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MHI room-temp wafer bonder line grows with 300mm tool

Mon, 1 Jan 2012

Mitsubishi Heavy Industries launched a fully automated 12" (300mm) wafer bonding tool, Bond Meister MWB-12-ST, capable of producing 3D LSI circuits at room temperature. The 300mm bonder targets production of memory chips and MPUs.


UltraFlat wafer-level semiconductor test process creates permanent PCB flatness

Mon, 1 Jan 2012

Multitest qualified its UltraFlat process for high parallel vertical probe card tests. UltraFlat provides permanent overall PCB flatness for better wafer-level test.


Hesse & Knipps heavy wire bonder handles power semis

Fri, 1 Jan 2012

Hesse & Knipps Inc. introduced its next-generation BONDJET BJ93X heavy wire bonder for back-end semiconductor assembly, targeting manufacturers of power semiconductors and automotive electronics.


PTI buys NEXX deposition tool for RDL and Cu pillar fab

Tue, 1 Jan 2012

NEXX Systems sold a 300mm Stratus electrochemical deposition (ECD) system to Powertech Technology for copper pillar bumps and re-distribution layers (RDL) fab, and possibly to make TSVs.


3D and 2.5D semiconductor packaging technologies @ The ConFab

Wed, 6 Jun 2012

As packaging has played a larger and larger role in chip performance, form factor, and capabilities, The ConFab has increased its focus on back-end processes. Cue

New Japan Radio implements Cu wire bonding for power semiconductors

Wed, 5 May 2012

New Japan Radio Co. Ltd. adopted Tanaka Denshi Kogyo KK

IC package revenues outgrow unit shipments through 2016

Tue, 5 May 2012

Increased demand for product functionality is driving up IC packaging revenue faster -- a 9.8% compound annual growth rate (CAGR) -- than IC unit growth -- 7.3% CAGR 2010-2016, says New Venture Research (NVR).


Kulicke & Soffa expands Singapore HQ, bolsters bonder tool R&D and manufacturing

Wed, 5 May 2012

Kulicke & Soffa broke ground on its Singapore global headquarters expansion, near the current leased headquarters location. A state-of-the-art facility in Serangoon will bolster the company

"3.5D interposer technology could someday replace PCBs" -- TSMC's Doug Yu

Tue, 5 May 2012

TSMC

Heraeus Al-clad Cu bonding wire avoids metallization changes in power semiconductors

Mon, 5 May 2012

Heraeus introduced its high-reliability composite aluminum/copper (CucorAl) semiconductor bonding wire, which offers strong mechanical and electrical bonds to semiconductor pads, with good thermal properties.


Hesse & Knipps opens wedge bonder demo lab on West Coast

Wed, 2 Feb 2012

Backend packaging equipment supplier Hesse & Knipps Inc. opened a West Coast Demo and Applications Laboratory at its manufacturer rep Chalman Technologies.


LEDs, power semiconductors packaged with high-thermal-conductivity die attach adhesives

Wed, 2 Feb 2012

Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for LEDs and small power semiconductor die packaging.


Rudolph sells metrology tool for back-end wafer packaging processes

Mon, 2 Feb 2012

Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.


3M debuts high-capacitance ECM for IC packaging, RF, other apps

Thu, 2 Feb 2012

3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI).


Tanaka establishes copper bonding wire production in Taiwan

Tue, 1 Jan 2012

Tanaka Denshi Kogyo K.K., of Tanaka Precious Metals, will establish a production subsidiary for manufacturing copper bonding wire in Taiwan, with manufacturing ramp on February 1.


3D MID sensor fabricated with Ticona laser-activated LCP circuits

Wed, 1 Jan 2012

2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic circuits. The Vectra E840i forms circuits on 3D injection moldings produced with an LDS process.


Sony stacks CMOS image sensor pixel structures and chips

Mon, 1 Jan 2012

Sony has developed a backside-illuminated CMOS image sensor that layers the pixel section with back-illuminated structures over the chips containing signal processing circuits, instead of using supporting substrates.


Will the $2 interposer be silicon or glass?

Tue, 11 Nov 2012

Dr. Phil Garrou reports from the 2nd annual Georgia Tech 2.5D Interposer Conference: what's the market projection for silicon and glass interposers, what's preventing high-volume manufacturing, and is there a crossover with flat-panel display glass manufacturing?


Altera taps Amkor for molded flip chip packaging of FPGA family

Wed, 3 Mar 2012

Altera Corporation will use an exposed-die molded flip chip technology from Amkor on its 28nm Arria V FPGA. Amkor

AMEC debuts TSV etch tool with Chinese installations

Wed, 3 Mar 2012

Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.


Interposer supply/ecosystem examined at IMAPS Device Packaging

Mon, 3 Mar 2012

Dr. Phil Garrou, a contributing editor and regular blogger on Solid State Technology, shares the highlights of an Evolving 2.5D/3D Infrastructure panel he hosted at IMAPS Device Packaging. On the table: where TSVs and interposers are made, a TSV/interposer timeline and cost analysis, and the requirements of mobile electronics.


AMAT, Singapore's microelectronics institute open 3D semiconductor packaging R&D lab

Wed, 3 Mar 2012

Applied Materials Inc. (AMAT) opened the new Centre of Excellence in Advanced Packaging at Singapore

STATS ChipPAC brings FOWLP to stacked packages for <1mm profile

Tue, 3 Mar 2012

STATS ChipPAC Ltd. (SGX-ST:STATSChP) uncrated its next-generation eWLB package-on-package (PoP) technology, with a package profile height below 1.0mm.


WACKER opens silicone R&D center for Korean electronics makers

Fri, 3 Mar 2012

WACKER expanded and relocated its South Korea technical laboratories and offices, bringing together R&D operations, applications technology, and basic and advanced training in silicones and polymers applications.


ICECool puts 3D thermal issues back in focus

Mon, 10 Oct 2012

With the approach of full commercial production of 3DIC products, Dr. Phil Garrou shifts his attention to thermal performance questions and proposed thermal solutions for the future.


Why SATS consolidation needs to happen

Fri, 10 Oct 2012

The advent of leading-edge semiconductor packaging technologies dictates efficient use of capital, and only the top-tier semiconductor assembly and test services (SATS) companies will have the financial wherewithal to develop required expertise and capacity, says one analyst.


SPTS unveils low-temp PECVD cluster tool for 3D ICs

Wed, 9 Sep 2012

SPTS' Delta fxP cluster system achieves low-temperature deposition of TEOS oxides and nitrides for via-reveal passivation in 3D IC packaging, solving two key problems of low temperatures and bonding adhesive outgassing.


EVG updates modular coater/developer with OmniSpray, NanoSpray coating options

Mon, 9 Sep 2012

EV Group's updated modular EVG150 high-volume coater/developer adds new modules for conformal coating of high topography surfaces, and coating surfaces with vertical sidewall angles, such as through-silicon vias (TSV).


FormFactor to acquire Microprobe, creates top probe card supplier

Tue, 9 Sep 2012

Wafer probe card maker FormFactor has agreed to acquire fellow probe card supplier MicroProbe, with a combined entity rivaling top-seller Micronics in the high-growth probe card market.


Honeywell taps Tezzaron Semiconductor to stack rad-hard die

Fri, 12 Dec 2011

Honeywell Microelectronics will use Tezzaron's 3D stacking on Honeywell

Advanced package technologies' growth through 2015

Tue, 12 Dec 2011

Small, mobile, Internet-connected devices are bucking the slow economy and use advanced packaging technologies to pack an enormous amount of functionality into a very small form factor, notes New Venture Research, which provides forecasts for each advanced packaging device type.


Fan-in WLCSP outpaces semiconductor packaging market

Thu, 12 Dec 2011

Yole identifies the fan-in wafer-level chipscale packaging (WLCSP) market for strong growth, and a diverse base of chip technologies. Fan-in WLCSP reached 2.3 million 300mm-equivalent wafers shipped in 2011, or about $1.7 billion in revenue.


High-temp area-array package test sockets suit military, geophysical apps

Tue, 12 Dec 2011

Aries Electronics debuted AR4HT Series chipscale package (CSP) test sockets that accept any area-array device for testing up to 200

Assembleon adds wafer handling to its flip-chip bonder

Mon, 8 Aug 2012

Assembl

Flooding in the Philippines threatens microelectronics facilities

Thu, 8 Aug 2012

Heavy monsoons moving through the Philippines are causing floods in and around Manila, the capital. The Philippines is a small but growing area for microelectronics manufacturing and packaging facilities.


Henkel underfill reduces warpage for thinner flip chip packages

Wed, 8 Aug 2012

Henkel Electronic Materials developed a new underfill system designed to reduce flip chip package stress by controlling die and substrate warpage, LOCTITE ECCOBOND UF 8840.


Agilent

Tue, 8 Aug 2012

Agilent debuted its compliance test application, Agilent N6462A DDR4, for systems using DDR4 memory.


Cascade Microtech modular wafer probe system offers 6 measurement packages

Tue, 7 Jul 2012

Cascade Microtech introduced the modular MPS150 manual wafer probe station with six application-specific test packages for RF, mmW, and I-V/C-V measurement; failure analysis; and high-power device characterization.


Henkel Electronic Materials pre-cuts die attach film for 150mm, 200mm wafers

Mon, 7 Jul 2012

Henkel Electronic Materials added LOCTITE ABLESTIK CDF 200P to its conductive die attach film offering. The pre-cut film is available in 150mm and 200mm diameter sizes for easy wafer-form matching. The film is both a dicing tape and die attach tape.


Nanya implements 3D IC TSV technology for DDR3, future DDR4 devices

Fri, 7 Jul 2012

Dr. Phil Garrou, contributing editor, shares Nanya Technology

3D TSV packages outgrow semiconductor industry by 10X

Thu, 7 Jul 2012

3D TSV chips will represent 9% of the total semiconductors value in 2017, according to Yole D

STATS ChipPAC rewards top suppliers of 2011

Wed, 7 Jul 2012

STATS ChipPAC presented its annual Supplier Awards to its top supplier partners for their excellent performance and outstanding support in 2011. Supplies are scored on technology, quality, delivery, responsiveness, service, and cost competiveness criteria.


Notes from SEMICON West: Detecting solder joint fractures

Mon, 7 Jul 2012

Jennifer Wrigley and Robert Bellinger, Olympus, share insights on SEMICON West

EVG temporary wafer bonding platform doubles throughput for 3D packaging

Wed, 7 Jul 2012

EVG introduced the EVG 850TB/DB automated temporary bonding and debonding system built on the company's new XT Frame platform, which has been optimized to support thin-wafer processing for high-volume 3D IC and TSV manufacturing.


Epson launches high-throughput IC test handler for volume test

Mon, 7 Jul 2012

Seiko Epson launched the NX1032XS pick-and-place IC test handler, boasting high throughput for transferring, inspecting, and sorting semiconductors.


3D and 2.5D Integration: A Status Report preview with TechSearch International

Tue, 6 Jun 2012

Solid State Technology is hosting 3D and 2.5D Integration: A Status Report, sponsored by EVG and ALLVIA, and is free for all attendees. This preview shares a sneak peek at

New speaker added for 3D and 2.5D Integration webcast

Mon, 6 Jun 2012

Solid State Technology will present 3D and 2.5D Integration: A Status Report on June 27, free for all attendees. William Chen, ASE, will join speakers David McCann, GLOBALFOUNDRIES and E. Jan Vardaman, TechSearch International.


Fast-curing conductive chip-attach adhesive meets RFID packaging needs

Wed, 6 Jun 2012

DELO introduced the DELOMONOPOX AD268 epoxy resin to meet the low-cost, reliable-attach needs of RFID device makers. The anisotropic, electrically conductive adhesive provides fast cure at chip attach, and is designed for flip-chip RFID packaging, as well as other packaging applications.


Wafer-level RF testing bottleneck resolved with Advantest, Hua Hong NEC methodology

Wed, 6 Jun 2012

Pure-play foundry Shanghai Hua Hong NEC and test equipment supplier Advantest co-developed a wafer-level, multi-site parallel test scheme for RFID semiconductor devices that meets industry-standard ISO 14443 guidelines.


DARPA seeks microfluidic thermal management for 3D ICs

Mon, 6 Jun 2012

DARPA

ECTC

Fri, 6 Jun 2012

Attendance was high at this year's Electronic Component Technology Conference (ECTC) in San Diego. Sandra Winkler is senior industry analyst at New Venture Research and IEEE/CPMT Luncheon Program Chair, shares the key trends in ECTC's sessions, like WLP, 2.5D, LED packaging, and more.


StratEdge improves thermal management in power semiconductors with LL packages

Wed, 6 Jun 2012

The LL leaded laminate copper-moly-copper base packages dissipates heat from high-power compound semiconductor devices, such as gallium nitride, gallium arsenide, and silicon carbide chips.


ASMPT integrates European business with SIPLACE organization

Mon, 5 May 2012

Asia-based ASM Pacific Technology (ASMPT) Group, a supplier of semiconductor assembly, bonding, and packaging equipment, will integrate with the SIPLACE organization in Europe.


Burn-in and test system offers device-by-device temperature control

Mon, 4 Apr 2012

Micro Control Company uncrated the HPB-5C High-Power Burn-In System, with variable airflow control for active thermal control of each device under test. The HPB-5C provides individual temperature control to each device under test.


SUSS buys Tamarack for lithography, laser structuring lines

Fri, 3 Mar 2012

SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.


TI adds bare die to small-quantity semiconductor packaging options

Tue, 3 Mar 2012

Texas Instruments Incorporated (TI, TXN) now offers bare die in quantities as low as 10 pieces for initial prototyping, and larger quantities (full waffle trays) for production volumes.


Semiconductors see some softness in Q1 2012

Tue, 4 Apr 2012

Semiconductor lead times decreased at the end of February 2012, reports analyst firm Gartner Inc. Although Gartner still expects the semiconductor industry to grow in 2012, Q1 showed some signs of softness.


Semiconductor sales flat through February 2012

Tue, 4 Apr 2012

The Semiconductor Industry Association (SIA) measured worldwide semiconductor sales at $22.9 billion in February 2012, down 1.3% from January’s $23.2 billion and 7.3% from February 2011.


Kyocera Display Corporation adds touchscreen tech, back-end modularization, more with Optrex buy

Mon, 4 Apr 2012

Kyocera Corporation will expand its LCD offering with the acquisition of LCD manufacturer Optrex Corporation, forming Kyocera Display Corporation.


Top 10 semiconductor foundries in 2011

Fri, 3 Mar 2012

The worldwide semiconductor foundry market totaled $29.8 billion in 2011, a 5.1% increase from 2010, according to Gartner. Given aggressive foundry spending in 2010 and 2011, oversupply was "inevitable," Gartner says.


LED manufacturing tool orders to dip in 2012 between LED demand waves

Thu, 3 Mar 2012

LED revenues are slowing down in 2012, after two years of remarkable growth, according to Strategy Analytics. LED fab equipment spending and epitaxial substrate demand in the LED sector will decline in 2012.


Touchscreen controller IC market tripling thanks to mobile devices

Wed, 3 Mar 2012

Shipments of touch screen displays in devices like smartphones and media tablets are booming, causing the market for touch controller integrated circuits (ICs) to almost triple in size during a five year span.


Glass-coated bonding wire targets copper, small diameter market

Tue, 3 Mar 2012

RED Micro Wire (RWM), a subsidiary of RED Equipment, announced a new high-quality copper wire featuring glass insulation for use in semiconductor wire bonding.


