Semiconductors

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Ultraviolet light to the extreme

Wed, 10 Oct 2013
For the first time, researchers have mapped this EUV emission and developed a theoretical model that explains how the emission depends on the three-dimensional shape of the plasma.

Pure-play foundries spending big on capital equipment

Wed, 10 Oct 2013
Semiconductor capital spending has increased significantly among pure-play foundries as more IDMs shift to a fabless/fab-lite business model and as new foundry participants intensify competition among the old guard.

Promising new alloy for resistive switching memory

Fri, 9 Sep 2013
Tiny nanoscale filaments could be breakthrough for smaller, denser memory devices.

Logic gates in graphene technology

Wed, 9 Sep 2013
Serial production of a QCA graphene cell could be possible. Simple, well-defined process steps are identified.

Densest array of carbon nanotubes grown to date

Fri, 9 Sep 2013
New technique could one day help improve the performance of microelectronics in devices ranging from batteries to spacecraft.

High temperature reverse bias reliability testing of high power devices

Wed, 9 Sep 2013
Power device characterization and reliability testing require instrumentation capable of sourcing higher voltages and more sensitive current measurements than ever before.

Graphene Frontiers awarded $745k NSF grant for ‘roll-to-roll’ graphene production

Thu, 9 Sep 2013
Graphene Frontiers, a Philadelphia-based advanced materials and nanotechnology company, has been awarded a $744,600 grant from the National Science Foundation. The funds will be used to develop roll-to-roll production of graphene.

Mentor Graphics and TSMC collaborate on reference flow for 16nm FinFet process technology

Fri, 9 Sep 2013
Mentor Graphics Corp. today announced that it has completed enhancements to its digital tool set for TSMC’s 16nm FinFET manufacturing processes.

Silicon Labs launches the world’s most energy-friendly MCUs

Wed, 10 Oct 2013
Silicon Labs, a developer of high-performance, analog-intensive, mixed-signal ICs, today introduced the industry’s most energy-friendly 32-bit microcontrollers (MCUs) based on the ARM Cortex-M0+ processor.

ASML and imec launch advanced patterning center

Mon, 10 Oct 2013
New Center will offer the global semiconductor ecosystem crucial patterning knowledge for sub-10nm technologies.

Applied Materials to merge with Tokyo Electron

Tue, 9 Sep 2013
Applied Materials Inc. and Tokyo Electron Limited today announced Applied Materials agreed to merge with Tokyo Electron.

Stanford scientists publish theory, formula to improve 'plastic' semiconductors

Tue, 9 Sep 2013
A better understanding of the conductive properties of flexible semiconductors will aid in the development of bendable electronics.

Micron and imec extend research collaboration

Tue, 9 Sep 2013
Imec and Micron Technology, Inc. announced today a three-year extension of their strategic research collaboration on advanced CMOS scaling and expanded on additional joint research efforts.

MACOM releases industry’s first surface mount L-Band 90W GaN power module

Tue, 9 Sep 2013
MACOM Technology Solutions Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced the newest entry in its portfolio of GaN in Plastic packaged power products.

Imec demonstrates 25Gb/s silicon photonics devices on single platform

Tue, 10 Oct 2013
Imec today announced the release of its fully integrated silicon photonics platform (iSiPP25G) for high-performance optical transceivers (25Gb/s and beyond).

Reducing mask write-time—which strategy is best?

Tue, 10 Oct 2013
An upcoming challenge of advanced-node design is the expected mask write time increase associated with the continued use of 193nm wavelength lithography.

EV Group introduces roll-to-roll nanoimprint lithography system

Tue, 10 Oct 2013
EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 570R2R—the industry's first roll-to-roll thermal nanoimprint lithography (NIL) tool.

Micron ships first samples of Hybrid Memory Cube

Wed, 9 Sep 2013
Micron Technology, Inc. announced today that it is shipping 2GB Hybrid Memory Cube (HMC) engineering samples.

SEMI book-to-bill ratio indicates bookings decline

Thu, 9 Sep 2013
North America-based manufacturers of semiconductor equipment posted $1.06 billion in orders worldwide in August 2013 (three-month average basis) and a book-to-bill ratio of 0.98, according to the August EMDS Book-to-Bill Report published today by SEMI.

Semtech named to Fortune’s list of 100 Fastest Growing Companies

Tue, 9 Sep 2013
Semtech Corporation, a supplier of analog and mixed-signal semiconductors, today announced that it has moved up four points on the Fortune Magazine list of the 100 Fastest Growing Companies that was published in the magazine’s September 16, 2013 issue.

A new training methodology needed

Wed, 9 Sep 2013
We have an interesting dynamic in the world of semiconductor training that has been in play since the financial crisis in 2008-2009.

Inside the Hybrid Memory Cube

Wed, 9 Sep 2013
The HMC provides a breakthrough solution that delivers unmatched performance with the utmost reliability.

Mobility now driving the industry

Wed, 9 Sep 2013
It’s apparent that the world’s appetite for electronics has never been greater. That has increasingly taken the form of mobile electronics, including smartphones, tablets and tablets and the new “phablets.” People want to watch movies and live sports on their phones.

Major leap towards graphene for solar cells

Wed, 10 Oct 2013
Surprising result: Graphene retains its properties even when coated with silicon.

Micron Technology appoints Thomas Snodgrass as VP of System Solutions

Tue, 10 Oct 2013
Micron Technology, Inc. today announced that the company has named Tom Snodgrass, vice president, System Solutions.

Alpha and Omega Semiconductor announces resignation of its CFO

Tue, 10 Oct 2013
Alpha and Omega Semiconductor today reported that Mary L. Dotz, its Chief Financial Officer, has announced her resignation in order to pursue other interests.

NXP NextPowerS3 MOSFETs offer super-fast switching with soft recovery

Fri, 9 Sep 2013
Industry’s first MOSFET platform to deliver integrated Schottky performance with low leakage current.

Imec and SPTS partner on advanced nanotechnology applications in BioMEMS

Tue, 10 Oct 2013
SPTS Technologies and imec announced a joint partnership to further advance micro- and nanosized components for BioMEMS.

Stanford and UT Austin professors to be honored at annual SRC TECHCON

Thu, 9 Sep 2013
Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, will honor professors from Stanford University and University of Texas at Austin with awards for chip-related research and education at SRC’s annual TECHCON conference Sept. 9-10.

Fairchild Semiconductor appoints Chris Allexandre VP of worldwide sales

Tue, 10 Oct 2013
Fairchild Semiconductor, a global supplier of high performance power and mobile semiconductor solutions, has appointed Chris Allexandre to the position of Senior Vice President of Worldwide Sales.

Wyle wins $14.9 million award to conduct technical evaluations for U.S. Air Force

Fri, 10 Oct 2013
Wyle has been awarded a task order valued at $14.9 million to provide analyses of military and commercial developmental semiconductor devices and components for the U.S. Air Force Research Laboratory at Wright-Patterson Air Force Base in Dayton, Ohio.

Alpha and Omega Semiconductor launches new DrMOS-IIIS power modules

Mon, 9 Sep 2013
Alpha and Omega Semiconductor, a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today launched the AOZ5019, a third-generation high efficiency power module with an EZPair package.

Noel Technologies now providing 450mm wafer services

Tue, 10 Oct 2013
Semiconductor wet processes, etches and cleans, resist spin coatings and films the first services available

With carbon nanotubes, a path to flexible, low-cost sensors

Wed, 9 Sep 2013
Researchers at the Technische Universitaet Muenchen (TUM) are showing the way toward low-cost, industrial-scale manufacturing of a new family of electronic devices.

A new photoresist technology for organic semiconductors enabling submicron patterns

Thu, 9 Sep 2013
Fujifilm and imec have developed a new photoresist technology for organic semiconductors that enables the realization of submicron patterns.

Gigaphoton develops CO2 drive laser for high output EUV light sources

Mon, 9 Sep 2013
Gigaphoton Inc. announced today that the company has jointly developed a high power CO2 drive laser for Extreme Ultraviolet (EUV) light sources with Mitsubishi Electric Corporation. Likewise, an average output level of 15W was achieved on a development EUV system – representing another step forward in realizing production level EUV light sources.

Global semiconductor sales increase for sixth straight month in August

Fri, 10 Oct 2013
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $25.87 billion for the month of August 2013, an increase of 6.4 percent compared to August 2012, marking the industry's largest year-over-year growth since March 2011.

IBM breaks record with silicon nanowire MOSFET

Fri, 10 Oct 2013
IBM devices with a 90nm gate pitch demonstrated the highest performance ever reported for a SiNW device at a gate pitch below 100 nm.

STMicroelectronics receives Innovation Management Award for chip manufacturing tech

Wed, 10 Oct 2013
STMicroelectronics announced on Tuesday it has won a prestigious BearingPoint Innovation Management Award for its FD-SOI technology in the "Innovation Ecosystem" category.

CU, MIT breakthrough in photonics could lead to faster electronics

Wed, 10 Oct 2013
A pair of breakthroughs in the field of silicon photonics by researchers at the University of Colorado Boulder, the Massachusetts Institute of Technology and Micron Technology Inc. could allow for the trajectory of exponential improvement in microprocessors that began nearly half a century ago—known as Moore's Law—to continue well into the future, allowing for increasingly faster electronics, from supercomputers to laptops to smartphones.

Intermolecular and Russian nanocenter sign joint development agreement

Fri, 10 Oct 2013
Intermolecular, Inc. and RUSNANO, the Fund for Infrastructure and Educational Programs, today announced the signing of a joint development agreement between Intermolecular and Ulnanotech, the leading Russian Federation nanocenter based in Ulyanovsk.

InvenSense opens Korean design center

Wed, 10 Oct 2013
InvenSense, Inc., the provider of MotionTracking system on chip devices, announced the opening of a new design center in Seoul, Korea.

TSMC to unveil 16nm FinFET platform at IEDM

Fri, 10 Oct 2013
At the International Electron Devices Meeting (IEDM) in December, TSMC researchers will unveil a 16nm FinFET process that by many measures is one of the world’s most advanced semiconductor technologies.

AppliedMicro appoints Doug Ahrens as Chief Financial Officer

Wed, 10 Oct 2013
Applied Micro Circuits Corporation, also known as AppliedMicro, today announced it has appointed semiconductor veteran Douglas T. Ahrens to serve as Vice President and Chief Financial Officer.

Intermolecular names Rick Neely CFO

Wed, 10 Oct 2013
Intermolecular, Inc. today announced that it has named C. Richard Neely, Jr. as the company's chief financial officer (CFO) and senior vice president.

Nordic Semiconductor launches world’s first concurrent ANT+ and Bluetooth low energy combo chip

Wed, 10 Oct 2013
Ultra low power (ULP) RF specialist Nordic Semiconductor ASA today announces the release of the world's first multi-protocol SoC solution offering concurrent ANT+ and Bluetooth low energy wireless communication natively in a single chip.

Americas region remains largest market for pure-play foundry sales

Wed, 10 Oct 2013
Emphasis on fabless and fab-lite models in U.S. contributes to 62% marketshare.

The Internet of Things is poised to change everything, says IDC

Fri, 10 Oct 2013
The Internet of Things represents a new construct in the information and communications technology world that is occupying the minds of IT vendors, service providers, and systems integrators as it represents huge potential for new streams of revenue and new customers.

World record solar cell with 44.7% efficiency

Mon, 9 Sep 2013
The Fraunhofer Institute for Solar Energy Systems ISE, Soitec, CEA-Leti and the Helmholtz Center Berlin jointly announced this week having achieved a new world record for the conversion of sunlight into electricity using a new solar cell structure with four solar subcells.

