014 (three-month average basis) and a book-to-bill ratio of 1.00.

Enabling mobility for IoT with advanced semiconductor technology - at SEMICON Singapore 2014

Thu, 3 Mar 2014
SEMICON Singapore will focus on the advanced technology developments to enable mobility for the Internet of Things (IoT).

ChaoLogix introduces ChaoSecure technology to boost semiconductor chip security

Thu, 3 Mar 2014
ChaoLogix, Inc., a semiconductor technology provider focused on developing embedded security and low-power design intellectual property, today introduced ChaoSecure technology that deters side channel attacks on semiconductor chips and contributes a superior layer of security compared to existing solutions.

Mentor Graphics acquires Berkeley Design Automation

Fri, 3 Mar 2014
Mentor Graphics Corp. today announced that it has acquired Berkeley Design Automation, Inc. BDA addresses nanometer circuit design challenges via its Analog FastSPICE unified verification platform and exceptional vertical-application expertise.

Discovery of new semiconductor holds promise for 2D physics and electronics

Fri, 3 Mar 2014
From super-lubricants, to solar cells, to the fledgling technology of valleytronics, there is much to be excited about with the discovery of a unique new two-dimensional semiconductor, rhenium disulfide, by researchers at Berkeley Lab’s Molecular Foundry.

Altera and Intel extend manufacturing partnership to include development of multi-die devices

Wed, 3 Mar 2014
Collaboration will optimize integration of 14nm Tri-Gate Stratix 10 FPGAs with heterogeneous technologies into a single system-in-a-package.

eInfochips opens new design services specializing in 16nm geometry

Wed, 3 Mar 2014
eInfochips, a semiconductor and product engineering company, today launched design services for chips based on 16nm geometry.

Particle Measuring Systems joins SEMATECH

Wed, 3 Mar 2014
This collaboration will address many of the profound changes taking place in the semiconductor industry that are impacting fundamental aspects of process and equipment design, including integration of new materials and process technology for sub-20nm node manufacturing, next-generation lithography requirements.

Nanolab Technologies expands services with new analytical and surface measurement tools

Wed, 3 Mar 2014
Nanolab Technologies, a Silicon Valley-based analytical services lab, has purchased and installed new tools and moved to a seven-day workweek.

Silicon Valley specialty foundry Noel Technologies names Joe Medeiros Director of Reclaim

Thu, 3 Mar 2014
Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, has added semiconductor industry veteran Joe Medeiros to its growing management staff.

Heat-conducting polymer cools hot electronic devices at 200 degrees C

Mon, 3 Mar 2014
Polymer materials are usually thermal insulators. But by harnessing an electropolymerization process to produce aligned arrays of polymer nanofibers, researchers have developed a thermal interface material able to conduct heat 20 times better than the original polymer. The modified material can reliably operate at temperatures of up to 200 degrees Celsius.

SEMATECH announces leadership changes

Mon, 3 Mar 2014
SEMATECH, the global consortium of semiconductor manufacturers, announced today that Ronald Goldblatt, vice president of Technical Strategy and Operations, has been appointed by the board of directors as acting president and chief executive officer, effective immediately.

University of Washington selects Altatech’s CVD system to develop new process materials

Mon, 3 Mar 2014
Altatech, a subsidiary of Soitec, has received an order from the University of Washington in Seattle for an AltaCVD chemical vapor deposition (CVD) system whose unique combination of capabilities allows users to develop new process materials with high added value.

Researchers improve performance of III-V nanowire solar cells on graphene

Tue, 4 Apr 2014
Researchers at the University of Illinois at Urbana-Champaign have achieved new levels of performance for seed-free and substrate-free arrays of nanowires from class of materials called III-V (three-five) directly on graphene

Fabricating nanostructures with silk could make clean rooms green rooms

Tue, 4 Apr 2014
Tufts University engineers have demonstrated that it is possible to generate nanostructures from silk in an environmentally friendly process that uses water as a developing agent and standard fabrication techniques.

MACOM announces IP licensing program for GaN-on-Si technology

Tue, 4 Apr 2014
M/A-COM Technology Solutions Inc. this week announced an IP licensing program for Gallium Nitride (GaN) on Silicon technology.

Quantum Polymers announces 8 inch diameter carbon and glass filled PEEK rod products

Tue, 4 Apr 2014
These products work well for applications requiring a balance of chemical resistance and mechanical strength in high temperature environments like those frequently found in the oil and gas, chemical processing, and semiconductor industries.

ON Semiconductor to acquire Trusense Imaging, Inc.

Thu, 4 Apr 2014
ON Semiconductor today signed a definitive agreement to acquire Truesense Imaging, Inc., a provider of high-performance image sensor devices addressing a wide range of industrial end-markets including machine vision, surveillance, traffic monitoring, medical and scientific imaging, and photography.

Park Systems introduces automatic defect review for semiconductor wafers

Thu, 4 Apr 2014
Park Systems this week introduced the Automatic Defect Review (ADR)AFM for 300mm bare wafers, a fully automated AFM solution that improves throughput of AFM defect review by up to 1,000 percent.

The sustainable manufacturing imperative

Thu, 4 Apr 2014
While sometimes seen as a social, legal and regulatory obligation, sustainability is increasingly considered a differentiating factor in global competitiveness relative to the technologies and products being provided.

2013: A year in review

Fri, 4 Apr 2014
2013 was a record year in terms of semiconductor device revenues; the industry finally exceeded the long elusive $300 billion mark, registering almost 5 percent growth according to the SIA.

SEMI reports 2013 global semiconductor materials sales of $43.5B USD

Mon, 4 Apr 2014
The global semiconductor materials market decreased 3 percent in 2013 compared to 2012 while worldwide semiconductor revenues increased 5 percent.

Global Semiconductor Alliance celebrates 20 years of industry collaboration

Tue, 4 Apr 2014
The Global Semiconductor Alliance (GSA) is celebrating 20 years of industry collaboration this year.

February semiconductor sales up 11.4 percent compared to last year

Wed, 4 Apr 2014
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $25.87 billion for the month of February 2014, an increase of 11.4 percent from February 2013 when sales were $23.23 billion.

SEMI releases fourth quarter 2013 worldwide photovoltaic equipent market statistics report

Wed, 4 Apr 2014
Billings and bookings show improvement in the fourth quarter.

SEMI announces Innovation Village at SEMICON Europa 2014

Wed, 4 Apr 2014
After the successful premier of a program to connect early-stage companies with strategic investors and venture capitalists (VCs) in the U.S., SEMI is expanding the program to Europe as part of SEMICON Europa 2014 in Grenoble, France (October 7-9).

Sunlight generates hydrogen in new porous silicon

Thu, 4 Apr 2014
Porous silicon manufactured in a bottom up procedure using solar energy can be used to generate hydrogen from water, according to a team of Penn State mechanical engineers, who also see applications for batteries, biosensors and optical electronics as outlets for this new material.

Scalable CVD process for making 2-D molybdenum diselenide

Thu, 4 Apr 2014
Nanoengineering researchers at Rice University and Nanyang Technological University in Singapore have unveiled a potentially scalable method for making one-atom-thick layers of molybdenum diselenide — a highly sought semiconductor that is similar to graphene but has better properties for making certain electronic devices like switchable transistors and light-emitting diodes.

Domain walls in nanowires cleverly set in motion

Thu, 4 Apr 2014
Important prerequisite for the development of nano-components for data storage and sensor technology.

Catching the (invisible) wave

Fri, 4 Apr 2014
UC Santa Barbara researchers create a unique semiconductor that manipulates light in the invisible infrared/terahertz range, paving the way for new and enhanced applications.

KLA-Tencor Corporation receives Intel’s Preferred Quality Supplier Award

Fri, 4 Apr 2014
KLA-Tencor Corporation has been recognized as one of 18 companies receiving Intel Corporation’s Preferred Quality Supplier (PQS) award for their performance in 2013.

SEMI reports 2013 semiconductor photomask sales of $3.1B

Mon, 4 Apr 2014
SEMI reports that the worldwide semiconductor photomask market was $3.1 billion in 2013 and is forecasted to reach $3.3 billion in 2015.

Shiny quantum dots brighten the future of solar cells

Mon, 4 Apr 2014
A house window that doubles as a solar panel could be on the horizon, thanks to recent quantum-dot work by Los Alamos National Laboratory researchers in collaboration with scientists from University of Milano-Bicocca (UNIMIB), Italy.

Mentor Graphics design and verification tools certified for TSMC 16nm FinFET production

Tue, 4 Apr 2014
Mentor Graphics Corp. today announced that its IC design to silicon solution has achieved certification for TSMC's Design Rule Manual (DRM) and SPICE model version 1.0 for its 16nm FinFET process.

SMIC appoints Hiroshi Ogawa as General Manager of SMIC Japan

Tue, 4 Apr 2014
Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, announced today that Hiroshi Ogawa was appointed as General Manager of SMIC Japan Corporation.

Deca Technologies ships 100-millionth wafer-level packaged component

Wed, 4 Apr 2014
Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth component.

MKS introduces dynamic frequency tuning patented DFT technology offered in RF plasma generators

Thu, 4 Apr 2014
MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced Dynamic Frequency Tuning (DFT) technology in RF plasma generators.

LG-Swiss researchers announce graphene membrane breakthrough

Fri, 4 Apr 2014
The findings open up the possibility in the future to develop highly efficient filters to treat air and water.

SEMI announces 2nd Vietnam Semiconductor Strategy Summit

Fri, 4 Apr 2014
Following the successful inaugural event in 2013, the 2nd annual SEMI Vietnam Semiconductor Strategy Summit will be held September 16-17, 2014 at the InterContinental Asiana Saigon Hotel in Ho Chi Minh City.

Cadence to acquire Jasper Design Automation

Mon, 4 Apr 2014
Cadence Design Systems, Inc. today announced plans to acquire Jasper Design Automation, Inc., a provider of formal analysis solutions, for approximately $170 million in cash.

SanDisk donates $1M to Berkeley College of Engineering

Mon, 4 Apr 2014
The donation will fund recently completed renovations to Cory Hall, home of the College’s Department of Electrical Engineering and Computer Sciences, and the undergraduate student Computing Lab, which has been renamed the SanDisk Computing Lab.

"Exotic" material is like a switch when super thin

Mon, 4 Apr 2014
Researchers from Cornell University and Brookhaven National Laboratory have shown how to switch a particular transition metal oxide, a lanthanum nickelate (LaNiO3), from a metal to an insulator by making the material less than a nanometer thick.

New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

Tue, 4 Apr 2014
The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format.

High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

Tue, 4 Apr 2014
By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University's Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost.

Zeta Instruments hires former KLA-Tencor exec as new COO

Wed, 4 Apr 2014
Zeta Instruments, Inc., an optical profiling and inspection company providing solutions for high-tech manufacturing, has announced that Jeff Donnelly has joined the company as its chief operating officer.

Contour Semiconductor names former Intel exec as new CEO

Tue, 4 Apr 2014
Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.

Spansion adds to flash memory portfolio

Thu, 4 Apr 2014
Spansion is adding three new Serial NOR and three new NAND memory densities specifically qualified to meet the extended temperature ranges and stringent quality requirements of the automotive industry.

imec reports 4 percent growth in 2013 fiscal year

Thu, 4 Apr 2014
Revenue for 2013 totaled 332 million euro, a four percent growth from the previous year.

IEEE Photonics Society announces Call For Papers

Thu, 4 Apr 2014
The IEEE Photonics Conference 2014 (IPC-2014) has announced a Call for Papers seeking original technical presentations in lasers, optoelectronics, optical fiber networks and related topics for the industry’s premier fall photonics conference.

Will interconnect manufacturing requirements cramp Moore's Law's style?

Fri, 4 Apr 2014
The recent years have seen considerable contention in the semiconductor industry on whether Moore’s Law is alive and well.

SEMICON Southeast Asia to be launched in 2015

Fri, 4 Apr 2014
Recognizing the changing dynamics of the microelectronics industry in Southeast Asia, SEMI today announced the expanded scope of its industry-leading SEMICON regional exposition which will now rotate between Singapore and other locations within Southeast Asia.

Freescale appoints Dan Durn as CFO

Fri, 4 Apr 2014
Freescale Semiconductor today announced that it has selected Dan Durn as senior vice president and chief financial officer, replacing current CFO, Alan Campbell, who announced his decision to retire in January of this year.

MACOM launches new 55 W GaN on SiC pulsed power transistor

Mon, 4 Apr 2014
M/A-COM Technology Solutions Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced a new GaN on SiC HEMT Pulsed Power Transistor for civilian and military radar pulsed applications.

SEMATECH appoints IBM veteran to direct strategic growth initiatives

Mon, 4 Apr 2014
Dr. Barth will join SEMATECH’s executive management team and will be responsible for cultivating effective alliance relationships and driving key strategic partnerships that align with the company’s core business objectives and long-term value creation and growth.

Scaling to 5nm: A plethora of paths

Mon, 4 Apr 2014
Previous semiconductor technology generations developed more clearly defined “winners” in terms of process technologies and materials choices.

How to create nanowires only 3 atoms wide with an electron beam

Tue, 4 Apr 2014
Junhao Lin, a Vanderbilt University Ph.D. student and visiting scientist at Oak Ridge National Laboratory (ORNL), has found a way to use a finely focused beam of electrons to create some of the smallest wires ever made.

Noel Technologies names Siavash Parsa Director of Technology

Thu, 5 May 2014
Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, has added semiconductor industry veteran Siavash Parsa to its growing management staff.

Graphene not all good

Tue, 4 Apr 2014
In a first-of-its-kind study of how a material some think could transform the electronics industry moves in water, researchers at the University of California, Riverside Bourns College of Engineering found graphene oxide nanoparticles are very mobile in lakes or streams and therefore likely to cause negative environmental impacts if released.

Graphene is only as strong as weakest link

Tue, 4 Apr 2014
There is no disputing graphene is strong. But new research by Rice University and the Georgia Institute of Technology should prompt manufacturers to look a little deeper as they consider the miracle material for applications.

Micron releases new SATA solid state drive

Tue, 4 Apr 2014
Micron Technology, Inc. this week announced a new enterprise-class solid state drive (SSD) designed specifically for data center storage platforms.

3D NAND: To 10nm and beyond

Fri, 2 Feb 2014
In launching the iPod music player, Apple bumped consumption of NAND flash – a type of non-volatile storage device – driving down cost and paving the way for the growth of the memory technology into what is now a multibillion dollar market, supplying cost-effective storage for smart phones, tablets and other consumer electronic gadgets that do not have high density requirements.

MACOM expands portfolio of high performance GaN components for RF solutions

Wed, 4 Apr 2014
M/A-COM Technology Solutions Inc., a supplier of high performance RF, microwave and millimeter wave products, today announced the availability and full technical support for 17 high-performance gallium nitride on silicon (GaN on Si) RF power transistors and amplifiers recently added to the MACOM product portfolio as a result of its acquisition of Nitronex, LLC.

Quantum Global Technologies joins SEMATECH to advance process tool chamber parts cleanliness

Wed, 4 Apr 2014
Quantum Global Technologies LLC today announced it joined SEMATECH in Albany NY, to advance process tool chamber parts cleanliness and analytical methods to meet sub-20nm wafer fabrication process requirements.

Entegris completes acquisition of ATMI

Wed, 4 Apr 2014
Entegris, Inc. today announced that it has completed its acquisition of ATMI, Inc., creating a supplier of products and materials for semiconductor and other advanced manufacturing.

Brooks Automation to acquire DMS

Wed, 4 Apr 2014
The cash purchase price is approximately $31 million, subject to an adjustment for working capital at closing. The acquisition is expected to close within the next two weeks upon satisfaction of customary closing conditions.

New rapid synthesis developed for bilayer graphene and high-performance transistors

Thu, 5 May 2014
Researchers at University of California, Santa Barbara, in collaboration with Rice University, have recently demonstrated a rapid synthesis technique for large-area Bernal (or AB) stacked bilayer graphene films that can open up new pathways for digital electronics and transparent conductor applications.

An edgy look at 2D molybdenum disulfide

Thu, 5 May 2014
Berkeley Lab researchers observe 1D edge states critical to nanoelectronic and photonic applications.

Global semiconductor industry posts highest-ever first quarter sales

Mon, 5 May 2014
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $78.47 billion during the first quarter of 2014, marking the industry's highest-ever first quarter sales.

Qualcomm elects Harish Manwani to board of directors

Mon, 5 May 2014
Qualcomm today announced the election of Harish Manwani to its Board of Directors. Manwani brings more than 35 years of consumer product and global management experience, and currently serves as the Chief Operating Officer at Unilever PLC.

Intel hires Steven Fund as new chief marketing officer

Mon, 5 May 2014
Intel Corporation today announced it has named Steven Fund, a senior industry executive with extensive brand and marketing experience, to the post of corporate vice president and Chief Marketing Officer reporting directly to Intel CEO Brian Krzanich.

Probing dopant distribution

Mon, 5 May 2014
Finding by Berkeley Lab Researchers at the Molecular Foundry opens the door to better doping of semiconductor nanocrystals.

Intel architecture fuels new wave of Chrome devices

Tue, 5 May 2014
Intel Corporation and other companies today introduced a new lineup of Chrome devices, including the first designs using Intel Celeron processors based on the Bay Trail-M system-on-chip (SoC).

Peregrine Semiconductor ships first UltraCMOS 10 production units

Tue, 5 May 2014
With partner GLOBALFOUNDRIES, the company also announces the completion of product and process qualification for the advanced RF SOI technology.

Microchip introduces 64-Mbit parallel Flash memory device on advanced process technology

Tue, 5 May 2014
Microchip Technology Inc., a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today introduced a new parallel Flash memory device.

SEMATECH achieves breakthrough defect reduction in EUV mask blanks

Tue, 5 May 2014
SEMATECH announced today that researchers have reached a significant milestone in reducing tool-generated defects from the multi-layer deposition of mask blanks used for extreme ultraviolet (EUV) lithography, pushing the technology another significant step toward readiness for high-volume manufacturing (HVM).

Avago completes acquisition of LSI

Tue, 5 May 2014
Avago Technologies Limited and LSI Corporation today announced Avago has completed its acquisition of LSI Corporation for $11.15 per share in an all-cash transaction valued at approximately $6.6 billion.

Graphene for real-world devices

Tue, 5 May 2014
New research in phonon scattering sheds more light on graphene as a replacement for silicon.

GlobalFoundries introduces 55nm automotive-specific advanced semiconductor manufacturing platform

Wed, 5 May 2014
GLOBALFOUNDRIES today introduced an optimized semiconductor manufacturing platform aimed specifically at meeting the stringent and evolving needs of the automotive industry.

SRC and UC Berkeley pursue more cost-effective approach to 3D chip integration

Wed, 5 May 2014
University of California, Berkeley researchers sponsored by Semiconductor Research Corporation (SRC) are pursuing a novel approach to 3D device integration that promises to lead to advanced mobile devices and wearable electronics featuring increased functionality in more low-profile packages.

BASF opens facility in Oregon

Thu, 5 May 2014
BASF today inaugurated a new Electronic Materials Sampling and Development facility in Hillsboro, Oregon. The new facility is a strategic step towards establishing a North American footprint to supply materials for semiconductor manufacturing applications related to the electronics industry.

First quarter semiconductor trends and update

Thu, 5 May 2014
Given the slow economic growth in the U.S. during the first quarter, coupled with challenging geo-political developments around the world,uncertainty once again permeates the industry outlook for the year.

Taking the lead out of a promising solar cell

Fri, 5 May 2014
Environmentally friendly solar cell pushes forward the "next big thing in photovoltaics."

SEMATECH reports higher dose sensitivity progress in novel photoresist platforms

Fri, 5 May 2014
SEMATECH announced today that researchers have reported progress which could significantly improve resist sensitivity by incorporating metal oxide nanoparticles for extreme ultraviolet (EUV) lithography.

SEMATECH appoints Satyavolu Papa Rao to lead process technology

Tue, 5 May 2014
In this key role, Papa Rao will serve as the operational lead, overseeing the strategic development of SEMATECH’s manufacturing, process, materials and ESH-related activities.

Applied Materials introduces the biggest materials change to interconnect technology in 15 years

Tue, 5 May 2014
Applied Materials, Inc. today announced its Applied Endura Volta CVD Cobalt system, the only tool capable of encapsulating copper interconnects in logic chips beyond the 28nm node by depositing precise, thin cobalt films.

New low-stress silicone encapsulant from Dow Corning

Tue, 5 May 2014
Dow Corning today introduced Dow Corning EE-3200 Low-Stress Silicone Encapsulant – the latest addition to its portfolio of advanced solutions designed to expand performance and durability of solar micro-inverters, power optimizers and other high value components.

Mentor Graphics launches MicReD industrial power tester for power cycle testing of electronic components

Tue, 5 May 2014
Mentor Graphics Corporation today announced the new MicReD Industrial Power Tester 1500A for power cycling and thermal testing of electronics components to simulate and measure lifetime performance.

Element Six's GaN-on-diamond wafers proven to provide three times improvement in power density in RF devices

Wed, 5 May 2014
Element Six today announced that its Gallium Nitride (GaN)-on-Diamond wafers have been proven by Raytheon Company to significantly outperform industry standard Gallium Nitride-on-Silicon Carbide (GaN-on-SiC) in RF devices.

Transphorm obtains exclusive licensing rights to Furukawa Electric's GaN patent portfolio

Wed, 5 May 2014
Transphorm Inc. today announced that it has obtained a sole worldwide license to Furukawa Electric Co., Ltd.'s extensive Gallium Nitride (GaN) power device portfolio that includes approximately 40 U.S. issued patents and 110 Japanese issued patents.

New policy helps combat counterfeit semiconductors

Wed, 5 May 2014
A newly finalized Department of Defense (DoD) rule reduces the risk of counterfeit semiconductor products being used by our military by implementing needed safeguards in the procurement of semiconductors and other electronic parts.

Nanowire bridging transistors open way to next-generation electronics

Wed, 5 May 2014
A new approach to integrated circuits, combining atoms of semiconductor materials into nanowires and structures on top of silicon surfaces, shows promise for a new generation of fast, robust electronic and photonic devices.

Improving financial predictability – is it chasing a mirage?

Thu, 5 May 2014
There is continued evidence that despite spending several millions on IT transformations, improving internal planning processes, maturing supply chains, and streamlining product development processes- several companies still struggle with predicting their financial and operational performance.

Memory design challenges require giga-scale SPICE simulation

Thu, 5 May 2014
Embedded memory is now consuming most of the area on an SoC chip. Complexity and circuit size are only growing, which means smaller process geometries, larger designs, and tighter design margins.

Noel Technologies reducing costs of nanoimprint stamps

Thu, 5 May 2014
Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, is now offering services for nanoimprint technology that reduce the costs of the nanoimprint stamps.

New materials and processes for advanced interconnects

Fri, 5 May 2014
Although on-chip interconnects have not been scaling at the same speed as other parts of the chip, new capabilities enabled by graphene and CNTs, among other materials, could soon change that.

In-line high-K/metal gate monitoring using picosecond ultrasonics

Fri, 5 May 2014
Only a direct measurement of SRAM structures can represent true variations of metal gate height due to CMP process and is strongly affected by the design and layout of pattern, including pattern density, dummy design, and spacing.

GLOBALFOUNDRIES and Samsung join forces on 14nm finFETs

Thu, 4 Apr 2014
Fabless companies could skip the 20nm node and move straight to 14nm FinFETs. That is the hope of GLOBALFOUNDRIES and Samsung who are announcing a joint program that offers a single process design kit (PDK) and manufacturing at four different fabs with identical processes.

3D EDA brings together proven 2D solutions

Fri, 3 Mar 2014
With anticipated economic limits to the continuation of Moore’s Law now on the horizon, it seems that moving into the 3rd dimension (3D) by stacking multiple layers of integrated circuits (IC) will be the ultimate expression of CMOS technology.

Domestic outsourcing: A key component in successful reshoring

Fri, 5 May 2014
After nearly a quarter of a century, the off-shoring manufacturing trend that decimated the U.S. manufacturing sector and played a significant role in the slow pace of the current economic recovery seems to be ending.

What’s new in the latest ITRS

Mon, 5 May 2014
The newly revamped International Technology Roadmap for Semiconductors was released in early April. It’s actually called the 2013 ITRS, which makes it seem already out of date, but that’s the way the numbering has always been.

Brewer Science unveils Apogee temporary wafer bonder

Mon, 5 May 2014
Brewer Science, Inc., a supplier of thin-wafer handling technology, materials, and equipment to the microelectronics industry, today unveiled the Brewer Science Apogee bonder for temporary wafer bonding applications.

SMIC and other groups collaborate to setup the "IC Advanced Technology Research Institute"

Mon, 5 May 2014
China's, largest and most advanced semiconductor foundry, today announced that SMIC, Wuhan Xinxin, Tsinghua University, Beijing University, Fudan University and the Chinese Academy of Sciences and Microelectronics have collaborated to setup the "IC Advanced Technology Research Institute" to create the most advanced IC technology research and development institution in China.

MediaTek, SK Hynix, AMD, and Micron sales surge in first quarter

Mon, 5 May 2014
Top 20 ranking shows that semiconductor industry company consolidation continues to accelerate.

Lighting the way to graphene-based devices

Mon, 5 May 2014
Berkeley Lab researchers use light to dope graphene boron nitride heterostructures.

Increase in first quarter 2014 silicon wafer shipments

Tue, 5 May 2014
Worldwide silicon wafer area shipments increased during the first quarter 2014 when compared to fourth quarter 2013 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Slideshow: What to look for at IITC 2014

Tue, 5 May 2014
The 17th annual IITC will be held May 21 – 23, 2014 in conjunction with the 31st AMC at the Doubletree Hotel in San Jose, California.

DAC panels tackle giga-scale design challenges, semiconductor market in China

Wed, 5 May 2014
The ProPlus blog here on Solid State Technology has looked at giga-scale design challenges and, this year, so will the Design Automation Conference (DAC).

Google Glass is far more than the sum of its parts, IHS Teardown reveals

Wed, 5 May 2014
Teardown analysis is a useful tool for understanding the component and manufacturing cost of electronics devices—but it doesn’t always tell the whole story of the value of a product.

Global market for CVD to reach $6.8B in 2019

Wed, 5 May 2014
BCC Research reveals in its new report, Thin-layer Deposition: CVD, Ion Implantation and Epitaxy, the global market for chemical vapor deposition (CVD) is expected to grow to $6.8 billion by 2019, with a five-year CAGR of 6.3%.

MagnaChip announces CEO transition

Wed, 5 May 2014
MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that Sang Park, 67, has retired as Chairman, Chief Executive Officer and Director, effective immediately.

SPTS Technologies announces the Omega Rapier XE System for 300mm wafer silicon etch processing

Thu, 5 May 2014
SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the launch of its Rapier XE system for 300mm wafer silicon etching.

NIST studies why quantum dots suffer from "fluorescence intermittency"

Thu, 5 May 2014
Researchers at the National Institute of Standards and Technology (NIST), working in collaboration with the Naval Research Laboratory, have found that a particular species of quantum dots that weren't commonly thought to blink, do.

Bending helps to control nanomaterials

Thu, 5 May 2014
A new remedy has been found to tackle the difficulty of controlling layered nanomaterials. Control can be improved by simply bending the material.

Sales of semiconductor equipment in North America continue to demonstrate strong growth

Fri, 5 May 2014
A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

KLA-Tencor announces new Teron SL650 reticle inspection system

Fri, 5 May 2014
Today, KLA-Tencor Corporation announced the Teron SL650, a new reticle quality control solution for IC fabs that supports 20nm design nodes and beyond.

Synopsys and TSMC collaborate to validate DesignWare IP in TSMC 16nm FinFET process

Tue, 5 May 2014
Synopsys, Inc. today announced the validation of DesignWare IP in the TSMC 16nm FinFET process technology, demonstrating the ongoing collaboration between Synopsys and TSMC to provide designers with proven IP for their advanced system-on-chip (SoC) designs.

Intel to collaborate with Rockchip

Tue, 5 May 2014
Intel Corporation today announced it has entered into a strategic agreement with Rockchip to expand the breadth of and accelerate the rate at which it brings its Intel architecture and communications-based solutions to market for a range of entry-level Android tablets worldwide.

UT Dallas team creates flexible electronics that change shape inside body

Tue, 5 May 2014
Transistors maintain electrical properties after implantation.

Penn research combines graphene and painkiller receptor into scalable chemical sensor

Tue, 5 May 2014
Researchers from the University of Pennsylvania have led an effort to create an artificial chemical sensor based on one of the human body's most important receptors, one that is critical in the action of painkillers and anesthetics..

ams reaches out to Chinese engineering community with new micro-site

Tue, 5 May 2014
ams AG, a provider of high performance analog ICs and sensors, has launched a new micro-site in China in an initiative designed to provide a more direct channel for communication with China's one million-strong electronic design and engineering community.

Amkor and Carsem announce patent infringement settlement

Wed, 5 May 2014
Amkor Technology, Inc. and Carsem today jointly announced the settlement of the litigation initiated by Amkor against Carsem alleging infringement of Amkor's MicroLeadFrame (MLF) patents.