Applied Materials analyst day preview

Mon, 3 Mar 2012

Applied Materials will host its annual Analyst meeting this week (March 28). Barclays Capital shares its expectations for AMAT's update and the wafer fab equipment (WFE) outlook in general.


Top 10 LED manufacturers in 2011, and shifting regional dominance

Wed, 2 Feb 2012

The global HB-LED market grew from $11.3 billion in 2010 to $12.5 billion in 2011, surging 9.8%, according to Strategies Unlimited. 10 companies accounted for more than 68% of the global LED supply.


Strategies in Light: Day 1, LED Lighting Report, New Start-ups

Wed, 2 Feb 2012

The 2012 Strategies in Light conference kicked off today at the Santa Clara Convention Center with a series of five workshops, two tutorials and one all-day investor forum.


EVG LED mask aligner offers COO improvement in gen-2

Tue, 2 Feb 2012

EVG uncrated the EVG620HBL Gen II fully automated mask alignment system for volume LED manufacturing. The second generation tool offers 55% higher wafer output per square meter of cleanroom space occupied, EVG reports.


SemiLEDs, LG Siltron, Epistar install Veeco MOCVD tools

Tue, 2 Feb 2012

Veeco Instruments (Nasdaq:VECO) reported 3 wins for its TurboDisc K465i GaN MOCVD tool : the same systems will be used for high-volume LED fab, GaN-on-Si research, and Si-based LED development.


LED lighting increases power electronics complexity, drives new power supply market

Fri, 2 Feb 2012

"Opportunities for Power Components in LED Lighting" from IMS Research reveals that rapid uptake of LED lighting, driven by legislation and rising costs of electricity, will result in a potential market of 4 billion power supply units by 2016, worth $10 billion.


Tackling EUV lithography shadow distortions with OPC

Thu, 2 Feb 2012

James Word and Christian Zunia, Mentor Graphics, explore the current capabilities of model-based OPC software to model and correct for the shadowing distortions unique to extreme ultra-violet lithography (EUVL).


Silicon Genesis wafering tool designed for solar, LED, packaging sectors

Mon, 3 Mar 2012

SiGen developed its second-generation production system for fabricating thin-silicon solar wafers, as well as HB-LED, and 3D semiconductor packaging wafers. The system tailored for silicon, GaAs, germanium, SiC, GaN and sapphire materials.


Silicon germanium grown monolithically to avoid crystal defects

Fri, 3 Mar 2012

European researchers have manufactured defect-free structures of different semiconductors on silicon wafers, using semiconductor manufacturing processes.


AIXTRON opens MOCVD training center in China

Fri, 3 Mar 2012

AIXTRON's training and demonstration center in Suzhou, China, will focus on improving MOCVD in advanced semiconductor and LED manufacturing operations around China, as well as on employee and environmental safety in electronics production environments.


Samsung, IBM and GlobalFoundries look to the future: A report from the Common Platform Technology Forum

Thu, 3 Mar 2012

Execs from Samsung, IBM, GlobalFoundries and ARM looked to the future at The Common Technology Platform Forum in Santa Clara. They focused on the innovation pipeline for 20nm and 14nm technology nodes, and the role that EUV, FinFETs, TSVs, CNTs and DSA will play.


SAFC Hitech expands LED precursor production in Taiwan

Thu, 3 Mar 2012

SAFC Hitech opened a multi-million dollar 270000sq.ft. expansion at its facility in Kaohsiung, Taiwan, increasing capacity for high-quality LED precursor production.


Silicon wafers sliced to 10% conventional bulk with Hyperion 3

Wed, 3 Mar 2012

Twin Creeks Technologies, semiconductor and solar cell manufacturing equipment supplier, debuted its first commercial silicon wafer production system that reduces solar module and semiconductor device wafers by up to 90%.


2012 semiconductor spending forecast nearly doubled at Gartner

Tue, 3 Mar 2012

Worldwide semiconductor revenue is projected to total $316 billion in 2012, a 4% increase from 2011, according to Gartner Inc. This outlook is up from Gartner's previous forecast, made in Q4 2011, for 2.2% growth.


Commercialization of stretchable electronics: The mc10 example

Tue, 4 Apr 2012

Commercialization of stretchable electronics: The mc10 example

Tue, 4 Apr 2012

Conference Report: MRS Spring 2012, Day 1

Tue, 4 Apr 2012

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco, describing recent work with graphene, organic electrochemical transistors, pentacene organic TFTs, and functional inks made of CNTs and other nanomaterials.


Optical display films undergo cyclical changes

Mon, 4 Apr 2012

Optical display film revenues are declining in 2012, after a compound annual growth rate of 19% from 2009 to 2011, according to NPD DisplaySearch Q1’12 Quarterly Display Optical Film Report.


Atmel touchscreen sensor offers ITO alternative for new displays

Mon, 4 Apr 2012

Atmel touchscreen sensor offers ITO alternative for new displays

Mon, 4 Apr 2012

Tanaka Precious Metals platinum electrode enables ozone-based semiconductor cleaning

Mon, 4 Apr 2012

Tanaka Kikinzoku Kogyo K.K. developed a platinum electrode that produces ozone solution at 40x the efficiency of existing technology.


OLED adhesive cures at low temperatures to rubber-like consistency

Thu, 4 Apr 2012

Engineered Conductive Materials LLC uncrated a low-temperature curing conductive adhesive, DB-1541-LTC, for OLED assembly.


SABIC LED resins offer improved color under heat exposure

Wed, 4 Apr 2012

SABIC’s Innovative Plastics business released 3 Lexan LUX resin grades for LED applications such as light guides and lenses. They are transparent and use a new formulation to improve initial color, color stability, and light transmission during heat aging.


Oxide TFT comes to the fore with FPD growth

Wed, 4 Apr 2012

The FPD market's growth is pushing next-generation display technologies forward, as profitability worsens for a-Si TFTs. New core technologies are needed to improve the performance of TFTs, such as oxide TFTs.


AMOLED TV manufacturing status, price trends

Tue, 1 Jan 2012

AMOLED TVs drew a crowd at CES, but manufacturing challenges and expensive fab materials will limit global shipments of the sets for several years, says IHS iSuppli. IHS compares the 55" AMOLED TVs from LG Display and Samsung, each using different manufacturing technologies.


Tanaka's ruthenium precursor enables 20nm DRAM semiconductors

Mon, 1 Jan 2012

Tanaka Kikinzoku Kogyo K.K. developed a ruthenium material able to form a film up to 6x the normal depth for capacitor electrodes used in DRAM, working with Professor Seiji Ogo of Kyushu University.


AIXTRON sells SiC CVD tool to United Silicon Carbide

Fri, 1 Jan 2012

USCi will develop next-generation silicon carbide (SiC) devices with AIXTRON SE's VP2400 hot-wall CVD tool. USCi plans to install the CVD system in Q3 2012.


KLA-Tencor uncrates metrology line-up for leading-edge semiconductor wafers

Fri, 1 Jan 2012

KLA-Tencor Corporation launched 3 semiconductor wafer defect inspection systems: the 2900, Puma 9650, and eS800 series. The suite is tailored to detect defects arising from new materials, device structures, and design rules.


imec launches flexible OLED display manufacturing research with Holst Centre

Thu, 1 Jan 2012

imec and Holst Centre, with associated industry partners, are developing flexible active-matrix OLED display technology, the associated drivers and circuits, and new manufacturing equipment to build the displays, all with an eye on low-cost and high-volume production.


Annealsys MOCVD tool integrates Hine Automation vacuum wafer transfer system

Thu, 1 Jan 2012

Hine Automation shipped its Star SL-300 single-substrate vacuum transfer system to Annealsys, which will integrate the wafer transfer system onto its MC-200 MOCVD tool for R&D and pilot environments.


Cheaper LED backlights require LED, plate materials changes

Wed, 1 Jan 2012

Consumers are adopting LED-backlit LCD TVs more slowly than expected, prompting TV makers to design lower-power, lower-cost LED backlights using fewer LEDs per TV set, shows the NPD DisplaySearch Quarterly LED Backlight Report.


Fabs in high-risk zones, 450mm, 3D IC themes of Semico's Semiconductor Fab Database

Wed, 1 Jan 2012

36% of semiconductor fabs are in high-risk zones, finds Semico, noting the industry disruptions caused by the Japan earthquake and tsunami and Thai flooding and the challenges these presented to chip makers in the regions. 


ISS day 2: Cloud computing to drive 450mm, closer collaboration

Wed, 1 Jan 2012

Day 2 of SEMI’s Industry Strategy Symposium (ISS) 2012 included talks by Mike Splinter of Applied Materials, Mark Thirsk of Linx Consulting, Tim Hendry of Intel, David Lazovsky of Intermolecular, a panel session on could computing run by Harvey Frye of TEL, Handel Jones of IBS and another panel session focused on 450mm, moderated by G. Dan Hutcheson of VLSI Research. Michael A. Fury of Techcet reports.


MAPPER Lithography tech resolves 22nm lines, spaces, contact holes in CEA-Leti work

Mon, 2 Feb 2012

CEA-Leti reports that the MAPPER Lithography massively parallel direct write technology resolves 22nm dense lines and spaces and 22nm dense contact holes in positive chemically amplified resist. The maskless lithography tech meets semiconductor requirements for 14nm and 10nm logic nodes.


Lithography, direct-attach LEDs, packaging trends at Strategies in Light Day 3

Fri, 2 Feb 2012

Day 3 of the 2012 Strategies in Light conference continued the LED Manufacturing session. Presenters covered LED manufacture, advanced packaging, metrology and testing, high-performance materials, and other topics, such as dimming. Blogger Michael A. Fury, Techcet Group, reports.


LED cost reduction to come from manufacturing: Strategies in Light

Fri, 2 Feb 2012

The manufacturing conference at Strategies in Light focused on methods for reducing cost through the manufacturing supply chain. Presenters discussed various methods of reducing manufacturing costs, from improved automation and standards implementation, automation to new packaging technologies. Laura Peters, LEDs Magazine, reports.


LED manufacturing highlights from Strategies in Light Day 2

Thu, 2 Feb 2012

Blogger Michael A. Fury, Techcet Group, reports from Day 2 of Strategies in Light: immersing himself in the LEDs manufacturing track of the conference.


Vistec installs first e-beam lithography EBPG5000pES in China

Mon, 1 Jan 2012

Wuhan National Laboratory for Optoelectronics at the Huazhong University of Science and Technology (Wuhan, China) has signed off its Vistec Lithography electron-beam lithography system Vistec EBPG5000pES.


Apple shares list of suppliers

Fri, 1 Jan 2012

For the first time, Apple Inc. has publicly published a list of over 150 companies that the electronics giant says represent 97% of its procurement expenditures for materials, manufacturing, and assembly of products worldwide.


DRAM oversupply could worsen in 2012

Fri, 1 Jan 2012

The dynamic random access memory (DRAM) market is encountering an "alarming" rise in inventory, low capex, and reduced demand from end-market applications, show analysts from IHS iSuppli, Deutsche Bank, and Barclays Capital.


Semiconductor fab capex forecast for 2012

Tue, 1 Jan 2012

Key points from SEMI's 2012 semiconductor fab equipment spending forecast include a predicted decline of 11% to $35 billion, steady growth in 300mm installs, and an H1 dip/H2 surge format.


EVG integrates UV lithography from Eulitha on mask aligner

Tue, 1 Jan 2012

EV Group signed a joint-development and licensing agreement with Eulitha AG, integrating Eulitha's PHABLE mask-based UV photolithography technology with EVG's automated mask aligner platform.


ROI potential for OLED, emerging display technologies

Mon, 1 Jan 2012

Printed, flexible, and organic electronics enable next-gen displays and other applications; however, technical hurdles and dev cycles impede ROI. The key is partnerships sharing materials, equipment, and device development expertise, shows Jonathan Melnick, Lux Research.


OLED trends: Materials, color patterning advances and the display race

Fri, 1 Jan 2012

OLED manufacturing advanced rapidly in 2011, making gains in organic materials, color patterning, electronic driving methods, and encapsulation, shows NPD DisplaySearch.


AMOLED displays draw attention on smartphone adoption

Thu, 1 Jan 2012

AMOLED shipments are estimated to have reached 90 million units in 2011, up 97% Y/Y, while revenue is expected to grow to $3.36 billion, up 169% Y/Y, according to NPD DisplaySearch.


10 LED manufacturing themes in 2012

Thu, 1 Jan 2012

Barclays Capital forecasts 2012 as a "subdued year" for the light-emitting diode (LED) industry, but there will be opportunities for MOCVD sales in the LED and power semiconductor sectors, as well as MOCVD upgrades.


22nm node semiconductors: Technical forecasts

Tue, 1 Jan 2012

Solid State Technology asked top analysts and technologists to provide insights on the transition to 22nm semiconductor devices. Read through the whole 10-forecast series, or check out the individual articles as you have time to see perspectives on lithography, device architecture, and more.


Gore debuts high-purity 20nm PTFE filter for semiconductor, FPD fab

Wed, 2 Feb 2012

Gore introduced a 20nm-rated PTFE filter, available in a HDPE cartridge. The filter is optimized for bulk processing high-purity chemicals used in semiconductor and flat panel display manufacturing.


Progress in Printed Electronics: An Interview with PARC’s Janos Veres

Tue, 1 Jan 2012

Solid State Technology editor Pete Singer caught up with Janos Veres, area manager for printed electronics in the electronic materials and devices laboratory at PARC.


MOCVD cools down, LED downstream processing heats up

Mon, 1 Jan 2012

Requirements for LED processing equipment are changing from cost driven to more technology driven decisions, a clear trend to more complex and more efficient manufacturing, according to Thomas Uhrmann and Thorsten Matthias of EV Group.


40nm manycore processors roll out at Tilera

Mon, 1 Jan 2012

Tilera launched its 36 and 16-core TILE-Gx 64-bit processors with low power consumption and high performance. The chips increase the number of cores on one die, without complicated redesigns, and are Tilera's first 40nm design.


Apple iPhone 4S steals smartphone show in Q4 2011; Samsung wins the year

Fri, 1 Jan 2012

While Apple's release of the iPhone 4S in Q4 2011 "unleashed tremendous pent-up demand" from consumers, Samsung used its broad range of smartphones to take the top spot, reports IHS.


ABB intros Cleanroom ISO 5 version of multipurpose 6-axis robot

Thu, 1 Jan 2012

ABB Robotics introduced an ISO 5 (Class 100) Cleanroom version of the IRB 120, its smallest multipurpose 6-axis robot. Any source materials in the IRB 120 prone to particle generation were modified to eliminate contamination potential in the manufacturing area.


Bilayer graphene's "Higgs boson" insulating property

Wed, 1 Jan 2012

UC Riverside researchers identified the "Higgs boson" property of bilayer graphene: when the electrons come close to 0, BLG becomes insulating. This spontaneous symmetry breaking is the same principle that endows mass for particles in high energy physics.


Soitec, Sumitomo Electric scale GaN engineered wafers to 6"

Tue, 1 Jan 2012

Soitec (Euronext) and Sumitomo Electric Industries Ltd. demonstrated 4" and 6" engineered gallium nitride (GaN) substrates, and launched pilot production lines to enable wider market adoption.


Vistec delivers electron-beam lithography system to ITME researchers in Poland

Thu, 4 Apr 2012

Vistec Electron Beam GmbH sold a Variable Shaped Beam system SB251 to the Institute of Electronic Materials Technology in Warsaw, Poland, for R&D on micro-optical and diffractive elements, new materials, and masks for optical lithography.