Monolithic 3D chip fabricated without TSVs

Fri, 10 Oct 2013
Researchers from Taiwan’s National Nano Device Laboratories avoided the use of TSVs by fabricating a monolithic sub-50nm 3D using a novel CMP technique.

TowerJazz announces the creation and accreditation of Jazz Semiconductor Trusted Foundry

Wed, 8 Aug 2013

Expands support for the US Aerospace and Defense market in its Newport Beach, CA facility


PC outlook lowered again

Fri, 8 Aug 2013
Worldwide PC shipments are now expected to fall by -9.7 percent in 2013, further deepening what is already the longest market contraction on record.

Moore's Law Dead By 2022: Crying Wolf?

Fri, 8 Aug 2013
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about recent predictions regarding the demise of continued scaling.

Dow Corning and EV Group to collaborate on temporary bonding materials for 3D-IC

Tue, 9 Sep 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG's LowTemp platform for room-temperature wafer bonding and debonding processes.

Imec and Veeco to collaborate on GaN-on-Si devices for LEDs and power electronics

Tue, 9 Sep 2013
Nanoelectronics research center imec of Belgium and Veeco Instruments Inc. are collaborating on a project aimed at lowering the cost of producing gallium nitride on silicon-based power devices and LEDs.

Advancing graphene for post-silicon computer logic

Tue, 9 Sep 2013
Team of UC Riverside researchers pioneer new approach for graphene logic circuits.

Analysis of South Korea’s CVD precursor industry

Wed, 9 Sep 2013
Chemical vapor deposition is a process used to deposit diverse thin films of crystalline or amorphous metal, inter-metallic compounds, oxides, nitrides, carbides, and inorganic polymer.

Electronics advance moves closer to a world beyond silicon

Wed, 9 Sep 2013
Researchers in the College of Engineering at Oregon State University have made a significant advance in the function of metal-insulator-metal, or MIM diodes, a technology premised on the assumption that the speed of electrons moving through silicon is simply too slow.

Collaboration needed on 3D-IC

Thu, 9 Sep 2013
The history of semiconductors has been a history of collaboration. Today, a similar industry-wide collaborative approach to 3D stacked ICs is needed to reach widespread 3D-IC adoption and continue the amazing progress our industry has historically achieved.

Will 2014 be the next Golden Year?

Thu, 9 Sep 2013
Some unexpected underdogs spur spending spree.

SPTS announces new Sigma PVD for 300mm power device manufacturing

Fri, 9 Sep 2013
SPTS Technologies this week announced the launch of its Sigma fxP physical vapor deposition (PVD) system for 300mm power device manufacturing.

Stanford scientists use DNA to assemble a transistor from graphene

Fri, 9 Sep 2013
DNA is the blueprint for life. Could it also become the template for making a new generation of computer chips based not on silicon, but on an experimental material known as graphene?

Growing thin films of germanium

Fri, 9 Sep 2013
A new method to grow germanium crystals at low temperatures may lead to next-generation large-scale integrated circuits and future flexible electronics.

Fab equipment spending up 25% in 2014

Mon, 9 Sep 2013
Semiconductor revenue has improved in 2013 compared to 2012 and early forecasts for 2014 project revenue growth averaging about eight percent.

Multibeam technology predicted for use in advanced photomask production by 2016, says survey

Mon, 9 Sep 2013
The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced the completion of the second annual eBeam Initiative survey.

Accidental nanoparticle discovery could hail revolution in manufacturing

Tue, 9 Sep 2013
A nanoparticle shaped like a spiky ball, with magnetic properties, has been uncovered in a new method of synthesising carbon nanotubes by physicists at Queen Mary University of London and the University of Kent.

SMTA Intermountain Chapter to hold annual technical symposium

Tue, 9 Sep 2013
The Surface Mount Technology Association (SMTA)’s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.

Saws made of carbon

Tue, 9 Sep 2013
More material could be saved when manufacturing wafers in future. Ultra-thin saws made of carbon nanotubes and diamond would be able to cut through silicon wafers with minimum kerf loss. A new method makes it possible to manufacture the saw wires.

New magnetic semiconductor material holds promise for 'spintronics'

Tue, 9 Sep 2013
Researchers at North Carolina State University have created a new compound that can be integrated into silicon chips and is a dilute magnetic semiconductor – meaning that it could be used to make "spintronic" devices, which rely on magnetic force to operate, rather than electrical currents.

SEMI: Second quarter semiconductor equipment billings US$ 7.55B

Tue, 9 Sep 2013
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.55 billion in the second quarter of 2013

New Intel CEO, president talk product plans and future of computing

Tue, 9 Sep 2013
From data centers to ultra-mobile devices such as tablets, phones and wearables, computing segments are undergoing exciting and even game-changing transitions, said new Intel CEO Brian Krzanich during today’s opening session of the Intel Developer Forum.

Shining a little light changes metal into semiconductor

Tue, 9 Sep 2013
By blending their expertise, two materials science engineers at Washington University in St. Louis changed the electronic properties of new class of materials — just by exposing it to light.

SUNY CNSE to develop center for 450mm computer chip manufacturing

Thu, 9 Sep 2013
Building on Governor Cuomo’s CNSE G450C initiative and expanded partnership between NanoCollege and the Mohawk Valley EDGE continues New York’s investment strategy.

The advantages of a hybrid scan test solution

Thu, 9 Sep 2013
Scan testing is the standard practice for test of integrated circuits. The vast majority of IC production test is based on automatic test pattern generation (ATPG) using the scan logic.

Bruker announces acquisition of Prairie Technologies

Fri, 9 Sep 2013
Bruker Corporation today announced that it has acquired Prairie Technologies, Inc. (Prairie), a provider of life science fluorescence microscopy products.

Brooks Automation appoints Lindon G. Robertson as CFO

Fri, 9 Sep 2013
Brooks Automation, Inc. today announced the appointment of Lindon G. Robertson as executive vice president and chief financial officer, effective October 1, 2013.

Brewer Science’s new carbon nanotube materials are qualified for NRAM manufacturing

Fri, 9 Sep 2013
Brewer Science announced today that the next generation of carbon nanotube materials, the CNTRENE 1020 material series, is officially qualified for NRAM nanotube random access memory device manufacturing by Nantero Inc.

Worldwide total semiconductor market to grow 3% in 2013; consolidation still rife

Fri, 9 Sep 2013
The worldwide semiconductor market is expected to grow three percent from 2012 to 2013. There has been sequential market growth from 1Q13 to 2Q13 and the vast majority of the top 20 vendors are expecting 3Q13 to grow revenues again.

MediaTek and Imagination expand partnership

Fri, 9 Sep 2013
Imagination Technologies has signed a further license agreement with MediaTek Inc., a fabless semiconductor company for wireless communications and digital multimedia solutions.

Entegris to partner with SEMATECH on surface conditioning and wafer cleaning technology

Mon, 9 Sep 2013
Entegris, Inc. and SEMATECH announced they have partnered to move forward the development of advanced nanoscale particle removal processes and cleaning technologies for next-generation wafers and devices.

Spansion licenses ARM processor technology to power embedded systems

Mon, 9 Sep 2013
Spansion Inc. today announced it has licensed a wide range of ARM processors for its current and future product lineup aimed at embedded applications in the automotive, industrial and consumer markets.

Graphene photodetector integrated into a computer chip

Mon, 9 Sep 2013
Both academia and the industry have high hopes for graphene. The material, which consists of a single layer of hexagonally arranged carbon atoms, has extraordinary properties.

Asia-Pac soars, Japan drops in regional semiconductor capex spending

Tue, 9 Sep 2013
Capex marketshare flips in Asia-Pac and Japan; Europe's share erodes while North America gains.

Imec, KULeuven and AIST pave the way toward increased mobility of beyond 10nm MOS devices

Tue, 9 Sep 2013
Tensile-strained GeSn MOSFET devices on Si developed using solid phase epitaxy.

Leading-edge technology to be responsible for 2013 increase in pure-play foundry sales

Tue, 9 Sep 2013
TSMC forecast to sell $6.33 billion worth of ≤28nm devices this year, a 3x increase over 2012.

Megasonic Cleaning without Damage?

Wed, 9 Sep 2013
Megasonics has been used considered and used for many years to meet many of the cleaning challenges, but it has been shown to cause damage to nanoscale device structures such as polysilicon lines.

RFMD introduces world’s first 6-inch GaN-on-SiC wafers for RF power transistors

Thu, 9 Sep 2013
RFMD today introduced the world's first 6-inch GaN-on-Silicon Carbide (SiC) wafers for manufacturing RF power transistors for both military and commercial use.

Worldwide semiconductor manufacturing equipment spending to decline 8.5 percent in 2013

Thu, 9 Sep 2013
Worldwide semiconductor manufacturing equipment spending is projected to total $34.6 billion in 2013, an 8.5 percent decline from 2012 spending of $37.8 billion, according to Gartner, Inc.

Dow introduces new SOLDERON tin-silver plating chemistry for lead-free bump plating

Wed, 10 Oct 2013
Next-gen SnAg offers industry-leading plating rates and process flexibility for flipchip packages and interconnects

Semiconductor materials market to approach $50 billion in 2014

Thu, 10 Oct 2013
SEMI believes that the semiconductor materials market will trend with the device market, resulting in an increase of one percent this year and a seven percent increase in 2014, resulting in a materials market approaching $50 billion in 2014.

ASMC 2014 offers opportunity for presenters

Thu, 11 Nov 2013
SEMI announced today that the deadline for presenters to submit an abstract for the 25th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 28.

Intersil appoints Roger Wendelken as senior VP of worldwide sales

Tue, 10 Oct 2013
Intersil Corporation, a provider of innovative power management and precision analog solutions, today announced the appointment of Roger Wendelken as senior vice president of worldwide sales effective immediately.

Model-based hints: GPS for LFD success

Wed, 10 Oct 2013
For several technology nodes now, designers have been required to run lithography-friendly design (LFD) checks prior to tape out and acceptance by the foundry. Due to resolution enhancement technology (RET) limitations at advanced nodes, we are seeing significantly more manufacturing issues, even in DRC-clean designs.

Laser thermal anneal to boost performance of 3D memory devices

Wed, 10 Oct 2013
Nanoelectronics research center imec and Excico have successfully demonstrated the application of laser thermal anneal (LTA) to boost the current in vertical polysilicon channel devices for 3D memory.

Argument for not cleaning up process water is wafer thin

Thu, 10 Oct 2013
When facilities management and water treatment company MSS Group was called in to clean up the process water in a globally renowned manufacturer of semiconductor wafers, the company was presented with an untreated water system suffering from significant corrosion.

Jury finds Qualcomm guilty of patent infringement

Thu, 10 Oct 2013
ParkerVision, Inc., a developer and marketer of semiconductor technology solutions for wireless applications, today announced that a jury in the U.S. District Court for the Middle District of Florida found Qualcomm Incorporated guilty of direct and indirect infringement of ParkerVision patents.

Power management, industrial analog units post strong gains

Fri, 10 Oct 2013
Total shipments of analog devices forecast to jump 14% in 2013.

Size matters in the giant magnetoresistance effect in semiconductors

Mon, 10 Oct 2013
In a paper appearing in Nature's Scientific Reports, Dr. Ramesh Mani, professor of physics and astronomy at Georgia State University, reports that a giant magnetoresistance effect depends on the physical size of the device in the GaAs/AlGaAs semiconductor system.

TV semiconductor market growing despite decline in TV shipments

Fri, 10 Oct 2013
Wireless video, network interfaces, multi-format decoders, LED backlighting boost average semiconductor content per TV.

Alpha and Omega Semiconductor introduces a new family of high performance common-drain MOSFETs

Mon, 10 Oct 2013
Alpha and Omega Semiconductor Limited this week released a new dual MOSFET family in the common-drain configuration in both DFN 5x6 and Micro-DFN 3.2x2 packages.