Strategic investors to connect with startups at SEMICON West event; Bob Metcalfe to keynote

Wed, 5 May 2014
SEMI today announced that SEMICON West 2014 will feature Bob Metcalfe, professor at the University of Texas at Austin, as the Silicon Innovation Forum’s keynote speaker.

IEDM announces 2014 Call for Papers

Wed, 5 May 2014
The 60th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

Global semiconductor leaders develop plan to promote worldwide industry growth

Wed, 5 May 2014
The Semiconductor Industry Association (SIA) today announced that global semiconductor industry leaders reached an agreement at the 18th annual meeting of the World Semiconductor Council (WSC) last week on a series of policy proposals to strengthen the industry through international cooperation.

Down to 5nm: Scaling with the usual suspects - performance, cost

Thu, 5 May 2014
The semiconductor industry never lacks for challenges and/or controversy as it forges ahead from one technology node to the next.

NanGate releases 15nm open source digital cell library

Thu, 5 May 2014
NanGate, Inc. – a provider of design-specific standard cell library IP and EDA tools for layout automation – announced that it has released the first edition of a new 15nm open cell library (OCL).

ams wins patent validity lawsuit launched by Melexis

Thu, 5 May 2014
ams, a manufacturer of high performance sensor and analog solutions, announces that the company has won a last-instance verdict against Melexis.

New cost-effective nanoimprint lithography methodology improves ordering in periodic arrays from block copolymers

Mon, 6 Jun 2014
A work led by the Institut Català de Nanociència i Nanotecnologia (ICN2) Phononic and Photonic Nanostructures Group suggests a new method to produce hexagonal periodic arrays with high fidelity while reducing time and costs.

Critical test issues up for debate at Test Vision 2020

Mon, 6 Jun 2014
Test professionals who want to learn, forecast and debate the future of semiconductor test will attend the 7th annual IEEE Test Vision 2020 Workshop, held in conjunction with SEMICON West 2014 (July 8-10) in San Francisco.

Samsung's 14nm finFET process technology ecosystem solidly in place for mobile consumer and SoC applications

Mon, 6 Jun 2014
Samsung today announced that the IP and design enablement ecosystem for its foundry’s 14nm FinFET process technology is firmly in place as customers begin their early design work.

Osamu Nakamura named President of SEMI Japan

Tue, 6 Jun 2014
Nakamura will succeed Yoichi Nakagawa, who is retiring from SEMI.

Georgia Tech research develops physics-based spintronic interconnect modeling for beyond-CMOS computing

Tue, 6 Jun 2014
Georgia Institute of Technology researchers collaborating with and sponsored by Intel Corporation through the Semiconductor Research Corporation (SRC) have developed a physics-based modeling platform that advances spintronics interconnect research for beyond-CMOS computing.

Plasma-Therm ranked first in customer satisfaction

Tue, 6 Jun 2014
Plasma-Therm, a global provider of semiconductor equipment, has again been ranked number one in an independent survey of customers, the company announced today.

Synopsys and Intel collaborate on 14nm Tri-Gate design platform

Tue, 6 Jun 2014
Synopsys, Inc. and Intel Corporation today announced broad SoC design enablement for Intel's 14nm Tri-Gate process technology for use by customers of Intel Custom Foundry.

2D transistors promise a faster electronics future

Tue, 6 Jun 2014
Faster electronic device architectures are in the offing with the unveiling of the world’s first fully two-dimensional field-effect transistor (FET) by researchers with the Lawrence Berkeley National Laboratory (Berkeley Lab).

Synopsys, STMicroelectronics and Samsung to collaborate on adoption of 28nm FD-SOI technology

Wed, 6 Jun 2014
Synopsys, Inc. today announced it has extended its collaboration with STMicroelectronics to include Samsung Electronics, enabling broader market adoption of ST's 28nm FD-SOI technology for SoC design.

First automotive MCU manufactured using GlobalFoundries' 55nm automotive-specific platform

Wed, 6 Jun 2014
Scaleo chip, the fabless semiconductor company in automotive electronics for powertrain, body control and driver-information, has used the GLOBALFOUNDRIES 55nm eFlash NVM Platform to develop a new family of microcontrollers.

Strengthening recovery: Fab equipment spending - 24% increase in 2014, possible record in 2015

Wed, 6 Jun 2014
After two years of decline, fab equipment spending is expected to increase 24 percent in 2014 and about 11 percent (US$39.5 billion).

Wireless infrastructure drives RF power semiconductor markets to well over $1B in 2013

Wed, 6 Jun 2014
Spending on RF power semiconductors for the wireless infrastructure markets has taken another jump in 2013.

Global semiconductor sales increase in April; Sustained growth projected for 2014 and 2015

Thu, 6 Jun 2014
The Semiconductor Industry Association (SIA) yesterday announced that worldwide sales of semiconductors reached $26.34 billion for the month of April 2014.

Micron Technology to discuss emerging memories at 2014 Symposia on VLSI Technology and Circuits

Thu, 6 Jun 2014
Micron Technology, Inc. today outlined their participation in the upcoming 2014 Symposia on VLSI Technology and Circuits scheduled for June 9-13.

On the road to recovery: Semiconductor growth expected for the next two years

Mon, 6 Jun 2014
According to the IMF and predictions by many other market research firms, 2014 and 2015 are expected to be growth years, comparable to or even better than the past few years.

ON Semiconductor to acquire Aptina Imaging

Mon, 6 Jun 2014
ON Semiconductor today signed a definitive agreement to acquire Aptina Imaging, a provider of high-performance CMOS image sensors for automotive and industrial markets.

New class of nanoparticle brings cheaper, lighter solar cells outdoors

Mon, 6 Jun 2014
Researchers in the University of Toronto’s Edward S. Rogers Sr. Department of Electrical & Computer Engineering have designed and tested a new class of solar-sensitive nanoparticle that outshines the current state of the art employing this new class of technology.

Paradigm shift in semi equipment - Confirmed

Tue, 7 Jul 2014
Technology node transitions slowing below 32nm.

UC Santa Barbara researchers introduce highest performing III-V metal-oxide semiconductor FET

Tue, 6 Jun 2014
Researchers from the University of California, Santa Barbara (UCSB) will introduce today the highest performing III-V metal-oxide semiconductor (MOS) field-effect transistors (FETs) at the 2014 Symposium on VLSI Technology.

Imec reports record ADC for next-generation software defined radio

Tue, 6 Jun 2014
Nanoelectronics research centre imec will present at this week’s VLSI circuits symposium 2014 (Honolulu, June 13) a low power pipelined SAR (successive-approximation register) ADC (analog to digital converter) in 28nm digital CMOS with record resolution, speed and power performance.

Dow Corning launches power electronic industry's first SiC wafer grading structure

Wed, 6 Jun 2014
Dow Corning today established a higher industry standard for silicon carbide (SiC) crystal quality by introducing a product grading structure that specifies ground-breaking new tolerances on killer device defects.

Research on high-performance field-effect transistors to be presented at 2014 VLSI Symposium

Thu, 6 Jun 2014
A team of researchers from Purdue University, SEMATECH and SUNY College of Nanoscale Science and Engineering will present today at the 2014 Symposium on VLSI Technology on their work involving high-performance molybdenum disulfide (MoS2) field-effect transistors (FETs).

Industry sustainability efforts mount with III-Vs and other advanced technologies

Thu, 6 Jun 2014
The introduction of new materials, such as III-Vs, into high-volume manufacturing of semiconductors, likely will occur sometime around the 7nm and/or 5nm nodes.

Semiconductor wet chemicals fall short of 2008 levels

Sat, 6 Jun 2014
Techcet forecasts $1B electronic chemicals business by 2015.

Analog Devices welcomes Dr. Edward Frank to Board of Directors

Sat, 6 Jun 2014
Analog Devices, Inc., a developer of high-performance semiconductors for signal processing applications, today announced that Dr. Edward Frank has been elected as a Director of the Company.

200mm equipment market gaining new lease on life

Mon, 6 Jun 2014
In 2004/2005, shipments of 300mm wafer fab equipment (WFE) began to outpace that of 200mm platforms.

The GaN power industry is consolidating in preparation for significant growth

Tue, 6 Jun 2014
The power supply/PFC segment will dominate the business from 2015-2018, ultimately representing 50 percent of device sales. At that point, automotive will then catch-up.

Cadence completes acquisition of Jasper Design Automation

Tue, 6 Jun 2014
Cadence Design Systems, Inc. today announced that it has completed the acquisition of Jasper Design Automation, Inc.

Boston Semi Equipment acquires MVTS Technologies

Tue, 6 Jun 2014
Boston Semi Equipment LLC (BSE) today announced it has completed the acquisition of MVTS Technologies (MVTS).

SEMI releases first quarter 2014 worldwide PV equipment market report

Wed, 6 Jun 2014
Bookings recover for second consecutive quarter; above parity for first time since 2011

memsstar relocates; Increases manufacturing capacity by 40%

Wed, 6 Jun 2014
memsstar Limited, a provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and micro-electrical mechanical systems (MEMS), today announced that it has relocated to a new, larger facility.

Scouting report for materials at end of the road: 2013 ITRS

Thu, 4 Apr 2013
The IC fabrication industry is approaching the end of the road for device miniaturization, with both atomic and economic limits looming on the horizon.

SEMI's 3DIC standards activities

Sat, 5 May 2013
I have said many times that it will be impossible for a complicated technology like 3DIC to ever become commercial without standardization.

UC Riverside to lead new energy frontier research center project

Wed, 6 Jun 2014
SHINES will investigate several aspects of basic research: new ultrathin films, nanostructured composites, high resolution imaging, the transport of electrical signals, heat and light.

Entegris opens new facility in Bedford, MA

Thu, 6 Jun 2014
Entegris Inc., a Billerica-based materials and solutions provider to the microelectronics industries, today inaugurated its new i2M Center for Advanced Materials Science ("The i2M Center") in Bedford, Massachusetts.

450mm transition toward sustainability: Facility and infrastructure requirements

Thu, 6 Jun 2014
Design and construction professionals are showing unprecedented levels of collaboration through the G450C.

Advanced Materials Developer Inpria raises $1.45M from Oregon Angel Fund

Thu, 6 Jun 2014
Inpria Corporation, a developer of high-resolution photoresists, announced today that it has received additional equity investment and commitments totaling $1.45 million

Subatmospheric gas storage and delivery: Past, present and future

Thu, 6 Jun 2014
Storing gas on a sorbent provides an innovative, yet simple and lasting solution.

Bookings and billings maintain a consistent pace in May 2014

Fri, 6 Jun 2014
North American semiconductor equipment industry posts May 2014 book-to-bill ratio of 1.00.

Collecting light with artificial "moth eyes"

Mon, 6 Jun 2014
Empa researchers have developed such a photoelectrochemical cell, recreating a moth’s eye to drastically increase its light collecting efficiency. The cell is made of cheap raw materials – iron and tungsten oxide.

HVM production and challenges of UHP PDMAT for ALD-TaN

Sun, 6 Jun 2014
For sub-22nm device generations, device manufacturers are likely to adopt PDMAT precursor for ALD-TaN barrier films for copper interconnect structures.

Noise cancellation: The new failure and yield analysis superpower

Sun, 6 Jun 2014
Root cause deconvolution is a quick and cost effective way to determine the underlying root causes represented in a population of failing devices from test data alone.

GlobalFoundries presents first global Supplier Awards

Mon, 6 Jun 2014
JSR Corporation, Lam Research, Tokyo Electron Ltd. and SUMCO Corporation honored for outstanding collaboration, service and cost leadership.

Avago Technologies to acquire PLX

Mon, 6 Jun 2014
Avago Technologies and PLX Technology, Inc. announced today that they have entered into a definitive agreement under which Avago will acquire PLX, a developer of PCI Express silicon and software connectivity solutions.

Micron collaborates with Intel on on-package memory solution, leveraging 3D memory technology

Mon, 6 Jun 2014
Micron Technology, Inc., a provider of advanced semiconductor solutions, today announced an ongoing collaboration with Intel to deliver an on-package memory solution for Intel's next-generation Xeon Phi processor, codenamed Knights Landing.

imec joins Graphene Flagship

Mon, 6 Jun 2014
To coincide with Graphene Week 2014, the Graphene Flagship is proud to announce that today one of the largest-ever European research initiatives is doubling in size.

At The ConFab 2014: Do we still need Moore’s Law?

Mon, 6 Jun 2014
Many questions were in the air on the first day of the 10th annual ConFab 2014, and certainly chief among them was raised during Dr. Roawen Chen of Qualcomm’s keynote “What’s On Our Mind” on Monday morning when he asked, “Should we pursue Moore's Law unconditionally?"

Texas Instruments promotes Brian Crutcher to executive vice president, Steve Anderson to lead Analog

Mon, 6 Jun 2014
Texas Instruments Incorporated has promoted Brian Crutcher to executive vice president of Business Operations with oversight for the company's product lines and sales.

A silicon replacement? USC Viterbi School of Engineering overcomes major issue in carbon nanotube tech

Mon, 6 Jun 2014
Researchers from the USC Viterbi School of Engineering describe how they have overcome a major issue in carbon nanotube technology by developing a flexible, energy-efficient hybrid circuit combining carbon nanotube thin film transistors with other thin film transistors.

SPTS and CEA-Leti/Nanoelec collaborate on 3D-TSV

Tue, 6 Jun 2014
SPTS Technologies, a manufacturer of etch, deposition and thermal processing equipment for the semiconductor industry, today announced that it has signed an agreement with CEA-Leti in Grenoble, France, to develop 3D-TSV technologies.

Singapore researchers use FEI Titan S/TEM to link plasmonics with molecular electronics

Tue, 6 Jun 2014
The National University of Singapore, Singapore University of Technology and Design, and the A*STAR institutes: Institute of High Performance Computing and Institute of Materials Research and Engineering announced their recent discovery of quantum plasmonic tunneling.

SMIC establishes the first 12 in CIS supply chain in China

Tue, 6 Jun 2014
Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, today announced that the first 12" color filter and micro lens array production line in mainland China has been completed and put into production by Toppan SMIC Electronics of Shanghai

ConFab panelists discuss optimizing R&D in the changing semi landscape

Tue, 6 Jun 2014
Overheard @The ConFab: “I feel the best I’ve felt about semi since 2009.” –Mike Noonen, Silicon Catalyst

The bright future of Si photonics

Wed, 6 Jun 2014
Beyond all of the hype and tumult, market drivers and technological developments are converging to ensure a bright future for Si photonics.

Is silicon wafer pricing on its way up again?

Wed, 6 Jun 2014
Silicon wafer volumes recover; revenues forecasted to improve. Techcet forecasts $8.7B on 9,500 MSI Si by 2015.

Gopal Rao at The ConFab: Scaling isn’t enough anymore

Wed, 6 Jun 2014
The core element of the semiconductor industry’s roadmap has been scaling – but Gopal Rao believes that isn’t enough anymore.

“What comes next?” — Latest technology breakthroughs featured at SEMICON West

Fri, 6 Jun 2014
The latest manufacturing, materials and production developments for emerging and adjacent markets will be featured at SEMICON West 2014, to be held on July 8-10 at the Moscone Center in San Francisco, Calif.

Winfried Kaiser to receive the SEMI Sales and Marketing Excellence Award

Fri, 6 Jun 2014
SEMI today announced that Winfried Kaiser, senior vice president Product Strategy Lithography Optics at ZEISS, has been selected as the 2014 recipient of the SEMI Sales and Marketing Excellence Award, inspired by the late Bob Graham.

Breakthrough research in the semiconductor industry

Mon, 6 Jun 2014
Research forms the DNA of the semiconductor industry — few other industries invest as much as a percentage of revenue.

Gigaphoton achieves 92W EUV light source output

Mon, 6 Jun 2014
Gigaphoton Inc., a major lithography light source manufacturer, announced today that it has successfully achieved 92 W EUV light source output at 4.2 percent conversion efficiency (CE) on its prototype laser-produced plasma (LPP) light sources for EUV lithography scanners.

EVG clears key barriers to 3DIC/TSV HVM with fusion wafer bonding solution

Mon, 6 Jun 2014
EV Group today unveiled the GEMINI FB XT—its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs).

Gigaphoton develops world's first helium-free purge process for ArF immersion lasers

Mon, 6 Jun 2014
Gigaphoton Inc., a major lithography light source manufacturer, announced today that it has succeeded in the development of an innovative purge process, one that does not use the rare gas helium, for its flagship "GT Series" of ArF immersion lasers.

Stanford engineers envision an electronic switch just 3 atoms thick

Tue, 7 Jul 2014
Computer simulation shows how to make a crystal that would toggle like a light switch between conductive and non-conductive structures; this could lead to flexible electronic materials and enable a cell phone to be woven into a shirt.

Bending the rules

Tue, 7 Jul 2014
A UCSB postdoctoral scholar in physics discovers a counterintuitive phenomenon: the coexistence of superconductivity with dissipation.

TowerJazz to establish new office in Kyoto, Japan

Tue, 7 Jul 2014
TowerJazz today announced the opening of a new sales and support office in Japan. The office is situated in Kyoto and will be the central base of Japanese sales, technical support and other services.

Nanolab Technologies acquires Microtech Laboratories, LLC

Wed, 7 Jul 2014
Nanolab Technologies, Inc. announced today that it has acquired Microtech Laboratories, LLC a well-established Dallas, Texas, failure analysis laboratory founded in 1999.

Smart, sustainable manufacturing: new sensors for process monitoring

Thu, 7 Jul 2014
Industries ranging from chemicals to agri-food to bio-tech and pharmaceuticals are looking at new sensor technologies to streamline processes and improve quality control.

IoT will transform transportation

Thu, 7 Jul 2014
Cars that can get along without drivers are coming, down the road, but they are a small part of the changes that the global transportation industries will undertake as microelectronics and the Internet of Things prompt major changes in infrastructure and logistics, as well as all type of vehicles.

SMIC and Qualcomm collaborate on 28nm wafer production in China

Thu, 7 Jul 2014
Semiconductor Manufacturing International Corporation and Qualcomm Incorporated, have announced that SMIC and Qualcomm Technologies are working together in connection with 28nm process technology and wafer manufacturing services in China to manufacture Qualcomm Snapdragon processors.

Columbia researchers observe tunable quantum behavior in bilayer graphene

Thu, 7 Jul 2014
Columbia researchers have observed the fractional quantum Hall effect in bilayer graphene and shown that this exotic state of matter can be tuned by an electric field.

Making dreams come true : Making graphene from plastic?

Thu, 7 Jul 2014
Recently, a domestic research team developed a carbon material without artificial defects commonly found during the production process of graphene while maintaining its original characteristics.

With "ribbons" of graphene, width matters

Thu, 7 Jul 2014
Using graphene ribbons of unimaginably small widths – just several atoms across – a group of researchers at the University of Wisconsin-Milwaukee (UWM) has found a novel way to "tune" the wonder material, causing the extremely efficient conductor of electricity to act as a semiconductor.

Alpha and Omega Semiconductor rolls out new family of MOSFETS

Thu, 7 Jul 2014
Alpha and Omega Semiconductor Limited, a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today announced the release of six new 25V and 30V MOSFETs.

Internet of Things: big numbers, many opportunities

Thu, 7 Jul 2014
Whatever forecast one uses for the future of the Internet of Things in terms of connected objects or business opportunities, the IoT will be big.

Monolithic 3DIC: Overcoming silicon defects

Mon, 7 Jul 2014
As dimensional scaling has reached the diminishing return era there is a buildup of interest in monolithic 3D as an alternative path forward.

Permanent bonding: A key technology for MEMS, advanced packaging, LEDs and SOI

Mon, 7 Jul 2014
Yole Développement has released a new report, Permanent Wafer Bonding, detailing permanent bonding technologies and the microelectronic applications that use permanent bonding such as MEMS, Advanced Packaging, LEDs and SOI substrates.

Orbotech to acquire SPTS Technologies

Mon, 7 Jul 2014
Orbotech Ltd. today announced the acquisition of SPTS Technologies Group Limited, a U.K.-based leading manufacturer of etch, deposition and thermal processing equipment for the microelectronics industry, from European private equity firm Bridgepoint and others.

Printed, flexible, and organic electronics: A growing opportunity

Tue, 7 Jul 2014
In wearable gadgets, flexible electronics may have met its dream application. And that’s no stretch of the imagination.

James C. Morgan announces $1,000,000 “Challenge Grant” for high tech industry workforce development

Tue, 7 Jul 2014
James C. Morgan, chairman emeritus, Applied Materials, Inc., today announced his commitment to match up to $500,000 in donations to the SEMI Foundation.

Applied Materials and Tokyo Electron unveil new company name

Tue, 7 Jul 2014
Applied Materials, Inc. and Tokyo Electron Limited today unveiled the new name and logo of their combined company which will be used once the merger closes.

SEMI and Solid State Technology announce the 2014 “Best of West” Award finalists

Tue, 7 Jul 2014
Each year at SEMICON West, the largest and most influential microelectronics exposition in North America, the “Best of West” awards are presented by Solid State Technology and SEMI. The award was established to recognize contributors moving the industry forward with their technological developments in the microelectronics supply chain.

Boston Semi Equipment expands sales and service organization

Tue, 7 Jul 2014
Boston Semi Equipment LLC (BSE) today announced it has completed the integration of the sales and service teams of MVTS and Aetrium into the BSE distribution channel.

SEMATECH and CNSE/SUNYIT launch CMP Center

Tue, 7 Jul 2014
The Center aims to accelerate the development of next generation CMP technology, and to drive improvement in the yield and cost of ownership of CMP processes.

Entegris launches ultra clean filter for semiconductor manufacturing

Tue, 7 Jul 2014
Entegris, Inc. announced the latest addition to its Torrento family of ultra clean liquid filtration solutions used in the semiconductor manufacturing process.

Applied Materials unveils CVD and CMP systems

Tue, 7 Jul 2014
On Monday, Applied Materials announced two new systems, a Reflexion LK Prime CMP system and a Producer XP Precision CVD system, both aimed at complex devices with 3D architectures.

Entegris focused on purification, materials

Wed, 7 Jul 2014
Semiconductor devices are manufactured using the most advanced processes and materials known to man and require levels of purity that measures contamination in parts per quadrillion (ppq).

SEMI forecasts double-digit business growth in 2014, 2015

Wed, 7 Jul 2014
The worldwide semiconductor capital equipment market is forecast to increase 20.8 percent this year to $38.44 billion, compared with 2013’s $31.82 billion, and another 10.8 percent in 2015 to $42.6 billion, according to Semiconductor Equipment and Materials International.

Solid State Technology and SEMI announce the 2014 “Best of West” Award winner

Wed, 7 Jul 2014
Solid State Technology and SEMI, yesterday announced the recipient of the 2014 “Best of West” Award — Nikon Corporation — for its NSR-S630D Immersion Scanner. The award recognizes important product and technology developments in the microelectronics supply chain. The Best of West finalists were selected based on their financial impact on the industry, engineering or scientific achievement, and/or societal impact.

Entegris announces new VaporSorb filter for advanced yield protection

Wed, 7 Jul 2014
Entegris, Inc. today announced a product extension for its VaporSorb line of airborne molecular contamination (AMC) filters.

A cool approach to flexible electronics

Thu, 7 Jul 2014
A nanoparticle ink that can be used for printing electronics without high-temperature annealing presents a possible profitable approach for manufacturing flexible electronics.

Graphene grain boundaries reviewed

Tue, 7 Jul 2014
Graphene has attracted overwhelming attention both for exploring fundamental science and for a wide range of technological applications.

A nanosensor to identify vapors based on a Graphene/Silicon heterojunction Schottky diode

Tue, 7 Jul 2014
Among other carbon-based nanomaterials, graphene represents a great promise for gas sensing applications.

IBM announces $3B research initiative

Tue, 7 Jul 2014
IBM announced it is investing $3 billion over the next 5 years in two broad research and early stage development programs to push the limits of chip technology needed to meet the emerging demands of cloud computing and Big Data systems.

Teradyne elects Mercedes Johnson to board of directors

Wed, 7 Jul 2014
Teradyne, Inc. announced the election of Mercedes Johnson to its Board of Directors. Ms. Johnson was also appointed to the Board’s Audit Committee.

TriQuint achieves GaN defense production milestones as part of the Defense Production Act Title III Program

Wed, 7 Jul 2014
TriQuint Semiconductor, Inc., an RF solutions supplier and technology innovator, announced that it has reached a defense production milestone, successfully completing the Defense Production Act Title III Gallium Nitride on Silicon Carbide Production Capacity program.

Former NetLogic CEO and Broadcom executive, Ron Jankov, joins eASIC board of directors

Wed, 7 Jul 2014
eASIC Corporation, a provider of Single Mask Adaptable ASIC devices, today announced the appointment of Ron Jankov to the company’s Board of Directors.

Edwards honored at SEMICON West 2014

Fri, 7 Jul 2014
Edwards Limited is pleased to announce that Mike Czerniak, Product Marketing Manager Exhaust Gas Management, was honored with SEMI’s Merit Award during SEMICON West last week.

Process Watch: The 10 fundamental truths of process control for the semiconductor IC industry

Tue, 7 Jul 2014
This is the first in a series of 10 installments which will discuss fundamental truths about process control - inspection and metrology - for the semiconductor industry.

CEA-Leti: Monolithic 3D is the solution for further scaling

Mon, 7 Jul 2014
Hughes Metras, Leti’s VP of Strategic Partnerships North America, introduced the lead talk at their SemiconWest 2014 Leti Day about monolithic 3D technology as the "solution for scaling."

Solid State Equipment wins 2014 3D InCites Award for WaferEtch TSV Revealer

Tue, 7 Jul 2014
Solid State Equipment LLC (SSEC), a provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment.

Allegro MicroSystems announces new silicon carbide Schottky barrier diode FMCA series

Tue, 7 Jul 2014
Allegro MicroSystems, LLC announces the release of the next generation series of silicon carbide Schottky barrier diodes.

SEMI: June 2014 equipment bookings at the highest level since May 2012

Tue, 7 Jul 2014
North America-based manufacturers of semiconductor equipment posted $1.47 billion in orders worldwide in June 2014 (three-month average basis) and a book-to-bill ratio of 1.09, according to the June EMDS Book-to-Bill Report published today by SEMI.

SEMI announces new South America Semiconductor Strategy Summit

Tue, 7 Jul 2014
SEMI today announced the launch of the association's first-ever event in Latin America.

Compact vibration harvester power supply with highest efficiency opens door to “Fix-and-Forget” sensor nodes

Wed, 7 Jul 2014
OMRON and Holst Centre/imec have unveiled a prototype of an extremely compact vibrational energy harvesting DC power supply with worlds’ highest efficiency.

Fundamental chemistry findings could help extend Moore’s Law

Wed, 7 Jul 2014
A Berkeley Lab-Intel collaboration outlines the chemistry of photoresist, enabling smaller features for future generations of microprocessors.

Understanding graphene’s electrical properties on an atomic level

Wed, 7 Jul 2014
Graphene, a material that consists of a lattice of carbon atoms, one atom thick, is widely touted as being the most electrically conductive material ever studied. However, not all graphene is the same. With so few atoms comprising the entirety of the material, the arrangement of each one has an impact on its overall function.

A new multi-bit 'spin' for MRAM storage

Wed, 7 Jul 2014
Interest in magnetic random access memory (MRAM) is escalating, thanks to demand for fast, low-cost, nonvolatile, low-consumption, secure memory devices. MRAM, which relies on manipulating the magnetization of materials for data storage rather than electronic charges, boasts all of these advantages as an emerging technology, but so far it hasn't been able to match flash memory in terms of storage density.

Micron 16nm NAND flash memory awarded Most Innovative Memory Device and Semiconductor of the Year

Wed, 7 Jul 2014
Micron Technology, Inc. and TechInsights today announced that Micron has been honored with both the Most Innovative Memory Device and Semiconductor of the Year awards for their 16nm NAND Flash memory technology in TechInsights' 11th Annual Insight Awards.

Peregrine Semiconductor and RF Micro Devices settle outstanding litigation

Wed, 7 Jul 2014
Peregrine Semiconductor Corporation, founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, and RF Micro Devices, Inc., a designer and manufacturer of high-performance radio frequency solutions, today announced that they have settled all outstanding claims between the companies.

VCs still investing in semiconductor technology, but need strategic partners and capital efficiency

Thu, 7 Jul 2014
Investors are still looking for differentiated technologies that solve high-value problems in semiconductor manufacturing, or that bring semiconductor technology to disruptive applications in other fields, particularly in the medical and environmental sectors

A*STAR and industry partners form S$200M semiconductor R&D joint labs

Thu, 7 Jul 2014
Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners.

Can lean innovation bring growth and profits back to semiconductors?

Fri, 7 Jul 2014
New approaches to start-ups can unlock mega-trend opportunities.

Cryogenic etching reduces plasma-induced damage of ultralow-k dielectrics

Mon, 7 Jul 2014
Reducing plasma-induced damage is key to advancing the scaling limits.