Understanding semiconductor wafer demand growth in 2012

Wed, 4 Apr 2012

Wafer demand grows at a CAGR of about 8-9%, but capital investment in wafer fab capacity does not stick with an 8-10% investment rate every year. Semico tracks wafer demand, which is “anything but stable.”


2012 semiconductor revenue forecast bumped up 1 point at IHS

Wed, 4 Apr 2012

The overall semiconductor industry will grow 4.3% in 2012, according to IHS, which raised its forecast 1 percentage point based on consumer demand for wireless products like smartphones and tablets.


Intel’s first 22nm trigate transistor products debut

Tue, 4 Apr 2012

Intel Corporation introduced its first product built on the 22nm 3D trigate transistor: the quad-core 3rd-generation Intel Core processor family for desktop, laptop and all-in-one (AIO) designs.


Qualcomm’s first 28nm semiconductor outperforms 45nm siblings by 25%

Tue, 4 Apr 2012

The HTC One S HSPA phone runs Android 4.0.3, based on Qualcomm’s first 28nm processor, the MSM8260A, with an Adreno 225 GPU core. ABI Research performed a teardown on the handset.


Semiconductor subsystems see record revenues thanks to 32nm and below

Mon, 4 Apr 2012

Strong lithography spending, as well as several acquisitions and divestures in the space, brought changes to the critical subsystems of semiconductor/related markets sector, says VLSIresearch. 


IBM adds membrane, chemical suppliers to lithium-air battery project

Mon, 4 Apr 2012

IBM welcomed Asahi Kasei and Central Glass to its Battery 500 Project team, collaborating on far-reaching research to improve electric vehicles. Asahi Kasei will engineer membrane technologies and Central Glass will develop electrolytes and additives for lithium-air batteries.


Rockwell Collins partners on switchable waveguide displays from SBG

Fri, 4 Apr 2012

SBG Labs, Inc., electro-holographic materials and device maker, will bring to market avionics and military displays based on its switchable waveguide DigiLens optics, under a 10-year agreement with Rockwell Collins.


North American semiconductor fab tool makers see March book-to-bill hike

Fri, 4 Apr 2012

With a book-to-bill ratio of 1.13, North America-based manufacturers of semiconductor equipment saw a sixth climb in the ratio, which has steadily improved since it hit 0.71 in September 2011, shows SEMI.


Intel’s Q1 2012 earnings: Key takeaways

Thu, 4 Apr 2012

Intel Corporation (NASDAQ:INTC) posted quarterly revenue of $12.9 billion, operating income of $3.8 billion, and net income of $2.7 billion. Analysts from FBR Capital Markets and Barclays Capital break down the numbers.


Texas Instruments (TI, TXN) names top suppliers

Thu, 4 Apr 2012

Texas Instruments awarded 15 of its 12,000 suppliers with Supplier Excellence Awards for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality.


Veeco ion beam deposition tool matches PVD speed

Mon, 4 Apr 2012

Veeco Instruments Inc. debuted the SPECTOR-HT ion beam deposition tool for thin-film deposition in optical products, such as lasers, telecommunications chips, and more.


Conference Report: MRS Spring 2012, Day 4

Fri, 4 Apr 2012

Blogger Michael A. Fury, Techcet Group, reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: nanowire FETs, laminate MEMS, nanoparticles in security printing, graphene nanoribbons, Ta2O5 memristors, redox flow batteries, graphene, and more.


LED researchers install VECO MOCVD in Korea

Fri, 4 Apr 2012

LED-IT Fusion Technology Research Center of Korea tapped Veeco for a TurboDisc K465i GaN MOCVD system for research and development of LEDs, including green LEDs and UV versions.


Graphene grown on 300mm wafers with AIXTRON tool in Japan

Thu, 4 Apr 2012

The National Institute of Advanced Industrial Science and Technology in Japan is using its AIXTRON SE BM 300 system to grow monolayer graphene on 300mm wafers.


Economy, fabless relationships, 450mm and more on deck at The ConFab 2012

Thu, 4 Apr 2012

The ConFab 2012, an invitation-only global conference and business meeting on semiconductor manufacturing, June 3-6 in Las Vegas, selected speakers and sessions for 2012.


Semiconductor foundries expect double-digit growth through 2015

Wed, 4 Apr 2012

The pure-play semiconductor foundry business will ride the growth of tablets, ultrabooks, and smartphones to $29.6 billion in revenues, according to an IHS iSuppli Semiconductor Manufacturing and Supply Market Tracker report.


Verticle takes hexagonal LED chips to mass production

Mon, 2 Feb 2012

Verticle began mass production of its hexagonal-shaped LED chip Honeycomb, developed with a proprietary copper substrate and chemical chip separation technology.


Shin-Etsu Chemical releases low-RI LED encapsulants

Fri, 2 Feb 2012

Shin-Etsu Chemical Co. Ltd.'s new KER-7000 Series silicone encapsulating materials offer a low (1.38) refractive index (RI) for HB-LED packaging with lower gas permeability and higher transparency.


Semiconductor metrology beyond 22nm: 3D memory metrology

Thu, 2 Feb 2012

The 22nm node marks the beginning of a major transition from conventional scaling of planar memory devices to complex 3D architectures. SEMATECH authors examine the metrology needs of 3D memory device architectures in Part 2 of this three-part series.


JSR Micro Taiwan opens LCD materials research lab

Thu, 2 Feb 2012

JSR Corporation began operations at its new Research and Development Facility at JSR Micro Taiwan, which manufactures and sells LCD materials in Taiwan.


3D micro-structuring, OLED display fab nab laser awards

Fri, 5 May 2012

The Innovation Award Laser Technology 2012 recognized 3D metal micro-structuring laser technology from Schepers, excimer laser design for OLED and LCD display fab from Coherent, and a laser brazing head technology from Precitec Optronik.


UNL taps SEMI-GAS for semiconductor metrology lab’s gas needs

Tue, 5 May 2012

SEMI-GAS Systems, ultra-high-purity gas source and distribution system maker, will outfit the University of Nebraska - Lincoln’s new Nanoscience Metrology Facility. Applied Energy Systems will provide field services.


President Obama speaks at Albany Nano-Tech Complex today

Tue, 5 May 2012

President Barack Obama toured the SUNY - Albany Nano-Tech Complex today, speaking about the economy and education in the CNSE NanoFab Extension Building.


Lower-cost LED backlights darken CCFL's future

Mon, 5 May 2012

Low-cost direct LED-backlit LCD TVs were introduced in March 2011, targeting share in the entry/mainstream LCD TV market currently dominated by CCFL-backlit TVs. They will eliminate CCFLs by 2014, says DisplaySearch.


Organic complementary logic aim of 2 European research projects

Fri, 5 May 2012

The Heterogeneous Technology Alliance in Europe is focusing on high-performance organic electronic circuits through 2 projects: COSMIC to develop p- and n-type OTFTs for complementary logic, and POLARIC for shrinking critical dimensions of OTFTs.


Top LCD polarizer makers show dominance in 2011

Thu, 5 May 2012

he top 3 large-area LCD polarizer makers -- LG Chem, Nitto Denko, and Sumitomo Chemical -- are widening their market share (area basis) lead over other makers, achieving 77% market share in 2011, according to Displaybank.


Low-cost Flash memory boosted by gray-market cellphones

Mon, 5 May 2012

The massive “gray market” for cellphones is propelling sales of lower-cost flash memories like eMMC and SPI NOR, as manufacturers of the unregulated phones strive to keep production costs low, says IHS.


Bridging the fabless-foundry gap: Highlighted ConFab presentation

Fri, 5 May 2012

At The ConFab in Las Vegas, TSMC’s BJ Woo, senior director, Graphic/PLD/CPU Business Development Division, will present “Bridging the Fabless-Foundry Gap.”


China's LED subsidy totals RMB2.2B

Thu, 5 May 2012

Barclays Capital’s Asia IT analyst Jones Ku shares details of China's State Council’s subsidy program for household electrical appliances. The program sets aside RMB2.2 billion to promote consumption of LEDs and “other energy-saving light bulbs.”


Tight 28nm supply shifts GPU maker shares in Q1

Thu, 5 May 2012

Barclays Capital’s C.J. Muse looks at the forecast for PC GPUs based on a new report from Mercury Research. Shipments of PC graphic devices in Q1 2012 came in in-line to slightly below historical trends. Nvidia lost share to Intel and AMD due to tight 28nm chip supply.


DRAM partially recovers thanks to Elpida bankruptcy

Tue, 5 May 2012

The market for DRAM is expected to partially reverse the drastic losses it incurred in 2011 and achieve revenue growth this year, the result of balanced supply and demand following the exit of major manufacturer Elpida Memory, according to IHS.


Semiconductor makers ready for H2 2012 snapback

Mon, 2 Feb 2012

FBR Capital released its Q4 2011 semiconductor industry analysis, surveying chip, distributor, EMS, PC OEM, communications equipment OEM, handset OEM, and industrial firms. Their conclusion? Corrective actions in the supply chain have set up a possible H2 2012 snapback for semiconductors.


HB-LED grade aluminum nitride meets thermal needs of today's LEDs

Fri, 2 Feb 2012

In this series, CMC Laboratories describes a new LED-grade AlN and what it accomplishes as a ceramic substrate. The AlN offers better heat dissipation for LED packages than alumina, at a lower cost than previous formulations.


Present at coolingZONE LED 2012 in Berlin

Thu, 2 Feb 2012

coolingZONE LED, May 29-31 in Berlin, is soliciting technical presentations on LED energy consumption, LED packaging, heat and air-flow simulations of LED products, and related topics.


TFT LCDs gain share on passive matrix displays in automotive apps

Wed, 2 Feb 2012

FPDs for use in automotive applications will see shipments grow about 50% from 2011 to 2015, says NPD DisplaySearch. The better quality of TFT LCDs is pushing passive matrix displays to the shoulder.


Combo chipsets to suffer against new embedded WiFi chipsets

Tue, 2 Feb 2012

Processors like Qualcomm’s Snapdragon will make an impact on future chip revenues, reports analyst firm In-Stat, an NPD Group company.


Large-area TFT LCD panels: Tablet PCs, price erosion, and what to expect in 2012

Tue, 2 Feb 2012

TFT LCD panel shipments are largely dictated by end markets (tablet PC panels are growing fastest) and panel prices (ongoing erosion), says NPD DisplaySearch. The TFT LCD industry is undergoing "unprecedented changes."


HB-LED grade aluminum nitride (AlN) sintering

Fri, 3 Mar 2012

Part 2 of this series covers furnace considerations for a new HB-LED-grade AlN, as well as furnace throughput. Jonathan Harris, CMC Laboratories, covers the role of the oxide sintering phase in AlN in defining the materials microstructure and thus determining key properties such as thermal conductivity and mechanical strength.


EVG wafer clean tool installed at Tokyo Institute of Technology

Thu, 3 Mar 2012

EV Group (EVG) shipped an EVG301 semi-automated single-wafer cleaning system to Tokyo Institute of Technology, for research on advanced optical communication ICs.


IBM sets quantum bit (qubit) error reduction records

Wed, 2 Feb 2012

IBM Research established new records for reducing errors in elementary computations and retaining the integrity of quantum mechanical properties in qubits for quantum computing, using superconducting qubits.


Intel (INTC), Micron (MU) expand NAND flash memory JV

Wed, 2 Feb 2012

Intel Corporation and Micron Technology, Inc., entered into agreements to expand their NAND Flash memory joint venture relationship, wherein Intel will sell its stake in 2 fabs to Micron, IMFS and IMFT.


ISS Europe: Bridging the valley of death

Mon, 2 Feb 2012

A common theme among the presenters at SEMI's ISS Europe was how Europe might bridge the so-called “valley of death” between basic research and volume manufacturing.


MEMS Symposium Report: Chasing 1 Trillion

Thu, 5 May 2012

The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.”


Active-matrix small/medium display growth tips Japan/Korea showdown

Wed, 5 May 2012

Active matrix small/medium displays, less than 9”, recorded 6% unit growth and 29% revenue growth in 2011, said NPD Displaysearch. Toshiba, Sony, and Hitachi's Japan Display Inc. venture could challenge the #1 Samsung SMD this year.


North American semiconductor tool makers see higher bookings in April

Wed, 5 May 2012

North America-based manufacturers of semiconductor fab equipment posted $1.60 billion in orders and $1.45 billion in billings in April 2012 for a book-to-bill ratio of 1.10, according to SEMI.


Researchers model ion bombardment for better nanofabrication

Wed, 5 May 2012

Brown University is using supercomputer simulations to better understand the ion bombardment of metal surfaces used in manufacturing nanoelectronics.


EUV lithography readiness: ConFab presentation preview

Mon, 5 May 2012

Stefan Wurm, director of lithography, SEMATECH will present “EUV Lithography Manufacturing Introduction: Infrastructure Readiness” in the session Technology Trends in Semiconductor Manufacturing at The ConFab 2012, June 3-6 in Las Vegas.


MOCVD sales halved from 2011 to 2012

Fri, 3 Mar 2012

342 MOCVD tools for LED manufacture will ship in 2012, compared to 654 last year, IMS Research reports in its most recent GaN LED Quarterly Supply and Demand report. Without China, the market would be nearly still.


North American semiconductor fab equipment sales above parity in February

Fri, 3 Mar 2012

North America-based makers of semiconductor equipment posted $1.33 billion in orders in February 2012, $1.32 billion in billings, and a book-to-bill ratio of 1.01, according to SEMI.


Apple A5X processor teardown: Bigger die, higher heat?

Thu, 3 Mar 2012

Apple’s ARM-based processors have created a point of hardware differentiation in applications processors. With the A5X, Apple is going with a much larger die at the 45nm node (shared across the 2 prior generations), shares Chipworks. It's also turned off the PoP track.


High-volume semiconductor fab reduces particle contamination test time

Wed, 3 Mar 2012

A high-volume semiconductor fab using particle monitor wafers to test for contamination in wafer fab tools looked to reduce its labor and test time. The fab switched to wireless wafer-like airborne particle sensors. Allyn Jackson, CyberOptics Semiconductor, shares the case study.


Japan's aging semiconductor industry revealed by 2011 earthquake

Tue, 3 Mar 2012

One year ago, Japan’s semiconductor industry was rocked by a devastating earthquake and tsunami. However, the real disaster for Japan’s chip industry occurred during the years before the earthquake, says IHS.


Intematix remote phosphor enables 100W-equivalent LED bulbs

Thu, 5 May 2012

Intematix debuted ChromaLit Contour remote phosphor architecture. ChromaLit Contour is shaped to enable internal and external convection airflow, cooling LEDs in 60, 75 and 100W-equivalent omni-directional lights.


Semiconductor sales grew incrementally in March 2012

Wed, 5 May 2012

Global semiconductor sales hit $23.3 billion in March 2012, up 1.5% from February 2012 and down 7.9% from March 2011, reports the Semiconductor Industry Association (SIA).


Fujitsu Semiconductor transfers Iwate wafer fab to DENSO

Tue, 5 May 2012

Fujitsu Semiconductor will transfer ownership of its Iwate Plant, a semiconductor wafer fab in Iwate, Japan producing system LSI, microcontrollers, etc., to DENSO.


SEMI lauds Congressman Dave Camp (R-MI) for microelectronics/photovoltaics support

Wed, 5 May 2012

SEMI presented US Congressman Dave Camp (R-MI) with its 2012 North American Government Leadership Award for his leadership and support of the US microelectronics and photovoltaic manufacturing value chain.