Scaling makes monolithic 3D IC practical

Mon, 10 Oct 2013
In the 1960s, James Early of Bell Labs proposed three-dimensional structures as a natural evolution for integrated circuits. Since then many attempts have been made to develop such a technology.

Monte Carlo analysis has become a gamble

Mon, 10 Oct 2013
Dr. Bruce McGaughy, CTO and SVP of Engineering at ProPlus Design Solutions, Inc. blogs about the wisdom of Monte Carlo analysis when high sigma methods are perhaps better suited to today’s designs.

Zygo Corp appoints Gary Willis as interim CEO

Mon, 10 Oct 2013
Zygo Corporation today announced that Dr. Chris L. Koliopoulos is stepping down as the Chairman of the Board, President and Chief Executive Officer effective immediately, following the mutual decision of Dr. Koliopoulos and Zygo's board of directors.

Book-to-bill ratio reflects seasonal softening

Tue, 10 Oct 2013
North America-based manufacturers of semiconductor equipment posted $975.3 million in orders worldwide in September 2013 (three-month average basis) and a book-to-bill ratio of 0.97, according to the September EMDS Book-to-Bill Report published today by SEMI.

UK photonics industry must connect higher in the value chain

Wed, 10 Oct 2013
Carlos Lee, Director General of the European Photonics Industry Consortium (EPIC), moderated a discussion with executives from the UK photonics industry and filed this report.

EU project to industrialize world record high-density capacitors

Wed, 10 Oct 2013
CEA-Leti, Fraunhofer IPMS-CNT and three European companies have launched a two-year project to industrialize 3D integrated capacitors with world-record density using atomic layer deposition.

Memory materials revolution highlighted at SMC

Wed, 10 Oct 2013
While the number of materials used in semiconductor logic will increase approximately 50 percent in the transition from 32nm to 22nm production, the materials revolution in memory will be even more pronounced, challenging developers, manufacturers, equipment, and materials suppliers, according to experts speaking at the SEMI Strategic Materials Conference 2013, held in Santa Clara on October 16-17.

SRC launches synthetic biology research for novel semiconductor applications

Wed, 10 Oct 2013
Research at six universities including MIT, University of Massachusetts at Amherst, Yale, Georgia Tech, Brigham Young and Washington

Imec and John Hopkins University team to expand healthcare applications for silicon nanotech

Thu, 10 Oct 2013
Researchers and physicians at Johns Hopkins University will collaborate with the nanoelectronics R&D center imec to advance silicon applications in healthcare, beginning with development of a device to enable a broad range of clinical tests.

Micron appoints Brian Angell as VP of Advanced Controller Development

Thu, 10 Oct 2013
Micron Technology, Inc. today announced that the company has named Brian Angell, vice president, Advanced Controller Development.

LED applications to be key drivers for bulk GaN market

Thu, 10 Oct 2013
In either a cautious or a more aggressive scenario, LED applications will certainly be the key drivers for the bulk GaN market, according to Yole Développement.

450mm higher gas flows pose opportunities

Wed, 10 Oct 2013
The move to 4500mm wafers will likely result in gas flow increased on process vacuum and abatement equipment.

Gallium nitride to drive growth of pulsed RF power semiconductor device markets to exceed $250M by 2018

Fri, 10 Oct 2013
Markets for pulsed RF power devices up to 18 GHz are expected to show continued solid growth over the next five years despite the current economic turmoil and cuts in defense spending. While the volatility of many global electronics markets is fueled by their association with consumer spending, markets for pulsed RF power devices are supported by quite different priorities.

MEMS devices for biomedical applications

Mon, 10 Oct 2013
Dr. Ramesh Ramadoss, Senior Manager in the MicroProbe Product Group of FormFactor Inc., provides an overview of MEMS and highlights a variety of applications in the biomedical area, including pressure sensors, inertial sensors, transducers for hearing aids, microfluidics for diagnostics and drug delivery, micromachined needles and microsurgical tools.

Researchers advance scheme to design seamless integrated circuits etched on graphene

Tue, 10 Oct 2013
Researchers in electrical and computer engineering at UC Santa Barbara have introduced and modeled an integrated circuit design scheme in which transistors and interconnects are monolithically patterned seamlessly on a sheet of graphene, a 2-dimensional plane of carbon atoms. The demonstration offers possibilities for ultra energy-efficient, flexible, and transparent electronics.

ASU, Georgia Tech create breakthrough for solar cell efficiency

Tue, 10 Oct 2013
New atomic layer-by-layer InGaN technology offers perfect crystal.

Advanced light source provides a new look at vanadium dioxide

Tue, 10 Oct 2013
Vanadium dioxide is one of the few known materials that acts like an insulator at low temperatures but like a metal at warmer temperatures starting around 67 degrees Celsius.

Global semiconductor leaders encourage China to support expansion of Key Trade Agreement

Wed, 10 Oct 2013
Senior executives from Semiconductor Industry Association (SIA) member companies and other multi-national semiconductor companies around the globe sent a letter to Chinese Vice Premiers Wang Yang and Ma Kai on October 16, encouraging China to support duty-free coverage for semiconductor products in an expanded Information Technology Agreement (ITA).

Will 2014 be the Next Golden Year?

Wed, 10 Oct 2013
Some unexpected underdogs spur spending spree.

Managing legacy fabs and the role of secondary equipment

Wed, 10 Oct 2013
The choice between buying new systems from OEMs or fully capable refurbished gear from qualified used equipment vendors is examined.

Three-dimensional atomic force microscopy

Wed, 10 Oct 2013
3D atomic force microscopes can measure critical dimensions, line edge roughness and sidewall roughness in a way that is highly accurate, non-destructive and cost-effective.

Defect-free mask blanks next EUV challenge

Wed, 10 Oct 2013
The next major roadblock to progress in the ongoing push to develop EUV lithography for volume production is the availability of defect-free mask blanks.

How to verify incident implant angles on medium current implants

Wed, 10 Oct 2013
Results can depend on the properties of the wafers used, the conditions of the implant, the conditions of the anneal process, and even the measurement technique.

Toshiba launches new embedded NAND flash memory using 19nm process technology

Thu, 10 Oct 2013
Toshiba Corporation today announced the launch of new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology.

Peregrine and GLOBALFOUNDRIES to collaborate

Fri, 11 Nov 2013
Peregrine Semiconductor and GLOBALFOUNDRIES, a leading provider of semiconductor manufacturing technology, are sampling the first RF Switches built on Peregrine’s new UltraCMOS 10 RF SOI technologies.

Revival in semiconductor industry drives growth in the surface mount technology equipment market

Fri, 11 Nov 2013
SMT equipment market continues to derive demand from major downstream industry segments including telecommunications, computing and consumer appliances, which are the most prolific users of PCBs, according to a new report from Global Industry Analysts, Inc.

Defective nanotubes turned into light emitters

Fri, 11 Nov 2013
UPV/EHU-University of the Basque Country researchers have developed and patented a new source of light emitter based on boron nitride nanotubes and suitable for developing high-efficiency optoelectronic devices.

New techniques produce cleanest graphene yet

Fri, 11 Nov 2013
Columbia Engineers develop new device architecture for 2D materials, making electrical contact from the 1D edge.

Rubicon launches first commercial line of large diameter patterned sapphire substrates

Fri, 11 Nov 2013
Rubicon Technology announced the launch of the first commercial line of large diameter patterned sapphire substrates (PSS) in four-inch through eight-inch diameters.

Imec demonstrates world's first III-V FinFET devices monolithically integrated on 300mm silicon wafers

Tue, 11 Nov 2013
Technology achievement marks significant step towards monolithic heterogeneous integration and non-silicon devices.

Are we using Moore's name in vain?

Tue, 11 Nov 2013
Clearly Moore's law is about cost, and Gordon Moore’s observation was that the optimum number of components (nowadays - transistors) to achieve minimum cost will double every year.

Expect big changes to 2013 Top 20 Semi Supplier ranking

Thu, 11 Nov 2013
SK Hynix, MediaTek, Micron, and Qualcomm each forecast to show ≥30% year-over-year growth.

DecaWave launches industry's most precise indoor location, communication CMOS chip

Thu, 11 Nov 2013
Fabless semiconductor company DecaWave announced today its first single chip of the ScenSor wireless technology family, DW1000, which makes indoor location and communications more accurate, cost-effective and power-efficient than ever before.

SRC, Northeastern University research to increase tumble frequency range of next-generation mobile devices

Thu, 11 Nov 2013
Development of voltage-tunable radio frequency inductors boosts semiconductor and defense industry applications.

Plastic Electronics Conference to rotate between Dresden and Grenoble beginning in 2014

Thu, 11 Nov 2013
SEMI, the global trade organization representing the nano- and micro-electronic manufacturing supply chains, today announced that next year’s Plastic Electronics Conference (PE2014) will be held in Grenoble, France and alternate with Dresden, Germany in future years to better address pan-European opportunities and challenges in Plastic Electronics.

OEM Group celebrates grand opening of expanded facility in Japan

Thu, 11 Nov 2013
Global semiconductor capital equipment manufacturer OEM Group, Inc. announced the opening of its new Sales and Service Center in Yokohama, Japan.

STMicroelectronics, Memoir Systems combine breakthrough memory, semiconductor process technologies

Thu, 11 Nov 2013
Efforts make embedded memory faster, cooler and simpler.

Toshiba starts shipments of CMOS image sensor for automotive view cameras

Mon, 11 Nov 2013
Toshiba Corporation today announced that started sample shipments of a VGA, 1/4 inch CMOS image sensor, “TCM5126GBA,” for automotive view cameras.

Xilinx ships industry's first 20nm all programmable product

Mon, 11 Nov 2013
Xilinx today announced first customer shipment of the semiconductor industry's first 20nm product manufactured by TSMC, and the PLD industry's first 20nm All Programmable device.

SIA awards Mike Splinter the Robert N. Noyce award

Mon, 11 Nov 2013
The Semiconductor Industry Association (SIA) today announced that Mike Splinter, former CEO and current executive chairman of the board of directors at Applied Materials, has been named the 2013 recipient of SIA's highest honor, the Robert N. Noyce Award.

Tosoh Corp. to expand Ohio PVD facility to meet needs of 450mm transition

Mon, 11 Nov 2013
Tosoh Corporation announced today that Tosoh Group company Tosoh SMD, Inc., will implement a major expansion at its Grove City, Ohio, operations to develop, produce, and support physical vapor deposition (PVD) sputtering targets for the new 450mm wafer semiconductor market.

Update on 450mm SEMI Standards

Wed, 11 Nov 2013
SEMI Standards task forces are working on encouraging the industry to collaborate on key issues like the technical parameters for 450mm silicon wafers, physical interfaces, carriers, assembly and packaging. To date, SEMI has 13 task forces working on 450mm and has published nineteen (19) 450mm standards with 14 more in the pipeline.

New way to dissolve semiconductors holds promise for electronics industry

Fri, 11 Nov 2013
Semiconductors, the foundation of modern electronics used in flat-screen TVs and fighter jets, could become even more versatile as researchers make headway on a novel, inexpensive way to turn them into thin films.

Taking a new look at carbon nanotubes

Fri, 11 Nov 2013
Despite their almost incomprehensibly small size – a diameter about one ten-thousandth the thickness of a human hair – single-walled carbon nanotubes come in a plethora of different “species,” each with its own structure and unique combination of electronic and optical properties.

Spansion launches family of flexible microcontrollers for the industrial "Internet of Things"

Mon, 11 Nov 2013
Designed for stringent industrial requirements, Spansion FM Family offers a range of high performance and low power solutions.