Superfast stress inspection for overlay control

Mon, 7 Jul 2014
Tighter overlay requirements are motivating device manufacturers to explore new ways to characterize and manage overlay to improve yield.

Harnessing big data

Mon, 7 Jul 2014
Addressing the analytics challenges in supply chain management.

A call to provide advanced equipment to growth companies

Mon, 7 Jul 2014
Historically, the major semiconductor capital equipment manufacturers have focused on supporting the bigger semiconductor companies at the expense of the smaller ones.

Wireless connectivity semiconductors maintain strong double-digit growth in health and fitness

Thu, 7 Jul 2014
Semiconductors providing wireless connectivity in health and fitness devices are set for solid double-digit growth in 2014 and beyond, especially as a clutch of wireless technologies make their way into a growing number of wearable devices.

Cambridge Nanotherm appoints Ralph Weir as CEO

Thu, 7 Jul 2014
Cambridge Nanotherm, a producer of semiconductor heatsink technology, today announced that it has appointed semiconductor industry veteran Ralph Weir as its CEO.

Cavium to acquire switching and SDN specialist Xpliant

Mon, 8 Aug 2014
Cavium, Inc., a provider of semiconductor products, announced an agreement to acquire Xpliant, Inc., a privately held company headquartered in San Jose, California.

Micron Technology appoints Stephen Pawlowski as Vice President of Advanced Computing Solutions

Mon, 8 Aug 2014
Micron Technology, Inc. today announced that Stephen Pawlowski has been named as vice president of Advanced Computing Solutions.

New material allows for ultra-thin solar cells

Mon, 8 Aug 2014
Extremely thin, semi-transparent, flexible solar cells could soon become reality.

Sensors, semiconductors, autonomous driving and regulation to drive ADAS revolution

Tue, 8 Aug 2014
In its recent market research report, ABI Research forecasts automotive camera sensor shipments to reach 197 million by 2020.

Global semiconductor industry on pace for record sales through first half of 2014

Tue, 8 Aug 2014
Sales up across every region and nearly all product categories compared to last year; Americas region shows strongest growth.

Taking great ideas from the lab to the fab

Tue, 8 Aug 2014
NSF and Intel support the development of domain-specific hardware to address health care needs.

Pfeiffer Vacuum joins the Facilities 450mm Consortium

Wed, 8 Aug 2014
The Facilities 450mm Consortium (F450C), a partnership of leading nanoelectronics facility companies guiding the effort to design and build the next-generation 450mm computer chip fabrication facilities, today announced it has again increased in size, naming Pfeiffer Vacuum as the twelfth member company to join the consortium.

SEMICON Taiwan 2014 to capitalize on growing market opportunities in Taiwan

Wed, 8 Aug 2014
Taiwan is forecast to have the largest regional semiconductor manufacturing equipment and materials capital expenditures in both 2014 and 2015.

SEMATECH and CNSE/SUNY launch new patterning center

Thu, 8 Aug 2014
SEMATECH and the newly merged SUNY College of Nanoscale Science and Engineering (CNSE) / SUNY Institute of Technology (SUNYIT) announced today they have launched their joint Patterning Center of Excellence.

GLOBALFOUNDRIES adds Bill Davidson as Chief Administrative Officer

Fri, 8 Aug 2014
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, announced today the addition of William “Bill” Davidson, Jr. as senior vice president and chief administrative officer (CAO), strengthening the company’s leadership team.

Nordson completes acquisition of Avalon Laboratories

Mon, 8 Aug 2014
Nordson Corporation today announced it has completed the acquisition of Los Angeles, California based Avalon Laboratories Holding Corp.

Strong growth in second quarter 2014 silicon wafer shipments

Tue, 8 Aug 2014
Worldwide silicon wafer area shipments increased during the second quarter 2014 when compared to first quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

SRC, UC Davis explore new materials and device structures to develop next-generation “Race Track Memory” technologies

Tue, 8 Aug 2014
University of California, Davis researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, are exploring new materials and device structures to develop next-generation memory technologies.

Notre Dame paper offers insights into a new class of semiconducting materials

Tue, 8 Aug 2014
A new paper by University of Notre Dame researchers describes their investigations of the fundamental optical properties of a new class of semiconducting materials known as organic-inorganic "hybrid" perovskites.

Pairing old technologies with new for next-generation electronic devices

Tue, 8 Aug 2014
UCL scientists have discovered a new method to efficiently generate and control currents based on the magnetic nature of electrons in semiconducting materials, offering a radical way to develop a new generation of electronic devices.

Eco-friendly "pre-fab nanoparticles" could revolutionize nano manufacturing

Wed, 8 Aug 2014
A team of materials chemists, polymer scientists, device physicists and others at the University of Massachusetts Amherst today report a breakthrough technique for controlling molecular assembly of nanoparticles over multiple length scales that should allow faster, cheaper, more ecologically friendly manufacture of organic photovoltaics and other electronic devices.

New test reveals purity of graphene

Wed, 8 Aug 2014
Graphene may be tough, but those who handle it had better be tender. The environment surrounding the atom-thick carbon material can influence its electronic performance, according to researchers at Rice and Osaka universities who have come up with a simple way to spot contaminants.

The growing semiconductor market in India

Thu, 8 Aug 2014
The semiconductor industry in India is estimated to grow from $10.02 billion in 2013 to $52.58 billion in 2020 at CAGR of 26.72%, according to Research and Markets new report the "Semiconductor Market in India 2014 - 2020."

Researchers prove stability of wonder material silicene

Fri, 8 Aug 2014
An international team of researchers has taken a significant step towards understanding the fundamental properties of the two-dimensional material silicene by showing that it can remain stable in the presence of oxygen.

STATS ChipPAC’s fcCuBE technology surpasses 100 million unit milestone

Wed, 8 Aug 2014
STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped over 100 million semiconductor packages with the company’s fcCuBE technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes.

ON Semiconductor completes acquisition of Aptina Imaging

Mon, 8 Aug 2014
ON Semiconductor today announced the completion of its acquisition of Aptina Imaging.

Gigaphoton unveils new function that enables 50% reduction of neon gas consumption for ArF immersion lasers

Mon, 8 Aug 2014
Gigaphoton Inc., a lithography light source manufacturer, today unveils a new function, called “eTGM,” available for its flagship high-output GT Series of ArF immersion laser products.

Riding the embedded software wave

Mon, 8 Aug 2014
Software that controls and powers embedded devices is playing a key role in making possible the highly integrated, multi-functional ‘smart’ devices we take for granted in our daily lives – from the ubiquitous smart phones/tablet to ‘smart’ home appliances and wearable electronics.

SmartPlay to offer design services for customers of Intel Custom Foundry

Tue, 8 Aug 2014
SmartPlay Inc., a design services company with expertise in digital, analog, wireless software and system design, announced that it is ready to offer design services to customers of Intel Custom Foundry that require expertise, know-how and unique IP in critical embedded applications.

Alpha and Omega Semiconductor announces promotion of Yifan Liang to CFO

Tue, 8 Aug 2014
Alpha and Omega Semiconductor Limited, a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today announced that the Board of Directors of AOS has promoted Mr. Yifan Liang, the Interim Chief Financial Officer, to serve as the Chief Financial Officer of AOS, effective immediately.

Promising ferroelectric materials suffer from unexpected electric polarizations

Tue, 8 Aug 2014
Electronic devices with unprecedented efficiency and data storage may someday run on ferroelectrics—remarkable materials that use built-in electric polarizations to read and write digital information, outperforming the magnets inside most popular data-driven technology.

Renesas Electronics expands portfolio of Simple Power Supply ICs

Wed, 8 Aug 2014
Renesas Electronics America, a leading supplier of advanced semiconductor solutions, today expands its portfolio of Simple Power Supply ICs, with innovative 16V input capable synchronous buck regulators that deliver up to 3A continuous current to loads at voltages as low as 0.8V.

MediaTek launches R&D center in Bengaluru

Wed, 8 Aug 2014
MediaTek today announced the establishment of a new research and development facility in Bengaluru, India.

Amkor Technology names David Watson to Board of Directors

Thu, 8 Aug 2014
Amkor Technology, Inc. today announced that David Watson has been appointed as a new member of the Company’s Board of Directors.

Intel and Unity Technologies announce collaboration

Thu, 8 Aug 2014
Intel Corporation and Unity Technologies today announced a strategic collaboration to advance the development of Android-based applications on Intel architecture.

Order activity for semiconductor equipment holds steady in July

Thu, 8 Aug 2014
North America-based manufacturers of semiconductor equipment posted $1.41 billion in orders worldwide in July 2014 (three-month average basis) and a book-to-bill ratio of 1.07, according to the July EMDS Book-to-Bill Report published today by SEMI.

A breakthrough in imaging gold nanoparticles to atomic resolution by electron microscopy

Fri, 8 Aug 2014
Nanometer-scale gold particles are intensively investigated for application as catalysts, sensors, drug delivery devices, biological contrast agents and components in photonics and molecular electronics.

SRC TECHCON 2014 Conference to feature speakers from GLOBALFOUNDRIES, LinkedIn, High Point University

Mon, 8 Aug 2014
The TECHCON 2014 conference hosted by Semiconductor Research Corporation (SRC), the university-research consortium for semiconductors and related technologies, will feature immediate past GLOBALFOUNDRIES CEO Ajit Manocha among the list of executive speakers at the Sept. 7-9 annual event.

ESI appoints new board member

Mon, 8 Aug 2014
Electro Scientific Industries, Inc., a supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced that Richard H. Wills, former Chairman and Chief Executive Officer of Tektronix, Inc., was appointed to the company’s Board of Directors.

JEDEC releases LPDDR4 Standard for low power memory devices

Mon, 8 Aug 2014
JEDEC Solid State Technology Association today announced the publication of JESD209-4 Low Power Double Data Rate 4 (LPDDR4).

Fairchild Semiconductor to close two facilities, cutting 15% of workforce

Mon, 8 Aug 2014
Fairchild Semiconductor, a supplier of high performance power and mobile products, today announced it will eliminate its internal five-inch and significantly reduce six-inch wafer fabrication lines.

New ClassOne electroplater a "sellout" at SEMICON West

Mon, 8 Aug 2014
When ClassOne Technology introduced its new Solstice electroplating systems at SEMICON West last month they didn’t expect to actually sell their first production unit off the show floor, but that’s what happened.

Plastic electronics: Opportunity on the edge of commercialization

Wed, 8 Aug 2014
The Plastics Electronics Conference and Exposition will co-locate with SEMICON Europa. Plastic Electronics 2014 (PE 2014) is themed “Enabling Applications beyond Limits in Electronics” and will be held at Alpexpo in Grenoble on 7-9 October.

Lean strategies and decentralized value chains fuel RFID uptake in manufacturing

Wed, 8 Aug 2014
New analysis from Frost & Sullivan, Analysis of the Global RFID in Manufacturing Market, finds that the market earned revenues of $1.29 billion in 2013 and estimates this to nearly quadruple to $4.99 billion in 2020.

Scientists craft a semiconductor only three atoms thick

Wed, 8 Aug 2014
Scientists have developed what they believe is the thinnest-possible semiconductor, a new class of nanoscale materials made in sheets only three atoms thick.

Competition for graphene

Wed, 8 Aug 2014
A new argument has just been added to the growing case for graphene being bumped off its pedestal as the next big thing in the high-tech world by the two-dimensional semiconductors known as MX2 materials.

Vietnam Semiconductor Strategy Summit —keynotes and highlights announced

Thu, 8 Aug 2014
SEMI today announced the keynotes for the 2nd Vietnam Semiconductor Strategy Summit(September 16-17), an executive conference focused on Vietnam’'s growing role in the global semiconductor industry.

A new, tunable device for spintronics

Fri, 8 Aug 2014
An international team of scientists including physicist Jairo Sinova from the University of Mainz realises a tunable spin-charge converter made of GaAs.

Copper shines as flexible conductor

Fri, 8 Aug 2014
Bend them, stretch them, twist them, fold them: modern materials that are light, flexible and highly conductive have extraordinary technological potential, whether as artificial skin or electronic paper.

UMC joins Fujitsu's new foundry company

Fri, 8 Aug 2014
United Microelectronics Corporation and Fujitsu Semiconductor Limited today announced an agreement for UMC to become a minority shareholder of a newly formed subsidiary of Fujitsu Semiconductor that will include its 300mm wafer manufacturing facility located in Kuwana, Mie, Japan.

Semiconductor and circuit manufacturing: one of the top export industries in the United States

Tue, 9 Sep 2014
Although operators will continue to face strong international competition, new opportunities in next-generation semiconductors and electronic inputs will encourage operators to invest in product development.

MEI Wet Processing Systems reveals performance data for new critical etch system

Tue, 9 Sep 2014
MEI Wet Processing Systems and Services revealed performance data today on its newly released Cu & TiW Critical Etch System for compound semiconductor manufacturing.

SUNY CSNE to use yield management software from Rudolph Technologies

Tue, 9 Sep 2014
Rudolph Technologies, Inc. announced today that the SUNY College of Nanoscale Science and Engineering (CNSE), Albany, NY, has selected its Discover Enterprise Yield Management Software (YMS) to provide an integrated data warehouse and analytics system for the Global 450 Consortium (G450C) equipment development program.

IDC lowers tablet projections for 2014 as demand in mature markets levels off

Tue, 9 Sep 2014
Following a second consecutive quarter of softer than expected demand, International Data Corporation (IDC) has lowered its worldwide tablet plus 2-in-1 forecast for 2014 to 233.1 million units.

Breakthrough in light sources for new quantum technology

Tue, 9 Sep 2014
Electronic circuits are based on electrons, but one of the most promising technologies for future quantum circuits are photonic circuits, i.e. circuits based on light (photons) instead of electrons.

SEMICON Taiwan 2014 opens today with spotlight on 3D-IC, sustainable manufacturing, and MEMS

Wed, 9 Sep 2014
Taiwanese chipmakers, LED manufacturers, and Outsourced Semiconductor Assembly and Test (OSAT) firms will spend firm nearly $24 billion in the next two years on equipment and materials, powering excitement for SEMICON Taiwan 2014, which opened today in Taipei.

Edwards marks milestone with 1,000th shipment of EZENITH system

Wed, 9 Sep 2014
Edwards Limited announced today that it has marked an important milestone with the shipment of its 1,000th EZENITH integrated vacuum and exhaust management system, which will ship to a US-based semiconductor manufacturing fab in October 2014.

Credo Semiconductor appoints Jeff Twombly as Vice President of Sales and Business Development

Wed, 9 Sep 2014
Credo Semiconductor today announced the appointment of Jeff Twombly as vice president of sales and business development.

Samsung adopts ProPlus Designs' 14nm finFET process

Wed, 9 Sep 2014
ProPlus Design Solutions, Inc. today announced Samsung Electronics has extended its partnership with ProPlus through the deployment of ProPlus' BSIMProPlus modeling platform for its 14-nanometer (nm) FinFET SPICE modeling.

Shinichi Machida named President and CEO of Fujitsu Semiconductor America

Thu, 9 Sep 2014
Fujitsu Semiconductor America (FSA) today announced that Shinichi "James" Machida, who led the company from late 2008 until spring of 2011, has been named as the new president and CEO of FSA.

Contour Semiconductor awarded three new U.S. patents

Thu, 9 Sep 2014
Contour Semiconductor, Inc., a developer of non-volatile memory technologies, today announced it has been awarded three new patents to back its Diode Transistor Memory (DTM) technology, the world's lowest production-cost, non-volatile memory technology.

GLOBALFOUNDRIES adds Louis Lupin as Chief Legal Officer

Thu, 9 Sep 2014
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, announced today that Louis “Lou” Lupin has joined the company as senior vice president and chief legal officer.

UCSB researchers develop ultra sensitive biosensor from molybdenite semiconductor

Thu, 9 Sep 2014
Move over, graphene. An atomically thin, two-dimensional, ultrasensitive semiconductor material for biosensing developed by researchers at UC Santa Barbara promises to push the boundaries of biosensing technology in many fields, from health care to environmental protection to forensic industries.

GaAs device market posts record revenues in 2013

Fri, 9 Sep 2014
Ongoing growth in cellular and Wi-Fi applications will continue to drive GaAs device revenues higher.

RFMD shareholders approve merger with TriQuint Semiconductor

Fri, 9 Sep 2014
RF Micro Devices, Inc. today announced the preliminary results of its special meeting of shareholders held earlier this morning to approve its agreement and plan of merger and reorganization with TriQuint Semiconductor, Inc.

Sidense demonstrates working one-time programmable bit cells in TSMC 16nm finFET technology

Fri, 9 Sep 2014
Sidense Corp., a developer of non-volatile memory OTP IP cores, today announced that it successfully demonstrated read and write capability for its 1T-OTP bit-cell architecture on test silicon fabricated in a 16nm CMOS FinFET process.

Altis Semiconductor and TSI Semiconductor join online multi-project wafer quote system

Fri, 9 Sep 2014
eSilicon Corporation, an independent semiconductor design and manufacturing solutions provider, today announced the addition of two foundries -- Altis Semiconductor and TSI Semiconductor -- to its automated, instant online quote system for multi-project wafer (MPW) shuttles.

GaN continues to move microwave RF power semiconductor markets to over $300M by 2019

Mon, 9 Sep 2014
Spending on microwave RF power semiconductors continues to tick upward as the availability of new gallium nitride (GaN) devices for 4 to 18GHz becomes more pervasive.

Layered graphene sandwich for next generation electronics

Mon, 9 Sep 2014
Sandwiching layers of graphene with white graphene could produce designer materials capable of creating high-frequency electronic devices, University of Manchester scientists have found.

Doped graphene nanoribbons with potential

Mon, 9 Sep 2014
Researchers from Empa and the Max Planck Institute for Polymer Research have now developed a new method to selectively dope graphene molecules with nitrogen atoms.

Gas applications in lithography

Mon, 9 Sep 2014
Lithography is a key enabling process with very demanding requirements. Shrinking feature sizes will raise the bar even further.

NSF and SRC announce research awards to 10 universities

Tue, 9 Sep 2014
The National Science Foundation (NSF) and Semiconductor Research Corporation (SRC) today announced nine research awards to 10 universities totaling nearly $4 million under a joint program focused on Secure, Trustworthy, Assured and Resilient Semiconductors and Systems (STARSS).

10nm success depends on concurrent design and development

Mon, 9 Sep 2014
The Prophets of Doom greet every new process node with a chorus of dire warnings about the end of scaling, catastrophic thermal effects, parasitics run amok and . . . you know the rest.

SEMI wins request for etch equipment export control review

Tue, 9 Sep 2014
Major milestone in longstanding push to remove etch equipment from U.S. export control list.

Second quarter 2014 semi equipment billings 28% higher than 2013 second quarter

Tue, 9 Sep 2014
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 9.62 billion in the second quarter of 2014.

GLOBALFOUNDRIES and SRC announce new scholarship for undergraduate engineering students

Tue, 9 Sep 2014
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced the “GLOBALFOUNDRIES Undergraduate Research Scholarship,” a new scholarship recognizing and rewarding aspiring, leadership-oriented engineering students interested in careers in the semiconductor industry.

New Swedish manufacturer of advanced deposition equipment for wide band gap semiconductor materials

Tue, 9 Sep 2014
A new company, Epiluvac AB, has entered the scene with the ambition to supply the needed deposition equipment.

Fermilab implements Ziptronix's DBI hybrid bonding in high-end 3D image sensors

Tue, 9 Sep 2014
Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.

Rigorously tuned compact models: Extending predictive models to full-chip

Tue, 9 Sep 2014
Fast and predictive 3D resist compact models are needed for OPC applications. A methodology to build such models is described, starting from a 3D bulk image, and including resist interface effects such as diffusion.

A fundamental truth of process control

Tue, 9 Sep 2014
You can’t fix what you can’t find. You can’t control what you can’t measure.

Equipment spending shows strong growth for 2014 and 2015

Wed, 9 Sep 2014
Front End fab equipment spending is projected to increase up to another 20 percent in 2015 to US$ 42 billion.

The semiconductor industry: Out in front, but lagging behind

Wed, 9 Sep 2014
Capital equipment suppliers must provide advanced analytical systems that leverage data generated by their tools to help their fab customers address the challenges of Big Data and advanced analytics.

SEMI advocates for the industry in Washington

Wed, 9 Sep 2014
With changes coming in Washington, SEMI has important work ahead supporting the innovators and job creators of this country.

The significance of IBM's EUV benchmark

Mon, 9 Sep 2014
IBM’s NXE3300B scanner, at the EUV Center of Excellence in Albany, recently completed a “40W” EUV light source upgrade.

Beautiful, brilliant people

Wed, 9 Sep 2014
It would be difficult to overstate how critical the development of a workable, high volume manufacturing EUV lithography solution is to the semiconductor industry.

Lithography: What are the alternatives to EUV?

Mon, 9 Sep 2014
Hopes remain high for EUV, but long delays has caused attention to shift to various alternatives.

Outlook: Healthy equipment spending into 2015

Wed, 9 Sep 2014
The general consensus for the semiconductor industry is for this year’s positive trend to continue into 2015 as both revenue growth and unit shipment growth are expected to be in the mid- to high- single digit range.

SiC power device advantages enhance power conversion systems

Mon, 3 Mar 2014
Compared to silicon, SiC has ten times the dielectric breakdown field strength, three times the bandgap and three times the thermal conductivity.

eBeam Initiative Survey indicates new eBeam expectations for photomask production

Tue, 9 Sep 2014
Continued semiconductor scaling drives new mask design requirements; use of complex mask shapes predicted to increase

Element Six selected by European Consortium as a partner to develop ultrafast pulse disk lasers

Tue, 9 Sep 2014
Element Six today announced it has been selected by the European Commission’s Seventh Framework Programme for Research and Technological Development to help develop a new ultrafast pulse disk laser.

Veeco Ion Beam Deposition technology reaches significant milestone to support EUV commercialization roadmap

Wed, 9 Sep 2014
Veeco Instruments Inc. announced today that its new Odyssey Ion Beam Deposition (IBD) Upgrade for the NEXUS IBD-LDD System has repeatedly produced photomask blanks with zero deposition defects larger than 70nm.

David Bell joins Triad Semiconductor's Board of Directors

Wed, 9 Sep 2014
Triad Semiconductor, Inc. today announced that David B. Bell former President & CEO of Intersil and former President of Linear Technology Corporation was appointed to the company's board of directors.

SEMI releases second quarter 2014 worldwide PV equipment market statistics report

Thu, 9 Sep 2014
Worldwide billings increased to $319 million in Q2 2014, an increase of 33 percent from the prior quarter but 11 percent below the same quarter a year ago.

Rudolph introduces new acoustic metrology and defect inspection technology

Thu, 9 Sep 2014
Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).

Mentor Graphics appoints Vice President for Embedded Technologies

Thu, 9 Sep 2014
Mentor Graphics Corp. today announced the appointment of Glenn Perry to the role of vice president of the company's Embedded Systems Division.

Samsung now mass producing industry’s first 20nm 6Gb LPDDR3 mobile DRAM

Thu, 9 Sep 2014
The new mobile memory chip will enable longer battery run-time and faster application loading on large screen mobile devices with higher resolution.

Making quantum dots glow brighter

Thu, 9 Sep 2014
Ultrathin layers of metal oxides can change the way quantum dots behave, in some cases turning them into more efficient light emitters.

For electronics beyond silicon, a new contender emerges

Thu, 9 Sep 2014
Silicon has few serious competitors as the material of choice in the electronics industry. Yet transistors, the switchable valves that control the flow of electrons in a circuit, cannot simply keep shrinking to meet the needs of powerful, compact devices; physical limitations like energy consumption and heat dissipation are too significant.

EMCORE Corporation announces CEO transition plan

Thu, 9 Sep 2014
EMCORE Corporation, a provider of compound semiconductor-based components and subsystems for the fiber optic and space solar power industries, today announced a transition plan of its Chief Executive Officer position in connection with the announced sale of its Space Photovoltaics business.

ProPlus Design Solutions expands sales operations to Europe

Thu, 9 Sep 2014
ProPlus Design Solutions, Inc. announced today it expanded its sales operations to Europe.

North American semiconductor equipment industry posts August 2014 book-to-bill ratio of 1.04

Thu, 9 Sep 2014
A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

Photonics community celebrates bipartisan passage of Revitalizing American Manufacturing and Innovation Act

Fri, 9 Sep 2014
Photonics community leaders including SPIE, the international society for optics and photonics, are celebrating bipartisan passage by the U.S. House of Representatives of a bill designed to stimulate development and commercialization of new technologies and promote growth of high-value jobs.

Northeastern University researchers develop novel method for working with nanotubes

Fri, 9 Sep 2014
Northeastern University researchers have developed a novel method for controllably constructing precise inter-nanotube junctions and a variety of nanocarbon structures in carbon nanotube arrays.

Physicists heat freestanding graphene to control curvature of ripples

Mon, 9 Sep 2014
An international team of physicists, led by a research group at the University of Arkansas, has discovered that heating can be used to control the curvature of ripples in freestanding graphene.

NANIUM launches the industry’s largest WLCSP in volume production

Tue, 9 Sep 2014
NANIUM today announced it has successfully launched the industry’s largest Wafer-Level Chip Scale Package (WLCSP) in volume.

KYOCERA joins imec’s industrial affiliation program on advanced silicon solar cell technology

Tue, 9 Sep 2014
Belgian nanoelectronics research centre imec and Kyocera Corporation announced today that Kyocera, the Japanese high-tech electronics company and manufacturer of photovoltaic (PV) cells, modules and systems, has joined imec’s industrial affiliation program (IIAP) to advance next-generation crystalline silicon solar cells.

SEMI forms new Tablet Working Group

Wed, 9 Sep 2014
When you say the word sapphire most people think of a brilliant blue gemstone. The members that have formed the Tablet Working Group think of sapphire as a key enabler of future growth for their respective businesses.

Future flexible electronics based on carbon nanotubes

Wed, 9 Sep 2014
Study in Applied Physics Letters show how to improve nanotube transistor and circuit performance with fluoropolymers

Flexible LEDs

Wed, 9 Sep 2014
Flexible light-emitting diode (LED) displays and solar cells crafted with inorganic compound semiconductor micro-rods are moving one step closer to reality, thanks to graphene and the work of a team of researchers in Korea.

Southampton scientists grow a new challenger to graphene

Wed, 9 Sep 2014
A team of researchers from the University of Southampton's Optoelectronics Research Centre (ORC) has developed a new way to fabricate a potential challenger to graphene.

Honeywell advanced materials help mobile devices dissipate heat

Thu, 9 Sep 2014
Honeywell Electronic Materials announced today that its advanced materials are being integrated into the production of tablets and smartphones, helping them stay cool and perform better.

New discovery could pave the way for spin-based computing

Fri, 9 Sep 2014
A University of Pittsburgh research team has discovered a way to fuse these two distinct properties in a single material, paving the way for new ultrahigh density storage and computing architectures.

Silicon Motion elects Han-Ping Shieh to Board of Directors

Fri, 9 Sep 2014
Mr. Shieh will replace Mr. Kenneth Kuan-Min Lin, who had chosen not to stand for reelection to the Board of Directors in order to focus more on his venture capital and other activities.

TSMC delivers first fully functional 16 finFET networking processor

Mon, 9 Sep 2014
TSMC today announced that its has successfully produced the foundry segment's first fully functional ARM-based networking processor with FinFET technology, through its collaboration with HiSilicon Technologies Co, Ltd.

United States photomask market to reach around $475M by 2019

Mon, 9 Sep 2014
According to the recently published TechSci Research report, "United States Photomask Market Forecast & Opportunities, 2019", the photomask market in the United States is forecast to reach $474.58 billion by 2019.

Tessera Technologies names Craig Mitchell as CTO and president of Invensas

Mon, 9 Sep 2014
Tessera Technologies, Inc. today announced it has named Craig Mitchell as chief technology officer for Tessera and president of Invensas Corporation, effective immediately.

Gigaphoton introduces "eGrycos" for ArF immersion lasers

Mon, 9 Sep 2014
Gigaphoton Inc., a lithography light source manufacturer, announced today that it has completed development of an electricity-reduction technology for its flagship “GT Series” of argon fluoride (ArF) immersion lasers used for semiconductor lithography processing.

Kurita, SEMATECH partner on wafer surface contamination and cleaning technology in semiconductor processing

Tue, 9 Sep 2014
SEMATECH, the global consortium of chipmakers, announced today that Kurita Water Industries Limited has partnered with SEMATECH to develop innovative technologies for low defectivity ultrapure water (UPW) applications used in semiconductor manufacturing.

A new dimension for integrated circuits: 3D nanomagnetic logic

Tue, 9 Sep 2014
Electrical engineers at the Technische Universität München (TUM) have demonstrated a new kind of building block for digital integrated circuits.

New technology may lead to prolonged power in mobile devices

Tue, 9 Sep 2014
Researchers from The University of Texas at Dallas have created technology that could be the first step toward wearable computers with self-contained power sources or, more immediately, a smartphone that doesn’t die after a few hours of heavy use.

All directions are not created equal for nanoscale heat sources

Wed, 10 Oct 2014
Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths.