Global LCD public display market sees first sequential downturn

Mon, 4 Apr 2012

Public displays, or large-format displays, have shown solid and steady growth in recent years. However, Q4 2011 witnessed the first sequential decline over the last three years in the LCD portion of this market.


Semiconductor revenues topped USD300B in 2011

Mon, 4 Apr 2012

Worldwide semiconductor revenues increased more than 3.7% year over year to $301 billion in 2011, according to the IDC Worldwide Semiconductor Applications Forecaster. IDC expects 2012 growth to be in the 6-7% range.


LED manufacturer Lumichip expands in Finland, opens development center

Fri, 4 Apr 2012

Lumichip Limited, an LED manufacturer, expanded its commercial operations in Finland and opened a new development center in Espoo, Finland.


MEI semiconductor wet process tools built to prevent contamination

Fri, 4 Apr 2012

MEI uses Vycom Flametec PVC-C for chemical rinse tanks and other wafer-contacting elements of its process tools, reducing tool-based contamination and protecting fab workers. Bill McGinty, MEI operations manager, discusses the benefits the new-generation plastic for semiconductor fab tools.


LED maker orders multiple fab tools from OEM Group

Thu, 4 Apr 2012

OEM Group began shipping a multi-tool order to a major LED manufacturer, including Spray Ozone Tool and Spray Acid Tool semi-automated batch surface preparation systems.


Confovis taps Digital Surf for metrology tool imaging software

Fri, 3 Mar 2012

Confovis will begin providing MountainsMap imaging and surface analysis software from Digital Surf with its ConfoCAM LED grid-confocal measuring systems for inspection and research.


MoCu LED material optimizes thermal management

Fri, 3 Mar 2012

PLANSEE developed Mo-Cu R670, a new molybdenum-copper composite material for optimizing heat dissipation in light-emitting diodes (LEDs).


3D LCD TV panels achieved 10% penetration in 2011

Thu, 3 Mar 2012

Total 3D TV panel shipments in 2011 reached 21.2 million, accounting for 10% of all LCD TV panels shipped, reports NPD DisplaySearch. Shutter glass technology use is still larger than patterned retarder technology.


LCD TV production outsourcing on the rise

Tue, 3 Mar 2012

One of every three LCD TVs is expected to be produced through an outsourcing partner in 2012, reports Displaybank in "LCD TV Outsourcing Production Industry Analysis and Forecast."


TSMC, Samsung foundries reconsidering 2012 capex on stronger 28nm demand

Mon, 3 Mar 2012

After only 2 months, semiconductor foundries are already considering raising their 2012 capex budgets, says Terence Whalen, Semiconductor Equipment analyst for North America at Citi.


SMC 2012: Supply chain opportunities in OLEDs, energy storage, and power semiconductors

Fri, 11 Nov 2012

Materials experts from across the supply chain gathered at the 2012 Strategic Materials Conference 2012 in San Jose in October, discussing key materials needs for micromanufacturing outside the CMOS mainstream: OLEDs and GaN-on-silicon power semiconductors, graphene, CNTs, and self-assembling polymers.


Advancing CNTs for next-gen chips

Thu, 11 Nov 2012

Researchers from IBM and Georgia Tech have disclosed significant progress in manipulating carbon nanotubes in transistors and interconnects, in ways compatible with traditional fabrication techniques, advancing toward using the materials for next-generation devices.


GSA working group evaluates new semiconductor startup models to attract investors

Tue, 11 Nov 2012

The Global Semiconductor Alliance (GSA) has formed a new working group and identify various alternatives to encourage startups to innovate, woo investors, generate returns, and keep generating sustainable industry M&A.


OLED TV panels' breakout year delayed, but it's coming

Mon, 11 Nov 2012

Despite continued delays from its two big proponents, OLED TV technology will finally start ramping over the next year, reaching one million unit shipments in 2014 and a 3% market penetration by 2016, says NPD DisplaySearch.


After worst-ever 2012, FPD equipment to see a brighter 2013

Tue, 10 Oct 2012

This year is shaping up to be a historically lousy year for makers of flat-panel display (FPD) manufacturing equipment, but expectations are looking up that demand will catch up to supply in 2013 and balance the market, according to NPD DisplaySearch projections.


Why node shrinks are no longer offsetting equipment costs

Wed, 10 Oct 2012

Semiconductor manufacturers can expect equipment costs to increase about 15% for each new process node, but previously enjoyed advantages of moving to smaller feature sizes are no longer offsetting those costs -- even with a 450mm wafer transition.


European consortia, ASML, supplier network plan for 450mm transition

Thu, 10 Oct 2012

At SEMICON Europa, European government representatives, consortia, and suppliers discussed programs to support and participate in the 450mm wafer-size transition -- including a comprehensive presentation from ASML about its roadmap for 450mm EUV platforms.


Intel offers muted optimism in 3Q12 results, but cutting capex

Wed, 10 Oct 2012

Intel spoke of caution in end markets when discussing its 3Q12 results, but a big dip in capex and lack of 2013 visibility will likely cause concern in the semiconductor manufacturing ecosystem.


AMD-GlobalFoundries' new wafer deal: What it means

Fri, 12 Dec 2012

A new wafer supply deal between AMD and GlobalFoundries will free up cash in the near-term, but industry watchers fear that long-term issues still loom.


ICPT 2012: Five themes summarizing CMP work and progress

Mon, 11 Nov 2012

This year's International Conference on Planarization/CMP Technology (ICPT) encompassed five themes describing use of CMP: new device structures, equipment and methods, Cu interconnects, consumables, and new CMP methods and processes.


IDTechEx forecasts a $100 million graphene market in 2018

Thu, 11 Nov 2012

Despite graphene's promise as a material in future electronics with excellent properties in almost all applications, it still faces difficulties in market acceptance, according to a report from IDTechEx.


Black Friday impressions: Bargains, bigger TVs, and Walmart's muscle

Wed, 11 Nov 2012

NPD DisplaySearch analyst Paul Gagnon took the pulse of consumer shoppers on Black Friday and came away with three observations: bargains are a priority, consumers want bigger upgrades, and Walmart flexed its muscles.


LED market for indoor residential lighting poised to surge

Tue, 11 Nov 2012

Technology improvements and supportive legislation are gathering momentum to help push LED adoption for residential buildings -- the largest lighting application sector.


Semiconductor equipment demand: Shades of 2009?

Fri, 11 Nov 2012

The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.


IEDM 2012 slideshow: Sneak preview of 14 conference papers

Tue, 12 Dec 2012

We've scanned the entire conference program for next week's 58th annual IEEE International Electron Devices Meeting (IEDM), to present a quick sampling of some of the more intriguing papers.


Gartner: Fab equipment still getting softer, next upcycle starts in 2014

Thu, 12 Dec 2012

Global spending on wafer fab equipment (WFE) is now on pace to finish 2012 with a -17% annual decline, and 2013 now looks like it'll only be slightly better at a -10% dropoff, before the next cyclical spending upturn begins in 2014, according to an updated forecast from Gartner.


Samsung reaffirms plans for $4B investment in Austin fab: What it means

Mon, 12 Dec 2012

Samsung's reaffirmation of its planned $4B investments in its Austin, TX facilities don't offer much extra info, but do serve as a message to the market about its future plans -- with or without Apple.


Tablet PCs are shifting supply chain strategies...can you say 100M iPads?

Wed, 12 Dec 2012

Increased tablet adoption, with Apple's continued dominance and emergence by new players (see Google, Microsoft) are changing the mobile PC competitive landscape -- and supply-chain partners are having to rethink their strategies to stay atop the game.


FPD makers lower overall unit shipments in favor of high-profit public display designs

Mon, 8 Aug 2012

The global market for public displays is strong, but in recent quarters, FPD manufacturers have emphasized revenue and profit over volume, thus lowering the overall unit shipment outlook for this category, according to NPD DisplaySearch.


Rubicon orders Zeta 300 optical profilers for sapphire LED substrates

Mon, 8 Aug 2012

Zeta Instruments will install multiple optical profilers for micron-scale surface analysis at sapphire substrate maker Rubicon Technology, for metrology and inspection on sapphire substrates and wafer production aimed at the HB-LED market.


EUV lithography project launches for better resolution at 14nm

Fri, 8 Aug 2012

Germany has launched a new project, EUV projection optics for 14nm resolution, or ETIK, led by Carl Zeiss and 6 other German companies and research institutes. The aim is to improve extreme ultraviolet (EUV) lithography resolution to the 14nm node.


ONNN CFO resigns as chipmaker reports flat growth

Fri, 8 Aug 2012

ON Semiconductor Corporation (Nasdaq: ONNN) will be looking for a new CFO, with Donald Colvin vacating the post within 90 days. ONNN also authorized its first share repurchase program, and reported flat growth for Q2, with similar guidance for Q3.


Process Watch: Bigger and better wafers

Thu, 8 Aug 2012

In the third installment in a series called Process Watch, the authors discuss some of the challenges of 450mm wafers. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.


The ConFab 2012: A retrospective

Thu, 8 Aug 2012

The ConFab, Solid State Technology’s invitation-only event for the semiconductor industry, took place in June, with presenters from top companies and analyst firms. If you couldn’t be there, check out all the coverage from the event -- reports, presentations, video interviews and more.


ITO alternatives for transparent conductors: From nanotubes to ZnO, adoption varies

Wed, 8 Aug 2012

Most firms offering alternatives to ITO focus on the touch-screen sensor market; however, this sector is too small for many of these firms to generate significant revenues. NanoMarkets outlines the various ITO alternatives, and their possible application spaces.


LED encapsulants grow with increased LED adoption

Tue, 7 Jul 2012

LED encapsulants are closely related to the LED’s lifespan and light transmittance. With high-power and high-brightness LEDs emerging, the encapsulant’s role is becoming more important, says Displaybank.


2012 “Best of West” award finalists announced

Thu, 6 Jun 2012

Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain.


Edwards tailors vacuum pump for LED, compound semiconductor manufacturing

Tue, 6 Jun 2012

Edwards (NASDAQ:EVAC) introduced the new iXH645H dry pump, optimized for metal-organic chemical vapor deposition, a key step in LED and compound semiconductor manufacturing.


SEMICON West 2012 exhibits preview: Lithography focus

Wed, 6 Jun 2012

SEMICON West is taking place July 10-12 in San Francisco, CA. Following are new products for  lithography, including photoresist coaters and ashers.


Semiconductor makers focus on flow control and treatment at leading edge; H20 reuse rises

Fri, 6 Jun 2012

Semiconductor manufacturers will spend $2.3 billion in 2012 for flow control and treatment products, shows McIlvaine Company. Even more pure water is required as the line sizes on chips are decreasing. This aspect, coupled with the opportunity for water reuse, is creating new opportunities.


How 4K x 2K LCD TVs affect display panel manufacturing, yields

Mon, 7 Jul 2012

Ultra-high resolution, called 4K x 2K, displays may be the new selling point for LCD TVs. The architecture requires changes to manufacturing methods, including more photomask layers, notes David Hsieh, DisplaySearch, in this summary of the feature and its effects.


OLED thin-film encapsulation technology key to new applications

Fri, 6 Jun 2012

OLED thin film encapsulation technology is the one of technologies emerging as the core technology of flexible OLED, and technology development and patent securing competition between world’s leading OLED companies will increase accordingly, shows Displaybank.


Maxim plans major upgrades to US semiconductor fabs

Fri, 6 Jun 2012

Maxim is spending $200 million to upgrade and expand its US semiconductor manufacturing facilities in San Antonio and Dallas, TX; Beaverton, OR; and San Jose, CA. Maxim manufactures about 50% of its products in the US.


Osram devises LED solder pad concept for easier second sourcing

Thu, 7 Jul 2012

Osram Opto Semiconductors developed a concept for uniform solder pads based on the Oslon LED component family. This enables second sourcing by Osram’s LED customers without an additional soldering board, potentially reduces the costs of storage and process modification.


C-SAM acoustic micro imaging system meets budget-conscious lab inspection needs

Tue, 7 Jul 2012

Sonoscan unveiled its Lab Model 9600 C-SAM acoustic micro imaging system to serve laboratory/failure analysis applications and for use in low-volume semiconductor production inspection.


LED bulb cost halved by 2020

Mon, 7 Jul 2012

The price of a LED bulb will fall by about half by 2020, hitting $11.06, according to Lux Research. With the LED chip package seeing 70%+ cost reduction, technology innovation will shift to the surrounding elements: thermal management, drivers and optics.


2012 ITRS stabilized for front-end, but changes loom for 2013

Fri, 7 Jul 2012

The overriding message for 2012 is that the roadmap has been largely stabilized with the significant changes that were input last year in the 2012 publication,” said Intel’s Alan Allan, speaking at Semicon West.


Fabless keynote: Xilinx on programmability @ SEMICON West

Thu, 7 Jul 2012

SEMICON West’s Day 2 keynote speaker represented a fabless company: Ivo Bolsens, PhD, SVP and CTO of Xilinx presented on how programmable chips and innovative packaging can advance semiconductors.


Osram plans LED packaging facility in Wuxi

Fri, 6 Jun 2012

OSRAM AG will build a new LED assembly plant in Wuxi, Jiangsu, China, packaging LED chips fabbed at its Regensburg, Germany and Penang, Malaysia wafer processing facilities.


How to cope with semiconductor fab tool obsolescence: ConFab preview

Thu, 5 May 2012

Sanjay Rajguru, director of ISMI, will present “Tool Obsolescence and the Impact on 200mm Manufacturing” at The ConFab 2012’s final session, Maximizing the Longevity of Investments.


USI updates coating tool for tablet, large display fab and R2R processing

Thu, 5 May 2012

Ultrasonic Systems Inc. (USI), ultrasonic spray coating tool manufacturer, developed new options for its MAX-800 coating system, such as an automated reel-to-reel system, tablet-glass handling conveyor, and more.


Element Six opens synthetic diamond fab in Silicon Valley to serve US customers

Wed, 5 May 2012

Element Six, maker of synthetic diamond supermaterials, opened its first US manufacturing facility in Silicon Valley, housing production, technical, and customer service.


Transparent displays unveil new applications for display technology

Mon, 5 May 2012

Transparent displays will hit the market this year, and create an $87.2 billion market by 2025, according to Displaybank.


Directed self-assembly lithography research yields contact holes on semiconductor wafer

Mon, 5 May 2012

Stanford University researchers, sponsored by Semiconductor Research Corporation (SRC), have created contact hole patterns for logic and memory semiconductors using a next-generation directed self-assembly (DSA) lithography process.


ConFab interview: Dai Nippon Printing's Naoya Hayashi

Tue, 6 Jun 2012

Naoya Hayashi, research fellow for electronic device operations at Dai Nippon Printing, speaks with Solid State Technology chief editor Pete Singer during The ConFab 2012. Hayashi presented “NGL Mask Readiness” in The ConFab’s session on technology trends.


A virtual IDM concept can unite semiconductor foundries, fabless companies, and packaging houses

Mon, 6 Jun 2012

The ConFab 2012, Solid State Technology’s invitation-only meeting of the semiconductor industry, opened today in Las Vegas with a keynote address from John Chen, PhD, VP of technology and foundry operations at Nvidia Corporation.


Metrology method measures <50nm particles in semiconductor processes to eliminate contaminants down to 12nm

Tue, 6 Jun 2012

W. L. Gore & Associates and CT Associates developed a method for measuring <50nm particles in ultra-pure water (UPW) used in semiconductor processes, and removing particles as small as 12nm, through a combination of ultrafiltration and microfiltration.