Micron announces development of new parallel processing architecture

Mon, 11 Nov 2013
Micron Technology, Inc. today announced the development of a fundamentally new computing architecture capable of performing high-speed, comprehensive search and analysis of complex, unstructured data streams.

Imagination unveils industry's most scalable image signal processing architecture

Mon, 11 Nov 2013
Imagination Technologies announces a ground-breaking new camera Image Signal Processing (ISP) architecture codenamed 'Raptor.'

EV Group introduces non-contact lithography system

Tue, 11 Nov 2013
Leveraging EVG's expertise in photolithography, the EVG PHABLE system incorporates a unique contactless lithography mask-based approach that enables full-field, high-resolution and cost-efficient micro- and nanopatterning of passive and active photonic components, such as patterned structures on light emitting diode (LED) wafers, in high-throughput production environments.

U.S. government awards AMD contract to research interconnect architectures

Tue, 11 Nov 2013
The DesignForward award supports the research of the interconnect architectures and technologies needed to support the data transfer capabilities in extreme-scale computing environments.

Above parity: SEMI releases October book-to-bill ratio

Wed, 11 Nov 2013
A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

SUSS MicroTec installs excimer laser stepper at Fraunhofer IZM Berlin

Wed, 11 Nov 2013
SUSS MicroTec has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.

Rubicon Technology appoints Warren Stewart as Senior VP of Sales and Marketing

Thu, 11 Nov 2013
Rubicon Technology, Inc. today announced that Warren S. Stewart III has joined the Company as Senior Vice President of Sales and Marketing, effective immediately.

Can Intel beat TSMC?

Mon, 11 Nov 2013
It would seem that if Intel could scale transistor cost as they have done in the last 40 years then they could win these super high volume consumer-oriented designs where cost is extremely important. And TSMC is clearly taking this seriously.

What can happen when graphene meets a semiconductor

Mon, 11 Nov 2013
For all the promise of graphene as a material for next-generation electronics and quantum computing, scientists still don't know enough about this high-performance conductor to effectively control an electric current.

Nanotubes can solder themselves, markedly improving device performance

Tue, 11 Nov 2013
University of Illinois researchers have developed a way to heal gaps in wires too small for even the world’s tiniest soldering iron.

Soitec and SunEdison enter into patent license agreement

Tue, 11 Nov 2013
Soitec and SunEdison, Inc. announced today that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products.

Semiconductor Industry Association begins leadership transition

Wed, 11 Nov 2013
Semiconductor Industry Association (SIA) president and CEO Brian Toohey has announced his plans to leave the association in 2014 to join New Hampshire-based DEKA Research & Development Corporation as executive vice president.

Semiconductor industry leaders to examine the future of 3D NAND at Dec 10 event

Mon, 12 Dec 2013
Manufacturing 3D NAND designs requires overcoming formidable technical challenges to create extremely complex high-aspect-ratio structures.

2013 semiconductor equipment sales forecast $32B; strong growth forecast for 2014

Tue, 12 Dec 2013
SEMI projects that worldwide sales of new semiconductor manufacturing equipment will contract 13.3 percent to $32.0 billion in 2013.

EV Group introduces full-field UV nanoimprint lithography system

Tue, 12 Dec 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 720 automated UV nanoimprint lithography (UV-NIL) system.

Sankalp Semiconductor appoints Dan Clein into its management team

Tue, 12 Dec 2013
Sankalp Semiconductor Private Limited, a leading Analog Mixed-Signal services and solutions company from India, announced today the appointment of Mr. Dan Clein into its management team. Dan will be based out of the North America region.

Lab school brings manufacturing technologies to middle-school classrooms

Tue, 12 Dec 2013
A partnership among the University of Virginia's (UVa) Schools of Education and Engineering and the Charlottesville Public Schools has led to the launch of Buford Engineering Design Academy, a laboratory school for advanced manufacturing.

Imec simplifies i-PERC solar cell processing by implementing laser doping from ALD-Al2O3

Tue, 12 Dec 2013
The cells achieved average conversion efficiencies of 20.2%.

Cellphones pass PCs as biggest systems market and IC user

Tue, 12 Dec 2013
Tablets and wireless networks are expected to show highest growth rates through 2017.

Soitec announces high-volume manufacturing of new eSI substrates

Wed, 12 Dec 2013
Soitec, a manufacturer semiconductor materials for the electronics and energy industries, today announced it has reached high-volume manufacturing of its new Enhanced Signal Integrity (eSI) substrates, enabling cost-effective and high-performance radio-frequency (RF) devices.

Micron Technology appoints Rajan Rajgopal as VP of Quality

Wed, 12 Dec 2013
Micron Technology, Inc. today announced that the company has named Rajan Rajgopal, vice president of Quality.

Worldwide semiconductor revenue grew 5.2 percent in 2013

Wed, 12 Dec 2013
Worldwide semiconductor revenue totaled $315.4 billion in 2013, a 5.2 percent increase from 2012 revenue of $299.9 billion, according to preliminary results by Gartner, Inc.

Laser light at useful wavelengths from semiconductor nanowires

Thu, 12 Dec 2013
Nanowire lasers could work with silicon chips, optical fibers, even living cells.

Industry on track for highest-ever annual sales in 2013

Thu, 12 Dec 2013
Worldwide sales increase for eighth straight month and top $27 billion for first time ever in October; WSTS forecast projects growth of 4.4 percent in 2013 and 4.1 percent in 2014.

Nikkiso initiates shipments of deep ultraviolet LEDs

Thu, 12 Dec 2013
NIKKISO CO. has announced that it has initiated shipments of commercial LED product samples emitting at a range of wavelengths in the UVB and UVC spectral regimes for industrial, biomedical, and environmental applications.

Brewer Science commercializes thermal slide debonder

Fri, 12 Dec 2013
Brewer Science, a supplier of thin-wafer-handling materials, processes, and equipment to the microelectronics industry, announced today the first commercial placement of its Cee 1300CSX thermal slide debonder.

Equipment spending down 2013; expect 33% growth in 2014

Fri, 12 Dec 2013
Fab construction projects boom in 2013 but slow in 2014.

Growing interest in the physics of nanostructures to drive demand for thin films

Fri, 12 Dec 2013
GIA invites senior industry executives, domain experts, technologists and market strategists to participate in a comprehensive global research initiative studying the “Thin Films” markets.

Graphene: Growing giants

Fri, 12 Dec 2013
While searching for an ideal growth platform for the material, investigators developed a promising new recipe for a graphene substrate: a thin film of copper with massive crystalline grains.

CEA-Leti signs agreement with Qualcomm to assess sequential 3D technology

Mon, 12 Dec 2013
CEA-Leti today announced an agreement with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to assess the feasibility and the value of Leti’s sequential 3D technology.

STMicroelectronics launches new advanced energy-harvesting IC

Tue, 12 Dec 2013
STMicroelectronics is opening new avenues for energy-harvesting applications with its latest IC integrating all the functions needed to power electronic circuits and recharge batteries using either a solar cell or Thermo-Electric Generator (TEG).

Singapore-MIT Alliance for Research Technology orders EV Group automated production bonding system

Tue, 12 Dec 2013
SMART, which is a leading research center established by the Massachusetts Institute of Technology (MIT) in partnership with the National Research Foundation of Singapore, will utilize the EVG850LT system to support its advanced substrate development efforts.

SEMICON West “Call for Papers” for New Semiconductor Technology Symposium, Science Park and TechXPOTs

Tue, 12 Dec 2013
SEMI today announced a “Call for Papers” for the new Semiconductor Technology Symposium, the popular TechXPOT programs, and a new Science Park program featuring university research and advanced R&D subjects at SEMICON West, North America’s premier microelectronics event, to be held July 8-10 at the Moscone Center in San Francisco, Calif.

Soitec announces confirmation of the strategic benefits of the Guépard program

Wed, 12 Dec 2013
Soitec announced this week that the European Commission has approved the financing for the Guépard program, coordinated by Soitec.

#1: Triangular MOSFETs with InGaAs Channels

Tue, 12 Dec 2012

#2: Thermally Stable Magnetic Tunnel Junction Memory

Tue, 12 Dec 2012

#3: TSMC’s Integrated 16nm FinFET Technology Platform

Tue, 12 Dec 2012

#4: Monolithic 3D Chip

Tue, 12 Dec 2012

#5: Nanofluidic Channels for Lab-on-Chip

Tue, 12 Dec 2012

#6: Novel Nanopore Sensor for DNA Sequencing

Tue, 12 Dec 2012

#7: Hybrid Nanowire/CMOS Biosensor

Tue, 12 Dec 2012

#8: 300mm wafer-scale Ge FinFET

Tue, 12 Dec 2012

#9: Record Silicon Nanowire MOSFETs

Tue, 12 Dec 2012

#10: Visualizing CBRAM Filaments

Tue, 12 Dec 2012

#11: Fastest Ge p-MOSFET

Tue, 12 Dec 2012

Slideshow: IEDM 2013 Highlights

Wed, 12 Dec 2013
This week, industry leaders and experts have gathered in Washington D.C. at the 59th annual IEEE International Electron Device Meeting (IEDM) conference.

Celebrating 20 years of BSIM3v3 SPICE models

Thu, 12 Dec 2013
Zhihong Liu of ProPlus Designs reflects on the history of the MOSFET SPICE model called BSIM3.

Synthesis of superconducting solid picene

Thu, 12 Dec 2013
Research by Professor Yoshihiro Kubozono at Okayama University has potential for innovative applications of solid picene and organic superconductors, graphene and other functional materials.

Soitec and IntelliEPI to collaborate on GaAs semiconductor materials

Thu, 12 Dec 2013
The agreement includes a technology license granted by Soitec to IntelliEPI, which may be extended to address future business opportunities in the GaAs market, including equipment transfer.

Graphene-based nano-antennas may enable networks of tiny machines

Thu, 12 Dec 2013
Networks of nanometer-scale machines offer exciting potential applications in medicine, industry, environmental protection and defense, but until now there's been one very small problem: the limited capability of nanoscale antennas fabricated from traditional metallic components.

Low-power tunneling transistor for high-performance devices at low voltage

Thu, 12 Dec 2013
A new type of transistor that could make possible fast and low-power computing devices for energy-constrained applications such as smart sensor networks, implantable medical electronics and ultra-mobile computing is feasible, according to Penn State researchers.

TSI Semiconductors appoints Deborah Harvey as Executive Vice President of Worldwide Foundry Sales

Fri, 12 Dec 2013
TSI Semiconductors, LLC, a specialty foundry services company offering flexible technology development and high-quality manufacturing solutions, today announced that Deborah Harvey has joined the company in the newly created position of executive vice president of Worldwide Foundry Sales.

Samsung announces Gregory Lee as President and CEO of Samsung Electronics North America headquarters

Mon, 12 Dec 2013
Samsung Electronics Co., Ltd. announced the appointment of Gregory Lee as President of the North America Headquarters in addition to his role as President of Samsung Telecommunications America (STA) effective immediately.

Avago Technologies to acquire LSI Corporation

Mon, 12 Dec 2013
Avago Technologies Limited and LSI Corporation today announced that they have entered into a definitive agreement under which Avago will acquire LSI for $11.15 per share in an all-cash transaction valued at $6.6 billion.

Mindspeed announces agreement to sell assets to Intel

Mon, 12 Dec 2013
Mindspeed Technologies, Inc., a supplier of semiconductor solutions for network infrastructure, today announced that it has signed a definitive agreement to sell the assets of its wireless infrastructure business unit to Intel Corporation.

Crystal film growth: nanosheets extend epitaxial growth applications

Tue, 12 Dec 2013
Molecularly thin two-dimensional crystals can alleviate the lattice matching restrictions of epitaxial crystalline thin film growth, as reported by researchers in Japan.