SEMICON Japan features "World of IoT"

Wed, 10 Oct 2014
Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs.

Boston Semi Equipment creates industry's largest independent ATE organization

Wed, 10 Oct 2014
Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name.

FlipChip International creates 250 multi-product wafer bump designs

Wed, 10 Oct 2014
FlipChip International (FCI), the global technology leader in flip chip bumping and advanced wafer level packaging, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013.

Dow Corning releases new 150mm SiC wafers

Thu, 10 Oct 2014
Dow Corning, a developer of silicon and wide-bandgap semiconductor technology, announced that it now offers 150mm diameter silicon carbide (SiC) wafers under its Prime Grade portfolio.

Photomask Technology speaker says EUV is nearly production-ready

Fri, 10 Oct 2014
Highlights at the recent SPIE Photomask Technology 2014 conference included a confident announcement from ASML about current EUV source capabilities, an insightful industry-expert panel discussion on mask-making complexities, and fresh energy from the co-located SPIE Scanning Microscopies conference.

Silicon Cloud International launches semiconductor collaborative platform in Singapore

Fri, 10 Oct 2014
Silicon Cloud International (SCI), a provider of secure and private cloud computing infrastructure, announced today successful pilot program launch of its semiconductor workflow platform in Singapore.

Crumpled graphene could provide an unconventional energy storage

Fri, 10 Oct 2014
Two-dimensional carbon 'paper' can form stretchable supercapacitors to power flexible electronic devices.

Europe: Strong growth in chip equipment spending in 2015

Mon, 10 Oct 2014
Global capital spending on semiconductor equipment is projected to grow 21.1 percent in 2014 and 21.0 percent in 2015.

EV Group unveils room-temperature covalent bonder

Mon, 10 Oct 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 580 ComBond.

Adoption of SiC & GaN to directly impact the power electronics industry

Mon, 10 Oct 2014
Emergence of new wide bandgap (WBG) technologies such as SiC and GaN materials will definitely reshape part of the established power electronics industry, according to Yole Développement (Yole).

Global semiconductor sales continue to climb in August

Mon, 10 Oct 2014
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $28.4 billion for the month of August 2014.

SEMI announces rising annual silicon wafer shipment forecast

Tue, 10 Oct 2014
SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2014-–2016.

Samsung to invest $14.7B in new semiconductor fab

Tue, 10 Oct 2014
Samsung Electronics announced plans on Monday to invest $14.7 billion (15.6 trillion Korean won) in a new semiconductor fabrication facility in Pyeongtaek, South Korea.

Albert Theuwissen of Harvest Imaging honored with European SEMI Award 2014

Wed, 10 Oct 2014
Albert Theuwissen, CEO of Harvest Imaging and professor at Delft University of Technology, is the recipient of the European SEMI Award 2014.

Altera CEO John Daane to receive Robert N. Noyce Award

Wed, 10 Oct 2014
The Semiconductor Industry Association announced that John P. Daane, President, CEO, and Chairman of the Board of Altera, has been named the 2014 recipient of SIA's highest honor, the Robert N. Noyce Award.

UMC announce joint venture for a 12" fab in China

Thu, 10 Oct 2014
The Board of Directors of United Microelectronics Corporation, a global semiconductor foundry, today announced a joint venture company focused on 12" wafer foundry services with Xiamen Municipal People's Government and FuJian Electronics & Information Group.

China's wafer foundry market: 15% growth in 2014

Thu, 10 Oct 2014
The wafer foundry market experienced a wavy development, jumping by 39.4 percent in 2010 following a 7.9 percent decline in 2009.

Mentor Graphics wins $36M in patent infringement suit

Mon, 10 Oct 2014
A Portland, Oregon jury today delivered a verdict in favor of Mentor Graphics in a patent infringement trial against Synopsys, Inc., awarding Mentor Graphics $35 million in damages and royalties.

A novel platform for future spintronic technologies

Mon, 10 Oct 2014
Scientists at EPFL, working with Université Paris-Sud and Paul Scherrer Institut, have discovered that a common insulating material behaves as a perfect spintronic conductor because it is not affected by background electron charge.

EUV and mask complexity

Mon, 10 Oct 2014
EUV and mask complexity were the hot topics at this year’s SPIE Photomask Technology conference in Monterey, Calif.

Threshold voltage tuning for 10nm and beyond CMOS integration

Mon, 10 Oct 2014
A novel metal gate integration scheme to achieve precise threshold voltage (VT) control for multiple VTs is described.

Managing oxide growth on in-process storage wafers for cost and yield impact

Mon, 10 Oct 2014
A system is described that mitigates unintended oxide growth for bare wafers while in-process storage and potentially post process at tools using nitrogen purge.

Semiconductor market in India is expected to reach US$ 52.58B by 2020

Tue, 10 Oct 2014
India has a very large industry base of electronics items, but there is little manufacturing base for semiconductors.

IRLYNX and CEA-Leti to streamline new CMOS-based infrared sensing modules

Wed, 10 Oct 2014
IRLYNX and CEA-Leti today announced they have launched a technology-development partnership for a new CMOS-based infrared technology that will allow a new type of smart and connected detectors in buildings and cities.

The mystery of reed relays: Understanding specifications

Wed, 10 Oct 2014
Specifications of reed relays, which are used for current switching in ATE and other applications are explained, including carry current, lifetime, minimum switch capacity, hot switching, operating speed and thermoelectric switching.

Element Six introduces new thermal grade of CVD diamond

Wed, 10 Oct 2014
Element Six this week announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD), DIAFILM TM130.

Qualcomm to acquire CSR

Thu, 10 Oct 2014
Qualcomm today announced that it has reached agreement with CSR regarding the terms of a recommended cash acquisition of CSR will be acquired by Qualcomm Global Trading Pte. Ltd.

Intel and IBM to lay out 14nm FinFET strategies on competing substrates at IEDM 2014

Thu, 10 Oct 2014
The development of increasingly sophisticated and energy-efficient CMOS technology for mobile, client and cloud computing depends on a continuing stream of advances in the process technologies with which the complex integrated circuits are built.

Intermolecular appoints Dr. Bruce McWilliams as President and CEO

Thu, 10 Oct 2014
Intermolecular, Inc. announced this week that Dr. Bruce McWilliams has been appointed president and chief executive officer.

SK Hynix Memory Solutions opens office in Longmont, Colorado

Tue, 11 Nov 2014
SK Hynix Memory Solutions (SKHMS), a provider of NAND flash solutions, today announced the opening of its new engineering development center in Longmont, Colorado.

Growing momentum in semiconductor manufacturing in Vietnam

Fri, 10 Oct 2014
The 2nd annual SEMI Vietnam Semiconductor Strategy Summit, co-organized with the Saigon Hi-Tech Park and with FabMax as the premier sponsor, was held September 16-17, 2014 in Ho Chi Minh City.

Semiconductor “dust” enables low cost solar cells, LEDs

Fri, 10 Oct 2014
The U.S. Patent Office has issued US Patent No. 8,859,310 to Versatilis LLC that shows how fine semiconductor particles, powders or fines, often the waste byproduct of dicing semiconductor wafers into ever smaller chips, can be processed into a sea of low cost solar cells or micro-LEDs.

Canadian semiconductor manufacturing industry revenue expected to decline 8% in 2014

Fri, 10 Oct 2014
Industry manufacturers, which are typically small- to mid-sized enterprises, will find it difficult to match the research and development (R&D) spending of multinational competitors.

IBM to pay GlobalFoundries $1.5B to take over chip fabs

Mon, 10 Oct 2014
IBM and GLOBALFOUNDRIES today announced that GLOBALFOUNDRIES will acquire IBM's global commercial semiconductor technology business.

Semiconductor equipment book-to-bill declines in September

Tue, 10 Oct 2014
While order activity moderated, equipment spending this year is expected to be robust and remain on pace for double-digit year-over-year growth.

Gigaphoton achieves 3-hour continuous operation of EUV light source

Tue, 10 Oct 2014
Gigaphoton Inc. announced today that it has succeeded in achieving 3-hour continuous operation of its prototype LPP EUV light source at 50 percent duty cycle and 42-W output, equivalent to usage in a high-volume-manufacturing (HVM) environment.

Special UO microscope captures defects in nanotubes

Tue, 10 Oct 2014
University of Oregon chemists have devised a way to see the internal structures of electronic waves trapped in carbon nanotubes by external electrostatic charges.

Lam Research ships 100th Syndion etch module

Tue, 10 Oct 2014
Lam Research Corp., a global supplier of wafer fabrication equipment and services to the semiconductor industry, today announced it has shipped the 100th Syndion module for deep silicon etch applications.

Samsung starts mass production of 8Gb DDR4 based on 20nm process technology

Wed, 10 Oct 2014
Samsung today announced that it is mass producing the industry’s most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers.

EUV light source developer Adlyte achieves key performance milestone for high-volume manufacturing

Wed, 10 Oct 2014
Adlyte Inc., a developer of high-brightness extreme light sources for advanced semiconductor inspection and metrology applications, today announced it has reached a key performance benchmark for its extreme ultraviolet (EUV) light source for high-volume manufacturing (HVM)-readiness.

Mergers, acquisitions reshape the automotive semi supplier landscape

Wed, 10 Oct 2014
Capped by last week’s announcement that Qualcomm Inc. would buy CSR PLC, the automotive semiconductor industry recently has been undergoing a wave of merger and acquisition (M&A) activity that has shaken up the competitive order of the market.

SMIC and Maxscend collaborate on 55nm RF IP platform

Thu, 10 Oct 2014
Semiconductor Manufacturing International Corporation and Maxscend Technologies Inc., a RF IP company based in China, announced that Maxscend Bluetooth RF IP has been silicon proven on SMIC's 55nm low leakage logic process.

KLA-Tencor reveals 'leveraged recapitalization' plan and an expanded stock repurchase program

Fri, 10 Oct 2014
Yesterday, KLA-Tencor announced a plan to significantly accelerate its strategy to drive stockholder returns.

SMIC and ASML sign volume purchase agreement

Mon, 10 Oct 2014
Semiconductor Manufacturing International Corporation and ASML Holding N.V. announce the signing of a volume purchase agreement that will provide SMIC with lithography systems from ASML.

Intersil announces appointment of industry executives to board of directors

Tue, 10 Oct 2014
Intersil Corporation, a provider of innovative power management and precision analog solutions, today announced the appointment of two accomplished executives to its board of directors, bringing the total number of independent directors to nine.

Novel integration of known technologies to reduce cost in 450mm manufacturing

Mon, 7 Jul 2014
A collaborative demonstration at G450C proactively trials and examines a solution to reduce cost for higher flows.

UMC enters volume production for Lantiq's Communication ICs

Tue, 10 Oct 2014
United Microelectronics Corporation, a global semiconductor foundry, and Lantiq, a supplier of broadband access and home networking technologies, today announced that UMC has entered volume production for Lantiq's SPT170 high voltage Power Management ICs.

TSMC, Kilopass deliver non-volatile memory for the 16nm finFET process node

Tue, 10 Oct 2014
Kilopass Technology Inc., a provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), announced today that it has successfully ported its one-time programmable (OTP) NVM technology to TSMC's 16 nanometer (nm) FinFET process.

MegaChips to acquire SiTime for $200M

Wed, 10 Oct 2014
SiTime Corporation, a MEMS and analog semiconductor company, today announced that it has signed a definitive agreement under which MegaChips Corporation, a top 25 fabless semiconductor company based in Japan, will acquire SiTime for $200 million in cash.

SEMICON Japan 2014: New venue and new ideas for rebounding industry

Wed, 10 Oct 2014
Today, SEMI announced an exceptional lineup of speakers for SEMICON Japan’s Opening Day — Accenture, Applied Materials, ARM, IBM Japan, Intel K.K., NIICT, Scripps, Toshiba, and Toyota.

Synopsys announces availability of DesignWare, non-volatile memory IP for TowerJazz 180nm process technology

Thu, 10 Oct 2014
Synopsys, Inc. today announced the availability of the silicon-proven DesignWare AEON Few Time Programmable (FTP) Trim Non-Volatile Memory (NVM) IP for TowerJazz 180-nanometer (nm) SL process technology.

SEMI extends ASMC Call for Papers deadline to November 10

Thu, 10 Oct 2014
SEMI announced today that the deadline for presenters to submit an abstract for the 26th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 10.

Solar glass price plunge to cease as trade sanctions take effect

Mon, 11 Nov 2014
After falling by about 50 percent from 2009 through 2014, pricing for solar glass is set to commence a rebound starting next year, as anti-dumping duties levied by the European Union go into effect on Chinese suppliers.

Global semiconductor industry posts highest-ever quarterly sales

Mon, 11 Nov 2014
Global sales for the month of September 2014 reached $29 billion, 8 percent higher than the September 2013 total of $26.9 billion and 1.9 percent more than last month's total of $28.5 billion.

Imec presents back-side illuminated CMOS image sensor with UV-optimized antireflective coating

Tue, 11 Nov 2014
At this week’s VISION 2014 exhibition, imec presents a backside-illuminated (BSI) CMOS image sensor chip featuring a new anti-reflective coating (ARC) optimized for UV light.

Better bomb-sniffing technology

Tue, 11 Nov 2014
University of Utah engineers have developed a new type of carbon nanotube material for handheld sensors that will be quicker and better at sniffing out explosives, deadly gases and illegal drugs.

'Nanomotor lithography' answers call for affordable, simpler device manufacturing

Tue, 11 Nov 2014
Nanoengineers at the University of California, San Diego recently invented a new method of lithography in which nanoscale robots swim over the surface of light-sensitive material to create complex surface patterns that form the sensors and electronics components on nanoscale devices.

2014 Global Semiconductor Alliance Award nominees announced

Tue, 11 Nov 2014
The Global Semiconductor Alliance (GSA) is pleased to announce the 2014 award nominees for the GSA Awards Dinner Celebration taking place on Thursday, December 11, 2014, at the Santa Clara Convention Center in Santa Clara, Calif.

Reno Sub-Systems closes first venture round with Intel Capital, Innovacorp and other investors

Wed, 11 Nov 2014
Reno Sub-Systems (Reno) today announced that it has closed its first venture funding round with Intel Capital, early stage Canadian venture capital organization Innovacorp and other investors.

Tetsuro Higashi to receive the SEMI Sales and Marketing Excellence Award

Wed, 11 Nov 2014
SEMI today announced that Tetsuro (Terry) Higashi, chairman, president and CEO of Tokyo Electron Limited (TEL), has been selected as the 2015 recipient of the SEMI Sales and Marketing Excellence Award, inspired by the late Bob Graham.

Clearing a path for electrons in polymers: Closing in on the speed limits

Wed, 11 Nov 2014
Researchers from the University of Cambridge have identified a class of low-cost, easily-processed semiconducting polymers which, despite their seemingly disorganised internal structure, can transport electrons as efficiently as expensive crystalline inorganic semiconductors.

GLOBALFOUNDRIES and INVECAS introduce new dedicated design service partner for leading-edge technologies

Thu, 11 Nov 2014
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing, design and technology solutions, today announced a partnership with INVECAS Inc.

Focus on technology challenges at SEMICON Japan 2014

Thu, 11 Nov 2014
Presentations by Accenture Japan, Scripps, Toyota and ARM, were announced today for SEMICON Japan 2014, the largest exhibition in Japan for semiconductor manufacturing and related processing technology.

SEMATECH names Ronald Goldblatt permanent CEO

Fri, 11 Nov 2014
SEMATECH, the global consortium of semiconductor manufacturers, today announced that Dr. Ronald Goldblatt has been named President and Chief Executive Officer by the company’s Board of Directors, effective immediately. Dr. Goldblatt has served as acting President and Chief Executive Officer since April 2014.

New process isolates promising material

Tue, 11 Nov 2014
Molybdenum disulfide has emerged as a leading successor to graphene.

Graphene Frontiers secures patent for commercial-scale material production

Fri, 11 Nov 2014
Graphene Frontiers LLC, a developer of graphene materials and device technology, announces the issuance of a key industry patent.

Applied Materials develops advanced patterning solution for memory devices

Mon, 11 Nov 2014
Applied Materials, Inc. today announced it collaborated with Samsung Electronics Co., Ltd. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.

Double-digit growth: Record sales to shake up Top 20 semi supplier ranking

Mon, 11 Nov 2014
TSMC, MediaTek, and SK Hynix’s sales are each expected to jump by >20% this year.

Internet of Things: Resolution of key challenges enables mass implementation in the future

Mon, 11 Nov 2014
The influx of wireless technologies and intelligent devices has resulted in the rapid evolution of the Internet of Things (IoT), a disruptive cross industry force expected to transform the manufacturing value chain into a state of hyper-connectivity.

On-demand conductivity for graphene nanoribbons

Mon, 11 Nov 2014
New research may help to develop graphene-based electronic devices that only become conductors when an external ultra-short pulse is applied, and are otherwise insulators.

$1,000,000 "Challenge Grant" goal achieved for SEMI high tech industry workforce development

Tue, 11 Nov 2014
With generous “Morgan Challenge Matchmaker” contributions, the SEMI Foundation recently reached its goal of $1 million for workforce development.

Qualcomm joins SRC’s Trustworthy and Secure Semiconductors and Systems Initiative

Tue, 11 Nov 2014
Semiconductor Research Corporation (SRC) today announced that Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated, has joined SRC’s Trustworthy and Secure Semiconductors and Systems (T3S) program.

Freescale and Intel processors now active at Rochester Electronics

Tue, 11 Nov 2014
Rochester Electronics, a fully-authorized manufacturer and distributor of semiconductors, will launch 2015 with the re-introduction of many popular processors from Freescale and Intel.

AKHAN Semiconductor announces licensing agreement with Argonne National Laboratory

Tue, 11 Nov 2014
AKHAN Semiconductor Inc. and the U.S. Department of Energy’s Argonne National Laboratory have reached an exclusive licensing agreement on a patent portfolio that will provide AKHAN with the intellectual property to become a fully-integrated semiconductor designer, developer and manufacturer.

Deal to expand information technology agreement will strengthen semiconductor industry

Tue, 11 Nov 2014
Agreement will extend tariff-free coverage of the latest semiconductor products and technologies.

SPTS Technologies awarded 'Supplier of the Year - Front End Equipment' by Infineon

Wed, 11 Nov 2014
SPTS Technologies, an Orbotech company, and a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced it was awarded ‘Supplier of the Year – Front End Equipment’ at this year’s Infineon Supplier Day held in Munich.

Slight increase in third quarter 2014 silicon wafer shipments

Wed, 11 Nov 2014
Worldwide silicon wafer area shipments increased during the third quarter 2014 when compared to second quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Professors from UC Berkeley and UT Dallas honored for excellence in semiconductor research

Thu, 11 Nov 2014
The Semiconductor Industry Association (SIA), in consultation with Semiconductor Research Corporation (SRC), today presented its University Research Award to professors from University of California, Berkeley and University of Texas at Dallas in recognition of their outstanding contributions to semiconductor research.

Intel CEO Brian Krzanich elected chairman of Semiconductor Industry Association

Thu, 11 Nov 2014
The Semiconductor Industry Association (SIA) today announced that the SIA board of directors has elected Brian Krzanich, CEO of Intel, as its 2015 chairman and Dr. Necip Sayiner, president, CEO and director of Intersil, as its 2015 vice chairman.

New way to move atomically thin semiconductors for use in flexible devices

Thu, 11 Nov 2014
Researchers from North Carolina State University have developed a new way to transfer thin semiconductor films, which are only one atom thick, onto arbitrary substrates, paving the way for flexible computing or photonic devices.

DuPont Microcircuit Materials introduces pure copper conductive ink

Fri, 11 Nov 2014
DuPont Microcircuit Materials introduced its first pure copper conductive ink for photonic curing, DuPont PE510 copper conductor.

GigOptix appoints Darren Ma as Vice President and Chief Financial Officer

Tue, 11 Nov 2014
GigOptix, Inc., a supplier of advanced high speed semiconductor components, today announced the appointment of Darren Ma as Vice President and Chief Financial Officer.

Revolutionary solar-friendly form of silicon shines

Tue, 11 Nov 2014
Silicon is the second most-abundant element in the earth's crust. When purified, it takes on a diamond structure, which is essential to modern electronic devices--carbon is to biology as silicon is to technology. A team of Carnegie scientists led by Timothy Strobel has synthesized an entirely new form of silicon, one that promises even greater future applications.

GIGAPHOTON provides new function for 50% reduction of neon gas consumption for ArF immersion laser users

Tue, 11 Nov 2014
Gigaphoton Inc., a lithography light source manufacturer, today announces the provision of a new function, called “eTGM (eco-Total Gas Management),” for the existing users of its flagship high-output GT Series of ArF immersion laser products free of charge for a fixed period of time.

SCREEN Semiconductor Solutions and imec sign collaboration agreement for joint R&D on advanced nodes

Mon, 11 Nov 2014
Today, nanoelectronics research center imec announced that SCREEN Semiconductor Solutions Co., Ltd., a leading manufacturer of advanced systems for the semiconductor industry, has joined imec’s suppliers hub for joint R&D in cleaning, wet etch and advanced lithography coat/develop processing.

Carbonics aims for improved power consumption and performance with new carbon nanomaterials

Wed, 11 Nov 2014
Startup is backed by $5.5M investment, leveraging carbon research conducted at UCLA and USC.

China and US boost worldwide industrial semiconductor market in 2014

Thu, 11 Nov 2014
Continuing strength in China and a resurgent U.S. economy are combining to drive accelerated growth in the worldwide market for semiconductors used in industrial applications this year, according to IHS Technology.

Paul A. Mascarena joins ON Semiconductor's board of directors

Thu, 11 Nov 2014
ON Semiconductor Corporation today announced that Paul A. Mascarenas has joined its Board of Directors. The Board also appointed Mr. Mascarenas to its Science and Technology Committee.

North American book-to-bill report shows equipment order activity has moderated

Fri, 11 Nov 2014
North America-based manufacturers of semiconductor equipment posted $1.10 billion in orders worldwide in October 2014 (three-month average basis) and a book-to-bill ratio of 0.93, according to the October EMDS Book-to-Bill Report published today by SEMI.

UO-industry collaboration points to improved nanomaterials

Fri, 11 Nov 2014
A potential path to identify imperfections and improve the quality of nanomaterials for use in next-generation solar cells has emerged from a collaboration of University of Oregon and industry researchers.

Physicists and chemists work to improve digital memory technology

Mon, 11 Nov 2014
The improvements in random access memory that have driven many advances of the digital age owe much to the innovative application of physics and chemistry at the atomic scale.

PDSTI completes acquisition of Montage

Mon, 11 Nov 2014
Montage Technology Group Limited, a global fabless provider of analog and mixed-signal semiconductor solutions addressing the home entertainment and cloud computing markets, today announced that Montage Technology Global Holdings, Ltd., an entity jointly formed by Shanghai Pudong Science and Technology Investment Co., Ltd. and China Electronics Investment Holdings Limited, has completed its acquisition of the company.

Hybrid Memory Cube Consortium releases new specification

Mon, 11 Nov 2014
The Hybrid Memory Cube Consortium (HMCC), dedicated to the development and establishment of an industry-standard interface specification for Hybrid Memory Cube (HMC) technology, today announced the finalization and public availability of its HMCC 2.0 specification (HMCC 2.0).

Micron Technology CFO to retire in 2015

Mon, 11 Nov 2014
Micron Technology, Inc. announced that Ronald C. Foster, Chief Financial Officer (CFO) and Vice President of Finance, will retire from Micron next year.

Research yields material made of single-atom layers that snap together like Legos

Tue, 11 Nov 2014
Physicists at the University of Kansas have fabricated an innovative substance from two different atomic sheets that interlock much like Lego toy bricks.

Slideshow: IEDM 2014 Preview

Wed, 11 Nov 2014
Browse for an advance look at some of the most newsworthy topics and papers to be presented at the 60th annual meeting, to be held at the Hilton San Francisco Union Square Hotel from December 15-17, 2014.

2) Fully Integrated 27nm 16Gb ReRAM

Tue, 11 Nov 2013

6) Dual-Channel Nanowire Transistors

Tue, 11 Nov 2013

7) Real-World Performance of Scaled InGaAs Devices

Tue, 11 Nov 2013

9) Flexible High-Performance Nonvolatile Memory

Tue, 11 Nov 2013

10) Nonvolatile Logic-in-Memory Technology

Tue, 11 Nov 2013

12) A New Memory Type – TRAM

Tue, 11 Nov 2013

Protons fuel graphene prospects

Wed, 11 Nov 2014
Published in the journal Nature, the discovery could revolutionise fuel cells and other hydrogen-based technologies as they require a barrier that only allow protons - hydrogen atoms stripped off their electrons - to pass through.

Van der Waals force re-measured

Wed, 11 Nov 2014
Although the van der Waals force was discovered around 150 years ago, it is still difficult to quantify when predicting the behaviour of solids, liquids, and molecules.

Cymer announces its new XLR 700ix DUV light source

Mon, 12 Dec 2014
Cymer, LLC, an ASML company, a supplier of light sources used by chipmakers to pattern advanced semiconductor chips, today announced its new argon fluoride (ArF) immersion light source, the XLR 700ix.

TSV based memory going to volume production: the era of 3DIC finally begins

Mon, 12 Dec 2014
With the recent Samsung announcement of mass production of 64 GB DDR4 DIMMs that use TSV technology for enterprise servers and cloud-based applications, all three of the major DRAM memory manufactures, Samsung, Hynix and Micron, have now announced the commercialization of TSV based memory architectures.

SEMICON Korea focuses on breaking through the limitations of semiconductor technology

Mon, 12 Dec 2014
Over 500 exhibiting companies from 20 countries and more than 40,000 attendees are expected to attend SEMICON Korea 2015, to be held February 4-6 at COEX in Seoul.

Semiconductor equipment sales forecast: $38B in 2014 to nearly $44B in 2015

Tue, 12 Dec 2014
SEMI projects that worldwide sales of new semiconductor manufacturing equipment will increase 19.3 percent to $38.0 billion in 2014, according to the SEMI Year-end Forecast, released today at the annual SEMICON Japan exposition.

SEMATECH reports significant progress in EUV resist outgas testing

Wed, 12 Dec 2014
​SEMATECH announced today that promising progress has been made in qualifying outgassing specifications for extreme ultraviolet (EUV) lithography.

Soitec announces new world record for solar cell efficiency at 46%

Wed, 12 Dec 2014
The record multi-junction solar cell converts 46 % of the solar light into electrical energy.

Cypress and Spansion to merge in $4B all-stock transaction

Wed, 12 Dec 2014
Cypress Semiconductor Corp. and Spansion, Inc. this week announced a definitive agreement to merge in an all-stock, tax-free transaction valued at approximately $4 billion.

SEMI Industry Strategy Symposium to focus on changing supply chain ecosystem and directions for growth

Wed, 12 Dec 2014
Microelectronics industry executives will convene at the SEMI Industry Strategy Symposium (ISS) on January 11-14 to discuss “Riding the Wave of Silicon Magic.”

Imec partners with Huawei on high-bandwidth optical data link technology

Wed, 12 Dec 2014
Nanoelectronics research center imec and global ICT leader Huawei announced today that they have taken a further step in their strategic partnership focusing on optical data link technology.

Wireless nanorod-nanotube film enables light stimulation of blind retina

Wed, 12 Dec 2014
Breakthrough could lead to artificial retinas for visually impaired. Combining semiconductor nanorods and carbon nanotubes, it could potentially form part of a future prosthetic device that replaces damaged retinal cells.

Global semiconductor sales increase in October; Substantial growth projected for 2014

Wed, 12 Dec 2014
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $29.7 billion for the month of October 2014, an increase of 9.6 percent from the October 2013 total.

ON Semiconductor adds new distribution partners to expand business in Japan and Asia-Pacific

Thu, 12 Dec 2014
ON Semiconductor has announced new distribution channel partner agreements with two multi-national electronics trading franchises based in Japan. Ryosan Co., Ltd. and Macnica Inc. join the roster of ON Semiconductor channel sales partners to help expand domestic sales within Japan and work to drive sales growth in China and other Asia-Pacific geographies.

High photosensitivity 2-D-few-layered molybdenum diselenide phototransistors

Mon, 12 Dec 2014
Two-dimensional (2D) layered materials are now attracting a lot of interest due to their unique optoelectronic properties at atomic thicknesses.

Veeco completes acquisition of Solid State Equipment Holdings LLC

Mon, 12 Dec 2014
Veeco Instruments Inc. announced that it has acquired privately held Solid State Equipment Holdings LLC (“SSEC”), based in Horsham, Pennsylvania.

Crossbar to demonstrate resistive RRAM innovation at IEDM 2014

Tue, 12 Dec 2014
Crossbar, Inc., a start-up company pioneering a new category of very high capacity and high-performance non-volatile memory, today announced it will be disclosing another major technology breakthrough in their development of Resistive RAM (RRAM) at next week’s IEEE International Electron Devices Meeting (IEDM).

SEMI reports third quarter 2014 worldwide semiconductor equipment figures

Tue, 12 Dec 2014
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 8.82 billion in the third quarter of 2014.