Argonne Labs to characterize diamond microelectronic material with AKHAN

Mon, 6 Jun 2012

AKHAN Technologies will collaborate with the Center for Nanoscale Materials at Argonne National Laboratory to fully characterize Miraj Diamond devices and materials, which are made by doping n-type diamond and can be used in the semiconductor industry.


Argonne Labs to characterize diamond microelectronic material with AKHAN

Mon, 6 Jun 2012

AKHAN Technologies will collaborate with the Center for Nanoscale Materials at Argonne National Laboratory to fully characterize Miraj Diamond devices and materials, which are made by doping n-type diamond and can be used in the semiconductor industry.


PVD process generates 10" AlN-on-sapphire template wafer at Kyma

Fri, 6 Jun 2012

Kyma Technologies demonstrated a 10" AlN on sapphire template, manufactured on its plasma vapor deposition on nanocolumns technology. The 10” sapphire substrate was provided by Monocrystal.


Best semiconductor fab tool suppliers: VLSIresearch survey results

Fri, 5 May 2012

VLSIresearch polled semiconductor manufacturers about their tool suppliers, asking chipmakers to rank equipment providers on customer satisfaction. This year’s results show renewed focus on fab needs.


SEMICON West Day 2: DSA lithography and CMP meetings

Thu, 7 Jul 2012

Blogger Michael A. Fury, Ph.D., Techcet Group, reports on Day 2 of SEMICON West with insights from the Sokudo Lithography Forum and NCCAVS CMPUG meeting, and -- sadly -- none on SEMICON West’s Happy Hour.


Chat with Intel’s Shekhar Borkar @ SEMICON West 2012: Overpowering power consumption

Wed, 7 Jul 2012

In this video interview, Intel's Shekhar Borkar shares some key topics from SEMICON West keynote: Near-threshold voltage transistor designs, 3D integration for DRAM, unconventional interconnect, and more.


Semicon West Day 1: FDSOI and TSV R&D with CEA-Leti

Wed, 7 Jul 2012

Michael A. Fury, Ph.D., reports on the opening day of SEMICON West (July 10), covering exaflop computing, FDSOI, TSV and other integration schemes, and silicon photonics with CEA-Leti.


Semiconductor equipment spending to contract 2.6% in 2012, grow in 2013

Tue, 7 Jul 2012

Semiconductor equipment sales will reach $42.4 billion in 2012, according to the mid-year edition of the SEMI Capital Equipment Forecast, released at SEMICON West 2012.


Semicon West 2012 opens with semiconductor revenue forecasts, high-level perspectives

Tue, 7 Jul 2012

Michael A. Fury, Ph.D., reports from the pre-opening day (July 9) of SEMICON West at the Moscone Center in San Francisco, CA. The first day hosts SEMI’s press conference on semiconductor revenues and the SEMI/Gartner Market Symposium.


More SEMICON West exhibit previews

Sun, 7 Jul 2012

Following are some of the new and flagship products that will appear this week at SEMICON West, July 10-12 in the Moscone Center of San Francisco, CA.


Micron’s Elpida acquisition: Analysts weigh in

Sat, 7 Jul 2012

With Micron Technology Inc. (Nasdaq:MU) acquiring bankrupt DRAM maker Elpida Memory Inc.’s assets for 200 billion Yen (approximately US$2.5 billion), several analysts are looking at the move and how it affects the DRAM manufacturing landscape, as well as the Flash memory sector.


USHIO UV irradiance meter offers thin form factor for optical film process control

Mon, 7 Jul 2012

Ushio launched its thinnest UV irradiance meter 'UIT-q365." The meter is 4.9mm thick, used to keep major UV processes within spec. It can be used during optical film manufacturing for flexible electronics, as well as during adhesion of precision optical parts.


Semico reins in semiconductor growth forecast

Thu, 7 Jul 2012

Semico Research has just updated its 2012 semiconductor industry forecast. Semico’s semiconductor growth forecast has stayed between 8 and 10% over about a year. The latest update holds Semico’s forecast at the bottom of that range: 8.6%.


Process Watch: Skewing the defect pareto

Mon, 6 Jun 2012

In the second installment in a series called Process Watch, the author provides tips on how to make sure you’re reviewing the yield killing defects and not wasting time reviewing nuisance events. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions for chip manufacturing at the leading edge.


LED wafer prices stabilize with more suppliers and steadier demand

Mon, 6 Jun 2012

A balance of LED demand and supply in 2012 is based on the downward-stabilized price of sapphire wafers. More ingot suppliers are coming online, with new entrants in Korea and China, providing a broader supplier base for LED makers, shows Displaybank.


Freescale picks new CEO from Texas Instruments

Fri, 6 Jun 2012

Freescale Semiconductor (FSL) named Gregg A. Lowe president and CEO, replacing Rich Bayer. Lowe joins Freescale from Texas Instruments (TI, TXN), where he was SVP and manager of the Analog business.


Semiconductor makers increase inventories ahead of higher demand

Thu, 6 Jun 2012

Semiconductor stockpiles held by chip suppliers increased during Q1 2012, but the rise in inventory for a second straight quarter was driven by the anticipation of higher demand from customers, according to IHS.


Veeco adds high-performance, compact MOCVD tools to TurboDisco line-up

Thu, 6 Jun 2012

Veeco Instruments added 3 new models of its TurboDisc MOCVD systems for HB-LED production: TurboDisc MaxBright M and MHP, and TurboDisc K465i HP.


Record semiconductor fab spending on tap for 2013

Wed, 6 Jun 2012

Fab equipment spending has improved in 2012, breaking the barrier into positive growth for the year, shows SEMI. Semiconductor makers will invest $39.5 billion in fabs, up 2% from 2011 spending. Fab capex will hit a record in 2013, $46.3 billion or 17% above 2012.


Analog IC manufacturing moves to 300mm; new growth applications arise

Thu, 7 Jul 2012

While communications make up the bulk of analog IC sales, growth is coming from automotive, energy, mobility, and medical/healthcare apps, according to Semico. This semiconductor sector is also moving to 300mm wafer production at smaller device nodes, which offers cost advantages.


AIXTRON debuts GaN-on-Si MOCVD reactor technology

Thu, 7 Jul 2012

AIXTRON SE introduced a 5 x 200mm gallium nitride on silicon (GaN-on-Si) reactor design for its G5 Planetary Reactor MOCVD platform. AIX G5+ comprises special reactor hardware and process design, developed with customers in AIXTRON’s R&D lab.


SiC manufacturing: Patents don’t equal revenue/market share, and watch for challengers to PVT growth

Tue, 7 Jul 2012

SiC is a niche material for semiconductor, power electronics, and LED manufacturing. Yole analyzed patents related to SiC growth and wafer manufacturing to glean trends in production, R&D, top companies, barriers to entry, and more.


Real-time monitoring slashes water and energy usage in semiconductor manufacturing on 300mm and 450mm wafers

Mon, 7 Jul 2012

SRC-sponsored researchers developed new sensor-based metrology technology that can significantly reduce water and related energy usage during semiconductor manufacturing.


Present on LEDs at Strategies in Light 2013

Mon, 7 Jul 2012

Strategies in Light 2013 will take place February 12-14 in Santa Clara, CA, hosted by PennWell Co.’s Strategies Unlimited and LEDs Magazine. The event’s theme is “Exploring the Growth Opportunities in the LED and Lighting Markets.”


North American semiconductor fab tool book-to-bill drops below parity in June

Fri, 7 Jul 2012

"Following seven months of increases, the three-month average bookings declined in June and likely reflects some slowing in investment plans attributed to weaknesses in the broader economy," said Denny McGuirk, SEMI.  "While order activity may slow, equipment spending this year will continue to be directed towards advanced technologies in wafer processing and packaging assembly."


MIT team models electronic behavior of OLEDs and other organic electronics

Fri, 6 Jun 2012

A multidisciplinary research team at MIT and the Universidad Autónoma de Madrid developed a new mathematical approach to simulating the electronic behavior of noncrystalline materials, with applications in OLEDs, flexible printable organic electronic circuits, and solar cells.


LED manufacturing equipment status report

Thu, 6 Jun 2012

To support the next cycle of LED manufacturing, tools such as MOCVD, plasma etch, lithography, and others must undergo cost efficiency and yield improvements, says Yole Développement. Trends include migrating to larger wafers, silicon substrates, and tools developed specifically for LED fab, rather than retooled from semiconductor manufacturing specs.


Conference report: TechConnect, Day 2

Thu, 6 Jun 2012

Day 2 of the 2012 TechConnect World Summit, Expo & Showcase opened with fifteen parallel sessions ranging from printed and flexible electronics to device modeling to green chemistry and water to nanotechnology for cancer diagnostics. The unifying theme for this conference is promising technology in search of funding and the opportunity for market validation.


Global DRAM recovery: Is DRAM becoming NAND-like?

Tue, 6 Jun 2012

Barclays Capital analysts say DRAM benefits from a supply discipline that was bolstered by oligopoly/DRAM consolidation and the Elpida bankruptcy; robust demand growth from non-PC applications (server/mobile DRAM bit demand to exceed PC for the first time in 2013E); and potential for additional positives related to Elpida (Hiroshima/Rexchip converted to non-DRAM).


Silicon chip-on-board LED substrate enables best thermal dissipation

Mon, 6 Jun 2012

Daewon Innost achieved what it says is the LED industry’s best thermal dissipation performance on its Glaxum LED Array family, based on the proprietary Nano-Pore Silicon Substrate (NPSS) technology.


Dontech glass filters optimize display clarity and contrast

Thu, 6 Jun 2012

Dontech released the VCG-Series glass filters, formed with next-generation glass fabrication and thin-film vacuum deposition technology to provide exceptional optical transparency and environmental durability.


Legacy semiconductor fab issues @ The ConFab 2012

Wed, 6 Jun 2012

Older production facilities face equipment obsolescence; skills obsolescence; scarce availability of parts, software, and support; and equipment capability extension and tool re-use. At the ConFab 2012 Executive Roundtable, representatives from Sematech/ISMI, IDMs, OEMs, equipment dealers, and industry consultants gathered to have an open discussion on concerns, roadblocks, and possible solutions.


LED makers urge DoE for more support

Wed, 9 Sep 2012

Stakeholders in LED manufacturing have met with US Department of Energy officials to plead their case for increased support in solid-state lighting (SSL) R&D and manufacturing, asserting that the technology's energy conservation benefits and ROI surpasses those of renewable energy technologies that get much more backing.


Tablets, smartphones driving turnaround in power management chips

Tue, 9 Sep 2012

Demand for power management semiconductors recovered in 2Q12 after declining for half a year, thanks to strong demand from electronic products such as smartphones and media tablets, according to IHS iSuppli.


Waiting for the next "golden year"

Fri, 9 Sep 2012

While various industry segments appear to be tapping the brakes, others are revving their engines, observes SEMI's Christian Gregor Dieseldorff -- and a 2012 stall could pave the way for a record-breaking 2013.


Semiconductor R&D spending rising 10% in 2012 to meet design, process challenges

Thu, 9 Sep 2012

Spending on R&D by semiconductor companies worldwide is expected to grow 10% in 2012 to a record $53.4 billion, as companies all across the ecosystem try to keep up with more complex IC designs and new process technologies, according to data from IC Insights.


SIA: July semiconductor sales inch up, unevenly

Wed, 9 Sep 2012

Global semiconductor sales totaled $24.34B in July, a scant 0.2% increase from the prior month and down -1.9% from a year ago, as macroeconomic challenges weigh down demand particularly in Europe and the Americas, according to the latest monthly data from the Semiconductor Industry Association (SIA).


Reports: Renesas targeted by investment firm KKR

Fri, 8 Aug 2012

US-based investment firm Kohlberg Kravis Roberts and Co. (KKR) reportedly is seeking to snap up struggling chip firm Renesas for ¥100 billion (US $1.3B)


LEDs to get backlighting market share help from rising CCFL costs

Mon, 8 Aug 2012

In 2011, LEDs were expected to grab market share from CCFLs in the display backlighting segment. However, prices for CCFL-backlight TVs fell alongside prices for LED-backlit TVs. Now, CCFL raw materials costs have exploded, setting the stage for market share grabs by LEDs, albeit later than expected, reports Jimmy Kim, DisplaySearch.


Laser nanofabrication for mass production at the nanoscale

Fri, 8 Aug 2012

Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.


Supply chain readiness in an era of accelerated change

Fri, 8 Aug 2012

In this SEMI News and Views blog, Karen Savala covers EUV lithography, 450mm wafers, and 3D IC developments, based on her recent presentation at SEMICON West, “Supply Chain Readiness in an Era of Accelerated Change.”


AIXTRON tool supports OTFT, OLED, other organic electronics manufacturing

Thu, 8 Aug 2012

AIXTRON launched the PRODOS-200 PVPD system for deposition of organic thin film materials, used to make OTFT displays and OLEDs, and in other manufacturing applications.


Spincast solution-based ITO could enable cheaper display manufacturing

Wed, 8 Aug 2012

Brown University developed a simpler, cheaper, solution-based manufacturing process for indium tin oxide (ITO) conductive films used in displays and solar cell manufacturing.


Mobile DRAM on the rise with growth in tablets, smartphones, and ultrathin laptops

Tue, 8 Aug 2012

The biggest change in the DRAM industry in 2012 has been Micron’s acquisition of Elpida. One key asset for Micron is mobile DRAM, which is growing in adoption thanks to integration into smartphones and tablets.


Measuring inside an active OLED

Mon, 10 Oct 2012

Researchers at the National Institute of Advanced Industrial Science say they have devised a way to selectively and nondestructively evaluate molecules within a sealed organic light-emitting diode (OLED) in operation, in hopes to further understand and eventually minimize performance degradation.


EUV Symposium takeaways: Slow and steady progress, much improvement expected in early 2013

Tue, 10 Oct 2012

EUV Symposium host imec and a pair of industry analysts gauge the pace of improvements in EUV lithography and its long march toward production readiness.


Europe to unite research efforts in Silicon Europe cluster alliance

Mon, 10 Oct 2012

Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”


Q2 semiconductor revenue may be “troubling” indicator of market health

Thu, 8 Aug 2012

Global semiconductor market revenue in Q2 2012 fell by 3% Y/Y to $75.2 billion, and grew sequentially <3%, resulting in widespread revenue declines for chip suppliers, particularly those headquartered in Japan and Europe, according to IHS.


New tool performs metal dicing, scribing for LED manufacturing

Thu, 8 Aug 2012

JP Sercel Associates' new IX-6100-MD can scribe and dice a variety of metal layers and alloys used in LED manufacturing.


Quarter-wave retarding film could enable simpler 3D large-screen displays

Tue, 8 Aug 2012

3D movies often rely on glasses for the viewer and a cumbersome 2-projector method. Researchers at South Korea’s Seoul National University have developed a quarter-wave retarding film that changes light polarization, applied to the display screen as a specialized coating.


Samsung spending $4B to update Austin semiconductor factory

Tue, 8 Aug 2012

Samsung Austin Semiconductor LLC says it will spend "about $4 billion" to renovate and retrofit its existing facility for "full system LSI production," mainly to produce mobile SoCs on 300mm wafers using 28nm process technologies.


Augmented reality means augmented NAND, mobile DRAM demand

Fri, 8 Aug 2012

Augmented reality (AR) is a disruptive yet nascent technology. According to Semico, AR will increase demand for NAND and mobile DRAM memory, as well as other technologies.