Micron collaborates with Broadcom to solve DRAM timing challenge

Tue, 12 Dec 2013
Micron Technology, Inc., a providers of advanced semiconductor solutions, today announced its collaboration with Broadcom Corporation to develop the industry's first solution designed for customers challenged by an intrinsic DDR3 timing parameter called tFAW, or four activate window.

IDT appoints Gregory Waters as President and CEO

Tue, 12 Dec 2013
Integrated Device Technology, Inc. today announced the appointment of Greg Waters, 53, as President, Chief Executive Officer and board member, effective January 6, 2014. Jeff McCreary, who served as interim CEO since August 2013, will remain a member of the IDT board of directors.

MACOM successfully completes tender offer for Mindspeed Technologies

Wed, 12 Dec 2013
M/A-COM Technology Solutions Holdings, Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced that it has successfully completed its previously announced tender offer to purchase all outstanding shares of common stock of Mindspeed Technologies, Inc. for $5.05 per share in cash.

Spansion dual-quad serial flash delivers performance for graphic-rich applications

Wed, 12 Dec 2013
Universal footprint enables common pinout with current and future high-speed memory.

Intel ends 2013 with a bang

Wed, 12 Dec 2013
ABI Research verified that Intel has a leading position in the mobile processor technology race; launching the first 22nm mobile application processor.

Soitec and CEA sign a five-year R&D partnership

Wed, 12 Dec 2013
This new contract aims to support Soitec's strategy for the electronics, solar energy and lighting markets.

STMicroelectronics joins ARM mbed Project

Thu, 12 Dec 2013
ARM, a semiconductor supplier, and STMicroelectronics today announced that ST has joined the ARM mbed Project.

Book-to-bill: Year-end activity substantially stronger compared to last year

Fri, 12 Dec 2013
North America-based manufacturers of semiconductor equipment posted $1.24 billion in orders worldwide in November 2013 (three-month average basis) and a book-to-bill ratio of 1.11.

TowerJazz and Panasonic sign agreement

Fri, 12 Dec 2013
TowerJazz, a global specialty foundry, and Panasonic Corporation today announced the signing of a definitive agreement to create a joint venture (JV) to manufacture Panasonic’s products, using Panasonic's three semiconductor manufacturing facilities in Japan

Mentor Graphics announces president and managing director for Japan

Fri, 12 Dec 2013
Mentor Graphics Corporation yesterday announced Greg Helton as president and managing director for Mentor Graphics Japan.

Micron revenue surges after Elpida deal officially closes

Mon, 12 Dec 2013
Micron Technology surged 130 percent in revenue during the third quarter as it finally closed its acquisition of bankrupt Elpida Memory of Japan, a vigorous ascent that also propelled the total market for dynamic random access memory (DRAM) to its best performance yet in 11 quarters.

Samsung releases 8Gb mobile DRAM

Fri, 1 Jan 2014
Samsung announced today that it has developed the industry’s first eight gigabit, low power double data rate 4, mobile DRAM.

Toppan Photomasks mourns the death of David Murray, president and CEO

Fri, 1 Jan 2014
Toppan Photomasks, Inc. (TPI) is saddened to announce the death of President and CEO David Murray after a long battle with cancer. Mr. Murray was 55 years old.

Architecture from STMicroelectronics leads industry transition to 64-bit computing

Mon, 1 Jan 2014
STMicroelectronics has released details of its STi8K architecture addressing future Systems-on-Chips (SoCs).

TOWA launches new Packaging Development Center

Thu, 1 Jan 2014
The TOWA Corporation of Japan, a supplier of packaging equipment for semiconductor, electronics and LED industries, has decided to expand their activities in Europe with an Innovation Center for Packaging Development and announced the launch of TOWA Europe B.V.

TSMC, Samsung and Micron top list of IC industry capacity leaders

Thu, 1 Jan 2014
The top 10 companies now hold 67% of worldwide IC industry capacity, up from 54% in 2009.

"Crisis? What Crisis?": New paradigm adjustments for capacity and equipment spending

Thu, 1 Jan 2014
Worldwide, the semiconductor industry growth rate back in 1973 was about 30 percent and slipped into 1975 with negative sales growth rates.

Slideshow: CES 2014 Highlights

Fri, 1 Jan 2014
This week in Las Vegas, the 2014 International Consumer Electronics Show focused on the Internet of Things, displaying many connected gadgets and services.

3) Invensas shows new xFD-based customer products with Etron Technology

Sun, 1 Jan 2010

Imec, AlixPartners to develop model for lowering costs of advanced semiconductor tech

Mon, 1 Jan 2014
Patterning options for N10/N7 nodes, advanced packaging solutions and 3D NAND memory to be targeted.

Imec celebrates 30 years

Tue, 1 Jan 2014
Nanotechnology research and development center imec, today announced the celebration of its 30th anniversary.

Economic recovery and pervasive computing to propel semiconductor manufacturing supply chain

Tue, 1 Jan 2014
Macroeconomic and microelectronic industry growth opportunities and innovation challenges underscored diverse perspectives from analysts, economists, technologists, semiconductor manufacturers and supply chain executives speaking at the SEMI Industry Strategy Symposium (ISS) that opened yesterday.

Microprocessor sales growth will strengthen slightly in 2014

Tue, 1 Jan 2014
A modest recovery in personal computers this year is expected to slightly strengthen overall sales growth in microprocessors, which is forecast to rise 9 percent in 2014 to a record-high $66.7 billion compared to $61.0 billion in 2013.

Xilinx and University of Florida honored with SEMI Award for advancements in interposers and CMOS fab process

Wed, 1 Jan 2014
SEMI today announced that two teams — from the University of Florida and Xilinx — are recipients of the 2013 SEMI Award for North America.

Semiconductor plastic packaging materials market to approach $21B by 2017

Wed, 1 Jan 2014
The market for semiconductor packaging materials, including thermal interface materials, is expected to maintain its $20 billion value through 2017, despite shifts away from the use of precious metals such as gold in wire bonding.

SRC launches industry consortium

Wed, 1 Jan 2014
Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, has launched a significant new initiative on Trustworthy and Secure Semiconductors and Systems (T3S).

ARM and UMC extend 28nm partnership

Thu, 1 Jan 2014
ARM and global semiconductor foundry UMC this week announced an agreement to offer the ARM Artisan physical IP platform along with POP IP for UMC’s 28nm high-performance low-power (HLP) process technology.

3DIC market to reach $7.52B by 2019

Thu, 1 Jan 2014
The market for 3DICs globally is forecast to reach USD 7.52 billion by 2019, according to a new market report published by transparency market research.

Intel vs. TSMC: An Update

Tue, 1 Jan 2014
On January 14, 2014, we read on the Investors.com headlines page - Intel Seen Gaining Huge Pricing Advantage Over TSMC. Just three days later comes the responding headline: TSMC: We're "Far Superior" to Intel and Samsung as a Partner Fab.

Besi and Imec collaborate on thermocompression technology

Tue, 1 Jan 2014
Today, at the SEMI European 3D TSV Summit, nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput.

Natural 3D counterpart to graphene discovered

Tue, 1 Jan 2014
The discovery of what is essentially a 3D version of graphene promises exciting new things to come for the high-tech industry, including much faster transistors and far more compact hard drives.

Researchers develop new technique for probing subsurface electronic structure

Tue, 1 Jan 2014
A new technique from an international team of researchers working at Berkeley Lab’s Advanced Light Source (ALS) promises to deliver the goods.

Optical Interconnects Conference 2014 to be held in Coronado, CA

Tue, 1 Jan 2014
The 2014 Optical Interconnects Conference, sponsored by the IEEE Photonics Society, announces a Call for Papers for the 25th anniversary of this premier conference, dedicated to bringing advanced interconnect technologies from research labs to commercial realization.

Semiconductors that detect cancer

Thu, 1 Jan 2014
As exciting as it is to watch the semiconductor industry push to sub-10nm dimensions, 450mm wafers, finFETs, 3D ICs and the like, what’s even cooler is the potential of semiconductor technology to make a real difference in medicine.

Progress on 450mm at G450C

Thu, 1 Jan 2014
At Semicon Europa, Paul Farrar, general manager of G450C, provided an update on the consortium’s progress in demonstrating 450mm process capability. He said 25 tools will be installed in the Albany cleanroom by the end of 2013, progress has been made on notchless wafers with a 1.5mm edge exclusion zone, they have seen significant progress in wafer quality, and automation and wafer carriers are working.

Design for yield trends

Thu, 1 Jan 2014
Should foundries establish and share best practices to manage sub-nanometer effects to improve yield and also manufacturability?

A bilayer temporary bonding solution for 3D-IC TSV fabrication

Thu, 1 Jan 2014
New technology eliminates the need for specialized equipment for wafer pre- or post-treatment.

Substrate impact on 2.5/3D IC costs

Thu, 1 Jan 2014
At the recent Georgia Tech Global Interposer Technology (GIT) Workshop in Atlanta, the pervasive theme appeared to be whether a change in substrate is required to lower overall costs and help drive HVM (high volume manufacturing) applications.

Advances in back-side via etching of SiC for GaN

Thu, 1 Jan 2014
The development of an 85µm diameter, 100µm deep SiC back-side via etch process for production is described.

FinFET evolution for the 7nm and 5nm CMOS technology nodes

Thu, 1 Jan 2014
In addition to extending the fin-based design investments, augmenting the FinFET for improved performance allows an evolution of the process infrastructure for a few more nodes.

Moving atomic layer etch from lab to fab

Thu, 1 Jan 2014
A new plasma-enhanced atomic layer etch method delivers atomic-level etch precision with process times that are practical for use in a manufacturing environment.

Applying leading-edge non-visual defect inspection to a mainstream 200mm fab

Thu, 1 Jan 2014
Improving economic competitiveness through cost reduction, cycle time improvement and more eco-friendly processing.

Synthetic diamond’s role in thermal management

Thu, 1 Jan 2014
Synthetic diamond is ideally suited for thermal management of semiconductor packaging, as it combines exceptionally high thermal conductivity with electrical isolation.

2014 Outlook: An era of unprecedented change

Fri, 1 Jan 2014
We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.

Cyclical upturn continues in 2014: Positive yet cautious expectations persist

Thu, 1 Jan 2013
In 2013, the IC industry emerged from a difficult 5-year period of minimal growth and started on its next cyclical upturn, a welcome piece of news.

Outlook for semiconductors and the value chain in 2014

Thu, 1 Jan 2013
We approach 2014 with a combination of positive policy, financial, and economic forces that will push world growth up to a +3% range.

Coming year promises increased capital spending and continued need for effective industry collaboration

Thu, 1 Jan 2013
For most of the past 15 years, the industry has displayed a fairly predictable pattern of fab equipment spending, characterized generally by two years of decline followed by two years of positive growth.

The shift to materials-enabled 3D

Thu, 1 Jan 2013
Innovations in mobile computing and communications will continue to be a driving factor for the semiconductor equipment industry.

Innovation and collaboration key in 2014

Thu, 1 Jan 2013
As far as the outlook goes for 2014-2015, investments coming from the semiconductor and microelectronics industries are going to be pretty robust.

Can we keep on benefiting from Moore’s Law?

Thu, 1 Jan 2013
For almost five decades, performance improvements and cost reduction of ICs have been cornerstones of the growth of the semiconductor industry.

Key market and technology trends in the sub-20nm era

Thu, 1 Jan 2013
Keeping up with Moore’s Law has always required significant investment and ingenuity, and this era brings additional challenges in device structures, materials and methodologies.