TSMC recognizes outstanding suppliers at Supply Chain Management Forum

Tue, 12 Dec 2014
TSMC held its 14th annual Supply Chain Management forum on December 4, 2014 to show appreciation for the support and contributions of its suppliers in 2014, and to recognize nine outstanding equipment and materials suppliers.

Linde appoints new Executive Board members

Tue, 12 Dec 2014
The Linde AG Supervisory Board has appointed Dr. Christian Bruch and Bernd Eulitz as new members of its Executive Board with effect from January 1, 2015.

OCEASOFT harnesses SIGFOX IoT network in Cobalt S3 sensor family for cloud connectivity

Tue, 12 Dec 2014
Industrial Internet of Things sensor-monitoring solution opens new vistas in pollution and environmental applications, other remote-sensing sectors.

Lattice Semiconductor announces appointment of Jeff Richardson to Board of Directors

Wed, 12 Dec 2014
Lattice Semiconductor Corporation today announced that its Board of Directors has appointed Jeff Richardson to the company’s Board of Directors and Audit Committee.

Entegris launches next generation of 450mm wafer carriers

Wed, 12 Dec 2014
Entegris, Inc., a developer of yield-enhancing materials and solutions for highly advanced manufacturing environments, announced the release and global availability of their next generation of 450mm wafer carrier solutions (P2) for the safe and reliable transport of 450mm wafers used in semiconductor manufacturing.

John Neuffer named president and CEO of SIA

Thu, 12 Dec 2014
The Semiconductor Industry Association (SIA) announced that John Neuffer has been named president & CEO of the association.

Holst Centre and imec develop thin-film hybrid oxide-organic microprocessor

Thu, 12 Dec 2014
Holst Centre, imec and their partner Evonik have realized a general-purpose 8-bit microprocessor, manufactured using complementary thin-film transistors (TFTs) processed at temperatures compatible with plastic foil substrates (250°C).

Intel announces IoT platform

Thu, 12 Dec 2014
Intel Corporation today announced the Intel IoT Platform, an end-to-end reference model designed to unify and simplify connectivity and security for the Internet of Things (IoT).

Global Semiconductor Alliance announces 2014 Award recipients

Fri, 12 Dec 2014
GSA members identified the Most Respected Public Semiconductor Company Award winners by casting ballots for the industry’s most respected companies for its products, vision and future opportunities.

Paul Daniel Dapkus wins 2015 John Tyndall Award

Fri, 12 Dec 2014
The Optical Society (OSA) and the IEEE Photonics Society announced that Paul Daniel Dapkus, W. M. Keck Distinguished Professor of Engineering at the University of Southern California, is the recipient of the 2015 John Tyndall Award.

Murata completes acquisition of Peregrine Semiconductor

Fri, 12 Dec 2014
Murata Electronics North America, Inc. and Peregrine Semiconductor Corporation, founder of RF silicon on insulator (SOI) and pioneer of advanced RF solutions, today announce that Murata has acquired all outstanding shares of Peregrine.

Stacking 2-dimensional materials may lower cost of semiconductor devices

Fri, 12 Dec 2014
A team of researchers led by North Carolina State University has found that stacking materials that are only one atom thick can create semiconductor junctions that transfer charge efficiently, regardless of whether the crystalline structure of the materials is mismatched - lowering the manufacturing cost for a wide variety of semiconductor devices such as solar cells, lasers and LEDs.

Scientists measure speedy electrons in silicon

Fri, 12 Dec 2014
An international team of physicists and chemists based at the University of California, Berkeley, has for the first time taken snapshots of this ephemeral event using attosecond pulses of soft x-ray light lasting only a few billionths of a billionth of a second.

Innovation in the shadow of volcanic change

Tue, 12 Dec 2014
The semiconductor equipment and materials industry is currently enjoying a double-digit annual growth rate and good prospects looking forward to 2015.

Synopsys and imec expand TCAD collaboration to 5nm and beyond

Tue, 12 Dec 2014
Synopsys, Inc. today announced the expansion of its collaboration with imec (nanoelectronics research center imec) to nanowire and other devices (FinFETs, Tunnel-FETs) targeting the 5-nanometer (nm) technology node and beyond.

Lead islands in a sea of graphene magnetize the material of the future

Tue, 12 Dec 2014
Researchers in Spain have discovered that if lead atoms are intercalated on a graphene sheet, a powerful magnetic field is generated by the interaction of the electrons' spin with their orbital movement.

Amkor Technology licenses proprietary copper pillar wafer bump technology to GLOBALFOUNDRIES

Tue, 12 Dec 2014
Amkor Technology, Inc., a provider of semiconductor assembly and test services, today announced that it has granted GLOBALFOUNDRIES a non-exclusive license to its proprietary copper pillar wafer bump technology.

The simplest element: Turning hydrogen into 'graphene'

Tue, 12 Dec 2014
New work from Carnegie's Ivan Naumov and Russell Hemley delves into the chemistry underlying some surprising recent observations about hydrogen, and reveals remarkable parallels between hydrogen and graphene under extreme pressures.

Imec demonstrates broadband graphene optical modulator on silicon

Wed, 12 Dec 2014
At this week’s IEEE International Electron Devices Meeting (IEDM 2014), nanoelectronics research center imec and its associated lab at Ghent University have demonstrated the industry’s first integrated graphene optical electro-absorption modulator (EAM) capable of 10Gb/s modulation speed.

Imec presents ultralow power RFID transponder chip in thin-film transistor technology on plastic at IEDM 2014

Wed, 12 Dec 2014
At this week’s IEDM 2014, held in San Francisco, California, nanoelectronics research center imec demonstrated an ultra-low power RFID transponder chip.

Process Watch: Fab managers don’t like surprises

Thu, 12 Dec 2014
Nobody likes surprises - especially the managers of $10 billion factories.

Laser spike annealing resolves sub-20nm logic device manufacturing challenges

Thu, 12 Dec 2014
LSA technology plays an enabling role to overcoming manufacturing challenges for sub-20nm logic devices.

Book-to-bill climbs above parity in November

Thu, 12 Dec 2014
North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.

From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

Thu, 12 Dec 2014
Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling.

The most expensive defect

Thu, 12 Dec 2014
Defects that aren’t detected inline cost fabs the most.

IoT's divergent needs will drive different types of technologies

Fri, 12 Dec 2014
Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical.

Eliminating electrostatic discharge: Protecting tomorrow's technology

Mon, 12 Dec 2014
A new range of dissipative materials based on fluoroelastomer and perfluoroelastomer polymers is designed for wafer processing and wafer handling applications.

Piezoelectricity in a 2-D semiconductor

Mon, 12 Dec 2014
Berkeley Lab researchers discovery of piezoelectricty in molybdenum disulfide holds promise for future MEMS.

Hands on: Crafting ultrathin color coatings

Mon, 12 Dec 2014
In Harvard's high-tech cleanroom, applied physicists produce vivid optical effects on paper.

Global semiconductor market set for strongest growth in four years in 2014

Tue, 12 Dec 2014
Worldwide semiconductor market revenue is on track to achieve a 9.4 percent expansion this year, with broad-based growth across multiple chip segments driving the best industry performance since 2010.

The ConFab 2015: Time for collaboration

Tue, 12 Dec 2014
The future of the semiconductor industry continues to shine brightly.

A new hardmask process, Saphira

Tue, 12 Dec 2014
A new hardmask material and process was introduced this month by Applied Materials. Designed for advanced logic and memories, including DRAM and vertical NAND, the hardmask is transparent, which simplifies processing.

Global semiconductor sales in November outpace 2013 totals

Mon, 1 Jan 2015
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $29.7 billion for the month of November 2014.

HLMC develops specialty technology in pursuit of growing IoT market

Mon, 1 Jan 2015
Chinese IC manufacturer Shanghai Huali Microelectronics Corporation gave a presentation on its outlook for the Internet of Things (IoT) market and the wide application of its specialty technology at the 2014 China Semiconductor Industry Association IC Design Branch Annual Conference ("ICCAD"), which was recently held at Hong Kong Science Park.

UCT announces new CEO

Mon, 1 Jan 2015
Ultra Clean Holdings, Inc. today announced that Mr. James Scholhamer has accepted an offer to become UCT's Chief Executive Officer, effective Monday, January 19, 2015.

Freshmen-level chemistry solves the solubility mystery of graphene oxide films

Tue, 1 Jan 2015
A Northwestern University-led team recently found the answer to a mysterious question that has puzzled the materials science community for years--and it came in the form of some surprisingly basic chemistry.

SEMICON West 2015: “Call for Papers” for Semiconductor Technology Symposium and TechXPOTs

Wed, 1 Jan 2015
SEMI today announced a “Call for Papers” for SEMICON West, North America’s premier microelectronics event, to be held July 14-16 at the Moscone Center in San Francisco, Calif.

GLOBALFOUNDRIES and Linear Dimensions to offer joint analog solution for wearables and MEMs sensors markets

Fri, 1 Jan 2015
GLOBALFOUNDRIES and Linear Dimensions Semiconductor Inc. today announced that they are working together to manufacture a 14-channel programmable reference from Linear Dimensions for multiple markets including IoT (Internet of Things) sensor and wearable device applications.

New secondary fab equipment market report available from SEMI

Fri, 1 Jan 2015
With new cost-sensitive semiconductor devices driving capacity demand, 200mm wafer size and currently existing (legacy) fabs are seeing a renaissance, SEMI completed a thorough study of the secondary fab equipment market to identify the market size and to capture key trends and issues impacting this industry segment.

Silicon Space Technology partners with GLOBALFOUNDRIES to deliver processors and memory solutions

Fri, 1 Jan 2015
Silicon Space Technology, an industry innovator in high-temp and rad-hard embedded system solutions, announced today the company has partnered with GLOBALFOUNDRIES to build commercial-ready products for extreme environments and applications.

DRAM capacity rises from slump; Sector faces new challenges

Mon, 1 Jan 2015
SEMI today announced details from the SEMI World Fab Forecast Report illuminating the state of the semiconductor manufacturing industry, coincident with convening SEMI’s Industry Strategy Symposium (ISS) in Half Moon Bay, Calif.

Graphene plasmons go ballistic

Mon, 1 Jan 2015
Graphene combined with the insulting power of boron nitride enables light control in tiny circuits with dramatically reduced energy loss.

One of the largest semiconductor companies in Europe signs agreement with Oxford Instruments

Tue, 1 Jan 2015
An agreement has been signed between one of the largest semiconductor companies in Europe and Oxford Instruments for the supply of multiple Failure Analysis (FA) systems, to be installed in its manufacturing sites globally over a period of two years.

IHS identifies technologies to transform the world over next five years

Mon, 1 Jan 2015
The Internet of Everything, cloud computing/big data and 3-D printing are the three technologies most likely to transform the world during the next five years, according to IHS Technology.

Mentor Graphics acquires Flexras Technologies

Tue, 1 Jan 2015
The Flexras timing-driven partitioning technology will expand and strengthen the portfolio of tools available from Mentor to help engineers overcome the challenges of increasingly complex design prototyping.

MagnaChip offers automotive semiconductor manufacturing process technology

Tue, 1 Jan 2015
MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products announced today that it has started to offer 0.18um automotive qualified process technology to foundry customers focused on high reliability automotive semiconductor applications.

Zinc oxide materials tapped for tiny energy harvesting devices

Tue, 1 Jan 2015
New research helps pave the way toward highly energy-efficient zinc oxide-based micro energy harvesting devices with applications in portable communications, healthcare and environmental monitoring, and more.

SUNY Board appoints Dr. Alain Kaloyeros as founding president of SUNY Polytechnic Institute

Wed, 1 Jan 2015
SUNY Polytechnic Institute (SUNY Poly) yesterday announced the SUNY Board of Trustees has appointed Dr. Alain Kaloyeros as the founding President of SUNY Poly.

JEOL and UC Irvine partner to develop electron microscopy and materials research center

Wed, 1 Jan 2015
JEOL USA and the University of California's Irvine Materials Research Institute (IMRI) have entered into a strategic partnership to create a premier electron microscopy and materials science research facility.

Further growth seen for semiconductor equipment and materials at SEMI ISS 2015

Wed, 1 Jan 2015
The SEMI Industry Strategy Symposium (ISS) opened yesterday with the theme “Riding the Wave of Silicon Magic.”

Two companies honored with SEMI Award

Wed, 1 Jan 2015
SEMI today announced that two companies, Brewer Science and Advanced Semiconductor Engineering, Inc. (ASE), are recipients of the 2014 SEMI Award for North America.

SAMCO announces MOCVD demonstration availability for the GaN-550 MOCVD system

Thu, 1 Jan 2015
SAMCO has announced MOCVD demonstration capability on a new gallium nitride (GaN-on-Si) system, the GaN-550, from Valence Process Equipment Inc.

Orbotech announces collaboration between SPTS and Fraunhofer on process development of wafer level packaging

Thu, 1 Jan 2015
Orbotech Ltd. today announced that SPTS Technologies is collaborating with Fraunhofer IZM, an international institute specializing in applied and industrial contract research, on next generation wafer level packaging of microelectronic devices.

UC Berkeley Extension launches three online programs in semiconductor technology

Thu, 1 Jan 2015
UC Berkeley Extension announces three online integrated circuit (IC) semiconductor technology programs to meet the training needs of the surging worldwide semiconductor industry; the industry is predicted to reach $345 billion in sales this year.

Samsung Electronics starts mass producing industry’s first 8-gigabit graphics DRAM

Thu, 1 Jan 2015
Samsung Electronics Co., Ltd. announced today that it has begun mass producing the industry’s first 8 gigabit (Gb) GDDR5 DRAM, based on the company’s leading-edge 20-nanometer (nm) process technology.

AKHAN Semiconductor first to invent fully transparent circuit creation process

Thu, 1 Jan 2015
Adam Khan, founder and CEO of AKHAN Semiconductor, Inc. was granted a US patent by the US Patent and Trademark Office today for a groundbreaking process that adheres diamond, the only truly transparent semiconductor, to metals and alloys (including transparent metals) in a way that allows for reliable wire bonding and high conductivity.

Solving an organic semiconductor mystery

Fri, 1 Jan 2015
Berkeley Lab researchers uncover hidden structures in domain interfaces that hamper performance.

Rice-sized laser, powered one electron at a time, bodes well for quantum computing

Fri, 1 Jan 2015
Princeton University researchers have built a rice grain-sized laser powered by single electrons tunneling through artificial atoms known as quantum dots.

Carbon nanotube finding could lead to flexible electronics with longer battery life

Fri, 1 Jan 2015
University of Wisconsin-Madison materials engineers have made a significant leap toward creating higher-performance electronics with improved battery life -- and the ability to flex and stretch.

Underdog DRAM

Tue, 1 Jan 2015
DRAM shifts out of a slump, but sector still faces obstacles.

2015 outlook: Tech trends and drivers

Tue, 1 Jan 2015
Leading industry experts provide their perspectives on what to expect in 2015. 3D devices and 3D integration, rising process complexity and “big data” are among the hot topics.

Will new policy in China trigger big changes?

Wed, 1 Jan 2015
In June 2014, the State Council of China issued the "National Guideline for the Development and Promotion of the IC Industry,” to support the domestic semiconductor industry. The document addresses development targets, approaches, and measures.

Silver nanowires demonstrate unexpected self-healing mechanism

Fri, 1 Jan 2015
With its high electrical conductivity and optical transparency, indium tin oxide is one of the most widely used materials for touchscreens, plasma displays, and flexible electronics. But its rapidly escalating price has forced the electronics industry to search for other alternatives.

Graphene enables all-electrical control of energy flow from light emitters

Fri, 1 Jan 2015
Scientists from ICFO, MIT, CNRS, CNISM and Graphenea have now demonstrated active, in-situ electrical control of the energy flow from erbium ions into photons and plasmons.

Self-assembled nanotextures create antireflective surface on silicon solar cells

Fri, 1 Jan 2015
Scientists at the U.S. Department of Energy's Brookhaven National Laboratory show that etching a nanoscale texture onto the silicon material itself creates an antireflective surface that works as well as state-of-the-art thin-film multilayer coatings.

EMCORE Corporation announces the appointment of Dr. Hank Blauvelt as Chief Technology Officer

Fri, 1 Jan 2015
EMCORE Corporation, a provider of compound semiconductor-based components, subsystems and systems for the broadband and specialty fiber optics market, announced today the appointment of Dr. Hank Blauvelt to Chief Technology Officer for EMCORE Corporation, reporting to Chief Executive Officer, Jeffrey Rittichier.

Researchers at Penn, UC Berkeley and Illinois use oxides to flip graphene conductivity

Tue, 1 Jan 2015
Graphene, a one-atom thick lattice of carbon atoms, is often touted as a revolutionary material that will take the place of silicon at the heart of electronics. The unmatched speed at which it can move electrons, plus its essentially two-dimensional form factor, make it an attractive alternative, but several hurdles to its adoption remain.

Rambus appoints Tom Fisher to its Board of Directors

Fri, 1 Jan 2015
Rambus Inc. today announced the appointment of Mr. Ellis Thomas Fisher as a director to its Board, effective immediately.

North American semiconductor equipment industry posts December 2014 book-to-bill ratio of 0.98

Mon, 1 Jan 2015
North America-based manufacturers of semiconductor equipment posted $1.37 billion in orders worldwide in December 2014 (three-month average basis) and a book-to-bill ratio of 0.98, according to the December EMDS Book-to-Bill Report published today by SEMI.

GIGAPHOTON honored with 2015 "Toshiba Partnership Award"

Mon, 1 Jan 2015
Gigaphoton Inc., a lithography light source manufacturer, today announced that the company has been recognized with a 2015 Partnership Award from Toshiba Semiconductor & Storage Company’s Yokkaichi Operations, a world production base of NAND flash memory devices.

Emerging non volatile memory technological choices are about to be made: STTMRAM or MRAM?

Mon, 1 Jan 2015
“The technological choice between STTMRAM/MRAM and RRAM will be made in the next two years,” announces the “More Than Moore” market research, technology and strategy consulting company, Yole Développement (Yole).

New Soitec eSI90 RF-SOI wafer improves RF performance of high-end smart phone components

Mon, 1 Jan 2015
Soitec (Euronext) has introduced its eSI90 substrate, the newest high-end wafer in its radio-frequency silicon-on-insulator (RF-SOI) product family.

New pathway to valleytronics

Tue, 1 Jan 2015
A potential avenue to quantum computing currently generating quite the buzz in the high-tech industry is "valleytronics," in which information is coded based on the wavelike motion of electrons moving through certain two-dimensional (2D) semiconductors.

2014 was bumper year for automotive semiconductors

Tue, 1 Jan 2015
The automotive semiconductor market did exceptionally well in 2014, according to new analysis from IHS.

New MES operations improvement software from critical manufacturing features integrated scheduling

Wed, 1 Jan 2015
Critical Manufacturing, a supplier of integrated manufacturing execution systems (MES), introduces cmNavigo 4.0, the industry’s first comprehensive MES software with embedded finite scheduling.

Gov. Baker announces $4M grant to UMass Lowell to fuel emerging printed electronics cluster

Thu, 1 Jan 2015
Gov. Charlie Baker today announced a $4 million dollar grant from the Massachusetts Technology Collaborative (“MassTech”) to UMass Lowell to support development of a printed and flexible electronics industry cluster, an emerging field that has the potential to become a $76 billion global market in the next decade.

Demystifying nanocrystal solar cells

Fri, 1 Jan 2015
Scientists are focusing on nanometer-sized crystals for the next generation of solar cells. These nanocrystals have excellent optical properties. Compared with silicon in today's solar cells, nanocrystals can be designed to absorb a larger fraction of the solar light spectrum. However, the development of nanocrystal-based solar cells is challenging.

New method allows for greater variation in band gap tunability

Fri, 1 Jan 2015
If you can't find the ideal material, then design a new one.

EUV, Internet of Things, 3D integration among hot topics at SPIE Advanced Lithography

Fri, 1 Jan 2015
Extreme ultraviolet lithography (EUV), 3D integration, and the Internet of Things will be among critical technologies featured at SPIE Advanced Lithography 2015 22 to 26 February in San Jose, California.

Status of the power electronics industry: It is now a question of integration

Mon, 2 Feb 2015
According to Yole Développement’s team, wide band gap (WBG) technologies are almost ready to be used by power electronics integrators. The question is now: How?

ClassOne acquires Microprocess Technologies product lines

Mon, 2 Feb 2015
ClassOne Technology, the wet-chemistry semiconductor equipment manufacturer, has announced the acquisition of two complete product lines from Microprocess Technologies.

SEMICON Korea opens tomorrow: Korea IC manufacturing fueled by memory and mobility

Tue, 2 Feb 2015
SEMICON Korea 2015 at COEX in Seoul opens tomorrow with more than 500 exhibiting companies and an expected 40,000 attendees.

Global semiconductor industry posts record sales in 2014

Mon, 2 Feb 2015
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that the global semiconductor industry posted record sales totaling $335.8 billion in 2014, an increase of 9.9 percent from the 2013 total of $305.6 billion.

Fabrication of patterns with linewidths down to 1.5nm

Tue, 2 Feb 2015
Researchers at aBeam Technologies, Lawrence Berkeley National Laboratory and Argonne National Laboratory have developed a technology to fabricate test patterns with a minimum linewidth down to 1.5nm.

ROHM Semiconductor announces monolithic EDLC cell balancing IC

Thu, 2 Feb 2015
ROHM recently announced the development of a cell balancing IC that contributes to increased miniaturization, greater stability, and longer life for EDLCs.

Breakthrough may lead to industrial production of graphene devices

Mon, 2 Feb 2015
With properties that promise faster computers, better sensors and much more, graphene has been dubbed the 'miracle material'. But progress in producing it on an industrial scale without compromising its properties has proved elusive.

One-atom-thin silicon transistors hold promise for super-fast computing

Mon, 2 Feb 2015
Researchers at The University of Texas at Austin's Cockrell School of Engineering have created the first transistors made of silicene, the world's thinnest silicon material.

Spansion and XMC expand partnership to jointly develop 3D NAND

Mon, 2 Feb 2015
Spansion Inc. and XMC, China's fastest growing 300mm semiconductor foundry, today announced that the two companies will work together to develop and manufacture 3D NAND technology.

Qualcomm and China's National Development and Reform Commission reach resolution

Mon, 2 Feb 2015
Qualcomm Incorporated today announced that it has reached a resolution with China's National Development and Reform Commission (NDRC) regarding the NDRC's investigation of Qualcomm under China's Anti-Monopoly Law.

Mentor Graphics launches broadest embedded systems solution for industrial automation

Mon, 2 Feb 2015
Mentor Graphics Corporation today announced the embedded systems industry's broadest portfolio for industrial automation.

Precision growth of light-emitting nanowires

Tue, 2 Feb 2015
A novel approach to growing nanowires promises a new means of control over their light-emitting and electronic properties.

Strategy is key differentiator as more efficient GaN, SiC power electronics enter market

Tue, 2 Feb 2015
Power electronics based on gallium nitride (GaN) and silicon carbide (SiC) have the potential to significantly improve efficiency. But since these materials are higher-cost, companies need market-specific strategies in order to succeed as these new wide-bandgap (WBG) materials claim market share from silicon-based semiconductors, according to Lux Research.

Processing of graphene on 300mm Si wafers in a state-of-the-art CMOS fabrication facility

Tue, 2 Feb 2015
The building blocks are described that can be used to fabricate other novel device architectures that can take advantage of the unique properties of graphene or other interesting single-layer (i.e., 2D) materials.

Improving the reliability of dry vacuum pumps in high-k ALD processes

Tue, 2 Feb 2015
Design features that contributed most to the improved performance include increased rotational speed, integrated rotor sleeves, and increased purge injection temperature.

Applied's merger with TEL: Still a work in progress

Wed, 2 Feb 2015
Applied Materials on Wednesday reported that its proposed merger with Tokyo Electron Ltd. (TEL) is still under way, without giving a deadline or expected date of conclusion.

SEMI wins semiconductor etch equipment export control ruling

Wed, 2 Feb 2015
This week, after a four-month investigation, the U.S. Department of Commerce declared the export controls on certain etch equipment and technology ineffective, thereby removing a cumbersome and onerous impediment to efficient trade.

Silicon wafer shipments reach record levels in 2014

Wed, 2 Feb 2015
Worldwide silicon wafer area shipments increased 11 percent in 2014 when compared to 2013 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

Imec and Holst Centre to present key achievements at ISSCC 2015

Thu, 2 Feb 2015
At this year’s International Solid State Circuits Conference to be held in San Francisco, Calif., Feb. 22-26, imec and Holst Centre will present eight scientific papers covering groundbreaking results on ultra-low power design for wireless broadband communication, for wireless sensor networks, and organic electronics.

Giga-scale challenges will dominate 2015

Fri, 2 Feb 2015
It wasn’t all that long ago when nano-scale was the term the semiconductor industry used to describe small transistor sizes to indicate technological advancement.

Researchers glimpse distortions in atomic structure of materials

Fri, 2 Feb 2015
Researchers from North Carolina State University are using a technique they developed to observe minute distortions in the atomic structure of complex materials, shedding light on what causes these distortions and opening the door to studies on how such atomic-scale variations can influence a material's properties.

Extreme-temperature electronics

Fri, 2 Feb 2015
Many industries are calling for electronics that can operate reliably in a harsh environment, including extreme temperatures above 200° Celsius.

Ghent University and imec demonstrate interaction between light and sound in nanoscale waveguide

Tue, 2 Feb 2015
Silicon photonics enables extreme light-matter interaction.

Security should not be hard to implement

Tue, 2 Feb 2015
Data is ubiquitous today. It is generated, exchanged and consumed at unprecedented rates.

Gigaphoton achieves continuous 140W EUV light source output at 50% duty cycle

Tue, 2 Feb 2015
Further contributing to the realization of a mass production-quality LPP light source for EUV scanners

eBeam Initiative announces education and collaboration focus on reactivating density benefits of Moore's Law

Tue, 2 Feb 2015
The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced that its top theme for 2015 will be the reactivation of the density benefits of Moore's Law through eBeam technology.

Novel solid-state nanomaterial platform enables terahertz photonics

Tue, 2 Feb 2015
cientists are pioneering the use of nanomaterials in compact, sensitive, fast, low-cost terahertz detectors with potential in applications such as biomedical diagnostics, airport security screening and high data-rate wireless communication

Novel crumpling method takes flat graphene from 2-D to 3-D

Tue, 2 Feb 2015
Researchers at the University of Illinois at Urbana-Champaign have developed a unique single-step process to achieve three-dimensional (3D) texturing of graphene and graphite.

Imec reports breakthrough results on DSA

Thu, 2 Feb 2015
At next week’s SPIE advanced lithography conference, to be held in San Jose, Calif., Feb. 22-26, imec will present breakthrough results on Directed Self-Assembly (DSA) process development.

China's semiconductor investment plans focus of SEMICON China 2015

Thu, 2 Feb 2015
China's new industry investment and government promotion policies outlined in the recent "National Guidelines for Development and Promotion of the IC Industry" represents major opportunities for China and global semiconductor companies.

Call for Papers open for SEMICON Europa 2015 and Plastic Electronics 2015

Thu, 2 Feb 2015
SEMI today announced the "Call for Papers" for technical sessions and presentations for SEMICON Europa 2015 which takes place October 6-8 in Dresden, Germany. Technical presentation abstracts are due April 30.

Mentor Graphics announces call for entries for Don Miller Award for Thermo-Fluid Design Excellence

Thu, 2 Feb 2015
Mentor Graphics Corporation today announced the call-for-entries for its first annual Don Miller Award for Excellence in System Level Thermo-Fluid Design.

KLA-Tencor extends its 5D patterning control solution with new metrology systems

Thu, 2 Feb 2015
Today, KLA- Tencor Corporation introduced two advanced metrology systems that support the development and production of 16nm and below IC devices: Archer 500LCM and SpectraFilm LD10.

Micron appoints Robert Peglar as Vice President of Advanced Storage Solutions

Thu, 2 Feb 2015
Micron Technology, Inc. today announced that Robert Peglar has been named as vice president of Advanced Storage Solutions.

Penn researchers develop new technique for making molybdenum disulfide

Fri, 2 Feb 2015
University of Pennsylvania researchers have made an advance in manufacturing one such material, molybdenum disulphide.

The future of electronics -- now in 2-D

Fri, 2 Feb 2015
The future of electronics could lie in a material from its past, as researchers from The Ohio State University work to turn germanium--the material of 1940s transistors--into a potential replacement for silicon.

Techniques for simplifying pulsed measurements: Part 1

Fri, 2 Feb 2015
Pulsed measurements are defined in Part 1, and common pulsed measurement challenges are discussed in Part 2.

Reframing the Roadmap: ITRS 2.0

Thu, 2 Feb 2014
The International Technology Roadmap for Semiconductor (ITRS) is being reframed to focus more on end applications, such as smartphones and micro-servers.