North American semiconductor fab tool orders tracked flat Y/Y in July

Fri, 8 Aug 2012

"Bookings and billings for North American semiconductor equipment in July are close to values reported exactly one year ago," said Denny McGuirk, SEMI, noting seasonally slow investment activity.


ASML adds Samsung as third chipmaker investor, closes funding plan

Mon, 8 Aug 2012

Lithography leader ASML completes its Co-Investment Program, tallying €3.85 billion in equity funds and €1.38B to support R&D into EUV and 450mm.


TSMC joins <10nm lithography mask writer project

Fri, 8 Aug 2012

TSMC joined IMS’s multibeam mask writer development collaboration to develop an electron multi-beam mask writer for use in advanced mask lithography applications, joining founding members DNP, Intel, and Photronics.


Locals lead semiconductor purchasing in Asia-Pacific

Thu, 8 Aug 2012

On a worldwide basis, Apple Inc. and other multinational OEMs may be the top semiconductor purchasers in 2012, but within the all-important Asia-Pacific region, locally based companies lead the pack when it comes to chip spending growth.


Bruker improves AFMs for semiconductor metrology with KPFM mode

Tue, 8 Aug 2012

Bruker released the PeakForce Kelvin Probe Force Microscopy mode for its AFMs. PeakForce KPFM improves quantitative surface potential data for semiconductor metrology and materials research.


Semiconductor silicon demand grew in Q2, expect flat 2012

Tue, 8 Aug 2012

Worldwide silicon wafer area shipments increased during Q2 2012, compared to Q1 and to Q2 2011, reports SEMI’s Silicon Manufacturers Group (SMG).


Japan's semiconductor industry: Fabs, equipment, and materials

Wed, 10 Oct 2012

Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy,  the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.


LED industry shifting production to 6-inch wafers

Tue, 10 Oct 2012

Driven by market demand, the semiconductor industry is progressing toward consensus on building-block standards for automating LED production on 6-in wafers, explains Paula Doe in an article for SST sister magazine LEDs Magazine.


Tezzaron takes over SVTC's Austin fab amid layoff reports

Mon, 10 Oct 2012

Tezzaron Semiconductor is taking over SVTC Technologies' wafer fab in Austin, TX, amid reports that the semiconductor/MEMS development organization is cutting back activities in Austin and in California.


Tablet display shipments booming in 2012, big panel makers joining the fray

Mon, 9 Sep 2012

Shipments of tablets are booming, and that means demand for tablet displays is set to spike as well -- and some new panel makers are getting in on the action, reports IHS iSuppli.


TSMC's schedule for 450mm mass production -- and lithography is the key

Wed, 9 Sep 2012

During sessions at this month's SEMICON Taiwan, execs from TEL, Lam Research, Applied Materials and KLA-Tencor revealed the latest developments in 450mm technology.


GlobalFoundries tips 14nm FinFETs with 20nm underpinnings

Tue, 9 Sep 2012

GlobalFoundries announced it has developed a 14nm process technology built off its 20nm planar (LPM) process, which it says will offer improved battery life and higher performance vs. other 20nm 2D planar transistors.


Sharp, Intel tieup rumored for ultrabook LCDs

Mon, 9 Sep 2012

Sharp Corp. reportedly is in discussions with Intel to use the Japanese firm's LCD panels in new ultrabook laptops, and could be seeking a more substantial partnership that would make the chipmaking giant its top stakeholder.


Chip demand still sliding, hopes for soft 3Q landing and recovery

Fri, 9 Sep 2012

Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.


Global semiconductor manufacturing equipment spending to decline in 2013, says Gartner

Thu, 6 Jun 2013

Outlook for semiconductor equipment market improves, but remains soft in the short term.


Producing cheaper and more flexible multiple thin crystalline silicon wafers

Wed, 6 Jun 2013

A team of researchers has found a way to make the manufacture of crystalline silicon materials faster and more affordable.


Bosch and STM hold joint honors as No. 1 MEMS suppliers for 2012

Tue, 6 Jun 2013

For the first time ever, no clear winner has emerged to claim top honors in the MEMS business for 2012, with Bosch of Germany and French-Italian STMicroelectronics ending up evenly splitting the title of No. 1 supplier for the year.


Bosch reaches 3 billion sensor milestone

Tue, 6 Jun 2013

Since the start of production in 1995, Bosch has manufactured well in excess of three billion MEMS sensors.


Defense semiconductor and similar applications represent 25% of sapphire industry revenue

Mon, 6 Jun 2013

Crystal growth equipment manufacturer GTAT is leading the charge and recently created a lot of buzz around this application and on the OEM front.


Smartphones forecast to represent over 50% of total cellphone sales for the first time in 2013

Tue, 6 Jun 2013

A new report from IC Insights shows that we could be on the verge of entering into “the post-PC era.”


Abu Dhabi doubles down on semiconductor research

Wed, 5 May 2013

ATIC and SRC today launched the ATIC-SRC Center of Excellence for Energy Efficient Electronic Systems (ACE4S), to be hosted jointly in Abu Dhabi by Khalifa University of Science, Technology and Research, and Masdar Institute of Science and Technology.


Samsung announces industry-first 45nm embedded flash logic process development

Fri, 5 May 2013

Samsung Electronics Co., Ltd., a provider of advanced semiconductor solutions, today announced the industry’s first 45nm embedded flash logic process development called eFlash. Samsung successfully implemented the new process into the smart card test chip, which means that this process technology fulfills the stringent quality requirements of the security solution market and can be successfully deployed on a commercial scale.


SiC and GaN semiconductors: What to expect in the next decade

Wed, 4 Apr 2013

The market for GaN and SiC power semiconductors is set to rise by factor of 18 from 2012 to 2022.


Leading MEMS microphone suppliers ride Apple’s gravy train to the top

Wed, 5 May 2013

Once again demonstrating Apple’s power to ordain winners in the electronics supply chain, the top suppliers last year of microelectromechanical systems microphones were those that provided devices for iPhones and iPads.


January DRAM, NAND flash sales indicate a promising year

Wed, 3 Mar 2013

Industry consolidation to just three big DRAM suppliers and a reduction in capital expenditures among these manufacturers helped propel DRAM average selling prices (ASPs) up 13% year over year in January, which contributed to a 19.9% jump in the total memory market and a 6.2% increase for the total IC market in January 2013. 


Intel launches low-power, high-performance microarchitecture

Tue, 5 May 2013

Intel Corporation today took the wraps off its brand new, low-power, high-performance microarchitecture named Silvermont.


One quarter of all notebooks to ship with touchscreens by 2016

Wed, 5 May 2013

Driven by falling prices and a major initiative from Intel Corp., shipments of touch-enabled mobile PCs are expected to enjoy rapid growth in 2013 and the coming years, rising to about 25 percent of all notebooks by 2016.


Shrinking flat-panel TV market wrings out marginal growth in first quarter

Tue, 5 May 2013

Bringing an end to a full year of declines, global flat-panel television shipments rose slightly in the first quarter, paving the way for marginal growth in 2013.


China becomes world’s leading PC market in 2012

Mon, 4 Apr 2013

China rose to the top of the PC market for the first time ever on an annual basis last year, relegating the United States to second place with a lead of more than 3 million units, according to an IHS iSuppli PC Dynamics Market Brief from information and analytics provider IHS.


Personal computer shipments post worst quarter on record, says IDC

Thu, 4 Apr 2013

In another sign of the worldwide shift in preferred personal devices, PC shipments posted the steepest decline ever in a single quarter, according to the International Data Corporation Worldwide Quarterly PC Tracker (IDC).


Veredus confirms VereFlu lab-on-chip detects the current subtype of avian flu

Wed, 4 Apr 2013

Veredus Laboratories today announced that the current version of VereFlu detects the current subtype of H7N9 (Avian Flu) that is responsible for the flu outbreak in China. H7N9 is the latest mutation to cause concern and increased surveillance in the region.


Health awareness spurs quadrupling in MEMS sensor market for wearable electronics

Tue, 4 Apr 2013

From smart wristwatches that record heart rates, to intelligent armbands that track physical activities, wearable electronics and fitness monitoring devices are attracting increased attention from health-conscious consumers, causing shipments of MEMS sensors used in these products to more than quadruple in just five years.


UC Riverside scientists discover new uses for carbon nanotubes

Wed, 5 May 2013

The atom-sized world of carbon nanotubes holds great promise for a future demanding smaller and faster electronic components.


Reinventing Intel

Fri, 4 Apr 2013

The semiconductor chip giant revealed plans to branch out beyond PCs. Will it work?


BeSpoon and CEA-Leti establish world-record distance measurement on a single chip

Wed, 4 Apr 2013

BeSpoon, a fabless semiconductor company, and CEA-Leti have demonstrated an IR-UWB integrated circuit able to measure distances within a few centimeters’ accuracy, and have established a world-record operating range at 880m (standard regulation) and 3,641m (emergency situations).


IBM announces $1B investment in flash memory R&D

Fri, 4 Apr 2013

IBM announced plans on Thursday to invest $1 billion in flash memory research and development and launch a series of systems that will use solid state drives.


Global market for MEMS microphone to more than double in five years

Wed, 2 Feb 2013

The global market for MEMS microphones has reached approximately $422 million in 2012. The market is predicted to increase to $865 million in 2017.


Silicon wafer revenues decline in 2012

Tue, 2 Feb 2013

Worldwide silicon wafer revenues declined by 12 percent in 2012 compared to 2011, according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.


LED technology and market challenges addressed in Taiwan

Thu, 2 Feb 2013

To help the Taiwan LED industry tackle the increasing challenges, an in-depth analysis of LED global market opportunities and technology breakthroughs were recently provided at the 2013 LED Market and Outlook seminar held by SEMI Taiwan.


MEMS revenue to climb a healthy 8 percent this year

Thu, 2 Feb 2013

A strong uptake in consumer and mobile devices will power the market for microelectromechanical systems (MEMS) to solid revenue growth in 2013, with breakthroughs in new sensor applications also expected this year, according to insights from the IHS iSuppli MEMS service at information and analytics provider IHS.


Despite surging demand from Apple, NAND market contracts in 2012

Tue, 2 Feb 2013

Global NAND flash memory market revenue fell 7 percent in 2012 as disappointing Ultrabook sales negated the impact of surging demand from Apple Inc. for its iPhone line, according to an IHS iSuppli Data Flash Market Tracker Report from information and analytics provider IHS (NYSE: IHS).


FAME center to focus on advanced electronics

Mon, 2 Feb 2013

Five University of California, Riverside professors will receive a total of $5 million as part of a $35 million research center aimed at developing materials and structures.


A*STAR and PGS to collaborate on MEMS sensor for oil and gas applications

Thu, 1 Jan 2013

A*STAR’s Institute of Microelectronics signed an agreement to collaborate with Petroleum Geo-Services to develop a high performance MEMS-based sensor for deep sea seismic oil and gas exploration.


Touch panel market projected for 34% growth in 2013

Wed, 1 Jan 2013

The touch panel market size in 2012 was 1.3 billion units, a 39.4% growth over 2011. The market is projected to grow 34% in 2013, growing to more than 1.8 billion units, according to a new research report from Displaybank.


CES: Phablets and table PCs break the PC mold

Fri, 1 Jan 2013

Among the usual confluences of useful and cool gadgets (not to mention bizarre) at this week's annual Consumer Electronics Show in Las Vegas, two types of devices with new formfactors aimed to rethink the PC model.


The gleam of well-polished sapphire

Tue, 1 Jan 2013

Is it time for high-brightness LED manufacturing to get serious about process control?  If so, what lessons can be learned from traditional, silicon-based integrated circuit manufacturing?


Is Apple changing its mind on touch panel structures?

Tue, 1 Jan 2013

Reports are circling around Apple's supply chain of a potential shift in the company's display technology for its future iPhones and iPads -- moving back to LCDs and away from touch panels -- but a drastic realignment of its supply chain is probably not likely, observes DisplaySearch.


Samsung grabs No.3 foundry spot on smartphone dominance

Thu, 1 Jan 2013

In the ranks of top foundries, there's a new Number Three in town: Samsung, which climbed up the ranks again in 2012 thanks to its ubiquity in smart phone technology, according to updated rankings by IC Insights.


ISSCC 2013 Slideshow: Highlights

Tue, 2 Feb 2013

ISSCC, the International Solid-State Circuits Conference, is being held on February 17-21, 2013, at the San Francisco Marriott Marquis Hotel. This year, in honor of the conference’s 60th anniversary, we have assembled highlights of the topics and trends that are being discussed.


Manufacturing innovations to drive MEMS equipment market to a >5% CAGR over 2012-2018

Tue, 2 Feb 2013

In its new report MEMS Front-End Manufacturing Trends, Yole Développement goes further in the equipment and materials market forecasts and in the manufacturing trends for MEMS. The report gives detailed analyses about MEMS device technology process flow, manufacturing trends and manufacturing cost breakdown.


Infographic: Computers with human senses

Tue, 2 Feb 2013

We are entering the era of cognitive systems, where electronic devices will mimic the human senses—in their own way, to see, smell, touch, taste and hear. IBM assembled this infographic to illustrate what they call the “5 in 5,” five innovations that will change our lives within five years.


Tech spending still strong, despite economic volatility

Mon, 2 Feb 2013

China looks a good bet to be the engine of growth again in 2013, while U.S. will see improving PC market and more software growth.


Touch panel transparent conductive film market worth $4.8 billion by 2019

Fri, 2 Feb 2013

The Touch Panel Transparent Conductive Film, or TCF, market was reported $956 million in 2012. Markets are anticipated to reach $4.8 billion by 2019.


Fab Spending Forecast: Equipment spending is expected to remain flat in 2013

Wed, 3 Mar 2013

Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.


ITO film market undergoing a sea of changes

Mon, 3 Mar 2013

Touch panel makers are seeking ways to catch both greater specifications and lower cost at the same time, amid rapidly falling touch panel prices. Displaybank analyzed and forecasted the ITO film and glass market, technologies, and industry.


Intel leads unexpectedly large decline in semiconductor market inventory

Wed, 3 Mar 2013

After reaching a worrisome high in the third quarter of 2012, global semiconductor inventories held by chip suppliers fell at a surprisingly fast rate in the fourth quarter, led by dramatic reductions for market leader Intel Corp.


A single European semiconductor strategy is on its way

Thu, 2 Feb 2013

STM, Imec, CEA-LETI, ASML, Soitec and EU representatives discussed directions at ISS Europe 2013 in Italy.


SPIE volunteers urge Congress to boost jobs, economy through photonics support

Mon, 3 Mar 2013

Volunteers sponsored by SPIE, the international society for optics and photonics, were in Washington, D.C., last week to thank Congressional representatives for recent support for photonics R&D and to urge future support for in several key areas vital to economic growth and scientific progress.


China’s RFID card market to nearly double to $807 million in 2017

Tue, 3 Mar 2013

The futuristic “Internet of Things” will more than double to 2.1 billion units, leading to a dramatic growth of domestic companies, says Lux Research.


The UV LED market is booming

Mon, 3 Mar 2013

Yole Développement announced today its new report “UV LEDs: Technology & Application Trends” which presents UV LED new applications and associated market metrics for the period 2012-2020, and a deep analysis of UV LED technology and UV LED lighting industry.


Mediatek trumps Qualcomm in RF with world’s smallest transceiver

Fri, 3 Mar 2013

ABI Research finds that Mediatek has delivered the world’s smallest multimode transceiver. Coming just a week after Qualcomm announced its intentions to produce RF front ends for high tier LTE smartphones, Mediatek releases the world’s smallest RF transceiver which is also the world’s first 40nm transceiver.