Keys to success: Testing in the New Mobile World

Thu, 1 Jan 2013
The semiconductor industry is moving from a PC-centric, digital era to a communication and mobile world.

Book-to-bill ratio continues to improve

Fri, 1 Jan 2014
The December three-month average bookings were at the highest level since June 2012 — a positive sign for the 2014 spending outlook.

Europe leaders to examine EC’s ambitious goal

Mon, 1 Jan 2014
At the SEMI Industry Strategy Symposium Europe (ISS Europe 2014) on February 23-25 in Salzburg, semiconductor industry executives will examine the conditions required to achieve the EU’s 10/100/20 strategy.

SMIC unveils 28nm readiness

Mon, 1 Jan 2014
Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, announced today that its 28nm technology has been process frozen and the company has successfully entered Multi Project Wafer stage to support customer's requirements on both 28nm PolySiON (PS) and 28nm high-k dielectrics metal gate processes.

Apple and Samsung are top OEMs, again, in semiconductor spending for 2013

Mon, 1 Jan 2014
Apple and Samsung remained the world’s largest buyers of semiconductor chips in 2013, but the intensifying battle between the two for the hearts and minds of consumers in their product offerings could presage another mighty showdown this year for the top ranking, according to a new report from IHS Technology.

Mobile PCs, smartphones will be top revenue opportunities for IC suppliers in high-speed wireless device market

Mon, 1 Jan 2014
Mobile PCs and smartphones will represent the top revenue opportunities for high-speed wireless integrated circuit (IC) suppliers by 2018, as these devices are projected to be the highest-volume applications in this market over the next five years.

Slimpin promoted to director in SwRI’s Applied Physics Division

Tue, 1 Jan 2014
David G. Slimpin has been promoted to director of the Electronics Systems and Robotics Department in the Applied Physics Division at Southwest Research Institute (SwRI). He was previously a program manager in the department.

Cooling microprocessors with carbon nanotubes

Tue, 1 Jan 2014
Researchers with the U.S. Department of Energy (DOE)’s Lawrence Berkeley National Laboratory (Berkeley Lab) have developed a “process friendly” technique that would enable the cooling of microprocessor chips through carbon nanotubes.

Crocus licences MLU technology to ARM

Wed, 1 Jan 2014
Crocus Technology today announces it has licensed its Magnetic Logic Unit technology to ARM.

North Carolina State University to lead research consortium on power electronics

Thu, 1 Jan 2014
Called the Next Generation Power Electronics Institute, the new consortium will provide shared facilities, equipment and testing to companies from the power electronics industry, focusing and small and medium-sized companies.

University of Strathclyde demonstrates world’s first continuously operating diamond Raman laser

Fri, 1 Jan 2014
Achievements prove diamond’s viability as a material for solid-state laser engineering, even in the most demanding intracavity applications.

2014 capital spending up in Korea; SEMICON Korea to address mobile innovation

Fri, 1 Jan 2014
With Korea expected to be the second largest region for fab construction spending in 2014, industry leaders will convene at SEMICON Korea 2014 in Seoul on February 12-14 to discuss the latest trends and technologies shaping the future of microelectronics manufacturing.

Long live FinFET

Mon, 2 Feb 2014
Zhihong Liu, Executive Chairman, ProPlus Design Solutions, Inc., San Jose, Calif. blogs on how the industry's move to FinFETs is impacting design.

Element Six's synthetic diamond proven as viable material for sophisticated optical components

Mon, 2 Feb 2014
Element Six, a developer of synthetic diamond supermaterials and member of the De Beers Group of Companies, today presented new data and announced that its high purity single crystal chemical vapor deposition (CVD) diamond material has been proven for use in intracavity cooling of disc lasers and in development of the first ever tunable diamond Raman laser system.

Entegris to acquire ATMI

Tue, 2 Feb 2014
Entegris, Inc. and ATMI today announced Entegris will acquire ATMI for approximately $1.15 billion, or approximately $850 million net of cash acquired, including the net cash proceeds from the sale of ATMI’s LifeSciences business of $170 million.

Diamond defects boosts quantum technology

Tue, 2 Feb 2014
New research shows that a remarkable defect in synthetic diamond produced by chemical vapor deposition allows researchers to measure, witness, and potentially manipulate electrons in a manner that could lead to new "quantum technology" for information processing.

New theory may lead to more efficient solar cells

Tue, 2 Feb 2014
A new theoretical model developed by professors at the University of Houston (UH) and Université de Montréal may hold the key to methods for developing better materials for solar cells.

Ballistic transport in graphene suggests new type of electronic device

Thu, 2 Feb 2014
Using electrons more like photons could provide the foundation for a new type of electronic device that would capitalize on the ability of graphene to carry electrons with almost no resistance even at room temperature – a property known as ballistic transport.

Intel elects five new corporate vice presidents

Thu, 2 Feb 2014
Intel Corporation today announced that its board of directors elected five new corporate vice presidents.

Silicon reclaim wafer market increased 14% in 2013

Thu, 2 Feb 2014
The worldwide reclaim wafer market is estimated at $460 million in 2013 and is forecasted to reach $493 million by 2015, according to SEMI.

Executives debate innovation drivers and cost reduction in microelectronics supply chain

Thu, 2 Feb 2014
The closing Executive Panel discussion at the SEMI Industry Strategy Symposium on January 15 provoked diverse views on the drivers and future of innovation in the microelectronics manufacturing supply chain.

The impact on OPC and SRAF caused by EUV shadowing effect

Fri, 2 Feb 2014
EUV’s off-axis mask illumination introduces a special problem in EUV OPC – the shadowing effect.

A square peg in a round hole: The economics of panel-based lithography for advanced packaging

Fri, 2 Feb 2014
Moving from round wafers to rectangular panels saves corner space, delivering a roughly 10% improvement in surface utilization.

IBM continues to evolve: Semiconductor business up for sale; moving into the cloud

Fri, 2 Feb 2014
The Financial Times (FT) is reporting that IBM Corp is exploring the sale of its semiconductor business and has hired Goldman Sachs to find potential buyers.

EV Group unveils high-volume manufacturing photoresist processing system

Tue, 2 Feb 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing.

Silicon wafer revenues decline in 2013

Tue, 2 Feb 2014
Worldwide silicon wafer revenues declined by 13 percent in 2013 compared to 2012 according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

Chips that listen to bacteria

Tue, 2 Feb 2014
A research team led by Ken Shepard, professor of electrical engineering and biomedical engineering at Columbia Engineering, and Lars Dietrich, assistant professor of biological sciences at Columbia University, has demonstrated that integrated circuit technology, the basis of modern computers and communications devices, can be used for a most unusual application—the study of signaling in bacterial colonies.

Rudolph announces shipments for 3D metrology of TSVs

Tue, 2 Feb 2014
Rudolph Technologies, Inc. announced today the sale of its first NSX 320 TSV Metrology System to CEA-Leti, a research organization based in Grenoble, France.

Intermolecular and Guardian Industries expand collaboration

Tue, 2 Feb 2014
Intermolecular, Inc. and Guardian Industries announced today the expansion and extension of their collaborative development program and strategic IP licensing agreement.

Fujitsu Labs and imec develop wireless transceiver technology for medical devices

Wed, 2 Feb 2014
Fujitsu Laboratories Ltd. and imec Holst Centre today announced that they have developed a wireless transceiver circuit for use in body area networks (BAN) for medical applications that adheres to the 400 MHz-band international standard.

ROHM Semiconductor's operational amplifiers for sensor signal amplification

Thu, 2 Feb 2014
ROHM Semiconductor today introduced the development of the BD5291G and the BD5291FVE low voltage, low offset operational amplifiers (opamp) designed to amplify signals from motion sensors such as accelerometers and gyroscopes.

SPTS Technologies opens new office in Korea

Thu, 2 Feb 2014
SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets today announced the opening of a new office in Korea.

How to make the wonder material graphene superconducting

Thu, 2 Feb 2014
Whenever a new material is discovered, scientists are eager to find out whether or not it can be superconducting. This applies particularly to the wonder material graphene.

Advanced Energy highlights enabling pulsing tech for 2X/1Xnm at SEMICON Korea 2014

Thu, 2 Feb 2014
Advanced Energy Industries, Inc. today will highlight its advanced pulsing technology at SEMICON Korea 2014.

Honeywell introduces new copper manganese sputtering targets

Fri, 2 Feb 2014
Honeywell announced today that it has introduced new copper manganese (CuMn) sputtering targets for semiconductor manufacturing based on patented technology offering customers higher strength, longer life, and better performance.

Dow Electronic Materials launches CMP polishing pads

Fri, 2 Feb 2014
Dow Electronic Materials, a business unit of The Dow Chemical Company, today introduced the IKONIC 4000 series of chemical mechanical planarization (CMP) polishing pads.

Renesas Electronics develops industry's first 28nm embedded flash memory tech for microcontrollers

Tue, 2 Feb 2014
Renesas Electronics Corporation today announced that it has developed the industry's first 28nm flash memory intellectual property (IP) for microcontrollers (MCUs) using a 28nm process technology.

MACOM acquires Nitronex

Tue, 2 Feb 2014
M/A-COM Technology Solutions Inc., a supplier of high performance analog, RF, microwave and millimeter wave products, last week announced that it has acquired Nitronex, LLC.

GaN Systems appoints Tony Astley as Director of European Operations

Tue, 2 Feb 2014
GaN Systems Inc, a developer of gallium nitride power switching semiconductors, has announced the appointment of Tony Astley as Director of European Operations.

SiC & GaN power semiconductors leads power discrete market by 2018

Tue, 2 Feb 2014
Analysts at ReportsNReports forecast the Global Power Discrete market to grow at a CAGR of 8.43% over the period 2013-2018.

Breakthrough development in 1D-1R memory cell array

Tue, 2 Feb 2014
Dr. Tae-Wook Kim at KIST announced their successful development of a 64-bit memory array using flexible and twistable carbon nano material and organo-polymer compound, which can accurately store and delete data.

World's first 79 GHz radar transmitter in 28nm CMOS

Tue, 2 Feb 2014
Imec, in collaboration with Vrije Universiteit Brussel, Brussels, Belgium, presents the world’s first 79 GHz radar transmitter implemented in plain digital 28nm CMOS.

Silicon-germanium chip sets new speed record

Tue, 2 Feb 2014
A research collaboration consisting of IHP-Innovations for High Performance Microelectronics in Germany and the Georgia Institute of Technology has demonstrated the world's fastest silicon-based device to date.

Avantor Performance Materials names Jean-Paul Mangeolle to Board of Directors

Wed, 2 Feb 2014
Avantor Performance Materials, a global manufacturer and supplier of high-performance chemistries, announces the appointment of Jean-Paul Mangeolle to its Board of Directors.

The most expensive SRAM in the world - 2.0

Thu, 2 Feb 2014
Embedded SRAM scaling is broken and, with it, Moore's Law.

Samsung, Intel Capital and Applied Materials fund Inpria to develop advanced semiconductor materials

Thu, 2 Feb 2014
Inpria Corporation announced today that it has received $4.7M of a committed $7.3M financing. The round was led by Samsung Venture Investment Corporation, the global investment arm of the Samsung Group, along with significant participation from Intel Capital, Intel’s global investment and M&A organization.

Plasma-Therm signs cross-licensing agreement with ON Semiconductor

Thu, 2 Feb 2014
Plasma-Therm announced today that it has entered into a new cross licensing agreement with ON Semiconductor to enable wafer singulation processes.

Using holograms to improve electronic devices

Thu, 2 Feb 2014
A team of researchers from the University of California, Riverside Bourns College of Engineering and Russian Academy of Science have demonstrated a new type of holographic memory device that could provide unprecedented data storage capacity and data processing capabilities in electronic devices.