January 2015 book-to-bill supports positive outlook for semiconductor equipment industry

Fri, 2 Feb 2015
A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

Cymer announces shipment of its first XLR 700ix DUV light source and introduces DynaPulse

Mon, 2 Feb 2015
Cymer, an ASML company, a developer of lithography light sources used by chipmakers to pattern advanced semiconductor chips, today announced the shipment of its first XLR 700ix light source.

Applied Materials unveils breakthrough e-beam metrology tool for finFET transistors and 3D NAND devices

Mon, 2 Feb 2015
At the SPIE Advanced Lithography conference in San Jose, Calif., Applied Materials, Inc., today announced the industry's first in-line 3D CD SEM metrology tool for solving the challenges of measuring the high aspect ratio and complex features of 3D NAND and FinFET devices.

AG Semiconductor Services and JA Mitsui Leasing join forces

Tue, 2 Feb 2015
AG Semiconductor Services, LLC (AGSS), one of the largest suppliers of used electronics manufacturing equipment, is pleased to announce that it has entered into a strategic relationship with JA Mitsui Leasing, Ltd. (JAML).

Radio chip for the 'Internet of things'

Tue, 2 Feb 2015
At this year's Consumer Electronics Show in Las Vegas, the big theme was the "Internet of things" -- the idea that everything in the human environment, from kitchen appliances to industrial equipment, could be equipped with sensors and processors that can exchange data, helping with maintenance and the coordination of tasks.

Freescale pushes for a secure Internet of Things

Tue, 2 Feb 2015
As the Internet of Things (IoT) continues to gain momentum, Freescale Semiconductor and its partners are tackling the most dire challenge the young movement has faced to date – the alarming lack of unified guidelines for ensuring the security of IoT applications.

Penang to host inaugural SEMICON Southeast Asia

Wed, 2 Feb 2015
The inaugural SEMICON Southeast Asia, will run from 22–24 April at the Subterranean Penang International Convention and Exhibition Centre (SPICE) in Penang, Malaysia.

Technologists focus on semiconductor factory productivity and process solutions at ASMC 2015

Wed, 2 Feb 2015
The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2015) will be held May 3-6 in Saratoga Springs, New York.

Top semiconductor R&D leaders ranked for 2014

Thu, 2 Feb 2015
Intel’s R&D expenditures were 2x greater than nearest competitor; Qualcomm with largest percentage increase; Nvidia with highest R&D/sales ratio.

Semiconductor unit shipments to exceed one trillion devices in 2017

Thu, 2 Feb 2015
Updated forecast expects robust 8.2% average annual unit shipment growth through 2019.

New nanowire structure absorbs light efficiently

Fri, 2 Feb 2015
Researchers at Aalto University, Finland have developed a new method to implement different types of nanowires side-by-side into a single array on a single substrate.

SEMICON Russia 2015 presents Microelectronics Market Conference and new TechARENA sessions

Mon, 3 Mar 2015
SEMICON Russia, a meeting place of the entire micro- and nanoelectronics industry in Russia, will take place from 16 to 18 June in Moscow.

Freescale and NXP agree to $40 Billion merger

Tue, 3 Mar 2015
Chipmaker NXP Semiconductors NV announced Sunday night that it has agreed to buy Freescale Semiconductor Ltd for $11.8 billion and merge business operations.

GSA announces 2015 Board of Directors election results and appointment

Thu, 3 Mar 2015
The Global Semiconductor Alliance (GSA) announced the appointment of two key executives as well as the results of its 2015 Board of Directors’ election.

Yole reports growth recovery in power electronics industry

Tue, 3 Mar 2015
Yole Développement (Yole) announces the return to the power electronics market growth, after two years of stagnancy.

Comparing market sizes and forecasted growth rates for systems, ICs

Tue, 3 Mar 2015
Cellphones expand as largest system market; IoT growing fastest through 2018.

Global semiconductor industry posts highest-ever January sales

Tue, 3 Mar 2015
Global sales from January 2015 were 2 percent lower than the December 2014 total of $29.1 billion, reflecting normal seasonal trends.

Mentor Graphics acquires Tanner EDA

Tue, 3 Mar 2015
Mentor Graphics Corp. today announced it has acquired the business assets of Tanner EDA, a tool provider for the design, layout and verification of analog/mixed-signal (AMS) and MEMS integrated circuits.

TowerJazz begins mass production of advanced IR sensor

Tue, 3 Mar 2015
TowerJazz, a specialty foundry, announced today it has begun mass production of an IR sensor used by Intel in one of its new 3D sensing solutions.

Intel honors 21 companies with Preferred Quality Supplier and Achievement Awards

Wed, 3 Mar 2015
Intel Corporation today announced that 19 companies will receive the 2014 Intel Preferred Quality Supplier (PQS) award that recognizes commitment to performance excellence and continuous improvement.

Mentor Graphics joins the Center for Power Electronics Systems

Wed, 3 Mar 2015
Mentor Graphics Corporation today announced that it has joined the Center for Power Electronics Systems (CPES) at Virginia Tech, the industry consortium dedicated to improving electrical power processing and distribution across various systems.

UT Dallas technology could make night vision, thermal imaging affordable

Wed, 3 Mar 2015
Semiconductors made in CMOS technology reach nearly 10 terahertz.

Boston Semi Equipment completes relocation of headquarters and Aetrium test handler business

Thu, 3 Mar 2015
The new facility houses corporate functions as well as the Aetrium test handler business acquired in 2014 and relocated from Minnesota to Massachusetts.

Graphene meets heat waves

Fri, 3 Mar 2015
In the race to miniaturize electronic components, researchers are challenged with a major problem: the smaller or the faster your device, the more challenging it is to cool it down.

Dr. Zixue Zhou appointed as Chairman of SMIC

Mon, 3 Mar 2015
Semiconductor Manufacturing International Corporation ("SMIC"), the largest pure-play foundry provider in China, has appointed Dr. Zixue Zhou as the new chairman and executive director of SMIC. Dr. Zhou's position as chairman will become effective as of today.

Squeezing out new science from material interfaces

Mon, 3 Mar 2015
With more than five times the thermal conductivity of copper, diamond is the ultimate heat spreader. But the slow rate of heat flow into diamond from other materials limits its use in practice.

CEA-Leti announces launch of Silicon Impulse IC design competence center

Tue, 3 Mar 2015
CEA-Leti today announced the launch of its Silicon Impulse IC design competence center, a comprehensive IC technology platform offering IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.

Applied Materials honored as a 2015 World's Most Ethical Company

Tue, 3 Mar 2015
Applied Materials, Inc. today announced it has been recognized as a 2015 World's Most Ethical Company by the Ethisphere Institute.

Mid-IR frequency combs enable high resolution spectroscopy for sensitive gas sensing

Tue, 3 Mar 2015
The results are an important step towards a small-footprint chip scale mid-infrared frequency comb source.

Strong fab equipment spending expected in 2015; Slowing but positive 2016

Tue, 3 Mar 2015
SEMI today announced an update of the SEMI World Fab Forecast report which updates outlooks for 2015 and 2016.

11 IC product categories to exceed total IC market growth in 2015

Thu, 3 Mar 2015
IC Insights’ March Update to the 2015 McClean Report (being released later this month) refreshes the forecasts for 33 major IC product categories through 2019.

Cypress and Spansion complete $5 Billion merger

Fri, 3 Mar 2015
Cypress Semiconductor Corp. and Spansion, Inc. announced that they have closed the merger of the two companies in an all-stock, tax-free transaction valued at approximately $5 billion.

XMC ships over 100 million units of backside illumination CMOS image sensors

Thu, 3 Mar 2015
XMC, a 300mm semiconductor manufacturing company, today announces it has shipped over 100 million Backside Illumination (BSI) CMOS Image Sensor (CIS) units.

Recovering economies driving growth in the industrial semiconductor market

Mon, 3 Mar 2015
The industrial semiconductor market will post a 9.7 percent compound annual growth rate (CAGR) over the next several years as revenue rises from $34.8 billion in 2013 to $55.2 billion in 2018.

SEMI reports 2014 global semiconductor equipment sales of $37.5B

Tue, 3 Mar 2015
SEMI today reported that worldwide sales of semiconductor manufacturing equipment totaled $37.50 billion in 2014, representing a year-over-year increase of 18 percent.

Imec to honor TSMC Chairman Dr. Morris Chang with "Lifetime of Innovation Award"

Tue, 3 Mar 2015
Nano-electronics research center imec has announced that it will award Dr. Morris Chang, founding chairman of Taiwan Semiconductor Manufacturing Company, Limited (TSMC), the world's first and largest semiconductor foundry, with a lifetime of innovation award.

High tech start-ups to connect with investors at SEMICON Europa 2015

Tue, 3 Mar 2015
SEMICON Europa 2015 (October 6-8) will prominently feature second edition of this very successful program connecting early-stage companies with strategic investors, venture capitalists and other relevant stakeholders.

EV Group releases new configurations to its high-vacuum wafer bonding technology

Tue, 3 Mar 2015
EV Group introduced two new configurations to its EVG 580 ComBond series of automated high-vacuum covalent wafer bonding systems.

Poised for more growth

Tue, 3 Mar 2015
Strong fab equipment spending expected in 2015; Slower but positive 2016.

Entrepix adds 300mm CMP capabilities to Phoenix foundry

Tue, 3 Mar 2015
Entrepix, Inc., a provider of chemical mechanical polishing (CMP) equipment and process services, today announced that it has expanded its foundry operations in Phoenix, Arizona by installing 300mm chemical mechanical planarization (CMP) processing.

Notchless wafer standard approved

Tue, 3 Mar 2015
450mm notchless wafer standardization has been under discussion for over a year.

Process Watch: Know your enemy

Wed, 3 Mar 2015
Anything that degrades the quality of the measurement also degrades the quality of the process because it introduces more variability into the Statistical Process Control (SPC) charts which are windows into the health of the process.

AKM Semiconductor signs global distribution agreement with Digi-Key

Wed, 3 Mar 2015
Global electronic components distributor Digi-Key Corporation, a provider of electronic component selection, availability and delivery, has partnered with AKM Semiconductor Inc., to facilitate the global distribution of AKM’s products.

MACOM announces new 650 W GaN on SiC HEMT pulsed power transistor

Wed, 3 Mar 2015
M/A-COM Technology Solutions Inc. today announced a 650 W gallium nitride (GaN) on silicon carbide (SiC) HEMT pulsed power transistor for L-band pulsed avionics applications.

Rice fine-tunes quantum dots from coal

Wed, 3 Mar 2015
Rice University scientists gain control of electronic, fluorescent properties of coal-based graphene.

NXP-Freescale merger to result in world's eighth largest chip maker

Wed, 3 Mar 2015
The recent acquisition of Freescale Semiconductor by NXP Semiconductors would catapult the merged entity into the world’s eighth-largest chipmaker, positioning the newly minted giant for an even more formidable presence in key industrial sectors, according to IHS.

Small powerful systems give rise to medical semiconductor sales

Thu, 3 Mar 2015
Market for medical semiconductors seen rising to $8.2 billion in 2018.

NC State researchers create 'nanofiber gusher'

Thu, 3 Mar 2015
Engineers and researchers at North Carolina State University and one of its start-up companies have now reported a method that can produce unprecedented amounts of polymer nanofibers, which have potential applications in filtration, batteries and cell scaffolding.

North American semiconductor equipment industry posts February 2015 book-to-bill ratio of 1.02

Fri, 3 Mar 2015
A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

NXP and GlobalFoundries announce production of 40nm embedded non-volatile memory technology

Tue, 3 Mar 2015
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, and NXP Semiconductor N.V, a semiconductor company for secure connection solutions, today announced that they have jointly developed a next-generation embedded non-volatile memory.

Silicon Labs and Digi-Key challenge developer innovation with "Your IoT" design competition

Tue, 3 Mar 2015
Silicon Labs and Digi-Key today announced an IoT design contest for pioneering developers who want to create connected "things" that will help make the world a smarter, more connected and energy-friendly place.

UW scientists build a nanolaser using a single atomic sheet

Tue, 3 Mar 2015
University of Washington scientists have built a new nanometer-sized laser -- using the thinnest semiconductor available today -- that is energy efficient, easy to build and compatible with existing electronics.

'Goldilocks material' could change spintronics

Tue, 3 Mar 2015
Attempting to develop a novel type of permanent magnet, a team of researchers at Trinity College in Dublin, Ireland has discovered a new class of magnetic materials based on Mn-Ga alloys.

Stephen G. Daly joins MACOM's Board of Directors

Tue, 3 Mar 2015
M/A-COM Technology Solutions Holdings, Inc., a supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor products, today announced the appointment of Stephen G. Daly as an independent director.

Silicon Space Technology appoints Bernd Lienhard as New CEO

Tue, 3 Mar 2015
Silicon Space Technology today announced that its Board of Directors appointed Bernd Lienhard as the company’s Chief Executive Officer, replacing David Patterson who has been interim CEO for the past three months.

First quarter semiconductor sales up 6% compared to last year

Mon, 5 May 2015
The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $83.1 billion during the first quarter of 2015, an increase of 6.0 percent compared to the first quarter of 2014.

Dr. Terry Brewer receives the Kathryn C. Hach Award for Entrepreneurial Success from the American Chemical Society

Wed, 3 Mar 2015
Dr. Terry Brewer, founder and CEO of Brewer Science, was presented the Kathryn C. Hach Award for Entrepreneurial Success on Tuesday, March 24, 2015, at the American Chemical Society’s 249th National Meeting.

Imec demonstrates 50GHz Ge waveguide electro-absorption modulator

Wed, 3 Mar 2015
At this week’s OFC 2015, the largest global conference and exposition for optical communications, nanoelectronics research center imec, its associated lab at Ghent University (Intec), and Stanford University have demonstrated a compact germanium (Ge) waveguide electro-absorption modulator (EAM) with a modulation bandwidth beyond 50GHz.

Micron and Intel unveil new 3D NAND flash memory

Thu, 3 Mar 2015
Micron Technology, Inc. and Intel Corporation today revealed the availability of their 3D NAND technology, the world’s highest-density flash memory.

University of Illinois at Urbana-Champaign research reduces microprocessor serial link power consumption

Tue, 3 Mar 2015
SRC sponsored research promises to cut serial link power by 80 Percent, helping extend Moore’s Law.

Chemists make new silicon-based nanomaterials

Fri, 3 Mar 2015
Chemists from Brown University have come up with a way to make new nanomaterials from a silicon-based compound.

Solving molybdenum disulfide's 'thin' problem

Fri, 3 Mar 2015
Research team increases material's light emission by twelve times.

Imec and sureCore collaborate on SRAM Design IP

Tue, 3 Mar 2015
sureCore Ltd., the low power SRAM IP company and nanoelectronics R&D center imec today announced that they are collaborating on low-power SRAM IP.

NXP-Freescale fusion creates automotive semiconductor powerhouse, IHS Says

Tue, 3 Mar 2015
The merged company would become the leading supplier of semiconductors to the automotive market, with at least $1 billion more revenue than the next-largest supplier, Renesas.

Pibond introduces a new product line for logic, memory, power and MEMS devices

Wed, 4 Apr 2015
Targeting 10nm node semiconductor processing, 3D NAND, power ICs as well as MEMS applications, this technology enables advanced device manufacturing through reduced cost of ownership (COO) and simplified processing.

Supplier Hub answers the needs of a changing semiconductor industry

Thu, 4 Apr 2015
Supplier Hub answers the needs of a changing semiconductor industry.

Advanced analytics for yield improvement and zero defect in semiconductors

Thu, 4 Apr 2015
Machine learning based advanced analytics for anomaly detection offers powerful techniques that can be used to achieve breakthroughs in yield and field defect rates.

Imaging tomorrow’s components, acoustically

Thu, 4 Apr 2015
Packages are changing. Acoustic methods provide a way to image and analyze them.

Southeast Asia to spend $19B for semiconductor equipment and materials by 2016

Thu, 4 Apr 2015
Programme information is now available on the inaugural SEMICON Southeast Asia, which will run from 22–24 April at SPICE in Penang.

U.S.-headquartered companies capture bulk of IDM, fabless IC sales

Fri, 4 Apr 2015
Recent acquisitions expeted to boost Europe's share in coming years.

AWSC purchases ClassOne’s Solstice S8 electroplater

Fri, 4 Apr 2015
Semiconductor equipment manufacturer ClassOne Technology announced the sale and delivery of its Solstice S8 Plating System to Advanced Wireless Semiconductor Company (AWSC) of Taiwan.

TSMC certifies Synopsys design tools for 16nm finFET plus production and for 10nm early design starts

Mon, 4 Apr 2015
This certification enables mutual customers to deploy tools in Synopsys' Galaxy Design Platform for 16nm production designs and 10nm early engagements.

Global semiconductor sales increase in February compared to last year

Mon, 4 Apr 2015
The Semiconductor Industry Association today announced worldwide sales of semiconductors reached $27.8 billion for the month of February 2015, an increase of 6.7 percent from February 2014 when sales were $26.0 billion.

SEMI reports 2014 global semiconductor materials sales of $44.3B

Tue, 4 Apr 2015
The global semiconductor materials market increased 3 percent in 2014 compared to 2013 while worldwide semiconductor revenues increased 10 percent.

Future electronics based on carbon nanotubes

Tue, 4 Apr 2015
The exceptional properties of tiny molecular cylinders known as carbon nanotubes have tantalized researchers for years because of the possibility they could serve as a successors to silicon in laying the logic for smaller, faster and cheaper electronic devices.

Flexible facilities for 450mm wafer fabs

Tue, 4 Apr 2015
When the commercial semiconductor manufacturing industry decides to move to the next wafer size of 450mm, it will be time to re-consider equipment and facilities strategies.

Techniques for simplifying pulsed measurements: Part 2

Wed, 4 Apr 2015
Common pulsed measurement challenges are defined.

2014: A year in review - Semiconductor equipment and materials market and outlook

Thu, 4 Apr 2015
2014 was the second record breaking year in a row in terms of semiconductor device revenues; the industry grew a robust 10 percent to total $336 billion, according to the WSTS.

Quantization of 'surface Dirac states' could lead to exotic applications

Tue, 4 Apr 2015
Researchers from the RIKEN Center for Emergent Matter Science in Japan have uncovered the first evidence of an unusual quantum phenomenon--the integer quantum Hall effect--in a new type of film, called a 3D topological insulator.

Graphene looking promising for future spintronic devices

Fri, 4 Apr 2015
Researchers at Chalmers University of Technology have discovered that large area graphene is able to preserve electron spin over an extended period, and communicate it over greater distances than had previously been known.

New understanding of electromagnetism could enable 'antennas on a chip'

Fri, 4 Apr 2015
A team of researchers from the University of Cambridge have unravelled one of the mysteries of electromagnetism, which could enable the design of antennas small enough to be integrated into an electronic chip. These ultra-small antennas - the so-called 'last frontier' of semiconductor design - would be a massive leap forward for wireless communications.

IDT appoints semiconductor veteran Robert A. Rango to Board of Directors

Fri, 4 Apr 2015
Integrated Device Technology, Inc. today announced that Robert A. Rango, a former Broadcom Corp. executive with extensive leadership skills in the global semiconductor market, has been appointed to IDT’s Board of Directors, effective April 6, 2015.

Duke University research advances testing of 3D integrated circuits for cost-effective development of electronics

Tue, 4 Apr 2015
Duke University researchers are working to advance the tools and methodologies used to test 3D integrated circuits (ICs), which promise to help ensure the ongoing development of higher performance, lower power semiconductor chips.

SEMI reports 2014 semiconductor photomask sales of $3.2B

Tue, 4 Apr 2015
SEMI reports that the worldwide semiconductor photomask market was $3.2 billion in 2014 and is forecasted to reach $3.4 billion in 2016.

Fifty years of Moore's Law made possible by semiconductor equipment and materials suppliers worldwide

Tue, 4 Apr 2015
April 2015 marks the 50th anniversary of one of the business world’'s most profound drivers, now commonly referred to as Moore's Law.

GaN Systems seals distribution deal in Japan and Asia

Tue, 4 Apr 2015
GaN Systems Inc., a developer of gallium nitride power switching semiconductors, today announced it has signed an agreement with Japanese semiconductor and electronic component distributor, Value Integrated Technology (Vitec).

KLA-Tencor introduces new portfolio for advanced semiconductor packaging

Thu, 4 Apr 2015
Today, KLA-Tencor Corporation announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830.

Semiconductor CEOs urge congress to enact Trade Promotion Authority

Thu, 4 Apr 2015
The SIA board of directors, led by Intel CEO and SIA chairman Brian Krzanich, sent a letter today to congressional leaders expressing support for the legislation and urging its swift passage.

Top 10 2015 semiconductor sales leaders forecast to include NXP/Freescale

Fri, 4 Apr 2015
Total top 10 marketshare of semiconductor industry now back over 50 percent.

Engineer improves rechargeable batteries with MoS2 nano 'sandwich'

Fri, 4 Apr 2015
The key to better cellphones and other rechargeable electronics may be in tiny "sandwiches" made of nanosheets, according to mechanical engineering research from Kansas State University.

Applied Materials announces new photomask etch system

Mon, 4 Apr 2015
Applied Materials today announced the Applied Centura Tetra Z Photomask Etch system for etching next-generation optical lithographic photomasks needed by the industry to continue multiple patterning scaling to the 10nm node and beyond.

MagnaChip to offer diversified products for Internet of Things applications

Mon, 4 Apr 2015
MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products announced today that it has kicked-off an Internet of Things (IoT) task force and will offer diversified products with ultra-low power technology in anticipation of the fast growing IoT market.

Global semiconductor market achieves strong, broad-based growth in 2014

Mon, 4 Apr 2015
Highest annual growth rate since 2010; strong growth expected again in 2015.

SiVance, LLC opens R&D lab to drive innovations in specialty silane and silicone technologies

Tue, 4 Apr 2015
SiVance, LLC, a subsidiary of Milliken & Company, today announced the opening of a new, 11,000 sq.ft. research and development (R&D) laboratory.

Synopsys to acquire software security company Codenomicon

Tue, 4 Apr 2015
Synopsys, Inc. today announced it has signed a definitive agreement to acquire Codenomicon.

Synopsys' modeling of 10nm parasitic variation effects ratified by open-source standards board

Tue, 4 Apr 2015
Synopsys, Inc. today announced new extensions to its open-source Interconnect Technology Format (ITF) which enable modeling of complex device and interconnect parasitic effects at the advanced 10-nanometer (nm) process node.

SPTS Technologies receives Supplier Excellence Award from Analog Devices

Tue, 4 Apr 2015
Orbotech LTD. today announced that SPTS Technologies, an Orbotech company and supplier of advanced wafer processing solutions for the global semiconductor and related industries, was presented with a Supplier Excellence Award in the ‘Special Achievement’ category at the Analog Devices annual award ceremony held in Hong Kong.

North American semiconductor equipment industry posts March 2015 book-to-bill ratio of 1.10

Wed, 4 Apr 2015
A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.

How emerging IoT impacts the semiconductor sector

Thu, 4 Apr 2015
In this 50th year anniversary of Moore’s Law, the steady scaling of silicon chips’ cost and performance that has so changed our world over the last half century is now poised to change it even further through the Internet of Things.

Communications, computer systems drive IC sales across all regions

Thu, 4 Apr 2015
Automotive systems forecast to remain a major application in Europe.

From metal to insulator and back again

Thu, 4 Apr 2015
New work from Carnegie's Russell Hemley and Ivan Naumov hones in on the physics underlying the recently discovered fact that some metals stop being metallic under pressure.

UGA chemists' synthesis of silicon oxides opens 'new world in a grain of sand'

Thu, 4 Apr 2015
In an effort that reaches back to the 19th-century laboratories of Europe, a discovery by University of Georgia chemistry researchers establishes new research possibilities for silicon chemistry and the semiconductor industry.

Surface matters: Huge reduction of heat conduction observed in flat silicon channels

Thu, 4 Apr 2015
A paper published in ACS Nano describes how the nanometre-scale topology and the chemical composition of the surface control the thermal conductivity of ultrathin silicon membranes.

Silicon Motion announces agreement to acquire Shannon Systems

Fri, 4 Apr 2015
Silicon Motion Technology Corporation, a developer of NAND flash controllers for solid state storage devices, today announced that it has entered into a definitive agreement to acquire Shannon Systems.

Applied Materials and Tokyo Electron terminate merger

Mon, 4 Apr 2015
The decision came after the U.S. Department of Justice (DoJ) advised the parties that the coordinated remedy proposal submitted to all regulators would not be sufficient to replace the competition lost from the merger

Two-dimensional semiconductor comes clean

Tue, 4 Apr 2015
Researchers at Columbia Engineering, Harvard, Cornell, University of Minnesota, Yonsei University in Korea, Danish Technical University, and the Japanese National Institute of Materials Science have shown that the performance of another 2D material--molybdenum disulfide (MoS2)--can be similarly improved by BN-encapsulation.

Brewer Science and Nissan Chemical Industries formalize agreement expanding support for the semiconductor industry

Tue, 4 Apr 2015
Brewer Science, Inc., and Nissan Chemical Industries, Ltd., announced they have formally extended their business relationship through 2028.

Imec reports 9% growth in 2014

Wed, 4 Apr 2015
Nanoelectronics research center imec, today reported the financial results for fiscal year ended December 31, 2014.

Georgia Tech research offers novel cellular sensing platform for expanded use of semiconductor in biotech applications

Thu, 4 Apr 2015
Researchers from the Georgia Institute of Technology have developed a novel cellular sensing platform that promises to expand the use of semiconductor technology in the development of next-generation bioscience and biotech applications.

Entegris elects James P. Lederer to Board of Directors

Fri, 5 May 2015
Entegris, Inc., a provider of yield-enhancing materials and solutions for advanced manufacturing processes, announced the election of James P. Lederer as an independent director at the Company's Annual Meeting of Shareholders held today.

Dow's SOLDERON tin-silver plating chemistry wins prestigious Bronze Edison Award

Fri, 5 May 2015
Dow Electronic Materials, a business unit of The Dow Chemical Company, today announced that its SOLDERON BP TS 6000 Tin-Silver Plating Chemistry was honored as a Bronze 2015 Edison Award winner in the Material Science: Manufacturing category.

Intel and the Department of Science and Technology launch the "Innovate for Digital India Challenge"

Fri, 5 May 2015
Intel in India reinforced its commitment to the Government of India's Digital India vision with the announcement of the Intel and DST "Innovate for Digital India Challenge", which will focus on the creation of products to increase technology adoption in India that will eventually result in the creation of a local technology ecosystem.

SEMI releases 4th Quarter 2014 worldwide photovoltaic equipment market statistics report

Thu, 4 Apr 2015
SEMI, the global industry association serving the manufacturing supply chain for the micro- and nano-electronics industries, this week reported that for the quarter ended December 31, 2014, worldwide photovoltaic manufacturing equipment book-to-bill ratio remained below parity, at 0.68.

SEMATECH and Exogenesis form strategic alliance to commercialize accelerated neutral atom beam tech

Mon, 5 May 2015
SEMATECH and Exogenesis Corp. have agreed to a strategic alliance to commercialize Exogenesis' Accelerated Neutral Atom Beam (ANAB) technology and their nAcceltm accelerated particle beam equipment platform.

New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead

Mon, 5 May 2015
A new study coauthored by Wellesley economist, Professor Daniel E. Sichel, reveals that innovation in an important technology sector is happening faster than experts had previously thought, creating a backdrop for better economic times ahead.

MagnaChip announces management changes

Mon, 5 May 2015
MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that Tae Young Hwang has resigned as the Company's Chief Operating Officer and President and from all other officer and director positions.

Improving organic transistors that drive flexible and conformable electronics

Tue, 5 May 2015
A revolution is coming in flexible electronic technologies as cheaper, more flexible, organic transistors come on the scene to replace expensive, rigid, silicone-based semiconductors, but not enough is known about how bending in these new thin-film electronic devices will affect their performance.

Defects in atomically thin semiconductor emit single photons

Tue, 5 May 2015
Researchers at the University of Rochester have shown that defects on an atomically thin semiconductor can produce light-emitting quantum dots.

"Microcombing" creates stronger, more conductive carbon nanotube films

Tue, 5 May 2015
Researchers from North Carolina State University and China's Suzhou Institute of Nano-Science and Nano-Biotics have developed an inexpensive technique called "microcombing" to align carbon nanotubes.

Silicon Storage Technology, GLOBALFOUNDRIES announce qualification of automotive grade 55nm flash memory tech

Tue, 5 May 2015
Microchip Technology Inc., through its Silicon Storage Technology subsidiary, and GLOBALFOUNDRIES today announced the full qualification and availability of SST’s 55nm embedded SuperFlash non-volatile memory on GLOBALFOUNDRIES’ 55nm Low Power Extended (LPx)/ RF enabled platform.

Co-design of chips, packages and boards

Wed, 5 May 2015
A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools.

New JEOL e-beam lithography system to enhance Quantum NanoFab capabilities

Wed, 5 May 2015
A JEOL e-beam lithography system will soon be a new resource for quantum information science researchers that utilize the cutting-edge facilities at the University of Waterloo Quantum NanoFab in Waterloo, Ontario.