Samsung tops optoelectronics ranking after absorbing LED venture

Thu, 3 Mar 2013

LED makers climb in the overall list of top suppliers of optoelectronics, sensors/actuators, and discretes, says 2013 O-S-D Report.


GaAs device revenue grows in 2012

Tue, 3 Mar 2013

Growth in the last quarter of 2012 pulled GaAs device revenue to a slight gain for 2012. The Strategy Analytics GaAs and Compound Semiconductor Technologies Service (GaAs) Insight, “GaAs Device Industry Closes up in 2012,” explores GaAs device revenue growth and trends. It also presents the revenue performance of leading GaAs device manufacturers and foundries like RFMD, Skyworks, TriQuint Semiconductor, Avago Technologies and WIN Semiconductors.


Polarizer market to grow to $14 billion by 2016

Thu, 4 Apr 2013

The polarizer market is expected to grow at a CAGR of 6 percent until 2016 to $12 billion in 2013 and to $14 billion in 2016. In 2012, the market amounted to $11.2 billion, up 9 percent year on year, according to “Polarizer Market and Industry Trend Analysis” published by Displaybank, recently acquired by IHS Inc.


Following decline of 2012, global TV market won’t recover until 2015

Mon, 4 Apr 2013

Stung by plunging sales in Japan and declining demand in North America and Western Europe, global television shipments in 2012 fell, marking a major inflection point that will have a lasting impact on the market, according to an IHS iSuppli Worldwide Television Market Tracker Report from the IHS TV Systems Intelligence Service at information and analytics provider IHS.


Emerging consumer applications are boosting the growth of the MEMS pressure sensor market

Tue, 3 Mar 2013

MEMS pressure sensor is one of the very first MEMS components appearing in the microsystem world. The technologies are quite mature and the market is big and expected to grow from $1.9B in 2012 to $3B in 2018.


Mobile video streaming drives demand for networking semiconductors in cars

Wed, 4 Apr 2013

Consumers increasingly want to use their media tablets and smartphones to stream high-definition video to displays in their cars, a phenomenon that will help to nearly double the size of the market for semiconductors used in automotive wired and wireless network applications from 2011 to 2018.


Strained silicon and HKMG take the stage at 22nm

Fri, 12 Dec 2011

Mohith Verghese, ASM America, covers the gate stack changes expected when 22nm semiconductors ramp in volume production. Topics include high-k gate dielectrics, strained silicon including nMOS strain, and the importance of conformal deposition wafer processing technology.


Mask-wafer double simulation: A new lithography requirement at 22nm

Fri, 12 Dec 2011

Accurate mask-wafer double simulation is a new, required step for lithography at the 20nm node and beyond because corner rounding becomes the dominant effect, explains Aki Fujimura, D2S.


At 22nm, the focus is first order effects

Thu, 12 Dec 2011

Regardless of transistor architecture, the impact of process variability on device and circuit performance has emerged as a significant concern at 22nm. Effects that until recently were negligible or could be mitigated with improved wafer manufacturing control are now first-order effects, says Howard Ko, Synopsys, who outlines the main culprits.


Semiconductor process technology challenges at 22nm

Wed, 12 Dec 2011

2012 promises much for the semiconductor industry, and the world. Gartner's Dean Freeman analyzes the roles of semiconductor fab tool makers for 22nm NAND and logic device manufacturing, and the role of chip makers adopting the new node.


Copper interconnects: Process integration of iALD TaN

Tue, 12 Dec 2011

Novellus authors investigated the film characteristics and process integration of TaN produced using iALD. High-density TaN with low resistivity and excellent conformality is demonstrated. With the adoption of Cu metallization, metal barriers such as TaN are needed to enhance the adhesion of metal to the dielectric and prevent the diffusion of Cu through the dielectric.


Applied Materials' Onyx treatment restores lost carbon, strengthens film structure

Tue, 11 Nov 2011

Applied Materials released a new film treatment, Applied Producer Onyx, that reduces the power consumption in semiconductor chips while increasing mechanical strength. The product targets the challenges associated with 3D packaging applications and technologies.


Top 10 polysilicon solar PV modules

Wed, 12 Dec 2011

Solarplaza has created top-10 and top-25 lists for poly-crystalline silicon solar PV modules, by efficiency. A mere 0.76% power conversion efficiency difference separates Solland Solar's top module from number 10, China Sunergy.


Novaled wins Deutscher Zukunftspreis for OLEDs

Fri, 12 Dec 2011

Organic light-emitting diode (OLED) company Novaled AG founders Professor Karl Leo, Dr. Jan Blochwitz-Nimoth, and Dr. Martin Pheiffer received the Deutscher Zukunftspreis from German Federal President Christian Wulff.


World record solar cell with 44.7% efficiency

Mon, 9 Sep 2013
The Fraunhofer Institute for Solar Energy Systems ISE, Soitec, CEA-Leti and the Helmholtz Center Berlin jointly announced this week having achieved a new world record for the conversion of sunlight into electricity using a new solar cell structure with four solar subcells.

Microfluidics: $4B in 2016, thanks to life sciences

Mon, 12 Dec 2011

In its new report, Emerging Markets For Microfluidic Applications, Yole Développement asserts that microfluidics are a "key technology" for the life sciences market, which will prop up microfluidics growth to $4 billion in 2016.


MEMS die size grows, test evolves, and other trends

Mon, 12 Dec 2011

Yole studies the evolution of inertial MEMS and magnetometers and provides reverse costing analysis of the MEMS devices in "Technology Trends for Inertial MEMS." The report considers 23 MEMS devices.


MEMS microphones surge, thanks to Apple

Wed, 1 Jan 2013

The market for MEMS microphones has nearly quintupled in just the past three years, topping a projected 2 billion shipments in 2012, thanks mainly for capabilities the technology enables in high-end smartphones, according to IHS iSuppli.


10 MEMS applications will top $100 million in 2017; thank mobile devices

Thu, 5 May 2012

Mobile phones and tablets each integrate about 5-10 MEMS per device. These “New MEMS” will benefit from the growth in smartphones and tablets, bringing in $5.4 billion in 2017.


Ricoh develops ink jettable piezoelectric material for future MEMS

Tue, 5 May 2012

Ricoh Company developed an ink-jet printing technique that can produce lead zirconate titanate piezoelectric material in a voluntary pattern shape at 2µm film thickness. Ricoh simultaneously developed a lead-free piezoelectric material, bearing the same deformation properties as the PZT material on a silicon substrate.


MEMS researchers at UToronto purchase plasma etch tool from Oxford Instruments

Tue, 6 Jun 2012

Plasma etch and deposition processing system maker Oxford Instruments Plasma Technology won an order for its recently launched PlasmaPro Estrelas100 deep silicon etch tool from the University of Toronto.


Sensors Expo report: MEMS Pre-Conference Symposium

Mon, 6 Jun 2012

Karen Lightman, MEMS Industry Group (MIG), reports on the group's pre-Sensors Expo symposium on MEMS. The coordination of equipment vendors, materials suppliers, foundries, device manufacturers, end-users, and OEMs is "music to her ears."


Canon intros lithography stepper for high-volume MEMS and LED production

Wed, 6 Jun 2012

Canon Inc. launched the FPA-3030i5+ i-line stepper for manufacturing MEMS and energy-efficient “green” devices such as power semiconductors in solar and wind applications and LEDs.


X-Fab takes majority stake in MFI, widens MEMS portfolio to support growth push

Thu, 11 Nov 2012

X-Fab Silicon Foundries says it has become the majority shareholder in German MEMS Foundry Itzehoe GmbH (MFI), the latest in a series of recent moves to raise its profile as a top MEMS foundry.


Low-cost MEMS fabrication using injection molding

Fri, 12 Dec 2012

Researchers in Japan have devised a MEMS fabrication technology using lower-cost production methods of printing and injection molding, enabling MEMS devices to be applied for fields such as lighting -- and producable by firms outside the semiconductor sector.


Micro-rheometer, microdevice adsorbtion get nods in Sandia student MEMS design contest

Thu, 9 Sep 2012

A device that measures very thin quantities of liquid, such as the synovial fluid in knee joints, and a device that measures change in mass when a microdevice adsorbs small amounts of material, earned top honors in Sandia National Labs' annual student MEMS design contest.


ST MEMS revenues nearly double with Apple in customer roster

Thu, 4 Apr 2012

IHS iSuppli Research reveals the top 10 consumer and mobile MEMS suppliers by revenue for 2011. STMicroelectronics outsold its competition thanks in part to Apple, which made up about half of STM's revenues for the sector.


MEMS to top $20 billion in 5 years, with double-digit growth

Fri, 7 Jul 2012

MEMS will continue to see steady, sustainable, double-digit growth for the next 6 years, with 20% compound average annual growth in units and 13% growth in revenues, to become a $21 billion market by 2017, according to Yole.


MEMS oscillators: Better alternative to crystal oscillators?

Tue, 7 Jul 2012

Harmeet Bhugra, Integrated Device Technology Inc., shares the benefits that MEMS technology can bring to a product -- oscillators -- that has been around since the early 19th century. Bhugra delineates the features of piezoelectric MEMS.


Yole updates World MEMS Players database for 2012

Tue, 7 Jul 2012

Yole updated its MEMS industry database, World MEMS Players 2012. The product includes contact information for MEMS players, geographical breakdown of the industry, and various MEMS device categories.


Dolomite develops plug-and-play microfluidics suite with UK SMART award

Mon, 7 Jul 2012

Dolomite has been awarded a SMART grant from the UK government to develop a plug-and-play microfluidic system, bringing microfluidics to a wider market and increasing research lab productivity.


Fraunhofer fabs optoelectronic LDPD on CMOS image sensors for low light

Wed, 1 Jan 2012

Fraunhofer Institute for Microelectronic Circuits and Systems IMS researchers developed a new optoelectronic component for low-light CMOS image sensor applications.


Multitest ships first MEMS MT9510 test tool to US IDM

Thu, 1 Jan 2012

Multitest shipped the first Multitest MEMS equipment for the MT9510 pick-and-place test handler to an IDM in the US. The IDM will perform MEMS gyroscope test on the newly installed tool.


MEMS microphones make noise in 2012

Tue, 1 Jan 2012

MEMS microphones will find continued strong implementation in phones, laptops, and tablets in the future, shows Jeremie Bouchaud, IHS, sharing shipment and revenue forecasts through 2015.


Nanomechanical loudspeaker could detect faint electrical signals

Thu, 1 Jan 2012

The JQI, the Neils Bohr Institute in Copenhagen, and Harvard University researchers developed a theoretical method for detecting weak electrical signals, using a nanomechanical "loudspeaker" and laser-based photon signals.


Implantable MEMS sensor gets jiggy with self-powering design

Fri, 1 Jan 2012

Straight outta Purdue University, a miniaturized implantable medical micro electro mechanical (MEMS) pressure sensor chip can be recharged with the block-rockin beats -- acoustic waves -- of rap music.


CNSE MEMS center earns ISO 9001:2008 registration

Mon, 3 Mar 2012

The CNSE STC, which performs micro electromechanical system (MEMS) and nanotechnology-enabled manufacturing and packaging, successfully completed ISO 9001:2008 registration.


Multitest delivers MEMS testing for pick-and-place set ups

Mon, 3 Mar 2012

Multitest expanded its MEMS portfolio to pick-and-place test applications with the introduction of its test and calibration cart for the MT9510.


ACUTRONIC MEMS testers enable economical test at the fab

Mon, 3 Mar 2012

ACUTRONIC released standard, off-the-shelf 2-axis rate tables to test several MEMS devices simultaneously. The 21-series is primarily made for MEMS manufacturers.


SensorsCon highlights: MEMS in the Internet of Things, networks, and camera pills

Thu, 3 Mar 2012

Blogger Michael A. Fury, Techcet Group, shares presentations from SensorsCon 2012, covering MEMS applications in wireless sensor networks and personal devices, and other sensor developments.


Top MEMS suppliers near $1 billion in sales

Mon, 3 Mar 2012

The market for MEMS grew 17% to $10.2 billion in 2011, according to Yole Développement. The top 2 suppliers -- Texas Instruments (TXN, TI) and STMicroelectronics (STM, ST) -- neared $1 billion in sales each.


Bosch's Akustica enters analog MEMS sector with 2-chip offering

Wed, 3 Mar 2012

Akustica, known for its monolithic single-chip digital MEMS devices, introduced its first analog 2-chip MEMS microphone for mobile handsets, the AKU340.


Microfluidic surface coating agent improves droplet performance

Thu, 3 Mar 2012

Microfluidic systems designer and maker Dolomite released Pico-Glide, a surface coating agent that facilitates advanced droplet microfluidics developed by Sphere Fluidics.


Colibrys relocates to new premises with $10M investment

Thu, 2 Feb 2012

MEMS maker Colibrys SA will relocate locally, to the Y-Parc at Yverdon-les-Bains, Canton Vaud, Switzerland. The new location will enable Colibrys to branch out into new application sectors.


CMOS image sensors keep pushing CCDs out of the picture

Mon, 2 Feb 2012

CMOS image sensors in 2011 continued to push CCD sensors into a smaller, isolated section of the market. CMOS image sensors are growing on use in mobile electronics and emerging applications, shows analyst firm IHS, and will find more adoption as back-side illumination costs come down.


Konica Minolta moves to MEMS for OLED-printing inkjet head

Tue, 2 Feb 2012

In the company's first use of MEMS technology, Konica Minolta developed the KM128SNG-MB high-precision inkjet printhead for manufacturing printed electronics.


Texas Instruments MEMS imaging for new markets

Mon, 2 Feb 2012

Mariquita Gordon from Texas Instruments discusses the company's MEMS-based DLP technology. In its 4th-gen embedded DLP evalution module, the LightCrafter, TI is opening up the applications space to new imaging markets, such as security, dentistry, and more.


MEMS for mobile electronics: Current and future devices to bring $6B+ by 2016

Wed, 2 Feb 2012

Annual revenues generated by micro electro mechanical system (MEMS) devices built into mobile devices -- including sensors, audio, displays and RF -- will exceed $6 billion by 2016, shows Juniper Research.


Texas Instruments develops HVM for poLight optical MEMS component

Thu, 2 Feb 2012

poLight collaborated with Texas Instruments to produce the optical MEMS component of poLight's TLens, aiming for faster focus time and lower power consumption in high volumes.


STM ships 2B MEMS sensors

Fri, 2 Feb 2012

STMicroelectronics has shipped 2 billion MEMS sensors to date, after hitting 1 billion only 15 months ago. The company recently increased its MEMS production capacity to 3 million+ sensors a day.


Xsens sensor fusion software ready for motion sensing in consumer electronics

Tue, 2 Feb 2012

Xsens introduced a suite of sensor fusion software for smartphones, media tablets and other mobile devices.


Gyroscope MEMS depose accelerometers in 2011 revenues

Thu, 3 Mar 2012

Gyroscopes generated more revenues in 2011 than any other consumer/mobile MEMS, the first time gyroscopes topped accelerometers, reports IHS.


Pure-play foundries spending big on capital equipment

Wed, 10 Oct 2013
Semiconductor capital spending has increased significantly among pure-play foundries as more IDMs shift to a fabless/fab-lite business model and as new foundry participants intensify competition among the old guard.

Applied Materials to merge with Tokyo Electron

Tue, 9 Sep 2013
Applied Materials Inc. and Tokyo Electron Limited today announced Applied Materials agreed to merge with Tokyo Electron.