2014 SPIE Startup Challenge winners announced

Thu, 2 Feb 2014
A microscope in a needle, a handheld device that prescribes corrective eyeglasses, and a device for heart attack diagnosis are winning projects in the 2014 SPIE Startup Challenge.

Semiconductor industry posts record sales in 2013

Thu, 2 Feb 2014
The Semiconductor Industry Association announced that worldwide semiconductor sales for 2013 reached $305.6 billion, the industry’s highest-ever annual total and an increase of 4.8 percent from the 2012 total of $291.6 billion.

Single chip device to provide real-time 3-D images from inside the heart and blood vessels

Thu, 2 Feb 2014
Researchers have developed the technology for a catheter-based device that would provide forward-looking, real-time, three-dimensional imaging from inside the heart, coronary arteries and peripheral blood vessels.

Frost & Sullivan recognize RFaxis with Award for Technology Innovation Leadership

Fri, 2 Feb 2014
Based on its recent analysis of the market for radio frequency front-end module (RF FEM) solution for wireless communication, Frost & Sullivan recognizes RFaxis, Inc. with the 2014 North American Frost & Sullivan Award for Technology Innovation Leadership.

North American semiconductor equipment industry posts January 2014 book-to-bill ratio of 1.04

Fri, 2 Feb 2014
A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

Europe launches PLACYD, a large consortium to address DSA lithography

Mon, 2 Feb 2014
PLACYD, an EU funded consortium of industrial and academic collaborators and led by Arkema will establish a dedicated material manufacturing facility that allows the production of block copolymers meeting the rigorous standards required for their use in industry as nanolithographic templates.

International Rectifier opens ultra-thin wafer processing facility in Singapore

Mon, 2 Feb 2014
International Rectifier, IR, today announced that the company has commenced initial production at its new ultra-thin wafer processing facility in Singapore (IRSG).

Call for Papers open for SEMICON Europa 2014, Plastics Electronics Conference

Mon, 2 Feb 2014
SEMI announced the “Call for Papers” for technical sessions and presentations for SEMICON Europa 2014 which takes place October 7-9 in Grenoble, France.

Movidius joins the Global Semiconductor Alliance

Mon, 2 Feb 2014
Movidius today announced that it has joined the Global Semiconductor Alliance (GSA).

SRC and MIT extend high resolution lithography capabilities

Wed, 2 Feb 2014
MIT researchers sponsored by Semiconductor Research Corporation have introduced new directed self-assembly (DSA) techniques that promise to help semiconductor manufacturers develop more advanced and less expensive components.

JILA physicists discover "quantum droplet" in semiconductor

Wed, 2 Feb 2014
JILA physicists used an ultrafast laser and help from German theorists to discover a new semiconductor quasiparticle—a handful of smaller particles that briefly condense into a liquid-like droplet.

eBeam Initiative announces key educational themes for 2014

Wed, 2 Feb 2014
The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced the top educational themes that it will highlight in 2014.

GlobalFoundries and Fraunhofer IIS to collaborate on EUROPRACTICE, Europe's MPW wafer shuttle program

Wed, 2 Feb 2014
GLOBALFOUNDRIES and Fraunhofer Institute for Integrated Circuits IIS today announced the extension of their long-term collaboration, focusing on 40nm and 28nm processes. GLOBALFOUNDRIES will also join the European Multi Product Wafer (MPW) Program EUROPRACTICE.

Intermolecular announces agreement with SanDisk and Toshiba

Fri, 2 Feb 2014
Intermolecular, Inc. today announced that the development activity related to the Collaborative Development Program agreement with SanDisk and Toshiba has reached its successful conclusion.

New SEMICON Europa in Grenoble to emphasize innovation and applications

Mon, 3 Mar 2014
SEMICON Europa, the region’s largest event for the microelectronics manufacturing and innovation supply chain, will be held 7-9 October 2014 in Grenoble.

Global semiconductor industry posts highest-ever January sales

Mon, 3 Mar 2014
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $26.28 billion for the month of January 2014, an increase of 8.8 percent from January 2013 when sales were $24.15 billion, marking the industry's highest-ever January sales total and the largest year-to-year increase in nearly three years.

Busch Vacuum Pumps and Systems joins F450C Consortium

Tue, 3 Mar 2014
The Facilities 450mm Consortium (F450C), a partnership of nanoelectronics facility companies guiding the effort to design and build the next-generation 450mm computer chip fabrication facilities, today announced Busch Vacuum Pumps and Systems as the eleventh member company to join the consortium.

Failure analysis and the innovative pinpoint conductive AFM

Tue, 3 Mar 2014
One of the most challenging issues in the semiconductor industry is the failure analysis (FA) investigation of devices with enduringly shrinking geometries down to single digit nanometer trench widths.

Silicon Labs acquires low-power analog IC products

Tue, 3 Mar 2014
Silicon Labs today announced the purchase of the full product portfolio and intellectual property of California-based Touchstone Semiconductor Inc.

How 19th century physics could change the future of nanotechnology

Tue, 3 Mar 2014
A new twist on a very old physics technique could have a profound impact on one of the most buzzed-about aspects of nanoscience.

Researchers at UC study zero-dimensional quantum dots

Tue, 3 Mar 2014
Zero-dimensional quantum dots identified by University of Cincinnati researchers could someday have a big effect on a variety of technologies, such as solar energy, lasers and medical diagnostics.

Moore's Law has stopped at 28nm

Wed, 3 Mar 2014
While many have recently predicted the imminent demise of Moore’s Law, we need to recognize that this actually has happened at 28nm.

Global failure analysis equipment market to grow at CAGR of 8.8% from 2013 to 2019

Wed, 3 Mar 2014
Rapid growth in nanotechnology coupled with growth in medical applications in the Asia Pacific region has fueled the growth of failure analysis equipment market.

University of Minnesota professor recognized for excellence in semiconductor research

Thu, 3 Mar 2014
The Semiconductor Industry Association this week presented its University Research Award – in consultation with Semiconductor Research Corporation (SRC) – to University of Minnesota professor Sachin Sapatnekar in recognition of his outstanding contributions to semiconductor research.

Samsung expands its 28nm technology offerings

Thu, 3 Mar 2014
Samsung Electronics, Co., Ltd. today announced that it has expanded its 28nm technology offerings with the addition of RF capabilities.

Fab equipment spending to increase 20-30% in 2014

Thu, 3 Mar 2014
The release today of the SEMI World Fab Forecast update reveals a 20 to 30 percent projected increase in semiconductor fab equipment spending in 2014.

Micron appoints Darren Thomas as VP of Storage Business Unit

Thu, 3 Mar 2014
Micron Technology, Inc. this week announced that Darren Thomas has been named as vice president of Micron's Storage business unit.

Weaker yen impact on the 2013 material and equipment market size

Thu, 3 Mar 2014
Semiconductor industry revenues reported by the World Semiconductor Trade Statistics (WSTS) reached a record high in 2013 with global revenues totaling over $305 million.

Semtech Corporation announces the appointment of new Executive VP

Fri, 3 Mar 2014
Semtech Corporation, a supplier of analog and mixed-signal semiconductors, today announced the appointment of Charles B. Ammann as Executive Vice President, General Counsel and Corporate Secretary.

MACOM introduces new addition to GaN in Plastic series

Fri, 3 Mar 2014
M/A-COM Technology Solutions Inc. (MACOM), a supplier of high performance RF, microwave, and millimeter wave products, introduced today its newest addition to the GaN in Plastic series.

Promising news for solar fuels from Berkeley Lab researchers at JCAP

Fri, 3 Mar 2014
A JCAP study shows that nearly 90-percent of the electrons generated by a semiconductor/cobaloxime hybrid catalyst designed to store solar energy in hydrogen are being stored in their intended target molecules.

DSA, EUV, nanopatterning are top themes at SPIE Advanced Lithography

Mon, 3 Mar 2014
Progress through collaborative efforts in directed self-assembly (DSA), the state of the art in nanoimprint technology, 3D approaches to scaling, and the latest on extreme ultraviolet (EUV) lithography research were hot topics at the recent SPIE Advanced Lithography symposium in San Jose.

Cadence PVS certified for GlobalFoundries' 65nm to 14nm processes

Tue, 3 Mar 2014
Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES certified the Cadence Physical Verification System (PVS) for custom/analog, digital and mixed-signal design physical signoff for 65nm to 14nm FinFET process technologies.

Leti demonstrates ultra-scaled self-aligned split-gate memory cell with 16nm gate length

Tue, 3 Mar 2014
CEA-Leti announced today it has fabricated ultra-scaled split-gate memories with gate length of 16nm, and demonstrated their functionality, showing good writing and erasing performances with memory windows over 6V.

Bending light with a tiny chip

Tue, 3 Mar 2014
The Caltech chip eliminates the need for bulky and expensive lenses and bulbs and instead uses a so-called integrated optical phased array (OPA) to project the image electronically with only a single laser diode as light source and no mechanically moving parts.

STATS ChipPAC introduces breakthrough manufacturing method for wafer level packaging

Wed, 3 Mar 2014
STATS ChipPAC, a provider of advanced semiconductor packaging and test services, has designed and implemented an innovative new manufacturing method that is a significant paradigm shift from conventional wafer level manufacturing.

SEMI reports 2013 global semiconductor equipment sales of $31.6 billion

Wed, 3 Mar 2014
SEMI, the global industry association for companies that supply manufacturing technology and materials to the world’s chip makers, today reported that worldwide sales of semiconductor manufacturing equipment totaled $31.58 billion in 2013.

EV Group boosts 2.5D and 3D IC/TSV performance with new NanoSpray application

Wed, 3 Mar 2014
EV Group today announced that its patented NanoSpray conformal coating technology is now available on its newly introduced EVG150XT resist coating and developing system for high-volume manufacturing (HVM) semiconductor applications.

Advancing the Russian microelectronics industry — SEMICON Russia 2014

Wed, 3 Mar 2014
On May 13-15, the key industry players, science institutes and innovation business representatives will gather in Moscow at SEMICON Russia — the premier Russian semiconductor exhibition and conference.

Fab productivity and process technologies addressed at upcoming semiconductor manufacturing conference

Wed, 3 Mar 2014
The 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) will be held May 19-21 in Saratoga Springs, New York.

Imec achieves record 8.4 percent conversion efficiency in fullerene-free organic solar cell

Wed, 3 Mar 2014
In this week’s Nature Communications, imec presents the development of fullerene-free organic photovoltaic (OPV) multilayer stacks achieving a record conversion efficiency of 8.4 percent.

SanDisk files lawsuit against SK Hynix for theft of trade secrets

Thu, 3 Mar 2014
These actions relate to the theft of trade secrets related to NAND flash technology by a former engineer of SanDisk who left the company in 2008 to work for SK Hynix.

Silicon Innovation Forum to expand in 2014

Thu, 3 Mar 2014
Coordinated by SEMI, the Silicon Innovation Forum is organized by leading strategic investment groups in the global semiconductor industry including: Applied Ventures, Dow Ventures, Intel Capital, Micron Ventures, TEL Venture Capital, BASF Ventures, and Samsung Ventures.

Toshiba brings civil suit against SK Hynix

Fri, 3 Mar 2014
Toshiba Corporation announced that it has brought a civil suit against Korea’s SK Hynix Inc. at the Tokyo District Court, under Japan’s Unfair Competition Prevention Act.

Surface characteristics influence cellular growth on semiconductor material

Fri, 3 Mar 2014
Changing the texture and surface characteristics of a semiconductor material at the nanoscale can influence the way that neural cells grow on the material.

Creating a graphene-metal sandwich to improve electronics

Fri, 3 Mar 2014
Researchers have discovered that creating a graphene-copper-graphene “sandwich” strongly enhances the heat conducting properties of copper, a discovery that could further help in the downscaling of electronics.