Enhanced thermal management solutions for RF power amplifiers

Wed, 5 May 2015
Synthetic diamond heat spreaders and GaN-on-Diamond wafers have emerged as a leading thermal- management technology for RF Power Amplifiers.

Understanding the structural and optical properties of silicon nitride

Thu, 5 May 2015
Using first-principles calculations, the electronic structures and optical properties that arise on doping-atom-containing silicon nitride systems are reported as a function of dielectric constant, reflectivity, absorption and loss spectra.

Visualizing formation in BEOL

Thu, 5 May 2015
New tests show in real-time that cracks can run on top of and through metal layers.

New approaches to small problems

Thu, 5 May 2015
The market expectations of modern electronics technology are changing the landscape in terms of performance and, in particular, power consumption, and new innovations are putting unprecedented demands on semiconductor devices.

Channeling valleytronics in graphene

Thu, 5 May 2015
To the list of potential applications of graphene - a two-dimensional semiconductor of pure carbon that is stronger and much faster than silicon - we can now add valleytronics.

ASE and TDK announce plans for joint venture agreement

Fri, 5 May 2015
Driving towards market leadership in setting the industry standard for semiconductor miniaturization in portable and wearable consumer devices.

TI strengthens analog marketshare; Skyworks gains from Apple's favor

Mon, 5 May 2015
Top 10 suppliers accounted for 57% of analog sales in 2014; 9 of 10 top suppliers with analog sales greater than $1.0 billion.

High-performance 3-D microbattery suitable for large-scale on-chip integration

Tue, 5 May 2015
By combining 3D holographic lithography and 2D photolithography, researchers from the University of Illinois at Urbana-Champaign have demonstrated a high-performance 3D microbattery suitable for large-scale on-chip integration with microelectronic devices.

JSR and imec partner to enable next generation EUV lithography resist solutions

Tue, 5 May 2015
JSR Corporation, a materials company and imec, a nanoelectronics R&D center, today signed a Letter of Intent (LOI) to partner in enabling manufacturing and quality control of EUV lithography materials for the semiconductor industry.

IEEE International Electron Devices Meeting announces 2015 Call for Papers

Tue, 5 May 2015
The paper submission deadline is Monday, June 22, 2015 at 23:59 p.m. Pacific Time.

IBM's silicon photonics technology ready to speed up cloud and Big Data applications

Tue, 5 May 2015
IBM today announced a significant milestone in the development of silicon photonics technology, which enables silicon chips to use pulses of light instead of electrical signals over wires to move data at rapid speeds and longer distances in future computing systems.

Micron Technology names Ernie Maddock as Chief Financial Officer

Tue, 5 May 2015
Micron Technology, Inc. this week announced that the company has appointed Ernie Maddock as Chief Financial Officer and Vice President, Finance, effective June 1, 2015.

Samsung announces ARTIK platform to accelerate Internet of Things development

Tue, 5 May 2015
Samsung Electronics Co., Ltd. today announced the Samsung ARTIK platform to allow faster, simpler development of new enterprise, industrial and consumer applications for the Internet of Things (IoT).

Intel, eASIC collaborate on customized Intel-based solutions for the cloud

Tue, 5 May 2015
Intel Corporation today announced plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the increasing demand for custom compute solutions for data centers and the "cloud."

Moore's Law to keep on 28nm

Wed, 5 May 2015
Scaling is now bifurcating - some scaling on with 28/22nm, while other push below 14nm.

SRC names former Freescale CTO Ken Hansen as new president and CEO

Thu, 5 May 2015
Semiconductor Research Corporation (SRC) announced today that Ken Hansen has been appointed SRC’s new President and Chief Executive Officer (CEO), effective June 1.

Freescale speeds the creation of sensor applications for a secure IoT

Thu, 5 May 2015
Freescale Semiconductor today introduced its Intelligent Sensing Framework (ISF) 2.1, which now includes integration with Freescale’s Processor Expert tool to help create, configure, and generate embedded sensor-based applications for Freescale microcontrollers (MCUs).

Process Watch: Time is the enemy of profitability

Thu, 5 May 2015
There are three main phases to semiconductor manufacturing: research and development (R&D), ramp, and high volume manufacturing (HVM). All of them are expensive and time is a critical element in all three phases.

Peregrine Semiconductor announces new general manager VP

Tue, 5 May 2015
Peregrine Semiconductor Corp., founder of RF SOI, today announced the promotion of Duncan Pilgrim to vice president and general manager of the newly formed high performance analog (HPA) business unit.

SEMICON West 2015 focuses on the most critical issues in semiconductor manufacturing

Fri, 5 May 2015
SEMI today announced the SEMICON West 2015 technical and business program agenda tackling the most important issues facing the future of semiconductor manufacturing.

Silicon Storage Technology, GLOBALFOUNDRIES announce qualification of automotive grade 55nm embedded flash tech

Fri, 5 May 2015
Microchip Technology Inc. and GLOBALFOUNDRIES today announced the full qualification and availability of SST's 55nm embedded SuperFlash non-volatile memory (NVM) on GLOBALFOUNDRIES' 55nm Low Power Extended (LPx)/ RF enabled platform.

Random nanowire configurations increase conductivity over heavily ordered configurations

Fri, 5 May 2015
Researchers at Lehigh University have identified for the first time that a performance gain in the electrical conductivity of random metal nanowire networks can be achieved by slightly restricting nanowire orientation.

Applied Materials' breakthrough patterning hard mask enables copper interconnect scaling

Tue, 5 May 2015
Applied Materials, Inc. today announced its Applied Endura Cirrus HTX PVD system with breakthrough technology for patterning copper interconnects at 10nm and beyond.

First quarter silicon wafer shipments reach record levels

Tue, 5 May 2015
Worldwide silicon wafer area shipments increased during the first quarter 2015 when compared to fourth quarter 2014 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

imec and Lam Research develop novel metallization method

Tue, 5 May 2015
During the IEEE IITC conference in Grenoble, the nanoelectronics research center imec and Lam Research Corporation today presented a novel bottom-up prefill technique for vias and contacts.

EV Group NILphotonics Competence Center sees strong demand For emerging photonic applications

Tue, 5 May 2015
Newly launched center assisting customers in developing products and applications in photonics; leads to multiple system orders.

Computing at the speed of light

Tue, 5 May 2015
University of Utah engineers have taken a step forward in creating the next generation of computers and mobile devices capable of speeds millions of times faster than current machines.

Freescale introduces its first GaN RF power transistor for cellular base stations

Tue, 5 May 2015
Freescale Semiconductor today introduced its first gallium nitride (GaN) RF power transistor for cellular base stations.

Advantest launches its first integrated test solution for optical transceivers

Tue, 5 May 2015
Semiconductor test equipment supplier Advantest Corporation has introduced its new 28G OPM (28-gigabit Optical Port Module), the company's first solution designed specifically for testing optical transceivers.

GLOBALFOUNDRIES offers new low-power 28nm solution for high-performance mobile and IoT applications

Wed, 5 May 2015
Technology is the first in the industry to provide design enablement support optimized to meet low power requirements of RF SoCs.

imec and Tokyo Electron demonstrate electrical advantages of direct Cu etch scheme for advanced interconnects

Wed, 5 May 2015
Today, at the IEEE IITC conference, nano-electronics research center imec and Tokyo Electron Limited (TEL) presented a direct Cu etch scheme for patterning Cu interconnects.

3D NAND, MRAM, RRAM: Emerging opportunities and challenges for the changing memory market

Thu, 5 May 2015
Ever growing volumes of data to be stored and accessed, and advancing process technologies for sophisticated control of deposition and etch in complex stacks of new materials, are creating a window of opportunity for an emerging variety of next-generation non-volatile memory technologies.

Six top 20 semiconductor suppliers show >20% growth

Thu, 5 May 2015
SK Hynix moves into top 5, MediaTek climbs into top 10, and Sharp and UMC move into the top 20 ranking.

SRC awarded NIST funding to develop Semiconductor Synthetic Biology Consortium

Thu, 5 May 2015
Semiconductor Research Corporation announced that it has received funding from the National Institute of Standards and Technology (NIST) Advanced Manufacturing Technology (AMTech) program to create a Semiconductor Synthetic Biology (SemiSynBio) consortium whose mission is to develop a SemiSynBio roadmap.

Samtec joins IRT Nanoelec Silicon Photonics Program

Thu, 5 May 2015
Samtec, Inc., a supplier of high-speed interconnects, microelectronics, and micro-optical solutions, is pleased to announce its entrance in the Silicon Photonics Program of the IRT Nanoelec.

Dow Corning introduces next-generation thermal interface material

Tue, 5 May 2015
Dow Corning, a developer of silicones, silicon-based technology and innovation, today unveiled new Dow Corning TC-3040 Thermally Conductive Gel, a next-generation thermal interface material.

Advantest develops semiconductor circuit analysis terahertz technology

Thu, 5 May 2015
Semiconductor test equipment supplier Advantest Corporation announced today that it has developed a technology utilizing short-pulse terahertz waves for analysis of electrical circuits.

Research institutes globally invest in Oxford Instruments' plasma systems for graphene and 2D materials development

Thu, 5 May 2015
As developments in graphene and 2D materials technology continue to increase, research institutes globally are investing in Oxford Instruments’ plasma processing Nanofab equipment using CVD, PECVD and ICPCVD techniques to further their work in this important area.

SEMI April 2015 book-to-bill report shows continued improvements in bookings and billings

Thu, 5 May 2015
A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

Infinitesima Ltd announces major RPM design win with Zeiss

Tue, 5 May 2015
Infinitesima announced today that its groundbreaking probe microscope has been integrated into the ZEISS MeRiT neXT photomask repair tool.

Digital Specialty Chemicals receives investment from Intel Capital

Tue, 5 May 2015
Digital Specialty Chemicals Limited (DSC), a dual bottom line corporation and leading provider of advanced materials to the semiconductor, pharmaceutical, and specialty chemical markets, announced that it has received an equity investment from Intel Capital, Intel Corporation’s global investment organization.

GaN Systems power transistors are 50% smaller

Tue, 5 May 2015
GaN Systems, a developer of gallium nitride power switching semiconductors, today confirmed the world’s smallest 650V, 15A gallium nitride transistor.

UMC unveils UMC Auto Platform to enable automotive IC designs

Tue, 5 May 2015
United Microelectronics Corporation, a global semiconductor foundry, today unveiled its UMC Auto technology platform to target IC companies designing chips for automotive applications.

Collaboration could lead to biodegradable computer chips

Fri, 5 May 2015
Portable electronics - typically made of non-renewable, non-biodegradable and potentially toxic materials - are discarded at an alarming rate in consumers' pursuit of the next best electronic gadget.

Avago Technologies to acquire Broadcom for $37B

Fri, 5 May 2015
Avago Technologies Limited and Broadcom Corporation today announced that they have entered into a definitive agreement under which Avago will acquire Broadcom in a cash and stock transaction that values the combined company at $77 billion in enterprise value.

NXP Semiconductors announces agreement to sell RF power business

Fri, 5 May 2015
NXP Semiconductors N.V. today announced an agreement that will facilitate the sale of its RF Power business to Jianguang Asset Management Co. Ltd.

Tablet shipments lose momentum; Total PC unit forecast downgraded

Fri, 5 May 2015
IC Insights has downgraded its forecast for the overall personal computing market, including much lower growth in tablets and continued weakness in standard PCs.

North America: A critical player in the advanced semiconductor market

Mon, 6 Jun 2015
As the fabless business model has transformed the semiconductor manufacturing landscape, Taiwan and South Korea have undeniably grown into key semiconductor producing regions. However, it should be noted that North America is home to Intel, Texas Instruments, Micron, GLOBALFOUNDRIES, Freescale, Fairchild, Microchip, ON Semiconductor, significant operations of Samsung, and other manufacturers.

Eulitha delivers PHABLE Photolithography System to MESA+ NanoLab

Tue, 6 Jun 2015
EULITHA, a Swiss startup company offering innovative lithography equipment and services for the nanotechnology, photonics and optoelectronic markets announced today the delivery of its unique PhableR 100 photolithography tool to the MESA + NanoLab of the University of Twente in the Netherlands.

GLOBALFOUNDRIES solidifies 14nm finFET design infrastructure for next-generation chip design

Tue, 6 Jun 2015
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced it has reached a critical milestone in providing a design infrastructure for its 14-nanometer (nm) FinFET process technology.

Avago Technologies acquisition of Broadcom creates new semiconductor powerhouse

Tue, 6 Jun 2015
Merger activity in the semiconductor industry moved to a new level with the announcement of the agreement for Avago Technologies to acquire Broadcom.

Entegris reaches milestones at its i2M Center for Advanced Materials Science

Thu, 6 Jun 2015
Entegris, Inc., a developer of yield-enhancing materials and solutions for highly advanced manufacturing environments, announced the first shipments of production quantities of UPE (ultra-high molecular weight polyethylene) membrane from its i2M Center for Advanced Materials Science in Bedford, Massachusetts.

Global semiconductor sales increase in April; Steady growth projected

Wed, 6 Jun 2015
The Semiconductor Industry Association (SIA) announced worldwide sales of semiconductors reached $27.6 billion for the month of April 2015, 4.8 percent higher than the April 2014 total of $26.3 billion and 0.4 percent lower than last month's total of $27.7 billion.

Is it time to switch to OASIS.MASK?

Thu, 6 Jun 2015
A summary of OASIS standard advantages and weaknesses is presented, based on six years of experience with customer databases.

Fab equipment growth continues into 2015

Thu, 6 Jun 2015
Fab equipment spending is forecast to depart from the typical historic trend over the past 15 years of two years of spending growth followed by one of decline. For the first time, equipment spending could grow every year for three years in a row: 2014, 2015, and 2016.

A major advance in mastering the extraordinary properties of an emerging semiconductor

Fri, 6 Jun 2015
Black phosphorus reveals its secrets thanks to a scientific breakthrough made by a team from Universite de Montreal, Polytechnique Montreal and CNRS in France.

Reduced defectivity and cost of ownership copper CMP cleans

Fri, 6 Jun 2015
A new, low pH, BTA free, noble-bond chemistry produced equivalent yield at substantially lower costs.

A novel characterization technique unveils the 3D structure of conductive filaments in resistive switching memories

Fri, 6 Jun 2015
Imec researchers have developed a novel technique – termed conductive atomic force microscopy tomography (or scalpel C-AFM) – that enables a three-dimensional characterization of emerging logic and memory devices.

Sankalp Semiconductor announces FD-SOI services and IP partnership with STMicroelectronics

Fri, 6 Jun 2015
Sankalp Semiconductor, a chip design service company, announced that it has signed an agreement with STMicroelectronics to serve as an FD-SOI services and IP partner.

Leti launches new Silicon Impulse FD-SOI Development Program

Mon, 6 Jun 2015
CEA-Leti announced today during the Design Automation Conference that seven partners have joined its new FD-SOI IC development program, Silicon Impulse.

Imagination and TSMC collaborate on advanced IoT IP platforms

Mon, 6 Jun 2015
Imagination Technologies (IMG.L) and TSMC announce a collaboration to develop a series of advanced IP subsystems for the Internet of Things (IoT) to accelerate time to market and simplify the design process.

Futuristic components on silicon chips, fabricated successfully

Mon, 6 Jun 2015
IBM researchers develop a technique for integrating 'III-V' materials onto silicon wafers, a breakthrough that may allow an extension to Moore's Law.

Move over, 16nm – here comes 10nm chips

Mon, 6 Jun 2015
Taiwan Semiconductor Manufacturing wants you to know that they’re ready, willing, and able to help you design chips with 10-nanometer features.

50 Years of Moore’s Law

Tue, 6 Jun 2015
For 50 years, Moore’s Law has served as a guide for technologists everywhere in the world, setting the pace for the semiconductor industry’s innovation cycle.

SEMI reports first quarter 2015 worldwide semiconductor equipment figures; billings $9.52B

Tue, 6 Jun 2015
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$9.52 billion in the first quarter of 2015.

imec presents large area industrial crystalline silicon n-PERT solar cell with record 22.5% efficiency

Wed, 6 Jun 2015
Nano-electronics research center imec announced today at Intersolar Europe, a new efficiency record for its large area n-type PERT (passivated emitter, rear totally diffused) crystalline silicon (Cz-Si) solar cell, now reaching 22.5 percent (calibrated at ISE CalLab).

Drive profitability through better forecasting

Wed, 6 Jun 2015
Different forecasting algorithms are highlighted and a framework is provided on how best to estimate product demand using a combination of qualitative and quantitative approaches.

IoT, Healthcare and 5G: Are we ready?

Tue, 6 Jun 2014
Imagine the world in 2020, only five years from now. If predictions hold true, more than 50 billion devices will be connected to the Internet (creating the Internet of Things), through smart homes, smart cities, smart factories, smart everything.

Safe CMP slurries

Tue, 6 Jun 2014
New chemical-mechanical planarization (CMP) processes for new materials planned to be used in building future IC devices are now in research and development (R&D).

ISSI agrees to merger terms with Cypress Semiconductor

Wed, 6 Jun 2015
Integrated Silicon Solution, Inc. today announced that it has finalized a definitive agreement to be acquired by Cypress Semiconductor Corporation for $20.25 per share in cash.

Slip sliding away: Graphene and diamonds prove a slippery combination

Wed, 6 Jun 2015
Scientists at the U.S. Department of Energy's Argonne National Laboratory have found a way to use tiny diamonds and graphene to give friction the slip, creating a new material combination that demonstrates the rare phenomenon of "superlubricity."

SPTS Technologies named among the 2015 10 Best Suppliers of chip making equipment by VLSIresearch

Wed, 6 Jun 2015
SPTS also ranked as a 2015 Best Supplier in the Fab Equipment Category.

Leti Workshop on June 26 to cover latest R&D successes in innovative memory technologies

Wed, 6 Jun 2015
CEA-Leti is hosting its seventh workshop on innovative memory technologies following the 17th annual LetiDays Grenoble, June 24-25, on the Minatec campus.

ASCENT project offers unparalleled access to European nanoelectronics infrastructure

Thu, 6 Jun 2015
Europe’s leading nanoelectronics institutes, Tyndall National Institute in Ireland, CEA-Leti in France and imec in Belgium, have entered a €4.7 million collaborative open-access project called ASCENT (Access to European Nanoelectronics Network).

Industry 4.0, automotive, and emerging markets highlights at SEMICON Europa

Thu, 6 Jun 2015
Today, SEMI announced that SEMICON Europa 2015, the region’s largest microelectronics manufacturing event, will offer new themes to support the semiconductor industry’'s development in Europe.

More change for the chip industry

Thu, 6 Jun 2015
As if scaling to 7nm geometries and going vertical with FinFETs, TSVs and other emerging technologies wasn’t challenge enough, the emerging market for connected smart devices will bring more changes to the semiconductor sector. And then there’s 3D printing looming in the wings.

“Easy does it” ─ Fabs trim spending plans

Fri, 6 Jun 2015
Still capex and equipment spending expected to increase in 2015 and 2016.

Researchers grind nanotubes to get nanoribbons

Mon, 6 Jun 2015
A simple way to turn carbon nanotubes into valuable graphene nanoribbons may be to grind them, according to research led by Rice University.

A KAIST research team develops the first flexible phase-change random access memory

Mon, 6 Jun 2015
Phase change random access memory (PRAM) is one of the strongest candidates for next-generation nonvolatile memory for flexible and wearable electronics.

Startups find strategic investors at SEMICON West 2015

Mon, 6 Jun 2015
SEMI today announced that SEMICON West 2015 will feature the Silicon Innovation Forum (SIF), a unique forum for strategic investors and key decision makers to meet new and emerging early-stage companies developing the future of microelectronics.

DCG Systems acquires MultiProbe

Mon, 6 Jun 2015
DCG Systems announced today that it has acquired the assets of MultiProbe, a provider of atomic force-based nanoprobing solutions for the semiconductor industry.

SK Hynix ramps production of high bandwidth memory

Tue, 6 Jun 2015
SK Hynix Inc. announced today that it is shipping mass production volumes of 1st generation High Bandwidth Memory (HBM1) based on SK hynix’s advanced 20nm-class DRAM process technology.

Leti workshop covers major trends in FD-SOI technologies

Tue, 6 Jun 2015
CEA-Leti will host a workshop on major trends in Fully Depleted Silicon-on-Insulator process and design technologies in connection with the 17th annual LetiDays Grenoble, June 24-25.

Plasma-Therm presents workshop at China University

Tue, 6 Jun 2015
Plasma-Therm recently presented an advanced plasma processing workshop at Xidian University in Xi’an, China that was attended by researchers, students and industry representatives and featured a day-long series of presentations about plasma processing.

IC manufacturers close or repurpose 83 wafer fabs from 2009-2014

Wed, 6 Jun 2015
150mm and 200mm wafer fabs account for two-thirds of total closures.

Researchers create transparent, stretchable conductors using nano-accordion structure

Thu, 6 Jun 2015
Researchers from North Carolina State University have created stretchable, transparent conductors that work because of the structures' "nano-accordion" design. The conductors could be used in a wide variety of applications, such as flexible electronics, stretchable displays or wearable sensors.

A new look at surface chemistry

Thu, 6 Jun 2015
For the first time in the long and vaunted history of scanning electron microscopy, the unique atomic structure at the surface of a material has been resolved.

North American semiconductor equipment industry posts May 2015 book-to-bill ratio of 0.99

Thu, 6 Jun 2015
North America-based manufacturers of semiconductor equipment posted $1.56 billion in orders worldwide in May 2015 (three-month average basis) and a book-to-bill ratio of 0.99.

Exagan raises €5.7M to produce high-efficiency GaN-on-Silicon power-switching devices on 200mm wafers

Tue, 6 Jun 2015
Exagan, a start-up innovator of gallium-nitride (GaN) semiconductor technology that enables smaller and more efficient electrical converters, today announced it has raised €5.7 million in first-round financing that will be used to produce high-speed power switching devices on 200mm wafers.

Sondrel announces further investment in graduate training for the semiconductor sector

Fri, 6 Jun 2015
Graham Curren, Sondrel CEO, has announced his commitment to further investment in the training of graduate engineers looking to develop a career in the IC design sector, by providing a teaching fellow, and nine scholarship awards to students engaged on the Sondrel University of Nottingham Ningbo (UNNC) School of VLSI Design.

First solar cell made of highly ordered molecular frameworks

Fri, 6 Jun 2015
"We have opened the door to a new room," says Professor Christof Wöll, Director of KIT Institute of Functional Interfaces (IFG).

IHS says Moore's Law led to trillions of dollars added to global economy

Fri, 6 Jun 2015
From connectivity to globalization and sustainability, the “Law” created by Gordon Moore’s prediction for the pace of semiconductor technology advances has set the stage for global technology innovation and contribution for 50 years.

Silicon Valley's specialty foundry Noel Technologies promotes Brenda Hill to VP

Mon, 6 Jun 2015
Noel Technologies, a specialty foundry in Silicon Valley providing process development and substrate fabrication for a variety of high-technology industries, has promoted Brenda Hill to vice president of business development, marketing and sales.

UMC collaborates with ARM to validate UMC 14nm finFET process

Mon, 6 Jun 2015
United Microelectronics Corporation, a global semiconductor foundry, today announced it has collaborated with ARM to tape out a process qualification vehicle (PQV) test chip on UMC's 14nm FinFET technology to help validate an ARM Cortex-A family core on the advanced foundry process node.

Cadence and Applied Materials collaborate on CMP process optimization

Mon, 6 Jun 2015
Cadence Design Systems, Inc. and Applied Materials, Inc. today announced the companies are collaborating on a development program to optimize the chemical-mechanical planarization (CMP) process through silicon characterization and modeling for advanced-node designs at 14 nanometer (nm) and below.

SMIC, Huawei, imec, and Qualcomm in joint investment on SMIC's new R&D company

Tue, 6 Jun 2015
The joint venture company will focus on R&D towards next generation CMOS logic technology and build China's most advanced integrated circuit (IC) development R&D platform.

Freescale takes its next generation QorIQ multicore platform to 16nm FinFET technology

Wed, 6 Jun 2015
Freescale Semiconductor has disclosed initial details regarding the next generation of its successful QorIQ multicore processor portfolio, today announcing it will drive innovation for the secure Internet of Tomorrow (IoT) on highly advanced 16nm FinFET process technology.

SMIC receives "2014 Foundry Supplier of the Year" award from Qualcomm

Thu, 6 Jun 2015
Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, today announced its receipt of the "2014 Foundry Supplier of the Year" award from customer Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated.

Power transistors seen stabilizing and setting record sales in 2015

Thu, 6 Jun 2015
After six years of gyrating between strong increases and sales declines, the power transistor business is returning to more normal growth patterns.

Stanford researchers stretch a thin crystal to get better solar cells

Thu, 6 Jun 2015
Crystalline semiconductors like silicon can catch photons and convert their energy into electron flows. New research shows a little stretching could give one of silicon's lesser-known cousins its own place in the sun.

“What’s next?” ─ Advances in technology at SEMICON West 2015

Thu, 6 Jun 2015
The latest manufacturing, materials and production developments in semiconductor and related technologies will be featured at SEMICON West 2015 on July 14-16 at Moscone Center in San Francisco, Calif.

Biodegradable, flexible silicon transistors

Tue, 6 Jun 2015
Wisconsin researchers have developed a new biodegradable silicon transistor based on a material derived from wood, opening the door for green, flexible, low-cost portable electronics in future.

What chipmakers will need to address growing complexity, cost of IC design and yield ramps

Mon, 6 Jun 2015
As these early days of the Internet of Things show the network’s promise and reveal technological challenges that could threaten its ability to meet user expectations in the years ahead, technology providers will be charged with supplying the solutions that will meet those challenges.

Building a better semiconductor

Mon, 6 Jun 2015
Research led by Michigan State University could someday lead to the development of new and improved semiconductors.

The peaks and valleys of silicon

Mon, 6 Jun 2015
When the new iPhone came out, customers complained that it could be bent -- but what if you could roll up your too big 6 Plus to actually fit in your pocket? That technology might be available sooner than you think, based on the work of USC Viterbi engineers.

Making new materials with micro-explosions

Mon, 6 Jun 2015
Scientists have made exotic new materials by creating laser-induced micro-explosions in silicon, the common computer chip material.

Opening a new route to photonics

Mon, 6 Jun 2015
A new route to ultrahigh density, ultracompact integrated photonic circuitry has been discovered by researchers with the Lawrence Berkeley National Laboratory (Berkeley Lab) and the University of California (UC) Berkeley.

Taiwan tops fab spending - Driving anticipation for SEMICON Taiwan 2015

Mon, 6 Jun 2015
In 2015,Taiwan is projected to have the highest capex for semiconductor manufacturing worldwide.

SPP Technologies to acquire SPTS Technologies' Thermal Products business

Wed, 7 Jul 2015
ORBOTECH LTD. today announced that SPTS Technologies Group Ltd. (SPTS), an Orbotech company and supplier of advanced wafer processing solutions, has sold its Thermal Products business to SPP Technologies Co, Ltd.

GLOBALFOUNDRIES completes acquisition of IBM Microelectronics business

Wed, 7 Jul 2015
GLOBALFOUNDRIES today announced that it has completed its acquisition of IBM’s Microelectronics business.

New method can make cheaper solar energy storage

Wed, 7 Jul 2015
EPFL scientists have now developed a simple, unconventional method to fabricate high-quality, efficient solar panels for direct solar hydrogen production with low cost.

Graphene flexes its electronic muscles

Wed, 7 Jul 2015
Flexing graphene may be the most basic way to control its electrical properties, according to calculations by theoretical physicists at Rice University and in Russia.

Ambiq Micro appoints Mike Noonen as interim CEO

Wed, 7 Jul 2015
Ambiq Micro, a developer of ultra-low power integrated circuits for power-sensitive applications, today announced the appointment Mike Noonen as interim Chief Executive Officer with immediate effect.

Tackling advanced litho challenges on the path to node 5

Thu, 7 Jul 2015
If you attended just about any mask making conference in the last five to seven years, you would have heard the lament about exploding data volumes and their impact on mask writing time and, by extension, mask costs.

Process Watch: Increasing process steps and the tyranny of numbers

Mon, 7 Jul 2015
Moving to the next design rule can be stressful for the inspection and metrology engineer. Like everything else in the fab, process control generally doesn’t get any easier as design rules shrink and new processes are introduced.

The big picture: More than 850 volume fabs in 2017

Mon, 7 Jul 2015
We, in the semiconductor supply chain, are constantly immersed in detailed numbers. It’s important to pull back and look at the major trends that have profoundly changed and are reshaping our industry.

Peregrine Semiconductor introduces first RF SOI 300mm technology platform

Mon, 7 Jul 2015
Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the UltraCMOS 11 platform.

Global semiconductor sales increase five percent in May 2015

Mon, 7 Jul 2015
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced worldwide sales of semiconductors reached $28.2 billion for the month of May 2015, an increase of 5.1 percent from May 2014, when sales were $26.8 billion.

EV Group ramps nanoimprint lithography into high-volume manufacturing with HERCULES NIL Track System

Tue, 7 Jul 2015
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the HERCULES NIL—a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG's SmartNIL large-area nanoimprint lithography (NIL) process in a single platform.