Emerging MEMS will account for 10% of the value of the total MEMS business by 2018

Thu, 8 Aug 2013
Innovation in MEMS no longer comes solely from new devices, but also from the integration of matu...

Global semiconductor sales increase for sixth straight month in August

Fri, 10 Oct 2013
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $25.87 billion for the month of August 2013, an increase of 6.4 percent compared to August 2012, marking the industry's largest year-over-year growth since March 2011.

Crossbar unveils resistive RAM with simple, three-layer structure

Mon, 8 Aug 2013

Crossbar, Inc., a start-up company, unveiled a new Resistive RAM (RRAM) technology that will be capable of storing up to one terabyte (TB) of data on a single 200mm2 chip.


First half of 2013 shows big changes to top 20 semiconductor supplier ranking

Mon, 8 Aug 2013

Later this month, IC Insights’ August Update to the 2013 McClean Report will show a ranking of the top 25 semiconductor suppliers in 1H13.


Tablet and cellphone processors offset PC MPU weakness

Tue, 8 Aug 2013

Total microprocessor sales are forecast to rise 8 percent in 2013 and reach $61.0 billion.


Second quarter shows increase in silicon wafer shipments

Wed, 8 Aug 2013

Worldwide silicon wafer area shipments increased during the second quarter 2013 when compared to first quarter 2013 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.


Despite challenges, industrial semiconductor market reports positive Q1

Thu, 8 Aug 2013

The market for semiconductors used in industrial electronics applications relished a better-than-expected first quarter as macroeconomic headwinds turned out to be less severe than initially feared.


$5.2B in printed electronics is expected to be sold in 2015

Thu, 8 Aug 2013

The total applied market created by printed electronics technology is expected to grow at a compound annual growth rate (CAGR) of 47 percent to $24.3 billion by 2020 from $3.3 billion in 2013


TSMC becomes the largest semiconductor supplier in the world in 2Q13

Tue, 8 Aug 2013

Share of total IC market by foundry-produced devices is forecast to reach over 45 percent in 2017.


Solid State Technology and SEMI announce 2013 “Best of West” award winner

Thu, 7 Jul 2013

Solid State Technology and SEMI announced the recipient of the 2013 “Best of West” Award — Mentor Graphics — for its Tessent TestKompress with Cell-Aware ATPG.


SEMICON West keynoter outlines The Big Five Challenges of the semiconductor industry

Tue, 7 Jul 2013

When Ajit Manocha, GlobalFoundries CEO, polled his audience during his keynote address on Tuesday at SEMICON West 2013, nearly 60 percent of the audience believed that the biggest challenge facing the semiconductor industry was the economy. However, during his presentation, Manocha seemed to suggest otherwise.


Installed capacity for 300mm wafer processing to rise to 70% of total capacity by 2017

Tue, 7 Jul 2013

Capacity for 200mm wafers forecast to slip more than 10 points during same period.


Foreign IC companies to represent 70% of China’s IC production in 2017

Wed, 7 Jul 2013

China’s total IC production is forecast to represent only 6% of the worldwide IC market in 2017.


Hybrid Memory Cube nears engineering sample milestone

Wed, 7 Jul 2013

Engineering samples of The Hybrid Memory Cube (HMC) are expected this summer, with high volume manufacturing coming next year. It will be one of the first high volume devices employing 3D integration and through silicon vias (TSVs), employing a bottom logic layer and 4-8 stacked DRAM layers.


Epi-wafer market to grow to $4 billion in 2020 as LED lighting zooms to $80 billion

Thu, 7 Jul 2013

GaN-on-Sapphire remain the entrenched incumbent; leading challenger GaN-on-silicon will gain only a 10 percent market share, Lux Research says.


Driven by Apple and Samsung, light sensors achieve double-digit revenue growth

Tue, 7 Jul 2013

Light and proximity sensors in mobile handsets and tablets are set for expansive double-digit growth within a five-year period, thanks to increasing usage by electronic giants Samsung and Apple.


EV Group unveils new via-filling process to improve reliability of 3D-IC/TSV packaging

Wed, 9 Sep 2013
EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new polymer via-filling process for 3D-IC/through-silicon-via semiconductor packaging applications.

Fab equipment spending up 25% in 2014

Mon, 9 Sep 2013
Semiconductor revenue has improved in 2013 compared to 2012 and early forecasts for 2014 project revenue growth averaging about eight percent.

New Intel CEO, president talk product plans and future of computing

Tue, 9 Sep 2013
From data centers to ultra-mobile devices such as tablets, phones and wearables, computing segments are undergoing exciting and even game-changing transitions, said new Intel CEO Brian Krzanich during today’s opening session of the Intel Developer Forum.

SUNY CNSE to develop center for 450mm computer chip manufacturing

Thu, 9 Sep 2013
Building on Governor Cuomo’s CNSE G450C initiative and expanded partnership between NanoCollege and the Mohawk Valley EDGE continues New York’s investment strategy.

Asia-Pac soars, Japan drops in regional semiconductor capex spending

Tue, 9 Sep 2013
Capex marketshare flips in Asia-Pac and Japan; Europe's share erodes while North America gains.

Booming market for touch-screen notebook PC displays hits speed bump in second quarter

Thu, 10 Oct 2013
How bad were conditions in the notebook PC market during the second quarter?

Book-to-bill ratio reflects seasonal softening

Tue, 10 Oct 2013
North America-based manufacturers of semiconductor equipment posted $975.3 million in orders worldwide in September 2013 (three-month average basis) and a book-to-bill ratio of 0.97, according to the September EMDS Book-to-Bill Report published today by SEMI.

Larger screen sizes and higher resolution are driving TV panel demand in a struggling market

Tue, 10 Oct 2013
The TV market has experienced a significant slowdown in growth over the past couple of years and, with OLEDs delayed, there have been no significant new premium features to drive consumer interest and spur replacement demand.

Imec demonstrates world's first III-V FinFET devices monolithically integrated on 300mm silicon wafers

Tue, 11 Nov 2013
Technology achievement marks significant step towards monolithic heterogeneous integration and non-silicon devices.

SIA awards Mike Splinter the Robert N. Noyce award

Mon, 11 Nov 2013
The Semiconductor Industry Association (SIA) today announced that Mike Splinter, former CEO and current executive chairman of the board of directors at Applied Materials, has been named the 2013 recipient of SIA's highest honor, the Robert N. Noyce Award.

Above parity: SEMI releases October book-to-bill ratio

Wed, 11 Nov 2013
A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

Can Intel beat TSMC?

Mon, 11 Nov 2013
It would seem that if Intel could scale transistor cost as they have done in the last 40 years then they could win these super high volume consumer-oriented designs where cost is extremely important. And TSMC is clearly taking this seriously.

Worldwide semiconductor revenue grew 5.2 percent in 2013

Wed, 12 Dec 2013
Worldwide semiconductor revenue totaled $315.4 billion in 2013, a 5.2 percent increase from 2012 revenue of $299.9 billion, according to preliminary results by Gartner, Inc.

Slideshow: IEDM 2013 Highlights

Wed, 12 Dec 2013
This week, industry leaders and experts have gathered in Washington D.C. at the 59th annual IEEE International Electron Device Meeting (IEDM) conference.

Intel ends 2013 with a bang

Wed, 12 Dec 2013
ABI Research verified that Intel has a leading position in the mobile processor technology race; launching the first 22nm mobile application processor.

TSMC, Samsung and Micron top list of IC industry capacity leaders

Thu, 1 Jan 2014
The top 10 companies now hold 67% of worldwide IC industry capacity, up from 54% in 2009.

Slideshow: CES 2014 Highlights

Fri, 1 Jan 2014
This week in Las Vegas, the 2014 International Consumer Electronics Show focused on the Internet of Things, displaying many connected gadgets and services.

Semiconductor plastic packaging materials market to approach $21B by 2017

Wed, 1 Jan 2014
The market for semiconductor packaging materials, including thermal interface materials, is expected to maintain its $20 billion value through 2017, despite shifts away from the use of precious metals such as gold in wire bonding.

Intel vs. TSMC: An Update

Tue, 1 Jan 2014
On January 14, 2014, we read on the Investors.com headlines page - Intel Seen Gaining Huge Pricing Advantage Over TSMC. Just three days later comes the responding headline: TSMC: We're "Far Superior" to Intel and Samsung as a Partner Fab.

Apple and Samsung are top OEMs, again, in semiconductor spending for 2013

Mon, 1 Jan 2014
Apple and Samsung remained the world’s largest buyers of semiconductor chips in 2013, but the intensifying battle between the two for the hearts and minds of consumers in their product offerings could presage another mighty showdown this year for the top ranking, according to a new report from IHS Technology.

North Carolina State University to lead research consortium on power electronics

Thu, 1 Jan 2014
Called the Next Generation Power Electronics Institute, the new consortium will provide shared facilities, equipment and testing to companies from the power electronics industry, focusing and small and medium-sized companies.

Ballistic transport in graphene suggests new type of electronic device

Thu, 2 Feb 2014
Using electrons more like photons could provide the foundation for a new type of electronic device that would capitalize on the ability of graphene to carry electrons with almost no resistance even at room temperature – a property known as ballistic transport.

Silicon wafer revenues decline in 2013

Tue, 2 Feb 2014
Worldwide silicon wafer revenues declined by 13 percent in 2013 compared to 2012 according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

2014 SPIE Startup Challenge winners announced

Thu, 2 Feb 2014
A microscope in a needle, a handheld device that prescribes corrective eyeglasses, and a device for heart attack diagnosis are winning projects in the 2014 SPIE Startup Challenge.

Global semiconductor industry posts highest-ever January sales

Mon, 3 Mar 2014
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $26.28 billion for the month of January 2014, an increase of 8.8 percent from January 2013 when sales were $24.15 billion, marking the industry's highest-ever January sales total and the largest year-to-year increase in nearly three years.

Fab equipment spending to increase 20-30% in 2014

Thu, 3 Mar 2014
The release today of the SEMI World Fab Forecast update reveals a 20 to 30 percent projected increase in semiconductor fab equipment spending in 2014.

Imec achieves record 8.4 percent conversion efficiency in fullerene-free organic solar cell

Wed, 3 Mar 2014
In this week’s Nature Communications, imec presents the development of fullerene-free organic photovoltaic (OPV) multilayer stacks achieving a record conversion efficiency of 8.4 percent.

Toshiba brings civil suit against SK Hynix

Fri, 3 Mar 2014
Toshiba Corporation announced that it has brought a civil suit against Korea’s SK Hynix Inc. at the Tokyo District Court, under Japan’s Unfair Competition Prevention Act.

Heat-conducting polymer cools hot electronic devices at 200 degrees C

Mon, 3 Mar 2014
Polymer materials are usually thermal insulators. But by harnessing an electropolymerization process to produce aligned arrays of polymer nanofibers, researchers have developed a thermal interface material able to conduct heat 20 times better than the original polymer. The modified material can reliably operate at temperatures of up to 200 degrees Celsius.

MEMS microphones broadcast strong growth

Fri, 4 Apr 2014
Global revenue for MEMS microphones is forecast to reach $1.04 billion this year, up a robust 24 percent from $836.9 million in 2013.

February semiconductor sales up 11.4 percent compared to last year

Wed, 4 Apr 2014
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $25.87 billion for the month of February 2014, an increase of 11.4 percent from February 2013 when sales were $23.23 billion.

Catching the (invisible) wave

Fri, 4 Apr 2014
UC Santa Barbara researchers create a unique semiconductor that manipulates light in the invisible infrared/terahertz range, paving the way for new and enhanced applications.

Sensor hubs make big gains while enabling the future of sensing

Wed, 4 Apr 2014
Sensor hubs that offload tasks from power-hungry application processors and let mobile devices like smartphones and tablets run longer on a single battery charge are reaping gargantuan gains thanks to the global microelectromechanical systems (MEMS) market

SEMATECH achieves breakthrough defect reduction in EUV mask blanks

Tue, 5 May 2014
SEMATECH announced today that researchers have reached a significant milestone in reducing tool-generated defects from the multi-layer deposition of mask blanks used for extreme ultraviolet (EUV) lithography, pushing the technology another significant step toward readiness for high-volume manufacturing (HVM).

New policy helps combat counterfeit semiconductors

Wed, 5 May 2014
A newly finalized Department of Defense (DoD) rule reduces the risk of counterfeit semiconductor products being used by our military by implementing needed safeguards in the procurement of semiconductors and other electronic parts.

Increase in first quarter 2014 silicon wafer shipments

Tue, 5 May 2014
Worldwide silicon wafer area shipments increased during the first quarter 2014 when compared to fourth quarter 2013 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Down to 5nm: Scaling with the usual suspects - performance, cost

Thu, 5 May 2014
The semiconductor industry never lacks for challenges and/or controversy as it forges ahead from one technology node to the next.

SID announces winners of 2014 Display Industry Awards

Wed, 6 Jun 2014
Yesterday, the Society for Information Display (SID) unveiled the winners of its prestigious 19th annual Display Industry Awards.

Industry sustainability efforts mount with III-Vs and other advanced technologies

Thu, 6 Jun 2014
The introduction of new materials, such as III-Vs, into high-volume manufacturing of semiconductors, likely will occur sometime around the 7nm and/or 5nm nodes.

GS Nanotech pioneers 3D packaging technology in Russia

Thu, 6 Jun 2014
GS Nanotech, microelectronics products development and manufacture center, plans to launch mass assembly of 3D stacked TSV (through-silicon via) microcircuits in next few years.

ConFab panelists discuss optimizing R&D in the changing semi landscape

Tue, 6 Jun 2014
Overheard @The ConFab: “I feel the best I’ve felt about semi since 2009.” –Mike Noonen, Silicon Catalyst

Gopal Rao at The ConFab: Scaling isn’t enough anymore

Wed, 6 Jun 2014
The core element of the semiconductor industry’s roadmap has been scaling – but Gopal Rao believes that isn’t enough anymore.

Printed, flexible, and organic electronics: A growing opportunity

Tue, 7 Jul 2014
In wearable gadgets, flexible electronics may have met its dream application. And that’s no stretch of the imagination.

Solid State Technology and SEMI announce the 2014 “Best of West” Award winner

Wed, 7 Jul 2014
Solid State Technology and SEMI, yesterday announced the recipient of the 2014 “Best of West” Award — Nikon Corporation — for its NSR-S630D Immersion Scanner. The award recognizes important product and technology developments in the microelectronics supply chain. The Best of West finalists were selected based on their financial impact on the industry, engineering or scientific achievement, and/or societal impact.

Global semiconductor industry on pace for record sales through first half of 2014

Tue, 8 Aug 2014
Sales up across every region and nearly all product categories compared to last year; Americas region shows strongest growth.

Strong growth in second quarter 2014 silicon wafer shipments

Tue, 8 Aug 2014
Worldwide silicon wafer area shipments increased during the second quarter 2014 when compared to first quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Intel and Unity Technologies announce collaboration

Thu, 8 Aug 2014
Intel Corporation and Unity Technologies today announced a strategic collaboration to advance the development of Android-based applications on Intel architecture.

UCSB researchers develop ultra sensitive biosensor from molybdenite semiconductor

Thu, 9 Sep 2014
Move over, graphene. An atomically thin, two-dimensional, ultrasensitive semiconductor material for biosensing developed by researchers at UC Santa Barbara promises to push the boundaries of biosensing technology in many fields, from health care to environmental protection to forensic industries.

SEMI wins request for etch equipment export control review

Tue, 9 Sep 2014
Major milestone in longstanding push to remove etch equipment from U.S. export control list.