Mega Fluid Systems and Entrepix join forces to offer complete CMP system

Mon, 3 Mar 2014
Mega Fluid Systems Inc., a supplier of chemical and slurry delivery equipment, and Entrepix Inc., a provider of chemical mechanical polishing (CMP) equipment and process services, today announced a partnership agreement.

GaN Systems appoints Jim Witham as CEO

Mon, 3 Mar 2014
GaN Systems, a developer of gallium nitride power switching semiconductors, today announced the appointment of Jim Witham as CEO of the corporation.

EV Group establishes China headquarters in Shanghai

Tue, 3 Mar 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has opened a new, wholly owned subsidiary in Shanghai, called EV Group China Ltd.

MKS to acquire Granville-Phillips division of Brooks Automation

Tue, 3 Mar 2014
MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, today announced it has agreed to purchase the assets of Granville-Phillips, a division of Brooks Automation, Inc., for $87 million in cash.

First methodology to analyze nanometer line pattern images

Tue, 3 Mar 2014
To meet the increasing demand for smaller, faster, and more powerful devices, a continued decrease in the dimensions of active parts of devices is required. The new methodology is a unique tool developed to address the gap existent in the metrology of sub-10nm line patterns.

SRC, UC Berkeley research promises to revolutionize electronic circuit design

Wed, 3 Mar 2014
Research from University of California, Berkeley scientists sponsored by Semiconductor Research Corporation (SRC) promises to revolutionize portable radio frequency (RF) electronics and communication systems via advancements in on-chip inductors by leveraging embedded nanomagnets.

SMIC CEO is awarded SEMI Outstanding EHS Achievement Award

Wed, 3 Mar 2014
Dr. Tzu-Yin Chiu, Chief Executive Officer & Executive Director of SMIC presented the SEMICON China 2014 opening keynote yesterday and was given a SEMI Outstanding EHS Achievement Award.

MediaTek to deploy Synopsys IC Compiler for hierarchical design implementation

Wed, 3 Mar 2014
Synopsys, Inc. today announced that MediaTek Inc., a fabless semiconductor company for wireless communications and digital multimedia solutions, has initiated deployment of Synopsys' IC Compiler place and route solution for hierarchical design implementation.

Applied Materials honored as a 2014 World's Most Ethical Company

Thu, 3 Mar 2014
Applied Materials, Inc. today announced that it was named a 2014 World's Most Ethical Company by the Ethisphere Institute, an independent center of research promoting best practices in corporate ethics and governance.

Equipment bookings and billings continue along a steady trend

Thu, 3 Mar 2014
North America-based manufacturers of semiconductor equipment posted $1.29 billion in orders worldwide in February 2014 (three-month average basis) and a book-to-bill ratio of 1.00.

Enabling mobility for IoT with advanced semiconductor technology - at SEMICON Singapore 2014

Thu, 3 Mar 2014
SEMICON Singapore will focus on the advanced technology developments to enable mobility for the Internet of Things (IoT).

ChaoLogix introduces ChaoSecure technology to boost semiconductor chip security

Thu, 3 Mar 2014
ChaoLogix, Inc., a semiconductor technology provider focused on developing embedded security and low-power design intellectual property, today introduced ChaoSecure technology that deters side channel attacks on semiconductor chips and contributes a superior layer of security compared to existing solutions.

Mentor Graphics acquires Berkeley Design Automation

Fri, 3 Mar 2014
Mentor Graphics Corp. today announced that it has acquired Berkeley Design Automation, Inc. BDA addresses nanometer circuit design challenges via its Analog FastSPICE unified verification platform and exceptional vertical-application expertise.

Discovery of new semiconductor holds promise for 2D physics and electronics

Fri, 3 Mar 2014
From super-lubricants, to solar cells, to the fledgling technology of valleytronics, there is much to be excited about with the discovery of a unique new two-dimensional semiconductor, rhenium disulfide, by researchers at Berkeley Lab’s Molecular Foundry.

Altera and Intel extend manufacturing partnership to include development of multi-die devices

Wed, 3 Mar 2014
Collaboration will optimize integration of 14nm Tri-Gate Stratix 10 FPGAs with heterogeneous technologies into a single system-in-a-package.

eInfochips opens new design services specializing in 16nm geometry

Wed, 3 Mar 2014
eInfochips, a semiconductor and product engineering company, today launched design services for chips based on 16nm geometry.

Particle Measuring Systems joins SEMATECH

Wed, 3 Mar 2014
This collaboration will address many of the profound changes taking place in the semiconductor industry that are impacting fundamental aspects of process and equipment design, including integration of new materials and process technology for sub-20nm node manufacturing, next-generation lithography requirements.

Nanolab Technologies expands services with new analytical and surface measurement tools

Wed, 3 Mar 2014
Nanolab Technologies, a Silicon Valley-based analytical services lab, has purchased and installed new tools and moved to a seven-day workweek.

Silicon Valley specialty foundry Noel Technologies names Joe Medeiros Director of Reclaim

Thu, 3 Mar 2014
Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, has added semiconductor industry veteran Joe Medeiros to its growing management staff.

Heat-conducting polymer cools hot electronic devices at 200 degrees C

Mon, 3 Mar 2014
Polymer materials are usually thermal insulators. But by harnessing an electropolymerization process to produce aligned arrays of polymer nanofibers, researchers have developed a thermal interface material able to conduct heat 20 times better than the original polymer. The modified material can reliably operate at temperatures of up to 200 degrees Celsius.

SEMATECH announces leadership changes

Mon, 3 Mar 2014
SEMATECH, the global consortium of semiconductor manufacturers, announced today that Ronald Goldblatt, vice president of Technical Strategy and Operations, has been appointed by the board of directors as acting president and chief executive officer, effective immediately.

University of Washington selects Altatech’s CVD system to develop new process materials

Mon, 3 Mar 2014
Altatech, a subsidiary of Soitec, has received an order from the University of Washington in Seattle for an AltaCVD chemical vapor deposition (CVD) system whose unique combination of capabilities allows users to develop new process materials with high added value.

Researchers improve performance of III-V nanowire solar cells on graphene

Tue, 4 Apr 2014
Researchers at the University of Illinois at Urbana-Champaign have achieved new levels of performance for seed-free and substrate-free arrays of nanowires from class of materials called III-V (three-five) directly on graphene

Fabricating nanostructures with silk could make clean rooms green rooms

Tue, 4 Apr 2014
Tufts University engineers have demonstrated that it is possible to generate nanostructures from silk in an environmentally friendly process that uses water as a developing agent and standard fabrication techniques.

MACOM announces IP licensing program for GaN-on-Si technology

Tue, 4 Apr 2014
M/A-COM Technology Solutions Inc. this week announced an IP licensing program for Gallium Nitride (GaN) on Silicon technology.

Quantum Polymers announces 8 inch diameter carbon and glass filled PEEK rod products

Tue, 4 Apr 2014
These products work well for applications requiring a balance of chemical resistance and mechanical strength in high temperature environments like those frequently found in the oil and gas, chemical processing, and semiconductor industries.

ON Semiconductor to acquire Trusense Imaging, Inc.

Thu, 4 Apr 2014
ON Semiconductor today signed a definitive agreement to acquire Truesense Imaging, Inc., a provider of high-performance image sensor devices addressing a wide range of industrial end-markets including machine vision, surveillance, traffic monitoring, medical and scientific imaging, and photography.

Park Systems introduces automatic defect review for semiconductor wafers

Thu, 4 Apr 2014
Park Systems this week introduced the Automatic Defect Review (ADR)AFM for 300mm bare wafers, a fully automated AFM solution that improves throughput of AFM defect review by up to 1,000 percent.

The sustainable manufacturing imperative

Thu, 4 Apr 2014
While sometimes seen as a social, legal and regulatory obligation, sustainability is increasingly considered a differentiating factor in global competitiveness relative to the technologies and products being provided.

2013: A year in review

Fri, 4 Apr 2014
2013 was a record year in terms of semiconductor device revenues; the industry finally exceeded the long elusive $300 billion mark, registering almost 5 percent growth according to the SIA.

SEMI reports 2013 global semiconductor materials sales of $43.5B USD

Mon, 4 Apr 2014
The global semiconductor materials market decreased 3 percent in 2013 compared to 2012 while worldwide semiconductor revenues increased 5 percent.

Global Semiconductor Alliance celebrates 20 years of industry collaboration

Tue, 4 Apr 2014
The Global Semiconductor Alliance (GSA) is celebrating 20 years of industry collaboration this year.

February semiconductor sales up 11.4 percent compared to last year

Wed, 4 Apr 2014
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $25.87 billion for the month of February 2014, an increase of 11.4 percent from February 2013 when sales were $23.23 billion.

SEMI releases fourth quarter 2013 worldwide photovoltaic equipent market statistics report

Wed, 4 Apr 2014
Billings and bookings show improvement in the fourth quarter.

SEMI announces Innovation Village at SEMICON Europa 2014

Wed, 4 Apr 2014
After the successful premier of a program to connect early-stage companies with strategic investors and venture capitalists (VCs) in the U.S., SEMI is expanding the program to Europe as part of SEMICON Europa 2014 in Grenoble, France (October 7-9).

Sunlight generates hydrogen in new porous silicon

Thu, 4 Apr 2014
Porous silicon manufactured in a bottom up procedure using solar energy can be used to generate hydrogen from water, according to a team of Penn State mechanical engineers, who also see applications for batteries, biosensors and optical electronics as outlets for this new material.

Scalable CVD process for making 2-D molybdenum diselenide

Thu, 4 Apr 2014
Nanoengineering researchers at Rice University and Nanyang Technological University in Singapore have unveiled a potentially scalable method for making one-atom-thick layers of molybdenum diselenide — a highly sought semiconductor that is similar to graphene but has better properties for making certain electronic devices like switchable transistors and light-emitting diodes.

Domain walls in nanowires cleverly set in motion

Thu, 4 Apr 2014
Important prerequisite for the development of nano-components for data storage and sensor technology.

Catching the (invisible) wave

Fri, 4 Apr 2014
UC Santa Barbara researchers create a unique semiconductor that manipulates light in the invisible infrared/terahertz range, paving the way for new and enhanced applications.

KLA-Tencor Corporation receives Intel’s Preferred Quality Supplier Award

Fri, 4 Apr 2014
KLA-Tencor Corporation has been recognized as one of 18 companies receiving Intel Corporation’s Preferred Quality Supplier (PQS) award for their performance in 2013.

SEMI reports 2013 semiconductor photomask sales of $3.1B

Mon, 4 Apr 2014
SEMI reports that the worldwide semiconductor photomask market was $3.1 billion in 2013 and is forecasted to reach $3.3 billion in 2015.

Shiny quantum dots brighten the future of solar cells

Mon, 4 Apr 2014
A house window that doubles as a solar panel could be on the horizon, thanks to recent quantum-dot work by Los Alamos National Laboratory researchers in collaboration with scientists from University of Milano-Bicocca (UNIMIB), Italy.

Mentor Graphics design and verification tools certified for TSMC 16nm FinFET production

Tue, 4 Apr 2014
Mentor Graphics Corp. today announced that its IC design to silicon solution has achieved certification for TSMC's Design Rule Manual (DRM) and SPICE model version 1.0 for its 16nm FinFET process.

SMIC appoints Hiroshi Ogawa as General Manager of SMIC Japan

Tue, 4 Apr 2014
Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, announced today that Hiroshi Ogawa was appointed as General Manager of SMIC Japan Corporation.

Deca Technologies ships 100-millionth wafer-level packaged component

Wed, 4 Apr 2014
Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth component.