Down to the quantum dot

Tue, 7 Jul 2015
Using a single molecule as a sensor, scientists in Jülich have successfully imaged electric potential fields with unrivalled precision.

Could black phosphorus be the next silicon?

Tue, 7 Jul 2015
New material could make it possible to pack more transistors on a chip, research suggests.

Qualcomm completes $2.4B acquisition of CSR

Fri, 8 Aug 2015
Qualcomm Incorporated today announced that its indirect, wholly-owned subsidiary, Qualcomm Global Trading Pte. Ltd, has completed its acquisition of CSR plc (CSR), a fabless provider of end-to-end semiconductor and software solutions for the Internet of Everything (IoE) and automotive segments.

SEMI updates key safety guidelines for semiconductor manufacturing equipment

Wed, 7 Jul 2015
SEMI today announced the cornerstone safety Standard S2 (Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment) will be updated this month.

Genmark Automation launches CODEX Stocker

Mon, 7 Jul 2015
Genmark Automation, a developer of tool and factory automation solutions for the semiconductor and related industries, today announced the launch of its new CODEX Stocker.

IBM Research alliance produces industry's first 7nm node test chips

Thu, 7 Jul 2015
IBM Research today announced that working with alliance partners at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE) it has produced the semiconductor industry’s first 7nm (nanometer) node test chips with functional transistors.

IoT platform, Silicon Impulse, energy efficiency and consumer applications focus of LetiDays discussion

Thu, 7 Jul 2015
Smart devices for the Internet of Things are among the top three growth drivers for the semiconductor industry, but the IoT is a highly fragmented market where multiple applications have varying energy requirements.

Micron Technology names Trevor Schulze as Chief Information Officer

Thu, 7 Jul 2015
Micron Technology, Inc. today announced it has appointed Trevor Schulze as Chief Information Officer (CIO).

Graphene gets competition

Thu, 7 Jul 2015
Graphene, the only one atom thick carbon network, achieved overnight fame with the 2010 Nobel Prize. But now comes competition: Such layers can also be formed by black phosphorous.

Substrate innovation for extending Moore and more than Moore

Fri, 7 Jul 2015
Engineered SOI substrates are now a mainstream option for the semiconductor industry.

Applied Materials introduces high-performance ALD technology for the 3D era

Mon, 7 Jul 2015
Applied Materials, Inc. today unveiled the Applied Olympia ALD system, featuring a unique, modular architecture that delivers high-performance ALD technology to manufacturers of leading-edge 3D memory and logic chips.

GLOBALFOUNDRIES launches industry's first 22nm FD-SOI technology platform

Mon, 7 Jul 2015
GLOBALFOUNDRIES today launched a new semiconductor technology developed specifically to meet the ultra-low-power requirements of the next generation of connected devices.

Leti reports FinFET feasibility and circuit design with CoolCube tech

Mon, 7 Jul 2015
CEA-Leti today announced its first results towards the demonstration of CoolCube’s feasibility in FinFET technology on its 300mm production line, and new CoolCube circuit designs that improve the trade off between area, speed and power.

Imec and Panasonic demonstrate breakthrough RRAM cell

Mon, 7 Jul 2015
Imec and Panasonic Corp. announced today that they have fabricated a 40nm TaOx-based RRAM (resistive RAM) technology with precise filament positioning and high thermal stability.

Applied Materials' new etch system provides atomic-level precision

Mon, 7 Jul 2015
Applied Materials, Inc. today announced a next-generation etch tool, the Applied Centris Sym3 Etch system, featuring an entirely new chamber for atomic-level precision manufacturing.

Controlling measurements of WLP on high mix, high volume manufacturing

Tue, 7 Jul 2015
The demand for 4-mask layer Cu-plated wafer-level chip scale packaging (WLCSP) is increasing rapidly, and the current capability for in-line Cu height measurements is not suitable for high volume manufacturing (HVM).

ECAE improves sputtering target performance

Tue, 7 Jul 2015
Because it can achieve extreme deformation, Equal Channel Angular Extrusion (ECAE) can deliver submicron, high strength and uniform microstructures. The resulting improvements in strength allow for monolithic targets with a longer target life of 20-100%.

Blood and tears at DAC

Tue, 7 Jul 2015
At this year’s Design Automation Conference (DAC) in San Francisco, Brian Otis, a Director at Google, talked about how hundreds of millions of people are at risk of diabetes – and how a smart contact lens that continuously monitors blood glucose levels and transmits the data to a smartphone might just be the ideal solution.

SEMI forecasts three years of growth in chip equipment spending

Tue, 7 Jul 2015
SEMI projects three consecutive years of growth in worldwide semiconductor equipment sales according to the mid-year edition of the SEMI Capital Equipment Forecast, released today at the SEMICON West exposition.

Buying used equipment? Be careful; know your seller

Tue, 7 Jul 2015
The used and refurbished semiconductor equipment market can be a hazardous business for buyers. The watchword always is: Caveat emptor – let the buyer beware.

Chinese chipmaker Tsinghua prepares $23B bid for Micron Technology

Tue, 7 Jul 2015
China’s state-owned Tsinghua Unigroup Ltd. is preparing a $23 billion bid for chipmaker Micron Technology, in what analysts say would be the biggest Chinese takeover of a U.S. company.

SEMI announces results of board elections and leadership appointments

Tue, 7 Jul 2015
SEMI today announced that Stephen S. Schwartz, CEO of Brooks Automation, and Toshikazu Umatate, senior vice president and general manager of the Semiconductor Lithography Business at Nikon Corporation, were elected as new directors to the SEMI International Board of Directors in accordance with the association's by-laws.

Keynote panel: Challenges abound for sub-14nm

Tue, 7 Jul 2015
SEMICON West 2015 kicked off Tuesday morning with a keynote panel session that addressed the challenges of "Scaling the Walls of Sub-14nm Manufacturing."

Mark Durcan, Micron CEO, recognized for outstanding EHS leadership

Tue, 7 Jul 2015
Durcan accepted his award for leadership at the Global Care Environmental, Health, and Safety (EHS) Lunch today at SEMICON West 2015 in San Francisco, Calif.

Rudolph Technologies and DISCO Corporation partner to improve wafer saw process

Tue, 7 Jul 2015
Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy.

Leti and EVG launch INSPIRE

Wed, 7 Jul 2015
CEA-Leti and EV Group launched a new program in nano-imprint lithography (NIL) called INSPIRE to demonstrate the benefits of the nano-patterning technology and spread its use for applications beyond semiconductors.

TÜV Rheinland showcases services & abilities for semi industry focus is on OSHA and EMC testing certification

Wed, 7 Jul 2015
TÜV Rheinland, a full-service testing, inspection and certification company, exhibiting at the annual SEMICON West expo, announced the expansion of services to include Environmental, Health & Safety testing and certification of Group III-V compounds in semiconductor manufacturing environments.

Managing hazardous process exhaust in high volume manufacturing

Wed, 7 Jul 2015
“Let no element on the periodic table go un-used!” That may well be the rallying cry of the semiconductor industry moving forward.

New materials require new approaches

Wed, 7 Jul 2015
Continued advances in the semiconductor will increasingly be enabled by materials technology, versus the scaling that has been commonplace over the last 50 years as defined by Moore’s Law.

SEMI Standards leaders honored at SEMICON West 2015

Wed, 7 Jul 2015
SEMI honored six industry leaders for their outstanding accomplishments in developing Standards for the microelectronics and related industries.

EUV: Unlike anything else in the fab

Thu, 7 Jul 2015
Imagine EUV lithography in high volume production. ASML has been working for years to make it happen.

Business is good for vendors of test and inspection/metrology equipment

Thu, 7 Jul 2015
Semiconductor test equipment and inspection/metrology equipment are unglamorous yet critical segments of the equipment field.

CH2M Hill: How being green benefits the bottom line

Thu, 7 Jul 2015
CH2M has seen many changes and trends in the semiconductor industry since the company was involved designing many of the industry’s first wafer fabs back in the 1980s.

SEMI member delegation to visit Vietnamese Central Government and High-Tech Parks in Hanoi

Thu, 7 Jul 2015
After two Semiconductor Strategy Symposiums in Ho Chi Minh City in 2013 and 2014, SEMI announced today that a SEMI Member Delegation will visit the Vietnamese Central Government in Hanoi on September 21-24.

Analog Devices joins SRC's Trustworthy and Secure Semiconductors and Systems Initiative

Mon, 7 Jul 2015
Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, today announced that Analog Devices, Inc. has joined SRC’s hardware cybersecurity research program called Trustworthy and Secure Semiconductors and Systems (T3S).

An easy, scalable and direct method for synthesizing graphene in silicon microelectronics

Tue, 7 Jul 2015
In the last decade, graphene has been intensively studied for its unique optical, mechanical, electrical and structural properties.

Dr. Gary Patton joins The ConFab Advisory Board

Tue, 7 Jul 2015
Solid State Technology today announced that Dr. Gary Patton has joined the Advisory Board for its annual conference and networking event, The ConFab.

North American semiconductor equipment industry posts June 2015 book-to-bill ratio

Wed, 7 Jul 2015
North America-based manufacturers of semiconductor equipment posted $1.51 billion in orders worldwide in June 2015 (three-month average basis) and a book-to-bill ratio of 0.98, according to the June EMDS Book-to-Bill Report published today by SEMI

“Above and beyond TSV for advanced ICs” - SEMI European 3D Summit 2016

Wed, 7 Jul 2015
SEMI today announced the fourth annual European 3D Summit. Entitled “European 3D Summit 2016: Above and Beyond TSV,” the advanced semiconductor Summit will take place on January 18-20, 2016 in Minatec in Grenoble, France.

SIA commends launch of Congressional Semiconductor Caucus

Wed, 7 Jul 2015
SIA recognized members of the caucus at a reception on Capitol Hill Tuesday evening and honored the caucus's co-chairs, Sen. James Risch (R-Idaho), Sen. Angus King (I-Maine), Rep. Pete Sessions (R-Texas), and Rep. Zoe Lofgren (D-Calif.).

ORNL researchers make scalable arrays of 'building blocks' for ultrathin electronics

Wed, 7 Jul 2015
Researchers at the Department of Energy's Oak Ridge National Laboratory have combined a novel synthesis process with commercial electron-beam lithography techniques to produce arrays of semiconductor junctions in arbitrary patterns within a single, nanometer-thick semiconductor crystal.

ROHM Semiconductor acquires Powervation

Thu, 7 Jul 2015
ROHM Co., Ltd., a developer of analog power IC solutions, announced today that it has completed the acquisition of Powervation Ltd., a privately held digital power IC company that develops Digital Power Management system-on-chip (SoC) solutions.

More efficient process to produce graphene developed by Ben-Gurion University researchers

Thu, 7 Jul 2015
Ben-Gurion University of the Negev (BGU) and University of Western Australia researchers have developed a new process to develop few-layer graphene for use in energy storage and other material applications that is faster, potentially scalable and surmounts some of the current graphene production limitations.

Reshaping the solar spectrum to turn light to electricity

Tue, 7 Jul 2015
A team of chemists at the University of California, Riverside found an ingenious way to make solar energy conversion more efficient.

Penn researchers discover new chiral property of silicon, with photonic applications

Fri, 7 Jul 2015
By encoding information in photons via their spin, "photonic" computers could be orders of magnitude faster and efficient than their current-day counterparts. Likewise, encoding information in the spin of electrons, rather than just their quantity, could make "spintronic" computers with similar advantages.

Qualcomm appoints Sunil Lalvani as vice president and president of Qualcomm India

Mon, 7 Jul 2015
Qualcomm Incorporated today announced the appointment of Sunil Lalvani as vice president and president of Qualcomm India, and the departure of Avneesh Agrawal, senior vice president and president of Qualcomm India and South Asia.

Rice University finding could lead to cheap, efficient metal-based solar cells

Mon, 7 Jul 2015
New research from Rice University could make it easier for engineers to harness the power of light-capturing nanomaterials to boost the efficiency and reduce the costs of photovoltaic solar cells.

Semiconductor market worth $332B in 2015

Tue, 7 Jul 2015
ReportsnReports.com added 2015 semiconductor market research reports that forecast a 2.9 percent CAGR to 2020 for semiconductor industry and a 6.7 percent rise from 2014 in the semiconductor equipment market size during 2015 across the world.

Short wavelength plasmons observed in nanotubes

Tue, 7 Jul 2015
A team of researchers with Berkeley Lab's Materials Sciences Division, working at the Advanced Light Source (ALS), has generated and detected plasmons that boast one of the strongest confinement factors ever: the plasmon wavelength is only one hundredth of the free-space photon wavelength.

Chinese automotive semiconductor revenues to hit $6.2B in 2015

Tue, 7 Jul 2015
The growth rate for vehicle shipments in China is slowing, but more and better performing semiconductors will still be required in automotive applications in the coming years.

Intel and Micron produce breakthrough memory technology

Tue, 7 Jul 2015
Intel and Micron begin production on new class of non-volatile memory, creating the first new memory category in more than 25 years.

Tsunami of M&A deals underway in the semiconductor industry in 2015

Wed, 7 Jul 2015
Marketshare expansion, Internet of Things opportunities, rising costs of R&D, and China’s aggressive new focus on the semiconductor industry all driving the recent M&A surge.

Advanced materials enable a smart and interconnected world - SEMI Strategic Materials Conference 2015

Wed, 7 Jul 2015
The SEMI Strategic Materials Conference (SMC), taking place September 22–-23 in Mountain View, Calif., will uncover the drivers for new materials and how material suppliers are impacted by the value chain they serve.

Meet the high-performance single-molecule diode

Wed, 7 Jul 2015
A team of researchers from Berkeley Lab and Columbia University has passed a major milestone in molecular electronics with the creation of the world's highest-performance single-molecule diode.

The confidence of the Wide Band Gap industry

Thu, 7 Jul 2015
WBG companies are slowly but surely reshaping the industry and accelerate the market adoption with numerous strategic mergers and acquisitions and the development of disruptive solutions.

Sol-gel capacitor dielectric offers record-high energy storage

Thu, 7 Jul 2015
Using a hybrid silica sol-gel material and self-assembled monolayers of a common fatty acid, researchers have developed a new capacitor dielectric material that provides an electrical energy storage capacity rivaling certain batteries, with both a high energy density and high power density.

SEMICON West: The road forward is 3DIC

Fri, 7 Jul 2015
SEMICON West 2015 had a strong and rich undercurrent – the roadmap forward is most certainly 3DIC.

A*STAR's IME Consortium announces development of innovative advanced packaging solutions

Tue, 8 Aug 2015
Following the launch of the 12th Electronics Packaging Research Consortium (EPRC12) in 2013, A*STAR’s Institute of Microelectronics (IME) and 11 of its consortium partners across the semiconductor supply chain have developed novel solutions in integrated circuit (IC) packaging.

SPTS Technologies receives a $16M multiple system order from WIN Semiconductors Corp.

Fri, 7 Jul 2015
ORBOTECH LTD. today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has received an order, worth approximately US$16M, for multiple etch and deposition systems from WIN Semiconductors Corp.

Samsung 3D TSV stacked DDR4 DRAM: the first analyzed memory product with via- middle TSV

Fri, 7 Jul 2015
According to Yole, 3D TSV technology is expected to reach $4.8B billion in revenues by 2019.

Better together: Graphene-nanotube hybrid switches

Mon, 8 Aug 2015
Yoke Khin Yap, a professor of physics at Michigan Technological University, has worked with a research team that created these digital switches by combining graphene and boron nitride nanotubes.

Mid-year global semiconductor sales ahead of last year's pace by 4 percent

Mon, 8 Aug 2015
The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $84.0 billion during the second quarter of 2015, an increase of 1.0 percent over the previous quarter and 2.0 percent compared to the second quarter of 2014.

ON Semiconductor introduces new ICs for next generation auto designs

Mon, 8 Aug 2015
ON Semiconductor has introduced an array of new AEC-Q100-compliant integrated circuits (ICs) optimized for implementation into next generation automobile designs.

Microchip Technology completes acquisition of Micrel

Tue, 8 Aug 2015
Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Micrel, Incorporated today announced that Microchip has completed its previously announced acquisition of Micrel.

Toshiba develops world’s first 256Gb, 48-layer BiCS FLASH

Tue, 8 Aug 2015
Toshiba America Electronic Components, Inc. (TAEC) today unveiled the new generation of BiCS FLASH, a three-dimensional (3D) stacked cell structure flash memory.

Intel to collaborate with Georgia Tech

Wed, 8 Aug 2015
Intel Corporation announced it will invest $5 million over the next five years to deepen its engineering pipeline partnership with the Georgia Institute of Technology and deploy research-driven solutions to inspire and retain women and underrepresented minorities to start and complete computer science and engineering degrees.

SunEdison Semiconductor announces manufacturing consolidation

Wed, 8 Aug 2015
The consolidation will consist of closing its Ipoh, Malaysia wafering plant by the end of 2016, and relocating the associated capacity to other plant sites. The company does not expect its total capacity to change.

SEMI Taiwan PV Committee elects new vice chairs

Wed, 8 Aug 2015
SEMI Taiwan PV Committee announced the newly-elected vice chairs: Cafer Huang, general manager at Giga Solar Materials Corp., and Swean Lin, president at Green Energy Technology Inc.

Samsung cuts Intel's semiconductor sales lead to 16% in second quarter

Thu, 8 Aug 2015
Samsung’s excellent growth rate in 2Q15 put the company closer to catching Intel and becoming the world’s leading semiconductor supplier.

Qualcomm to acquire Ikanos

Thu, 8 Aug 2015
Qualcomm Incorporated subsidiary, Qualcomm Atheros, Inc., today announced it entered into a definitive merger agreement to acquire Ikanos Communications, Inc., a high performance broadband networking semiconductor and software provider enabling both central office and home gateway solutions.

Toshiba develops world's first 16-die stacked NAND flash memory with TSV tech

Thu, 8 Aug 2015
Toshiba Corporation today announced the development of the world’s first 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology.

CMR induced in pure lanthanum manganite

Tue, 8 Aug 2015
Colossal magnetoresistance is a property with practical applications in a wide array of electronic tools including magnetic sensors and magnetic RAM. New research successfully used high-pressure conditions to induce colossal magnetoresistance for the first time in a pure sample of a compound called lanthanum manganite, LaMnO3.

ON Semiconductor appoints Alan Campbell to Board of Directors

Fri, 8 Aug 2015
ON Semiconductor Corporation today announced that Alan Campbell has joined its Board of Directors.

MagnaChip to host first Foundry Technology Symposium in Shanghai, China

Mon, 8 Aug 2015
MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today it is hosting its first Foundry Technology Symposium at the Grand Hyatt in Shanghai, China, on September 22, 2015.

Record shipments levels continue into the second quarter 2015

Tue, 8 Aug 2015
Worldwide silicon wafer area shipments increased during the second quarter 2015 when compared to first quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Rice U. discovery may boost memory technology

Tue, 8 Aug 2015
Scientists at Rice University have created a solid-state memory technology that allows for high-density storage with a minimum incidence of computer errors.

Imec pushes the boundaries of GaN technology

Wed, 8 Aug 2015
Nano-electronics research center imec announced today that it is extending its Gallium Nitride-on-Silicon (GaN-on-Si) R&D program, and is now offering joint research on GaN-on-Si 200mm epitaxy and enhancement mode device technology.

Low Power Conference at SEMICON Europa 2015

Wed, 8 Aug 2015
Trends and innovations for low and ultra-low power integrated circuits are the focus of the Low Power Conference at the SEMICON Europa 2015 in Dresden, October 6-8.

Peregrine Semiconductor expands into new building

Fri, 8 Aug 2015
Peregrine Semiconductor Corp. announced the addition of a third building to its Sorrento Valley headquarters.

Black phosphorus surges ahead of graphene

Fri, 8 Aug 2015
A Korean team of scientists tune BP's band gap to form a superior conductor, allowing for the application to be mass produced for electronic and optoelectronics devices

Discovery in growing graphene nanoribbons could enable faster, more efficient electronics

Fri, 8 Aug 2015
University of Wisconsin-Madison engineers have discovered a way to grow graphene nanoribbons with desirable semiconducting properties directly on a conventional germanium semiconductor wafer.

ISSI provides update on closing of acquisition by Uphill

Fri, 8 Aug 2015
Integrated Silicon Solution, Inc., a global fabless semiconductor company, today provided an update on the closing of its pending acquisition by Uphill Investment Co. for $23.00 per share in cash.

Surprising discoveries about 2-D molybdenum disulfide

Mon, 8 Aug 2015
Scientists with the U.S. Department of Energy (DOE)'s Lawrence Berkeley National Laboratory (Berkeley Lab) have used a unique nano-optical probe to study the effects of illumination on two-dimensional semiconductors at the molecular level.

Drexel engineers 'sandwich' atomic layers to make new materials for energy storage

Mon, 8 Aug 2015
A team from Drexel's Department of Materials Science and Engineering created the material-making method, that can sandwich 2-D sheets of elements that otherwise couldn't be combined in a stable way.

Comparison 1Y nanometer NAND architecture and beyond

Mon, 8 Aug 2015
Do we still think the 2D NAND Flash technologies have hit the scaling wall?

As utilities get smarter, smart meter semiconductors rise

Tue, 8 Aug 2015
The global market for semiconductors used in smart meters that provide two-way communications between meters and utilities will continue to expand in the coming years, providing significant growth opportunities semiconductor manufacturers.

Leon Panetta to deliver keynote address at annual SIA Award Dinner

Tue, 8 Aug 2015
The Semiconductor Industry Association (SIA) announced former Defense Secretary Leon Panetta will deliver the keynote address at the upcoming SIA Award Dinner, taking place on Thursday, Dec. 3 in San Jose, Calif.

Update for exporters: Trade wins and delays

Tue, 8 Aug 2015
With trade policy dominating headlines in recent weeks, all eyes were on Maui in the waning days of August as trade ministers from twelve nations convened for perhaps the final time to finalize the Trans-Pacific Partnership (TPP).

Microcontroller unit shipments surge but falling prices sap sales growth

Wed, 8 Aug 2015
Explosion of smartcards, embedded sensors, and new Internet of Things applications are driving up unit volumes of low-cost 32-bit MCU solutions, says Mid-Year Update.

ON Semiconductor names former Texas Instruments VP to Board of Directors

Wed, 8 Aug 2015
ON Semiconductor Corporation this week announced that Gilles Delfassy has joined its Board of Directors.

MagnaChip appoints Gary Tanner to Board of Directors

Thu, 8 Aug 2015
MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced the appointment of Gary Tanner to its Board of Directors.

Laser-burned graphene gains metallic powers

Thu, 8 Aug 2015
Rice University chemists who developed a unique form of graphene have found a way to embed metallic nanoparticles that turn the material into a useful catalyst for fuel cells and other applications.

Manchester team reveal new, stable 2-D materials

Thu, 8 Aug 2015
Dozens of new 2-dimensional materials similar to graphene are now available, thanks to research from University of Manchester scientists.

Peregrine Semiconductor announces next chapter in intelligent integration

Thu, 8 Aug 2015
Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the next chapter in intelligent integration -- integrated phase and amplitude control at microwave frequencies.

Book-to-bill ratio reports indicate a solid year for the industry

Thu, 8 Aug 2015
A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

Small electronics companies spent $78.3B on semiconductors in 2014

Fri, 8 Aug 2015
Startups and small electronics companies spent $78.3 billion on semiconductors in 2014, representing 23 percent of the total market, compelling semiconductor companies to revisit their sales strategy to focus on the large number of smaller organizations than relying on big deals from large customers, research firm Gartner said.

Cypress introduces the world's lowest-power energy harvesting power management ICs

Fri, 8 Aug 2015
Cypress Semiconductor Corp. today announced a new family of Energy Harvesting Power Management Integrated Circuits (PMICs) that enable tiny, solar-powered wireless sensors for Internet of Things (IoT) applications.

Opportunities in South America for semiconductor manufacturing

Mon, 8 Aug 2015
SEMI today announced the second annual SEMI South America Semiconductor Strategy Summit (SA SSS) at the Sheraton Rio on November 10-12 in Rio De Janeiro, Brazil.

GaN nanoelectronics-transistor blocking voltage exceeds 1kV

Mon, 8 Aug 2015
Research reported in Applied Physics Express (APEX) by Tohru Oka and colleagues at the Research and Development Headquarters for TOYODA GOSEI Co., Ltd in Japan describe the development of ‘vertically orientated’ GaN-based transistors with blocking voltages exceeding 1kV.

Another milestone in hybrid artificial photosynthesis

Wed, 8 Aug 2015
Berkeley Lab researchers use solar energy and renewable hydrogen to produce methane.

Successful boron-doping of graphene nanoribbon

Thu, 8 Aug 2015
Physicists at the University of Basel succeed in synthesizing boron-doped graphene nanoribbons and characterizing their structural, electronic and chemical properties.

University of Colorado and SRC research accelerates microscopic imaging for next-generation nanoelectronics

Thu, 8 Aug 2015
University of Colorado researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductor technologies, have developed new microscopic imaging techniques to help advance next-generation nanotechnology in applications ranging from data storage to medicine.

New AMS fab going to Marcy, NY

Thu, 8 Aug 2015
Austria-based ams AG, formerly known as Austriamicrosystem, announced plans to locate a new 360,000 ft2 fab in upstate New York at the Nano Utica site in Marcy, NY.

ROHM adopts latest model of Lasertec's SiC wafer inspection and review system

Thu, 8 Aug 2015
Lasertec Corporation announced today that ROHM Co., Ltd. selected the latest model of Lasertec’s SICA, SiC wafer inspection and review system.

Pure-play foundry sales forecast to surpass $12B in fourth quarter 2015

Fri, 8 Aug 2015
Atypical 2015 sales pattern, but stronger growth forecast to resume in second half of this year.

A partnership to secure and protect the emerging Internet of Things

Fri, 8 Aug 2015
The National Science Foundation (NSF), in partnership with Intel Corporation, one of the world's leading technology companies, today announced two new grants totaling $6 million to research teams that will study solutions to address the security and privacy of cyber-physical systems.

Laith Altimime joins SEMI as President of SEMI Europe

Tue, 9 Sep 2015
SEMI, the global association serving the electronics supply chain, today announced the appointment of Laith Altimime as president of SEMI Europe, effective October 1, 2015.

Tech, academic leaders call for robust research investments to bolster U.S. tech leadership, advance IoT

Tue, 9 Sep 2015
A coalition of leaders from the tech industry and academia, led by the Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC), today released a report highlighting the urgent need for robust investments in research to advance the burgeoning Internet of Things (IoT) and develop other cutting-edge innovations that will sustain and strengthen America’s global technology leadership into the future.

20th annual SEMICON Taiwan 2015 opens today

Wed, 9 Sep 2015
SEMICON Taiwan 2015 opened today starting a three-day event drawing over 43,000 attendees from electronics manufacturing.

CyberOptics demonstrates new WaferSense and ReticleSense Auto Multi Sensors

Wed, 9 Sep 2015
CyberOptics Corporation, a global developer and manufacturer of high precision 3D sensing technology solutions, will demonstrate the first wireless sensor to combine leveling, vibration and Relative humidity (RH) measurement in an all-in-one device at SEMICON Taiwan in Taipei, September 2-4, 2015.

Made from solar concentrate

Wed, 9 Sep 2015
Solar cell from Berkeley Lab/University of Illinois absorbs high-energy light at 30-fold higher concentration than conventional cells.

Intel's Bill Holt awarded Robert N. Noyce Award

Thu, 9 Sep 2015
Holt will accept the award at SIA's Annual Award Dinner on Thursday, Dec. 3.

Automotive industry now the third largest end market for power semiconductors

Thu, 9 Sep 2015
In 2014, the automotive sector significantly outperformed the overall market average for semiconductors.

GLOBALFOUNDRIES and Catena partner to provide next-generation RF connectivity solutions for wireless markets

Thu, 9 Sep 2015
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced it has partnered with Catena, a developer of Radio Frequency (RF) Communication IPs for connectivity, to offer complete Wi-Fi and Bluetooth solutions for System-on-Chip (SoC) designers targeting mobile, Internet-of-Things (IoT), RF connectivity markets.

Asia-Pacific to dominate IC sales across system categories in 2015

Fri, 9 Sep 2015
Europe to remain largest regional market for auto ICs, but Asia-Pacific gaining fast.

QEOS and GLOBALFOUNDRIES to offer industry’s first CMOS platform for millimeter-wave markets

Fri, 9 Sep 2015
QEOS, Inc., a designer of connectivity and sensing CMOS millimeter-wave (mmWave) solutions, and GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced they are partnering to co-develop the industry’s first mmW CMOS platform.

Global semiconductor sales down slightly in July

Fri, 9 Sep 2015
Softening demand, currency devaluation lead to slower sales.

Key industry leaders join The ConFab Advisory Board

Fri, 9 Sep 2015
Solid State Technology is thrilled to announce that several key industry leaders have joined the Advisory Board for its annual conference and networking event, The ConFab.